Method for manufacturing a contactless communication medium and contactless communication medium

Abstract

The present application provides a kind of compared with the case that the capacitance of external capacitor is determined without considering the difference between reference resonant frequency and temporary resonant frequency, the manufacturing method of non-contact communication medium and non-contact communication medium can easily match the resonant frequency of resonant circuit with reference resonant frequency.Non-contact communication medium has: processing circuit, installed in the substrate formed with antenna coil, and has built-in capacitor;And external capacitor, together with built-in capacitor and antenna coil constitute resonant circuit that generates resonance at pre-defined resonant frequency.Non-contact communication medium manufacturing method includes the following steps: in the state that external capacitor is not connected to processing circuit and in the state that processing circuit is connected to antenna coil, temporary resonant frequency is measured;And according to the difference between reference resonant frequency and temporary resonant frequency when non-contact communication medium communicates with external via magnetic field, the capacitance of external capacitor is determined.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a contactless communication medium and the contactless communication medium itself. Background Technology

[0002] Patent Document 1 discloses a contactless IC module comprising a substrate, an antenna portion formed on one side of the substrate, an IC chip formed on one side of the substrate, and a common electrode formed on the other side of the substrate. In the contactless IC module described in Patent Document 1, the antenna portion includes an antenna coil with a spiral pattern and a conductor portion that exists in a spiral pattern along the outer periphery of the antenna coil.

[0003] Patent Document 2 discloses an IC card that incorporates a resonant circuit with an antenna coil and a capacitor, and enables contactless communication at least through electromagnetic induction. The IC card described in Patent Document 2 comprises a card body, an IC chip embedded in the card body, an adjustment capacitor embedded in the card body and connected to the IC chip, and an adjustment capacitor for adjusting the electrostatic capacitance value of the capacitor, and the IC chip and the adjustment capacitor connected at least within the card's interior in the embossing area. It is configured with a wiring section that can be physically cut by embossing in the embossing area.

[0004] Patent Document 3 discloses an antenna circuit formed on the surface of an insulating substrate. The antenna circuit described in Patent Document 3 includes a wound planar antenna, a common connecting pad connected to one end of the planar antenna, multiple individual connecting pads, and inductance adjustment wiring. The multiple individual connecting pads are arranged around the common connecting pad at predetermined intervals. Any one of the multiple individual connecting pads is connected to the other end of the planar antenna. The inductance adjustment wiring connects the middle terminal portion of the planar antenna to the individual connecting pads other than the one connected to the other end of the planar antenna.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2007-310898

[0006] Patent Document 2: Japanese Patent Application Publication No. 2009-271656

[0007] Patent Document 3: Japanese Patent Publication No. 2006-217185 Summary of the Invention

[0008] One embodiment of the present invention provides a method for manufacturing a contactless communication medium and a contactless communication medium that enables the resonant frequency of the resonant circuit to be easily matched with the reference resonant frequency, compared to the case where the capacitance of the external capacitor is determined without considering the difference between the reference resonant frequency and the temporary resonant frequency.

[0009] The first aspect of the present invention relates to a method for manufacturing a contactless communication medium, the contactless communication medium comprising: a processing circuit mounted on a substrate having an antenna coil and having a built-in capacitor, the antenna coil generating electricity through an externally applied magnetic field; and an external capacitor external to the processing circuit, which, together with the built-in capacitor and the antenna coil, constitutes a resonant circuit that resonates at a predetermined resonant frequency under the action of a magnetic field, the processing circuit operating using the electricity generated by the resonant circuit, wherein the method for manufacturing the contactless communication medium includes the following steps: measuring a temporary resonant frequency when the external capacitor is not connected to the processing circuit and when the processing circuit is connected to the antenna coil; and determining the capacitance of the external capacitor based on the difference between a reference resonant frequency and the temporary resonant frequency when the contactless communication medium communicates with the outside via a magnetic field.

[0010] The second aspect of the present invention is a method for manufacturing a contactless communication medium as described in the first aspect, which further includes the step of forming a resonant circuit by mounting an external capacitor having a determined capacitance on a substrate.

[0011] The third aspect of the present invention is a method for manufacturing a non-contact communication medium as described in the second aspect, wherein a resonant circuit is formed by connecting an external capacitor to a substrate in a surface-mount manner.

[0012] The fourth aspect of the present invention is a method for manufacturing a contactless communication medium as described in the second or third aspect, wherein, after a processing circuit connected to an antenna coil is sealed with a sealing material, an external capacitor having a determined capacitance is mounted on a substrate.

[0013] The fifth aspect of the present invention is a method for manufacturing a non-contact communication medium according to any one of the first to fourth aspects, wherein, with the external capacitor not connected to the processing circuit, the processing circuit is connected to the antenna coil and the temporary resonant frequency is measured.

[0014] The sixth aspect of the present invention is a method for manufacturing a contactless communication medium according to any one of the first to fifth aspects, which further includes the following steps: transmitting a signal representing a temporary resonant frequency; and receiving the transmitted signal, and determining the capacitance of an external capacitor based on the temporary resonant frequency represented by the received signal.

[0015] The seventh aspect of the present invention is a method for manufacturing a contactless communication medium according to any one of the first to sixth aspects, wherein the processing circuit has been integrated into an IC chip.

[0016] The eighth aspect of the present invention is a method for manufacturing a non-contact communication medium according to any one of the first to seventh aspects, wherein the substrate is a flexible substrate.

[0017] The ninth aspect of the present invention relates to a contactless communication medium comprising: a processing circuit mounted on a substrate having an antenna coil and having a built-in capacitor, the antenna coil generating power through an externally applied magnetic field; and an external capacitor external to the processing circuit, which, together with the built-in capacitor and the antenna coil, constitutes a resonant circuit that resonates at a predetermined resonant frequency under the influence of a magnetic field. The processing circuit operates using power generated by the resonant circuit, and the capacitance of the external capacitor is determined based on the difference between a reference resonant frequency and a temporary resonant frequency when the contactless communication medium communicates with the outside via a magnetic field. The temporary resonant frequency is measured when the external capacitor is not connected to the processing circuit and when the processing circuit is connected to the antenna coil.

[0018] The tenth aspect of the present invention is the contactless communication medium involved in the ninth aspect, wherein the processing circuit has been integrated into an IC chip.

