A new type of wafer defect detection device

Abstract

The present invention relates to a novel wafer defect detection device, which includes a base and a loading rack, a material taking device, a wafer rotation and positioning device, a wafer rack moving device, a wafer flipping device, a wafer defect detection device, a dotting device, a drying device and a discharging device that are sequentially arranged on the base; a wafer rack is arranged on the wafer rack moving device, and the wafer is placed on the wafer rack. The present invention has the advantages of facilitating the detection of double-sided defects of the wafer, dotting and marking the detected defects, drying the dotting marks at the same time to prevent the ink from contaminating the wafer again, and improving the production efficiency, etc.

Description

Technical Field:

[0001] The present invention relates to the field of chip technology, and particularly to a novel wafer defect detection device. Background Art:

[0002] During the production and manufacturing process of wafers, scratches often occur on the surface, and there will be surface stains during the production process. For wafers with such surface scratches or surface stains, when they are subsequently sliced into chips, the chips at the scratched or stained areas generally have poor quality. To avoid such adverse phenomena, wafers need to be detected before slicing to remove defective wafers or mark the defective areas of the wafers. When slicing, the wafers at the marked areas are removed to avoid poor quality of the sliced chips. Currently, the detection of wafer scratches or stains generally uses manual recognition, which is inefficient and prone to missed detection. At the same time, when marking the wafers and putting them into the wafer box before the ink has dried, it will cause secondary contamination of the wafers. Drying the marking ink will also cause time waiting and affect production efficiency.

[0003] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of implication that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention:

[0004] To achieve the above object, the present invention provides a novel wafer defect detection device, which includes a base and a material rack, a wafer picking device, a wafer rotation and positioning device, a wafer rack moving device, a wafer flipping device, a wafer defect detection device, a dotting device, a drying device, and a wafer placing device that are sequentially arranged on the base; a wafer rack is arranged on the wafer rack moving device for placing wafers; the wafer rack moving device moves the wafer rack to a wafer flipping position, a wafer detection position, a wafer dotting position, a wafer drying position, and a wafer rack initial position respectively; the picking device moves the wafer on the material rack to a positioning wafer placement position, and places the positioned wafer on the wafer rack at the wafer rack initial position; the wafer rotation and positioning device picks up the wafer from the positioning wafer placement position, positions the wafer, and then places the positioned wafer back to the positioning wafer placement position; the wafer flipping device picks up the wafer from the wafer rack at the wafer flipping position, flips the wafer, and then places the flipped wafer back to the wafer rack at the wafer flipping position; the wafer defect detection device takes pictures of the wafers on the wafer rack at the wafer detection position; the dotting device makes dot marks on the wafers on the wafer rack at the wafer dotting position; the drying device picks up and dries the dotted wafers on the wafer rack at the wafer drying position; the placing device puts the dried wafers into a waste box or a good product box.

[0005] Furthermore, the material picking device includes a material picking slide rail and a material picking moving cylinder arranged on the base; a material picking moving bracket is slidably arranged on the material picking slide rail; the material picking moving cylinder is connected to the material picking moving bracket to drive the material picking moving bracket to move on the material picking slide rail; a material picking lifting cylinder and a material picking bracket slidably arranged are respectively fixedly arranged on the material picking moving bracket; the material picking lifting cylinder is connected to the material picking bracket to drive the material picking bracket to move on the material picking moving bracket; a material picking suction cup 1 and a material picking suction cup 2 are respectively arranged on the material picking bracket, and the material picking suction cup 1 sucks or releases the wafer on the material rack.

[0006] Furthermore, the wafer rotation positioning device includes a positioning slide rail and a positioning seat respectively arranged on the base; a positioning movable cylinder and a slidable positioning placement frame are respectively fixedly arranged on the positioning slide rail; the positioning movable cylinder is connected to the positioning placement frame to drive the positioning placement frame to move on the positioning slide rail; a positioning rotation motor and a rotatable wafer positioning placement seat are respectively fixedly arranged on the positioning placement frame; the positioning rotation motor is connected to the wafer positioning placement seat to drive the wafer positioning placement seat to rotate; a positioning bracket is arranged on the positioning seat; a positioning light source and a slidable positioning camera bracket are respectively fixedly arranged on the positioning bracket; a positioning camera is arranged on the positioning camera bracket.

