A cleaning liquid supply device and a semiconductor cleaning apparatus

Abstract

The application provides a cleaning liquid supply device and a semiconductor cleaning equipment, which comprises a liquid storage cavity and a liquid supplement pipe. A heat exchange pipe is arranged in the liquid storage cavity, and the heat exchange pipe is at least partially immersed in the cleaning liquid in the liquid storage cavity. By arranging the heat exchange pipe in the liquid storage cavity and communicating with the liquid supplement pipe, and by at least partially immersing the heat exchange pipe in the cleaning liquid in the liquid storage cavity, when the cleaning liquid in the liquid supplement pipe flows into the liquid storage cavity from the heat exchange pipe when supplementing the cleaning liquid in the liquid storage cavity through the liquid supplement pipe, the cleaning liquid in the heat exchange pipe and the cleaning liquid in the liquid storage cavity exchange heat with each other when there is a temperature difference, so that the temperature of the cleaning liquid flowing into the liquid storage cavity from the heat exchange pipe can reach the temperature of the original liquid storage cavity in a short time, so as to ensure that the temperature of the cleaning liquid supplemented into the liquid storage cavity is constant. Only one liquid storage cavity is needed, so that the structure is simplified and waste is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a cleaning fluid supply device and semiconductor cleaning equipment. Background Technology

[0002] Semiconductor cleaning equipment includes nozzles for spraying cleaning fluid onto the wafer surface and a cleaning fluid supply device for supplying cleaning fluid to the nozzles. To ensure effective cleaning of the wafer surface, the temperature of the cleaning fluid sprayed from the nozzles needs to be kept relatively constant, while simultaneously ensuring an uninterrupted supply of cleaning fluid to the nozzles. Current cleaning fluid supply devices employ two sets of storage chambers and two sets of supply lines to guarantee a constant temperature and uninterrupted supply of cleaning fluid to the nozzles. When the cleaning fluid in one storage chamber is nearly depleted, the supply line to the nozzles is switched to the other storage chamber and supply line. To ensure a continuous supply to the nozzles, switching often occurs when only a small amount of cleaning fluid remains in one storage chamber. This method requires two storage chambers, pumps, filters, supply lines, etc., resulting in a complex structure and high cost. Furthermore, the need to switch when the cleaning fluid in the storage chamber is not depleted leads to waste of cleaning fluid. Summary of the Invention

[0003] This invention provides a cleaning fluid supply device and a semiconductor cleaning equipment, which facilitates the continuous and constant-temperature supply of cleaning fluid to the nozzles of the semiconductor cleaning equipment, while simplifying the structure of the cleaning supply device and reducing the waste of cleaning fluid.

[0004] In a first aspect, the present invention provides a cleaning fluid supply device for use in semiconductor cleaning equipment. The device includes a storage chamber for storing cleaning fluid and a replenishment pipe located outside and communicating with the storage chamber. A heat exchange tube is disposed within the storage chamber, one end of which is connected to the replenishment pipe, and the other end of which is located within the storage chamber to replenish the storage chamber with cleaning fluid. The heat exchange tube is at least partially immersed in the cleaning fluid within the storage chamber.

[0005] In the above-described scheme, a heat exchange tube is installed inside the storage chamber, with one end connected to a replenishment tube. The heat exchange tube is at least partially immersed in the cleaning fluid within the storage chamber. When cleaning fluid is replenished to the storage chamber through the replenishment tube, the cleaning fluid in the replenishment tube flows from the heat exchange tube into the storage chamber. Furthermore, as the cleaning fluid flows through the heat exchange tube, heat exchange occurs between the cleaning fluid in the heat exchange tube and the cleaning fluid in the storage chamber due to the temperature difference. This allows the temperature of the cleaning fluid flowing from the heat exchange tube into the storage chamber to reach the same level as the original temperature in the storage chamber within a short time, ensuring that the temperature of the cleaning fluid replenished into the storage chamber remains constant. Compared to the existing dual-chamber, dual-pipeline cleaning fluid supply device, the solution of this application only requires one storage chamber, thereby simplifying the equipment structure and reducing costs. Furthermore, during the supply process, the solution of this application can continuously replenish the storage chamber with new cleaning fluid through the replenishment pipe, so that the cleaning fluid in the storage chamber will not run out, eliminating the need to replace the storage chamber and preventing waste of cleaning fluid caused by replacing the storage chamber, thus reducing the waste of cleaning fluid.

