Materials used for position error compensation in the assembly of discrete components

Abstract

An assembly includes a substrate; a coating comprising a Bingham fluid layer disposed on a surface of the substrate; and discrete components partially embedded in or disposed on the coating comprising Bingham fluid. A method includes irradiating a dynamically released structure disposed on a carrier, wherein discrete components adhere to the dynamically released structure, the irradiation causing the discrete components to be released from the carrier; and receiving the released discrete components in or on a coating disposed on a surface of the substrate, the coating comprising Bingham fluid.

Description

[0001] Priority requirements

[0002] This application claims priority to U.S. Patent Application Serial No. 62 / 859,830, filed June 11, 2019, the entire contents of which are incorporated herein by reference. Background Technology

[0003] The present invention generally relates to assembling discrete components on a substrate. Summary of the Invention

[0004] In one aspect, an assembly includes a substrate; a coating containing Bingham fluid disposed on a surface of the substrate; and discrete components partially embedded in or disposed on the coating containing Bingham fluid.

[0005] The implementation scheme may include any one or more of the following features.

[0006] Bingham fluids include one or more of fluxes, solder pastes, conductive inks, semiconductive inks, gels, and chemically inert materials.

[0007] Discrete components include light-emitting diodes (LEDs).

[0008] The substrate includes a semiconductor wafer. The substrate includes adhesive tape. The substrate includes a rigid substrate. The substrate includes a printed circuit board.

[0009] In one aspect, an assembly includes a substrate; and a coating containing Bingham fluid disposed on the substrate, a first surface of the coating being in contact with the substrate, wherein the coating is configured such that when discrete components are incident on a second surface of the coating opposite to the first surface, the discrete components are disposed on or partially embedded in the coating.

[0010] The implementation scheme may include any one or more of the following features.

[0011] Bingham fluids include one or more of fluxes, solder pastes, conductive inks, semiconductive inks, gels, and chemically inert materials. Bingham fluids include conductive pastes.

[0012] The substrate includes a printed circuit board.

[0013] In one aspect, a method includes irradiating a dynamically released structure disposed on a carrier, wherein discrete components adhere to the dynamically released structure, the irradiation causing the discrete components to be released from the carrier; and receiving the released discrete components in or on a coating disposed on a surface of a substrate, the coating comprising Bingham fluid.

[0014] The implementation scheme may include any one or more of the following features.

[0015] Irradiating the dynamic release layer involves irradiating the dynamic release layer with laser energy.

[0016] Irradiation includes ablation of at least a portion of the dynamically released layer.

[0017] This method involves reducing the adhesion of the dynamically released layer prior to irradiation.

[0018] Irradiation of the dynamic release layer includes irradiation of the dynamic release layer through a carrier.

[0019] Discrete components include LEDs.

[0020] The second substrate includes adhesive tape. The second substrate includes a printed circuit board.

[0021] In one aspect, a method includes forming a coating on the surface of a target substrate, the coating comprising Bingham fluid; and receiving discrete components in or on the coating, the discrete components having been transferred from a carrier by a laser-assisted transfer process.

[0022] In an implementation scheme, forming a coating containing Bingham fluid involves distributing one or more of a flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert material onto the surface of a target substrate.

[0023] In one aspect, a method includes determining an alignment error between discrete components of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including discrete components adhered to a support via a dynamic release layer; determining a beam offset characteristic based on the alignment error; and providing a signal indicating the beam offset characteristic to optics of the laser-assisted transfer system, the optics being configured to adjust the position of a beam pattern relative to the discrete components according to the beam offset characteristic.

[0024] The implementation scheme may include any one or more of the following features.

[0025] The method includes adjusting the position of the beam pattern relative to discrete components using optical elements based on beam offset characteristics. The method also includes adjusting the position of the beam pattern using a galvanometer laser scanner.

[0026] Determining alignment error includes determining one or more of the magnitude and direction of the alignment error.

[0027] Determining beam offset characteristics involves determining the offset between the center of the discrete component and the offset position on the discrete component. Determining the offset includes determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position on the discrete component.

[0028] The method includes determining beam offset characteristics to at least partially compensate for alignment errors. The method also includes determining beam offset characteristics such that when a beam pattern is incident on a discrete component assembly according to the beam offset characteristics, the discrete components are transferred to a target position on the substrate.

