Including system-in-package relative to the circuit board

Abstract

This invention is entitled "System-in-Package Including Relative Circuit Boards". The invention describes system-in-package structures and assembly methods. In one embodiment, a system-in-package encapsulates relative circuit boards, each relative circuit board including mounting components that overlap with mounting components of the relative circuit boards. The gaps between the relative circuit boards may be filled with a molding material that additionally encapsulates the overlapping mounted components. In some embodiments, the relative circuit boards are stacked on top of each other using one or more interposers that can provide mechanical or electrical connections.

Description

[0001] This application is a divisional application of Chinese patent application 201910127706.7, filed on February 21, 2019, entitled "System-in-package including relative circuit board". Technical Field

[0002] The implementation schemes described in this article relate to electronic packaging, and more specifically, to printed circuit board assemblies. Background Technology

[0003] The trend in consumer electronics is towards minimizing products across a range of categories, including telephones, computers, portable music players, earphones, and audio systems, except for display size. Consequently, there is a driving force to minimize all components within these products.

[0004] The main logic board (MLB) is a common component in almost all consumer electronics products. The industry has been working to use smaller and thinner dies, packages, and components. The spacing between components is also becoming increasingly smaller. The industry is also striving to add more and more intelligent features to all portable electronic products, including smartphones and watches. These new features require new hardware. To implement hardware such as camera modules, alarms, charging, batteries, and biosensors, the MLB may become limited by a certain volume, along with limitations on area, height, or shape. Summary of the Invention

[0005] This invention describes a system-in-package (SIP) structure and assembly method. In one embodiment, a SIP structure includes: a first circuit board having a first side and a second side opposite to the first side; one or more second-side components mounted at least on the second side of the first circuit board; a second circuit board having a first side and a second side opposite to the first side; and one or more first-side components mounted at least on the first side of the second circuit board. According to an embodiment, the first side of the second circuit board faces the second side of the first circuit board, and the gap between the first and second circuit boards is filled with a molding material.

[0006] The opposing circuit board may be stacked using one or more interposers that provide mechanical connections and optionally electrical connections. In one embodiment, the interposer includes one or more lateral tunnels extending from the lateral outer side of the interposer to the lateral inner side of the interposer.

[0007] Assembly of a system-in-package according to an embodiment may include stacking a first circuit board onto a second circuit board, and then molding the stacked circuit boards to fill the gaps between the circuit boards with a molding material. In some embodiments, the molding material flows through one or more lateral tunnels extending through one or more interposers. In the final system-in-package structure, the molding material may be retained in the lateral tunnels. Attached Figure Description

[0008] Figure 1 This is a flowchart illustrating a method for assembling a system-level package according to one implementation scheme.

[0009] Figures 2A-2E This is a cross-sectional side view showing the sequence of assembling a system-in-package according to one implementation.

[0010] Figure 3 This is a schematic cross-sectional side view showing a stacked interpolator installed between two circuit boards according to one embodiment.

[0011] Figure 4 This is a schematic top view layout of the circuit board components and interposers on the circuit board according to the implementation plan.

[0012] Figures 5A-5B This is a schematic cross-sectional side view showing an inserter including a transverse tunnel according to an embodiment.

[0013] Figures 6A-6D This is a cross-sectional side view showing the sequence of an assembly system-level package using sacrificial supports according to one embodiment.

[0014] Figures 7A-7B This is a schematic top view of the sacrificial support mounted on the circuit board according to the implementation plan.

[0015] Figures 8A-8C This is a cross-sectional side view showing the sequence of assembling a system-in-package with dual-sided surface mount circuit boards according to one embodiment.

[0016] Figures 9A-9D This is a cross-sectional side view showing the sequence of assembling a system-in-package with a pre-molded circuit board according to one embodiment.

