Sealing assembly and device comprising the same

Abstract

Various embodiments of a hermetic assembly and methods of forming such an assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by laser bonding, and a ferrule having a body and a flange extending from the body. The flange is welded to a weld portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Description

Technical Field

[0001] This disclosure generally relates to sealing assemblies including rings and devices including such assemblies. Background Technology

[0002] Various systems require an airtight seal between the window and the housing. Typically, the window may comprise a dielectric material, while the housing may comprise a metal. Such devices may include sensors or ports that require the window to be transmissive to electromagnetic radiation for emitting or detecting, or for observing one or more components housed within the housing.

[0003] Furthermore, other systems may require electrical coupling between electrical components housed within a hermetically sealed housing and external devices. Typically, this electrical coupling needs to withstand various environmental factors to maintain the stability of one or more conductive pathways from the outer surface to the housing. For example, implantable medical devices (IMDs) including electronic circuitry and battery components, such as pacemakers, defibrillators, neurostimulators, and drug pumps, require a housing or enclosure to house and hermetically seal these components within the patient's body. Many of these IMDs include one or more electrical feedthrough assemblies to provide electrical connections between components contained within the housing and components of the IMD outside the housing; for example, sensors and / or electrodes and / or leads mounted on the outer surface of the housing, or electrical contacts housed within a connector head mounted on the housing to provide coupling to one or more implantable leads. These leads typically carry one or more electrodes and / or one or more other types of physiological sensors.

[0004] Feedthrough assemblies typically include one or more feedthrough pins that extend between the inside and outside of a housing via rings. Each feedthrough pin is electrically isolated from the ring, and for multipole assemblies, they are electrically isolated from each other by insulating elements (e.g., glass or ceramic) mounted within the ring and surrounding the feedthrough pins. Glass insulators are typically sealed directly to the pins and rings, for example, by heating the assembly to a temperature at which the glass wets the pins and rings, while ceramic insulators are typically sealed to the pins and rings via brazing joints. High temperatures are typically required to bond corrosion-resistant conductive materials with corrosion-resistant insulating materials. Summary of the Invention

[0005] The present disclosure generally relates to various embodiments of a sealing assembly. The assembly includes a collar comprising a body and a flange extending from the body. The flange is welded to a weld portion of a patterned layer disposed between the flange and a first main surface of a dielectric substrate of the assembly, such that the collar is hermetically sealed to the dielectric substrate. The sealing assembly can form part of a hermetically sealed package, wherein a housing of the package can be connected to the collar of the assembly.

[0006] In one example, aspects of this disclosure relate to a sealing assembly including a dielectric substrate having a first main surface and a second main surface, a patterned layer laser-bonded to the first main surface of the dielectric substrate, and a collar having a body and a flange extending from the body. A welded portion of the flange is soldered to the patterned layer, the welded portion being disposed between the flange and the first main surface of the dielectric substrate, such that the collar is hermetically sealed to the dielectric substrate.

[0007] In another example, several aspects of this disclosure relate to a hermetically sealed package including a housing and a hermetically sealed assembly forming part of the housing. The hermetically sealed assembly includes a dielectric substrate having a first main surface and a second main surface, a patterned layer laser-bonded to the first main surface of the dielectric substrate, and a ferrule having a body and a flange extending from the body. A welded portion of the flange is welded to the patterned layer, the welded portion being disposed between the flange and the first main surface of the dielectric substrate, such that the ferrule is hermetically sealed to the dielectric substrate. An edge of the ferrule body is connected to an edge of the housing.

[0008] In another embodiment, aspects of this disclosure relate to a method comprising laser bonding a patterned layer to a first main surface of a dielectric substrate, and welding a flange of a ferrule to a welding portion of the patterned layer such that the welding portion is between the flange and the first main surface of the dielectric substrate, and the ferrule is hermetically sealed to the dielectric substrate. The flange extends from the body of the ferrule.

[0009] Details of one or more aspects of this disclosure are set forth in the accompanying drawings and the following description. Other features, objects, and advantages of the technology described in this disclosure will be apparent from the description and drawings and from the claims. Attached Figure Description

[0010] Figure 1 This is a schematic cross-sectional view of one embodiment of the sealing assembly.

[0011] Figure 2 yes Figure 1 A schematic top view of the sealing assembly.

[0012] Figure 3 It includes Figure 1 A schematic cross-sectional view of the hermetic sealing package of the sealing assembly.

[0013] Figure 4 It is formed Figure 3 A flowchart of an embodiment of a method for a hermetically sealed encapsulated body.