[0007] Furthermore, the wafer rack includes a wafer rack base, a plurality of spreading rods, a spreading cylinder and a wafer placement suction cup respectively arranged on the wafer rack base; the spreading rod can movably pass through the wafer placement suction cup and is connected to the spreading cylinder.

[0008] Furthermore, the wafer moving device includes a horizontal linear motor fixedly arranged on the base; a vertical linear motor is arranged on a sliding plate of the horizontal linear motor; and the wafer rack is fixedly arranged on the sliding plate of the vertical linear motor.

[0009] Furthermore, the wafer flipping device includes a flip seat; a flip moving cylinder and a flip moving slide rail are respectively fixedly arranged on the flip seat; a flip slider is slidably arranged on the flip moving slide rail; the flip moving cylinder is connected to the flip slider to drive the flip slider to move on the flip moving slide rail; a flip rotating cylinder and a flip suction cup are respectively fixedly arranged on the flip slider; the flip rotating cylinder is connected to the flip suction cup to drive the flip suction cup to rotate.

[0010] Furthermore, the wafer defect detection device includes a detection seat; a detection bracket is arranged on the detection seat; a detection light source and a detection camera bracket are fixedly arranged on the detection bracket and slidably arranged; and a detection camera is arranged on the detection camera bracket.

[0011] Further, the dotting device includes a dotting machine bracket provided on the detection base; a dotting machine is provided on the dotting machine bracket to make dot marks on the defects of the wafer.

[0012] Further, the drying device includes a drying table and a material placing bracket respectively provided on the base; a drying horizontal moving cylinder is fixedly provided on the material placing bracket; a drying vertical moving cylinder is provided on the slider of the drying horizontal moving cylinder; a drying lifting cylinder is provided on the slider of the drying vertical moving cylinder; a drying moving frame is provided on the slider of the drying lifting cylinder; a drying wafer picking suction cup is provided on the drying moving frame; a wafer picking suction cup insertion groove is provided on the drying table.

[0013] Further, the material placing device includes a material placing moving cylinder and a material placing moving slide rail respectively fixedly provided on the material placing bracket; a material placing lifting cylinder is slidably provided on the material placing moving slide rail; a material placing suction cup is provided on the slider of the material placing lifting cylinder.

[0014] Further, a wafer cassette device is also included; the wafer cassette device includes a waste box, a good product box and a wafer cassette switching cylinder; the wafer cassette switching cylinder is respectively connected to the waste box and the good product box.

[0015] Further, the material rack includes a material rack body and a plurality of guide rods; a jaw cylinder is provided on the material rack body; the guide rods can movably pass through the top surface of the material rack body and are connected to the jaw cylinder.

[0016] Further, a central control unit is also included, and the central control unit includes:

[0017] A positioning picture extraction module for extracting the wafer positioning picture taken by the positioning camera;

[0018] A positioning recognition module for analyzing whether the wafer scribing direction in the wafer positioning picture meets the requirements;

[0019] A defect picture extraction module for extracting the wafer picture taken by the detection camera;

[0020] A defect recognition module for detecting the wafer defects on the wafer picture;

[0021] A defect printing module for controlling the dotting machine to print the wafer defects found by the defect recognition module onto the wafer;

[0022] A work scheduling module for controlling the operation of the material-taking moving cylinder, material-taking lifting cylinder, material-taking suction cup 1, material-taking suction cup 2, positioning moving cylinder, positioning rotating motor, horizontal linear motor, vertical linear motor, flipping moving cylinder, flipping rotating cylinder, flipping suction cup, spreading cylinder, drying horizontal moving cylinder, drying vertical moving cylinder, drying lifting cylinder, drying wafer-taking suction cup, material-releasing moving cylinder, material-releasing lifting cylinder, material-releasing suction cup, and wafer cassette switching cylinder.

