Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes an external electrode having a connection portion and a belt portion. An organic layer is disposed between an electrode layer and a plating layer of the belt portion of the external electrode, and a conductive resin layer is disposed between an electrode layer and a plating layer of the connection portion of the external electrode.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0183658, filed on December 24, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as display devices including liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, mobile phones, etc., to allow them to be charged and discharged.

[0004] Multilayer ceramic capacitors (MLCCs), with advantages such as compactness, guaranteed high capacitance, and ease of installation, can be used as components in a variety of electronic devices. As various electronic devices, such as computers and mobile devices, become smaller and have higher power outputs, the demand for miniaturization and higher capacitance of multilayer ceramic capacitors has increased.

[0005] In addition, with the recent increase in industry interest in vehicle electrical components, MLCCs also need to have high reliability and high strength characteristics for use in vehicles or infotainment systems.

[0006] To ensure the bending strength of multilayer electronic components, a method has been proposed to improve bending strength by setting an organic layer between the electrode layer and the plating layer.

[0007] However, the organic layer reduces the electrical connectivity between the electrode layer and the plating, thereby increasing the equivalent series resistance (ESR). Summary of the Invention

[0008] An exemplary embodiment provides a multilayer electronic component with low equivalent series resistance (ESR).

[0009] An exemplary embodiment provides a multilayer electronic component with improved flexural strength characteristics.

[0010] According to another aspect of this disclosure, a multilayer electronic component includes: a body comprising a first inner electrode and a second inner electrode disposed alternately in a first direction and a dielectric layer therebetween the first inner electrode and the second inner electrode; the body comprising a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; a first outer electrode comprising a first connecting portion disposed on the third surface and a first strip portion extending from the first connecting portion to the first surface, the second surface, the fifth surface and the sixth surface; and a second outer electrode comprising a second connecting portion disposed on the fourth surface and a second strip portion extending from the second connecting portion to the first surface, the second surface, the fifth surface and the sixth surface. The first external electrode includes a first electrode layer connected to the first internal electrode, a first plating layer disposed on the first electrode layer, and a first conductive resin layer disposed between the first electrode layer and the first plating layer in the first connection portion. The multilayer electronic assembly further includes a first organic layer disposed between the first electrode layer and the first plating layer in the first strip portion. The second external electrode includes a second electrode layer connected to the second internal electrode, a second plating layer disposed on the second electrode layer, and a second conductive resin layer disposed between the second electrode layer and the second plating layer in the second connection portion. The multilayer electronic assembly further includes a second organic layer disposed between the second electrode layer and the second plating layer in the second strip portion. Attached Figure Description

[0011] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0012] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to exemplary embodiments of the present disclosure;

[0013] Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I';

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken from line II-II';

[0015] Figure 4 This is an exploded perspective view schematically illustrating a body in which a dielectric layer and an internal electrode are stacked, according to an exemplary embodiment of the present disclosure.

[0016] Figure 5This is a schematic perspective view of a variant of a multilayer electronic assembly according to exemplary embodiments of the present disclosure; and

[0017] Figure 6 It is along Figure 5 The cross-sectional view taken from line III-III'. Detailed Implementation

[0018] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be readily understood by those skilled in the art. The order of operations described herein is merely illustrative and is not limited to the order presented; changes that will be readily understood by those skilled in the art may be made, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of functions and structures well-known to those skilled in the art may be omitted.

[0019] The features described herein may be implemented in various forms and are not to be construed as limited to the examples described herein. Rather, the examples described herein have been provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0020] It should be noted here that the use of the term “may” in relation to examples or exemplary embodiments (e.g., what an example or exemplary embodiment may include or implement) means that there exists at least one example or exemplary embodiment that includes or implements such a feature, and is not limited to all examples or exemplary embodiments including or implementing such a feature.

[0021] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to" another element, or "bonded to" another element, the element may be directly "on," directly "connected to," or directly "bonded to" the other element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to," or "directly bonded to" another element, there are no other elements in between.

[0022] As used herein, the term “and / or” includes any one of the relevant listed items or any combination of any two or more items.

[0023] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0024] For ease of description, spatial relative terms such as “above,” “above,” “below,” and “under” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relative terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “above” or “above” relative to another element will be “below” or “under” relative to said other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.

