Power conversion device

Abstract

A power conversion device (100) includes: a plurality of ports (10, 20, 30) provided to a housing (60); a plurality of conversion circuits (13, 23, 33) electrically connected to the ports; and a plurality of coils (17, 27, 37) electrically connected to the conversion circuits and wound around a transformer core (50), respectively. Further, a prescribed conversion circuit (33) is mounted on a prescribed substrate (73), and a prescribed coil (37) electrically connected to the prescribed conversion circuit (33) is fixed around a substrate hole (73a) in the prescribed substrate (73). Further, in a state in which the transformer core (50) is inserted through the substrate hole (73a), the prescribed coil (37) is positioned with respect to the coils (17, 27) other than the prescribed coil (37) by fixing the prescribed substrate (73) to the housing (60).

Description

[0001] Citation of relevant applications

[0002] This application is based on Japanese Patent Application No. 2019-203324, filed on November 8, 2019, the contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to a power conversion device having multiple ports, which transforms the power input from any one port and outputs it from the other ports. Background Technology

[0004] The intelligent module, which integrates multiple circuits, has the following structure. The intelligent module includes a general-purpose substrate and a custom-designed substrate. The general-purpose substrate contains many customer-standard circuits. On the other hand, the custom-designed substrate contains circuits whose structure and configuration may differ according to customer specifications. Patent Document 1 illustrates this technology.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2013-21748 Summary of the Invention

[0008] According to the above-described technology, circuits that need to be modified to meet customer specifications can be easily changed simply by replacing a custom substrate. Therefore, customization can be ensured. However, the inventors have noticed that when this technology of modifying a portion of the circuit is used in a specified power conversion device, the following problems may occur.

[0009] That is, in a specified power conversion device, voltage transformation is performed via multiple coils wound around the core of a transformer. In such a power conversion device, if a portion of the circuit is modified according to customer requirements, the required magnetic coupling between the coils may also change. Specifically, for specifications requiring efficient power transfer between the coils, a magnetic coupling close to 100% is required. On the other hand, for specifications requiring stable voltage generated by the output coils, a magnetic coupling slightly lower than 100% is required.

[0010] Therefore, in a power conversion device that transforms voltage via multiple coils, if a part of the circuit is modified according to customer requirements, it may become necessary to readjust the magnetic coupling between the coils. However, in the intelligent module of Patent Document 1, such adjustment of magnetic coupling is not considered.

[0011] This disclosure is made in view of the above circumstances, and its main purpose is to make it easy to modify a part of the circuit in a power conversion device that transforms voltage via multiple coils, according to customer needs, and to make it easy to adjust the magnetic coupling between the coils.

[0012] The power conversion device disclosed herein includes a housing, multiple ports, multiple conversion circuits, and multiple coils. The multiple ports are disposed in the housing. Multiple conversion circuits are disposed for each of the aforementioned ports and are electrically connected to their respective ports. Multiple coils are disposed for each of the aforementioned conversion circuits, are electrically connected to their respective conversion circuits, and are wound around a predetermined transformer core.

[0013] The aforementioned power conversion device converts the DC or AC power used at the aforementioned port side to AC power of a specified frequency through the aforementioned conversion circuits, transmits the AC power of the specified frequency between the aforementioned coils through magnetic coupling, and performs voltage transformation along with the transmission.

[0014] The aforementioned power conversion device has a predetermined substrate with predetermined substrate holes. A portion of a plurality of the aforementioned conversion circuits, namely a predetermined conversion circuit, is mounted on the predetermined substrate, and a predetermined coil, electrically connected to the predetermined conversion circuit, is fixed around the substrate holes in the predetermined substrate in a state that moves together with the predetermined substrate. Furthermore, with the transformer core inserted into the substrate holes, the predetermined substrate is fixed to the housing, thereby positioning the predetermined coil relative to the other coils.

[0015] According to this disclosure, since a specified conversion circuit and a specified coil are mounted on a specified substrate, both the specified conversion circuit and the specified coil can be easily replaced as a set simply by replacing the specified substrate with other components. Therefore, the specified conversion circuit and the specified coil can be easily changed according to customer needs, etc.

[0016] Furthermore, since the specified coil moves together with the specified substrate, the position of the specified coil can be adjusted simply by adjusting the position of the specified substrate, thereby adjusting the magnetic coupling between the specified coil and coils other than the specified coil. Therefore, the desired magnetic coupling can be obtained simply by setting the specified substrate at a position corresponding to the desired magnetic coupling.

