Adhesive member, display device, and method for manufacturing display device

Abstract

The present invention relates to an adhesive member, a display device, and a manufacturing method of a display device. The adhesive member includes: a conductive particle layer including a plurality of conductive particles; a non-conductive layer provided on the conductive particle layer; and a shielding layer interposed between the conductive particle layer and the non-conductive layer and including a plurality of shielding members spaced apart from each other.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0000997, filed on January 5, 2021, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This invention relates to an adhesive component, a display device, and a method for manufacturing the display device. Background Technology

[0004] With the increasing demand for multimedia, the demand for display devices is also increasing. In response, various types of display devices are being used, such as liquid crystal display (LCD) devices, organic light-emitting diode (OLED) display devices, quantum dot light-emitting diode (QLED) display devices, etc.

[0005] Light-emitting elements and driving components, such as driving integrated circuits for driving the light-emitting elements, can be mounted on the display panel of the display device. The display panel and driving components can be electrically connected to each other by bonding them together via adhesive components such as anisotropic conductive films. Summary of the Invention

[0006] According to an embodiment of the present invention, an adhesive component includes: a conductive particle layer comprising a plurality of conductive particles; a non-conductive layer disposed on the conductive particle layer; and a shielding layer inserted between the conductive particle layer and the non-conductive layer and comprising a plurality of shielding members spaced apart from each other.

[0007] In an embodiment of the present invention, the non-conductive layer comprises a plurality of non-conductive particles, and each of the plurality of non-conductive particles comprises an elastic particle and an adhesive coating disposed on the elastic particle.

[0008] In an embodiment of the present invention, the thickness of the non-conductive layer is greater than the thickness of the conductive particle layer.

[0009] In an embodiment of the present invention, the plurality of shielding members are inserted between a plurality of pad electrodes of a display panel and between a plurality of bumps of a driving member configured to drive a pixel circuit of the display panel, and the width of each of the plurality of shielding members is less than or equal to the width of the gap between the plurality of bumps.

[0010] In an embodiment of the present invention, at least one of the plurality of conductive particles is configured to overlap with the plurality of shielding members in the thickness direction.

[0011] In embodiments of the present invention, each of the plurality of shielding components includes a heat-resistant material.

[0012] In embodiments of the present invention, each of the plurality of shielding components comprises a non-conductive ferromagnetic material.

[0013] In embodiments of the present invention, each of the plurality of shielding components includes at least one of gadolinium (Gd), terbium (Tb), dysprosium (Dy), or holmium (Ho).

[0014] According to an embodiment of the present invention, a display device includes: a display panel; a driving member configured to drive the display panel; and an adhesive member inserted between the display panel and the driving member, wherein the adhesive member includes: a conductive particle layer including a plurality of conductive particles; a non-conductive layer disposed on the conductive particle layer; and a shielding layer inserted between the conductive particle layer and the non-conductive layer and including a plurality of shielding members spaced apart from each other.

[0015] In an embodiment of the present invention, the non-conductive layer comprises a plurality of non-conductive particles, and each of the plurality of non-conductive particles comprises an elastic particle and a coating that at least partially surrounds the elastic particle.

[0016] In an embodiment of the present invention, the thickness of the non-conductive layer is greater than the thickness of the conductive particle layer.

[0017] In an embodiment of the present invention, the driving member includes a plurality of protrusions, and the width of each of the plurality of shielding members is less than or equal to the width of the gap between the plurality of protrusions.

[0018] In an embodiment of the present invention, the display panel includes a plurality of pad electrodes, each of the plurality of pad electrodes having a width greater than or equal to the width of each of the plurality of bumps, and each of the plurality of shielding members having a width greater than or equal to the width of the gap between the pad electrodes.

[0019] In an embodiment of the present invention, at least one of the plurality of conductive particles is configured to overlap with the plurality of shielding members in the thickness direction.

[0020] In embodiments of the present invention, each of the plurality of shielding components includes a heat-resistant material.

[0021] In embodiments of the present invention, each of the plurality of shielding components comprises a non-conductive ferromagnetic material.

[0022] According to an embodiment of the present invention, a method for manufacturing a display device includes: inserting an adhesive member between a plurality of pad electrodes of a display panel and a plurality of bumps of a driving member, wherein the adhesive member includes: a conductive particle layer; a non-conductive layer disposed on the conductive particle layer; and a shielding layer disposed between the conductive particle layer and the non-conductive layer and including a plurality of shielding members, wherein the conductive particle layer includes a plurality of conductive particles; and performing thermo-press bonding on at least one of the display panel or the driving member, such that a plurality of first conductive particles of the plurality of conductive particles flow between the plurality of shielding members of the shielding layer.

[0023] In an embodiment of the invention, thermocompression bonding of at least one of the display panel or the driving member includes preventing the flow of a plurality of second conductive particles located between the plurality of pad electrodes.

[0024] In an embodiment of the present invention, the manufacturing method further includes aligning the adhesive component with the display panel and the driving component by using a magnetic field after inserting the adhesive component.

[0025] In embodiments of the invention, aligning the adhesive component with the display panel and the driving component using a magnetic field includes moving the adhesive component in at least one direction using a magnetic field provided by a magnet provided in a pressure member configured to hold the driving component. Attached Figure Description

[0026] The above and other features of the present invention will become clearer from a detailed description of embodiments of the invention with reference to the accompanying drawings, in which:

[0027] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention;

[0028] Figure 2 It is along Figure 1 A cross-sectional view of line AA′;

[0029] Figure 3 It is along Figure 1 A cross-sectional view of line BB′;

[0030] Figure 4 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention;

[0031] Figure 5 This is a plan view showing an adhesive component according to an embodiment of the present invention;

[0032] Figure 6 This is a cross-sectional view showing conductive particles according to an embodiment of the present invention;

[0033] Figure 7 This is a cross-sectional view showing non-conductive particles according to an embodiment of the present invention;

[0034] Figure 8 This is a plan view showing an adhesive component according to an embodiment of the present invention;

[0035] Figure 9 This is a perspective view showing non-conductive particles according to an embodiment of the present invention;

[0036] Figure 10 This is a perspective view showing non-conductive particles according to an embodiment of the present invention;

[0037] Figure 11 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention;

[0038] Figure 12 It is shown Figure 10 A plan view of the adhesive components;

[0039] Figure 13 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention;

[0040] Figure 14 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention;

[0041] Figure 15 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present invention;

[0042] Figure 16 and Figure 17 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention;

[0043] Figure 18 and Figure 19 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention;

[0044] Figure 20 , Figure 21 and Figure 22 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention;

[0045] Figure 23 , Figure 24 and Figure 25 A diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention; and

[0046] Figure 26 , Figure 27 , Figure 28 and Figure 29This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention. Detailed Implementation

[0047] The invention will now be described more fully below with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Throughout the specification, the same reference numerals may denote the same components. In the drawings, the thickness of layers and regions may be exaggerated for clarity. In other words, since the dimensions and thicknesses of components in the drawings may be exaggerated for clarity, the following embodiments of the invention are not limited thereto.

[0048] It will also be understood that when a layer is referred to as being "on" another layer or substrate, that layer or substrate may be directly on said other layer or substrate, or an intermediary layer may be present. In contrast, when an element is referred to as being "directly on" another element, no intermediary element is present.

[0049] In the following description, embodiments of the invention will be described with reference to the accompanying drawings.

