Mask, mask assembly, and method of manufacturing display panel

Abstract

The present application relates to a mask, a mask assembly, and a method of manufacturing a display panel. The mask includes a main body portion including a cell region and a peripheral region surrounding the cell region, the main body portion having a plurality of cell openings defined therein; and a plurality of mark patterns at the peripheral region. The cell region includes a first region; and a second region adjacent to the first region, and the plurality of cell openings includes first cell openings defined at the first region and spaced apart from each other; and second cell openings defined at the second region and spaced apart from each other. Each of the mark patterns includes at least one recessed portion and has a point-symmetrical shape with respect to a corresponding point of symmetry.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0182580, filed on December 23, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure relate to masks, mask assemblies, and methods of manufacturing display panels. More specifically, the embodiments of this disclosure relate to masks, mask assemblies, and methods of manufacturing display panels that can reduce the manufacturing cost of display panels. Background Technology

[0004] Display devices include various electronic components, such as display panels for displaying images, input sensing components for sensing external inputs, and electronic modules. The display panel includes light-emitting elements for generating light. Electronic modules include cameras, infrared sensors, proximity sensors, etc.

[0005] The display panel comprises multiple pixels. Each pixel includes driving elements such as transistors and display elements such as organic light-emitting diodes. An electronic module is disposed beneath the display panel. The electronic module overlaps with the arrangement of pixels in the area of ​​the display panel.

[0006] Display elements are formed by stacking electrodes and light-emitting patterns on a substrate. The light-emitting patterns are patterned using a deposition process that uses a mask.

[0007] The information disclosed above in this background section is intended to enhance the understanding of the background technology of this disclosure, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0008] The luminescent pattern of a display panel is patterned using a deposition process that utilizes a mask with openings defined by the mask. Process errors can occur when the substrate and mask are misaligned during the deposition process. Therefore, precise alignment of the substrate and mask is desirable.

[0009] One or more embodiments of this disclosure relate to masks capable of correcting alignment with a substrate and reducing manufacturing costs.

[0010] One or more embodiments of this disclosure relate to a mask assembly including a mask and a method of manufacturing a display panel using the mask assembly. Therefore, the reliability of the display panel manufactured using the mask assembly can be improved.

[0011] According to one or more embodiments of this disclosure, a mask includes: a main portion including a cell region and a peripheral region surrounding the cell region, the main portion having a plurality of cell openings defined therein; and a plurality of marking patterns at the peripheral region. The cell region includes: a first region; and a second region adjacent to the first region, and the plurality of cell openings includes: first cell openings defined at the first region and spaced apart from each other; and second cell openings defined at the second region and spaced apart from each other. Each of the marking patterns includes at least one recessed portion and has a point-symmetric shape about a corresponding symmetrical point.

[0012] In one embodiment, the recessed portion may be recessed from the upper or lower surface of the main body portion.

[0013] In this implementation, the marker patterns can be connected to each other.

[0014] In an embodiment, the recessed portion may include a plurality of recessed portions, and the plurality of recessed portions may include: a first recessed portion; a second recessed portion spaced apart from the first recessed portion; a third recessed portion symmetrical to the first recessed portion about a corresponding symmetry point; and a fourth recessed portion symmetrical to the second recessed portion about a corresponding symmetry point.

[0015] In an implementation, each of the recessed portions in the plan view may have a polygonal shape.

[0016] In an implementation, in a plan view, the recessed portion may overlap with the corresponding symmetrical point.

[0017] In an implementation, in a plan view, the recessed portion may have a closed curve shape around the corresponding symmetrical point.

[0018] In an implementation, the area of ​​the opening of the first unit in the plan view may be different from the area of ​​the opening of the second unit.

[0019] In an implementation, in a plan view, the distance between adjacent first unit openings in the first unit opening may be different from the distance between adjacent second unit openings in the second unit opening.

[0020] According to one or more embodiments of this disclosure, a mask assembly includes: a plurality of masks positioned along one direction; and a frame below the plurality of masks. Each of the masks includes a body portion comprising a cell region and a peripheral region surrounding the cell region, the body portion having a plurality of cell openings defined therein. At least one of the masks includes: a plurality of marking patterns at the peripheral region and including at least one recessed portion; and a hole adjacent to a first marking pattern of the marking patterns. Each of the marking patterns has a point-symmetric shape about a corresponding symmetry point.

[0021] In an implementation, the unit region may include a first region and a second region adjacent to the first region, and the plurality of unit openings may include: a first unit opening defined in the first region and spaced apart from each other; and a second unit opening defined in the second region and spaced apart from each other, the second unit opening being different from the first unit opening.

[0022] In an implementation, in a plan view, the hole may overlap with the corresponding symmetrical point.

[0023] In one embodiment, the recessed portion of the first marking pattern may be spaced apart from the hole.

[0024] In one embodiment, the recessed portion of the first marking pattern can be integrally connected to the hole.

[0025] In one implementation, an opening may be defined in the frame, and the opening may overlap with holes and multiple unit openings in a plan view.

[0026] According to one or more embodiments of this disclosure, a method of manufacturing a display panel includes: forming a first mask assembly, the first mask assembly including: a first mask including a first set of unit openings, a first set of marking patterns spaced apart from the first set of unit openings, and a first hole; and a first frame; forming a second mask assembly, the second mask assembly including: a second mask including a second set of unit openings identical to the first set of unit openings, a second set of marking patterns identical to the first set of marking patterns, and a second hole; and a second frame; forming a first pattern including a first light-emitting pattern and a first test film on a target substrate using the first mask assembly; forming a second pattern including a second light-emitting pattern and a second test film on the target substrate using the second mask assembly; adjusting the position of the first mask assembly according to the position of the first test film; and adjusting the position of the second mask assembly according to the position of the second test film. The second light-emitting patterns are respectively formed on the first light-emitting patterns, and the first test film and the second test film are formed at different positions relative to each other.

[0027] In an implementation, the first luminescent pattern and the second luminescent pattern may include organic patterns configured to emit light of the same color as each other.

[0028] In this embodiment, the first set of marking patterns and the second set of marking patterns can be formed by a semi-etching process.

[0029] In an implementation, each of the first set of marking patterns and the second set of marking patterns may include: a first marking pattern having a point-symmetric shape about a first symmetric point; and a second marking pattern having a point-symmetric shape about a second symmetric point.

[0030] In one embodiment, forming the first mask assembly may include: providing a mask including a cell opening, a first marking pattern, and a second marking pattern; and irradiating a first symmetric point with a laser beam to form a first aperture. Forming the second mask assembly may include: providing another mask identical to the first mask; and irradiating a second symmetric point with a laser beam to form a second aperture.

[0031] According to one or more embodiments of this disclosure, the mask may include a marking pattern aligned with a substrate, and the reliability of the display panel manufactured using the mask may be improved. Depending on the color of the light-emitting pattern to be deposited using the mask, the mask can be publicly used. Therefore, the cost of manufacturing the mask can be reduced. Attached Figure Description

[0032] Referring to the accompanying drawings, the above and other aspects and features of this disclosure will become more clearly understood from the following detailed description of illustrative, non-limiting exemplary embodiments, in which:

[0033] Figure 1A This is a perspective view showing a display device according to an embodiment of the present disclosure;

[0034] Figure 1B This is an exploded perspective view showing a display device according to an embodiment of the present disclosure;

[0035] Figure 2 This is a plan view showing a display panel according to an embodiment of the present disclosure;

[0036] Figures 3A to 3B This is an enlarged plan view showing a portion of a display panel according to one or more embodiments of the present disclosure;

[0037] Figure 4 This is a cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0038] Figure 5 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present disclosure;

[0039] Figure 6 This is a perspective view showing a mask assembly according to an embodiment of the present disclosure;

[0040] Figure 7 It is shown Figure 6 A plan view of a portion of the mask assembly shown;

[0041] Figure 8A This illustrates an embodiment according to the present disclosure. Figure 6 A plan view of a portion of the mask assembly shown;

[0042] Figure 8B It is along Figure 8AA cross-sectional view taken along line I-I' to illustrate a mask assembly according to an embodiment of the present disclosure;

[0043] Figure 8C It is along Figure 8A A cross-sectional view taken along line I-I' to illustrate a mask assembly according to an embodiment of the present disclosure;

[0044] Figure 9A This illustrates an embodiment according to the present disclosure. Figure 6 A plan view of a portion of the mask assembly shown;

[0045] Figure 9B It is along Figure 9A A cross-sectional view taken along line II-II' to illustrate a mask assembly according to an embodiment of the present disclosure;

[0046] Figure 9C It is along Figure 9A A cross-sectional view taken along line II-II' to illustrate a mask assembly according to an embodiment of the present disclosure;

[0047] Figures 10A to 10F This is a plan view showing a mask according to various embodiments of the present disclosure;

[0048] Figure 11 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0049] Figure 12 This is a plan view showing a target substrate according to an embodiment of the present disclosure;

[0050] Figures 13A to 13B This is a plan view illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0051] Figure 13C This is a cross-sectional view illustrating a method of manufacturing a display panel according to an embodiment of the present disclosure;

[0052] Figure 13D This is a plan view illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0053] Figures 14A to 14C This is a plan view illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure; and

[0054] Figure 15 This is a partially enlarged plan view of the target substrate after the deposition process according to an embodiment of the present disclosure. Detailed Implementation

[0055] In the following description, embodiments will be illustrated in more detail with reference to the accompanying drawings, in which the same reference numerals consistently denote the same elements. However, this disclosure may be implemented in a variety of different forms and should not be construed as being limited to the embodiments shown herein. Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey to those skilled in the art the aspects and features of this disclosure. Therefore, processes, elements, and techniques that are not essential for those skilled in the art to fully understand the aspects and features of this disclosure may not be described. Unless otherwise stated, the same reference numerals denote the same elements throughout the drawings and written description, and therefore, their description need not be repeated.

[0056] When specific implementation methods can be carried out differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed simultaneously or substantially simultaneously, or two consecutively described processes may be performed in the reverse order of the described sequence.

[0057] In the accompanying drawings, for clarity, the relative dimensions of elements, layers, and regions may be exaggerated and / or simplified. For ease of explanation, spatially relative terms such as “below,” “under,” “below,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature and another element(s) shown in the figures. It should be understood that, in addition to the orientations described in the figures, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below,” “under,” or “below” other elements or features will then be oriented “above” other elements or features. Thus, the exemplary terms “below” and “below” can include both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein should be interpreted accordingly.

[0058] In the accompanying drawings, the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular or substantially perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0059] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the spirit and scope of this disclosure, the first element, first component, first region, first layer, or first portion described below may be referred to as a second element, second component, second region, second layer, or second portion.

[0060] It should be understood that when an element or layer is referred to as being "on," "connected to," or "attached to" another element or layer, it can be directly on, directly connected to, or directly attached to the other element or layer, or one or more intermediary elements or layers may exist. Similarly, when a layer, area, or element is referred to as being "electrically connected" to another layer, area, or element, it can be directly electrically connected to the other layer, area, or element, and / or can be indirectly electrically connected to the other layer, area, or element in the presence of one or more intermediary layers, areas, or elements therebetween. Furthermore, it should be understood that when an element or layer is referred to as being "between two elements or layers," it can be the only element or layer between the two elements or layers, or one or more intermediary elements or layers may exist.

[0061] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit this disclosure. As used herein, the singular forms “a” and “an” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “have,” and “having” designate the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, the expression “A and / or B” means A, B, or A and B. When following a list of elements, expressions such as “at least one of…” modify the elements of the entire list, not individual elements in the list. For example, the expression "at least one of a, b and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0062] As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms rather than terms of degree, and are intended to allow for inherent deviations in measurements or calculations that will be recognized by those skilled in the art. Furthermore, the word “may” as used in describing embodiments of this disclosure means “one or more embodiments of this disclosure.” As used herein, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively. Additionally, the term “exemplary” is intended to indicate an example or illustration.

[0063] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having the same meaning as they have in the relevant field and / or the context of this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0064] In the following, a mask, a mask assembly, and a method of manufacturing a display panel according to embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0065] Figure 1A This is a perspective view showing a display device according to an embodiment of the present disclosure, and Figure 1B It is shown Figure 1A An exploded perspective view of the display device.

[0066] The display device DD can be a device activated in response to an electrical signal. The display device DD can include various suitable implementations. For example, the display device DD can be applied to various suitable electronic devices, such as mobile phones, smartwatches, tablet computers, laptop computers, smart TVs, etc. However, this disclosure is not limited thereto, and the display device DD can be applied to other suitable electronic devices, provided they do not depart from the spirit and scope of this disclosure. In this embodiment, a mobile phone is shown and described in more detail as a representative example of a display device DD.

[0067] Display device DD can display an image IM via display surface FS facing a third direction DR3, the display surface FS being parallel or substantially parallel to each of the first direction DR1 and the second direction DR2. The display surface FS through which the image IM is displayed can correspond to the front surface of display device DD. The image IM can include still images and / or moving images (e.g., video).

