Light-emitting module and its manufacturing method

Abstract

The present invention provides a light-emitting module that suppresses scattering of light emitted from a light source and has excellent reliability, and a method for manufacturing the light-emitting module. The light-emitting module (100) includes: a plurality of light-emitting elements (1); a first substrate (10) having an element mounting region (13) for mounting the light-emitting elements, and having a plurality of first terminals (110) arranged along the element mounting region on the outer side of the element mounting region; a second substrate (20) having a substrate mounting region (23) for mounting the first substrate, and having a plurality of second terminals (120) arranged along the substrate mounting region on the outer side of the substrate mounting region; a plurality of leads (130) connected to the first terminals and the second terminals and arranged along the outer edge of the first substrate; a light-shielding covering member (40) covering the plurality of leads at a position on the outer side of the element mounting region; and a light-transmitting first protrusion (41) arranged along the element mounting region between the element mounting region and the first terminals and connected to the covering member.

Description

Technical Field

[0001] This disclosure relates to light-emitting modules and methods for manufacturing light-emitting modules. Background Technology

[0002] Currently, light-emitting modules using multiple light-emitting elements are used as light sources for vehicle-mounted applications or projectors. When using a light-emitting module as a light source, for example, a structure is adopted in which light is emitted from the light source through a lens. As such a light-emitting module, a structure is known in which multiple light-emitting elements are arranged on a sub-support, the sub-support is further mounted on a wiring board, and the sub-support and the wiring board are connected by leads (e.g., Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-212301 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The objective of this disclosure is to provide a light-emitting module and a method for manufacturing the light-emitting module that suppresses scattering of light emitted from a light source and has excellent reliability.

[0008] Technical solutions for solving the problem

[0009] This disclosure provides a light-emitting module comprising: a plurality of light-emitting elements; a first substrate having an element mounting region on its upper surface where the plurality of light-emitting elements are mounted, and a plurality of first terminals disposed along the element mounting region on an upper surface further outward of the element mounting region; a second substrate having a substrate mounting region on its upper surface where the first substrate is mounted, and a plurality of second terminals disposed along the substrate mounting region on an upper surface further outward of the substrate mounting region; a plurality of leads connected to the first terminals and the second terminals and arranged along the outer edge of the first substrate; a light-shielding covering member covering the plurality of leads at a position further outward of the element mounting region; and a light-transmitting first protrusion disposed along the element mounting region between the element mounting region and the first terminals and in contact with the covering member.

[0010] This disclosure provides a method for manufacturing a light-emitting module, comprising: an element placement step of placing a plurality of light-emitting elements in an element placement area of ​​a first substrate; a substrate placement step of placing the first substrate in a substrate placement area of ​​a second substrate; a lead connection step of connecting a plurality of first terminals disposed at a position outside the element placement area of ​​the first substrate and a plurality of second terminals disposed at a position outside the substrate placement area of ​​the second substrate by means of leads; a first protrusion placement step of placing a light-transmitting first protrusion along the element placement area between the element placement area and the first terminals; and a covering member placement step of placing a light-shielding covering member connected to the first protrusion and covering the leads outside the first protrusion.

[0011] Invention Effects

[0012] According to embodiments of the present disclosure, a light-emitting module that suppresses scattered light and has excellent reliability, and a method for manufacturing the same, can be provided. Attached Figure Description

[0013] Figure 1 This is a perspective view schematically illustrating an embodiment of a light-emitting module.

[0014] Figure 2 This is a top view schematically illustrating an embodiment of the light-emitting module.

[0015] Figure 3 yes Figure 2 A cross-sectional view at line III-III.

[0016] Figure 4 yes Figure 2 A sectional view of the portion at line IV-IV.

[0017] Figure 5 yes Figure 2 A cross-sectional view at the V-V line.

[0018] Figure 6 yes Figure 2 A sectional view at line VI-VI.

[0019] Figure 7 This is a top view schematically illustrating the first protrusion, the second protrusion, and the lead wire in the light-emitting module of an embodiment.

[0020] Figure 8 This is a flowchart illustrating the manufacturing method of the light-emitting module according to the embodiment.

[0021] Figure 9A This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0022] Figure 9BThis is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0023] Figure 9C This is an enlarged top view illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0024] Figure 9D This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0025] Figure 9E This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0026] Figure 9F This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0027] Figure 9G This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0028] Figure 9H This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment.

[0029] Figure 10A This is a cross-sectional view schematically illustrating a first modified example of the implementation.

[0030] Figure 10B This is a cross-sectional view schematically illustrating a second variation of the implementation.

[0031] Figure 10C This is a cross-sectional view schematically illustrating a third variation of the implementation method.

[0032] Figure 11 This is a flowchart illustrating the manufacturing method of the light-emitting module of the first modified example.

[0033] Figure 12 This is a cross-sectional view schematically illustrating a fourth variation of the implementation.

[0034] Figure 13 This is a top view schematically illustrating another structure of the implementation method.

[0035] Figure 14 This is a top view schematically illustrating another structure of the implementation method.

[0036] Figure 15 This is a schematic top view of the light-emitting module that acquires experimental data.

[0037] Figure 16 It is an enlarged representation Figure 15 A cross-sectional view of the periphery of the first convex part.

[0038] Figure 17AIt is a graph representing the relative brightness of the light-emitting surface of the light-emitting module.

[0039] Figure 17B It is Figure 17A A magnified portion of the chart. Detailed Implementation

[0040] Hereinafter, the light-emitting module of the embodiment will be described with reference to the accompanying drawings. Furthermore, for the purpose of clarification, the dimensions or positional relationships of the components shown in the drawings are sometimes exaggerated. Also, the dimensions or arrangement of the components are not strictly consistent in the top view and the corresponding sectional view. To avoid making the drawings overly complex, illustrations of some elements are sometimes omitted, or end views showing only cross-sections are used as sectional views. Moreover, in the following description, up, down, left, right, front, and back are relative and do not represent absolute directions. Furthermore, the same names and symbols generally represent the same or homogeneous components, and detailed descriptions are sometimes appropriately omitted. Additionally, for the embodiment, "enclosing" or "covering" is not limited to direct contact, but also includes indirect coverage via, for example, other components. In this specification, top view refers to observation from the light-emitting surface of the light-emitting module.

[0041] <First Implementation>

[0042] [Structure of the LED Module]

[0043] Reference Figures 1 to 7 The structure of the light-emitting module in the embodiment will be described.

[0044] Figure 1 This is a perspective view schematically representing the overall structure of the light-emitting module in an embodiment. Figure 2 This is a top view schematically illustrating the overall implementation of the light-emitting module. Figure 3 yes Figure 2 A cross-sectional view at line III-III. Figure 4 yes Figure 2 A cross-sectional view at line IV-IV. Figure 5 yes Figure 2 A cross-sectional view at the V-V line. Figure 6 yes Figure 2 A sectional view at line VI-VI. Figure 7 This is a top view schematically illustrating the first protrusion, the second protrusion, and the lead wire in the light-emitting module of an embodiment.

[0045] The light-emitting module 100 includes: a plurality of light-emitting elements 1; a first substrate 10 having an element mounting region 13 on its upper surface where the plurality of light-emitting elements 1 are mounted, and a plurality of first terminals 110 disposed along the element mounting region 13 on its upper surface further outward than the element mounting region 13; a second substrate 20 having a substrate mounting region 23 on its upper surface where the first substrate 10 is mounted, and a plurality of second terminals 120 disposed along the substrate mounting region 23 on its upper surface further outward than the substrate mounting region 23; a plurality of leads 130 connected to the first terminals 110 and the second terminals 120 and arranged along the outer edge of the first substrate; a light-shielding covering member 40 covering the plurality of leads 130 at a position further outward than the element mounting region 13; and a light-transmitting first protrusion disposed along the element mounting region 13 between the element mounting region 13 and the first terminals 110 and in contact with the covering member 40. The covering member 40 is disposed across the upper surface of the first substrate 10 and the upper surface of the second substrate 20. The first protrusion 41 is disposed in a frame shape on the first substrate 10, for example, surrounding a plurality of light-emitting elements 1.

