Display device

Abstract

A display device includes a display panel, a heat spreader having a top surface attached to a first surface of the display panel, and an adhesive layer between the display panel and the heat spreader, wherein the adhesive layer has a plurality of relief patterns at a surface on the display panel side.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0186111, filed on December 29, 2020, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device having a heat dissipation component. Background Technology

[0004] With the advent of the fully developed information age, there is a growing interest in information displays that process and display massive amounts of information. In response, various display devices with advantages such as thinness, light weight, and low power consumption have been developed and have attracted attention.

[0005] Among various flat panel display devices, organic light-emitting diode (OLED) display devices can be lightweight and thin because they are self-emissive and do not require a backlight unit, which is used in liquid crystal displays that are non-emissive. Furthermore, OLED display devices have advantages in power consumption.

[0006] Organic light-emitting diode (OLED) display devices are driven by low-voltage direct current (DC) and have a fast response time. Furthermore, OLED display devices are resistant to external shocks and can be used over a wide range of temperatures because their components are solid-state. Additionally, OLED display devices are manufactured at a relatively low cost.

[0007] Organic light-emitting diode (OLED) display devices are widely used in electronic devices, such as computer or television monitors, as well as portable electronic devices, such as smartphones or tablet PCs, to provide various types of information in a variety of ways.

[0008] In addition, organic light-emitting diode (OLED) display devices generate heat when emitting light. This heat degrades the OLEDs and causes afterimages, resulting in a reduction in image quality.

[0009] In particular, when the display device has a larger size and higher resolution, more light is produced, and the heat generated accordingly also increases.

[0010] Therefore, a heat dissipation component is needed to quickly dissipate heat from inside an organic light-emitting diode display device to the outside. Summary of the Invention

[0011] Therefore, this disclosure is intended to provide a display device that substantially eliminates one or more problems caused by the limitations and disadvantages of the prior art.

[0012] In addition, this disclosure provides a display device with a heat dissipation component.

[0013] Additional features and aspects will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the inventive concept provided herein. Other features and aspects of the inventive concept may be realized and obtained by means of structures particularly pointed out in the draft specification, or from its derivatives, the claims, and the drawings.

[0014] To achieve these and other aspects of the inventive concept, as embodied and broadly described herein, a display device includes: a display panel; a heat sink having a top surface attached to a first surface of the display panel; and an adhesive layer between the display panel and the heat sink, wherein the adhesive layer has a plurality of embossed patterns on a surface on the side of the display panel.

[0015] In another aspect, a display device includes: a display panel; a source printed circuit board disposed on a first surface of the display panel; a driver integrated circuit disposed on the first surface of the display panel and electrically connected to the display panel and the source printed circuit board; and a buffer member between the driver integrated circuit and the display panel and between the source printed circuit board and the display panel, wherein the buffer member has a protrusion corresponding to the driver integrated circuit, and wherein the distance between the driver integrated circuit and the display panel is greater than the distance between the source printed circuit board and the display panel.

[0016] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0017] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate various aspects of this disclosure and, together with the description, serve to explain the various principles of this disclosure.

[0018] In the attached diagram:

[0019] Figure 1 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;

[0020] Figure 2 This is a schematic cross-sectional view of an example display panel of a display device according to an embodiment of the present disclosure;

[0021] Figure 3 yes Figure 1 A magnified view of region A1;

[0022] Figure 4This is a schematic cross-sectional view of the adhesive layer according to an embodiment of the present disclosure;

[0023] Figure 5 This is a schematic plan view of the adhesive layer according to an embodiment of the present disclosure;

[0024] Figure 6 This is a schematic rear view of a display device according to an embodiment of the present disclosure; and

[0025] Figure 7 It corresponds to Figure 6 The cross-sectional view of line II-II'. Detailed Implementation

[0026] Exemplary embodiments of this disclosure will now be described in detail with reference to examples thereof shown in the accompanying drawings.

[0027] Figure 1 This schematically shows a cross-sectional view of a display device according to an embodiment of the present disclosure, and Figure 2 This is a schematic cross-sectional view illustrating an example of a display panel of a display device according to an embodiment of the present disclosure.

