Electronic device

Abstract

An electronic device, comprising: an electronic panel including a first area, a folding area, and a second area arranged along a first direction, the folding area being folded with respect to a folding axis defined in a second direction crossing the first direction; a support layer located below the electronic panel and including a folding portion, a first portion, and a second portion, the folding portion overlapping the folding area and the folding portion being provided with a plurality of holes defined through the folding portion, the first portion overlapping the first area, the second portion overlapping the second area; and a folding sensing module including a sensing pad attached to the first portion and electrically conductive, a driver configured to apply an electrical signal to the sensing pad, and a sensing line connecting the sensing pad and the driver.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0001992, filed on January 7, 2021, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Some aspects of embodiments of this disclosure relate to an electronic device. Background Technology

[0004] An electronic device includes a display device. The display device includes a display area that is activated in response to an electrical signal. The display device can sense input applied to it from the outside via the display area (e.g., via a touch sensor at the display area) and simultaneously display various images to provide information to the user. In recent years, with the development of display devices with various shapes, the display area can be implemented in various shapes.

[0005] For example, foldable electronic devices using flexible materials are being actively developed. The display device of a foldable electronic device can be folded relative to a folding axis (e.g., a set or predetermined folding axes), and due to the folding of the display device, the display area can be provided in various shapes.

[0006] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0007] Aspects of some embodiments of this disclosure relate to an electronic device. For example, this disclosure relates to a foldable electronic device.

[0008] Some aspects of embodiments of this disclosure include electronic devices capable of sensing their own folded state.

[0009] According to some embodiments of the present invention, an electronic device includes: an electronic panel including a first region, a folded region, and a second region arranged along a first direction, the folded region being folded relative to a folding axis defined in a second direction intersecting the first direction; a support layer located below the electronic panel and including a folded portion, a first portion, and a second portion, the folded portion overlapping the folded region and the folded portion being provided with a plurality of holes defined through the folded portion, the first portion overlapping the first region, and the second portion overlapping the second region; and a folding sensing module including a sensing pad attached to the first portion and conductive, a driver configured to apply an electrical signal to the sensing pad, and a sensing line connecting the sensing pad and the driver.

[0010] According to some embodiments, the folded portion is conductive.

[0011] According to some embodiments, the electrical signal has a voltage different from the voltage applied to the folded portion.

[0012] According to some embodiments, the folded portion is configured to receive a ground voltage.

[0013] According to some embodiments, the first portion is configured to receive the same voltage as the voltage applied to the folded portion.

[0014] According to some embodiments, the sensing pad is electrically insulated from the first portion.

[0015] According to some embodiments, the electronic device further includes a circuit board electrically connected to the electronic panel, wherein the electronic panel includes: a display panel including a plurality of pixels; and an input sensor including a plurality of sensor electrodes overlapping the pixels in a plane, the circuit board being electrically connected to each of the display panel and the input sensor, and the driver being electrically connected to the circuit board.

[0016] According to some embodiments, the electronic device further includes a flexible plate connecting the circuit board and the support layer, wherein the sensing line is located on the flexible plate.

[0017] According to some embodiments, the minimum spacing between the folded portion and the sensing pad varies depending on the degree of folding of the electronic panel.

[0018] According to some embodiments, the plurality of holes have a shape that changes according to the degree of folding of the electronic panel. Attached Figure Description

[0019] The above and other features of some embodiments of this disclosure will become apparent when considered in conjunction with the accompanying drawings and by referring to the following detailed description, wherein:

[0020] Figure 1A and Figure 1B This is a perspective view illustrating an electronic device according to some embodiments of the present disclosure;

[0021] Figure 2 This is an exploded perspective view illustrating an electronic device according to some embodiments of the present disclosure;

[0022] Figure 3A and Figure 3B This is a plan view illustrating some components of an electronic panel according to some embodiments of the present disclosure;

[0023] Figure 4A and Figure 4B This is a cross-sectional view illustrating a display device according to some embodiments of the present disclosure;

[0024] Figure 5A and Figure 5B This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure;

[0025] Figure 6 This is a schematic view of a folding sensing module according to some embodiments of the present disclosure;

[0026] Figure 7A and Figure 7B This is a plan view illustrating a portion of a support layer according to some embodiments of the present disclosure;

[0027] Figure 8A This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure;

[0028] Figure 8B It is a plan view showing a portion of the support layer; and

[0029] Figure 9A and Figure 9B This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure. Detailed Implementation

[0030] In this disclosure, it will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, the element or layer may be directly on, directly connected to or directly coupled to the other element or layer, or there may be an intermediary element or layer.

[0031] The same reference numerals always indicate the same elements. In the accompanying drawings, the thickness, proportions, and dimensions of components are exaggerated in order to effectively describe the technical content.

[0032] As used herein, the term “and / or” includes any and all combinations of one or more of the relevant listed items.

[0033] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element. For example, "first direction" may be referred to as "second direction," and vice versa. As used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms as well.

[0034] For ease of description, spatial relative terms such as “below,” “under,” “below,” “under,” “below,” “above,” and “above” may be used in this document to describe the relationship between one element or feature and another element (multiple elements) or feature (multiple features) as shown in the accompanying drawings.

[0035] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Unless expressly defined herein, terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formalized sense.

[0036] It will also be understood that, when used in this specification, the terms “comprising” and / or “including” indicate the presence of the stated features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or groups thereof.

[0037] In the following, aspects of some embodiments of this disclosure will be explained in more detail with reference to the accompanying drawings.

[0038] Figure 1A and Figure 1B This is a perspective view showing an electronic device ED according to some embodiments of the present disclosure. Figure 1A The electronic device ED in its unfolded state is shown, and Figure 1B The electronic device ED is shown in a folded state.

[0039] Reference Figure 1A and Figure 1B The electronic device ED may include a display surface DS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED may display an image IM to a user through the display surface DS.

[0040] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. An image IM may be displayed in the display area DA or may not be displayed in the non-display area NDA. The non-display area NDA may surround the display area DA such that the non-display area NDA is on the periphery of the display area DA (or outside the coverage area of ​​the display area DA). However, embodiments according to this disclosure are not limited to or are not limited thereto, and the shape of the display area DA and the shape of the non-display area NDA may be varied to have any suitable shape according to the design of the electronic device ED.

