A pick-and-place structure, a die bonding device, and its working method

Abstract

This invention discloses a pick-and-place structure and a die-bonding device, including a worktable with pick-and-place die-bonding mechanisms symmetrically arranged at both ends. Each pick-and-place die-bonding mechanism includes a spindle rotary motor positioned above the worktable and a mounting frame positioned below the worktable. The output end of the spindle rotary motor passes through the worktable and connects to the mounting frame. Voice coil motors are symmetrically arranged on both sides of the mounting frame, and the output ends of the voice coil motors are mounted on mounting bases with swing arms on the mounting bases. The worktable also includes multiple vision CCDs and control solenoid valves, with the vision CCDs distributed on both sides of the pick-and-place die-bonding mechanism. This invention, through its overall structural design and the alternating movement of the double swing arms, shortens the time and significantly improves production efficiency.

Description

Technical Field

[0001] This invention relates to the field of integrated automated semiconductor equipment, specifically a pick-and-place structure and a die bonding device. Background Technology

[0002] With the rapid development of technology and the continuous emergence of new semiconductor materials, the information technology industry is booming, giving rise to automated integrated semiconductor equipment. This equipment not only reduces labor costs and improves resource utilization but also greatly increases production efficiency. While providing convenience in daily use, traditional automated integrated semiconductor equipment consists of a swing arm and a set of vertical Z-axis mechanisms. It picks up a chip, completes die bonding, and then removes the chip, resulting in low production efficiency. Therefore, we propose an improved pick-and-place structure and die bonding equipment. Summary of the Invention

[0003] To address the shortcomings of low production efficiency in existing technologies, this invention provides a pick-and-place structure and a die bonding device.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0005] The present invention discloses a pick-and-place structure, including a worktable, with pick-and-place die-bonding mechanisms symmetrically arranged at both ends of the worktable. Each pick-and-place die-bonding mechanism includes a spindle rotary motor disposed above the worktable and a mounting frame disposed below the worktable. The output end of the spindle rotary motor passes through the worktable and is connected to the mounting frame. Voice coil motors are symmetrically arranged on both sides of the mounting frame, and the output end of the voice coil motor is provided with a mounting base. A swing arm is provided on the mounting base. The worktable is also provided with multiple vision CCDs and control solenoid valves, with the multiple vision CCDs distributed on both sides of the pick-and-place die-bonding mechanism.

[0006] As a preferred embodiment of the present invention, one end of the mounting base is provided with a mounting plate, the middle of the mounting plate is provided with a first mounting hole, one end of the swing arm is provided with a first connecting plate, the middle of the connecting plate is provided with a first connecting hole, and the first mounting hole and the first connecting hole are connected by a rotating shaft.

[0007] As a preferred embodiment of the present invention, a reset plate is connected to the mounting base via a rotating shaft. One end of the reset plate is provided with a fixing post, and two first springs are provided on the fixing post. The ends of the two first springs are respectively connected to the inner walls on both sides of the mounting base. The other end of the reset plate passes through one end of the mounting base to the outside, and the other end of the reset plate is provided with a second mounting hole. One end of the first connecting plate is provided with a second connecting plate, and the middle part of the second connecting plate is provided with a second connecting hole. The second mounting hole and the second connecting hole are connected by a rotating shaft.

[0008] As a preferred embodiment of the present invention, the bottom of the first connecting plate is provided with a ball locking groove, a second spring and a positioning ball are provided in the ball locking groove, the positioning ball is located below the second spring, and one end of the mounting plate is provided with a hemispherical groove that cooperates with the positioning ball.

[0009] As a preferred embodiment of the present invention, the locking groove is cylindrical, the inner radius of the locking groove is larger than the radius of the positioning ball, the opening of the locking groove is circular, and the radius of the opening of the locking groove is smaller than the radius of the positioning ball.

[0010] As a preferred embodiment of the present invention, the top of the mounting bracket is provided with wiring holes.

[0011] As a preferred embodiment of the present invention, the two voice coil motors and the two swing arms are symmetrically distributed on both sides below the working platform with the main shaft rotary motor as the axis.

[0012] As a preferred embodiment of the present invention, a home position sensor is provided below the work platform.

[0013] The present invention provides a die bonding device, comprising the pick-and-place structure as described in any one of claims 1-7.

[0014] The present invention also discloses a method for operating the above-mentioned pick-and-place structure and die bonding device, comprising the following steps:

[0015] S1. Start the spindle rotation motor. The spindle rotation motor drives the mounting bracket to rotate, which in turn drives two voice coil motors to rotate, thereby driving the swing arm to rotate to the appropriate position. The nozzle on one of the swing arms picks up the chip.