[0023] Compared with the prior art, a novel wafer defect detection device of the present invention is provided with a wafer rotation and positioning device for positioning the wafer, a wafer defect detection device for identifying wafer defects, and also a wafer flipping device for flipping the wafer so as to detect the back side of the wafer. The detected defects are marked on the wafer by a dotting device. Further, a drying device is provided to dry the wafer after dotting, preventing the ink marks from contaminating the wafer again, shortening the drying time of the ink marks, and improving production efficiency. Thus, the present invention has the advantages of being convenient for detecting double-sided defects of the wafer, dotting and marking the detected defects, drying the dotting and marking simultaneously to prevent the ink marks from contaminating the wafer again, and improving production efficiency. Description of the Drawings:

[0024] Figure 1 It is a leftward schematic view of a novel wafer defect detection device of the present invention;

[0025] Figure 2 It is a rightward schematic view of a novel wafer defect detection device of the present invention;

[0026] Figure 3 It is a schematic view of the wafer rack moving device of a novel wafer defect detection device of the present invention;

[0027] Figure 4 It is a schematic view of the wafer rack of a novel wafer defect detection device of the present invention;

[0028] Figure 5 It is a schematic view of the material rack of a novel wafer defect detection device of the present invention;

[0029] Figure 6 It is a schematic top view of the working process of a novel wafer defect detection device of the present invention;

[0030] The reference numerals are: 1 - base, 2 - material taking slide rail, 3 - material rack, 301 - material rack body, 302 - jaw cylinder, 303 - guide rod, 4 - discharging suction cup, 5 - wafer cassette device, 6 - discharging moving cylinder, 7 - discharging support, 8 - drying horizontal moving cylinder, 9 - drying moving frame, 10 - drying lifting cylinder, 11 - drying wafer taking suction cup, 12 - detection seat, 13 - wafer rack moving device, 1301 - horizontal linear motor, 1302 - vertical linear motor, 14 - dotting machine support, 15 - dotting machine, 16 - detection support, 17 - detection camera support, 18 - detection camera, 19 - detection light source, 20 - wafer rack, 2001 - wafer rack base, 2002 - expanding cylinder, 2003 - wafer placing suction cup, 2004 - expanding rod, 21 - drying table, 22 - flipping suction cup, 23 - flipping slider, 24 - positioning seat, 25 - positioning support, 26 - positioning camera support, 27 - positioning light source, 28 - positioning slide rail, 29 - positioning placing rack, 30 - positioning moving cylinder, 31 - positioning rotating motor, 32 - wafer positioning placing seat, 33 - positioning camera, 34 - flipping seat, 35 - flipping moving cylinder, 36 - flipping moving slide rail, 37 - flipping moving cylinder, 38 - discharging moving slide rail, 39 - discharging lifting cylinder, 40 - material taking moving cylinder, 41 - material taking moving support, 42 - material taking support, 43 - material taking suction cup 1, 44 - material taking lifting cylinder, 45 - material taking suction cup 2, 46 - drying vertical moving cylinder. Detailed implementation manners:

[0031] The following will describe the detailed implementation manners of the present invention in detail, but it should be understood that the protection scope of the present invention is not limited by the detailed implementation manners.

[0032] Unless otherwise clearly stated, throughout the specification and claims, the term "comprise" or its variations such as "comprises" or "comprising" etc. will be understood to include the stated elements or components, without excluding other elements or other components.

[0033] Such as Figure 1 、 Figure 2As shown in the figure, a new type of wafer defect detection device includes a base 1, and a material rack 3, a wafer picking device, a wafer rotation and positioning device, a wafer rack moving device 13, a wafer flipping device, a wafer defect detection device, a dotting device, a drying device, and a material discharging device that are sequentially arranged on the base 1; a wafer rack 20 is arranged on the wafer rack moving device 13 for placing wafers; the wafer rack moving device 13 moves the wafer rack 20 to a wafer flipping position, a wafer detection position, a wafer dotting position, a wafer drying position, and a wafer rack initial position respectively; the picking device moves the wafer on the material rack 3 to a positioning wafer placement position, and places the positioned wafer on the wafer rack 20 at the wafer rack initial position; the wafer rotation and positioning device picks up the wafer from the positioning wafer placement position, positions the wafer, and then places the positioned wafer back to the positioning wafer placement position; the wafer flipping device picks up the wafer from the wafer rack 20 at the wafer flipping position, flips the wafer, and then places the flipped wafer back to the wafer rack 20 at the wafer flipping position; the wafer defect detection device takes pictures of the wafers on the wafer rack 20 at the wafer detection position; the dotting device makes dotting marks on the wafers on the wafer rack 20 at the wafer dotting position; the drying device picks up and dries the dotted wafers on the wafer rack 20 at the wafer drying position; the material discharging device puts the dried wafers into a waste box or a good product box.