[0041] In the following text, the direction perpendicular (or orthogonal) to the plane defined by the first direction DR1 and the second direction DR2 may be referred to as the third direction DR3. In this disclosure, the expressions "when viewed in a plane" or "in a plan view" may indicate the state of view on the third direction DR3. In the following text, the first direction DR1, the second direction DR2, and the third direction DR3 are indicated by the first direction axis, the second direction axis, and the third direction axis, respectively, and are assigned the same reference numerals as those used for the first direction axis, the second direction axis, and the third direction axis.

[0042] The electronic device ED may include a folded region FA and multiple non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first region NFA1 and a second region NFA2. The first region NFA1, the folded region FA, and the second region NFA2 may be arranged sequentially in a second direction DR2.

[0043] like Figure 1B As shown, the folding region FA can be folded relative to a folding axis FX extending in the first direction DR1. According to some embodiments, the folding axis FX can be defined as substantially parallel to the first direction DR1. The folding region FA can have a curvature (e.g., a set or predetermined curvature) and a radius of curvature. The electronic device ED can be folded inward (inward folding) such that the first region NFA1 and the second region NFA2 can face each other and the display surface DS can be concealed from the outside.

[0044] According to some embodiments, the electronic device ED can be folded outward (outward folding) so that the display surface DS can be exposed to the outside. According to some embodiments, the electronic device ED can be configured to repeatedly perform an inward folding operation or an outward folding operation by unfolding. According to some embodiments, the electronic device ED can be configured to selectively (e.g., based on user activity) perform unfolding, inward folding, and outward folding operations.

[0045] Figure 2 This is an exploded perspective view showing an electronic device ED according to some embodiments of the present disclosure.

[0046] Reference Figure 2 The electronic device ED may include a display device DD, an electronic module EM, a power module PSM, and a housing EDC. According to some embodiments, the power module PSM may also include a mechanical structure to control the folding operation of the display device DD.

[0047] The display device DD can generate or display images and can sense external input from the user (e.g., touch input). The display device DD may include a window module WM and a display module DM. The window module WM can provide the front surface of the electronic device ED.

[0048] The display module DM may include an electronic panel EP, a driver chip DIC, a circuit board FCB, and a support layer PLT. The electronic panel EP can essentially provide the display area DA and the non-display area NDA of the electronic device ED. The electronic panel EP can display an image at the display area DA and can sense external input (e.g., touch input). However, this is only an example, and the area for displaying the image and the area for sensing external input can be different from each other, and the embodiment is not particularly limited.

[0049] The electronic panel EP can be flexible. As an example, the electronic panel EP can perform a folding or unfolding operation relative to the folding axis FX. The electronic panel EP may include a first region NFA1, a folding region FA, and a second region NFA2 arranged in a second direction DR2. The first region NFA1, the folding region FA, and the second region NFA2 may be defined in each layer of the display device DD.

[0050] The electronic panel EP may have flexible properties to fold along a folding axis FX. According to some embodiments, the folding axis FX may have a shape extending in a first direction DR1. The electronic panel EP may include a folding region FA, a first region NFA1, and a second region NFA2, which, when viewed in a plan view, are distinguishable from each other relative to the folding axis FX. The first region NFA1, the folding region FA, and the second region NFA2 may be arranged sequentially in a second direction DR2.

[0051] The folded region FA can be folded relative to the folding axis FX. When the folded region FA is folded, tensile or compressive stress is applied to the folded region FA, and therefore, strain may occur in the folded region FA, causing shape deformation. When viewed in a plane, the folded region FA can overlap with the folding axis FX in the unfolded state.

[0052] The first region NFA1 and the second region NFA2 may be spaced apart from each other in the second direction DR2 and may be defined such that the folded region FA is located between the first region NFA1 and the second region NFA2. When the electronic device ED is folded, the first region NFA1 and the second region NFA2 may be arranged to overlap each other when viewed in a plan view. As an example, when the electronic device ED is folded inward, the second region NFA2 may be arranged on top of the first region NFA1. Alternatively, when the electronic device ED is folded outward, the second region NFA2 may be arranged below the first region NFA1.

[0053] The driver chip DIC can be electrically connected to the electronic panel EP. The driver chip DIC can apply electrical signals to the electronic panel EP or can receive electrical signals generated by the electronic panel EP. As an example, the driver chip DIC may include driving circuitry for driving pixels, as described in more detail below.

[0054] The driver chip DIC can be mounted on the electronic panel EP; however, this is merely an example, and according to some embodiments, the driver chip DIC can be mounted on the circuit board FCB. However, the embodiments according to this disclosure are not particularly limiting.

[0055] The circuit board FCB can be electrically connected to the electronic panel EP and the driver chip DIC. As an example, the circuit board FCB may include driving circuitry to drive either the pixel or the driver chip DIC. According to some embodiments, the circuit board FCB may include driving circuitry to drive the input sensor IS (see below for more detailed description). Figure 3B ).

[0056] Additionally, according to some embodiments, the display module DM may also include a layer disposed below the electronic panel EP to support the electronic panel EP or an adhesive layer to attach the support layer PLT to the electronic panel EP.

[0057] A support layer PLT can be disposed beneath an electronic panel EP. The support layer PLT supports the electronic panel EP. The support layer PLT may comprise a material having an elastic modulus equal to or greater than approximately 60 GPa. The support layer PLT may comprise a metallic material such as stainless steel. For example, the support layer PLT may comprise SUS 304; however, embodiments according to this disclosure are not limited thereto or thereby. The support layer PLT may comprise a variety of metallic materials.

[0058] In addition, the support layer PLT can include materials with relatively high thermal conductivity. Therefore, the heat dissipation performance of the display device DD can be improved by using the support layer PLT.

[0059] The support layer PLT may include a first portion PP1, a folded portion PP0, and a second portion PP2 arranged in the second direction DR2. The folded portion PP0 may be located between the first portion PP1 and the second portion PP2.

[0060] The first portion PP1 may overlap with the first region NFA1. The second portion PP2 may overlap with the second region NFA2. The folded portion PP0 may overlap with the folded region FA. The folded portion PP0 may be conductive or have conductive properties. For example, the folded portion PP0 may include a metallic material, a conductive polymer, or a conductive oxide material.

[0061] Multiple holes HH (e.g., reference) Figure 7A The folded portion PP0 can be defined. The folded portion PP0 can have a grid pattern shape surrounding the hole HH in the unfolded state. According to some embodiments, because the folded portion PP0 of the support layer PLT, which overlaps with the folding area FA, has a grid pattern, the flexibility of the folded portion PP0 can be improved. Therefore, the support layer PLT can be folded relatively easily according to the folding operation of the electronic panel EP. This will be described in more detail below.

