Display device

Abstract

A display device according to an embodiment of the present invention includes a substrate on which a plurality of light emitting elements are provided, a plurality of lines provided on an upper surface of the substrate, a plurality of upper pads provided on the upper surface of the substrate and connected to the plurality of lines, a plurality of link lines provided on a lower surface of the substrate, a plurality of lower pads provided on the lower surface of the substrate and connected to the plurality of link lines, and a plurality of side lines connecting the plurality of upper pads to the plurality of lower pads, wherein the plurality of side lines include a plurality of first side lines and a plurality of second side lines, and the plurality of first side lines and the plurality of second side lines are provided on different layers.

Description

Technical Field

[0001] The present invention relates to display devices, and more specifically, to display devices capable of ensuring the arrangement space of side lines and preventing migration phenomena in the side lines. Background Technology

[0002] Liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs), which have been widely used to date, are gradually expanding their application scope.

[0003] Due to their ability to provide high-resolution screens and the advantages of allowing for thinner designs and reduced weight, liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs) are widely used in the screens of common electronic devices such as mobile phones and laptops, and their applications are gradually expanding.

[0004] However, in both liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs), there are limitations on reducing the size of the bezel area visible to the user—the area in the display device where no image is displayed. For example, in the case of LCDs, the need for sealants to seal the liquid crystal and to bond the upper and lower substrates limits the size of the bezel area. Similarly, in OLEDs, the organic light-emitting elements are formed of organic materials and are highly susceptible to moisture and oxygen, requiring encapsulation to protect them, thus limiting the size of the bezel area. In particular, since ultra-large screens cannot be implemented as a single panel, when multiple LCD panels or multiple OLED panels are arranged in a tiled pattern to achieve an ultra-large screen, the user may be able to see the bezel area between adjacent panels.

[0005] As an alternative, display devices incorporating LEDs have been proposed. Because LEDs are formed from inorganic materials rather than organic materials, they offer superior reliability and a longer lifespan compared to liquid crystal displays or organic light-emitting diode displays. Furthermore, LEDs are suitable for use in ultra-large screens due to their fast illumination speed, low power consumption, excellent stability resulting from strong shock resistance, and ability to display high-brightness images.

[0006] Therefore, LED components are commonly used in display devices to provide ultra-large screens that minimize bezel areas. Summary of the Invention

[0007] Technical issues

[0008] The inventors of this invention have recognized that, due to the superior luminous efficiency of LEDs compared to organic light-emitting elements (OLEDs), the size of a pixel—that is, the size of the light-emitting area that needs to emit light of the same brightness—is much smaller in the case of a display device including LEDs compared to a display device using OLEDs. Therefore, the inventors of this invention have recognized that, when a display device is implemented using LEDs, the distance between the light-emitting areas of adjacent pixels is much greater than the distance between the light-emitting areas of adjacent pixels in an OLED display device with the same resolution. Therefore, the inventors of this invention have recognized that, when a tiled display is implemented by arranging multiple display panels in a tiled configuration, since the spacing between the LEDs located at the outermost edge of a display panel and the LEDs located at the outermost edge of another display panel adjacent to that display panel can be made the same as the spacing between LEDs located within a single display panel, a zero-bezel configuration, essentially devoid of bezel areas, can be achieved. However, as described above, in order to make the spacing between the LEDs located at the outermost edge of a display panel and the LEDs located at the outermost edge of another display panel adjacent to that display panel the same as the spacing between LEDs located within a single display panel, various drivers, such as gate drivers and data drivers, previously positioned on the upper surface of the display panel, need to be positioned on the lower surface of the display panel instead of the upper surface.

[0009] Therefore, the inventors of this invention have invented a display device with a novel structure in which elements such as thin-film transistors and LEDs are disposed on the upper surface of the display panel, and drivers such as gate drivers and data drivers are disposed on the lower surface of the display panel. Furthermore, the inventors of this invention have invented a manufacturing technique in which side lines are formed on the side surfaces of the display panel to connect the elements disposed on the upper surface of the display panel and the drivers disposed on the lower surface of the display panel. Specifically, side lines are formed on the display panel using printed pads. Therefore, by using small-sized printed pads and performing multiple printing operations, side lines can be formed on a large-area display panel without limiting the size of the display panel.

[0010] However, the inventors of this invention have recognized that line design space becomes a problem in display devices having the structure described above. The technique described above for forming side lines using printed pads is a method of printing side lines using printed pads: after forming an etched gravure pattern in a metal plate mold, conductive paste is filled into the gravure pattern, and after applying the filled conductive paste to the printed pads, the side lines are printed using the printed pads. However, when performing the etching process using photoresist to form the gravure pattern, a problem exists where the gap between the gravure patterns may not be excessively narrowed due to the process margin of the etching process. Furthermore, when using the maximum margin to reduce the gap between the gravure patterns to a few micrometers, the following problems may occur: the conductive paste may not be properly filled into the gravure pattern, or the conductive paste may remain in the gravure pattern. Therefore, for process stability, it is necessary to ensure the gap between the gravure patterns, for example, ensuring a gap of approximately 50 μm or greater.

[0011] Furthermore, due to the need for high resolution in the display panel, the number of light-emitting elements per unit area of ​​the display device increases. Consequently, the number of lines used to transmit signals to the light-emitting elements also increases. Therefore, although the number of lines to be arranged in a predetermined space increases, there are limitations in reducing the spacing between side lines.

[0012] Meanwhile, the inventors of this invention have recognized the problem of migration that can occur between adjacent side lines. Migration occurs when moisture is present and a potential difference exists between two adjacent electrodes or lines, causing metal ions to move from one electrode or line to another via an electrochemical reaction, thus electrically connecting the two adjacent electrodes or lines. In other words, when a potential difference is formed between adjacent side lines over a long period during the operation of a display device, the problem can occur where metal ions constituting the side lines move from one side line to another, and adjacent side lines become electrically connected. In particular, when the resolution of the display device is high, the migration problem described above may be exacerbated due to the increased number of side lines and the reduced spacing between them.

[0013] Therefore, the inventors of this invention have invented a display device having a novel structure that can increase the number of side lines that can be set in a predetermined space and ensure the spacing between the side lines.

[0014] Therefore, the objective of this invention is to provide a display device that can increase the number of side lines provided in a limited space by providing side lines in a double-layer structure.

[0015] Another objective of this invention is to provide a display device in which side lines are disposed on different layers, thereby increasing the spacing between the lines.

[0016] Another objective of this invention is to provide a display device that can extend the line width of the side lines provided on the display device.

[0017] The purpose of this disclosure is not limited to the purposes mentioned above, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0018] Technical solution

[0019] A display device according to an exemplary embodiment of the present invention includes: a substrate on which a plurality of light-emitting elements are disposed; a plurality of lines disposed on an upper surface of the substrate; a plurality of connecting lines disposed on a lower surface of the substrate; and a plurality of side lines connecting the plurality of lines and the plurality of connecting lines, wherein the plurality of side lines include a plurality of first side lines and a plurality of second side lines, wherein the plurality of first side lines and the plurality of second side lines are disposed on different layers.

[0020] A display device according to an exemplary embodiment of the present invention includes: a substrate on which a plurality of light-emitting elements are disposed; a plurality of first lines and a plurality of second lines disposed on an upper surface of the substrate; a plurality of first upper pads and a plurality of second upper pads disposed on the upper surface of the substrate and connected to the plurality of first lines and the plurality of second lines; a plurality of first connecting lines and a plurality of second connecting lines disposed on a lower surface of the substrate; a plurality of first lower pads and a plurality of second lower pads disposed on the lower surface of the substrate and connected to the plurality of first connecting lines and the plurality of second connecting lines; a plurality of first side lines connecting the plurality of first upper pads and the plurality of first lower pads; a first insulating layer disposed to cover the plurality of first side lines; and a plurality of second side lines connecting the plurality of second upper pads and the plurality of second lower pads and disposed on the first insulating layer.

[0021] Further details of the exemplary implementation are included in the detailed implementation and the accompanying drawings.

[0022] Beneficial effects

[0023] According to the present invention, the number of side lines can be increased by setting the side lines on different layers.

[0024] According to the present invention, by setting the side lines on different layers, the spacing between the side lines can be increased, and migration that may occur in the side lines can be prevented.

[0025] According to the present invention, the voltage drop that may occur in the display device can be reduced by increasing the width of the side lines.