[0068] In this embodiment, the front (or upper) and rear (or lower) surfaces of each component of the display device DD can be defined relative to the direction of the displayed image IM. The front and rear surfaces can be opposite each other in a third direction DR3, and the normal direction of each of the front and rear surfaces can be parallel to or substantially parallel to the third direction DR3. The distance in the third direction DR3 between the front and rear surfaces of the respective components can correspond to the thickness of the respective component of the display device DD in the third direction (e.g., the thickness direction) DR3. As used herein, the expression "when viewed in a plane" or "in a plan view" can refer to viewing from a direction perpendicular to or substantially perpendicular to the relevant surface (e.g., the front or top surface) of the relevant component (e.g., viewing from the third direction DR3). The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 shown in the figures are opposite to each other, and therefore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be modified to other suitable directions.

[0069] refer to Figure 1A and Figure 1B The display device DD may include a window 100, a display module (e.g., a display layer) 200, a driving circuit 300, a housing 400, and an electronic module (e.g., an electronic component or electronic device) 500. In this embodiment, the window 100 and the housing 400 may be connected to each other (e.g., coupled or attached) to provide the appearance of the display device DD.

[0070] Window 100 may include an optically transparent material. For example, window 100 may include glass, sapphire, or plastic material. Window 100 may have a single-layer structure or a multi-layer structure. As an example, a window 100 with a multi-layer structure may include multiple plastic films connected to each other (e.g., coupled or stacked), or may have a glass substrate and plastic films connected to (e.g., coupled to) the glass substrate (or plastic films stacked on the glass substrate).

[0071] Window 100 may include a transmissive area TA and a border area BZA. The front surface of the display device DD may correspond to the transmissive area TA and the border area BZA of window 100.

[0072] The transmissive region TA can be an optically transparent region. The user can view the image IM through the transmissive region TA. In this embodiment, the transmissive region TA can have a quadrilateral shape with rounded vertices, but this disclosure is not limited thereto. The transmissive region TA can have various suitable shapes and should not be particularly limited.

[0073] When compared to the transmittance of the transmittance region TA, the border region BZA can be a region with relatively low transmittance. For example, the border region BZA may correspond to an area comprising (e.g., printed) a material with an appropriate color (e.g., a predetermined color).

[0074] The border region BZA may be defined as adjacent to the transmission region TA. For example, the border region BZA may surround the transmission region TA (e.g., around the periphery of the transmission region TA). Thus, the transmission region TA may have a shape defined by the border region BZA, but this disclosure is not limited thereto, and the border region BZA may be configured to be adjacent only to one or more sides of the transmission region TA, or the border region BZA may be omitted.

[0075] The display module 200 may be disposed below (e.g., below) the window 100. The display module 200 may include a display panel 210 and an input sensing unit (e.g., an input sensing layer or input sensor) 220. The display module 200 may display an image IM and may sense external input. The display module 200 may include a front surface IS, which includes an active area AA and a peripheral area NAA.

[0076] The effective area AA can be an area activated by an electrical signal. In this embodiment, the effective area AA can be an area through which the image IM is displayed, and can correspond to or substantially correspond to (e.g., in parallel or simultaneously) an area for sensing external input.

[0077] The transmission region TA may overlap with at least a portion of the effective region AA. Therefore, a user can view the image IM through the transmission region TA, or can provide external input. However, this disclosure is not limited thereto. In other words, the area through which the image IM is displayed and the area through which external input is sensed may be spaced apart (e.g., separated) from each other at the effective region AA, and are not particularly limited thereto.

[0078] The peripheral region NAA can be covered by the border region BZA. The peripheral region NAA can be sealed by the border region BZA, and therefore, the peripheral region NAA cannot be seen from the outside. The peripheral region NAA can be defined as being adjacent to the effective region AA. For example, the peripheral region NAA can surround the effective region AA (e.g., around the periphery of the effective region AA). Driving circuitry and / or driving lines for driving pixels can be arranged at the peripheral region NAA.

[0079] In this embodiment, the effective area AA and the peripheral area NAA are shown as flat or substantially flat, but this disclosure is not limited thereto, and a portion of the peripheral area NAA and a portion of the effective area AA may be bent. In this case, a portion of the peripheral area NAA may be bent toward the rear surface of the display device DD, and therefore, the size of the bezel area BZA may be reduced at the front surface of the display device DD.

[0080] The display panel 210 may be a liquid crystal display panel or a light-emitting display panel, but this disclosure is not limited thereto. For example, the display panel 210 may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots and / or quantum rods.

[0081] Display panel 210 may be flexible. As used herein, when describing a component, the term "flexible" may mean that the component has bendable properties, including fully foldable structures, partially curved structures, and all structures between fully foldable and partially curved structures. For example, display panel 210 may be a curved display panel or a foldable display panel. However, display panel 210 is not limited to this or by this limitation, and display panel 210 may be a rigid display panel 210.

[0082] The input sensing unit 220 can be mounted on the display panel 210. For example... Figure 1B As shown, the input sensing unit 220 can be directly disposed on the display panel 210. In other words, the input sensing unit 220 can be formed on the display panel 210 through a continuous process, and therefore, an adhesive film may not be required between the input sensing unit 220 and the display panel 210. However, this disclosure is not limited thereto, and according to embodiments, an adhesive film may also be provided between the input sensing unit 220 and the display panel 210. In this case, after the input sensing unit 220 is manufactured through a process separate from that of the display panel 210, the input sensing unit 220 can be fixed to (e.g., attached to or attached to) the upper surface of the display panel 210 by the adhesive film.

[0083] The input sensing unit 220 can sense external input applied to it from the outside. External input includes various suitable forms of input provided from outside the display device DD. For example, external input can be configured as force, pressure, temperature, light, etc. External input can include proximity input (e.g., hover input) applied when an object (e.g., a user's finger or pen) approaches or is near the display device DD at an appropriate distance (e.g., a predetermined distance), and touch input caused by the user's body (e.g., the user's hand or finger).

[0084] The driving circuit 300 can be electrically connected to the display module 200. The driving circuit 300 may include a main circuit board MB and a flexible circuit board CF.

[0085] The flexible circuit board CF can be electrically connected to the display module 200. The flexible circuit board CF can be connected to the pad PD located at the peripheral area NAA of the display module 200. The flexible circuit board CF can provide electrical signals to the display module 200 to drive the display module 200. These electrical signals can be generated by the flexible circuit board CF or the main circuit board MB.

[0086] The main circuit board MB may include various driving circuits for driving the display module 200, or it may include connectors for providing power. The main circuit board MB may be a rigid printed circuit board or a flexible printed circuit board.

[0087] Despite Figure 1B The illustration shows a flexible circuit board CF connecting the display module 200 and the main circuit board MB to each other; however, this disclosure is not limited to this and may include multiple flexible circuit boards CF. In other words, multiple flexible circuit boards CF can be configured, and multiple flexible circuit boards CF can connect the display panel 210 and the main circuit board MB to each other.

[0088] The electronic module 500 may be disposed below (e.g., beneath) the display module 200. In this embodiment, the electronic module 500 may overlap with the effective area AA and may be disposed below (e.g., beneath) the display module 200. The electronic module 500 may include various suitable functional modules. For example, the electronic module 500 may include a thermal sensing module (e.g., a thermal sensor), a light-emitting module (e.g., a light-emitting device), an audio output module (e.g., an audio output device), a camera module (e.g., a camera), etc.

[0089] The housing 400 can be connected to (e.g., coupled to or attached to) the window 100. The housing 400 can be connected to (e.g., coupled to or attached to) the window 100 to provide interior space therebetween. The display module 200 and the electronic module 500 can be housed within the interior space.

[0090] The housing 400 may include a suitable material with relatively high rigidity. For example, the housing 400 may include glass, plastic, or metal. The housing 400 may include multiple frames and / or panels or combinations thereof. The housing 400 can stably protect the components of the display device DD housed within the internal space from external impacts.

[0091] According to an embodiment, the display module 200 may include a sensing region SSA defined therein. The sensing region SSA may be an area overlapping with the electronic module 500. The display device DD can receive external signals for the electronic module 500 through the sensing region SSA, or can provide signals from the electronic module 500 to the outside through the sensing region SSA. For example, the electronic module 500 can sense external objects through the sensing region SSA, or can provide sound signals (such as voice) or light signals (such as infrared) to the outside through the sensing region SSA.

[0092] The sensing area SSA can be defined to overlap with the transmission area TA. In this case, the separate area at the border area BZA for the sensing area SSA to overlap with the electronic module 500 can be omitted. Therefore, the size of the border area BZA can be reduced.

[0093] According to the implementation, the sensing area SSA of the display module 200 can have a relatively high transmittance compared to the transmittance of the portion of the effective area AA that does not overlap with the sensing area SSA. For example, at least some elements of the display module 200 can be removed or omitted at the sensing area SSA. Therefore, the electronic module 500 can easily transmit and / or receive signals through the sensing area SSA.

[0094] Figure 2 This is a plan view illustrating a display panel according to an embodiment of the present disclosure. The display panel 210 may include a display area DA for displaying images. The display area DA may correspond to the effective area AA of the display module 200 (e.g., reference to...). Figure 1B The display area DA may include a first display area DA1 and a second display area DA2. Each of the first display area DA1 and the second display area DA2 may include a plurality of pixels PX.

[0095] Each of the pixels PX may include a display element and a thin-film transistor electrically connected to the display element. The display element may include, for example, an organic light-emitting diode. The pixel PX may be arranged at the display area DA and may provide light (e.g., emit light). The pixel PX may be arranged at a first display area DA1 and a second display area DA2, but this disclosure is not limited thereto. For example, some of the pixels PX may be arranged in a non-display area.

[0096] Pixels PX can be arranged in a matrix along a first direction DR1 and a second direction DR2 that intersects (e.g., perpendicularly or substantially perpendicularly) the first direction DR1. According to an embodiment, pixels PX may include a first luminescent pixel, a second luminescent pixel, and a third luminescent pixel for displaying red, green, and blue, respectively.

[0097] The first display area DA1 can be defined as being adjacent to the second display area DA2. For example... Figure 2 As shown, the first display area DA1 may surround the second display area DA2 (e.g., around the periphery of the second display area DA2). However, this disclosure is not limited thereto or thereby, and according to embodiments, the first display area DA1 may be an area adjacent to one or more sides of the second display area DA2. This depends on the sensing area SSA (e.g., reference...). Figure 1B The first display area DA1 and the second display area DA2 can have various suitable shapes and should not be subject to any particular restrictions.

[0098] According to an implementation, the second display area DA2 can be defined as being adjacent to the sensing area SSA (e.g., reference). Figure 1B Corresponding to. For example, when two sensing areas SSA are defined, two second display areas DA2 can be defined to correspond to the two sensing areas SSA (e.g., refer to). Figure 1B )overlapping.

[0099] When viewed in a plane (e.g., in a planar diagram), the second display area DA2 can be connected to the sensing area SSA (e.g., reference). Figure 1B The second display area DA2 may overlap with the sensing area SSA (e.g., reference). Figure 1B The dimensions of the second display area DA2 are the same or substantially the same as those of the sensing area SSA, but this disclosure is not limited thereto or thereby. In other words, the size of the second display area DA2 can be larger than that of the sensing area SSA (e.g., reference DA2). Figure 1B The dimensions of the electronic module 500 are thus increased, allowing for greater freedom in changing its position.

[0100] The second display area DA2 can be connected to the electronic module 500 (e.g., below) disposed below the display panel 210. Figure 1B The transmittance of the second display area DA2 can be greater than that of the first display area DA1. Therefore, light can be transmitted to the electronic module 500 (e.g., reference DA1) via the second display area DA2. Figure 1B Sending signals and / or receiving signals from electronic module 500 (e.g., reference 500) Figure 1B ) Receive signals (e.g., can be sent to electronic module 500 (e.g., reference) Figure 1B Easily transmit signals and / or receive signals from electronic module 500 (e.g., reference). Figure 1B (Easily receive signals).

[0101] When viewed in a plane (e.g., in a planar diagram), the second display area DA2 can have various suitable shapes. For example... Figure 2As shown, the second display area DA2 may have a quadrilateral shape, but this disclosure is not limited thereto. According to an embodiment, the second display area DA2 may have a circular shape.

[0102] As a representative example Figure 2 The diagram shows a structure in which the second display area DA2 is defined at the upper left portion of the display area DA, but this disclosure is not limited thereto. In some other examples, depending on (e.g., depending on) the location of the electronic module 500, the second display area DA2 may be defined at various other suitable areas, such as the upper right portion, central (e.g., center) portion, lower left portion, or lower right portion of the display area DA.

