Processing device and method for removing processed objects

Abstract

The present application provides a processing device and a method for carrying out a processed object, which more strongly performs drainage on a holding surface and more reliably performs carrying out of the processed object when carrying out the processed object after processing. A holding table (10) of a processing device (1) has a porous plate (11) having a central region (13-1) that attracts and holds a processed object (100), a frame (12) having a recess (14) that houses the porous plate (11), an attraction line (16) formed on a bottom surface (14-1) of the frame (12) that communicates the central region (13-1) with an attraction source (17), and an air supply line (18) that communicates with an air supply source (19) and ejects air from a peripheral region (13-2) surrounding the central region (13-1).

Description

Technical Field

[0001] The present invention relates to a processing apparatus and a method for removing a workpiece from a holding table. Background Technology

[0002] A processing apparatus is known to process a workpiece held on a holding table and remove the processed workpiece from the holding table (see, for example, Patent Documents 1 and 2).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2016-127195

[0004] Patent Document 2: Japanese Patent No. 6309371

[0005] When removing the workpiece from the holding table after processing, there is a problem that it cannot be removed due to the surface tension of the processing liquid (water) that enters between the workpiece and the holding surface of the holding table. Therefore, in order to drain the water accumulated on the holding surface, a negative pressure is introduced into the holding surface when the workpiece is removed, and the workpiece is held while the water is sucked out, thereby draining the water and releasing the fixation caused by surface tension. However, the following problem exists: in the state where the workpiece and the holding surface are in a vacuum, no matter how much suction is applied, it is impossible to completely remove the water remaining on the holding surface, and sometimes the conveying error occurs when removing the workpiece from the holding surface. Summary of the Invention

[0006] The present invention was made in view of this problem and its object is to provide a processing apparatus and a method for removing the workpiece, which can more effectively maintain drainage on the surface when removing the processed workpiece and can remove the workpiece more reliably.

[0007] To solve the aforementioned problems and achieve the objective, the processing apparatus of the present invention comprises: a holding table having a holding surface for holding a workpiece; a processing unit for processing the workpiece held by the holding table; a liquid supply nozzle for supplying processing liquid to the processing point processed by the processing unit; a transfer unit for transferring the workpiece from the holding table; and a control unit, characterized in that the holding table comprises: a perforated plate having a central region for attracting and holding the workpiece; a frame having a recess for receiving the perforated plate; and a suction line formed on the bottom surface of the frame. The central region is connected to the suction source; and an air supply line is connected to the air supply source, from which air is ejected from the outer peripheral region surrounding the central region. The control unit connects the perforated plate to the suction source via the suction line, uses the central region to suction the workpiece, removes water between the perforated plate and the workpiece, and supplies air to the air supply line, ejecting air from the outer peripheral region to make the outer periphery of the workpiece float off the holding surface, relieving the surface tension of the water between the perforated plate and the workpiece. With the surface tension relieved, the workpiece is removed from the holding table by the transfer unit.

[0008] To address the aforementioned issues and achieve the objective, the workpiece removal method of the present invention removes the workpiece from a holding table in a processing apparatus via a removal unit. The processing apparatus includes: a holding table having a holding surface for holding the workpiece; a processing unit for processing the workpiece held by the holding table; a liquid supply nozzle for supplying processing liquid to the processing point processed by the processing unit; and the removal unit for removing the workpiece from the holding table. The holding table includes: a perforated plate having a central region for attracting and holding the workpiece; a frame having a recess for receiving the perforated plate; a suction line formed on the bottom surface of the frame, communicating the central region with a suction source; and an air supply line communicating with an air supply source. The method for removing the workpiece involves the following steps: a peripheral buoyancy step, in which the porous plate is connected to the suction source via the suction line, the workpiece is attracted by the central region, water between the porous plate and the workpiece is removed, and air is supplied to the air supply line, air is ejected from the peripheral region to buoy only the outer periphery of the workpiece from the holding surface, thereby relieving the surface tension of the water between the porous plate and the workpiece; a workpiece holding step, in which the workpiece is held by the removal unit; and a removal step, after the workpiece holding step and the peripheral buoyancy step, in which the suction of the central region on the workpiece is cut off, the workpiece is removed entirely from the holding table, and the workpiece is removed from the holding table.

