Multilayer ceramic electronic component

Abstract

A multilayer ceramic electronic component is provided. The multilayer ceramic electronic component includes a ceramic main body including first internal electrodes and second internal electrodes disposed in an alternating stack with dielectric layers interposed between the first internal electrodes and the second internal electrodes, a first external electrode connected to the first internal electrodes and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrodes and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic main body, the first electrode layer, and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and a glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0189535, filed on December 31, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer ceramic electronic component. Background Technology

[0003] In recent years, with the expansion of the application fields of electronic products, the technological field of using multilayer ceramic electronic components has also expanded. In particular, as vehicles become increasingly electronic, structures are used in which the vehicle's electronic control unit (ECU) or transmission control unit (TCU) is located in the engine compartment or directly attached to the transmission.

[0004] However, when existing multilayer ceramic electronic components are used in harsh environments such as high temperature and high vibration, repeated expansion and contraction due to high / low temperature cycling causes continuous mechanical stress. Furthermore, the application of continuous mechanical stress is a major cause of cracking in terminal electrodes or solder.

[0005] In addition, in the process of manufacturing multilayer ceramic electronic components, after sintering the ceramic body and the external electrode, a plating layer is usually formed on the external electrode. When manufacturing electronic components through high-temperature heat treatment, a hydrophilic oxide layer with high surface energy is formed on the surface of the ceramic body, and there is a high probability that pores that serve as pathways for water permeability will appear at the interface between the ceramic body and the external electrode.

[0006] In particular, when multilayer ceramic electronic components are continuously exposed to high temperature and / or high humidity environments, the possibility of ion migration in the external electrodes of the multilayer ceramic electronic components themselves increases. The oxide layer formed on the surface of the ceramic body has high surface energy, and under the influence of high temperature, high humidity, and high voltage, its hydrophilicity makes it easy for moisture to adhere to the surface of the ceramic body. Through such moisture, ion migration occurs, causing electrode material to migrate towards the opposite electrode, which may lead to short circuits, thereby reducing the reliability of the multilayer ceramic electronic components. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer ceramic electronic component that prevents property degradation due to moisture penetration.

[0008] Another aspect of this disclosure provides a multilayer ceramic electronic component with suppressed ion migration.

[0009] Another aspect of this disclosure provides a multilayer ceramic electronic component with reduced short-circuit defects.

[0010] Another aspect of this disclosure provides a multilayer ceramic electronic component with excellent reliability.

[0011] According to one aspect of this disclosure, a multilayer ceramic electronic component includes: a ceramic body having a first and second surface opposite to each other in a first direction, a third and fourth surface opposite to each other in a second direction, and a fifth and sixth surface opposite to each other in a third direction, and including a first inner electrode and a second inner electrode disposed alternately stacked in the third direction, with a dielectric layer between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second outer electrode connected to the second inner electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer, and the second electrode layer, wherein the first conductive layer and the second conductive layer are sintered electrodes comprising a conductive metal and a glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.

[0012] According to another aspect of this disclosure, a multilayer ceramic electronic component includes: a ceramic body including a first inner electrode and a second inner electrode configured to be alternately stacked, with a dielectric layer between the first inner electrode and the second inner electrode; a first outer electrode connected to the first inner electrode and including a first electrode layer and a first conductive layer; a second outer electrode connected to the second inner electrode and including a second electrode layer and a second conductive layer; a first coating comprising an inorganic film layer and disposed between the first electrode layer and the first conductive layer and between the second electrode layer and the second conductive layer; and a second coating comprising a polymer containing at least one vinyl group and configured to cover the first outer electrode and the second outer electrode.

[0013] According to another aspect of this disclosure, a multilayer ceramic electronic component includes: a ceramic body comprising alternatingly stacked first and second inner electrodes, with a dielectric layer between the first and second inner electrodes; a first outer electrode connected to the first inner electrode and including a first electrode layer and a first conductive layer; a second outer electrode connected to the second inner electrode and including a second electrode layer and a second conductive layer; and a first coating layer disposed between the first electrode layer and the first conductive layer and between the second electrode layer and the second conductive layer. The first coating layer has island-shaped plating solution anti-permeability layers. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0015] Figure 1 This is a schematic perspective view of a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0016] Figure 2 It is shown schematically. Figure 1 A three-dimensional view of the ceramic body;

[0017] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I'; and

[0018] Figure 4 yes Figure 3 An enlarged view of region A. Detailed Implementation

[0019] Exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0020] In the accompanying drawings, the X direction can be defined as a first direction, the L direction, or the length direction; the Y direction can be defined as a second direction, the W direction, or the width direction; and the Z direction can be defined as a third direction, the T direction, or the thickness direction.

