Coil assembly

Abstract

A coil assembly is provided. The coil assembly includes a main body, a support substrate, a coil portion on a surface of the support substrate, and first and second outer electrodes provided on the main body and connected to the coil portion, respectively. 100 μm ≤ 0.5 × b × tan θ, where, in a cross section perpendicular to the surface of the support substrate, P1 is a point closer to an adjacent coil turn among points at which an outline of one coil turn and the support substrate intersect, P2 is a point closer to the point P1 among points at which an outline of the adjacent coil turn and the support substrate intersect, P3 is a point closer to the adjacent coil turn among points at which the one coil turn has a maximum line width, a first virtual line segment connects the points P1 and P3, "b" is a length of a second virtual line segment connecting the points P1 and P2, and "θ" is an angle defined by the first virtual line segment and the second virtual line segment.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2021-0000990, filed on January 5, 2021, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0004] Thin-film inductors can be manufactured by the following steps: forming a coil portion on a substrate by a plating process, forming a resin composite containing filler and resin on the substrate and the coil portion and curing it to manufacture the component body, and forming an external electrode on the outer surface of the component body. Summary of the Invention

[0005] One aspect of this disclosure is to provide a coil assembly in which, when the coil portion is formed by a plating process, the plating growth angle of the plating layer is controlled so that the coil portion has a height greater than or equal to 100 μm.

[0006] According to one aspect of this disclosure, a coil assembly includes: a body; a support substrate disposed in the body; a coil portion having at least one turn located on a surface of the support substrate; and a first external electrode and a second external electrode, spaced apart from each other on the body and respectively connected to the coil portion. 100μm≤0.5×b×tanθ, wherein, in a cross-section perpendicular to the surface of the support substrate, “P1” is the point closer to the adjacent second turn among the points where the outline of the first turn of the coil portion intersects the surface of the support substrate, “P2” is the point closer to point P1 among the points where the outline of the second turn intersects the surface of the support substrate, “P3” is the point closer to the second turn on the outline of the first turn among the points where the first turn has the maximum line width, a first virtual line segment connects points P1 and P3 to each other, “b” is the length of the second virtual line segment connecting points P1 and P2 to each other, and “θ” is the angle defined by the first virtual line segment and the second virtual line segment.

[0007] According to another aspect of this disclosure, a coil assembly includes: a body; a support substrate disposed in the body; a coil portion having at least one turn located on a surface of the support substrate; and a first external electrode and a second external electrode, spaced apart from each other and disposed on the body, and respectively connected to the coil portion. The side surface of the portion of the at least one turn of the coil portion that contacts the support substrate forms an angle of less than 90° with the surface of the support substrate. Attached Figure Description

[0008] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description.

[0009] Figure 1 This is a schematic perspective view of a coil assembly according to an exemplary embodiment of the present disclosure.

[0010] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0011] Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0012] Figure 4 It is shown Figure 3 A schematic enlarged view of an example of the "A" section.

[0013] Figure 5 It is shown Figure 3 A schematic enlarged view of another example of the “A” part.

[0014] Figure 6 It is shown Figure 3 A schematic enlarged view of another example of the “A” part.

[0015] Figure 7 It is shown Figure 3 A schematic enlarged view of another example of the “A” part. Detailed Implementation

[0016] The terminology used in this disclosure is for describing particular embodiments and is not intended to limit the disclosure. Unless otherwise stated, singular terms include plural forms. The terms "comprising," "including," "constructed as," etc., in this disclosure are used to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, and do not preclude the possibility of combining or adding one or more additional features, quantities, steps, operations, elements, components, or combinations thereof. Furthermore, the terms "set on," "located on," etc., may indicate that an element is located above or below an object, and do not necessarily mean that the element is above the object relative to the direction of gravity.

[0017] Terms such as “integrated into…” or “combined into…” can not only indicate that elements are in direct and physical contact with each other, but can also include a configuration in which another element is located between the elements such that the elements are also in contact with the other element.

[0018] For ease of description, the dimensions and thicknesses of the elements shown in the accompanying drawings are indicated by way of example, and this disclosure is not limited thereto.

[0019] In the attached figures, the L direction is the first direction or the length (longitudinal) direction, the W direction is the second direction or the width direction, and the T direction is the third direction or the thickness direction.

[0020] In the following, a coil assembly according to exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the drawings, the same or corresponding components may be designated by the same reference numerals, and repeated descriptions will be omitted.

[0021] In electronic devices, various types of electronic components can be used, and various types of coil assemblies can be used between electronic components to remove noise or for other purposes.

[0022] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, general-purpose ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0023] Figure 1 This is a schematic perspective view of a coil assembly according to an exemplary embodiment. Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'. Figure 4 It is shown Figure 3 A schematic enlarged view of an example of the "A" section.

[0024] Reference Figures 1 to 4 According to an exemplary embodiment, the coil assembly 1000 may include a main body 100, a support substrate 200, a coil portion 300, and external electrodes 400 and 500. Additionally, the coil assembly 1000 may also include an insulating layer IF.

[0025] The main body 100 may form the exterior of the coil assembly 1000 according to this embodiment, and the coil portion 300 and the support substrate 200 may be embedded in the main body 100.

[0026] The main body 100 can be formed into an overall hexahedral shape.

[0027] based on Figures 1 to 3The main body 100 has a first surface 101 and a second surface 102 that are opposite each other in the length direction L, a third surface 103 and a fourth surface 104 that are opposite each other in the width direction W, and a fifth surface 105 and a sixth surface 106 that are opposite each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the main body 100 may correspond to the wall surface of the main body 100 that connects the fifth surface 105 and the sixth surface 106 of the main body 100. In the following, the two end surfaces (one end surface and the other end surface) of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body 100, respectively, and the two side surfaces (one side surface and the other side surface) of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body 100, respectively. One surface of the main body 100 may refer to the sixth surface 106 of the main body 100, and the other surface of the main body 100 may refer to the fifth surface 105 of the main body 100. When the coil assembly 1000 according to this embodiment is mounted on a mounting substrate such as a printed circuit board (PCB), the sixth surface of the body 100 may be configured as a mounting surface.