[0014] Figure 5 This is a schematic side view of one embodiment of an implantable medical device.

[0015] Figure 6 yes Figure 5 A schematic cross-sectional view of a portion of the hermetically sealed package of an implantable medical device.

[0016] Figure 7 yes Figure 5 A schematic perspective cross-sectional view of an hermetically sealed package for an implantable medical device.

[0017] Figure 8 yes Figure 7 A schematic bottom perspective view of the sealing assembly of the hermetic seal package.

[0018] Figure 9 This is a schematic perspective view of another embodiment of an implantable medical device.

[0019] Figure 10 yes Figure 9 A schematic cross-sectional view of a portion of an implantable medical device.

[0020] Figure 11 This is a schematic perspective view of another embodiment of an implantable medical device.

[0021] Figure 12 yes Figure 11 A schematic cross-sectional view of an implantable medical device.

[0022] Figure 13 This is a schematic cross-sectional view of another embodiment of the sealing assembly.

[0023] Figure 14 yes Figure 13 A schematic plan view of the sealing assembly.

[0024] Figure 15 This is a schematic cross-sectional view of another embodiment of the hermetic seal package.

[0025] Figure 16 yes Figure 3 A schematic side view of a portion of an airtight sealed package. Detailed Implementation

[0026] The present disclosure generally relates to various embodiments of a hermetically sealed assembly. The assembly includes a collar comprising a body and a flange extending from the body. As used herein, the term "collar" refers to an element or assembly located between two or more additional components to facilitate physical connection and / or provide structural support for components in the assembly. The flange is welded to a weld portion of a patterned layer disposed between the flange and a first main surface of a dielectric substrate of the assembly, such that the collar is hermetically sealed to the dielectric substrate. The hermetically sealed assembly may form part of a hermetically sealed package, wherein a housing of the package may be connected to the collar of the assembly.

[0027] Some feedthrough assemblies include a dielectric substrate attached to a metal battery or casing. However, bonding a dielectric material to a metallic material can be challenging. Some techniques for performing this bonding require polishing the bonding surface of the metal battery or casing to make it extremely smooth. This smooth bonding surface must be kept clean before bonding to present a flat, smooth, and clean surface for bonding.

[0028] Other techniques for bonding dielectric and metallic materials include bonding or brazing a weld ring to the dielectric wafer, and then welding the metal casing or battery to the weld ring. However, these techniques still require polishing the bonding surfaces of the dielectric wafer and the weld ring to make them very smooth. And while brazed weld rings may not require the same level of surface preparation as other types of bonding, brazing is a high-temperature process that can generate stress in the material and, due to such thermal stress, limits the processing sequence, size, shape, and design of the assembly.

[0029] One or more embodiments of this disclosure provide a sealing assembly including a flanged ferrule welded to a patterned layer disposed on a main surface of a dielectric substrate. The ferrule can be attached to a housing or battery with minimal or no polishing or using a solder ring. Furthermore, compared to assemblies using solder rings or other connection techniques, the ferrule can allow for thinner housing sidewalls and provide a larger area for electronic components on the dielectric substrate. One or more embodiments of this disclosure can further simplify the attachment of the housing to the dielectric substrate of the sealing assembly. Additionally, the ferrule can help protect the edges of the dielectric substrate and also isolate the substrate from some external loads that could damage it. One or more embodiments of the ferrule described herein can be coupled to only one side of the dielectric substrate, without needing to be coupled to the other side. Furthermore, it is possible to coupled the ferrule to the substrate after the component has been disposed on the substrate, as it is not necessary to solder the ferrule to the high processing temperatures typically required for the substrate.

[0030] Different embodiments of the sealing assembly described herein can be included in a hermetically sealed package suitable for any appropriate application. In one or more embodiments, the hermetically sealed package can maintain the integrity of the conductive path connecting external contact electrodes or devices to components housed within the package, while protecting the enclosed electronic device or circuitry from undesirable external environmental factors.

[0031] Various embodiments of sealing assemblies and hermetic sealing packages including such assemblies can be used with any suitable device or system, such as electronic systems used in smartphones, tablets, laptops, construction equipment, underwater equipment, implantable medical devices, etc.

