Multilayer ceramic electronic component

Abstract

The disclosure provides a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including first internal electrodes and second internal electrodes and dielectric layers disposed to face each other and be alternately stacked with respective dielectric layers interposed between the first internal electrodes and the second internal electrodes, a first external electrode connected to the first internal electrodes, a second external electrode connected to the second internal electrodes, and a protective layer disposed on the ceramic main body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion auxiliary layer and a coating layer, an average thickness of the protective layer is equal to or greater than 70 nm and less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is equal to or greater than 0.25 and equal to or less than 0.75.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0189101, filed with the Korean Intellectual Property Office on December 31, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer ceramic electronic component. Background Technology

[0003] Recently, with the expansion of applications for electronic products, the technology of using multilayer ceramic electronic components has also expanded. In particular, according to vehicle electronics (on-board electronic devices), structures that place the vehicle's electronic control unit (ECU) or transmission control unit (TCU) in the engine compartment or directly attach it to the transmission have been used.

[0004] However, when existing multilayer ceramic electronic components are used in harsh environments such as high temperatures and high vibrations, repeated expansion and contraction due to high / low temperature cycling results in continuous mechanical stress. Furthermore, the continuous application of mechanical stress is a major cause of cracking in terminal electrodes or solder.

[0005] Furthermore, in the manufacturing process of multilayer ceramic electronic components, in many cases, a plating layer is formed on the external electrode after sintering the ceramic body and the external electrode. However, when manufacturing electronic components through high-temperature heat treatment, a hydrophilic oxide layer with high surface energy is formed on the surface of the ceramic body, and the possibility of pores being generated at the interface between the ceramic body and the external electrode increases, with the pores becoming pathways for moisture to permeate.

[0006] Specifically, when multilayer ceramic electronic components are continuously exposed to high temperature and / or high humidity environments, the likelihood of ion migration in the external electrodes of the multilayer ceramic electronic components themselves increases. The oxide layer formed on the surface of the ceramic substrate has high surface energy, and due to the high temperature, high humidity, and hydrophilicity of the oxide layer, moisture easily adheres to the surface of the ceramic substrate when voltage is applied. Ion migration occurs, where electrode material migrates towards the opposite electrode through this moisture, and problems such as reduced reliability of the multilayer ceramic electronic components (e.g., short circuits) may occur. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer ceramic electronic component that can prevent performance degradation due to moisture penetration.

[0008] Another aspect of this disclosure provides a multilayer ceramic electronic component capable of suppressing ion migration.

[0009] Another aspect of this disclosure provides a multilayer ceramic electronic component that can reduce defects such as short circuits.

[0010] Another aspect of this disclosure provides a multilayer ceramic electronic component capable of exhibiting excellent reliability.

[0011] According to one aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a first inner electrode and a second inner electrode disposed facing each other and alternately stacked, and a dielectric layer, wherein the respective dielectric layer is disposed between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode; a second outer electrode connected to the second inner electrode; and a protective layer disposed on the ceramic body, the first outer electrode and the second outer electrode, wherein the protective layer includes an adhesion assist layer and a coating layer, the average thickness of the protective layer is greater than or equal to 70 nm and less than 400 nm, and the ratio of the average thickness of the coating layer to the average thickness of the protective layer is greater than or equal to 0.25 and less than or equal to 0.75.

[0012] According to another aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a first inner electrode and a second inner electrode disposed facing each other and alternately stacked, and a dielectric layer, wherein the respective dielectric layer is disposed between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode; a second outer electrode connected to the second inner electrode; and a protective layer disposed on the ceramic body, the first outer electrode and the second outer electrode, wherein the protective layer includes an adhesion assist layer and a coating layer, the average thickness of the protective layer is greater than or equal to 400 nm and less than or equal to 600 nm, and the ratio of the average thickness of the coating layer to the average thickness of the protective layer is greater than or equal to 0.05 and less than or equal to 0.95.

[0013] According to another aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a first inner electrode and a second inner electrode disposed facing each other and alternately stacked, and a dielectric layer, wherein the respective dielectric layer is disposed between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode; a second outer electrode connected to the second inner electrode; and a cover layer disposed on the ceramic body, the first outer electrode and the second outer electrode, wherein the cover layer includes a first layer and a second layer, the average thickness of the cover layer is greater than or equal to 70 nm and less than 400 nm, and the ratio of the average thickness of the second layer to the average thickness of the cover layer may be greater than or equal to 0.25 and less than or equal to 0.75.

[0014] According to another aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a first inner electrode and a second inner electrode disposed facing each other and alternately stacked, and a dielectric layer, wherein the respective dielectric layer is disposed between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode; a second outer electrode connected to the second inner electrode; and a cover layer disposed on the ceramic body, the first outer electrode and the second outer electrode, wherein the cover layer includes a first layer and a second layer, the average thickness of the cover layer is greater than or equal to 400 nm and less than or equal to 600 nm, and the ratio of the average thickness of the second layer to the average thickness of the cover layer is greater than or equal to 0.05 and less than or equal to 0.95. Attached Figure Description

[0015] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0016] Figure 1 This is a schematic perspective view illustrating a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0017] Figure 2 It is shown Figure 1 A schematic three-dimensional diagram of the ceramic body;

[0018] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I';

[0019] Figure 4 yes Figure 3 Enlarged view of region A;

[0020] Figure 5 yes Figure 4 Enlarged view of region B;

[0021] Figure 6A These are captured images of multilayer ceramic electronic components in which ion migration has not occurred, and Figure 6B These are captured images of multilayer ceramic electronic components where ion migration has already occurred; and

[0022] Figure 7A These are captured images of multilayer ceramic electronic components normally mounted on a board. Figure 7B The captured image shows misaligned multilayer ceramic electronic components during the mounting process on a board. Figure 7C This is a captured image of a multilayer ceramic electronic component that has separated from the board when it was being mounted on the board. Detailed Implementation

[0023] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0024] In the accompanying drawings, the X direction refers to the first direction, the L direction, or the length direction; the Y direction refers to the second direction, the W direction, or the width direction; and the Z direction refers to the third direction, the T direction, or the thickness direction.

