PCB laminated stator manufacturing method, PCB laminated stator and motor thereof

Abstract

The application provides a PCB laminated stator preparation method, a PCB laminated stator and a motor thereof. The method comprises the following steps: obtaining at least two substrates; performing a pattern plating operation on each substrate to form a preset coil on each substrate, thereby obtaining a plurality of first-level substrates; performing a pressing operation on the plurality of first-level substrates to obtain a multilayer composite board; and performing a conduction operation on the multilayer composite board to make the coils conduct with each other to form a continuous coil winding, thereby forming the PCB laminated stator. The PCB laminated stator preparation method can greatly reduce the volume and weight of the PCB laminated stator, and is particularly suitable for products with high miniaturization requirements. In addition, the PCB laminated stator does not need to be provided with tooth slots, thereby avoiding the problem of tooth slot speed fluctuation of the motor during operation, and improving the stability of the motor during operation and reducing the noise of the motor during operation.

Description

Technical Field

[0001] This invention relates to the field of motor technology, and in particular to a method for manufacturing a PCB multilayer stator, a PCB multilayer stator, and a motor thereof. Background Technology

[0002] An electric motor is a common device that converts electrical energy into mechanical energy. It mainly consists of a stator and a rotor. The traditional method of manufacturing an electric motor stator is to first cut multiple slots on an iron core, and then manually or automatically wind copper wire into the corresponding slots to obtain the motor stator.

[0003] However, the motor stator produced using the above manufacturing method has a relatively large volume and weight because the copper wire is directly wound into the slots of the iron core. This results in a relatively large overall size and weight of the motor, making it unsuitable for miniaturized products, especially for products with high miniaturization requirements. Further reducing the size of the motor stator is therefore crucial. Furthermore, the multiple slots on the iron core cause fluctuations in the slot rotation speed during motor operation, affecting the stability of the motor stator's operation. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a PCB multilayer stator that is smaller in size, lighter in weight, and more stable in performance, as well as the PCB multilayer stator and its motor.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A method for fabricating a PCB multilayer stator includes:

[0007] Obtain at least two substrates;

[0008] Each of the substrates is subjected to a pattern electroplating operation to form a preset coil in each of the substrates, thereby obtaining multiple primary substrates;

[0009] Multiple primary substrates are laminated together to obtain a multilayer composite board;

[0010] The multilayer composite board is subjected to a conduction operation to enable the coils to conduct to each other and form a continuous coil winding, thus forming a PCB multilayer stator.

[0011] In one embodiment, the pattern electroplating operation includes the following specific steps:

[0012] The pattern electroplating operation sequentially involves the steps of lamination, exposure and development, etching, and film removal.

[0013] In one embodiment, the step of conducting the multilayer composite board includes the following specific steps:

[0014] The multilayer composite board is drilled using a drilling device to form through holes, which are used for interconnection between the coils.

[0015] After the through hole is deslag-removed, it is then copper-plated to form a through hole.

[0016] In one embodiment, before the step of conducting the multilayer composite coil board, the PCB multilayer stator fabrication method further includes: performing a positioning operation on the multilayer composite board so that the through hole is set at a preset position on the multilayer composite board.

[0017] In one embodiment, the line width of each coil is 0.01 mm to 0.05 mm.

[0018] In one embodiment, after the step of performing a conduction operation on the multilayer composite board to enable the coils to conduct to each other to form a continuous coil winding and to form a PCB multilayer stator, the PCB multilayer stator fabrication method further includes:

[0019] The PCB multilayer stator is subjected to solder mask treatment to form a protective layer on the surface of the PCB multilayer stator;

[0020] The PCB stator with the protective layer is cut to remove excess material around the PCB stator.

[0021] In one embodiment, the thickness of the protective layer is 0.2 mil to 0.4 mil.

[0022] In one embodiment, during the cutting operation of the PCB layer stator with the protective layer formed, the PCB layer stator is cut by a cutting device.

[0023] A PCB multilayer stator is obtained by the PCB multilayer stator fabrication method described in any of the above embodiments.

[0024] An electric motor includes a PCB-integrated stator, a rotor assembly, and a housing assembly as described in the above embodiment. The PCB-integrated stator is disposed within the housing assembly, and the PCB-integrated stator and the rotor assembly are rotatably disposed relative to each other.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] 1. The above-described PCB multilayer stator fabrication method uses multiple substrates as carriers. Each substrate undergoes pattern electroplating to form a pre-defined coil. These substrates are then laminated to obtain a multilayer composite board. A conductive process is then applied to the multilayer composite board, allowing the coils to interconnect along its thickness and form a continuous winding. This enables the multiple coils to be stacked on the multilayer composite board, resulting in a miniaturized PCB multilayer stator. Compared to traditional motor stators, the absence of an iron core and copper wire significantly reduces the size and weight of the PCB multilayer stator, making it particularly suitable for products with high miniaturization requirements. Furthermore, since the PCB multilayer stator does not require slots, it avoids the problem of slot speed fluctuations during motor operation, thereby improving motor stability and reducing noise.