[0021] This disclosure relates to a multilayer ceramic electronic component. Figures 1 to 4 This is a schematic diagram illustrating a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure. (Refer to...) Figures 1 to 4 According to an exemplary embodiment, a multilayer ceramic electronic assembly 100 may include: a ceramic body 110, including a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122, wherein the first internal electrode 121 and the second internal electrode 122 are alternately stacked in a third direction (Z direction) and the dielectric layer 111 is located between the first internal electrode 121 and the second internal electrode 122, and the ceramic body 110 has a first surface S1 and a second surface S2 opposite to each other in a first direction (X direction), and a third surface S3 opposite to each other in a second direction (Y direction). The fourth surface S4, and the fifth surface S5 and the sixth surface S6 opposite to each other in the third direction (Z direction); the first external electrode 131, connected to the first internal electrode 121 and including a first electrode layer 131a, a first conductive layer 131b and a first metal layer 131c; the second external electrode 132, connected to the second internal electrode 122 and including a second electrode layer 132a, a second conductive layer 132b and a second metal layer 132c; and the first coating 141, disposed on the ceramic body 110, the first electrode layer 131a and the second electrode layer 132a.

[0022] Here, the first conductive layer 131b and the second conductive layer 132b can be sintered electrodes comprising conductive metal and glass. Furthermore, the first coating 141 includes a plurality of openings disposed on the first electrode layer 131a and the second electrode layer 132a. In one example, the first coating 141 can be an island-shaped plating solution anti-permeability layer.

[0023] The moisture resistance reliability of multilayer ceramic electronic components can be significantly affected by two factors. First, product defects may occur due to plating solution penetration during the manufacturing process. Second, external moisture may penetrate during the use of the finished product, thus shortening its lifespan. In recent years, product sizes have decreased, and multilayered external electrodes have been increasingly used to meet various electrical and / or mechanical performance requirements. However, plating solution penetration is possible when forming a plating layer on a multilayered external electrode. Furthermore, methods that form a protective layer only on the exterior of the ceramic body and the external electrode have the following limitations: the adhesion between the surface of the ceramic body and the protective layer is generally weak, and it is difficult to adequately ensure the reliability of the component when exposed to repetitive vibrations. To address these issues, the present invention places a first coating 141 on the ceramic body, the first electrode layer of the first external electrode, and the second electrode layer of the second external electrode to prevent moisture penetration, inhibit ion migration, and improve the bonding strength between the first coating 141 and the multilayer ceramic electronic component, thereby improving moisture resistance reliability.

[0024] A multilayer ceramic electronic component 100 according to an exemplary embodiment of the present disclosure may include: a ceramic body 110 including a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122, wherein the first internal electrode 121 and the second internal electrode 122 are arranged to be stacked alternately in a third direction (Z direction) and the dielectric layer 111 is located between the first internal electrode 121 and the second internal electrode 122.

[0025] The ceramic body 110 may include a first surface S1 and a second surface S2 opposite each other in a first direction (X direction), a third surface S3 and a fourth surface S4 opposite each other in a second direction (Y direction), and a fifth surface S5 and a sixth surface S6 opposite each other in a third direction (Z direction).

[0026] There are no particular limitations on the specific shape of the ceramic body 110, but as shown in the figure, the ceramic body 110 can be a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, although the ceramic body 110 is not a perfectly straight hexahedral shape, it can have a generally hexahedral shape. If desired, the ceramic body 110 can be rounded so that the corners are not angled. Rounding can be, for example, tumble polishing, but is not limited to this.

[0027] In the ceramic body 110, dielectric layers 111 and first internal electrodes 121 and second internal electrodes 122 can be stacked alternately. Dielectric layers 111, first internal electrodes 121 and second internal electrodes 122 can be stacked in the third direction (Z direction). Multiple dielectric layers 111 are in a sintered state, and adjacent dielectric layers 111 can be integrated such that their boundaries may not be easily distinguishable without the use of a scanning electron microscope (SEM).

[0028] According to exemplary embodiments in this disclosure, dielectric layer 111 may include dielectric layers composed of (Ba 1-x Ca x (Ti) 1-y (Zr,Sn,Hf) y The component represented by O3 (here, 0 ≤ x ≤ 1 and 0 ≤ y ≤ 0.5) can be, for example, a compound in which Ca, Zr, Sn and / or Hf are partially dissolved in BaTiO3. In the above composition, x can be in the range of greater than or equal to 0 and less than or equal to 1, and y can be in the range of greater than or equal to 0 and less than or equal to 0.5, but is not limited thereto. For example, when x is 0 and y is 0 in the above composition, the component can be BaTiO3. Furthermore, for the purposes of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can be added to the component.

[0029] The dielectric layer 111 can be formed by adding additives to a slurry containing the above materials as needed, coating the slurry onto a carrier film, and drying the slurry to prepare multiple ceramic green sheets. The ceramic green sheets can be formed by using a doctor blade to form sheets with a thickness of several micrometers from the slurry, but are not limited to this method.

[0030] The ceramic body 110 can be formed by alternately stacking ceramic green sheets with a first internal electrode 121 printed thereon and ceramic green sheets with a second internal electrode 122 printed thereon in the third direction (Z direction). The printing method of the first internal electrode 121 and the second internal electrode 122 can be screen printing or gravure printing, but is not limited to these methods.

[0031] The first inner electrode 121 and the second inner electrode 122 may be stacked such that their ends are exposed to opposite ends of the ceramic body 110. Specifically, the first inner electrode 121 and the second inner electrode 122 may be exposed to two surfaces of the ceramic body 110 in a first direction (X direction), and in this case, the first inner electrode 121 may be exposed in the direction of the first surface S1 of the ceramic body 110, and the second inner electrode 122 may be exposed in the direction of the second surface S2 of the ceramic body 110.