[0026] The effects of the present invention are not limited to the foregoing, and include a variety of other effects. Attached Figure Description

[0027] Figure 1 This is a schematic top view of a display device according to an exemplary embodiment of the present invention.

[0028] Figure 2 yes Figure 1 A schematic enlarged plan view of region A.

[0029] Figure 3 It is along Figure 1 The cross-sectional view taken from line III-III'.

[0030] Figure 4 This is an enlarged plan view of a display device according to another exemplary embodiment of the present invention.

[0031] Figure 5 This is an enlarged plan view of a display device according to yet another exemplary embodiment of the present invention.

[0032] Figure 6 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present invention.

[0033] Figure 7 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present invention.

[0034] Figure 8 This is a cross-sectional view of a display device according to another exemplary embodiment of the present invention. Detailed Implementation

[0035] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the following detailed description of exemplary embodiments and the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only to enable those skilled in the art to fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0036] The shapes, dimensions, ratios, angles, numbers, etc., shown in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Unless terms such as “comprising,” “having,” and “consisting of” are used herein in conjunction with the term “only,” these terms generally imply that additional components are permissible. Unless otherwise expressly stated, any reference to the singular also includes the plural.

[0037] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0038] When using terms such as “on top of,” “above,” “below,” or “beside” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts unless these terms are used with the terms “immediately following” or “directly.”

[0039] When an element or layer is placed "on" another element or layer, the additional layer or element may be placed directly on or between the other element.

[0040] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of this disclosure, the first component referred to below can be the second component.

[0041] Throughout the specification, similar reference numerals generally denote similar elements.

[0042] For ease of description, the dimensions and thicknesses of the components shown in the accompanying drawings are illustrated, but this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0043] Features of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole and may be interlocked and operated in various technical ways, and the embodiments may be performed independently or in relation to each other.

[0044] Various exemplary embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0045] Figure 1 This is a schematic top view of a display device according to an exemplary embodiment of the present invention.

[0046] Reference Figure 1 LEDs 130, which function as light-emitting elements, are disposed in each of the unit pixels P of the display device 100. Although the use of LEDs 130 as light-emitting elements has been described herein, the invention is not limited thereto, and organic light-emitting elements, quantum dot elements, etc., may also be used.

[0047] LED130 includes a first LED131 and a second LED132. The first LED131 and the second LED132 are arranged in a line within a unit pixel P of the substrate 110, and the first LED131 and the second LED132 are arranged adjacent to each other.

[0048] The first LED 131 is disposed in the first row of unit pixel P. The first LED 131 is composed of elements that emit light of different colors. For example, the first LED 131 includes a first red LED 131R, a first green LED 131G, and a first blue LED 131B.

[0049] The second LED 132 is disposed in the second row of unit pixel P. The second LED 132 is composed of elements that emit light of the same color as the first LED 131. For example, the second LED 132 includes a second red LED 132R, a second green LED 132G, and a second blue LED 132B. However, the invention is not limited thereto, and the first LED 131 and the second LED 132 may also include white LEDs for realizing white sub-pixels. Furthermore, the type and number of LEDs constituting the first LED 131 and the second LED 132 may be configured differently depending on the embodiment.

[0050] The plurality of LEDs 130 disposed in the display device 100 may be spaced apart from each other at different intervals. For example, a plurality of unit pixels P include a plurality of first LEDs 131 and a plurality of second LEDs 132 arranged side by side in two lines, and in each unit pixel P, the first LEDs 131 and the second LEDs 132 are spaced apart at the same interval. However, the interval between the first LEDs 131 and the second LEDs 132 disposed at the boundary of the unit pixel P may be different from the interval between the first LEDs 131 and the second LEDs 132 disposed within the unit pixel P. However, this is not a limitation, and each of the first LEDs 131 and the second LEDs 132 may be disposed at the same interval from each other throughout the entire area of ​​the display device 100.

[0051] The plurality of first LEDs 131 and the plurality of second LEDs 132 can be driven by different thin-film transistors. Furthermore, among the plurality of first LEDs 131 and the plurality of second LEDs 132, the first LEDs 131 and the second LEDs 132 that emit light of the same color can be driven by different gate lines and data lines.

[0052] The first LED 131 can be a main LED, while the second LED 132 can be a redundant LED. That is, the second LED 132 operates when a defect occurs in the first LED 131 of a specific unit pixel, thereby improving the reliability of the display device 100. However, the present invention is not limited thereto, and both the first LED 131 and the second LED 132 of the light-emitting display device 100 can be main LEDs that emit light when displaying an image.

[0053] Furthermore, when a tiled display is implemented using the display device 100 according to an exemplary embodiment of the present invention, since the spacing between the outermost LED 130 of one display panel and the outermost LED 130 of the adjacent display panel can be implemented to be the same as the spacing between LEDs 130 in one display panel, a zero-bezel area that is essentially non-existent can be achieved. Therefore, it can be described that the display device 100 is defined to have only a display area, and no non-display area is defined in the display device 100.

[0054] Figure 2 yes Figure 1 A schematic enlarged plan view of region A in the diagram. Figure 3 It is along Figure 1 The cross-sectional view taken from line III-III'. (Refer to...) Figure 2 and Figure 3 The display device 100 includes a substrate 110, an LED 130, a thin-film transistor 120, multiple pads 180, multiple lines 160, multiple connecting lines, multiple insulating layers, and multiple side lines 150. Figure 2 For ease of explanation, only the upper pad 180T, line 160, substrate 110, first insulating layer 171, and side line 150 are shown among the various components of the display device 100.

[0055] First, refer to Figure 3 The substrate 110 includes a first substrate 111 and a second substrate 112. The first substrate 111 is a substrate supporting a component disposed on the upper part of the display device 100, and may be an insulating substrate. For example, the first substrate 111 may be formed of glass or resin. Furthermore, the first substrate 111 may be formed comprising a polymer or plastic. In some embodiments, the first substrate 111 may be formed of a flexible plastic material. Furthermore, although in... Figure 3 The middle substrate 110 is described as having a structure comprising two substrates, but the invention is not limited thereto, and the substrate 110 may be configured as a single substrate.

[0056] LED 130, upper pad 180T, line 160, and thin-film transistor 120 are disposed on the first substrate 111. Hereinafter, the display device 100 is described as a top-emitting type display device, but is not limited thereto.

[0057] Reference Figure 3 A thin-film transistor 120 is disposed on a first substrate 111. The thin-film transistor 120 is shown as a thin-film transistor with a bottom gate structure, in which a gate electrode 121 is disposed at the bottom, an active layer 122 is disposed on the gate electrode 121, and a source electrode 123 and a drain electrode 124 are disposed on the active layer 122, but is not limited thereto.

[0058] A passivation layer 114 for protecting the thin-film transistor 120 is disposed on the source electrode 123 and the drain electrode 124. However, in some embodiments, the passivation layer 114 may be omitted.

[0059] A common line CL is disposed on the gate insulating layer 113. The common line CL is a line used to apply a common voltage to the LED 130 and can be configured to be spaced apart from the gate line or data line. The common line CL can be formed of the same material as the source electrode 123 and drain electrode 124 or multiple lines, but is not limited thereto.

[0060] A reflective layer 143 is disposed on the passivation layer 114 in the display area. The reflective layer 143 is a layer for reflecting light emitted from the LED 130 toward the first substrate 111 toward the top of the display device 100, thereby emitting light to the outside of the display device 100. The reflective layer 143 may be formed of a metallic material with high reflectivity.

[0061] An adhesive layer 115 is disposed on the reflective layer 143. The adhesive layer 115 is used to bond the LED 130 to the reflective layer 143, and can insulate the reflective layer 143, which is formed of a metallic material, from the LED 130. The adhesive layer 115 can be formed of a thermosetting material or a photocurable material, but is not limited thereto.

[0062] LED 130 is disposed on adhesive layer 115. LED 130 includes an n-type layer 133, an active layer 134, a p-type layer 135, an n-electrode 137, and a p-electrode 136. Figure 3 In the diagram, an LED with a lateral structure is shown as LED130, but the structure of LED130 is not limited to this.

[0063] An n-type layer 133 is disposed at the bottom of the LED 130. The n-type layer 133 is a layer used to provide electrons to the active layer 134, and can be formed by implanting n-type impurities into gallium nitride (GaN), but is not limited thereto.

