Substrate structure and electronic device

Abstract

A substrate structure and an electronic device are disclosed. The substrate structure includes a substrate, a plurality of conductive lines, and a plurality of conductive members. A plurality of through holes penetrates a plate of the substrate, a plurality of first conductive pads is disposed on a first surface and adjacent to first openings of the through holes, and a plurality of second conductive pads is disposed on a second surface and adjacent to second openings of the through holes. The conductive lines are contained in the through holes, a first end of the conductive line is located at the first opening of the corresponding through hole, and a second end of the conductive line is located at the second opening of the corresponding through hole. The conductive members are disposed on the first surface and the second surface of the plate, the first end of each conductive line is electrically connected to each first conductive pad corresponding thereto through one of the conductive members, and the second end of each conductive line is electrically connected to each second conductive pad corresponding thereto through one of the conductive members. At least a portion of each conductive line does not directly contact a hole wall of each through hole.

Description

Technical Field

[0001] This invention relates to a substrate structure, and more particularly to a substrate structure and an electronic device including the substrate structure. Background Technology

[0002] In the manufacturing process of electronic devices, especially optoelectronic devices, when it is necessary to electrically connect the circuit layers on the upper and lower surfaces of a substrate, the traditional method is to first drill holes in the substrate, and then use chemical plating and / or electroplating processes to form conductive films in the holes. The conductive films in the holes are then connected to the circuit layers on the upper and lower surfaces, thereby achieving the purpose of electrically connecting the circuit layers on the upper and lower surfaces of the substrate.

[0003] However, the process of forming conductive films using chemical plating or electroplating is not only more complex and expensive, but also raises environmental pollution issues related to the plating solution. Summary of the Invention

[0004] In view of the above, the object of the present invention is to provide a substrate structure and an electronic device. Unlike known processes such as chemical plating or electroplating, the present invention has the advantages of simple process, low cost, and relatively environmentally friendly.

[0005] To achieve the above objectives, a substrate structure according to the present invention includes a substrate, multiple conductive lines, and multiple conductive elements. The substrate includes a plate, a plurality of through holes, a plurality of first conductive pads, and a plurality of second conductive pads. The plate defines corresponding first and second surfaces. The through holes penetrate the plate and each through hole defines a first opening, a second opening, and a hole wall. The first conductive pads are disposed on the first surface of the plate and adjacent to the first openings of the through holes. The second conductive pads are disposed on the second surface of the plate and adjacent to the second openings of the through holes. Conductive wires are accommodated in the through holes. Each conductive wire extends from the first opening to the second opening of each through hole and defines corresponding first and second ends. The first end of each conductive wire is located at the first opening of the corresponding through hole, and the second end of each conductive wire is located at the second opening of the corresponding through hole. Conductive elements are disposed on the first and second surfaces of the plate. The first end of each conductive wire is electrically connected to the corresponding first conductive pad through one of the conductive elements, and the second end of each conductive wire is electrically connected to the corresponding second conductive pad through one of the conductive elements. At least a portion of each conductive wire does not directly contact the hole wall of each through hole.

[0006] In one embodiment, at least a portion of each conductive wire does not directly contact each conductive element.

[0007] In one embodiment, the substrate structure further includes a plurality of organic materials, each via defining a gap between each conductive line and the hole wall, each organic material filling each gap, and each organic material connecting each conductive line and each hole wall.

[0008] In one embodiment, the substrate structure further defines a plurality of recessed spaces; wherein, the two ends of each organic material approach the first opening and the second opening of each through hole, and together with the hole wall and the first opening or the second opening, form each recessed space, and at least a portion of each conductive element is located in each recessed space.

[0009] In one embodiment, the substrate structure further defines a plurality of recessed spaces, which are respectively located between the hole wall and the first opening and between the hole wall and the second opening, and at least a portion of each conductive element is located in each recessed space.

[0010] In one embodiment, the first end of each conductive wire is electrically connected to the corresponding first conductive pad through one of the conductive elements, and the second end of each conductive wire is electrically connected to the corresponding second conductive pad through another conductive element.

[0011] In one embodiment, at least one conductive element extends from a first end to a second end along the corresponding conductive line.

[0012] In one embodiment, the conductive elements respectively cover at least a portion of the first openings and the second openings of the vias.

[0013] In one embodiment, each through-hole is defined with a depth-to-diameter ratio greater than or equal to 0.5 and less than or equal to 75.

[0014] In one embodiment, the plate is defined with a thickness greater than or equal to 0.01 mm and less than or equal to 1.1 mm.

[0015] In one embodiment, each through-hole is defined with a diameter greater than or equal to 0.015 mm.

[0016] In one embodiment, each conductive wire is defined with a wire diameter greater than or equal to 0.01 mm.

[0017] In one embodiment, each conductive wire is defined with a wire diameter greater than or equal to 0.005 mm.

[0018] In one embodiment, the plate is a rigid substrate, a flexible substrate, or a combination of a rigid substrate and at least one flexible substrate.

[0019] In one embodiment, a conductive layer is provided in the plate body, the conductive layer passes through one of the through holes and is electrically connected to one of the conductive components.

[0020] In one embodiment, the plate includes multiple substrates, with a conductive layer disposed between two of the substrates; in the two substrates, the aperture of one substrate adjacent to the first opening is larger than the aperture of the other substrate away from the first opening, thus exposing the conductive layer.

[0021] In one embodiment, the plate comprises a glass material, a polyimide (PI) material, or a combination thereof.

[0022] In one embodiment, the material of each conductive wire includes gold, copper, or aluminum, or alloys thereof.

[0023] In one embodiment, the material of each conductive element comprises gold, tin, copper, silver, or an alloy of any combination thereof.

[0024] In one embodiment, a first end of one of the conductive elements is eutectic connected to one of its corresponding first conductive pads, and / or a second end of one of the conductive elements is eutectic connected to one of its corresponding second conductive pads.

[0025] In one embodiment, the substrate further includes first conductive lines disposed on a first surface of the plate and electrically connected to these first conductive pads.

[0026] In one embodiment, the substrate further includes second conductive lines disposed on a second surface of the plate and electrically connected to these second conductive pads.

[0027] To achieve the above objectives, an electronic device according to the present invention includes a substrate structure as described above and a plurality of electronic structures disposed on a first surface of a plate. These electronic structures are electrically connected to the first conductive pads and electrically connected to the second conductive pads via conductive lines.

[0028] In one embodiment, these electronic structures are multiple optoelectronic components.

[0029] To achieve the above objectives, a method for manufacturing a substrate structure according to the present invention includes at least the following steps: preparing a substrate, wherein the substrate includes a rigid substrate, a flexible substrate, a plurality of through holes, and a plurality of first conductive pads, the rigid substrate defining corresponding first surfaces and second surfaces, the first conductive pads being disposed on the first surfaces of the rigid substrate, the through holes penetrating the rigid substrate, the flexible substrate being located on the second surfaces of the rigid substrate and closing one of the openings of the through holes; inserting a plurality of conductive wires into the through holes, wherein each conductive wire defines corresponding first ends and second ends, the second ends of each conductive wire contacting the flexible substrate, the first ends of each conductive wire approaching another opening of the corresponding through hole, and at least a portion of each conductive wire not directly contacting the hole wall of the inserted through hole; and coating a plurality of conductive elements onto the first ends of the conductive wires and hardening the conductive elements, such that the conductive elements electrically connect the first ends of the conductive wires to the first conductive pads respectively.

[0030] In one embodiment, before or after the step of inserting multiple conductive wires into the perforations, the manufacturing method further includes: fabricating first conductive lines on a first surface of a rigid substrate, wherein the first conductive pads are electrically connected to the first conductive lines.

[0031] In one embodiment, in the step of coating multiple conductive elements, the manufacturing method further includes: simultaneously fabricating a first conductive line.

[0032] In one embodiment, after the step of inserting multiple conductive wires into the perforations, the manufacturing method further includes: removing a flexible substrate to expose the openings of the perforations; and fabricating a plurality of second conductive pads on a second side of a rigid substrate, the second conductive pads being adjacent to the openings of the perforations.

