Thermal infrared detector

Abstract

A thermal infrared detector is provided, comprising: a thermal infrared sensor array comprising a plurality of resistive infrared devices arranged in a plurality of rows and a plurality of columns; and a drive circuit configured to drive the thermal infrared sensor array, wherein at least two of the plurality of resistive infrared devices that are adjacent to each other in a row direction or a column direction are grouped together, wherein at least one of the plurality of resistive infrared devices is shared by at least two groups, and wherein at least two of the plurality of resistive infrared devices comprised in each of the at least two groups are connected in series.

Description

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2020-0183610, filed on December 24, 2020, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The exemplary embodiments of this disclosure relate to thermal infrared detectors. Background Technology

[0004] Thermal infrared (TIIR) devices convert the heat generated within the device by absorbing far-infrared (LWIR) energy emitted from the object being measured into an electrical signal. Thermal imaging cameras or thermal video recorders can convert the signals from multiple TIR devices arranged in a two-dimensional array into thermal images, making temperature differences in the measured object or the entire scene visible to the naked eye. Typical TIR detection devices operating at room temperature include radiative thermal devices, thermopile devices, and thermoelectric devices. These devices are used in a variety of small or portable applications because they do not require cryogenic cooling systems. Summary of the Invention

[0005] One or more example embodiments provide a thermal infrared detector, a thermal infrared sensor array, and a driving method thereof.

[0006] Additional aspects will be set forth in part in the description which follows, and will become clear in part from the description, or may be learned by practice of the exemplary embodiments.

[0007] According to one aspect of an example embodiment, a thermal infrared detector is provided, comprising: a thermal infrared sensor array including a plurality of resistive infrared devices disposed in a plurality of rows and a plurality of columns; and a driving circuit configured to drive the thermal infrared sensor array, wherein at least two resistive infrared devices of the plurality of resistive infrared devices that are adjacent to each other in a row direction or a column direction are grouped together, wherein at least one resistive infrared device of the plurality of resistive infrared devices is shared by at least two groups, and wherein at least two resistive infrared devices of the plurality of resistive infrared devices included in each of the at least two groups are connected in series.

[0008] The thermal infrared detector may also include a connection switch connected between at least two resistive infrared devices included in each of at least two groups.

[0009] The number of rows can be M, the number of columns can be N, and each of M and N can be a natural number greater than or equal to 3.

[0010] The thermal infrared detector may also include multiple pixels, each of which includes a corresponding resistive infrared device among multiple resistive infrared devices. Each of the multiple pixels may include: a first switch, the first end of which is connected to a row direction line, and the second end of which is connected to the first end of the corresponding resistive infrared device among the multiple resistive infrared devices; and a second switch, the first end of which is connected to a column direction line, and the second end of which is connected to the second end of the corresponding resistive infrared device among the multiple resistive infrared devices.

[0011] The thermal infrared detector may also include multiple pixels, each of which includes a corresponding resistive infrared device among multiple resistive infrared devices. Each of the multiple pixels may include: a first switch, which switches from a row direction line based on a row selection signal, and a first terminal of the first switch is connected to a first terminal of the corresponding resistive infrared device among the multiple resistive infrared devices, and a second terminal of the first switch is connected to a column direction line; and a second switch, the first terminal of the second switch being connected to a second terminal of the corresponding resistive infrared device among the multiple resistive infrared devices, and the second terminal of the second switch being grounded.

[0012] The driving circuit can also be configured to: sequentially drive pixel groups including adjacent pixels in multiple pixels arranged in multiple rows and multiple columns; and connect switches to measure the series resistance of at least two resistive infrared devices in each pixel group.

[0013] The drive circuit can also be configured to: output a connection signal for turning on the connection switch; and output a first row selection signal for selecting the first row among multiple rows.

[0014] The driving circuit can also be configured to: output a first connection signal, the first connection signal being used to turn on a connection switch that connects a first resistive infrared device in a first row of a plurality of rows to a fourth resistive infrared device in a second row that is grouped with the first resistive infrared device; output a first row first selection signal for selecting the first resistive infrared device in the first row, such that a first switch connected to a first terminal of the first resistive infrared device in the first row is turned on based on the first row first selection signal; and output a first column selection signal for selecting the first column of a plurality of columns, such that a second switch connected to a second terminal of the fourth resistive infrared device in the second row is turned on based on the first column selection signal.

[0015] The driving circuit can also be configured to: output a second connection signal for activating a connection switch that connects a second resistive infrared device in the first row to a fifth resistive infrared device in the second row grouped with the second resistive infrared device; output a first row second selection signal for selecting a second resistive infrared device in the first row, such that a first switch connected to a first terminal of a second resistive infrared device in the first row is activated based on the first row second selection signal; and output a second column selection signal for selecting a second column among a plurality of columns, such that a second switch connected to a second terminal of a fifth resistive infrared device in the second row is activated based on the second column selection signal.

[0016] The driving circuit can also be configured to: output a first connection signal, the first connection signal being used to turn on a connection switch that connects a first resistive infrared device in a first row of a plurality of rows to a second resistive infrared device in a group with the first resistive infrared device in the first row; output a first row first selection signal for selecting the first resistive infrared device in the first row of a plurality of rows, such that a first switch connected to a first terminal of the first resistive infrared device in the first row is turned on based on the first row first selection signal; and output a second column selection signal for selecting a second column of a plurality of columns, such that a second switch connected to a second terminal of the second resistive infrared device in the second row is turned on based on the second column selection signal.

[0017] The driving circuit can also be configured to: output a second connection signal for activating a connection switch that connects a second resistive infrared device in the first row to a third resistive infrared device in the first row grouped with the second resistive infrared device; output a first row second selection signal for selecting the second resistive infrared device in the first row from among multiple rows, such that a first switch connected to a first terminal of the second resistive infrared device in the first row is activated based on the first row second selection signal; and output a third column selection signal for selecting the third column from among multiple columns, such that a second switch connected to a second terminal of the third resistive infrared device in the first row is activated based on the third column selection signal.

[0018] Each of the multiple resistive infrared devices may include a calorimeter.

[0019] According to another aspect of the example embodiment, a thermal infrared sensor array is provided, comprising: a plurality of resistive infrared devices connected to M row electrodes and N column electrodes; a plurality of first switches, each of the plurality of first switches being connected between a first terminal of each of the plurality of resistive infrared devices and a corresponding row electrode line; a plurality of second switches, each of the plurality of second switches being connected between a second terminal of each of the plurality of resistive infrared devices and a corresponding column electrode line; and a plurality of connection switches being respectively connected in series between adjacent resistive infrared devices among the plurality of resistive infrared devices to group at least two adjacent resistive infrared devices in the row direction or column direction.

