Apparatus and method for testing objects in a dry gas environment

Abstract

An apparatus for testing an object can include a test chamber, a first chamber, a second chamber, and a gas supply module. The test chamber houses a test plate for testing an object. The first chamber is below the test chamber and houses a lower surface of the test plate. The second chamber surrounds the first chamber to isolate the first chamber from ambient gas. The gas supply module supplies dry gas to the second chamber to provide a positive pressure above ambient pressure to prevent ambient gas from infiltrating the first chamber. Thus, the second chamber can prevent infiltration of humid ambient gas into the first chamber during testing of the object at cryogenic temperatures to prevent condensation of water on the lower surface of the test plate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0169442, filed on December 7, 2020, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to an apparatus and method for testing an object. More specifically, this disclosure relates to an apparatus and method for testing semiconductor packages in a dry gas environment. Background Technology

[0004] A testing apparatus can be used to test semiconductor packages at low temperatures. The testing apparatus may include: a test board configured to support the semiconductor package; and a test chamber configured to house the test board.

[0005] According to relevant technologies, the lower surface of the test plate can be exposed to air at a certain temperature. Therefore, when the test chamber cools, water condensation can occur on the lower surface of the test plate. Summary of the Invention

[0006] An apparatus for testing a test object includes: a test chamber, a first chamber, a second chamber, and a gas supply module. The test chamber is configured to house a test plate for the test object. The first chamber is disposed below the test chamber to house the lower surface of the test plate. The second chamber surrounds the first chamber to isolate the first chamber from ambient air. The gas supply module supplies dry gas to the second chamber to provide a positive pressure higher than the ambient air pressure, thereby preventing ambient air from seeping into the first chamber.

[0007] An apparatus for testing a test object includes: a test chamber, a first chamber, a second chamber, a compressor, a first gas line, a first valve, a first humidity sensor, a first controller, a second gas line, and a second valve. The test chamber houses a test plate for the test object. The first chamber is disposed below the test chamber to accommodate the lower surface of the test plate. The second chamber at least partially surrounds the first chamber to isolate the first chamber from ambient air. The compressor generates dry gas to be supplied to both the first and second chambers. The first gas line connects the compressor to the first chamber. The first valve is disposed at the first gas line to control the supply of dry gas to the first chamber. The first humidity sensor is disposed in the first chamber to detect a first humidity level in the first chamber. The first controller controls the operation of the first valve based on the first humidity level detected by the first humidity sensor in the first chamber. The second gas line connects the compressor to the second chamber. The second valve is disposed at the second gas line to control the supply of dry gas to the second chamber, thereby providing a positive pressure above ambient pressure to the second chamber.

[0008] A method for testing an object includes: maintaining a test chamber at a test temperature; supplying dry gas to a first chamber and a second chamber; the first chamber being disposed below the test chamber to accommodate the lower surface of a test plate; and the second chamber at least partially surrounding the first chamber to isolate the first chamber from ambient air; stopping the supply of dry gas to the first chamber when a positive pressure above ambient air pressure is supplied to the second chamber; and then testing the object in the test chamber. Attached Figure Description

[0009] Example embodiments of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 This is a cross-sectional view showing an apparatus for testing an object according to an exemplary embodiment of the present disclosure;

[0011] Figure 2 It is along Figure 1 A cross-sectional view taken by line A-A';

[0012] Figure 3 It is along Figure 1 A cross-sectional view taken from line B-B';

[0013] Figure 4 This is an enlarged cross-sectional view showing the first and second chambers of a test apparatus according to an exemplary embodiment of the present disclosure;

[0014] Figure 5 This is a cross-sectional view showing an apparatus for testing an object according to an exemplary embodiment of the present disclosure;

[0015] Figure 6 It is along Figure 5 A cross-sectional view taken from line C-C';

[0016] Figure 7 It is along Figure 5 A cross-sectional view taken by line D-D'; and

[0017] Figure 8 It shows the use Figure 1 The flowchart shows the method of using the device in the diagram to test the object. Detailed Implementation

[0018] In the following text, exemplary embodiments will be described in detail with reference to the accompanying drawings.