[0032] Figures 1 to 2 These are various schematic diagrams of one embodiment of the sealing assembly 10. In one or more embodiments, the sealing assembly 10 may be a feedthrough assembly as it includes one or more feedthroughs 18, as further described herein. The assembly 10 includes a dielectric substrate 12 having a first main surface 14 and a second main surface 16, feedthroughs 18 disposed in the dielectric substrate, and a patterned layer 20 connected to the first main surface of the dielectric substrate. In one or more embodiments, the patterned layer 20 may be a patterned conductive layer. The assembly 10 also includes a collar 22 having a body 24 and a flange 26 extending from the body. The collar 22 is connected to a solder portion 28 of the patterned conductive layer 20, the solder portion 28 being disposed between the flange 26 and the first main surface 14 of the dielectric substrate 12, such that the collar is hermetically sealed to the dielectric substrate.

[0033] The dielectric substrate 12 may comprise any suitable one or more materials. In one or more embodiments, the substrate 12 may comprise at least one of the following dielectric materials: glass, quartz, silicon dioxide, sapphire, silicon carbide, diamond, or gallium nitride. Furthermore, the substrate 12 may comprise at least one of the following biocompatible materials or coatings or layers that provide biocompatibility.

[0034] In one or more embodiments, substrate 12 may be a transparent substrate. As used herein, the phrase "transparent substrate" refers to a substrate that can transmit a given percentage of electromagnetic radiation incident upon it during the use of the laser bonding techniques described herein to preferentially heat only the primary surfaces of the substrate (e.g., the first primary surface 14 or the second primary surface 16 of substrate 12) without heating the internal bulk of the substrate, thereby producing a bond with a relatively greater strength than the bulk strength of the substrate. In one or more embodiments, substrate 12 may be substantially transparent within a desired wavelength or wavelength range. As used herein, the phrase "substantially transparent" means that, assuming no reflection at the air-substrate boundary, the substrate transmits more than 50% of the electromagnetic radiation incident upon it for a selected wavelength or wavelength range. In one or more embodiments, substrate 12 may substantially transmit electromagnetic radiation having a wavelength of at least 200 nm. In one or more embodiments, substrate 12 may substantially transmit electromagnetic radiation with wavelengths greater than 10,000 nm. In one or more embodiments, substrate 12 may substantially transmit electromagnetic radiation in the wavelength range of 200 nm to 10,000 nm. In one or more embodiments, substrate 12 may substantially transmit at least one of UV light, visible light, or IR light.

[0035] The substrate 12 may include any suitable size, such as thickness. Furthermore, the substrate 12 may take any suitable shape or one or more forms. The substrate 12 may be a single, monolithic substrate or multiple substrates joined together using any suitable technology or one or more techniques.

[0036] Feedthrough 18 is disposed in substrate 12 and may include any suitable one or more feedthroughs providing electrical connection between a first primary surface 14 and a second primary surface 16 of the substrate. In one or more embodiments, assembly 10 may include an array of feedthroughs 18. Sealing assembly 10 may include any suitable number of feedthroughs, such as 1, 2, 3, 4, 5, 10, 20 or more feedthroughs. Each feedthrough 18 of assembly 10 may be substantially identical in structure. In one or more embodiments, one or more feedthroughs may have characteristics different from one or more additional feedthroughs. Feedthrough 18 may include a via 30 disposed between the first primary surface 14 and the second primary surface 16 of substrate 12. Conductive material 32 may be disposed in the via 30 to provide electrical path between the first primary surface 14 and the second primary surface 16 of substrate 12.

[0037] The feedthrough 18 may also include an external contact 34. In one or more embodiments, the external contact 34 may be part of a patterned conductive layer 20 disposed adjacent to a first primary surface 14 of the substrate 12. As used herein, the term "adjacent to the first primary surface of the substrate" means that an element or assembly is disposed closer to the first primary surface of the substrate than a second primary surface of the substrate. In one or more embodiments, the external contact 34 may be disposed on the first primary surface 14 of the substrate 12. The external contact 34 may be disposed on a via 30 adjacent to the first primary surface 14 of the substrate 12. In one or more embodiments, the external contact 34 may be electrically connected to a conductive material 32 disposed in the via 30. The external contact 34 may be hermetically sealed to the first primary surface 14 of the substrate 12 using any suitable one or more techniques.