[0028] exist Figure 1 and Figure 2 In this embodiment of the present disclosure, the display device includes a display panel 100, a polarizing plate 200, an encapsulation film 300, an adhesive layer 400, and a heat sink 500.

[0029] Display panel 100 can be Figure 2 The organic light-emitting diode display panel shown herein indicates that the display device according to the embodiments of this disclosure can be an organic light-emitting diode display device.

[0030] Specifically, in the organic light-emitting diode display panel 100 according to an embodiment of the present disclosure, a patterned semiconductor layer 122 is formed on an insulating substrate 110. The substrate 110 may be a glass substrate or a plastic substrate. The semiconductor layer 122 may be formed of an oxide semiconductor material. In this case, a light-shielding pattern (not shown) and a buffer layer (not shown) may also be formed below the semiconductor layer 122. The light-shielding pattern blocks light incident on the semiconductor layer 122 and prevents the semiconductor layer 122 from deteriorating due to light. The buffer layer may be formed of an inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiNx), and may be a single layer or multiple layers. Alternatively, the semiconductor layer 122 may be formed of polycrystalline silicon, and in this case, impurities may be doped at both ends of the semiconductor layer 122.

[0031] A gate insulating layer 130 of insulating material is formed on the semiconductor layer 122, substantially entirely above the substrate 110. The gate insulating layer 130 may be formed of an inorganic insulating material such as silicon oxide (SiO2). When the semiconductor layer 122 is formed of polysilicon, the gate insulating layer 130 may be formed of silicon oxide (SiO2) or silicon nitride (SiNx).

[0032] A gate electrode 132, made of a conductive material such as metal, is formed on a gate insulating layer 130 corresponding to the center of the semiconductor layer 122. Additionally, a gate line (not shown) and a first capacitor electrode (not shown) may be formed on the gate insulating layer 130. The gate line extends in a first direction, and the first capacitor electrode is connected to the gate electrode 132.

[0033] For example, the gate electrode 132, the gate line, and the first capacitor electrode may be formed of one or more of aluminum (Al), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), copper (Cu), and their alloys, and may have a single-layer structure or a multi-layer structure, but are not limited thereto.

[0034] Meanwhile, in embodiments of this disclosure, although the gate insulating layer 130 is formed substantially entirely over the substrate 110, the gate insulating layer 130 can be patterned to have the same shape as the gate electrode 132.

[0035] On the gate electrode 132, an interlayer insulating layer 140 of insulating material is formed substantially entirely above the substrate 110. The interlayer insulating layer 140 may be formed of inorganic insulating materials such as silicon oxide (SiO2) or silicon nitride (SiNx) or organic insulating materials such as photopropylene or benzocyclobutene.

[0036] The interlayer insulating layer 140 has a first contact hole 140a and a second contact hole 140b exposing the top surfaces at both ends of the semiconductor layer 122. The first contact hole 140a and the second contact hole 140b are disposed on both sides of the gate electrode 132 and spaced apart from the gate electrode 132. Here, the first contact hole 140a and the second contact hole 140b are formed in the gate insulating layer 130. Alternatively, when the gate insulating layer 130 is patterned to have the same shape as the gate electrode 132, the first contact hole 140a and the second contact hole 140b are formed only in the interlayer insulating layer 140.

[0037] Source electrode 142 and drain electrode 144, made of a conductive material such as metal, are formed on the interlayer insulating layer 140. Additionally, data lines (not shown), power lines (not shown), and a second capacitor electrode (not shown) may be formed on the interlayer insulating layer 140.

[0038] For example, the source electrode 142 and drain electrode 144, data line, power line and second capacitor electrode may be formed of one or more of aluminum (Al), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), copper (Cu) and their alloys, and may have a single-layer structure or a multi-layer structure, but are not limited thereto.