[0032] The first internal electrode 121 and the second internal electrode 122 may comprise a conductive metal. The conductive metal may include, for example, one or more conductive metals selected from silver (Ag), nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The first internal electrode 121 and the second internal electrode 122 may be formed using a conductive paste comprising a conductive metal.

[0033] In the multilayer ceramic electronic assembly according to the present disclosure, a first external electrode 131 and a second external electrode 132 may be disposed on the outer surface of the ceramic body 110. The first external electrode 131 may be disposed on the first surface S1 of the ceramic body 110 of the multilayer ceramic electronic assembly 100 according to the present disclosure, and the second external electrode 132 may be disposed on the second surface S2 of the ceramic body 110.

[0034] In this example, the first external electrode 131 of the multilayer ceramic electronic component of this disclosure may include a first electrode layer 131a, a first conductive layer 131b, and a first metal layer 131c, and the second external electrode 132 may include a second electrode layer 132a, a second conductive layer 132b, and a second metal layer 132c. In this case, a first coating layer 141, which will be described later, may be disposed between the first electrode layer 131a and the first conductive layer 131b, and between the second electrode layer 132a and the second conductive layer 132b. That is, in the first external electrode 131 of the multilayer ceramic electronic component according to this example, the first electrode layer 131a, the first coating layer 141, the first conductive layer 131b, and the first metal layer 131c may be stacked sequentially. In the second external electrode 132, the second electrode layer 132a, the first coating layer 141, the second conductive layer 132b, and the second metal layer 132c may be stacked sequentially. The first electrode layer 131a can be connected to the first inner electrode 121, and the second electrode layer 132a can be connected to the second inner electrode 122.

[0035] In exemplary embodiments of this disclosure, the first electrode layer 131a and the second electrode layer 132a of the multilayer ceramic electronic component may be sintered electrodes comprising a conductive metal. The conductive metal may include at least one of, for example, nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.

[0036] As an example of a method for forming the first electrode layer 131a and the second electrode layer 132a, the first electrode layer 131a and the second electrode layer 132a can be formed by immersing the ceramic body 110 in a conductive paste containing a conductive metal and then firing the resulting structure, or by printing the conductive paste onto the surface of the ceramic body 110 using screen printing or gravure printing and then firing the resulting structure. Alternatively, the first electrode layer 131a and the second electrode layer 132a can be formed by coating the surface of the ceramic body 110 with conductive paste or by transferring a dry film obtained by drying the conductive paste onto the ceramic body 110 and then firing the resulting structure, but are not limited to these methods. For example, the first electrode layer 131a and the second electrode layer 132a can be formed by forming conductive paste on the ceramic body 110 using various methods different from those described above, and then firing the conductive paste.

[0037] In the examples of this disclosure, a first coating 141 may be disposed on a first electrode layer 131a and a second electrode layer 132a of a multilayer ceramic electronic component. The first coating 141 may be disposed on the ceramic body 110, the first electrode layer 131a, and / or the second electrode layer 132a of the multilayer ceramic electronic component. The first coating 141 may be configured to cover the ceramic body 110 and may be configured to contact the first electrode layer 131a and the second electrode layer 132a. A portion of the first coating 141 covering the first electrode layer 131a and a portion of the first coating 141 covering the second electrode layer 132a may be connected to each other.

[0038] In an exemplary embodiment of this disclosure, the first coating 141 of the multilayer ceramic electronic component may be an inorganic thin film layer. The inorganic thin film layer may be formed using oxides, nitrides, or other compounds of metals and / or nonmetals. In this exemplary embodiment, when the first coating 141 is an inorganic thin film layer, chemical reactions with external contaminants are minimized, thereby improving the reliability of the first coating 141. The composition of the inorganic thin film layer may include one or more oxides selected from the group consisting of Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, and Y2O3; one or more compounds selected from the group consisting of SrTiO3 and BaTiO3; and compounds selected from the group consisting of AlN and SiN. x One or more nitrides selected from the group.

[0039] In an example, the first coating 141 of the multilayer ceramic electronic component according to this disclosure may include a plurality of openings disposed on the first electrode layer 131a and the second electrode layer 132a. (See also...) Figure 3An opening may be formed in the region of the first coating 141 disposed on the first electrode layer 131a and the second electrode layer 132a. The opening may penetrate the first coating 141, and two or more openings may be provided. An opening is a region where the first coating 141 is not disposed, and can serve as a connection channel between the first electrode layer 131a and the first conductive layer 131b, and between the second electrode layer 132a and the second conductive layer 132b (described later). In the multilayer ceramic electronic assembly according to this example, the connectivity between the first electrode layer 131a and the first conductive layer 131b and between the second electrode layer 132a and the second conductive layer 132b can be improved because the first coating 141 has multiple openings.

[0040] In exemplary embodiments of this disclosure, a plurality of openings included in the first coating 141 of the multilayer ceramic electronic assembly according to this disclosure may be formed in the process of forming the first conductive layer 131b and the second conductive layer 132b. For example, openings disposed in the first coating 141 may be formed by dissolving a portion of the components of the first coating 141. The first coating 141 of the multilayer ceramic electronic assembly according to this disclosure may include components formed using oxides or nitrides as described above, and these components may be dissolved in a glass, which will be described later, and the areas dissolved in the glass may form openings.