[0033] In one embodiment, the flexible substrate includes an adhesive layer, and the adhesive layer is attached to a second side of the rigid substrate.

[0034] In one embodiment, before or after the step of inserting multiple conductive wires into the perforations, the manufacturing method further includes: fabricating second conductive lines on a second side of a rigid substrate, wherein the second conductive pads are electrically connected to each other with the second conductive lines.

[0035] In one embodiment, in the step of coating multiple conductive elements, the manufacturing method further includes: simultaneously fabricating a second conductive line.

[0036] In one embodiment, before or after the step of inserting multiple conductive wires into these perforations, the manufacturing method further includes: fabricating multiple second conductive pads on the surface of the flexible substrate away from the rigid substrate.

[0037] In one embodiment, before or after the step of inserting multiple conductive lines into the perforations, the manufacturing method further includes: fabricating second conductive lines on a surface of a flexible substrate away from a rigid substrate, wherein the second conductive pads are electrically connected to each other.

[0038] In one embodiment, after the step of inserting multiple conductive wires into the perforations, the manufacturing method further includes: drilling multiple external holes in a flexible substrate, the external holes communicating with the perforations in a rigid substrate; the second conductive pads being adjacent to the external holes of the perforations.

[0039] In one embodiment, the manufacturing method further includes: having two flexible substrates respectively disposed on a first side and a second side of a rigid substrate, and respectively sealing the two openings of each through hole; drilling a plurality of first external holes on the flexible substrate located on the first side of the rigid substrate and distributing a plurality of first conductive pads; wherein the first external holes are respectively connected to the through holes, and the first conductive pads correspond to the first external holes.

[0040] In one embodiment, before or after the step of inserting multiple conductive lines into these through holes, the manufacturing method further includes: fabricating a first conductive line on a flexible substrate located on a first side of a rigid substrate, wherein the first conductive pads are electrically connected to the first conductive line.

[0041] In one embodiment, before or after the step of inserting multiple conductive wires into these perforations, the manufacturing method further includes: fabricating multiple second conductive pads on a flexible substrate located on a second side of a rigid substrate.

[0042] In one embodiment, before or after the step of inserting multiple conductive lines into the perforations, the manufacturing method further includes: fabricating second conductive lines on a surface of a flexible substrate away from a rigid substrate, wherein the second conductive pads are electrically connected to each other.

[0043] In one embodiment, in the step of coating multiple conductive elements, the manufacturing method further includes: drilling multiple second external holes in a flexible substrate located on the second side of a rigid substrate, and placing multiple second conductive pads thereon; wherein the second external holes are respectively connected to the perforations, and the second conductive pads correspond to the second external holes.

[0044] In one embodiment, prior to the step of coating the conductive elements, the manufacturing method further includes filling a plurality of organic materials into the perforations.

[0045] In one embodiment, the step of filling these organic materials is performed after the step of inserting these conductive wires.

[0046] In one embodiment, the organic material is in a fluid state.

[0047] In one embodiment, after the step of inserting multiple conductive wires into the perforations, the manufacturing method further includes the step of repeatedly coating conductive elements: coating other conductive elements onto the second ends of the conductive wires and hardening the other conductive elements so that the other conductive elements electrically connect the second ends of the conductive wires to the second conductive pads respectively.

[0048] In one embodiment, prior to the step of repeatedly coating the conductive element, the manufacturing method further includes the step of repeatedly filling the organic material: filling the perforations with additional organic material.

[0049] In one embodiment, during the step of repeatedly filling organic materials, the viscosity of some of the repeatedly filled organic materials is lower than that of the originally filled organic materials.

[0050] In one embodiment, in the step of repeatedly coating the conductive element, the manufacturing method further includes: simultaneously fabricating a second conductive line.

[0051] In one embodiment, in the step of coating multiple conductive elements, at least one conductive element extends from a first end to a second end along a corresponding conductive line, and is connected to a corresponding first conductive pad at the first end of the conductive line, and to a corresponding second conductive pad at the second end of the conductive line, wherein at least a portion of the at least one conductive element does not directly contact the wall of the inserted perforation.

[0052] As described above, in the substrate structure and electronic device of the present invention, conductive lines are arranged within the through-holes of the substrate, and a portion of the conductive elements are used to electrically connect the first end of the conductive lines to the first conductive pad, while another portion of the conductive elements are used to electrically connect the second end of the conductive lines to the second conductive pad. This allows the first conductive pad located on the upper side of the substrate to be electrically connected to the second conductive pad located on the lower side of the substrate via the conductive elements. Therefore, compared to known techniques that use chemical plating or electroplating processes to form conductive films and electrically connect the conductive pads on the upper and lower surfaces of the substrate, the present invention is simpler to manufacture, lower in cost, and more environmentally friendly. Furthermore, the finished product has advantages such as reduced electrical connection failure rate and wide applicability. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of a substrate structure according to an embodiment of the present invention.

[0054] Figures 2A to 2C They are respectively Figure 1 Cross-sectional schematic diagrams of different embodiments of the substrate structure along the cut lines 2A-2A.

[0055] Figure 3 This is a schematic diagram of a substrate structure according to another embodiment of the present invention.

[0056] Figure 4This is a schematic diagram of an electronic device according to an embodiment of the present invention.

[0057] Figure 5 This is a schematic diagram of the process steps of a substrate structure manufacturing method according to an embodiment of the present invention.

[0058] Figures 6A to 8 These are schematic diagrams illustrating different manufacturing processes of the substrate structure of the present invention.

[0059] Figure 9 and Figure 10 These are schematic diagrams of different embodiments of the substrate structure of the present invention. Detailed Implementation

[0060] The substrate structure and electronic device according to a preferred embodiment of the present invention will be described below with reference to the accompanying drawings, wherein the same components will be described with the same reference numerals.

[0061] Figure 1 This is a schematic diagram of a substrate structure according to an embodiment of the present invention. Figures 2A to 2C They are respectively Figure 1 Cross-sectional schematic diagrams of the substrate structure along cleavage line 2A-2A for different embodiments. (See attached diagram.) Figure 1 As shown, the substrate structure in this embodiment is an active matrix (AM) substrate structure, but it is not limited to this. In different embodiments, the substrate structure can also be a passive matrix (AM) substrate structure or other types of substrate structures.

[0062] Please refer to Figure 1 , Figures 2A to 2C As shown, the substrate structure 1 includes a substrate 11, multiple conductive lines 12, and multiple conductive elements 13.

[0063] The substrate 11 includes a plate 111, a plurality of through holes H, a plurality of first conductive pads 112a and a plurality of second conductive pads 112b. In addition, in some embodiments, the substrate 11 further includes first conductive lines (e.g., a plurality of signal lines L1, L2) and second conductive lines (not shown).

[0064] The plate 111 is defined with a corresponding first surface S1 (upper surface) and a second surface S2 (lower surface), and the first conductive line and the second conductive line are respectively arranged on the first surface S1 and the second surface S2 of the plate 111. For example... Figure 1As shown, the first conductive line in this embodiment includes multiple signal lines L1 and multiple signal lines L2. These signal lines L1 are arranged laterally on the first surface S1 of the substrate 11 and are substantially parallel to each other. These signal lines L2 are arranged longitudinally on the first surface S1 of the substrate 11 and are substantially parallel to each other, and the signal lines L1 and L2 are arranged perpendicularly and alternately. In some embodiments, these signal lines L1 and L2 may be conductive lines for transmitting electrical signals, such as scan lines and / or data lines, depending on the function and purpose of the electronic device. In some embodiments, the second conductive line (not shown) may also include multiple wires or signal lines.