[0103] Figure 2 A second display area DA2 is shown, but this disclosure is not limited to or restricted by it, and multiple second display areas DA2 may be provided. Depending on the purpose of the electronic module 500, the second display areas DA2 may be defined as two or more areas spaced apart from each other (e.g., separated). For example, one of the second display areas DA2 may be defined in the upper left portion of the display area DA, and another of the second display areas DA2 may be defined in the upper right portion of the display area DA. Each of the second display areas DA2 may be surrounded by a first display area DA1 (e.g., the first display area DA1 surrounds the periphery of each of the second display areas DA2).

[0104] The density of pixels PX arranged in the first display area DA1 can be different from the density of pixels PX arranged in the second display area DA2, which can increase the transmittance of the second display area DA2. Furthermore, the resolution of the second display area DA2 can be lower than the resolution of the first display area DA1.

[0105] For example, for the same unit area, the number of pixels PX arranged in the second display area DA2 can be less than the number of pixels PX arranged in the first display area DA1. In other words, the planar area of ​​the pixels PX arranged in the second display area DA2 can be less than the planar area of ​​the pixels PX arranged in the first display area DA1. This will be referenced below. Figure 3A and Figure 3B The pixels PX arranged in the first display area DA1 and the second display area DA2 are described in more detail.

[0106] Figure 3A and Figure 3B This is an enlarged plan view showing a portion of a display panel according to one or more embodiments of the present disclosure. Figure 3A and Figure 3B The area shown includes the boundary between the first display area DA1 and the second display area DA2.

[0107] refer to Figure 3A and Figure 3B Each of the display panels 210a and 210b may include a plurality of light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2, and a non-light-emitting region NPXA surrounding the light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 (e.g., around the periphery of the light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2). The light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 may correspond to a plurality of light-emitting pixels. Depending on the emission color of the light-emitting pixels, the light-emitting pixels may include a first light-emitting pixel, a second light-emitting pixel, and a third light-emitting pixel. The first to third light-emitting pixels may correspond to the aforementioned pixel PX.

[0108] The light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 may include first light-emitting regions P-R1 and P-R2, second light-emitting regions P-G1 and P-G2, and third light-emitting regions P-B1 and P-B2. The first light-emitting regions P-R1 and P-R2 may correspond to first light-emitting pixels, the second light-emitting regions P-G1 and P-G2 may correspond to second light-emitting pixels, and the third light-emitting regions P-B1 and P-B2 may correspond to third light-emitting pixels.

[0109] The first emitting regions P-R1 and P-R2, the second emitting regions P-G1 and P-G2, and the third emitting regions P-B1 and P-B2 can be distinguished from each other based on (for example, depending on) the color of the light emitted from them. For example, the first emitting regions P-R1 and P-R2 can be regions for emitting red light, the second emitting regions P-G1 and P-G2 can be regions for emitting green light, and the third emitting regions P-B1 and P-B2 can be regions for emitting blue light.

[0110] The first light-emitting regions P-R1 and P-R2, the second light-emitting regions P-G1 and P-G2, and the third light-emitting regions P-B1 and P-B2 can be set to be spaced apart from each other. For example... Figure 3A and Figure 3B As shown, the first light-emitting regions P-R1 and P-R2 and the third light-emitting regions P-B1 and P-B2 can be arranged alternately on the first direction DR1 and the second direction DR2. The second light-emitting regions P-G1 and P-G2 can be arranged along the diagonal direction defined between the first direction DR1 and the second direction DR2. Figure 3A and Figure 3BThe arrangement of the first light-emitting regions P-R1 and P-R2, the second light-emitting regions P-G1 and P-G2, and the third light-emitting regions P-B1 and P-B2 shown in the figure is an RGBG matrix structure (or alternatively referred to as...). structure, (This is a registered trademark of Samsung Display Co., Ltd., Yongin City, South Korea). However, this disclosure is not limited thereto, and the arrangement of the light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2 and P-B2 can be any suitable arrangement, such as a stripe structure in which the light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2 and P-B2 are arranged sequentially in one direction, but this disclosure is not particularly limited thereto.

[0111] The first luminescent regions P-R1 and P-R2, the second luminescent regions P-G1 and P-G2, and the third luminescent regions P-B1 and P-B2 may have different dimensions from each other. In this case, the size may refer to the planar area when viewed in a plane (e.g., in a planar diagram). As an example, when viewed in a plane (e.g., in a planar diagram), the size of the third luminescent region P-B1 may be the largest among the luminescent regions, and the size of the second luminescent region P-G1 may be the smallest among the luminescent regions, but this disclosure is not limited thereto or thereby restricted. The luminescent regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 may have the same or substantially the same size as each other, or may have various suitable sizes depending on (e.g., depending on) their emission color, and therefore, this disclosure is not particularly limited.

[0112] When viewed in a plane (e.g., in a planar diagram), the luminescent regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 can have various suitable shapes, such as circular shapes, polygonal shapes, etc. The first luminescent regions P-R1 and P-R2, the second luminescent regions P-G1 and P-G2, and the third luminescent regions P-B1 and P-B2 can have different shapes from each other, or they can have the same or substantially the same shape. However, the shapes of the first luminescent regions P-R1 and P-R2, the second luminescent regions P-G1 and P-G2, and the third luminescent regions P-B1 and P-B2 are not limited to or restricted by these shapes.

[0113] Some luminescent regions P-R1, P-G1, and P-B1 may overlap with the first display region DA1, and other luminescent regions P-R2, P-G2, and P-B2 may overlap with the second display region DA2. The luminescent regions P-R1, P-G1, and P-B1 overlapping with the first display region DA1, and the luminescent regions P-R2, P-G2, and P-B2 overlapping with the second display region DA2, may be spaced apart from each other at different distances and / or may have different sizes. Therefore, the transmittance of the second display region DA2 may be higher than that of the first display region DA1.

[0114] refer to Figure 3A The sizes of the light-emitting areas P-R2, P-G2, and P-B2 that overlap with the second display area DA2 of the display panel 210a can be smaller than the sizes of the light-emitting areas P-R1, P-G1, and P-B1 that overlap with the first display area DA1 of the display panel 210a. As an example, the light-emitting areas P-R2, P-G2, and P-B2 that overlap with the second display area DA2 can have the same or substantially the same shape as the light-emitting areas P-R1, P-G1, and P-B1 that overlap with the first display area DA1, but can have smaller sizes than the light-emitting areas P-R1, P-G1, and P-B1 that overlap with the first display area DA1.

[0115] The non-emitting region NPXA overlapping the second display region DA2 may include an optically transparent portion. Therefore, when the sizes of the emitting regions P-R2, P-G2, and P-B2 overlapping the second display region DA2 are smaller than the sizes of the emitting regions P-R1, P-G1, and P-B1 overlapping the first display region DA1, the size of the non-emitting region NPXA can be increased at the second display region DA2. Thus, the transmittance of the second display region DA2 can be increased.

[0116] refer to Figure 3B The distance between the light-emitting areas P-R2, P-G2, and P-B2 that overlap with the second display area DA2 of the display panel 210b can be greater than the distance between the light-emitting areas P-R1, P-G1, and P-B1 that overlap with the first display area DA1. For ease of explanation, Figure 3B The diagram illustrates a first diagonal distance DD1 between adjacent first light-emitting regions P-R1 in the first display area DA1 and a second diagonal distance DD2 between adjacent first light-emitting regions P-R2 in the second display area DA2. Figure 3BIn the first distance DD1, the straight-line distance between the center of one first light-emitting area P-R1 and the center of another first light-emitting area P-R1 in the first display area DA1 is represented, and the second distance DD2, the straight-line distance between the center of one first light-emitting area P-R2 and the center of another first light-emitting area P-R2 in the second display area DA2 is represented.

[0117] The first distance DD1 and the second distance DD2 can be different from each other. For example, the second distance DD2 can be greater than the first distance DD1. Because the distances are different, for the same unit area, the number of light-emitting regions P-R2, P-G2, and P-B2 overlapping with the second display area DA2 can be less than the number of light-emitting regions P-R1, P-G1, and P-B1 overlapping with the first display area DA1. In other words, the density of light-emitting regions P-R2, P-G2, and P-B2 at the second display area DA2 can be less than the density of light-emitting regions P-R1, P-G1, and P-B1 at the first display area DA1. Therefore, the transmittance of the second display area DA2 can be increased.

[0118] Figure 4 This is a cross-sectional view showing the display panel according to an embodiment. Figure 4 A cross-section of a first light-emitting region P-R1 that overlaps with a first display region DA1 is schematically shown. The first light-emitting region P-R1 may correspond to a first light-emitting pixel.

[0119] refer to Figure 4 The display panel 210 may include a base layer BL, a circuit element layer DP-CL, a display element layer DP-OL, and a package layer TFL.

[0120] The base layer BL can be a display substrate on which a circuit element layer DP-CL and a display element layer DP-OL are disposed. The base layer BL can include at least one of a silicon substrate, a plastic substrate, a glass substrate, a polymer layer, and a stacked structure including multiple insulating layers.

[0121] The circuit element layer DP-CL can be disposed on the base layer BL. The circuit element layer DP-CL may include at least one insulating layer and circuit elements. The circuit elements may include signal lines and pixel driving circuits. The circuit element layer DP-CL can be formed by forming an insulating layer, a semiconductor layer, and a conductive layer through a coating process or a deposition process, and then patterning the insulating layer, the semiconductor layer, and the conductive layer through several photolithography processes.

[0122] According to an embodiment, the circuit element layer DP-CL may include a barrier layer BRL, a buffer layer BFL, a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, a fourth insulating layer 40, a fifth insulating layer 50, a sixth insulating layer 60, and a seventh insulating layer 70, as well as a plurality of thin-film transistors T1 and T2. The buffer layer BFL, the barrier layer BRL, and the first insulating layer 10, the second insulating layer 20, the third insulating layer 30, the fourth insulating layer 40, the fifth insulating layer 50, the sixth insulating layer 60, and the seventh insulating layer 70 may include at least one of inorganic layers and organic layers.

[0123] A barrier layer (BRL) can be disposed on the base layer (BL). The barrier layer (BRL) can prevent or substantially prevent impurities present in the base layer (BL) and / or moisture from the outside from diffusing into the thin-film transistors (T1 and T2). Impurities can be one or more gases or sodium generated by the pyrolysis of the base layer (BL).

[0124] A buffer layer (BFL) can be disposed on the barrier layer (BRL). A semiconductor pattern can be disposed on the buffer layer (BFL). The buffer layer (BFL) can increase the adhesion (e.g., adhesion strength) between the base layer (BL) and the semiconductor pattern.

[0125] Thin-film transistors T1 and T2 included in the circuit element layer DP-CL may include a first pixel transistor T1 and a second pixel transistor T2. The first pixel transistor T1 and the second pixel transistor T2 may be disposed at a first display area DA1. Multiple pixel transistors may be disposed in a second display area DA2 (e.g., reference...). Figure 3A and Figure 3B At location ), the first pixel transistor T1 and the second pixel transistor T2 can form a pixel PX with a light-emitting element OL disposed on the first pixel transistor T1 and the second pixel transistor T2 (e.g., reference). Figure 2 ).

[0126] Figure 4 The arrangement relationship between the first active portion A1, the second active portion A2, the first gate G1, the second gate G2, the first source S1, the second source S2, the first drain D1, and the second drain D2 that form the first pixel transistor T1 and the second pixel transistor T2 is shown.

[0127] In this embodiment, the first active portion A1 and the second active portion A2 may comprise different materials from each other. As an example, the first active portion A1 may comprise a polysilicon semiconductor, and the second active portion A2 may comprise a metal-oxide-semiconductor semiconductor. However, this disclosure is not limited thereto, and according to embodiments, the first active portion A1 and the second active portion A2 may comprise the same or substantially the same materials. In this case, the stacked structure of the circuit element layers DP-CL can be relatively simplified.

[0128] The first source S1 and the first drain D1 can have a higher doping concentration than the first active portion A1, and can function as electrodes. The second source S2 and the second drain D2 can be regions of the metal-oxide-semiconductor that have been reduced, and can also function as electrodes.

[0129] The circuit element layer DP-CL may further include an upper electrode UE. The upper electrode UE may be configured to overlap with the first gate G1. The upper electrode UE may be used together with the first gate G1 as the gate electrode of the first pixel transistor T1, or it may form a capacitor with the first gate G1. However, this is provided by way of example only, and therefore, this disclosure is not limited thereto. According to an embodiment, the upper electrode UE may be omitted from the display panel 210.

[0130] The display element layer DP-OL can be disposed on the circuit element layer DP-CL. The display element layer DP-OL may include a light-emitting element OL and a pixel-defining layer PDL. The light-emitting element OL may include an organic light-emitting diode or a quantum dot light-emitting diode. The light-emitting element OL may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electronic control layer ECL, and a second electrode CE, which are stacked sequentially on top of each other.