[0041] For example, in this exemplary embodiment, a first coating 141 is disposed on a first electrode layer 131a and a second electrode layer 132a, and a first conductive layer 131b and a second conductive layer 132b are disposed on the first coating 141. Subsequently, the first conductive layer 131b and the second conductive layer 132b can be fired. In this case, when the first conductive layer 131b and the second conductive layer 132b contain glass, a portion of the oxide or nitride constituting the first coating 141 dissolves in the glass and is removed, and an opening can be formed in the area where the first coating 141 has dissolved. In this case, since the dissolution of the first coating 141 by the glass is not regular, the multiple openings included in the first coating 141 may not have a regular pattern, may be randomly arranged, and may be irregularly arranged.

[0042] In exemplary embodiments of this disclosure, the average thickness of the first coating 141 of the multilayer ceramic electronic component may be in the range of greater than or equal to 50 nm and less than or equal to 200 nm. In this disclosure, "thickness" may refer to the thickness of the component measured in a direction perpendicular to the surface of the component, and "average thickness" may refer to the arithmetic mean of the thicknesses of the component measured from points dividing the area where the component is disposed into 10 equal parts in a cross-section taken perpendicular to the Z-axis at the center of the multilayer ceramic electronic component.

[0043] The method for forming the first coating 141 of the multilayer ceramic electronic component according to this disclosure is not particularly limited. For example, the first coating 141 can be formed using, for example, atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc., but is not limited thereto.

[0044] In an exemplary embodiment of this disclosure, a first coating 141 may be disposed on a first electrode layer 131a and a second electrode layer 132a of the multilayer ceramic electronic component of this disclosure, and a first conductive layer 131b and a second conductive layer 132b may be disposed on the first coating 141. A portion of the first conductive layer 131b and a portion of the second conductive layer 132b may be disposed on the first coating 141, and the remaining portion of the first conductive layer 131b may be configured to contact the first electrode layer 131a through an opening in the first coating 141, and the remaining portion of the second conductive layer 132b may be configured to contact the second electrode layer 132a through an opening in the first coating 141.

[0045] In the example, the first conductive layer 131b and the second conductive layer 132b can be sintered electrodes comprising a conductive metal and glass. The conductive metal can include, for example, one or more of nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The glass can be a composition in which oxides are mixed. The glass can be at least one selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxides, alkali metal oxides, and alkaline earth metal oxides, but is not particularly limited thereto. The transition metal can be one or more selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); the alkali metal can be one or more selected from the group consisting of lithium (Li), sodium (Na), and potassium (K); and the alkaline earth metal can be one or more selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0046] At least a portion of the first conductive layer 131b and at least a portion of the second conductive layer 132b of the multilayer ceramic electronic assembly according to this disclosure may be configured to contact the first electrode layer 131a and the second electrode layer 132a, respectively. The portion of the first conductive layer 131b that contacts the first electrode layer 131a and the portion of the second conductive layer 132b that contacts the second electrode layer 132a may be disposed within an opening in the first coating layer 141. As described above, the portions of the first conductive layer 131b and the second conductive layer 132b disposed within the opening include the portions of the first conductive layer 131b and the second conductive layer 132b disposed in the region where the oxide or nitride of the first coating layer 141 is dissolved.

[0047] When the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic assembly according to this disclosure contain the aforementioned glass composition, the glass composition has a certain degree of fluidity during sintering and a predetermined solubility for oxides or nitrides. Therefore, a portion of the first coating 141 is dissolved, forming an opening, and either the first conductive layer 131b or the second conductive layer 132b can be disposed within the opening. The first conductive layer 131b and the second conductive layer 132b disposed within the opening can be configured to contact the first electrode layer 131a and the second electrode layer 132a, respectively. The first conductive layer 131b and the second conductive layer 132b disposed within the opening of the first coating 141 may not be arranged according to a specific rule, may not have a specific pattern, may be randomly arranged, and / or may be irregularly arranged.

[0048] In the example, the first conductive layer 131b of the multilayer ceramic electronic component 100 of this disclosure may be configured to cover the first electrode layer 131a, and the second conductive layer 132b may be configured to cover the second electrode layer 132a. In this disclosure, configuring a component to cover a specific area can mean that the component is configured such that the portion of the area covered by the component is not visible from the outside. In this example, the first conductive layer 131b may be configured to cover the entire first electrode layer 131a, and the second conductive layer 132b may be configured to cover the entire second electrode layer 132a.

[0049] As an example of a method for forming the first conductive layer 131b and the second conductive layer 132b, the first conductive layer 131b and the second conductive layer 132b can be formed by immersing a ceramic body in a conductive paste containing conductive metal and glass and then firing the ceramic body, or by printing the conductive paste onto the surface of the ceramic body using screen printing, gravure printing, or the like and then firing the ceramic body. Furthermore, the first conductive layer 131b and the second conductive layer 132b can be formed by coating the surface of the ceramic body with conductive paste or by transferring a dry film obtained by drying the conductive paste onto the ceramic body and then firing the ceramic body; however, the method for forming the first conductive layer 131b and the second conductive layer 132b is not limited to these methods. For example, in addition to the methods described above, the first conductive layer 131b and the second conductive layer 132b can be formed by forming conductive paste on the ceramic body according to various methods and then firing the ceramic body.