[0046] Furthermore, the light-emitting module 100 may have a reflective member 7 on the element mounting area 13 on the first substrate 10, which exposes the upper surface of a plurality of light-emitting elements 1 and covers the side surface. Moreover, the light-emitting module may have a wavelength conversion member 5 covering the upper surface of the plurality of light-emitting elements 1.

[0047] The light-emitting module 100 mainly includes multiple light-emitting elements 1, a first substrate 10 on which the multiple light-emitting elements 1 are mounted, a second substrate 20 on which the first substrate 10 is mounted, leads 130, namely first leads 31 and second leads 32, electrically connecting the first substrate 10 and the second substrate 20, a covering member 40 covering the leads 130, a first protrusion 41 disposed on the first substrate 10 and connected to the covering member 40, a second protrusion 42 disposed on the second substrate and connected to the covering member 40, a reflective member 7 covering the side of the light-emitting elements 1 on the first substrate 10, and a wavelength conversion member 5 covering the upper surface of the light-emitting elements 1.

[0048] The following is an explanation of each structure.

[0049] (First substrate)

[0050] The first substrate 10 includes a flat support member and wiring disposed on the upper surface of the support member. The first substrate 10 has a component mounting region 13 on its upper surface where multiple light-emitting elements are mounted, and wiring is disposed in the component mounting region 13 to form a predetermined circuit. The first substrate has multiple first terminals 110 as wiring disposed on the upper surface outside the component mounting region, and the first terminals 110 are electrically connected to the wiring disposed in the component mounting region. The first substrate 10 is a semiconductor substrate, such as silicon, and the area on the upper surface where no wiring is disposed is covered by an insulating film. The wiring may also be disposed inside the support member or on its lower surface. For example, the first substrate 10 can be an integrated circuit (IC) substrate that integrates circuitry for driving and controlling multiple light-emitting elements.

[0051] Multiple light-emitting elements 1 are arranged in a matrix in the element placement area 13. As an example, the element placement area 13 can be set as a rectangular area when viewed from above. The element placement area 13 is rectangular in this case, and the first terminals 110 are arranged in a row along the opposite long sides of the rectangle, with the element placement area 13 in between.

[0052] The first terminal 110 includes, on the outer side of the component mounting area 13, a plurality of first external connection terminals 11 arranged in a row along one long side of the rectangular component mounting area 13, and a plurality of second external connection terminals 12 arranged in a row along another long side opposite to the first long side. The first external connection terminals 11 are terminals that connect to one end of the first lead 31. The second external connection terminals 12 are terminals that connect to one end of the second lead 32. Here, as an example, each of the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12 is generally rectangular in shape, spaced apart from each other, and arranged in a row along the long side of the component mounting area 13. Furthermore, as an example, the first external connection terminals 11 are aligned at equal intervals. The interval between the alignment of the first external connection terminals 11 and the second external connection terminals 12 can be set to 20 μm or more and 100 μm or less. The interval between the alignment of the first external connection terminals 11 and the interval between the alignment of the second external connection terminals 12 can be the same or different.

[0053] Here, as an example, the first substrate 10 has a plurality of first drive terminals 15 for processing drive signals for turning on or off the light-emitting element 1. The first drive terminals 15 can be arranged alternately with the first external connection terminals 11 in the same row. The third lead 33, which will be described later, is connected to the first drive terminal 15.

[0054] In addition, multiple light-emitting elements 1 are arranged in a matrix on the first substrate 10 and electrically connected to any one of the first terminals (i.e., the first external connection terminal 11 and the second external connection terminal 12). The multiple light-emitting elements 1 can also be grouped in a predetermined number and connected in series or in parallel with the first terminal.

[0055] Wiring can be formed using metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni, or their alloys. Such wiring can be formed through electroplating, electroless plating, vapor deposition, sputtering, and other methods.

[0056] (Second substrate)

[0057] The second substrate 20 includes a flat substrate and wiring disposed on at least the upper surface of the substrate. The second substrate 20 has a substrate mounting region 23 on which the first substrate 10 is mounted, and a second terminal 120 is provided on the upper surface further outward from the substrate mounting region 23.

[0058] The substrate mounting region 23 is the area where the first substrate 10 is mounted via a bonding member. This substrate mounting region 23 is configured to have an area equal to the top view shape of the first substrate 10. If the first substrate 10 is rectangular in top view, the substrate mounting region 23 can also be rectangular. Here, the second terminal 120 includes a first lead connection terminal 21 connected to the first external connection terminal 11 via a lead and a second lead connection terminal 22 connected to the second external connection terminal 12 via a lead. The first lead connection terminal 21 and the second lead connection terminal 22 are disposed on the second substrate 20 across the substrate mounting region 23.

[0059] Multiple first lead connection terminals 21 are arranged in a row along one long side of the rectangular substrate mounting area 23 on the outer side of the substrate mounting area 23. The first lead connection terminal 21 is a terminal that connects to the other end of the first lead 31, which is connected to the first external connection terminal 11 at one end.

[0060] Multiple second lead connection terminals 22 are arranged in a row along the other long side of the rectangular substrate mounting area 23 (i.e., the side opposite to the aforementioned long side, separated by the substrate mounting area 23). The second lead connection terminals 22 are terminals that connect one end of a second lead 32 that is connected to the second external connection terminal 12. Here, as an example, each of the first lead connection terminals 21 and the second lead connection terminals 22 is approximately rectangular in shape, spaced apart from each other, and arranged in a row along the substrate mounting area 23.

[0061] The alignment spacing between the first lead connection terminal and the second lead connection terminal 22 can be set to be between 50μm and 200μm. The alignment spacing between the first lead connection terminal 21 and the second lead connection terminal 22 can be the same or different.

[0062] The second terminal can be formed, for example, using the same material and forming method as the wiring of the first substrate 10 described.

[0063] Here, as an example, the second substrate 20 has a plurality of second driving terminals 16 on its upper surface for driving signals that process the lighting or extinguishing of the light-emitting element 1. The second driving terminals 16 are, for example, disposed on the upper surface inside the first lead connection terminal (i.e., on the substrate mounting area side). The third lead 33, which will be described later, is connected to the second driving terminal 16.

[0064] The substrate is preferably made of a material with high heat dissipation, and more preferably a material with high light-shielding properties and substrate strength. Specifically, examples include ceramics such as alumina, aluminum nitride, and mullite; resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA); and composite materials composed of resin and metal or ceramic. The substrate can also be a flat substrate or a substrate with a cavity on its upper surface. In this case, the second substrate 20 can use the bottom of the cavity as a substrate mounting area and mount the first substrate 10 within the cavity.

[0065] The second substrate 20 may also have wiring for mounting the first substrate 10 on the surface of the substrate mounting area 23. The first substrate 10 and the second substrate 20 can be joined by bonding materials such as Ag sintered body, solder, and adhesive resin.

[0066] (lead)

[0067] As the lead 130, conductive leads made of metals such as gold, copper, platinum, and aluminum, and / or alloys containing at least these metals, can be used. Gold, which has excellent thermal resistance, is particularly preferred. In terms of lead diameter, examples include 15 μm or more and 50 μm or less. Furthermore, the lead 130 includes a first lead and a second lead connected to the first and second terminals, and a third lead for processing a driving signal for lighting or extinguishing the light-emitting element 1. The third lead 33 is connected between the first driving terminal 15 disposed on the first substrate 10 and the second driving terminal 16 disposed on the second substrate 20. The first lead, second lead, and third lead 33 differ only in length and can each be formed from identical components.

