Splitting knife structure, welding apparatus, and wire bonding method

Abstract

The application provides a cleaving knife structure, a welding device and a wire bonding method, and relates to the technical field of welding. The cleaving knife structure comprises a cleaving knife body, the cleaving knife body comprises a first end portion and a second end portion, and the second end portion serves as a welding end portion; the cleaving knife body is provided with a first channel and a second channel, the first channel penetrates through the first end portion and the second end portion along an axis, the second channel is in communication with the outside at the first end portion and is arranged in a spaced manner with the first channel, and the second channel is in communication with the first channel at the second end portion; the first channel is used for allowing a first metal wire to pass through, and the second channel is used for allowing a second metal wire to pass through. By arranging the second metal wire in the second channel, the thickness of the metal anti-oxidation layer of the eutectic solder ball can be increased during the welding process, the anti-oxidation function is realized, and thus the welding bonding force is improved, and the welding quality is improved.

Description

Technical Field

[0001] This invention relates to the field of welding technology, and more specifically, to a cleaver structure, welding equipment, and wire bonding method. Background Technology

[0002] Currently, in the semiconductor device manufacturing process, chip pads and substrate pads need to be soldered using wire bonding. Existing wire bonding typically uses aluminum or gold wire, and the bonding is performed ultrasonically. Ultrasonic waves from an ultrasonic generator are transmitted to a wedge via a transducer, generating high-frequency vibrations. When the wedge contacts the wire bonding and the workpiece, under pressure and vibration, the two metal surfaces rub against each other, breaking down the oxide film and causing plastic deformation. This results in close contact between the two clean metal surfaces, achieving ion bonding and ultimately forming a strong mechanical connection. However, the presence of an oxide layer during wire bonding can lead to low weld strength, causing problems such as solder ball detachment and failure to pass tensile tests. Summary of the Invention

[0003] The objectives of this invention include, for example, providing a cleaving structure, welding equipment, and wire bonding method that can increase the thickness of the anti-oxidation layer during welding, improve the oxidation phenomenon on the metal surface, enhance the bonding force of the welded structure, thereby improving the welding quality and effect.

[0004] The embodiments of the present invention can be implemented as follows: In a first aspect, the present invention provides a cleaver structure, including a cleaver body, the cleaver body including a first end and a second end, the second end serving as a welding end; the cleaver body is provided with a first channel and a second channel, the first channel passing through the first end and the second end along an axis, the second channel communicating with the outside at the first end and being spaced apart from the first channel, the second channel communicating with the first channel at the second end; the first channel is used for a first metal welding wire to pass through, and the second channel is used for a second metal welding wire to pass through.

[0005] In an optional embodiment, the second end is provided with a third channel, which is used to connect the first channel and the second channel.

[0006] In an optional implementation, the axes of the first channel and the second channel are parallel to each other, and the axis of the third channel is perpendicular to the axes of the first channel and the second channel, respectively.

[0007] In an optional embodiment, the outer surface of the first metal bonding wire is provided with an anti-oxidation layer.

[0008] In an optional embodiment, the second channel is provided with the second metal bonding wire, which is made of nickel or palladium.

[0009] In an optional embodiment, the outer surface of the first metal bonding wire is provided with an anti-oxidation layer, and the material of the anti-oxidation layer is the same as that of the second metal bonding wire.

[0010] In an optional embodiment, the first metal bonding wire extends into the first channel from the first end, and the second metal bonding wire extends into the second channel from the first end, extends into the first channel through the third channel, and the end of the second metal bonding wire away from the first end abuts against the side wall of the first channel, so that the second metal bonding wire is located at the end of the first metal bonding wire, and the second metal bonding wire is closer to the outlet of the first channel than the first metal bonding wire.

[0011] In an optional embodiment, the second channel is connected to a gas tube for introducing inert gas into the second channel.

[0012] In an optional embodiment, the chopping knife body is provided with a fourth channel, which communicates with the second channel and is used to connect an air tube; The second metal welding wire is disposed in the second channel, and the gas pipe is used to introduce the inert gas into the second channel.

[0013] In a second aspect, the present invention provides a welding apparatus, including an ultrasonic welding machine base and a cleaving structure as described in any of the foregoing embodiments, the cleaving structure being mounted on the ultrasonic welding machine base.

[0014] Thirdly, the present invention provides a wire-casting method, employing a splitting blade structure as described in any of the foregoing embodiments, the method comprising: The cleaver structure is used to form eutectic solder balls on the first pad; Separate the cleaving structure and the eutectic solder ball, leaving the first metal solder line on the eutectic solder ball; The end of the first metal wire away from the eutectic solder ball is soldered onto the second pad.