[0065] The substrate 11 can be a rigid substrate, a flexible substrate, or a rigid-flex plate, such as a glass substrate, a metal substrate, a ceramic substrate, a polyimide (PI) material, or a substrate made of a composite material including at least the aforementioned materials; it is understood that when the flexible substrate is sufficiently thick, its physical properties will gradually approach those of a rigid substrate. The plate body 111 itself may also contain glass material, polyimide (PI) material, or a combination thereof. The plate body 111 can be a rigid substrate, a flexible substrate, or a combination of at least one rigid substrate and at least one flexible substrate. The flexible substrate can be polyimide (PI) material, an adhesive layer, or a combination thereof. In this embodiment, the plate body 111 is a rigid substrate (here, the rigid substrate is designated 1111), and it is taken as containing glass material (i.e., a rigid glass plate). Figure 2A As shown, the plate 111 (or rigid substrate 1111) is defined with a thickness d, which can be greater than or equal to 0.01 mm (hereinafter referred to as mm) and less than or equal to 1.1 mm, i.e., 0.01 mm ≤ d ≤ 1.1 mm. The thickness d can be selected, for example, 10 μm, 20 μm (hereinafter referred to as μm), 30 μm, 100 μm, 400 μm, 500 μm, or 700 μm, etc. The plate 111 (or rigid substrate 1111) typically has a uniform thickness d, but this is not limited; therefore, when the thickness d of the plate 111 (or rigid substrate 1111) is not uniform, the thickness d is defined as the minimum thickness of the plate 111 (or rigid substrate 1111) itself. Furthermore, the materials of the first conductive line and / or the second conductive line can include, for example, metals such as gold, copper, or aluminum, or any combination thereof, or alloys of any combination thereof, or other conductive materials.

[0066] These through holes H penetrate the plate 111 and connect the first surface S1 and the second surface S2 of the plate 111, and are respectively adjacent to these signal lines L1 and L2. For example... Figures 2A to 2CAs shown, each through-hole H is defined with a first opening O1, a second opening O2 opposite to the first opening O1 (the first opening O1 and the second opening O2 can be simply referred to as openings O1 and O2), and a hole wall W. These first conductive pads 112a are disposed on the first surface S1 of the plate 111, and are respectively adjacent to these first openings O1 of these through-holes H, and are electrically connected to the first conductive lines (i.e., electrically connected to, for example,...) Figure 1 (Signal line L1 or signal line L2 shown). In addition, these second conductive pads 112b are disposed on the second surface S2 of the plate 111, and are respectively adjacent to the second openings O2 of these through holes H and electrically connected to the second conductive lines.

[0067] In some embodiments, the dimensions of the first opening O1 and the second opening O2 may be the same or different. Each through-hole H can have a defined aperture, which can be a minimum aperture, greater than or equal to 15 μm. The aperture can be selected, for example, 15 μm, 20 μm, 30 μm, 50 μm, or 100 μm. Here, the aperture of the through-hole H can be a uniform value (i.e., the aperture is a single numerical value); or, the aperture of the through-hole H can be non-uniform (e.g., a tapered hole with a waist that is narrower in the middle and wider at the top and bottom, or a tapered hole that is wider at the top and narrower at the bottom, or vice versa). Furthermore, each through-hole H can be defined with a depth-to-diameter ratio. The depth of each through-hole H can be understood as the thickness d of the plate 111. For example, when the plate 111 has a uniform thickness, the depth of each through-hole H is the thickness d of the plate 111; conversely, the depth values ​​of each through-hole H may be different. This depth-to-diameter ratio can be selected to be greater than or equal to 0.5 and less than or equal to 75 (0.5 ≤ depth-to-diameter ratio ≤ 75). The depth-to-diameter ratio can be selected as follows: 0.5 (e.g., 50μm / 500μm), 0.67 (e.g., 10μm / 15μm), 1.33 (e.g., 20μm / 15μm), 6.67 (e.g., 100μm / 15μm), 25 (e.g., 500μm / 20μm), 33.33 (e.g., 500μm / 15μm), 35 (e.g., 700μm). 46.67 (e.g., 700μm / 15μm), or 73.33 (e.g., 1100μm / 15μm), etc.

[0068] Multiple conductive lines 12 are accommodated in these through holes H. Each conductive line 12 extends from a first opening O1 to a second opening O2 of each through hole H. Here, each conductive line 12 defines a corresponding first end E1 and a second end E2. The first end E1 of the conductive line 12 is located at the first opening O1 of the corresponding through hole H, and the second end E2 of the conductive line 12 is located at the second opening O2 of the corresponding through hole H. In some embodiments, at least one conductive line 12 may be accommodated in one through hole H; in some embodiments, at least a portion of the through holes H accommodate conductive lines 12. This embodiment takes as an example that conductive lines 12 are accommodated in all through holes H, and each through hole H accommodates one conductive line 12.

[0069] In some embodiments, such as Figure 2A and Figure 2B As shown, the conductive wire 12 may not directly contact the hole wall W of the through hole H, but this is not a limitation. In different embodiments, such as... Figure 2C As shown, the conductive wire 12 can also contact the hole wall W of the through-hole H. In some embodiments, the material of each conductive wire 12 can be a metal wire, such as gold, copper, or aluminum, or any combination thereof, or any alloy thereof. Each conductive wire 12 can be defined with a wire diameter, which can be greater than or equal to 0.01 mm (cm). Here, the wire diameter is the maximum possible wire diameter, for example, it can be 50 μm (mm), 1 mil (about 25 μm, material can be, for example, copper or gold), 15 μm (material can be, for example, copper), or 10 μm (material can be, for example, gold). In some embodiments, the wire diameter of the conductive wire 12 can be greater than or equal to 0.005 μm. It is understood that the wire diameter of the conductive wire 12 must also take into account the design to accommodate it within the diameter of the through-hole H.

[0070] Multiple conductive elements 13 are disposed on the first surface S1 and the second surface S2 of the plate 111. These conductive elements 13 can respectively cover at least a portion of the first openings O1 and the second openings O2 of the through holes H. In some embodiments, the conductive elements 13 can partially or completely cover the first opening O1 and / or the second opening O2. Figures 2A to 2CIn this embodiment, the first opening O1 and the second opening O2 of the through hole H are respectively covered by two conductive elements 13, and the conductive elements 13 completely cover the first opening O1 and the second opening O2. In addition, a portion of these conductive elements 13 can be electrically connected to the first ends E1 of these conductive wires 12 to these first conductive pads 112a, while another portion of these conductive elements 13 can be electrically connected to the second ends E2 of these conductive wires 12 to these second conductive pads 112b. In other words, in order to enable the first conductive lines (signal lines L1, L2) located on the first surface S1 of the plate 111 to be electrically connected to the second conductive lines on the second surface S2 of the plate 111 through the through hole H, the substrate structure 1 of this embodiment is to implant at least one conductive line 12 in the through hole H, and to use conductive members 13 to cover at least a portion of the first opening O1 and the second opening O2 of the through hole H respectively, so that the two ends (E1, E2) of the conductive line 12 are electrically connected to the first conductive pad 112a and the second conductive pad 112b through the corresponding conductive members 13 respectively. In this way, the first conductive pad 112a located on the first surface S1 of the plate 111 can form a circuit through the conductive member 13, the conductive line 12 in the through hole H, and the second conductive pad 112b located on the second surface S2 of the plate 111. It can be understood that the first conductive lines (signal lines L1, L2) located on the first surface S1 of the plate 111 can be electrically connected to the second conductive lines located on the second surface S2 of the plate 111 through the aforementioned circuit. In some embodiments, at least a portion of the first opening O1 of the through hole H and at least a portion of the second opening O2 may be covered by the same conductive element 13. For example, the conductive element 13 may extend from the first end E1 to the second end E2 of the conductive line 12, and the conductive element 13 is located at the first conductive pad 112a corresponding to the portion of the electrical connection of the first opening O1 and the second conductive pad 112b corresponding to the portion of the electrical connection of the conductive element 13 at the second opening O2.

