Method for manufacturing LED electronic device, LED electronic device, and light emitting device
CN114664674BActive Publication Date: 2026-06-19FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
- Filing Date
- 2020-12-23
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
In the application of integrated circuits in the field of LED displays, the separation of LED chips from ICs leads to limited space for the size of the light-emitting devices and waste of manufacturing materials.
Method used
A circuit layer is generated on a dielectric substrate, filled with photoresist and patterned, then the LED chip is bonded and packaged, and integrated into the LED electronic device.
Benefits of technology
The size of the light-emitting device was reduced, saving on manufacturing materials and enabling full-color display.
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Smart Images
Figure CN114664674B_ABST
Abstract
A method for fabricating an LED electronic device, the LED electronic device, and a light-emitting device are disclosed. The method for fabricating the LED electronic device includes: forming a first circuit layer on one side of a dielectric substrate; filling the first circuit layer with positive photoresist and patterning the positive photoresist according to a preset photomask; filling the patterned positive photoresist with a dielectric material; removing the remaining positive photoresist from the first circuit layer to obtain an exposed position for bonding an LED chip; and bonding the LED chip at the exposed position of the first circuit layer and encapsulating it. This invention integrates and encapsulates the LED chip inside the LED electronic device, thereby controlling the chip's light emission. The light-emitting device only needs to encapsulate a miniature LED electronic device to achieve full-color LED display, significantly reducing the size and space of the light-emitting device and saving fabrication materials.
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