[0016] S2. The spindle rotary motor operates, driving the mounting bracket to rotate 180°. The chip-picking arm rotates to the die-bonding position and performs the die-bonding action, while the other arm rotates to the chip-picking position and performs the chip-picking action.

[0017] S3. With the assistance of the home position sensor, the spindle rotation motor rotates 180° to complete the reset. The swing arm repeats the above operation, and so on.

[0018] S4. During the chip pick-up and die bonding process described above, the voice coil motor is activated as needed to drive the swing arm to move up and down, thereby adjusting the height of the swing arm to complete the chip pick-up, placement, and die bonding process.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The die-bonding mechanism of the present invention includes a spindle rotary motor disposed above the worktable and a mounting frame disposed below the worktable. The output end of the spindle rotary motor passes through the worktable and is connected to the mounting frame. Voice coil motors are symmetrically arranged on both sides of the mounting frame. The output end of the voice coil motor is provided with a mounting base. A swing arm is provided on the mounting base. By utilizing the alternating movement of the two swing arms, the time is shortened and the production efficiency is greatly improved.

[0021] 2. This invention uses a first connecting plate to hinge the swing arm to the mounting plate, and a reset plate is connected to the mounting base via a rotating shaft. One end of the reset plate is provided with a fixing post, and two first springs are provided on the fixing post. The ends of the two first springs are respectively connected to the inner walls on both sides of the mounting base. The other end of the reset plate passes through one end of the mounting base to the outside. The swing arm is then hinged to the reset plate using a second connecting plate. During the swinging process, the swing arm will drive the second connecting plate to swing left and right, which will drive one end of the reset plate to swing left and right. Under the action of the first spring, the reset plate is reset, thereby driving the swing arm to reset. This makes the swing arm anti-vibration and less prone to damage during rapid swinging, and improves its stability in chip picking and die bonding, thus improving work quality.

[0022] 3. The present invention provides a ball-locking groove at the bottom of the first connecting plate, and a second spring and a positioning ball are provided in the ball-locking groove. The positioning ball is located below the second spring. One end of the mounting plate is provided with a hemispherical groove that cooperates with the positioning ball. The cooperation between the hemispherical groove and the positioning ball helps the swing arm to stabilize quickly after deflection and reset, avoids continuous vibration under inertia, further improves its stability in picking up chips and bonding die, and improves work quality. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of a pick-and-place structure and a die-bonding device according to the present invention;

[0025] Figure 2 This is a schematic diagram of the picking and placing structure and the die-bonding mechanism of the die-bonding device of the present invention;

[0026] Figure 3 This is a schematic diagram of the pick-and-place structure and the pick-and-place die-bonding mechanism of the die-bonding device of the present invention from another angle;

[0027] Figure 4 This is a schematic diagram of the mounting base of the pick-and-place structure and the die bonding device of the present invention;

[0028] Figure 5 This is a schematic diagram of the swing arm of a pick-and-place structure and a die-bonding device according to the present invention;

[0029] Figure 6 This is a schematic diagram of the mounting base and swing arm connection structure of the pick-and-place structure and the die bonding equipment of the present invention;

[0030] Figure 7 This is a schematic diagram of the internal structure of the mounting base of the pick-and-place structure and die bonding equipment of the present invention.

[0031] In the diagram: 1. Worktable; 2. Die-bonding mechanism; 3. Spindle rotary motor; 4. Mounting bracket; 5. Voice coil motor; 6. Mounting base; 7. Swing arm; 8. Vision CCD; 9. Control solenoid valve; 10. Wiring hole; 601. Reset plate; 602. Fixing post; 603. First spring; 604. First mounting hole; 605. Mounting plate; 606. Second mounting hole; 607. Hemispherical groove; 701. First connecting plate; 702. Second connecting plate; 703. First connecting hole; 704. Second connecting hole; 705. Ball locking groove; 706. Second spring; 707. Positioning ball. Detailed Implementation