[0071] Furthermore, in each through-hole H, at least a portion of each conductive wire 12 does not directly contact the hole wall W of each through-hole H, or further, at least a portion of each conductive wire 12 does not contact each conductive element 13. In some embodiments, at least a portion of each conductive wire 12 does not directly contact the hole wall W of each through-hole H, and does not directly contact each conductive element 13 (that is, a conductive wire 12 located somewhere in the through-hole H does not directly contact the conductive element 13 nor directly contact the hole wall W). In some embodiments, the material of each conductive element 13 may, for example, include gold, tin (materials such as tin, bismuth, copper, silver), copper, or silver, or any combination thereof, or an alloy thereof, and is not limited thereto. Before curing, the conductive element 13 may be a fluid material, such as solder paste or silver paste. In some embodiments, when fluid material fills the first opening O1 of the through hole H, some fluid material (conductive element 13) may extend along the first end E1 of the corresponding conductive line 12 to the second end E2, so that the aforementioned conductive element 13 extends along the first end E1 of the corresponding conductive line 12 to the second end E2; at this time, at least a portion of each conductive line 12 may still not directly contact the hole wall W of each through hole H.

[0072] Please refer to again Figures 2A to 2C As shown, each through-hole H defines a gap G between each conductive line 12 and the hole wall W; in some embodiments, such as 2B to Figure 2C As shown, the substrate structure 1 may further include a plurality of organic materials 14, each organic material 14 being able to fill (but not limited to filling) the voids G within each via H, and each organic material 14 within each via H being able to connect each conductive line 12 to each via wall W. In other words, each organic material 14 may cover at least a portion of each conductive line 12, and each organic material 14 may fill each void G within each via H; alternatively, each organic material 14 may not fill each void G (for example, air bubbles may be present within the via H), and this invention is not limiting. It is worth noting that at least a portion of each conductive line 12 may not directly contact the via wall W of each via H, but may still indirectly contact the via wall W of each via H through the filling or filling of the organic material 14, which is not contradictory in this context.

[0073] Furthermore, the substrate structure 1 of this embodiment may further define a plurality of recessed spaces U, which may be located between the hole wall W and the first opening O1 and between the hole wall W and the second opening O2, respectively, and at least a portion of each conductive element 13 is located in its corresponding recessed space U. When filled with an organic material, such as 2B to Figure 2CAs shown, the upper and lower ends of each organic material 14 approach (i.e., are quite close to) the first opening O1 and the second opening O2 of each through hole H, and each organic material 14 further forms a recessed space U together with the hole wall W and the first opening O1, or each organic material 14 with the hole wall W and the second opening O2, such that at least a portion of each conductive element 13 disposed in the first opening O1 and the second opening O2 can be located in the recessed space U. Here, the recessed space U is located where the first opening O1 and the second opening O2 are recessed into the through hole H, and is a space reserved for the conductive element 13 to be filled in, and the conductive element 13 can contact the hole wall W. In other words, in this invention, due to process factors, a portion of the conductive element 13 may be filled into the recessed space U of the through hole H through the first opening O1 and the second opening O2. Therefore, as shown in 2B to Figure 2C In each through hole H shown, the conductive element 13 not only covers the first opening O1 and the second opening O2 on both sides of the through hole H, but also fills each recessed space U. Apart from the recessed space U, the remaining space of the through hole H is filled or further filled by the organic material 14.

[0074] in addition, Figure 3 This is a schematic diagram of a substrate structure according to another embodiment of the present invention. Figure 3 As shown, the substrate structure 1a of this embodiment has roughly the same component composition and connection relationship as the substrate structure 1 of the aforementioned embodiment. The difference is that in the substrate structure 1a of this embodiment, each through hole H is located outside the corresponding first conductive pad 112a and second conductive pad 112b, and does not overlap with the first conductive pad 112a and second conductive pad 112b. In addition, each conductive element 13 of this embodiment may only partially cover the first opening O1 and second opening O2 of the corresponding through hole H. Of course, in different embodiments, at least one through hole H may partially overlap with the corresponding first conductive pad 112a and / or second conductive pad 112b; or the conductive element 13 may completely cover the first opening O1 of the through hole H, but partially cover the second opening O2; or the conductive element 13 may completely cover the second opening O2 of the through hole H, but partially cover the first opening O1, which is not limited.

[0075] in addition, Figure 4 This is a schematic diagram of an electronic device according to an embodiment of the present invention. Figure 4 As shown, the electronic device 2 may include a substrate structure 1 and multiple electronic structures 3. The electronic device 2 in this embodiment is based on the inclusion of a substrate structure 1, but it is not limited thereto. In different embodiments, the electronic device 2 may also include the aforementioned substrate structure 1a or variations thereof. For specific technical details, please refer to the above description, which will not be elaborated further here.

[0076] These electronic structures 3 are disposed on the substrate structure 1. In this embodiment, these electronic structures 3, taking multiple optoelectronic structures as an example, are disposed on the first surface S1 of the plate 111 of the substrate structure 1, and these electronic structures 3 are electrically connected to the first conductive pads 112a and / or the first conductive lines (e.g., signal lines L1 or L2), and are electrically connected to the second conductive pads 112b and / or the second conductive lines (not shown) through the conductive lines 12. Each optoelectronic structure is electrically connected to the first conductive pads 112a through two electrical connection pads P1 and P2 corresponding to the extended signal lines L1 and L2 (i.e., the first conductive lines), so that each optoelectronic structure can be electrically connected to the first conductive pads 112a through the two electrical connection pads P1 and P2, and electrically connected to the second conductive pads 112b through the conductive lines 12. The electronic structures 3 and their electrical layout on the substrate structure 1 in this embodiment are not limited to optoelectronic structures.

[0077] In this embodiment, each optoelectronic structure may include at least one optoelectronic component, which may be a millimeter- or micrometer-sized optoelectronic chip or optoelectronic package. In some embodiments, each optoelectronic component may include, for example, but not limited to, at least one light-emitting diode chip (LED chip), a mini LED chip, a micro LED chip, a micro sensor chip, or at least one package, or optoelectronic chips or packages of any size, whether millimeter-, micrometer-, or smaller. A millimeter-sized package may include a micrometer-sized chip. In some embodiments, each optoelectronic component may include one optoelectronic chip or package, thereby understanding the optoelectronic component as a single pixel; or, in some embodiments, each optoelectronic component may include multiple optoelectronic chips or packages, which can be understood as the optoelectronic component including multiple pixels. In some embodiments, the optoelectronic component may include, for example, red, blue, or green LED, Mini LED, or Micro LED chips, or LED, Mini LED, or Micro LED chips or packages of other colors. When the three optoelectronic chips or packages on the optoelectronic component are red, blue, and green LED, MiniLED, or MicroLED chips, respectively, a full-color LED, MiniLED, or microLED display can be formed. The aforementioned chips can be dies with horizontal electrodes, flip-chip electrodes, or vertical electrodes, and are electrically connected to the electrodes via wire bonding or flip-chip bonding. The aforementioned packages are not limited to packages with active components or passive packages without active components; active components include, but are not limited to, thin-film transistors (TFTs) or silicon integrated circuits (ICs). In some embodiments, the electronic device 2 may further include one or more active components, such as, but not limited to, thin-film transistors (TFTs) or silicon integrated circuits (ICs), corresponding to at least one of the aforementioned optoelectronic components 3. In some embodiments, the electronic structure (e.g., but not limited to) includes active devices such as active components (and / or integrated components thereof) of thin-film transistors (TFTs) or silicon integrated circuits (ICs), or passive devices such as passive components (and / or integrated components thereof) of capacitors, resistors, inductors, conductors, encoders, potentiometers, antennas, transformers, filters, attenuators, couplers, oscillators, radio frequency components or microwave (or millimeter wave) components.