[0015] The beneficial effects of the embodiments of the present invention include, for example: The cleaver structure provided in this embodiment of the invention has a first channel and a second channel spaced apart on the cleaver body. The first channel and the second channel are connected at the welding end. By setting a second metal welding wire in the second channel, since the material of the anti-oxidation layer on the outer surface of the first metal welding wire is the same as the material of the second metal welding wire, the thickness of the anti-oxidation layer can be increased during the welding process, avoiding oxidation of the welding metal surface, thereby improving the bonding force of the welded structure, improving the welding quality, and improving the welding effect.

[0016] The welding equipment provided in this embodiment of the invention includes the aforementioned cleaving structure and ultrasonic machine platform. The cleaving structure is mounted on the ultrasonic machine platform. Using this welding equipment, welding wires and pads can be completed, and the thickness of the anti-oxidation layer can be increased during the welding process, thereby improving the bonding force of the welded structure, improving the welding quality, and improving the welding effect.

[0017] The wire bonding method provided in this embodiment of the invention uses the above-mentioned cleaving structure for welding wire bonding, which is convenient to operate and can effectively improve the bonding force of the welded structure, improve the welding quality, and improve the welding effect. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a cleaver structure provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the first application scenario of the cleaving blade structure provided in the embodiments of the present invention; Figure 3 for Figure 2 A magnified view of a portion of point A in the middle; Figure 4 A schematic diagram of a structure for forming eutectic solder balls during the welding process of a wedge structure provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of a second application scenario of the cleaving blade structure provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of a third application scenario of the cleaving blade structure provided in an embodiment of the present invention; Figure 7 This is a schematic diagram illustrating the application scenario of the cleaving structure provided in this embodiment of the invention for vertical wire drawing.

[0020] Icons: 100-Cleaver structure; 110-Cleaver body; 111-First end; 113-Second end; 114-Outer peripheral conical surface; 115-Straight end face; 120-First channel; 130-Second channel; 140-Third channel; 141-Sharp corner; 150-First metal bonding wire; 151-Eutectic solder ball; 160-Second metal bonding wire; 170-Gas tube; 171-Fourth channel; 210-First pad; 220-Second pad. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0025] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0026] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0027] Please refer to Figures 1 to 4This embodiment provides a cleaver structure 100, including a cleaver body 110. The cleaver body 110 includes a first end 111 and a second end 113, with the second end 113 serving as a welding end. The cleaver body 110 is provided with a first channel 120 and a second channel 130. The first channel 120 passes through the first end 111 and the second end 113 along the axis. The second channel 130 communicates with the outside at the first end 111 and is spaced apart from the first channel 120. The second channel 130 communicates with the first channel 120 at the second end 113. The first channel 120 is used for a first metal welding wire 150 to pass through, and the second channel 130 is used for a second metal welding wire 160 to pass through. By setting a first channel 120 and a second channel 130 at intervals on the body 110 of the cleaver, and connecting the first channel 120 and the second channel 130 at the welding end, and by setting a second metal welding line 160 in the second channel 130, since the anti-oxidation layer material on the outer surface of the second metal welding line 160 and the first metal welding line 150 is the same, the thickness of the anti-oxidation layer can be increased during the welding process, so as to avoid oxidation of the welding metal surface, thereby improving the bonding force of the welding structure, improving the welding quality, and improving the welding effect.

[0028] Optionally, the inlet of the first channel 120 is located at the first end 111, and the outlet is located at the second end 113. The first metal bonding wire 150 extends from the first end 111 and reaches the second end 113. The inlet of the second channel 130 is located at the first end 111, and the outlet communicates with the first channel 120. The second metal bonding wire 160 enters from the inlet, passes through the outlet of the second channel 130, and reaches the first channel 120, so as to form an anti-oxidation layer between the first metal bonding wire 150 and the pad (metal to be soldered). In this embodiment, the second end 113 is tapered, that is, the second end 113 includes an outer peripheral conical surface 114 and a straight end surface 115. The outlet of the first channel 120 passes through the straight end surface 115, and the second channel 130 extends to the outer peripheral conical surface 114 but does not penetrate the outer peripheral conical surface 114. The second end 113 is provided with a third channel 140, which connects the first channel 120 and the second channel 130. Specifically, one end of the third channel 140 is connected to the first channel 120, and the other end is connected to the second channel 130. In this embodiment, the axes of the first channel 120 and the second channel 130 are parallel to each other, and the axis of the third channel 140 is perpendicular to both the axes of the first channel 120 and the second channel 130. However, this is not the only possible embodiment. In other optional embodiments, the third channel 140 may also be set at an acute or obtuse angle to the axis of the second channel 130, meaning the axis of the third channel 140 may be inclined relative to the horizontal plane. This is not specifically limited here.