[0029] This method involves using a machine vision system to determine alignment errors.

[0030] The method involves irradiating a dynamic release layer with a light beam, the position of the beam pattern relative to the discrete components having been adjusted according to beam offset characteristics, and the irradiation causing the discrete components to release from the carrier substrate.

[0031] The method includes receiving discrete components at a target location on a target substrate.

[0032] In one aspect, a system includes a computing system comprising one or more processors coupled to a memory and configured to determine an alignment error between discrete components of a discrete component assembly and a target position on a target substrate, the discrete component assembly including discrete components adhered to a support via a dynamic release layer, the discrete component assembly being mounted in a laser-assisted transfer system; determining beam offset characteristics based on the alignment error; and providing a signal indicating the beam offset characteristics to optics of the laser-assisted transfer system, the optics being configured to adjust the position of a beam pattern relative to the discrete components according to the beam offset characteristics.

[0033] The implementation scheme may include any one or more of the following features.

[0034] The system includes optical components. The optical components include a galvanometer laser scanner.

[0035] Determining beam offset characteristics involves determining the offset between the center of the discrete component and the offset position on the discrete component. Determining the offset includes determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position on the discrete component.

[0036] One or more processors and a memory are configured to determine beam offset characteristics to at least partially compensate for alignment errors. The one or more processors and a memory are configured to determine beam offset characteristics such that when a beam pattern is incident on a discrete component assembly according to the beam offset characteristics, the discrete component is transferred to a target position on the substrate.

[0037] A machine vision system is implemented using one or more processors and memory. Attached Figure Description

[0038] Figure 1A and 1B This is a diagram of the laser-assisted transfer process.

[0039] Figures 2A to 2C This is a diagram of the laser-assisted transfer process.

[0040] Figure 3 A diagram of a system used for laser-assisted transfer.

[0041] Figure 4 This is a diagram of the discrete components and the target substrate.

[0042] Figures 5A to 5C This is a diagram of the laser-assisted transfer process. Detailed Implementation

[0043] We describe here a method for addressing positional errors in the transfer of discrete components from a support to a target substrate during laser-assisted processing. In some instances, the target substrate may include a coating containing Bingham fluid, in which or on which the discrete components are received. The Bingham fluid prevents spontaneous displacement of the transferred discrete components, thereby facilitating high-precision transfer of the discrete components.

[0044] Figure 1A A laser-assisted transfer process is described for the high-volume, low-cost, contactless assembly of discrete components 102 onto a substrate 130. The term discrete component generally refers to, for example, any unit that becomes part of a product or electronic device such as an electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system, such as any semiconductor material having circuitry formed on a portion of a semiconductor material. In some instances, the discrete component can be a light-emitting diode (LED). Discrete components can be ultra-thin, meaning a maximum thickness of less than 100 μm, less than 50 μm, less than 40 μm, less than 30 μm, less than 25 μm, less than 20 μm, less than 10 μm, or less than 5 μm. Discrete components can be ultra-small, meaning a maximum length or width dimension less than or equal to 300 μm per side, 100 μm per side, 50 μm per side, 20 μm per side, or 10 μm per side. Discrete components can be both ultra-thin and ultra-small.

[0045] During laser-assisted transfer, the discrete component assembly 108 is located in the component transfer system 100. The discrete component assembly 108 includes a support 110, with a dynamic release structure 112 disposed on the front side of the support 110. The discrete component 102 is adhered to the support 110 via the dynamic release structure 112. The support 110 can be a rigid support, such as glass or a rigid polymer substrate; or a flexible support, such as adhesive tape. The dynamic release structure 112 can be a single-layer or multi-layer structure, such as a structure with two, three, four, or more layers.

[0046] During laser-assisted transfer, the back side of the support 110 is irradiated with radiation, such as laser light (e.g., beam pattern 116). Beam pattern 116 can be, for example, a single beam (as shown) or a pattern of multiple beams from a single or multiple light sources. The support 110 is transparent to the wavelength of the radiation (e.g., laser energy). An element transparent to a given wavelength is one through which at least some of the radiation of that wavelength passes. The radiation passes through the support 110 and is incident on a region of the dynamic release structure 112, causing ablation of at least a portion of the thickness of the dynamic release layer in the region on which the laser beam pattern 116 is incident (which we refer to as the irradiation region). Ablation generates a trapped gas, which expands and generates stress in the dynamic release structure 112. The stress causes deformation in at least some of the material of the dynamic release structure 112, forming one or more blister bubbles 118. For example, a single blister bubble 118 is formed when the beam pattern 116 is a single beam or a pattern of multiple closely spaced beams. When the beam pattern 116 comprises a plurality of sufficiently spaced beams, a pattern of a plurality of bubbles 118 is formed. Here, the term bubble 118 generally refers to a single bubble or a pattern of a plurality of bubbles.