[0028] The body 100 may be configured such that the coil assembly 1000, including the external electrodes 400 and 500 which will be described later, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Since the above dimensions of the coil assembly 1000 are merely illustrative, cases where the dimensions of the coil assembly 1000 are smaller or larger than the above dimensions are not excluded from the scope of this disclosure.

[0029] The aforementioned length of the coil assembly 1000 may refer to the maximum value among a plurality of line segments (dimensions) connected to the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the length direction L of the body 100, based on an optical microscope or scanning electron microscope (SEM) image of a cross-section of the coil assembly 1000 in the width direction W and in the length-thickness direction (LT) of the central portion of the coil assembly 1000 in the cross-sectional image. Alternatively, the length of the coil assembly 1000 may refer to the arithmetic mean of the lengths (dimensions) of at least two line segments connected to the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the length direction L of the body 100.

[0030] The aforementioned thickness of the coil assembly 1000 may refer to the maximum value among the lengths (dimensions) of a plurality of line segments connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the thickness direction T of the body 100, based on an optical microscope or scanning electron microscope (SEM) image of the cross-section of the coil assembly 1000 in the width direction W and in the length-thickness direction (LT) of the central portion of the coil assembly 1000 in the cross-sectional image. Alternatively, the thickness of the coil assembly 1000 may refer to the arithmetic mean of the lengths (dimensions) of at least two line segments connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the thickness direction T of the body 100.

[0031] The aforementioned width of the coil assembly 1000 may refer to the maximum value among the lengths (dimensions) of a plurality of line segments connected to the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the width direction W of the body 100, based on an optical microscope or scanning electron microscope (SEM) image of the cross-section of the coil assembly 1000 in the thickness direction T along the length-width direction (LW). Alternatively, the width of the coil assembly 1000 may refer to the arithmetic mean of the lengths (dimensions) of at least two line segments connected to the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image and parallel to the width direction W of the body 100.

[0032] Optionally, the length, width, and thickness of the coil assembly 1000 can be measured using a micrometer. In this method, the measurement is performed by zeroing a micrometer (instrument) with repeatability and reproducibility (R&R), inserting the coil assembly 1000 between the tips of the micrometer, and rotating the measuring rod. When measuring the length of the coil assembly 1000 using the micrometer method, the length can refer to a single measurement or the arithmetic mean of two or more measurements. This measurement method can be applied equivalently to the width and thickness of the coil assembly 1000.

[0033] The body 100 may include an insulating resin and fillers dispersed in the insulating resin. The filler may be a dielectric material or a magnetic material. The magnetic material may be ferrite powder particles or magnetic metal powder particles. The dielectric material may be an organic filler or an inorganic filler. For example, the body 100 may be formed by stacking magnetic metal powder particles dispersed in one or more magnetic composite sheets in an insulating resin.

[0034] Examples of ferrite powder particles may include one or more of the following: spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites, etc.), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites, etc.), garnet-type ferrites (such as Y-based ferrites, etc.), and Li-based ferrites.

[0035] Magnetic metal powder particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, magnetic metal powder particles may be one or more selected from pure iron powder, Fe-Si based alloy powder, Fe-Si-Al based alloy powder, Fe-Ni based alloy powder, Fe-Ni-Mo based alloy powder, Fe-Ni-Mo-Cu based alloy powder, Fe-Co based alloy powder, Fe-Ni-Co based alloy powder, Fe-Cr based alloy powder, Fe-Cr-Si based alloy powder, Fe-Si-Cu-Nb based alloy powder, Fe-Ni-Cr based alloy powder, and Fe-Cr-Al based alloy powder.

[0036] Magnetic metal powder particles can be amorphous or crystalline. For example, magnetic metal powder particles can be Fe-Si-B-Cr based amorphous alloy powders, but are not limited to this.

[0037] Inorganic fillers may be selected from one or more of the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0038] Each filler may have an average diameter of approximately 0.1 μm to 30 μm, but is not limited to this.

[0039] Body 100 may include two or more types of fillers dispersed in a resin. The term “different types of fillers” means that fillers dispersed in a resin are distinguished from each other by at least one of the following: average diameter, composition, crystallinity, shape, and magnetic properties (e.g., whether they have the same magnetic permeability).

[0040] In the following text, for ease of description, the filler will be assumed to be magnetic metal powder particles, but this disclosure is not limited to the body 100 having a structure in which magnetic metal powder particles are dispersed in an insulating resin.

[0041] Insulating resins can be in single or combined forms, including but not limited to epoxy resins, polyimides, liquid crystal polymers, etc.

[0042] The main body 100 may include a core 110 extending through the support substrate 200 and the coil portion 300, which will be described later. The core 110 may be formed by filling the central portion of each of the coil portion 300 and the support substrate 200 with a magnetic composite sheet, but this disclosure is not limited thereto.

[0043] The support substrate 200 can be embedded in the main body 100. The support substrate 200 can support the coil section 300, which will be described later.

[0044] The support substrate 200 may include an insulating material such as a thermosetting insulating resin (e.g., epoxy resin), a thermoplastic insulating resin (e.g., polyimide), or a photosensitive insulating resin, or the support substrate 200 may include an insulating material prepared by impregnating a reinforcing material (e.g., glass fiber or inorganic filler) in an insulating resin. For example, the support substrate 200 may include, but is not limited to, insulating materials such as prepreg, Ajinomoto Build-up Film (ABF), FR-4, bismaleimide triazine (BT) film, photosensitive dielectric (PID) film, etc.

[0045] Inorganic fillers may be selected from one or more of the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0046] When the support substrate 200 is formed using an insulating material including reinforcing material, the support substrate 200 provides improved rigidity. When the support substrate 200 is formed using an insulating material that does not include glass fiber, the support substrate 200 facilitates a thinner coil assembly 1000. Furthermore, for assemblies with the same volume, the effective volume of the coil portion 300 and / or magnetic material can be increased to improve assembly characteristics. When the support substrate 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes used to form the coil portion 300 can be reduced. Therefore, it is beneficial to reduce production costs and to form fine vias.

[0047] The coil section 300 can be provided in the main body 100 to exhibit the characteristics of the coil assembly 1000. For example, when the coil assembly 1000 is used as a power inductor, the coil section 300 can store the electric field as a magnetic field to maintain the output voltage for stabilizing the power of electronic devices.

[0048] The coil portion 300 may include coil patterns 311 and 312, vias 320, and lead-out patterns 331 and 332.