[0025] This disclosure relates to a multilayer ceramic electronic component. Figures 1 to 5 This is a schematic diagram illustrating a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure. In the following, reference will be made to... Figures 1 to 5 Describes a multilayer ceramic electronic component according to this disclosure.

[0026] A multilayer ceramic electronic assembly 100 according to an exemplary embodiment of the present disclosure may include: a ceramic body 110 including a first inner electrode 121 and a second inner electrode 122 disposed facing each other and alternately stacked, and a dielectric layer 111, wherein the respective dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122; a first outer electrode 131 connected to the first inner electrode 121; a second outer electrode 132 connected to the second inner electrode 122; and a protective layer 140 disposed on the ceramic body 110, the first outer electrode 131 and the second outer electrode 132.

[0027] In this case, the protective layer 140 may include an adhesion assist layer 140b and a coating 140a. To improve the moisture resistance reliability of multilayer ceramic electronic components, methods such as forming a waterproof layer on the outer surface of the multilayer ceramic electronic component can be used. However, this method typically has the limitation of weak adhesion between the surface of the ceramic body and the waterproof layer, and has the problem of difficulty in adequately ensuring the reliability of the substrate when the multilayer ceramic electronic component is exposed to repetitive vibrations. According to an exemplary embodiment of this disclosure, the protective layer 140 disposed on the surface of the multilayer ceramic electronic component includes an adhesion assist layer 140b and a coating 140a to solve the above-mentioned problems. As a result, moisture resistance reliability can be improved by preventing moisture penetration, inhibiting ion migration, and increasing the bonding strength with the multilayer ceramic electronic component.

[0028] In exemplary embodiments of this disclosure, the average thickness of the protective layer 140 of the multilayer ceramic electronic component can be greater than or equal to 70 nm and less than 400 nm, and the average thickness t of the coating a With the average thickness t of the protective layer 140 h The ratio t a / t hThe thickness can be greater than or equal to 0.25 and less than or equal to 0.75. In this specification, the term "thickness" can refer to the thickness of a component measured in a direction perpendicular to the surface of a component, and the term "average thickness" can refer to the arithmetic mean of the thicknesses measured at points that divide the area where the protective layer 140 is disposed into ten equal parts at equal intervals, relative to a cross-section of the multilayer ceramic electronic assembly taken along a direction perpendicular to the Z-axis and passing through the center of the multilayer ceramic electronic assembly. The measurement of the average thickness is not limited to these examples, and those skilled in the art can choose the number of measurement points, the interval between measurement points, etc., if desired. The thickness measurement at each measurement point can be performed using a microscope image (e.g., a scanning electron microscope (SEM) image), but is not limited to this. The average thickness of the protective layer 140 and the average thickness of the coating can be values ​​measured at the same points. When the average thickness of the protective layer 140 and the average thickness of the coating of the multilayer ceramic electronic assembly according to this exemplary embodiment are within the above ranges, the moisture resistance can be excellent, and the bonding strength of the protective layer 140 can be improved, thereby further improving moisture resistance reliability.

[0029] In another exemplary embodiment of this disclosure, the average thickness of the protective layer 140 of the multilayer ceramic electronic component can be greater than or equal to 400 nm and less than or equal to 600 nm, and the average thickness t of the coating a With the average thickness t of the protective layer 140 h The ratio t a / t h The thickness can be greater than or equal to 0.05 and less than or equal to 0.95. When the average thickness of the protective layer 140 and the average thickness of the coating of the multilayer ceramic electronic component according to this exemplary embodiment are within the above range, moisture resistance reliability can be improved, and defects when mounting the multilayer ceramic electronic component on a board can be suppressed.

[0030] A multilayer ceramic electronic component 100 according to an exemplary embodiment of the present disclosure may include a ceramic body 110, the ceramic body 110 including alternately stacked first internal electrodes 121 and second internal electrodes 122 and dielectric layers 111, with the respective dielectric layers 111 being located between the first internal electrodes 121 and the second internal electrodes 122.

[0031] The ceramic body 110 may include a first surface S1 and a second surface S2 that are opposite to each other in a first direction (X direction), a third surface S3 and a fourth surface S4 that are opposite to each other in a second direction (Y direction), and a fifth surface S5 and a sixth surface S6 that are opposite to each other in a third direction (Z direction).

[0032] The specific shape of the ceramic body 110 is not particularly limited, but as shown in the figure, it can be a hexahedral shape or a shape similar to a hexahedron. Although the ceramic body 110 does not have a perfectly straight hexahedral shape due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the sintering process, the ceramic body 110 can be generally hexahedral in shape. If necessary, the ceramic body 110 can be rounded so that its edges are not angled. Rounding can be, for example, tumble polishing, but is not limited to this.

[0033] Dielectric layer 111, first internal electrode 121, and second internal electrode 122 may be alternately stacked in ceramic body 110. Dielectric layer 111, first internal electrode 121, and second internal electrode 122 may be stacked in the third direction (Z direction). Multiple dielectric layers 111 may be in a sintered state, and adjacent dielectric layers 111 may be integral with each other, making their boundaries difficult to distinguish without the use of a scanning electron microscope (SEM).