[0062] The folding sensing module (FSM) can be attached to the display module (DM) to sense the folding of the display module (DM). For example, the folding sensing module (FSM) can be attached to the support layer (PLT) and can sense the folding of the support layer (PLT), and therefore the folding sensing module (FSM) can sense whether the electronic panel (EP) is folded and the folding angle of the electronic panel (EP).

[0063] The folding sensing module (FSM) can be coupled to at least one of the first portion PP1 and the second portion PP2 of the support layer PLT. For example, the folding sensing module (FSM) may include a sensing pad FP, a sensing line FL, and a driver FD. The sensing pad FP can be coupled to the support layer PLT. The folding sensing module (FSM) can sense the spacing between the sensing pad FP and the folding portion PP0. The spacing between the sensing pad FP and the folding portion PP0 can be set in various ways (such as minimum spacing, maximum spacing, average spacing, etc.) according to preset criteria; however, setting only one spacing can relatively improve accuracy. According to some embodiments, the minimum spacing will be described as a representative example.

[0064] The sensing line FL can electrically connect the driver FD to the sensing pad FP. The driver FD can apply an electrical signal to the sensing pad FP and receive an electrical signal from the sensing pad FP, and the electrical signal applied to the sensing pad FP has a voltage different from the voltage applied to the folded portion PP0. The spacing between the sensing pad FP and the folded portion PP0 can vary depending on the degree of folding. The fold sensing module FSM can sense whether the electronic device ED is folded and the degree of folding based on the spacing between the first portion PP1 and the folded portion PP0 or the spacing between the second portion PP2 and the folded portion PP0. According to some embodiments of this disclosure, the fold sensing module FSM, with a relatively simplified configuration, is attached to the support layer PLT, thus enabling the sensing of the folding of the electronic panel EP. Therefore, manufacturing costs can be reduced and the assembly process can be simplified. The fold sensing module FSM will be described in more detail later.

[0065] An electronic module (EM) may include at least a main controller. The EM may include wireless communication modules, camera modules, proximity sensor modules, image input modules, audio input modules, audio output modules, memory, and external interface modules. Modules may be mounted on a circuit board or electrically connected to each other via a flexible circuit board. The EM may be electrically connected to a power supply module (PSM).

[0066] The main controller controls the overall operation of the electronic device ED. For example, the main controller can activate or deactivate the display device DD to match user input. The main controller can control the operation of the display device DD and other modules. The main controller may include at least one microprocessor.

[0067] The housing EDC can accommodate the display module DM, the electronics module EM, and the power supply module PSM. The housing EDC may include two separate housings EDC1 and EDC2; however, embodiments according to this disclosure are not limited thereto or thereby restrictive. According to some embodiments, the electronics ED may also include a hinge structure to connect the two housings EDC1 and EDC2 to each other. Housings EDC1 and EDC2 may be coupled to a window module WM. Housings EDC1 and EDC2 can protect the display module DM, the electronics module EM, and the power supply module PSM housed within them.

[0068] Figure 3A and Figure 3B This illustrates an electronic panel EP (refer to) according to some embodiments of the present disclosure. Figure 2 A floor plan of some components. Figure 3A This is a plan view showing the display panel DP of the electronic panel EP, and Figure 3B This is a plan view showing the input sensor IS of the electronic panel EP. In the following text, reference will be made to... Figure 3A and Figure 3B A more detailed description of aspects of some embodiments of this disclosure is provided below.

[0069] Electronic Panel EP (Reference) Figure 2 The display panel (DP) may include an input sensor (IS). According to some embodiments, the input sensor (IS) may be directly disposed on the display panel (DP); however, this is merely an example. The input sensor (IS) may be coupled to the display panel (DP) via an adhesive layer (e.g., a set or predetermined adhesive layers) or may be disposed on the lower surface of the display panel (DP); however, embodiments according to this disclosure are not limited thereto or thereby restrictive.

[0070] The display panel DP may include a substrate layer BS, pixels PX, signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2 and PL, scan driver SDV, driver chip DIC and emitter driver EDV. Alternatively, the display panel DP may include, in cross-section, a stacked substrate layer BS, circuit layer, light-emitting element layer and encapsulation layer.

[0071] The substrate layer BS can provide a substrate surface on which the pixels PX are arranged. The substrate layer BS can be a glass substrate, a metal substrate, or a polymer substrate. However, this is only an example, and the substrate layer BS can be an inorganic layer, an organic layer, or a composite material layer, and should not be particularly limited thereto.

[0072] The matrix layer BS can have a multilayer structure. For example, the matrix layer BS can have a three-layer structure consisting of a synthetic resin layer, an adhesive layer, and a synthetic resin layer. For example, the synthetic resin layer can include polyimide resins. Alternatively, the synthetic resin layer can include at least one of acrylate resins, methacrylate resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0073] The substrate layer BS can be flexible. The electronic panel EP can have a shape substantially corresponding to the shape of the substrate layer BS. The substrate layer BS may include a first non-curved region AA1, a second non-curved region AA2, and a curved region BA, which are separated from each other in the second direction DR2. The second non-curved region AA2 and the curved region BA may be part of the non-display region DP-NDA. The curved region BA may be located between the first non-curved region AA1 and the second non-curved region AA2.

[0074] The first non-curved region AA1 can correspond to Figure 1A The display surface DS. The first non-curved region AA1 may include a first region NFA10, a second region NFA20, and a folded region FA0. The first region NFA10, the second region NFA20, and the folded region FA0 may correspond to the first region NFA1, the second region NFA2, and the folded region FA of the electronic panel EP, respectively.

[0075] The lengths of the curved region BA and the second non-curved region AA2 in the first direction DR1 can be less than the length of the first non-curved region AA1 in the first direction DR1. As described above, the folding shaft FX (refer to...) Figure 2 It can be defined as being substantially parallel to the first direction DR1. The relatively short region in the direction of the folding axis FX can be easily bent.

[0076] The display panel DP may include displays corresponding to the display areas DA (see reference). Figure 1A ) and non-display area NDA (reference) Figure 1A The display area DP-DA and the non-display area DP-NDA are defined as follows. In this disclosure, the expression "one area / part corresponds to another area / part" means "one area / part overlaps with another area / part," and "areas / parts" should not be limited to having the same size as each other. Figure 3A In this configuration, pixels (PX) can be arranged in the display area DP-DA, while the scan driver (SDV), driver chip (DIC), and transmit driver (EDV) can be arranged in the non-display area DP-NDA. The driver chip (DIC) may include a data driver.

