Transfer device and transfer method

Abstract

This application provides a transfer device and a transfer method. The transfer device includes a transfer substrate and a transfer carrier plate disposed opposite to the transfer substrate. The transfer substrate includes a substrate body and a transfer head body. The substrate body includes multiple through holes that penetrate the substrate body along a first direction. The transfer head body includes multiple adhesive posts, with one adhesive post disposed in each through hole. The transfer head body is slidably connected to the substrate body along the first direction through the adhesive posts. The transfer carrier plate is used to carry multiple chips to be transferred, each corresponding to one of the adhesive posts. In a second direction, the width of the chip to be transferred is greater than the diameter of the through hole. This application utilizes the relative sliding between the adhesive posts and the through holes to transfer the chips to be transferred, and uses the through holes to peel off the chips to be transferred that are adhered to the adhesive posts, allowing them to fall onto the receiving substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a transfer device and a transfer method. Background Technology

[0002] Micro-LED, or Light Emitting Diode (LED) miniaturization technology, refers to the mass transfer of traditional LED arrays, miniaturized and addressed onto a circuit board to form ultra-small pitch LEDs. This further shrinks the length of LEDs from the millimeter level to the micrometer level, achieving ultra-high pixel density and resolution. MicroLEDs possess the characteristic of being self-emissive and requiring no backlight, similar to Organic Light Emitting Diodes (OLEDs). However, compared to OLEDs, MicroLEDs offer easier and more accurate color calibration, longer lifespan, higher brightness, and lower packaging requirements, making them easier to implement in flexible and seamless displays. They represent a highly promising future display technology.

[0003] Currently, the methods for transferring light-emitting diodes (LEDs) typically employ magnetic or electrostatic adsorption. The transfer principle involves applying a voltage to a head made of silicon material, thereby generating a close contact force with the micro LED through electrostatic phenomena. However, these methods can cause damage to the micro LED due to electrostatic phenomena caused by the voltage applied to the head during electrostatic induction, and the process is complex and not conducive to rapid device fabrication. Summary of the Invention

[0004] This application provides a mobile terminal to alleviate the shortcomings of related technologies.

[0005] To achieve the above functions, the technical solutions provided in this application are as follows:

[0006] This application provides a transfer device, including a transfer substrate and a transfer carrier plate disposed opposite to the transfer substrate, wherein the transfer substrate includes:

[0007] A substrate body, the substrate body including a plurality of through holes, the through holes penetrating the substrate body along a first direction, the first direction being a direction perpendicular to the transfer carrier plate;

[0008] The transfer head body includes a plurality of adhesive posts, one of which is disposed in a through hole. The transfer head body is slidably connected to the substrate body along the first direction through the adhesive posts.

[0009] The transfer carrier plate is used to carry multiple chips to be transferred, each corresponding to one of the adhesion posts. In the second direction, the width of the chip to be transferred is greater than the diameter of the through hole, and the second direction is perpendicular to the first direction.

[0010] In the transfer device provided in this application embodiment, the adhesion column includes an adhesion layer and an adhesion column body arranged sequentially along the direction away from the transfer carrier plate, wherein the material of the adhesion layer is an adhesive material.

[0011] In the transfer device provided in the embodiments of this application, along the first direction, the width of the adhesive layer is less than or equal to the diameter of the through hole.

[0012] In the transfer device provided in this application embodiment, along the first direction, the length of the adhesion column body is greater than the depth of the through hole.

[0013] In the transfer apparatus provided in this application embodiment, in the second direction, the cross-sectional area of ​​the adhesion post is smaller than the cross-sectional area of ​​the chip to be transferred.

[0014] This application provides a transfer method, including the following steps:

[0015] A transfer device is provided, the transfer device includes a transfer substrate and a transfer carrier plate disposed opposite to the transfer substrate, the substrate body includes a plurality of through holes, the through holes penetrate the substrate body along a first direction, the first direction being a direction perpendicular to the transfer carrier plate, the transfer head body includes a plurality of adhesive posts, and one of the through holes is provided with an adhesive post;

[0016] Multiple chips to be transferred are formed on the side of the transfer carrier plate near the transfer substrate. Along the second direction, the width of the chips to be transferred is greater than the diameter of the through hole. The second direction is perpendicular to the first direction.