[0017] Figures 10A-10C This is a cross-sectional side view showing the sequence of assembling a system-in-package with a pre-molded circuit board according to one embodiment. Detailed Implementation

[0018] The implementation describes a system-in-package (SiP) structure and assembly method in which opposing circuit boards are stacked on top of each other, with the gaps between the stacked boards filled with a molding material. Furthermore, interposer structures may be arranged between the circuit boards to provide mechanical support for the stacked structure and to provide electrical connections between the circuit boards. The implementation described herein is applicable to various circuit boards, such as printed circuit boards and MLBs.

[0019] In one aspect, it has been observed that the open-face design of traditional circuit board layouts, such as for main logic boards (MLBs), can lead to increased yield losses, reliability failures, and performance degradation as component density increases. The industry typically focuses on underfill materials to make the entire circuit board more robust. However, underfill materials and tooling can be expensive. Alternative structures and processes for achieving the desired reliability and performance features are described according to implementation schemes.

[0020] According to the implementation, two circuit boards are stacked together instead of using a single board with an open surface. Therefore, the overall x, y dimensions of the system can be smaller. The two circuit boards can be connected by interposers. Interposers can be present on both sides (e.g., stacked and joined), or a single interposer can be present on one of the boards. According to the implementation, the interposers electrically connect the two circuit boards and physically connect them. For example, the interposers include through-holes for signal and power transmission between the circuit boards. An additional molding design using a molding material (such as epoxy molding compound (EMC)) can be included to fill the gap between the two circuit boards. For example, a film-assisted transfer molding process may be able to fill gaps of tens of micrometers. In some implementations, this can allow for the elimination of underfill for board components. The molding design can also have mechanical robustness, especially compared to open-surface designs or hollow board stacks. Additionally, the molding structure can be waterproof. Furthermore, due to the stacked design, the component layout on the circuit boards can be more flexible for improved signal integrity.

[0021] According to embodiments, the interposer may include through-holes for signal and power connections, and optionally include active or passive components such as integrated circuits, resistors, capacitors (e.g., electrostatic discharge (ESD) decoupling capacitors), etc. The interposer may additionally provide electromagnetic interference (EMI) shielding. In some embodiments, the interposer is arranged along the edge or contour of a circuit board. In some embodiments, the interposer includes lateral tunnels or spaces to facilitate molding operations. These lateral tunnels may be partially or completely filled with a molding compound, which is a molding compound used to fill gaps between opposing circuit boards.

[0022] Various embodiments are described with reference to the accompanying drawings. However, some embodiments may be implemented without one or more of these specific details or without being combined with other known methods and configurations. In the following description, numerous specific details such as particular configurations, dimensions, processes, etc., are shown to provide a thorough understanding of the embodiments. In other instances, well-known semiconductor processes and manufacturing techniques are not described in particular detail to avoid unnecessarily obscuring the embodiments. The phrase "an embodiment" as used throughout the specification means that a particular feature, structure, configuration, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the phrase "in an embodiment" appearing multiple times throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, configuration, or characteristic may be combined in one or more embodiments in any suitable manner.

[0023] As used herein, the terms “above,” “to,” “between,” “across,” and “on” can refer to the relative position of a layer with respect to other layers. A layer being “above,” “across,” or “on” with respect to another layer, or being “in contact” with another layer, can mean directly contacting other layers or having one or more intervening layers. A layer being “between” multiple layers can mean directly contacting those multiple layers or having one or more intervening layers.

[0024] Now for reference Figure 1 It provides a cross-sectional side view illustration of a method for assembling a system-in-package according to one implementation scheme. For clarity and brevity, the following section... Figure 1 The argument can be compared with the Figures 2A-2E The description of the sequence illustrated herein is presented concurrently. However, it should be understood that these implementations are not limited to this, and variations in structure and sequence can be envisioned. For example, Figures 3-10C Various structural and sequential variations are provided, as described below.