[0034] According to exemplary embodiments in this disclosure, dielectric layer 111 may comprise dielectric material composed of (Ba 1-x Ca x (Ti) 1-y (Zr,Sn,Hf) y The component is represented by BaTiO3 (here, 0 ≤ x ≤ 1 and 0 ≤ y ≤ 0.5). The component can be, for example, a compound in which Ca, Zr, Sn, and / or Hf are partially dissolved in BaTiO3. In the above compositional formula, x can be in the range of 0 or greater than or equal to 1, and y can be in the range of 0 or greater than or equal to 0.5, but is not limited thereto. For example, when x is 0, y is 0, and z is 0 in the above compositional formula, the component can be BaTiO3. Furthermore, according to the purpose of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can be added to the component.

[0035] The dielectric layer 111 can be formed by adding additives to a slurry comprising the above-described materials as needed, coating the slurry onto a carrier film, and then drying it to prepare multiple ceramic sheets. The ceramic sheets can be formed by using a doctor blade to fabricate the slurry into sheets with a thickness of several micrometers, but are not limited thereto.

[0036] The ceramic body 110 can be formed by alternately stacking ceramic green sheets with a first inner electrode 121 and a second inner electrode 122 printed on them in the third direction (Z direction). The method of printing the first inner electrode and the second inner electrode can be screen printing, gravure printing, etc., but is not limited to these methods.

[0037] The first inner electrode 121 and the second inner electrode 122 may be stacked such that their end surfaces are respectively exposed to opposite portions of the ceramic body 110. Specifically, the first inner electrode 121 and the second inner electrode 122 may be respectively exposed to opposite surfaces of the ceramic body 110 in a first direction (X direction), the first inner electrode 121 may be exposed to the first surface S1 of the ceramic body 110, and the second inner electrode 122 may be exposed to the second surface S2 of the ceramic body 110.

[0038] The first internal electrode 121 and the second internal electrode 122 may comprise a conductive metal. The conductive metal may comprise, for example, one or more of silver (Ag), nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The first internal electrode 121 and the second internal electrode 122 may be formed using a conductive paste comprising the conductive metal.

[0039] In the multilayer ceramic electronic assembly according to the present disclosure, a first external electrode 131 and a second external electrode 132 may be disposed on the outer surface of the ceramic body 110. The first external electrode 131 may be disposed on the first surface S1 of the ceramic body 110 of the multilayer ceramic electronic assembly 100 according to the present disclosure, and the second external electrode 132 may be disposed on the second surface S2 of the ceramic body 110.

[0040] The first external electrode 131 may include a first electrode layer 131a, a first conductive layer 131b, and a first metal layer 131c. The second external electrode 132 may include a second electrode layer 132a, a second conductive layer 132b, and a second metal layer 132c. The first electrode layer 131a may be connected to the first internal electrode 121, and the second electrode layer 132a may be connected to the second internal electrode 122. Additionally, the first conductive layer 131b may be disposed on the first electrode layer 131a, and the second conductive layer 132b may be disposed on the second electrode layer 132a. The first conductive layer 131b may be configured to cover the first electrode layer 131a, and the second conductive layer 132b may be configured to cover the second electrode layer 132a.

[0041] In exemplary embodiments of this disclosure, the first electrode layer 131a and the second electrode layer 132a of the multilayer ceramic electronic component 100 can be sintered electrodes comprising a conductive metal. The conductive metal may comprise one or more of, for example, nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.

[0042] Additionally, the first electrode layer 131a and the second electrode layer 132a may contain a glass composition. The glass composition may be a composition of oxides mixed together, and may be one or more selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxides, alkali metal oxides, and alkaline earth metal oxides, but is not particularly limited thereto. The transition metal may be selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); the alkali metal may be selected from the group consisting of lithium (Li), sodium (Na), and potassium (K); and the alkaline earth metal may be at least one selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0043] For example, the first electrode layer 131a and the second electrode layer 132a can be formed by immersing a ceramic body in a conductive paste containing a conductive metal and then sintering the ceramic body, or by printing the conductive paste onto the surface of the ceramic body using screen printing, gravure printing, or similar methods and then sintering the ceramic body. Alternatively, the first electrode layer 131a and the second electrode layer 132a can be formed by coating the conductive paste onto the surface of the ceramic body or by transferring a dry film obtained from drying the conductive paste onto the ceramic body and then sintering the ceramic body, but are not limited to these methods. For example, the first electrode layer 131a and the second electrode layer 132a can be formed by forming conductive paste on the ceramic body using various methods other than those described above, and then sintering the ceramic body.

[0044] According to exemplary embodiments of this disclosure, a first conductive layer 131b and a second conductive layer 132b disposed on a first electrode layer 131a and a second electrode layer 132a of a multilayer ceramic electronic assembly 100 may be plating layers. The first conductive layer 131b and the second conductive layer 132b may contain nickel (Ni) as a main component, and may contain one or more of the following, but are not limited to, components selected from the group consisting of copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The plating layer may be one or more layers, and may be formed by sputtering or electrodeposition, but is not limited to these methods.

[0045] In exemplary embodiments of this disclosure, the first metal layer 131c and the second metal layer 132c disposed on the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic assembly 100 may be plating layers. The first metal layer 131c may be configured to cover the first conductive layer 131b, and the second metal layer 132c may be configured to cover the second conductive layer 132b. The first metal layer and the second metal layer may contain tin (Sn) as the main component, and may contain one or more of the following, but are not limited to, components selected from the group consisting of copper (Cu), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.