[0017] The transfer substrate and the transfer carrier are aligned, and the adhesion posts correspond one-to-one with the chips to be transferred. The chips to be transferred are picked up onto the transfer substrate by sliding connection between the adhesion posts and the substrate body.

[0018] The transfer substrate and the receiving substrate are aligned, and the chip to be transferred is transferred onto the receiving substrate.

[0019] In the transfer method provided in this application embodiment, the step of aligning the transfer substrate with the transfer carrier, having each adhesive post correspond one-to-one with the chip to be transferred, and slidingly connecting the adhesive posts to the substrate body to pick up the chip to be transferred onto the transfer substrate, further includes the following step:

[0020] Slide the adhesion column toward the transfer carrier plate;

[0021] The adhesion post is passed through the through hole and brought into contact with the chip to be transferred, so that the chip to be transferred adheres to the adhesion post.

[0022] In the transfer method provided in this application embodiment, the step of aligning the transfer substrate with the receiving substrate and transferring the chip to be transferred onto the receiving substrate further includes the following steps:

[0023] Move the adhesion post away from the receiving substrate;

[0024] The chip to be transferred is peeled off from the adhesion post using the through hole, so that the chip to be transferred is transferred to the receiving substrate.

[0025] In the transfer method provided in this application embodiment, the adhesion pillar includes an adhesion layer and an adhesion pillar body arranged sequentially along the direction away from the transfer carrier. The material of the adhesion layer is an adhesive material, and the material of the adhesion pillar body is a rigid material. The bonding force between the adhesion layer and the adhesion pillar body is greater than the bonding force between the adhesion layer and the chip to be transferred.

[0026] The beneficial effects of the embodiments of this application are as follows: This application provides a transfer device and a transfer method. The transfer device includes a transfer substrate and a transfer carrier plate disposed opposite to the transfer substrate. The transfer substrate includes a substrate body and a transfer head body. The substrate body includes a plurality of through holes, which penetrate the substrate body along a first direction. The transfer head body includes a plurality of adhesion pillars, and one of the adhesion pillars is disposed in one of the through holes. The transfer head body is slidably connected to the substrate body along the first direction through the adhesion pillars. The transfer carrier plate is used to carry a plurality of chips to be transferred that correspond one-to-one with the adhesion pillars. In a second direction, the width of the chip to be transferred is greater than the diameter of the through hole. When transferring the chip, the embodiments of this application only need to use the through holes to peel off the chip to be transferred that is adhered to the adhesion pillar and let it fall onto the receiving substrate. The transfer process is simple and the transfer cost is low. Attached Figure Description

[0027] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0028] Figure 1 This is a cross-sectional schematic diagram of the transfer device provided in the embodiments of this application;

[0029] Figure 2A flowchart of the transfer method provided in the embodiments of this application;

[0030] Figures 3A-3E for Figure 2 Process flow diagram of the transfer method. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0032] This application provides a transfer device and a transfer method. These will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0033] Please see Figures 1 to 3E This application provides a transfer device and a transfer method. The transfer device 1 includes a transfer substrate 10 and a transfer carrier plate 20 disposed opposite to the transfer substrate 10.

[0034] The transfer substrate 10 includes a substrate body 11 and a transfer head body 12. The substrate body includes a plurality of through holes 110. The through holes 110 penetrate the substrate body 11 along a first direction Y, where the first direction Y is perpendicular to the transfer carrier plate 20.

[0035] The transfer head body 12 includes a plurality of adhesive posts 120, and an adhesive post 120 is provided in a through hole 110. The transfer head body 12 is slidably connected to the substrate body 11 along the first direction Y through the adhesive post 120.