[0020] Each of M and N can be a natural number greater than or equal to 3. The size of the group can be m in the row direction and n in the column direction, where m is a natural number less than M and n is a natural number less than N, and neither m nor n is 1.

[0021] At least two groups may share at least one resistive infrared device.

[0022] Each of the multiple connection switches can be located at a first pixel, which includes one of the multiple resistive infrared devices, one of the multiple first switches, and one of the multiple second switches, or at a second pixel in a group with the first pixel, wherein the second pixel is adjacent to the first pixel in the row or column direction.

[0023] Each of the multiple resistive infrared devices may include a calorimeter.

[0024] The method may include: activating a connection switch among a plurality of connection switches based on a connection signal, the connection switch being positioned between one of a plurality of resistive infrared devices in row m and one of a plurality of resistive infrared devices in row m+1, the plurality of resistive infrared devices in row m and the plurality of resistive infrared devices in row m+1 being grouped together; activating a first switch among a plurality of first switches based on a row m selection signal, the first switch being connected to a first terminal of the resistive infrared device in row m and column n; activating a second switch among a plurality of second switches based on a column n selection signal, the second switch being connected to a second terminal of the resistive infrared device in row m+1 and column n; and obtaining the series resistance of the resistive infrared devices in row m and column n and the resistive infrared devices in row m+1 and column n, where m is a natural number less than M and n is a natural number less than N.

[0025] The method may include: activating a connection switch among a plurality of connection switches based on a connection signal, the connection switch being positioned between one of a plurality of resistive infrared devices in row m and column n and one of a plurality of resistive infrared devices in row m and column n+1, wherein the plurality of resistive infrared devices in row m and column n and one of a plurality of resistive infrared devices in row m and column n+1 are grouped together; activating a first switch among a plurality of first switches based on a row m selection signal, the first switch being connected to a first terminal of the resistive infrared device in row m and column n; activating a second switch among a plurality of second switches based on a column n+1 selection signal, the second switch being connected to a second terminal of the resistive infrared device in row m and column n+1; and obtaining the series resistance of the resistive infrared devices in row m and column n and the resistive infrared devices in row m and column n+1, where m is a natural number less than M and n is a natural number less than N.

[0026] A method for driving a thermal infrared sensor is provided, the method comprising: activating a first switch based on receiving a row m selection signal, the first switch being connected to a first terminal of a resistive infrared device in the m-th row and n-th column of a plurality of resistive infrared devices; selectively activating a switch based on a connection signal, the switch being connected among the plurality of resistive infrared devices to electrically connect P×Q resistive infrared devices from the m-th row to the m+P-1-th row and from the n-th column to the n+Q-1-th column; activating a second switch based on a column n+Q-1 selection signal, the second switch being connected to a second terminal of a resistive infrared device in the n+Q-1-th column and from the m-th row to the m+P-1-th row of the plurality of resistive infrared devices; and obtaining the series resistance of the P×Q resistive infrared devices, wherein m is a natural number less than M, n is a natural number less than N, P is a natural number less than M, Q is a natural number less than N, and neither P nor Q is 1.

[0027] According to another aspect of the exemplary embodiment, a thermal infrared detector is provided, comprising: a pixel array including a plurality of pixels disposed in a plurality of rows and a plurality of columns, each of the plurality of pixels including a plurality of resistive infrared devices; and a driving circuit configured to drive the pixel array, wherein the pixel array includes a plurality of pixel groups, each of the plurality of pixel groups including at least two resistive infrared devices that are adjacent to each other in a row direction or a column direction, wherein the plurality of pixel groups overlap each other such that at least two resistive infrared devices are shared by at least two pixel groups, and wherein the at least two resistive infrared devices shared by at least two pixel groups are connected in series. Attached Figure Description

[0028] The above and / or other aspects, features, and advantages of the exemplary embodiments will become clearer from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 A thermal infrared detector according to an example embodiment is shown;

[0030] Figure 2 This is a conceptual diagram of pixel grouping based on an example embodiment;

[0031] Figure 3 This is a circuit diagram for signal detection of pixel groups according to another example embodiment;

[0032] Figure 4 It includes Figure 1 A schematic diagram of the pixels in a resistive infrared device;

[0033] Figure 5 This is a pixel circuit diagram driven by a 2×1 group according to another example embodiment;

[0034] Figure 6 This is a pixel circuit diagram driven by a 2×1 group according to another example embodiment;

[0035] Figure 7 yes Figure 5 Circuit diagram for signal detection of pixels;

[0036] Figure 8 This is a pixel circuit diagram driven by a 1×2 group according to another example embodiment;

[0037] Figure 9 yes Figure 8 Circuit diagram for signal detection of pixels;

[0038] Figure 10 This is a pixel circuit diagram driven by m×n groups according to another example embodiment;

[0039] Figure 11 yes Figure 10 Circuit diagram for signal detection of pixels;

[0040] Figure 12 This is a flowchart of a method for driving a thermal infrared sensor array according to an example embodiment;

[0041] Figure 13 This is a flowchart of a method for driving a thermal infrared sensor array according to another example embodiment;

[0042] Figure 14 This is a timing diagram of a method for driving a thermal infrared sensor array according to another example embodiment; and

[0043] Figure 15 This is a pixel circuit diagram according to another example embodiment. Detailed Implementation

[0044] Reference will now be made in detail to the embodiments illustrated in the accompanying drawings, wherein similar reference numerals always refer to similar elements. In this respect, exemplary embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, exemplary embodiments are described below only with reference to the accompanying drawings to explain various aspects. The term “and / or” as used herein includes any one and all combinations of one or more of the relevant listed items. Expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0045] In consideration of the functions described herein, the terms used herein have been selected from those currently widely used and generally pertaining to common terminology. However, these terms may vary depending on the intent of a person skilled in the art, precedent, and the emergence of new technologies. Furthermore, for special cases, the meaning of the terms chosen by the applicant will be explained in detail in the description section. Therefore, the terms used herein are defined based on their meaning in relation to the content discussed throughout the specification, rather than by their simplistic meaning.

[0046] The terms "first" and "second" used in this document are only for describing various constituent elements, but the constituent elements are not limited by these terms. These terms are only used for the purpose of distinguishing one constituent element from another.