[0009] This invention provides a more powerful way to maintain drainage on the surface when removing the processed workpiece, thus enabling more reliable removal of the workpiece. Attached Figure Description

[0010] Figure 1 This is a perspective view showing an example of the structure of the processing apparatus according to the embodiment.

[0011] Figure 2 It is shown Figure 1 A cross-sectional view of the main parts of the processing device.

[0012] Figure 3 It is shown Figure 1 A perspective view of the main parts of the processing device 1.

[0013] Figure 4 This is a flowchart illustrating an example of the processing steps of the workpiece removal method according to an embodiment.

[0014] Label Explanation

[0015] 1: Processing device; 10: Holding table; 11: Perforated plate; 12: Frame; 13: Holding surface; 13-1: Central area (suction area); 13-2: Outer peripheral area (outer peripheral part of the suction area); 14: Recess; 14-1: Bottom surface; 14-2: Inner surface; 15-1: Central part; 15-2: Outer peripheral part; 16: Suction line; 17: Suction source; 18: Air supply line; 19: Air supply source; 20: Processing unit; 30: Liquid supply nozzle; 35: Processing liquid (water); 40: First transfer unit; 50: Second transfer unit; 60: Control unit; 100: Workpiece. Detailed Implementation

[0016] Referring to the accompanying drawings, the embodiments (implementations) for carrying out the present invention will be described in detail. The present invention is not limited to the contents described in the following embodiments. Furthermore, the constituent elements described below include contents that are readily conceived by those skilled in the art and substantially the same. Additionally, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications to the structure can be made without departing from the spirit of the present invention.

[0017] [Implementation Method]

[0018] The processing apparatus 1 and the method for removing the workpiece according to an embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing an example of the structure of the processing apparatus 1 according to the embodiment. Figure 2 It is shown Figure 1 A cross-sectional view of the main part of the processing device 1. Figure 3 It is shown Figure 1A perspective view of the main parts of the processing device 1. (See figure) Figure 1 As shown, the processing apparatus 1 of the embodiment includes: a holding worktable 10, a processing unit 20, a liquid supply nozzle 30, a first transfer unit 40, a second transfer unit 50, a control unit 60, a display unit 70, a cleaning unit 80, and a box-mounted stage 90.

[0019] In this embodiment, the workpiece 100 processed by the processing apparatus 1 is, for example, a wafer-shaped semiconductor wafer or optical device wafer made of materials such as silicon, sapphire, silicon carbide (SiC), gallium arsenide, or glass. Figure 1 As shown, a chip-sized device 103 is formed on a flat front surface 101 within an area divided by multiple predetermined dividing lines 102 arranged in a grid pattern. In this invention, the workpiece 100 can be processed as a single unit without being attached to an adhesive tape. For example, when it is desirable to perform a half-cut to form a groove of incomplete depth with good precision, it is often processed as a single unit to avoid being affected by thickness deviations in the adhesive tape. Alternatively, the workpiece 100 can be attached to the back surface 104 on the back side of the front surface 101, and a ring frame can be mounted on the outer edge of the adhesive tape. Alternatively, the workpiece 100 can be attached to an adhesive tape of the same shape without being mounted on a ring frame. Furthermore, in this invention, the workpiece 100 can be a rectangular packaging substrate, ceramic plate, or glass plate, etc., having multiple resin-sealed devices.

[0020] like Figure 2 As shown, the holding table 10 includes: a perforated plate 11, a frame 12, a suction line 16, and an air supply line 18. The perforated plate 11 is formed into a disc shape from porous ceramic or the like, which has a large number of pores. The frame 12 is formed into a disc shape from stainless steel or the like, and a recess 14 for receiving the perforated plate 11 is formed in the center. The perforated plate 11 is embedded in the recess 14 of the frame 12.