[0050] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present invention. Figure 2 It is along Figure 1 The cross-sectional view taken by line AA′. Figure 3 It is along Figure 1 The cross-sectional view taken from line BB′.

[0051] Reference Figure 1 The display device 1 is a device for displaying moving images and / or still images. The display device 1 can be used as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-book readers, portable multimedia players (PMPs), navigation systems, and ultra-mobile personal computers (UMPCs), as well as various other products such as televisions, laptops, monitors, billboards, and Internet of Things devices.

[0052] The display device 1 may include a display panel DP, which includes a screen for displaying images.

[0053] For example, an organic light-emitting diode (OLED) display panel can be used as a display panel DP. In the following embodiments, an example of using an organic light-emitting diode (OLED) display panel as a display panel DP will be described, but the invention is not limited thereto, and other types of display panels, such as liquid crystal display (LCD) panels, field emission display (FED) panels, electrophoresis devices, or quantum dot light-emitting diode (QLED) display panels, can be used as display panel DP.

[0054] When viewed in a plan view, the display panel DP can have a substantially rectangular shape. For example, the corners of the display panel DP can be rounded or can have right angles. In this case, the two corners of the display panel DP (e.g., the substrate SUB) adjacent to a portion of the display panel DP connected to the printed circuit board PCB described below can be cut into an "L" shape, but the invention is not limited thereto. For example, the display panel DP may include protrusions adjacent to the two corners of the display panel DP and adjacent to the printed circuit board PCB.

[0055] The display panel DP may include a display area DA for displaying video or images and a non-display area NDA disposed around the periphery of the display area DA. For example, the non-display area NDA may at least partially surround the display area DA. When viewed in a plan view, the display area DA may have a substantially rectangular shape, and the non-display area NDA may have a rectangular shape with an opening in which the display area DA may be provided, such that the non-display area NDA may at least partially surround the display area DA, but the invention is not limited thereto.

[0056] The display device 1 may also include a printed circuit board (PCB). The PCB may be bonded to a sub-region PA of the substrate SUB, as will be described below. In this case, as... Figure 1 As shown, when the display panel DP is unfolded, the driving component DM can be positioned between the printed circuit board PCB and the curved area BA when viewed in a plan view. The printed circuit board PCB may include a rigid circuit substrate, a flexible printed circuit board, and a flexible printed circuit film.

[0057] The display panel (DP) may include a base plate (SUB).

[0058] The substrate SUB can be a flexible substrate comprising a flexible material such as polyimide (PI). However, the invention is not limited thereto, and the substrate SUB can also be a rigid substrate comprising a rigid material such as glass or quartz.

[0059] The base SUB may include a main region MA, a curved region BA connected to the main region MA, and a sub-region PA connected to the curved region BA.

[0060] The main region MA can be substantially flat. The display region DA can be located within the main region MA. The curved region BA and the sub-region PA can be located within the non-display region NDA. The curved region BA can extend from the main region MA, and the sub-region PA can extend from the curved region BA. The curved region BA can connect the main region MA to the sub-region PA. The curved region BA and the sub-region PA can be located on one side of the main region MA, such as the lower end of the main region MA, but the invention is not limited thereto. The driving component DM and the multiple pad electrodes PE, which will be described below (see reference). Figure 3 The sub-region PA can be disposed in the main region MA and / or the bent region BA. However, the invention is not limited thereto, and the driving member DM and the pad electrode PE can be disposed in the main region MA and / or the bent region BA. The bent region BA can be bent in a direction opposite to the display direction (in the case of top-emitting type, the bent region BA can be bent in the rear direction). In this case, the sub-region PA can overlap with the main region MA in the thickness direction. However, the bending direction of the bent region BA is not limited to the above examples, and the bent region BA can be bent, for example, in the display direction (e.g., the front direction).

[0061] Reference Figure 1 and Figure 2 The display panel DP may also include a plurality of conductive layers 120, 130, 140 and 150 disposed on the substrate SUB, and a plurality of insulating layers 111, 112, 113, VIA1 and VIA2 for insulating the plurality of conductive layers 120, 130, 140 and 150. The display panel DP may also include a light-emitting layer EL.

[0062] A buffer layer (BFF) can be disposed on the substrate (SUB). The buffer layer (BFF) prevents moisture and oxygen from penetrating from the outside through the substrate (SUB). The buffer layer (BFF) may include silicon nitride (SiN). x ) layer, silicon oxide (SiO2) layer and silicon oxynitride (SiO2) layer x N y The invention may be made of any of the following layers, but is not limited thereto.

[0063] Semiconductor layer 105 may be disposed on buffer layer BFF. Semiconductor layer 105 forms the channel of thin-film transistor. Semiconductor layer 105 may be disposed in each pixel of display area DA. In some cases, semiconductor layer 105 may also be disposed in non-display area NDA. Semiconductor layer 105 may include polysilicon.

[0064] The first insulating layer 111 may be disposed on the semiconductor layer 105. For example, the first insulating layer 111 may be disposed on the entire substrate SUB. The first insulating layer 111 may be a gate insulating layer with gate insulation function.

[0065] The first insulating layer 111 may include silicon compounds or metal oxides, etc. For example, the first insulating layer 111 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiO) x N y These include aluminum oxide (Al₂O₃), tantalum oxide (Ta₂O₅), hafnium oxide (HfO₂), zirconium oxide (ZrO), and titanium oxide (TiO₂). These can be used individually or in combination.

[0066] The first conductive layer 120 may be disposed on the first insulating layer 111. The first conductive layer 120 may include the gate electrode GE of the thin-film transistor TFT and the first electrode CE1 of the storage capacitor.

[0067] The first conductive layer 120 may include at least one selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductive layer 120 may be a single layer or a stack made of the example materials.

[0068] The second insulating layer 112 may be disposed on the first conductive layer 120. The second insulating layer 112 may insulate the first conductive layer 120 from the second conductive layer 130. The second insulating layer 112 may be made of a material selected from the example materials of the first insulating layer 111.

[0069] A second conductive layer 130 may be disposed on the second insulating layer 112. The second conductive layer 130 may include a second electrode CE2 of the storage capacitor. The second conductive layer 130 may be made of a material selected from the example materials of the first conductive layer 120. Since the second insulating layer 112 is disposed between the first electrode CE1 and the second electrode CE2, the first electrode CE1 and the second electrode CE2 of the storage capacitor may form a capacitor.

[0070] A third insulating layer 113 may be disposed on the second conductive layer 130. The third insulating layer 113 may include at least one of the example materials used for the first insulating layer 111. In embodiments of the invention, the third insulating layer 113 may include an organic insulating material. The organic insulating material may be selected from the example materials used for the first via layer VIA1, which will be described below.

[0071] The third conductive layer 140 may be disposed on the third insulating layer 113. The third conductive layer 140 may include a source electrode SE, a drain electrode DE, a high-potential voltage electrode ELVDDE, and a signal line (not shown).

[0072] The third conductive layer 140 may include at least one of, for example, molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The third conductive layer 140 may be a single layer made of the example materials. The invention is not limited thereto, and the third conductive layer 140 may be a stack. For example, the third conductive layer 140 may be formed as a stacked structure of titanium (Ti) / aluminum (Al) / titanium (Ti), molybdenum (Mo) / aluminum (Al) / molybdenum (Mo), molybdenum (Mo) / aluminum germanium (AlGe) / molybdenum (Mo), or titanium (Ti) / copper (Cu). In embodiments of the invention, the third conductive layer 140 may be formed of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0073] The first via layer VIA1 may be disposed on the third conductive layer 140. The first via layer VIA1 may include an organic insulating material. The organic insulating material may include at least one of, for example, acrylic resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene oxide resins, polyphenylene sulfide resins, and benzocyclobutene (BCB).