[0047] The terminology used herein is not intended to limit the embodiments. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context explicitly indicates otherwise. Furthermore, in exemplary embodiments, when a layer, region, or component is referred to as being electrically connected to another layer, region, or component, it may be a direct electrical connection to the other layer, region, or component or an indirect electrical connection via an intermediate layer, region, or component. Additionally, it should be understood that the terms “comprising” and / or “including” as used herein mean the presence of the stated feature or component, but do not exclude the presence or addition of one or more other features or components.

[0048] In the context of describing this disclosure (especially in the context of the appended claims), the use of the terms “a,” “an,” and “the,” and similar designations, should be interpreted to cover both the singular and the plural. Furthermore, the steps of all the methods described herein may be performed in any suitable order, unless otherwise indicated herein or explicitly stated otherwise by the context. This disclosure is not limited to the described order of steps.

[0049] This disclosure can be described as functional block components and various processing steps. Such functional blocks can be implemented by any number of hardware and / or software components configured to perform a specified function. For example, a functional block related to an embodiment can be implemented by one or more microprocessors or other circuit configurations for a predetermined function. Furthermore, functional blocks can be implemented using any programming or scripting language. Additionally, functional blocks can be implemented by algorithms executed in one or more processors. Embodiments can utilize conventional techniques for electronic environment setup, signal processing, and / or data processing, etc.

[0050] The connecting lines or connectors shown in the various accompanying figures are intended to illustrate the functional relationships and / or physical or logical couplings between the various components. It should be noted that in actual equipment, there may be many alternative or additional functional relationships, physical connections, or logical connections.

[0051] The present disclosure will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are illustrated. However, the present disclosure may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

[0052] In one example embodiment, a thermal infrared detector can be applied to the readout circuit IC and signal detection control circuit of a thermal imaging system.

[0053] In one example embodiment, the thermal infrared sensor array may include a plurality of thermal infrared devices configured in a two-dimensional array, which can convert the output signals from the thermal infrared devices into a thermal image to display the temperature difference of the object to be measured or the entire scene.

[0054] In one example embodiment, although the thermal infrared device may be described as a radiation-measuring resistance thermometer, the embodiment is not limited thereto, and the thermal infrared device may include a thermopile or a thermoelectric device.

[0055] In one example embodiment, grouping or grouping can be the operation of combining multiple devices arranged in a sensor array in the row and / or column directions.

[0056] In one example embodiment, a pixel may be a device implemented in a pixel array, and a pixel may include a thermal infrared device, a row selection switch, a column selection switch, etc.

[0057] Figure 1 A thermal infrared detector 100 according to an example embodiment is shown.

[0058] refer to Figure 1 The thermal infrared detector 100 may include a pixel array 110 and a driving circuit 120.

[0059] The thermal infrared detector 100 can be implemented using an uncooled thermal imaging camera. An uncooled thermal imaging camera may include an optical system, a focal plane array, a signal processor, a signal controller, a temperature stabilizer, and a display. In the optical system, infrared light radiated from an object or scene is projected onto the focal plane array through an infrared lens. The infrared radiation energy projected onto the focal plane array is converted into an electrical signal by the focal plane array sensor and the signal processor, and then converted into a digital signal via analog-to-digital conversion. To reduce heat conduction to the surrounding atmosphere, the focal plane array can be arranged in a vacuum-sealed manner, and an infrared window can be positioned in front of the focal plane array. The data converted into digital signals is converted into image data through bias correction, amplification correction, and other signal processing in the signal processor, and is displayed on the screen. Bias and amplification correction can be performed by adding additional reference devices on a row-by-row or column-by-column basis. The temperature stabilizer allows the focal plane array sensor to operate under constant temperature conditions.

[0060] Return to reference Figure 1 The pixel array 110 may include a plurality of devices 111 to 117 arranged in both row and column directions. Devices 111 to 117 may be sensors, such as thermal infrared sensors, resistive infrared devices, or radiative thermal devices. Although the devices are described as resistive infrared devices, such as radiative thermal devices, they may be other types of sensors, such as thermopile or thermoelectric devices. The pixel array 110 may be implemented by a plurality of infrared detection devices arranged in a two-dimensional array on a silicon substrate.

[0061] The driving circuit 120 may include a readout integrated circuit (ROIC) to detect changes in the characteristics of each detection device. The driving circuit 120 may sequentially drive all pixels of the pixel array 110 to read data from the infrared detection device or resistive infrared device and detect the temperature of the object to be measured.

[0062] The driving circuit 120 may also include a bias circuit for generating a bias signal, a row selection circuit for selectively activating a detection device, a column selection circuit, a column channel amplifier circuit, a sample and hold circuit, a column multiplexer, an output buffer circuit, etc.

[0063] The signal path from one pixel to the output is as follows. The active calorimeter is biased via a switch. A non-photosensitive reference calorimeter can be connected to the end of each column. To integrate the difference in current flowing into the active and non-photosensitive calorimeters, an amplification (transimpedance amplifier) ​​circuit is used. The amplifier's output voltage is integrated in a capacitor by the operation of a switch, and then sent to the output voltage by the operation of a switch.

[0064] One end of the effective calorimeter resistor is connected to a bias voltage. The other end of the effective calorimeter resistor is connected to the first column line via a first switch. The switching control line of the switch is connected to the first row line. One end of the first column line is connected to a non-photosensitive resistor, and the amplifier input port is connected to a reference voltage. Time-interleaved drive operation measures the resistance of devices arranged at specific intervals to obtain and display a thermal image. The timing control circuit is configured to control the timing of the row selection circuit and the column selection circuit. In response to a signal from the timing control circuit, the row selection circuit can selectively activate one of the row lines. The row selection circuit can be implemented by a multiplexer or other types of components / devices.

[0065] Pixel array 110 may include a plurality of resistive infrared devices 111 to 117 connected to M row electrodes and N column electrodes. M represents the number of electrodes in the row direction, and N represents the number of electrodes in the column direction. The plurality of resistive infrared devices are grouped in the row direction or the column direction. For example, in the row direction, resistive infrared devices 111 and 112 are grouped together, resistive infrared devices 112 and 113 are grouped together, and resistive infrared devices 113 and 114 are grouped together, thereby grouping all pixels. In the column direction, resistive infrared devices 111 and 115 are grouped together. In an example embodiment, M and N are natural numbers greater than or equal to 3.

[0066] In one example embodiment, a signal is detected from a pixel group comprising m × n adjacent pixels, where m and n are natural numbers, but neither m nor n is 1. In this state, there are pixels included in two or more pixel groups. Pixels included in the same pixel group are electrically connected to each other to operate as a resistive radiometer. Individual pixels are included in at least one pixel group. See below for reference. Figure 2 and Figure 3 Describe the grouping operation.