[0034] Furthermore, an embodiment of the picking device of the present invention is given, which includes a picking slide rail 2 and a picking moving cylinder 40 arranged on the base 1. A picking moving bracket 41 is slidably arranged on the picking slide rail 2. The picking moving cylinder 40 is connected to the picking moving bracket 41, and the picking moving cylinder 40 drives the picking moving bracket 41 to move on the picking slide rail 2. A picking lifting cylinder 44 and a picking bracket 42 are respectively fixedly arranged and slidably arranged on the picking moving bracket 41. The picking lifting cylinder 44 is connected to the picking bracket 42, and the picking lifting cylinder 44 drives the picking bracket 42 to move on the picking moving bracket 41. A picking suction cup one 43 and a picking suction cup two 45 are respectively arranged on the picking bracket 42, and the picking suction cup one 43 sucks or releases the wafers on the material rack 3.

[0035] Furthermore, the present invention provides an embodiment of a wafer rotation positioning device, which includes a positioning slide rail 28 and a positioning seat 24 respectively arranged on the base 1, a positioning movable cylinder 30 and a slidably arranged positioning placement frame 29 are respectively fixedly arranged on the positioning slide rail 28, the positioning movable cylinder 30 is connected to the positioning placement frame 29, the positioning movable cylinder 30 drives the positioning placement frame 29 to move on the positioning slide rail 28, a positioning rotation motor 31 and a rotatably arranged wafer positioning placement seat 32 are respectively fixedly arranged on the positioning placement frame 29, the positioning rotation motor 31 is connected to the wafer positioning placement seat 32, the positioning rotation motor 31 drives the wafer positioning placement seat 32 to rotate, a positioning bracket 25 is arranged on the positioning seat 24, a positioning light source 27 and a slidably arranged positioning camera bracket 26 are respectively fixedly arranged on the positioning bracket 25, and a positioning camera 33 is arranged on the positioning camera bracket 26.

[0036] Furthermore, the present invention provides a specific embodiment of the wafer rack 20, such as Figure 4 As shown, it includes a wafer rack base 2001, a plurality of spreading rods 2004, a spreading cylinder 2002 and a wafer placement suction cup 2003 respectively arranged on the wafer rack base 2001, and the spreading rod 2004 can movably pass through the wafer placement suction cup 2003 and is connected to the spreading cylinder 2002.

[0037] Furthermore, the present invention provides a specific embodiment of the wafer moving device, such as Figure 3 As shown, it includes a horizontal linear motor 1301 fixedly arranged on a base 1 , a vertical linear motor 1302 is arranged on a sliding plate of the horizontal linear motor 1301 , and a wafer rack 20 is fixedly arranged on the sliding plate of the vertical linear motor 1302 .

[0038] Furthermore, the present invention provides an embodiment of a wafer flipping device, which includes a flip seat 34, on which a flip moving cylinder 35 and a flip moving slide rail 36 are respectively fixedly arranged, a flip slider 23 is slidably arranged on the flip moving slide rail 36, the flip moving cylinder 35 is connected to the flip slider 23 to drive the flip slider 23 to move on the flip moving slide rail 36, and a flip rotating cylinder 37 and a flip suction cup 22 are respectively fixedly arranged on the flip slider 23, and the flip rotating cylinder 37 is connected to the flip suction cup 22 to drive the flip suction cup 22 to rotate.

[0039] Furthermore, the present invention provides an embodiment of a wafer defect detection device, which includes a detection seat 12, a detection bracket 16 is arranged on the detection seat 12, a detection light source 19 and a detection camera bracket 17 are fixedly arranged on the detection bracket, and a detection camera 18 is arranged on the detection camera bracket 17.

[0040] Further, the present invention provides an embodiment of a dotting device, including a dotting machine bracket 14 disposed on a detection base 12. A dotting machine 15 is disposed on the dotting machine bracket 14. The dotting machine 15 makes dot marks on the defects of the wafer. The dotting machine 15 uses three-axis fine adjustment in the prior art, clamps a dotting device, and the dotting device is driven by an electromagnet, and clamps a thin wire to move up and down to drive the ink in the ink cartridge to the wafer. The size of the dot can be adjusted by controlling the retraction length or thickness of the thin wire to control the size of the ink dot.