[0019] Figure 1 This is a cross-sectional view showing an apparatus for testing an object according to an exemplary embodiment of the present disclosure; Figure 2 It is along Figure 1 A cross-sectional view taken by line A-A'; Figure 3 It is along Figure 1 A cross-sectional view taken by line B-B'; and Figure 4 This is an enlarged cross-sectional view showing the first and second chambers of a test apparatus according to an exemplary embodiment of the present disclosure.

[0020] The test apparatus 100 of this example embodiment can test the electrical characteristics of an object. For example, the object may include a semiconductor device, such as a semiconductor package P. For example, the test apparatus 100 can test the semiconductor package P at low temperatures (e.g., below room temperature). However, the test apparatus 100 can also test the semiconductor package P at both high and low temperatures (e.g., at or above room temperature). Furthermore, the object may include other electronic devices besides the semiconductor package P.

[0021] refer to Figures 1 to 3 The testing device 100 may include a testing chamber 110, a first chamber 120, a second chamber 130, and a gas supply module 200.

[0022] Test chamber 110 can be configured to receive test board B. Test board B can be at least partially disposed within test chamber 110. Multiple semiconductor packages P can be mounted on the upper surface of test board B. Test chamber 110 can include an opening configured to receive test board B. The opening can be formed through the center of the lower surface of test chamber 110. Therefore, the lower surface of test board B can be exposed by the opening. At least one cable C for supplying power to test board B can be connected to the lower surface of test board B.

[0023] Temperature sensor 112 can be attached to the inner wall of test chamber 110. Temperature sensor 112 can measure the internal temperature of test chamber 110.

[0024] Temperature controller 114 may be installed in test chamber 110. Temperature controller 114 may, for example, maintain test chamber 110 at test temperature by providing a desired level of cooling.

[0025] When the semiconductor package P can be tested at a low temperature, the test chamber 110 can be cooled and maintained at that temperature. The upper surface of the test board B can be located within the test chamber 110. The lower surface of the test board B can be exposed to the outside of the test chamber 110. For example, the lower surface of the test board B can be directly exposed to ambient air. Therefore, a temperature difference can be generated between the upper and lower surfaces of the test board B, and water can condense on the lower surface of the test board B. This water condensation may cause electrical short circuits between the wires in the test board B due to ion migration. To prevent water condensation on the lower surface of the test board B, the first chamber 120 and the second chamber 130 can be arranged below the test chamber 110, thereby protecting the lower surface of the test board B from ambient air.

[0026] The first chamber 120 may be disposed below the test chamber 110. For example, the first chamber 120 may have an upper end that contacts the lower surface of the test chamber 110. Furthermore, the first chamber 120 may have a volume larger than that of the test plate B. For example, the first chamber 120 may accommodate the lower surface of the test plate B. For example, the lower surface of the test plate B may be exposed to the first chamber 120.

[0027] Cable C can pass through a first hole formed through the lower surface of the first chamber 120. To provide a seal between cable C and the inner surface of the first hole, a first gasket 140 can be disposed between cable C and the inner surface of the first hole.

[0028] The first chamber 120 may have a first wall thickness T1. In addition, the first chamber 120 may have a first volume V1. The first volume V1 may be defined by the inner surface of the first chamber 120, the lower surface of the test plate B, and the portion of the lower surface of the test chamber 110 located between the upper end of the first chamber 120 and the lower surface of the test plate B.

[0029] To prevent the test plate B from warming up to room temperature, the first chamber 120 may include an insulating material, so that the first chamber 120 can act as an insulating barrier. For example, the first chamber 120 may include epoxy resin, but the present invention is not limited to this.

[0030] Alternative locations, such as Figure 4 As shown, the first chamber 120a may have a double-tube shape, including an inner tube 122a, an outer tube 124a, and an insulation layer 126a located between the inner tube 122a and the outer tube 124a. The insulation layer 126a may include air. In addition, insulation material may be disposed in the insulation layer 126a.

[0031] The second chamber 130 may be disposed below the test chamber 110. The second chamber 130 may at least partially surround the first chamber 120. The second chamber 130 may include an upper end that contacts the lower surface of the test chamber 110. For example, the second chamber 130 may have a smaller volume than the first chamber 120. For example, the second chamber 130 may be disposed around the outer surface of the first chamber 120. Therefore, the second chamber 130 can isolate the first chamber 120 from ambient air.