[0006] In one specific implementation, the heat exchange tube is made of PFA plastic (tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer) or polytetrafluoroethylene to improve the heat exchange effect.

[0007] In one specific embodiment, the heat exchange tube includes at least one spiral tube immersed in a cleaning solution within the storage chamber, thereby increasing the surface area of ​​the heat exchange tube, reducing the temperature equilibrium time, and improving the heat exchange effect.

[0008] In one specific embodiment, multiple spiral tubes are immersed in the cleaning fluid within the storage chamber. These spiral tubes are arranged side-by-side within the storage chamber, with adjacent spiral tubes connected in series. One end of each spiral tube is connected to a replenishment pipe, while the other end remains within the storage chamber to replenish the cleaning fluid. This increases the surface area of ​​the heat exchange tubes and improves the heat exchange efficiency by increasing the number of spiral tubes.

[0009] In one specific embodiment, the heat exchange tube includes multiple U-shaped tubes immersed in cleaning fluid within a storage chamber. The multiple U-shaped tubes are stacked within the storage chamber, and the pipes of adjacent U-shaped tubes are connected in series. One end of each U-shaped tube is connected to a replenishment pipe, while the other end is located within the storage chamber to replenish the cleaning fluid. This increases the surface area of ​​the heat exchange tube and improves the heat exchange effect.

[0010] In one specific embodiment, the cleaning fluid supply device further includes a circulating outlet pipe disposed outside and communicating with the storage chamber, and a pump disposed outside the storage chamber, wherein the inlet of the pump is connected to the circulating outlet pipe. A heater is also disposed outside the storage chamber, and the inlet of the heater is connected to the outlet of the pump via a connecting pipe. A circulating inlet pipe is also disposed outside the storage chamber, communicating with the outlet of the heater, and is also connected to the storage chamber. By providing a heater and a circulation loop, the cleaning fluid in the storage chamber can be circulated and heated, maintaining a constant temperature for the cleaning fluid within the storage chamber.

[0011] In one specific embodiment, a filter is also connected between the outlet of the heater and the circulating inlet pipe. The inlet of the filter is connected to the outlet of the heating element via a connecting pipe, and the outlet of the filter is connected to the circulating inlet pipe. By installing a filter in the circulation loop, the cleaning fluid is filtered, reducing impurities in the cleaning fluid.

[0012] In one specific embodiment, the circulating inlet pipe is further provided with an outlet for supplying cleaning fluid to the nozzles of the semiconductor cleaning equipment, and a first valve is provided at the outlet. This ensures that the cleaning fluid supplied to the nozzles of the semiconductor cleaning equipment is at a constant temperature and is clean.