[0047] Bubble 118 applies mechanical force to discrete component 102. When the mechanical force applied by bubble 118 is sufficient to overcome the adhesive force between discrete component 102 and dynamic release structure 112, the mechanical force applied by bubble 118 (in combination with gravity) pushes the discrete component away from support 110 (e.g., in a downward direction) to transfer it to target substrate 130.

[0048] A further description of the laser-assisted transfer process can be found in U.S. Patent Publication No. US2014 / 0238592, the entire contents of which are incorporated herein by reference.

[0049] The transfer vector 150 represents the direction of travel of the discrete component 102 as it is released from the support 110, and points to the final placement of the discrete component 102 on the target substrate 130. The direction of the transfer vector 150 is a function of the position of the laser beam pattern 116 relative to the discrete component 102. When as Figure 1A and 1B When the incident laser beam pattern 116 is centered relative to the discrete component 102, the resulting bubble 118 (e.g., a pattern of a single bubble or multiple bubbles) is also centered relative to the discrete component 102, and the transfer vector 150 is perpendicular to the surface of the dynamic release structure 112 (referred to as the vertical transfer vector). As a result, the discrete component 102 falls on the target substrate 130 at a position directly below the location of the discrete component 102 in the discrete component assembly 108.

[0050] One objective of the laser-assisted transfer process can be to transfer discrete component 102 to a specific target location 140 on a target substrate 130. Target location 140 can be a position on the target substrate 130 intended to center the discrete component 102. For example, when the target substrate 130 is a device substrate such as a printed circuit board, target location 140 can be a position on the target substrate 130 where interconnect elements such as bonding pads align with interconnect elements on the discrete component 102.

[0051] To align the target position 140 on the target substrate 130 with the position of the discrete component 102 in the discrete component assembly 108, the target substrate 130 may be moved relative to the discrete component assembly 108, or the discrete component assembly 108 may be moved relative to the target substrate 130, or both. Relative movement can be implemented using mechanical adjustment mechanisms such as linear translation stages, actuators, or other suitable mechanical adjustment devices. For example, the coordinates of the center of the discrete component 102 in the discrete component assembly 108 in the global xy coordinate system can be adjusted to match the global xy coordinates of the target position.

[0052] Mechanical adjustments for the relative positioning of discrete component assembly 108 and target substrate 130 can sometimes result in errors, for example, due to inaccuracies in the mechanical adjustment mechanism, such as deviations along the x-axis, y-axis, or both. Such errors can lead to alignment errors between the xy coordinates of discrete component 102 and the xy coordinates of target position 140. Other sources of error can also contribute to alignment errors between the xy coordinates of discrete component 102 and target position 140, for example, in addition to or in lieu of errors caused by mechanical adjustments. For example, the difference between the intended position of discrete component 102 in discrete component assembly 108 and the actual position of discrete component 102 in discrete component assembly 108 can occur during prior processing, such as during singulation of discrete component 102 or during placement of discrete component 102 on support 110. If the xy-coordinate alignment between the target location 140 and the location of the discrete component 102 in the discrete component assembly 108 is based on the expected position of the discrete component 108, then this difference due to previous processing can result in alignment errors between the xy-coordinates of the discrete component 102 and the xy-coordinates of the target location 140. In some instances, such alignment errors can be at least partially resolved by fine mechanical adjustment of the relative positions of the target substrate 130 and the discrete component assembly 108 before the laser-assisted transfer process begins.

[0053] refer to Figures 2A to 2CIn some instances, the beam pattern 116 may be offset from the center of the discrete component 102 during the laser-assisted transfer process, meaning that the beam pattern 116 is incident at a position offset from the center of the discrete component. This offset of the beam pattern 116 can be used to at least partially compensate for alignment errors between the xy coordinates of the discrete component 102 and the xy coordinates of the target position 140.