[0067] Figure 2 This is a conceptual diagram of pixel grouping based on an example embodiment.

[0068] refer to Figure 2 This shows the first row r along the row direction. a The second line r b The third line r c The fourth line r d and the fifth line r e and the first column c along the column direction a Column 2 c b Column 3 c c Column 4c d Column 5c e And the sixth column cf In such Figure 2 In one example embodiment shown, an M×N pixel array (where M is 5 and N is 6) and an m×n pixel group (where m is 2 and n is 3) are described. Although an example of M×N being 5×6 and m×n being 2×3 is described, the embodiment is not limited thereto, and various modifications can be made depending on the design and the application area of ​​the infrared sensor.

[0069] In one example embodiment, a 2×3 pixel group comprises six pixels. (Included in pixel group G) i The six pixels p bb p bc p bd p cb p cc and p cd They are electrically connected to each other and operate as a resistive radiative thermal meter. Because they absorb more infrared light over a larger area compared to a single pixel, the signal change is increased. Similarly, this is included in pixel group G. j The six pixels p cc p cd p ce p dc p dd and p de They are electrically connected to each other and operate as a resistive radiative calorimeter. Included in pixel group G. k The six pixels p cd p ce p cf p dd p de and p df They are electrically connected to each other and operate as a resistive radiative calorimeter. Pixel p cc Included in pixel group G i and pixel group G j Of the two, pixel p cd Included in pixel group G i G j and G k Of the three, pixel p ce p dd and p de Included in pixel group G j and G k Of the two. For example... Figure 2 As shown, each pixel group shares at least one pixel. Pixel group G i and G j Shared pixel P cc and pixel P cd .like Figure 2As shown, when the spacing between adjacent pixel groups matches the pixel pitch, image data with the same spatial resolution can be obtained.

[0070] Figure 3 This is a circuit diagram for signal detection of pixel groups according to another example embodiment.

[0071] refer to Figure 3 Describe signal detection for a 2×2 pixel group. For example... Figure 3 As shown, there are three row lines (row1 to row3) and three column lines (col1 to col3). The pixels of the first row line (row1) and the first column line (col1) can include the resistor R of the resistive calorimeter. 11 and the first switch S 01 To the fourth switch S 04 The pixels of the first row (row1) and the second column (col2) may include resistive infrared devices R. 12 and the fifth switch S 05 Up to the ninth switch S 09 .

[0072] The pixels in the second row (row2) and the first column (col1) can include the resistor R of the resistive calorimeter. 21 and the fifteenth switch S 15 Up to the eighteenth switch S 18 The pixels of the second row (row2) and the second column (col2) may include resistive infrared devices R. 22 and the nineteenth switch S 19 Up to the twenty-third switch 5 23 Similarly, other pixels can be arranged using resistive devices and switches.

[0073] When grouped in 2×2 pixels, this includes the resistance R of the resistive calorimeter. 11 The resistor R is connected in series with the resistance calorimeter. 21 The third switch 5 03 The resistance R of the resistance-type radiative calorimeter 21 Connected in series to resistive infrared device R 22 The twenty-first switch S 21 and resistive infrared devices R 22 Connected in series to resistive infrared device R 12 The eighth switch S 08 .

[0074] When the first pixel group is driven, in order to connect the resistive infrared devices R in the 2×2 group in series 11 R 21 R 22 and R 12 Turn on the third switch S 03Switch S (21) 21 and the eighth switch S 08 Then, when the first row selection signal is applied to the first pixel group, the first switch S is turned on. 01 When the second column selection signal is applied to the first pixel group, the sixth switch S is turned on. 06 Based on the series resistance R 11 R 21 R 22 and R 12 The changed output signal is output through the second column line col2. As described above, the reference resistance value (e.g., the value of the current flowing into the non-photosensitive calorimeter) is input to the amplifier circuit.

[0075] Similarly, when driving the second pixel group, in order to connect the resistive infrared devices R in the next 2×2 group in series... 12 R 22 R 23 and R 13 Connect the eighth switch S 08 Switch S (26) 26 and the thirteenth switch S 13 Based on the signal indicating the selection of pixels in the first row and second column, the fifth switch S is activated. 05 When the third column selection signal is applied to the second pixel group, the eleventh switch S is turned on. 11 Based on the series resistance R 12 R 22 R 23 and R 13 The changed output signal is output through the third column line col3.

[0076] By driving all pixel groups sequentially in the manner described above, the temperature of the object to be measured is detected from the output signal of all pixel groups.

[0077] In one example embodiment, although the connection switch belonging to the first pixel group is turned on, a row or column selection signal is output, and the resistance value of the series connection is measured, this disclosure is not limited to this. Instead, the row or column selection signal can be output first, and then the connection switch belonging to the corresponding pixel group can be turned on.

[0078] In one example embodiment, a thermal infrared sensor array is implemented to measure the change in electrical properties of multiple resistive infrared devices arranged in a row or column direction based on the infrared incident radiation. In this configuration, signals are measured by spatially grouping multiple adjacent devices, and the thermal infrared sensor array is implemented such that at least one device is simultaneously included in a spatially adjacent group. Furthermore, the resistive infrared devices are connected in series within each group. Therefore, problems caused by pixel miniaturization can be solved, such as decreased sensitivity due to reduced infrared absorption area and increased thermal conductivity, increased equivalent noise temperature difference (NETD) due to reduced volume of the calorimeter material, or increased NETD 1 / f.

[0079] Figure 4 It includes Figure 1 A schematic diagram of the pixels of a resistive infrared device.

[0080] refer to Figure 4 The image shows the pixel configuration of the microbolometer. The X metal electrode (X metal) and Y metal electrode (Y metal) correspond to... Figure 3 The electrodes for the first row lines (row1) to the third row lines (row3) and the first column lines (col1) to the third column lines (col3) are shown in the diagram. The portion absorbing infrared light described above can be a resistive infrared device or a resistive device for a microbolometer. While silicon nitride and vanadium oxide can be used for these devices, the embodiments are not limited to these materials. The pixel size of microbolometers is gradually decreasing. Recently, the pixel size has decreased to approximately 10 micrometers, and is expected to reach approximately 8 micrometers in the near future. Therefore, due to pixel miniaturization, technical problems arise, such as increased thermal conductivity due to the reduction in pixel area and effective area, and the decrease in leg length. A thermal infrared sensor array and its driving method according to an example embodiment can have the following effects: increasing the effective area of ​​the sensor and reducing thermal conductivity through group driving. Furthermore, because data is acquired by moving pixel by pixel, resolution of pixel pitch can be achieved, thereby realizing a high-resolution column image.