[0027] 2. The PCB multilayer stator obtained by the above-mentioned PCB multilayer stator preparation method has multiple substrates separating each coil from the others. In this way, the multiple substrates can play an insulating role and can also transfer the heat in the coils better, thus achieving a better heat dissipation effect. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a flowchart of a PCB multilayer stator fabrication method according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the structure of the first substrate according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the second substrate according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the structure of the third substrate according to an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of the fourth substrate according to an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the connection between the PCB layered stator and the discrete fan according to one embodiment of the present invention.

[0035] Reference numerals: 10, PCB layer stator; 100, first substrate; 110, first coil; 120, first through hole; 200, second substrate; 210, second coil; 220, second through hole; 300, third substrate; 310, third coil; 320, third through hole; 400, fourth substrate; 410, fourth coil; 420, fourth through hole; 500, protrusion; 20, cooling fan; 21, heat sink body; 22, fan blade. Detailed Implementation

[0036] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] This application provides a method for fabricating a multilayer stator for a PCB (Printed Circuit Board), comprising: obtaining at least two substrates; performing a pattern electroplating operation on each substrate to form a preset coil on each substrate, thereby obtaining multiple primary substrates; performing a lamination operation on the multiple primary substrates to obtain a multilayer composite board; and performing a conduction operation on the multilayer composite board to make each coil interconnected to form a continuous coil winding, thereby forming a multilayer stator for the PCB.

[0040] The aforementioned PCB multilayer stator fabrication method uses multiple substrates as carriers. Each substrate undergoes pattern electroplating to form a pre-defined coil. These substrates are then laminated to obtain a multilayer composite board. A conductive process is then applied to the multilayer composite board, allowing the coils to interconnect along its thickness and form continuous windings. This enables the multiple coils to be stacked on the multilayer composite board, resulting in a miniaturized PCB multilayer stator. Compared to traditional motor stators, the absence of an iron core and copper wire significantly reduces the size and weight of the PCB multilayer stator, making it particularly suitable for products with high miniaturization requirements. Furthermore, since the PCB multilayer stator does not require slots, it avoids the problem of slot speed fluctuations during motor operation, thereby improving motor stability and reducing noise. Furthermore, in the PCB multilayer stator prepared by the above-mentioned PCB multilayer stator, since each coil is separated from the other by multiple substrates, the multiple substrates can provide insulation and transfer heat from the coils to the coils, thus achieving a better heat dissipation effect.

[0041] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments:

[0042] like Figure 1 As shown, a method for fabricating a PCB multilayer stator includes some or all of the following steps:

[0043] S100: Obtain at least two substrates.

[0044] It is understandable that by providing at least two substrates, a carrier is provided for each coil so that patterning electroplating operations can be performed on each substrate. Since the weight of multiple substrates is relatively light, the PCB stacked stator is lightweight, so as to better realize the characteristics of a lighter and thinner PCB stacked stator.

[0045] S200: Perform pattern electroplating on each of the substrates to form a preset coil on each of the substrates, thereby obtaining multiple primary substrates.

[0046] In this embodiment, by performing a pattern electroplating operation on each substrate, a preset coil can be formed on each substrate, thereby providing a basic unit for the coil winding, so that connected coil windings can be formed on the multilayer composite board in the future.

[0047] S300: Perform a lamination operation on multiple primary substrates to obtain a multilayer composite board.

[0048] It is understandable that by pressing multiple substrates together, each coil can be separated from the others by using the substrates as barriers. In this way, on the one hand, the multiple substrates can provide insulation, thereby effectively preventing short circuits in the coils; on the other hand, the multiple substrates can better transfer heat from the coils, thus achieving a better heat dissipation effect.

[0049] S400: Perform a conduction operation on the multilayer composite board to make each coil conduct to each other to form a continuous coil winding, forming a PCB multilayer stator.

[0050] It is understandable that by performing a conduction operation in the thickness direction of the multilayer composite board, the coils can be interconnected in the axial direction of the multilayer composite board, thereby enabling the coils to form a continuous coil winding when they are stacked.

[0051] The aforementioned PCB multilayer stator fabrication method uses multiple substrates as carriers. Each substrate undergoes pattern electroplating to form a pre-defined coil. These substrates are then laminated to obtain a multilayer composite board. A conductive process is then applied to the multilayer composite board, allowing the coils to interconnect along its thickness and form continuous windings. This enables the multiple coils to be stacked on the multilayer composite board, resulting in a miniaturized PCB multilayer stator. Compared to traditional motor stators, the absence of an iron core and copper wire significantly reduces the size and weight of the PCB multilayer stator, making it particularly suitable for products with high miniaturization requirements. Furthermore, since the PCB multilayer stator does not require slots, it avoids the problem of slot speed fluctuations during motor operation, thereby improving motor stability and reducing noise.

[0052] The PCB multilayer stator obtained by the above-mentioned PCB multilayer stator fabrication method has multiple substrates separating each coil from the others. In this way, the multiple substrates can provide insulation and transfer heat from the coils to the outside, thus achieving a good heat dissipation effect.