[0078] in addition, Figure 5 This is a schematic diagram illustrating the process steps of a substrate structure manufacturing method according to an embodiment of the present invention. Figure 5As shown, the method for manufacturing the substrate structure proposed in this invention may include at least the following steps: preparing a substrate; wherein the substrate includes a rigid substrate, a flexible substrate, a plurality of through holes, and a plurality of first conductive pads, the rigid substrate having corresponding first and second surfaces, the first conductive pads being disposed on the first surface of the rigid substrate, the through holes penetrating the rigid substrate, the flexible substrate being located on the second surface of the rigid substrate and closing one of the openings of the through holes (step S01); inserting a plurality of conductive wires into the through holes; wherein each conductive wire has corresponding first and second ends, the second end of each conductive wire contacting the flexible substrate, the first end of each conductive wire approaching another opening of the corresponding through hole, and at least a portion of each conductive wire not directly contacting the hole wall of the inserted through hole (step S02); and coating a plurality of conductive elements onto the first ends of the conductive wires and hardening the conductive elements, so that the conductive elements respectively electrically connect the first ends of the conductive wires to the first conductive pads (step S03). In addition, the manufacturing method of the present invention may also include the step of repeatedly coating conductive elements: coating other conductive elements on the second ends of the conductive wires and hardening the other conductive elements so that the other conductive elements are respectively electrically connected to the second ends of the conductive wires to the second conductive pads.

[0079] Please refer to the following. Figure 1 and cooperate Figures 6A to 8 To illustrate the steps described above. Among them, Figures 6A to 8 These are schematic diagrams illustrating different manufacturing processes of the substrate structure of the present invention.

[0080] Please refer to the following: Figure 6AAs shown, step S01 involves preparing a substrate 11. The substrate 11 includes a rigid substrate 1111, a flexible substrate 1112, multiple through-holes h1, and multiple first conductive pads 112a. The rigid substrate 1111 has corresponding first surfaces s1 and second surfaces s2. The first conductive pads 112a are disposed on the first surface s1 of the rigid substrate 1111. The through-holes h1 penetrate the rigid substrate 1111. The flexible substrate 1112 is located on the second surface s2 of the rigid substrate 1111 and closes one of the openings of the through-holes h1 (i.e., the second opening o2). Here, the rigid substrate 1111 and the flexible substrate 1112 can be referred to as a plate 111. In this embodiment, the flexible substrate 1112 is an adhesive layer that can be removed in subsequent processes. Its purpose is to close the second opening o2 of the through-holes h1 of the substrate 11 and to fix the conductive wires 12 implanted in step S02, after which it can be removed to facilitate subsequent processes. The adhesive layer material may include, for example, an adhesive material. In some embodiments, the flexible substrate 1112 may further include a flexible composite layer of polyimide (PI) or a release film in addition to the adhesive layer. In some embodiments, the adhesive layer (flexible substrate 1112) may comprise materials such as silicone, acrylic, or resin. In some embodiments, a plurality of perforations h1 may be formed on the plate 111 by laser light, for example, but not limited to. In some embodiments, a plurality of first conductive pads 112a may be formed on the first surface s1 of the rigid substrate 1111 by printing or spraying processes, for example, but not limited to.

[0081] Next, step S02 involves inserting multiple conductive wires 12 into the perforations h1. Each conductive wire 12 has a corresponding first end E1 and a second end E2. The second end E2 of each conductive wire 12 contacts the flexible substrate 1112, and the first end E1 of each conductive wire 12 is close to another opening (i.e., the first opening o1) of the corresponding perforation h1. At least a portion of each conductive wire 12 does not directly contact the hole wall w1 of the perforation h1 into which it is inserted. Here, the conductive wires 12 are implanted through the first opening o1 of the perforation h1. In some embodiments, one (or more) conductive wires 12 may be implanted into one perforation h1. In some embodiments, step S02, in which the conductive wires 12 are inserted, may further include simultaneously inserting conductive wires 12 into multiple perforations h1. In other words, during the process of implanting the conductive wires 12, one (or more) conductive wires 12 may be simultaneously and separately inserted into multiple perforations h1 at one time. Of course, it can also be inserted in stages, for example, inserting one (or more) conductive wires 12 into one hole h1 at a time. This invention is not limited to this.

[0082] Before or after step S02, when inserting multiple conductive wires 12 into these through holes H, please refer to [reference needed]. Figure 1As shown, the manufacturing method may further include: fabricating first conductive lines (signal lines L1, L2) on the first surface s1 of the rigid substrate 1111, wherein the first conductive pads 112a are electrically connected to the first conductive lines (signal lines L1, L2). Here, the first conductive lines (signal lines L1, L2) can be fabricated, for example, by printing or spraying. It should be noted that if the conductive lines 12 are placed first and then the first conductive lines are fabricated, any protruding conductive parts 13 should be smoothed before fabricating the first conductive lines to reduce interference in subsequent processes and thus improve process accuracy.

[0083] In addition, such as Figure 6B As shown, before or after step S02, where multiple conductive lines 12 are inserted into the perforations h1, the manufacturing method may further include: removing the flexible substrate 1112 (adhesive layer) to expose the second openings o2 of the perforations h1; and fabricating a plurality of second conductive pads 112b on the second surface s2 of the rigid substrate 1111, the second conductive pads 112b being adjacent to the second openings o2 of the perforations h1. In some embodiments, the flexible substrate 1112 may be removed by means of mechanical stress removal, tearing, dissociation removal, or removal after reducing adhesion. In some embodiments, the flexible substrate 1112 may be a dissociable material. In some embodiments, the flexible substrate 1112 may be removed by irradiation with ultraviolet light or by changing the temperature (cooling or heating). In addition, the second conductive pads 112b may also be fabricated, for example, by printing or spraying processes. Since the flexible substrate 1112 in this embodiment can be removed, the first surface s1 and the second surface s2 of the rigid substrate 1111 of the substrate 11 are equivalent to Figures 2A to 2C The first surface S1 and the second surface S2 of the plate 111 are shown; the perforation h1 of the rigid substrate 1111 is equivalent to Figures 2A to 2C The through-hole H of the substrate 11 shown; the first opening o1 and the second opening o2 of the through-hole h1 are equivalent to Figures 2A to 2C The first opening O1 and the second opening O2 of the through hole H are shown; the wall w1 of the through hole h1 is equivalent to Figures 2A to 2C The hole wall W of the through hole H shown.

[0084] Furthermore, before or after step S02, which involves inserting multiple conductive lines 12 into the perforations h1, the manufacturing method may further include: fabricating second conductive lines on the second surface s2 of the rigid substrate 1111 (plate 111), wherein the second conductive pads 112b are electrically connected to each other. The second conductive lines may also be fabricated, for example, by printing or spraying processes.

[0085] Furthermore, after step S02 where these conductive wires 12 are inserted, and before proceeding to the next step S03, the process of coating the conductive element 13, such as Figure 6BAs shown, multiple organic materials 14 can be filled into these perforations h1 first. In some embodiments, the organic material 14 may be in a fluid state, and may be filled into the perforation h1, for example, through the first opening o1 of the perforation h1. It is worth mentioning that the order of filling the organic material 14 and placing the conductive wires 12 is not limited, and can be considered in general by taking into account the viscosity of the organic material 14 or process adjustments. That is, the step of filling the organic material 14 can be performed after placing the conductive wires 12 and before coating the conductive element 13; or, the step of filling the organic material 14 can be performed before placing the conductive wires 12. The present invention is not limited. In this embodiment, the step of filling these organic materials 14 is performed after the step S02 of placing these conductive wires 12. In some embodiments, the organic material 14 may contain materials from the Silicon series, Acrylic series, or Resin series. In some embodiments, the organic material 14 may be slowly cured at room temperature, or cured at a specific temperature, or cured by irradiation with ultraviolet light, depending on the material and properties of the organic material 14.