[0038] The via 30 of the feedthrough 18 can be of any suitable size and take any suitable shape. The size and shape of the via 30 depend on the thickness of the substrate 12 and the technique used to provide the conductive material 32, which forms an electrical path between the first main surface 14 and the second main surface 16 of the substrate 12. Exemplary shapes of the via 30 may include parallel surface walls and / or tapered surface walls. In one or more embodiments where the substrate 12 has a thickness of about 100 to 500 μm, a typical opening of the via 30 at the first main surface 14 of the substrate 12 may be no greater than 500 μm, or no greater than 250 μm, or no greater than 100 μm, or no greater than 80 μm, or no greater than 50 μm, or no greater than 10 μm. Of course, the diameter of the via 30 may be greater than (or less than) the examples shown, depending on the substrate thickness and / or one or more techniques used to provide the conductive material forming the electrical path. Any suitable technique or technique can be used to form the via 30, such as drilling, chemical etching, laser etching, etc.

[0039] The feedthrough 18 may further include a conductive material 32 disposed in the via 30 to provide a conductive path between the first primary surface 14 and the second primary surface 16 of the substrate 12. The conductive material 32 may include any suitable one or more conductive materials, such as copper, titanium, aluminum, chromium, nickel, gold, platinum, composites (e.g., silver-filled epoxy resin), and combinations thereof. The conductive material 32 may be disposed in the via 30 using any suitable one or more techniques to provide a conductive path from the external contact 34 to one or more devices or contacts disposed on or near the second primary surface 16 of the substrate 12. In one or more embodiments, the conductive material 32 may be disposed in the via 30 such that it substantially fills the via. In one or more embodiments, the conductive material 32 may be disposed in the via along the sidewalls of the via and the opening of the via at the first primary surface 14.

[0040] Feedthrough 18 may also include external contact 34. In one or more embodiments, external contact 34 may be adapted to electrically couple feedthrough 18 to a conductor or contact of a device, such as a contact in the head of an implantable medical device. Such conductor and contact may be electrically coupled to external contact 34 using any suitable one or more techniques, such as welding, physical contact, fusion, etc. External contact 34 may include any suitable conductive material or combination of conductive materials, such as at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, Kova iron-nickel-cobalt alloy, or nickel (including cladding structures, laminates, etc.). In one or more embodiments, external contact 34 may include two or more materials, such as bimetals, cladding laminates, etc.

[0041] Furthermore, the external contact 34 can take any suitable shape or one or more shapes. In one or more embodiments, the external contact 34 can take a circular shape in a plane parallel to the first main surface 14 of the substrate 12, such as... Figure 2 As shown. In one or more embodiments, the external contact 34 may take a rectangular shape in a plane parallel to the first main surface 14 of the substrate 12. Furthermore, the external contact 34 may take any suitable one or more shapes in a plane orthogonal to the first main surface 14 of the substrate 12, such as a square, cone, dome, etc. In one or more embodiments, the external contact 34 may take a shape substantially the same as the external contacts of one or more additional feedthroughs 18. In one or more embodiments, the external contact 34 may take a shape different from the external contacts of one or more additional feedthroughs 18. Furthermore, in one or more embodiments, the one or more external contacts 34 may include complex shapes, such as grooves or channels formed in the contacts, to facilitate the connection of conductors or electronic devices to the contacts.

[0042] The external contact 34 may also include any suitable size. In one or more embodiments, the contact 34 may have any suitable thickness in a direction perpendicular to the first main surface 14 of the substrate 12. It is conceivable that, for the purposes of this disclosure, the size of the external contact thickness is limited only by manufacturing techniques. With this in mind, in one or more exemplary embodiments, a typical thickness may be at least 2 micrometers. In other exemplary embodiments, a thickness of less than 10 millimeters may be desirable, although larger thicknesses are also contemplated according to embodiments of this disclosure. The thickness of the contact 34 may be the same as or different from the thickness of the external contacts of one or more additional feedthroughs. In one or more embodiments, the external contact 34 may have sufficient size and thickness to enable the electrical coupling of conductors and / or electronic devices to the external contact using laser, resistance, or other welding and bonding techniques.

[0043] In one or more embodiments, the external contact 34 may be formed or disposed on the via 30 on the first main surface 14 of the substrate 12. For the purposes of this disclosure, the terms “forming,” “in the process of forming,” and “forming” will be used interchangeably with the terms “disposed,” “being disposed,” and “disposed,” respectively, such that these terms are considered equivalent. In other words, the external contact 34 is disposed over the via 30 such that the contact covers the via and the via is not visible in a plan view of the first main surface 14 of the substrate 12. In one or more embodiments, the external contact 34 (or any external contact described herein) may be formed separately from the substrate 12 as a discrete component, or it may be patterned from a conductive sheet or foil.