[0025] According to the implementation scheme, the illustrated processing sequence begins with a circuit board that has already been filled with components and optional interposers using SMT assembly. This operation can be performed at the panel level, followed by the individualization of the filled circuit board. In some variations, the circuit board may be filled on one or both sides, or may also be molded on one or both sides, or may not have been molded at all. Therefore, the processing sequence described herein according to the implementation scheme is compatible with a variety of different circuit board designs. These circuit boards can then be stacked and molded, which can be performed during the panel reconstruction process, followed by the individualization of the stacked circuit boards. Optionally, a final SMT assembly can be performed before or after the individualization to add any additional desired components to the stacked circuit board.

[0026] In one embodiment, during operation 110, a first circuit board 210 is stacked on top of a second circuit board 240 to form a circuit board stack 280. Figures 2A-2B As shown, the first circuit board 210 may include a first side 212 and a second side 214 opposite to the first side, and one or more second side components 220 mounted at least on the second side 214 (e.g., the bottom side) of the first circuit board 210. The second circuit board 240 may include a first side 242 and a second side 244, and one or more first side components 250 mounted at least on the first side 212 (e.g., the top side) of the second circuit board 240. According to an embodiment, a gap 281 and associated components, such as..., exist between the first circuit board 210 and the second circuit board 240. Figure 2B As shown. Therefore, gap 281 is also located between overlapping (e.g., vertical rather than horizontal) components 220, 250.

[0027] like Figure 2B as well as Figure 3 As shown in the close-up diagram, interposers 230 and 260 are also mounted to either or both of circuit boards 210 and 240, and extend between and connect the first circuit board 210 and the second circuit board 240. This connection can be physical and can additionally be an electrical connection between the circuit boards. Thus, a single interposer can be mounted on one of the circuit boards 210 and 240, which will connect the circuit boards 210 and 240 after stacking. Alternatively, as illustrated, interposers can be mounted on each circuit board, and the stacked circuit boards include stacked interposers 230 and 260 to form an interposer stack 270. According to the embodiment, one or more interposers 230 and 260 are positioned laterally adjacent to one or more components 220 and 250 on their respective circuit boards 210 and 240.

[0028] Circuit boards 210, 240 may be substrates with one or more layers having conductive traces or routes therein. For example, circuit boards 210, 240 may include rigid substrates 211, 241 having conductive traces 215, 245 for attaching various components, interposers, etc. The conductive traces 215, 245 may be wholly or partially contained within the rigid substrates 211, 241, or may be formed on the surface of the substrates 211, 241. In some configurations, a significant portion of the conductive traces 215, 245 is contained within multiple metal layers within the substrates 211, 241, with limited routes of the conductive traces 215, 245 located on top of the substrates 211, 241. In one embodiment, each interposer 230, 260 is bonded to the conductive traces 215, 245 on the substrates 211, 241 of the respective circuit board 210, 240. Substrates 211 and 241 can be formed from various materials including conventional substrates, such as FR-2 (resin-impregnated phenolic paper), FR-4 (resin-impregnated woven glass fiber), ABF (Ajinomoto Build-up Film) metal or metal-core substrates, silicon-core substrates, ceramics, polymers, etc. In some embodiments, the substrate can be flexible. Conductive traces 215 and 245 can be formed from suitable materials (such as copper). In one embodiment, the first conductive trace 215 is additionally electrically connected to one or more second-side components 220 mounted on a second side 214 of the first circuit board 210, and the second conductive trace 245 is additionally electrically connected to one or more first-side components 250 mounted on a first side 242 of the second circuit board 240.