[0036] The transfer carrier plate 20 is used to carry a plurality of chips 30 to be transferred, which correspond one-to-one with the adhesion post 120. In the second direction X, the width of the chip 30 to be transferred is greater than the diameter of the through hole 110. The second direction X is perpendicular to the first direction Y.

[0037] It should be noted that, in this embodiment, by providing the substrate body with multiple through holes 110, the through holes 110 penetrating the substrate body 11 along the first direction Y, and the transfer head body 12 with multiple adhesion posts 120, one of the through holes 110 being provided with an adhesion post 120, and the transfer head body 12 being slidably connected to the substrate body 11 along the first direction Y through the adhesion posts 120, when transferring the chip 30 to be transferred carried by the transfer carrier 20, the transfer head body 12 can be utilized... The relative sliding of the adhesion post 120 and the through hole 110 allows the chip 30 to be transferred to be transferred. Furthermore, since the width of the chip 30 to be transferred is greater than the opening size of the through hole 110 near the transfer head body 12 along the second direction X, after the chip 30 to be transferred is adhesively adsorbed, it can be peeled off using the through hole 110, allowing the chip 30 to be transferred to the receiving substrate, thereby completing the transfer process of the chip 30 to be transferred.

[0038] It is understandable that, compared to existing technologies that use magnetic or electrostatic adsorption to adsorb the chip 30 to be transferred, the transfer principle involves applying a voltage to the head portion made of silicon material, thereby generating a close contact force with the chip 30 to be transferred through electrostatic phenomena. However, in existing methods, the chip 30 is damaged due to electrostatic phenomena caused by the voltage applied to the transfer head during electrostatic induction, and the process is complex and not conducive to rapid device fabrication. In this embodiment, the chip 30 to be transferred is transferred by utilizing the relative sliding between the adhesion post 120 and the through hole 110. The transfer process is simple and the transfer cost is low. At the same time, the chip 30 to be transferred is peeled off from the adhesion post 120 using the through hole 110, so that the chip 30 to be transferred is transferred to the receiving substrate, thereby avoiding damage to the chip 30 to be transferred.

[0039] The technical solution of this application will now be described in conjunction with specific embodiments.

[0040] In one embodiment, please refer to Figure 1 This is a cross-sectional schematic diagram of the transfer device provided in the embodiments of this application.

[0041] This embodiment provides a transfer device 1, which includes a transfer substrate 10 and a transfer carrier plate 20 disposed opposite to the transfer substrate 10. The transfer substrate 10 includes a substrate body 11 and a transfer head body 12.

[0042] The substrate body includes a plurality of through holes 110, which penetrate the substrate body 11 along a first direction Y, the first direction Y being perpendicular to the transfer carrier plate 20; the transfer head body 12 includes a plurality of adhesive posts 120, one of the through holes 110 being disposed therein, and the transfer head body 12 being slidably connected to the substrate body 11 along the first direction Y through the adhesive posts 120; it is understood that the shape of the through holes 110 is not specifically limited in this embodiment; specifically, the transfer head body 12 is located on the side of the substrate body 11 away from the transfer carrier plate 20.

[0043] The transfer carrier plate 20 is used to carry multiple chips 30 to be transferred, each corresponding to one of the adhesion posts 120. In the second direction X, the width of the chip 30 to be transferred is greater than the diameter of the through hole 110. The second direction X is perpendicular to the first direction Y. Specifically, the first direction is... Figure 1 The Y direction in the middle, the second direction is Figure 1 The X direction in the equation.

[0044] Specifically, the substrate body 11 includes a first surface and a second surface disposed opposite to each other. The through hole 110 penetrates the first surface (not marked in the figure) and the second surface (not marked in the figure). The adhesion post 120 is located in the through hole 110. One of the adhesion posts 120 is slidably disposed with one of the through holes 110. Along the first direction Y, the length of the adhesion post 120 is greater than the depth of the through hole 110, and the adhesion post 120 penetrates the through hole 110. The transfer carrier 20 includes a third surface (not marked in the figure) and a fourth surface (not marked in the figure) disposed opposite to each other. The third surface is disposed opposite to the first surface. The chip 30 to be transferred is located above the third surface. The chip 30 to be transferred includes, but is not limited to, a miniature light-emitting diode (Mini-LED). This embodiment does not impose specific limitations on this.