[0049] Specifically, based on Figures 1 to 3 In the direction of the first coil pattern 311 and the first lead-out pattern 331, the first coil pattern 311 and the first lead-out pattern 331 can be disposed on the upper surface of the fifth surface 105 of the support substrate 200 facing the main body 100, and the second coil pattern 312 and the second lead-out pattern 332 can be disposed on the lower surface of the support substrate 200 opposite to the upper surface of the support substrate 200.

[0050] Reference Figures 1 to 3 On the upper surface of the support substrate 200, the first coil pattern 311 can contact and connect with the first lead-out pattern 331. On the lower surface of the support substrate 200, the second coil pattern 312 can contact and connect with the second lead-out pattern 332. A through-hole 320 can penetrate the support substrate 200 to contact and connect with the inner end of each of the first coil pattern 311 and the second coil pattern 312. The first lead-out pattern 331 can be exposed on the first surface 101 of the body 100 to contact and connect with the first external electrode 400 (described later) disposed on the first surface 101 of the body 100. The second lead-out pattern 332 can be exposed on the second surface 102 of the body 100 to contact and connect with the second external electrode 500 (described later) disposed on the second surface 102 of the body 100. Therefore, the coil portion 300 can be used as a single coil connected in series between the first external electrode 400 and the second external electrode 500.

[0051] Each of the first coil pattern 311 and the second coil pattern 312 may be in the form of a planar spiral forming at least one turn around the core 110. For example, the first coil pattern 311 may be formed at least one turn around the core 110 on the upper surface of the support substrate 200.

[0052] The coil portion 300 may include at least three conductive layers 300A, 300B, and 300C. Specifically, the coil portion 300 may include: a conductive thin film 300A disposed on a support substrate 200; a conductive pattern layer 300B disposed on the conductive thin film 300A and spaced apart from the support substrate 200; and an upper conductive layer 300C disposed on the conductive pattern layer 300B to cover at least a portion of the side surface of the conductive pattern layer 300B. In this embodiment, the upper conductive layer 300C may cover the side surface of each of the conductive thin film 300A and the conductive pattern layer 300B to contact the support substrate 200. Since the coil portion 300 has coil patterns 311 and 312, vias 320, and lead-out patterns 331 and 332, each of the coil patterns 311 and 312, vias 320, and lead-out patterns 331 and 332 may include a conductive thin film 300A, a conductive pattern layer 300B, and an upper conductive layer 300C. In the following text, reference will be made to Figure 4 Only the first coil pattern 311 is described, but each of the second coil pattern 312, the first lead pattern 331, the second lead pattern 332 and the via 320 may also include the conductive film 300A, the conductive pattern layer 300B and the upper conductive layer 300C described in the first coil pattern 311.

[0053] Reference Figure 4 Each turn of the first coil pattern 311 may include: a conductive film 300A disposed on the upper surface of the support substrate 200; a conductive pattern layer 300B disposed on the conductive film 300A and spaced apart from the support substrate 200; and an upper conductive layer 300C disposed on the conductive pattern layer 300B to cover the side surfaces of each of the conductive film 300A and the conductive pattern layer 300B to contact the support substrate 200.

[0054] The conductive thin film 300A can be a seed layer for forming the conductive patterned layer 300B by a plating process. The conductive thin film 300A may include at least one of, for example, copper (Cu), molybdenum (Mo), nickel (Ni), titanium (Ti), and chromium (Cr). As an example, the conductive thin film 300A can be formed by vapor deposition (such as sputtering) and may include molybdenum (Mo). As another example, the conductive thin film 300A can be formed by electroless plating and may include copper (Cu). The thickness of the conductive thin film 300A may be less than or equal to 5 μm. When the thickness of the conductive thin film 300A is greater than 5 μm, it is not economically viable. The thickness (length in the linewidth direction) of the conductive film 300A can refer to the maximum value among the lengths (dimensions) of a plurality of line segments connecting the outermost boundary lines of the conductive film 300A shown in the cross-sectional image in the width direction W and in the length-thickness direction (LT) of the coil assembly 1000. Alternatively, the thickness of the conductive film 300A can refer to the minimum value among the lengths (dimensions) of a plurality of line segments connecting the outermost boundary lines of the conductive film 300A shown in the cross-sectional image and in the length direction L of the body 100, where the two boundary lines are opposite to each other and parallel to the length direction L of the body 100. Optionally, the thickness of the conductive film 300A may refer to the arithmetic average of the lengths (dimensions) of at least three line segments among the outermost boundary lines of the conductive film 300A shown in the cross-sectional image, which are opposite to each other in the length direction L and parallel to the length direction L of the main body 100. When obtaining the thickness of the conductive film 300A using the above method, if the coil portion 300 has multiple turns, the thickness of the conductive film 300A can be obtained by applying the above method to the conductive film 300A of one turn. Alternatively, the thickness of the conductive film 300A in each turn can be obtained using the above method, and the obtained thicknesses can be arithmetically averaged to calculate the thickness of the conductive film 300A.

[0055] A conductive pattern layer 300B may be disposed on the conductive thin film 300A and may be spaced apart from the support substrate 200. For example, the conductive pattern layer 300B may be configured to contact the conductive thin film 300A in a manner that exposes the side surfaces of the conductive thin film 300A. As an example, the conductive thin film 300A and the conductive pattern layer 300B may be formed by the following steps: forming a metal layer for the conductive thin film 300A on the entire upper surface of the support substrate 200; forming an opening-patterned resist on the metal layer; filling the openings of the resist using the metal for forming the conductive pattern layer 300B; removing the resist; and removing the portion of the metal layer exposed to the outside by removing the resist from the upper surface of the support substrate 200. The conductive thin film 300A and the conductive pattern layer 300B may be formed by such an exemplary manufacturing process that the conductive pattern layer 300B exposes the side surfaces of the conductive thin film 300A to be spaced apart from the support substrate 200.