[0019] The eleventh aspect of the present invention is the non-contact communication medium involved in the ninth or tenth aspect, wherein the substrate is a flexible type substrate. Attached Figure Description

[0020] Figure 1 This is a schematic perspective view showing an example of the appearance of the magnetic tape cassette according to the embodiment.

[0021] Figure 2 This is a schematic perspective view showing an example of the structure of the right rear end of the inner side of the lower housing of the magnetic tape cassette according to the embodiment.

[0022] Figure 3 This is a side sectional view showing an example of a support member provided on the inner surface of the lower housing of the magnetic tape cassette according to the embodiment.

[0023] Figure 4 This is a schematic structural diagram illustrating an example of the hardware structure of the magnetic tape drive involved in the implementation.

[0024] Figure 5 This is a schematic perspective view illustrating an example of how a magnetic field is released from the underside of the magnetic tape cassette in the embodiment via a contactless reader / writer.

[0025] Figure 6 This is a conceptual diagram illustrating an example of how a magnetic field is applied to a cartridge memory within a magnetic tape cassette according to an embodiment from a contactless reader / writer.

[0026] Figure 7 This is a bottom view showing an example of the rear structure of the cassette memory according to the embodiment.

[0027] Figure 8 This is a top view showing an example of the surface structure of the cassette memory according to the embodiment.

[0028] Figure 9 This is a schematic circuit diagram illustrating an example of the circuit structure of the cassette memory involved in the implementation.

[0029] Figure 10 This is a block diagram illustrating an example of a resonant circuit forming system according to an implementation method.

[0030] Figure 11 This is an explanatory diagram illustrating an example of the operation of the capacitance determination unit according to the embodiment.

[0031] Figure 12 This is an explanatory diagram illustrating an example of the operation of the capacitance determination unit according to the embodiment.

[0032] Figure 13 This is an explanatory diagram illustrating an example of the operation of the capacitance determination unit according to the embodiment.

[0033] Figure 14 This is a flowchart illustrating an example of the manufacturing process of a cassette memory involved in the implementation method.

[0034] Figure 15 This is a top view showing a modified example of the surface structure of a cassette memory.

[0035] Figure 16 This is a conceptual diagram representing a variation of the tilt angle of a cartridge memory within a magnetic tape cassette. Detailed Implementation

[0036] First, let me explain the terms used in the following explanation.

[0037] CPU stands for Central Processing Unit. RAM stands for Random Access Memory. NVM stands for Non-Volatile Memory. ROM stands for Read Only Memory. EEPROM stands for Electrically Erasable and Programmable Read Only Memory. SSD stands for Solid State Drive. USB stands for Universal Serial Bus. ASIC stands for Application Specific Integrated Circuit. PLD stands for Programmable Logic Device. FPGA stands for Field-Programmable Gate Array. SoC stands for System-on-a-Chip. IC stands for Integrated Circuit. RFID stands for Radio Frequency Identifier. LTO stands for Linear Tape-Open. CM stands for Cartridge Memory.

[0038] In the following explanation, for ease of explanation, Figure 1 In the diagram, arrow A indicates that the tape cassette 10 is loaded into the tape drive 30 (see reference). Figure 4 In the direction indicated by arrow A, the direction of arrow A is defined as the front direction of tape cassette 10, and the front side of tape cassette 10 is defined as the front side of tape cassette 10. In the following structural description, "front" refers to the front side of tape cassette 10.

[0039] Furthermore, in the following explanation, for ease of explanation, Figure 1 In the following structural description, arrow B, which is orthogonal to arrow A, is defined as the right direction, and the right side of tape cassette 10 is defined as the right side of tape cassette 10. In the following structural description, "right" refers to the right side of tape cassette 10.

[0040] Furthermore, in the following explanation, for ease of explanation, Figure 1In the diagram, arrow C represents a direction orthogonal to both arrow A and arrow B. Arrow C is defined as the upward direction of tape cassette 10, and the upward side of tape cassette 10 is defined as the upper side of tape cassette 10. In the following structural description, "upper" refers to the upper side of tape cassette 10.

[0041] Furthermore, in the following explanation, for ease of explanation, Figure 1 In this design, the direction opposite to the front direction of the tape cassette 10 is defined as the rear direction of the tape cassette 10, and the rear side of the tape cassette 10 is defined as the rear side of the tape cassette 10. In the following structural description, "rear" refers to the rear side of the tape cassette 10.

[0042] Furthermore, in the following explanation, for ease of explanation, Figure 1 In this context, the direction opposite to the upward direction of the tape cassette 10 is defined as the downward direction of the tape cassette 10, and the downward side of the tape cassette 10 is defined as the lower side of the tape cassette 10. In the following structural description, "lower" refers to the lower side of the tape cassette 10.

[0043] Furthermore, in the following description, the specification of the tape cassette 10 will be illustrated by example, using an LTO. Also, in the following description, the LTO related to the technology of this invention will be described with the specifications shown in Table 1 below as applicable, but this is merely an example, and the specifications of the IBM 3592 tape cassette may also be followed.

[0044] [Table 1]

[0045]

[0046] In Table 1, "REQA~SELECT system" refers to the polling commands described later. The "REQA~SELECT system" includes at least the commands "Request A," "Request SN," and "Select." "Request A" is a command to query the cartridge memory for its type. In this embodiment, "Request A" is one type, but it is not limited to this and can be multiple types. "Request SN" is a command to query the cartridge memory for its serial number. "Select" is a command to announce that the cartridge memory is ready to be read or written. The READ system is equivalent to the read command described later. The WRITE system is equivalent to the write command described later.

[0047] As an example, such as Figure 1As shown, the tape cassette 10 is generally rectangular in top view and has a box-shaped housing 12. The housing 12 is made of resin such as polycarbonate and has an upper housing 14 and a lower housing 16. The upper housing 14 and the lower housing 16 are joined together by welding (e.g., ultrasonic welding) and screw fixing, with the lower peripheral surface of the upper housing 14 in contact with the upper peripheral surface of the lower housing 16. The joining method is not limited to welding and screw fixing, and other joining methods may also be used.