[0074] A fourth conductive layer 150 may be disposed on the first via layer VIA1. The fourth conductive layer 150 may include a data line DL, a connection electrode CNE, and a high-potential voltage line ELVDDL. The data line DL may be electrically connected to the source electrode SE of the thin-film transistor TFT through a contact hole passing through the first via layer VIA1. The connection electrode CNE may be electrically connected to the drain electrode DE of the thin-film transistor TFT through a contact hole passing through the first via layer VIA1. The high-potential voltage line ELVDDL may be electrically connected to the high-potential voltage electrode ELVDDE through a contact hole passing through the first via layer VIA1. The fourth conductive layer 150 may include a material selected from the example materials used for the third conductive layer 140.

[0075] The second via layer VIA2 may be disposed on the fourth conductive layer 150. The second via layer VIA2 may include at least one of the example materials used for the first via layer VIA1.

[0076] The anode electrode ANO can be disposed on the second via layer VIA2. The anode electrode ANO can be electrically connected to the connection electrode CNE through a contact hole passing through the second via layer VIA2.

[0077] A dam bank may be disposed on the anode electrode ANO. The dam bank may include contact holes that expose at least a portion of the anode electrode ANO. The dam bank may be made of organic or inorganic insulating materials. For example, the dam bank may be made of at least one of photoresist, polyimide resin, acrylic resin, silicon compound, and polyacrylic resin.

[0078] The light-emitting layer EL can be disposed on the anode electrode ANO and within the opening OP of the dam layer BANK. For example, the light-emitting layer EL can be disposed on the upper surface of the anode electrode ANO. The cathode electrode CAT is disposed on the light-emitting layer EL and the dam layer BANK. The cathode electrode CAT can be a common electrode disposed above multiple pixels.

[0079] The thin-film encapsulation layer 170 can be disposed on the cathode electrode CAT. The thin-film encapsulation layer 170 can cover the organic light-emitting element OLED. The thin-film encapsulation layer 170 can be a stacked layer of inorganic and organic films stacked alternately. For example, the thin-film encapsulation layer 170 may include a first inorganic encapsulation film 171, an organic encapsulation film 172, and a second inorganic encapsulation film 173 stacked sequentially, but the present invention is not limited thereto.

[0080] The display panel DP may include a lower panel CPNL disposed on the substrate SUB. For example, the lower panel CPNL may be disposed on the lower surface of the substrate SUB. The lower panel CPNL may include at least one functional layer, including, for example, a digitizer, a heat sink, a barrier, or a buffer.

[0081] Reference Figures 1 to 3 The display panel (DP) can also include multiple pad electrodes (PE).

[0082] Multiple pad electrodes PE can be disposed in a sub-region PA of the substrate SUB. For example, the multiple pad electrodes PE can be electrically connected to at least one of a plurality of conductive layers via lines connected to pixel circuitry of the display area DA. The multiple pad electrodes PE can comprise materials that are the same as or similar to the plurality of conductive layers. For example, the multiple pad electrodes PE can comprise at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). As described below, the multiple pad electrodes PE can be electrically connected to a plurality of bumps BP of the drive component DM via an adhesive member AD. At least one of a plurality of insulating layers can be disposed on the upper surface of the substrate SUB on which the drive component DM is mounted, and the multiple pad electrodes PE can be exposed via holes formed in at least one of the plurality of insulating layers.

[0083] The display device 1 may also include a driving component DM for driving the pixel circuitry of the display panel DP.

[0084] The driving component DM can be mounted in a sub-region PA of the display panel DP, but the present invention is not limited thereto. In embodiments of the present invention, the driving component DM is mounted on the display panel DP by a plastic flip-chip (COP) method, but the present invention is not limited thereto. The driving component DM can also be mounted by a thin-film flip-chip (COF) method or a glass flip-chip (COG) method.

[0085] The driving component DM may include a driving chip IC and multiple bumps BP.

[0086] The driver chip IC may include a semiconductor chip, which includes circuitry for driving pixel circuitry of the display panel DP, such as a display driver integrated circuit. Multiple bumps (BPs) may protrude from the driver chip IC and be electrically connected to the circuitry of the driver chip IC.

[0087] Multiple bumps (BPs) can be configured to face multiple pad electrodes (PEs) located in a sub-region (PA) of the substrate (SUB). For example, as... Figure 3 As shown, multiple pad electrodes PE can be disposed in sub-regions PA of the substrate SUB. Multiple bumps BP can include a conductive material, such as at least one of gold (Au), nickel (Ni), and tin (Sn).

[0088] The display device 1 may also include an adhesive component AD for bonding the display panel DP to the drive component DM.

[0089] An adhesive component AD can be inserted between a substrate SUB and a drive component DM to bond the substrate SUB to the drive component DM. For example, the adhesive component AD can be inserted between the upper surface of a substrate SUB on which multiple pad electrodes PE are disposed and the lower surface of a drive component DM on which multiple bumps BP are disposed to electrically connect the multiple pad electrodes PE to the multiple bumps BP of the drive component DM.

[0090] In the following text, reference will be made to Figures 4 to 7 Describe the adhesive component AD in more detail.

[0091] Figure 4 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention. Figure 5 This is a plan view showing an adhesive component according to an embodiment of the present invention. Figure 6 This is a cross-sectional view showing conductive particles according to an embodiment of the present invention. Figure 7 This is a cross-sectional view showing a non-conductive particle according to an embodiment of the present invention.

[0092] The adhesive component AD can be a thin-film component, such as an anisotropic conductive film, inserted between the pad electrode PE of the display panel DP and the bump BP of the drive component DM to bond the pad electrode PE and electrically connect it to the bump BP, but the present invention is not limited thereto.

[0093] Reference Figure 4 The adhesive component AD may include a conductive particle layer CL and a non-conductive layer NCL disposed on the conductive particle layer CL.

[0094] The conductive particle layer CL may include a first matrix resin BS1 and multiple conductive particles CP.

[0095] The first matrix resin BS1 may include an insulating adhesive material. The insulating adhesive material may include thermoplastic materials such as styrene-butadiene and polyvinyl butadiene, and / or thermosetting materials such as epoxy resin, polyurethane, and acrylic resin. The first matrix resin BS1 may be used in the drive component DM (reference) Figure 3 ) Connected to the display panel DP (reference) Figure 3 The hot-press bonding process melts and solidifies the DP (display panel DP) to the drive component DM (drive component DM).

[0096] Multiple conductive particles CP can be dispersed in a first matrix resin BS1. Each of the multiple conductive particles CP may include a conductive material. In a thermoforming process, the multiple conductive particles CP can flow into the first matrix resin BS1 and can be bonded to the pad electrodes PE of the display panel DP (reference). Figure 3 ) and the bump BP of the drive component DM (reference) Figure 3 The conductive particles (CP) are trapped between the pad electrodes (PE) and the bumps (BP), thereby electrically connecting the PE pads to the bumps (BP). Multiple conductive particles (CP) can be finely sized spherical particles. For example, the diameter of the conductive particles (CP) can range from approximately 1 μm to approximately 15 μm. As another example, the diameter of the conductive particles (CP) can range from approximately 2 μm to approximately 4 μm. However, the size of the conductive particles (CP) is not limited to the examples described above.