[0077] Each pixel PX may include a light-emitting element and a thin-film transistor connected to the light-emitting element. According to some embodiments, the display area DP-DA and the non-display area DP-NDA may be distinguished from each other by the presence or absence of a light-emitting element; however, this is merely an example. According to some embodiments, some pixels PX may include thin-film transistors arranged in the non-display area DP-NDA; however, embodiments according to this disclosure are not limited thereto or thereby.

[0078] Signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL may include multiple scan lines SL1 to SLm, multiple data lines DL1 to DLn, multiple light-emitting lines EL1 to ELm, a first control line CSL1, a second control line CSL2, and a power line PL. Among the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL, the data lines DL1 to DLn, the first control line CSL1, the second control line CSL2, and the power line PL may be connected to multiple pads. Each of m and n is a natural number. Pixel PX may be connected to scan lines SL1 to SLm, data lines DL1 to DLn, and light-emitting lines EL1 to ELm.

[0079] Scan lines SL1 to SLm can extend in the first direction DR1 and can be connected to the scan driver SDV. Data lines DL1 to DLn can extend in the second direction DR2 and can be connected to the driver chip DIC via the bend region BA. Emitting lines EL1 to ELm can extend in the first direction DR1 and can be connected to the emitter driver EDV.

[0080] The power line PL may include a portion extending in the second direction DR2 and a portion extending in the first direction DR1. The portions extending in the first direction DR1 and the portions extending in the second direction DR2 may be arranged on different layers. The portion of the power line PL extending in the first direction DR1 may extend through a curved region BA to a second non-curved region AA2. The power line PL may provide a first voltage to the pixel PX.

[0081] The first control line CSL1 can be connected to the scan driver SDV and can extend through the curved region BA toward the lower end of the second non-curved region AA2. The second control line CSL2 can be connected to the transmit driver EDV and can extend through the curved region BA toward the lower end of the second non-curved region AA2.

[0082] In the plan view, the display pad DPP can be arranged adjacent to the lower end of the second non-bent region AA2. The driver chip DIC, power line PL, first control line CSL1, and second control line CSL2 can be connected to the display pad DPP. The circuit board FCB can be electrically connected to the display pad DPP via an anisotropic conductive adhesive layer.

[0083] Furthermore, according to some embodiments, the sensor pad ISP can be arranged adjacent to the display pad DPP and can be connected to the circuit board FCB. The sensor pad ISP can form an input sensor IS. That is, according to some embodiments, the display panel DP and the input sensor IS can be driven using a single circuit board FCB; however, this is merely an example. According to some embodiments, the sensor pad ISP can be arranged on a different layer than the layer on which the display pad DPP is arranged, or it can be driven using a different circuit board than the circuit board FCB; however, embodiments according to this disclosure are not limited thereto or thereby restricted.

[0084] For ease of explanation, Figure 3B An input sensor IS formed on a display panel DP is shown. The input sensor IS may include sensor electrodes SE1 and SE2, sensor lines SL1 and SL2, and sensor pads ISP.

[0085] When viewed in a plane, the input sensor IS can include an active region IS-DA and a peripheral region IS-NDA. The active region IS-DA can be the area that senses external input, and essentially, sensor electrodes SE1 and SE2 can be arranged in the active region IS-DA.

[0086] According to some embodiments, when viewed in a plane, the active region IS-DA may overlap with the display region DP-DA. In the plane, the active region IS-DA may correspond to the display region DP-DA and the peripheral region IS-NDA may correspond to the non-display region DP-NDA; however, this is merely an example. According to some embodiments, the display region DP-DA and the active region IS-DA may be defined as not overlapping each other or partially overlapping each other; however, embodiments according to this disclosure are not limited thereto or are not restricted thereto.

[0087] Sensor electrodes SE1 and SE2 may include a first sensor electrode SE1 and a second sensor electrode SE2 insulated from the first sensor electrode SE1. The first sensor electrode SE1 may extend in a first direction DR1 and may be arranged in a second direction DR2. Each first sensor electrode SE1 may include a first sensor portion SP1 and a first connection portion BP1 arranged in the first direction DR1 and electrically connected to each other.

[0088] The second sensor electrode SE2 may extend in the second direction DR2 and may be arranged in the first direction DR1. Each second sensor electrode SE2 may include a second sensor portion SP2 and a second connecting portion BP2 arranged in the second direction DR2 and electrically connected to each other. The first connecting portion BP1 may be arranged on a layer different from the layer on which the second connecting portion BP2 is arranged and may be electrically insulated from the second connecting portion BP2.

[0089] This is merely an example, and each first sensor electrode SE1 can be provided as an electrode with a monolithic shape. Similarly, each second sensor electrode SE2 can be provided as an electrode with a monolithic shape.

[0090] One end of the first sensor line SL1 can be connected to the first sensor electrode SE1, and one end of the second sensor line SL2 can be connected to the second sensor electrode SE2. The other ends of the first sensor line SL1 and the second sensor line SL2 can be connected to the sensor pad ISP. Therefore, the first sensor line SL1 and the second sensor line SL2 can receive independent electrical signals, and the first sensor electrode SE1 and the second sensor electrode SE2 can be driven independently.

[0091] According to some embodiments, the input sensor IS can sense the position and intensity of an external input using a mutual capacitance method; however, this is merely an example. According to some embodiments, the input sensor IS can be driven using a self-capacitance method. According to some embodiments, the input sensor IS can be driven using a resistive film method or an optical method, and the driving method for the external input should not be particularly limited as long as it is sensed.

[0092] Figure 4A and Figure 4B This is a cross-sectional view showing a display device DD according to some embodiments of the present disclosure. Figure 4A This is a cross-sectional view of the electronic panel EP before bending in the bending region BA, and... Figure 4B This is a cross-sectional view showing the electronic panel EP after the bending region BA has been bent. Figure 4A and Figure 4B In the figures, the same reference numerals indicate Figures 2 to 3B The same elements in the same text, and therefore, some detailed descriptions of the same or similar elements can be omitted. Meanwhile, Figure 4A and Figure 4B It also shows Figure 2 Some components are not shown in the diagram.

[0093] Reference Figure 4A The display device DD may include a window module WM and a display module DM. The window module WM may include a border pattern BP, a plastic film PF, a thin glass substrate UTG, and an optical film LF.

