Transfer device of LED chip, chip assembling process and display screen
By using a transfer head and an isolator in a MicroLED chip transfer device, the problem of solder paste connection between the P and N electrodes was solved, achieving high-yield chip assembly.
CN114783910BActive Publication Date: 2025-11-25SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Patent Information
- Application Number
- CN202210350221.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-04-02
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2042-04-02
Smart Images
Figure CN114783910B_ABST
Abstract
The application provides a transfer device of an LED chip, an assembly process of the chip and a display screen. The transfer device of the LED chip comprises a transfer head, the transfer head has a mounting side, the mounting side has a chip mounting position, the transfer head is configured to fix the chip on the chip mounting position and move the LED chip, a driving device is mounted on the mounting side, a separation piece is connected with the driving device and is arranged close to the chip mounting position, the separation piece has an idle state and a separation state, in the separation state, the separation piece is arranged corresponding to the chip mounting position and is located between a P electrode and an N electrode to separate the P electrode and the N electrode, and in the idle state, the separation piece is arranged away from the chip mounting position. The transfer device of the LED chip provided by the application is beneficial to improving the yield of products.
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Citation Information
Patent Citations
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