[0097] In embodiments of the present invention, the plurality of conductive particles CP may be polygonal shaped particles.

[0098] The non-conductive layer NCL may include a second matrix resin BS2 and multiple non-conductive particles NCP.

[0099] The second matrix resin BS2 may be made of a material substantially the same as or similar to the first matrix resin BS1. The second matrix resin BS2 may be made of the same insulating adhesive material as the first matrix resin BS1, or it may be made of an insulating adhesive material different from the insulating adhesive material of the first matrix resin BS1.

[0100] Multiple non-conductive particles (NCPs) can be dispersed in a second matrix resin, BS2. Each of the multiple non-conductive NCPs can be made of an insulating material. During the thermo-pressing bonding process, the multiple non-conductive NCPs can reduce the flowability of the multiple conductive particles (CPs).

[0101] Reference Figure 5 Multiple conductive particles (CP) and multiple non-conductive particles (NCP) can be dispersed separately in the first matrix resin BS1 (reference). Figure 4 In the first matrix resin BS1 and the second matrix resin BS2. For example, multiple conductive particles CP and multiple non-conductive particles NCP can be irregularly dispersed in the first matrix resin BS1 and the second matrix resin BS2. When viewed in a plan view, gaps can be provided between the multiple conductive particles CP and between the multiple non-conductive particles NCP. For example, the gaps provided between the multiple conductive particles CP can vary, and the gaps provided between the multiple non-conductive particles NCP can vary. For example, the gaps provided between the multiple conductive particles CP can be different from or the same as the gaps provided between the multiple non-conductive particles NCP. Figure 5 As shown, multiple non-conductive particles (NCPs) can be distributed at a density higher than that of multiple conductive particles (CPs), but the present invention is not limited thereto. (See reference...) Figure 6 Each of the multiple conductive particles CP may include a first elastic particle PP1, a conductive coating CCL, and multiple insulating particles ICP.

[0102] For example, the first elastic particle PP1 can be made of, for example, spherical particles (such as polymer particles) comprising an elastic material. The first elastic particle PP1 can have fine dimensions. For example, the diameter of the first elastic particle PP1 can range from about 1 μm to about 15 μm. As another example, the diameter of the first elastic particle PP1 can range from about 2 μm to about 4 μm. However, the size of the first elastic particle PP1 is not limited to the examples described above.

[0103] The conductive coating CCL can be configured to at least partially surround the outer surface of the first elastic particle PP1 to coat the first elastic particle PP1. The conductive coating CCL can be made of a conductive material. For example, the conductive material can include metals such as nickel (Ni) and silver (Ag).

[0104] Multiple insulating particles (ICPs) can be deposited on the conductive coating (CCL) to form an uneven surface on the CCL. Multiple insulating particles (ICPs) allow conductive particles (CPs) to be easily deposited on the pad electrode (PE) (reference). Figure 3 ) and BP (reference) Figure 3 They are trapped between each other and can prevent short circuits that can occur when different conductive particles (CP) are in close contact with each other.

[0105] Reference Figure 7 Each of the multiple non-conductive particles NCP may include a second elastic particle PP2 and an adhesive coating ADL.

[0106] For example, the second elastic particle PP2 can be a spherical particle comprising an elastic material, such as polymer particles. The second elastic particle PP2 can be smaller than the first elastic particle PP1. For example, the diameter of the second elastic particle PP2 can range from about 2 μm to about 4 μm, but the invention is not limited thereto.

[0107] The adhesive coating ADL can be configured to at least partially surround the outer surface of the second elastic particle PP2 to coat the second elastic particle PP2. The adhesive coating ADL may include an insulating adhesive material. For example, the insulating adhesive material may include thermoplastic materials such as styrene-butadiene and polyvinyl butadiene, and / or thermosetting materials such as epoxy resin, polyurethane, and acrylic resin. In this case, the adhesive coating ADL may be made of a material different from the material of the second matrix resin BS2 in which the non-conductive particles NCP are dispersed, but the invention is not limited thereto. For example, the adhesive coating ADL will melt during the hot-press bonding process described below to increase the adhesive strength between the display panel DP and the drive member DM. In embodiments of the invention, the adhesive coating ADL may be formed to have a relatively smooth surface on the second elastic particle PP2, but the invention is not limited thereto. For example, the adhesive coating ADL may be without bumps and may have a relatively flat surface.

[0108] Reference Figure 6 and Figure 7 The conductive particles (CP) can have a larger size than the non-conductive particles (NCP). Therefore, during the thermoforming process, the non-conductive NCP particles can penetrate between the conductive particles (CP) to reduce the flowability of the conductive particles (CP). However, the invention is not limited thereto, and the size of the conductive particles (CP) can be smaller than or equal to the size of the non-conductive NCP particles.

[0109] The first diameter D1 of the conductive particle CP can be larger than the second diameter D2 of the non-conductive particle NCP. For example, the first diameter D1 and the second diameter D2 can be the diameters of the first elastic particle PP1 and the second elastic particle PP2, respectively. As another example, the first diameter D1 can be the diameter of the conductive particle CP, including the thickness of the conductive coating CCL and the insulating particle ICP. As an additional example, the second diameter D2 can be the diameter of the non-conductive particle NCP, including the thickness of the adhesive coating ADL. Diameter can refer to the maximum diameter and / or the average diameter. For example, the range of the first diameter D1 can be from about 2 μm to about 4 μm, and the range of the second diameter D2 can be from about 2 μm to about 4 μm, but the invention is not limited thereto.

[0110] Figure 8 This is a plan view showing an adhesive component according to an embodiment of the present invention.

[0111] Reference Figure 8 ,and Figure 5 In different embodiments, multiple conductive particles (CP) and multiple non-conductive particles (NCP) can be configured to have a predetermined arrangement.

[0112] For example, such as Figure 8 As shown, when viewed in a plan view, multiple conductive particles (CP) and multiple non-conductive particles (NCP) can be arranged in a matrix to form multiple rows and multiple columns. In this case, the non-conductive particles (NCP) can have a smaller size than the conductive particles (CP). For example, the multiple non-conductive particles (NCP) can be arranged to form a greater number of rows and columns than the number of conductive particles (CP). Therefore, when viewed in a plan view, the multiple non-conductive particles (NCP) can be arranged with a narrower interval than the multiple conductive particles (CP). However, the invention is not limited to this, and for example, the multiple non-conductive particles (NCP) can have the same number of rows and columns as the number of conductive particles (CP). As an additional example, when viewed in a plan view, the interval between the multiple non-conductive particles (NCP) can be greater than or equal to the interval between the multiple conductive particles (CP).

[0113] like Figure 8 As shown, at least some of the multiple non-conductive particles NCP can be arranged to not completely overlap with the multiple conductive particles CP in the thickness direction or can be arranged to partially overlap with the multiple conductive particles CP, but the present invention is not limited thereto.

[0114] In addition to the arrangement of multiple conductive particles (CP) and multiple non-conductive particles (NCP), Figure 8 Implementation examples and Figures 4 to 7 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 8 The embodiments are described repeatedly.