[0053] In one embodiment, the substrate includes a layered base layer and a copper layer to perform a patterned electroplating operation on the substrate to form coils on the surface of the substrate. Since there can be multiple substrates, multiple machines can be used to perform batch patterned electroplating operations on the substrates simultaneously, which can greatly improve the production efficiency of PCB multilayer stators.

[0054] In this embodiment, the base layer is a PP layer, i.e., a polypropylene layer. Because the PP layer is lightweight, has uniform thickness, a smooth and flat surface, good heat resistance, good chemical stability, good electrical insulation, and is non-toxic, the PCB multilayer stator prepared also has the characteristics of being lightweight, having good heat resistance, good chemical stability, and being environmentally friendly.

[0055] In one embodiment, the pattern electroplating operation includes the following specific steps: the pattern electroplating operation sequentially performs lamination, exposure and development, etching, and film removal steps. In this embodiment, by sequentially performing lamination, exposure and development, etching, and film removal steps on multiple substrates, multiple preset coils can be respectively set on corresponding substrates, thereby realizing the printing of preset coils on each substrate, and thus providing basic conductor units for coil windings.

[0056] In this embodiment, the step of laminating multiple primary substrates further includes aluminum foil and prepreg. Specifically, by laminating the aluminum foil and prepreg with multiple substrates, the connection strength between the substrates can be improved, effectively preventing the multilayer composite board from easily detaching.

[0057] In one embodiment, the step of conducting the multilayer composite board includes the following specific steps: drilling the multilayer composite board with a drilling device to form through holes, the through holes being used for interconnection between the coils; after removing slag from the through holes, copper plating is performed on the through holes to form conductive holes.

[0058] In this embodiment, a drilling device is used to drill holes in the thickness direction of the multilayer composite board so that each coil can be interconnected in the thickness direction of the multilayer composite board. Then, the through holes are deslag-removing treatment to remove residual glue residue inside the through holes, thereby obtaining a clean inner wall of the through holes. Then, the through holes are copper-plated to form a conductive layer on the inner wall of the through holes, that is, to form a conductive through hole, so that each coil can be interconnected in the axial direction and form a continuous coil winding.

[0059] In one embodiment, the inner wall of the through-hole is bored to form a groove. This increases the surface area of ​​the inner wall of the through-hole, allowing for the formation of a larger conductive layer within the through-hole. This, in turn, increases the axial current flow area of ​​the PCB stator. Since multiple coils are distributed on the radial plane of the PCB stator, while the through-holes are distributed on the axial plane, the direction of the current in the PCB stator changes due to the conductive layer on the through-hole. This can easily cause current imbalance during commutation. By increasing the surface area of ​​the through-hole to increase the area of ​​the conductive layer, the current flow area of ​​the PCB stator can be improved. The radial current of the B-layer stator can enter the conductive layer of the through-hole wall more smoothly and reliably, thus forming a more stable current magnetic field during operation and improving the stability of the PCB layer stator's performance. On the other hand, since the groove is set on the inner wall of the through-hole, the internal space of the through-hole can be fully utilized, increasing the layering of the PCB layer stator coils. This allows the PCB layer stator to achieve higher power output while ensuring miniaturization, thus meeting the requirements of miniaturized high-power products and making it more adaptable to modern market demands. Furthermore, the increased space on the inner wall of the through-hole improves airflow, allowing the PCB layer stator to dissipate heat more effectively during operation. This prevents overheating during prolonged use, ensuring normal operation and extending the lifespan of the PCB layer stator. Of course, forming grooves on the inner wall of the through-hole is not limited to boring the inner wall; other methods can also be used.

[0060] In one embodiment, there are multiple grooves, each uniformly distributed on the inner wall of the through hole. This further increases the surface area of ​​the inner wall of the through hole, thereby increasing the area of ​​the conductive layer within the through hole. This further increases the current flow within the through hole, allowing the radial current of the PCB stator to enter the conductive layer of the inner wall of the through hole more smoothly and reliably. Consequently, the PCB stator can form a more stable current magnetic field during operation, thus further improving the stability of the PCB stator's performance. Simultaneously, it increases the airflow within the through hole, thereby improving the heat dissipation efficiency of the PCB stator. This further enhances the operational stability of the PCB stator.

[0061] In one embodiment, in the step of boring the inner wall of the through hole, the inner wall of the through hole is boring with a boring bar, and the boring bar moves in an S-shape to form an S-shaped groove on the inner wall of the through hole. This can further improve the axial current of the PCB stator and the air flow in the through hole, and further improve the stability of the PCB stator operation.

[0062] Since multiple S-shaped grooves are formed in the inner wall of the through hole, if the depth of the S-shaped grooves is large, the height of the groove walls will be high, making it difficult for the molten copper to flow between adjacent S-shaped grooves. In one embodiment, by controlling the depth of the S-shaped grooves to be 0.01mm to 0.03mm, the height of the groove walls formed in adjacent S-shaped grooves is smaller, allowing the molten copper to flow smoothly between adjacent S-shaped grooves, thereby enabling a more complete conductive layer to be formed on the inner wall of the through hole.