[0094] The border pattern BP can be used with the non-display area DP-NDA (see reference). Figure 3A The border pattern BP can be disposed on one surface of the thin glass substrate UTG or on one surface of the plastic film PF. According to some embodiments, the border pattern BP is disposed on the lower (or rear) surface of the plastic film PF; however, this should not be limited to or construed as such. According to some embodiments, the border pattern BP can be disposed on the upper surface of the plastic film PF. The border pattern BP can be a colored light-blocking layer and can be formed by a coating process. The border pattern BP can include a substrate material and a pigment or dye mixed with the substrate material.

[0095] Thin glass substrate UTGs can have thicknesses ranging from approximately 15 μm to approximately 45 μm. Thin glass substrate UTGs can be chemically tempered glass. Creases in thin glass substrate UTGs can be minimized even with repeated folding and unfolding operations.

[0096] The plastic film PF can be disposed on a thin glass substrate UTG. The plastic film PF can have a thickness ranging from about 50 μm to about 80 μm. The plastic film PF can include polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate. According to some embodiments, at least one of a hard coating, an anti-fingerprint layer, and an anti-reflective layer can be disposed on the upper surface of the plastic film PF.

[0097] The first adhesive layer AL1 can attach the thin glass substrate UTG to the plastic film PF. The first adhesive layer AL1 can be a pressure-sensitive adhesive (PSA) film or an optically clear adhesive (OCA) film. The adhesive layers described below can be substantially the same as the first adhesive layer AL1 and can include conventional adhesives.

[0098] The optical film LF can be arranged in Figure 4A In the first non-curved region AA1 shown in the figure, the optical film LF can at least cover the display area DP-DA (see reference). Figure 3A The second adhesive layer AL2 can attach the optical film LF to the thin glass substrate UTG, and the third adhesive layer AL3 can attach the optical film LF to the electronic panel EP.

[0099] The plastic film PF, border pattern BP, thin glass substrate UTG, and optical film LF can be attached to each other through an adhesive layer. Figure 4A The first adhesive layer AL1, the second adhesive layer AL2, and the third adhesive layer AL3 in the adhesive layer of the window module WM are shown as representative examples.

[0100] The first adhesive layer AL1 can be separated from the thin glass substrate UTG. Because the strength of the plastic film PF is lower than that of the thin glass substrate UTG, scratches are relatively easy to appear on the plastic film PF. After the first adhesive layer AL1 and the plastic film PF separate from each other, another plastic film PF can be attached to the thin glass substrate UTG.

[0101] The second adhesive layer AL2 and the third adhesive layer AL3 can be disposed on the upper and lower surfaces of the optical film LF, respectively. The second adhesive layer AL2 can attach the optical film LF to the thin glass substrate UTG, and the third adhesive layer AL3 can attach the optical film LF to the electronic panel EP.

[0102] The display module (DM) can be positioned below the window module (WM). The display module (DM) may include an electronic panel (EP), a panel protective layer (PPL), a barrier layer (BRL), a support layer (PLT), spacers (SPC), and a conductive film (FFL) (see reference). Figure 4B ).

[0103] A panel protective layer PPL can be disposed beneath the electronic panel EP. The panel protective layer PPL protects the lower portion of the electronic panel EP. The panel protective layer PPL can comprise a flexible plastic material. For example, the panel protective layer PPL can comprise polyethylene terephthalate. According to some embodiments, the panel protective layer PPL may not be disposed within the folded area FA. A fourth adhesive layer AL4 can attach the panel protective layer PPL to the electronic panel EP, and a fifth adhesive layer AL5 can attach the panel protective layer PPL to the barrier layer BRL.

[0104] The panel protective layer PPL may include a first panel protective layer PPL-1 protecting the first non-bending region AA1 of the electronic panel EP and a second panel protective layer PPL-2 protecting the second non-bending region AA2 of the electronic panel EP. (See reference...) Figure 4B When the bending region BA is bent, the second panel protective layer PPL-2 can be disposed below the first non-bending region AA1, and the first panel protective layer PPL-1 can be disposed above the second non-bending region AA2. Since the panel protective layer PPL is not located within the bending region BA, the bending region BA can be bent more easily. The fourth adhesive layer AL4 may include a first portion AL4-1 corresponding to the first panel protective layer PPL-1 and a second portion AL4-2 corresponding to the second panel protective layer PPL-2.

[0105] The barrier layer (BRL) can be located beneath the panel protective layer (PPL). The BRL increases resistance to compressive forces caused by external pressure. Therefore, the BRL prevents the display panel from being subjected to pressure drops (DP). Figure 3AThe barrier layer BRL can comprise a flexible plastic material, such as polyimide or polyethylene terephthalate. Alternatively, the barrier layer BRL can be a colored film with low light transmittance. The barrier layer BRL can absorb light incident on it from the outside. As an example, the barrier layer BRL can be a black plastic film. When viewing the display device DD from the top of the window module WM, the components arranged beneath the barrier layer BRL may not be perceptible to the user. The fifth adhesive layer AL5 can attach the panel protective layer PPL to the barrier layer BRL, and the sixth adhesive layer AL6 can attach the barrier layer BRL to the support layer PLT.

[0106] The support layer PLT can be disposed below the barrier layer BRL. The support layer PLT can comprise a material having an elastic modulus equal to or greater than approximately 60 GPa. The support layer PLT can comprise a metallic material such as stainless steel. For example, the support layer PLT can comprise SUS 304; however, this should not be limited to or construed as such. The support layer PLT can comprise a variety of metallic materials. The support layer PLT can support the electronic panel EP. Furthermore, the heat dissipation performance of the display device DD can be improved by the support layer PLT.

[0107] Multiple holes HH can pass through the folded portion PP0 to overlap with the folded region FA. The first portion PP1 of the support layer PLT can support the first region NFA1, the second portion PP2 of the support layer PLT can support the second region NFA2, and the folded portion PP0 of the support layer PLT can support the folded region FA. Because the holes HH pass through the folded portion PP0, the folded portion PP0 can be easily folded to correspond to the electronic panel EP. This will be described in more detail later.

[0108] Reference Figure 4B When the bending area BA of the electronic panel EP is bent, the driver chip DIC and the circuit board FCB can be arranged on the lower surface of the support layer PLT. Figure 4B The display device DD is shown in its assembled state.