[0017] Based on the above, in a power conversion device that transforms voltage via multiple coils, a portion of the circuit can be easily modified according to customer needs, and the magnetic coupling between the coils can be easily adjusted. Attached Figure Description

[0018] The above-mentioned objects, other objects, features, and advantages of this disclosure will become clearer with reference to the accompanying drawings and the following detailed description. The accompanying drawings are described below.

[0019] Figure 1 This is a top view showing the power conversion device of the first embodiment.

[0020] Figure 2 yes Figure 1 The cross-sectional view along line II-II shown.

[0021] Figure 3 This is a front sectional view showing the state in which a spacer is sandwiched between the housing and the sub-base plate.

[0022] Figure 4 This is a front sectional view showing the state in which a spacer is sandwiched between the housing and the main substrate.

[0023] Figure 5 It is a graph showing the relationship between the distance between substrates and the magnetic coupling degree.

[0024] Figure 6 This is a front sectional view of the power conversion device according to the second embodiment.

[0025] Figure 7 This is a front cross-sectional view showing the state after the sub-substrate configuration has been changed upwards.

[0026] Figure 8 This is a top view showing the power conversion device according to the third embodiment.

[0027] Figure 9 This is a top view showing the state after the configuration of the sub-substrate has been changed in the horizontal direction. Detailed Implementation

[0028] Next, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the present disclosure is not limited to these embodiments, and appropriate modifications can be made to implement them without departing from the spirit of the disclosure.

[0029] [First Implementation Method]

[0030] Figure 1 This is a top view showing the power conversion device 100 according to this embodiment. The power conversion device 100 is installed in a vehicle. The power conversion device 100 includes a housing 60, a first port 10, a second port 20, a third port 30, a first conversion circuit 13, a second conversion circuit 23, a third conversion circuit 33, a first coil 17, a second coil 27, a third coil 37, a transformer core 50, a main substrate 71, and a sub-substrate 73.

[0031] Figure 2 It means Figure 1The cross-sectional view along line II-II is shown. Hereinafter, referring to the figures, one side of the thickness direction of the main substrate 71 and the sub-substrate 73 is designated as "upper" and the other side of the thickness direction is designated as "lower". However, the power conversion device 100 may also designate "upper" as "lower" and "upper" as two sides in the horizontal direction.

[0032] The housing 60 has a box-shaped housing body 60a that opens upwards and a cover (not shown) mounted on the upper part of the housing body 60a. The lower part of the transformer core 50 is fixed to the inner bottom of the housing 60.

[0033] A coil substrate 72 is mounted on a main substrate 71. A first substrate hole 71a is formed in the main substrate 71, a second substrate hole 72a is formed in the coil substrate 72, and a third substrate hole 73a is formed in the sub-substrate 73. The aforementioned first substrate hole 71a, second substrate hole 72a, and third substrate hole 73a are holes for inserting the transformer core 50, penetrating each substrate 71, 72, and 73 in the vertical direction. The transformer core 50 is divided into an upper part and a lower part in a manner that allows each substrate 71, 72, and 73 to be mounted.

[0034] The first coil 17 is embedded in the main substrate 71 in such a way that it is wound around the first substrate hole 71a. Therefore, the first coil 17 is fixed to the main substrate 71 in a state that moves together with the main substrate 71.

[0035] The second coil 27 is embedded in the coil substrate 72 in such a way that it is wound around the second substrate hole 72a. The coil substrate 72 is fixed to the main substrate 71. Therefore, the second coil 27 is fixed to the main substrate 71 in a state where it moves together with the main substrate 71 via the coil substrate 72.

[0036] The third coil 37 is embedded in the sub-substrate 73 in such a way that it is wound around the third substrate hole 73a. Therefore, the third coil 37 is fixed to the sub-substrate 73 in a state that moves together with the sub-substrate 73.

[0037] The main substrate 71 is fixed to the housing 60 with the transformer core 50 inserted into the first substrate hole 71a and the second substrate hole 72a. Specifically, a predetermined first support portion 61 is formed on the inner wall of the housing 60, and the main substrate 71 is fixed to the first support portion 61 by screws 76. Therefore, the first coil 17 and the second coil 27 are fixed in a state of being wound around the transformer core 50.

[0038] The sub-substrate 73 is fixed to the housing 60 with the transformer core 50 inserted into the third substrate hole 73a. Specifically, a second support portion 62 is formed on the inner wall of the housing 60, spaced apart from the first support portion 61 by a layer difference, and the sub-substrate 73 is fixed to this second support portion 62 by screws 76. Thus, the sub-substrate 73 is arranged parallel to the main substrate 71. Furthermore, the third coil 37 is fixed in a state of being wound around the transformer core 50 and is positioned relative to the first coil 17 and the second coil 27.