[0032] Pressure sensor 132 can be disposed in the second chamber 130. Pressure sensor 132 can measure the internal pressure of the second chamber 130.

[0033] Cable C can pass through a second hole formed through the lower surface of the second chamber 130. For example, cable C can pass through the second hole and the first hole to connect to the lower surface of the test plate B. To establish a seal between cable C and the inner surface of the second hole, a second sealing gasket 142 can be disposed between cable C and the inner surface of the second hole.

[0034] The second chamber 130 may have a second wall thickness T2. The second wall thickness T2 may be thicker than the first wall thickness T1. Isolation of the test plate B from ambient air may be primarily achieved by the second chamber 130. Therefore, although the first wall thickness T1 of the first chamber 120 may be thinner than the second wall thickness T2 of the second chamber 130, the test plate B may not be exposed to ambient air.

[0035] Furthermore, the second chamber 130 may have a second volume V2. The second volume V2 may be defined by the inner surface of the second chamber 130, the outer surface of the first chamber 120, and the portion of the lower surface of the test chamber 110 located between the first chamber 120 and the second chamber 130. For example, the second volume V2 may be smaller than the first volume V1.

[0036] To prevent the test plate B from heating up due to the ambient air temperature, the second chamber 130 may include a heat-insulating material, thus serving as a heat insulation barrier. For example, the second chamber 130 may include epoxy resin, but the invention is not limited to this.

[0037] Alternative locations, such as Figure 4 As shown, the second chamber 130a may have a double-tube shape, including an inner tube 132a, an outer tube 134a, and an insulation layer 136a located between the inner tube 132a and the outer tube 134a. The insulation layer 136a may include air. In addition, insulation material may be disposed in the insulation layer 136a.

[0038] The gas supply module 200 can selectively supply dry gas to the first chamber 120 and the second chamber 130. The gas supply module 200 may include: a compressor 210, a main gas line 220, a first gas line 222, a second gas line 224, a first valve 230, a second valve 232, a first humidity sensor 240, a second humidity sensor 242, a first controller 250, and a second controller 252.

[0039] Compressor 210 can be configured to generate dry gas. The dry gas can have a predetermined pressure. The dry gas can include dry air (e.g., low-humidity air), however, the invention is not limited to this.

[0040] The main gas line 220 can extend from the compressor 210. Therefore, the dry gas generated by the compressor 210 can be supplied through the main gas line 220.

[0041] A first gas line 222 may branch off from the main gas line 220. The first gas line 222 may be connected to the first chamber 120. Dry gas can be supplied to the first chamber 120 through the first gas line 222. In an exemplary embodiment of this disclosure, the first gas line 222 may include a single line connected to a side surface of the first chamber 120.

[0042] The first valve 230 can be installed at the first gas line 222. The first valve 230 can control the amount of dry gas supplied through the first gas line 222. For example, the first valve 230 can control the amount of dry gas supplied to the first chamber 120.

[0043] A first humidity sensor 240 can be disposed in the first chamber 120. The first humidity sensor 240 can measure the first humidity in the first chamber 120. Because water condensation can occur on the lower surface of the test plate B, the first humidity sensor 240 can be attached to the lower surface of the test plate B. Alternatively, the first humidity sensor 240 can be attached to the inner wall of the first chamber 120.

[0044] The first controller 250 can receive a first humidity level measured by the first humidity sensor 240. The first controller 250 can control the operation of the first valve 230, i.e., the opening angle of the first valve 230, based on the first humidity level. Furthermore, the first controller 250 can receive the internal temperature of the test chamber 110 measured by the temperature sensor 112.

[0045] For example, when the first humidity measured by the first humidity sensor 240 is higher than the set humidity in the first chamber 120, the first controller 250 can open the first valve 230. Dry gas can be supplied to the first chamber 120 by opening the first valve 230 to reduce the first humidity in the first chamber 120. Conversely, when the first humidity measured by the first humidity sensor 240 is less than or equal to the set humidity in the first chamber 120, the first controller 250 can close the first valve 230. The supply of dry gas to the first chamber 120 can be interrupted by closing the first valve 230.