[0025] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0026] The shapes shown in the accompanying drawings may vary due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that occur during manufacturing.

[0027] The features of the examples described herein can be combined in various ways that will be readily understood after understanding the disclosure of this application. Furthermore, while the examples described herein have multiple constructions, other constructions that will be readily understood after understanding the disclosure of this application are possible.

[0028] The accompanying drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated.

[0029] In the accompanying drawings, the first direction can be defined as the stacking direction or thickness direction (T), the second direction can be defined as the length direction (L), and the third direction can be defined as the width direction (W).

[0030] Multilayer electronic components

[0031] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to exemplary embodiments of the present disclosure.

[0032] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0033] Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0034] Figure 4 This is an exploded perspective view schematically illustrating a body in which a dielectric layer and an internal electrode are stacked, according to an exemplary embodiment of the present disclosure.

[0035] In the following text, reference will be made to Figures 1 to 4 Describes a multilayer electronic assembly 100 according to exemplary embodiments of the present disclosure.

[0036] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure includes: a body 110 including a first inner electrode 121 and a second inner electrode 122 alternately stacked in a first direction and a dielectric layer 111, wherein the dielectric layer 111 is located between the first inner electrode 121 and the second inner electrode 122, and the body 110 includes a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 to the fourth surface 4 and opposite to each other in a third direction; a first outer electrode 131 including a first connecting portion A1 disposed on the third surface 3 and a first strip portion B1 extending from the first connecting portion A1 to the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6; and a second outer electrode 132 including a second connecting portion A2 disposed on the fourth surface 4 and a second strip portion B2 extending from the second connecting portion A2 to the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6. The first external electrode 131 includes a first electrode layer 131a connected to the first internal electrode 121 and a first plating layer 131c disposed on the first electrode layer 131a. A first conductive resin layer 131b is disposed between the first electrode layer 131a and the first plating layer 131c in the first connecting portion A1. A first organic layer 141 is disposed between the first electrode layer 131a and the first plating layer 131c in the first strip portion B1. The second external electrode 132 includes a second electrode layer 132a connected to the second internal electrode 122 and a second plating layer 132c disposed on the second electrode layer 132a. A second conductive resin layer 132b is disposed between the second electrode layer 132a and the second plating layer 132c in the second connecting portion A2. A second organic layer 142 is disposed between the second electrode layer 132a and the second plating layer 132c in the second strip portion B2.

[0037] In the body 110, dielectric layer 111 and internal electrodes 121 and 122 are stacked alternately.

[0038] The specific shape of the body 110 is not limited. As an example, as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Because the ceramic powder particles contained in the body 110 shrink during firing, the body 110 may not have a hexahedral shape with perfect straight lines, but rather a substantially hexahedral shape.

[0039] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0040] The multiple dielectric layers 111 forming the body 110 are in a sintered state, and adjacent dielectric layers 111 can be integrated, so that the boundary between adjacent dielectric layers 111 cannot be distinguished without the use of a scanning electron microscope (SEM).

[0041] According to exemplary embodiments of this disclosure, the material used to form the dielectric layer 111 is not limited, as long as sufficient electrostatic capacitance can be obtained. For example, barium titanate-based materials, lead-based perovskite composite materials, or strontium titanate-based materials can be used. Barium titanate-based materials may include BaTiO3-based ceramic powder particles, and the BaTiO3-based ceramic powder particles may include BaTiO3 and materials obtained by partially dissolving calcium (Ca), zirconium (Zr), etc., in BaTiO3. 1-x Ca x TiO3, Ba(Ti 1-y Ca y O3、(Ba 1-x Ca x (Ti) 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3.

[0042] As a material for forming dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc., can be added to powder particles such as barium titanate (BaTiO3) according to the purposes of this disclosure.

[0043] Furthermore, the thickness td of dielectric layer 111 is not particularly limited. However, the thickness td of dielectric layer 111 can be less than or equal to 0.6 μm to facilitate the miniaturization and high capacitance of multilayer electronic components. Here, the thickness td of dielectric layer 111 may refer to the average thickness of dielectric layer 111.