[0041] Further, the present invention provides an embodiment of a drying device, including a drying table 21 and a loading bracket 7 respectively disposed on a base 1. A heating wire is disposed in the drying table 21 to heat and dry the wafer placed thereon. A drying horizontal moving cylinder 8 is fixedly disposed on the loading bracket 7. A drying vertical moving cylinder 46 is disposed on the slider of the drying horizontal moving cylinder 8. A drying lifting cylinder 10 is disposed on the slider of the drying vertical moving cylinder 46. A drying moving frame 9 is disposed on the slider of the drying lifting cylinder 10. A drying wafer suction cup 11 is disposed on the drying moving frame 9. Three drying wafer suction cups 11 are provided. To facilitate the drying wafer suction cup 11 to suck the wafer on the drying table 21, a wafer suction cup insertion groove is disposed on the drying table 21. When taking the wafer, the drying wafer suction cup 11 enters from the wafer suction cup insertion groove to the bottom of the wafer, sucks and lifts the wafer to move.

[0042] Further, the present invention provides an embodiment of a loading device, which includes a loading moving cylinder 6 and a loading moving slide rail 38 respectively fixedly disposed on a loading bracket 7. A loading lifting cylinder 39 is slidably disposed on the loading moving slide rail 38. A loading suction cup 4 is disposed on the slider of the loading lifting cylinder 39.

[0043] Further, to classify and store the wafers after detection and drying, the present invention further provides a wafer cassette device 5 on the basis of the above embodiments. The wafer cassette device 5 specifically includes a waste box, a good product box, and a wafer cassette switching cylinder. The wafer cassette switching cylinder is respectively connected to the waste box and the good product box, and pushes the waste box and the good product box to switch positions to the loading position of the loading device.

[0044] Further, wafers have various different size specifications. To prevent the wafers from being scattered, the wafer rack 3 for placing the wafers is as Figure 5 shown, including a rack body 301 and a plurality of guide rods 303. A jaw cylinder 302 is disposed on the rack body 301. The guide rods 303 can movably pass through the top surface of the rack body 301 and are connected to the jaw cylinder 302. When the jaw cylinder 302 works, the jaws of the jaw cylinder 302 drive the guide rods 303 to clamp the wafer at the center of the top surface of the rack body 301 to facilitate the picking device to pick up the wafer.

[0045] Further, it further includes a central control unit, and the central control unit includes:

[0046] A positioning picture extraction module, used to extract the wafer positioning picture taken by the positioning camera 33;

[0047] A positioning and recognition module is used to analyze whether the wafer scoring direction of the wafer positioning image meets the requirements. The positioning and recognition module can use a processor that can run pattern recognition software;

[0048] A defect image extraction module, used to extract the wafer image taken by the inspection camera 18;

[0049] A defect recognition module, used to find wafer defects on the wafer image, the defect recognition module may use a processor capable of running pattern recognition software;

[0050] A defect printing module, used to control the dotting machine 15 to print the wafer defects found by the defect recognition module onto the wafer;

[0051] The work scheduling module is used to control the work of the material picking moving cylinder 40, the material picking lifting cylinder 44, the material picking suction cup 1 43, the material picking suction cup 2 45, the positioning moving cylinder 30, the positioning rotating motor 31, the horizontal linear motor 1301, the vertical linear motor 1302, the flipping moving cylinder 35, the flipping rotating cylinder 37, the opening cylinder 2002, the drying horizontal moving cylinder 8, the drying vertical moving cylinder 46, the drying lifting cylinder 10, the drying wafer picking suction cup 11, the material discharging moving cylinder 6, the material discharging lifting cylinder 39, the material discharging suction cup 4 and the wafer box switching cylinder.