[0054] When the beam pattern 116 is offset from the discrete component 102 (e.g., off-center), the resulting bubble 118 (e.g., a pattern of a single bubble or multiple bubbles) is also off-center relative to the discrete component 102. This offset causes the transfer vector 150 to deviate from the surface normal by an angle α (referred to as an angled transfer vector). The angle α of the transfer vector 150 is related to the magnitude d and direction of the offset of the beam pattern 116 from the center of the discrete component 102 (sometimes referred to as beam offset). For the normal transfer vector (e.g., as shown in the figure), the angle α is different. Figure 1A As shown in the diagram, discrete component 102 is transferred to a target position 140 directly below the position of discrete component 102 in the discrete component assembly. An angled transfer vector causes discrete component 102 to transfer to an offset position 134 on a target substrate 130 that is displaced relative to the target position 140.

[0055] Figure 2B and Figure 2C A top view of a discrete component assembly 108 with attached discrete components 102 is shown, wherein the beam pattern 116 is offset from the center of the discrete component 102. Dashed box 132 depicts the position of the discrete component 102 on the target substrate 130 after the transfer, with the dashed box centered at the offset position 134. The distance between the target position 140 and the offset position 134 is the placement error ε caused by the offset of the beam pattern 116. The placement error ε can be along the x-axis, such as... Figure 2B As shown; along the y-axis (not shown); can have components along the x-axis and y-axis respectively, such as Figure 2C As shown in the image.

[0056] The magnitude of the placement error ε is related to the magnitude of the beam offset d and the height g of the gap 135 between the bottom surface of the discrete component 102 and the top surface of the target substrate 130 in the discrete component assembly 108. For example, given the gap height g, the magnitude of the beam offset d can have a direct linear relationship with the placement error ε. The spatial direction pointed to by the transfer vector 150 is opposite to the direction of the beam offset. For example, in... Figure 2A In the diagram, beam pattern 116 is shifted to the left side, while transfer vector 150 points to the right side.

[0057] As discussed above, alignment errors can occur between the xy coordinates of discrete component 102 and the xy coordinates of target position 140. To compensate for such errors, the beam pattern 116 can be intentionally offset so that the placement error ε matches the alignment error between the xy coordinates of discrete component 102 and target position 140. Compensating for alignment errors by introducing an offset in the beam pattern 116 helps achieve precise alignment for laser-assisted transfer processes and enables rapid alignment, thereby facilitating high-volume transfer processes.

[0058] In the example, refer to Figure 3 An alignment error α (not shown) may exist between the xy coordinates of the discrete component 102 in the laser-assisted transfer system 300 and the xy coordinates of the target position 140. The alignment error may be caused by, for example, inaccuracies in the mechanical alignment mechanism, positioning errors of the discrete component 102 on the support 110, or other reasons. To compensate for the alignment error, the beam pattern 116 may be offset to induce an angular transfer vector 150 resulting in a placement error ε equal to the alignment error α. Then, regardless of the alignment error α between the xy coordinates of the discrete component 102 in the discrete component assembly 108 and the xy coordinates of the target position 140, the discrete component 102 is directly transferred to its target position 140.

[0059] The laser-assisted transfer system 300 includes a light source 302, such as a laser. A beam 306 from the light source 302 can be incident on one or more optical elements 304, such as a lens, a diffractive optical element (e.g., a beam splitter), which can shape the beam 306 from the light source 302 into a beam pattern 116. The beam pattern 116 can be a single beam (as shown) or can include multiple narrow beams having a smaller size (e.g., diameter) than the beam 306.

[0060] A photodetector 310, such as a camera, is positioned to capture an image of the relative positions of discrete component 102 and target location 140 on target substrate 130. The image 312 from the photodetector 310 is provided to a computing system 314, which includes one or more processors coupled to a memory and is configured to process the image 312 to determine an alignment error 'a'. For example, the computing system 312 may implement machine vision methods to identify discrete component 102 and target location 140 and determine the magnitude and orientation of the separation between the center of discrete component 102 and target location 140.

[0061] Based on the alignment error 'a', the calculation system 312 determines the beam offset characteristics of the beam pattern 116 such that when the beam pattern 116 is offset by the beam offset characteristics, the discrete component 102 will move to the target position 140. The beam offset characteristics represent the magnitude 'd' and direction of the beam offset. In some instances, the beam offset characteristics may represent other parameters, such as the number or arrangement of fine beams in the beam pattern 116.