[0048] A magnetic tape cassette reel 18 is rotatably housed inside the housing 12. The cassette reel 18 includes a reel hub 18A, an upper flange 18B1, and a lower flange 18B2. The reel hub 18A is cylindrical. The reel hub 18A is the central axis of the cassette reel 18, with its axis aligned vertically along the housing 12 and positioned at the center of the housing 12. The upper flange 18B1 and lower flange 18B2 are each annular. The upper flange 18B1 is fixed to the upper end of the reel hub 18A at its central view, and the lower flange 18B2 is fixed to the lower end of the reel hub 18A at its central view. A magnetic tape MT is wound around the outer periphery of the reel hub 18A, with the width end of the magnetic tape MT held by the upper flange 18B1 and lower flange 18B2. Furthermore, the reel hub 18A and lower flange 18B2 can be integrally formed.

[0049] An opening 12B is formed on the front side of the right wall 12A of the housing 12. The magnetic tape MT is pulled out through the opening 12B.

[0050] As an example, such as Figure 2 As shown, a cassette memory 19 is housed at the right rear end of the lower housing 16. The cassette memory 19 is an example of a "contactless communication medium" involved in the technology of this invention. In this embodiment, a so-called passive RFID tag is used as the cassette memory 19.

[0051] The cartridge memory 19 stores management information. The management information is information for managing the tape cartridge 10. For example, the management information may include identification information that can identify the tape cartridge 10, information indicating the recording capacity of the tape MT, a summary of the information recorded in the tape MT (hereinafter also referred to as "recording information"), the items of the recording information, and the recording format of the recording information.

[0052] The cartridge memory 19 communicates with an external device (not shown) in a contactless manner. Examples of external devices include, for instance, a read / write device used in the manufacturing process of the tape cartridge 10 and a tape drive (e.g., Figure 4 The read / write device (e.g., tape drive 30) used in the tape drive 30 is shown. Figures 4-6 The non-contact reading and writing device 50 shown.

[0053] External devices read and write various information to the cartridge memory 19 in a non-contact manner. Details will be described later. The cartridge memory 19 generates electricity by acting electromagnetically on a magnetic field applied from the external device. The cartridge memory 19 then uses the generated electricity to operate and communicates with the external device via the magnetic field, thereby exchanging various types of information with the external device. Furthermore, the communication method can be, for example, a method conforming to known standards such as ISO 14443 or ISO 18092, or a method conforming to the ECMA 319 LTO standard, etc.

[0054] As an example, such as Figure 2 As shown, a support member 20 is provided on the inner surface of the bottom plate 16A at the right rear end of the lower housing 16. The support member 20 is a pair of tilting platforms that support the cassette memory 19 from below in an inclined state. The pair of tilting platforms are a first tilting platform 20A and a second tilting platform 20B. The first tilting platform 20A and the second tilting platform 20B are arranged spaced apart in the left-right direction of the housing 12, and are modularly mounted on the inner surface of the rear wall 16B and the inner surface of the bottom plate 16A of the lower housing 16. The first tilting platform 20A has an inclined surface 20A1 that slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A. Furthermore, the inclined surface 20B1 also slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A.

[0055] On the front side of the support member 20, a pair of position limiting ribs 22 are arranged spaced apart in the left-right direction. The pair of position limiting ribs 22 are vertically provided on the inner surface of the base plate 16A, limiting the position of the lower end of the cassette memory 19 disposed in the support member 20.

[0056] As an example, such as Figure 3 As shown, a reference surface 16A1 is formed on the outer surface of the base plate 16A. The reference surface 16A1 is a plane. Here, a plane refers to a plane that is parallel to the horizontal plane when the base plate 16A is used as the lower side and the lower housing 16 is placed on the horizontal plane. The tilt angle θ of the support member 20, that is, the tilt angle of the tilt surface 20A1 and the tilt surface 20B1, is 45 degrees relative to the reference surface 16A1. In addition, 45 degrees is just an example, and it can be "0 degrees < tilt angle θ < 45 degrees", or it can be 45 degrees or more.

[0057] The cassette memory 19 includes a substrate 26. The substrate 26 is an example of a "substrate" according to the technology of this invention. The substrate 26 is a flexible substrate and is generally rectangular in shape. The substrate 26 has two surfaces in the thickness direction, namely a surface 26A and a back surface 26B. The substrate 26 is placed on a support member 20 with its back surface 26B facing downwards, and the support member 20 supports the back surface 26B of the substrate 26 from below. A portion of the back surface 26B of the substrate 26 contacts the inclined surfaces 20A1 and 20B1 of the support member 20, and the surface 26A of the substrate 26 is exposed to the inner surface 14A1 side of the top plate 14A.

[0058] The upper housing 14 has a plurality of ribs 24. The plurality of ribs 24 are arranged at intervals in the left-right direction of the housing 12. The plurality of ribs 24 protrude downward from the inner surface 14A1 of the top plate 14A of the upper housing 14, and the front end face 24A of each rib 24 has an inclined surface corresponding to the inclined surfaces 20A1 and 20B1. That is, the front end face 24A of each rib 24 is inclined at 45 degrees relative to the reference surface 16A1.

[0059] With the cassette memory 19 disposed on the support member 20, as described above, when the upper housing 14 is engaged with the lower housing 16, the front end face 24A of each rib 24 contacts the substrate 26 from the surface 26A side, and the substrate 26 is held by the front end face 24A of each rib 24 and the inclined surface of the support member 20. Thus, the vertical position of the cassette memory 19 is restricted by the ribs 24.

[0060] As an example, such as Figure 4 As shown, the tape drive 30 includes a transport device 34, a read head 36, and a control device 38. A tape cassette 10 is loaded into the tape drive 30. The tape drive 30 is a device for pulling a tape MT from the tape cassette 10 and reading recorded information from the pulled-out tape MT in a linear serpentine manner using the read head 36. Furthermore, in this embodiment, reading recorded information, in other words, refers to the playback of recorded information.

[0061] The control device 38 controls the entire tape drive 30. In this embodiment, the control device 38 is implemented using an ASIC, but the technology of the present invention is not limited thereto. For example, the control device 38 can also be implemented using an FPGA. Furthermore, the control device 38 can also be implemented using a computer including a CPU, ROM, and RAM. Moreover, it can also be implemented by combining two or more of the following: ASIC, FPGA, and computer. That is, the control device 38 can also be implemented using a combination of hardware and software structures.

[0062] The conveying device 34 is a device for selectively conveying magnetic tape MT in both forward and reverse directions, and includes a feed motor 40, a take-up reel 42, a take-up motor 44, multiple guide rollers GR, and a control device 38.