[0109] For example, the curved region BA can be bent such that the second non-curved region AA2 can be disposed below the first non-curved region AA1. Therefore, the driver chip DIC can be disposed below the first non-curved region AA1. As the curved region BA bends, the second non-curved region AA2 of the electronic panel EP can be disposed on one surface of the spacer SPC. The spacer SPC can prevent or reduce the collision between the electronic panel EP and the support layer PLT. Additionally, the spacer SPC can prevent excessive bending of the electronic panel EP and can allow the electronic panel EP to maintain its curvature (e.g., a set or predetermined curvature) while bending. The spacer SPC can be elastic or rigid; however, embodiments according to this disclosure are not limited thereto or thereby restricted.

[0110] A bending protection layer BPL may be disposed in at least the bending region BA. The bending protection layer BPL may overlap with the bending region BA, the first non-bending region AA1, and the second non-bending region AA2. The bending protection layer BPL may be disposed on a portion of the first non-bending region AA1 and a portion of the second non-bending region AA2.

[0111] The Bending Protective Layer (BPL) can be bent together with the Bending Region BA. The BPL protects the Bending Region BA from external impacts and controls the neutral plane of the Bending Region BA. The BPL controls the stress in the Bending Region BA to allow the neutral plane to be close to the signal lines arranged within the Bending Region BA.

[0112] One surface of the second part of the second panel protective layer PPL-2, which is not attached to the fourth adhesive layer AL4, can be attached to the spacer SPC.

[0113] A conductive film FFL can be disposed between the support layer PLT and the circuit board FCB. The conductive film FFL can contact the rear surface of each of the support layer PLT and the circuit board FCB. Static electricity generated in the circuit board FCB can diffuse and disperse to the support layer PLT through the conductive film FFL. Therefore, the electrical reliability of the circuit board FCB can be improved.

[0114] Simultaneously, the support layer PLT can receive voltage (e.g., a set or predetermined voltage) via the conductive film FFL. As an example, the support layer PLT can receive ground voltage via the rear surface of the circuit board FCB. The voltage transmitted through the conductive film FFL can be supplied to the folded portion PP0 of the support layer PLT, and therefore, the folded portion PP0 can have voltage (e.g., a set or predetermined voltage).

[0115] Additionally, according to some embodiments, the electronic device may also include a foldable circuit board F-FPC. The foldable circuit board F-FPC can house the foldable sensing module FSM (see reference). Figure 2 It is electrically connected to the circuit board FCB.

[0116] The foldable circuit board (F-FPC) can be a circuit film comprising an insulating film and lines mounted on the insulating film. As an example, the circuit board (FCB) can be a flexible board, and the sensing lines (FL) of the foldable sensing module (FSM) can be referenced. Figure 2 The folding circuit board F-FPC is mounted on the flexible board. The folding circuit board F-FPC can be electrically connected to the circuit board FCB. The folding circuit board F-FPC can also electrically connect the folding sensing module FSM to the circuit board FCB. Therefore, the sensing line FL of the folding sensing module FSM can be mounted on the folding circuit board F-FPC, and the circuit board FCB can be electrically connected to the sensing pad FP (see reference). Figure 2).

[0117] According to some embodiments, the foldable circuit board F-FPC can be a flexible board, and the driver FD of the foldable sensing module FSM (see reference) Figure 2 The folding circuit board (F-FPC) is mounted on the flexible plate. In this case, the driver FD of the folding sensing module (FSM) can be electrically connected to the driving circuit of the electronic panel (EP).

[0118] However, this is merely an example, and according to some embodiments, the folding circuit board F-FPC can be omitted. In this case, the sensing line FL of the folding sensing module FSM can be connected to the driver FD provided on a separate circuit board, and therefore, the folding sensing module FSM and the circuit board FCB can be driven independently of each other. According to some embodiments, the electronic device can be implemented in various ways and should not be particularly limited.

[0119] Figure 5A and Figure 5B This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure. Figure 6 This is a schematic view illustrating a foldable sensing module (FSM) according to some embodiments of the present disclosure. For ease of illustration, Figure 5A and Figure 5B Only the electronic panel EP, the support layer PLT, and the folding sensing module FSM are shown. Figure 5A This is a cross-sectional view showing the electronic panel EP in its unfolded state, and Figure 5B This is a cross-sectional view showing the electronic panel EP in a folded state. Figure 5A , Figure 5B and Figure 6 In the figures, the same reference numerals indicate Figures 1A to 4B The same elements in the same text, and therefore, some detailed descriptions of the same or similar elements can be omitted.

[0120] According to some embodiments, the support layer PLT may be conductive. The folded portion PP0 may have a first voltage. The first voltage may have various voltage levels, such as a ground voltage. The electrical signal applied to the sensing pad FP has a voltage different from the first voltage applied to the folded portion PP0.

[0121] According to some embodiments, the first portion PP1 and the second portion PP2 can be physically and electrically coupled to the folded portion PP0. Therefore, the first portion PP1 and the second portion PP2 can have a voltage level substantially the same as that of the folded portion PP0.

[0122] The folding sensing module FSM can be coupled to the first portion PP1 of the support layer PLT. For example, the sensing pad FP of the folding sensing module FSM can be arranged on the surface PP1-S (hereinafter referred to as the attachment surface PP1-S) of the first portion PP1 facing the folded portion PP0.

[0123] The sensing pad FP can be coupled to the attachment surface PP1-S via an adhesive layer (e.g., a set or predetermined adhesive layer) AD. The adhesive layer AD can include various materials, as long as these materials have insulating properties and can physically couple the sensing pad FP to the first portion PP1. As an example, the adhesive layer AD can include optically clear adhesive (OCA), optically clear resin (OCR), photopolymer resin, thermosetting resin, or silicone resin.

[0124] The sensing pad FP can have the same characteristics as the sensor pad ISP (refer to...). Figure 3B The shape is similar to that of the folded sensing module (FSM). That is, since the folded sensing module (FSM) includes simplified sensing pads (FP), the process can be simplified and the ability to assemble components can be improved.

[0125] The sensing pad FP can be coupled to the first portion PP1 via the adhesive layer AD, and therefore, the sensing pad FP can be electrically insulated from the first portion PP1; however, this is only an example. If the first portion PP1 has insulating properties, the sensing pad FP can be coupled directly to the first portion PP1 without the adhesive layer AD and should not be particularly limited thereto.