[0063] It is also understandable that if the S-shaped grooves are densely distributed on the inner wall of the through hole, it will have a certain impact on the flow rate of the copper liquid in the through hole. In order to enable the copper liquid to flow better in each S-shaped groove, in one embodiment, the number of grooves is L = (n-1)*(d+L1), where L is the circumference of the through hole, L1 is the groove width, d is the distance between each groove, and the ratio of the distance d to the circumference of L of the through hole is (0.15~0.5), and n is an integer. In this way, the number of multiple grooves can be better controlled, so that the distance between two adjacent grooves is within a relatively suitable range. On the one hand, it can effectively avoid the formation of highly dense grooves, which is conducive to the better flow of the heat generated by the current in the through hole during operation, that is, better heat dissipation. On the other hand, it can improve the flow rate of copper liquid between adjacent grooves, thereby generating a more complete conductive layer on the inner wall of the through hole. Furthermore, by using the above formula to distribute the number of grooves on the inner wall of the through hole, it is possible to effectively ensure that the axial current and radial current of the PCB layer stator produced in batches are kept within a certain standard value, which is more conducive to automated production.

[0064] In one embodiment, one end of the through-hole is ground to form a protrusion at its periphery. It can be understood that grinding the outer edge of one end of the through-hole effectively reduces the weight of the PCB stator, resulting in a smaller and lighter stator. Furthermore, during subsequent copper plating operations, the protrusion at the outer edge of the through-hole acts as a drainage mechanism, allowing the molten copper to flow into the through-hole more effectively and quickly, thus enabling the rapid formation of a more complete conductive layer within the through-hole.

[0065] In one embodiment, the number of boring tools is multiple, enabling multiple boring tools to simultaneously perform batch boring of through holes, thereby improving the production efficiency of PCB layered stators.

[0066] In one embodiment, a grinding head is used to grind one edge of the through hole, and multiple grinding heads are used to achieve batch grinding of the through holes, thereby improving the production efficiency of PCB layer stators.

[0067] In one embodiment, in order to obtain a fine and thin conductive layer on the inner wall of the through hole, in the step of copper plating the through hole, the copper is first heated, and then the multilayer composite board is immersed in the copper liquid to form a fine and thin conductive layer on the inner wall of the through hole.

[0068] In one embodiment, the heating operation condition is a temperature of 350°C to 450°C. By heating the copper liquid, copper ions can form a conductive layer in the through hole more quickly. The copper liquid is kept at 350°C to 450°C throughout the copperification process to ensure that the deposition rate of copper ions in the through hole remains uniform. In this way, a more uniform and flat conductive layer can be formed on the inner wall of the through hole.

[0069] In one embodiment, before immersing the multilayer composite plate in molten copper, a heating operation is performed on the multilayer composite plate. It is understood that heating the multilayer composite plate reduces the temperature difference between the multilayer composite plate and the molten copper, allowing the newly added multilayer composite plate to react quickly with copper ions, thereby forming a conductive layer on the inner wall of the through-hole more rapidly.

[0070] In one embodiment, the heating operation is performed at 150°C to 200°C for 5 to 10 minutes. By heating the multilayer composite board to 150°C to 200°C and maintaining this temperature for 5 to 10 minutes, the internal temperature of the multilayer composite board reaches 100°C to 120°C, causing a slight expansion of the resin surface on the inner wall of the through-holes. The multilayer composite board is then immediately immersed in molten copper at 350°C to 450°C. Due to the slight expansion of the resin surface on the inner wall of the through-holes, the surface area of ​​the inner wall of the through-holes is increased, and the resin becomes more viscous. This allows copper ions to be reliably deposited on the viscous resin and form a conductive layer on the inner wall of the through-holes. This greatly improves the connection strength between the conductive layer and the inner wall of the through-holes, thus preventing the conductive layer from easily detaching. It should also be noted that during the copper plating process, the copper liquid is maintained at 350℃~450℃ throughout the entire copper plating process. This ensures that the internal temperature of the multilayer composite board can reach 100℃~120℃, allowing the resin inside the multilayer composite board to remain in a slightly expanded state throughout the copper plating process. This ensures that copper ions are deposited on the viscous resin throughout the copper plating process, thereby connecting the conductive layer formed on the inner wall of the through hole with the viscous resin. This improves the connection strength between the conductive layer covering the inner wall of the through hole and the inner wall of the through hole, thus comprehensively improving the connection strength between the conductive layer and the inner wall of the through hole.

[0071] In one embodiment, prior to the copper plating operation on the via, the via is further roughened to increase the roughness of the inner wall of the via, thereby providing multiple attachment points for subsequent copper ion deposition. This allows the copper ions to better adhere to the multiple attachment points, increasing the connection strength between the conductive layer and the inner wall of the via. The roughening of the inner wall of the via also reduces the height of the groove walls, allowing the molten copper to flow better between the grooves. This results in a more complete conductive layer being formed on the inner wall of the via. Furthermore, the increased surface area of ​​the roughened inner wall of the via further increases the axial current of the PCB stator, reducing the difference between the axial current and the radial current of the PCB stator.