[0086] Next, step S03 is performed: a plurality of conductive elements 13 are coated onto the first ends E1 of the conductive wires 12, and the conductive elements 13 are hardened, so that the conductive elements 13 electrically connect the first ends E1 of the conductive wires 12 to the first conductive pads 112a respectively. In some embodiments, the conductive elements 13 are hardened by means of heating, pressurizing, or a combination thereof, or other means. In some embodiments, the conductive elements 13 can be coated by spraying or printing, so that the second ends E2 of the conductive wires 12 can be electrically connected to the second conductive pads 112b through the conductive elements 13. In some embodiments, in step S03 of coating the plurality of conductive elements 13, the first conductive lines (signal lines L1, L2) and / or the second conductive lines can be fabricated simultaneously. In some embodiments, when the first conductive lines (signal lines L1, L2) and the conductive elements 13 are fabricated in the same process, the material of the conductive elements 13 may be recessed into the through-hole H, but this will not affect the electrical connection function. In some embodiments, the electrical connection between the conductive element 13 and the conductive wire 12, the first conductive pad 112a or the second conductive pad 112b may be a eutectic formed by the aforementioned metal, or any combination of the aforementioned metals, or an alloy of any combination of the aforementioned metals.

[0087] In some embodiments, in step S03 of coating multiple conductive elements 13, at least one conductive element 13 (fluid material before curing) may extend along the first end E1 to the second end E2 of the corresponding conductive line 12, and connect to the corresponding first conductive pad 112a at the first end E1 of the conductive line 12, and connect to the corresponding second conductive pad 112b at the second end E2 of the conductive line 12; wherein at least a portion of each conductive line 12 may still not directly contact the hole wall w1 of each perforation h1.

[0088] Please refer to again Figure 6BAs shown, the manufacturing method of this embodiment may further include the step of repeatedly coating conductive elements 13, that is, coating other conductive elements 13 onto the second ends E2 of these conductive lines 12 and hardening the other conductive elements 13, so that the other conductive elements 13 electrically connect the second ends E2 of these 12 to the second conductive pads 112b, and then electrically connect to the second conductive line. In some embodiments, the other conductive elements 13 may be coated by spraying or printing, so that the second ends E2 of the conductive lines 12 can be electrically connected to the second conductive pads 112b and the second conductive line through the other conductive elements 13. In some embodiments, the second conductive line may be fabricated simultaneously in the step of repeatedly coating multiple conductive elements 13. It is worth noting that in the step of repeatedly coating conductive elements 13, the semi-finished product of the substrate structure 1 may be inverted first, so that the first surface S1 and the second surface S2 of the substrate 11 are opposite, and then the coating step is performed.

[0089] Furthermore, prior to the step of repeatedly coating the conductive material 13, if there is a need to fill the voids G within the perforations h1 during the aforementioned step of filling multiple organic materials 14 into these perforations h1, the step of filling the organic materials 14 can be repeated, that is, filling other organic materials 14 into these perforations h1. Here, other organic materials 14 of the same or different materials can be filled into the perforations h1 through the second opening o1 of each perforation h1. In this process, the viscosity of the other organic materials 14 that are repeatedly filled can be lower than the viscosity of the original organic materials 14. The purpose is that if the viscosity of the organic materials 14 filled in the second time is lower, the flowability will be better, which can make up for the voids left when the organic materials 14 were filled in the first time, so that the voids G of the perforations h1 can be more fully filled (e.g., completely filled) by the organic materials 14.

[0090] In addition, such as Figure 7A and Figure 7B As shown, the manufacturing process of the substrate structure in this embodiment is largely the same as that in the previous embodiment. The difference is that the flexible substrate 1112 of the substrate structure 11 in this embodiment is not an adhesive layer, but a flexible substrate that remains on the second surface s2 of the rigid substrate 1111 (without being removed). The material of the flexible substrate (flexible substrate 1112) is, for example, but not limited to, PI.

[0091] Furthermore, before or after step S02, in which multiple conductive wires 12 are inserted into the perforations h1, the manufacturing method of this embodiment may further include: forming multiple second conductive pads 112b on the surface of the flexible substrate 1112 away from the rigid substrate 1111 (second surface s2). Additionally, before or after step S02, in which multiple conductive wires 12 are inserted into the perforations h1, the manufacturing method of this embodiment may further include: forming second conductive lines on the surface of the flexible substrate 1112 away from the rigid substrate 1111 (second surface s2), wherein the second conductive pads 112b are electrically connected to the second conductive lines. In some embodiments, the second conductive lines may be formed simultaneously with step S03, in which multiple conductive elements 13 are coated.

[0092] Furthermore, in order to enable the conductive element 13 to be electrically connected to the second end E2 of the conductive wire 12, after step S02 of inserting multiple conductive wires 12 into these through holes h1, the manufacturing method of this embodiment may further include: drilling multiple external holes h2 into the flexible substrate 1112, wherein these external holes h2 communicate with these through holes h1 of the rigid substrate 1111, and these second conductive pads 112b are adjacent to these external holes h2 of these through holes h1. Here, it is taken as an example that the diameter of the external hole h2 is the same as the diameter of the through hole h1. Of course, in different embodiments, the diameter of the external hole h2 may not be the same as the diameter of the through hole h1, which will be described in detail later.

[0093] It is understood that, since the flexible substrate 1112 is not removed in this embodiment, the first surface s1 of the rigid substrate 1111 and the surface of the flexible substrate 1112 that are away from the second surface s2 of the rigid substrate 1111 are equivalent to... Figures 2A to 2C The plate 111 shown has a first surface S1 and a second surface S2; the through hole h1 of the rigid substrate 1111 and the outer hole h2 of the flexible substrate 1112 together constitute the plate. Figures 2A to 2C The through hole H of the substrate 11 shown; the first opening o1 of the through hole h1, and the opening of the second surface s2 of the outer hole h2 away from the rigid substrate 1111, are equivalent to Figures 2A to 2C The first opening O1 and the second opening O2 of the through hole H are shown; the hole wall w1 of the perforation h1 and the hole wall w2 of the flexible substrate 1112 together constitute Figures 2A to 2C The hole wall W of the through hole H shown.

[0094] It is understood that in some embodiments, the flexible substrate 1112 may further include an adhesive layer (not shown) in addition to the flexible substrate, and may be fully or partially, permanently or temporarily fixed to the rigid substrate 1111, as described in the previous embodiments as a flexible composite layer. Here, it is still possible to perform a perforation process on the flexible substrate 1112 (flexible substrate and its adhesive layer) without removing it, and this is not limited.

[0095] In addition, such as Figure 8 As shown, the manufacturing process of the substrate structure in this embodiment is largely the same as that in the previous embodiment. The difference is that in step S01 of placing the substrate 11 in this embodiment, the number of flexible substrates 1112 of the substrate structure 11 is two, and both of these flexible substrates 1112 are flexible substrates, and are respectively disposed on the first surface s1 and the second surface s2 of the rigid substrate 1111, and respectively close the two openings o1 and o2 of each through hole h1. Figure 8 (In the image, the flexible substrate 1112 is indicated by the dashed line). Furthermore, to enable the conductive element 13 to be electrically connected to the first end E1 of the conductive wire 12, the manufacturing method of this embodiment further includes: drilling a plurality of first external holes h2 on the flexible substrate 1112 located on the first surface s1 of the rigid substrate 1111, and arranging a plurality of first conductive pads 112a; wherein these first external holes h2 respectively connect to these through holes h1, and these first conductive pads 112a correspond to these first external holes h2 (e.g., a one-to-one correspondence). Here, it is taken as an example that the diameter of the first external hole h2 is the same as the diameter of the through hole h1. Of course, in different embodiments, the diameter of the first external hole h2 may not be the same as the diameter of the through hole h1. Because the flexible substrate 1112 on the upper side of the rigid substrate 1111 has the first external hole h2, in step S03 of coating the plurality of conductive elements 13, the conductive element 13 can be electrically connected to the first end E1 of the conductive wire 12 through the first external hole h2.

