光检测器件和电子设备

By incorporating pixel separation walls, including front and back trenches, into the solid-state imaging element, the charge leakage problem is solved, thereby improving image quality.

CN114695413BActive Publication Date: 2026-07-17SONY GROUP CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SONY GROUP CORP
Filing Date
2017-01-13
Publication Date
2026-07-17

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Abstract

本公开涉及一种可以防止电荷泄漏到相邻像素中的固态成像元件和电子设备。多个像素对经由针对各个像素的不同片上透镜入射到背面上的光进行光电转换。像素分离壁形成在相邻像素之间，并且包括作为在前表面上形成的沟槽的前表面沟槽和作为在背面上形成的沟槽的背面沟槽。配线层设置在前表面上。例如，本公开可应用于背面照射型CMOS图像传感器。
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