[0056] The conductive pattern layer 300B can be formed by electroplating using a conductive thin film 300A as a seed layer. The conductive pattern layer 300B may include at least one of, for example, copper (Cu), aluminum (Al), silver (Ag), gold (Au), tin (Sn), molybdenum (Mo), nickel (Ni), titanium (Ti), and chromium (Cr). The conductive pattern layer 300B may include a metal different from the metal of the conductive thin film 300A. In this case, during the process of removing the aforementioned metal layer (as described above, as part of the structure of the conductive thin film 300A in subsequent processes), the metal layer may be selectively removed to significantly reduce the conductor loss of the conductive thin film 300A, but this disclosure is not limited thereto. The area of ​​the lower surface of the conductive pattern layer 300B, which is configured to contact the conductive thin film 300A, may be the same as the area of ​​the upper part of the conductive pattern layer 300B. For example, the conductive pattern layer 300B may have a cross-section based on a surface perpendicular to the support substrate 200 (e.g., as shown in the image). Figure 3 and Figure 4 The rectangular cross-sectional shape of the section in the width-thickness direction (WT) shown in the figure.

[0057] An upper conductive layer 300C may be disposed on a conductive pattern layer 300B to cover the side surfaces of each of the conductive film 300A and the conductive pattern layer 300B, and to contact the support substrate 200. The upper conductive layer 300C may be formed by electroplating using the conductive pattern layer 300B as a seed layer. In the upper conductive layer 300C, the thickness (vertical dimension) of the region disposed on the upper surface of the conductive pattern layer 300B may be greater than the thickness (horizontal dimension) of the region disposed on the side surface of the conductive pattern layer 300B. For example, the upper conductive layer 300C may have an anisotropic shape where the growth in the horizontal direction is less than the growth in the vertical direction. Due to the anisotropic shape of the upper conductive layer 300C, the cross-sectional area of ​​the conductor constituting the coil portion 300 can be further increased, while preventing short circuits between adjacent turns in the final coil including the upper conductive layer 300C. For example, the upper conductive layer 300C may be formed by anisotropic plating on the conductive pattern layer 300B. In this case, the total number of processes can be reduced based on the thickness of the final coil. For example, when the thickness of the final coil is greater than 100 μm, if the final coil is patterned using a resist plating agent, at least two resist plating layering processes and at least two plating processes are required due to current technology limitations. However, in this embodiment, the conductive pattern layer 300B can be formed using a resist plating agent through patterning, and the upper conductive layer 300C can be formed using the conductive pattern layer 300B as a seed layer through anisotropic plating, thereby eliminating at least one resist plating layering, exposure, and development process compared to the prior art.

[0058] The thickness (size) of the region of the upper conductive layer 300C disposed on the upper surface of the conductive pattern layer 300B can refer to the maximum value among the lengths (sizes) of multiple line segments connecting the boundary line corresponding to the upper surface of the conductive pattern layer 300B and the boundary line corresponding to the upper surface of the upper conductive layer 300C to each other in the thickness direction T, based on an optical microscope or scanning electron microscope (SEM) image of the cross-section of the coil assembly 1000 in the central portion in the width direction W of the coil assembly 1000 in the length-thickness direction (LT). Alternatively, the thickness (size) of the region of the upper conductive layer 300C disposed on the upper surface of the conductive pattern layer 300B can refer to the minimum value among the lengths (sizes) of multiple line segments connecting the boundary line corresponding to the upper surface of the conductive pattern layer 300B and the boundary line corresponding to the upper surface of the upper conductive layer 300C to each other in the thickness direction T, based on the optical microscope or scanning electron microscope (SEM) image. Optionally, the thickness (size) of the region of the upper conductive layer 300C disposed on the upper surface of the conductive pattern layer 300B may refer to the arithmetic mean of the lengths (sizes) of at least two of a plurality of line segments connecting the boundary line corresponding to the upper surface of the conductive pattern layer 300B and the boundary line corresponding to the upper surface of the upper conductive layer 300C to each other in the thickness direction T, based on the optical microscope or scanning electron microscope (SEM) image.

[0059] The upper conductive layer 300C may have a shape in which it protrudes upward on the upper side in a cross section perpendicular to the upper surface of the support substrate 200. For example, the upper surface of the upper conductive layer 300C may be a curved surface with an upwardly protruding shape. On the other hand, the upper surface of the conductive pattern layer 300B may be a substantially flat surface. In this case, since the angled portion of the upper conductive layer 300C can be significantly reduced, the DC resistance (Rdc) of the coil portion 300 can be reduced.

[0060] The upper conductive layer 300C may include at least one of, for example, molybdenum (Mo), nickel (Ni), titanium (Ti), and chromium (Cr). In this embodiment, the upper conductive layer 300C may be a copper anisotropic plating, but this disclosure is not limited thereto.

[0061] As an example, when the first coil pattern 311, via 320, and first lead-out pattern 331 are formed on the upper surface of the support substrate 200 by a plating process, the conductive film 300A of the via 320, the conductive film 300A of the first coil pattern 311, and the conductive film 300A of the first lead-out pattern 331 can be formed together in the same process to integrate them. For example, no boundary is formed between the conductive film 300A of the first coil pattern 311, the conductive film 300A of the via 320, and the conductive film 300A of the first lead-out pattern 331.

[0062] The angle between the side surface of at least one turn of the coil portion 300 and the surface of the support substrate 200 can be less than 90°. Therefore, the height and volume of the coil portion 300 can be increased by controlling the growth angle and shape of the plating on the coil portion 300.

[0063] In a cross-section perpendicular to the upper surface of the support substrate 200, where "P1" is the point closer to the adjacent second turn among the points where the outline of the first turn of the coil portion 300 intersects with the upper surface of the support substrate 200, "P2" is the point closer to point P1 among the points where the outline of the second turn adjacent to the first turn intersects with the upper surface of the support substrate 200, "P3" is the point closer to the second turn on the outline of the first turn among the points where the first turn has the maximum line width, "a" is the length of the first virtual line segment connecting points P1 and P3 to each other, "b" is the length of the second virtual line segment connecting points P1 and P2 to each other, and θ is the angle defined by the first and second virtual line segments, the coil assembly 1000 satisfies the formula 100μm≤0.5×b×tanθ. This will be described in detail below.