[0039] Furthermore, when current flows through any one of the first coil 17, the second coil 27, and the third coil 37, a magnetic flux is generated in the transformer core 50. When this current is alternating current, the magnetic flux generated in the transformer core 50 changes, and this change in magnetic flux induces an electromotive force in each of the coils 17, 27, and 37. In this way, alternating current is transferred between the coils 17, 27, and 37 through magnetic coupling. Accompanying this transfer, the alternating current is transformed according to the turns ratio of the coils 17, 27, and 37 and the degree of magnetic coupling between them.

[0040] The first port 10 is located on a designated outer surface of the housing 60, and a designated low-voltage circuit (not shown) is electrically connected to the first port 10. The low-voltage circuit is a DC circuit with a low-voltage power source such as a lead-acid battery and a load such as various vehicle electrical equipment.

[0041] A first conversion circuit 13 is mounted on the main substrate 71 and electrically connected to the first port 10 and the first coil 17. When DC power is input from the low-voltage circuit to the first port 10, the first conversion circuit 13 converts the DC power into AC power of a predetermined frequency and supplies it to the first coil 17. Conversely, when DC power is output from the first port 10 to the low-voltage circuit, the first conversion circuit 13 converts the AC power of the predetermined frequency supplied from the first coil 17 into DC power and supplies it to the first port 10. Specifically, the first conversion circuit 13 is an inverter circuit with four semiconductor switches 14, which, by controlling the four semiconductor switches 14, appropriately performs bidirectional conversion between DC and AC power of the predetermined frequency.

[0042] The second port 20 is located on the outer side of the housing 60, opposite to the side of the first port 10. A specified high-voltage circuit (not shown) is electrically connected to this second port 20. The high-voltage circuit is a DC circuit with a high-voltage power source such as a lithium battery and a load such as an inverter that drives a rotary motor to rotate the tire.

[0043] The second conversion circuit 23 is mounted on the main substrate 71 and electrically connected to the second port 20 and the second coil 27. When DC power is input from the high-voltage circuit to the second port 20, the second conversion circuit 23 converts the DC power into AC power of a predetermined frequency and supplies it to the second coil 27. Conversely, when DC power is output from the second port 20 to the high-voltage circuit, the second conversion circuit 23 converts the AC power of the predetermined frequency supplied from the second coil 27 into DC power and supplies it to the second port 20. Specifically, the second conversion circuit 23 is an inverter circuit with four semiconductor switches 14, which, by controlling the four semiconductor switches 14, appropriately performs bidirectional conversion between DC and AC power of the predetermined frequency.

[0044] The third port 30 is located on the outer side of the housing 60 where the second port 20 is located. A custom circuit is electrically connected to this third port 30. The custom circuit is a circuit added by the customer to the vehicle through selection. The custom circuit is arbitrary; specific examples include circuits with loads such as heaters for heating various catalysts, steering wheels, etc.; circuits with loads such as various optional instruments; circuits with power sources such as solar panels; and circuits with power sources such as booster batteries.

[0045] The third conversion circuit 33 is mounted on the sub-board 73 and is electrically connected to the third port 30 and the third coil 37. The third conversion circuit 33 is appropriately selected depending on the form of the customized circuit. Therefore, various forms exist for the third conversion circuit 33.

[0046] The third conversion circuit 33 can take the following forms. The custom circuit is a DC circuit. When DC power is input from this custom circuit to the third port 30, the third conversion circuit 33 converts the DC power into AC power of a specified frequency and supplies it to the third coil 37. Conversely, when DC power is output from the third port 30 to the custom circuit, the third conversion circuit 33 converts the AC power of the specified frequency supplied from the third coil 37 into DC power and supplies it to the third port 30. Specifically, this third conversion circuit 33 is an inverter circuit with four semiconductor switches 14. By controlling these four semiconductor switches 34, bidirectional conversion between DC and AC power of the specified frequency is appropriately performed. Furthermore, Figure 1 , Figure 2 The third conversion circuit 33 is shown in this form.

[0047] Alternatively, another form of the third conversion circuit 33 can be exemplified as follows: The custom circuit is an AC circuit. When AC power is input from the custom circuit to the third port 30, the third conversion circuit 33 converts the AC power (e.g., 50 or 60 Hz) into AC power of a specified frequency (e.g., several hundred kilohertz) and supplies it to the third coil 37. On the other hand, when AC power is output from the third port 30 to the custom circuit, the third conversion circuit 33 converts the AC power of the specified frequency supplied from the third coil 37 into AC power of the frequency used in the custom circuit and supplies it to the third port 30.