[0044] External contact 34 is electrically coupled to conductive material 32 disposed in through-hole 30. In one or more embodiments, external contact 34 is in direct contact with conductive material 32 to electrically couple the contact to the conductive material. In one or more embodiments, one or more additional conductive layers (e.g., interlayer 40) may be disposed between external contact 34 and conductive material 32 to electrically couple the external contact to the conductive material.

[0045] In one or more embodiments, the external contact 34 is hermetically sealed to the first main surface 14 of the substrate 12. Any suitable one or more techniques can be used to hermetically seal the external contact 34 to the first main surface 14 of the substrate 12. For example, in one or more embodiments, such as Figure 2 As shown, the external contact 34 can be hermetically sealed to the first main surface 14 of the substrate 12 via a bonding 35 surrounding the via 30. This bonding 35 can be formed using any suitable technique or one or more. For example, in one or more embodiments, the bonding 35 can be formed using a laser to provide a laser bond. By surrounding the via 30 with the bonding 35 that hermetically seals the external contact 34 to the first main surface 14 of the substrate 12, the via is also protected from the external environment. Therefore, the electrical coupling between the external contact 34 and the conductive material 32 disposed in the via 30 is protected, and the integrity of this electrical path from the first main surface 14 of the substrate to the second main surface 16 can be maintained. In one or more embodiments, the external contact 34 can also be attached to the first main surface 14 of the substrate 12 using bonding other than the bonding 35. For example, in one or more embodiments, the external contact 34 can be attached to the first main surface 14 via the bonding 35 and one or more additional bondings (e.g., point bonding) between the external contact 34 and the first main surface.

[0046] In one or more embodiments, the feedthrough 18 may include an internal contact 36 disposed adjacent to a second primary surface 16 of the substrate 12. As used herein, the term "adjacent to a second primary surface of the substrate" means that an element or assembly is disposed closer to the second primary surface than to a first primary surface of the substrate. The internal contact 36 may include any suitable one or more materials, such as the same material used for the external contact 34 or other materials, and may be formed using any suitable one or more techniques, such as sputtering, electroplating, evaporation, etc. Furthermore, the internal contact 36 may take any suitable one or more shapes and have any suitable thickness in a direction perpendicular to the second primary surface 16 of the substrate 12, such as the same shape and thickness described with respect to the external contact 34, or other thicknesses and shapes, such as conductive traces.

[0047] An internal contact 36 is disposed above a via 30 on the second main surface 16 of the substrate 12. The contact 36 can be electrically coupled to a conductive material 32 disposed in the via 30. The arrangement 30 of the external contact 34, the via 30, and the internal contact 36 facilitates the formation of an electrical path between the outer side adjacent to the first main surface 14 and the inner side adjacent to the second main surface 16. In one or more embodiments, the internal contact 36 is hermetically sealed to the second main surface 16 of the substrate 12 using any suitable technique, such as by bonding around the via 30 (e.g., laser bonding).

[0048] The patterned layer 20 is connected to the first main surface 14 of the dielectric substrate 12. The patterned layer 20 may comprise any suitable one or more conductive or non-conductive materials, such as at least one selected from copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, Kova iron-nickel-cobalt alloy, or nickel. Figures 1 to 2 In the illustrated embodiment, the patterned layer 20 is a patterned conductive layer. In one or more embodiments, the patterned conductive layer 20 may comprise one or more foils disposed using any suitable technique or technology. The patterned conductive layer 20 may comprise any suitable layer or sublayer.

[0049] Furthermore, when connected to the first main surface 14 of the dielectric substrate 12, the patterned conductive layer 20 can be arranged in any suitable pattern. In one or more embodiments, one or more portions of the patterned conductive layer 20 may form one or more external contacts 34 of one or more vias 18 disposed in the dielectric substrate 12. Additionally, the patterned conductive layer 20 may include one or more solder portions 28 for attaching the collar 22 to the dielectric substrate 12, as further described herein.

[0050] The patterned conductive layer 20 can be disposed on or adjacent to the first main surface 14 of the dielectric substrate 12 using any suitable technique or one or more of the following methods: photolithography, etching, plasma vapor deposition, chemical vapor deposition, electroplating, laser bonding, etc. In one or more embodiments, the patterned conductive layer 20 can be attached to the first main surface 14 by one or more laser bonding techniques 59.

[0051] In one or more embodiments, assembly 10 may include a second patterned conductive layer 38 disposed on or adjacent to a second main surface 16 of dielectric substrate 12. The second patterned conductive layer 38 may include any suitable patterned conductive layer, such as patterned conductive layer 20. In one or more embodiments, one or more portions of the second patterned conductive layer 38 may provide one or more internal contacts 36 of one or more feedthroughs 18. The same design features and possibilities described herein with respect to the first patterned conductive layer 20 may be applied to the second patterned conductive layer 38.