[0115] Figure 9 This is a perspective view showing non-conductive particles according to an embodiment of the present invention. Figure 10 This is a perspective view showing non-conductive particles according to an embodiment of the present invention;

[0116] Reference Figure 9 and Figure 10 ,and Figure 7 Different embodiments may have non-conductive particles (NCPs) that can have shapes other than spherical shapes.

[0117] For example, such as Figure 9As shown, the non-conductive particles (NCP) may include a plurality of protruding members (ACMs) extending from the adhesive coating (ADL). For example, each of the plurality of protruding members (ACMs) may be part of the adhesive coating (ADL). For example, the plurality of protruding members (ACMs) may be integrally attached to the adhesive coating (ADL), or the plurality of protruding members (ACMs) may be separate components made of a material different from that of the adhesive coating (ADL). Each of the plurality of protruding members (ACMs) may include the aforementioned insulating adhesive material. Figure 9 In this process, the protruding member ACM can have a conical or triangular shape, but the invention is not limited to these. In the hot-press bonding process, the flowability of non-conductive NCP particles can be reduced due to the multiple protruding members ACM.

[0118] As another example, such as Figure 10 As shown, the non-conductive NCP particles can have a cylindrical shape. In this case, during the thermoforming process, the non-conductive NCP particles can have a diameter smaller than [missing information]. Figure 7 The fluidity of spherical, non-conductive NCP particles is improved, and they can have a fluidity greater than that of other particles. Figure 9 The flowability may be, for example, that of non-conductive NCP particles with a needle-like shape. For instance, the flowability of the non-conductive NCP particles can be appropriately adjusted during the hot-press bonding process depending on their shape.

[0119] In addition to the shape of non-conductive NCP particles Figure 9 and Figure 10 Implementation examples and Figures 4 to 7 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 9 and Figure 10 The embodiments are described repeatedly.

[0120] Figure 11 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention. Figure 12 It is shown Figure 11 A plan view of the adhesive components.

[0121] Reference Figure 11 and Figure 12 ,and Figure 4 The implementation methods differ, in Figure 11 and Figure 12 In the adhesive component ADa, a non-conductive layer NCL comprising multiple dam PDAMs can be disposed on a conductive particle layer CL.

[0122] When viewed in a plan view, each of the multiple dam PDAMs can have, for example, a rectangular prism shape or a cylindrical shape. The multiple dam PDAMs can be arranged to be spaced apart at regular intervals. The openings OP formed between the dam PDAMs can be filled with a second matrix resin BS2. The second matrix resin BS2 can be made of a resin of a different type than the first matrix resin BS1, or it can be made of the same type of resin as the first matrix resin BS1.

[0123] Refer again Figure 3 The spacing between the dam PDAMs can be substantially the same as the spacing between the pad electrodes PE and / or the spacing between the bumps BP. As described below, in the thermocompression bonding process, the pad electrodes PE and bumps BP can be electrically connected to each other through conductive particles CP in the opening OP between the dam PDAMs.

[0124] like Figure 11 and Figure 12 As shown, multiple dam PDAMs and multiple conductive particles CP can be configured to not overlap each other in the thickness direction. In this case, the multiple conductive particles CP can be arranged at regular intervals. However, the invention is not limited thereto. Multiple dam PDAMs and multiple conductive particles CP can also be configured to overlap each other in the thickness direction. In this case, the multiple conductive particles CP can be arranged as follows: Figure 5 The irregular dispersion shown is in the first matrix resin BS1, or as... Figure 8 The image shows that the resin can be regularly dispersed in the first matrix resin BS1.

[0125] like Figure 11 As shown, each of the plurality of dam PDAMs can have substantially the same thickness as the non-conductive layer NCL, and a second matrix resin BS2 can be disposed between the plurality of dam PDAMs. For example, when viewed in a cross-sectional view, the plurality of dam PDAMs can isolate the second matrix resin BS2 filled between the plurality of dam PDAMs. However, the invention is not limited thereto, and the thickness of each of the plurality of dam PDAMs can be less than the thickness of the non-conductive layer NCL. In this case, for example, the lower ends of the plurality of dam PDAMs can be in direct contact with the conductive particle layer CL, and the second matrix resin BS2 filled between the plurality of dam PDAMs can be disposed above the upper ends of the plurality of dam PDAMs to be integrally connected to each other.

[0126] Each of the multiple dam PDAMs may be made of an insulating material. The insulating material may include an organic insulating material with high heat resistance, such as at least one of polysulfone, polyethersulfone, polyphenylene sulfide, polyimide, polyamide-imide, siloxane-modified polyimide, siloxane-modified polyamide-imide, polyetherimide, and polyetheretherketone. Each of the multiple dam PDAMs may also include a non-insulating ferromagnetic material, as described below.

[0127] In addition to multiple dam PDAMs Figure 11 and Figure 12 Implementation examples and Figures 4 to 7 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 11 and Figure 12 The embodiments are described repeatedly.

[0128] Figure 13 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention.

[0129] Reference Figure 13 The adhesive component ADb may also include inserts in the conductive particle layer CL and the non-conductive layer NCL (see reference). Figure 4 The shielding layer SCL between the adhesive components ADb. In this case, the conductive particle layer CL of the adhesive component ADb may include multiple conductive particles CP, and the non-conductive layer NCL may be made solely of the second matrix resin BS2.

[0130] The shielding layer SCL may include multiple shielding components SCM.

[0131] Multiple shielding components (SCMs) can be configured to be spaced apart from each other at predetermined intervals (e.g., regular intervals). In embodiments of the invention, the gap between the shielding components (SCMs) can be less than or equal to the pad electrode (PE) (reference). Figure 3 The width of the bump BP can be greater than or equal to the width of the bump BP (see reference). Figure 3 The width of the invention is not limited thereto.

[0132] Refer again Figure 3 When viewed in a cross-sectional view, the shielding member SCM may have a width corresponding to the gap between the pad electrodes PE and / or the gap between the bumps BP. The gap between the pad electrodes PE may be equal to or different from the gap between the bumps BP. For example, the gap between the pad electrodes PE may be smaller than the gap between the bumps BP, but the invention is not limited thereto.

[0133] The width of the shielding member SCM can be less than or equal to the gap between the bumps BP. In this case, the width of the shielding member SCM can be greater than or equal to the gap between the pad electrodes PE. However, the invention is not limited thereto, and for example, the width of the shielding member SCM can be less than the gap between the pad electrodes PE.

[0134] As another example, the gap between bumps (BP) and the width of shielding member (SCM) can each be approximately 16 μm, and the gap between pad electrodes (PE) can be approximately 16 μm or less, but the invention is not limited thereto.

[0135] When viewed in cross-sectional view, each shielding member SCM has a width substantially equal to the gap between the bumps BP, preventing conductive particles CP from penetrating between the bumps BP during the thermocompression bonding process. For example, the pad electrode PE can have a thickness less than or equal to the thickness of the bumps BP. The thickness can be the surface height. For example, the thickness of the pad electrode PE can range from approximately 1 μm to approximately 2 μm, and the thickness of the bumps BP can be approximately 8 μm. Therefore, as described above, when the flow of conductive particles CP is restricted due to the relatively narrower space between the pad electrodes PE compared to the space between the bumps BP, the density of conductive particles CP increases, thereby increasing the collection rate of conductive particles CP. However, the invention is not limited thereto, and the pad electrode PE can have a thickness less than the thickness of the bumps BP, and the space between the pad electrodes PE can be relatively narrower than the space between the bumps BP.