[0048] Specifically, in this case, the third conversion circuit 33 includes a first AC-DC conversion circuit and a second AC-DC conversion circuit. The first AC-DC conversion circuit converts AC (e.g., 50 or 60 Hz) input from the custom circuit to DC, and the second AC-DC conversion circuit converts the converted DC to AC at the specified frequency (e.g., several hundred kilohertz). Here, both the first and second AC-DC conversion circuits are inverter circuits with four semiconductor switches, and the third conversion circuit 33, having the first and second AC-DC conversion circuits, appropriately performs bidirectional conversion between AC at the frequency used in the custom circuit and AC at the specified frequency.

[0049] Furthermore, as another form of the third conversion circuit 33, the following can be cited. The custom circuit is a DC circuit that only has a load and no power supply; the third port 30 is dedicated to outputting power and does not receive power. Therefore, the third conversion circuit 33 is a rectifier circuit with four diodes that unidirectionally converts the AC power of a predetermined frequency supplied from the third coil 37 into DC power and supplies it to the third port 30.

[0050] As described above, various conversion circuits exist as the third conversion circuit 33, and the appropriate conversion circuit needs to be selected and set according to the form of the customized circuit. Similarly, the third coil 37 also needs to be selected and set with an appropriate number of turns and other characteristics according to the form of the customized circuit.

[0051] Next, the surrounding structure of the structure shown above will be described. For example... Figure 1 As shown, a first heat dissipation member 81 is provided at a position overlapping with the semiconductor switch 14 of the first switching circuit 13 in a top view. Additionally, a second heat dissipation member 82 is provided at a position overlapping with the semiconductor switch 24 of the second switching circuit 23 in a top view. Furthermore, a third heat dissipation member 83 is provided at a position overlapping with the semiconductor switch 34 of the third switching circuit 33 in a top view.

[0052] Moreover, such as Figure 2 As shown, the first heat dissipation member 81 abuts against the main substrate 71 or its mounting below the semiconductor switch 14 and against the housing 60. The second heat dissipation member 82 abuts against the main substrate 71 or its mounting below the semiconductor switch 24 and against the housing 60. The third heat dissipation member 83 abuts against the sub-substrate 73 or its mounting below the semiconductor switch 34 and against the housing 60. Furthermore, a cooling device such as a water channel and air-cooled fins (not shown) is provided in the housing 60. Therefore, the housing 60 becomes cooler than the semiconductor switches 14, 24, and 34 of each switching circuit 13, 23, and 33. Therefore, the heat generated in each semiconductor switch 14, 24, and 34 is transferred to the housing 60 and dissipated via the heat dissipation members 81, 82, and 83.

[0053] like Figure 1 As shown, the sub-substrate 73 is positioned at a location overlapping the noise source 44 when viewed from above, and the back of the sub-substrate 73 covers the top of the noise source 44. The noise source 44 is, for example, an electrical device that generates noise, such as an ECU for controlling semiconductor switches 14, 24, 34, or a higher-level ECU for controlling the aforementioned ECU.

[0054] Figure 3 This is a front cross-sectional view showing the state in which a spacer 77 is clamped between the second support portion 62 and the sub-substrate 73, and the sub-substrate 73 is fixed to the second support portion 62 with screws 76. Hereinafter, the distance between the main substrate 71 and the sub-substrate 73 will be referred to as "substrate distance D". By clamping the spacer 77 between the second support portion 62 and the sub-substrate 73, the substrate distance D can be increased compared to the case where it is not clamped. Furthermore, by selecting a spacer 77 with a greater thickness, the substrate distance D can be further increased.

[0055] Furthermore, since the third coil 37 moves together with the sub-substrate 73, the distance D between the substrates increases, and consequently, the distance from the first coil 17 and the second coil 27 to the third coil 37 also increases. Therefore, the magnetic coupling of the third coil 37 relative to the first coil 17 and the second coil 27 decreases. Additionally, at this time, with... Figure 2 Compared to the situation shown, the third heat dissipation component 83 can be addressed by providing a component whose thickness increases along the vertical direction of the spacer 77.

[0056] Figure 4This is a front cross-sectional view showing the state in which a spacer 77 is clamped between the first support portion 61 and the main substrate 71, and the main substrate 71 is fixed to the first support portion 61 with screws 76. Thus, by clamping the spacer 77 between the first support portion 61 and the main substrate 71, the distance D between the substrates can be reduced compared to the case where it is not clamped. Furthermore, by selecting a spacer 77 with a greater thickness, the distance D between the substrates can be further reduced.