[0052] The patterned conductive layer 20 may include any suitable number of layers. For example, the patterned conductive layer 20 may include a conductive sublayer 60 and an interlayer 40 disposed between the conductive sublayer and a first main surface 14 of the dielectric substrate 12. The interlayer 40 may include any suitable one or more materials, such as titanium, niobium, tantalum, zirconium, and alloys thereof. Furthermore, the interlayer 40 may have any suitable dimensions. In one or more embodiments, the interlayer 40 may have a thickness of at least 50 nanometers and no more than 10 micrometers, measured in a direction perpendicular to the first main surface 14 of the dielectric substrate 12. The interlayer 40 may be disposed between the conductive sublayer 60 and the first main surface 14 of the dielectric substrate 12 using any suitable one or more techniques, such as the same techniques described herein with respect to the patterned conductive layer 20. In one or more embodiments, the interlayer 40 and the conductive sublayer 60 may be disposed on the first main surface 14 of the substrate 12 and then patterned using any suitable one or more techniques. Furthermore, the second patterned conductive layer 38 may include any suitable number of layers. Although not shown, the second patterned conductive layer 38 may include one or more conductive sublayers and an interlayer disposed between the conductive sublayers and the second main surface 16 of the dielectric substrate 12. Any suitable interlayer, such as interlayer 40, may be used.

[0053] A collar 22 is connected to a dielectric substrate 12. The collar 22 may comprise any suitable one or more materials, such as at least one of titanium, niobium, or stainless steel. In one or more embodiments, the collar 22 may comprise a conductive material. The collar 22 may take any suitable one or more shapes and have any suitable dimensions.

[0054] For example, such as Figure 2 As shown, the collar 22 may have an elliptical shape in a plane parallel to the first main surface 14 of the substrate 12. Furthermore, the flange 26 may also be elliptical in a plane parallel to the first main surface 14 of the substrate 12.

[0055] The collar 22 includes a body 24 and a flange 26 extending from the body. The flange 26 may be integrally formed with the body 24 or manufactured separately and attached to the body using any suitable one or more techniques. The flange 26 may include the same one or more materials used to form the body 24. In one or more embodiments, the flange 26 and the body 24 may include different materials.

[0056] As described herein, the collar 22 can be attached to the dielectric substrate 12 using any suitable one or more techniques. Figure 1 As shown, a collar 22 is connected to a solder portion 28 of the patterned conductive layer 20, which is disposed between a flange 26 and a first main surface 14 of the dielectric substrate 12, such that the collar is hermetically sealed to the dielectric substrate. In one or more embodiments, the collar 22 may be connected to a second main surface 16 of the dielectric substrate 12. Furthermore, in one or more embodiments, the collar 22 may be connected to both the first and second main surfaces 14 of the dielectric substrate; for example, the collar may include a second flange (not shown) that can be connected to the second main surface of the dielectric substrate. In one or more embodiments, when the collar 22 is connected to the solder portion, the main surface 42 of the flange 26 contacts the solder portion 28 of the patterned conductive layer 20. In one or more embodiments, the main surface 42 of the flange 26 is substantially parallel to the first main surface 14 of the dielectric substrate 12. As used herein, the term "substantially parallel" means that the angle formed between the main surface 42 of the flange 26 and the first main surface 14 of the dielectric substrate 12 is less than 10 degrees. Furthermore, the gap between the main surface 42 of the flange 26 and the first main surface 14 of the dielectric substrate 12 is compatible with the bonding technology used to connect the flange to the dielectric substrate.

[0057] The flange 26 can be welded to the weld portion 28 of the patterned conductive layer 20 using one or more suitable techniques. In one or more embodiments, the flange 26 is welded to the weld portion 28 of the patterned conductive layer 20 via a weld seam 44. The weld seam 44 can be provided using any suitable welding technique, such as laser welding. Furthermore, the weld seam 44 can take any suitable shape and have any suitable dimensions.