[0096] Furthermore, before or after step S02, which involves inserting multiple conductive wires 12 into the through holes h1, the manufacturing method of this embodiment may further include: fabricating first conductive lines (signal lines L1, L2) on the surface of the flexible substrate 1112 away from the rigid substrate 1111 (first surface s1), and electrically connecting these first conductive pads 112a to the first conductive lines (signal lines L1, L2). Additionally, before or after step S02, which involves inserting multiple conductive wires 12 into the through holes h1, the manufacturing method of this embodiment may further include: fabricating multiple second conductive pads 112b on the surface of the flexible substrate 1112 away from the rigid substrate 1111 (second surface s2). Furthermore, before or after step S02, which involves inserting multiple conductive wires 12 into the through holes h1, the manufacturing method of this embodiment may further include: fabricating second conductive lines on the surface of the flexible substrate 1112 away from the rigid substrate 1111 (second surface s2), and electrically connecting these second conductive pads 112b to the second conductive lines. Here, a second conductive line is formed on the surface of the flexible substrate 1112 located on the second surface s2 of the rigid substrate 1111 away from the rigid substrate 1111, and these second conductive pads 112b are electrically connected to each other with the second conductive line. Here, the formation of the second conductive line can be performed simultaneously with the step S03 of coating multiple conductive elements 13.

[0097] To enable the conductive element 13 to be electrically connected to the second end E2 of the conductive wire 12, the manufacturing method of this embodiment may further include: drilling a plurality of second external holes h3 on the flexible substrate 1112 located on the second surface S2 of the rigid substrate 1111, and arranging a plurality of second conductive pads 112b; wherein, these second external holes h3 are respectively connected to these through holes h1, and these second conductive pads 112b correspond to these second external holes h3. Here, it is taken that the diameter of the second external hole h3 is the same as the diameter of the through hole h1. Of course, in different embodiments, the diameter of the second external hole h3 may not be the same as the diameter of the through hole h1. Since the flexible substrate 1112 on the lower side has second external holes h3, the conductive element 13 can be electrically connected to the second end E2 of the conductive wire 12 through the second external holes h3 during the step of repeatedly coating the conductive element 13.

[0098] Furthermore, in this embodiment, the flexible substrate 1112 may further include an adhesive layer (not shown in the figure) that is general or partial, temporary or permanent, in addition to the flexible substrate. Other technical contents of the substrate structure manufacturing method can be referred to the above description and will not be repeated here.

[0099] It is understood that, since neither of the two flexible substrates 1112 is removed in this embodiment, the surface of the upper flexible substrate 1112 that is away from the first surface s1 of the rigid substrate 1111, and the surface of the lower flexible substrate 1112 that is away from the second surface s2 of the rigid substrate 1111, are equivalent to... Figures 2A to 2C The first surface S1 and the second surface S2 of the plate 111 shown; the through hole h1 of the rigid substrate 1111, the first external hole h2 of the upper flexible substrate 1112, and the second external hole h3 of the lower flexible substrate 1112 together constitute Figures 2A to 2C The through-hole H of the substrate 11 shown; the opening of the first outer hole h2 on the first surface s1 away from the rigid substrate 1111, and the opening of the second outer hole h3 on the second surface s2 away from the rigid substrate 1111, are equivalent to Figures 2A to 2C The first opening O1 and the second opening O2 of the through hole H shown; the hole wall w1 of the perforation h1, the hole wall w2 of the upper flexible substrate 1112, and the hole wall w3 of the lower flexible substrate 1112 together constitute Figures 2A to 2C The hole wall W of the through hole H shown.

[0100] In some embodiments, step S03, which involves coating multiple conductive elements 13, can be replaced by applying heat (e.g., high laser temperature) to the first end E1 of the conductive wire 12, causing the first end E1 of the conductive wire 12 to melt and connect to the corresponding first conductive pad 112a; at this time, the first end E1 of the conductive wire 12 and the first conductive pad 112a form a eutectic connection. In some embodiments, the step of repeatedly coating multiple conductive elements 13 can also be replaced by applying heat (e.g., high laser temperature) to the second end E2 of the conductive wire 12, causing the second end E2 of the conductive wire 12 to melt and connect to the corresponding second conductive pad 112b; at this time, the second end E2 of the conductive wire 12 and the second conductive pad 112b form a eutectic connection. Furthermore, it is understood that heat can be applied simultaneously or separately to the first end E1 or the second end E2 of the conductive wire 12 to form a eutectic connection.

[0101] In some embodiments, when step S03 of coating multiple conductive elements 13 can be replaced by, for example, a laser high-temperature step, when multiple conductive lines 12 are placed into these vias H, the second end E2 of the conductive line 12 is located at the second opening O2 adjacent to the via H and is not yet in a state of direct connection with other components (e.g., suspended). At this time, heat can be applied to the first end E1 of the conductive line 12 to form a eutectic connection between the first end E1 of the conductive line 12 and the first conductive pad 112a. It is understood that step S01 of preparing the substrate 11 (see...) Figure 5 , Figure 6A , Figure 6B In this embodiment, the flexible substrate 1112, which serves as the adhesive layer, can be selectively omitted; in this embodiment, the step of removing the flexible substrate 1112 (adhesive layer) can be omitted. It is understood that in some embodiments, the conductive wire 12 may be a cut segment; in some embodiments, the conductive wire 12 may be a part of the original conductive wire that has not yet detached (been cut), until the first end E1 of the conductive wire 12 is laser-applied to detach it from the original conductive wire. It is understood that in some embodiments, the step of filling the through-hole H with multiple organic materials 14 can also be selectively omitted.

[0102] Continuing on the above, in the substrate structure 1 (or 1a) and its manufacturing method, and the electronic device 2 of the above embodiments, conductive lines 12 are provided in the through-holes H of the substrate 11, wherein the first end E1 of each conductive line 12 is electrically connected to the first conductive pad 112a by means of one of the conductive elements 13, and the second end E2 of each conductive line 12 is connected to the second conductive pad 112b by means of the same or another conductive element 13 (e.g., extending along the first end E1 of the corresponding conductive line 12 to the second end E2). The conductive wire 12 is electrically connectable, allowing its two ends (E1, E2) to be electrically connected to the first conductive pad 112a and the second conductive pad 112b respectively through the conductive element 13. This enables the first conductive line (signal lines L1, L2) located on the first surface S1 of the plate 111 (or, for example, the first surface S1 of the rigid substrate 1111) to be electrically connected to the second conductive line located on the second surface S2 of the plate 111 via the first conductive pad 112a, the conductive element 13, the conductive wire 12, and the second conductive pad 112b. Therefore, compared to known techniques that utilize chemical plating and / or electroplating processes to form conductive films and electrically connect the circuit layers on the upper and lower surfaces of the substrate, the substrate structure 1 (or 1a) and its manufacturing method, as well as the electronic device 2 of the present invention, not only have a simpler manufacturing process and lower cost, but also offer the advantage of being more environmentally friendly.

[0103] In some embodiments, the plate 111 is provided with a conductive layer 1113; wherein the plate 111 is provided with at least one or more substrates, the conductive layer 1113 is passed through by at least one through hole H, and is electrically connected to one of the conductive elements corresponding to the aforementioned through hole H, such as... Figure 9 As shown, the conductive layer 1113 electrically connects the conductive element 13 located at the first opening O1 (or the second opening O2) to the corresponding first conductive pad 112a (and second conductive pad 112b). The manufacturing process of the substrate structure in this embodiment is similar to... Figure 7BThe general structure is similar. The difference lies in that, in the substrate structure 11 of this embodiment, at least one conductive layer 1113 is provided between the flexible substrate 1112 and the rigid substrate 1111. This conductive layer can be a conductive layer pre-placed on the flexible substrate 1112 or the rigid substrate 1111, and then the flexible substrate 1112 and the rigid substrate 1111 are bonded together. Alternatively, a conductive layer can be pre-placed on both the flexible substrate 1112 and the rigid substrate 1111, and then the flexible substrate 1112 and the rigid substrate 1111 are bonded together, so that there is at least one conductive layer 1113 between the flexible substrate 1112 and the rigid substrate 1111. In this embodiment, the conductive layer 1113 is electrically connected to the conductive element 13 located at the second opening O2, and further electrically connected to the corresponding first conductive pad 112a and second conductive pad 112b. However, the present invention does not limit the conductive layer 1113 to be adjacent to the first opening O1 or the second opening O2. In addition, the method of this embodiment can also be applied to other embodiments of the present invention. It is understood that the conductive layer 1113 can be a single layer or multiple layers, and can also replace the conductive lines provided on the first surface S1 and / or the second surface S2 of the plate 111.