[0032] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0033] Example: Figure 1-3 As shown, this invention discloses a pick-and-place structure and die-bonding equipment, including a worktable 1. Pick-and-place die-bonding mechanisms 2 are symmetrically arranged at both ends of the worktable 1. Each pick-and-place die-bonding mechanism 2 includes a spindle rotary motor 3 positioned above the worktable 1 and a mounting frame 4 positioned below the worktable 1. The output end of the spindle rotary motor 3 passes through the worktable 1 and connects to the mounting frame 4. Voice coil motors 5 are symmetrically arranged on both sides of the mounting frame 4. The output ends of the voice coil motors 5 are provided with mounting bases 6, and swing arms 7 are mounted on the mounting bases 6. The two voice coil motors 5 and the two swing arms 7 are symmetrically distributed on both sides below the worktable 2 with the spindle rotary motor 3 as the axis. By utilizing the alternating movement of the two swing arms 7, the time is shortened, greatly improving production efficiency. The swing arms 7 have a hollow structure and multiple through holes to reduce their mass and wind resistance during swinging, preventing damage to the swing arms 7 due to inertia and wind resistance. The top of the mounting frame 4 has wiring holes 10 for wiring organization, preventing damage to the wiring caused by the spindle rotary motor 3 during operation. The worktable 1 is also equipped with multiple vision CCDs 8 and control solenoid valves 9, used to control the nozzles on the swing arm 7 to pick up and place the chip. Multiple vision CCDs 8 are distributed on both sides of the die-bonding mechanism 2 for control. A home position sensor is located below the worktable 2, used to position the swing arm 7 during its 180° rotation and reset process.

[0034] Among them, such as Figure 4-6As shown, one end of the mounting base 6 is provided with a mounting plate 605, and the middle of the mounting plate 605 is provided with a first mounting hole 604. One end of the swing arm 7 is provided with a first connecting plate 701, and the middle of the connecting plate 701 is provided with a first connecting hole 703. The first mounting hole 604 and the first connecting hole 703 are connected by a rotating shaft, connecting the first connecting plate 701 and the mounting plate 605, so that the swing arm 7 is connected to the mounting base 6 and the swing arm 7 can rotate. Figure 7 As shown, a reset plate 601 is connected to the mounting base 6 via a rotating shaft. One end of the reset plate 601 has a fixing post 602, and two first springs 603 are mounted on the fixing post 602. The ends of the two first springs 603 are respectively connected to the inner walls on both sides of the mounting base 6. The other end of the reset plate 601 passes through one end of the mounting base 6 to the outside, and the other end of the reset plate 601 has a second mounting hole 606. One end of the first connecting plate 701 has a second connecting plate 702, and the middle of the second connecting plate 702 has a second connecting hole. The second mounting hole 606 and the second connecting hole 704 are connected by a rotating shaft. During the swinging process, the swing arm 7 will drive the first connecting plate 701 to rotate on the mounting plate 605. The second connecting plate 702 swings left and right, causing one end of the reset plate 601 to swing left and right. Under the action of the first spring 603, the reset plate 601 is reset, thereby driving the swing arm 7 to reset. This makes the swing arm 7 shockproof and less prone to damage during rapid swinging, and improves its stability in picking up chips and bonding die, thus improving the working quality.

[0035] The first connecting plate 701 has a ball-locking groove 705 at its bottom. A second spring 706 and a positioning ball 707 are located within the ball-locking groove 705. The positioning ball 707 is positioned below the second spring 706. The second spring 706 pushes the positioning ball 707 outwards. The ball-locking groove 705 is cylindrical, with an inner radius larger than the radius of the positioning ball 707. The opening of the ball-locking groove 705 is circular, with a radius smaller than the radius of the positioning ball 707. Under the push of the second spring 706, a portion of the positioning ball 707 protrudes from the ball-locking groove 705. One end of the mounting plate 605 has a hemispherical groove 607 that mates with the positioning ball 707. When the swing arm 7 does not deflect, the exposed portion of the positioning ball 707 is placed in the hemispherical groove 607. When the swing arm 7 deflects, the positioning ball 707 disengages from the hemispherical groove 607, and the second mounting plate 606 presses the positioning ball 707, causing it to compress the second spring 706 and move into the locking ball groove 705. When the swing arm 7 resets under the action of the first spring 603, the positioning ball 707 resets under the action of the second spring 706 and is placed back in the hemispherical groove 607. The cooperation between the hemispherical groove 607 and the positioning ball 707 helps the swing arm 7 to quickly stabilize after deflection and reset, avoids continuous vibration under inertia, further improves its stability in chip picking and die bonding, and improves work quality.

[0036] Based on the above-described pick-and-place structure and die bonding equipment working method, the steps are as follows:

[0037] S1. Start the spindle rotation motor 3. The spindle rotation motor 3 drives the mounting bracket 4 to rotate. The mounting bracket 4 drives the two voice coil motors 5 to rotate, thereby driving the swing arm 7 to rotate to the appropriate position. The nozzle on one of the swing arms 7 picks up the chip.