[0057] Furthermore, since the first coil 17 and the second coil 27 move together with the main substrate 71, the distance D between the substrates decreases, and consequently, the distance from the first coil 17 and the second coil 27 to the third coil 37 also decreases. As a result, the magnetic coupling of the third coil 37 with respect to the first coil 17 and the second coil 27 increases. Additionally, at this time, with... Figure 2 Compared to the situation shown, the first heat dissipation member 81 and the second heat dissipation member 82 can be addressed by providing a member whose thickness increases along the vertical direction of the spacer 77.

[0058] Figure 5 This is a graph showing the relationship between the inter-substrate distance D and the magnetic coupling degree of the third coil 37 relative to the first coil 17. Thus, the smaller the inter-substrate distance D, the greater the magnetic coupling degree; conversely, the larger the inter-substrate distance D, the smaller the magnetic coupling degree. Therefore, the magnetic coupling degree can be adjusted by adjusting the inter-substrate distance D.

[0059] According to this embodiment, the following effects can be obtained. As described above, it is necessary to appropriately change the form of the third conversion circuit 33 and the third coil 37 according to the form of the customized circuit. In this regard, since the third conversion circuit 33 and the third coil 37 are mounted on the sub-board 73, both the third conversion circuit 33 and the third coil 37 can be easily replaced as a set simply by replacing the sub-board 73 with other components. Therefore, the third conversion circuit 33 and the third coil 37 can be easily changed according to the form of the customized circuit, that is, the customer's requirements.

[0060] Furthermore, since the third coil 37 moves together with the sub-substrate 73, the position of the third coil 37 can be adjusted simply by adjusting the position of the sub-substrate 73, thereby adjusting the magnetic coupling between the third coil 37 and the other coils 17 and 27. Therefore, the desired magnetic coupling can be obtained simply by setting the sub-substrate 73 at a position corresponding to the desired magnetic coupling.

[0061] Furthermore, since the first coil 17 and the second coil 27 move together with the main substrate 71, the positions of the first coil 17 and the second coil 27 can be adjusted simply by adjusting the position of the main substrate 71, thereby adjusting the magnetic coupling degree of the third coil 37 relative to the first coil 17 and the second coil 27. Therefore, the magnetic coupling degree can be adjusted not only by the arrangement of the sub-substrate 73 but also by the arrangement of the main substrate 71.

[0062] Furthermore, by clamping a spacer 77 between the main substrate 71 and the first support portion 61, or between the sub-substrate 73 and the second support portion 62, the distance D between the substrates can be easily adjusted. Therefore, the magnetic coupling degree of the third coil 37 relative to the first coil 17 and the second coil 27 can be easily adjusted.

[0063] Furthermore, the spacer 77 can be clamped between either the sub-substrate 73 and the second support portion 62, or between the main substrate 71 and the first support portion 61. Moreover, compared to the case where the spacer 77 is not clamped between the sub-substrate 73 and the second support portion 62, the inter-substrate distance D increases when the spacer 77 is clamped between the sub-substrate 73 and the second support portion 62. On the other hand, compared to the case where the spacer 77 is not clamped between the main substrate 71 and the first support portion 61, the inter-substrate distance D decreases when the spacer 77 is clamped between the main substrate 71 and the first support portion 61. Therefore, the inter-substrate distance D can be increased or decreased from the normal state without the spacer 77.

[0064] Furthermore, by setting the layer difference between the first support portion 61 and the second support portion 62, the substrate distance D in the normal state without using the spacer 77 can be set.

[0065] Furthermore, the heat generated in the semiconductor switches 14, 24, and 34 of the first switching circuit 13, the second switching circuit 23, and the third switching circuit 33 is transferred to the housing 60 via the heat dissipation components 81, 82, and 83, thereby improving the heat dissipation performance of each semiconductor switch 14, 24, and 34. Moreover, when the arrangement of the main substrate 71 or the sub-substrate 73 is changed in the vertical direction, the heat dissipation components 81, 82, and 83 can be changed to components with different heights to address the issue.

[0066] Furthermore, since the back side of the sub-substrate 73 covers the area above the noise source 44, the propagation of noise generated from the noise source 44 to surrounding circuits can be suppressed as much as possible.

[0067] [Second Implementation]

[0068] Next, the second embodiment will be described. In the following embodiments, components that are the same as or correspond to those in the previous embodiments will be labeled with the same symbols. Regarding this embodiment, the description will focus on the differences between the first embodiment and the first embodiment.