[0029] Optionally, the first metal bonding wire 150 can be made of copper wire, gold wire or alloy wire, etc. The outer surface of the first metal bonding wire 150 is provided with an anti-oxidation layer. Optionally, the anti-oxidation layer can be nickel or palladium covered on the outer surface of the first metal bonding wire 150, such as nickel or palladium, to improve the oxidation resistance of the first metal bonding wire 150, thereby improving the strength of the metal bonding layer and improving the welding bond.

[0030] Optionally, a second metal bonding wire 160 is provided within the second channel 130. The second metal bonding wire 160 is made of nickel or palladium, for example, nickel or palladium. It is understood that if the outer surface of the first metal bonding wire 150 is provided with an anti-oxidation layer, and the material of the anti-oxidation layer is the same as that of the second metal bonding wire 160 within the second channel 130, this arrangement, using the same material or metals of the same group, is more conducive to bonding and can increase the thickness of the anti-oxidation layer on the surface of the eutectic solder ball 151. For example, if the anti-oxidation layer on the surface of the first metal bonding wire 150 and the second metal bonding wire 160 are both made of metallic nickel, during welding, the second metal bonding wire 160 melts first, and after the nickel in the second metal bonding wire 160 melts, it bonds with the nickel layer on the surface of the first metal bonding wire 150, increasing the thickness of the nickel layer of the metal anti-oxidation layer and improving the welding bonding strength. Furthermore, using the same nickel or palladium material for both can also increase the welding volume of the eutectic solder ball 151 and improve the anti-oxidation performance. It should be noted that the volume of the eutectic solder ball 151 is not necessarily better the larger it is. The anti-oxidation layer on the surface of the first metal solder wire 150 and the second metal solder wire 160 are made of the same or similar metal materials, allowing for stepwise melting of the first metal solder wire 150. First, the surface anti-oxidation layer melts, then the internal first metal solder wire 150 itself melts. This stepwise melting avoids the formation of an excessively large eutectic solder ball 151. If the first metal solder wire 150 and the anti-oxidation layer are melted all at once, the melting volume is too large, resulting in incomplete melting and poor solder ball strength. Furthermore, melting the first metal solder wire 150 and the anti-oxidation layer all at once has low melting efficiency. The melting method in this embodiment increases the thickness of the metal anti-oxidation layer, appropriately increases the volume of the eutectic solder ball 151, and improves the welding effect. At the same time, it avoids the problems of low welding efficiency and poor welding strength caused by an excessively large melting volume, thereby improving welding efficiency, welding effect, and bonding strength.

[0031] In this embodiment, a first metal bonding wire 150 extends into the first channel 120 from the first end 111, and a second metal bonding wire 160 extends into the second channel 130 from the first end 111, then through the third channel 140 into the first channel 120. The end of the second metal bonding wire 160 away from the first end 111 abuts against the sidewall of the first channel 120, so that the second metal bonding wire 160 is located at the end of the first metal bonding wire 150, reaching the outlet of the first channel 120, and is closer to the outlet of the first channel 120 than the first metal bonding wire 150. Since the second metal bonding wire 160 is made of nickel or palladium, which has a certain degree of ductility... Utilizing the ductility of metal, the second metal welding wire 160 is pressed against the sidewall at the outlet of the first channel 120. Ideally, under the influence of the transmission force, the second metal welding wire 160 is completely in contact with the sidewall of the first channel 120, and under the transmission force of the first metal welding wire 150, the end of the first metal welding wire 150 contacts the second metal welding wire 160. If the first metal welding wire 150 continues to move downward, it can push out the second metal welding wire 160, so that the first metal welding wire 150 and the second metal welding wire 160 move downward together to the welding part, that is, together to the outlet of the first channel 120. Afterward, the spark rod discharges to the first metal welding wire 150 and the second metal welding wire 160 in the splitting structure 100, respectively. The high temperature generated by the discharge melts the ends of the first metal welding wire 150 and the second metal welding wire 160 to form a weld ball. Specifically, since the second metal bonding wire 160 is closer to the outlet and located below the first metal bonding wire 150, the second metal bonding wire 160 is melted first to form a droplet. At this time, the first metal bonding wire 150 moves downward, causing the metal droplet to be subjected to surface tension. The droplet covers the end of the first metal bonding wire 150, and the first metal bonding wire 150 is melted again to form a eutectic solder ball 151. That is, the second metal bonding wire 160 is melted first, then the first metal bonding wire 150 is melted, and a eutectic solder ball 151 is formed at the welding end.