[0045] Further, the adhesion post 120 includes an adhesion layer 121 and an adhesion post body 122 sequentially disposed along a direction away from the transfer carrier plate 20. The adhesion layer 121 is made of an adhesive material, including but not limited to polydimethylsiloxane (PDMS). One end of the adhesion layer 121 is bonded to the adhesion post body 122, and the other end of the adhesion layer 121 is bonded to the chip 30 to be transferred. Preferably, in this embodiment, along the first direction Y, the width of the adhesion layer 121 is less than or equal to the diameter of the through hole 110, and the length of the adhesion post body 122 is greater than the depth of the through hole 110.

[0046] It is understood that in this embodiment, the relative sliding between the adhesive post 120 and the through hole 110, through the adhesive layer 121 with adhesive material, allows each adhesive post 120 to adhesively adsorb one chip 30 to be transferred, thereby picking up the chip 30 to be transferred onto the transfer substrate 10; and since the transfer head body 12 in the transfer device 1 includes a plurality of adhesive posts 120, and the adhesive layer 121 of the adhesive post 120 is adhesive, each adhesive post 120 can adhesively adsorb one chip 30 to be transferred, thus realizing the massive transfer of the chip 30 to be transferred.

[0047] In this embodiment, in the second direction X, the cross-sectional area of ​​the adhesion post 120 is smaller than the cross-sectional area of ​​the chip 30 to be transferred. Preferably, the cross-sectional area of ​​the adhesion post 120 is 70% to 80% of the cross-sectional area of ​​the chip 30 to be transferred, thereby ensuring that the chip 30 to be transferred is picked up onto the transfer substrate 10 when the chip 30 to be transferred is transferred.

[0048] Furthermore, the material of the adhesive post body 122 includes, but is not limited to, rigid materials, including, but not limited to, metallic materials. This embodiment does not impose specific limitations on this. The bonding force between the adhesive post body 122 and the adhesive layer 121 is greater than the bonding force between the adhesive layer 121 and the chip 30 to be transferred, thereby ensuring that when the chip 30 to be transferred is peeled off using the through hole 110, the chip 30 to be transferred is separated from the adhesive layer 121.

[0049] It should be noted that, in this embodiment, the shape of the adhesive layer 121 includes, but is not limited to, a frustum shape or a cylinder shape, and the orthographic projection of the adhesive layer 121 on the transfer head body 12 overlaps with the orthographic projection of the adhesive column body 122 on the transfer head body 12.

[0050] Please see Figure 2 ,and Figures 3A-3E ;in, Figure 2 A flowchart of the transfer method provided in the embodiments of this application; Figures 3A-3E for Figure 2 Process flow diagram of the transfer method.

[0051] This embodiment provides a transfer method, including the following steps:

[0052] Step S100: A transfer device 1 is provided. The transfer device 1 includes a transfer substrate 10 and a transfer carrier plate 20 disposed opposite to the transfer substrate 10. The transfer substrate 10 includes a substrate body 11 and a transfer head body 12. The substrate body includes a plurality of through holes 110. The through holes 110 penetrate the substrate body 11 along a first direction Y. The first direction Y is a direction perpendicular to the transfer carrier plate 20.

[0053] The transfer head body 12 includes a plurality of adhesion posts 120, and one adhesion post 120 is disposed within one of the through holes 110. The transfer head body 12 is slidably connected to the substrate body 11 along the first direction Y through the adhesion posts 120. Figure 3A As shown.

[0054] Step S200: A plurality of chips 30 to be transferred are formed on the side of the transfer carrier 20 near the transfer substrate 10. Along the second direction X, the width of the chips 30 to be transferred is greater than the diameter of the through-hole 110. The first direction Y is perpendicular to the transfer carrier 20, and the second direction X is perpendicular to the first direction Y. Figure 3B As shown.