[0021] The holding table 10 has a holding surface 13 for holding the workpiece 100. The holding surface 13 is formed by the upper surface of the perforated plate 11 and the upper surface of the frame 12. The upper surface of the perforated plate 11 and the upper surface of the frame 12 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. In this embodiment, the holding surface 13 holds the workpiece 100 with its front side 101 facing upwards and directly holds the workpiece 100 from the back side 104 side. When the diameter of the perforated plate 11 is smaller than that of the workpiece 100, the upper surface of the frame 12 supports the outer periphery of the workpiece 100 that protrudes from the perforated plate 11.

[0022] like Figure 2As shown, the suction line 16 is formed in the central portion 15-1 of the bottom surface 14-1 of the recess 14 of the frame 12, and connects the central region 13-1 of the perforated plate 11 to the suction source 17 via the suction valve 16-1. Figure 2 As shown, by opening the suction valve 16-1, negative pressure from the suction source 17 is introduced into the central region 13-1 of the porous plate 11 through the suction line 16, thereby making the central region 13-1 of the porous plate 11 a suction region for attracting and holding the workpiece 100 placed thereon.

[0023] like Figure 2 As shown, an air supply line 18 is formed on the outer periphery 15-2 of the bottom surface 14-1 of the recess 14 of the frame 12. Through an air supply valve 18-1, the outer periphery 13-2 surrounding the central region 13-1 of the perforated plate 11 is connected to an air supply source 19, and air is ejected from the outer periphery 13-2 surrounding the central region 13-1. Here, the upper surface of the perforated plate 11 has a central region 13-1 and an outer periphery 13-2, with the outer periphery 13-2 located on the outer periphery of the central region 13-1. The air supply line 18 is not limited to... Figure 2 The example shown can also be configured such that air is ejected from the inner side 14-2 of the frame 12 surrounding the recess 14 or from the upper surface of the annular protrusion 14-3 of the frame 12.

[0024] Here, in this embodiment, for example, the outer peripheral portion 15-2 refers to the area outside a circle that is half the inner diameter of the bottom surface 14-1, and is concentric with the bottom surface 14-1. Additionally, the central portion 15-1 refers to the area on the bottom surface 14-1 that is radially inward from the location where the air supply line 18 is formed.

[0025] In the workbench 10, such as Figure 2 As shown, when the suction valve 16-1 is opened and negative pressure from the suction source 17 is introduced through the suction line 16, and the air supply valve 18-1 is opened and air from the air supply source 19 is introduced through the air supply line 18, the central region 13-1 of the holding surface 13 becomes a suction region that suctions the workpiece 100 on the holding surface 13 while suctioning away the processing liquid 35 that enters between the holding surface 13 and the workpiece 100. The outer peripheral region 13-2 becomes an ejection region that surrounds the central region 13-1 and has air ejection outlets at at least one location, thereby causing the outer periphery of the workpiece 100 on the holding surface 13 to float from the holding surface 13.

[0026] In addition, in this embodiment, the boundary between the central region 13-1 and the outer peripheral region 13-2 on the upper surface of the perforated plate 11 varies depending on the location where the suction line 16 and the air supply line 18 are formed, as well as the pressure value (gauge pressure) of the negative pressure from the suction line 16 and the amount or pressure of air supplied from the air supply line 18.

[0027] The worktable 10 is configured to move freely in the X-axis direction, which is one of the horizontal directions, via an X-axis movement unit (not shown). The worktable 10 is moved along the X-axis direction via the X-axis movement unit, thereby... Figure 1 As shown, the worktable 10 moves back and forth between the loading / unloading area 3 for loading and unloading the workpiece 100 and the processing area 4 for processing the workpiece 100 by the processing unit 20. The worktable 10 is configured to rotate freely about a Z-axis perpendicular to the XY plane in the vertical direction via a rotary drive source (not shown).

[0028] like Figure 1 As shown, the machining unit 20 is disposed in the machining area 4 and performs machining on the workpiece 100 held by the holding surface 13 of the holding table 10 located in the machining area 4. In this embodiment, the machining unit 20 is a cutting unit, which has a cutting tool mounted on the front end of the spindle. The cutting tool, which is subjected to a rotational motion about an axis parallel to the Y-axis direction (which is perpendicular to the X-axis direction) applied by the spindle, cuts the workpiece 100 held by the holding table 10 located in the machining area 4, for example, along a predetermined dividing line 102.