[0072] In order to enable the molten copper to flow better in each groove, in one embodiment, the thickness of the roughening layer is 0.01 mm to 0.02 mm, so that a thinner roughening layer can be formed on the inner wall of the through hole, ensuring that copper ions can flow in each groove, so that a more complete and stronger conductive layer can be formed on the inner wall of the through hole.

[0073] In one embodiment, the drilling equipment is a CNC drilling machine. Since the CNC drilling machine can drill multiple multilayer composite boards at the same time, it can realize the mass production of multilayer composite boards and greatly improve the production efficiency of PCB multilayer stators.

[0074] In one embodiment, the drilling operation of the multilayer composite board using a drilling device further includes drilling mounting holes and heat dissipation holes in the multilayer composite board. By drilling mounting holes and heat dissipation holes in the multilayer composite board, the mounting holes can be used to install components, and the heat dissipation holes can dissipate the heat generated by the coil in a timely manner, thereby reducing the heat generated during the operation of the PCB multilayer stator, thereby improving the stability of the PCB multilayer stator operation, and ensuring that the motor can operate normally for a long time.

[0075] In one embodiment, before the step of conducting the multilayer composite coil board, the PCB multilayer stator fabrication method further includes: positioning the multilayer composite board so that the through holes are set at a preset position on the multilayer composite board. By positioning the multilayer composite board, the drilling equipment can better drill the individual coils.

[0076] In one embodiment, the positioning operation includes printing through-hole outlines on the substrate so that the drilling equipment can directly drill through-hole outlines, thereby obtaining the preset through-hole more quickly.

[0077] In one embodiment, the linewidth of each coil is 0.01mm to 0.05mm. It can be understood that by controlling the linewidth of each inner and outer coil to 0.01mm to 0.05mm, a more layered PCB stator can be obtained, thereby better meeting the requirements of products with high miniaturization demands.

[0078] In one embodiment, after the step of conducting the multilayer composite board to make the coils interconnect to form a continuous coil winding and a PCB multilayer stator, the PCB multilayer stator preparation method further includes: performing solder resist treatment on the PCB multilayer stator to form a protective layer on the surface of the PCB multilayer stator; and performing a cutting operation on the PCB multilayer stator with the protective layer to remove excess material around the PCB multilayer stator.

[0079] It is understandable that by performing a solder mask operation on the PCB stator, specifically by applying green oil to the surface of the PCB stator, a protective layer can be formed on the surface of the PCB stator, which can provide better protection for the exposed coils of the PCB stator. Then, the PCB stator with the protective layer is cut to remove excess material around the perimeter of the PCB stator, thereby obtaining a standard-sized and lightweight PCB stator. This achieves a standardized and miniaturized PCB stator, and also improves the compatibility between the PCB stator and the motor, so that users can install the PCB stator on the motor more quickly.

[0080] In one embodiment, the thickness of the protective layer is 0.2mil to 0.4mil, so that a thin protective layer can be covered on the surface of the PCB stacked stator, thereby ensuring that a small and lightweight PCB stacked stator is obtained.

[0081] To enable a thin protective layer to effectively protect the PCB multilayer stator, in one embodiment, the protective layer includes a first coating layer, a second coating layer, and a third coating layer. The first coating layer is formed on the side of each coil facing away from the substrate, the second coating layer is formed on the sidewall where each coil connects to the substrate, and the third coating layer is formed on the substrate. The first coating layer, through the second and third coating layers, forms a continuous protective layer, allowing the first, second, and third coating layers to cover the PCB multilayer stator. The thickness of the first coating layer is 0.4 mil, the thickness of the second coating layer is 0.2 mil, and the thickness of the third coating layer is 0.4 mil. This ensures that a thin protective layer can effectively protect the PCB multilayer stator, resulting in a small, standardized, and highly secure PCB multilayer stator, thereby improving the safety of using small, standardized PCB multilayer stators.

[0082] In one embodiment, during the cutting operation of the PCB stator with the protective layer formed, the PCB stator is cut using a cutting device. It is understood that cutting the PCB stator with a cutting device quickly removes excess material around the PCB stator, thereby improving the production efficiency of the PCB stator.

[0083] In this embodiment, there are multiple cutting devices, which allows multiple cutting devices to simultaneously perform large-scale cutting of PCB multilayer stators, thereby greatly improving the production efficiency of PCB multilayer stators.

[0084] This application also provides a PCB multilayer stator 10, which is obtained by the PCB multilayer stator 10 fabrication method described in any of the above embodiments. It can be understood that by using the above-described PCB multilayer stator 10 fabrication method, a PCB multilayer stator 10 with smaller size, lighter weight, and more stable performance can be obtained, so as to better meet the requirements of miniaturized products.