[0064] An active layer 134 is disposed on the n-type layer 133. The active layer 134 is a light-emitting layer that emits light by combining electrons and holes, and can be formed of a nitride semiconductor such as indium gallium nitride (InGaN).

[0065] A p-type layer 135 is disposed on the active layer 134. The p-type layer 135 is a layer for injecting holes into the active layer 134, and can be formed by implanting p-type impurities into gallium nitride (GaN), but is not limited thereto.

[0066] The n-electrode 137 is disposed on the n-type layer 133. The n-electrode 137 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (TO) based transparent conductive oxide, but is not limited thereto.

[0067] The p-electrode 136 is disposed on the p-type layer 135. The p-electrode 136 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (TO) based transparent conductive oxides, but is not limited thereto. The p-electrode 136 may be formed simultaneously with the n-electrode 137 by the same process as the n-electrode 137, such as a mask process, but is not limited thereto.

[0068] A first planarization layer 116 is disposed on the thin-film transistor 120. The upper surface of the first planarization layer 116 may have a surface parallel to the first substrate 111 in areas other than the contact holes and the area where the LED 130 is disposed. Therefore, the first planarization layer 116 can planarize any steps that may occur due to components disposed beneath it. In this case, the first planarization layer 116 may be formed such that portions of the p electrode 136 and n electrode 137 of the LED 130 are exposed.

[0069] at the same time, Figure 3 The structure of LED130 shown can be applicable to both the first LED131 and the second LED132.

[0070] A first electrode 141 is disposed on the first planarization layer 116. The first electrode 141 can electrically connect the source electrode 123 of the thin-film transistor 120 to the p electrode 136 of the LED 130 through contact holes formed in the first planarization layer 116, the passivation layer 114, and the adhesive layer 115. However, it is not limited thereto; depending on the type of thin-film transistor 120, the first electrode 141 can be configured to contact the drain electrode 124 of the thin-film transistor 120.

[0071] The second electrode 142 is disposed on the first planarization layer 116. The second electrode 142 can be electrically connected to the common line CL of the LED 130 via contact holes formed in the first planarization layer 116, passivation layer 114, and adhesive layer 115. Figure 3 The present invention describes that the thin-film transistor 120 is electrically connected to the p electrode 136 and the common line CL is electrically connected to the n electrode 137, but the present invention is not limited thereto, and the thin-film transistor 120 may be electrically connected to the n electrode 137 and the common line CL may be electrically connected to the p electrode 136.

[0072] A dam layer 119 is disposed on the first electrode 141, the second electrode 142, and the first planarization layer 116. The dam layer 119 may be formed of an insulating material. In addition, the dam layer 119 may include, for example, a black material (such as black pigment) capable of blocking light in order to reduce the reflection of external light caused by the components of the display device 100.

[0073] An upper pad 180T is disposed on the first substrate 111. The upper pad 180T is one of a plurality of pads 180 disposed on the substrate 110, and may be a pad connected to the side line 150 and the line 160, transmitting signals transmitted from the side line 150 to the line 160. During the formation of the thin-film transistor 120, the upper pad 180T may be formed simultaneously with the thin-film transistor 120, and may be formed, for example, from the same material as one of the components of the thin-film transistor 120. Furthermore, the upper pad 180T may be formed from, for example, the same material as the gate electrode 121 of the thin-film transistor 120, but is not limited thereto.

[0074] A first planarization layer 116 is disposed on the upper pad 180T. The upper surface of the first planarization layer 116 may have a surface parallel to the first substrate 111 in areas other than the contact holes. Therefore, the first planarization layer 116 can planarize any steps that may occur due to components disposed beneath it. In this case, the first planarization layer 116 may be formed such that a portion of the upper pad 180T is open.

[0075] Reference Figure 2 and Figure 3 The upper pad 180T includes the first upper pad 180T1 and the second upper pad 180T2.

[0076] The first upper pad 180T1 can be positioned closer to the outside of the substrate 110 than the second upper pad 180T2. The first upper pad 180T1 can be connected to the first side line 151 through a contact hole formed in the first planarization layer 116.

[0077] The second upper pad 180T2 can be disposed on the same layer as the first upper pad 180T1. The second upper pad 180T2 can be disposed closer to the center of the substrate 110 than the first upper pad 180T1. That is, the second upper pad 180T2 can be disposed inward compared to the first upper pad 180T1. The second upper pad 180T2 can be connected to the second side line 152 through a contact hole. The second upper pad 180T2 can be formed of the same material as the first upper pad 180T1, but is not limited thereto.

[0078] Reference Figure 2Line 160 is disposed on the first substrate 111. Line 160 may be a line configured to drive the display device 100. The display device 100 may include various circuits and light-emitting elements, and the driver is configured to drive the various circuits and light-emitting elements. Therefore, line 160 may be a line configured to provide a signal applied from the driver to each of the unit pixels P. For example, line 160 may be various lines, such as data lines, gate lines, high-potential power lines, low-potential power lines, reference voltage lines, light-emitting signal lines, etc.

[0079] Line 160 can be formed of the same material as the components of thin-film transistor 120 and formed on the same layer as the components of thin-film transistor 120. For example, line 160 can be formed of the same material as gate electrode 121 and formed on the same layer as gate electrode 121, or it can be formed of the same material as source electrode 123 and drain electrode 124 and formed on the same layer as source electrode 123 and drain electrode 124, but these are not limited to these. Furthermore, line 160 can be formed of the same material as upper pad 180T and disposed on the same layer as upper pad 180T. Additionally, line 160 can be integrally formed with upper pad 180T.

[0080] Line 160 includes a first line 161 and a second line 162. The first line 161 is a line connected to a first upper pad 180T1 in the upper pad 180T, and the second line 162 is a line connected to a second upper pad 180T2 in the upper pad 180T. The first line 161 and the second line 162 may be formed of the same material and disposed on the same layer, but are not limited thereto, and the first line 161 and the second line 162 may be formed of different materials and disposed on different layers.

[0081] The second substrate 112 is a substrate that supports components disposed below it, and may be an insulating substrate. For example, the second substrate 112 may be formed of glass or resin. Furthermore, the second substrate 112 may be formed to include polymers or plastics. The second substrate 112 may be formed of the same material as the first substrate 111. In some embodiments, the second substrate 112 may be formed of a flexible plastic material. Drivers, lower pads 180B, and interconnects are disposed on the lower surface of the second substrate 112.

[0082] A driver for driving the LED 130 of the display device 100 can be disposed on the lower surface of the second substrate 112. For example, a gate driver, a data driver, a timing controller, etc., can be disposed on the lower surface of the second substrate 112, but the present invention is not limited thereto. The driver can be formed directly on the lower surface of the second substrate 112, can be disposed on the lower surface of the second substrate 112 by a chip-on-film (COF) method, or can be disposed on the lower surface of the second substrate 112 by a method of disposing of it on a printed circuit board (PCB), but is not limited thereto.

[0083] The lower pad 180B is disposed on the lower surface of the second substrate 112. The lower pad 180B is one of a plurality of pads 180 disposed below the substrate 110, and the lower pad 180B may be a pad connected to the side line 150 and the link line and transmitting signals transmitted from the link line to the side line 150.

[0084] A second planarization layer 117 is disposed on the lower pad 180B. One surface of the second planarization layer 117 may have a surface parallel to the second substrate 112 in a region other than the contact holes. Therefore, the second planarization layer 117 can planarize any steps that may occur due to components disposed beneath it. In this case, the second planarization layer 117 may be formed such that a portion of the lower pad 180B is open.

[0085] The lower pad 180B includes a first lower pad 180B1 and a second lower pad 180B2.

[0086] The first lower pad 180B1 can be positioned closer to the outside of the substrate 110 than the second lower pad 180B2. The first lower pad 180B1 can be connected to the first side line 151 through a contact hole formed in the second planarization layer 117.

[0087] The second lower pad 180B2 can be disposed on the same layer as the first lower pad 180B1. The second lower pad 180B2 can be disposed closer to the center of the substrate 110 than the first lower pad 180B1. That is, compared to the first lower pad 180B1, the second lower pad 180B2 can be disposed inward. The second lower pad 180B2 can be connected to the second side line 152 through a contact hole. The second lower pad 180B2 can be formed of the same material as the first lower pad 180B1, but is not limited thereto.

[0088] Link lines are disposed on the lower surface of the second substrate 112. Link lines can be lines used to transmit signals from a driver to line 160. For example, link lines can be lines configured to provide signals applied from a driver disposed on the lower surface of the second substrate 112 to each of the LEDs 130.