[0029] Still referencing Figure 3One or more components 220, 250 and one or more through-holes 230, 260 can be mounted onto their respective circuit boards using SMT techniques (such as flip-chip technology) with the aid of solder bumps 350. Alternative techniques, including conductive films, pins, wire bonding, etc., can be used additionally. In the illustrated embodiment, the stacked through-holes 230, 260 are bonded to each other. In applications where the through-holes 230, 260 primarily provide structural support, any suitable bonding technique can be used. Where the through-holes 230, 260 additionally provide electrical connections, the bonding technique can support those connections. For example, conductive paste, films, and solder bumps 350 can be suitable bonding methods. To facilitate electrical connections, the through-holes 230, 260 may include one or more metal traces 310, such as through-holes extending from the bottom side of the through-hole to the top side of the through-hole. The metal traces 310 may be contained within one or more insulating material layers 302. Therefore, the inserters 230, 260 are not limited to configurations with through-holes, and the metal trace 310 may be formed within multiple metal layers and insulating material layers 302. The inserters 230, 260 may optionally include a top-side route 330 or a bottom-side route 320 to facilitate electrical connection.

[0030] Now for reference Figure 2C In operation 120, the circuit board stack 280 can be placed on the carrier substrate 290. This operation can be performed at the panel level, where multiple circuit board stacks 280 are placed on the carrier substrate 290. Various carrier substrates can be used, such as glass or metal carriers. Placement can be aided by adding an adhesive tape layer. The carrier substrate 290 can be a rigid substrate to support manipulation and subsequent molding and individualization operations.

[0031] Subsequently, in operation 130, the circuit board stack 280 can be molded, thereby filling the gap 281 between the first circuit board 210 and the second circuit board 240 with molding material 295. For example... Figure 2D As shown, the molding operation can be performed at the panel level, where multiple molding cavities correspond to multiple board stacks 280. In one embodiment, the molding operation is a film-assisted transfer molding process. Such processes can fill gaps of tens of micrometers. In one aspect, doing so can allow the omission of underfill material for any of the components 220, 250 or interposers 230, 260. The board stack can then be individualized in operation 140. The individualization, depending on the embodiment, can cut through only one of the boards (e.g., the second board 240) or can cut through both boards 210, 240 and the molding material 295 within the gap 281.

[0032] According to the implementation plan, additional processing and SMT installation of various components can be performed before or after individualization. Figure 2E This is a schematic cross-sectional side view illustrating a unibody system-in-package 200 according to one embodiment. As shown in the unibody structure, component 220 overlaps with component 250. Additionally, molding material 295 is used to fill the gaps between circuit boards 210 and 240, as well as the gaps between other components 220 and 250. According to one embodiment, a first circuit board 210 includes a plurality of interposers 230 laterally adjacent to one or more components 220 on the first circuit board, a second circuit board 240 includes a plurality of interposers 260 laterally adjacent to one or more components 250 on the second circuit board, and stacking the first circuit board onto the second circuit board includes engaging the first plurality of interposers onto the second plurality of interposers to form an interposer stack 270.

[0033] According to the implementation scheme, the final surface mount operation may optionally place component 222 onto a first side 212 of the first circuit board 210, and / or place components 290, 292 onto a first side 242 of the second circuit board 240. As shown, the second circuit board 240 may have a larger area (e.g., increased length or width) than the first circuit board 210 to accommodate the additional components 290, 292. In other implementation schemes, the order of the final surface mount and individualization of the components may be reversed.

[0034] Now for reference Figure 4 as well as Figures 5A-5B Both, Figure 4 This is a schematic top view layout of the circuit board components and interposers in the system-in-package according to the implementation scheme. Figures 5A-5B This is a schematic cross-sectional side view of the inserter including the transverse tunnel 410 according to the implementation scheme. For clarity, Figure 4 The schematic top layout view is about the components 220 and interpolators 230 relative to a single board 210 within the board stack.