[0039] Source electrode 142 and drain electrode 144 are spaced apart from each other, with gate electrode 132 inserted between source electrode 142 and drain electrode 144. Source electrode 142 and drain electrode 144 contact the two ends of semiconductor layer 122 through first contact hole 140a and second contact hole 140b, respectively. Although not shown in the figures, data lines extend in a second direction and intersect with gate lines to define each pixel region. Power lines for supplying high-potential voltages are spaced apart from the data lines. A second capacitor electrode is connected to drain electrode 144 and overlaps with the first capacitor electrode to form a storage capacitor, with interlayer insulating layer 140 serving as a dielectric between the first and second capacitor electrodes. Alternatively, the first capacitor electrode may be connected to drain electrode 144, and the second capacitor electrode may be connected to gate electrode 132.

[0040] Semiconductor layer 122, gate electrode 132, source electrode 142, and drain electrode 144 constitute a thin-film transistor. Here, the thin-film transistor may have a coplanar structure in which the gate electrode 132, source electrode 142, and drain electrode 144 are disposed on one side of semiconductor layer 122, that is, above semiconductor layer 122, but is not limited thereto.

[0041] Alternatively, the thin-film transistor can have an inverted staggered structure, in which the gate electrode is disposed below the semiconductor layer, and the source and drain electrodes are disposed above the semiconductor layer. In this case, the semiconductor layer can be formed of amorphous silicon.

[0042] Here, the thin-film transistor corresponds to the driving thin-film transistor of the organic light-emitting diode display device, and a switching thin-film transistor (not shown) having the same structure as the driving thin-film transistor is also formed corresponding to each pixel region on the substrate 110. The gate electrode 132 of the driving thin-film transistor is connected to the drain electrode (not shown) of the switching thin-film transistor, and the source electrode 142 of the driving thin-film transistor is connected to the power supply line. In addition, the gate electrode (not shown) and the source electrode (not shown) of the switching thin-film transistor are connected to the gate line and the data line, respectively.

[0043] Meanwhile, one or more sensing thin-film transistors with the same structure as driving thin-film transistors can be formed in each pixel region on the substrate 110, but this is not a limitation.

[0044] On the source electrode 142 and drain electrode 144, a passivation layer 152 and a coating layer 154 of insulating material are sequentially formed, substantially entirely above the substrate 110. The passivation layer 152 may be formed of an inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiNx). The coating layer 154 may be formed of an organic insulating material such as propylene or benzocyclobutene. The coating layer 154 may have a flat top surface.

[0045] The passivation layer 152 and the coating layer 154 have a drain contact hole 156 that exposes the drain electrode 144. Here, the drain contact hole 156 is shown as being formed directly above the second contact hole 140b. Alternatively, the drain contact hole 156 may be spaced apart from the second contact hole 140b.

[0046] One of the passivation layer 152 and the coating layer 154 can be omitted. For example, the passivation layer 152 of the inorganic insulating material can be omitted.

[0047] A first electrode 162 of a conductive material with a relatively high work function is formed on the coating layer 154. The first electrode 162 is formed in each pixel region and contacts the drain electrode 144 through the drain contact hole 156. For example, the first electrode 162 may be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0048] An insulating material dam layer 170 is formed on the first electrode 162. The dam layer 170 is disposed between adjacent pixel regions. The dam layer 170 has an opening exposing the central portion of the first electrode 162, and overlaps with and covers the edge of the first electrode 162. Here, the dam layer 170 has a single-layer structure, but is not limited thereto.

[0049] Alternatively, the dike layer may have a double-layer structure. That is, the dike layer may have a first dike and a second dike built on top of the first dike. The width of the first dike may be wider than the width of the second dike. In this case, the first dike may be formed of a hydrophilic inorganic or organic insulating material, and the second dike may be formed of a hydrophobic organic insulating material.

[0050] A light-emitting layer 180 is formed on the first electrode 162 exposed through the opening in the dam layer 170. The light-emitting layer 180 includes a hole auxiliary layer 182, a light-emitting material layer 184, and an electron auxiliary layer 186 sequentially disposed on the first electrode 162.

[0051] Here, the luminescent material layer 184 is shown as being disposed only in the opening of the embankment layer 170. Alternatively, the luminescent material layer 184 may also be formed on the embankment layer 170.