[0013] Secondly, the present invention also provides a semiconductor cleaning apparatus, which includes a nozzle for spraying cleaning fluid onto the wafer surface and any of the aforementioned cleaning fluid supply devices connected to the nozzle to supply cleaning fluid to the nozzle. By providing a heat exchange tube within a storage chamber, one end of the heat exchange tube being connected to a replenishment tube, and the heat exchange tube being at least partially immersed in the cleaning fluid within the storage chamber, when cleaning fluid is replenished to the storage chamber through the replenishment tube, the cleaning fluid in the replenishment tube flows from the heat exchange tube into the storage chamber. Furthermore, as the cleaning fluid flows through the heat exchange tube, heat exchange occurs between the cleaning fluid in the heat exchange tube and the cleaning fluid in the storage chamber when a temperature difference exists, thereby allowing the temperature of the cleaning fluid flowing from the heat exchange tube into the storage chamber to reach the same level as the original temperature in the storage chamber within a short period of time, ensuring that the temperature of the cleaning fluid replenished into the storage chamber remains constant. Compared to the existing dual-chamber, dual-pipeline cleaning fluid supply device, the solution of this application only requires one storage chamber, thereby simplifying the equipment structure and reducing costs. Furthermore, during the supply process, the solution of this application can continuously replenish the storage chamber with new cleaning fluid through the replenishment pipe, so that the cleaning fluid in the storage chamber will not run out, eliminating the need to replace the storage chamber and preventing waste of cleaning fluid caused by replacing the storage chamber, thus reducing the waste of cleaning fluid. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a cleaning fluid supply device provided in an embodiment of the present invention.

[0015] Figure label:

[0016] 10-Liquid storage chamber; 11-Replenishment pipe; 12-Heat exchange pipe

[0017] 13-Circulation outlet pipe 14-Circulation inlet pipe

[0018] 21-Liquid pump 22-Heater 23-Filter

[0019] 31-Outlet port 32-First valve Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] To facilitate understanding of the cleaning fluid supply device provided in this embodiment of the invention, the application scenario of the cleaning fluid supply device provided in this embodiment of the invention will be described first. This cleaning fluid supply device is used in semiconductor cleaning equipment to supply cleaning fluid to the nozzles in the semiconductor cleaning equipment. The cleaning fluid supply device will now be described in detail with reference to the accompanying drawings.

[0022] refer to Figure 1 The cleaning fluid supply device provided in this embodiment of the invention includes a storage chamber 10 for storing cleaning fluid, serving as a container for storing the cleaning fluid. When setting the storage chamber 10, a structure with a hollow cavity, such as a tank or shell, can be used to position the outer wall of the storage chamber 10. A replenishment pipe 11, communicating with the storage chamber 10, is also provided outside the storage chamber 10, through which cleaning fluid is replenished to the storage chamber 10. A valve can be installed at the replenishment pipe 11; when the valve is opened, the replenishment pipe 11 replenishes cleaning fluid to the storage chamber 10; when the valve is closed, the replenishment pipe 11 stops replenishing cleaning fluid to the storage chamber 10.

[0023] Continue to refer to Figure 1 A heat exchange tube 12 is installed inside the liquid storage chamber 10. One end of the heat exchange tube 12 is connected to the replenishment tube 11, and the other end is located inside the liquid storage chamber 10 to replenish the cleaning fluid into the liquid storage chamber 10. When the cleaning fluid is replenished into the liquid storage chamber 10 through the replenishment tube 11, the cleaning fluid in the replenishment tube 11 flows from the heat exchange tube 12 into the liquid storage chamber 10. Figure 1As shown, the heat exchange tube 12 is at least partially immersed in the cleaning fluid in the storage chamber 10, meaning the level of the cleaning fluid in the storage chamber 10 needs to be higher than the lowest point of the heat exchange tube 12, so that the outer wall of the heat exchange tube 12 has a portion in direct contact with the cleaning fluid in the storage chamber 10. When replenishing the cleaning fluid, the cleaning fluid flows from the replenishment pipe 11 into the heat exchange tube 12, and then flows through the heat exchange tube 12 into the storage chamber 10. As the cleaning fluid flows in the heat exchange tube 12, heat exchange occurs between the cleaning fluid in the heat exchange tube 12 and the cleaning fluid in the storage chamber 10 due to the temperature difference. This ensures that the temperature of the cleaning fluid flowing from the heat exchange tube 12 into the storage chamber 10 is more consistent with the original temperature in the storage chamber 10, thus maintaining a constant temperature for the cleaning fluid replenished into the storage chamber 10. For example, refer to... Figure 1 The temperature T1 of the cleaning fluid in the replenishment pipe 11 is generally 22-23℃, while the temperature T3 of the cleaning fluid in the storage chamber 10 is generally 25℃. When the cleaning fluid flows through the heat exchange pipe 12, the cleaning fluid in the storage chamber 10 conducts heat to the cleaning fluid in the heat exchange pipe 12 through the pipe wall, raising the temperature of the cleaning fluid in the heat exchange pipe 12 to a temperature similar to that in the storage chamber 10. The temperature T2 of the cleaning fluid flowing out of the heat exchange pipe 12 can be 24-25℃, making the temperature of the cleaning fluid flowing out of the heat exchange pipe 12 almost the same as that of the cleaning fluid in the storage chamber 10, thus heating the newly replenished cleaning fluid. Compared with the existing dual-chamber, dual-pipeline cleaning fluid supply device, the solution of this application only requires one storage chamber 10, thereby simplifying the structure. Furthermore, during the supply process, the solution of this application can continuously replenish the cleaning fluid to the storage chamber 10 through the replenishment pipe 11, so that the cleaning fluid in the storage chamber 10 will not be used up. Therefore, there is no need to replace the storage chamber 10, and the cleaning fluid will not be wasted due to the replacement of the storage chamber 10, thereby reducing the waste of cleaning fluid.