[0085] In this embodiment, the PCB stator 10 includes a first substrate 100, a second substrate 200, a third substrate 300, and a fourth substrate 400 stacked in phase. The coils include a first coil 110, a second coil 210, a third coil 310, and a fourth coil 410 that are connected in series. The first coil 110 is formed on the first substrate 100, the second coil 210 is formed on the second substrate 200, the third coil 310 is formed on the third substrate 300, and the fourth coil 410 is formed on the fourth substrate 400 to form a four-layer composite board. The PCB stator 10 meets the product requirements for high power miniaturization.

[0086] In one embodiment, there are multiple through holes and multiple protrusions 500, with each protrusion 500 disposed on a through hole so that each protrusion 500 can better conduct heat in the corresponding through hole, thereby allowing the heat in each through hole to dissipate more quickly.

[0087] In one embodiment, each of the protrusions 500 is distributed clockwise or counterclockwise on the PCB stator 10, and multiple S-shaped grooves are formed in the through holes so that multiple vortex channels can be formed when used in conjunction with the cooling fan 20 in the motor, so as to better dissipate the heat generated by the PCB stator 10 during operation, and further improve the heat dissipation efficiency of the motor.

[0088] In this embodiment, the through holes include a first through hole 120, a second through hole 220, a third through hole 320, and a fourth through hole 420. Specifically, as shown... Figure 2 As shown, the first substrate 100 has a plurality of first through holes 120, and each first through hole 120 is spaced apart on the first substrate 100. The first coil 110 is formed on the surface of the first substrate 100 and the inner wall of the first through hole 120, as shown. Figure 3 As shown, the second substrate 200 has a plurality of second through holes 220, and each second through hole 220 is spaced apart on the second substrate 200. The second coil 210 is formed on the surface of the second substrate 200 and the inner wall of the second through holes 220, as shown. Figure 4As shown, the third substrate 300 has a plurality of third through holes 320, and each of the third through holes 320 is spaced apart on the third substrate 300. The third coil 310 is formed on the surface of the third substrate 300 and the inner wall of the third through holes 320, as shown. Figure 5 As shown, the fourth substrate 400 has a plurality of fourth through holes 420, and each of the fourth through holes 420 is spaced apart on the fourth substrate 400. The fourth coil 410 is formed on the surface of the fourth substrate 400 and the inner wall of the fourth through hole 420. The first coil 110, the second coil 210, the third coil 310 and the fourth coil 410 are interconnected to form a continuous coil winding. Each of the first through holes 120, the second through holes 220, the third through holes 320 and the fourth through holes 420 are arranged in a one-to-one correspondence, so that the extension directions of each corresponding first through hole 120, second through hole 220, third through hole 320 and fourth through hole 420 coincide with each other to form a plurality of through holes on the PCB stator 10, thereby realizing that the plurality of coils are interconnected in the axial direction of the PCB stator 10.

[0089] like Figure 2 As shown, in one embodiment, the first coil 110 includes a plurality of spaced first sub-coils and a first connecting line. Each first sub-coil is arranged around the first substrate 100 and forms a region of a first inscribed circle on the first substrate 100. The first connecting line is disposed on the region of the first inscribed circle and is used for partial communication between the spaced first sub-coils, such as... Figure 3 As shown, the second coil 210 includes a plurality of spaced second sub-coils and second connecting lines. Each second sub-coil is arranged around the second substrate 200 and forms a region of a second inscribed circle on the second substrate 200. The second connecting lines are disposed on the region of the second inscribed circle and are used for partial communication between the spaced second sub-coils, such as... Figure 4 As shown, the third coil 310 includes a plurality of spaced third sub-coils and third connecting lines. Each third sub-coil is arranged around the third substrate 300 and forms a region of a third inscribed circle on the third substrate 300. The third connecting lines are used for partial communication between the spaced third sub-coils, such as... Figure 5As shown, the fourth coil 410 includes multiple spaced fourth sub-coils and fourth connecting lines. Each fourth sub-coil is arranged around the fourth substrate 400 and forms a region of a fourth inscribed circle on the fourth substrate 400. The fourth connecting lines are disposed on the region of the fourth inscribed circle and are used for partial communication between the spaced fourth sub-coils. Thus, after the first substrate 100, the second substrate 200, the third substrate 300 and the fourth substrate 400 are pressed together to form a multilayer composite board, and through subsequent conduction operations, the first sub-coils, the second sub-coils, the third sub-coils and the fourth sub-coils can form a continuous coil winding. When the motor is working, the continuous coil winding formed on the PCB stator 10 can generate an electromagnetic field to ensure the normal operation of the motor.