[0032] It is understandable that by applying pressure to the first metal bonding wire 150, the eutectic solder ball 151 at the end is pressed against the surface of the pad under pressure. The high-frequency vibration wave of the ultrasonic wave is then transmitted to the two metal surfaces to be welded, the eutectic solder ball 151 and the pad, raising the temperature of the welding area. Applying further pressure causes plastic deformation at the interface between the eutectic solder ball 151 and the pad, as well as the first metal bonding wire 150 itself. The metal surfaces rub against each other, forming a fusion between molecular layers, thus achieving the welding purpose. Because of the second metal bonding wire 160, the formed eutectic solder ball 151 is larger, thereby increasing the thickness of the anti-oxidation layer between the pad and the eutectic solder ball 151, preventing oxidation of the pad, thus improving the welding bond strength, welding quality, and welding effect.

[0033] Optionally, the inner wall of the third channel 140 is provided with a protruding sharp corner 141 for abutting against the second metal welding wire 160 in the third channel 140. The sharp corner 141 is located near the outlet of the third channel 140, similar to a knife edge structure, which is conducive to bending and breaking the second metal welding wire 160, and facilitates the separation of the second metal welding wire 160 after welding.

[0034] Combination Figure 5 Optionally, in other embodiments, the second channel 130 is connected to a gas pipe 170, which is used to introduce an inert gas into the second channel 130. That is, the second bonding wire metal is not placed in the second channel 130; instead, an inert gas is introduced. The inert gas includes, but is not limited to, helium, nitrogen, neon, fluorine, or argon, and can be a natural or artificially synthesized gas with good antioxidant properties. It can be understood that during the welding process, the inert gas is introduced into the second channel 130, and pressure is applied to the first metal bonding wire 150, pressing the eutectic solder ball 151 at the end of the first metal bonding wire 150 to the surface of the pad. The high-frequency vibration wave of the ultrasonic wave is then transmitted to the two metal surfaces to be welded, the eutectic solder ball 151 and the pad, raising the temperature of the welding area. Applying a certain pressure causes plastic deformation at the interface between the eutectic solder ball 151 and the pad, as well as the first metal bonding wire 150 itself. The metal surfaces rub against each other, forming a fusion between molecular layers, thus achieving the welding purpose. The introduced inert gas can prevent oxidation of the weld metal layer surface, improve oxidation resistance, and lubricate and clean the inner wall of the weld cutter. This prevents residual metal debris from remaining on the inner wall during the movement of the first metal weld wire 150, which could damage the anti-oxidation layer on its surface or obstruct its movement, leading to weld cutter blockage. Furthermore, the inert gas can rapidly cool the weld cutter after welding, improving welding efficiency. It also prevents the weld from being affected by static electricity, improving welding quality and overall welding effect.

[0035] Combination Figure 6 It should be noted that, in some other optional embodiments, the chopping blade body 110 is provided with a fourth channel 171, which communicates with the second channel 130 and is used to connect the air pipe 170; the second metal welding wire 160 is disposed in the second channel 130, and the air pipe 170 is used to introduce inert gas into the second channel 130. That is, while the second metal welding wire 160 is disposed in the second channel 130, inert gas is introduced into the second channel 130 through the air pipe 170, which can better prevent the surface of the welded metal layer from being oxidized, improve the bonding force of the welded structure, improve the welding quality, and improve the welding effect. It also has the effects of accelerating cooling, cleaning the chopping blade, preventing the influence of static electricity, and improving welding efficiency. Optionally, the air pipe 170 can be disposed on the side or end face of the chopping blade body 110, which is not specifically limited here.