[0050] According to the examples of this disclosure, the first metal layer 131c and the second metal layer 132c disposed on the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component can be plating layers. The first metal layer 131c and the second metal layer 132c may include one or more selected from the group consisting of copper (Cu), tin (Sn), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb) and alloys thereof, but are not limited thereto. Optionally, an additional plating layer 131d may also be disposed on the first metal layer 131c, and an additional plating layer 132d may also be disposed on the second metal layer 132c.

[0051] In exemplary embodiments of this disclosure, the first metal layer 131c and the second metal layer 132c of the multilayer ceramic electronic component may have a structure in which two or more plating layers are stacked. The first metal layer 131c and the second metal layer 132c may have a structure in which two or more plating layers containing different compositions are stacked, such as a structure in which a tin (Sn) plating layer is stacked on a nickel (Ni) plating layer, but are not limited thereto. When the first metal layer and the second metal layer of the multilayer ceramic electronic component of this disclosure have a structure in which two or more plating layers are stacked as described above, both desired mechanical properties and excellent moisture resistance and reliability can be simultaneously achieved. The plating layers may be formed by sputtering or electroplating, but are not limited thereto.

[0052] In the example, at least a portion of the first external electrode 131 of the multilayer ceramic electronic assembly according to the present disclosure may extend onto the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110. Additionally, at least a portion of the second external electrode 132 may extend onto the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110. In this case, the first external electrode 131 and the second external electrode 132 may be spaced apart from each other. When at least a portion of the first external electrode 131 and / or at least a portion of the second external electrode 132 extends onto the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110, this extension portion can serve as a so-called strip and improves the mounting strength of the multilayer ceramic electronic assembly 100 according to the present disclosure and prevents moisture penetration.

[0053] In exemplary embodiments of this disclosure, the multilayer ceramic electronic assembly according to this disclosure may further include a second coating 142 disposed on the ceramic body 110, the first external electrode 131, and the second external electrode 132. The second coating 142 may be configured to cover the ceramic body 110, the first external electrode 131, and the second external electrode 132. In this case, a portion of the second coating 142 covering the first external electrode 131 and a portion of the second coating 142 covering the second external electrode 132 may be connected to each other. Preferably, the second coating 142 may be configured to cover the entire ceramic body 110, the first external electrode 131, and the second external electrode 132. That is, the second coating 142 of this disclosure may be configured to cover the entire surface of the multilayer ceramic electronic assembly 100. Therefore, better moisture resistance and reliability can be obtained compared to the case where the second coating 142 is formed only on a portion of the multilayer ceramic electronic assembly.

[0054] The second coating 142 may include a first layer 142a and a second layer 142b. The first layer 142a and the second layer 142b may be stacked sequentially and disposed on the ceramic body 110, the first external electrode 131 and the second external electrode 132. In this case, the first layer 142a may be configured to be in direct contact with the ceramic body 110, the first external electrode 131 and the second external electrode 132, and the second layer 142b may be disposed on the first layer 142a.

[0055] At this point, the second coating 142 may include a cross-linked first layer 142a and a second layer 142b. In this disclosure, "bonding" can refer to the state in which the surfaces of the adhesive and the adherend are bonded by interfacial bonding forces. The interfacial bonding forces can be due to chemical interactions between surface molecules of the adhesive and surface molecules of the adherend, or they can be due to mechanical bonding. In this disclosure, the term "cross-linking" can refer to the formation of a network structure through chemical / physical bonds between molecules, such as covalent bonds, ionic bonds, van der Waals bonds, or hydrogen bonds. Because the first layer 142a and the second layer 142b are cross-linked, the first layer 142a and the second layer 142b may have superior bonding forces.

[0056] In the examples disclosed herein, the composition of the first layer 142a is not particularly limited, provided that the first layer 142a of the multilayer ceramic electronic component exhibits excellent adhesion to the ceramic body and / or the second layer 142b, which will be described later. The first layer 142a may include, but is not limited to, at least one selected from polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, acrylic, phenol, epoxy resin, polyurethane, siloxane, melamine, and alkyd polymers.

[0057] In an example, the first layer 142a of the multilayer ceramic electronic assembly according to this disclosure may include a compound / polymer containing two or more vinyl groups. The compound / polymer containing two or more vinyl groups is intended to improve the mechanical / chemical strength of the second coating 142 according to this disclosure and may be bonded to the surface of the ceramic body 110 and crosslinked with the second layer 142b, which will be described later. In the multilayer ceramic electronic assembly according to this disclosure, a compound / polymer containing two or more vinyl groups may be applied to the first layer 142a to improve the bonding strength between the first layer 142a and the surface of the ceramic body 110 and / or the second layer 142b.

[0058] There are no particular limitations on compounds containing two vinyl groups, but they can be, for example, 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (V4D4), 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane (V3D3), divinylbenzene (DVB), diethylene glycol divinyl ether (DEGDVE), ethylene glycol diacrylate (EGDA), ethylene glycol dimethacrylate (EGDMA), 1,3-divinyl-1,1,3,3-tetramethyl-disiloxane (V2D2), etc.