[0131] The first electrode AE ​​can be disposed on the seventh insulating layer 70. At least a portion of the first electrode AE ​​can be exposed through the opening OP of the pixel defining layer PDL. The plurality of openings OP of the pixel defining layer PDL can define light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 (e.g., reference). Figure 3A and Figure 3B Therefore, the luminescent regions P-R1, P-G1, P-B1, P-R2, P-G2, and P-B2 (e.g., reference) Figure 3A and Figure 3B The size of each of the following can correspond to the area of ​​the corresponding first electrode AE ​​exposed through the corresponding opening OP of the pixel-defining layer PDL. The non-light-emitting region NPXA can correspond to the pixel-defining layer PDL.

[0132] The hole control layer (HCL) and the electronic control layer (ECL) can be commonly disposed at the first light-emitting region P-R1 and the non-light-emitting region NPXA. An aperture mask can be used to jointly form the hole control layer (HCL) and the electronic control layer (ECL) for multiple pixels.

[0133] The emissive layer EML can be patterned to correspond to the opening OP of the pixel-defined layer PDL. The emissive layer EML can be formed differently depending on the emissive pixel. The emissive layer EML can be deposited in a manner different from that of the hole control layer HCL and the electron control layer ECL, which have film shapes. A mask assembly according to one or more embodiments of the present disclosure can be used to form an emissive layer EML with a suitable pattern (e.g., a predetermined pattern).

[0134] The emissive layer (EML) can have a structure in which multiple emissive layers are stacked on top of each other. The EML may include a first emissive layer EML1 and a second emissive layer EML2 disposed on the first emissive layer EML1. The color of light emitted from the first emissive layer EML1 may be the same as or substantially the same as the color of light emitted from the second emissive layer EML2. However, the wavelength range of the emission spectrum of the first emissive layer EML1 may differ from the wavelength range of the emission spectrum of the second emissive layer EML2. Each of the first emissive layer EML1 and the second emissive layer EML2 may be provided in a pattern shape corresponding to the opening OP of the pixel defining layer (PDL). The first emissive layer EML1 and the second emissive layer EML2 may be sequentially deposited and formed using a mask assembly, which will be described in more detail below. Figure 4 The structure in which the light-emitting layers EML1 and EML2 are stacked is shown, but this disclosure is not limited thereto, and the light-emitting layer EML corresponding to some light-emitting regions may have a single-layer structure.

[0135] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can be commonly disposed at the first light-emitting region P-R1 and the non-light-emitting region NPXA.

[0136] The encapsulation layer TFL can be disposed on the display element layer DP-OL. The encapsulation layer TFL may include multiple thin layers. The thin layers may include inorganic layers and organic layers. Some thin layers may be configured to improve optical efficiency, and some thin layers may be configured to protect the light-emitting element OL from oxygen and / or moisture.

[0137] Figure 5 This is a cross-sectional view showing a deposition apparatus according to an embodiment of the present disclosure, and Figure 6 This is a perspective view showing a mask assembly according to an embodiment of the present disclosure. The deposition apparatus DPA can be used to manufacture... Figure 4 The deposition process of the display panel 210, and more specifically, the deposition process for forming the light-emitting layer EML. The light-emitting layer EML formed by using the deposition apparatus DPA can be configured to... Figure 3A and Figure 3B The pattern shapes corresponding to the light-emitting areas P-R1, P-G1, P-B1, P-R2, P-G2 and P-B2 shown in the figure.

[0138] refer to Figure 5 The deposition apparatus (DPA) may include a deposition chamber (CB), a stationary component (CM), a deposition source (DS), and a mask assembly (MSA). In some embodiments, the deposition apparatus (DPA) may also include additional mechanical equipment to enable an online system.

[0139] The deposition conditions of the deposition chamber CB can be set to a vacuum state. The deposition chamber CB may include a bottom surface, a top surface, and sidewalls. The bottom surface of the deposition chamber CB may be parallel to or substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the bottom surface of the deposition chamber CB may be parallel to or substantially parallel to the third direction DR3.

[0140] A fixing member CM can be disposed within the deposition chamber CB. The fixing member CM can be disposed above the deposition source DS and can be mounted on the top surface of the deposition chamber CB. The fixing member CM can include a body BD and a magnetic member MM connected to (e.g., coupled to or attached to) the body BD.

[0141] The body BD may include a plate that secures the mask assembly MSA to a target substrate WS disposed between the body BD and the mask assembly MSA. However, the body BD is not limited to this, as long as the mask assembly MSA is secured. A magnetic component MM may be disposed inside or outside the body BD. The magnetic component MM can use magnetic force to secure the mask assembly MSA.

[0142] The deposition source DS may include a deposition material. The deposition material may be a sublimable or evaporable material, and may include at least one of metallic, inorganic, and organic materials. As an example, the deposition source DS may include a luminescent material to form a luminescent layer EML (e.g., reference...). Figure 4 ).

[0143] The deposition material included in the deposition source DS can be ejected as deposition vapor DM. The deposition vapor DM can be deposited on the target substrate WS by a mask assembly MSA to form a suitable pattern (e.g., a predetermined pattern).

[0144] The stage ST can be located within the deposition chamber CB and can be positioned above the deposition source DS. The stage ST can support the mask assembly MSA. The stage ST may also include a driver for moving the mask assembly MSA to precisely align the mask assembly MSA with the target substrate WS. The stage ST can be located outside the path of the deposition vapor DM supplied from the deposition source DS to the target substrate WS.

[0145] The mask assembly (MSA) can be mounted on the stage (ST) within the deposition chamber (CB). The mask assembly (MSA) may include a mask (MSK) and a frame (FM). The target substrate (WS) may be mounted on the mask assembly (MSA).

[0146] The target substrate WS may include a glass substrate or a plastic substrate. For example, the target substrate WS may include a polymer layer disposed on a base substrate, which may be removed in a subsequent part of the manufacturing process of the display panel 210, and the polymer layer may correspond to... Figure 4 The base layer BL of the display panel 210 shown is shown. However, this disclosure is not limited thereto or thereby.

[0147] After performing a deposition process using a deposition apparatus (DPA), such as Figure 3A and Figure 3B As shown, a light-emitting pattern layer corresponding to the light-emitting regions P-R1, P-G1, P-B1, P-R2, P-G2 and P-B2 can be formed on the target substrate WS.

[0148] The target substrate WS on which the deposition process is performed can be a substrate on which a plurality of display panels 210 are formed before dicing. A plurality of display panels 210 can be provided by dicing along dicing lines defined in the target substrate WS and separating portions of the target substrate WS from each other, but this disclosure is not limited thereto. According to an embodiment, depending on the size of the display panel 210 to be manufactured, the target substrate WS can be a substrate on which a display panel 210 is formed.

[0149] refer to Figure 6 The mask assembly (MSA) may include a frame (FM) and multiple mask elements (MSKs). For ease of illustration, the frame (FM) and mask elements (MSKs) are... Figure 6 They are shown as being separated from each other.

[0150] The frame FM can be provided with a frame opening OP-F defined to pass through it. The frame opening OP-F can be a hole passing through the frame FM from the upper surface to the lower surface of the frame FM. A portion of the lower surface of the mask MSK can be exposed to the deposition source DS through the frame opening OP-F.

[0151] When viewed in a plane (e.g., in a plan view), the frame FM may have a quadrilateral ring shape, but this disclosure is not limited thereto or thereby restricted. According to embodiments, when viewed in a plane (e.g., in a plan view), the frame FM may have a polygonal ring shape or a circular ring shape, but this disclosure is not limited thereto, and the shape of the frame FM is not particularly limited, as long as the frame FM can support the mask MSK.

[0152] The frame FM may include metallic materials. For example, the frame FM may include nickel (Ni), nickel-cobalt alloy, nickel-iron alloy, stainless steel (SUS), or Invar alloy, but this disclosure is not limited thereto, and the materials used for the frame FM are not limited thereto or thereby restricted.

[0153] The mask MSK can be disposed on the frame FM. The mask MSK can extend in the second direction DR2 and can be arranged along the first direction DR1. Compared with the frame FM, the mask MSK can include a metallic material with a relatively small coefficient of thermal expansion. The mask MSK can include nickel (Ni), nickel-cobalt alloy, nickel-iron alloy, etc.

[0154] Each of the mask MSKs may include a main body portion MSB and a cell opening OP-M. The main body portion MSB can form the appearance of the mask MSK. When viewed in a plane (e.g., in a planar view), the main body portion MSB may include a cell region CA and a peripheral region EA surrounding the cell region CA (e.g., around the periphery of the cell region CA).

[0155] The cell regions CA can be defined as multiple, and the multiple cell regions CA can be spaced apart from each other along the second direction DR2. The peripheral region EA can surround the cell regions CA (e.g., around the periphery of the cell regions CA). The cell regions CA of the mask MSK included in the mask assembly MSA can be arranged in a matrix form along the first direction DR1 and the second direction DR2.

[0156] Cell openings OP-M can be arranged in each of the cell regions CA according to appropriate rules (e.g., predetermined rules or specific rules). Cell openings OP-M can be defined as extending through the body portion MSB of the mask MSK. When viewed in a plane (e.g., in a planar view), cell openings OP-M can have a shape corresponding to the shape of the emissive layer EML to be deposited therefrom. As an example, when viewed in a plane (e.g., in a planar view), the shape of cell openings OP-M can correspond to... Figure 3A The shapes of the first luminescent regions P-R1 and P-R2, the second luminescent regions P-G1 and P-G2, or the third luminescent regions P-B1 and P-B2 are shown in the figure.

[0157] At least one mask in a mask MSK may include multiple marker patterns and apertures HO. An aperture HO may be defined to overlap with a peripheral region EA. An aperture HO may define a portion MSB that passes through the main body of the mask MSK. An aperture HO may be defined to be adjacent to one of the marker patterns, as will be described in more detail below.

[0158] Masks MSK can be attached to (e.g., joined to or attached to) frame FM via a welding process. In the manufacturing process of mask assembly MSA, each of the mask MSKs can be tensioned in a first direction DR1 and / or a second direction DR2, and then each of the tensioned mask MSKs can be welded to frame FM.

[0159] Since the mask assembly MSA comprises multiple mask MSKs that are separate from each other, mask sagging can be prevented from occurring more frequently in the mask MSKs compared to sagging in a large mask corresponding to a frame FM. According to an embodiment, the mask assembly MSA may include a mask MSK having an integral plate shape extending in a first direction DR1 and a second direction DR2, but this disclosure is not limited thereto.

[0160] Figure 7 It is shown Figure 6 An enlarged plan view of part V1 of the mask assembly shown. Figure 7 This is a plan view showing one of the masks MSK included in the mask assembly MSA, namely mask MSK1.

[0161] refer to Figure 7 The mask MSK1 may include a main body portion MSB, cell openings OP-M1 and OP-M2, and marking patterns MA1 and MA2. For ease of illustration, the cell openings OP-M1 and OP-M2 included in the mask MSK1 may be shown exaggerated relative to actual scale.

[0162] The main body portion MSB may include a cell region CA and a peripheral region EA surrounding the cell region CA (e.g., around the periphery of the cell region CA). The cell region CA may include a first region CA1 and a second region CA2. In the deposition process, the first region CA1 may correspond to the first display region DA1 of the display panel 210 (e.g., reference DA1). Figure 3A The second region CA2 may correspond to the second display region DA2 of the display panel 210 (for example, refer to...). Figure 3A ).

[0163] Element openings OP-M1 and OP-M2 may be defined at element region CA and may be spaced apart from each other. Element openings OP-M1 and OP-M2 may include a first element opening OP-M1 defined at a first region CA1 and a second element opening OP-M2 defined at a second region CA2.

[0164] The first unit opening OP-M1 may have a shape similar to that deposited in the first display area DA1 (e.g., reference). Figure 3A The shape corresponds to the shape of some light-emitting patterns that emit light of the same color as each other in the light-emitting pattern at the location. As an example, the shape of the first unit opening OP-M1 may correspond to the shape of the first display area DA1 (e.g., reference). Figure 3A The shape of the first overlapping luminescent region P-R1.

[0165] The second unit opening OP-M2 can have the same shape as the deposition in the second display area DA2 (e.g., reference). Figure 3AThe shape corresponds to the shape of some light-emitting patterns that emit light of the same color as each other in the light-emitting pattern at the location. As an example, the shape of the second unit opening OP-M2 may correspond to the shape of the second display area DA2 (e.g., reference). Figure 3A The shape of the overlapping first luminescent region P-R2.

[0166] Each of the first unit opening OP-M1 and the second unit opening OP-M2 can be arranged according to an appropriate rule (e.g., a predetermined rule or a specific rule). As an example, the first unit opening OP-M1 and the second unit opening OP-M2 can be arranged to correspond to the arrangement of the first light-emitting regions P-R1 and P-R2 defined at the display area DA of the display panel 210.

[0167] The first unit opening OP-M1 can be different from the second unit opening OP-M2. The second unit opening OP-M2 can have a different size (e.g., area) than the first unit opening OP-M1. As an example, Figure 7 As shown, when viewed in a plane (e.g., in a plan view), the area of ​​the second unit opening OP-M2 can be smaller than the area of ​​the first unit opening OP-M1.