[0024] When determining the material of the heat exchange tube 12, the material of the heat exchange tube 12 can be PFA plastic or polytetrafluoroethylene, which are relatively easy to conduct heat, in order to improve the heat exchange effect.

[0025] When specifically configuring heat exchange tube 12, refer to... Figure 1The heat exchange tube 12 may include at least one spiral tube immersed in the cleaning fluid within the storage chamber 10. Using a spiral tube as the heat exchange tube 12 increases the heat exchange area due to its special shape, thereby increasing the surface area of ​​the heat exchange tube 12, reducing the temperature equilibrium time, and improving the heat exchange effect. When determining the number of spiral tubes, the number immersed in the cleaning fluid can be one, or any value of two, three, four, five, six, or more than two. When placing multiple spiral tubes in the storage chamber 10, they can be arranged side-by-side, with adjacent spiral tubes connected in series. One end of each spiral tube is connected to the replenishment pipe 11, and the other end is located within the storage chamber 10 to replenish the cleaning fluid. This allows for the placement of more spiral tubes in the storage chamber 10, increasing the surface area of ​​the heat exchange tube 12 and improving the heat exchange effect.

[0026] It should be noted that the arrangement of the heat exchange tubes 12 is not limited to the spiral tube arrangement shown above. Other arrangements are also possible. For example, multiple U-shaped tubes can be used as heat exchange tubes 12. In this case, the heat exchange tubes 12 immersed in the cleaning fluid in the storage chamber 10 are multiple U-shaped tubes. When placing multiple U-shaped tubes in the storage chamber 10, the multiple U-shaped tubes can be stacked in the storage chamber 10, and the pipes of two adjacent U-shaped tubes are connected in series. One end of the multiple U-shaped tubes is connected to the replenishment pipe 11, and the other end is located in the storage chamber 10 to replenish the cleaning fluid into the storage chamber 10. This allows for the placement of more U-shaped tubes in the storage chamber 10, increasing the surface area of ​​the heat exchange tubes 12 and improving the heat exchange effect.

[0027] Continue to refer to Figure 1 Alternatively, a circulating heating device can be installed outside the liquid storage chamber 10 to circulate and heat the cleaning fluid in the liquid storage chamber 10. For specific installation details, please refer to [reference needed]. Figure 1 A circulation outlet pipe 13 and a pump 21 are provided outside the storage chamber 10, both communicating with the storage chamber 10. The inlet of the pump 21 is connected to the circulation outlet pipe 13. A heater 22 is also provided outside the storage chamber 10, with its inlet connected to the outlet of the pump 21 via a connecting pipe. A circulation inlet pipe 14 is also provided outside the storage chamber 10, communicating with the outlet of the heater 22 and also connected to the storage chamber 10. The pump 21 draws the cleaning fluid from the storage chamber 10 out of the circulation outlet pipe 13 and then delivers it to the heater 22 for heating. After being heated by the heater 22, the cleaning fluid is then delivered back to the storage chamber 10 through the circulation inlet pipe 14. By providing the heater 22 and the circulation loop, the cleaning fluid in the storage chamber 10 can be circulated and heated, maintaining a constant temperature.