[0090] In one embodiment, each first sub-coil has two first through holes 120 distributed inside, that is, a first distribution area of ​​first through holes 120 is formed on the first substrate 100, and a plurality of first through holes 120 are provided in the circumferential direction of the first inscribed circle, that is, a second distribution area of ​​first through holes 120 is formed on the first substrate 100. In this way, two first through holes are provided inside each first sub-coil, so that the corresponding two through holes can dissipate the heat generated by each first sub-coil in a timely manner. At the same time, the plurality of first through holes 120 distributed in the circumferential direction of the first inscribed circle can also dissipate the heat generated by the plurality of first sub-coils in a timely manner, thereby improving the heat dissipation efficiency of the first substrate 100, and thus realizing more than 10 heat dissipation paths for the PCB layer stator, which can effectively avoid the phenomenon that the motor is prone to short circuit due to excessive temperature.

[0091] Similarly, each of the first sub-coils has two second through holes 220 distributed inside, forming a first distribution area of ​​second through holes 220 on the second substrate 200, and multiple second through holes 220 are arranged in the circumferential direction of the second inscribed circle, forming a second distribution area of ​​second through holes 220 on the second substrate 200. This allows the multiple second through holes 220 to dissipate the heat generated by the multiple second sub-coils in a timely manner, thereby improving the heat dissipation efficiency of the second substrate 100. Similarly, the third substrate 300 and the fourth substrate 400 also have high heat dissipation efficiency. Since each first through hole 120 corresponds one-to-one with each second through hole 220, each third through hole 320 and each fourth through hole 420, the heat dissipation path inside the PCB stator 10 can be greatly improved. This effectively avoids the accumulation of too much heat inside the PCB stator 10, which can cause the motor to fail frequently, thus reducing the frequency of motor failures and ensuring the service life of the components inside the motor, thereby improving the service life of the motor.

[0092] Of course, the number of substrates is not limited to four; it can be two, six, eight, or other numbers, thereby enabling the diversification of PCB layer stator 10 to better adapt to modern market demands.

[0093] like Figure 6 As shown, in one embodiment, in order to improve the heat dissipation efficiency of the PCB stator 10, heat dissipation holes are also provided on the PCB stator 10. In this way, the heat dissipation efficiency of the PCB stator 10 can be further improved, and the service life of the motor can be better ensured.

[0094] This application also provides a motor, including a PCB-integrated stator 10, a rotor assembly, and a housing assembly as described in the above embodiment. The PCB-integrated stator 10 is disposed within the housing assembly, and the PCB-integrated stator 10 and the rotor assembly are rotatably disposed relative to each other. It can be understood that the PCB-integrated stator 10 and the rotor assembly are rotatably disposed relative to each other, and both the PCB-integrated stator 10 and the rotor assembly are disposed on the housing assembly, thereby improving the compactness of the motor structure and facilitating the miniaturization of the motor, thus meeting the requirements of higher-performance miniaturized products. In this embodiment, the motor assembled using the above-described PCB stator can achieve a power of 750KW and has high heat dissipation efficiency, ensuring a high-power motor with high heat dissipation while maintaining miniaturization.

[0095] Because the PCB-integrated stator 10 and rotor assembly can be housed within the housing assembly, the heat generated by the motor during operation is more difficult to dissipate. Please refer to [link / reference needed]. Figure 6 In one embodiment, a heat sink is also included. The heat sink is disposed on one side of the PCB stator 10 and is rotatably mounted on a rotating assembly. The housing assembly has ventilation holes. Thus, when the rotating assembly rotates, it can drive the heat sink to rotate together, so that the heat sink can dissipate the heat generated by the PCB stator 10 to the ventilation holes of the housing assembly in a timely manner, and then dissipate the heat into the air through the ventilation holes, thereby achieving a better heat dissipation effect for the motor.

[0096] In one embodiment, the cooling fan 20 includes a heat dissipation body 21 and fan blades 22. The fan blades 22 are arc-shaped, and each arc-shaped fan blade 22 is spaced apart from each protrusion 500 so that when the cooling fan 20 rotates, the multiple arc-shaped fan blades 22 and the multiple protrusions 500 can form multiple vortex channels. That is, when the cooling fan 20 is running, the heat coming out of the through hole of the protrusion 500 can be introduced into the vortex channel in a timely manner, thereby avoiding the heat coming out of the through hole from dissipating in the radial direction of the housing. This allows the protrusions 500 to dissipate the heat in the through hole in a more concentrated manner in the axial direction of the housing assembly, so that the heat in the through hole can flow out from the vent hole more quickly, thereby improving the heat dissipation efficiency of the motor.

[0097] Please see Figure 6 In one embodiment, there are multiple fan blades 22, and the side of each arc-shaped fan blade 22 facing a protrusion 500 is arc-shaped. This allows the arc-shaped fan blades 22 and the protrusion 500 to better conduct heat in each through hole, thereby allowing the heat in each through hole to be dissipated into the housing assembly more quickly, further improving the heat dissipation efficiency of the motor.