[0044] The main body 110 may include an effective portion Ac and cover portions 112 and 113. The effective portion Ac is disposed within the main body 110 and includes a first inner electrode 121 and a second inner electrode 122 disposed facing each other, with a dielectric layer disposed between the first inner electrode 121 and the second inner electrode 122 to form a capacitor. The cover portions 112 and 113 are respectively formed above and below the effective portion Ac in a first direction.

[0045] In addition, the effective portion Ac (which contributes to the capacitance of the capacitor) can be formed by repeatedly stacking a plurality of first inner electrodes 121 and second inner electrodes 122 and having a dielectric layer 111 between the first inner electrodes 121 and the second inner electrodes 122.

[0046] The covers 112 and 113 include an upper cover 112 and a lower cover 113, with the upper cover 112 disposed above the effective portion Ac in the first direction and the lower cover 113 disposed below the effective portion Ac in the first direction.

[0047] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the effective portion Ac in the thickness direction, respectively, and are mainly used to prevent damage to the inner electrode due to physical or chemical stress.

[0048] The upper cover 112 and the lower cover 113 do not include internal electrodes and may include the same material as the dielectric layer 111.

[0049] In other words, the upper cover 112 and the lower cover 113 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0050] Additionally, edge portions 114 and 115 may be provided on the side surface of the effective portion Ac.

[0051] Edge portions 114 and 115 may include an edge portion 114 disposed on the fifth surface 5 of the body 110 and an edge portion 115 disposed on the sixth surface 6 of the body 110. That is, edge portions 114 and 115 may be disposed on the two side surfaces of the effective portion Ac in the width direction.

[0052] like Figure 3 As shown, the edges 114 and 115 refer to the region between the two ends of the first inner electrode 121 and the second inner electrode 122 and the boundary surface of the body 110 in a cross section taken in the width direction W and the thickness direction T of the body 110.

[0053] Edges 114 and 115 are primarily used to prevent damage to the inner electrode caused by physical or chemical stress.

[0054] Since the inner electrode is formed by coating conductive paste on the area of ​​the ceramic green sheet other than the area where the edge portion is to be formed, the edge portions 114 and 115 can be formed accordingly in the area of ​​the ceramic green sheet where the edge portion is to be formed.

[0055] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed by cutting the stack after stacking the ceramic green sheet with the inner electrodes printed on it so that the inner electrodes are exposed on the two side surfaces in the width direction of the effective portion Ac, and then stacking a single dielectric layer or two or more dielectric layers on the two side surfaces in the width direction of the effective portion Ac.

[0056] Internal electrodes 121 and 122 are stacked alternately with dielectric layer 111.

[0057] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged to face each other, and each dielectric layer 111 constituting the body 110 is located between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0058] Reference Figure 2 The first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body and connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second inner electrode 122.

[0059] In other words, the first inner electrode 121 may not be connected to the second outer electrode 132, but may be connected to the first outer electrode 131; the second inner electrode 122 may not be connected to the first outer electrode 131, but may be connected to the second outer electrode 132. Therefore, the first inner electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance.

[0060] Here, the first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by a dielectric layer 111 disposed between them.

[0061] Reference Figure 4 The main body 110 can be formed by stacking a ceramic green sheet with a first internal electrode 121 printed thereon and a ceramic green sheet with a second internal electrode 122 printed thereon in the thickness direction (Z direction), and then firing the stack.

[0062] The materials forming the internal electrodes 121 and 122 are not limited, and materials with excellent conductivity can be used. For example, the internal electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0063] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for the internal electrodes onto a ceramic green sheet. The conductive paste includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The method for printing the conductive paste for the internal electrodes can be screen printing or gravure printing, but this disclosure is not limited thereto.

[0064] Furthermore, the thickness te of the inner electrodes 121 and 122 is not particularly limited. However, the thickness te of the inner electrodes 121 and 122 can be 0.6 μm or less to facilitate miniaturization and high capacitance of multilayer electronic components. Here, the thickness te of the inner electrodes 121 and 122 may refer to the average thickness of the inner electrodes 121 and 122.