[0052] The working process of the present invention is combined with Figure 6 The instructions are as follows:

[0053] The material-taking moving cylinder moves the material-taking suction cup 1 above the material rack, i.e., position A. At this time, the material-taking suction cup 2 is above the positioning placement rack, i.e., position B. Positioning the wafer placement position -> The material-taking lifting cylinder moves down -> The material-taking suction cup 1 adsorbs the wafer on the wafer rack at position A, and the material-taking suction cup 2 adsorbs the wafer at position B, the positioning wafer placement position (positioning placement rack) -> The material-taking lifting cylinder moves up -> The material-taking moving cylinder moves to the right, the material-taking suction cup 1 moves to position B, the positioning wafer placement position (positioning placement rack), and the material-taking suction cup 2 moves to position D, the initial position of the wafer rack (wafer rack) -> The material-taking lifting cylinder moves down -> The material-taking suction cup 1 places the adsorbed wafer at position A onto the wafer at position B, the positioning wafer placement position (positioning placement rack), and the material-taking suction cup 2 places the adsorbed wafer at position B, the positioning wafer placement position, onto the wafer rack at the initial position of the wafer rack at position D -> The positioning moving cylinder moves the positioning placement rack to position C, the positioning camera takes a photo of the wafer, the positioning image extraction module extracts the wafer positioning image taken by the positioning camera, and the positioning recognition module analyzes whether the wafer notch direction in the wafer positioning image meets the requirements -> Does not meet the requirements -> The positioning rotation motor rotates, driving the wafer positioning placement seat to rotate, and the wafer placed on it rotates accordingly to meet the positioning requirements -> The positioning moving cylinder returns the positioning placement rack to position B, the positioning wafer placement position -> The horizontal linear motor moves the wafer rack to position F, the wafer flipping position -> The vertical linear motor moves the wafer rack to position G, the wafer detection position -> The detection camera takes a photo of the front side of the wafer, the defect image extraction module extracts the front-side image of the wafer taken by the detection camera, and the defect recognition module identifies the wafer defects on the front-side image of the wafer -> The vertical linear motor moves the wafer rack to position F, the wafer flipping position –> The expanding cylinder of the wafer rack drives the expanding rod to lift the wafer -> The flipping moving cylinder drives the flipping suction cup to position F and extends it to the bottom of the wafer on the wafer rack -> The flipping suction cup adsorbs the wafer -> The flipping moving cylinder drives the flipping suction cup adsorbed with the wafer to position E -> The flipping rotation cylinder drives the flipping suction cup to rotate, and the wafer adsorbed on the flipping suction cup rotates simultaneously -> The flipping moving cylinder drives the flipping suction cup to position F, the wafer flipping position -> The flipping suction cup releases the wafer onto the wafer rack -> The vertical linear motor moves the wafer rack to position G, the wafer detection position -> The detection camera takes a photo of the back side of the wafer, the defect image extraction module extracts the back-side image of the wafer taken by the detection camera, and the defect recognition module identifies the wafer defects on the back-side image of the wafer -> The vertical linear motor moves the wafer rack to position H, the wafer dotting position -> The defect printing module controls the dotting machine to print the wafer defects found by the defect recognition module onto the wafer -> The vertical linear motor moves the wafer rack to position I, the wafer drying position –> The expanding cylinder drives the expanding rod to lift the wafer –> There are 3 groups of drying material-taking suction cups in the embodiment of the present invention, numbered in sequence as: drying material-taking suction cup I, drying material-taking suction cup II, and drying material-taking suction cup III. The drying horizontal moving cylinder drives the drying material-taking suction cup I in front of position I,Before the drying pick-up suction cup II reaches position J and the drying pick-up suction cup III reaches position K -> The drying vertical moving cylinder drives the drying pick-up suction cup I to extend into the bottom of the wafer on the wafer rack, the drying pick-up suction cup II to the bottom of the wafer at position J on the drying table (pick-up suction cup insertion slot), and the drying pick-up suction cup III to the bottom of the wafer at position K on the drying table (pick-up suction cup insertion slot) -> The drying pick-up suction cups respectively adsorb the wafers at positions I, J, and K -> The drying lifting cylinder drives the drying pick-up suction cups adsorbed with wafers to lift -> The drying horizontal moving cylinder drives the drying pick-up suction cups to positions J, K, and L respectively, and at the same time the vertical linear motor moves the wafer rack to position D, the initial position of the wafer rack -> The drying lifting cylinder drives the drying pick-up suction cups to descend -> The drying pick-up suction cups release the wafers to positions J, K, and L -> The discharging moving cylinder drives the discharging suction cup to position L -> The discharging lifting cylinder drives the discharging suction cup to descend -> The discharging suction cup adsorbs the wafer at position L -> The discharging lifting cylinder drives the discharging suction cup adsorbed with the wafer to rise -> The discharging moving cylinder drives the discharging suction cup to the discharging position. When the wafer is defect-free, the wafer cassette switching cylinder pushes the good product cassette to the discharging position. When the wafer is defective, the wafer cassette switching cylinder pushes the waste cassette to the discharging position -> The discharging suction cup releases the wafer to the good product cassette or the waste cassette.,