[0081] Figure 5 This is a pixel circuit diagram for 2×1 group driving according to another example embodiment.

[0082] refer to Figure 5 The first pixel group 500 is described as an example of a pixel structure that can be used for 2×1 pixel group signal detection in a 3×3 pixel array. The first pixel group 500 includes P 11 and P 21 First switch S 01 Connected to the resistor R of the radiative calorimeter 11 One end is between the first row line row1 and the third switch S. 03 Connected to the resistor R of the radiative calorimeter11 The other end is between the first column line col1 and the second switch S. 02 Connected to the resistor R of the radiative calorimeter 11 and the resistance R of the radiative thermal meter 11 The resistance R of the radiation calorimeter grouped together 21 Between. Tenth switch S 10 Connected to the resistor R of the radiative calorimeter 21 One end is between the second row line and row2, and the twelfth switch S 12 Connected to the resistor R of the radiative calorimeter 21 The other end is between the first column line col1 and the second end. For example... Figure 5 As shown, signals are read out sequentially from 2×1 pixel groups that can be grouped in a 3×3 pixel array. Nine pixels are arranged at specific intervals along rows and columns, and are configured with three row lines and three column lines. Row lines row1, row2, and row3 can be connected to a bias power supply. An amplifier circuit can be connected to the ends of each of the first to third column lines col1, col2, and col3, and a reference voltage can be applied to the input port of the amplifier circuit. In a 3×3 pixel array, six 2×1 pixel combinations can be obtained, for example, p 11 &p 21 P 12 &P 22 p 13 &P 23 P 21 &P 31 p 22 &p 32 and P 23 &P 33 The number of 2×1 pixel groups that can be combined in an M×N pixel array can be (M-1)×N. M and N are natural numbers greater than or equal to 3. In the case of the calorimeter method, the calorimeter resistors in the pixel group are connected in series to form a group resistor. The ends (ends facing each other) of the calorimeter resistors in two pixels arranged in adjacent rows and included in the same column are optionally connected to each other. The other end of the calorimeter resistor belonging to the first row line is optionally connected to the row line, and the other end of the calorimeter resistor belonging to the second row line is connected to the column line. The signal of the group resistor can be read through the first row line and the column line.

[0083] Figure 6 This is a pixel circuit diagram for 2×1 group driving according to another example embodiment.

[0084] refer to Figure 6 The first pixel group 600 is described as an example of a pixel structure that can be used for 2×1 pixel group signal detection in a 3×3 pixel array. The first pixel group 600 includes P 11and P 21 First switch S 01 Connected to the resistor R of the radiative calorimeter 11 One end is between the first column line col1 and the third switch S. 03 Connected to the resistor R of the radiative calorimeter 11 The other end is between the common ground terminal and the second switch S. 02 Connected to the resistor R of the radiative calorimeter 11 and the resistance R of the radiative thermal meter 11 The resistance R of the radiation calorimeter grouped together 21 Between. Tenth switch S 10 Connected to the resistor R of the radiative calorimeter 21 One end is between the first column line col1 and the twelfth switch S. 12 Connected to the resistor R of the radiative calorimeter 21 Between the other end and the common ground terminal.

[0085] Figure 6 Another pixel structure is shown that can be used for signal detection of 2×1 pixel groups in a 3×3 pixel array. The description includes the resistance R of a calorimeter. 11 and the resistance R of the radiative thermal meter 21 A 2×1 pixel group. The resistance R of the radiative thermal meter. 11 and the resistance R of the radiative thermal meter 21 By turning on the second switch S 02 Series connection. In this state, by turning on the twelfth switch S... 12 Measure the resistance R of the radiant thermal instrument 21 One end is connected to a common bias voltage. Then, when the first switch S... 01 When the control signal of the first row line (row1) is turned on, the resistance R of the radiative thermal meter is measured. 11 The other end is connected to the first column line col1 to perform signal detection. Similarly, in R... 12 and R 22 R 13 and R 23 R 21 and R 31 R 22 and R 32 and R 23 and R 33 In the combination, similar connections are made, and output data in the form of a 2×1 array can be obtained through signal measurement.

[0086] Figure 7 yes Figure 5 The circuit diagram for signal detection of pixels.

[0087] refer to Figure 5 and Figure 7It describes the signal detection of six pixel groups 710 to 760.

[0088] For the first pixel group 710, turn on the second switch S. 02 And turn on the first switch S 01 and the twelfth switch S 12 The output value 715 is obtained through the first column line col1. Although in the above description, turning on the second switch S... 02 Then turn on the first switch S 01 and the twelfth switch S 12 However, the first switch S can be turned on. 01 and the twelfth switch S 12 Then you can turn on the second switch S. 02 Or it can turn on three switches at the same time.

[0089] For the second pixel group 720, turn on the fifth switch S. 05 Then turn on the fourth switch S 04 and the fifteenth switch S 15 The output value 725 is obtained through the second column line, col2.

[0090] For the third pixel group 730, turn on the eighth switch S. 08 Then turn on the seventh switch S 07 and the eighteenth switch S 18 The output value 735 is obtained through the third column line col3.

[0091] For the fourth pixel group 740, turn on the eleventh switch S. 11 Then turn on the tenth switch S 10 Twentieth switch S 20 The output value 745 is obtained through the first column line, col1.

[0092] For the fifth pixel group 750, turn on the fourteenth switch S. 14 Then turn on the thirteenth switch S. 13 Twenty-second switch S 22 The output value 755 is obtained through the second column line, col2.

[0093] For the sixth pixel group 760, turn on the seventeenth switch S. 17 Then turn on the sixteenth switch S. 16 Twenty-fourth switch S 24 The output value 765 is obtained through the third column line, col3.

[0094] After driving the six pixel groups, the temperature value of the object to be measured can be obtained from the output value 715 to the output value 765 and displayed.

[0095] In one example embodiment, although the first pixel group 710 to the sixth pixel group 760 are described as being driven sequentially, the embodiment is not limited thereto, and the first pixel group 710 to the sixth pixel group 760 may be driven simultaneously. Furthermore, the first pixel group 710 to the third pixel group 730, which do not overlap with each other, may be driven simultaneously, and then the fourth pixel group 740 to the sixth pixel group 760 may be driven simultaneously.

[0096] Figure 8 This is a pixel circuit diagram for 1×2 group driving according to another example embodiment. Figure 9 yes Figure 8 The circuit diagram for signal detection of pixels.