[0089] The connecting lines include a first connecting line and a second connecting line.

[0090] The first link is a line connected to the first lower pad 180B1 in the lower pad 180B, and the second link is a line connected to the second lower pad 180B2 in the lower pad 180B. The first link and the second link can be formed of the same material and disposed on the same layer, but are not limited thereto, and the first link and the second link can be formed of different materials and disposed on different layers.

[0091] Reference Figure 3 A first bonding layer 118 is disposed between the first substrate 111 and the second substrate 112. The first bonding layer 118 may be in the form of a film for bonding the first substrate 111 and the second substrate 112. The first bonding layer 118 may be formed of a material capable of bonding the first substrate 111 and the second substrate 112 by curing via various curing methods. The first bonding layer 118 may be disposed over the entire region between the first substrate 111 and the second substrate 112, or it may be disposed only over a portion of the region between the first substrate 111 and the second substrate 112.

[0092] Side lines 150 are disposed on the side surface of substrate 110. Side lines 150 can connect link lines disposed on the lower surface of substrate 110 to lines 160 disposed on the upper surface of substrate 110. For example, side lines 150 connect to an upper pad 180T disposed on the upper surface of the first substrate 111 and a lower pad 180B disposed on the lower surface of the second substrate 112, and can connect the line 160 connected to the upper pad 180T to the link line connected to the lower pad 180B. Therefore, side lines 150 allow signals applied from the driver to be applied to each LED 130.

[0093] Side line 150 can be formed by printing conductive paste using printed pads. Side line 150 can be formed from a material with high conductivity, such as silver (Ag) or copper (Cu). The width of side line 150 can be greater than the width of line 160, but is not limited thereto.

[0094] The lateral line 150 includes a first lateral line 151 and a second lateral line 152.

[0095] A first side line 151 is disposed on the upper and side surfaces of the first substrate 111 and the lower and side surfaces of the second substrate 112. The first side line 151 can be configured to contact the first upper pad 180T1 through a contact hole formed in the first planarization layer 116. Furthermore, the first side line 151 can be configured to contact the first lower pad 180B1 through a contact hole formed in the second planarization layer 117. Therefore, the first side line 151 can connect the first upper pad 180T1 and the first lower pad 180B1.

[0096] A second side line 152 is disposed on the first side line 151. The second side line 152 is configured to surround the upper and side surfaces of the first substrate 111 and the lower and side surfaces of the second substrate 112. The second side line 152 may be configured to contact the second upper pad 180T2 through a contact hole formed in the first planarization layer 116. Furthermore, the second side line 152 may be configured to contact the second lower pad 180B2 through a contact hole formed in the second planarization layer 117. Therefore, the second side line 152 can connect the second upper pad 180T2 and the second lower pad 180B2. In addition, the second side line 152 may overlap with the first side line 151, the first upper pad 180T1, the second upper pad 180T2, the first lower pad 180B1, and the second lower pad 180B2.

[0097] Simultaneously, an insulating layer 170 may be disposed on the side line 150. The insulating layer 170 is a layer used to protect the side line 150 from external influences and to insulate the side line 150 from the outside. The insulating layer 170 may be formed of an insulating material. Furthermore, in order to reduce the reflection of external light caused by the side line 150, the insulating layer 170 may include, for example, a black material capable of blocking light, such as black pigment.

[0098] The insulating layer 170 includes a first insulating layer 171 and a second insulating layer 172.

[0099] A first insulating layer 171 may be disposed on a first side line 151. The first insulating layer 171 may be disposed around the first side line 151 to protect the first side line 151. A plurality of first insulating layers 171 may be disposed around a single first side line 151, or a single first insulating layer 171 may be disposed around all of the multiple first side lines 151.

[0100] The second side line 152 can be disposed on the first insulating layer 171, and the second insulating layer 172 can be disposed on the second side line 152. The second insulating layer 172 can be configured to surround the second side line 152 to protect the second side line 152. A plurality of second insulating layers 172 can be configured to surround one second side line 152, or a single second insulating layer 172 can be configured to surround all the second side lines of a plurality of second side lines 152.

[0101] In previous display devices, line design space became a problem. In these devices, side lines were formed on the side surfaces of the display panel to connect components such as thin-film transistors and LEDs on the upper surface to drivers such as gate drivers and data drivers on the lower surface. Specifically, by performing multiple printings using printed pads, side lines could be formed on large-area display panels without limiting the panel size. The technique for forming side lines using printed pads, as described above, involves printing side lines using printed pads: after forming a gravure pattern etched in a metal plate mold, conductive paste is filled into the gravure pattern, and after the filled conductive paste is applied to printed pads, the side lines are printed using the printed pads. However, when using photoresist to perform the etching process to form the gravure pattern, a problem arises: due to the process margin of the etching process, the gaps between the gravure patterns may not become excessively narrow. Furthermore, when using maximum margin to reduce the gap between gravure patterns to a few micrometers, the following problems may arise: the conductive paste may not be properly filled into the gravure pattern, or the conductive paste may remain in the gravure pattern. Therefore, for process stability, the gap between gravure patterns should be ensured, for example, a gap of approximately 50 μm or greater.

[0102] Furthermore, due to the need for high resolution in the display panel, the number of light-emitting elements per unit area of ​​the display device increases. Consequently, the number of lines used to transmit signals to the light-emitting elements also increases. Therefore, the following problem arises: despite the increase in the number of lines to be arranged within a predetermined space, there are limitations in reducing the spacing between the side lines.

[0103] Therefore, in the display device 100 according to an exemplary embodiment of the present invention, the limitation of design space can be alleviated by providing multiple side lines 150 on different layers. For example, in the case of six side lines per unit area in a conventional display device, in the display device 100 according to an exemplary embodiment of the present invention, six additional side lines 150 can be placed on top of the aforementioned six side lines 150. Therefore, the number of side lines 150 to be provided per unit area can be increased without reducing the spacing between the side lines 150. Therefore, it is not necessary to reduce the gap between the gravure patterns of the metal plate used to form the side lines 150, and the gap between the gravure patterns can be sufficiently ensured, thereby solving the problem of conductive paste not being properly filled in the gravure pattern or conductive paste remaining in the gravure pattern. Therefore, in the display device 100 according to an exemplary embodiment of the present invention, the process stability of the manufacturing process of the side lines 150 can be maintained.

[0104] Furthermore, in the display device 100 according to an exemplary embodiment of the present invention, by arranging multiple side lines 150 on different layers, the number of side lines 150 to be arranged in a predetermined space can be increased. Therefore, in the display device 100 according to an exemplary embodiment of the present invention, the number of side lines 150 arranged in the predetermined space and the number of LEDs 130 receiving signals through the side lines 150 can be increased, thereby increasing the resolution of the display device 100. Alternatively, if the resolution of the display device 100 remains constant, the type of signal provided to the LEDs 130 can be more diversified.

[0105] Figure 4 This is an enlarged plan view of a display device according to another exemplary embodiment of the present invention. (Refer to reference...) Figures 1 to 3 Compared to the described display device 100, Figure 4 The display device 400 differs only in the upper pad 480T, lower pad, line 460, link line and side line 450, and its other configurations are basically the same, so redundant descriptions will be omitted.

[0106] The upper pad 480T includes the first upper pad 480T1 and the second upper pad 480T2.

[0107] The first upper pad 480T1 can be disposed on the outside of the substrate 110. The first upper pad 480T1 can be connected to the first side line 451 through a contact hole formed in the first planarization layer 116.

[0108] The second upper pad 480T2 can be disposed on the same layer as the first upper pad 480T1. The second upper pad 480T2 can be disposed closer to the center of the substrate 110 than the first upper pad 480T1. That is, compared with the first upper pad 480T1, the second upper pad 480T2 can be disposed inward. The second upper pad 480T2 can be connected to the second side line 452 through a contact hole. The second upper pad 480T2 can be formed of the same material as the first upper pad 480T1, but is not limited thereto.

[0109] The first upper pad 480T1 and the second upper pad 480T2 can be alternately disposed on the substrate 110. That is, the second upper pad 480T2 and the first upper pad 480T1 can be disposed in a zigzag shape.