[0068] The lead 130 can be configured to span the long side of the first substrate 10, which is generally rectangular when viewed from above, for example, to be approximately orthogonal to the long side.

[0069] Furthermore, among the plurality of first leads 31 arranged in a column, the first lead 31 located in the center of the column is configured, as described above, to be approximately orthogonal to the long side of the first substrate 10 when viewed from above, and the first leads 31 located at the ends can also be configured to be inclined relative to the long side of the first substrate 10 when viewed from above. The second lead 32 is configured similarly.

[0070] The spacing between the alignment of multiple first leads 31 can be the same or different. The spacing between the alignment of the first leads 31 can be set to be between 20μm and 100μm. The spacing between the alignment of the second leads 32 can be the same or different. The spacing between the alignment of the second leads 32 can be set to be between 20μm and 100μm.

[0071] (Light-emitting element)

[0072] Regarding the light-emitting element 1, for example, its shape is generally rectangular when viewed from above, and it includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light-emitting element 1 has positive and negative electrodes on the same side, with the surface containing the electrodes serving as the lower surface, and is flip-chip mounted on the first substrate 10. In this case, the upper surface opposite to the surface where the electrodes are disposed becomes the main light-extracting surface of the light-emitting element 1. Furthermore, in the light-emitting module 100, the light-emitting elements 1 are aligned and mounted on the first substrate 10 at predetermined intervals along a matrix direction. The size or number of light-emitting elements 1 used can be appropriately selected depending on the desired form of the light-emitting module. Preferably, smaller light-emitting elements 1 are mounted in greater density. This allows for control of the illumination range with a greater number of divisions, enabling its use as a light source in a high-resolution lighting system. For example, 1,000 to 20,000 light-emitting elements 1 with sides of 40 to 100 μm, which are rectangular in shape when viewed from above, can be arranged in a matrix to form a rectangle.

[0073] The light-emitting element 1 can be selected from elements of any wavelength. For example, as a blue or green light-emitting element 1, it can be selected to use ZnSe or nitride semiconductors (In). X Al Y Ga 1－X-Y The light-emitting element 1 can be a GaP element (where N ≤ X, 0 ≤ Y, X + Y ≤ 1). Alternatively, semiconductors represented by GaAlAs and AlInGaP can be used as the red light-emitting element 1. Furthermore, semiconductor light-emitting elements made of other materials can also be used. The composition or emission color of the light-emitting element 1 can be appropriately selected according to the purpose.

[0074] (Jointing components)

[0075] In addition, such as Figure 6As shown, the light-emitting element 1 is bonded to the wiring of the element mounting region 13 disposed on the first substrate 10 via a conductive bonding member. When the light-emitting element 1 is flip-chip mounted on the first substrate 10, bumps made of metal materials such as Au, Ag, Cu, and Al can be used as bonding members. Alternatively, solder such as AuSn alloys or Sn-based lead-free solder can be used as bonding members. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by reflow soldering. Alternatively, a conductive adhesive material containing conductive particles in resin can be used as a bonding member. The bonding between the light-emitting element 1 and the first substrate 10 can also be formed by plating. For example, copper can be used as a material.

[0076] Alternatively, the connection between the light-emitting element 1 and the first substrate 10 can be achieved by directly connecting the electrodes of the light-emitting element 1 and the wiring of the first substrate 10 without using a connection component.

[0077] (Reflective component)

[0078] like Figure 6 As shown, the reflective component 7 is a component that covers the upper surface of the first substrate 10 and the side surface of the light-emitting element 1. The upper surface of the light-emitting element 1 is exposed through the reflective component 7. The reflective component 7 may also cover the area between the lower surface of the light-emitting element 1 and the first substrate 10. The reflective component 7 can reflect light emitted from the side surface of the light-emitting element 1 and cause it to be emitted from the upper surface of the light-emitting surface of the light-emitting module 100, i.e., the wavelength conversion component 5. Therefore, the light extraction efficiency of the light-emitting module 100 can be improved. In addition, when the light-emitting element 1 is individually lit, the boundary between the light-emitting area and the non-light-emitting area can be made clear. As a result, the contrast between the light-emitting area and the non-light-emitting area is improved. Furthermore, the reflective component 7 may be disposed separately from the covering component 40 (first protrusion 41) or disposed in contact with the covering component 40.

[0079] Furthermore, the reflective component 7 is preferably made of a soft resin with low elasticity and excellent shape conformability. Resin materials with good transmittance and insulation properties, such as thermosetting resins like epoxy resin and silicone resin, can be appropriately used as the material for the reflective component 7. Additionally, the reflective component 7 is preferably made of a white resin containing reflective particles in the resin that forms the matrix. Reflective materials such as titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass fillers can be appropriately used. Furthermore, the reflective component 7 may also contain light-absorbing materials such as carbon black and graphite.

[0080] (Wavelength conversion component)

[0081] The wavelength conversion component 5 covers the upper surface of multiple light-emitting elements 1. The wavelength conversion component 5 also includes the upper surface of the multiple light-emitting elements 1 and the upper surface of the reflective component. The upper surface of the wavelength conversion component 5 constitutes the light-emitting surface of the light-emitting module 100. The wavelength conversion component 5 is capable of performing wavelength conversion on at least a portion of the light emitted from the light-emitting elements 1 and extracting it to the outside.

[0082] The wavelength conversion component 5 is roughly rectangular when viewed from above and is configured to enclose multiple light-emitting elements 1.

[0083] Regarding the wavelength conversion component 5, it can be disposed on the light-emitting element 1 by means of sheet or plate processing, or it can be coated onto the light-emitting element 1 in layers by means of spraying or the like. Alternatively, it can be formed by means of injection molding, transfer molding, compression molding or the like using molds.

[0084] Examples of wavelength conversion components include sintered phosphor bodies or substances containing phosphor powder in a base material such as resin, glass, or other inorganic materials. Transparent materials such as epoxy resin, silicone resin, resins mixed with these, or glass can be used as the base material. The thickness of the wavelength conversion component 5 can be set to, for example, approximately 20 μm to 100 μm. Furthermore, the wavelength conversion component 5 is formed to cover the entire upper surface of the plurality of light-emitting elements 1. Additionally, the wavelength conversion component 5 extends to a position abutting against the first protrusion 41 described later.

[0085] As a phosphor, yttrium-aluminum-garnet phosphors (e.g., Y3(Al,Ga)5O) can be used. 12 Ce), lutetium-aluminum-garnet phosphors (e.g., Lu3(Al,Ga)5O) 12 Ce), terbium-aluminum-garnet phosphors (e.g., Tb3(Al,Ga)5O 12 Ce), β-series thionolites (e.g., (Si,Al)3(O,N)4:Eu), and α-series thionolites (e.g., Ca(Si,Al)). 12 (O, N) 16 Nitride-based phosphors such as Eu, CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), fluoride-based phosphors such as KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si,Al)F6:Mn) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), perovskite-structured phosphors (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2, or AgInSe2), etc.

[0086] (Covered components)

[0087] The covering member 40 is a light-shielding resin that covers the leads 130 (specifically, the first lead 31 and the second lead 32) at a position outside the component mounting region 13. Furthermore, as an example, the covering member 40 covers the first lead 31 and the second lead 32 and is arranged around the component mounting region 13 in a frame-like shape when viewed from above. The covering member 40 is configured to contact the first protrusion described later. Additionally, the covering member 40 also covers the third lead 33. The covering member 40 is disposed spaced apart from the wavelength conversion member 5.