[0062] The computing system 314 provides a signal 316 indicating beam offset characteristics to the laser-assisted transfer system 300, for example, to control one or more optical elements 318 to adjust the position of the beam pattern 116 according to the beam offset characteristics. In an example, the one or more optical elements 318 may be a scanner capable of adjusting the position of the beam pattern 116, such as a galvanometer laser scanner.

[0063] By implementing beam offset characteristics through a scanner, alignment errors can be quickly compensated for, resulting in shorter transfer times per discrete component and thus increasing the production output of the laser-assisted transfer process.

[0064] Reference Figure 4 In some instances, the target substrate 430 receiving discrete components 102 during laser-assisted transfer may include a coating comprising a die-catching material (DCM) 402 disposed on its surface. The die-catching material (DCM) 402 may be a material that receives discrete components transferred from a carrier substrate as is and holds them in their target positions while reducing post-transfer movement of the discrete components on the target substrate. The process of receiving discrete components and holding them in their target positions is sometimes referred to as die-catching. The DCM may be a viscous fluid that slows down the velocity of the discrete components 102 as they are incident on the coating 402.

[0065] In some cases, once discrete component 102 has been captured by the DCM of coating 402, discrete component 102 can "float" within the coating. Floating of discrete component 102 is the slow movement of discrete component 102 away from its original placement position by any distance. Floating can be caused by surface tension, thermal drift, fluid leveling after component impact, Brownian motion, or other factors, or a combination of these factors. Floating of the received discrete component can be undesirable, for example, in that it can contribute to overall placement errors during the transfer process. For example, component floating can cause placement errors exceeding established standards, thereby rendering the placed discrete component unusable for its intended application. In some instances, such as in applications involving closely spaced discrete components, component floating can cause incoming discrete components to come into contact with pre-placed discrete components, thereby further increasing placement errors in the previously placed discrete components or introducing other undesirable characteristics in a group of discrete components.

[0066] In some instances, for specific applications, such as discrete components of a specific size or mass, the rheological properties of the DCM of coating 402 can be adjusted to improve the accuracy and reliability of the laser-assisted transfer process.

[0067] refer to Figure 5A and Figure 5B In some instances, the target substrate 530 includes a coating 502 containing Bingham fluid disposed on the surface of substrate 504. Bingham fluid is a viscoplastic material that behaves as a rigid body under low stress but flows as a viscous fluid at or above its yield stress. Bingham fluid is sometimes also referred to as Bingham liquid, Bingham plastic, structured liquid, or viscoplastic solid. Bingham fluid may include gels (e.g., alcogels, hydrogels, organic gels, or other types of gels), synthetic polymers, viscous pastes, fluxes, solder pastes, suspensions, conductive or semiconductive inks (e.g., organic inks), chemically inert materials, or any combination of two or more thereof.

[0068] When the discrete component 102 is transferred to the target substrate 530 during laser-assisted transfer, the discrete component 102 is captured by a coating 502 containing Bingham fluid and partially embedded in the coating (e.g., Figure 5B (As shown in the diagram) or arranged on top of the coating. By partial embedding, we mean that the bottom surface 136 of the discrete component 102 is lower than the top surface 506 of the coating 502, while the top surface 508 of the discrete component 102 is higher than the top surface 506 of the coating 502. Once the discrete component 102 is partially embedded in the coating 502, the rheological properties of the Bingham fluid prevent the discrete component 102 from spontaneously shifting or floating from its position. The precision and accuracy of component placement can thus be improved by using a coating containing Bingham fluid as a grain-catching material.

[0069] Substrate 504 can be an adhesive tape, such as wafer tape. Substrate 504 can be a rigid substrate, such as a glass substrate or a semiconductor substrate. Substrate 504 can be a device substrate, such as a printed circuit board (PCB). In some instances, substrate 504 can be a semiconductor substrate, such as a semiconductor wafer or a portion thereof intended for use in a multi-chip stack.