[0046] The second gas line 224 may branch off from the main gas line 220. The second gas line 224 may be connected to the second chamber 130. Dry gas can be supplied to the second chamber 130 through the second gas line 224. In an exemplary embodiment of this disclosure, the second gas line 224 may include a single line connected to a side surface of the second chamber 130.

[0047] The second valve 232 can be installed at the second gas line 224. The second valve 232 can control the amount of dry gas supplied through the second gas line 224. For example, the second valve 232 can control the amount of dry gas supplied to the second chamber 130.

[0048] The second humidity sensor 242 can be installed in the second chamber 130. The second humidity sensor 242 can measure the second humidity in the second chamber 130.

[0049] The second controller 252 can receive a second humidity level measured by the second humidity sensor 242. The second controller 252 can control the operation of the second valve 232, i.e., the opening angle of the second valve 232, based on the second humidity level. Furthermore, the second controller 252 can receive the internal pressure of the second chamber 130 measured by the pressure sensor 132. The second controller 252 can also receive the internal temperature of the test chamber 110 measured by the temperature sensor 112.

[0050] The second humidity control valve 232 can be used to initialize and monitor the test chamber 110. After initializing the test apparatus 100, the second humidity of the second chamber 130 may not be closely related to the humidity of the test chamber 110 in which the test process is performed. However, when the second humidity is higher than the set humidity, it can be assumed that the test apparatus 100 is malfunctioning. In this case, the second controller 252 can open the second valve 232 to supply dry gas to the second chamber 130. If the second humidity of the second chamber 230 does not decrease even when dry gas is supplied, the test apparatus 100 can be stopped. The test apparatus 100 can then be repaired.

[0051] In an exemplary embodiment of this disclosure, the gas supply module 200 may include a first controller 250 and a second controller 252. Alternatively, the gas supply module 200 may include a single controller configured to control the first valve 230 and the second valve 232.

[0052] The dry gas supplied to the second chamber 130 can provide a positive pressure to the second chamber 130 that is higher than the pressure of ambient air (e.g., ambient pressure). Because the pressure in the second chamber 130 can be higher than the pressure of ambient air, humid ambient air can bypass the second chamber 130. Therefore, the second chamber 130 can be used to prevent ambient air from infiltrating into the first chamber 120. Thus, the second chamber 130 can be configured to isolate the first chamber 120 from ambient air.

[0053] To provide the aforementioned function to the second chamber 130, a positive pressure can be applied to the second chamber 130. The second controller 252 can continuously open the second valve 232 until a positive pressure can be formed in the second chamber 130. After providing positive pressure to the second chamber 130, the second controller 252 can reduce the opening angle of the second valve 232 while maintaining the positive pressure in the second chamber 130. Therefore, the amount of dry gas supplied to the second chamber 130 can be reduced.

[0054] After the supply of dry gas to the first chamber 120 is stopped during the cryogenic test, the dry gas supplied to the second chamber 130 can maintain a positive pressure in the second chamber 130. Therefore, the positive pressure of the first chamber 120, which may be continuously supplied with dry gas, can be slightly higher than the positive pressure of the second chamber 130, which may no longer be supplied with dry gas. As described above, because the second volume V2 of the second chamber 130 can be smaller than the first volume V1 of the first chamber 120, the amount of dry gas used in the cryogenic test can be reduced.

[0055] After the supply of dry gas to the first chamber 120 is stopped, the first chamber 120 can be isolated from the ambient air through the second chamber 130. Therefore, the transfer of ambient air temperature to the first chamber 120 can be suppressed. Thus, the transfer of ambient air temperature to the test board B and semiconductor package P through the first chamber 120 can also be suppressed. Furthermore, the dry gas in the first chamber 120 can remain within the test chamber 110, the second chamber 130, and / or the outside. Therefore, during low-temperature testing, the low temperature of the test chamber 110 can cool the dry gas in the first chamber 120. The cooled dry gas can be continuously retained in the isolated first chamber 120 to reduce temperature changes in the test board B and semiconductor package P. Therefore, the time required to supply the test temperature to the test chamber 110 can be greatly reduced, and temperature changes in the test chamber 110 during low-temperature testing can also be reduced.