[0104] In some embodiments, the conductive element 13 located at the first opening O1 or the second opening O2 may be electrically connected in a stepped manner to the first conductive pad 112a or the second conductive pad 112b, the conductive layer 1113, and the conductive wire 12. For example... Figure 10 As shown, the manufacturing process of the substrate structure in this embodiment is similar to... Figure 9 The general structure is similar. The difference lies in that, in the substrate structure 11 of this embodiment, the conductive layer 1113 is located between the two substrates (1111, 1112). The diameter of the first external hole h2 of the flexible substrate 1112 adjacent to the first opening O1 is larger than the diameter of the through hole h1 of the rigid substrate 1111 away from the first opening O1. This exposes a portion of the conductive layer 1113, allowing the conductive element 13 to be electrically connected in a stepped manner to the second conductive pad 112b, the conductive layer 1113, and the conductive line 12, and to the corresponding first conductive pad 112a. This embodiment also does not limit the conductive layer 1113 to be adjacent to the first opening O1 or the second opening O2. Furthermore, the method of this embodiment can also be applied to other embodiments of the present invention.

[0105] The conductive wire implantation vias employed in this invention are widely applicable to substrate structures with a large difference between hole depth and diameter (i.e., a high depth-to-diameter ratio), reducing the possibility of electrical connection failure due to the difficulty of reaching small apertures with electroplating or chemical plating. Furthermore, the substrate structure in this invention can have conductive lines laid on or not. For example, laying conductive lines allows the electronic device to be used as an end product, while not laying conductive lines allows the electronic device to be transposed and electrically connected to other circuit boards or end products, thus providing a wider range of applications.

[0106] In summary, in the substrate structure and electronic device of the present invention, by providing conductive lines in the through-holes of the substrate, the first ends of these conductive lines are electrically connected to the first conductive pads using a portion of these conductive elements, and the second ends of these conductive lines are electrically connected to the second conductive pads using another portion or the same portion of these conductive elements (for example, the first and second ends of the conductive lines are electrically connected to the first and second conductive pads respectively using different conductive elements, or the same conductive element extends along the first end of the conductive line to the second end and is electrically connected to the first and second conductive pads). This allows the first conductive pad located on the upper side of the plate to be electrically connected to the second conductive pad located on the lower side of the plate through the conductive elements and conductive lines to form a circuit. This further allows the first conductive line (signal line) located on the first surface of the plate to be electrically connected to the second conductive line located on the second surface of the plate through the aforementioned circuit. Therefore, compared with the known technology of forming a conductive film by chemical plating and / or electroplating to electrically connect the circuit layers on the upper and lower surfaces of the substrate, the present invention is not only simpler to manufacture, lower in cost, and more environmentally friendly, but its finished products also have the advantages of wide application and reduced electrical connection failure rate.

[0107] The above description is illustrative only and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims.

Claims

1. A substrate structure, comprising: The substrate includes a plate, multiple through holes, multiple first conductive pads, and multiple second conductive pads; The plate body defines corresponding first and second surfaces, the through hole penetrates the plate body, each through hole defines a first opening, a second opening and a hole wall, the first conductive pad is disposed on the first surface of the plate body and adjacent to the first opening of the through hole, and the second conductive pad is disposed on the second surface of the plate body and adjacent to the second opening of the through hole; Multiple conductive wires are accommodated in the through hole. Each conductive wire extends from the first opening of the through hole to the second opening. Each conductive wire defines a corresponding first end and a second end. The first end of the conductive wire is located at the first opening of the corresponding through hole, and the second end of the conductive wire is located at the second opening of the corresponding through hole. as well as Multiple conductive elements are arranged on the first and second surfaces of the plate. The first end of each conductive wire is electrically connected to the corresponding first conductive pad through one of the conductive elements, and the second end of each conductive wire is electrically connected to the corresponding second conductive pad through one of the conductive elements. Wherein, at least a portion of each of the conductive wires does not directly contact the hole wall of each of the through holes; After being cured, the conductive component completely covers the first opening and the second opening corresponding to the through hole.

2. The substrate structure according to claim 1, wherein at least a portion of each of the conductive lines does not directly contact each of the conductive elements.

3. The substrate structure according to claim 1, further comprising a plurality of organic materials; Each of the vias defines a gap between each of the conductive lines and the hole wall, each of the organic materials fills each of the gaps, and each of the organic materials connects each of the conductive lines and each of the hole walls.

4. The substrate structure according to claim 3 is further defined to have a plurality of recessed spaces; in, The two ends of each organic material approach the first opening and the second opening of each through hole, and together with the hole wall and the first opening or the second opening, form each recessed space, and at least a portion of each conductive element is located in each recessed space.

5. The substrate structure according to claim 1, further defining a plurality of recessed spaces, the recessed spaces being respectively located between the hole wall and the first opening and between the hole wall and the second opening, and at least a portion of each conductive element being located in each of the recessed spaces.

6. The substrate structure according to claim 1, wherein, The first end of each of the conductive wires is electrically connected to the corresponding first conductive pad through one of the conductive elements, and the second end of each of the conductive wires is electrically connected to the corresponding second conductive pad through the other conductive element.

7. The substrate structure according to claim 1, wherein, At least one of the conductive elements extends from the first end of the corresponding conductive line to the second end.

8. The substrate structure according to claim 1, wherein each of the vias defines a depth-to-diameter ratio, the ratio of the depth-to-diameter ratio being greater than or equal to 0.5 and less than or equal to 75.

9. The substrate structure according to claim 1, wherein the plate body defines a thickness, the thickness being greater than or equal to 0.01 mm and less than or equal to 1.1 mm.

10. The substrate structure of claim 1, wherein each of the vias defines a aperture, the aperture being greater than or equal to 0.015 mm.

11. The substrate structure of claim 1, wherein each of the conductive lines defines a wire diameter greater than or equal to 0.01 mm.

12. The substrate structure according to claim 1, wherein each of the conductive lines defines a wire diameter greater than or equal to 0.005 mm.

13. The substrate structure according to claim 1, wherein the plate is a rigid substrate, a flexible substrate, or a combination of at least one rigid substrate and at least one flexible substrate.

14. The substrate structure of claim 13, wherein the plate body is provided with a conductive layer, the conductive layer passing through one of the through holes and electrically connected to one of the conductive elements.

15. The substrate structure according to claim 13, wherein the plate body is provided with multiple substrates, and a conductive layer is disposed between two of the substrates; wherein, in the two substrates, the aperture of one substrate adjacent to the first opening is larger than the aperture of the other substrate away from the first opening, thus exposing the conductive layer.

16. The substrate structure of claim 13, wherein the plate comprises a glass material, a polyimide material, or a combination thereof.

17. The substrate structure of claim 1, wherein the material of each of the conductive lines comprises gold, copper, or aluminum, or an alloy thereof.

18. The substrate structure of claim 1, wherein the material of each of the conductive elements comprises gold, tin, copper, silver, or an alloy of any combination thereof.

19. The substrate structure according to claim 1, wherein the first end of one of the conductive elements is eutectic connected to one of its corresponding first conductive pads, and / or the second end of one of the conductive elements is eutectic connected to one of its corresponding second conductive pads.

20. The substrate structure according to claim 1, wherein the substrate further includes a first conductive line, the first conductive line being disposed on the first surface of the plate and electrically connected to the first conductive pad.

21. The substrate structure according to claim 20, wherein the substrate further includes a second conductive line disposed on the second surface of the plate and electrically connected to the second conductive pad.

22. An electronic device comprising: The substrate structure according to any one of claims 1 to 21; as well as Multiple electronic structures are arranged on the first surface of the plate. The electronic structures are electrically connected to the first conductive pad and electrically connected to the second conductive pad through the conductive lines.

23. The electronic device according to claim 22, wherein the electronic structure comprises a plurality of optoelectronic components.

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