[0069] Figure 6 , Figure 7 This is a front cross-sectional view of the power conversion device 100 according to this embodiment. In addition to the first support portion 61 and the second support portion 62, the housing 60 also has a third support portion 63 on its inner wall. Specifically, the third support portion 63 is formed on the inner wall of the housing 60, spaced apart from the second support portion 62 by a layer difference. A sub-substrate 73 is present. Figure 6 The sub-base plate 73 shown is for mounting on the second support portion 62 and is larger than the sub-base plate 73. Figure 7 The sub-substrate 73 shown is used for mounting on the third support portion 63. Depending on the support portions 62 and 63, the sub-substrate 73 can be changed to a substrate of a different size.

[0070] According to this embodiment, the distance D between the substrates can be changed by altering the support portions 62 and 63 on which the sub-substrate 73 is mounted. Furthermore, the following effect can be obtained: Since the sub-substrate 73 used for the second support portion 62 and the sub-substrate 73 used for the third support portion 63 are of different sizes, it is impossible to mount the sub-substrate 73 used for the second support portion 62 onto the third support portion 63, or vice versa. Therefore, it is possible to prevent errors such as mounting the sub-substrate 73 in the wrong position during the assembly of the power conversion device 100, which could lead to an unexpected magnetic coupling degree between the third coil 37 and the first coil 17 and the second coil 27.

[0071] [Third Implementation Method]

[0072] Next, the third embodiment will be described. This embodiment will be described based on the first embodiment, focusing on the differences between it and the first embodiment.

[0073] Figure 8 , Figure 9 This is a top view showing the power conversion device 100 of this embodiment. Furthermore, in the above figure, the sub-board 73 is shown with dashed lines, and the main board 71 is omitted from the illustration so that coils 17 and 37 can be seen.

[0074] The sub-substrate 73 is mounted in a manner that allows for horizontal position adjustment. For example, this structure can be achieved by providing elongated holes extending in a horizontal direction on the sub-substrate 73 as screw through holes, and by passing screws 76 through these elongated holes to screw them into the housing 60. Alternatively, for example, this can be achieved by providing screw holes in the housing 60 for mounting the sub-substrate 73 to a predetermined first position, and providing screw holes for mounting the sub-substrate 73 to a second or third position after horizontal displacement from the first position.

[0075] Furthermore, the magnetic coupling is adjusted by adjusting the position of the sub-substrate 73 along the horizontal direction. In detail, as... Figure 8 As shown, when viewed from above, when the third coil 37 overlaps with the first coil 17, the magnetic coupling of the third coil 37 relative to the first coil 17 becomes stronger. On the other hand, as... Figure 9 As shown, when viewed from above, the magnetic coupling of the third coil 37 relative to the first coil 17 weakens when the third coil 37 is offset relative to the first coil 17.

[0076] According to this embodiment, by adjusting the arrangement of the sub-substrate 73 in the horizontal direction, i.e., the direction orthogonal to the through direction of the substrate hole 73a, the magnetic coupling degree of the third coil 37 with respect to the first coil 17 and the second coil 27 can be adjusted.

[0077] [Other Implementation Methods]

[0078] The above embodiments can be implemented with the following modifications. For example, the power conversion device 100 can be installed in a vehicle other than a vehicle or on a fixed object. Additionally, for example, a DC circuit other than the aforementioned low-voltage or high-voltage circuit can be electrically connected to the first port 10 or the second port 20. Furthermore, for example, the first conversion circuit 13 and the second conversion circuit 23 can be configured as AC-AC conversion circuits that convert between the frequency used at ports 10 and 20 and the aforementioned predetermined frequency used at coils 17 and 27, and an AC circuit can be electrically connected to the first port 10 and the second port 20. Additionally, for example, the first port 10 or the second port 20 can be designated as an output-only circuit, and the first conversion circuit 13 or the second conversion circuit 23 can be configured as a rectifier circuit that unidirectionally converts the AC supplied from coils 17 and 27 to DC.

[0079] Alternatively, instead of mounting two sets of switching circuits 13, 23 and coils 17, 27 on the main substrate 71, only one set may be mounted, or more than three sets may be mounted. Furthermore, instead of mounting only one set of switching circuits 33 and coils 37 on the sub-substrate 73, more than two sets may be mounted.

[0080] Alternatively, for example, instead of fixing the first coil 17 or the second coil 27 to the main substrate 71, it can also be fixed to the transformer core 50, thereby allowing only the position of the third coil 37 to be adjusted.