[0168] Furthermore, in the mask according to the embodiment, the distance between adjacent second cell openings OP-M2 may be different from the distance between adjacent first cell openings OP-M1 (for example, see...). Figure 3B For example, the distance between adjacent second unit openings OP-M2 can be greater than the distance between adjacent first unit openings OP-M1.

[0169] The first unit opening OP-M1 and the second unit opening OP-M2 may have different sizes, or the distance between adjacent first unit openings OP-M1 and the distance between adjacent second unit openings OP-M2 may be different. Depending on (e.g., depending on) some areas, using a mask MSK1 that includes first unit openings OP-M1 and second unit openings OP-M2 with different sizes and / or separation distances, the display panel 210 can be manufactured to include light-emitting pixels with different sizes and / or separation distances in some areas.

[0170] The first unit opening OP-M1 and the second unit opening OP-M2 can define a passage through the main body portion MSB. The first unit opening OP-M1 and the second unit opening OP-M2 can be formed by etching the main body portion MSB using a photomask.

[0171] Marker patterns MA1 and MA2 can be disposed at the peripheral region EA. As an example, marker patterns MA1 and MA2 can be disposed at the upper left portion of the mask MSK1, but this disclosure is not limited thereto. According to embodiments, marker patterns MA1 and MA2 can be disposed at the upper central portion of the mask MSK1, or between the cell regions CA of the mask MSK1. The positions of marker patterns MA1 and MA2 can be determined based on (e.g., depending on) the alignment mark AM of the target substrate WS (e.g., reference). Figure 12 The position of the document may vary, but this disclosure is not specifically limited thereto.

[0172] The marking patterns MA1 and MA2 can be spaced apart from each other in one direction. Figure 7 Marking patterns MA1 and MA2 are shown spaced apart from each other in a first direction DR1, but this disclosure is not limited thereto or thereby restricted. According to an embodiment, marking patterns MA1 and MA2 may be connected to each other, and a recessed pattern may be inserted between them.

[0173] Marker patterns MA1 and MA2 can be patterns recessed from the upper or lower surface of the body portion MSB. Marker patterns MA1 and MA2 can be formed by a semi-etching process. When viewed in a plane (e.g., in a planar view), each of marker patterns MA1 and MA2 can have a single closed curve shape or multiple closed curve shapes.

[0174] Marker patterns MA1 and MA2 may be markers indicating the location where the hole HO is formed. The hole HO can be used as a reference for locating the first unit opening OP-M1 and the second unit opening OP-M2. Each of the marker patterns MA1 and MA2 may have a point-symmetric shape about a symmetric point. The symmetric point may correspond to the indication of the location where the hole HO is formed.

[0175] Marker patterns MA1 and MA2 may have the same or substantially the same shape as each other, but this disclosure is not limited to or restricted by this. For example, marker patterns MA1 and MA2 may have different shapes as long as they can indicate the location of the hole HO.

[0176] Marker patterns MA1 and MA2 can serve as indicators for locating unit openings OP-M1 and OP-M2. The positions of marker patterns MA1 and MA2, as well as unit openings OP-M1 and OP-M2, can be varied (e.g., depending on) the tension of mask MSK1. The marker patterns MA1 and MA2, as well as unit openings OP-M1 and OP-M2, included in mask MSK1 can be designed to account for positional variations caused by tension.

[0177] Marker patterns MA1 and MA2 can be formed in parallel (e.g., simultaneously or substantially simultaneously) with cell openings OP-M1 and OP-M2 of mask MSK1. As an example, in the same etching process, cell openings OP-M1 and OP-M2 can be etched to penetrate the body portion MSB, and marker patterns MA1 and MA2 can be etched to be recessed from the upper or lower surface of the body portion MSB, but this disclosure is not limited to or restricted by this. For example, marker patterns MA1 and MA2 can be formed by an additional process after forming cell openings OP-M1 and OP-M2.

[0178] The mask MSK1 may include an aperture HO defined at a peripheral region EA. The aperture HO can serve as a reference for aligning the mask assembly MSA and the target substrate WS with each other during the deposition process. The mask assembly MSA and the target substrate WS can be aligned by centering the aperture HO with an alignment mark AM (e.g., a reference) included at the target substrate WS. Figure 12 They align themselves with each other using the same reference point.

[0179] Hole HO can be defined as being adjacent to one of the marking patterns MA1 and MA2. Figure 7 The aperture HO is shown to be adjacent to the first marker pattern MA1 in the first marker pattern MA1 and the second marker pattern MA2, but this disclosure is not limited thereto. The position of the aperture HO may vary depending on the type (e.g., class) of the luminescent pattern to be deposited.

[0180] Hole HO may be formed during the manufacturing process of mask assembly MSA, but not during the process of forming unit openings OP-M1 and OP-M2 of mask MSK1. In other words, mask MSK1 may not include hole HO before being attached to (e.g., coupled to or attached to) frame FM. Hole HO may be formed after mask MSK1 is tensioned and attached to (e.g., coupled to or attached to) frame FM, or it may be formed before mask MSK1 is tensioned.

[0181] Hole HO can be used in deposition processes to allow the target substrate WS to be aligned with the mask assembly MSA (e.g., reference). Figure 5 Alignment indication. Furthermore, the aperture HO can be used to form a test film used to calibrate the target substrate WS and mask assembly MSA during the deposition process (see, for example, [link to documentation]). Figure 5 Alignment position between ).

[0182] The aperture HO can be formed through a process separate from that of the cell openings OP-M1 and OP-M2. Therefore, the number of photomasks used to manufacture masks in which the cell openings OP-M1 and OP-M2 are located at the same position as each other, and the aperture HO is located at different positions from each other, can be reduced.

[0183] Masks with identical aperture shapes and defined by identical positions can be used to deposit multiple light-emitting layers with identical light-emitting patterns on the same target substrate. However, masks with different aperture positions can be used in each deposition process to form test films spaced apart from each other and used as references for positioning each of the deposited light-emitting layers.

[0184] More specifically, a test film formed on the target substrate in parallel with (e.g., simultaneously or substantially simultaneously with) the luminescent pattern can be used to inspect and correct the alignment of the mask and the target substrate with each other. The test film can be formed through apertures defined by the mask. Because the alignment of the mask and target substrate is corrected with respect to the location where the test film is formed, the test films can be formed spaced apart from each other for precise correction for each deposition layer. Therefore, the mask used in each deposition process can be configured with apertures defined at different locations.

[0185] According to the comparative method, the mask is manufactured with holes defined in the upper and lower portions of the peripheral region, and the mask is rotated 180 degrees while being used in a deposition process for light-emitting patterns having the same shape as each other. However, after rotating the mask 180 degrees as in the comparative method, it may be impossible to use a mask with cell openings having different shapes depending on the region in which the cell openings are defined.

[0186] However, according to one or more embodiments of this disclosure, a mask including a marking pattern indicating the location of formed holes can be configured to manufacture a mask through which cell openings formed at the same location and of the same shape are defined, and through which holes are defined at different locations. In other words, after manufacturing multiple masks including cell openings and marking patterns at the same location using the same photomask, the location of the holes can be selectively configured to be adjacent to any suitable marking pattern in the marking pattern based on the light-emitting pattern formed by using the mask. Therefore, the mask manufacturing process can be simplified, and the mask manufacturing cost can be reduced.

[0187] Figure 8A This illustrates an embodiment according to the present disclosure. Figure 6 A plan view of part V2 of the mask assembly shown. Figure 8B and Figure 8C It is along Figure 8A A cross-sectional view taken along line I-I' to illustrate the mask assembly according to various embodiments of the present disclosure. Figures 8A to 8C In the figures, the same reference numerals are used to indicate the above references. Figures 1A to 7 The same or substantially the same elements are described, and therefore, their redundant descriptions need not be repeated.

[0188] Marking patterns MA1 and MA2 may include a first marking pattern MA1 and a second marking pattern MA2. Each of the first marking pattern MA1 and the second marking pattern MA2 may have a point-symmetric shape about a corresponding symmetric point. The first marking pattern MA1 may have a point-symmetric shape about a first symmetric point C1, and the second marking pattern MA2 may have a point-symmetric shape about a second symmetric point C2.

[0189] Each of the first marking pattern MA1 and the second marking pattern MA2 may include one or more recessed portions HF1, HF2, HF3, and HF4. The recessed portions HF1, HF2, HF3, and HF4 may have a shape that recesses from the upper surface MSB-U or lower surface MSB-B of the body portion MSB of the mask MSK1. The marking patterns MA1 and MA2 may include the recessed portions HF1, HF2, HF3, and HF4 to indicate the location where the aperture HO is formed.

[0190] When viewed in a plane (e.g., in a planar diagram), the recessed portions HF1, HF2, HF3, and HF4 can have a closed curve shape. As an example, Figure 8A Each of the recessed portions HF1, HF2, HF3, and HF4 is shown as having a quadrilateral closed curve shape in a plane (e.g., in a plan view). However, this disclosure is not limited to this or by it, and the recessed portions HF1, HF2, HF3, and HF4 may have any suitable closed curve shape in a plan view, such as a polygonal shape, a circular shape, or a toroidal shape.

[0191] When viewed in a plane (e.g., in a plan view), the recessed portions HF1, HF2, HF3, and HF4 may have the same or substantially the same shape as each other, but this disclosure is not limited thereto or thereby restrictive. According to embodiments, some of the recessed portions HF1, HF2, HF3, and HF4 may have a shape different from that of the other recessed portions HF1, HF2, HF3, and HF4. For example, some of the recessed portions HF1, HF2, HF3, and HF4 may have a quadrilateral shape, and the other recessed portions HF1, HF2, HF3, and HF4 may have a triangular shape.

[0192] The recessed portions HF1, HF2, HF3, and HF4 can be point-symmetric with respect to the symmetrical points C1 and C2 of the marking patterns MA1 and MA2. (Reference) Figure 8A The recessed portions HF1, HF2, HF3 and HF4 included in the first marking pattern MA1 can be referred to as the first recessed portion HF1, the second recessed portion HF2, the third recessed portion HF3 and the fourth recessed portion HF4, respectively.

[0193] The first recessed portion HF1 and the third recessed portion HF3 can be symmetrical about a first symmetry point C1 along the second direction DR2. The second recessed portion HF2 and the fourth recessed portion HF4 can be symmetrical about a first symmetry point C1 along the first direction DR1. Each of the first recessed portion HF1 and the third recessed portion HF3 can have a quadrilateral shape with a long side extending along the second direction DR2, and each of the second recessed portion HF2 and the fourth recessed portion HF4 can have a quadrilateral shape with a long side extending along the first direction DR1.

[0194] A hole HO can be defined as being adjacent to one of the first marking patterns MA1 and the second marking pattern MA2. A hole HO can be formed to overlap with a symmetrical point of a marking pattern. As an example, Figure 8A The diagram shows that the hole HO is defined as being adjacent to the first marking pattern MA1 and overlapping with the first symmetrical point C1, but this disclosure is not limited thereto. In this case, the center point of the hole HO may correspond to the first symmetrical point C1 of the first marking pattern MA1.

[0195] The hole HO may be defined as being spaced apart from the recessed portions HF1, HF2, HF3, and HF4, but this disclosure is not limited thereto or thereby restrictive. According to an embodiment, the hole HO may be defined as overlapping with at least one recessed portion. As an example, Figure 8A The diagram shows that when viewed in a plane (e.g., in a plan view), the hole HO is spaced apart from the first recessed portion HF1, the second recessed portion HF2, the third recessed portion HF3, and the fourth recessed portion HF4 included in the first marking pattern MA1.

[0196] refer to Figure 8B The recessed portions HF1, HF2, HF3, and HF4 can be portions recessed from the upper surface MSB-U of the main body portion MSB. Each of the recessed portions HF1, HF2, HF3, and HF4 can be formed by a semi-etching process. The thickness DI1 of the main body portion MSB overlapping with the recessed portions HF1, HF2, HF3, and HF4 can be less than the thickness DI2 of the main body portion MSB that does not overlap with the recessed portions HF1, HF2, HF3, and HF4.

[0197] refer to Figure 8C The recessed portions HF1, HF2, HF3, and HF4 can be portions recessed from the lower surface MSB-B of the main body portion MSB. These recessed portions HF1, HF2, HF3, and HF4, recessed from the lower surface MSB-B of the main body portion MSB, can also be formed using a semi-etching process. Similar to the above reference... Figure 8BIn the described implementation, the thickness DI3 of the main body portion MSB that overlaps with the recessed portions HF1, HF2, HF3 and HF4 can be less than the thickness DI2 of the main body portion MSB that does not overlap with the recessed portions HF1, HF2, HF3 and HF4.