[0059] There are no particular restrictions on the thickness of the first layer 142a, as long as sufficient bonding strength can be ensured. However, for example, the average thickness can be greater than or equal to 21 nm and less than or equal to 420 nm.

[0060] In exemplary embodiments of this disclosure, the second layer 142b of the second coating 142 of the multilayer ceramic electronic component may include a hydrophobic polymer. A hydrophobic polymer may refer to a polymer formed using hydrophobic monomers. In this disclosure, "hydrophobic" may mean that a surface formed using a certain component has a contact angle of 90° or greater relative to water at room temperature / 1 atmosphere. The hydrophobic monomer is not particularly limited, as long as it exhibits sufficient water repellency, and may include one or more monomers selected from the group consisting of siloxane monomers, acrylic monomers, amine monomers, carbonate monomers, ester monomers, and fluorocarbon monomers.

[0061] In an example, the second layer 142b of the multilayer ceramic electronic component according to this disclosure may include a compound containing vinyl and fluorine. The vinyl may crosslink with the first layer 142a to enhance the bonding strength of the second layer 142b, and the fluorine-containing compound provides excellent water resistance and physical / chemical resistance to external contaminants.

[0062] There are no particular restrictions on the types of compounds containing vinyl groups and fluorine. For example, compounds containing vinyl groups and fluorine may include, for instance, 1H,1H,2H,2H-perfluorodecyl acrylate (PFDA), perfluorodecyl methacrylate (PFDMA), dodecafluoroheptyl acrylate, pentafluorophenyl methacrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-pentadecafluorononyl acrylate, 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-pentadecafluorononyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecylfluorooctyl acrylate, 2-methyl- 3,3,4,4,5,5,6,6,7,7,8,8,8-Tetrafluorooctyl acrylate, 3,3,4,4,5,5,6,6,7,7,7-Undecylfluoroheptyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,7,7,7-Undecylfluoroheptyl acrylate, 3,3,4,4,5,5,6,6,6-Nonfluorohexyl acrylate, 2-Methyl-3,3,4,4,5,5,6,6,6-Nonfluorohexyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-Nondecylfluorodecafluoroacrylate Monoalkyl acrylates, 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,11-nonadecanofluoroundecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-heneofluorododecyl acrylate (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-heneicosafluorododecyl acrylate) 2-Methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-teicosicofluorododecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,13-teicosicofluorotridecyl acrylate (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,13-tricosafluorotridecyl acrylate) acrylate), 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,13-tetrafluorotridecyl acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-pentafluorotetradecyl acrylate (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-pentafluorotetradecyl acrylate), 2-methyl-3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,14-pentafluorotetradecyl acrylate, etc., but not limited to these.

[0063] There are no particular restrictions on the thickness of the second 142b layer, as long as sufficient bonding strength can be ensured. However, for example, the average thickness can be greater than or equal to 21 nm and less than or equal to 420 nm.

[0064] In exemplary embodiments of this disclosure, the average thickness of the second coating 142 of the multilayer ceramic electronic component can be greater than or equal to 50 nm and less than or equal to 700 nm. If the thickness of the second coating 142 of the multilayer ceramic electronic component in this exemplary embodiment is less than 50 nm, the adhesion of the first layer 142a may be weakened and the water resistance may be reduced. Conversely, if the thickness of the second coating 142 exceeds 700 nm, the ion migration inhibition and adhesion of the second coating 142 may be excellent; however, due to the excessive thickness of the second coating 142, the bonding strength with the solder may be reduced, and therefore the board adhesion strength may be reduced when the multilayer ceramic electronic component is mounted on a board.

[0065] The method for forming the first layer 142a and the second layer 142b of the multilayer ceramic electronic component according to this disclosure is not particularly limited. For example, the first layer 142a and the second layer 142b can be formed using atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc., but are not limited thereto.

[0066] <Experimental Example>

[0067] The ion migration suppression, bonding strength, mounting defects, and moisture load defects of the multilayer ceramic electronic components according to this disclosure were tested under the following conditions.

[0068] In the components used in the test, a first electrode layer and a second electrode layer were formed on a ceramic body using copper (Cu), and then a first coating was formed using an initiator chemical vapor deposition (iCVD) apparatus. Subsequently, a conductive paste containing copper (Cu) was applied to the first coating and heat-treated to form a first conductive layer and a second conductive layer.

[0069] After forming the first and second conductive layers, a Sn plating layer is formed, and a second coating is formed using an iCVD device. One hundred MLCCs with dimensions of 1.6mm × 0.8mm × 0.8mm, mass-produced by Samsung Electro-Mechanics, are used as the assembly.

[0070] The first coating is formed by Al2O3 as the material and by ALD deposition of Al(CH)3 (TMA, trimethylaluminum) and NH3 at a temperature of 250°C.

[0071] The second coating is formed by iCVD, using tetrabutyl peroxide (TBPO) as the deposition initiator. 2,4,6,8-Tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (V4D4) is used as the first layer, and perfluorodecyl methacrylate (PFDMA) is used as the second layer.