[0097] refer to Figure 8 and Figure 9 It describes the signal detection of six pixel groups 910 to 960.

[0098] For the first pixel group 910, turn on the fourth switch S. 04 Then turn on the first switch S 01 and the fifth switch S 05 The output value is obtained through the second column line, col2.

[0099] For the second pixel group 920, turn on the seventh switch S. 07 Then turn on the third switch S 03 and the eighth switch S 08 The output value is obtained through the third column line, col3.

[0100] For the third pixel group 930, turn on the twelfth switch S. 12 Then turn on the ninth switch 5. 09 and the thirteenth switch S 13 The output value is obtained through the second column line, col2.

[0101] For the fourth pixel group 940, turn on the fifteenth switch S. 15 Then turn on the eleventh switch S. 11 and the sixteenth switch S 16 The output value is obtained through the third column line, col3.

[0102] For the fifth pixel group 950, turn on the twentieth switch S. 20 Then turn on the seventeenth switch S. 17 Twenty-first switch S 21 The output value is obtained through the second column line, col2.

[0103] For the sixth pixel group 960, turn on the twenty-third switch S. 23 Then turn on the nineteenth switch S. 1924th Switch 5 24 The output value is obtained through the third column line, col3.

[0104] Figure 10 This is a pixel circuit diagram driven by an m×n group according to another example embodiment. Figure 11 yes Figure 10 The circuit diagram for signal detection of pixels.

[0105] Figure 10 This illustrates a method for sequentially reading signals from 2×2 pixel groups that can be combined in a 3×3 pixel array. For example... Figure 10 and Figure 11 As shown, nine pixels are arranged at specific intervals along rows and columns, and are configured in three row lines and three column lines. Row lines row1, row2, and row3 can be connected to a bias power supply. An amplifier circuit can be connected to column line c. o The ends of each of l1, col2, and col3, and the input port of the amplifier circuit can be applied with a reference voltage. In a 3×3 pixel array, such as Figure 11 As shown, based on the 2×2 pixel group, four pixel groups 1110, 1120, 1130, and 1140 can be obtained. The number of 2×2 pixel groups that can be combined in an M×N pixel array is (M-1)×(N-1). M and N are natural numbers greater than or equal to 3. In the radiometric method, the radiometric resistors in the pixel group are connected in series to form a group resistor.

[0106] For the first pixel group 1110, in order to measure the resistance R of the calorimeter 11 R 21 R 22 and R 12 Connect them to each other and turn on the fourth switch S. 04 Switch S (23) 23 and the ninth switch S 09 Then turn on the first switch S 01 and the seventh switch S 07 The output value is obtained through the third column line, col3.

[0107] For the second pixel group 1120, in order to measure the resistance R of the calorimeter 12 R 22 R 23 and R 13 Connect them to each other and turn on the ninth switch S. 09 Switch S, number twenty-eight 28 and the fourteenth switch S 14 Then turn on the sixth switch S. 06 and the twelfth switch S 12 The output value is obtained through the fourth column line, col4.

[0108] For the third pixel group 1130, in order to measure the resistance R of the calorimeter 21 R 31 R 32 and R 22 Connect them to each other and turn on the nineteenth switch S. 19 38th switch S 38 24th switch S 24 Then turn on the sixteenth switch S. 16 22nd Switch 5 22 The output value is obtained through the third column line, col3.

[0109] For the fourth pixel group 1140, in order to measure the resistance R of the calorimeter 22 R 32 R 33 and R 23 Connect them to each other and turn on the twenty-fourth switch S. 24 Switch S (43) 43 29th switch S 29 Then turn on the twenty-first switch S. 21 The 27th switch S 27 The output value is obtained through the fourth column line, col4.

[0110] In one example embodiment, because several adjacent pixels operate via electrical connections to each other, the amount of infrared radiation energy absorbed can increase with the increase of the effective area, and because the calorimeter resistors in several pixels are connected in series to operate as a single resistor, the amount of resistance change with temperature can increase. Therefore, as the output signal from the thermal infrared sensor array increases, the sensitivity and signal-to-noise ratio (SNR) can be improved, and the temperature resolution can be reduced.

[0111] Figure 12 This is a flowchart of a method for driving a thermal infrared sensor array according to an example embodiment.

[0112] refer to Figure 12The system outputs a connection signal (S1200) to connect the resistive infrared device of the first pixel to a device grouped with it. A connection switch (S1202) is activated between the resistive infrared devices in the first row and the resistive infrared devices in the second row grouped with them. In this state, the connection switch is connected between the resistive infrared device of the first pixel and the device grouped with it (the resistive infrared device of the pixel in the next row), and the connection switch is activated in response to the connection signal. A first row selection signal is output (S1204). In response to the first row selection signal, a first switch is activated (S1206). In this state, the first switch is connected between the first row line and one end of the resistive infrared device of the first pixel.

[0113] Output the first column selection signal (S1208). In response to the first column selection signal, turn on the second switch (S1210). In this state, the second switch is connected between the resistive infrared devices of the pixels grouped together in the first column and the next row.

[0114] Measure the series resistance of the resistive infrared devices in the first row and the resistive infrared devices in the second row (S1212).

[0115] In one example embodiment, for an M×N pixel array, the output signal is detected by m×n groups or subgroups. In this state, M and N are both natural numbers, both M and N are greater than or equal to 3, m is a natural number less than M, and n is a natural number less than N. In this state, neither m nor n is 1. (Refer to...) Figure 12 In the example embodiment described, m is 2, n is 1, and the size of the group is 2×1. Although in the reference... Figure 12 The example embodiment described illustrates the process of detecting the output signal of a group, but the output signals can be detected sequentially for each group of the entire pixel array.

[0116] Figure 13 This is a flowchart of a method for driving a thermal infrared sensor array according to another example embodiment.

[0117] refer to Figure 13 The system outputs a connection signal (S1300) to connect the resistive infrared device of the first pixel to the device grouped with it. A connection switch (S1302) is activated between the resistive infrared devices in the first row and the resistive infrared devices in the second column grouped with them. In this state, the connection switch is connected between the resistive infrared device of the first pixel and the devices grouped with it (the resistive infrared devices of pixels in the same row and the next column), and the connection switch is activated in response to the connection signal.

[0118] Output the first row selection signal (S1304). In response to the first row selection signal, turn on the first switch (S1306). In this state, the first switch is connected between the first row line and one end of the resistive infrared device of the first pixel.

[0119] Output the second column selection signal (S1308). In response to the second column selection signal, turn on the second switch (S1310). In this state, the second switch is connected between the second column line and the resistive infrared devices of the pixels in the first row and second column of the group.