[0038] S2. The spindle rotary motor 3 operates, driving the mounting bracket 4 to rotate 180°. The chip-picking arm 7 rotates to the die-bonding position and performs the die-bonding action. The other arm rotates to the chip-picking position and performs the chip-picking action.

[0039] S3. With the assistance of the home position sensor, the main spindle rotation motor 3 rotates 180° to complete the reset. The swing arm 7 repeats the above operation, and so on.

[0040] S4. During the chip pick-up and die bonding process described above, the voice coil motor 5 is started as needed to drive the swing arm 7 to move up and down, thereby adjusting the height of the swing arm 7 to complete the chip pick-up and die bonding process.

[0041] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A pick-and-place structure comprising a worktable (1), characterized in that, The worktable (1) is symmetrically provided with a die-bonding mechanism (2) at both ends. The die-bonding mechanism (2) includes a spindle rotary motor (3) located above the worktable (1) and a mounting frame (4) located below the worktable (1). The output end of the spindle rotary motor (3) passes through the worktable (1) and is connected to the mounting frame (4). The mounting frame (4) is symmetrically provided with voice coil motors (5) on both sides. The output end of the voice coil motor (5) is provided with a mounting base (6). The mounting base (6) is provided with a swing arm (7). The worktable (1) is also provided with multiple vision CCDs (8) and control solenoid valves (9). The multiple vision CCDs (8) are distributed on both sides of the die-bonding mechanism (2). The mounting base (6) has a mounting plate (605) at one end, and a first mounting hole (604) in the middle of the mounting plate (605). The swing arm (7) has a first connecting plate (701) at one end, and a first connecting hole (703) in the middle of the connecting plate (701). The first mounting hole (604) and the first connecting hole (703) are connected by a rotating shaft. The mounting base (6) is connected to a reset plate (601) via a rotating shaft. One end of the reset plate (601) is provided with a fixing post (602). The fixing post (602) is provided with two first springs (603). The ends of the two first springs (603) are respectively connected to the inner walls on both sides of the mounting base (6). The other end of the reset plate (601) passes through one end of the mounting base (6) to the outside. The other end of the reset plate (601) is provided with a second mounting hole (606). One end of the first connecting plate (701) is provided with a second connecting plate (702). The middle part of the second connecting plate (702) is provided with a second connecting hole (704). The second mounting hole (606) and the second connecting hole (704) are connected by a rotating shaft. The bottom of the first connecting plate (701) is provided with a ball locking groove (705), and a second spring (706) and a positioning ball (707) are provided in the ball locking groove (705). The positioning ball (707) is located below the second spring (706), and one end of the mounting plate (605) is provided with a hemispherical groove (607) that cooperates with the positioning ball (707).

2. The pick-and-place structure of claim 1, wherein, The locking groove (705) is cylindrical, and the inner radius of the locking groove (705) is larger than the radius of the positioning ball (707). The opening of the locking groove (705) is circular.

3. A pick-and-place structure according to claim 2, wherein, The mounting bracket (4) has a wiring hole (10) on its top.

4. The pick-and-place structure of claim 1, wherein, The two voice coil motors (5) and the two swing arms (7) are symmetrically distributed on both sides below the worktable (1) with the main shaft rotary motor (3) as the axis.

5. A die bonding apparatus, characterized in that, Includes the pick-and-place structure as described in any one of claims 1-4.

6. A chip pick-and-place die bonding method, using the pick-and-place structure according to any one of claims 1-4, or the working method of the die bonding equipment according to claim 5, characterized in that, Includes the following steps: S1. Start the spindle rotation motor (3). The spindle rotation motor (3) drives the mounting bracket (4) to rotate. The mounting bracket (4) drives the two voice coil motors (5) to rotate, thereby driving the swing arm (7) to rotate to the appropriate position. The nozzle on one of the swing arms (7) picks up the chip. S2. The spindle rotary motor (3) works, driving the mounting bracket (4) to rotate 180°. The chip pick-up arm (7) rotates to the die bonding position and performs the die bonding action. The other arm rotates to the chip pick-up position and performs the chip pick-up action. S3. With the assistance of the home position sensor, the main shaft rotary motor (3) rotates 180° to complete the reset. The swing arm (7) repeats the above operation, and so on. S4. During the chip pick-up and die bonding process, the voice coil motor (5) is started to drive the swing arm (7) to move up and down, thereby adjusting the height of the swing arm (7) to complete the chip pick-up and die bonding process.

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