[0035] Intercalators according to embodiments have been described as providing mechanical support and electrical connections between stacked circuit boards. According to embodiments, intercalators can also be used to provide shielding, such as electromechanical interference (EMI) shielding. Therefore, intercalators can be arranged in various different ways. In some embodiments, the intercalators are distributed, thereby providing mechanical support and electrical connections at designated locations. Intercalators can be spaced apart or closely spaced. When used for EMI shielding, intercalators can be arranged closely together and can surround one or more components. Figure 4As shown, in a configuration where interposers 230 / 270 are arranged around one or more of components 220 (and 250) laterally, adjacent to the periphery of one of the circuit boards 210 (or 240), multiple interposers 230 / 270 may be arranged around one or more of the components 220 (and 250). This can be a uniform configuration completely around the periphery of the circuit board, or it can be a non-uniform configuration, where narrower spacing is allowed closer to specific components, while wider spacing is allowed closer to other components. Figure 4 In another embodiment also illustrated, multiple interpolators 230 / 270 may be arranged at a smaller scale and situated between 220, but still surrounding one or more specific components 220. In both embodiments, the interpolators 230 / 270 may surround (or be arranged more densely (with spacing between them)) a subsystem comprised of specific passive components 220P in order to shield it from other components, such as wireless components 220W located outside the subsystem within the stacked system-in-package or outside the system-in-package.

[0036] In some embodiments, while a dense arrangement of inserters may be provided, this could affect the flow of the molding compound during molding operations. Therefore, inserters 230, 260 may include a lateral tunnel 410 extending from the lateral outer side 422 of the inserter to the lateral inner side 424 of the inserter, through which the molding compound can flow during molding.

[0037] In one embodiment, molding the circuit board stack 280 includes causing a molding compound to flow through a plurality of interposers 230 and / or 260 that connect the bottom side of the first circuit board 210 to the top side of the second circuit board 240, wherein the plurality of interposers 230 and / or 260 are laterally adjacent to one or more components 220 on the first circuit board 210 and one or more components 250 on the second circuit board 240.

[0038] Now for reference Figures 5A-5B Various configurations for providing lateral tunnel 410 are shown. It should be understood that these configurations are exemplary, and alternative arrangements are contemplated for the implementation. As shown, interposers 230, 260 may include a top side 332, a bottom side 322, and multiple metallic traces 310 extending from the bottom side 322 of the interposer to the top side 332 of the interposer. One or more lateral channels 410 may extend from the lateral outer side 422 of the interposer to the lateral inner side 424 of the interposer. Additionally, the interposer may optionally include a top side wiring layer 330 and a bottom side wiring layer 320 (e.g., ...). Figure 3(As shown). In some embodiments, a metallic shielding layer may be formed on the outer side 422 of the interposer, particularly for EMI shielding applications. In some embodiments, interposers 230, 260 may include additional active or passive components embedded within the interposer, such as integrated circuits, resistors, and capacitors (e.g., electrostatic discharge decoupling capacitors).

[0039] Figures 5A-5B Both specific embodiments shown provide one or more transverse tunnels 410 extending through the top side 332 of the insert. These may, for example, resemble notches formed in the insulating material 302. Similarly, one or more transverse tunnels 410 (e.g., notches) may extend through the bottom side 322 of the insert. Additionally or alternatively, one or more intermediate transverse tunnels 410 may extend through the central portion of the insert. Such intermediate transverse tunnels 410 are completely closed (e.g., not open on the top or bottom side). Figure 5A An example of an inserter including a post (e.g., a through hole) with a metal trace 310 is particularly illustrated. Figure 5B In an exemplary embodiment, the interposer may include a plurality of staggered posts of metal traces 310. In such embodiments, the number of transverse tunnels 410 may be reduced, or the spacing may be increased to accommodate additional posts of metal traces 310.

[0040] The interposer, according to the embodiment, can be held between circuit boards within the system-in-package structure. The lateral tunnel 410 can provide a pathway for the flow of molding compound during the molding operation. According to some embodiments, the lateral tunnel 410 can remain completely filled with molding material 295 in the final structure.

[0041] In the following text Figures 6A-10C Several process flow variants will be provided in the description. Although they are illustrated and described separately, it should be understood that many of these process flows can be combined and integrated with... Figures 1-5B Combine this with relevant descriptions.