[0064] Reference Figure 3 and Figure 4 The first coil pattern 311 may include a first turn 311-1, a second turn 311-2, a third turn 311-3, and a fourth turn 311-4 formed on the upper surface of the support substrate 200. As an example, points P1, P2, and P3 are defined as follows: "P1" is one of two points formed by bringing the contour of the first turn 311-1 into contact with the support substrate 200 (based on...). Figure 4 The direction is located at the point on the right), "P2" is the point closer to point P1 of the two points formed by making the outline of the second turn 311-2 adjacent to the first turn 311-1 contact the support substrate 200 (based on the direction of the point on the right). Figure 4 The direction is located at the point on the left). "P3" is the point closer to the second turn 311-2 among the two points in the outline of the first turn 311-1 that correspond to the area of ​​the first turn 311-1 with the maximum line width (based on...). Figure 4 The direction is set at the point on the right. Points P1, P2, and P3 can be used to define two virtual line segments L1 and L2 that intersect each other at point P1, and to define the length "a" of the first virtual line segment L1 and the length "b" of the second virtual line segment L2. For example, when connecting points P1 and P3, a first virtual line segment L1 with length "a" can be defined, and when connecting points P1 and P2, a second virtual line segment L2 with length "b" can be defined. Since the first virtual line segment L1 and the second virtual line segment L2 intersect each other at point P1, the angle formed by the first virtual line segment L1 and the second virtual line segment L2 at point P1 can be defined as θ. Under the above definition, the coil assembly according to this embodiment can satisfy the formula 100μm≤0.5×b×tanθ.

[0065] Typically, when an anisotropic plating layer is used as the final layer of the coil during its formation by plating, the linewidth of the anisotropic plating layer increases in the upward direction, thus the anisotropic plating layer has a maximum linewidth at a specific height. Furthermore, the linewidth of the anisotropic plating layer tends to be less than the maximum linewidth at heights greater than the specific height. In this embodiment, points P1, P2, and P3 can be used to control the angle of the profile of each turn of the coil portion 300, allowing the height of the coil portion 300 (formed as a final coil including the upper conductive layer 300C) to be greater than 100 μm. In this embodiment, since the upper conductive layer 300C (anisotropic plating layer) surrounds the entire exposed surface of the conductive film 300A and the conductive pattern layer 300B to contact the support substrate 200, the profile of each turn of the coil portion 300 can be formed through the surface of the upper conductive layer 300C.

[0066] The length "b" of the second virtual segment L2 can be greater than or equal to 6 μm and less than or equal to 20 μm. When the length "b" of the second virtual segment L2 is less than 6 μm, the upper conductive layer 300C (the final layer of the coil section 300) may come into contact with each other in adjacent turns, thereby causing a short circuit between adjacent turns. When the length "b" of the second virtual segment L2 is greater than 20 μm, the spacing between the turns of the coil section 300 can be relatively increased, which may be detrimental to increasing the number of turns.

[0067] Preferably, the angle θ formed by the first virtual line segment L1 and the second virtual line segment L2 can be greater than or equal to 84.3° and less than or equal to 89.0°. When the angle θ formed by the first virtual line segment L1 and the second virtual line segment L2 is less than 84.3°, the distance between the lower side (e.g., P1) and the upper side (e.g., P3) of the profile of each turn is increased. Figure 4 The distance between P1 and P3 in the width direction W) causes a short circuit between adjacent turns. When the angle θ formed by the first virtual line segment L1 and the second virtual line segment L2 is greater than 89.0°, it may increase the difficulty of the process.

[0068] In this embodiment, to satisfy the equation 100μm≤0.5×b×tanθ, as an example, when b=6μm, θ can be greater than or equal to 88.3° and less than or equal to 89.0°. As another example, when b=8μm, θ can be greater than or equal to 87.7° and less than or equal to 89.0°. As another example, when b=10μm, θ can be greater than or equal to 87.2° and less than or equal to 89.0°. As another example, when b=12μm, θ can be greater than or equal to 86.6° and less than or equal to 89.0°. As another example, when b=14μm, θ can be greater than or equal to 86.0° and less than or equal to 89.0°. As another example, when b=16μm, θ can be greater than or equal to 85.5° and less than or equal to 89.0°. As another example, when b = 18 μm, θ can be greater than or equal to 84.9° and less than or equal to 89.0°. As another example, when b = 20 μm, θ can be greater than or equal to 84.3° and less than or equal to 89.0°.

[0069] Table 1 shows the variation of the height H1 of each turn of the coil at its maximum line width with respect to θ when b is 6 μm. Referring to Table 1, when b is 6 μm, within the range of θ being greater than or equal to 88.3° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0070] Table 1

[0071] 83.0 3 25 24 84.0 3 29 29 85.0 3 34 34 88.2 3 96 95 88.3 3 101 101 88.5 3 115 115 89.0 3 172 172

[0072] Table 2 shows the variation of the height H1 of each turn of the coil at its maximum line width with respect to θ when b is 8 μm. Referring to Table 2, when b is 8 μm, within the range of θ being greater than or equal to 87.7° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0073] Table 2

[0074] 83 4 33 33 84 4 38 38 85 4 46 46 86 4 57 57 87.7 4 100 100 88 4 115 115 89 4 229 229

[0075] Table 3 shows the variation of the height H1 of each turn of the coil at its maximum line width with respect to θ when b is 10 μm. Referring to Table 3, when b is 10 μm, within the range of θ being greater than or equal to 87.2° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0076] Table 3

[0077] 83 5 41 41 84 5 48 48 85 5 57 57 86 5 72 72 87.2 5 102 102 88 5 143 143 89 5 286 286

[0078] Table 4 shows the variation of the height H1 of each turn of the coil at its maximum line width according to θ when b is 12 μm. Referring to Table 4, when b is 12 μm, within the range of θ being greater than or equal to 86.6° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0079] Table 4

[0080]

[0081]

[0082] Table 5 shows the variation of the height H1 of each turn of the coil at its maximum line width according to θ when b is 14 μm. Referring to Table 5, when b is 14 μm, within the range of θ being greater than or equal to 86.0° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0083] Table 5

[0084] 83 7 57 57 84 7 67 67 85 7 80 80 86 7 100 100 87 7 134 134 88 7 201 200 89 7 401 401

[0085] Table 6 shows the variation of the height H1 of each turn of the coil at its maximum line width according to θ when b is 16 μm. Referring to Table 6, when b is 16 μm, within the range of θ being greater than or equal to 85.5° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0086] Table 6

[0087]

[0088]

[0089] Table 7 shows the variation of the height H1 of each turn of the coil at its maximum line width according to θ when b is 18 μm. Referring to Table 7, when b is 18 μm, within the range of θ being greater than or equal to 84.9° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0090] Table 7

[0091] 83 9 74 73 84.9 9 101 101 85 9 103 103 86 9 129 129 87 9 172 172 88 9 258 258 89 9 516 516

[0092] Table 8 shows the variation of the height H1 of each turn of the coil at its maximum line width with respect to θ when b is 20 μm. Referring to Table 8, when b is 20 μm, within the range of θ being greater than or equal to 84.3° and less than or equal to 89.0°, the height H1 of each turn of the coil at its maximum line width can be greater than or equal to 100 μm, while preventing short circuits between turns.