[0052] Each of the hole-assisted layer 182, the luminescent material layer 184, and the electron-assisted layer 186 can be formed from organic materials and can be formed by a solution process. Therefore, the process can be simplified, and a display device with large size and high resolution can be provided. Spin coating, inkjet printing, or screen printing methods can be used as solution processes, but this disclosure is not limited thereto, and other variations are possible.

[0053] Alternatively, each of the hole auxiliary layer 182, the luminescent material layer 184, and the electron auxiliary layer 186 can be formed by a vacuum evaporation process, or by a combination of solution processing and vacuum evaporation processes.

[0054] Meanwhile, an electronic auxiliary layer 186 can be formed from inorganic materials.

[0055] Hole auxiliary layer 182 may include at least one of hole injection layer (HIL) and hole transport layer (HTL), and electron auxiliary layer 186 may include at least one of electron injection layer (EIL) and electron transport layer (ETL).

[0056] On the electronic auxiliary layer 186, a second electrode 192 of a conductive material with a relatively low work function is formed substantially entirely above the substrate 110. The second electrode 192 may be formed of aluminum (Al), magnesium (Mg), silver (Ag), or an alloy thereof.

[0057] The first electrode 162, the light-emitting layer 180, and the second electrode 192 constitute a light-emitting diode (LED) De. The first electrode 162 can be used as an anode, and the second electrode 192 can be used as a cathode, but is not limited thereto.

[0058] Although not shown in the figures, an encapsulation layer can be formed on the second electrode 192 to block moisture or oxygen introduced from the outside, thereby protecting the light-emitting diode De. The encapsulation layer may include at least one inorganic insulating layer. Alternatively, the encapsulation layer may have a structure in which inorganic and organic insulating layers are alternately stacked.

[0059] An organic light-emitting diode display device according to an embodiment of the present disclosure may be a bottom-emitting type where light emitted from the light-emitting material layer 184 is output to the outside through the first electrode 162. In this case, the second electrode 192 serves as a reflector.

[0060] Refer again Figure 1A polarizing plate 200 is disposed on the display panel 100. The polarizing plate 200 is attached to the light-emitting surface of the display panel 100, that is, the surface through which an image is displayed. As described above, when the organic light-emitting diode display device according to the embodiment of the present disclosure is a bottom-emitting type, the surface on the substrate 110 side becomes the light-emitting surface of the display panel 100. Therefore, the polarizing plate 200 is attached to the bottom surface of the substrate 110 of the display panel 100, that is, the surface opposite to the top surface on which the light-emitting diode De is formed.

[0061] The polarizer 200 may include a linear polarizer and a quarter-wave plate, and may be a circular polarizer 200 that converts linearly polarized light into circularly polarized light or vice versa. The polarizer 200 can block external light reflected from the display panel 100 from being output to the outside, thereby improving contrast.

[0062] Next, an encapsulation film 300 is placed under the display panel 100. The encapsulation film 300 blocks external moisture and prevents damage to the light-emitting diodes (LEDs) De. The encapsulation film 300 is attached to the second electrode 192 of the LEDs De in the display panel 100. At this time, the encapsulation film 300 can contact the encapsulation layer on the second electrode 192.

[0063] The encapsulation film 300 includes a first film 310 and a second film 320, and the second film 320 is disposed between the display panel 100 and the first film 310.

[0064] The first film 310 can be a surface-sealed metal foil film. The second film 320 can be a surface-sealed pressure-sensitive adhesive. That is, the first film 310 is attached to the display panel 100 through the second film 320.

[0065] Next, a heat sink 500 is placed under the display panel 100 and attached to the display panel 100 by an adhesive layer 400. More specifically, the heat sink 500 is attached to an encapsulation film 300 under the display panel 100 by an adhesive layer 400.

[0066] The heat sink 500 is used to radiate heat generated in the display panel 100 to the outside. The heat sink 500 can be formed of a metal material with relatively high thermal conductivity and can have a thickness of about 0.3 mm to about 0.5 mm. For example, the heat sink 500 can be formed of aluminum (Al).

[0067] Meanwhile, the adhesive layer 400 can be a pressure-sensitive adhesive (PSA). The adhesive layer 400 can have a thickness of about 0.05 mm to about 0.1 mm, and advantageously, the adhesive layer 400 has a thickness of about 0.05 mm to about 0.07 mm.