[0063] The delivery motor 40 rotates and drives the tape reel 18 inside the tape cassette 10 under the control of the control device 38. The control device 38 controls the rotation direction, speed, and torque of the tape reel 18 by controlling the delivery motor 40.

[0064] The take-up motor 44 rotates and drives the take-up reel 42 under the control of the control device 38. The control device 38 controls the rotation direction, speed, and torque of the take-up reel 42 by controlling the take-up motor 44.

[0065] When the magnetic tape MT is wound by the take-up reel 42, the delivery motor 40 and the take-up motor 44 are rotated by the control device 38 to make the magnetic tape MT travel in the forward direction. The speed and torque of the delivery motor 40 and the take-up motor 44 can be adjusted according to the speed of the magnetic tape MT wound by the take-up reel 42.

[0066] When the magnetic tape MT is wound back to the tape reel 18, the delivery motor 40 and the take-up motor 44 are rotated by the control device 38 to make the magnetic tape MT travel in the reverse direction. The speed and torque of the delivery motor 40 and the take-up motor 44 can be adjusted according to the speed of the magnetic tape MT wound by the take-up reel 42.

[0067] By adjusting the respective speeds and torques of the feed motor 40 and the take-up motor 44, a tension within a predetermined range is applied to the magnetic tape MT. Here, the predetermined range refers, for example, to the range of tension that enables the read head 36 to read data from the magnetic tape MT, obtained through computer simulation and / or based on actual machine testing.

[0068] In this embodiment, the tension of the magnetic tape MT is controlled by controlling the rotational speed and torque of the feed motor 40 and the take-up motor 44, but the technology of the present invention is not limited thereto. For example, the tension of the magnetic tape MT can be controlled by using a tension adjustment roller, or it can be controlled by pulling the magnetic tape MT into a vacuum chamber.

[0069] Multiple guide rollers GR are rollers that guide the magnetic tape MT. The travel path of the magnetic tape MT is defined by multiple guide rollers GR being separately arranged across the read head 36 between the tape cassette 10 and the take-up reel 42.

[0070] The read head 36 includes a read element 46 and a holder 48. The read element 46 is held by the holder 48 in contact with the traveling magnetic tape MT and reads recorded information from the magnetic tape MT conveyed by the transport device 34.

[0071] The tape drive 30 includes a contactless read / write device 50. The contactless read / write device 50 is an example of the "external" aspect of the technology described in this invention. The contactless read / write device 50 is positioned below the tape cassette 10 when it is filled, facing the back surface 26B of the cartridge memory 19. Furthermore, the state in which the tape cassette 10 is filled in the tape drive 30 refers to, for example, a state in which the tape cassette 10 has reached a predetermined position as the position where the read head 36 begins reading recording information from the tape MT.

[0072] As an example, such as Figure 5 As shown, the contactless read / write device 50 releases a magnetic field MF from the underside of the tape cassette 10 toward the cartridge memory 19. The magnetic field MF penetrates the cartridge memory 19. Furthermore, the magnetic field MF is an example of the "magnetic field" involved in the technology of this invention.

[0073] As an example, such as Figure 6 As shown, the contactless read / write device 50 is connected to the control device 38. The control device 38 outputs a control signal to the contactless read / write device 50 to control the cassette memory 19. The contactless read / write device 50 releases a magnetic field MF toward the cassette memory 19 according to the control signal input from the control device 38. The magnetic field MF penetrates from the back side 26B of the cassette memory 19 toward the surface 26A.

[0074] The contactless reader / writer 50 transmits a command signal to the cartridge memory 19 under the control of the control device 38. Details will be described later. The command signal is a signal representing an instruction to the cartridge memory 19. When the command signal is transmitted from the contactless reader / writer 50 to the cartridge memory 19, the command signal transmitted from the contactless reader / writer 50 according to the instructions from the control device 38 is contained within the magnetic field MF. In other words, the command signal is superimposed on the magnetic field MF. That is, the contactless reader / writer 50 sends the command signal to the cartridge memory 19 via the magnetic field MF under the control of the control device 38.

[0075] An IC chip 52 and an external capacitor 54 are mounted on the surface 26A of the cassette memory 19. The IC chip 52 and the external capacitor 54 are bonded to the surface 26A. Furthermore, the IC chip 52 and the external capacitor 54 are sealed on the surface 26A of the cassette memory 19 by a sealing material 56. Here, the sealing material 56 is an ultraviolet-curable resin that cures upon reaction with ultraviolet light. However, ultraviolet-curable resin is only one example; a light-curable resin that cures upon reaction with light in a wavelength region other than ultraviolet light may also be used as the sealing material 56, as may a thermosetting resin, or even an adhesive. The IC chip 52 is an example of a "processing circuit" according to the technology of this invention. The external capacitor 54 is an example of an "external capacitor" according to the technology of this invention. The sealing material 56 is an example of a "sealing material" according to the technology of this invention.

[0076] As an example, such as Figure 7 As shown, a coil 60 is formed in a ring shape on the back surface 26B of the cassette memory 19. Here, copper foil is used as the material for the coil 60. Copper foil is just one example; other conductive materials such as aluminum foil can also be used. The coil 60 is connected by a magnetic field MF (see reference 50) applied from the contactless read / write device 50. Figure 5 and Figure 6 The induced current is generated by the action of the coil. Furthermore, coil 60 is an example of an "antenna coil" according to the technology of this invention.

[0077] A first conductive portion 62A and a second conductive portion 62B are provided on the back surface 26B of the cassette memory 19. The first conductive portion 62A and the second conductive portion 62B are soldered, and the two ends of the coil 60 are electrically connected to the IC chip 52 on the surface 26A (see reference). Figure 6 and Figure 8 ) and external capacitor 54 (reference) Figure 6 and Figure 8 ).

[0078] As an example, such as Figure 8 As shown, on surface 26A of the cassette memory 19, the IC chip 52 and the external capacitor 54 are electrically connected to each other via wires. Specifically, one terminal of the positive and negative terminals of the IC chip 52 is connected to the first conductive section 62A via wire 64A, and the other terminal is connected to the second conductive section 62B via wire 64B. Furthermore, the external capacitor 54 has a pair of electrodes. Figure 8 In the example shown, the pair of electrodes are electrodes 54A and 54B. Electrode 54A is connected to the first conductive part 62A via wire 64C, and electrode 54B is connected to the second conductive part 62B via wire 64D. Thus, the IC chip 52 and the external capacitor 54 are connected in parallel with respect to the coil 60.