[0093] Table 8

[0094] 83 10 82 81 84.3 10 101 100 85 10 115 114 86 10 143 143 87 10 191 191 88 10 287 286 89 10 573 573

[0095] In one example, the thickness, width, and length of an element in the coil assembly disclosed in the exemplary embodiments of this disclosure, or the distance between two points, can be measured in the cross-sectional cut surface of the body 100. The cut surface can be a cut surface that cuts the body 100 in a first direction (L direction) – third direction (T direction) plane, or a cut surface that cuts the body 100 in a first direction (L direction) – second direction (W direction) plane. When the cut surface cuts the body 100 in the first direction (L direction) – third direction (T direction) plane, the cut surface may cut the central portion of the body 100 in the second direction (W direction), and when the cut surface cuts the body 100 in the first direction (L direction) – second direction (W direction) plane, the cut surface may cut the central portion of the body 100 in the third direction (T direction). The location of the cut surface is not limited to these examples; those skilled in the art can select other locations within the body 100 if desired. If necessary, multiple measurements can be performed at different or the same locations on the cut surface, thereby obtaining the thickness, width, and length of the target feature or the distance between target points by averaging the values ​​of the multiple measurements. Optionally, the measured dimension can be the maximum or minimum value of the multiple measurements. Optionally, the measured dimension can be the value of a single measurement at a measurement area that can be set by those skilled in the art. In one example, a scanning electron microscope (SEM) may be used for the measurement, but this disclosure is not limited thereto. Other methods and / or tools understood by those skilled in the art may be used even if not described in this disclosure.

[0096] An insulating layer IF may be disposed between the coil portion 300 and the body 100, and between the support substrate 200 and the body 100. The insulating layer IF may be formed along the surface of the support substrate 200 on which coil patterns 311 and 312 and lead-out patterns 331 and 332 of the coil portion 300 are formed. For example, the insulating layer IF may extend along the surface of the support substrate 200 on which the lead-out patterns 331 and 332 of the coil portion 300 are disposed. The insulating layer IF may be configured to insulate the coil portion 300 and the body 100, and may include known insulating materials such as parylene, but this disclosure is not limited thereto. As another example, the insulating layer IF may include insulating materials other than parylene, such as epoxy resin. The insulating layer IF may be formed by vapor deposition, but this disclosure is not limited thereto. As another example, the insulating layer IF may be formed by stacking and curing insulating films for forming the insulating layer IF on both surfaces of the support substrate 200 on which the coil portion 300 is formed. Alternatively, the insulating layer IF can be formed by coating and curing an insulating paste for forming the insulating layer IF onto both surfaces of the support substrate 200 on which the coil portion 300 is formed. The insulating layer IF can be formed to fill the space between the turns of the coil portion 300.

[0097] The first external electrode 400 and the second external electrode 500 may be disposed on the body 100 at intervals from each other. For example, the first external electrode 400 and the second external electrode 500 may be disposed on the sixth surface 106 of the body 100 at intervals from each other. In this embodiment, the first external electrode 400 and the second external electrode 500 may respectively cover the first surface 101 and the second surface 102 of the body 100, and may extend to at least a portion of each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100. Specifically, the first external electrode 400 may cover the first surface 101 of the body 100 to contact and connect with the first lead-out pattern 331 exposed on the first surface 101 of the body 100, and may extend from the first surface 101 of the body 100 to at least a portion of each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100. The second external electrode 500 may cover the second surface 102 of the body 100 to contact and connect with the second lead-out pattern 332 exposed on the second surface 102 of the body 100, and may extend from the second surface 102 of the body 100 to at least a portion of each of the third surface 103, the fourth surface 104, the fifth surface 105 and the sixth surface 106 of the body 100. Figure 1The shapes of the first external electrode 400 and the second external electrode 500 shown are merely exemplary, and this disclosure is not limited thereto. As an example, the first external electrode 400 may cover at least a portion of the first surface 101 of the body 100 to contact the first lead-out pattern 331, and may have a shape extending only to a sixth surface among the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100, for example, an "L" shape. Alternatively, the first external electrode 400 may cover at least a portion of the first surface 101 of the body 100 to contact the first lead-out pattern 331, and may have a shape extending only to the fifth surface 105 and the sixth surface 106 among the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100, for example, a "[" shape.

[0098] External electrodes 400 and 500 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but this disclosure is not limited thereto. Each of external electrodes 400 and 500 may be formed in a single-layer or multi-layer structure. For example, the first external electrode 400 may include a first layer disposed on the body 100 and a second layer disposed on the first layer. The first layer may be a copper (Cu) plating or a conductive resin layer. The conductive resin layer may be formed by coating a conductive paste comprising conductive powder particles of copper (Cu) and / or silver (Ag) dispersed in a resin, and then curing the coated conductive paste. The second layer may include nickel (Ni) and tin (Sn). The second layer may include, for example, a nickel plating disposed on the first layer and comprising nickel (Ni) and a tin plating disposed on the nickel plating and comprising tin (Sn). However, this disclosure is not limited thereto.

[0099] Figure 5 It is shown Figure 3 A schematic enlarged view of another example of the “A” part.

[0100] Reference Figure 5 In another embodiment, the coil portion 300 may include a conductive thin film 300A, a conductive pattern layer 300B, and an upper conductive layer 300C. The upper conductive layer 300C may be disposed on the conductive pattern layer 300B to cover at least a portion of the side surface of the conductive pattern layer 300B, and may be spaced apart from the support substrate 200 to expose the side surface of the conductive thin film 300A.