[0126] Reference Figure 6 A voltage (e.g., a set or predetermined voltage), such as a ground voltage, can be applied to the folded portion PP0, and a sensing pad FP spaced apart from the folded portion PP0 by a distance dd can form a capacitance (e.g., a set or predetermined capacitance) with the folded portion PP0. The capacitance can change according to variations in the distance dd between the sensing pad FP and the folded portion PP0. The distance dd between the sensing pad FP and the folded portion PP0 varies as follows: Figure 5A The electronic panel EP shown can be in its unfolded state at a first distance d1, and as... Figure 5B The folded state of the electronic panel EP shown can be a second distance d2, which is different from the first distance d1. The first distance d1 or the second distance d2 can correspond to the average distance between the sensing pad FP and the surface PP0-S1 (hereinafter referred to as the sensing surface PP0-S1) of the folded portion PP0 facing the first portion PP1.

[0127] Even if the electronic panel EP is folded, the area of ​​the sensing pad FP or the sensing surface PP0-S1 can remain the same; however, the spacing can change. Therefore, the capacitance between the sensing pad FP and the folded portion PP0 can change. The driver of the fold sensing module FSM can sense this change in capacitance, and thus, the fold sensing module FSM can sense whether the electronic panel EP is folded and the folding angle.

[0128] Reference Figure 6 According to some embodiments, the sensing pad FP can be electrically connected to the circuit board FCB via the sensing line FL. That is, the driver of the folding sensing module FSM can be mounted on the circuit board FCB. Meanwhile, according to some embodiments, the sensing pad FP can be electrically connected to the input sensor IS (see reference 1). Figure 3B The driving circuit for the folding sensing module (FSM) can be replaced. Therefore, a separate driving circuit for the folding sensing module (FSM) can be eliminated, thus reducing costs.

[0129] Furthermore, since the folding sensing module FSM is controlled using a circuit board FCB, the electronic panel EP can be controlled using a single circuit board (see reference). Figure 5A and Figure 5B ) and the folding sensing module FSM. As an example, when the folding sensing module FSM senses that the electronic panel EP is in a folded state, the electronic device ED (refer to Figure 1A and Figure 1B The electronic device ED can control the electronic panel EP to be closed, and when the folding sensing module FSM senses that the electronic panel EP is in an unfolded state, the electronic device ED can control the electronic panel EP to be opened. Therefore, power consumption in the electronic device ED can be reduced, and damage to components due to degradation can be prevented. Alternatively, for example, the size of the image displayed on the electronic panel EP can be controlled based on the folding angle of the electronic panel EP sensed by the folding sensing module FSM, or the input sensor IS (see reference) can be controlled. Figure 3B The active region IS-DA (refer to) Figure 3B (size).

[0130] However, this is just one example; the foldable sensing module (FSM) can be electrically connected to the display panel (DP) (see reference). Figure 3A The drive circuitry may include a driver independent of the circuit board FCB, and this should not be limited to or restricted by it.

[0131] Figure 7A and Figure 7B This is a plan view illustrating a portion of a support layer PLT according to some embodiments of the present disclosure. Figure 7A As shown Figure 5A The electronic panel EP shown in its unfolded state (refer to) Figure 2). Figure 7B This shows the result after stretching left and right along the second direction DR2. Figure 7A The support layer PLT shown in the figure corresponds to Figure 5B The folded state. Figure 7A and Figure 7B In the figures, the same reference numerals indicate Figures 1A to 6 The same elements in the same text, and therefore, some detailed descriptions of the same or similar elements can be omitted.

[0132] Reference Figure 7A When viewed in a plane, the folded portion PP0 of the support layer PLT can have a lattice shape. For example, the folded portion PP0 may include multiple first branches BR1 and multiple second branches BR2. Each first branch BR1 may extend in a first direction DR1. The first branches BR1 may be substantially parallel to the folding axis FX shown in FIG1.

[0133] Second branches BR2 can be arranged between first branches BR1. For example, each second branch BR2 can extend in the second direction DR2. Each second branch BR2 can extend from portions of two first branches BR1 that are adjacent to each other in the first direction DR1. First branches BR1 can be connected to each other through second branches BR2.

[0134] The second branch BR2 can be located between the first branch BR1 closest to the first part PP1 and the first branch BR1. The second branch BR2 can also be located between the second part PP2 and the first branch BR1 closest to the second part PP2. As a result, the folded part PP0 can be connected to the first part PP1 and the second part PP2 through the second branch BR2.

[0135] The first branch BR1 and the second branch BR2 can surround the hole HH and can define a lattice shape. Each hole HH can be defined as a strip with rounded ends; however, this is merely an example. According to some embodiments, each hole HH can have a circular shape, an elliptical shape, or a polygonal shape, etc., and is not particularly limited according to the embodiments of this disclosure.

[0136] Reference Figure 7B When the electronic panel EP is folded, the support layer PLT can be folded to correspond to the electronic panel EP. Due to the stress or bending of the material caused by the folding operation, the shape of the folded portion PP0 can be changed. Therefore, the shape of the hole HH-F (hereinafter referred to as "hole HH-F in the folded state") can be changed. Each hole HH-F in the folded state can have a larger shape than the hole HH in the folded state (see reference). Figure 7AThe dimensions of the hole HH. According to some embodiments of this disclosure, the folded portion PP0 can be easily folded as the shape of the hole HH changes.

[0137] Meanwhile, the space between the attachment surface PP1-S and the sensing surface PP0-S1 can correspond to the hole HH (refer to...). Figure 7A ) and one of the holes HH-F. Additionally, the distances d1 and d2 between the attachment surface PP1-S and the sensing surface PP0-S1 can substantially correspond to the folded sensing module FSM (see reference). Figure 5A and Figure 5B ) sensing pad FP (reference) Figure 5A and Figure 5B The spacing distance between the attachment surface PP1-S and the sensing surface PP0-S1. When the size of the space between the attachment surface PP1-S and the sensing surface PP0-S1 changes, the spacing distances d1 and d2 may change, and the capacitance value measured by the folding sensing module FSM may change. The capacitance value may include information about whether the electronic panel EP is folded and the folding angle of the electronic panel EP. According to some embodiments of this disclosure, since the folding sensing module FSM is inserted into the support layer PLT, the electronic device ED (refer to...) Figure 1A and Figure 1B Folding and electronic devices ED (refer to) Figure 1A and Figure 1B The folding angle of the fold is easily sensed.