[0068] As described above, in embodiments of this disclosure, the heat sink 500 is attached to one side of the display panel 100, allowing heat in the display panel 100 to be rapidly dissipated to the outside. In this case, the heat sink 500 is attached to substantially the entire surface of the display panel 100 via an adhesive layer 400.

[0069] Additionally, air bubbles may be generated during the process of attaching the heat sink 500, and a closed system can be formed around the air bubbles. The closed system prevents heat dissipation generated in the display panel 100 from causing localized heating and leading to a reduction in the lifespan of the display panel 100 and afterimages.

[0070] Therefore, in embodiments of this disclosure, a plurality of embossed patterns are formed on the surface of the adhesive layer 400 on the side of the display panel 100, thereby preventing or minimizing the generation of air bubbles.

[0071] Reference Figure 3 Provide a detailed description.

[0072] Figure 3 yes Figure 1 A magnified view of area A1, and refer to it together. Figure 1 .

[0073] like Figure 3 As shown, the adhesive layer 400 has a plurality of embossed patterns 412 on one surface of the display panel 100 side (i.e., the surface facing the display panel 100 and in contact with the encapsulation film 300). Therefore, the embossed patterns 412 are in contact with the encapsulation film 300. More specifically, the embossed patterns 412 are in contact with the first film 310 of the encapsulation film 300.

[0074] In this case, valleys 414 are formed between adjacent embossed patterns 412, and due to the valleys 414, the adhesive layer 400 is partially separated from the encapsulation film 300. That is, the adhesive layer 400 is partially separated from the first film 310 of the encapsulation film 300.

[0075] When the heat sink 500 is attached to the display panel 100 via the adhesive layer 400, the valley 414 becomes a path for the movement of air bubbles. Therefore, the generation of air bubbles or the size of air bubbles can be suppressed.

[0076] Reference Figure 4 and Figure 5 Detailed description of the adhesive layer 400 with embossed pattern 412.

[0077] Figure 4 This is a schematic cross-sectional view of the adhesive layer according to an embodiment of the present disclosure, and Figure 5 This is a schematic plan view of an adhesive layer according to an embodiment of the present disclosure. Figure 1 and Figure 3 They are combined and referenced together. Here, Figure 5 The surface of the adhesive layer that forms the embossed pattern is shown.

[0078] like Figure 4 and Figure 5 As shown, the adhesive layer 400 according to an embodiment of the present disclosure includes a first adhesive layer 410, a base layer 420 and a second adhesive layer 430, and the base layer 420 is disposed between the first adhesive layer 410 and the second adhesive layer 430.

[0079] For example, the first adhesive layer 410 and the second adhesive layer 430 may be formed of acrylic adhesive, and the base layer 420 may be formed of polyethylene terephthalate (PET). However, this disclosure is not limited thereto.

[0080] Here, the thickness of the base layer 420 can be greater than the thickness of the second adhesive layer 430 and less than the thickness of the first adhesive layer 410. For example, the thickness of the first adhesive layer 410 can be about 300 μm, the thickness of the base layer 420 can be about 25 μm, and the thickness of the second adhesive layer 430 can be about 15 μm, but is not limited thereto.

[0081] The adhesive layer 400 is supplied with a first release liner 440 and a second release liner 450 attached to its two surfaces. When the adhesive layer 400 is attached to the encapsulation film 300 and the heat sink 500, the first release liner 440 and the second release liner 450 are removed. Here, the first release liner 440 is attached to the first adhesive layer 410, and the second release liner 450 is attached to the second adhesive layer 430.

[0082] For example, after removing the second release paper 450 and bonding the adhesive layer 400 to the heat sink 500, the first release paper 440 can be removed, and the adhesive layer attached to the heat sink 500 can be bonded to the display panel 100, more specifically, to the encapsulation film 300.

[0083] At this time, the first adhesive layer 410 bonded to the encapsulation film 300 on the display panel 100 side has an embossed pattern 412.