[0088] The distance between the reflective component 7 and the covering component 40 is preferably 100 μm or more and 500 μm or less. The distance between the wavelength conversion component 5 and the covering component 40 may be the same as or different from the distance between the reflective component 7 and the covering component 40.

[0089] Furthermore, the frame-shaped covering member 40, which is generally rectangular when viewed from above, has a wider area on its long side than on its short side. Moreover, the height of the covering member 40 (i.e., the distance from the upper surface of the second substrate 20 to the upper surface of the covering member 40) is configured to be highest directly above the top of the lead 130 (here, the ring top of the lead). In other words, the covering member 40 is configured such that its top 40a overlaps with the top of the lead 130. Furthermore, the position of the top 40a of the covering member 40 is configured to be above the top 41a of the first protrusion 41, which will be described later.

[0090] Examples of light-shielding coating components 40 include resins containing light-shielding fillers. Resins used as the base material include, for example, silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, and acrylic resins. Light-shielding fillers include light-absorbing substances such as pigments, carbon black, and graphite, as well as reflective substances similar to those contained in the aforementioned reflective components. Specifically, examples include white resins with excellent reflectivity, black resins with excellent light absorption, and gray resins with both reflectivity and light absorption. Furthermore, the coating component 40 may be constructed by stacking multiple layers of these resins. Considering the degradation of the resin due to light absorption, the coating component 40 preferably uses a white resin that is reflective at least on its outermost surface.

[0091] (First convex part, second convex part)

[0092] The light-emitting module has a first light-transmitting protrusion on the first substrate 10 between the element placement region 13 and the first terminal 110, which is disposed along the element placement region 13 and in contact with the covering member 40. Furthermore, the light-emitting module has a second protrusion on the upper surface of the second substrate 20, disposed further outward than the second terminal 120 and in contact with the covering member 40. That is, the covering member 40 extends from the upper surface of the first substrate 10 to the upper surface of the second substrate 20 and is disposed between the first and second protrusions.

[0093] The coating member 40 is disposed between a first protrusion 41 arranged on the first substrate 10 in a manner surrounding the element mounting region 13 and a second protrusion 42 arranged on the second substrate 20 in a manner surrounding the substrate mounting region 23. This arrangement of the coating member 40 can be formed by supplying uncured resin constituting the coating member 40 into the frame surrounded by the first protrusion 41 and the second protrusion 42. In other words, the first protrusion 41 and the second protrusion 42 can be used as dams to impede the flow of uncured resin when supplying the coating member 40.

[0094] The first protrusion 41 and the second protrusion 42 can be set to a predetermined height by setting multiple layers of uncured resin to overlap along the height direction. For example, the first protrusion 41 and the second protrusion 42 can be set to a predetermined height by applying a section of resin adjusted to a predetermined viscosity from a nozzle onto the substrate and repeating this operation.

[0095] In the light-emitting module, the first protrusion 41 is disposed on the first substrate with its top positioned above the light-emitting element 1 and the wavelength conversion component 5.

[0096] The height of the first protrusion 41 from the upper surface of the first substrate can be the same as or different from the height of the second protrusion from the upper surface of the second substrate. In different cases, it is preferable that the second protrusion is higher than the first protrusion. In this case, the difference between the height from the upper surface of the second substrate to the top of the first protrusion and the height from the upper surface of the second substrate to the top of the second protrusion can be smaller than the thickness of the first substrate 10 (i.e., the distance from the upper surface to the lower surface of the first substrate 10). Therefore, when the covering member 40 is disposed between the first protrusion 41 and the second protrusion 42, it is possible to prevent uncured covering member 40 from overflowing to the outside of the second protrusion.

[0097] The resin exemplified as the base material for the aforementioned coating component can be used for the first protrusion and the second protrusion. Furthermore, the resin constituting the first protrusion and the second protrusion is preferably a resin with a higher viscosity than the resin constituting the coating component 40. The viscosity of the resin can be adjusted, for example, by the amount of viscosity-adjusting filler contained in the resin.

[0098] The first protrusion 41 is translucent relative to light emitted from the light-emitting element 1 and the wavelength conversion component 5. The first protrusion 41 can be made of a resin material with light transmittance and insulation properties, such as a thermosetting resin like epoxy resin or silicone resin. The first protrusion 41 is configured as a rectangular frame surrounding the element mounting area when viewed from above. As an example, the covering component 40 is configured to contact the top of the first protrusion 41.

[0099] The first protrusion 41 is arranged in a rectangular frame shape on the first substrate 10 along the outer periphery of the component mounting region 13 when viewed from above. The first protrusion 41 is positioned between the long side of the component mounting region 13 and the plurality of first terminals 110 at a position along the long side direction of the component mounting region 13, and is positioned on the first substrate 10 between the component mounting region 13 and the outer edge of the first substrate at a position along the short side direction of the component mounting region 13.

[0100] Furthermore, the first protrusion 41 preferably has an inclined surface that slopes from the substrate side toward the top of the first protrusion. The inclined surface is preferably a curved surface that convexes outwards; specifically, the first protrusion 41 is preferably semi-circular or semi-elliptical in cross-sectional shape. Thus, the covering member 40 can have a surface that convexes toward the covering member 40 on the side that contacts the first protrusion 41. By having such a surface shape, light emitted from the wavelength conversion member 5, passing through the first protrusion, and moving toward the covering member 40 can be reflected toward the first substrate 10. Therefore, because accidental light leakage or stray light upwards (to the light extraction side) is suppressed, a light-emitting module that suppresses light scattering can be obtained.

[0101] The second protrusion 42 is disposed in the light-emitting module at a position lower than the light-emitting element 1 and the wavelength conversion component 5 (i.e., opposite to the light extraction side). Therefore, the second protrusion 42 may or may not be transparent to light emitted from the light-emitting element 1. In the manufacturing process, the second protrusion 42, like the first protrusion 41, can be used as a dam to prevent the uncured coating component 40 from spreading. Therefore, it is preferable to arrange it in the same process as the first protrusion 41 or in a continuous process, and from the viewpoint of simplifying the manufacturing method, it is preferable to use a transparent resin, similar to the first protrusion 41.

[0102] Even when the first substrate 10 is rectangular and the lead 130 is only disposed on the long side of the rectangle, it is preferable that the top of the covering member 40 disposed on the short side of the first substrate 10 is at approximately the same height as the top of the covering member 40 disposed on the long side of the first substrate 10.

[0103] Regarding the light-emitting module 100, since the first protrusion 41 is transparent, light emitted from the wavelength conversion member 5 can pass through the first protrusion 41. Moreover, since the light-emitting module 100 can cause the light passing through the first protrusion 41 to be reflected towards the first substrate 10 at the interface with the covering member 40, it can suppress scattered light.

[0104] As an example, the light-emitting module 100 with the above structure can be used as a light source for a vehicle's headlights. For example, a structure is adopted in which light is emitted from the light source through a lens. The light-emitting module 100 illuminates the light-emitting element 1 via an external power switch. Furthermore, the light-emitting module 100 is configured to individually drive some or all of the pre-set light-emitting elements 1.

[0105] In the light-emitting module 100, because the covering member 40 is light-shielding and is disposed in contact with the first protrusion 41, it can absorb light transmitted through the first protrusion 41 or reflect it towards the substrate side. Therefore, the light-emitting module 100 can be configured to suppress light scattering to the outside and suppress light leakage or stray light. Because stray light is suppressed, the optical design of the lens can be easily performed when the light-emitting module 100 is used in combination with a lens. Furthermore, because the covering member 40 contains reflective and / or light-absorbing materials as fillers for light-shielding, the amount of resin in the covering member 40 can be reduced compared to using a transparent resin without these fillers. This suppresses the load on the leads caused by the thermal expansion of the resin. Because the heat effect on the leads is small, the light-emitting module can be configured to have improved lead connectivity and excellent reliability.