[0079] As an example, such as Figure 9 As shown, the IC chip 52 includes a built-in capacitor 80, a power supply circuit 82, a computer 84, a clock signal generator 86, and a signal processing circuit 88. The IC chip 52 is a general-purpose IC chip that can be used in applications other than the cassette cartridge 10, and functions as a cassette cartridge computing device by installing a cassette cartridge program. Furthermore, the built-in capacitor 80 is an example of a "built-in capacitor" according to the technology of this invention.

[0080] Furthermore, the cassette memory 19 includes a power generator 70. The power generator 70 generates electricity by acting on a coil 60 with a magnetic field MF applied from the contactless read / write device 50. Specifically, the power generator 70 uses a resonant circuit 92 to generate alternating current (AC) power and converts the generated AC power into direct current (DC) power for output. Additionally, the resonant circuit 92 is an example of a "resonant circuit" according to the technology of this invention.

[0081] The power generator 70 includes a resonant circuit 92 and a power supply circuit 82. The resonant circuit 92 includes an external capacitor 54, a coil 60, and a built-in capacitor 80. The built-in capacitor 80 is a capacitor integrated into the IC chip 52, and the power supply circuit 82 is also integrated into the IC chip 52. The built-in capacitor 80 is connected in parallel with the coil 60. Furthermore, the built-in capacitor 80 is connected in parallel with the external capacitor 54.

[0082] External capacitor 54 is an external capacitor relative to IC chip 52. IC chip 52 is a general-purpose IC chip that can be used in applications different from tape cartridge 10. Therefore, the capacitance of built-in capacitor 80 is sometimes insufficient to achieve the resonant frequency required in the cartridge memory 19 used in tape cartridge 10. Therefore, in cartridge memory 19, an external capacitor 54 is mounted on IC chip 52 as a capacitor that has the capacitance required to cause resonant circuit 92 to resonate at a predetermined resonant frequency through the action of magnetic field MF. The capacitance of external capacitor 54 is formed by resonant circuit system 120 (described later) (see reference). Figure 10 The frequency is determined by [the method described in the original text]. Additionally, the frequency equivalent to the predetermined resonant frequency is, for example, 13.56 MHz, which can be appropriately determined based on the specifications of the cassette memory 19 and / or the contactless read / write device 50. Furthermore, 13.56 MHz is an example of the "predetermined resonant frequency" involved in the technology of this invention.

[0083] The power supply circuit 82 includes a rectifier circuit and a smoothing circuit. The rectifier circuit is a full-wave rectifier circuit with multiple diodes. A full-wave rectifier circuit is just one example; a half-wave rectifier circuit could also be used. The smoothing circuit consists of capacitors and resistors. The power supply circuit 82 converts the AC power input from the resonant circuit 92 into DC power and supplies the converted DC power (hereinafter also simply referred to as "power") to various driving elements within the IC chip 52. Examples of various driving elements include the computer 84, the clock signal generator 86, and the signal processing circuit 88. Thus, by using the power generator 70 to supply power to the various driving elements within the IC chip 52, the IC chip 52 operates using the power generated by the power generator 70.

[0084] Computer 84 includes a CPU, NVM, and RAM (all figures omitted). The NVM stores the tape cassette program and management information. The CPU controls the operation of the cassette memory 19 by reading the program from the NVM and executing the program in RAM.

[0085] Specifically, the CPU selectively performs polling, reading, and writing processes based on the command signals input from the signal processing circuit 88. Polling is the process of establishing communication between the cassette memory 19 and the contactless read / write device 50, and is performed, for example, as a preparatory process before the reading and writing processes. Reading is the process of reading management information, etc., from the NVM. Writing is the process of writing management information, etc., into the NVM. Polling, reading, and writing processes (hereinafter, unless otherwise specified, referred to as "various processes") are all performed by the CPU according to the clock signal generated by the clock signal generator 86. That is, the CPU performs various processes at a processing speed corresponding to the clock frequency.

[0086] Clock signal generator 86 generates a clock signal and outputs it to computer 84. Computer 84 operates according to the clock signal input from clock signal generator 86.

[0087] Signal processing circuit 88 is connected to resonant circuit 92. Signal processing circuit 88 has a decoding circuit and an encoding circuit (both omitted from the diagram). The decoding circuit of signal processing circuit 88 extracts the command signal from the magnetic field MF received by coil 60, decodes it, and outputs it to computer 84. Computer 84 outputs a response signal to the command signal to signal processing circuit 88. That is, computer 84 performs processing corresponding to the command signal input from signal processing circuit 88 and outputs the processing result as a response signal to signal processing circuit 88. In signal processing circuit 88, if a response signal is input from computer 84, the encoding circuit of signal processing circuit 88 modulates the response signal by encoding it and outputs it to resonant circuit 92. Resonant circuit 92 sends the response signal input from the encoding circuit of signal processing circuit 88 to contactless read / write device 50 via magnetic field MF. That is, when the response signal is sent from cassette memory 19 to contactless read / write device 50, the response signal is contained in magnetic field MF. In other words, the response signal is superimposed on magnetic field MF.

[0088] As an example, Figure 10 The resonant circuit forming system 120 shown is a system for forming a resonant circuit 92 by mounting an IC chip 52 and an external capacitor 54 on a substrate 26 on which a coil 60 is formed. The resonant circuit forming system 120 is, for example, incorporated into a production line for a cassette memory 19.

[0089] As an example, such as Figure 10 As shown, the resonant circuit forming system 120 includes an IC chip mounting device 124, a temporary resonant frequency measuring device 126, an external capacitor mounting device 128, and a control device 121.

[0090] The IC chip mounting apparatus 124, for example, connects the IC chip 52 to the coil 60 of the unfinished cassette memory (hereinafter referred to as "unfinished CM") 152 by the operation of a production line worker to form an unfinished cassette memory (hereinafter referred to as "unfinished CM with installed IC chip") 154 with an installed IC chip. The unfinished CM 152 is a cassette memory in the manufacturing process where the coil 60 is formed on the substrate 26 and neither the IC chip 52 nor the external capacitor 54 is installed. The unfinished CM 154 with installed IC chip is a cassette memory in the manufacturing process where the IC chip 52 is mounted on the substrate 26 where the coil 60 is formed and the external capacitor 54 is not installed. Thus, a resonant circuit, namely a temporary resonant circuit 148 (see reference), is formed that includes a built-in capacitor 80 and the coil 60 but does not include the external capacitor 54. Figure 12 Furthermore, the IC chip mounting device 124 seals the IC chip 52 connected to the substrate 26 with sealing material 56.