[0084] The first release liner 440 has a recess 442 and a protrusion 444 on the surface in contact with the first adhesive layer 410, and due to the recess 442 and the protrusion 444 of the first release liner 440, a valley 414 between the embossed pattern 412 and the embossed pattern 412 is formed in the first adhesive layer 410. Here, the embossed pattern 412 of the first adhesive layer 410 corresponds to the recess 442 of the first release liner 440, and the valley 414 of the first adhesive layer 410 corresponds to the protrusion 444 of the first release liner 440.

[0085] On this plane, each of the relief patterns 412 can have a square shape, and the valley 414 can form a lattice shape. However, this disclosure is not limited thereto. Alternatively, each of the relief patterns 412 can have a rectangular shape or other polygonal shape, and can have curved corners. In addition, each side of each of the relief patterns 412 can be a straight line or a curve. In different ways, each of the relief patterns 412 can have a circular shape, an elliptical shape, etc. At the same time, the shape of the valley 414 can be changed according to the shape of the relief pattern 412.

[0086] The width w1 of the embossed pattern 412 is greater than the distance d1 between adjacent embossed patterns 412. In other words, the width w1 of the embossed pattern 412 is greater than the width d1 of the valley 414. Furthermore, the height h1 of the embossed pattern 412 can be less than the thickness of the first adhesive layer 410, and the height h1 of the embossed pattern 412 can be approximately 50% to approximately 70% of the thickness of the first adhesive layer 410. That is, the depth h1 of the valley 414 can be less than the thickness of the first adhesive layer 410, and the depth h1 of the valley 414 can be approximately 50% to approximately 70% of the thickness of the first adhesive layer 410.

[0087] For example, the width w1 of the relief pattern 412 can be about 300 μm to about 400 μm, the distance d1 between adjacent relief patterns 412, i.e. the width d1 of the valley 414, can be about 30 μm to about 45 μm, and the height h1 of the relief pattern 412, i.e. the depth h1 of the valley 414, can be about 15 μm to about 21 μm.

[0088] As described above, in the embodiments of this disclosure, when the heat sink 500 is attached to substantially the entire surface of the display panel 100 via the adhesive layer 400, a plurality of embossed patterns 412 are provided on the surface of the adhesive layer 400 on the display panel 100 side, thereby suppressing bubble formation or minimizing the size of the bubbles. That is, even if bubbles are formed, the size of the bubbles can be made less than about 15 mm.

[0089] Therefore, localized overheating and afterimages can be prevented, which improves brightness and image quality and increases the lifespan of the display device.

[0090] In the preceding embodiments, a bottom-emitting display device has been described as an example; however, the display device of this disclosure can be a top-emitting type where light emitted from the light-emitting material layer 184 is output to the outside through the second electrode 192. In this case, the first electrode 162 may further include a reflective layer formed of an opaque conductive material, and the second electrode 192 may have a relatively thin thickness to allow light to pass through it, or it may be formed of a transparent conductive material.

[0091] In a top-emitting display device, the surface on the side of the second electrode 192 becomes the light-emitting surface. The polarizing plate 200 can be attached to the top surface of the second electrode 192 of the light-emitting diode De, more specifically, to the encapsulation layer, and the heat sink 500 can be attached to the bottom surface of the substrate 110 of the display panel 100.

[0092] Meanwhile, the display device of this disclosure includes a driving section for driving the display panel 100, and the driving section can be disposed on the rear surface of the display panel 100, i.e., the rear surface of the heat sink 500. (Refer to...) Figure 6 and Figure 7 The present disclosure describes a display device including a driving section.

[0093] Figure 6 This is a schematic rear view of a display device according to an embodiment of the present disclosure. Figure 7 It corresponds to Figure 6 The cross-sectional view of line II-II' will be referenced together. Figure 1 Here, Figure 1 Corresponding to along Figure 6 The cross section intercepted by line I-I'.

[0094] like Figure 6 and Figure 7 As shown, the display device according to an embodiment of the present disclosure further includes at least one driver integrated circuit (D-IC) 610 and a source printed circuit board (S-PCB) 620 located on the rear surface of the heat sink 500 to drive the display panel 100.