[0106] [Manufacturing method of light-emitting modules]

[0107] Next, refer to Figure 8 , Figures 9A to 9H The manufacturing method of the light-emitting module is explained.

[0108] Figure 8 This is a flowchart illustrating the manufacturing method of the light-emitting module according to the embodiment. Figures 9A to 9H This is a top view schematically illustrating a method for manufacturing a light-emitting module according to an embodiment. Furthermore, the light-emitting elements 1 are placed at predetermined intervals, except... Figure 9C Apart from the enlarged top view, the intervals are omitted.

[0109] The manufacturing method of the light-emitting module includes an element placement step S11, in which multiple light-emitting elements are placed on an element placement area of ​​a first substrate; a substrate placement step S13, in which the first substrate is placed on a substrate placement area of ​​a second substrate; a step S14, in which multiple first terminals disposed outside the element placement area of ​​the first substrate and multiple second terminals disposed outside the substrate placement area of ​​the second substrate are connected by leads; a first protrusion placement step S16, in which a light-transmitting first protrusion is disposed along the element placement area between the element placement area and the first terminals; and a covering member placement step S18, in which a light-shielding covering member is disposed outside the first protrusion and connected to the first protrusion and covering the leads. Furthermore, a second protrusion placement step S17, in which a second protrusion is disposed on the second substrate outside the second terminals, is performed before or after the first protrusion placement step S16. Moreover, a reflective member placement step S12 is performed after the element placement step S11. Each step will be described below.

[0110] The component placement process S11 is a process of placing a plurality of light-emitting elements 1 on the component placement area 13 of the first substrate 10. In the component placement process S11, a component is prepared in which a plurality of light-emitting elements are arranged at predetermined intervals on a support substrate. After the plurality of light-emitting elements 1 are attached to the component placement area of ​​the first substrate, the support substrate is peeled off. Furthermore, it is preferable to prepare the first substrate 10 with wiring such as first terminals in advance before performing the component placement process S11. The first terminals 110 can be formed by attaching metal foils such as Cu and Al, coating a paste of metal powders such as Cu and Ag, or plating Cu, etc. In addition, the wiring that is electrically connected to the light-emitting elements 1 in the component placement area can be patterned by etching or printing. Furthermore, the first substrate 10 can also be prepared by purchasing, etc.

[0111] The light-emitting element 1 can be electrically bonded to the element mounting area 13 on the first substrate 10, for example, by plating. The light-emitting element 1 is aligned and mounted along the matrix direction at predetermined intervals in the element mounting area. The light-emitting element 1 can be prepared by some or all of the manufacturing processes such as semiconductor growth. Alternatively, it can be prepared by purchasing.

[0112] The reflective component placement process S12 is a process in which the side surface of the light-emitting element 1 is covered by a reflective component after the light-emitting element 1 is placed in the element placement area 13 of the first substrate 10. Here, after the light-emitting element 1 is placed on the first substrate 10, a reflective component, such as white resin, is placed between the light-emitting elements 1 on the side surface of the light-emitting element 1. Furthermore, in the reflective component placement process S12, the upper surface of the light-emitting element 1 is covered by a mask before the reflective component 7 is placed, and the mask is removed after the reflective component 7 is placed, thereby allowing the upper surface of the light-emitting element 1 to be exposed from the reflective component 7.

[0113] The substrate placement process S13 is a process of placing the first substrate 10 onto the substrate placement area 23 of the second substrate 20. Here, the first substrate 10, on which the light-emitting element 1 is placed, is disposed on the substrate placement area 23 of the second substrate 20, for example, by bonding with a bonding material such as sintered Ag. Furthermore, before performing the substrate placement process S13, the second substrate 20, on which wiring such as second terminals is disposed, is prepared in advance.

[0114] In the wire connection process S14, the first terminal 110 of the first substrate 10 and the second terminal 120 of the second substrate 20 are connected by a lead 130. Specifically, a plurality of first external connection terminals 11 of the first substrate 10 and a plurality of first lead connection terminals 21 of the second substrate 20 are connected by a plurality of first leads 31, and a plurality of second external connection terminals 12 of the first substrate 10 and a plurality of second lead connection terminals 22 of the second substrate 20 are connected by a plurality of second leads 32. Furthermore, the wire connection process S14 includes a step of connecting a third lead 33 to a first drive terminal 15 of the first substrate 10 and a second drive terminal 16 of the second substrate 20.

[0115] The lead wire can be first connected to the first external connection terminal 11 provided on the first substrate 10, and then connected to the first lead wire connection terminal 21 provided on the second substrate. By connecting the lead wire in this order, the top of the lead wire can be positioned closer to the first external connection terminal 11. That is, because the lead wire can be formed along the steps of the first substrate 10 and the second substrate 20, the amount of resin disposed below the lead wire can be suppressed in the encapsulation component placement process described later, and the breakage of the lead wire caused by the thermal expansion of the encapsulation component can be suppressed.

[0116] Wavelength conversion component arrangement step S15 is a step of arranging wavelength conversion components 5 covering multiple light-emitting elements 1. For the wavelength conversion component 5, a sheet-like component of a predetermined size is prepared in advance and arranged on the light-emitting element 1. The wavelength conversion component 5 can be fixed to the light-emitting element 1 via a light-transmitting bonding component such as resin, or it can be fixed to the light-emitting element 1 using adhesive properties of the wavelength conversion component without a bonding component.

[0117] The first protrusion configuration step S16 is a process in which a light-transmitting first protrusion 41 is configured on the upper surface of the first substrate 10 and between the component placement area 13 and the first terminal 110, in a manner along the component placement area 13. In the first protrusion configuration step S16, the first protrusion 41 is configured by moving the nozzle along the component placement area 13 while supplying uncured resin for forming the first protrusion 41 from the nozzle of the dispenser.

[0118] In the second protrusion configuration process S17, a second protrusion is configured on the upper surface of the second substrate 20, further outward than the second terminal. Furthermore, the first protrusion 41 and the second protrusion 42 are preferably made of the same material, thereby allowing the first protrusion configuration process S16 and the second protrusion configuration process S17 to be performed as a single process.

[0119] Alternatively, in the first protrusion configuration step S16 and the second protrusion configuration step S17, the second protrusion 42 may be configured first in the second protrusion configuration step S17, and then the first protrusion 41 may be configured in the first protrusion configuration step S16. Alternatively, the first protrusion configuration step S16 and the second protrusion configuration step S17 may be performed simultaneously, and the first protrusion 41 and the second protrusion 42 may be configured approximately simultaneously.

[0120] The coating component arrangement step S18 is a step of arranging a light-shielding coating component that is connected to and covers the lead wire, located outside the first protrusion. Specifically, it is a step of arranging a light-shielding coating component 40 between the first protrusion 41 and the second protrusion 42, the light-shielding coating component 40 using a resin with a lower viscosity than the first protrusion 41 and the second protrusion 42 as the base material. The coating component 40 is arranged across the first substrate 10 and the second substrate 20. Therefore, the coating component 40 also covers the side of the first substrate 10. Furthermore, the position of the top 40a of the coating component 40 arranged in the coating component arrangement step S18 is formed to be higher than the top 41a of the first protrusion 41. In order to set the position of the top 40a of the coating component 40 to be higher than the top 41a of the first protrusion 41, it is preferable, for example, to repeatedly supply resin before the supplied resin cures. The supply of the coating component 40 is preferably performed directly above the top of the lead wire. Therefore, the top of the lead wire is easily covered by the covering component 40.