[0091] The temporary resonant frequency measuring device 126 is, for example, a device equipped with an impedance analyzer and capable of measuring the resonant frequency of a resonant circuit. The external capacitor mounting device 128 is a device for bonding and connecting an external capacitor 54 to the substrate 26. The temporary resonant frequency measuring device 126 and the external capacitor mounting device 128 are connected to the control device 121 via cables.

[0092] The control device 121 includes a computer 122, a receiver 136, and a display 138. The computer 122 includes a CPU 122A, an NVM 122B, and RAM 122C, which are connected via a bus 122D. Figure 10 In the example shown, for ease of illustration, one bus is depicted as bus 122D, but multiple buses are also possible. Furthermore, bus 122D can include a serial bus or a parallel bus consisting of a data bus, an address bus, and a control bus. Receiver 136 receives instructions from the administrator of the management resonant circuit forming system 120. Display 138 displays various information. Receiver 136 and display 138 are connected to computer 122 via bus 122D.

[0093] The NVM122B stores the capacitance determination procedure 130 and the reference resonant frequency 132. Here, as an example of the NVM122B, an EEPROM, SSD, or HDD is used, but it is not limited to these; a combination of multiple non-volatile memory devices can also be used. Various information is temporarily stored in RAM 122C. RAM 122C is used as the working memory by the CPU 122A.

[0094] CPU 122A reads the capacitance determination program 130 from NVM 122B and executes the read capacitance determination program 130 on RAM 122C. CPU 122A performs capacitance determination processing to determine the capacitance of external capacitor 54 by operating as capacitance determination unit 134 according to the capacitance determination program 130 executed on RAM 122C.

[0095] When an execution instruction is received from the receiving device 136, the capacitance determination unit 134 performs capacitance determination processing. The execution instruction is, for example, input by an operator from the receiving device 136.

[0096] As an example, such as Figure 11 As shown, in the capacitance determination process, the capacitance determination unit 134 outputs a temporary resonant frequency determination instruction 142 to the temporary resonant frequency determination device 126, causing the temporary resonant frequency determination device 126 to determine the resonant frequency of the temporary resonant circuit 148, i.e., the temporary resonant frequency 150 (reference). Figure 12Furthermore, the capacitance determination unit 134 causes the temporary resonant frequency measuring device 126 to send a temporary resonant frequency signal 144, representing the measured temporary resonant frequency 150, to the capacitance determination unit 134. The temporary resonant frequency 150 is an example of a "temporary resonant frequency" according to the technology of this invention. The temporary resonant frequency signal 144 is an example of a "signal" according to the technology of this invention.

[0097] As an example, such as Figure 12 As shown, the capacitance determination unit 134 receives a temporary resonant frequency signal 144 sent from the temporary resonant frequency measuring device 126. The capacitance determination unit 134 reads the reference resonant frequency 132 from the NVM 122B and determines the capacitance of the external capacitor 54 based on the difference between the temporary resonant frequency 150 contained in the received temporary resonant frequency signal 144 and the reference resonant frequency 132. The reference resonant frequency 132 is an example of the "reference resonant frequency" involved in the technology of this invention. The reference resonant frequency 132 is a frequency predetermined as the frequency at which the cassette memory 19 communicates with the contactless read / write device 50 via the magnetic field MF, for example, 13.56 MHz.

[0098] The difference used in the capacitance determination unit 134 is, for example, the difference between the temporary resonant frequency 150 and the reference resonant frequency 132. In addition, the difference is just one example; for example, it can also be the ratio of one of the temporary resonant frequency 150 and the reference resonant frequency 132 to the other, as long as it is a value that can determine the degree to which the temporary resonant frequency 150 deviates from the reference resonant frequency 132.

[0099] As an example, such as Figure 13 As shown, the capacitance determination unit 134 sends information related to the determined capacitance, i.e., capacitance information, to the external capacitor mounting device 128. The external capacitor mounting device 128 receives the capacitance information sent from the capacitance determination unit 134. The external capacitor mounting device 128 obtains the unfinished CM154 with the installed IC chip from the IC chip mounting device 124, and mounts the external capacitor 54, which has the capacitance indicated by the capacitance information, onto the unfinished CM154 with the installed IC chip in a surface-mount manner. Specifically, various capacitors with different capacitances are prepared in advance on the production line, and the external capacitor mounting device 128 mounts the capacitor with the capacitance closest to the determined capacitance as the external capacitor 54 onto the unfinished CM154 with the installed IC chip. Thus, a resonant circuit 92 with a reference resonant frequency 132 is formed.

[0100] Next, refer to Figure 14 The function of the resonant circuit forming system 120 according to this embodiment will be explained.

[0101] As an example, in Figure 14 In the manufacturing process of the resonant circuit 92 shown, firstly, in step ST101, the IC chip mounting device 124 connects the IC chip 52 to the coil 60 of the unfinished CM152. Then, the manufacturing process proceeds to step ST102.

[0102] In step ST102, the IC chip mounting apparatus 124 forms an unfinished CM154 with an IC chip mounted by sealing the IC chip 52 connected to the coil 60 of the unfinished CM152 with sealing material 56. Then, the manufacturing process proceeds to step ST103.

[0103] In step ST103, the temporary resonant frequency measuring device 126 measures the resonant frequency, i.e., the temporary resonant frequency 150, of the temporary resonant circuit 148 formed on the incomplete CM154 with the IC chip already installed. Then, the manufacturing process proceeds to step ST104.

[0104] In step ST104, the temporary resonant frequency measuring device 126 sends a temporary resonant frequency signal 144, representing the measured temporary resonant frequency 150, to the capacitance determination unit 134. The capacitance determination unit 134 receives the temporary resonant frequency signal 144 sent from the temporary resonant frequency measuring device 126. Then, the manufacturing process proceeds to step ST105.