[0095] The driver integrated circuit 610 is mounted on the surface of an intermediate member 612, such as a flexible printed circuit (FPC), a strip, or a film. This surface may be an inner surface facing the display panel 100, and the driver integrated circuit 610 is electrically connected to the display panel 100 and the source printed circuit board 620 through the intermediate member 612.

[0096] In this embodiment, for example, four driver integrated circuits 610 are connected to the display panel 100, but it is not limited to this. The number of driver integrated circuits 610 can be changed.

[0097] The source printed circuit board 620 is fixed to the heat sink 500 by conductive strip 630, and the electrostatic discharge path is fixed by conductive strip 630.

[0098] Meanwhile, a buffer member 700 is disposed between the driver integrated circuit 610 and the heat sink 500, and between the source printed circuit board 620 and the heat sink 500. For example, the buffer member 700 may have a thickness of about 0.15 mm to about 0.2 mm.

[0099] The first surface of the buffer member 700 can contact the driver integrated circuit 610 and the source printed circuit board 620, and the second surface of the buffer member 700 can contact the heat sink 500.

[0100] Here, the buffer member 700 has a protrusion 710, which is formed by bending to correspond to the driver integrated circuit 610. Therefore, the distance between the driver integrated circuit 610 and the heat sink 500 is greater than the distance between the source printed circuit board 620 and the heat sink 500. In addition, the distance between the driver integrated circuit 610 and the encapsulation film 300 is greater than the distance between the source printed circuit board 620 and the encapsulation film 300, and the distance between the driver integrated circuit 610 and the display panel 100 is greater than the distance between the source printed circuit board 620 and the display panel 100.

[0101] At this time, the protrusion 710 is bent and protrudes toward the drive integrated circuit 610, and is spaced apart from the heat sink 500. Therefore, except for the protrusion 710, the second surface of the buffer member 700 is in contact with the heat sink 500.

[0102] Typically, because the driver integrated circuit 610 is susceptible to stiffness, it may be damaged when in contact with a hard object. That is, in this disclosure, the driver integrated circuit 610 may be damaged when in contact with the encapsulation film 300 or the heat sink 500.

[0103] In addition, the driver integrated circuit 610 generates a relatively large amount of heat. When this heat is transferred to the encapsulation film 300, the encapsulation film 300 may be damaged. Damage to the encapsulation film 300 will also affect the display panel 100, thereby reducing image quality.

[0104] Therefore, in this disclosure, the protrusion 710 is provided in the buffer member 700 to act as a damper, thereby preventing the drive integrated circuit 610 from contacting the encapsulation film 300 or the heat sink 500. Thus, damage to the drive integrated circuit 610 due to contact with the encapsulation film 300 or the heat sink 500 can be prevented.

[0105] Furthermore, the distance between the driver integrated circuit 610 and the encapsulation film 300 is increased by the protrusion 710, preventing heat generated in the driver integrated circuit 610 from being transferred to the encapsulation film 300. Therefore, damage to the encapsulation film 300 due to heat generated in the driver integrated circuit 610 can be prevented.

[0106] Preferably, the size of the protrusion 710 is larger than the size of the driver integrated circuit 610. In this case, the width of the protrusion 710 is greater than the width of the driver integrated circuit 610, and the length of the protrusion 710 is greater than the length of the driver integrated circuit 610.

[0107] The cushioning member 700 can be formed from a flexible, formable material. The cushioning member 700 can be molded. Therefore, the manufacturing process can be simplified, and no additional configuration is required, thereby reducing manufacturing costs.

[0108] For example, the cushioning member 700 may be formed of polyethylene terephthalate (PET). However, this disclosure is not limited thereto. Alternatively, the cushioning member 700 may be formed of metal or polycarbonate (PC).

[0109] As described above, in this disclosure, the buffer member 700 is configured to have a protrusion 710, which prevents the driver integrated circuit 610 from contacting the encapsulation film 300 or the heat sink 500, and increases the distance between the driver integrated circuit 610 and the encapsulation film 300 or the heat sink 500. Therefore, damage to the driver integrated circuit 610 due to contact and damage to the encapsulation film 300 due to heat from the driver integrated circuit 610 can be prevented.