[0136] An opening (OP) can be formed between the shielding members (SCM). The opening (OP) can be empty or filled with a resin that is the same as or similar to the first matrix resin BS1 and / or the second matrix resin BS2. Similar to... Figure 12 The multiple dam PDAMs shown in the figure, when viewed in a plan view, may have multiple shielding components SCMs in a rectangular prism shape or a cylindrical shape, but the invention is not limited thereto.

[0137] Multiple conductive particles CP can be as follows Figure 5 The mixture shown is dispersed in the first matrix resin BS1 at varying intervals, or it can be as follows: Figure 8 The conductive particles shown are dispersed in a first matrix resin BS1 with constant spacing and arrangement. Some of the multiple conductive particles CP may be configured to overlap with the multiple shielding members SCM in the thickness direction, and the remaining portions of the multiple conductive particles CP may be configured not to overlap with the multiple shielding members SCM in the thickness direction, but the invention is not limited thereto. Similar to Figure 11 Multiple conductive particles (CPs) can be configured to not overlap with multiple shielding components (SCMs) in the thickness direction.

[0138] Each of the plurality of shielding components SCMs may be made of an insulating material with high heat resistance. The plurality of shielding components SCMs may be made of materials substantially the same as or similar to the plurality of dam PDAMs, but the invention is not limited thereto. Each of the plurality of shielding components SCMs may include a non-conductive ferromagnetic material, or a mixture of a non-conductive material and a ferromagnetic material. Each of the plurality of shielding components SCMs may include a magnetic composite structure of a non-conductive material surrounding a ferromagnetic material. The non-conductive ferromagnetic material may include at least one rare earth element, such as gadolinium (Gd), terbium (Tb), dysprosium (Dy), and holmium (Ho).

[0139] The thickness of the shielding layer SCL can be less than or equal to the diameter of the conductive particles CP. Therefore, during the thermoforming process, the conductive particles CP can be well trapped between the multiple pad electrodes PE and bumps BP. See again... Figure 3 The conductive particle layer CL and the non-conductive layer NCL can each have a thickness corresponding to the pad electrode PE and the bump BP, respectively. For example, the thickness of the conductive particle layer CL can be less than the thickness of the non-conductive layer NCL, but the present invention is not limited thereto.

[0140] In addition to the shielding layer SCL Figure 13 Implementation examples and Figures 4 to 7 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 13 The embodiments are described repeatedly.

[0141] Figure 14 This is a cross-sectional view showing an adhesive component according to an embodiment of the present invention.

[0142] Reference Figure 14 ,and Figure 13 In different embodiments, the non-conductive layer NCL of the adhesive component ADc may also include a plurality of non-conductive particles NCP dispersed in the second matrix resin BS2.

[0143] Multiple non-conductive particles NCP can be like Figure 5 The irregular dispersion shown is in the second matrix resin BS2, or it can be as follows: Figure 8 The particles shown are dispersed in the second matrix resin BS2 with a constant tendency. For example, multiple non-conductive NCP particles can be arranged with varying intervals and varying arrangements, or multiple non-conductive NCP particles can be arranged with constant intervals and constant arrangements.

[0144] As described above, during the thermo-press bonding process, multiple non-conductive particles (NCP) can reduce the flowability of multiple conductive particles (CP) and increase the bonding strength between multiple pad electrodes (PE) and multiple bumps (BP).

[0145] In addition to multiple non-conductive NCP particles Figure 14 Implementation examples and Figure 13 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 14 The embodiments are described repeatedly.

[0146] Figure 15 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present invention. Figure 16 and Figure 17 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0147] Reference Figures 1 to 15A method for manufacturing a display device according to an embodiment of the present invention may include inserting an adhesive member AD between a plurality of pad electrodes PE of a display panel DP and a plurality of bumps BP of a driving member DM. The adhesive member AD includes: a conductive particle layer CL comprising a plurality of conductive particles CP, a non-conductive layer NCL disposed on the conductive particle layer CL, and a shielding layer SCL disposed between the conductive particle layer CL and the non-conductive layer NCL and comprising a plurality of shielding members SCM. The method further includes thermocompressing at least one of the display panel DP and the driving member DM to allow the plurality of conductive particles CP to flow between the plurality of shielding members SCM of the shielding layer SCL.

[0148] Performing thermocompression bonding on at least one of the display panel DP and the driving component DM may include preventing the flow of conductive particles CP disposed between multiple pad electrodes PE.

[0149] After inserting the adhesive component AD, the manufacturing method of the display device may further include aligning the adhesive component AD with the display panel DP and the driving component DM by using a magnetic field.

[0150] Using a magnetic field to align the adhesive component AD includes moving the adhesive component AD in at least one direction using a magnetic field provided by a magnet provided in a pressure component PM that holds the drive component DM.

[0151] However, the method of manufacturing the display device is not limited to the above example, and at least some of the above steps may be omitted or at least one other operation may be included with reference to other descriptions in this specification.

[0152] In the following text, reference will be made to Figure 16 and Figure 17 Describe in detail the manufacturing method of the display device.

[0153] Reference Figure 16 It is possible to fabricate a display panel DP, a driving component DM, and an adhesive component AD for bonding the display panel DP to the driving component DM. Each of the display panel DP and the driving component DM can be fabricated by a stage ST (reference). Figure 26 ) and / or chuck holding and securing. For example, each of the display panel DP and drive component DM can be held and secured to Figure 26 The table ST or pressurizing member PM with vacuum hole pressurizing member shown is illustrated, but the present invention is not limited thereto.

[0154] like Figures 1 to 3 and Figure 16As shown, multiple pad electrodes PE can be disposed on the substrate SUB of the display panel DP. An adhesive component AD can be located above the multiple pad electrodes PE, and a driving component DM can be located above the adhesive component AD. Multiple bumps BP can be disposed on the driving chip IC, and the multiple bumps BP can be aligned to overlap with the multiple pad electrodes PE in the thickness direction. In this case, in the adhesive component AD, a conductive particle layer CL can be positioned facing the multiple pad electrodes PE, and a non-conductive layer NCL can be positioned facing the multiple bumps BP.

[0155] Reference Figure 16 After the alignment of the display panel (DP), driving component (DM), and adhesive component (AD) is completed, a pressure bonding process can be performed. This pressure bonding process can be a thermoforming process. For example, as... Figure 16 As shown, a pressurizing member PM that provides heat for the thermo-pressurized bonding between the display panel DP and the driving member DM can travel to the upper part of the driving member DM and pressurize the driving member DM, thereby performing thermo-pressurized bonding between the driving member DM and the substrate SUB.

[0156] Reference Figure 16 and Figure 17 Due to the heat and pressure provided by the pressurizing member PM, the first matrix resin BS1 and the second matrix resin BS2 of the adhesive member AD can melt. Due to the melting of the first matrix resin BS1 and the second matrix resin BS2, a filling member FM can be formed to fill the space between the substrate SUB and the driving member DM.

[0157] Multiple conductive particles (CP) and multiple non-conductive particles (NCP) can flow within the molten filler component FM (first matrix resin BS1 and second matrix resin BS2). Some of the conductive particles (CP) can be inserted between the pad electrode (PE) and the bump (BP), thereby electrically connecting the pad electrode (PE) to the bump (BP). In this case, as... Figure 17 As shown, some of the multiple non-conductive particles NCP can also be inserted between the pad electrode PE and the bump BP.