[0198] refer to Figure 8A and Figure 8B The orifice HO can be defined to pass through the main body portion MSB. The orifice HO can be spaced apart from the recessed portions HF1, HF2, HF3, and HF4. (See reference) Figure 8B The thickness DI2 of the main body portion MSB adjacent to the hole HO can be greater than the thickness DI1 of the main body portion MSB overlapping with the recessed portions HF1, HF2, HF3 and HF4.

[0199] When viewed in a plane (e.g., in a planar view), the frame opening OP-F, which defines the passage through the frame FM, can overlap with the aperture HO and the first unit opening OP-M1. In the deposition process, deposition vapor DM ejected from the deposition source DS can be deposited on the target substrate WS after passing through the frame opening OP-F, the aperture HO, and the first unit opening OP-M1.

[0200] The direction of the laser beam irradiation to form the aperture HO can vary according to the reference plane of the main body portion MSB, from which recessed portions HF1, HF2, HF3, and HF4 are provided. For example, as Figure 8B As shown, when the recessed portions HF1, HF2, HF3, and HF4 are recessed from the upper surface MSB-U of the main body portion MSB, the laser beam can irradiate the upper surface MSB-U. Figure 8C As shown, when the recessed portions HF1, HF2, HF3 and HF4 are recessed from the lower surface MSB-B of the main body portion MSB, the laser beam can irradiate the lower surface MSB-B.

[0201] Figure 9A This illustrates an embodiment of the present disclosure. Figure 6 The enlarged plan view of the mask assembly corresponding to part V2 shown in the figure. Figure 9B and Figure 9C It is along Figure 9A A cross-sectional view taken along line II-II' is provided to illustrate the mask assembly according to various embodiments of the present disclosure. Except that the shapes of the marking patterns MA1 and MA2 may differ, Figure 9A The mask component MSA shown can have the same characteristics as... Figure 8A The mask components MSA shown have the same or substantially the same configuration. Therefore, their redundant description need not be repeated.

[0202] refer to Figure 9AEach of the marking patterns MA1 and MA2 may include a recessed portion HF1 having a single overall shape. As an example, Figure 9A The diagram shows a cross-shaped recessed portion HF1 in which a strip extending in the first direction DR1 intersects (e.g., crosses) a strip extending in the second direction DR2.

[0203] When viewed in a plane (e.g., in a planar view), the recessed portion HF1 can have a closed curve shape. The shape of the recessed portion HF1 is not particularly limited, as long as it indicates the location where the hole HO is formed. The recessed portion HF1 can have a point-symmetric shape about a symmetrical point of the marking pattern. As an example, the recessed portion HF1 included in the first marking pattern MA1 can have a point-symmetric shape about a first symmetrical point C1. The recessed portion HF1 can overlap with the first symmetrical point C1.

[0204] The hole HO can be defined as overlapping the recessed portion HF1. ​​In other words, the hole HO can be defined as the portion that passes through the main body portion MSB and overlaps with the recessed portion HF1. ​​(See reference) Figure 9B and Figure 9C The hole HO can be integrally formed with the recessed portion HF1. ​​The hole HO can be integrally connected to the recessed portion HF1. Figure 9B The recessed portion HF1 shown can be recessed from the upper surface MSB-U of the main body portion MSB and can be integrally formed with the hole HO. Figure 9C The recessed portion HF1 shown can be recessed from the lower surface MSB-B of the main body portion MSB and can be integrally formed with the hole HO. (Reference) Figure 9B The thickness DI1 of the main body portion MSB adjacent to the hole HO can be less than the thickness DI2 of the main body portion MSB that does not overlap with the recessed portion HF1.

[0205] The number and / or shape of the recessed portions forming the marking patterns MA1 and MA2 can be modified as needed or desired. Figure 8A and Figure 9A The shapes of the marking patterns MA1 and MA2 shown are provided as examples only, and this disclosure is not particularly limited thereto, provided that the marking patterns MA1 and MA2 can indicate the location where the hole HO is formed.

[0206] Figures 10A to 10F This is a plan view showing masks according to various embodiments. Figures 10A to 10F Each of the figures shows the mask MSK-C prior to the formation of the mask assembly MSA.

[0207] The marking patterns MA1 and MA2 included in the mask MSK-C can have various suitable shapes. The shapes of the marking patterns MA1 and MA2 can be modified differently depending on (for example, depending on) the shape of the recessed portions that form the marking patterns MA1 and MA2. Figures 10A to 10F Examples of marking patterns MA1 and MA2 with various suitable shapes according to various embodiments are shown. However, the shapes of marking patterns MA1 and MA2 are not limited to or restricted by these embodiments.

[0208] In more detail, Figures 10A to 10F A first marking pattern MA1 and a second marking pattern MA2 having the same or substantially the same shape are shown, but this disclosure is not limited thereto or thereby restricted. According to embodiments, the first marking pattern MA1 and the second marking pattern MA2 may have different shapes from each other.

[0209] refer to Figures 10A to 10E The first marking pattern MA1 and the second marking pattern MA2 may be spaced apart from each other in one direction, but this disclosure is not limited thereto or thereby restricted. Figure 10F As shown, the first marking pattern MA1 and the second marking pattern MA2 can indicate different locations where holes are formed, and can be connected to each other by the recessed pattern HFP.

[0210] refer to Figures 10A to 10C Each of the first marking pattern MA1 and the second marking pattern MA2 may include multiple recessed portions. (See reference) Figure 10D and Figure 10E Each of the first marking pattern MA1 and the second marking pattern MA2 may include a recessed portion.

[0211] refer to Figure 10A The first marking pattern MA1 may include a first recessed portion HF1-1, a second recessed portion HF2-1, a third recessed portion HF3-1 and a fourth recessed portion HF4-1 with a point symmetry relationship, and the second marking pattern MA2 may include a first recessed portion HF1-2, a second recessed portion HF2-2, a third recessed portion HF3-2 and a fourth recessed portion HF4-2 with a point symmetry relationship.

[0212] Each of the first recessed portion HF1-1, the second recessed portion HF2-1, the third recessed portion HF3-1, and the fourth recessed portion HF4-1 of the first marking pattern MA1, and the first recessed portion HF1-2, the second recessed portion HF2-2, the third recessed portion HF3-2, and the fourth recessed portion HF4-2 of the second marking pattern MA2, can have a quadrilateral shape with a long side extending in one direction. Each of the first recessed portions HF1-1 and HF1-2, and the third recessed portions HF3-1 and HF3-2, can have a quadrilateral shape with a long side extending in a second direction DR2, and each of the second recessed portions HF2-1 and HF2-2, and the fourth recessed portions HF4-1 and HF4-2, can have a quadrilateral shape with a long side extending in a first direction DR1.

[0213] Similar to the above references Figure 8A The first marking pattern MA1 is described. The first recessed portion HF1-2 and the third recessed portion HF3-2 of the second marking pattern MA2 may have a symmetrical relationship about a second symmetry point C2 in the second direction DR2. The second recessed portion HF2-2 and the fourth recessed portion HF4-2 of the second marking pattern MA2 may have a symmetrical relationship about a second symmetry point C2 in the first direction DR1.

[0214] The center lines CL2 of the second recessed portion HF2-1 and the fourth recessed portion HF4-1 of the first marking pattern MA1 and the center lines CL2 of the second recessed portion HF2-2 and the fourth recessed portion HF4-2 of the second marking pattern MA2 can extend in the first direction DR1 and can be defined as being on the same line as each other.

[0215] In the first marking pattern MA1, the first symmetrical point C1 may correspond to the point where the center line CL1-1 of the first recessed portion HF1-1 and the third recessed portion HF3-1 intersects (e.g., crosses) the center line CL2 of the second recessed portion HF2-1 and the fourth recessed portion HF4-1. In the second marking pattern MA2, the second symmetrical point C2 may correspond to the point where the center line CL1-2 of the first recessed portion HF1-2 and the third recessed portion HF3-2 intersects (e.g., crosses) the center line CL2 of the second recessed portion HF2-2 and the fourth recessed portion HF4-2.

[0216] Besides the shape of its concave portion Figure 10B and Figure 10C The marking patterns MA1 and MA2 shown can be compared with the above reference. Figure 10A The described marking patterns MA1 and MA2 are the same or substantially the same. Therefore, their redundant descriptions need not be repeated.

[0217] refer to Figure 10B When viewed in a plane (e.g., in a planar diagram), each of the first recessed portions HF1-1 to HF4-1 of the first marking pattern MA1 and the first recessed portions HF1-2 to HF4-2 of the second marking pattern MA2 can have a triangular shape. The vertices of the first recessed portions HF1-1 and HF1-2 can respectively face the vertices of the third recessed portions HF3-1 and HF3-2 in the second direction DR2. The vertices of the second recessed portions HF2-1 and HF2-2 can respectively face the vertices of the fourth recessed portions HF4-1 and HF4-2 in the first direction DR1.

[0218] refer to Figure 10C When viewed in a plane (e.g., in a planar diagram), each of the first recessed portions HF1-1 to HF4-1 of the first marking pattern MA1 and each of the first recessed portions HF1-2 to HF4-2 of the second marking pattern MA2 may have a cross-shaped form. The first recessed portions HF1-1 to HF4-1 and the first recessed portions HF1-2 to HF4-2 may have the same or substantially the same area as each other.

[0219] refer to Figure 10D and Figure 10E The first marking pattern MA1 and the second marking pattern MA2 may include first recessed portions HF1-1 and HF1-2, which have point-symmetric shapes about symmetric points C1 and C2, respectively.

[0220] refer to Figure 10D When viewed in a plane (e.g., in a planar view), each of the first recessed portions HF1-1 and HF1-2 may have a ring shape. The first recessed portions HF1-1 and HF1-2 may each have a ring shape around points of symmetry C1 and C2 (e.g., around the periphery of points of symmetry C1 and C2). As an example, Figure 10D The diagram shows a first recessed portion HF1-1 of a first marking pattern MA1 having a point-symmetric annular shape about a first symmetric point C1, and a first recessed portion HF1-2 of a second marking pattern MA2 having a point-symmetric annular shape about a second symmetric point C2. However, this disclosure is not limited thereto, and the first recessed portions HF1-1 and HF1-2 may have polygonal annular shapes, such as quadrilateral annular shapes, but the shapes of the first recessed portions HF1-1 and HF1-2 are not particularly limited, as long as the first recessed portions HF1-1 and HF1-2 have a point-symmetric shape.

[0221] refer to Figure 10EEach of the first recessed portions HF1-1 and HF1-2 may have a polygonal shape. The first recessed portion HF1-1 of the first marking pattern MA1 may have a point-symmetric shape about a first symmetric point C1 and may overlap with the first symmetric point C1. The first recessed portion HF1-2 of the second marking pattern MA2 may have a point-symmetric shape about a second symmetric point C2 and may overlap with the second symmetric point C2. The shapes of the first recessed portions HF1-1 and HF1-2 are not particularly limited, as long as they have a polygonal shape possessing a point-symmetric shape.

[0222] refer to Figure 10F The first marking pattern MA1 and the second marking pattern MA2 can be connected to each other. The first recessed portion HF1-1 of the first marking pattern MA1 can have a strip shape with point symmetry about a first symmetry point C1 and extend in the second direction DR2. The first recessed portion HF1-2 of the second marking pattern MA2 can be spaced apart from the first recessed portion HF1-1 of the first marking pattern MA1 and can have a strip shape extending in the second direction DR2. The first recessed portion HF1-2 of the second marking pattern MA2 can have a point symmetry about a second symmetry point C2.

[0223] Figure 10F The mask MSK-C of the illustrated embodiment may include a recessed pattern HFP. A first recessed portion HF1-1 of a first marking pattern MA1 may overlap with a first symmetry point C1, and a first recessed portion HF1-2 of a second marking pattern MA2 may overlap with a second symmetry point C2. The recessed pattern HFP may extend in a first direction DR1 and may connect the first marking pattern MA1 and the second marking pattern MA2 to each other. The recessed pattern HFP may overlap with the first symmetry point C1 and the second symmetry point C2.

[0224] Figures 10A to 10F The first symmetry point C1 and the second symmetry point C2 shown can be indicators of the location where the aperture HO is formed. The aperture HO can be defined to overlap with either the first symmetry point C1 or the second symmetry point C2. The location where the aperture HO is formed on the mask MSK-C can vary depending on the type of luminescent pattern to be deposited using the mask MSK-C, and the user can selectively determine the location of the aperture HO.

[0225] The method for manufacturing the display panel will be described in more detail below. In the following embodiments, the same or substantially the same description of the components described above may be applied, without repeating any redundant descriptions, and the process of manufacturing the display panel will be described in more detail.

[0226] Figure 11This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment. The method for manufacturing a display panel may include forming a first mask assembly (S10), forming a second mask assembly (S20), forming a first pattern (S30), forming a second pattern (S40), adjusting the position of the first mask assembly (S50), and adjusting the position of the second mask assembly (S60).