[0081] Alternatively, for example, in the first embodiment, the positional relationship between the main substrate 71 and the sub-substrate 73 may be reversed, which is the opposite of the case in the first embodiment. When the spacer 77 is sandwiched between the main substrate 71 and the housing 60, the distance D between the substrates becomes larger, and when the spacer 77 is sandwiched between the sub-substrate 73 and the housing 60, the distance D between the substrates becomes smaller.

[0082] In addition, for example, in the first embodiment, instead of using the spacer 77, multiple housings 60 with different vertical spacings, i.e., the first support portion 61 and the second support portion 62, can be prepared, and the distance D between the substrates can be adjusted by replacing the housings 60.

[0083] Alternatively, for example, in the first embodiment, instead of each heat dissipation member 81, 82, 83, the heat dissipation portion that abuts against each substrate 71, 73 or its mounting may be integrally formed with the housing 60. Moreover, if only one substrate 71, 73 is sandwiched between the support portion 61, 62 and the spacer 77, a heat dissipation member with the same thickness as the spacer 77 may be sandwiched between the substrate 71, 73 and the heat dissipation portion.

[0084] Alternatively, for example, in the third embodiment, instead of adjusting the position of the sub-substrate 73 in the horizontal direction, the third coil 37 can be fixed to the sub-substrate 73 with its center eccentric from the center of the third substrate hole 73a, and when the sub-substrate 73 is flipped, the position of the third coil 37 is shifted in the horizontal direction.

[0085] Additionally, for example, in each embodiment, the coil substrate 72 is fixed to the lower surface of the main substrate 71 in the figure, but it may also be fixed to the upper surface of the main substrate 71. Furthermore, when the coil substrate 72 is fixed to either the lower or upper surface of the main substrate 71, a spacer may be sandwiched between the main substrate 71 and the coil substrate 72. The thickness of this spacer can be appropriately selected. Based on the above, the position of the second coil 27 relative to the first coil 17 and the third coil 37 can be adjusted. Therefore, the degree of freedom in the relative positions of the three coils 17, 27, and 37 increases, as does the degree of freedom in the magnetic coupling.

[0086] Although this disclosure has been described based on embodiments, it should be understood that this disclosure is not limited to the above embodiments and structures. This disclosure also includes various modifications and equivalent variations. In addition, various combinations and methods, and further including other combinations and methods of only a single element or more or less, also fall within the scope and concept of this disclosure.

Claims

1. A power conversion device, The power conversion device includes a housing, multiple ports, multiple conversion circuits, and multiple coils. The multiple ports are disposed in the housing. The multiple conversion circuits are configured for each port and electrically connected to their respective ports. The multiple coils are configured for each conversion circuit, electrically connected to their respective conversion circuits, and wound around a predetermined transformer core. The power conversion device converts the DC or AC power used at the port side to AC power of a specified frequency through the conversion circuits of each circuit. The specified frequency AC power is transmitted between the coils via magnetic coupling, and voltage transformation occurs accompanying this transmission. The power conversion device includes: a predetermined substrate having predetermined substrate holes; and another substrate, which is different from the predetermined substrate and has other substrate holes different from the predetermined substrate holes. A portion of the plurality of conversion circuits, namely a specified conversion circuit, is mounted in the specified substrate, and a coil, namely a specified coil, electrically connected to the specified conversion circuit, is fixed around the substrate hole in the specified substrate in a state that moves together with the specified substrate. A different conversion circuit, i.e., another conversion circuit, is mounted on the other substrate, and a coil, i.e., another coil, electrically connected to the other conversion circuit, is fixed around the other substrate hole in the other substrate in a state that moves together with the other substrate. A first support portion is formed in the housing, and a second support portion is formed therein, spaced apart from the first support portion by a layer difference. With the transformer core inserted into the hole of the other substrate, the other substrate is fixed to the first support portion. With the transformer core inserted into the substrate hole of the specified substrate, the specified substrate is fixed to the second support portion, thereby positioning the specified coil relative to the other coil.

2. The power conversion device as described in claim 1, characterized in that, The specified switching circuit includes a semiconductor switch, which is mounted on the specified substrate. In a top view of the specified substrate, which is observed along the through-hole of the specified substrate, a heat dissipation member is provided at a position overlapping with the semiconductor switch, which abuts against the specified substrate or the mounting of the specified substrate and against the housing.