[0138] Figure 8A This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure, and Figure 8B This is a plan view showing a portion of the support layer PLT. Figure 8A It shows the corresponding Figure 5B An electronic panel EP is folded at a certain angle (e.g., a set or predetermined angle) in the area of ​​the region. Figure 8B The stretching is shown to correspond to Figure 8A The image shows the support layer PLT of the electronic panel EP. Figure 8A and Figure 8B In the figures, the same reference numerals indicate Figures 1A to 7B The same elements in the same text, and therefore, some detailed descriptions of the same or similar elements can be omitted.

[0139] Reference Figure 8A and Figure 8B The spacing d3 between the sensing pad FP and the sensing surface PP0-S1 can vary depending on the folding angle of the electronic panel EP. Figure 8A The folding angle of the electronic panel EP shown can be less than approximately 180 degrees (that approximately 180 degrees is...). Figure 5BThe folding angle of the electronic panel EP shown in the figure can be greater than approximately zero (0) degrees, which is Figure 5A The folding angle of the electronic panel EP is shown in the figure. Figure 8A The electronic panel EP is shown folded at an angle of approximately 90 degrees.

[0140] Reference Figure 8B In this case, the hole HH-F1 can have the same Figure 7A The hole HH shown in the figure Figure 7B The hole HH-F shown has different shapes and sizes. The spacing d3 between the sensing pad FP and the sensing surface PP0-S1 can be different from the spacing distances d1 and d2 (see reference). Figure 7A and Figure 7B The Folding Sensing Module (FSM) can sense the capacitance change between the folded portion PP0 and the sensing pad FP based on the difference in the interval distance d3. Therefore, the FSM can sense whether the electronic panel EP is folded and the folding angle of the electronic panel EP.

[0141] Figure 9A and Figure 9B This is a cross-sectional view showing a portion of an electronic device according to some embodiments of the present disclosure. Figure 9A and Figure 9B It shows the corresponding Figure 5A The cross-section. In Figure 9A and Figure 9B In the figures, the same reference numerals indicate Figures 1A to 7B The same elements are used in the same way, and therefore, some detailed descriptions of the same elements can be omitted.

[0142] Reference Figure 9A Multiple folding sensing modules FSM1 and FSM2 can be provided. A first folding sensing module FSM1 can be coupled to a first portion PP1, and a second folding sensing module FSM2 can be coupled to a second portion PP2. The first folding sensing module FSM1 can be disposed on the attachment surface PP1-S of the first portion PP1 to sense the distance d11 from the sensing surface PP0-S1. The first folding sensing module FSM1 can sense the folding angle between the first portion PP1 and the folded portion PP0.

[0143] The second folding sensing module FSM2 can be located on the attachment surface PP2-S of the second portion PP2 to sense the distance d12 from the sensing surface PP0-S2. The second folding sensing module FSM2 can sense the folding angle between the second portion PP2 and the folded portion PP0. According to some embodiments of this disclosure, since the folding sensing modules FSM1 and FSM2 are respectively arranged on the first portion PP1 and the second portion PP2, the degree of folding of the first region NFA1 and the degree of folding of the second region NFA2 can be sensed independently.

[0144] As another way, refer to Figure 9B The support layer PLT-1 may include a first portion PP1-1 and a second portion PP2-1 that are electrically separated from the folded portion PP0-1. The first portion PP1-1 and the second portion PP2-1 may receive a voltage different from the voltage applied to the folded portion PP0-1.

[0145] Meanwhile, the first part PP1-1 and the second part PP2-1 can have electrical insulation properties. When the first part PP1-1 has electrical insulation properties, the adhesive layer AD can be omitted. In this case, the sensing pad FP can be formed directly on or directly attached to the attachment surface PP1-S.

[0146] According to some embodiments of this disclosure, as long as the folding sensing module FSM is attached to the attachment surface PP1-S of the first portion PP1-1 and senses changes in the distance from the sensing surface PP0-S1, the folding sensing module FSM can be unaffected by the electrical characteristics of the first portion PP1-1. Therefore, even if the first portion PP1-1 is electrically or physically separated from the folding portion PP0-1, is formed of a different material than the folding portion PP0-1, or has a different voltage than the folding portion PP0-1, the folding sensing module FSM can still stably sense the folding angle of the electronic panel EP.

[0147] While aspects of some embodiments of this disclosure have been described, it should be understood that this disclosure is not intended to be limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of this disclosure as claimed. Therefore, the subject matter of the disclosure should not be limited to any single embodiment described herein, and the scope of the inventive concept should be determined in accordance with the appended claims and their equivalents.

Claims

1. An electronic device, wherein, The electronic device includes: An electronic panel includes a first region, a folded region, and a second region arranged along a first direction, the folded region being folded relative to a folding axis defined in a second direction intersecting the first direction; A support layer, located below the electronic panel, includes a folded portion, a first portion, and a second portion. The folded portion overlaps with the folded region and is provided with a plurality of holes defined through the folded portion. The first portion overlaps with the first region, and the second portion overlaps with the second region. A folding sensing module includes conductive sensing pads attached to the first portion or the second portion, a driver configured to apply electrical signals to the sensing pads, and sensing lines connecting the sensing pads and the driver, the sensing pads being spaced apart from the folding portion. The folding sensing module senses the distance between the sensing pad and the folding portion to sense whether the electronic panel is folded and the degree of folding.

2. The electronic device according to claim 1, wherein, The folded portion is conductive.

3. The electronic device according to claim 2, wherein, The electrical signal has a voltage different from the voltage applied to the folded portion.

4. The electronic device according to claim 3, wherein, The folded portion is configured to receive ground voltage.

5. The electronic device according to claim 3, wherein, The first or second portion is configured to receive the same voltage as the voltage applied to the folded portion.

6. The electronic device according to claim 5, wherein, The sensing pad is electrically insulated from the first portion or the second portion.

7. The electronic device according to claim 1, wherein, The electronic device further includes a circuit board electrically connected to the electronic panel, wherein the electronic panel includes: The display panel includes multiple pixels; and An input sensor includes a plurality of sensor electrodes overlapping the pixel in a plane, the circuit board is electrically connected to the display panel and each of the input sensors, and the driver is electrically connected to the circuit board.

8. The electronic device according to claim 7, wherein, The electronic device further includes a flexible plate connecting the circuit board and the support layer, wherein the sensing line is located on the flexible plate.

9. The electronic device according to claim 1, wherein, The minimum spacing between the folded portion and the sensing pad varies depending on the degree of folding of the electronic panel.

10. The electronic device according to claim 9, wherein, The plurality of holes have shapes that change according to the degree of folding of the electronic panel.

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