[0065] Reference Figure 2 When the region of the first external electrode 131 is divided according to its position, the first external electrode 131 may include a first connecting portion A1 disposed on the third surface 3 of the body and a first strip portion B1 extending from the first connecting portion A1 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0066] The first external electrode 131 includes a first electrode layer 131a connected to the first internal electrode 121 and a first plating layer 131c disposed on the first electrode layer 131a. A first conductive resin layer 131b is disposed between the first electrode layer 131a and the first plating layer 131c in the first connecting portion A1, and a first organic layer 141 is disposed between the first electrode layer 131a and the first plating layer 131c in the first strip portion B1. Furthermore, the first organic layer 141 can contact the first electrode layer 131a and the first plating layer 131c in the first strip portion B1. The first conductive resin layer 131b can contact the first electrode layer 131a and the first plating layer 131c in the first connecting portion A1.

[0067] When the region of the second external electrode 132 is divided according to its position, the second external electrode 132 may include a second connecting portion A2 disposed on the fourth surface 4 of the body and a second strip portion B2 extending from the second connecting portion A2 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0068] The second external electrode 132 includes a second electrode layer 132a connected to the second internal electrode 122 and a second plating layer 132c disposed on the second electrode layer 132a. A second conductive resin layer 132b is disposed between the second electrode layer 132a and the second plating layer 132c in the second connecting portion A2, and a second organic layer 142 is disposed between the second electrode layer 132a and the second plating layer 132c in the second strip portion B2. Furthermore, the second organic layer 142 can contact the second electrode layer 132a and the second plating layer 132c in the second strip portion B2. The second conductive resin layer 132b can contact the second electrode layer 132a and the second plating layer 132c in the second connecting portion A2.

[0069] In the prior art, to ensure the bending strength of multilayer electronic components, a method has been proposed to improve bending strength by placing an organic layer between the electrode layer and the plating layer. However, the organic layer reduces the electrical connectivity between the electrode layer and the plating layer, thereby increasing the equivalent series resistance (ESR).

[0070] According to exemplary embodiments of the present disclosure, flexural strength characteristics can be improved by disposing organic layers 141 and 142 between electrode layers 131a and 132a and plating layers 131c and 132c in strip portions B1 and B2, and ESR can be reduced by disposing conductive resin layers 131b and 132b between electrode layers 131a and 132a and plating layers 131c and 132c in connecting portions A1 and A2.

[0071] The first electrode layer 131a and the second electrode layer 132a can be formed using any material (such as metal), as long as the material is conductive, and the specific material can be determined by taking into account electrical properties and structural stability.

[0072] For example, the first electrode layer 131a and the second electrode layer 132a may include conductive metal and glass.

[0073] The conductive metal used in electrode layers 131a and 132a is not limited, as long as it is a material that can be electrically connected to the inner electrode to form a capacitor. For example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0074] Electrode layers 131a and 132a can be formed by coating conductive paste and then firing the conductive paste, which is prepared by adding glass frit to conductive metal particles.

[0075] The plating layers 131c and 132c can be disposed on the electrode layers 131a and 132a.

[0076] The platings 131c and 132c are primarily used to improve mounting characteristics. The type of platings 131c and 132c is not particularly limited and can be platings containing at least one of Ni, Sn, Pd and their alloys, and can be formed from multiple layers.

[0077] For a more specific example of plating layers 131c and 132c, plating layers 131c and 132c may be Ni plating layers or Sn plating layers, or Ni plating layers and Sn plating layers may be sequentially formed on electrode layers 131a or 132a. However, this disclosure is not limited thereto, and plating layers 131c and 132c may include Sn plating layers, Ni plating layers and Sn plating layers formed sequentially, or may include multiple Ni plating layers and / or multiple Sn plating layers.

[0078] A first conductive resin layer 131b is disposed between the first electrode layer 131a and the first plating layer 131c of the first connecting portion A1, and a first organic layer 141 is disposed between the first electrode layer 131a and the first plating layer 131c of the first strip portion B1. A second conductive resin layer 132b is disposed between the second electrode layer 132a and the second plating layer 132c of the second connecting portion A2, and a second organic layer 142 is disposed between the second electrode layer 132a and the second plating layer 132c of the second strip portion B2.

[0079] The conductive resin layers 131b and 132b disposed between the electrode layers 131a and 132a and the plating layers 131c and 132c in the connecting portions A1 and A2 are used to improve the electrical connectivity between the electrode layers 131a and 132a and the plating layers 131c and 132c to reduce ESR.