[0121] In the first protrusion configuration step S16, the second protrusion configuration step S17, and the coating component configuration step S18, for example, the first protrusion 41 and the second protrusion 42 are made of silicone resin, and the coating component is also made of silicone resin. The viscosity of the uncured resin forming the coating component can be adjusted by adding fillers or other materials that adjust the physical properties of the resin or viscosity. Furthermore, in this step, configuring the first protrusion 41 and the second protrusion 42 includes configuring uncured or preferably temporarily cured resin material, and is not limited to the case of complete curing.

[0122] Furthermore, the covering component 40 and the first protrusion 41 can also be as follows: Figures 10A to 10C The structure is shown. Hereinafter, various modifications of the embodiment will be described with reference to the figures. Figure 10A This is a cross-sectional view schematically illustrating a first modified example of the implementation. Figure 10B This is a cross-sectional view schematically illustrating a second variation of the implementation. Figure 10C This is a cross-sectional view schematically illustrating a third variation of the embodiment. Furthermore, structures already described are labeled with the same symbols and their descriptions are omitted, or descriptions are omitted to avoid repeating the same information.

[0123] (First variation)

[0124] like Figure 10A As shown, in the light-emitting module 100A, the covering component 40 can also be configured to have a first covering component 141 that is connected to the first protrusion 41 and covers the lead wire 130 and a second covering component 142 that covers the first covering component 141.

[0125] The first covering member 141 is disposed across the first substrate 10 and the second substrate 20 such that it covers the first lead 31, the second lead 32, and the third lead 33. Furthermore, the first covering member 141 is configured such that one end of the first substrate 10 side is in contact with the first protrusion 41. Additionally, the other end of the first covering member 141 on the second substrate 20 side is spaced apart from the second protrusion 42.

[0126] The first covering component 141 can be made of a dark-colored resin (e.g., black or gray resin) in which the base material contains light-absorbing substances as light-shielding fillers. Thermosetting resins such as epoxy resin or silicone resin can be used as the base material. Since the first covering component 141 covers the lead 130, it is preferable to use a resin with lower elasticity than the second covering component 142. By using a low-elasticity resin for the first covering component 141, the heat-induced impact on the lead can be further reduced, improving the connection reliability of the lead. Furthermore, when the first covering component 141 is made of a dark-colored resin, it is preferable to use a reflective white resin for the second covering component 142 covering the first covering component 141. This suppresses the deterioration of the first covering component 141 caused by absorbing external light, ensuring the reliability of the light-emitting module.

[0127] The second covering member 142 is preferably configured to cover the first covering member 141 and be in contact with the first protrusion 41. The second covering member 142 is preferably formed of a white resin containing a reflective material as described above. The second covering member 142 is preferably formed of a resin with higher elasticity than the first covering member 141. The second covering member 142 is configured such that one end is in contact with the first protrusion 41 and the other end is in contact with the second protrusion 42. Furthermore, the elasticity of the first covering member 141 and the second covering member 142 can be adjusted by adding a plasticizer or using different resin materials. By forming the first covering member 141 with a low-elasticity resin and the second covering member 142 with a high-elasticity resin, the mechanical influence from the outside can be reduced, and the effect of thermal expansion on the lead 130 can be reduced.

[0128] In the manufacturing method of the light-emitting module 100A, such as Figure 11 As shown, in the described manufacturing method, the coating component arrangement step S18 includes a first coating component arrangement step S18A and a second coating component arrangement step S18B. In the first coating component arrangement step S18A, a first coating component 141 is supplied from a nozzle to cover the lead wire 130. One end of the first coating component 141 is configured to contact the outer surface of the first protrusion 41. The other end of the first coating component 141 is configured to be separated from the second protrusion.

[0129] In the second covering member configuration step S18B, the second covering member 142 is configured to cover the first covering member 141. One end of the second covering member 142 is configured to contact the first protrusion. The second covering member 142 is configured on the first covering member 141 such that its top is higher than the top 41a of the first protrusion 41.

[0130] (Second and Third Modifications)

[0131] like Figure 10B and Figure 10C As shown, in the light-emitting modules 100B and 100C, the first protrusion 241 can also be configured to cover the outer periphery of the wavelength conversion component 5.

[0132] like Figure 10B and Figure 10C As shown, the first protrusion 241 includes a first portion 241a covering the wavelength conversion member 5, a second portion 241b forming the top of the first protrusion 241, and a third portion 241c absorbing or reflecting light incident on the first protrusion 241.

[0133] The first portion 241a is configured to cover at least a portion of the outer edge of the wavelength conversion component 5 that is not directly opposite the light-emitting element 1. By covering the outer edge of the wavelength conversion component 5, the first portion 241a allows scattered light to easily penetrate into the first protrusion 241. The location where the first portion 241a covers the wavelength conversion component 5 can be configured to cover the outer edge of the long side of the wavelength conversion component 5, which is rectangular when viewed from above. Alternatively, both the outer edge of the wavelength conversion component 5 that is the short side and the outer edge that is the long side can be covered together.

[0134] The second portion 241b has a curved surface that forms the top of the first protrusion 241 and convexes upward. By positioning the top of the first protrusion 241 higher than the top of the lead wire, the second portion 241b functions as a dam when the covering member 40 is positioned.

[0135] The third portion 241c is formed with a curved shape at the interface between the first protrusion 241 and the covering member 40, protruding towards the covering member 40. This third portion 241c is formed with a curved surface extending from the top towards the outer side, reflecting light that has entered the first protrusion 241 towards the first substrate 10. By providing this third portion 241c, light incident on the first protrusion 241 is reflected towards the first substrate 10, making it less likely to be exposed to the outside.

[0136] In the light-emitting module 100B, one end of the covering component 40 is the same as described above. Figure 6 The light-emitting module 100 shown has the same structure and is configured to connect with the outer side of the first protrusion 241 to a position beyond the top of the first protrusion 241 or to the top, and further to a position in front of the top.

[0137] Furthermore, in the light-emitting module 100C, the first protrusion 241 is... Figure 10B The light-emitting module 100B of the modified example 2 shown has the same structure, and the covering component 40 is the same as... Figure 10A The light-emitting module 100A of the modified example 1 shown has the same structure. Therefore, in the light-emitting module 100C, one end of the first covering member 141 and one end of the second covering member 142 are configured to contact the outer surface of the first protrusion 241.

[0138] In the light-emitting modules 100B and 100C, regarding the first protrusion 241, since the first portion 241a covers the outer edge of the wavelength conversion component 5, the first protrusion 241 and the wavelength conversion component 5 are not easily separated, thus protecting the light-emitting element 1 from dust or moisture. This improves the reliability of the light-emitting module. This structure is particularly preferred when using an integrated circuit (IC) substrate as the first substrate 10.

[0139] In the manufacturing method of the light-emitting module 100B or the light-emitting module 100C, as the first protrusion configuration step S16A, in the already described first protrusion configuration step S16, the uncured resin forming the first protrusion 241 is configured to overlap two or more sections on the first substrate 10. At this time, the resin of the second section is supplied in such a way that it is configured to be outside the first section and overlaps with the resin of the first section. Thus, the first protrusion 241 is configured having a first portion 241a covering the outer periphery of the wavelength conversion member 5, a second portion 241b constituting the top of the first protrusion 241, and a third portion 241c having a curved surface that is continuous from the top.

[0140] In the manufacturing method of the light-emitting module 100B, the covering component configuration process S18 can be performed by the same process as that of the light-emitting module 100 already described.

[0141] Furthermore, in the manufacturing method of the light-emitting module 100C, in the covering component arrangement process S18, the first covering component arrangement process S18A and the second covering component arrangement process S18B can be performed in the same manner as the light-emitting module 100A described above.

[0142] In addition, such as Figure 12 As shown, the light-emitting module 100D may also have a recess 24 in the center of the second substrate 20D, and a substrate mounting region 23D is provided in the recess 24. In this way, since the second substrate 20D has a recess 24 that constitutes the substrate mounting region 23D, the overall thickness of the light-emitting module 100D can be reduced.