[0227] Figure 12 This is a plan view showing the target substrate according to an embodiment. Figure 12 This illustrates the placement of elements in the deposition apparatus DPA (e.g., reference) during the manufacturing of a display panel. Figure 5 The target substrate WS is defined in the diagram. The deposition surface of the target substrate WS may be parallel to or substantially parallel to the surface defined by the first direction DR1 and the second direction DR2. The target substrate WS may include alignment marks AM.

[0228] The deposition surface of the target substrate WS may include a first substrate region A10 on which a light-emitting pattern is to be deposited and a second substrate region A20 adjacent to the first substrate region A10. The first substrate region A10 of the target substrate WS may be a DP-CL (e.g., reference 1) where a circuit element layer is formed during the deposition process of the light-emitting pattern. Figure 4 ), the area of ​​the electrodes of the light-emitting element OL and the pixel-defining layer PDL.

[0229] The second substrate region A20 may surround the first substrate region A10 (e.g., around the periphery of the first substrate region A10). Alignment marks AM may be provided at the second substrate region A20. The second substrate region A20 may overlap with the peripheral region EA of the mask MSK of the mask assembly MSA. The second substrate region A20 may be the region where the test film is formed, as described in more detail below.

[0230] Based on its positional relationship with the aperture HO that defines the passage through the mask MSK, the alignment mark AM can be used to align the position of the mask assembly MSA with the position of the target substrate WS. Furthermore, based on its positional relationship with the test film formed on the second substrate region A20, the alignment mark AM can be used to correct the alignment between the mask assembly MSA and the target substrate WS.

[0231] Figure 13A , Figure 13B and Figure 13D This is a plan view illustrating various processes of a method for manufacturing a display panel using a first mask assembly according to an embodiment of the present disclosure, and Figure 13C This is a cross-sectional view illustrating the process of manufacturing a display panel according to an embodiment of the present disclosure. Figures 14A to 14C This is a plan view illustrating various processes of a method for manufacturing a display panel using a second mask assembly according to an embodiment of the present disclosure.

[0232] A first mask assembly can be formed by connecting (e.g., coupling or attaching) a first mask and a first frame to each other. A first set of cell openings, a first set of marking patterns spaced apart from the first set of cell openings, and a first hole can be defined in the first mask of the first mask assembly. A second mask assembly can be formed by connecting (e.g., coupling or attaching) a second mask and a second frame to each other. A second set of cell openings, a second set of marking patterns spaced apart from the second set of cell openings, and a second hole can be defined in the second mask of the second mask assembly.

[0233] Any suitable unit openings described above can be applied to the first set of unit openings and the second set of unit openings, and any suitable marking patterns described above can be applied to the first set of marking patterns and the second set of marking patterns. These components are referred to as the first set and the second set to distinguish the components included in separate masks. Each of the first frame and the second frame can be referred to as a frame.

[0234] refer to Figures 13A to 13C Forming the first mask assembly MSA1 may include manufacturing the first mask MSK-C1, forming the first hole HO1, and tensioning the first mask MSK-C1 to connect (e.g., attach or attach) the first mask MSK-C1 to the frame FM.

[0235] refer to Figure 14A and Figure 14B Forming the second mask assembly may include manufacturing the second mask MSK-C2, forming the second hole HO2, and tensioning the second mask MSK-C2 to connect (e.g., attach or attach) the second mask MSK-C2 to the frame FM.

[0236] The positions and shapes of the unit openings OP-M1 and OP-M2 of the first mask MSK-C1 can be the same as those of the unit openings OP-M1 and OP-M2 of the second mask MSK-C2, and the positions of the holes HO1 and HO2 of the first mask MSK-C1 and the second mask MSK-C2 can be different from each other.

[0237] Manufacturing the first mask MSK-C1 may include forming cell openings OP-M1 and OP-M2 and marking patterns MA1 and MA2 in the main body portion MSB of the mask MSK-C. Manufacturing the second mask MSK-C2 may include forming cell openings OP-M1 and OP-M2 and marking patterns MA1 and MA2 using the same or substantially the same process as that used to manufacture the first mask MSK-C1. Therefore, the first mask MSK-C1 and the second mask MSK-C2 may include cell openings OP-M1 and OP-M2 that are identical or substantially identical to each other, as well as marking patterns MA1 and MA2 that are identical or substantially identical to each other.

[0238] refer to Figure 13A and Figure 14A The first unit opening OP-M1 can be formed in the first region CA1 of the mask MSK-C. A second unit opening OP-M2, which may differ from the first unit opening OP-M1, can be formed in the second region CA2 adjacent to the first region CA1. The mask MSK-C may include marking patterns MA1 and MA2 formed in the peripheral region EA.

[0239] The first unit opening OP-M1 and the second unit opening OP-M2 can be formed by etching through the main body portion MSB of the mask MSK-C. For example, the first unit opening OP-M1 and the second unit opening OP-M2 can be formed by photolithography.

[0240] Marker patterns MA1 and MA2 can be formed by a semi-etching process to create recesses from the upper surface MSB-U or lower surface MSB-B of the main body portion MSB of the mask MSK-C. Marker patterns MA1 and MA2 can be formed in parallel (e.g., simultaneously or substantially simultaneously) when the first unit opening OP-M1 and the second unit opening OP-M2 are formed. For example, marker patterns MA1 and MA2, as well as unit openings OP-M1 and OP-M2, can be formed by varying the degree of etching of the main body portion MSB during a photolithography process, but this disclosure is not limited to or restricted by this. According to an embodiment, marker patterns MA1 and MA2 can be formed after the formation of the first unit opening OP-M1 and the second unit opening OP-M2.

[0241] After forming the unit openings OP-M1 and OP-M2 and the marking patterns MA1 and MA2, the aperture can be formed adjacent to one of the marking patterns MA1 and MA2 of the mask MSK-C by irradiating one of the symmetrical points with a laser beam LS. The position of the formed aperture can vary depending on the position of the laser beam LS, and the first mask MSK-C1 and the second mask MSK-C2 can be classified according to the position of the aperture.

[0242] Figure 13A It is a plan view showing the process of forming the first hole HO1, and Figure 13B This is a plan view showing the first mask MSK-C1 through which the first hole HO1 is formed. Figure 14A It is a plan view showing the process of forming the second pore HO2, and Figure 14B This is a plan view showing the second mask MSK-C2 through which the second hole HO2 is formed.

[0243] refer to Figure 13A and Figure 13BThe first aperture HO1 can be formed by irradiating a laser beam LS onto a first symmetrical point C1, which is a symmetrical reference point for the shape of the first marking pattern MA1. The first aperture HO1 can overlap with the first symmetrical point C1 and can be formed to be adjacent to the first marking pattern MA1. The first aperture HO1 can be spaced apart from the second symmetrical point C2.

[0244] refer to Figure 14A and Figure 14B The second aperture HO2 can be formed by irradiating the second symmetry point C2, which is a symmetric reference point for the shape of the second marking pattern MA2. The second aperture HO2 can overlap with the second symmetry point C2 and can be formed adjacent to the second marking pattern MA2. The second aperture HO2 can be spaced apart from the first symmetry point C1. Therefore, the first mask MSK-C1 can include the same unit openings OP-M1 and OP-M2 as the unit openings OP-M1 and OP-M2 of the second mask MSK-C2, and can include a first aperture HO1 formed at a position different from the position of the second aperture HO2 of the second mask MSK-C2.

[0245] After the first aperture HO1 is formed, the first mask MSK-C1 can be tensioned and attached to (e.g., coupled to or attached to) the frame FM; however, this disclosure is not limited thereto. For example, according to an embodiment, after the mask MSK-C is tensioned and attached to (e.g., coupled to or attached to) the frame FM, the first aperture HO1 can be formed to form the first mask assembly MSA1. Similarly, after the second aperture HO2 is formed, the second mask MSK-C2 can be tensioned and attached to (e.g., coupled to or attached to) the frame FM. However, this disclosure is not limited thereto, and according to an embodiment, after the mask MSK-C is tensioned and attached to the frame FM, the first aperture HO1 can be formed to form the first mask assembly MSA1, or the second aperture HO2 can be formed to form the second mask assembly.

[0246] Figure 13C This is a cross-sectional view illustrating the process of depositing a luminescent pattern. As a representative example, Figure 13C A first mask assembly MSA1, including a first mask MSK-C1, is shown.

[0247] The first mask assembly MSA1 can be located in the deposition apparatus DPA (e.g., reference). Figure 5 The target substrate WS can then be positioned on the first mask assembly MSA1. The first mask assembly MSA1 can be aligned with the target substrate WS such that the center of the first aperture HO1 of the first mask MSK-C1 coincides with a reference point defined in the alignment mark AM of the target substrate WS.

[0248] When the first mask assembly MSA1 is aligned with the target substrate WS, deposition vapor DM can be deposited on the target substrate WS, and thus a light-emitting layer EML with the shape of the aforementioned light-emitting pattern can be formed. The shape of the light-emitting pattern can correspond to the shape of the cell openings OP-M1 and OP-M2.

[0249] The test film, which will be described in more detail below, can be formed in parallel (e.g., simultaneously or substantially simultaneously) with the light-emitting layer EML. The test film can be formed by depositing deposition vapor DM on the target substrate WS through holes in a mask.

[0250] Figure 13D This indicates that during execution Figure 13C The diagram shows a plan view of the first target substrate WS1 after the deposition process shown, which forms the first luminescent pattern P-Ra. The first target substrate WS1 can correspond to the target substrate WS on which the first luminescent pattern P-Ra is formed, overlapping with the first substrate region A10.

[0251] refer to Figure 13D For different display areas, the first emitting pattern P-Ra can have different shapes. The first emitting pattern P-R1a formed in the first display area DA1 can correspond to the shape of the first unit opening OP-M1 of the first mask MSK-C1. The first emitting pattern P-R2a formed in the second display area DA2 can correspond to the shape of the second unit opening OP-M2 of the first mask MSK-C1. The shape of the first emitting pattern P-Ra can correspond to any suitable one of the aforementioned first emitting areas P-R1 and P-R2.

[0252] The alignment marks AM of the target substrate WS may include multiple marks M1 to M6 to define multiple reference points. The first marks M1 to the fifth marks M5 may have a strip shape extending in the second direction DR2. The first marks M1 to the fifth marks M5 may be arranged along the first direction DR1 and may be spaced apart from each other. The sixth mark M6 may have a strip shape extending in the first direction DR1.

[0253] Alignment markers AM can be set with multiple reference points defined by markers M1 to M6. These reference points indicate the positions where a light-emitting pattern will be formed on the target substrate WS. When a corresponding reference point among the multiple reference points coincides with the center of a hole in the mask, a light-emitting pattern can be formed at a precise location. Figure 13D The first reference point MC-C1, defined by the first marker M1 and the sixth marker M6, is shown.

[0254] The first reference point MC-C1 can correspond to the point where the imaginary center line MC1 of the first mark M1 extending in the second direction DR2 intersects with the imaginary center line MC6 of the sixth mark M6 extending in the first direction DR1.

[0255] exist Figure 13C In the deposition process shown, the test film can be formed in the second substrate region A20 of the target substrate WS. Figure 13D A first test film TT1 is shown formed at a second substrate region A20 of the first target substrate WS1. The first test film TT1 can be formed with... Figure 13B The first hole HO1 of the first mask MSK-C1 shown corresponds to this. The first test film TT1 can indicate the deposition location of the first luminescent pattern P-Ra.

[0256] After the deposition process, it is possible to determine whether the first luminescent pattern P-Ra is deposited at a precise location based on the position of the first test film TT1, and the alignment position of the first mask assembly MSA1 can be corrected as needed or desired. More specifically, it is possible to determine whether the first luminescent pattern P-Ra is deposited at a precise location using the distances dx and dy between the center point TT1-C of the first test film TT1 and the first reference point MC-C1 in the first direction DR1 and the second direction DR2, respectively.

[0257] Figure 13D The diagram illustrates the deposition of a first test film TT1 offset from a first reference point MC-C1. The first test film TT1 is spaced from the first reference point MC-C1 by a distance dx in a first direction DR1 and by a distance dy in a second direction DR2. Therefore, based on this offset, it can be predicted that the first luminescent pattern P-Ra will also be deposited spaced from its precise deposition location by distances dx and dy. The position of the first mask assembly MSA1 can be adjusted based on the distances dx and dy of the first test film TT1 spaced from the first reference point MC-C1 to allow the formation of the first luminescent pattern P-Ra at a precise location in subsequent deposition processes.

[0258] Then, including the second luminescent pattern P-Rb and the second test film TT2 (e.g., reference). Figure 14C The second pattern can be deposited on the first target substrate WS1 by placing the first target substrate WS1 (on which a first pattern including the first luminescent pattern P-Ra and the first test film TT1 is formed) on the second mask assembly.

[0259] Figure 14C This is a plan view showing a second target substrate WS2 obtained by forming a second light-emitting pattern P-Rb on a first target substrate WS1. The second target substrate WS2 may correspond to the first target substrate WS1 on which the first light-emitting pattern P-Ra and the second light-emitting pattern P-Rb are formed, overlapping with the first substrate region A10.