[0080] Organic layers 141 and 142, disposed between the electrode layers 131a and 132a and the plating layers 131c and 132c in the strip portions B1 and B2, are used to suppress the transmission of external forces that may cause cracks in the main body 110 due to substrate warping, thereby improving the bending strength characteristics of the multilayer electronic assembly 100. Furthermore, organic layers 141 and 142 can inhibit moisture penetration into the main body 110, thereby improving moisture resistance reliability.

[0081] In an exemplary embodiment, the first organic layer 141 may be configured to cover the end of the first electrode layer 131a at the first strip portion B1, and the second organic layer 142 may be configured to cover the end of the second electrode layer 132a at the second strip portion B2. Therefore, the bending strength can be further improved according to the arrangement of the organic layers 141 and 142.

[0082] In an exemplary embodiment, the first organic layer 141 is configured to extend beyond the end of the first plating 131c of the first strip portion B1 to cover a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. The second organic layer 142 may be configured to extend beyond the end of the second plating 132c of the second strip portion B2 to cover a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. Therefore, the flexural strength can be further improved according to the arrangement of the organic layers 141 and 142.

[0083] In addition, the organic layers 141 and 142, which are configured to contact the surface of the body 110, can seal the pores or cracks of the body 110, thereby preventing moisture from penetrating into the body through the outer surface of the body.

[0084] In an exemplary embodiment, the first organic layer 141 and the second organic layer 142 may include an organosilicon compound. Examples of organosilicon compounds include decyltrimethoxysilane, n-propyltrimethoxysilane, and octyltriethoxysilane.

[0085] In this case, the organosilicon compound has a polyfunctional alkoxysilane Si-(C n H 2n+1 The structure of 3 can contain nitrogen (N) elements. Therefore, it can further improve the bending strength and moisture resistance.

[0086] In an exemplary embodiment, in a cross-section taken at the center of the third-direction aspect of the main body along the first and second directions, when the maximum dimension of the first conductive resin layer 131b at the first connection portion A1 in the second direction is T1 and the outermost dimension in the first direction from one end of the first plating layer 131c of the first strip portion B1 to the first external electrode 131 in the second direction is L1, T1 / L1 is 0.1 or less. If T1 / L1 exceeds 0.1, the effect of reducing ESR may be insufficient.

[0087] Here, T1 may refer to the maximum thickness of the first conductive resin layer 131b, and L1 may refer to the length of the strip portion B1.

[0088] Furthermore, the lower limit of T1 / L1 is not particularly limited, but in order to further improve the bending strength, T1 / L1 may preferably be 0.04 or greater.

[0089] Measurements of T1 and L1 can be performed using an optical microscope or a scanning electron microscope (SEM), but this disclosure is not limited thereto. Other methods and / or tools, as understood by one of ordinary skill in the art, may be used even if not described in this disclosure.

[0090] The first conductive resin layer 131b is disposed between the first electrode layer 131a and the first plating layer 131c of the first connecting portion A1, and the second conductive resin layer 132b is disposed between the second electrode layer 132a and the second plating layer 132c of the second connecting portion A2.

[0091] The conductive resin layers 131b and 132b disposed between the electrode layers 131a and 132a and the plating layers 131c and 132c in the connecting portions A1 and A2 can improve the electrical connectivity between the electrode layers 131a and 132a and the plating layers 131c and 132c, thereby reducing ESR.

[0092] The method for forming the conductive resin layers 131b and 132b disposed at the connecting portions A1 and A2 is not particularly limited. For example, after forming the electrode layers 131a and 132a on the main body 110, an organic layer may be formed on the electrode layers 131a and 132a and on the outer surface of the main body 110. The organic layer disposed at the connecting portion is removed to expose the electrode layer, and then the conductive resin layer may be formed on the electrode layer of the connecting portion.

[0093] In the process of removing the organic layer disposed at the connection portion, the organic layer may remain on a portion of the connection portion. Therefore, the first organic layer 141 may extend to be disposed on a portion of the first connection portion A1, and the second organic layer 142 may extend to be disposed on a portion of the second connection portion A2.