[0046] In an exemplary embodiment, at least a portion of the first external electrode 131 of the multilayer ceramic electronic assembly according to the present disclosure extends to and is disposed on the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110. Additionally, at least a portion of the second external electrode 132 extends to and is disposed on the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110. In this case, the first external electrode 131 and the second external electrode 132 can be spaced apart from each other. When at least a portion of the corresponding first external electrode 131 and / or second external electrode 132 extends to and is disposed on the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110, the extended portion can serve as a so-called strip and can be used to improve the mounting strength of the multilayer ceramic electronic assembly 100 according to the present disclosure and prevent moisture penetration into the multilayer ceramic electronic assembly 100.

[0047] In the multilayer ceramic electronic assembly according to this disclosure, a protective layer 140 may be disposed on the ceramic body, the first external electrode 131, and the second external electrode 132. The protective layer 140 may be configured to cover at least a portion of the ceramic body, the first external electrode 131, and / or the second external electrode 132. In this specification, "a component is configured to cover the ceramic body 110" means that the component is configured such that the portion of the ceramic body 110 covered by the component is not exposed to the outside. In this case, the protective layer 140 may be configured to substantially cover all of the ceramic body, the first external electrode 131, and / or the second external electrode 132. In this specification, "substantially covering" a predetermined area means not only that the component is configured to strictly cover the entire area, but also includes manufacturing process errors, for example, the ratio of the area in the predetermined area where the component is not disposed to the total area of ​​the predetermined area is greater than or equal to 0% and less than or equal to 5%. In an exemplary embodiment, the protective layer 140 may be configured to cover the entire surface of the multilayer ceramic electronic assembly according to this disclosure. Therefore, superior moisture resistance reliability can be obtained compared to when a protective layer is formed only on a portion of a multilayer ceramic electronic component.

[0048] The protective layer 140 may include an adhesion assist layer 140b and a coating 140a. The adhesion assist layer and the coating 140a may be stacked sequentially on the ceramic body 110, the first external electrode 131, and the second external electrode 132. In this case, the adhesion assist layer may be configured to be in direct contact with the ceramic body, the first external electrode 131, and the second external electrode 132, and the coating 140a may be disposed on the adhesion assist layer 140b.

[0049] In one exemplary embodiment, the coating 140a covering the first external electrode 131 and the coating 140a covering the second external electrode 132 may be connected to each other.

[0050] On the other hand, the adhesion assist layer 140b covering the first external electrode 131 and the adhesion assist layer 140b covering the second external electrode 132 can be spaced apart from each other.

[0051] Furthermore, the protective layer 140 may include an adhesion aid layer 140b and a coating 140a, which may be cross-linked together. In this specification, the term "bonding" refers to the state in which the surfaces of the adhesive and the adherend are bonded together by interfacial bonding forces. These interfacial bonding forces may arise from chemical interactions between surface molecules of the adhesive and surface molecules of the adherend, or they may arise from mechanical bonding. In this specification, the term "cross-linking" refers to the formation of a network structure through chemical / physical bonds between molecules (such as covalent bonds, ionic bonds, van der Waals bonds, or hydrogen bonds). The adhesion aid layer 140b and the coating 140a may be cross-linked together to achieve superior bonding.

[0052] In the exemplary embodiments of this disclosure, the composition of the adhesion aid layer 140b of the multilayer ceramic electronic component is not particularly limited, as long as it exhibits excellent adhesion to the ceramic body 110 and / or the coating 140a described later. The adhesion aid layer 140b may comprise, but is not limited to, polystyrene polymers, vinyl acetate polymers, polyester polymers, polyethylene polymers, polypropylene polymers, polyamide polymers, rubber polymers, acrylic polymers, phenolic polymers, epoxy polymers, polyurethane polymers, siloxane polymers, melamine polymers, and alkyd polymers.

[0053] In an exemplary embodiment, the polymer of the adhesion assist layer 140b of the multilayer ceramic electronic assembly according to the present disclosure may comprise a compound having two or more vinyl groups. The compound comprising two or more vinyl groups, according to the present disclosure, for improving the mechanical / chemical strength of the protective layer 140, may be bonded to the surface of the ceramic body 110 and may crosslink with the coating 140a, described later. In the multilayer ceramic electronic assembly according to the present disclosure, the adhesion between the adhesion assist layer 140b and the surface of the ceramic body 110 and / or the coating 140a can be improved by applying a compound comprising two or more vinyl groups to the adhesion assist layer 140b.

[0054] There are no particular limitations on compounds containing two vinyl groups, and they may include, for example, 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (V4D4), 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane (V3D3), divinylbenzene (DVB), diethylene glycol divinyl ether (DEGDVE), ethylene glycol diacrylate (EGDA), ethylene glycol dimethacrylate (EGDMA), 1,3-divinyl-1,1,3,3-tetramethyl-disiloxane (V2D2), etc.

[0055] In an exemplary embodiment, the adhesion assist layer 140b of the multilayer ceramic electronic component according to this disclosure may have an average thickness tb of 25 nm or greater. The average thickness of the adhesion assist layer 140b may be a value measured by the method described above. When the adhesion assist layer 140b is formed using a compound comprising two or more vinyl groups, at least one vinyl group may be used to bond the adhesion assist layer 140b to the ceramic body 110, and another vinyl group may be used to bond the adhesion assist layer 140b to the coating 140a, which will be described later. In this case, in order for the adhesion assist layer 140b according to this exemplary embodiment to have sufficient adhesive strength, the vinyl groups of the polymer of the adhesion assist layer 140b need to be sufficiently drawn onto the surface. The average thickness may be set for this purpose; for example, it is necessary to set the adhesion assist layer 140b with an average thickness of at least 25 nm to ensure sufficient adhesion, and when the average thickness of the adhesion assist layer 140b is less than 25 nm, the strength of the protective layer 140 may be reduced due to insufficient adhesion. There is no particular upper limit to the average thickness of the adhesion aid layer 140b, and the average thickness of the adhesion aid layer 140b may be less than or equal to, for example, t. h -25nm, where t h It is the average thickness of the protective layer 140.