[0029] Furthermore, in this invention, the processing unit 20 is not limited to such a cutting unit; for example, it can also be a grinding unit. This grinding unit has a grinding wheel mounted at the front end of the spindle, and uses the grinding wheel, which is rotated about an axis parallel to the Z-axis direction applied by the spindle, to grind, for example, the back side 104 side of the workpiece 100 held by the holding table 10 located in the processing area 4. Alternatively, the processing unit 20 can also be a lapping unit, which has a lapping pad mounted at the front end of the spindle, and uses the lapping pad, which is rotated about an axis parallel to the Z-axis direction applied by the spindle, to lapping, for example, the back side 104 side of the workpiece 100 held by the holding table 10 located in the processing area 4.

[0030] A liquid supply nozzle 30 is disposed adjacent to the processing unit 20 in the processing area 4, supplying processing liquid 35 (not shown) from a liquid supply source to the processing point of the workpiece 100 being processed by the processing unit 20 and the area near the processing point. When the processing unit 20 is the cutting unit described above, the processing point is the point where the workpiece 100 is cut using a cutting tool. When the processing unit 20 is a grinding unit or a lapping unit, the processing point is any point on the surface of the workpiece 100 being ground or lapping using a grinding wheel or lapping pad. The processing liquid 35 can be appropriately selected and used depending on the type, conditions, and specifications of the processing by the processing unit 20. In this embodiment, the processing liquid 35 is water (pure water) used as cutting water, grinding water, or lapping water.

[0031] like Figure 1 and Figure 2 As shown, the first transfer unit 40 includes: a first transfer arm 41, a Y-axis moving unit 42, a Z-axis moving unit 43, a plate member 44, a groove 45, a gripping part 46, an air supply source 47, and an air supply line 48. The first transfer arm 41 is an L-shaped member that extends along the Z-axis direction on its upper side and along the X-axis direction on its lower side. The upper part of the first transfer arm 41 is connected to the Y-axis moving unit 42 via the Z-axis moving unit 43, and the plate member 44 is fixed to the lower part of the first transfer arm 41.

[0032] The Y-axis moving unit 42 moves the first take-out arm 41 together with the Z-axis moving unit 43 along the Y-axis direction. The Z-axis moving unit 43 moves the first take-out arm 41 along the Z-axis direction. The Y-axis moving unit 42 and the Z-axis moving unit 43 are respectively configured to have: a known ball screw, which is configured to rotate freely about the axes of the Y-axis and the Z-axis; a known pulse motor, which rotates the ball screw about the axis; and a known guide rail, which supports the first take-out arm 41 to move freely in the Y-axis direction or the Z-axis direction.

[0033] like Figure 1 and Figure 3 As shown, the plate component 44 is formed in the shape of a circular plate. The upper side of the plate component 44 is supported by the first conveying arm 41, and multiple radially arranged components are formed on the lower side of the plate component 44 from the center. Figure 1 and Figure 3 (Three slots 45 are shown in the example shown). The plate component 44 is provided with a holding part 46, which holds the annular frame 106 mounted on the workpiece 100 at a position opposite to the opening of the box 95 placed on the box mounting table 90 described later.

[0034] like Figure 2 and Figure 3As shown, the slot 45 is connected to the air supply source 47 via an air supply line 48 formed inside the plate member 44. The slot 45 is formed such that, in the portion connected to the air supply line 48, the cross-sectional area of ​​the slot 45 on the section perpendicular to the direction of extension of the slot 45 is larger than the cross-sectional area of ​​the air supply line 48 on the section perpendicular to the direction of air flow.

[0035] Air supplied from air supply source 47 flows at high speed from the center toward the radial direction within slot 45. Due to the relationship between the cross-sectional area of ​​slot 45 and air supply line 48, the air supplied from air supply source 47 accelerates as it flows into slot 45 from air supply line 48, and flows within slot 45 while introducing surrounding air on both sides of slot 45, thus generating a negative pressure near slot 45 through the Bernoulli effect. Regarding the plate member 44 of the first transfer unit 40, the negative pressure generated near slot 45 allows the plate member 44 to hold the workpiece 100 on the holding surface 13 of the holding table 10 opposite to the side where slot 45 is formed in a non-contact manner.