[0120] Measure the series resistance of the resistive infrared devices in the first row and the resistive infrared devices in the second column (S1312).

[0121] In one example embodiment, for an M×N pixel array, the output signal is detected by m×n groups or subgroups. In this state, M and N are both natural numbers, both M and N are greater than or equal to 3, m is a natural number less than M, and n is a natural number less than N. In this state, neither m nor n is 1. (Refer to...) Figure 13 In the example embodiment described, m is 1, n is 2, and the size of the group is 1×2. Although in the reference... Figure 13 The example embodiment described illustrates the process of detecting the output signal of a group, but the output signals can be detected sequentially for each group of the entire pixel array.

[0122] Figure 14 This is a timing diagram of a method for driving a thermal infrared sensor array according to an example embodiment.

[0123] refer to Figure 14 This paper illustrates a method for simultaneously detecting signals in a 2×2 pixel group using 81 pixels in a 9×9 array. Signals from groups of pixels in columns 1 through 8 are detected between timest1 and t4. In this state, the output signal for the 2×2 pixel group is compared with a reference signal. Figure 10 and Figure 11 The description is the same. At t1, signals are simultaneously detected in four non-overlapping pixel groups including rows 1 and 2; at t2, signals are simultaneously detected in four non-overlapping pixel groups including rows 3 and 4; at t3, signals are simultaneously detected in four non-overlapping pixel groups including rows 5 and 6; and at t4, signals are simultaneously detected in four non-overlapping pixel groups including rows 7 and 8.

[0124] Next, signals from groups of pixels in columns 2 to 9 are detected at times t5 to t8. At t5, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 1 and 2; at t6, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 3 and 4; at t7, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 5 and 6; and at t8, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 7 and 8.

[0125] Next, signals from groups of pixels in columns 1 to 8 are detected at times t9 to t12. At t9, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 2 and 3; at t10, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 4 and 5; at t11, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 6 and 7; and at t12, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 8 and 9.

[0126] Next, signals from groups of pixels in columns 2 through 9 are detected at times t13 to t16. At t13, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 2 and 3; at t14, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 4 and 5; at t15, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 6 and 7; and at t16, signals are simultaneously detected from four non-overlapping pixel groups comprising rows 8 and 9. Data from 64 groups of pixels in an 8×8 array can be measured using the above method.

[0127] Figure 15 This is a pixel circuit diagram according to another example embodiment.

[0128] refer to Figure 15 This illustrates the circuit structure capable of detecting groups within a thermoelectric far-infrared sensor. Each pixel may include a temperature-varying capacitor C. x and switch S x Variable capacitor C x One end can be connected to a reference voltage, and the other end can be connected according to switch S. x The operation is connected to the column lines. Switches are arranged between adjacent row lines and between adjacent column lines. For example, in group detection of a 2×2 pixel group, switch S is turned on. r12 When the ON signal is applied to the first row line (row1), both row line 1 and row line 2 are activated simultaneously. When the ON switch S is activated... c12 When the four capacitive sensors C1, C2, C4 and C5 are connected in parallel and operate as a capacitor, a signal is detected from the first column line col1 or the second column line col2.

[0129] The example embodiments can be written as computer programs and implemented in a general-purpose digital computer that executes the programs using computer-readable recording media. Furthermore, the data structures used in the above example embodiments can be recorded in computer-readable recording media using various methods. Examples of computer-readable recording media include magnetic storage media (e.g., ROM, floppy disk, hard disk, etc.), optical recording media (e.g., CD-ROM or DVD), etc.

[0130] Because the thermal infrared detector according to the example embodiment operates as a plurality of adjacent pixels electrically connected to each other, the amount of far-infrared radiation energy absorbed can increase with the increase of the effective area.

[0131] Furthermore, because the calorimeter resistors in several pixels are connected in series to operate as a single resistor, the amount of resistance change with temperature is increased, and the output signal is increased, which can improve sensitivity and SNR, while the minimum temperature resolution can be made smaller.

[0132] Furthermore, since the pixel group area of ​​several electrically connected adjacent pixels is selected by moving in units of one pixel, a resolution equivalent to the pixel pitch can be obtained.

[0133] It should be understood that the exemplary embodiments described herein should be considered descriptive only and not for limiting purposes. The description of features or aspects in each exemplary embodiment should typically be interpreted as other similar features or aspects that may be used in other embodiments. Although exemplary embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope defined by the claims.

Claims

1. A thermal infrared detector, comprising: A thermal infrared sensor array comprising multiple resistive infrared devices arranged in multiple rows and columns; The driving circuit is configured to drive the thermal infrared sensor array; as well as Multiple pixels, arranged in the multiple rows and multiple columns, In the plurality of resistive infrared devices, at least two resistive infrared devices that are adjacent to each other in the row or column direction are grouped together. At least one of the plurality of resistive infrared devices is shared by at least two groups. The plurality of resistive infrared devices include at least two resistive infrared devices in each of the at least two groups that are connected in series, and Each of the plurality of pixels includes a corresponding resistive infrared device among the plurality of resistive infrared devices, and Each of the plurality of pixels includes: A first switch, the first end of which is connected to the row direction line, and the second end of which is connected to the first end of the corresponding resistive infrared device among the plurality of resistive infrared devices; and The second switch has its first end connected to the column direction line and its second end connected to the second end of the corresponding resistive infrared device among the plurality of resistive infrared devices.

2. The thermal infrared detector according to claim 1, further comprising: A connection switch is provided between the at least two resistive infrared devices included in each of the at least two groups.

3. The thermal infrared detector according to claim 2, wherein the number of the plurality of rows is M, the number of the plurality of columns is N, and each of M and N is a natural number greater than or equal to 3.

4. The thermal infrared detector according to claim 2, wherein the driving circuit is further configured to: The pixel group, including adjacent pixels among the plurality of pixels, is driven sequentially; and Turn on the connection switch to measure the series resistance of the at least two resistive infrared devices in each group.

5. The thermal infrared detector according to claim 2, wherein the driving circuit is further configured to: Output a connection signal for turning on the connection switch; and Output a first row selection signal for selecting the first row among the plurality of rows.

6. The thermal infrared detector according to claim 1, wherein the driving circuit is further configured to: Output a first connection signal, which is used to turn on the connection switch that connects the first resistive infrared device in the first row of the plurality of rows to the fourth resistive infrared device in the second row that is grouped with the first resistive infrared device. Output a first row first selection signal for selecting the first resistive infrared device in the first row, so that a first switch connected to the first terminal of the first resistive infrared device in the first row is turned on based on the first row first selection signal; as well as Output a first column selection signal for selecting a first column among the plurality of columns, so that a second switch connected to the second terminal of the fourth resistive infrared device in the second row is turned on based on the first column selection signal.