[0143] In addition, among the light-emitting modules already described, they can also be configured as follows: Figure 13 and Figure 14 The arrangement of the first protrusion 41N and the second protrusion 42N shown.

[0144] That is, in each light-emitting module, such as Figure 13 As shown, the first protrusion 41N is disposed on the first substrate 10 with respect to the component mounting region 13. That is, the first protrusion 41N is disposed in a straight line along the long side direction of the component mounting region 13. Furthermore, the light-transmitting first protrusion 41N is disposed along the component mounting region 13 between the component mounting region 13 and the first external connection terminal 11 and the second external connection terminal 12, which serve as the first terminal 110, in a manner that connects to the wavelength conversion member 5.

[0145] Furthermore, the second protrusion 42N is configured to be disposed on the upper surface of the second substrate 20, further outward than the first lead connection terminal 21 and the second lead connection terminal 22, which serve as the second terminal 120, and is in contact with the covering member 40. The second protrusion 42N is arranged in a straight line with a length opposite to that of the first protrusion 41N.

[0146] In addition, in each light-emitting module, such as Figure 14 As shown, the second protrusion 42N can also be omitted.

[0147] Example

[0148] Next, refer to Figures 15-16 7. An embodiment of the light-emitting module of this application will be described. However, this application is not limited to this embodiment.

[0149] Fabricate a light-emitting module with the following structure. A pulsed current of 2.5 mA (Duty: 10%) flows through each light-emitting element. Measure the average luminance (cd / m²) of the front light from the light-emitting module over 100 seconds. 2 ). Figure 17A and Figure 17BThis is a graph that shows the relationship between the relative value of the average brightness relative to the light-emitting area (Au) on the vertical axis and the distance from approximately the center of the light-emitting area on the horizontal axis. Furthermore, the light-emitting area is defined as the area directly above the light-emitting element in the light-emitting module 100S.

[0150] like Figure 15 and Figure 16 As shown, the basic structure of the light-emitting module 100S is as follows. The shape of the first protrusion 241 is set to the structure already described as a second variation, and the components constituting the first protrusion 241 and the components constituting the covering component 40 are set to conditions 1 to 5 as follows. Furthermore, Figure 15 and Figure 16 The symbols for the structures shown are the same as those for the structures already described, with explanations omitted as appropriate.

[0151] <Common Basic Structure of Light-Emitting Modules>

[0152] (1) The first substrate 10 is a silicon substrate with an integrated IC. In terms of substrate size, the first substrate 10 has a rectangular shape of 14.5mm × 5.39mm when viewed from above, and a thickness of 0.615mm.

[0153] (2) The light-emitting element 1 is inverted conical in shape, with a rectangular upper surface of 45μm × 45μm and a thickness of 8.5μm. The light-emitting element 1 is disposed on the first substrate 10 via a 3μm thick Cu-plated layer serving as an element bonding member. Furthermore, reflective members are disposed between the light-emitting elements on the first substrate 10. The reflective members are made of dimethylsilicone resin containing titanium oxide. The light-emitting elements 1 are configured such that the distance between them is 50μm. The light-emitting elements 1 disposed on the first substrate 10 are arranged in 64 rows × 64 columns × 4 segments, totaling 16384 elements.

[0154] (3) The second substrate 20 is a Cu core substrate with Cu encapsulated inside the substrate, and wiring layers are arranged on the front and back sides. The second substrate 20 has a top view size of 20mm × 13mm and a thickness of 0.522mm.

[0155] (4) The second substrate 20 and the first substrate 10 are bonded together by Ag paste containing silicone resin.

[0156] (5) The first terminal disposed on the first substrate 10 and the second terminal disposed on the second substrate 20 are electrically connected by a lead 130. The lead 130 is made of Au and has a diameter φ of 45 μm.

[0157] (6) A sheet-like wavelength conversion component 5, which has a rectangular shape of 13.7 mm × 4.0 mm and a thickness of 0.03 mm when viewed from above, is disposed on the upper surface of the light-emitting element 1. The wavelength conversion component 5 is made of dimethyl silicone resin containing YAG phosphor. The particle size of the YAG phosphor contained in the wavelength conversion component 5 is less than 10 μm.

[0158] (7) As a common structure, the covering component 40, which covers the lead 130 and is arranged across the first substrate 10 and the second substrate 20, contains a light-shielding filler in the dimethyl silicone resin that serves as the base material.

[0159] (8) A first protrusion 241 is disposed 200 μm away from the light-emitting area. The first protrusion 241 covers the periphery of the wavelength conversion member 5 and is disposed on the first substrate 10. As for the first protrusion 241, the width of the first protrusion 241 (i.e., the shortest distance from the end of the first protrusion 241 on the side of the light-emitting element 1 to the end of the first substrate 10 on the outer edge side) is 400 μm, and the height of the top of the first protrusion 241 from the first substrate 10 is 260 μm. The first protrusion 241 is formed such that two arcs are connected on the upper surface in terms of cross-sectional shape, and the top of the arc on the side of the covering member 40 is higher than the top of the arc on the side of the light-emitting element 1. In the first protrusion 241, the distance from the top of the first protrusion 241 (i.e., the top of the arc on the side of the covering member 40) to the end on the side of the covering member is 115 μm.

[0160] Furthermore, the light-emitting modules 100S under conditions 1 to 5 are manufactured with the above values ​​as design values, but the manufactured light-emitting modules 100S sometimes include errors caused by component tolerances or installation tolerances of about ±50μm.

[0161] <Structure of the first protrusion and structure of the covering component>

[0162] The structures of the first protrusion 241 and the covering component 40 in conditions 1 to 5 are as follows.

[0163] [Condition 1]

[0164] The first protrusion 241 and the covering component 40 are made of black resin. The black resin is a dimethyl silicone resin containing commercially available carbon filler.

[0165] [Condition 2]

[0166] The first protrusion 241 uses a light-transmitting resin. This light-transmitting resin is dimethyl silicone resin. Additionally, the covering component 40 uses a white resin containing alumina as a reflective filler within the dimethyl silicone resin. The alumina concentration in this white resin is approximately 13% by mass.

[0167] [Condition 3]

[0168] The first protrusion 241 uses a light-transmitting resin. This light-transmitting resin is a dimethyl silicone resin with a viscosity different from that in condition 2. The covering part 40 uses a white resin with the same conditions as in condition 2.

[0169] [Condition 4]

[0170] The first protrusion 241 uses a white resin. This white resin is a white resin containing hollow silica filler as a reflective filler within a dimethyl silicone resin. The concentration of the hollow silica filler in this white resin is approximately 33% by mass. The covering component 40 uses a white resin with the same conditions as in condition 2.

[0171] [Condition 5]

[0172] The first protrusion 241 uses a white resin. This white resin is a dimethyl silicone resin containing alumina as a reflective filler. The concentration of alumina in this white resin is approximately 13% by mass. The covering part 40 uses a white resin under the same conditions as in condition 2.

[0173] Furthermore, in conditions 1 to 5, in order to achieve the desired shape, the first protrusion 241 and the covering component 40 are appropriately fitted with trace amounts of silica-based nanofillers to adjust the viscosity or thixotropy of the resin.

[0174] <Research under conditions 1 to 5>

[0175] like Figure 17A and Figure 17B As shown, the average brightness (cd / mm²) of the front light of the light-emitting module 100S is measured at the position from the light-emitting area across the first protrusion to the covering component. 2 This confirms the generation status of stray light (unwanted reflections or scatterings of light generated outside the emitting area). Figure 17A and Figure 17B In this study, the light-emitting area is set to a region of 0 μm to 1600 μm, the first protrusion is set to a region of 1800 μm to 2200 μm, and the region in contact with the first protrusion and the covering component is set to a region of 2080 μm to 2200 μm.