[0036] In this embodiment, the plate component 44 of the first transfer unit 40 uses the negative pressure generated by the Bernoulli effect through the flow of air in the groove 45 to hold the workpiece 100 on the holding table 10 in a non-contact manner. However, the present invention is not limited to this. The suction pad provided on the lower side of the plate component 44 can also be made to contact the front side 101 of the workpiece 100 to attract and hold the workpiece 100. The suction pad can also attract and hold the upper surface of the annular frame of the workpiece 100 which is mounted on the workpiece 100 by means of adhesive tape.

[0037] The first transfer unit 40 uses the gripping part 46 to grasp and remove the workpiece 100 before processing from the box 95 placed on the box placement stage 90, and places it on a pair of guide rails 93 for temporarily placing the workpiece 100 in the transfer-in / transfer-out area 3, which are located above the moving area of ​​the holding worktable 10. The first transfer unit 40 uses negative pressure generated by the Bernoulli effect to hold the workpiece 100 before processing on the pair of guide rails 93 in a non-contact manner, and places it on the holding surface 13 of the holding worktable 10 positioned in the transfer-in / transfer-out area 3. The first transfer unit 40 uses negative pressure generated by the Bernoulli effect to hold and remove the processed workpiece 100 on the holding surface 13 of the holding worktable 10 positioned in the transfer-in / transfer-out area 3 in a non-contact manner, and transfers it to the cleaning unit 80. The first transfer unit 40 uses negative pressure generated by the Bernoulli effect to hold the workpiece 100, which has been cleaned by the cleaning unit 80, in a non-contact manner and places it on a pair of guide rails 93. The first transfer unit 40 uses the holding part 46 to hold the processed and cleaned workpiece 100 placed on the pair of guide rails 93 and transfer it into the box 95 placed on the box placement stage 90.

[0038] The second transfer unit 50 has a structure that is substantially the same as that of the first transfer unit 40, such as Figure 1 and Figure 2 As shown, the second transfer unit 50 includes: a second transfer arm 51, a Y-axis moving unit 52, a Z-axis moving unit 53, a plate component 54, a groove 55, a gripping part 56, an air supply source 57, and an air supply line 58. The second transfer arm 51, Y-axis moving unit 52, Z-axis moving unit 53, plate component 54, groove 55, gripping part 56, air supply source 57, and air supply line 58 each have a structure substantially the same as the first transfer arm 41, Y-axis moving unit 42, Z-axis moving unit 43, plate component 44, groove 45, gripping part 46, air supply source 47, and air supply line 48. The second transfer unit 50 uses the plate component 54 to utilize the negative pressure generated by the Bernoulli effect to hold the processed workpiece 100 in a non-contact manner, transferring it from the holding worktable 10 to the cleaning unit 80. The first transport unit 40 and the second transport unit 50 alternately transport the workpiece 100 while maintaining a staggered position along the Z-axis to avoid collisions. Figure 1 In the example shown, the processing device 1 has two transfer units, a first transfer unit 40 and a second transfer unit 50. However, the invention is not limited to this. It may have only one transfer unit of either one or more transfer units.

[0039] The control unit 60 controls the operation of various components of the processing apparatus 1 to enable the processing apparatus 1 to perform processing of the workpiece 100. The control unit 60 controls the formation of the suction area and the ejection area on the holding surface 13 by controlling the opening and closing of the suction valve 16-1 of the suction line 16 and the air supply valve 18-1 of the air supply line 18. The control unit 60 controls the pressure value (gauge pressure) of the negative pressure introduced from the suction line 16 to the holding surface 13 by controlling the suction source 17, and controls the supply amount or supply pressure of air from the air supply line 18 by controlling the air supply source 19.

[0040] The control unit 60 controls the position and movement of the first and second transfer arms 41 and 51 of the first and second transfer units 40 and 50 in the Y-axis and Z-axis directions by controlling the Y-axis movement units 42 and 52 and the Z-axis movement units 43 and 53. The control unit 60 controls the supply of air from the air supply sources 47 and 57 to the slots 45 and 55, thereby controlling the negative pressure generated by the Bernoulli effect through air flow within the slots 45 and 55, and thus controlling the holding of the workpiece 100 by the plate components 44 and 54 of the first transfer units 40 and 50. The control unit 60 controls the holding of the workpiece 100 by controlling the holding parts 46 and 56.