[0056] In exemplary embodiments of this disclosure, the coating 140a of the protective layer 140 of the multilayer ceramic electronic component may comprise a hydrophobic polymer. A hydrophobic polymer may refer to a polymer formed from hydrophobic monomers. In this specification, the term "hydrophobic" may mean that a surface formed using a certain component has a contact angle of 90° or greater relative to water at room temperature / 1 atmosphere. The hydrophobic monomer is not particularly limited, provided it exhibits sufficient water-repellent capability, and may comprise one or more monomers selected from the group consisting of siloxanes, acrylics, amines, carbonates, esters, and fluorocarbons.

[0057] In an exemplary embodiment, the protective layer 140 (e.g., coating 140a) of the multilayer ceramic electronic component according to this disclosure may use a compound comprising vinyl and fluorine. The vinyl can crosslink with the aforementioned adhesion aid layer 140b to enhance the adhesion of the coating 140a, and the fluorine provides excellent water resistance and physical / chemical resistance to external contaminants.

[0058] There are no particular limitations on the types of compounds containing vinyl groups and fluorine. Compounds containing vinyl groups and fluorine may include, for example, 1H,1H,2H,2H-perfluorodecyl acrylate (PFDA), perfluorodecyl methacrylate (PFDMA), dodecafluoroheptyl acrylate, pentafluorophenyl methacrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-pentadecafluorononyl acrylate, 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-pentadecafluorononyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,8-tetrafluorooctyl acrylate, 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,8-tridecylfluorooctyl acrylate, and 2-methyl-3,3,4,4,5,5,6,6,7,7,8 8,8-Tridecylfluorooctyl acrylate, 3,3,4,4,5,5,6,6,7,7,7-Undecylfluoroheptyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,7,7,7-Undecylfluoroheptyl acrylate, 3,3,4,4,5,5,6,6,6-Nonafluorohexyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,6-Nonafluorohexyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-Nondecylfluoroundecyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,7,7,8,8,9 9,10,10,11,11,11-Noctodecylfluoroundecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-Ticosicofluorododecyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-Ticosicofluorododecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,13-Ticosicofluorotridecyl acrylate, 2-methyl Methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,13-tetrafluorotetradecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-tetradecyl tetradecyl acrylate, and 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-tetradecyl tetradecyl acrylate, etc., but not limited to these.

[0059] In another exemplary embodiment of this disclosure, the coating 140a of the multilayer ceramic electronic component can be an inorganic thin film layer. The inorganic thin film layer can be formed using oxides or nitrides of metals and / or nonmetallic compounds, or mixtures thereof. In this exemplary embodiment, when the coating 140a of the protective layer 140 is an inorganic thin film layer, chemical reactions with external contaminants can be significantly reduced, thereby improving the reliability of the protective layer 140. The composition of the inorganic thin film layer is not particularly limited and may include, for example, one or more oxides selected from the group consisting of Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, and Y2O3, one or more selected from the group consisting of SrTiO3 and BaTiO3, or oxides selected from the group consisting of AlN and SiN. x One or more nitrides selected from the group.

[0060] In an exemplary embodiment, the coating 140a of the multilayer ceramic electronic component according to this disclosure may have an average thickness of 25 nm or greater. The average thickness of the coating 140a may be a value measured by the method described above. If an adhesion aid layer 140b is present, the coating 140a may also be formed on the adhesion aid layer 140b as a film with a predetermined level or greater thickness to have the desired waterproof capability. The average thickness is set for this purpose, and the average thickness of the coating 140a is preferably 25 nm or greater. There is no particular upper limit to the average thickness of the coating 140a, and the average thickness of the coating 140a may be less than or equal to, for example, t. h -25nm, where t h It is the average thickness of the protective layer 140.

[0061] The methods for forming the adhesion assist layer 140b and coating 140a of the multilayer ceramic electronic component according to this disclosure are not particularly limited. The adhesion assist layer 140b and coating 140a can be formed by, for example, atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc., but are not limited thereto.

[0062] In another exemplary embodiment of this disclosure, a multilayer ceramic electronic component may include: a ceramic body 110 including a first inner electrode 121 and a second inner electrode 122 disposed facing each other and alternately stacked, and a dielectric layer 111, wherein the respective dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122; a first outer electrode 131 connected to the first inner electrode 121; a second outer electrode 132 connected to the second inner electrode 122; and a cover layer 140 (corresponding to the protective layer 140 of the foregoing embodiment), disposed on the ceramic body 110, the first outer electrode 131 and the second outer electrode 132, wherein the cover layer 140 includes a first layer 140b and a second layer 140a (corresponding to the adhesion assist layer 140b and the coating layer 140a of the foregoing embodiment, respectively), the average thickness of the cover layer 140 is greater than or equal to 70 nm and less than 400 nm, and the average thickness of the second layer 140a is t a With the average thickness t of the cover layer 140 h The ratio t a / t h It can be greater than or equal to 0.25 and less than or equal to 0.75.

[0063] In another exemplary embodiment of this disclosure, a multilayer ceramic electronic component may include: a ceramic body 110 including a first inner electrode 121 and a second inner electrode 122 disposed facing each other and alternately stacked, and a dielectric layer 111, wherein the respective dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122; a first outer electrode 131 connected to the first inner electrode 121; a second outer electrode 132 connected to the second inner electrode 122; and a cover layer 140 disposed on the ceramic body 110, the first outer electrode 131 and the second outer electrode 132, wherein the cover layer 140 includes a first layer 140b and a second layer 140a, the average thickness of the cover layer 140 is greater than or equal to 400 nm and less than or equal to 600 nm, and the average thickness of the second layer 140a is t a With the average thickness t of the cover layer 140 h The ratio t a / t h It can be greater than or equal to 0.05 and less than or equal to 0.95.