[0110] Line 460 is disposed on substrate 110. Line 460 includes a first line 461 and a second line 462. The first line 461 is a line connected to a first upper pad 480T1 in the upper pad 480T, and the second line 462 is a line connected to a second upper pad 480T2 in the upper pad 480T. The first line 461 and the second line 462 may be formed of the same material and disposed on the same layer, but are not limited thereto, and the first line 461 and the second line 462 may be formed of different materials and disposed on different layers. Furthermore, the first line 461 may be disposed between the second lines 462. That is, the first line 461 and the second line 462 may be disposed alternately on substrate 110.

[0111] The lower pads include the first lower pad and the second lower pad.

[0112] The first lower pad can be disposed on the outside of the substrate 110. The first lower pad can be connected to the first side line 451 through a contact hole formed in the second planarization layer 117.

[0113] The second lower pad can be disposed on the same layer as the first lower pad. The second lower pad can be disposed closer to the center of the substrate 110 than the first lower pad. That is, the second lower pad can be disposed inward compared to the first lower pad. The second lower pad can be connected to the second side line 452 through a contact hole. The second lower pad can be formed of the same material as the first lower pad, but is not limited thereto.

[0114] The first and second lower pads can be alternately disposed on the lower surface of the substrate 110. That is, the second lower pad and the first lower pad can be arranged in a zigzag pattern.

[0115] The connecting lines are disposed on the lower surface of the substrate 110.

[0116] The connecting lines include a first connecting line and a second connecting line.

[0117] The first link line is a line connected to a first lower pad in the lower pad, and the second link line is a line connected to a second lower pad in the lower pad. The first link line and the second link line can be formed of the same material and disposed on the same layer, but are not limited thereto; the first link line and the second link line can also be formed of different materials and disposed on different layers. Furthermore, the first link line can be disposed between the second link lines. That is, the first link line and the second link line can be alternately disposed on the lower surface of the substrate 110.

[0118] Side lines 450 are disposed on the side surface of the substrate 110. Side lines 450 include a first side line 451 and a second side line 452.

[0119] A first side line 451 is disposed on the upper surface, side surface, and lower surface of the substrate 110. The first side line 451 can be configured to contact the first upper pad 480T1 through a contact hole formed in the first planarization layer 116. Furthermore, the first side line 451 can be configured to contact the first lower pad through a contact hole formed in the second planarization layer 117. Therefore, the first side line 451 can connect the first upper pad 480T1 and the first lower pad.

[0120] A second side line 452 is disposed on the first side line 451. The second side line 452 is configured to surround the upper surface, side surface, and lower surface of the substrate 110. The second side line 452 can be configured to contact the second upper pad 480T2 through a contact hole formed in the first planarization layer 116. Furthermore, the second side line 452 can be configured to contact the second lower pad through a contact hole formed in the second planarization layer 117. Therefore, the second side line 452 can connect the second upper pad 480T2 and the second lower pad.

[0121] In this configuration, the second sideline 452 can be configured not to overlap with the first sideline 451. That is, the first sideline 451 is positioned between the second sidelines 452, such that the second sideline 452 can overlap with the second upper pad 480T2 and the second lower pad, and the first sideline 451 can overlap with the first upper pad 480T1 and the first lower pad.

[0122] In a display device 400 according to another exemplary embodiment of the present invention, the spacing between the multiple side lines 450 can be increased by arranging them on different layers. For example, in a conventional display device where six side lines are provided per unit area and all six side lines are arranged on the same layer, in the display device 400 according to another embodiment of the present invention, the multiple side lines 450 are arranged in a two-layer structure, with three first side lines 451 of the six side lines 450 arranged in the first layer and the other three second side lines 452 arranged in the second layer. Therefore, the spacing between the multiple side lines 450 can be increased compared to the case where all the side lines 450 are arranged on one layer. Therefore, in the display device 400 according to another exemplary embodiment of the present invention, migration phenomena that may occur in the multiple side lines 450 can be suppressed by increasing the distance between adjacent multiple side lines 450, thereby ensuring the reliability of the display device 400.

[0123] Figure 5 This is an enlarged plan view of a display device according to yet another exemplary embodiment of the present invention.

[0124] With reference Figures 1 to 3 Compared to the described display device 100, Figure 5The display device 500 differs only in the upper pad 580T, lower pad, line 560, link line, and side line 550, while its other configurations are basically the same. Therefore, redundant descriptions will be omitted.

[0125] The upper pad 580T includes the first upper pad 580T1 and the second upper pad 580T2.

[0126] The first upper pad 580T1 can be disposed on the outside of the substrate 110. The first upper pad 580T1 can be connected to the first side line 551 through a contact hole formed in the first planarization layer 116.

[0127] The second upper pad 580T2 can be disposed on the same layer as the first upper pad 580T1. The second upper pad 580T2 can be disposed closer to the center of the substrate 110 than the first upper pad 580T1. That is, compared with the first upper pad 580T1, the second upper pad 580T2 can be disposed inward. The second upper pad 580T2 can be connected to the second side line 552 through a contact hole. The second upper pad 580T2 can be formed of the same material as the first upper pad 580T1, but is not limited thereto.

[0128] The first upper pad 580T1 and the second upper pad 580T2 can be alternately disposed on the substrate 110. That is, the second upper pad 580T2 and the first upper pad 580T1 can be disposed in a zigzag shape.

[0129] In a display device 500 according to another exemplary embodiment of the present invention, the first upper pad 580T1 and the second upper pad 580T2 may have different sizes. For example, the width of the second upper pad 580T2 may be greater than the width of the first upper pad 580T1.

[0130] Furthermore, the separation distance of the second upper pad 580T2 can be different from the separation distance of the first upper pad 580T1. For example, the separation distance of the first upper pad 580T1 can be greater than the separation distance of the second upper pad 580T2.

[0131] Line 560 is disposed on substrate 110. Line 560 includes a first line 561 and a second line 562. The first line 561 is a line connected to a first upper pad 580T1 in the upper pad 580T, and the second line 562 is a line connected to a second upper pad 580T2 in the upper pad 580T. The first line 561 and the second line 562 may be formed of the same material and disposed on the same layer, but are not limited thereto, and the first line 561 and the second line 562 may be formed of different materials and disposed on different layers. Furthermore, they may be disposed between the first line 561 and the second line 562.

[0132] The second line 562 can be a power line for the display device 500. For example, the second line 562 can be a power line such as a high-potential power line or a low-potential power line.

[0133] In a display device 500 according to another exemplary embodiment of the present invention, the first line 561 and the second line 562 may have different dimensions. For example, the width of the second line 562 may be greater than the width of the first line 561, and the width of the second line 562 may be two or more times the width of the first line 561. Furthermore, the spacing between the second lines 562 may differ from the spacing between the first lines 561. For example, the spacing between the first lines 561 may be greater than the spacing between the second lines 562.

[0134] The lower pads include the first lower pad and the second lower pad.

[0135] The first lower pad can be disposed on the outside of the substrate 110. The first lower pad can be connected to the first side line 551 through a contact hole formed in the second planarization layer 117.

[0136] The second lower pad can be disposed on the same layer as the first lower pad. The second lower pad can be disposed closer to the center of the substrate 110 than the first lower pad. That is, the second lower pad can be disposed inward compared to the first lower pad. The second lower pad can be connected to the second side line 552 through a contact hole. The second lower pad can be formed of the same material as the first lower pad, but is not limited thereto.

[0137] The first and second lower pads can be alternately disposed on the substrate 110. That is, the second lower pad and the first lower pad can be arranged in a zigzag pattern.

[0138] In a display device 500 according to another exemplary embodiment of the present invention, the first lower pad and the second lower pad may have different sizes. For example, the width of the second lower pad may be greater than the width of the first lower pad. Furthermore, the spacing between the second lower pads may differ from the spacing between the first lower pads. For example, the spacing between the first lower pads may be greater than the spacing between the second lower pads.

[0139] The connecting lines are disposed on the lower surface of the substrate 110.

[0140] The connecting lines include a first connecting line and a second connecting line.

[0141] The first link is a line connected to a first lower pad in the lower pad, and the second link is a line connected to a second lower pad in the lower pad. The first and second link can be formed of the same material and disposed on the same layer, but are not limited thereto, and the first and second link can be formed of different materials and disposed on different layers. Furthermore, the first link can be disposed between the second link.

[0142] The second connection line can be connected to the second line 562, which serves as a power supply line, via the side line 550 of the display device 500. Therefore, the second connection line can be a high-potential power connection line or a low-potential power connection line.