[0054] The foregoing description of the specific exemplary embodiments of the present invention is for purposes of illustration and exemplification. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many changes and variations are possible in light of the above teaching. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the invention and its practical applications, so that those skilled in the art can implement and utilize the various different exemplary embodiments of the present invention, as well as various different selections and changes. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A novel wafer defect detection device, characterized in that: It includes a base (1), and successively arranged on the base (1) are a rack (3), a material taking device, a wafer rotation and positioning device, a wafer rack moving device (13), a wafer flipping device, a wafer defect detection device, a dotting device, a drying device, and a blanking device; a wafer rack (20) is arranged on the wafer rack moving device (13) for placing wafers; the wafer rack moving device (13) moves the wafer rack (20) to a wafer flipping position, a wafer detection position, a wafer dotting position, a wafer drying position, and a wafer rack initial position respectively; the material taking device moves the wafer on the rack (3) to a positioning wafer placement position, and places the positioned wafer on the wafer rack (20) at the wafer rack initial position; the wafer rotation and positioning device takes the wafer from the positioning wafer placement position, positions the wafer, and then places the positioned wafer back to the positioning wafer placement position; the wafer flipping device takes the wafer from the wafer rack (20) at the wafer flipping position, flips the wafer, and then places the flipped wafer back to the wafer rack (20) at the wafer flipping position; the wafer defect detection device takes a photo of the wafer on the wafer rack (20) at the wafer detection position; the dotting device makes dotting marks on the wafer on the wafer rack (20) at the wafer dotting position; the drying device takes the wafer on the wafer rack (20) at the wafer drying position after dotting and dries it; the blanking device puts the dried wafer into a waste box or a good product box; the material taking device includes a material taking slide rail (2) and a material taking moving cylinder (40) arranged on the base (1); a material taking moving bracket (41) is slidably arranged on the material taking slide rail (2); the material taking moving cylinder (40) is connected to the material taking moving bracket (41) to drive the material taking moving bracket (41) to move on the material taking slide rail (2); a material taking lifting cylinder (44) and a slidably arranged material taking bracket (42) are respectively fixed on the material taking moving bracket (41); the material taking lifting cylinder (44) is connected to the material taking bracket (42) to drive the material taking bracket (42) to move on the material taking moving bracket (41); a material taking suction cup one (43) and a material taking suction cup two (45) are respectively arranged on the material taking bracket (42), and the material taking suction cup one (43) sucks or releases the wafer on the rack (3); the wafer rotation and positioning device includes a positioning slide rail (28) and a positioning seat (24) respectively arranged on the base (1); a positioning moving cylinder (30) and a slidably arranged positioning placement rack (29) are respectively fixed on the positioning slide rail (28); the positioning moving cylinder (30) is connected to the positioning placement rack (29) to drive the positioning placement rack (29) to move on the positioning slide rail (28); a positioning rotation motor (31) and a rotatably arranged wafer positioning placement seat (32) are respectively fixed on the positioning placement rack (29); the positioning rotation motor (31) is connected to the wafer positioning placement seat (32) to drive the wafer positioning placement seat (32) to rotate; a positioning bracket (25) is arranged on the positioning seat (24);A positioning light source (27) is fixedly arranged on the positioning bracket (25) respectively, and a positioning camera bracket (26) is slidably arranged; a positioning camera (33) is arranged on the positioning camera bracket (26).; 2. The novel wafer defect detection device according to claim 1, characterized in that: The wafer rack (20) comprises a wafer rack base (2001), a plurality of spreading rods (2004), a spreading cylinder (2002) and a wafer placement suction cup (2003) respectively arranged on the wafer rack base (2001); the spreading rod (2004) can movably pass through the wafer placement suction cup (2003) and is connected to the spreading cylinder (2002).

3. A novel wafer defect detection device according to claim 2, characterized in that: The wafer rack moving device (13) comprises a horizontal linear motor (1301) fixedly arranged on the base (1); a vertical linear motor (1302) is arranged on a sliding plate of the horizontal linear motor (1301); and the wafer rack (20) is fixedly arranged on the sliding plate of the vertical linear motor (1302).