[0064] The average thickness of the second 140a layer can be 25 nm or greater.

[0065] The cover layer 140 may include a first layer and a second layer 140a that are interconnected with each other.

[0066] The cover layer 140 may be configured to cover at least a portion of the ceramic body 110, the first external electrode 131 and / or the second external electrode 132.

[0067] The first layer 140b may include one or more polymers selected from the group consisting of polystyrene polymers, vinyl acetate polymers, polyester polymers, polyethylene polymers, polypropylene polymers, polyamide polymers, rubber polymers, acrylic polymers, phenol polymers, epoxy polymers, polyurethane polymers, siloxane polymers, melamine polymers, and alkyd polymers.

[0068] The polymer of the second layer 140a may contain compounds having two or more vinyl groups.

[0069] The second layer 140a may contain a hydrophobic polymer.

[0070] The second layer 140a may contain compounds having vinyl and fluorine properties.

[0071] The second layer 140a can be an inorganic thin film layer.

[0072] The second layer 140a may contain materials composed of Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, Y2O3, SrTiO3, BaTiO3, AlN, and SiN. x Choose one or more from the groups formed.

[0073] In this exemplary embodiment, descriptions of content that is repeated in the above embodiments will be omitted.

[0074] <Experimental Example>

[0075] The ion migration suppression, bonding strength, mounting defects, and moisture load defects of the multilayer ceramic electronic components according to this disclosure were tested under the following conditions.

[0076] The components used in the test were multilayer ceramic capacitors (MLCCs), in which copper (Cu) is used to form the first and second electrode layers on a ceramic body, followed by Ni and Sn plating layers. One hundred mass-produced MLCCs with dimensions of 1.6mm × 0.8mm × 0.8mm, supplied by Samsung Electro-Mechanics, were used.

[0077] A protective layer 140 was formed on a multilayer ceramic electronic component using an initiation chemical vapor deposition (iCVD) apparatus. Tetrabutyl peroxide (TBPO) was used as the deposition initiator, and 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (V4D4) and perfluorodecyl methacrylate (PFDMA) were used as the materials for the adhesion aid layer and the coating, respectively.

[0078] As deposition conditions, the multilayer ceramic electronic components were placed on a plate maintained at 40°C, and the filament temperature was set to 200°C. Subsequently, the deposition time was adjusted to manufacture multilayer ceramic electronic components with different protective layer thicknesses.

[0079] Ion migration was performed by adding 1.3 ml of distilled water between the two external electrodes at 25°C and 1 atm, followed by applying a 15 V direct current (DC) to the external electrodes. As ion migration proceeded after the application of power to the external electrodes, dendrites of the metallic component were observed to grow from the negative electrode to the positive electrode of the MLCC. A current of 1 mA or greater flowed when the two electrodes of the multilayer ceramic electronic component were connected to each other via the grown dendrites, and the number of multilayer ceramic electronic components exhibiting current flow within five minutes was measured. Figure 6A These are captured images of multilayer ceramic electronic components where ion migration is not observed. Figure 6B These are captured images of multilayer ceramic electronic components where ion migration has already occurred.

[0080] Bond strength tests were conducted using adhesive tape. The peel strength of the tape relative to the glass substrate, measured at 25°C, 300 mm / min, and a 90° angle, was 30 gf / 25 mm. The adhesive tape was adhered to the surface of a multilayer ceramic electronic component. After 1 minute, force was applied to the tape at a 90° angle to separate it from the component. The number of components whose protective layer was removed from the surface to which the tape was attached after separation was measured.

[0081] In the installation failure test, multilayer ceramic electronic components are mounted on a board with attached electrode pads using solder, and the number of misaligned multilayer ceramic electronic components is measured. Figure 7A These are captured images of misaligned multilayer ceramic electronic components. Figure 7B These are captured images of misaligned multilayer ceramic electronic components. Figure 7C This is a captured image of a multilayer ceramic electronic component in the case of its separation.

[0082] In the moisture load test, the number of multilayer ceramic electronic components that exhibit defects when the rated voltage is applied to the multilayer ceramic electronic component at a temperature of 85°C and a relative humidity of 85% is measured.

[0083] [Table 1]

[0084]

[0085]

[0086] Referring to Table 1, it can be confirmed that when the protective layer thickness is 100 nm, with an adhesion aid layer thickness of 20 nm and a coating thickness of 80 nm, ion migration occurs, resulting in defects in the bonding strength and moisture resistance tests. However, when the adhesion aid layer thickness is 30 nm and the coating thickness is 70 nm, excellent results are observed in all tests. Furthermore, it can be confirmed that when the protective layer thickness is 100 nm, with an adhesion aid layer thickness of 80 nm and a coating thickness of 20 nm, defects occur in the migration and moisture resistance tests in multiple products. However, when the adhesion aid layer thickness is 70 nm and the coating thickness is 30 nm, no defects are observed in any tests.

[0087] It was confirmed that when the protective layer thickness was 200 nm, the bonding strength was excessively reduced when the adhesion aid layer thickness was 20 nm and the coating thickness was 180 nm. However, when the adhesion aid layer thickness was 50 nm and the coating thickness was 150 nm, excellent results were observed in all tests. Furthermore, it was confirmed that when the adhesion aid layer thickness was 180 nm and the coating thickness was 20 nm, ion migration occurred and very poor results were observed in the moisture load test. However, when the adhesion aid layer thickness was 150 nm and the coating thickness was 50 nm, no defects were observed in any tests.