[0058] In one or more embodiments, the collar 22 may be electrically connected to the patterned conductive layer 20 using any suitable one or more techniques. For example... Figure 1As shown, assembly 10 includes a second feedthrough 46 disposed in dielectric substrate 12, electrically connected to flange 26 of collar 22. Feedthrough 46 may include any suitable feedthrough, such as feedthrough 18. Feedthrough 46 includes a through-hole 48 disposed between a first main surface 14 and a second main surface 16 of dielectric substrate 12, and conductive material 50 disposed in the through-hole. Conductive material 50 is electrically connected to solder portion 28 of patterned conductive layer 20 via interlayer 40 (if present). Solder portion 28 of patterned conductive layer 20 is electrically connected to flange 26 of collar 22. Second feedthrough 46 also includes an internal contact 52 disposed near the second main surface 16 of dielectric substrate 12 and electrically connected to conductive material 50 disposed in through-hole 48. As a result, internal contact 52 is electrically connected to collar 22.

[0059] Assembly 10 may also include one or more electronic devices or electronic components 54 disposed near at least one of the first main surface 14 or the second main surface 16 of the dielectric substrate 12. Electronic components 54 may include at least one of any suitable circuitry or components, such as capacitors, transistors, integrated circuits (including controllers or multiplexers), sensors, accelerometers, optical components (e.g., transmitters and detectors), etc. Although described as including one electronic component 54, assembly 10 may include any suitable number of electronic components. Furthermore, electronic components 54 may be electrically connected to one or more feedthroughs 18 using any suitable one or more technologies. In one or more embodiments, electronic components 54 are electrically connected to one or more feedthroughs 18 via one or more device contacts 56. Such device contacts 56 may be electrically connected to one or more internal contacts 36 of the feedthrough 18 using any suitable one or more technologies. In one or more embodiments, electronic components 54 may include one or more test points (e.g., ...) disposed on one or more surfaces of the electronic component. Figure 8 One or more test points 362), as further described herein.

[0060] As described herein, one or more embodiments of assembly 10 may include a patterned conductive layer 20, which is connected (e.g., hermetically sealed) to a first primary surface 14 of dielectric substrate 12 using any suitable one or more techniques, such as welding, laser welding, laser bonding, diffusion bonding, laser-assisted diffusion bonding, etc. In one or more embodiments, the patterned conductive layer 20 may be connected to the first primary surface 14 using laser diffusion bonding techniques described in commonly owned U.S. Patent No. 10,124,559 B2 (titled "Kinematically Limited Nano-Screen Diffusion Bond Structures and Methods"). For example, electromagnetic radiation (e.g., light) may be guided through a second primary surface 16 of dielectric substrate 12 and focused at the interface between patterned conductive layer 20 and first primary surface 14 to form laser bonding 59 and laser bonding 35 of external contact 34. In embodiments where interlayer 40 is present, electromagnetic radiation may be focused at the interface between interlayer and first primary surface 14.

[0061] Any suitable electromagnetic radiation can be used to form a bond between one or more portions of the patterned conductive layer 20 and the first main surface 14 of the dielectric substrate 12. In one or more embodiments, the electromagnetic radiation may include a laser, which may include any suitable wavelength or wavelength range. In one or more embodiments, the laser may include light having a wavelength of at least 200 nm. In one or more embodiments, the laser may include a wavelength of no more than 10,000 nm. For example, the laser may include UV light, visible light, IR light, and combinations thereof. In one or more embodiments, a UV laser may be used to provide light having a wavelength of about 350 nm and a pulse width of 30 ns. In one or more embodiments, the materials used for the substrate 12 and the patterned conductive layer 20, as well as the power level and wavelength of the light used, may be selected such that the light does not directly damage, ablate, distort, or cut the substrate and the patterned conductive layer, and that the substrate and the patterned conductive layer maintain their integral properties.

[0062] Typically, light can be provided by any suitable laser or laser system. For example, a laser can generate light with a relatively narrow set of wavelengths (e.g., a single wavelength). The light emitted by the laser can form a collimated beam that is not focused at a specific point. The light emitted by the laser can be focused at the interface between the patterned conductive layer 20 and the first main surface 14 to generate laser bonding.

[0063] Although a laser can provide light with a narrow wavelength range, in one or more embodiments, a laser can represent one or more devices that emit light with a wider wavelength range than a single typical laser. A wide variety of devices can be used to emit light with narrow or wide wavelength ranges. In one or more embodiments, a laser can include one or more laser devices, including diode and fiber lasers. Laser sources can also include, for example, TI sapphire, argon-ion, Nd:YAG, XeF, HeNe, Dye, GaAs / AlGaAs, CO2, Alexandrite, InGaAs, InGaAsP, Nd:glass, Yb:YAG, or Yb fiber lasers. Laser devices can also include one of continuous wave, modulated, or pulsed modes. Therefore, a wide variety of laser devices can be used in the bonding process. In one or more embodiments, the power level of the laser can be set to approximately 1 W, distributed over a focused beam diameter of approximately 10 μm, with a top-cap or Gaussian spatial energy distribution.