[0094] When electrode layers 131a and 132a comprise conductive metal and glass, the electrode layers 131a and 132a at the corners (the region between the connecting portions A1 and A2 and the strip portions B1 and B2) may be thin. Because of this, the corners may become the primary moisture penetration paths, thereby reducing moisture-proof reliability. Therefore, the first organic layer 141 may extend to and be disposed at a portion of the first connecting portion A1, and the second organic layer 142 may extend to and be disposed at a portion of the second connecting portion A2 to cut off the primary moisture penetration paths, thereby further improving moisture-proof reliability.

[0095] Here, the first organic layer 141 may be disposed at the first connection portion A1 between the first conductive resin layer 131b and the first electrode layer 131a, and the second organic layer 142 may be disposed at the second connection portion A2 between the second conductive resin layer 132b and the second electrode layer 132a. Furthermore, the first organic layer 141 may be spaced apart from the central portion of the first connection portion A1, and the second organic layer 142 may be spaced apart from the central portion of the second connection portion A2.

[0096] The conductive resin layers 131b and 132b may contain a conductive metal and a matrix resin.

[0097] The conductive metal contained in the conductive resin layers 131b and 132b is used to electrically connect the conductive resin layers 131b and 132b to the electrode layers 131a and 132a.

[0098] The conductive metal contained in the conductive resin layers 131b and 132b is not particularly limited, as long as it is a material that can be electrically connected to the electrode layers 131a and 132a, and may include at least one selected from, for example, nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0099] The conductive metal contained in the conductive resin layers 131b and 132b may include at least one of spherical powder particles and flake powder particles. That is, the conductive metal may be formed from only flake powder particles or only spherical powder particles, or it may be formed from a mixture of flake powder particles and spherical powder particles.

[0100] Here, spherical powder particles may include non-perfectly spherical forms, for example, those with a length ratio (major axis to minor axis) of 1.45 or less.

[0101] Flake-shaped powder particles refer to powder particles with a flat and elongated shape, wherein the length ratio of the long axis to the short axis (long axis / short axis) can be 1.95 or greater, but is not limited thereto.

[0102] The major and minor axis lengths of spherical and flake-shaped powder particles can be measured from the following image: an image obtained by scanning a cross-section taken at the center of a multilayer electronic component in the third direction using SEM.

[0103] The matrix resin contained in conductive resin layers 131b and 132b is used to ensure adhesion and absorb shock.

[0104] The matrix resin contained in the conductive resin layers 131b and 132b is not particularly limited, as long as it has adhesive and shock-absorbing properties and can be mixed with conductive metal powder particles to form a paste. For example, the matrix resin may include epoxy resin.

[0105] In addition, conductive resin layers 131b and 132b may contain multiple metal powder particles, intermetallic compounds, and matrix resins.

[0106] Intermetallic compounds are used to connect multiple metal powder particles to improve electrical connectivity, and can be used to surround multiple metal powder particles to connect the metal powder particles to each other.

[0107] Here, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the matrix resin.

[0108] In other words, since the intermetallic compound contains a metal with a melting point lower than the curing temperature of the matrix resin, the metal with a melting point lower than the curing temperature of the matrix resin melts during the drying and curing process and forms an intermetallic compound with some of the metal powder particles to surround the metal powder particles. Preferably, the intermetallic compound may include a low-melting-point metal with a melting point of 300°C or lower.

[0109] For example, intermetallic compounds may include Sn, which has a melting point of 213°C–220°C. Sn melts during the drying and curing process, and the molten Sn wets high-melting-point metal powder particles such as Ag, Ni, or Cu due to capillary action, reacting with some of the Ag, Ni, or Cu metal powder particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. The Ag, Ni, or Cu particles that do not participate in the reaction remain in their original metal powder particle form.

[0110] Therefore, the plurality of metal powder particles may include at least one of Ag, Ni and Cu, and the intermetallic compound may include at least one of Ag3Sn, Ni3Sn4, Cu6Sn5 and Cu3Sn.

[0111] Figure 5 This is a schematic perspective view of a variant of a multilayer electronic assembly 100' according to exemplary embodiments of the present disclosure. Figure 6 It is along Figure 5 The cross-sectional view taken from line III-III'.