[0088] Furthermore, it was confirmed that when the protective layer thickness was 600 nm, the bonding strength was significantly reduced when the adhesion aid layer thickness was 20 nm and the coating thickness was 580 nm. However, when the adhesion aid layer thickness was 50 nm and the coating thickness was 550 nm, no defects were observed in any tests. Additionally, it was confirmed that when the adhesion aid layer thickness was 580 nm and the coating thickness was 20 nm, ion migration occurred in multiple products, and defects appeared in the moisture load test. However, when the adhesion aid layer thickness was 550 nm and the coating thickness was 50 nm, excellent results were observed in all tests.

[0089] On the other hand, it can be seen that with a total protective layer thickness of 700nm, defects were found in the results of every test in multiple products, regardless of the ratio between the thickness of the adhesion aid layer and the coating.

[0090] Therefore, when summarizing the test results, it can be confirmed that when the average thickness of the entire protective layer of the multilayer ceramic electronic component is greater than or equal to 70 nm and less than 400 nm, when the average thickness t of the coating... a With the average thickness t of the protective layer h The ratio t a / t hWhen the value is greater than or equal to 0.25 and less than or equal to 0.75, it consistently shows excellent results in ion migration test, bonding strength test, installation defect test and moisture load test.

[0091] Furthermore, it can be confirmed that when the average thickness of the protective layer is greater than or equal to 400 nm and less than or equal to 600 nm, when the average thickness t of the coating... a With the average thickness t of the protective layer h The ratio t a / t h When the value is greater than or equal to 0.05 and less than or equal to 0.95, it shows excellent results in all tests.

[0092] Furthermore, it can be confirmed that even if the average thickness t of the coating a With the average thickness t of the protective layer h The ratio t a / t h Within the aforementioned range, when the thickness of the adhesion aid layer and / or the coating thickness is less than 25 nm, the individual properties of the adhesion aid layer and the coating cannot be fully expressed. Therefore, it can be confirmed that when the average thickness of the protective layer, the ratio of the average thickness of the coating to the average thickness of the protective layer, and / or the average thickness of the adhesion aid layer and the coating are within a predetermined range, excellent multilayer ceramic electronic components can be provided, in which ion migration is effectively suppressed, the bonding strength of the protective layer is excellent, and no installation defects or moisture load defects occur.

[0093] As described above, according to the exemplary embodiments in this disclosure, the characteristics of multilayer ceramic electronic components can be prevented from deteriorating due to moisture penetration into the multilayer ceramic electronic components.

[0094] In addition, it can suppress ion migration in multilayer ceramic electronic components.

[0095] In addition, it can reduce defects such as short circuits in multilayer ceramic electronic components.

[0096] In addition, multilayer ceramic electronic components with excellent reliability can be provided.

[0097] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged to face each other and stacked alternately, and a dielectric layer, wherein the respective dielectric layer is located between the first inner electrode and the second inner electrode. The first external electrode is connected to the first internal electrode; The second external electrode is connected to the second internal electrode; and A protective layer is disposed on the ceramic body, the first external electrode, and the second external electrode. The protective layer includes an adhesion-aiding layer and a coating layer. The average thickness of the protective layer is greater than or equal to 70 nm and less than 400 nm, and The ratio of the average thickness of the coating to the average thickness of the protective layer is greater than or equal to 0.25 and less than or equal to 0.

75.

2. The multilayer ceramic electronic component as described in claim 1, wherein, The coating has an average thickness of 25 nm or greater.

3. The multilayer ceramic electronic component as described in claim 1, wherein, The adhesion aid layer and the coating are cross-linked together.

4. The multilayer ceramic electronic component as described in claim 1, wherein, The protective layer is configured to cover at least a portion of the ceramic body, the first external electrode, and the second external electrode.

5. The multilayer ceramic electronic component as described in claim 1, wherein, The adhesion aid layer comprises one or more polymers selected from the group consisting of polystyrene polymers, vinyl acetate polymers, polyester polymers, polyethylene polymers, polypropylene polymers, polyamide polymers, rubber polymers, acrylic polymers, phenol polymers, epoxy polymers, polyurethane polymers, siloxane polymers, melamine polymers, and alkyd polymers.

6. The multilayer ceramic electronic component as described in claim 5, wherein, The adhesive aid layer is selected from one or more polymers that contain compounds having two or more vinyl groups.

7. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises a hydrophobic polymer.

8. The multilayer ceramic electronic component as described in claim 7, wherein, The coating contains compounds having vinyl and fluorine components.

9. The multilayer ceramic electronic component as described in claim 1, wherein, The coating is an inorganic thin film layer.

10. The multilayer ceramic electronic component as described in claim 9, wherein, The coating comprises components from Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, Y2O3, SrTiO3, BaTiO3, AlN, and SiN. x Choose one or more from the groups formed.

11. The multilayer ceramic electronic component as claimed in claim 1, wherein, The coating is configured to cover the adhesion aid layer.

12. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged to face each other and stacked alternately, and a dielectric layer, wherein the respective dielectric layer is located between the first inner electrode and the second inner electrode. The first external electrode is connected to the first internal electrode; The second external electrode is connected to the second internal electrode; as well as A cover layer is disposed on the ceramic body, the first external electrode, and the second external electrode. The covering layer includes a first layer and a second layer. The first layer is an adhesion-aiding layer and has an average thickness of 25 nm or greater. The average thickness of the capping layer is greater than or equal to 70 nm and less than 400 nm, and The ratio of the average thickness of the second layer to the average thickness of the cover layer can be greater than or equal to 0.25 and less than or equal to 0.