7. The thermal infrared detector according to claim 6, wherein the driving circuit is further configured to: Output a second connection signal, which is used to turn on the connection switch that connects the second resistive infrared device in the first row to the fifth resistive infrared device in the second row that is grouped with the second resistive infrared device; Output a first row second selection signal for selecting the second resistive infrared device in the first row, so that a first switch connected to the first terminal of the second resistive infrared device in the first row is turned on based on the first row second selection signal; as well as A second column selection signal is output to select a second column among the plurality of columns, so that a second switch connected to the second terminal of the fifth resistive infrared device in the second row is turned on based on the second column selection signal.

8. The thermal infrared detector according to claim 1, wherein the driving circuit is further configured to: Output a first connection signal, which is used to turn on the connection switch that connects the first resistive infrared device in the first row of the plurality of rows to the second resistive infrared device in the first row that is grouped with the first resistive infrared device. Output a first row first selection signal for selecting the first resistive infrared device in the first row of the plurality of rows, so that a first switch connected to the first terminal of the first resistive infrared device in the first row is turned on based on the first row first selection signal; as well as A second column selection signal is output to select a second column among the plurality of columns, so that a second switch connected to the second terminal of the second resistive infrared device in the first row is turned on based on the second column selection signal.

9. The thermal infrared detector according to claim 8, wherein the driving circuit is further configured to: Output a second connection signal, which is used to turn on the connection switch that connects the second resistive infrared device in the first row to the third resistive infrared device in the first row that is grouped with the second resistive infrared device. Output a first row second selection signal for selecting the second resistive infrared device in the first row of the plurality of rows, so that a first switch connected to the first terminal of the second resistive infrared device in the first row is turned on based on the first row second selection signal; as well as A third column selection signal is output to select the third column among the plurality of columns, so that a second switch connected to the second terminal of the third resistive infrared device in the first row is turned on based on the third column selection signal.

10. The thermal infrared detector of claim 1, wherein each of the plurality of resistive infrared devices comprises a calorimeter.

11. A thermal infrared sensor array, comprising: Multiple resistive infrared devices are connected to M row electrodes and N column electrodes; A plurality of first switches, wherein a first end of each of the plurality of first switches is connected to a first end of each of the plurality of resistive infrared devices, and a second end of each of the plurality of first switches is connected to a corresponding row electrode line; A plurality of second switches, wherein the first end of each of the plurality of second switches is connected to the second end of each of the plurality of resistive infrared devices, and the second end of each of the plurality of second switches is connected to a corresponding column electrode line; as well as Multiple connection switches are connected in series between adjacent resistive infrared devices among the multiple resistive infrared devices, so as to group at least two adjacent resistive infrared devices in the row or column direction.

12. The thermal infrared sensor array of claim 11, wherein each of M and N is a natural number greater than or equal to 3, the size of the group is m in the row direction and n in the column direction, m is a natural number less than M, n is a natural number less than N, and neither m nor n is 1.

13. The thermal infrared sensor array of claim 11, wherein at least two groups share at least one resistive infrared device.

14. The thermal infrared sensor array of claim 11, wherein each of the plurality of connection switches is disposed at a first pixel including one of the plurality of resistive infrared devices, one of the plurality of first switches, and one of the plurality of second switches, or at a second pixel in a group with the first pixel, the second pixel being adjacent to the first pixel in the row direction or the column direction.

15. The thermal infrared sensor array of claim 11, wherein each of the plurality of resistive infrared devices comprises a calorimeter.

16. A method for driving a thermal infrared sensor array according to claim 11, the method comprising: The connection switch among the plurality of connection switches is turned on based on the connection signal. The connection switch is set between one of the plurality of resistive infrared devices in the m-th row and one of the plurality of resistive infrared devices in the m+1-th row. The resistive infrared device in the m-th row and the resistive infrared device in the m+1-th row are grouped together. Based on the m-th row selection signal, one of the plurality of first switches is turned on, and the first switch among the plurality of first switches is connected to the first terminal of the resistive infrared device in the m-th row and n-th column; Based on the selection signal of the nth column, one of the plurality of second switches is turned on, and the second switch among the plurality of second switches is connected to the second terminal of the resistive infrared device in the (m+1)th row and the nth column; as well as Obtain the series resistance of the resistive infrared device in the m-th row and n-th column and the resistive infrared device in the (m+1)-th row and n-th column, where m is a natural number less than M and n is a natural number less than N.

17. A method for driving a thermal infrared sensor array according to claim 11, the method comprising: The connection switch among the plurality of connection switches is activated based on the connection signal. The connection switch is located between one of the plurality of resistive infrared devices in the m-th row and n-th column and one of the plurality of resistive infrared devices in the m-th row and n+1-th column. The resistive infrared devices in the m-th row and n-th column and the resistive infrared devices in the m-th row and n+1-th column are grouped together. Based on the selection signal of the m-th row, one of the plurality of first switches is turned on, and the first switch among the plurality of first switches is connected to the first terminal of the resistive infrared device in the m-th row and the n-th column; Based on the selection signal of column n+1, one of the plurality of second switches is turned on, and the second switch among the plurality of second switches is connected to the second terminal of the resistive infrared device in row m and column n+1; as well as Obtain the series resistance of the resistive infrared device in the m-th row and the n-th column and the resistive infrared device in the m-th row and the (n+1)-th column, where m is a natural number less than M and n is a natural number less than N.

18. A method for driving a thermal infrared sensor, the method comprising: The first switch is turned on based on the received m-th row selection signal. The first switch is connected to the first terminal of the resistive infrared device in the m-th row and n-th column among a plurality of resistive infrared devices. The switch is selectively turned on based on the connection signal. The switch is connected among the plurality of resistive infrared devices to electrically connect P×Q resistive infrared devices from the m-th row to the m+P-1-th row and from the n-th column to the n+Q-1-th column in series. The second switch is turned on based on the selection signal of the (n+Q-1)th column, and the second switch is connected to the second terminal of each of the plurality of resistive infrared devices in the (n+Q-1)th column, from the (m)th row to the (m+P-1)th row; as well as Obtain the series resistance of the P×Q resistive infrared devices. Where m is a natural number less than M, n is a natural number less than N, P is a natural number less than M, Q is a natural number less than N, and neither P nor Q is 1.

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