[0072] Regarding the deposition conditions, the multilayer ceramic electronic component was placed on a plate maintained at 40°C, and the filament temperature was set to 200°C. Subsequently, by adjusting the deposition time, multilayer ceramic electronic components with different thicknesses of the first and second coatings were manufactured.

[0073] Ion migration was tested by adding 1.3 ml of distilled water between the external electrodes at 25°C and 1 atm and applying a 15 V DC current to both external electrodes. Upon power-up, ion migration began, and dendrites of metallic composition were observed growing from the negative (-) electrode to the positive (+) electrode of the MLCC. When the two electrodes of the multilayer ceramic electronic component were connected to the grown dendrites, a current of 1 mA or greater flowed through them, and the number of components with current flowing through them was measured over 5 minutes.

[0074] Bond strength was tested at 25°C on a glass plate at a speed of 300 mm / min and a 90° angle using tape with a peel strength of 30 gf / 25 mm. The tape was applied to the surface of a multilayer ceramic electronic component, and after one minute, the tape was separated by applying force at a 90° angle. After separation, the number of components on the surface to which the tape was attached was measured to show the amount of a second coating removed.

[0075] In the installation defect test, multilayer ceramic electronic components are mounted on a board with electrode pads attached using solder, and the number of misaligned components is measured.

[0076] In the moisture load test, the number of defects occurring when the rated voltage is applied at 85°C and 85% relative humidity is measured.

[0077] In plating defect testing, the number of components with discontinuous plating is measured.

[0078] In capacity defect testing, the number of components whose capacity is insufficient to meet the required level is measured.

[0079] [Table 1]

[0080]

[0081] Referring to Table 1, it can be seen that when the thickness of the second coating is 200 nm, if the thickness of the first coating is less than 50 nm, ion migration occurs and moisture load defects appear. However, it can be seen that when the thickness of the first coating is 50 nm, excellent results are obtained in all tests. Furthermore, it can be seen that when the thickness of the first coating exceeds 200 nm under the same conditions, many plating defects and capacity defects appear, but when the thickness of the first coating is 200 nm, no defects appear in any type of test.

[0082] [Table 2]

[0083]

[0084]

[0085] Referring to Table 2, it can be seen that when the thickness of the first coating is 100 nm, if the thickness of the second coating is less than 50 nm, ion migration occurs and moisture load defects appear. However, it can be seen that when the thickness of the second coating is 50 nm, excellent results are obtained in all tests. Furthermore, it can be seen that when the thickness of the second coating exceeds 700 nm under the same conditions, installation defects occur, but when the thickness of the second coating is 700 nm, no defects appear in any type of test.

[0086] Therefore, when the test results are put together, it can be seen that when the average thickness of the first coating of the multilayer ceramic electronic component is greater than or equal to 50 nm and less than or equal to 200 nm, excellent results are obtained in all types of tests, and it can also be seen that when the average thickness of the second coating is greater than or equal to 50 nm and less than or equal to 700 nm, excellent results are obtained in all types of tests.

[0087] As described above, according to exemplary embodiments of the present disclosure, performance degradation caused by moisture penetration into multilayer ceramic electronic components can be prevented.

[0088] According to exemplary embodiments of the present disclosure, ion migration in multilayer ceramic electronic components can be suppressed.

[0089] According to exemplary embodiments of this disclosure, short-circuit defects in multilayer ceramic electronic components can be reduced.

[0090] According to exemplary embodiments of the present disclosure, multilayer ceramic electronic components with excellent reliability can be provided.

[0091] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction. The ceramic body includes a first inner electrode and a second inner electrode arranged to be alternately stacked in the third direction, and a dielectric layer is disposed between the first inner electrode and the second inner electrode. A first external electrode is connected to a first internal electrode extending from the first surface and includes a first electrode layer, a first conductive layer, and a first metal layer; The second external electrode is connected to the second internal electrode extending from the second surface and includes a second electrode layer, a second conductive layer and a second metal layer. A first coating is disposed on the ceramic body, the first electrode layer, and the second electrode layer; as well as The second coating is disposed on the first coating, the first external electrode, and the second external electrode. Wherein, the first conductive layer and the second conductive layer are sintered electrodes comprising conductive metal and glass, and the first coating includes a plurality of openings disposed on the first electrode layer and the second electrode layer, and The second coating comprises a first layer and a second layer, and both the first layer and the second layer are disposed on the portion of the first external electrode disposed on the first surface and the portion of the second external electrode disposed on the second surface. The first layer comprises a polymer containing two or more vinyl groups, and the second layer is disposed on the first layer.

2. The multilayer ceramic electronic component according to claim 1, wherein: The first electrode layer, the first coating layer, the first conductive layer, and the first metal layer are sequentially stacked in the first external electrode. The second electrode layer, the first coating layer, the second conductive layer, and the second metal layer are sequentially stacked in the second external electrode, and The first electrode layer and the first conductive layer are connected to each other through the plurality of openings in the first coating, and the second electrode layer and the second conductive layer are connected to each other.

3. The multilayer ceramic electronic component according to claim 1, wherein: The first electrode layer includes a portion disposed on the first surface of the ceramic body and another portion extending to the third, fourth, fifth, and sixth surfaces of the ceramic body. The second electrode layer includes a portion disposed on the second surface of the ceramic body and another portion extending to the third, fourth, fifth and sixth surfaces of the ceramic body.