75.

13. The multilayer ceramic electronic component as described in claim 12, wherein, The second layer has an average thickness of 25 nm or greater.

14. The multilayer ceramic electronic component as described in claim 12, wherein, The first layer and the second layer are interconnected.

15. The multilayer ceramic electronic component as described in claim 12, wherein, The cover layer is configured to cover at least a portion of the ceramic body, the first external electrode, and the second external electrode.

16. The multilayer ceramic electronic component as claimed in claim 12, wherein, The first layer comprises one or more polymers selected from the group consisting of polystyrene polymers, vinyl acetate polymers, polyester polymers, polyethylene polymers, polypropylene polymers, polyamide polymers, rubber polymers, acrylic polymers, phenol polymers, epoxy polymers, polyurethane polymers, siloxane polymers, melamine polymers, and alkyd polymers.

17. The multilayer ceramic electronic component as claimed in claim 16, wherein, The first layer may be one or more polymers comprising compounds having two or more vinyl groups.

18. The multilayer ceramic electronic component as claimed in claim 12, wherein, The second layer contains a hydrophobic polymer.

19. The multilayer ceramic electronic component as claimed in claim 18, wherein, The second layer contains compounds having vinyl and fluorine properties.

20. The multilayer ceramic electronic component as claimed in claim 12, wherein, The second layer is an inorganic thin film layer.

21. The multilayer ceramic electronic component as claimed in claim 20, wherein, The second layer comprises Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, Y2O3, SrTiO3, BaTiO3, AlN, and SiN. x Choose one or more from the groups formed.

22. The multilayer ceramic electronic component as described in claim 12, wherein, The first external electrode includes a first electrode layer connected to the first internal electrode, a first conductive layer disposed on the first electrode layer, and a first metal layer disposed on the first conductive layer. The second outer electrode includes a second electrode layer connected to the second inner electrode, a second conductive layer disposed on the second electrode layer, and a second metal layer disposed on the second conductive layer.

23. The multilayer ceramic electronic component as described in claim 22, wherein, The first electrode layer and the second electrode layer are sintered electrodes containing conductive metal.

24. The multilayer ceramic electronic component as described in claim 22, wherein, The first conductive layer and the second conductive layer are plating layers.

25. The multilayer ceramic electronic component as described in claim 22, wherein, The first metal layer and the second metal layer are plating layers.

26. The multilayer ceramic electronic component as described in claim 12, wherein, The second layer is configured to cover the first layer.

27. The multilayer ceramic electronic component as claimed in claim 12, wherein, The second layer covering the first outer electrode and the second layer covering the second outer electrode are connected to each other.

28. The multilayer ceramic electronic component as described in claim 12, wherein, The first layer covering the first external electrode and the first layer covering the second external electrode are spaced apart from each other.

29. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged to face each other and stacked alternately, and a dielectric layer, wherein the respective dielectric layer is located between the first inner electrode and the second inner electrode. The first external electrode is connected to the first internal electrode; The second external electrode is connected to the second internal electrode; and A protective layer is disposed on the ceramic body, the first external electrode, and the second external electrode. The protective layer includes an adhesion-aiding layer and a coating layer. The average thickness of the protective layer is greater than or equal to 400 nm and less than or equal to 600 nm, and The ratio of the average thickness of the coating to the average thickness of the protective layer is greater than or equal to 0.05 and less than or equal to 0.

95.

30. The multilayer ceramic electronic component as described in claim 29, wherein, The coating has an average thickness of 25 nm or greater.

31. The multilayer ceramic electronic component as described in claim 29, wherein, The adhesion aid layer and the coating are cross-linked together.

32. The multilayer ceramic electronic component as described in claim 29, wherein, The protective layer is configured to cover at least a portion of the ceramic body, the first external electrode, and the second external electrode.

33. The multilayer ceramic electronic component as described in claim 29, wherein, The adhesion aid layer comprises one or more polymers selected from the group consisting of polystyrene polymers, vinyl acetate polymers, polyester polymers, polyethylene polymers, polypropylene polymers, polyamide polymers, rubber polymers, acrylic polymers, phenol polymers, epoxy polymers, polyurethane polymers, siloxane polymers, melamine polymers, and alkyd polymers.

34. The multilayer ceramic electronic component as described in claim 33, wherein, The adhesive aid layer is selected from one or more polymers that contain compounds having two or more vinyl groups.

35. The multilayer ceramic electronic component as described in claim 29, wherein, The coating comprises a hydrophobic polymer.

36. The multilayer ceramic electronic component as described in claim 35, wherein, The coating contains compounds having vinyl and fluorine components.

37. The multilayer ceramic electronic component as described in claim 29, wherein, The coating is an inorganic thin film layer.

38. The multilayer ceramic electronic component as described in claim 37, wherein, The coating comprises components from Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, Y2O3, SrTiO3, BaTiO3, AlN, and SiN. x Choose one or more from the groups formed.

39. The multilayer ceramic electronic component as described in claim 29, wherein, The coating is configured to cover the adhesion aid layer.

40. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged to face each other and stacked alternately, and a dielectric layer, wherein the respective dielectric layer is located between the first inner electrode and the second inner electrode. The first external electrode is connected to the first internal electrode; The second external electrode is connected to the second internal electrode; as well as A cover layer is disposed on the ceramic body, the first external electrode, and the second external electrode. The covering layer includes a first layer and a second layer. The first layer is an adhesion-aiding layer and has an average thickness of 25 nm or greater. The average thickness of the capping layer is greater than or equal to 400 nm and less than or equal to 600 nm, and The ratio of the average thickness of the second layer to the average thickness of the cover layer is greater than or equal to 0.05 and less than or equal to 0.95.

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