[0176] In the experimental data, the relative brightness value decreases sharply with the outer edge of the luminous region as the boundary. The optimal structure maintains a low relative brightness as one moves away from the luminous region. Furthermore, even if a peak value of relative brightness is confirmed in a region far from the luminous region, a structure with a smaller maximum value of the peak value can be considered superior. For example, if the peak value of the relative brightness confirmed at a location far from the luminous region is approximately 2.2% or less, the influence of stray light in the optical system unit using the luminous module as the light source is considered minimal.

[0177] In the light-emitting module 100S, with all the mounted light-emitting elements illuminated, the generation of stray light was investigated. Figure 17A and Figure 17B In the diagram, a thick solid line represents condition 1, a double-dotted line represents condition 2, a dotted line represents condition 3, a dotted-dotted line represents condition 4, and a thin solid line represents condition 5.

[0178] In the structure of condition 5, a peak value of more than 7% relative brightness was identified at the location of the first protrusion far from the light-emitting area.

[0179] In contrast, in the structure of condition 4, a peak value of more than 4% relative brightness was confirmed at the position of the first protrusion. Additionally, in the structure of condition 1, a peak value of approximately 2.2% relative brightness was confirmed at a position slightly closer to the light-emitting surface than the first protrusion.

[0180] In the structure of condition 2, a peak value with a relative brightness of less than 2.2% was identified at a position further outward (on the side of the covering component) than the position of the first protrusion.

[0181] In the structure of condition 3, a peak value of approximately 2.2% weaker in relative brightness was identified at a position further outward (on the side of the covering component) than the first protrusion 241.

[0182] The results above confirm that by using a light-transmitting component in the first protrusion 241 as in conditions 2 and 3, the relative brightness of the generated stray light is reduced to the same level as that of the black resin.

[0183] Furthermore, based on the experimental data mentioned above, it is also speculated that the same situation applies to the structure of the first protrusion 41 and the covering component 40 in the first embodiment. It is believed that by making the first protrusion 41 transparent, stray light (unexpected scattered light) in the light-emitting module can be suppressed.

[0184] The light-emitting module and its manufacturing method of the present invention have been specifically described above in terms of their implementation methods. However, the scope of the present invention is not limited to these descriptions and must be interpreted broadly based on the descriptions of the technical solutions. Furthermore, it goes without saying that various modifications and alterations based on these descriptions are also included in the scope of the present invention.

[0185] Industrial availability

[0186] The light-emitting module 100 of the present disclosure can be used for various light sources such as vehicle headlights or projectors.

[0187] Symbol Explanation

[0188] 1. Light-emitting element

[0189] 5 Wavelength conversion components

[0190] 7. Reflective components

[0191] 10 First substrate

[0192] 110 First Terminal

[0193] 11 First external connection terminal

[0194] 12 Second external connection terminal

[0195] 13 Component placement area

[0196] 15 First drive terminal

[0197] 16 Second drive terminal

[0198] 20, 20A Second Substrate

[0199] 120 Second Terminal

[0200] 21 First lead connection terminal

[0201] 22 Second lead connection terminal

[0202] 23. Substrate mounting area

[0203] 24 recess

[0204] 130 lead wire

[0205] 31 First Lead

[0206] 31a Top of the first lead

[0207] 32 Second lead

[0208] 32a Top of the second lead

[0209] 33 Third lead

[0210] 40 Covered components

[0211] 41 First convex part

[0212] 42 Second convex part

[0213] 100, 100A LED modules

[0214] S11 Component Placement Process

[0215] S12 Reflective component configuration process

[0216] S13 Substrate Placement Process

[0217] S14 Lead wire connection process

[0218] S15 Wavelength Conversion Component Configuration Process

[0219] S16 First Protrusion Configuration Process

[0220] S17 Second Protrusion Configuration Process

[0221] S18 Covering component configuration process

Claims

1. A light-emitting module, comprising: Multiple light-emitting elements; A first substrate has an element mounting region on its upper surface on which the plurality of light-emitting elements are mounted, and a plurality of first terminals arranged along the element mounting region on its upper surface further outward from the element mounting region. The second substrate has a substrate mounting region on which the first substrate is mounted on its upper surface, and a plurality of second terminals arranged along the substrate mounting region on its upper surface which is further outward from the substrate mounting region. Multiple leads are connected to the first terminal and the second terminal and are arranged along the outer edge of the first substrate; A light-shielding covering component that covers the plurality of leads at a position outside the element placement area; A light-transmitting first protrusion is disposed along the element placement area between the element placement area and the first terminal, and is in contact with the covering member; The interface between the first protrusion and the covering member has a curved shape that bulges toward the covering member.

2. The light-emitting module according to claim 1, wherein, The upper surface of the second substrate has a second protrusion disposed outside the second terminal and in contact with the covering member.

3. The light-emitting module according to claim 2, wherein, The first protrusion is configured in a frame shape to surround the component mounting area. The second protrusion is configured in a frame shape to surround the first substrate. The covering component is disposed between the first protrusion and the second protrusion.

4. The light-emitting module according to any one of claims 1 to 3, wherein, The area where the component is placed is rectangular when viewed from above. The leads are respectively arranged along one side of the component placement area and the other side opposite to the first side.

5. The light-emitting module according to any one of claims 1 to 3, wherein, Equipped with a wavelength conversion component covering the plurality of light-emitting elements, When viewed from above, the wavelength conversion component encloses the plurality of light-emitting elements.

6. The light-emitting module according to any one of claims 1 to 3, wherein, The covering component includes a first covering component that is in contact with the first protrusion and covers the lead wire, and a second covering component that covers the first covering component.

7. The light-emitting module according to claim 6, wherein, The first covering component contains a light-absorbing substance.

8. The light-emitting module according to claim 6, wherein, The second covering component contains a reflective material.

9. The light-emitting module according to any one of claims 1 to 3, wherein, The top of the covering component is positioned higher than the top of the first protrusion.

10. A method for manufacturing a light-emitting module, comprising: The component placement process involves placing multiple light-emitting components in the component placement area of ​​the first substrate; The substrate placement process involves placing the first substrate on the substrate placement area of ​​the second substrate. The lead connection process uses multiple leads to connect multiple first terminals located at a position outside the element placement area of ​​the first substrate and multiple second terminals located at a position outside the substrate placement area of ​​the second substrate. The first protrusion configuration process involves configuring a light-transmitting first protrusion along the component mounting area between the component mounting area and the first terminal; The process of configuring the covering component involves configuring a light-shielding covering component that is connected to the first protrusion and covers the plurality of leads on the outer side of the first protrusion. The interface between the first protrusion and the covering member has a curved shape that bulges toward the covering member.

11. The method for manufacturing a light-emitting module according to claim 10, wherein, After the first protrusion configuration step and before the covering component configuration step, the method further includes: A second protrusion configuration process in which a second protrusion is configured on the second substrate, wherein the second protrusion is configured at a position further outward than the second terminal. In the process of configuring the covering component, the covering component is configured between the first protrusion and the second protrusion.

12. The method for manufacturing a light-emitting module according to claim 10 or 11, wherein, The process of configuring the covering component includes a process of configuring a first covering component that is connected to the first protrusion and covers the plurality of leads, and a process of configuring a second covering component that covers the first covering component.

13. The method for manufacturing a light-emitting module according to claim 10 or 11, wherein, Prior to the first protrusion configuration step, there is a step of configuring a wavelength conversion component covering the plurality of light-emitting elements. In the first protrusion configuration step, the first protrusion is configured to cover at least a portion of the outer edge of the wavelength conversion component.

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