[0028] like Figure 1The cleaning fluid supply device shown can also include a filter 23 connected between the outlet of the heater 22 and the circulating inlet pipe 14. The inlet of the filter 23 is connected to the outlet of the heating element via a connecting pipe, and the outlet of the filter 23 is connected to the circulating inlet pipe 14. By installing the filter 23 in the circulation loop, after the cleaning fluid is heated by the heater 22, it flows into the filter 23 for filtration, and then is transported to the circulating inlet pipe 14 and flows into the storage pipe, reducing impurities in the cleaning fluid.

[0029] When supplying cleaning fluid from the cleaning fluid supply device to the nozzles in the semiconductor cleaning equipment, refer to Figure 1 An output port 31 for supplying cleaning fluid to the nozzles of the semiconductor cleaning equipment can be provided on the circulating inlet pipe 14, and a first valve 32 is provided at the output port 31. In application, when cleaning fluid needs to be supplied to the nozzles, the first valve 32 is opened, connecting the output port 31 and the nozzles in the semiconductor cleaning equipment through a connecting pipe, allowing the cleaning fluid to be delivered from the output port 31 to the nozzles. Because the cleaning fluid flows through the heater 22 and the filter 23 before being output from the output port 31 to the nozzles, the cleaning fluid supplied to the nozzles of the semiconductor cleaning equipment is kept at a constant temperature and is clean. When it is not necessary to supply cleaning fluid to the nozzles, the first valve 32 can be closed, allowing the circulating loop to heat the cleaning fluid and maintain a constant temperature.

[0030] By installing a heat exchange tube 12 inside the storage chamber 10, with one end of the heat exchange tube 12 connected to the replenishment tube 11, and the heat exchange tube 12 being at least partially immersed in the cleaning fluid inside the storage chamber 10, when replenishing the storage chamber 10 with cleaning fluid through the replenishment tube 11, the cleaning fluid in the replenishment tube 11 flows from the heat exchange tube 12 into the storage chamber 10. Furthermore, as the cleaning fluid flows through the heat exchange tube 12, heat exchange occurs between the cleaning fluid in the heat exchange tube 12 and the cleaning fluid in the storage chamber 10 when a temperature difference exists. This allows the temperature of the cleaning fluid flowing from the heat exchange tube 12 into the storage chamber 10 to reach the same temperature as the original temperature in the storage chamber 10 within a short time, ensuring that the temperature of the cleaning fluid replenished into the storage chamber 10 remains constant. Compared with the existing dual-chamber, dual-pipeline cleaning fluid supply device, the solution of this application only requires one storage chamber 10, thereby simplifying the equipment structure and reducing costs. Moreover, during the supply process, the solution of this application can continuously replenish the cleaning fluid to the storage chamber 10 through the replenishment pipe 11, so that the cleaning fluid in the storage chamber 10 will not be used up. Therefore, there is no need to replace the storage chamber 10, which will not cause waste of cleaning fluid due to the replacement of the storage chamber 10, thereby reducing the waste of cleaning fluid.