[0105] In step ST105, the capacitance determination unit 134 determines the capacitance of the external capacitor 54 based on the difference between the reference resonant frequency 132 read from the NVM122B and the temporary resonant frequency 150 contained in the temporary resonant frequency signal 144. The capacitance determination unit 134 sends capacitance information representing the determined capacitance to the external capacitor mounting device 128. Then, the manufacturing process proceeds to step ST106.

[0106] In step ST106, the external capacitor mounting device 128 connects an external capacitor 54, which has a capacitance indicated by capacitance information, to the coil 60 of the incomplete CM154 with the IC chip already mounted. This forms a resonant circuit 92.

[0107] As described above, the cassette memory 19 includes an IC chip 52 and an external capacitor 54. The IC chip 52 has a built-in capacitor 80 and is mounted on a substrate 26 having a coil 60 that generates electricity through the action of a magnetic field MF applied from a contactless reader / writer 50. The external capacitor 54 is external to the IC chip 52. The built-in capacitor 80, the external capacitor 54, and the coil 60 constitute a resonant circuit 92 that resonates at a predetermined resonant frequency under the action of the magnetic field MF. The IC chip 52 operates using the electricity generated by the resonant circuit 92. The manufacturing method of the cassette memory 19 includes the following steps: measuring a temporary resonant frequency 150 with the external capacitor 54 not connected to the IC chip 52 and with the IC chip 52 connected to the coil 60; and determining the capacitance of the external capacitor 54 based on the difference between a reference resonant frequency 132 and the temporary resonant frequency 150 when the cassette memory 19 communicates with the contactless reader / writer 50 via the magnetic field MF. Therefore, according to this structure, compared to the case where the capacitance of the external capacitor 54 is determined without considering the difference between the reference resonant frequency 132 and the temporary resonant frequency 150, the resonant frequency of the resonant circuit 92 can be easily matched with the reference resonant frequency 132.

[0108] Furthermore, the manufacturing method of the cassette memory 19 includes the step of forming a resonant circuit 92 by mounting an external capacitor 54 having a determined capacitance onto a substrate 26. Therefore, according to this structure, compared to the case where the capacitance of the external capacitor 54 is determined without considering the difference between the reference resonant frequency 132 and the temporary resonant frequency 150, the resonant frequency of the resonant circuit 92 can be easily matched with the reference resonant frequency 132.

[0109] Furthermore, in the manufacturing method of the cassette memory 19, the resonant circuit 92 is formed by connecting the external capacitor 54 to the substrate 26 in a surface-mount manner. Therefore, according to this structure, compared with the case where the external capacitor 54 is connected to the substrate 26 in a through-hole mounting manner, it is possible to mount the external capacitor 54 to the substrate 26 in a space-saving manner.

[0110] Furthermore, in the manufacturing method of the cassette memory 19, after the IC chip 52, which is connected to the coil 60, is sealed with sealing material 56, an external capacitor 54 having a predetermined capacitance is mounted on the substrate 26. Therefore, according to this structure, the connection between the coil 60 and the IC chip 52 can be protected before the external capacitor 54 is mounted on the substrate 26.

[0111] Furthermore, in the manufacturing method of the cassette memory 19, the temporary resonant frequency 150 is measured after connecting the IC chip 52 to the coil 60 with the external capacitor 54 not connected to it. Therefore, according to this structure, the temporary resonant frequency 150 can be measured more accurately than when the external capacitor 54 is connected to the IC chip 52.

[0112] Furthermore, the manufacturing method of the cassette memory 19 further includes the steps of: transmitting a temporary resonant frequency signal 144 representing a temporary resonant frequency 150; and receiving the transmitted temporary resonant frequency signal 144. In the manufacturing method of the cassette memory 19, the capacitance of the external capacitor 54 is determined based on the temporary resonant frequency 150 represented by the received temporary resonant frequency signal 144. Therefore, according to this structure, compared to determining the capacitance of the external capacitor 54 without transmitting or receiving the temporary resonant frequency signal 144, the capacitance of the external capacitor 54 can be determined in a shorter time.

[0113] Furthermore, in the manufacturing method of the cassette memory 19, the built-in capacitor 80 and various driving elements are integrated into an IC chip. Therefore, according to this structure, compared with the case where the built-in capacitor 80 and various driving elements are not integrated into an IC chip, the built-in capacitor 80 and various driving elements can be easily mounted on the substrate 26.

[0114] Furthermore, in the manufacturing method of the cassette memory 19, the substrate 26 is a flexible substrate. Therefore, according to this structure, compared with the case of using a non-flexible substrate, a cassette memory 19 that is not easily broken can be formed.

[0115] Furthermore, in the above embodiment, an example was described in which the IC chip mounting apparatus 124 mounts the IC chip 52 onto the incomplete CM152 by means of an operator; however, the technology of the present invention is not limited thereto. The IC chip mounting apparatus 124 may also mount the IC chip 52 onto the incomplete CM152 according to instructions from the control device 121.

[0116] Furthermore, in the above embodiment, the example described is that the temporary resonant frequency measuring device 126 measures the temporary resonant frequency 150 of the temporary resonant circuit 148 according to the instruction from the capacitance determination unit 134, and sends the temporary resonant frequency signal 144 representing the measured temporary resonant frequency 150 to the capacitance determination unit 134. However, the technology of the present invention is not limited to this. The temporary resonant frequency 150 can also be measured by an operator using an impedance analyzer or oscilloscope, and the temporary resonant frequency signal 144 representing the measured temporary resonant frequency 150 can be input into the computer 122 via the receiving device 136.

[0117] Furthermore, in the above embodiments, an example of connecting the IC chip 52 and the coil 60 via wires has been given, but the technology of the present invention is not limited thereto. For example, such as Figure 15 As shown, IC chip 52 can also be connected in a flip-chip configuration. In this case, for example, one terminal of the positive and negative terminals of IC chip 52 is directly connected to the first conductive section 62A, and the other terminal is directly connected to the second conductive section 62B.

[0118] Furthermore, in the above embodiments, the tilt angle θ is exemplified as 45 degrees, but the technology of the present invention is not limited to this. As an example, such as Figure 16 As shown, the tilt angle of the cassette memory 19 relative to the reference plane 16A1 can also be a tilt angle θ1 that is smaller than the tilt angle θ. An example of a tilt angle θ1 is 30 degrees. Since the tilt angle θ1 is smaller than the tilt angle θ, more magnetic lines of force can pass through the coil 60 (reference) compared to the case of tilt angle θ. Figure 7 As a result, with the tape cartridge 10 loaded in the tape drive 30, the coil 60 is able to obtain a larger induced current compared to the case with a tilt angle θ.