[0112] Reference Figure 5 and Figure 6 The first organic layer and the second organic layer may extend to cover the entire area of ​​the first surface, second surface, fifth surface and sixth surface of the body 110 where the first electrode layer 131a and the second electrode layer 132a are not disposed, and the first organic layer and the second organic layer may be connected to each other to form an organic layer 140'.

[0113] (Example)

[0114] After forming an electrode layer on a body in which a dielectric layer and an inner electrode are stacked, a multifunctional alkoxysilane Si-(C) is formed on the outer surface of the electrode layer and the body. n H 2n+1The structure includes an organic layer containing nitrogen. The organic layer at the connection is then removed, and a conductive resin layer is formed on the connection where the organic layer has been removed, having a thickness satisfying T1 / L1 in Table 1 below. However, in the cases of test numbers 1*, 7*, 13*, 19*, and 25*, the organic layer was not removed and no conductive resin layer was formed. A plating layer is then formed to complete the sample sheet.

[0115] For the dimensions in Table 1 below, 1005 refers to a sample piece with a length of 1.0 mm and a width of 0.5 mm, 1608 refers to a sample piece with a length of 1.6 mm and a width of 0.8 mm, 2012 refers to a sample piece with a length of 2.0 mm and a width of 1.2 mm, 3216 refers to a sample piece with a length of 3.2 mm and a width of 1.6 mm, and 3225 refers to a sample piece with a length of 3.2 mm and a width of 2.5 mm.

[0116] T1 and L1 are measured in a cross-section cut at the center of the third direction of the main body 110 in the first and second directions. T1 is measured as the maximum dimension of the first conductive resin layer 131b in the second direction at the first connection portion A1, and L1 is measured as the outermost dimension in the second direction from the end of the plating 131c of the first strip portion B1 to the first external electrode 131 in the second direction.

[0117] The ESR is measured using an LCR meter based on the self-resonant frequency (SRF).

[0118] [Table 1]

[0119]

[0120]

[0121] As can be seen from Table 1, under the same sheet size conditions, by controlling T1 / L1 to 0.1 or less, it can be ensured that the ESR of the invention example is lower than that of test numbers 1*, 7*, 13*, 19* and 25*, respectively. In test numbers 1*, 7*, 13*, 19* and 25*, the organic layer at the connection point was not removed.

[0122] Furthermore, it can be seen that, under the same sheet size conditions, the ESR decreases as T1 / L1 decreases. However, test numbers 2, 8, 14, 20, and 26, with a T1 / L1 of 0.02, have the lowest ESR, but due to the thin conductive resin layer, there is a possibility of reduced flexural strength.

[0123] As described above, according to an exemplary embodiment, since the organic layer is disposed between the electrode layer and the plating layer of the strip portion of the outer electrode, and the conductive resin layer is disposed between the electrode layer and the plating layer of the connection portion of the outer electrode, the ESR can be reduced while ensuring flexural strength characteristics.

[0124] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a first inner electrode and a second inner electrode alternately disposed in a first direction and a dielectric layer, wherein the dielectric layer is disposed between the first inner electrode and the second inner electrode, and the body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; The first external electrode includes a first connecting portion disposed on the third surface and a first strip portion extending from the first connecting portion to the first surface, the second surface, the fifth surface and the sixth surface; as well as The second external electrode includes a second connecting portion disposed on the fourth surface and a second strip portion extending from the second connecting portion to the first surface, the second surface, the fifth surface, and the sixth surface. in, The first external electrode includes a first electrode layer connected to the first internal electrode, a first plating layer disposed on the first electrode layer, and a first conductive resin layer disposed between the first electrode layer and the first plating layer in the first connection portion. The multilayer electronic assembly further includes a first organic layer disposed between the first electrode layer and the first plating layer in the first strip portion. The second external electrode includes a second electrode layer connected to the second internal electrode, a second plating layer disposed on the second electrode layer, and a second conductive resin layer disposed between the second electrode layer and the second plating layer at the second connection portion. The multilayer electronic assembly further includes a second organic layer disposed between the second electrode layer and the second plating layer at the second strip portion. The first conductive resin layer and the second conductive resin layer are not overlapped with the first surface in the first direction.