[0041] In this embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes: an arithmetic processing unit having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as ROM (read-only memory) or RAM (random access memory); and an input / output interface device. The arithmetic processing unit of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60, and outputs control signals for controlling the processing apparatus 1 to each component of the processing apparatus 1 via the input / output interface device of the control unit 60.

[0042] The display unit 70 displays: a screen showing the settings of the processing conditions of the processing apparatus 1; a screen showing the processing results; a screen showing settings related to the control of the opening and closing of the suction valve 16-1 and the air supply valve 18-1 based on the control unit 60; and a screen showing settings related to the control of the operation of the first and second take-out units 40 and 50 based on the control unit 60. In this embodiment, the display unit 70 is configured with a liquid crystal display device or the like. The display unit 70 is provided with an input unit for the operator to input information related to various settings of the processing apparatus 1. In this embodiment, the input unit provided in the display unit 70 is configured with at least one of a touch panel and a keyboard provided in the display unit 70. In addition, in this invention, the processing apparatus 1 is not limited to this and may not have a display unit 70. Furthermore, in this invention, the processing apparatus 1 is not limited to this and may be connected to information devices such as smartphones, tablets, wearable devices, and computers in a wired or wireless manner instead of a display unit 70, displaying information on the display section of the information device and operating it using the input section of the information device.

[0043] The cleaning unit 80 cleans the processed workpiece 100, removing processing debris and other foreign matter adhering to it. The box-mounted platform 90 is a platform for holding boxes 95, which serve as containers for holding multiple workpieces 100, and allows the boxes 95 to move up and down in the Z-axis direction. In this embodiment, the processing apparatus 1 has a cleaning unit 80, which serves as one of the destinations for the second transfer unit 50 to move the workpieces 100. However, in this invention, it is not limited to this; an inspection device for checking the quality of the processed workpieces 100 may also serve as the destination for the second transfer unit 50 to move the workpieces 100, and the cleaning unit 80 may not be required.

[0044] Next, this specification will describe the workpiece removal method of the embodiment with reference to the accompanying drawings. The workpiece removal method of the embodiment is a method of removing the workpiece 100 from the holding worktable 10 by means of the first and second removal units 40 and 50, and is implemented using the processing apparatus 1. Figure 4 This is a flowchart illustrating an example of the processing steps of the workpiece removal method according to an embodiment. For example... Figure 4 As shown, the workpiece removal method of the embodiment includes an outer periphery lifting step 1001, a workpiece holding step 1002, and a removal step 1003. The workpiece removal method of the embodiment is implemented, for example, when the workpiece 100 held by the holding surface 13 of the holding table 10 is to be removed after processing in the processing unit 20.

[0045] The peripheral lifting step 1001 is as follows: the porous plate 11 is connected to the suction source 17 through the suction line 16, the workpiece 100 is attracted by the central region 13-1 of the holding surface 13, the processing liquid 35 (water) between the porous plate 11 and the workpiece 100 is removed, and air is supplied to the air supply line 18. Air is ejected from the peripheral region 13-2 surrounding the central region 13-1 so that only the peripheral part of the workpiece 100 is lifted from the holding surface 13, thereby relieving the surface tension of the processing liquid 35 (water) between the porous plate 11 and the workpiece 100.