[0101] As a result, in this embodiment, the contour of each turn is formed only with the surface of the conductive layer 300C. Figure 4Unlike the above embodiments, the outline of each turn may include a combination of the surface of the conductive thin film 300A, the surface of the conductive pattern layer 300B, and the surface of the upper conductive layer 300C. For example, the areas of the two side surfaces of the conductive thin film 300A and the two side surfaces of the conductive pattern layer 300B that are not covered by the upper conductive layer 300C may form the outline of each turn in this embodiment together with the surface of the upper conductive layer 300C.

[0102] In this embodiment, points P1 and P2 can be defined as follows: P1 is one of two points formed by bringing the two side surfaces of the conductive film 300A of the first turn 311-1 into contact with the support substrate 200 (based on...). Figure 5 The point P2 (located on the right) is the point closer to point P1 of the two points formed by bringing the two side surfaces of the conductive film 300A of the second turn 311-2 adjacent to the first turn 311-1 into contact with the support substrate 200. Figure 5 (The direction is located at the point on the left). Point P3, the first virtual line segment L1, the second virtual line segment L2, and the length "a" of the first virtual line segment L1 and the length "b" of the second virtual line segment L2 can be... Figure 4 The same method is defined as described in the above embodiments, therefore, its description will be omitted.

[0103] and Figure 4 Unlike the above embodiments, in this embodiment, the upper conductive layer 300C may be configured on the conductive pattern layer 300B to cover at least a portion of the side surface of the conductive pattern layer 300B and expose the side surface of the conductive film 300A. As a result, compared to... Figure 4 Unlike the above embodiments, in this embodiment, the insulating layer IF can contact at least a portion of the side surface of each of the conductive thin film 300A and the conductive pattern layer 300B.

[0104] Figure 6 It is shown Figure 3 A schematic enlarged view of another example of the “A” part. Figure 7 It is shown Figure 3 A schematic enlarged view of another example of the “A” part.

[0105] Reference Figure 4 and Figure 6 ,and Figure 4 Compared to the embodiments shown, it is applied to Figure 6 The coil portion 300 in the illustrated embodiment may further include a conductive surface layer 300D. (See also...) Figure 5 and Figure 7 ,and Figure 5 Compared to the embodiments shown, it is applied to Figure 7 The coil portion 300 of the embodiment shown may further include a conductive surface layer 300D. Therefore, when describing... Figure 6 and Figure 7 In the embodiments shown, only information regarding the conductive surface layer 300D (and) will be provided. Figure 4 and Figure 5 A detailed description of the differences between the embodiments shown. This can be achieved through application... Figure 4 The embodiments shown are described in the following description. Figure 6 The elements shown, except for the conductive surface layer 300D, can be applied... Figure 5 The embodiments shown are described in the following description. Figure 7 The elements shown, except for the conductive surface layer 300D, are all other elements; therefore, details regarding them will be omitted. Figure 6 Other elements and Figure 7 Description of other elements.

[0106] Reference Figure 6 and Figure 7 , applied to Figure 6 and Figure 7 Each of the coil portions 300 in the illustrated embodiment may include a conductive thin film 300A, a conductive pattern layer 300B, and an upper conductive layer 300C, and may also include a conductive surface layer 300D. The conductive surface layer 300D may be disposed on the conductive pattern layer 300B and may cover the side surfaces of the conductive thin film 300A and the conductive pattern layer 300B to contact the support substrate 200. In this embodiment, the upper conductive layer 300C may be disposed on the conductive surface layer 300D and may cover at least a portion of the side surfaces of the conductive surface layer 300D.

[0107] The conductive surface layer 300D can be formed by electroplating using a conductive pattern layer 300B as a seed layer. The conductive surface layer 300D may have an isotropic shape with substantially the same thickness (vertical dimension) in the region disposed on the upper surface of the conductive pattern layer 300B and the same thickness (horizontal dimension) in the region disposed on the side surface of the conductive pattern layer 300B. The isotropic shape of the conductive surface layer 300D can be achieved by performing an isotropic plating process using the conductive pattern layer 300B as a seed layer, but this disclosure is not limited thereto. When the conductive surface layer 300D is formed by isotropic plating, the spacing between the conductive pattern layers 300B of adjacent turns can be reduced using the conductive surface layer 300D to increase the volume of the coil portion 300. Furthermore, when the conductive surface layer 300D is formed by isotropic plating, the conductive surface layer 300D can also be formed on the upper surface of the conductive pattern layer 300B, such that the seed structure used to form the upper conductive layer 300C can be formed to have a relatively large height compared to the case where the conductive surface layer 300D is absent. As a result, the final coil structure including the upper conductive layer 300C can have a relatively large height compared to the case where the conductive surface layer 300D is absent. The conductive surface layer 300D may include at least one of, for example, copper (Cu), aluminum (Al), silver (Ag), gold (Au), tin (Sn), molybdenum (Mo), nickel (Ni), titanium (Ti), and chromium (Cr).

[0108] exist Figure 6 In the illustrated embodiment, the upper conductive layer 300C may cover the entire side surface of the conductive surface layer 300D to contact the support substrate 200. Figure 7 In the embodiment shown, the upper conductive layer 300C may be spaced apart from the support substrate 200 to expose at least a portion of the side surface of the conductive surface layer 300D.

[0109] exist Figure 6 In the embodiment shown, the outline of each turn of the coil portion 300 may only include the surface of the upper conductive layer 300C. Figure 7 In the embodiment shown, the outline of each turn of the coil portion 300 may include a combination of the areas of the two side surfaces of the conductive surface layer 300D that are not covered by the upper conductive layer 300C and the surface of the upper conductive layer 300C.

[0110] As described above, when the coil is formed by the plating process, the plating growth angle of the plating layer can be controlled so that the coil portion has a height greater than or equal to 100 μm.

[0111] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and changes may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: main body; A support substrate is disposed in the main body; The coil portion has at least one turn located on the surface of the support substrate; as well as The first and second external electrodes are disposed on the main body at a distance from each other, and are respectively connected to the coil portion. Where 100μm≤0.5×b×tanθ, In a cross-section perpendicular to the surface of the support substrate, "P1" is the point closer to the adjacent second turn among the points where the outline of the first turn of the coil intersects the surface of the support substrate; "P2" is the point closer to point P1 among the points where the outline of the second turn intersects the surface of the support substrate; "P3" is the point closer to the second turn on the outline of the first turn among the points where the first turn has the maximum line width; a first virtual line segment connects points P1 and P3 to each other; "b" is the length of the second virtual line segment connecting points P1 and P2 to each other; and "θ" is the angle defined by the first virtual line segment and the second virtual line segment. Among them, the angle "θ" is greater than or equal to 84.3° and less than or equal to 89.0°.