[0036] This invention also provides a welding apparatus, including an ultrasonic welding machine and a cleaving structure 100 as described in any of the foregoing embodiments, the cleaving structure 100 being mounted on the ultrasonic welding machine. A first metal welding wire 150 is inserted through a first channel 120, and a second metal welding wire 160 is inserted through a second channel 130. First, the second metal welding wire 160 enters the first channel 120 from the outlet of the second channel 130 via a third channel 140, near the outlet of the first channel 120. Due to the ductility of the second metal bonding wire 160, it presses against the sidewall at the outlet of the first channel 120. The end of the first metal bonding wire 150 is located above the second metal bonding wire 160. At this time, the first metal bonding wire 150 moves downward under the transmission force, pressing the second metal bonding wire 160 down together to the welding part (the outlet of the first channel 120). The spark rod discharges with the first metal bonding wire 150 and the second metal bonding wire 160 in the splitting structure 100. The high temperature generated by the discharge melts the ends of the second metal bonding wire 160 and the first metal bonding wire 150 to form eutectic solder balls 151. Specifically, the second metal bonding wire 160 is first melted to form a droplet shape and covers the end of the first metal bonding wire 150. The second metal bonding wire 160 is then melted to form eutectic solder balls 151. Continue to apply pressure to the first metal bonding wire 150. Under the pressure, the eutectic bonding ball 151 is pressed onto the surface of the pad. Then, the high-frequency vibration wave of the ultrasonic wave is transmitted to the two metal surfaces that need to be welded, namely the eutectic bonding ball 151 and the pad, so that the temperature of the welding area rises. Then, a certain pressure is applied to the first metal bonding wire 150, so that the interface between the eutectic bonding ball 151 and the pad and the bonding wire itself undergo plastic deformation. The metal surfaces rub against each other to form fusion between molecular layers, thus achieving the purpose of welding.

[0037] Because the cleaver structure 100 has a second channel 130, and a second metal welding wire 160 is provided within the second channel 130, the second metal welding wire 160 is made of nickel or palladium. During the welding process, the second metal welding wire 160 is first melted and coated onto the end of the first metal welding wire 150, which can increase the thickness of the anti-oxidation layer of the metal, thereby improving the welding bonding strength. Similarly, introducing an inert gas into the second channel 130 can also prevent the weld metal from being oxidized, improve the welding bonding strength, and improve the welding quality. At the same time, introducing an inert gas also has the effects of accelerating cooling, cleaning the cleaver, preventing the influence of static electricity, and improving welding efficiency.

[0038] Combination Figure 7 This invention also provides a wire-punching method, employing the splitting blade structure 100 as described in any of the foregoing embodiments, the method comprising: Using the aforementioned cleaving structure 100, eutectic solder balls 151 are formed on the first solder pad 210. The second metal solder wire 160 first melts to form droplets, which then coat the end of the first metal solder wire 150. The first metal solder wire 150 is then melted to form the eutectic solder ball 151. The eutectic solder ball 151 can increase the thickness of the anti-oxidation layer on the metal surface, improve the bonding strength of the welded structure, and result in higher weld strength. Alternatively, an inert gas can be introduced into the second channel 130 to prevent oxidation of the metal surface layer during welding. Alternatively, based on the second metal solder wire 160 within the second channel 130, an inert gas can be introduced into the second channel 130 to further prevent oxidation of the metal surface layer during welding, improve the bonding strength of the welded structure, and result in higher weld strength and better weld quality.

[0039] It is easy to understand that during the welding process, when the first metal bonding wire 150 moves downward under the transmission force, it causes the first metal bonding wire 150 and the second metal bonding wire 160 to move together. Since the axis of the third channel 140 is approximately perpendicular to the first channel 120 and the second channel 130, at the exit position of the third channel 140, the second metal bonding wire 160 is subjected to the shearing force of the first metal bonding wire 150 moving downward, causing the second metal bonding wire 160 to bend and break at the exit of the third channel 140. The arrangement of the third channel 140 causes the second metal bonding wire 160 to bend. In this embodiment, the length of the third channel 140 is relatively short, resulting in a smaller contact area between the second metal bonding wire 160 and the inner wall of the third channel 140, making it easier to bend and break the second metal bonding wire 160, and making it easier to separate the second metal bonding wire 160 from the eutectic solder ball 151.

[0040] Furthermore, the inner wall of the third channel 140 is provided with a protruding sharp corner 141 for contacting the second metal welding wire 160 inside the third channel 140. The sharp corner 141 is located near the outlet of the third channel 140, similar to a knife edge structure, which is conducive to bending and breaking the second metal welding wire 160, and facilitates the separation of the second metal welding wire 160 after welding.

[0041] After welding is completed, the splitting structure 100 and the eutectic solder ball 151 are separated, so that the first metal solder line 150 remains on the eutectic solder ball 151; this method can achieve vertical wire bonding on the first solder pad 210.