[0056] Figure 5 This is a cross-sectional view showing an apparatus for testing an object according to an exemplary embodiment of the present disclosure. Figure 6 It is along Figure 5 The cross-sectional view taken by line C-C' in the diagram, and Figure 7 It is along Figure 5 The cross-sectional view taken by line D-D' in the diagram.

[0057] In addition to the first gas line and the second gas line, the test apparatus 100a may include the above-mentioned references. Figure 1 The components of the described test apparatus 100 are substantially the same. Therefore, the same reference numerals may refer to the same components, and for any component not described in detail herein, it may be assumed that the component is at least similar to the corresponding component described elsewhere in this disclosure.

[0058] refer to Figures 5 to 7 The first gas line may include gas line 222-1 (1-1) and gas line 222-2 (1-2). Gas line 222-1 and gas line 222-2 may be connected to the first chamber 120. Gas line 222-1 and gas line 222-2 may be spaced apart from each other at a uniform distance. Therefore, gas line 222-1 and gas line 222-2 may be arranged at an angle of approximately 180° relative to each other. Alternatively, the first gas line may include at least three gas lines spaced apart from each other at a uniform distance.

[0059] Because the first gas line can be branched into gas line 222-1 (1-1) and gas line 222-2 (1-2), dry gas can be supplied to the first chamber 120 quickly.

[0060] The second gas line may include gas line 224-1 (2-1) and gas line 224-2 (2-2). Gas line 224-1 and gas line 224-2 may be connected to the second chamber 130. Gas line 224-1 and gas line 224-2 may be spaced apart from each other at a uniform distance. Therefore, gas line 224-1 and gas line 224-2 may be arranged at an angle of approximately 180° relative to each other. Alternatively, the second gas line may include at least three gas lines spaced apart from each other at a uniform distance.

[0061] Because the second gas line can be branched into gas line 224-1 (2-1) and gas line 224-2 (2-2), dry gas can be supplied to the second chamber 130 quickly.

[0062] Figure 8 It shows the use Figure 1 The flowchart shows the method of using the device in the diagram to test the object.

[0063] refer to Figure 1 and Figure 8In step ST300, the temperature controller 114 can maintain the test chamber 110 at the test temperature, for example, by cooling the air disposed therein. When testing the semiconductor package P in the test chamber 110 at a low temperature, the temperature controller 114 can maintain the test chamber 110 at a low temperature. Conversely, when testing the semiconductor package P in the test chamber 110 at a high temperature, the temperature controller 114 can maintain the test chamber 110 at a high temperature, for example, by heating the air disposed therein.

[0064] In step ST310, the first controller 250 can open the first valve 230. The second controller 252 can open the second valve 232. The dry gas generated by the compressor 210 can be supplied to the first chamber 120 through the first gas line 222. In addition, the dry gas can also be supplied to the second chamber 130 through the second gas line 224.

[0065] In step ST320, the first humidity sensor 240 measures the first humidity in the first chamber 120. The measured first humidity can then be sent to the first controller 250. The second humidity sensor 242 measures the second humidity in the second chamber 130. The measured second humidity can then be sent to the second controller 252.

[0066] The first controller 250 can compare the first humidity with the set humidity. The second controller 252 can compare the second humidity with the set humidity.

[0067] When the first humidity and the second humidity are higher than the set humidity, in step ST310, dry gas can be continuously supplied to the first chamber 120 and the second chamber 130.

[0068] Conversely, when the first humidity and the second humidity do not exceed the set humidity, in step ST330, the first controller 250 can close the first valve 230. Therefore, dry gas can be stopped from being supplied to the first chamber 120.

[0069] Specifically, when the initial humidity may be higher than the set humidity, condensation may occur on the lower surface of the test plate B. Therefore, the first controller 250 can open the first valve 230 to supply dry gas to the first chamber 120. Thus, the initial humidity in the first chamber 120 can be reduced by the dry gas.