4. A novel wafer defect detection device according to claim 3, characterized in that: The wafer flipping device comprises a flip seat (34); a flip movable cylinder (35) and a flip movable slide rail (36) are respectively fixedly arranged on the flip seat (34); a flip slider (23) is slidably arranged on the flip movable slide rail (36); the flip movable cylinder (35) is connected to the flip slider (23) to drive the flip slider (23) to move on the flip movable slide rail (36); a flip rotating cylinder (37) and a flip suction cup (22) are respectively fixedly arranged on the flip slider (23); the flip rotating cylinder (37) is connected to the flip suction cup (22) to drive the flip suction cup (22) to rotate.

5. A novel wafer defect detection device according to claim 4, characterized in that: The wafer defect detection device comprises a detection seat (12); a detection bracket (16) is arranged on the detection seat (12); a detection light source (19) and a detection camera bracket (17) are respectively fixedly arranged on the detection bracket; and a detection camera (18) is arranged on the detection camera bracket (17).

6. The novel wafer defect detection device according to claim 5, wherein: The dotting device comprises a dotting machine support (14) arranged on the detection seat (12); a dotting machine (15) is arranged on the dotting machine support (14) to dot and mark defects on the wafer.

7. A novel wafer defect detection device according to claim 6, characterized in that: The drying device comprises a drying table (21) and a material discharging support (7) respectively arranged on the base (1); a drying horizontal movable cylinder (8) is fixedly arranged on the material discharging support (7); a drying vertical movable cylinder (46) is arranged on the slider of the drying horizontal movable cylinder (8); a drying lifting cylinder (10) is arranged on the slider of the drying vertical movable cylinder (46); a drying movable frame (9) is arranged on the slider of the drying lifting cylinder (10); a drying film taking suction cup (11) is arranged on the drying movable frame (9); and a film taking suction cup insertion slot is arranged on the drying table (21).

8. A novel wafer defect detection device according to claim 7, characterized in that: The material discharge device comprises a material discharge moving cylinder (6) and a material discharge moving slide rail (38) respectively fixedly arranged on the material discharge bracket (7); a material discharge lifting cylinder (39) slidably arranged on the material discharge moving slide rail (38); and a material discharge suction cup (4) is arranged on a slide block of the material discharge lifting cylinder (39).

9. A novel wafer defect detection device according to claim 8, characterized in that: It also comprises a wafer box device (5); the wafer box device (5) comprises a waste box, a good box and a wafer box switching cylinder; the wafer box switching cylinder is connected to the waste box and the good box respectively.

10. A novel wafer defect detection device according to any one of claims 1 to 9, characterized in that: The material rack (3) comprises a material rack body (301) and a plurality of guide rods (303); a clamping claw cylinder (302) is arranged on the material rack body (301); the guide rods (303) can movably pass through the top surface of the material rack body (301) and are connected to the clamping claw cylinder (302).

11. A novel wafer defect detection device according to claim 10, characterized in that: Also included is a central control unit, the central control unit comprising: A positioning image extraction module, used to extract a wafer positioning image taken by a positioning camera (33); Positioning and recognition module, used to analyze whether the wafer scoring direction of the wafer positioning image meets the requirements; A defect image extraction module, used to extract a wafer image taken by a detection camera (18); Defect recognition module, used to find wafer defects on wafer images; A defect printing module, used for controlling a dotting machine (15) to print the wafer defects found by the defect recognition module onto the wafer; The work scheduling module is used to control the work of the material picking moving cylinder (40), the material picking lifting cylinder (44), the material picking suction cup one (43), the material picking suction cup two (45), the positioning moving cylinder (30), the positioning rotating motor (31), the horizontal linear motor (1301), the vertical linear motor (1302), the flip moving cylinder (35), the flip rotating cylinder (37), the flip suction cup (22), the opening cylinder (2002), the drying horizontal moving cylinder (8), the drying vertical moving cylinder (46), the drying lifting cylinder (10), the drying wafer picking suction cup (11), the material discharging moving cylinder (6), the material discharging lifting cylinder (39), the material discharging suction cup (4) and the wafer box switching cylinder.

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