[0070] When substrate 504 is a device substrate, the coating 502 containing Bingham fluid can facilitate the interconnection of discrete components 102 to electrical contacts on substrate 504, such as bonding pads. For example, the coating 502 containing Bingham fluid can be a conductive paste, such as conductive solder paste. (See reference...) Figure 5C In some instances, a processing step may be performed after the laser-assisted transfer of discrete component 102 to bring the bottom surface 136 of discrete component 102 into contact with electrical contact points on substrate 504. In one instance, the coating 502 containing Bingham fluid may be a welding flux removed during the welding process. In another instance, the assembly of substrate 504 having discrete components 102 partially embedded in the coating 502 is subjected to, for example, pressure from a thermoelectric electrode, which extrudes Bingham fluid between discrete component 102 and substrate 504, thereby enabling electrical contact between discrete component 102 and substrate 504.

[0071] Several implementation schemes have been described. However, it should be understood that various modifications can be made without departing from the spirit and scope of this disclosure. For example, some of the steps above may be independent of the order and therefore may be performed in a different order than that described.

[0072] Other embodiments are also within the scope of the appended claims.

Claims

1. An assembly comprising: substrate; A coating containing Bingham fluid disposed on the surface of the substrate; and Discrete components, which are partially embedded in the coating containing the Bingham fluid. The coating is a grain-catching material configured to receive discrete components transferred from a carrier substrate and hold the discrete components in their target positions. The entire bottom surface of the discrete component is lower than the top surface of the coating; The Bingham fluid mentioned therein includes one or more of flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert materials.

2. The assembly according to claim 1, wherein the discrete component includes a light-emitting diode (LED).

3. The assembly of claim 1, wherein the substrate comprises a semiconductor wafer.

4. The assembly of claim 1, wherein the substrate comprises adhesive tape.

5. The assembly according to claim 1, wherein the substrate comprises a rigid substrate.

6. The assembly of claim 1, wherein the substrate comprises a printed circuit board.

7. An assembly comprising: substrate; and A coating containing Bingham fluid is disposed on the substrate, the first surface of the coating being in contact with the substrate. The coating is configured such that when a discrete component is incident on a second surface of the coating opposite to the first surface, the discrete component is partially embedded in the coating. The coating is a grain-catching material configured to receive discrete components transferred from a carrier substrate and hold the discrete components in their target positions. The entire bottom surface of the discrete component is lower than the top surface of the coating; The Bingham fluid mentioned therein includes one or more of flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert materials.

8. The assembly of claim 7, wherein the Bingham fluid comprises a conductive paste.

9. The assembly of claim 7, wherein the substrate comprises a printed circuit board.

10. A method for transferring discrete components, comprising: Irradiation of a dynamically released structure arranged on a carrier, wherein discrete components are adhered to the dynamically released structure, and the irradiation causes the discrete components to be released from the carrier; and The released discrete components are received in a coating disposed on the surface of a substrate, the coating comprising Bingham fluid. The coating is a grain-catching material configured to receive discrete components transferred from a carrier substrate and hold the discrete components in their target positions. The discrete component is partially embedded in the coating and the entire bottom surface of the discrete component is lower than the top surface of the coating; The Bingham fluid mentioned therein includes one or more of flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert materials.

11. The method for transferring discrete components according to claim 10, wherein irradiating the dynamic release structure comprises irradiating the dynamic release structure with laser energy.

12. The method for transferring discrete components according to claim 10 or 11, wherein the irradiation includes ablation of at least a portion of the dynamically released structure.

13. The method for transferring discrete components according to claim 10, comprising reducing the adhesive force of the dynamic release structure prior to the irradiation.

14. The method for transferring discrete components according to claim 10, wherein irradiating the dynamic release structure comprises irradiating the dynamic release structure through the carrier.

15. The method for transferring discrete components according to claim 10, wherein the discrete components include LEDs.

16. The method for transferring discrete components according to claim 10, wherein the substrate comprises adhesive tape.

17. The method for transferring discrete components according to claim 10, wherein the substrate comprises a printed circuit board.

18. A method for transferring discrete components, comprising: A coating is formed on the surface of a target substrate, the coating comprising Bingham fluid; and Discrete components are received in the coating, having been transferred from the carrier via a laser-assisted transfer process. The coating is a grain-catching material configured to receive discrete components transferred from a carrier substrate and hold the discrete components in their target positions. The discrete component is partially embedded in the coating and the entire bottom surface of the discrete component is lower than the top surface of the coating; The formation of a coating containing Bingham fluid includes disposing of one or more of a flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert material on the surface of the target substrate.

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