[0070] Furthermore, when the second humidity is higher than the set humidity, the second controller 252 can determine that the testing device 100 is malfunctioning. In this case, the second controller 252 can open the second valve 232 to supply dry gas to the second chamber 130. However, if the second humidity in the second chamber 130 does not decrease even when dry gas is supplied, the testing device 100 can be stopped. The testing device 100 can then be repaired.

[0071] After the supply of dry gas to the first chamber 120 is stopped, the first chamber 120 can be isolated from the ambient air through the second chamber 130. Therefore, the transfer of ambient air temperature to the first chamber 120 can be suppressed. Thus, the transfer of ambient air temperature to the test board B through the first chamber 120 can also be suppressed. Furthermore, the dry gas in the first chamber 120 can remain within the test chamber 110, the second chamber 130, and / or the outside. Therefore, during low-temperature testing, the low temperature of the test chamber 110 can cool the dry gas in the first chamber 120. The cooled dry gas can be continuously retained in the isolated first chamber 120 to reduce temperature changes in the test board B and the semiconductor package P. Therefore, the time required to supply the test temperature to the test chamber 110 can be greatly reduced, and temperature changes in the test chamber 110 during low-temperature testing can also be reduced.

[0072] To continuously supply the second chamber 130 with the function of preventing ambient air from seeping into the first chamber 120, the pressure in the second chamber 130 can be maintained at a pressure higher than the ambient air pressure (e.g., ambient pressure). However, since the second chamber 130 may already have positive pressure, it may not be necessary to maintain an initial supply of dry gas to create the positive pressure.

[0073] Therefore, in step ST340, given that the pressure in the second chamber 130 can be higher than the pressure of ambient air (i.e., the pressure in the second chamber 130 can be maintained at a positive pressure), the second controller 252 can reduce the opening angle of the second valve 232. This reduces the amount of dry gas supplied to the second chamber 130. For example, the amount of dry gas supplied to the second chamber 130 can be minimized.

[0074] In step ST350, the opening angle of the second valve 232 can be maintained at the minimum amount of dry gas continuously supplied to the second chamber 130.

[0075] In step ST360, when the first humidity measured by the first humidity sensor 240 is higher than the set humidity, in step ST310, the first controller 250 can continuously supply dry gas to the first chamber 120 and the second chamber 130.

[0076] Conversely, when the first humidity does not exceed the set humidity, the minimum amount of dry gas supplied to the second chamber 130 can be continuously maintained in step ST350.

[0077] The semiconductor package P can then be tested in test chamber 110 while keeping test chamber 110 at a low temperature, and the first chamber 120 and the second chamber 130 can be kept at or below the set humidity.

[0078] According to an example embodiment, the chamber below the test chamber can be divided into a first chamber and a second chamber, with a positive pressure higher than the ambient air pressure applied to the second chamber. Therefore, during cryogenic testing of the object, the second chamber can be used to prevent humid ambient air from seeping into the first chamber, thus preventing condensation of water on the lower surface of the test plate. Furthermore, after applying positive pressure to the second chamber, dry gas can be supplied only to the second chamber without supplying it to the first chamber, thereby reducing the amount of dry gas used in cryogenic testing.

[0079] The foregoing is a description of exemplary embodiments of the present invention and is not to be construed as a necessary limitation of the invention. Although some exemplary embodiments have been described, those skilled in the art will readily understand that many modifications may be made to the exemplary embodiments without substantially departing from the novel teachings and aspects of the invention. Therefore, all such modifications are intended to be included within the scope of this disclosure.

Claims

1. An apparatus for testing an object, the apparatus comprising: Testing room; A test board for testing objects, the test board being disposed in the test chamber; A first chamber, adjacent to the test chamber, wherein the lower surface of the test plate is exposed to the first chamber; The second chamber is disposed around the outer surface of the first chamber to surround the first chamber such that the first chamber is disposed in the second chamber and isolated from the ambient air, thereby suppressing the transfer of temperature from the ambient air to the first chamber; as well as The gas supply module supplies dry gas to both the second chamber and the first chamber, and provides a positive pressure higher than the ambient pressure to the second chamber, thereby preventing ambient air from seeping into the first chamber. The volume of the second chamber is defined by the inner surface of the second chamber, the outer surface of the first chamber, and the portion of the lower surface of the test chamber located between the first chamber and the second chamber.