2. The multilayer electronic component according to claim 1, wherein, The first organic layer is configured to cover the end of the first electrode layer at the first strip portion, and the second organic layer is configured to cover the end of the second electrode layer at the second strip portion.

3. The multilayer electronic component according to claim 2, wherein, The first organic layer is configured to extend beyond the end of the first coating of the first strip portion to cover a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface, and The second organic layer is configured to extend beyond the end of the second coating of the second strip portion to cover a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface.

4. The multilayer electronic component according to claim 1, wherein, The first organic layer and the second organic layer comprise organosilicon compounds.

5. The multilayer electronic component according to claim 4, wherein, The organosilicon compound has a polyfunctional alkoxysilane Si-(C n H 2n+1 It has a structure of 3 and includes the element N.

6. The multilayer electronic assembly according to claim 1, wherein, T1 / L1 is 0.1 or less, where T1 is the maximum dimension of the first conductive resin layer at the first connection in the second direction, and L1 is the outermost dimension in the second direction from the end of the first plating of the first strip to the first external electrode.

7. The multilayer electronic assembly according to claim 1, wherein, In a cross-section taken at the center of the third direction of the main body along the first and second directions, T1 / L1 is 0.1 or less, where T1 is the maximum dimension of the first conductive resin layer at the first connection in the second direction, and L1 is the outermost dimension in the second direction from the end of the first plating of the first strip to the first external electrode.

8. The multilayer electronic component according to claim 1, wherein, T1 / L1 is greater than or equal to 0.04 and less than or equal to 0.1, where T1 is the maximum dimension of the first conductive resin layer at the first connection portion in the second direction, and L1 is the outermost dimension in the second direction from the end of the first plating layer of the first strip portion to the first external electrode.

9. The multilayer electronic component according to claim 1, wherein, In a cross-section taken at the center of the third direction of the main body along the first and second directions, T1 / L1 is greater than or equal to 0.04 and less than or equal to 0.1, where T1 is the maximum dimension of the first conductive resin layer at the first connection portion along the second direction, and L1 is the outermost dimension in the second direction from the end of the first plating layer of the first strip portion to the first external electrode.

10. The multilayer electronic assembly according to claim 1, wherein, The first electrode layer and the second electrode layer comprise conductive metal and glass.

11. The multilayer electronic assembly according to claim 1, wherein, The first conductive resin layer and the second conductive resin layer comprise a conductive metal and a matrix resin.

12. The multilayer electronic assembly according to claim 11, wherein, The matrix resin includes epoxy resin.

13. The multilayer electronic assembly according to claim 1, wherein, The first coating and the second coating include a Ni coating and a Sn coating disposed on the Ni coating.

14. The multilayer electronic assembly according to claim 1, wherein, The first organic layer is configured to extend into a portion of the first connecting portion, and the second organic layer is configured to extend into a portion of the second connecting portion.

15. The multilayer electronic assembly according to claim 14, wherein, The first organic layer is spaced apart from the central portion of the first connector, and the second organic layer is spaced apart from the central portion of the second connector.

16. The multilayer electronic assembly according to claim 14, wherein, The first organic layer is disposed between the first conductive resin layer and the first electrode layer at the first connection portion, and The second organic layer is disposed between the second conductive resin layer and the second electrode layer at the second connection portion.

17. The multilayer electronic assembly according to claim 1, wherein, The first organic layer and the second organic layer are configured to extend to cover the entire area of ​​the first surface, the second surface, the fifth surface and the sixth surface where the first electrode layer and the second electrode layer are not disposed, and the first organic layer and the second organic layer are connected to each other.

18. The multilayer electronic assembly according to claim 1, wherein, The first organic layer is disposed between the first electrode layer and the first plating layer at the first strip portion and is in contact with the first electrode layer and the first plating layer. The second organic layer is disposed between the second electrode layer and the second plating layer at the second strip portion and is in contact with the second electrode layer and the second plating layer.

19. The multilayer electronic assembly according to claim 18, wherein, The first conductive resin layer is disposed at the first connection portion between the first electrode layer and the first plating layer and is in contact with the first electrode layer and the first plating layer. The second conductive resin layer is disposed at the second connection portion between the second electrode layer and the second plating layer and is in contact with the second electrode layer and the second plating layer.

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