[0055] Step S300: Align the transfer substrate 10 with the transfer carrier plate 20, with each adhesion post 120 corresponding to a chip 30 to be transferred. The adhesion posts 120 are slidably connected to the substrate body 11, allowing the chip 30 to be transferred to be picked up onto the transfer substrate 10. Figure 3C As shown.

[0056] Specifically, in this embodiment, step S300 includes the following steps:

[0057] Step S301: Slide the adhesion column 120 toward the direction close to the transfer carrier plate 20, wherein the adhesion column 120 includes an adhesion layer 121 and an adhesion column body 122 arranged sequentially in the direction away from the transfer carrier plate 20, wherein the material of the adhesion layer 121 is an adhesive material, and one end of the adhesion layer 121 is bonded to the adhesion column body 122.

[0058] Step S302: The adhesion post 120 is passed through the through hole 110 and brought into contact with the chip 30 to be transferred. The other end of the adhesion layer 121 is bonded to the chip 30 to be transferred, so that the chip 30 to be transferred is adhered to the adhesion post 120. In the second direction X, the cross-sectional area of ​​the adhesion post 120 is smaller than the cross-sectional area of ​​the chip 30 to be transferred. Preferably, the cross-sectional area of ​​the adhesion post 120 is 70% to 80% of the cross-sectional area of ​​the chip 30 to be transferred.

[0059] Step S400: Align the transfer substrate 10 with the receiving substrate 40, and transfer the chip 30 to be transferred onto the receiving substrate 40.

[0060] Specifically, step S400 includes the following steps:

[0061] Step S401: Move the adhesion post 120 in a direction away from the receiving substrate 40, such as... Figure 3D As shown.

[0062] Step S402: Using the through-hole 110, the chip 30 to be transferred is peeled off from the adhesion post 120, transferring the chip 30 to the receiving substrate 40. The bonding force between the adhesion post body 122 and the adhesion layer 121 is greater than the bonding force between the adhesion layer 121 and the chip 30 to be transferred. This ensures that when transferring the chip 30, the through-hole 110 can be used to peel it off, transferring the chip 30 to the receiving substrate. Figure 3E As shown.

[0063] It should be noted that, in this embodiment, the transfer method further includes step S500: peeling off the transfer substrate 10.

[0064] It is understandable that, compared to existing technologies that use magnetic or electrostatic adsorption to adsorb the chip 30 to be transferred, the transfer principle involves applying a voltage to the head portion made of silicon material, thereby generating a close contact force with the chip 30 to be transferred through electrostatic phenomena. However, in existing methods, the chip 30 is damaged due to electrostatic phenomena caused by the voltage applied to the transfer head during electrostatic induction, and the process is complex and not conducive to rapid device fabrication. In this embodiment, the chip 30 to be transferred is transferred by using the transfer head body 12 to slide along the first direction Y through the adhesion post 120. The transfer process is simple and the transfer cost is low. At the same time, the chip 30 to be transferred is peeled off from the adhesion post 120 using the through hole 110, so that the chip 30 to be transferred is transferred to the receiving substrate, thereby avoiding damage to the chip 30 to be transferred.

[0065] In summary, this application provides a transfer device and a transfer method. The transfer device includes a transfer substrate and a transfer carrier plate disposed opposite to the transfer substrate. The transfer substrate includes a substrate body and a transfer head body. The substrate body includes multiple through holes that penetrate the substrate body along a first direction, which is perpendicular to the transfer carrier plate. The transfer head body includes multiple adhesive posts, with one adhesive post disposed within each of the through holes. The transfer head body is slidably connected to the substrate body along the first direction via the adhesive posts. The transfer carrier plate is used to carry multiple chips to be transferred, each corresponding to one of the adhesive posts. In a second direction, the width of the chip to be transferred is greater than the diameter of the through hole, and the second direction is perpendicular to the first direction. This application utilizes the relative sliding between the adhesive posts and the through holes to transfer the chips to be transferred. Furthermore, the chips to be transferred can be peeled off from the adhesive posts using only the through holes, allowing them to fall onto the receiving substrate. Therefore, the transfer process is simple and the transfer cost is low.