[0110] In this disclosure, a heat sink is attached to substantially the entire surface of the display panel, allowing heat in the display panel to be quickly dissipated to the outside and preventing degradation of image quality.

[0111] Furthermore, the embossed pattern is applied to the surface of the display panel side of the adhesive layer, which prevents or minimizes air bubbles generated during attachment, thus preventing localized overheating and ghosting. This improves brightness and image quality and increases the lifespan of the display device.

[0112] Furthermore, the protruding buffer member prevents the driver integrated circuit from contacting the encapsulation film or heat sink, thus increasing the distance between them. This prevents damage to the driver integrated circuit due to contact and damage to the encapsulation film due to heat from the driver integrated circuit. Consequently, it prevents degradation of the display panel's image quality.

[0113] It will be apparent to those skilled in the art that various modifications and variations can be made to the display device of this disclosure without departing from the technical concept or scope thereof. Therefore, this disclosure is intended to cover modifications and variations thereof, provided they fall within the scope of the appended claims and their equivalents.

Claims

1. A display device, comprising: Display panel; A heat sink has a top surface attached to a first surface of the display panel; An adhesive layer between the display panel and the heat sink; The source printed circuit board is arranged below the bottom surface of the heat sink. A driver integrated circuit is disposed below the bottom surface of the heat sink and electrically connected to the display panel and the source printed circuit board; as well as A buffer component is provided between the driver integrated circuit and the heat sink, and between the source printed circuit board and the heat sink. The buffer member has a protrusion corresponding to the driving integrated circuit. Wherein, the distance between the driver integrated circuit and the heat sink is greater than the distance between the source printed circuit board and the heat sink, and The adhesive layer has multiple embossed patterns on the surface of the display panel.

2. The display device according to claim 1, wherein, The width of one of the plurality of relief patterns is greater than the distance between adjacent relief patterns.

3. The display device according to claim 1, wherein, The adhesive layer includes a first adhesive layer, a second adhesive layer, and a base layer between the first adhesive layer and the second adhesive layer, and the first adhesive layer has the plurality of embossed patterns.

4. The display device according to claim 3, wherein, The thickness of the base layer is greater than the thickness of the second adhesive layer and less than the thickness of the first adhesive layer.

5. The display device according to claim 1, further comprising an encapsulation film between the display panel and the adhesive layer, in, The encapsulation film comes into contact with the plurality of embossed patterns.

6. The display device according to claim 1, wherein, The buffer member is formed of an elastic material.

7. The display device according to claim 6, wherein, The buffer component is formed of polyethylene terephthalate, metal or polycarbonate.

8. The display device according to claim 1, further comprising a polarizing plate on the second surface of the display panel. in, The display panel displays images through the second surface.

9. The display device according to claim 1, wherein the width of the protrusion is greater than the width of the driving integrated circuit, and the length of the protrusion is greater than the length of the driving integrated circuit.

10. A display device, comprising: Display panel; A source printed circuit board disposed on the first surface of the display panel; A driver integrated circuit is disposed on the first surface of the display panel and electrically connected to the display panel and the source printed circuit board; A buffer component is provided between the driver integrated circuit and the display panel, and between the source printed circuit board and the display panel. as well as A heat sink between the display panel and the buffer component; The buffer member has a protrusion corresponding to the driving integrated circuit, and The distance between the driver integrated circuit and the display panel is greater than the distance between the source printed circuit board and the display panel.

11. The display device according to claim 10, wherein, The buffer member is formed of an elastic material.

12. The display device according to claim 11, wherein, The buffer component is formed of polyethylene terephthalate, metal or polycarbonate.

13. The display device according to claim 10, further comprising an encapsulation film between the display panel and the heat sink.

14. The display device according to claim 13, further comprising an adhesive layer disposed between the encapsulation film and the heat sink. in, The adhesive layer has multiple embossed patterns on the surface of the display panel side.

15. The display device according to claim 10, further comprising a polarizing plate on the second surface of the display panel. in, The display panel displays images through the second surface.

16. The display device of claim 10, wherein the width of the protrusion is greater than the width of the driving integrated circuit, and the length of the protrusion is greater than the length of the driving integrated circuit.

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