2. The apparatus according to claim 1, wherein, The gas supply module includes: The compressor is configured to generate dry gas; A first gas line connects the compressor and the first chamber; and A first valve is located at the first gas line and is configured to control the supply of dry gas to the first chamber.

3. The apparatus according to claim 2, wherein, The first gas pipeline comprises multiple pipelines spaced apart from each other at uniform distances.

4. The apparatus according to claim 2, wherein, The gas supply module also includes: A first humidity sensor is disposed in the first chamber and configured to measure a first humidity in the first chamber; and A first controller is configured to control the operation of the first valve based on the first humidity in the first chamber as measured by the first humidity sensor.

5. The apparatus according to claim 4, wherein, The first humidity sensor is disposed on the lower surface of the test plate.

6. The apparatus according to claim 2, wherein, The gas supply module also includes: A second gas line connects the compressor and the second chamber; and A second valve is located at the second gas line and is configured to control the supply of dry gas to the second chamber.

7. The apparatus according to claim 6, wherein, The second gas pipeline includes multiple pipelines spaced apart from each other at a distance.

8. The apparatus according to claim 6, wherein, The gas supply module also includes: A second humidity sensor, disposed in the second chamber and configured to measure a second humidity level in the second chamber; and The second controller is configured to control the operation of the second valve based on the second humidity in the second chamber as measured by the second humidity sensor.

9. The apparatus according to claim 1, wherein, The first chamber has an upper end that contacts the lower surface of the test chamber, and the second chamber has an upper end that contacts the lower surface of the test chamber.

10. The apparatus according to claim 1, wherein, The volume of the second chamber is smaller than that of the first chamber.

11. The apparatus according to claim 1, wherein, The wall thickness of the second chamber is greater than that of the first chamber.

12. The apparatus according to claim 1, wherein, Both the first chamber and the second chamber contain thermal insulation material.

13. The apparatus according to claim 1, wherein, Both the first chamber and the second chamber have a double-tube structure.

14. The apparatus according to claim 1, wherein, The first chamber has a first hole, and the second chamber has a second hole, wherein a cable connected to the test board passes through the first hole and the cable passes through the second hole.

15. The apparatus of claim 14, further comprising: A first sealing gasket is disposed between the inner surface of the first hole and the cable; as well as A second sealing gasket is disposed between the inner surface of the second hole and the cable.

16. The apparatus according to claim 1, further comprising: A temperature sensor is disposed in the test chamber and configured to measure the internal temperature of the test chamber.

17. The apparatus according to claim 1, further comprising: A temperature controller is installed in the test chamber and controls the test temperature of the test chamber.

18. The apparatus according to claim 1, wherein, The object includes semiconductor packaging.

19. An apparatus for testing an object, the apparatus comprising: Testing room; A test board for testing objects, the test board being disposed in the test chamber; A first chamber, adjacent to the test chamber, wherein the lower surface of the test plate is exposed to the first chamber; The second chamber is disposed around the outer surface of the first chamber to surround the first chamber such that the first chamber is disposed in the second chamber and isolated from the ambient air, thereby suppressing the transfer of temperature from the ambient air to the first chamber; The compressor is configured to supply dry gas to both the first chamber and the second chamber; A first gas pipeline is connected between the compressor and the first chamber; as well as A first valve is located at the first gas line and is configured to control the supply of dry gas to the first chamber; A first humidity sensor is disposed in the first chamber and configured to measure a first humidity in the first chamber; A first controller is configured to control the first valve based on the first humidity in the first chamber as measured by the first humidity sensor; A second gas line is connected between the compressor and the second chamber; as well as A second valve is installed at the second gas pipeline to control the supply of dry gas to the second chamber. The volume of the second chamber is defined by the inner surface of the second chamber, the outer surface of the first chamber, and the portion of the lower surface of the test chamber located between the first chamber and the second chamber.

20. The apparatus of claim 19, further comprising: A second humidity sensor is disposed in the second chamber and configured to measure a second humidity in the second chamber; as well as The second controller is configured to control the second valve based on the second humidity in the second chamber as measured by the second humidity sensor.

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