[0066] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0067] The foregoing has provided a detailed description of a transfer device and transfer method provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A transfer device, characterized by, The transfer device comprises a transfer substrate and a transfer carrier plate arranged opposite to the transfer substrate, the transfer substrate comprises: a substrate body comprising a plurality of through holes, the through holes penetrating the substrate body along a first direction, the first direction being perpendicular to the transfer carrier plate; a transfer head body comprising a plurality of adhesive columns, one adhesive column being arranged in one through hole, the transfer head body being slidably connected to the substrate body along the first direction through the adhesive columns, the adhesive column comprising an adhesive layer and an adhesive column body arranged in sequence along a direction away from the transfer carrier plate, the material of the adhesive layer being adhesive material, along the first direction, the width of the adhesive layer being less than or equal to the diameter of the through hole, the length of the adhesive column body being greater than the depth of the through hole; wherein the transfer carrier plate is used to carry a plurality of chips to be transferred corresponding to the adhesive columns one by one, and the adhesive column is used to carry the chip to move; in a second direction, the width of the chip to be transferred is greater than the diameter of the through hole, the second direction being perpendicular to the first direction; when the adhesive column carries the chip to move to the through hole, the through hole is used to peel the chip from the adhesive column, so that the chip to be transferred is picked up on the transfer substrate.

2. The transfer device of claim 1, wherein, In the second direction, the cross-sectional area of the adhesive column is less than the cross-sectional area of the chip to be transferred.

3. The transfer device of claim 2, wherein, The cross-sectional area of the adhesive column is 70% to 80% of the cross-sectional area of the chip to be transferred.

4. A transfer method based on the transfer device of claim 1, characterized in that, The method comprises the following steps: providing a transfer device, the transfer device comprising a transfer substrate and a transfer carrier plate arranged opposite to the transfer substrate, the substrate body comprising a plurality of through holes, the through holes penetrating the substrate body along a first direction, the first direction being perpendicular to the transfer carrier plate, the transfer head body comprising a plurality of adhesive columns, one adhesive column being arranged in one through hole; forming a plurality of chips to be transferred on one side of the transfer carrier plate close to the transfer substrate, along a second direction, the width of the chip to be transferred is greater than the diameter of the through hole, the second direction being perpendicular to the first direction; aligning the transfer substrate with the transfer carrier plate, the adhesive column corresponding to the chip to be transferred one by one, the adhesive column being used to carry the chip to move, the adhesive column carrying the chip to move to the through hole through the sliding connection between the adhesive column and the substrate body, the through hole being used to peel the chip from the adhesive column, so that the chip to be transferred is picked up on the transfer substrate; aligning the transfer substrate with a receiving substrate, and transferring the chip to be transferred to the receiving substrate.

5. The transfer method according to claim 4, characterized in that, In the step of aligning the transfer substrate with the transfer carrier plate, the adhesive column corresponding to the chip to be transferred one by one, and picking up the chip to be transferred on the transfer substrate through the sliding connection between the adhesive column and the substrate body, the method further comprises the following steps: sliding the adhesive column towards the direction close to the transfer carrier plate; The adhesive column is contacted with the chip to be transferred through the through hole, so that the chip to be transferred is adhered to the adhesive column.

6. The transfer method according to claim 5, characterized by, The step of aligning the transfer substrate with a receiving substrate and transferring the chip to be transferred to the receiving substrate further comprises the steps of: Moving the adhesive column away from the receiving substrate; The chip to be transferred adhered to the adhesive column is peeled off by the through hole, so that the chip to be transferred is transferred to the receiving substrate.

7. The transfer method according to claim 4, characterized by, The adhesive column comprises an adhesive layer and an adhesive column body arranged in sequence away from the transfer carrier plate, the material of the adhesive layer is viscous material, the material of the adhesive column body is rigid material, and the binding force between the adhesive layer and the adhesive column body is greater than the binding force between the adhesive layer and the chip to be transferred.

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