4. The multilayer ceramic electronic component according to claim 1, wherein, The first electrode layer and the second electrode layer are sintered electrodes containing conductive metal.

5. The multilayer ceramic electronic component according to claim 1, wherein, The first coating comprises Al2O3, HfO2, ZrO2, La2O3, SiO2, Ta2O5, Nb2O5, Y2O3, SrTiO3, BaTiO3, AlN, and SiN. x Choose one or more from the groups formed.

6. The multilayer ceramic electronic component according to claim 1, wherein, The average thickness of the first coating is greater than or equal to 50 nm and less than or equal to 200 nm, and the average thickness of the second coating is greater than or equal to 50 nm and less than or equal to 700 nm.

7. The multilayer ceramic electronic component according to claim 1, wherein, The first metal layer and the second metal layer are plating layers.

8. The multilayer ceramic electronic component according to claim 7, wherein, The first metal layer and the second metal layer have a structure in which two or more plating layers are stacked.

9. The multilayer ceramic electronic component according to claim 1, wherein, The average thickness of the first layer is greater than or equal to 21 nm and less than or equal to 420 nm, and the average thickness of the second layer is greater than or equal to 21 nm and less than or equal to 420 nm.

10. The multilayer ceramic electronic component according to claim 9, wherein, The first layer and the second layer comprise different materials, and the first layer and the second layer are cross-linked together.

11. The multilayer ceramic electronic component according to any one of claims 1-10, wherein, The second layer comprises a hydrophobic polymer.

12. The multilayer ceramic electronic component according to any one of claims 1-10, wherein, The second layer comprises compounds containing vinyl and fluorine.

13. The multilayer ceramic electronic component according to any one of claims 1-10, wherein, The first layer and the second layer are stacked sequentially and disposed on the ceramic body, the first external electrode and the second external electrode.

14. The multilayer ceramic electronic component according to claim 13, wherein, The first layer is configured to be in direct contact with the ceramic body, the first external electrode, and the second external electrode.

15. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged in alternating stacks, and a dielectric layer is disposed between the first inner electrode and the second inner electrode; A first external electrode is connected to the first internal electrode and includes a first electrode layer and a first conductive layer; The second outer electrode is connected to the second inner electrode and includes a second electrode layer and a second conductive layer. The first coating includes an inorganic film layer and is disposed between the first electrode layer and the first conductive layer and between the second electrode layer and the second conductive layer; as well as The second coating comprises a polymer containing at least one vinyl group and is configured to cover the first external electrode and the second external electrode. The second coating comprises a first layer and a second layer, wherein the first layer comprises a polymer containing two or more vinyl groups, and the second layer is disposed on the first layer.

16. The multilayer ceramic electronic component according to claim 15, wherein: The first coating includes a plurality of openings penetrating the first coating, and Through the plurality of openings, the first electrode layer is in contact with the first conductive layer, and the second electrode layer is in contact with the second conductive layer.

17. The multilayer ceramic electronic component according to claim 16, wherein: The ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction. The plurality of openings of the first coating are provided on the first and second surfaces of the ceramic body, but not on the fifth and sixth surfaces of the ceramic body.

18. The multilayer ceramic electronic component according to any one of claims 15-17, wherein, The first coating covering a portion of the first electrode layer and the first coating covering a portion of the second electrode layer are connected to each other.

19. The multilayer ceramic electronic component according to claim 18, wherein, The portion of the first outer electrode covered by the second coating and the portion of the second outer electrode covered by the second coating are connected to each other.

20. A multilayer ceramic electronic component, comprising: The ceramic body includes a first inner electrode and a second inner electrode arranged in alternating stacks, and a dielectric layer is disposed between the first inner electrode and the second inner electrode; A first external electrode is connected to the first internal electrode and includes a first electrode layer and a first conductive layer; The second outer electrode is connected to the second inner electrode and includes a second electrode layer and a second conductive layer. A first coating is disposed between the first electrode layer and the first conductive layer, and between the second electrode layer and the second conductive layer; as well as The second coating is configured to cover both the first and second external electrodes. The first coating has an island-shaped anti-penetration layer for the plating solution, and The second coating comprises a first layer and a second layer, the first layer and the second layer comprising different materials and being cross-linked together.

21. The multilayer ceramic electronic component according to claim 20, wherein: The first coating includes a plurality of openings penetrating the first coating, and Through the plurality of openings, the first electrode layer is in contact with the first conductive layer, and the second electrode layer is in contact with the second conductive layer.

22. The multilayer ceramic electronic component according to claim 20, wherein, The first coating covering a portion of the first electrode layer and the first coating covering a portion of the second electrode layer are connected to each other.

23. The multilayer ceramic electronic assembly according to any one of claims 20-22, wherein the first external electrode includes a portion disposed on a first surface of the ceramic body and a strip extending from the portion of the first external electrode, and the second external electrode includes a portion disposed on a second surface of the ceramic body opposite to the first surface in a first direction and a strip extending from the portion of the second external electrode.

24. The multilayer ceramic electronic component according to claim 20, wherein, The portion of the first outer electrode covered by the second coating and the portion of the second outer electrode covered by the second coating are connected to each other.

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