2. The coil assembly according to claim 1, wherein, The coil portion includes: a conductive thin film disposed on the support substrate; a conductive pattern layer disposed on the conductive thin film and spaced apart from the support substrate; and an upper conductive layer disposed on the conductive pattern layer to cover at least a portion of the side surface of the conductive pattern layer. In a cross-section perpendicular to the surface of the supporting substrate, the thickness of the region of the upper conductive layer disposed on the upper surface of the conductive pattern layer is greater than the thickness of the region of the upper conductive layer disposed on the side surface of the conductive pattern layer.

3. The coil assembly according to claim 2, wherein, The upper conductive layer covers the side surfaces of each of the conductive thin film and the conductive pattern layer, and is in contact with the supporting substrate.

4. The coil assembly according to claim 2, wherein, The upper conductive layer is spaced apart from the supporting substrate so that at least a portion of the side surface of the conductive film is exposed.

5. The coil assembly according to claim 1, wherein, The coil portion includes: a conductive thin film disposed on the support substrate; a conductive pattern layer disposed on the conductive thin film and spaced apart from the support substrate; a conductive surface layer covering the surface of the conductive pattern layer; and an upper conductive layer disposed on the conductive surface layer to cover at least a portion of the side surface of the conductive surface layer. In a cross-section perpendicular to the surface of the supporting substrate, the thickness of the region of the upper conductive layer disposed on the upper surface of the conductive surface layer is greater than the thickness of the region of the upper conductive layer disposed on the side surface of the conductive surface layer.

6. The coil assembly according to claim 5, wherein, The conductive surface layer covers the side surfaces of each of the conductive thin film and the conductive pattern layer to contact the supporting substrate.

7. The coil assembly according to claim 6, wherein, The upper conductive layer is in contact with the supporting substrate.

8. The coil assembly according to claim 5, wherein, The upper conductive layer is spaced apart from the supporting substrate so that at least a portion of the side surface of the conductive surface layer is exposed.

9. A coil assembly, comprising: main body; A support substrate is disposed in the main body; The coil portion has at least one turn located on the surface of the support substrate; as well as The first and second external electrodes are disposed on the main body at a distance from each other, and are respectively connected to the coil portion. Where 100μm≤0.5×b×tanθ, In a cross-section perpendicular to the surface of the support substrate, "P1" is the point closer to the adjacent second turn among the points where the outline of the first turn of the coil intersects the surface of the support substrate; "P2" is the point closer to point P1 among the points where the outline of the second turn intersects the surface of the support substrate; "P3" is the point closer to the second turn on the outline of the first turn among the points where the first turn has the maximum line width; a first virtual line segment connects points P1 and P3 to each other; "b" is the length of the second virtual line segment connecting points P1 and P2 to each other; and "θ" is the angle defined by the first virtual line segment and the second virtual line segment. The length "b" is greater than or equal to 6μm and less than or equal to 20μm.

10. The coil assembly according to claim 9, wherein, Angle "θ" is greater than or equal to 85.5° and less than or equal to 87.2°.

11. A coil assembly, comprising: main body; A support substrate is disposed in the main body; The coil portion has at least one turn located on the surface of the support substrate; as well as The first and second external electrodes are disposed on the main body at a distance from each other, and are respectively connected to the coil portion. Wherein, the side surface of at least one turn of the coil portion forms an angle of less than 90° with the surface of the supporting substrate. The coil portion includes: a conductive thin film disposed on the support substrate; a conductive pattern layer disposed on the conductive thin film and spaced apart from the support substrate; a conductive surface layer covering the surface of the conductive pattern layer; and an upper conductive layer disposed on the conductive pattern layer to cover at least a portion of the side surface of the conductive pattern layer. In a cross-section perpendicular to the surface of the supporting substrate, the conductive surface layer has an isotropic shape with the same thickness in the region disposed on the upper surface of the conductive pattern layer and the same thickness in the region disposed on the side surface of the conductive pattern layer. The conductive surface layer contacts the side surface of each of the conductive thin film and the conductive pattern layer.

12. The coil assembly according to claim 11, wherein, The thickness of the conductive film is less than or equal to 5 μm.

13. The coil assembly of claim 11, wherein, In a cross-section perpendicular to the surface of the supporting substrate, the thickness of the region of the upper conductive layer disposed on the upper surface of the conductive pattern layer is greater than the thickness of the region of the upper conductive layer disposed on the side surface of the conductive pattern layer.

14. The coil assembly of claim 11, wherein, The upper conductive layer covers the side surfaces of each of the conductive thin film and the conductive pattern layer, and is in contact with the supporting substrate.

15. The coil assembly of claim 11, wherein, The conductive surface layer is disposed between the upper conductive layer and the conductive pattern layer, and The conductive surface layer is in contact with the supporting substrate.

16. The coil assembly of claim 15, wherein, The upper conductive layer covers at least a portion of the side surface of the conductive surface layer, and In a cross-section perpendicular to the surface of the supporting substrate, the thickness of the region of the upper conductive layer disposed on the upper surface of the conductive surface layer is greater than the thickness of the region of the upper conductive layer disposed on the side surface of the conductive surface layer.

17. The coil assembly of claim 16, wherein, The upper conductive layer extends along the entire side surface of the conductive surface layer and contacts the supporting substrate.

18. The coil assembly of claim 11, wherein, The upper surface of the conductive pattern layer is a substantially flat surface, and the upper surface of the upper conductive layer is a curved surface.

19. The coil assembly according to any one of claims 11-18, further comprising an insulating layer disposed between the coil portion and the body and between the support substrate and the body. in, The insulating layer extends along the surface of the support substrate where the lead-out pattern of the coil portion is disposed. The lead-out pattern is located at opposite ends of the coil portion and exposed from the body to connect to the first external electrode and the second external electrode. The insulating layer is configured to fill the space between adjacent turns of the coil portion.

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