[0042] Figures 6A-6D This is a cross-sectional side view showing the sequence of an assembly system-level package using sacrificial supports according to one embodiment. Figures 7A-7BThis is a schematic top view of a sacrificial support mounted on a circuit board according to an embodiment. It is conceivable that during film-assisted molding operations of the stacked circuit boards, molding overflow may occur onto the non-molded side of the circuit boards. In one embodiment, a sacrificial support 600 can be used to mitigate this possibility. In such embodiments, the two circuit boards 210, 240 can optionally be cut to slightly larger than the final product size. The sacrificial support 600 can then be mounted within an enlarged portion of one or both circuit boards, for example, around the perimeter. The support can be mounted in selected areas of the circuit board, such as all corners, as... Figure 7A As shown. The sacrificial support 600 can also be a frame with sufficient holes for molding flow, such as... Figure 7B As shown.

[0043] The sacrificial support 600 allows the circuit board stack 280 to be more robust during the molding operation, resulting in less deformation of the circuit board stack 280. Furthermore, this allows for increased pressure applied to the circuit board and can prevent molding overflow or material flow. Figure 6A In the illustrated process sequence, the sacrificial support can be mounted on one or both of the circuit boards. Circuit board 240 has been selected for illustrative purposes. The circuit boards are then stacked and molded, as follows: Figure 6B As shown. After the molding operation, it can be done as follows: Figure 6C The stacked circuit boards are individually segmented to remove the sacrificial support 600, followed by optional final surface mounting of component 222, as shown. Figure 6D As shown. Alternatively, the order of the final surface mounting and individualization division of component 222 can be reversed. In some embodiments, the individualization division operation can form individualization division edges 299 that span the sides of the first circuit board 210, the sides of the second circuit board 240, and the sides of the molding compound 295.

[0044] Figures 8A-8C This is a cross-sectional side view illustrating the sequence of assembling a system-in-package (SIP) with dual-sided surface mount circuit boards according to one embodiment. Although the described and illustrated embodiments have so far focused on the stacking of single-sided mount circuit boards 210, 240, the embodiments are not limited thereto. Therefore, SMT processes for either or both of the circuit boards 210, 240 can be performed prior to stacking or molding. As shown, the first circuit board 210 may include components 220, 222 mounted on opposite sides, and the second circuit board 240 may include components 250, 252 mounted on opposite sides. Subsequently, the dual-sided mount circuit boards can be stacked and molded, as... Figure 8C As shown.

[0045] Figures 9A-9DThis is a cross-sectional side view showing the sequence of assembling a system-in-package with a pre-molded circuit board according to one embodiment. Figures 9A-9D In the process variant shown, one of the circuit boards (second circuit board 240) already includes the molded component 252 on the second side 244 and is encapsulated within the molding material 254. Figure 9A The SMT mounting for two circuit boards illustrated in the example can be performed at the panel level, and... Figure 9B The stacked components were previously individually divided into unit circuit boards 210 and 240. Furthermore, as previously mentioned, the components can be interchanged. Figure 9D Final SMT installation of component 222 and Figure 9C The order of individual segmentation in the process.

[0046] Figures 10A-10C This is a cross-sectional side view showing the sequence of assembling a system-in-package with a pre-molded circuit board according to one embodiment. Figures 10A-10C The process flow includes variations in which SMT component mounting and molding operations are performed on the two circuit boards 210 and 240 before stacking. For example... Figures 10A-10B As shown, molding operations (such as membrane-assisted molding) are performed while keeping the surfaces of the inserts 230 and 260 exposed for electrical connection. Figure 10C As shown, a final stacking operation is performed to form a circuit board stack 280. During the final stacking operation, an adhesive layer, such as epoxy resin or thermal adhesive, can be applied between circuit boards 210 and 240 to enhance mechanical rigidity and secure molding materials 296 and 297 together. Intercalators 230 and 260 can be joined using appropriate methods as described above, such as conductive paste, film, and solder bumps 350.