[0158] As described above, the adhesive component AD can include multiple non-conductive particles NCP to restrict the flow of multiple conductive particles CP, thereby allowing a substantially constant number of conductive particles CP to be trapped between the pad electrodes PE and the bumps BP. Therefore, even when the multiple pad electrodes PE and the multiple bumps BP have a fine pitch, for example, a pitch ranging from about 1 μm to about 30 μm, the connection area, resistance, and conductivity between the pad electrodes PE and the bumps BP can be maintained.

[0159] When the first matrix resin BS1 and the second matrix resin BS2 melt, multiple conductive particles CP and multiple non-conductive particles NCP can flow between multiple pad electrodes PE and multiple bumps BP. For example... Figure 17 As shown, since at least one non-conductive particle NCP is located between conductive particles CP, between conductive particles CP and pad electrodes PE, and / or between conductive particles CP and bumps BP, short circuits caused by relatively tight contact between multiple conductive particles CP can be prevented.

[0160] Subsequently, the filler component FM (first matrix resin BS1 and second matrix resin BS2) can be cured, and then the bonding between the substrate SUB and the drive component DM can be completed.

[0161] Figure 18 and Figure 19 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0162] Reference Figure 18 and Figure 19 The adhesive component ADa, which includes multiple dam PDAMs, can be used to bond the display panel DP and the drive component DM together.

[0163] Reference Figure 18 The adhesive component ADa, comprising multiple dam PDAMs, can be inserted between the substrate SUB and the drive component DM. For example... Figure 18 As shown, the adhesive component ADa can be aligned such that the multiple dam PDAMs do not overlap with the multiple pad electrodes PEs and the multiple bumps BPs in the thickness direction and / or pressure direction. For example, the multiple dam PDAMs can be aligned between the multiple pad electrodes PEs and / or between the multiple bumps BPs.

[0164] After that, similar Figure 16 and Figure 17 In the embodiment shown, the pressurizing member PM can descend toward the driving member DM to perform thermocompression bonding on the substrate SUB, the adhesive member ADa, and the driving member DM. In this case, the first matrix resin BS1 and the second matrix resin BS2 can melt due to the heat and pressure provided by the pressurizing member PM to form the filler member FM, and the multiple dams PDAM may not be melted to maintain their shape. Therefore, the flow of the multiple conductive particles CP is restricted by the multiple dams PDAM, such that the multiple conductive particles CP do not flow between the multiple pad electrodes PE and / or between the multiple bumps BP, and such that most of the multiple conductive particles CP can be trapped between the multiple pad electrodes PE and the multiple bumps BP.

[0165] exist Figure 19The image shows an example of a conductive particle CP being trapped between a pad electrode PE and a bump BP, but the number of conductive particles CP located between the pad electrode PE and the bump BP is not limited to this.

[0166] In addition to the application of ADa adhesive components including multiple dam PDAM, Figure 18 and Figure 19 Implementation examples and Figure 16 and Figure 17 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figure 18 and Figure 19 The embodiments are described repeatedly.

[0167] Figures 20 to 22 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0168] Reference Figures 20 to 22 The adhesive component ADb, including the shielding layer SCL, can be used for bonding between the display panel DP and the drive component DM.

[0169] Reference Figure 20 The adhesive component ADb can be aligned such that the conductive particle layer CL faces the plurality of pad electrodes PE, and the non-conductive layer NCL faces the plurality of bumps BP. The adhesive component ADb can be aligned such that the plurality of shielding components SCM do not overlap with the plurality of pad electrodes PE and the plurality of bumps BP in the thickness direction and / or the pressure direction. For example, the plurality of shielding components SCM can be configured to overlap with the gaps between the plurality of pad electrodes PE and the gaps between the plurality of bumps BP. As described above, the width of one shielding component SCM can be substantially the same as the gap between the bumps BP and / or the gap between the pad electrodes PE. The opening OP between the pad electrodes PE, the shielding components SCM, and the bumps BP can overlap each other in the thickness direction and / or the pressure direction.

[0170] Reference Figure 21 After alignment, the pressurizing member PM can descend toward the driving member DM, thereby thermoforming the substrate SUB, adhesive member ADb, and driving member DM. In this case, the first matrix resin BS1 and the second matrix resin BS2 may melt due to the heat and pressure provided by the pressurizing member PM, and multiple shielding members SCM may not melt to maintain their shape. When the opening OP is empty, the molten first matrix resin BS1 and / or the molten second matrix resin BS2 can flow into the opening OP along with the conductive particles CP. When the opening OP is filled with a resin that is the same as or similar to the first matrix resin BS1 and / or the second matrix resin BS2, the conductive particles CP can flow into the opening OP as the molten resin flows.

[0171] like Figure 21 As shown, in the thermocompression bonding process, each shielding member SCM has a width substantially the same as the gap between the bumps BP and / or the gap between the pad electrodes PE, allowing conductive particles CP to flow into the opening OP and be trapped between the pad electrodes PE and the bumps BP. Additionally, conductive particles CP dispersed in the gaps between the multiple pad electrodes PE can be blocked by the shielding member SCM to prevent them from penetrating into the space between the multiple bumps BP. Therefore, open-circuit faults and / or short-circuit faults due to unnecessary flow of conductive particles CP can be prevented in advance.

[0172] Reference Figure 22 After passing through the first matrix resin BS1 (reference) Figure 4 ) and second matrix resin BS2 (reference) Figure 4 After the filler component FM formed by the melting of ) solidifies, pressure bonding between the display panel DP and the drive component DM can be completed. In this case, such as Figure 22 As shown, some of the multiple conductive particles CP may be located in the opening OP to electrically connect the pad electrode PE to the bump BP, and the remainder of the multiple conductive particles CP may be located only between the multiple pad electrodes PE and the shielding layer SCL (reference). Figure 14 Below. For example, the remaining conductive particles CP of the plurality of conductive particles CP may be located between the shielding member SCM and the substrate SUB while being disposed in the gap between the plurality of pad electrodes PE. However, the invention is not limited thereto, and for example, the conductive particles CP may be disposed between the plurality of bumps BP above the shielding layer SCL.

[0173] In addition to the application of adhesive components ADb, including the shielding layer SCL, Figures 20 to 22 Implementation examples and Figure 16 and Figure 17 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figures 20 to 22 The embodiments are described repeatedly.

[0174] Figures 23 to 25 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0175] Reference Figures 23 to 25 The adhesive component ADC, including the shielding layer SCL, can be used to bond the display panel DP and the drive component DM together. Multiple non-conductive particles NCP are dispersed within the non-conductive layer NCL.

[0176] Reference Figure 24 and Figure 25Due to the thermo-press bonding process, multiple non-conductive particles (NCPs) can flow between multiple bumps (BPs) and above the shielding layer (SCL). For example, while being disposed in the gaps between multiple bumps (BPs), the non-conductive particles (NCPs) can also be located between the shielding member (SCM) and the driver chip (IC). Therefore, as described above, by preventing short-circuit faults between multiple bumps (BPs) and increasing the particle density in the filling member (FM) (first matrix resin BS1 and second matrix resin BS2), the flow of multiple conductive particles (CPs) can be restricted.