3. A power conversion device, The power conversion device includes a housing, multiple ports, multiple conversion circuits, and multiple coils. The multiple ports are disposed in the housing. The multiple conversion circuits are configured for each port and electrically connected to their respective ports. The multiple coils are configured for each conversion circuit, electrically connected to their respective conversion circuits, and wound around a predetermined transformer core. The power conversion device converts the DC or AC power used at the port side to AC power of a specified frequency through the conversion circuits of each circuit. The specified frequency AC power is transmitted between the coils via magnetic coupling, and voltage transformation occurs accompanying this transmission. The power conversion device has a specified substrate with specified substrate holes. A portion of the plurality of conversion circuits, namely a specified conversion circuit, is mounted in the specified substrate, and a coil, namely a specified coil, electrically connected to the specified conversion circuit, is fixed around the substrate hole in the specified substrate in a state that moves together with the specified substrate. With the transformer core inserted into the hole in the substrate, the specified substrate is fixed to the housing, thereby positioning the specified coil relative to other coils. The specified conversion circuit has a semiconductor switch mounted on the specified substrate. In a top view of the specified substrate observed along the through-hole of the substrate, a heat dissipation member is provided at a position overlapping with the semiconductor switch, which abuts against the specified substrate or the mounting of the specified substrate and against the housing.

4. The power conversion device according to any one of claims 1 to 3, characterized in that, The specified substrate is mounted on the housing in a manner that allows its position relative to the transformer core and the coil other than the specified coil to be adjusted in a direction orthogonal to the through direction of the substrate hole.

5. A power conversion device, The power conversion device includes a housing, multiple ports, multiple conversion circuits, and multiple coils. The multiple ports are disposed in the housing. The multiple conversion circuits are configured for each port and electrically connected to their respective ports. The multiple coils are configured for each conversion circuit, electrically connected to their respective conversion circuits, and wound around a predetermined transformer core. The power conversion device converts the DC or AC power used at the port side to AC power of a specified frequency through the conversion circuits of each circuit. The specified frequency AC power is transmitted between the coils via magnetic coupling, and voltage transformation occurs accompanying this transmission. The power conversion device has a specified substrate with specified substrate holes. A portion of the plurality of conversion circuits, namely a specified conversion circuit, is mounted in the specified substrate, and a coil, namely a specified coil, electrically connected to the specified conversion circuit, is fixed around the substrate hole in the specified substrate in a state that moves together with the specified substrate. With the transformer core inserted into the hole in the base plate, the designated base plate is mounted on the housing in a manner that allows adjustment of its position relative to the transformer core and the coil other than the designated coil in a direction orthogonal to the penetration direction of the base plate hole. The specified substrate is fixed to the housing, thereby positioning the specified coil relative to other coils.

6. The power conversion device as described in claim 3 or 5, characterized in that, The power conversion device has another substrate, which is different from the specified substrate and has different substrate holes than the specified substrate holes. A different conversion circuit, i.e., another conversion circuit, is mounted on the other substrate, and a coil electrically connected to the other conversion circuit, i.e., another coil, is fixed around the other substrate hole in the other substrate in a state that moves together with the other substrate. With the transformer core inserted into the hole of the other substrate, the other substrate is fixed to the housing.

7. The power conversion device as described in claim 3 or 5, characterized in that, By clamping a spacer between the specified substrate and the housing, the spacing between the specified coil and other coils becomes larger or smaller compared to the case where the spacer is not clamped.

8. The power conversion device as described in claim 6, characterized in that, By clamping a spacer between the specified substrate and the housing or between the other substrate and the housing, the gap between the specified coil and the other coil becomes larger or smaller compared to the case where the spacer is not clamped.

9. The power conversion device as described in claim 6, characterized in that, Spacers can be clamped between the specified substrate and the housing, as well as between the other substrate and the housing. When a spacer is sandwiched between the specified substrate and the housing, the gap between the specified coil and the other coil becomes larger compared to the case where no spacer is sandwiched between the specified substrate and the housing; when a spacer is sandwiched between the other substrate and the housing, the gap between the specified coil and the other coil becomes smaller compared to the case where no spacer is sandwiched between the other substrate and the housing.

10. The power conversion device as claimed in claim 8, characterized in that, Spacers can be clamped between the specified substrate and the housing, as well as between the other substrate and the housing. When a spacer is sandwiched between the specified substrate and the housing, the gap between the specified coil and the other coil becomes larger compared to the case where no spacer is sandwiched between the specified substrate and the housing; when a spacer is sandwiched between the other substrate and the housing, the gap between the specified coil and the other coil becomes smaller compared to the case where no spacer is sandwiched between the other substrate and the housing.

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