[0047] When utilizing the various aspects of the embodiments, it will be apparent to those skilled in the art that combinations or variations of the above embodiments may also be used to form a system-in-package including stacked circuit boards. Although the embodiments have been described in language specific to structural features and / or methodological behavior, it should be understood that the appended claims are not necessarily limited to the specific features or behaviors described. Rather, the specific features and behaviors disclosed should be understood as embodiments used for illustrative purposes.

Claims

1. A system-level encapsulation, comprising: Circuit board; Multiple components are mounted on the circuit board; One or more interposers are mounted on the circuit board and are laterally adjacent to the plurality of components; The first intercalator of the one or more intercalators includes one or more transverse tunnels extending from the transverse outer side to the transverse inner side of the first intercalator; and A molding material that laterally surrounds the plurality of components and the one or more intercalators, and at least partially fills the one or more lateral tunnels for the first intercalator.

2. The system-in-package of claim 1, wherein each of the one or more interposers includes an insulating material and a plurality of metal traces extending from the bottom side to the top side of the corresponding interposer.

3. The system-in-package according to claim 2, wherein the plurality of traces are a plurality of vias.

4. The system-in-package of claim 1, wherein the one or more interpolators are arranged laterally around the plurality of components.

5. The system-in-package of claim 4, wherein the one or more interposers are arranged adjacent to the periphery of the circuit board.

6. The system-in-package of claim 4, further comprising additional components mounted on the circuit board outside the one or more interposers.

7. The system-in-package of claim 6, wherein the molding material does not laterally surround the additional component.

8. The system-in-package of claim 1, wherein one or more interposers are soldered to the circuit board.

9. The system-in-package of claim 1, wherein the one or more lateral tunnels extend through the top or bottom side of the first intercalator.

10. The system-in-package of claim 1, wherein the one or more lateral tunnels extend through the bottom side of the first intercalator.

11. The system-in-package of claim 1, wherein the one or more lateral tunnels include a first lateral tunnel extending through the top side of the first interposer and a second lateral tunnel extending through the bottom side of the first interposer.

12. The system-in-package of claim 11, wherein the first lateral tunnel is located directly above the second lateral tunnel.

13. The system-in-package of claim 1, wherein the one or more lateral tunnels extend through the central portion of the first intercalator.

14. The system-in-package of claim 1, wherein the one or more lateral tunnels include one or more first lateral tunnels extending through the top or bottom side of the first interposer, and one or more intermediate lateral tunnels extending through the central portion of the first interposer, wherein the one or more first lateral tunnels are not connected to the one or more intermediate lateral tunnels.

15. The system-in-package of claim 1, wherein the one or more interpolators laterally surround the subsystem of the plurality of components.

16. The system-in-package of claim 1, wherein the one or more interpolators comprise passive devices.

17. The system-in-package of claim 1, wherein the circuit board includes a rigid substrate and conductive traces electrically connecting the plurality of components.

18. The system-level packaging according to claim 1, wherein: Each of the one or more inserters includes insulating material and multiple metal traces extending from the bottom side to the top side of the corresponding inserter. and The one or more transverse tunnels include a first set of transverse tunnels extending through the top side of the first inserter and a second set of transverse tunnels extending through the bottom side of the first inserter.

19. The system-in-package of claim 18, wherein the one or more interpolators are arranged laterally around the plurality of components.

20. The system-level packaging according to claim 1, wherein: Each of the one or more inserters includes insulating material and multiple metal traces extending from the bottom side to the top side of the corresponding inserter. and The one or more transverse tunnels include a first transverse tunnel extending through the top side of the first inserter and a second transverse tunnel extending through the bottom side of the first inserter, wherein the first transverse tunnel is located directly above the second transverse tunnel.

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