[0098] Compared with the prior art, the present invention has at least the following advantages:

[0099] 1. The above-described PCB multilayer stator fabrication method uses multiple substrates as carriers. Each substrate undergoes pattern electroplating to form a pre-defined coil. These substrates are then laminated to obtain a multilayer composite board. A conductive process is then applied to the multilayer composite board, allowing the coils to interconnect along its thickness and form a continuous winding. This enables the multiple coils to be stacked on the multilayer composite board, resulting in a miniaturized PCB multilayer stator. Compared to traditional motor stators, the absence of an iron core and copper wire significantly reduces the size and weight of the PCB multilayer stator, making it particularly suitable for products with high miniaturization requirements. Furthermore, since the PCB multilayer stator does not require slots, it avoids the problem of slot speed fluctuations during motor operation, thereby improving motor stability and reducing noise.

[0100] 2. The PCB multilayer stator obtained by the above-mentioned PCB multilayer stator preparation method has multiple substrates separating each coil from the others. In this way, the multiple substrates can play an insulating role and can also transfer the heat in the coils better, thus achieving a better heat dissipation effect.

[0101] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for fabricating a PCB multilayer stator, characterized in that, include: Obtain at least two substrates; Each of the substrates is subjected to a pattern electroplating operation to form a preset coil in each of the substrates, thereby obtaining multiple primary substrates; Multiple primary substrates are laminated together to obtain a multilayer composite board; The multilayer composite board is subjected to a conduction operation so that each coil is interconnected to form a continuous coil winding, thus forming a PCB multilayer stator; The step of conducting the circuit in the multilayer composite board includes the following specific steps: The multilayer composite board is drilled using a drilling device to form through holes, which are used for interconnection between the coils. The inner wall of the through hole is bored to form a groove. After the through hole is deslag-removed, it is then copper-plated to form a through hole. The inner wall of the through hole is boring with a boring tool in an S-shape to form an S-shaped groove on the inner wall of the through hole. One end of the through hole is ground to form a protrusion at the periphery of one end of the through hole; The distribution of each of the protrusions on the PCB stacked stator is clockwise or counterclockwise; The PCB stator includes a first substrate, a second substrate, a third substrate, and a fourth substrate stacked in phase. The coil includes a first coil, a second coil, a third coil, and a fourth coil that are connected in series. The first coil is formed on the first substrate, the second coil is formed on the second substrate, the third coil is formed on the third substrate, and the fourth coil is formed on the fourth substrate to form a four-layer composite board. The first coil includes a plurality of spaced first sub-coils and a first connecting line. Each first sub-coil is arranged around the first substrate and forms a region of a first inscribed circle on the first substrate. The first connecting line is disposed on the region of the first inscribed circle and is used for partial communication between the spaced first sub-coils. The second coil includes a plurality of spaced second sub-coils and a second connecting line. Each second sub-coil is arranged around the second substrate and forms a region of a second inscribed circle on the second substrate. The second connecting line is disposed on the region of the second inscribed circle and is used for partial communication between the spaced second sub-coils. The third coil includes a plurality of spaced third sub-coils and a third connecting line. Each third sub-coil is arranged around the third substrate and forms a region of a third inscribed circle on the third substrate. The third connecting line is used for partial communication between the spaced third sub-coils. The fourth coil includes a plurality of spaced fourth sub-coils and a fourth connecting line. Each fourth sub-coil is arranged around the fourth substrate and forms a region of a fourth inscribed circle on the fourth substrate. The fourth connecting line is disposed on the region of the fourth inscribed circle and is used for partial communication between the spaced fourth sub-coils.

2. The PCB multilayer stator fabrication method according to claim 1, characterized in that, The pattern electroplating operation includes the following specific steps: The pattern electroplating operation sequentially involves the steps of lamination, exposure and development, etching, and film removal.

3. The PCB multilayer stator fabrication method according to claim 1, characterized in that, Before the step of conducting the multilayer composite coil board, the PCB multilayer stator fabrication method further includes: performing a positioning operation on the multilayer composite board so that the through hole is set at a preset position on the multilayer composite board.

4. The PCB multilayer stator fabrication method according to claim 1, characterized in that, The line width of each coil is 0.01mm to 0.05mm.

5. The PCB multilayer stator fabrication method according to claim 1, characterized in that, After performing a conduction operation on the multilayer composite board to enable the coils to conduct to each other and form a continuous coil winding, thus forming a PCB multilayer stator, the PCB multilayer stator fabrication method further includes: The PCB multilayer stator is subjected to solder mask treatment to form a protective layer on the surface of the PCB multilayer stator; The PCB stator with the protective layer is cut to remove excess material around the PCB stator.

6. The PCB multilayer stator fabrication method according to claim 5, characterized in that, The thickness of the protective layer is 0.2mil to 0.4mil.

7. A method for fabricating a PCB multilayer stator according to claim 5, characterized in that, In the cutting operation of the PCB layer stator with the protective layer formed, the PCB layer stator is cut by a cutting device.

8. A PCB multilayer stator, characterized in that, The PCB multilayer stator is prepared using any one of claims 1 to 7.

9. An electric motor, characterized in that, The system includes the PCB layer stator, rotor assembly, and housing assembly as described in claim 8, wherein the PCB layer stator is disposed within the housing assembly, and the PCB layer stator and the rotor assembly are rotatably disposed relative to each other.

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