[0042] Optionally, the end of the first metal bonding wire 150 away from the eutectic solder ball 151 is soldered to the second pad 220. The soldering method between the first metal bonding wire 150 and the second pad 220 can be achieved using a soldering device including the aforementioned wedge structure 100.

[0043] In summary, the cleaving structure 100, welding equipment, and wire bonding method provided by the embodiments of the present invention have the following beneficial effects: The cleaver structure 100 provided in this embodiment of the invention has a first channel 120 and a second channel 130 spaced apart on the cleaver body 110. The first channel 120 and the second channel 130 are connected at the welding end. During the welding process, adding a second metal welding wire 160 (nickel or palladium) can increase the thickness of the anti-oxidation layer, preventing oxidation of the weld metal surface, thereby improving the bonding strength of the welded structure, improving the welding quality, and improving the welding effect. The second metal welding wire 160 and an inert gas can be added simultaneously during welding, which not only improves the bonding strength of the welded structure but also accelerates cooling, cleans the cleaver, prevents static electricity effects, and improves welding efficiency.

[0044] The welding equipment provided in this embodiment of the invention includes the aforementioned cleaving structure 100 and an ultrasonic machine platform. The cleaving structure 100 is mounted on the ultrasonic machine platform. Using this welding equipment, welding wires and pads can be completed, and the thickness of the anti-oxidation layer can be increased during the welding process, thereby improving the bonding force of the welded structure, improving the welding quality, and improving the welding effect.

[0045] The wire bonding method provided in this embodiment of the invention uses the above-mentioned cleaving structure 100 for welding wire bonding, which is convenient to operate and can effectively improve the bonding force of the welded structure, improve the welding quality, and improve the welding effect.

[0046] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cleaver structure, characterized in that, Used for wire bonding on pads; the wedge structure includes a wedge body, the wedge body includes a first end and a second end, the second end serving as the welding end; the wedge body is provided with a first channel and a second channel, the first channel passing through the first end and the second end along an axis, the second channel communicating with the outside at the first end and spaced apart from the first channel, the second channel communicating with the first channel at the second end; the first channel is used for a first metal bonding wire to pass through, and the second channel is used for a second metal bonding wire to pass through; The second end is provided with a third channel, which is used to connect the first channel and the second channel; the axes of the first channel and the second channel are parallel to each other, and the axis of the third channel is perpendicular to the axes of the first channel and the second channel respectively; The inner wall of the third channel is provided with a protruding sharp corner, which is located near the outlet of the third channel and is used to abut against the second metal welding wire in the third channel. The second channel contains the second metal welding wire, which is made of nickel or palladium; the outer surface of the first metal welding wire is provided with an anti-oxidation layer, the material of which is the same as that of the second metal welding wire; during welding, the ignition rod discharges to the first metal welding wire and the second metal welding wire respectively, and the high temperature generated by the discharge melts the ends of the first metal welding wire and the second metal welding wire to form a welding ball.

2. The cleaving structure according to claim 1, characterized in that, The first metal bonding wire extends into the first channel from the first end, and the second metal bonding wire extends into the second channel from the first end, extends into the first channel through the third channel, and the end of the second metal bonding wire away from the first end abuts against the side wall of the first channel, so that the second metal bonding wire is located at the end of the first metal bonding wire, and the second metal bonding wire is closer to the outlet of the first channel than the first metal bonding wire.

3. The cleaving structure according to claim 1, characterized in that, The second channel is connected to a gas tube, which is used to introduce inert gas into the second channel.

4. The cleaving structure according to claim 3, characterized in that, The chopping knife body is provided with a fourth channel, which is connected to the second channel and is used to connect an air tube; The second metal welding wire is disposed in the second channel, and the gas pipe is used to introduce inert gas into the second channel.

5. A welding device, characterized in that, It includes an ultrasonic welding machine base and a cleaver structure as described in any one of claims 1 to 4, the cleaver structure being mounted on the ultrasonic welding machine base.

6. A wire bonding method, characterized in that, The method, employing the cleaver structure as described in any one of claims 1 to 4, comprises: Solder balls are formed on the first pad using the aforementioned cleaver structure; wherein, the second metal wire is first melted to form a droplet shape, which covers the end of the first metal wire, and then the first metal wire is melted to form a solder ball; Separate the cleaver structure and the solder ball, leaving the first metal solder line on the solder ball; The end of the first metal wire away from the solder ball is soldered onto the second pad.

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