[0031] In addition, embodiments of the present invention also provide a semiconductor cleaning apparatus, see reference. Figure 1The cleaning equipment includes a nozzle for spraying cleaning fluid onto the wafer surface and any one of the aforementioned cleaning fluid supply devices connected to the nozzle to supply cleaning fluid to the nozzle. A heat exchange tube 12 is installed in the storage chamber 10, with one end of the heat exchange tube 12 connected to a replenishment tube 11. The heat exchange tube 12 is at least partially immersed in the cleaning fluid within the storage chamber 10. When cleaning fluid is replenished to the storage chamber 10 through the replenishment tube 11, the cleaning fluid in the replenishment tube 11 flows from the heat exchange tube 12 into the storage chamber 10. Furthermore, as the cleaning fluid flows through the heat exchange tube 12, heat exchange occurs between the cleaning fluid in the heat exchange tube 12 and the cleaning fluid in the storage chamber 10 when a temperature difference exists. This allows the temperature of the cleaning fluid flowing from the heat exchange tube 12 into the storage chamber 10 to reach the original temperature in the storage chamber 10 within a short time, ensuring that the temperature of the cleaning fluid replenished into the storage chamber 10 remains constant. Compared with the existing dual-chamber, dual-pipeline cleaning fluid supply device, the solution of this application only requires one storage chamber 10, thereby simplifying the equipment structure and saving costs. Moreover, during the supply process, the solution of this application can continuously replenish the cleaning fluid to the storage chamber 10 through the replenishment pipe 11, so that the cleaning fluid in the storage chamber 10 will not be used up. Therefore, there is no need to replace the storage chamber 10, which will not cause waste of cleaning fluid due to the replacement of the storage chamber 10, thereby reducing the waste of cleaning fluid.

[0032] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cleaning fluid supply device, used in semiconductor cleaning equipment, characterized in that, include: A reservoir for storing cleaning fluid; A replenishment pipe located outside and connected to the liquid storage cavity; A heat exchange tube is installed in the liquid storage chamber. One end of the heat exchange tube is connected to the liquid replenishment tube, and the other end is located in the liquid storage chamber to replenish the liquid storage chamber with cleaning liquid. The heat exchange tube is at least partially immersed in the cleaning liquid in the liquid storage chamber. When the cleaning liquid flows in the heat exchange tube, the cleaning liquid in the heat exchange tube and the cleaning liquid in the liquid storage chamber will exchange heat with each other when there is a temperature difference. A circulating outlet pipe is disposed outside the liquid storage chamber and communicates with the liquid storage chamber; A pump is installed outside the storage chamber, and the inlet of the pump is connected to the circulation outlet pipe. A heater is installed outside the liquid storage chamber, and the inlet of the heater is connected to the outlet of the pump through a connecting pipe. A circulating inlet pipe is disposed outside the liquid storage chamber and communicates with the liquid outlet of the heater, and the circulating inlet pipe is also communicated with the liquid storage chamber; A filter is also connected between the outlet of the heater and the circulating inlet pipe. The inlet of the filter is connected to the outlet of the heater through a connecting pipe, and the outlet of the filter is connected to the circulating inlet pipe. An output port for supplying cleaning fluid to the nozzle of the semiconductor cleaning equipment is also provided on the circulating inlet pipe, and a first valve is provided at the output port; The heat exchange tube comprises multiple spiral tubes immersed in cleaning fluid within the storage chamber. These spiral tubes are arranged side-by-side within the storage chamber, with adjacent spiral tubes connected in series. One end of each spiral tube is connected to the replenishment tube, and the other end is located within the storage chamber to replenish cleaning fluid. Alternatively, the heat exchange tube comprises multiple U-shaped tubes immersed in cleaning fluid within the storage chamber. These U-shaped tubes are stacked within the storage chamber, with adjacent U-shaped tubes connected in series. One end of one of the U-shaped tubes is connected to the replenishment tube, and the other end is located within the storage chamber to replenish cleaning fluid.

2. The cleaning fluid supply device as described in claim 1, characterized in that, The heat exchange tube is made of PFA plastic or polytetrafluoroethylene.

3. A semiconductor cleaning device, characterized in that, include: Nozzles used to spray cleaning fluid onto the wafer surface; A cleaning fluid supply device as described in any one of claims 1 to 2, which is connected to the nozzle to supply cleaning fluid to the nozzle.

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