[0046] In the peripheral buoyancy step 1001, the control unit 60 controls the negative pressure value (gauge pressure) of the suction source 17 to be weaker than when the workpiece 100 is held by suction using the entire holding surface 13 of the perforated plate 11, and opens the suction valve 16-1 of the suction line 16, thereby connecting the perforated plate 11 and the suction source 17 through the suction line 16, and using the central region 13-1 of the holding surface 13 to suction the workpiece 100, removing water such as the processing liquid 35 between the perforated plate 11 and the workpiece 100. Additionally, in the peripheral buoyancy step 1001, the control unit 60 opens the air supply valve 18-1 of the air supply line 18, thereby supplying air from the air supply source 19 to the air supply line 18, and ejecting air from the peripheral region 13-2 of the holding surface 13, causing only the outer periphery of the workpiece 100 to float from the holding surface 13. In the peripheral levitation step 1001, as described above, the negative pressure value (gauge pressure) of the suction source 17 is reduced, and the suction in the central region 13-1 of the holding surface 13 based on the suction line 16 and the levitation of the outer periphery of the workpiece 100 in the peripheral region 13-2 of the holding surface 13 based on the air ejected from the air supply line 18 are performed simultaneously. This allows the processing liquid 35 (water) on the holding surface 13 to be forcibly pulled apart from the back surface 104 side of the workpiece 100 on the holding surface 13, breaking the vacuum state formed between the perforated plate 11 and the workpiece 100, and releasing the surface tension of the processing liquid 35 (water) between the perforated plate 11 and the workpiece 100. Furthermore, the peripheral region 13-2 forming the air ejection outlet can be as follows: Figure 2 The area shown is the outer periphery of the upper surface of the perforated plate 11, or it can be the upper surface of the frame 12 surrounding the perforated plate 11. When the diameter of the workpiece 100 is larger than that of the perforated plate 11, the outer periphery of the workpiece 100 is supported on the upper surface of the frame 12, so it is preferable to form an air outlet on the upper surface of the frame 12.

[0047] The workpiece holding step 1002 is as follows: After the surface tension of the processing liquid 35 (water) between the perforated plate 11 and the workpiece 100 has been released using the peripheral levitation step 1001, the workpiece 100 is held by the first transfer unit 40. In the workpiece holding step 1002, the control unit 60 utilizes the negative pressure generated by the Bernoulli effect through air flow within the tank 45, and uses the plate member 44 of the first transfer unit 40 to hold the workpiece 100, which has been released from the surface tension of the processing liquid 35 (water) between the perforated plate 11 and the holding surface 13, in a non-contact manner.

[0048] The removal step 1003 is as follows: After the peripheral lifting step 1001 and the workpiece holding step 1002, the attraction of the central region 13-1 of the holding surface 13 to the workpiece 100 is cut off, causing the workpiece 100 to leave the holding table 10 as a whole, and the workpiece 100 is removed from the holding table 10. In the removal step 1003, the control unit 60 closes the suction valve 16-1 of the suction line 16, thereby cutting off the communication between the perforated plate 11 and the suction source 17 implemented by the suction line 16, thereby cutting off the attraction of the central region 13-1 of the holding surface 13 to the workpiece 100, causing the workpiece 100 to leave the holding table 10 as a whole. In the removal step 1003, the plate component 44 of the first removal unit 40 thus holds the workpiece 100 in a non-contact manner by using the negative pressure generated by the Bernoulli effect through the flow of air in the slot 45. In the removal step 1003, the control unit 60 then removes the workpiece 100, which is held in a non-contact manner by the plate member 44 of the first removal unit 40.

[0049] Regarding the plate component 44 of the first transfer unit 40, if the non-contact attraction achieved by the negative pressure generated by the Bernoulli effect in the workpiece holding step 1002 is weak and thus cannot completely hold the workpiece 100, then when the attraction of the central region 13-1 of the holding surface 13 to the workpiece 100 is cut off by the subsequent transfer step 1003, and the workpiece 100 is completely removed from the holding table 10, the plate component 44 of the first transfer unit 40 completely holds the workpiece 100.

[0050] In addition, in this embodiment, in the workpiece holding step 1002 and the removal step 1003, the plate member 44 of the first removal unit 40 uses the negative pressure generated by the Bernoulli effect through the air flowing in the groove 45 to hold the workpiece 100 in a non-contact manner. However, this is not the only method of the present invention. The workpiece 100 can also be held by directly contacting the suction pad provided on the lower side of the plate member 44.