[0260] The second luminescent pattern P-Rb can be a luminescent layer deposited on the first luminescent pattern P-Ra. The first luminescent pattern P-Ra and the second luminescent pattern P-Rb can have the same or substantially the same deposition shape and location. The first luminescent pattern P-Ra can correspond to the first luminescent layer EML1, and the second luminescent pattern P-Rb can correspond to the formation on the first luminescent layer EML1 (e.g., see...). Figure 4 The second light-emitting layer EML2 on the surface.

[0261] The first emitting pattern P-Ra and the second emitting pattern P-Rb can be emitting layers that emit light having the same or substantially the same color as each other but with different wavelength ranges of emission spectra. For example, the first emitting pattern P-Ra and the second emitting pattern P-Rb can be emitting layers that emit light having the same or substantially the same color as each other but include emitting materials that are different from each other, but this disclosure is not limited to or restricted by this. According to an embodiment, the first emitting pattern P-Ra and the second emitting pattern P-Rb can be emitting layers that emit light having different colors as each other and are sequentially stacked on a third-direction DR3.

[0262] Similar to the first emitting pattern P-Ra, the second emitting pattern P-Rb can have different shapes for different display areas. The second emitting pattern P-R1b formed in the first display area DA1 can correspond to the shape of the first unit opening OP-M1 of the second mask MSK-C2. The second emitting pattern P-R2b formed in the second display area DA2 can correspond to the shape of the second unit opening OP-M2 of the second mask MSK-C2. The shape of the second emitting pattern P-Rb can correspond to the shapes of the first emitting areas P-R1 and P-R2.

[0263] Figure 14C A first reference point MC-C1 defined by a first mark M1 and a sixth mark M6, and a second reference point MC-C2 defined by a second mark M2 and a sixth mark M6 are shown. The second reference point MC-C2 may correspond to the point where the imaginary center line MC2 of the second mark M2 extending in the second direction DR2 intersects with the imaginary center line MC6 of the sixth mark M6 extending in the first direction DR1.

[0264] When the second luminescent pattern P-Rb is deposited, the second test film TT2 can be formed in parallel (e.g., simultaneously or substantially simultaneously) on the second substrate region A20 of the first target substrate WS1. The second test film TT2 can be formed corresponding to Figure 14B The second hole HO2 of the second mask MSK-C2 shown is illustrated. The second test film TT2 can indicate the deposition location of the second luminescent pattern P-Rb.

[0265] The second test film TT2 can be formed spaced apart from the first test film TT1. When the second test film TT2 is formed to overlap with the first test film TT1, it may be difficult to accurately determine the deposition position of the second luminescent pattern P-Rb. Therefore, the second test film TT2 can be formed spaced apart from the first test film TT1 to determine whether the second luminescent pattern P-Rb is formed at the precise position overlapping with the first luminescent pattern P-Ra.

[0266] It is possible to determine whether the second luminescent pattern P-Rb is deposited at a precise location based on the position of the second test film TT2, and the alignment position of the second mask assembly can be corrected as needed or desired. The distances dx and dy between the center point TT2-C of the second test film TT2 and the second reference point MC-C2 in the first direction DR1 and the second direction DR2, respectively, can be used to determine whether the second luminescent pattern P-Rb is deposited at a precise location.

[0267] Figure 14C The diagram shows a first test film TT1 with a center point aligned with a first reference point MC-C1, and a second test film TT2 with a center point TT2-C that is not aligned with a second reference point MC-C2. Therefore, in this case, the deposition of the first luminescent pattern P-Ra at a precise location can be determined based on the first test film TT1 having a center point aligned with the first reference point MC-C1. On the other hand, because the second test film TT2 is spaced apart from the second reference point MC-C2 by distances dx and dy in the first direction DR1 and the second direction DR2, the deposition of the second luminescent pattern P-Rb at a distance spaced apart from the precise location can be determined. By testing films TT1 and TT2, it can be determined that the first luminescent pattern P-Ra and / or the second luminescent pattern P-Rb, which are expected to be deposited at the same or substantially the same locations, are deposited at a distance spaced apart from the precise location by distances dx and dy.

[0268] The position of the second mask assembly can be adjusted so that, based on (e.g., based on) the spacing distances dx and dy between the second test film TT2 and the second reference point MC-C2, a second luminescent pattern P-Rb is formed at a precise location in a subsequent deposition process. Therefore, the reliability of the deposition process can be improved.

[0269] Figure 15 This is a plan view of a target substrate after the deposition process of the light-emitting pattern, according to an embodiment of the present disclosure. The light-emitting pattern and a test film can be formed on the target substrate WS-F on which the light-emitting pattern deposition process has been completed. In the light-emitting pattern, some light-emitting patterns can overlap each other, and other light-emitting patterns can be formed spaced apart from each other. For example, as described above, Figure 14CThe first luminescent pattern P-Ra and the second luminescent pattern P-Rb can be formed to overlap each other and can correspond to Figure 15 The first luminescent regions P-R1 and P-R2 are shown in the diagram. A first luminescent pattern P-Ra corresponding to the first luminescent regions P-R1 and P-R2 and a third luminescent pattern corresponding to the second luminescent regions P-G1 and P-G2 can be formed to be spaced apart from each other. The luminescent patterns deposited on the target substrate WS-F can correspond to the aforementioned luminescent regions P-R1, P-R2, P-G1, P-G2, P-B1, and P-B2.

[0270] Test films TT1 to TT5 can be formed spaced apart from each other. Test films TT1 to TT5 can indicate the position of the luminescent pattern formed on the target substrate WS-F. The first test films TT1 to the fifth test films TT5, which are spaced apart from each other, can be formed by the same or substantially the same process as the first test film TT1 and the second test film TT2 described above. Based on the position of test films TT1 to TT5, it is possible to check whether the luminescent pattern is deposited at a precise location, and the position of each in the mask assembly can be corrected as needed or desired.

[0271] The third luminescent pattern may be formed in parallel (e.g., simultaneously or substantially simultaneously) with the third test film TT3, and the fourth luminescent pattern may be formed in parallel (e.g., simultaneously or substantially simultaneously) with the fourth test film TT4. The third and fourth luminescent patterns may be luminescent patterns formed corresponding to the second luminescent regions P-G1 and P-G2. The third and fourth luminescent patterns may be patterns sequentially stacked in the same regions as each other. The fifth luminescent pattern may be formed in parallel (e.g., simultaneously or substantially simultaneously) with the fifth test film TT5, and may be a luminescent pattern formed corresponding to the third luminescent regions P-B1 and P-B2.

[0272] For example, the first and second luminescent patterns may be luminescent layers for emitting red light, the third and fourth luminescent patterns may be luminescent layers for emitting green light, and the fifth luminescent pattern may be a luminescent layer for emitting blue light, but this disclosure is not limited to or restricted by these provisions.

[0273] A mask according to one or more embodiments of the present disclosure may include a plurality of marking patterns before being attached to (e.g., coupled to or attached to) a frame, each of the marking patterns including at least one recessed portion. The marking patterns may be patterns thereon reflecting the locations of cell openings included in the mask. In the process of manufacturing the mask assembly, holes may be formed through the mask adjacent to one of the marking patterns. According to one or more embodiments of the present disclosure, mask assemblies having selectively different hole locations can be manufactured using the same mask. Mask assemblies, each including masks with the same cell opening locations and different hole locations, can be used in a deposition process to form luminescent patterns of the same shape and can be used for alignment correction to ensure precise alignment of each mask assembly with the substrate. According to one or more embodiments of the present disclosure, masks can be commonly used to form luminescent patterns of the same shape, and the etching process used to manufacture the mask can be simplified, and thus the manufacturing cost of the mask can be reduced.

[0274] Although some exemplary embodiments have been described, it will be readily understood by those skilled in the art that various modifications may be made to the exemplary embodiments without departing from the spirit and scope of this disclosure. It should be understood that, unless otherwise described, the description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Therefore, as will be apparent to those skilled in the art, unless specifically indicated otherwise, features, characteristics, and / or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Therefore, it should be understood that the above is an example of various exemplary embodiments and should not be construed as limiting to the specific exemplary embodiments disclosed herein, and various modifications to the disclosed exemplary embodiments and other exemplary embodiments are intended to be included within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. Mask, including: The main body includes a unit region and a peripheral region surrounding the unit region, the main body having a plurality of unit openings defined therein; as well as Multiple marking patterns are present in the outer area. The unit region includes: First region; and The second region is adjacent to the first region. The plurality of unit openings include: The first unit opening is defined in the first region and spaced apart from each other; and The second unit opening is defined in the second region and spaced apart from each other. Each of the marking patterns includes at least one recessed portion and has a point-symmetric shape about a corresponding symmetrical point. In the plan view, the area of ​​the opening of the first unit is different from the area of ​​the opening of the second unit.

2. The mask according to claim 1, wherein, The recessed portion is recessed from the upper or lower surface of the main body portion.

3. The mask according to claim 1, wherein, The marked patterns are connected to each other.

4. The mask according to claim 1, wherein, The recessed portion includes a plurality of recessed portions, and the plurality of recessed portions include: The first recessed portion; The second recessed portion is spaced apart from the first recessed portion; The third recessed portion is symmetrical to the first recessed portion about the corresponding symmetrical point; and The fourth recessed portion is symmetrical to the second recessed portion about the corresponding symmetrical point.

5. The mask according to claim 4, wherein, In the plan view, each of the recessed portions has a polygonal shape.

6. The mask according to claim 1, wherein, In the plan view, the recessed portion overlaps with the corresponding symmetrical point.

7. The mask according to claim 1, wherein, In the plan view, the recessed portion has a closed curve shape around the corresponding symmetrical point.

8. The mask according to claim 1, wherein, In the plan view, the distance between adjacent first unit openings in the first unit opening is different from the distance between adjacent second unit openings in the second unit opening.

9. A mask assembly, including: Multiple masks, positioned along one direction; as well as The frame, beneath the multiple masks, Each of the masks includes a main body portion, the main body portion including a cell region and a peripheral region surrounding the cell region, the main body portion having a plurality of cell openings defined therein. At least one of the masks includes: Multiple marking patterns are present in the peripheral area and include at least one recessed portion; and The hole is adjacent to the first mark pattern in the mark pattern, and Each of the marked patterns has a point-symmetric shape about its corresponding symmetrical point. The unit region includes a first region and a second region adjacent to the first region, and The plurality of unit openings include: The first unit opening is defined in the first region and spaced apart from each other; and The second unit opening is defined in the second region and spaced apart from each other, and the second unit opening is different from the first unit opening.

10. The mask assembly according to claim 9, wherein, In the plan view, the hole overlaps with the corresponding symmetrical point.

11. The mask assembly according to claim 9, wherein, The recessed portion of the first marking pattern is spaced apart from the hole.

12. The mask assembly according to claim 9, wherein, The recessed portion of the first marking pattern is integrally connected to the hole.

13. The mask assembly according to claim 9, wherein, An opening is defined in the frame, and the opening overlaps with the hole and the plurality of unit openings in the plan view.

14. A method for manufacturing a display panel, comprising: Forming a first mask assembly, the first mask assembly comprising: A first mask includes a first set of unit openings, a first set of marking patterns spaced apart from the first set of unit openings, and a first hole; and First framework; Forming a second mask assembly, the second mask assembly comprising: The second mask includes a second set of unit openings identical to the first set of unit openings, a second set of marking patterns identical to the first set of marking patterns, and a second hole; and Second framework; Each of the first group of unit openings and the second group of unit openings includes: a first unit opening and a second unit opening, wherein, in a plan view, the area of ​​the first unit opening is different from the area of ​​the second unit opening. The first pattern, comprising a first light-emitting pattern and a first test film, is formed on the target substrate using the first mask assembly. The second mask assembly is used to form a second pattern on the target substrate, including a second light-emitting pattern and a second test film; Adjust the position of the first mask assembly according to the position of the first test film; and Adjust the position of the second mask assembly according to the position of the second test film. The second light-emitting pattern is formed on the first light-emitting pattern, and the first test film and the second test film are formed at different positions.

15. The method according to claim 14, wherein, The first luminescent pattern and the second luminescent pattern comprise organic patterns configured to emit light of the same color as each other.

16. The method of claim 14, wherein, The first set of marking patterns and the second set of marking patterns are formed by a semi-etching process.

17. The method of claim 14, wherein, Each of the first set of marking patterns and the second set of marking patterns includes: The first marking pattern has a point-symmetric shape about a first symmetric point; and The second marking pattern has a dot-symmetric shape about the second symmetric point.

18. The method according to claim 17, in, The first mask assembly includes: A first mask is provided, comprising a cell opening, a first marking pattern, and a second marking pattern; and A laser beam is directed onto the first symmetrical point to form the first hole, and The second mask assembly includes: Provide a second mask identical to the first mask; and The laser beam is directed onto the second symmetrical point to form the second hole.

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