Sensing sensor and electronic device

By using a cover layer with a low modulus and synthetic rubber material in the sensing sensor, the problem of cracking caused by stress concentration during folding was solved, improving the folding performance and reliability of electronic devices.

CN114764995BActive Publication Date: 2026-06-19SAMSUNG DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SAMSUNG DISPLAY CO LTD
Filing Date
2022-01-07
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

During the folding process, existing electronic devices are prone to developing cracks in their sensors due to stress concentration, affecting their reliability and folding performance.

Method used

By configuring a cover layer with a low modulus in the sensing sensor, located outside the base layer, and setting openings in the folded area to reduce stress concentration, polyimide and synthetic rubber materials are used to improve the flexibility and durability of the cover layer.

Benefits of technology

This effectively reduces stress concentration during folding, prevents cracks in the cover layer, and improves the folding characteristics and reliability of the sensing sensor.

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Abstract

The present invention discloses a sensing sensor and an electronic device. The electronic device includes: a display module divided into a first non-foldable region arranged sequentially along a first direction, a foldable region folded along a virtual folding axis extending in a second direction intersecting the first direction, and a second non-foldable region; and a sensing sensor including a first base layer disposed below the display module, a first sensing coil disposed on the first base layer, a second sensing coil insulated from the first sensing coil, and a first cover layer disposed between the first sensing coil and the second sensing coil, wherein the modulus of the first cover layer is less than the modulus of the first base layer.
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