[0051] Regarding the processing apparatus 1 and the workpiece removal method of the embodiment having the above-described structure, the holding table 10 has a suction line 16 and an air supply line 18. When removing the processed workpiece 100, the workpiece 100 is attracted by a relatively weak negative pressure in the central region 13-1 of the holding surface 13 through the suction line 16, removing the processing liquid 35 (water) between the perforated plate 11 and the workpiece 100. Furthermore, the outer periphery of the workpiece 100 is lifted from the holding surface 13 by the air supply line 18, breaking the vacuum state formed between the perforated plate 11 and the workpiece 100 and relieving the surface tension of the processing liquid 35 (water). Therefore, the processing apparatus 1 and the workpiece removal method of the embodiment can more effectively drain water from the holding surface 13 and can relieve the workpiece 100 from being fixed to the holding surface 13 due to the surface tension. In addition, the processing apparatus 1 and the workpiece removal method of the embodiment have the following effects: when removing the processed workpiece 100, the removal of the workpiece 100 is performed more reliably.

[0052] For example, in the case of a so-called half-cut, where the workpiece 100 is cut along the predetermined dividing line 102 to form a cutting groove with a depth less than (e.g., about half the thickness) of the workpiece 100, in the case of grinding the workpiece 100 to a very thin thickness, or in the case of edge trimming where the outer periphery of the workpiece 100 is cut in a circumferential manner, in order to prevent damage to the workpiece 100, the workpiece 100 is held in a non-contact manner by the first transfer unit 40 using the Bernoulli effect. Regarding the processing apparatus 1 and the workpiece transfer method of the embodiment, in the case where the workpiece 100 is held in a non-contact manner with a weak force by the first transfer unit 40 using the Bernoulli effect, in particular, by relieving the surface tension of the processing liquid 35 (water) between the perforated plate 11 and the workpiece 100, the effects of the above-described embodiment, which can be achieved by relieving the surface tension and fixing the workpiece 100 to the holding surface 13, can be significantly utilized.

[0053] Furthermore, the present invention is not limited to the embodiments described above. That is, various modifications and implementations can be made without departing from the spirit of the present invention.

Claims

1. A processing apparatus, comprising: A holding table having a holding surface for holding the workpiece; A processing unit that processes the workpiece held by the holding table; A liquid supply nozzle supplies processing liquid to the processing points processed by the processing unit; The transfer unit removes the workpiece from the holding table; and Control unit Its features are, The holding table has the following features: A perforated plate having a central region for attracting and retaining the workpiece; A frame having a recess for receiving the perforated plate; A suction conduit, formed on the bottom surface of the frame, connects the central area to the suction source; and An air supply pipeline, connected to an air supply source, ejects air from the outer perimeter surrounding the central area. The control unit connects the perforated plate to the suction source via the suction line, uses the central area to suction the workpiece, removes water between the perforated plate and the workpiece, and supplies air to the air supply line. Air is ejected from the outer peripheral area, causing the outer periphery of the workpiece to float off the holding surface, relieving the surface tension of the water between the perforated plate and the workpiece. With the surface tension relieved, the workpiece is removed from the holding table by the transfer unit.

2. A method for removing a workpiece from a holding table in a processing apparatus, wherein the workpiece is removed from the holding table by a removal unit. The processing device has the following features: The holding table has a holding surface for holding the workpiece. A processing unit that processes the workpiece held by the holding table; A liquid supply nozzle supplies processing liquid to the processing points being processed using the processing unit; and The removal unit removes the workpiece from the holding worktable. in, The holding table has the following features: A perforated plate having a central region for attracting and retaining the workpiece; A frame having a recess for receiving the perforated plate; A suction conduit, formed on the bottom surface of the frame, connects the central area to the suction source; and An air supply pipeline, connected to an air supply source, ejects air from the outer perimeter surrounding the central area. The method for removing the workpiece comprises the following steps: In the peripheral buoyancy step, the porous plate is connected to the suction source through the suction line, the workpiece is attracted by the central area, the water between the porous plate and the workpiece is removed, and air is supplied to the air supply line. Air is ejected from the peripheral area so that only the peripheral part of the workpiece is buoyed from the holding surface, thereby relieving the surface tension of the water between the porous plate and the workpiece. The workpiece holding step involves holding the workpiece through the transfer unit; as well as The removal step, following the workpiece holding step and the peripheral lifting step, cuts off the attraction of the central region to the workpiece, causing the workpiece to leave the holding table as a whole, and removes the workpiece from the holding table.

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