[0119] The descriptions and illustrations above constitute a detailed explanation of a portion of the technology involved in this invention, and are merely one example of the technology of this invention. For example, the descriptions related to the above-described structure, function, effect, and effect are examples of the structure, function, effect, and effect of the portion involved in the technology of this invention. Therefore, without departing from the technical spirit of this invention, unnecessary parts may be deleted from the descriptions and illustrations above, or new elements may be added or replaced. Furthermore, to avoid complications and to facilitate understanding of the portion involved in the technology of this invention, descriptions related to common technical knowledge that are not particularly necessary to explain in terms of enabling the implementation of this invention have been omitted from the descriptions and illustrations above.

[0120] In this specification, "A and / or B" has the same meaning as "at least one of A and B". That is, "A and / or B" can mean only A, only B, or a combination of A and B. Furthermore, in this specification, the same approach applies to situations where three or more cases are connected by "and / or".

[0121] All documents, patent applications and technical standards described in this specification, and the specific and separately described documents, patent applications and technical standards incorporated herein by reference, are incorporated herein by reference to the same extent.

[0122] Symbol Explanation

[0123] 10-Cassette tape, 12-House, 12A-Right wall, 12B-Opening, 14-Upper house, 14A-Top plate, 14A1-Inner surface, 16-Lower house, 16A-Bottom plate, 16A1-Reference surface, 16B-Rear wall, 18-Cassette tape reel, 18A-Reel hub, 18B1-Upper flange, 18B2-Lower flange, 19-Cassette memory, 20-Supporting component, 20A-First tilting stage, 20A1, 20B1-Tilting surfaces, 20B-Second tilting stage, 22-Position limiting rib, 24- Rib, 24A-Front end face, 26-Substrate, 26A-Surface, 26B-Back end, 30-Magnetic tape drive, 34-Transport device, 36-Read head, 38-Control device, 40-Feed motor, 42-Take reel, 44-Take motor, 46-Read element, 48-Retainer, 50-Contactless reader / writer, 52-IC chip, 54-External capacitor, 54A, 54B-Electrodes, 56-Sealing material, 60-Coil, 62A-First conductive section, 62B-Second conductive section, 64A 64B, 64C, 64D - Wires; 70 - Power Generator; 80 - Built-in Capacitor; 82 - Power Supply Circuit; 84 - Computer; 86 - Clock Signal Generator; 88 - Signal Processing Circuit; 92 - Resonant Circuit; 120 - Resonant Circuit Forming System; 121 - Control Device; 122 - Computer; 122A - CPU; 122B - NVM; 122C - RAM; 122D - Bus; 124 - IC Chip Mounting Device; 126 - Temporary Resonant Frequency Measurement Device; 128 - External Power Supply. Container mounting device, 130 - Capacitance determination procedure, 132 - Reference resonant frequency, 134 - Capacitance determination unit, 136 - Receiving device, 138 - Display, 142 - Temporary resonant frequency measurement indicator, 144 - Temporary resonant frequency signal, 148 - Temporary resonant circuit, 150 - Temporary resonant frequency, 152 - Incomplete cassette memory, 154 - Incomplete cassette memory with installed IC chip, A, B, C - Arrows, GR - Guide roller, MF - Magnetic field, MT - Magnetic tape, θ, θ1 - Tilting angle.

Claims

1. A method for manufacturing a contactless communication medium, the contactless communication medium comprising: a processing circuit mounted on a substrate having an antenna coil and having a built-in capacitor, the antenna coil generating electricity through an externally applied magnetic field; and an external capacitor external to the processing circuit, which, together with the built-in capacitor and the antenna coil, constitutes a resonant circuit that resonates at a predetermined resonant frequency under the influence of the magnetic field, the processing circuit operating using the electricity generated by the resonant circuit, wherein... The method for manufacturing the contactless communication medium includes the following steps: The temporary resonant frequency is determined when the external capacitor is not connected to the processing circuit and when the processing circuit is connected to the antenna coil; and The capacitance of the external capacitor is determined based on the difference between the reference resonant frequency and the temporary resonant frequency when the contactless communication medium communicates with the outside via the magnetic field.

2. The method for manufacturing a contactless communication medium according to claim 1, further comprising the following steps: The resonant circuit is formed by mounting the external capacitor, which has a defined capacitance, onto the substrate.

3. The method for manufacturing a contactless communication medium according to claim 2, wherein, The resonant circuit is formed by surface-mounting the external capacitor to the substrate.

4. The method for manufacturing a contactless communication medium according to claim 2 or 3, wherein, After the processing circuit, which is connected to the antenna coil, is sealed with a sealing material, the external capacitor having a determined capacitance is mounted on the substrate.

5. The method for manufacturing a contactless communication medium according to any one of claims 1 to 3, wherein, With the external capacitor not connected to the processing circuit, the processing circuit is connected to the antenna coil, and the temporary resonant frequency is measured.

6. The method for manufacturing a contactless communication medium according to any one of claims 1 to 3, further comprising the following steps: Send a signal representing the temporary resonant frequency; and Receive the transmitted signal. The capacitance of the external capacitor is determined based on the temporary resonant frequency represented by the received signal.

7. The method for manufacturing a contactless communication medium according to any one of claims 1 to 3, wherein, The processing circuit has been integrated into an IC chip.

8. The method for manufacturing a contactless communication medium according to any one of claims 1 to 3, wherein, The substrate is a flexible substrate.

9. A contactless communication medium, comprising: A processing circuit is mounted on a substrate having an antenna coil, and has a built-in capacitor, wherein the antenna coil generates electricity by the action of an externally applied magnetic field; and An external capacitor, located outside the processing circuit, together with the built-in capacitor and the antenna coil, forms a resonant circuit that resonates at a predetermined resonant frequency under the influence of the magnetic field. The processing circuit operates using the power generated by the resonant circuit. The capacitance of the external capacitor is determined based on the difference between the reference resonant frequency and the temporary resonant frequency when the contactless communication medium communicates with the outside via the magnetic field. The temporary resonant frequency is measured when the external capacitor is not connected to the processing circuit and when the processing circuit is connected to the antenna coil.

10. The contactless communication medium according to claim 9, wherein, The processing circuit has been integrated into an IC chip.

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