[0143] In a display device 500 according to another exemplary embodiment of the present invention, the first link line and the second link line may be provided with different sizes. For example, the width of the second link line may be greater than the width of the first link line, and the width of the second link line may be two or more times the width of the first link line.

[0144] Furthermore, the separation distance of the second link can differ from that of the first link. For example, the separation distance of the first link can be greater than that of the second link.

[0145] Side lines 550 are disposed on the side surface of the substrate 110. Side lines 550 include a first side line 551 and a second side line 552.

[0146] A first side line 551 is disposed on the upper surface, side surface, and lower surface of the substrate 110. The first side line 551 can be configured to contact the first upper pad 580T1 through a contact hole formed in the first planarization layer 116. Furthermore, the first side line 551 can be configured to contact the first lower pad through a contact hole formed in the second planarization layer 117. Therefore, the first side line 551 can connect the first upper pad 580T1 and the first lower pad.

[0147] A second side line 552 is disposed on the first side line 551. The second side line 552 is configured to surround the upper surface, side surface, and lower surface of the substrate 110. The second side line 552 may be configured to contact the second upper pad 580T2 through a contact hole formed in the first planarization layer 116. Furthermore, the second side line 552 may be configured to contact the second lower pad through a contact hole formed in the second planarization layer 117. Therefore, the second side line 552 can connect the second upper pad 580T2 and the second lower pad.

[0148] The second side line 552 can be connected to the second line 562, which serves as the power supply line for the display device 500, and the second connection line, which serves as the power connection line.

[0149] In a display device 500 according to yet another exemplary embodiment of the present invention, the first side line 551 and the second side line 552 may have different dimensions. For example, the width of the second side line 552 may be greater than the width of the first side line 551.

[0150] Furthermore, the separation distance of the second side line 552 may differ from the separation distance of the first side line 551. For example, the separation distance of the first side line 551 may be greater than the separation distance of the second side line 552.

[0151] In a display device 500 according to another exemplary embodiment of the present invention, a plurality of upper pads 580T, a plurality of lines 560, and a plurality of side lines 550 disposed on a substrate 110 are arranged with different sizes, and therefore, the widths of the plurality of second side lines 552 and the plurality of lines 560 are increased, so that voltage drops that may occur in the display device 500 can be minimized. The display device 500 according to another exemplary embodiment of the present invention includes a first side line 551 disposed on a first layer and a second side line 552 disposed on a second layer, and the width of the second side line 552 can be set to be greater than the width of the first side line 551. Therefore, the width and cross-sectional area of ​​the plurality of second side lines 552 can be increased. For example, the width of the plurality of second side lines 552 can be at least twice the width of the plurality of first side lines 551. Therefore, in the display device 500 according to another exemplary embodiment of the present invention, the resistance of the second side lines 552 and the second lines 562 that transmit power is reduced, so that problems such as brightness deviation caused by voltage drops in the display device 500 can be improved.

[0152] In addition, in a display device 500 according to another exemplary embodiment of the present invention, a plurality of second side lines 552 are designed as low-potential voltage lines, for example, lines that transmit ground voltage, thereby protecting the first side lines 551 and components of the display device 500 from the influence of external static electricity.

[0153] Figure 6 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present invention. (Referring to...) Figures 1 to 3 Compared to the described display device 100, the display device 600 according to another exemplary embodiment of the present invention differs only in the addition of the sealing member 644 and the first cover layer 691, and its other configurations are substantially the same, and therefore, redundant descriptions will be omitted.

[0154] Reference Figure 6A first cover layer 691 is disposed on the second insulating layer 172 and on the substrate 110. The first cover layer 691 may be disposed on the LED 130 and the sealing member 644, thereby protecting the display device 600 from external impacts. The first cover layer 691 may be formed of glass or plastic material, but is not limited thereto. The first cover layer 691 may be a cover window or a shatterproof film, but is not limited thereto.

[0155] A second bonding layer 645 may be disposed between the substrate 110 and the first cover layer 691. The second bonding layer 645 may be disposed on the substrate 110 and bonded between the substrate 110 and the first cover layer 691. The second bonding layer 645 may be formed of a material capable of bonding the substrate 110 and the first cover layer 691 by curing via various curing methods. The second bonding layer 645 may be disposed in the entire region between the substrate 110 and the first cover layer 691, or it may be disposed only in a portion of the region between them.

[0156] A sealing member 644 is provided on a side surface of the substrate 110. The sealing member 644 is configured to cover the second insulating layer 172. For example, the sealing member 644 may cover a portion of the second insulating layer 172 provided on the upper surface of the substrate 110, a portion of the second insulating layer 172 provided on the side surface of the substrate 110, and a portion of the second insulating layer 172 provided on the lower surface of the substrate 110. Furthermore, the sealing member 644 may be configured to contact the first covering layer 691.

[0157] The sealing member 644 can be formed of a resilient material. For example, the sealing member 644 can be formed of a material such as acrylic resin or epoxy resin, but is not limited thereto.

[0158] The side surface of the sealing member 644 may have a first surface that is located in the same plane as the side surface of the first cover layer 691. In addition, the sealing member 644 is disposed on the second insulating layer 172 disposed on the lower surface of the substrate 110, and may have a second surface that extends from the first surface and has a different inclined shape.

[0159] Meanwhile, in a display device 600 according to another exemplary embodiment of the present invention, after the sealing member 644 is formed on the second side line 152, the size of the display device 600 can be adjusted by a cutting process, such as grinding or laser cutting. For example, after the first cover layer 691 is joined using the second bonding layer 645, the sealing member 644 is applied to the side surface of the display device 600. Thereafter, the display device 600 can be manufactured by removing a portion of the first cover layer 691 and a portion of the sealing member 644 by a cutting process such as grinding or laser cutting. Therefore, the sealing member 644 disposed in the cutting area may include a first surface located in the same plane as the side surface of the first cover layer 691 and a second surface having an inclined shape that is not disposed in the cutting area.

[0160] In a display device 600 according to another exemplary embodiment of the present invention, a first cover layer 691 is disposed on the upper surface of the substrate 110, and a sealing member 644 is disposed on the side surface of the substrate 110, thereby protecting the display device 600 from external impacts. During transport, the display device may be exposed to external forces, potentially damaging it. Furthermore, when using the display device to implement a tiled display, the spacing between adjacent display devices needs to be minimized to prevent viewers from seeing the gaps between them. Therefore, even minor errors during the tiling process can lead to contact with adjacent display panels and potentially damage the display device. In particular, when removing non-display areas to achieve a zero-bezel display, the protection of side lines may become a problem. Therefore, in a display device 600 according to another exemplary embodiment of the present invention, the first cover layer 691 protects the display device 600 from impacts occurring on the upper surface of the substrate 110, and the sealing member 644 protects the side lines 150 and the side surfaces of the substrate 110 from impacts occurring on the side surfaces of the substrate 110.

[0161] Furthermore, in a display device 600 according to another exemplary embodiment of the present invention, the side surface of the sealing member 644 and the side surface of the first cover layer 691 can be disposed on the same plane, thereby improving the visibility of the display device 600. Typically, the side lines and insulating layers of the display device are disposed on surfaces inclined from the side surface of the substrate. For example, the cross-sections of the side lines and insulating layers are shaped like curved surfaces of a shell structure, and they are disposed around the side surface of the substrate. Therefore, when the display device is laid flat, for example, a 'V'-shaped groove is formed between the display devices. Thus, the 'V'-shaped groove can be seen in the display device, thereby reducing the visibility of the display device. Therefore, in a display device 600 according to another exemplary embodiment of the present invention, the sealing member 644 is disposed on the side line 150 and the insulating layer 170, and the side surface of the sealing member 644 is disposed on the same plane as the side surface of the first cover layer 691, so that the 'V'-shaped groove can be prevented from being seen in the display device 600.

[0162] Figure 7 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present invention. (Referring to...) Figure 6 Compared to the described display device 600, the display device 700 according to another embodiment of the present invention differs only in the sealing member 744, and its other configurations are substantially the same, and therefore, redundant descriptions will be omitted.