[0177] In addition to the application of adhesive components ADC in which multiple non-conductive particles NCP are dispersed in a non-conductive layer NCL. Figures 23 to 25 Implementation examples and Figures 20 to 22 The embodiments are substantially the same or similar, and therefore details thereof have been omitted herein. Figures 23 to 25 The embodiments are described repeatedly.

[0178] Figures 26 to 29 This is a diagram illustrating the steps of a method for manufacturing a display device according to an embodiment of the present invention.

[0179] Reference Figures 26 to 29 The adhesive component ADd, including the shielding layer SCL, can be used to bond the display panel DP and the driving component DM together, and the shielding component SCM of the shielding layer SCL can include a non-conductive magnetic material. In this case, the non-conductive layer NCL can be made solely of the second matrix resin BS2, but the invention is not limited thereto. Similar to... Figure 23 In some embodiments, the non-conductive layer NCL may include multiple non-conductive particles NCP (see reference). Figure 4 ).

[0180] Reference Figure 26 A display panel DP and a driving member DM can be fabricated. In this case, the display panel DP can be held on a stage ST including a vacuum hole ST_H and fixed due to the negative pressure formed in the vacuum hole ST_H. The driving member DM can be held and fixed to the lower end of a pressure member PM including a vacuum hole PM_H. For example, the pressure member PM may include a clamping member or clamping unit for clamping the driving member DM.

[0181] After the display panel DP and the driving component DM are held in place, the adhesive component ADd can be picked up by the pressure component PM. For example, the pressure component PM may include a magnet component MM with a magnet or a magnetic field generating device with a coil for generating a magnetic field. The adhesive component ADd can be picked up by magnetic force and / or magnetic field, which is generated by the magnet component MM or the magnetic field generating device to act on the non-conductive ferromagnetic material of the shielding component SCM.

[0182] Although already Figure 26 The illustration shows a rectangular magnetic component MM comprising different polarities (N pole and S pole), but the invention is not limited thereto. For example, the magnetic component MM may comprise a cylindrical shape and / or a U-shaped shape. As another example, the magnetic component MM may comprise multiple magnets, and the adhesive component ADd may be aligned due to magnetic forces (e.g., magnetic fields) acting between the same polarities of each of the multiple magnets and / or due to magnetic forces (e.g., magnetic fields) acting between different polarities.

[0183] Reference Figure 27 After picking up the adhesive component ADd, alignment of the adhesive component ADd can be performed. Alignment can be achieved due to a magnetic field. For example, the magnetic force generated by the magnetic field of a magnet acts on the shielding member SCM of the adhesive component ADd, allowing the adhesive component ADd to move. For example, in at least one direction, it can be... Figure 27 The magnet or the pressurizing member PM comprising the magnet moves in the horizontal direction, and because the magnet is in the direction corresponding to the direction of movement of the magnet (e.g., in...). Figure 27 The adhesive component ADd on the lower end of the pressure component PM can move in the horizontal direction.

[0184] Through the alignment described above, the shielding member SCM of the adhesive member ADd can be aligned so that it does not overlap with the plurality of bumps BP in the thickness direction and / or the pressure direction. Therefore, as described above, the flow of the plurality of conductive particles CP of the conductive particle layer CL over the shielding layer SCL can be prevented.

[0185] Reference Figure 28 After the adhesive component ADd is aligned, the pressure component PM can be lowered toward the substrate SUB to perform a thermocompression bonding process on the drive component DM and the display panel DP. Due to the thermocompression bonding process, the flow of multiple conductive particles CP is... Figure 21 The flow described in the text is the same.

[0186] Reference Figure 29 After the filler component FM, formed by melting the first matrix resin BS1 and the second matrix resin BS2, is cured, the pressure bonding between the display panel DP and the drive component DM can be completed. As described above, since the adhesive component ADd includes the shielding layer SCL, the conductive particles CP can flow into the opening OP to be trapped between the pad electrode PE and the bump BP, and can prevent open circuit failures and / or short circuit failures caused by unnecessary flow of the conductive particles CP in advance.

[0187] According to the adhesive component, display device, and manufacturing method of the display device according to embodiments of the present invention, defects caused by the flow of conductive particles CP during bonding can be prevented.

[0188] The effects of the present invention are not limited to those illustrated above, and the present invention may include many more effects.

[0189] Although the invention has been described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made to the embodiments without departing from the spirit and scope of the invention.

Claims

1. An adhesive component, wherein, The adhesive component includes: The conductive particle layer comprises multiple conductive particles; A non-conductive layer is disposed on the conductive particle layer; and A shielding layer, inserted between the conductive particle layer and the non-conductive layer, and comprising a plurality of shielding members spaced apart from each other. The plurality of shielding members overlap in the thickness direction with the gap between the plurality of bumps of the driving members of the pixel circuit configured to drive the display panel.

2. The adhesive component according to claim 1, wherein, The non-conductive layer comprises a plurality of non-conductive particles, and each of the plurality of non-conductive particles comprises an elastic particle and an adhesive coating disposed on the elastic particle. The thickness of the non-conductive layer is greater than the thickness of the conductive particle layer.

3. The adhesive component according to claim 1, wherein, The plurality of shielding members are inserted between the plurality of pad electrodes of the display panel and between the plurality of bumps of the driving members configured to drive the pixel circuit of the display panel, and The width of each of the plurality of shielding members is equal to the width of the gap between the plurality of protrusions.

4. The adhesive component according to claim 1, wherein, At least one of the plurality of conductive particles is configured to overlap with the plurality of shielding members in the thickness direction.

5. The adhesive component according to claim 1, wherein, Each of the plurality of shielding components includes a heat-resistant material, and Each of the plurality of shielding components comprises a non-conductive ferromagnetic material.

6. A display device, wherein, The display device includes: Display panel; A driving component, configured to drive the display panel; and An adhesive component is inserted between the display panel and the drive component. The adhesive component includes: The conductive particle layer comprises multiple conductive particles; A non-conductive layer is disposed on the conductive particle layer; and A shielding layer, inserted between the conductive particle layer and the non-conductive layer, and comprising a plurality of shielding members spaced apart from each other. The driving component includes multiple protrusions, and The plurality of shielding members overlap with the gap between the plurality of protrusions of the driving member in the thickness direction.

7. The display device according to claim 6, wherein, The non-conductive layer comprises multiple non-conductive particles, and Each of the plurality of non-conductive particles includes an elastic particle and a coating that at least partially surrounds the elastic particle.

8. The display device according to claim 6, wherein, The thickness of the non-conductive layer is greater than the thickness of the conductive particle layer, and Wherein, at least one of the plurality of conductive particles is configured to overlap with the plurality of shielding members in the thickness direction.

9. The display device according to claim 6, wherein, The width of each of the plurality of shielding members is equal to the width of the gap between the plurality of protrusions.

10. A method for manufacturing a display device, wherein, The manufacturing method includes: An adhesive component is inserted between multiple pad electrodes of a display panel and multiple bumps of driving members configured to drive pixel circuits of the display panel. The adhesive component includes: a conductive particle layer; a non-conductive layer disposed on the conductive particle layer; and a shielding layer disposed between the conductive particle layer and the non-conductive layer and including multiple shielding members, wherein the conductive particle layer includes multiple conductive particles. Wherein, the plurality of shielding members overlap with the gap between the plurality of protrusions of the driving member in the thickness direction. At least one of the display panel or the driving member is thermo-pressed together, such that a plurality of first conductive particles of the plurality of conductive particles flow between the plurality of shielding members of the shielding layer.

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