[0163] Reference Figure 7 A sealing member 744 is disposed on a side surface of the substrate 110. The sealing member 744 is configured to cover the second side line 152, the second insulating layer 172, and the lower pad 180B. For example, the sealing member 744 may cover a portion of the second insulating layer 172 disposed on the upper surface of the substrate 110, the second insulating layer 172 disposed on the side surface of the substrate 110, and the second insulating layer 172 and the lower pad 180B disposed on the lower surface of the substrate 110. Therefore, the sealing member 744 can cover the side surface of the substrate 110 on which the first cover layer 691 is not disposed, as well as the lower surface of the substrate 110.

[0164] In a display device 700 according to another exemplary embodiment of the present invention, a first cover layer 691 is disposed on the upper surface of a substrate 110, and a sealing member 744 is disposed on the side surface of the substrate 110, such that the first cover layer 691 can protect the display device 700 from impacts occurring on the upper surface of the substrate 110, and the sealing member 744 can protect the side line 150 and the side surface of the substrate 110 from impacts occurring on the side surface of the substrate 110.

[0165] In addition, in a display device 700 according to another exemplary embodiment of the present invention, the side surface of the sealing member 744 and the side surface of the first cover layer 691 are disposed on the same plane, so that the 'V' shaped groove can be prevented from being seen and the visibility of the display device 700 can be improved.

[0166] Furthermore, in a display device 700 according to another exemplary embodiment of the present invention, a sealing member 744 is configured to cover the second insulating layer 172 disposed on the lower surface of the substrate 110, thereby protecting the display device 700 from impacts occurring from the lower surface of the substrate 110. That is, in a display device 700 according to another exemplary embodiment of the present invention, the sealing member 744 is configured to extend to cover both the second insulating layer 172 and the lower pad 180B disposed on the lower surface of the substrate 110. Therefore, in a display device 700 according to another exemplary embodiment of the present invention, the sealing member 744 can protect the side line 150 and the lower pad 180B from impacts occurring on the lower surface of the substrate 110.

[0167] Figure 8 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present invention. (Referring to...) Figure 6 Compared to the described display device 600, the display device 800 according to another exemplary embodiment of the present invention differs only in that the sealing member 844 is different and a second cover layer 892 is added, and its other configurations are substantially the same, and therefore redundant descriptions will be omitted.

[0168] Reference Figure 8 A second cover layer 892 is disposed below the substrate 110. The second cover layer 892 may be disposed below the substrate 110 and cover the second insulating layer 172 and the lower pad 180B. It can protect the display device 800 from external impacts. The second cover layer 892 may be formed of glass or plastic material, but is not limited to these. The second cover layer 892 may be a cover window or a shatterproof film, but is not limited to these.

[0169] Simultaneously, a third bonding layer 846 can be disposed between the substrate 110 and the second cover layer 892. The third bonding layer 846 can bond the substrate 110 and the second cover layer 892. The third bonding layer 846 can be formed of a material capable of bonding the substrate 110 and the second cover layer 892 by curing through various curing methods. The third bonding layer 846 can be disposed in the entire region between the substrate 110 and the second cover layer 892, or it can be disposed only in a portion of the region between them.

[0170] A sealing member 844 is disposed on a side surface of the substrate 110. The sealing member 844 is configured to cover the second insulating layer 172. For example, the sealing member 844 may cover a portion of the first cover layer 691 and the second insulating layer 172 disposed on the upper surface of the substrate 110, the second insulating layer 172 disposed on the side surface of the substrate 110, and a portion of the second insulating layer 172 disposed on the lower surface of the substrate 110.

[0171] The side surface of the sealing member 844 may have a first surface that is located on the same plane as the side surface of the first cover layer 691 and the side surface of the second cover layer 892.

[0172] Meanwhile, in a further exemplary embodiment of the display device 800 according to the present invention, after the sealing member 844 is formed on the second side line 152, the size of the display device 800 can be adjusted by a cutting process, such as grinding or laser cutting. For example, after the first cover layer 691 is bonded using a second bonding layer 645 and the second cover layer 892 is bonded using a third bonding layer 846, the sealing member 844 is applied to the side surface of the display device 800. Thereafter, the display device 800 can be manufactured by removing a portion of the first cover layer 691, a portion of the second cover layer 892, and a portion of the sealing member 844 by a cutting process, such as grinding or laser cutting. Therefore, the sealing member 844 disposed in the cutting area may include a first surface located in the same plane as the side surface of the first cover layer 691 and the side surface of the second cover layer 892.

[0173] In a display device 800 according to another exemplary embodiment of the present invention, a first cover layer 691 is disposed on the upper surface of a substrate 110, and a sealing member 844 is disposed on the side surface of the substrate 110, such that the first cover layer 691 can protect the display device 800 from impacts occurring on the upper surface of the substrate 110, and the sealing member 844 can protect the side line 150 and the side surface of the substrate 110 from impacts occurring on the side surface of the substrate 110.

[0174] In addition, in a further exemplary embodiment of the display device 800 according to the present invention, the side surface of the sealing member 844 and the side surface of the first cover layer 691 are disposed on the same plane, so that the 'V' shaped groove can be prevented from being seen and the visibility of the display device 800 can be improved.

[0175] In addition, in a further exemplary embodiment of the display device 800 according to the present invention, the second cover layer 892 may be configured to cover the second insulating layer 172 disposed on the lower surface of the substrate 110 and the substrate 110, thereby protecting the display device 800 from impacts occurring on the lower surface of the substrate 110.

[0176] In a display device 800 according to another exemplary embodiment of the present invention, a first cover layer 691 is disposed on the upper surface of a substrate 110, and a sealing member 844 is disposed on the side surface of the substrate 110, such that the first cover layer 691 can protect the display device 800 from impacts occurring on the upper surface of the substrate 110, and the sealing member 844 can protect the side line 150 and the side surface of the substrate 110 from impacts occurring on the side surface of the substrate 110.

[0177] In addition, in a further exemplary embodiment of the display device 800 according to the present invention, the side surface of the sealing member 844 and the side surface of the first cover layer 691 are disposed on the same plane, so that the 'V' shaped groove can be prevented from being seen and the visibility of the display device 800 can be improved.

[0178] Furthermore, in a further exemplary embodiment of the display device 800 according to the present invention, a second cover layer 892 may be disposed on the lower surface of the substrate 110, thereby protecting the display device 800 from external impacts. That is, in a further exemplary embodiment of the display device 800 according to the present invention, the second cover layer 892 is disposed to cover both the second insulating layer 172 and the lower pad 180B disposed on the lower surface of the substrate 110. Therefore, in a further exemplary embodiment of the display device 800 according to the present invention, the second cover layer 892 can protect the side line 150 and the lower pad 180B from impacts occurring on the lower surface of the substrate 110.

[0179] Exemplary embodiments of this disclosure can also be described as follows:

[0180] According to one aspect of this disclosure, a display device includes: a substrate on which a plurality of light-emitting elements are disposed; a plurality of lines disposed on an upper surface of the substrate; a plurality of connecting lines disposed on a lower surface of the substrate; and a plurality of side lines connecting the plurality of lines and the plurality of connecting lines, wherein the plurality of side lines include a plurality of first side lines and a plurality of second side lines, wherein the plurality of first side lines and the plurality of second side lines are disposed on different layers.

[0181] The display device may further include: a first insulating layer covering a plurality of first side lines and disposed between the plurality of first side lines and a plurality of second side lines; and a second insulating layer disposed covering the plurality of second side lines, wherein the first insulating layer and the second insulating layer may include a black material.

[0182] The display device may further include: a plurality of upper pads disposed on the upper surface of the substrate and connected to a plurality of lines; and a plurality of lower pads disposed on the lower surface of the substrate and connected to a plurality of link lines, wherein side lines are connected to the plurality of lines via the plurality of upper pads and to the plurality of link lines via the plurality of lower pads, the plurality of upper pads including a plurality of first upper pads connected to a plurality of first side lines and a plurality of second upper pads connected to a plurality of second side lines, and the plurality of lower pads including a plurality of first lower pads connected to a plurality of first side lines and a plurality of second lower pads connected to a plurality of second side lines.

[0183] Multiple second upper pads are configured to be closer to the center of the substrate than multiple first upper pads, and multiple second lower pads can be configured to be closer to the center of the substrate than multiple first lower pads.

[0184] Multiple second side lines can overlap with multiple second upper pads and multiple second lower pads.

[0185] Multiple first upper pads and multiple second upper pads are arranged in a zigzag shape, and multiple first lower pads and multiple second lower pads can also be arranged in a zigzag shape.

[0186] Multiple first upper pads and multiple second upper pads are set on the same layer, and lines extending from multiple first upper pads and lines extending from multiple second upper pads can be set on the same layer.

[0187] The width of the multiple second upper pads is greater than the width of the multiple first upper pads, and the lines connecting the multiple second upper pads can be power lines.

[0188] The display device may further include: a sealing member covering multiple second side lines; and a first cover layer disposed on the substrate to contact the sealing member.

[0189] The side surface of the sealing member may include a first surface that lies in the same plane as the side surface of the first cover layer and a second surface that extends from the first surface and has an inclined shape.

[0190] The display device may also include: a plurality of lower pads disposed on the lower surface of the substrate and connected to a plurality of link lines, and a sealing member may be configured to cover the plurality of lower pads.

[0191] The display device may further include: a second cover layer disposed below the substrate and on the lower part of the sealing member, wherein the side surface of the first cover layer, the side surface of the sealing member, and the side surface of the second cover layer may be disposed on the same plane.

[0192] According to another aspect of this disclosure, a display device includes: a substrate on which a plurality of light-emitting elements are disposed; a plurality of first lines and a plurality of second lines disposed on an upper surface of the substrate; a plurality of first upper pads and a plurality of second upper pads disposed on the upper surface of the substrate and connected to the plurality of first lines and the plurality of second lines; a plurality of first connecting lines and a plurality of second connecting lines disposed on a lower surface of the substrate; a plurality of first lower pads and a plurality of second lower pads disposed on the lower surface of the substrate and connected to the plurality of first connecting lines and the plurality of second connecting lines; a plurality of first side lines connecting the plurality of first upper pads and the plurality of first lower pads; a first insulating layer disposed to cover the plurality of first side lines; and a plurality of second side lines connecting the plurality of second upper pads and the plurality of second lower pads and disposed on the first insulating layer.

[0193] At least a portion of the multiple first lateral lines and at least a portion of the multiple second lateral lines may overlap each other.

[0194] Multiple first sidelines can be set between multiple second sidelines.

[0195] Multiple first upper pads are positioned closer to the outside of the substrate than multiple second upper pads, and multiple first lower pads can be positioned closer to the outside of the substrate than multiple second lower pads.

[0196] Multiple first upper pads and multiple second upper pads are alternately disposed on the substrate, and multiple first lower pads and multiple second lower pads can be alternately disposed on the substrate.

[0197] The width of the multiple second side wires is greater than the width of the multiple first side wires, and the multiple second side wires can be connected to the power cord.

[0198] The display device may further include: a second insulating layer configured to cover a plurality of second side lines; a sealing member disposed on the second insulating layer; and a first covering layer disposed on a plurality of light-emitting elements and the sealing member.

[0199] The sealing component can cover multiple first lower pads and multiple second lower pads.

[0200] The display device may also include a second cover layer disposed below a plurality of first lower pads and a plurality of second lower pads and in contact with the sealing member.

[0201] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope of the claims should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: A substrate on which multiple light-emitting elements are disposed; Multiple lines disposed on the upper surface of the substrate; Multiple connecting lines are disposed on the lower surface of the substrate; Multiple side lines connecting the multiple lines and the multiple link lines, including multiple first side lines and multiple second side lines; and A first insulating layer is disposed between the plurality of first side wires and the plurality of second side wires. The multiple first side lines and the multiple second side lines are arranged on different layers.

2. The display device according to claim 1, further comprising: The second insulating layer is configured to cover the plurality of second side wires. Wherein, the first insulating layer covers the plurality of first side wires, and The first insulating layer and the second insulating layer comprise a black material.

3. The display device according to claim 1, further comprising: Multiple upper pads are disposed on the upper surface of the substrate and connected to the multiple lines; as well as Multiple lower pads disposed on the lower surface of the substrate and connected to the multiple interconnect lines The side line is connected to the multiple lines via the multiple upper pads. The side line is connected to the multiple connecting lines via the multiple lower pads. The plurality of upper pads include a plurality of first upper pads connected to the plurality of first side lines and a plurality of second upper pads connected to the plurality of second side lines. The plurality of lower pads include a plurality of first lower pads connected to the plurality of first side lines and a plurality of second lower pads connected to the plurality of second side lines.

4. The display device according to claim 3, wherein, The plurality of second upper pads are positioned closer to the center of the substrate than the plurality of first upper pads, and The plurality of second lower pads are positioned closer to the center of the substrate than the plurality of first lower pads.

5. The display device according to claim 4, wherein, The plurality of second side lines overlap with the plurality of second upper pads and the plurality of second lower pads.

6. The display device according to claim 4, wherein, The plurality of first upper pads and the plurality of second upper pads are arranged in a zigzag shape, and The plurality of first lower pads and the plurality of second lower pads are arranged in a zigzag shape.

7. The display device according to claim 3, wherein, The plurality of first upper pads and the plurality of second upper pads are disposed on the same layer. Among the plurality of lines, the lines extending from the plurality of first upper pads and the lines extending from the plurality of second upper pads are disposed on the same layer.

8. The display device according to claim 3, wherein, The width of each of the plurality of second upper pads is greater than the width of each of the plurality of first upper pads. Among these lines, the line connected to the plurality of second upper pads is a power line.

9. The display device according to claim 1, further comprising: A sealing member covering the plurality of second side lines; as well as A first cover layer is disposed on the substrate to contact the sealing member.

10. The display device according to claim 9, wherein, The side surface of the sealing member includes a first surface that lies in the same plane as the side surface of the first cover layer and a second surface that extends from the first surface and has an inclined shape.

11. The display device according to claim 10, further comprising: Multiple lower pads disposed on the lower surface of the substrate and connected to the multiple interconnect lines The sealing member is configured to cover the plurality of lower pads.

12. The display device according to claim 9, further comprising: A second cover layer is disposed below the substrate and on the lower part of the sealing member. The side surfaces of the first covering layer, the sealing member, and the second covering layer are disposed on the same plane.

13. A display device, comprising: A substrate on which multiple light-emitting elements are disposed; Multiple first lines and multiple second lines are disposed on the upper surface of the substrate; A plurality of first upper pads and a plurality of second upper pads are disposed on the upper surface of the substrate and connected to the plurality of first lines and the plurality of second lines; Multiple first link lines and multiple second link lines are disposed on the lower surface of the substrate; A plurality of first lower pads and a plurality of second lower pads are disposed on the lower surface of the substrate and connected to the plurality of first link lines and the plurality of second link lines; Multiple first side lines connecting the plurality of first upper pads and the plurality of first lower pads; A first insulating layer is configured to cover the plurality of first side lines; as well as Multiple second side lines are provided on the first insulating layer, connecting the plurality of second upper pads and the plurality of second lower pads.

14. The display device according to claim 13, wherein, At least a portion of the plurality of first side lines and at least a portion of the plurality of second side lines overlap each other.

15. The display device according to claim 13, wherein, The plurality of first side lines are positioned between the plurality of second side lines.

16. The display device according to claim 13, wherein, The plurality of first upper pads are positioned closer to the outside of the substrate than the plurality of second upper pads, and The plurality of first lower pads are positioned closer to the outside of the substrate than the plurality of second lower pads.

17. The display device according to claim 16, wherein, The plurality of first upper pads and the plurality of second upper pads are alternately disposed on the substrate, and The plurality of first lower pads and the plurality of second lower pads are alternately disposed on the substrate.

18. The display device according to claim 13, wherein, The width of each of the plurality of second side lines is greater than the width of each of the plurality of first side lines, and The multiple second side wires are connected to the power supply line.

19. The display device according to claim 13, further comprising: A second insulating layer is configured to cover the plurality of second side lines; A sealing member disposed on the second insulating layer; as well as A first covering layer is disposed on the plurality of light-emitting elements and the sealing member.

20. The display device according to claim 19, wherein, The sealing member covers the plurality of first lower pads and the plurality of second lower pads.

21. The display device according to claim 19, further comprising: A second cover layer is disposed below the plurality of first lower pads and the plurality of second lower pads and contacts the sealing member.

22. The display device according to claim 13, wherein, The plurality of first lines, the plurality of second lines, the plurality of first upper pads, and the plurality of second upper pads are formed of the same material and disposed on the same layer.

23. The display device according to claim 22, wherein, The plurality of first lines and the plurality of first upper pads are integrally formed, and the plurality of second lines and the plurality of second upper pads are integrally formed.

24. An electronic device comprising a display device according to any one of claims 1 to 23.

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