[0064] As described herein, various embodiments of the feedthrough assembly can be used in any suitable device or system. For example, Figure 3 This is a schematic cross-sectional view of one embodiment of an hermetically sealed package 100. The package 100 includes a housing 102 and... Figure 1 The sealing assembly 10. Although described as including Figure 1 The hermetically sealed assembly 10 may be a single, but the hermetically sealed package 100 may include any suitable hermetically sealed assembly. In one or more embodiments, the hermetically sealed assembly 10 may form part of the housing 102. The housing 102 defines a recess 112 within which one or more electronic components or circuits (e.g., electronic component 54) may be disposed. Furthermore, the housing 102, the collar 22, and the dielectric substrate 12 form a cavity 116.

[0065] The housing 102 of the package 100 may include any suitable size and take any suitable one or more shapes. Typically, the size and shape of the housing 102 at least partially surround the electronic device 54. In one or more embodiments, the housing 102 may include one or more sidewalls 104 that may be attached to the sealing assembly 10 using any one or more suitable techniques as further described herein. The housing 102 may completely surround and enclose the electronic device 54, and the sealing assembly 10 may be attached to the housing. In one or more embodiments, the housing 102 may include an open side or face, and the sealing assembly 10 may be attached to the housing within this open side, such that the sealing assembly forms part of the housing. The housing 102 may be a single, integral housing, or it may include one or more portions joined together using any suitable one or more techniques.

[0066] The housing 102 may comprise any suitable one or more materials, such as metals, polymers, ceramics, or inorganic materials. In one or more embodiments, the housing 102 may comprise at least one of glass, quartz, silicon dioxide, sapphire, silicon carbide, diamond, synthetic diamond, or gallium nitride (including cladding structures, laminates, etc.). In one or more embodiments, the housing 102 may comprise at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, nickel, Kova iron-nickel-cobalt alloy, or aluminum-magnesium alloy (including cladding structures, laminates, etc.). In one or more embodiments, the housing 102 may comprise one or more materials that are the same as the dielectric substrate 12 of the sealing assembly 10.

[0067] Package 100 may include any suitable electronic component 54 or electronic device disposed within housing 102. In one or more embodiments, electronic component 54 may include any suitable integrated circuit or device, such as a controller, multiplexer, etc. It should be understood that any electronic device mentioned in this disclosure may be coupled to a power source. Furthermore, package 100 may include a second electronic component 110 disposed in any suitable location within housing 102. Second electronic component 110 may include any suitable integrated circuit or device. In one or more embodiments, second electronic component 110 may include a power source adapted to provide power to one or more integrated circuits or devices disposed within or outside housing 102. Any suitable power source 110 may be disposed within housing 102, for example, one or more batteries, capacitors, etc. Power source 110 may be recharged by electrically connecting it to a power source via hermetically sealed assembly 10. In one or more embodiments, power source 110 may be adapted to be inductively charged by an inductive power system outside package 100. Power source 110 may be electrically connected to electronic component 54 using any suitable one or more technologies. In one or more embodiments, the power source 110 may include a hermetically sealed battery connected to the hermetically sealed assembly 10 using any suitable one or more technologies.

[0068] The housing 102 can be connected to the sealing assembly 10 using any suitable technology or one or more techniques. Figure 3 In the illustrated embodiment, the edge 58 of the body 26 of the ferrule 22 is connected to the edge 106 of the housing 102 via a bonding or weld seam 108. The weld seam 108 can be formed using any suitable technique or one or more techniques, for example, the same technique described herein as the weld seam 44 between the weld portion 28 of the flange 24 and the patterned conductive layer 20. Furthermore, the ferrule 22 may include a dangling element 114 disposed adjacent to the edge 106 of the housing 102. In one or more embodiments, the dangling element 114 may be adapted to prevent energy used to form the weld seam 108 from damaging the electronic component 54.

[0069] As described herein, the collar 22 of the sealing assembly 10 can be electrically connected to the patterned conductive layer 20 via a solder portion 28 of the patterned conductive layer. Consequently, the patterned conductive layer 20 can also be electrically connected to the housing 102 of the package 100 via the collar 22 and its connection to the housing. In one or more embodiments, the collar 22 can be electrically connected to, for example, a ground terminal on the housing 102 of the package 100.

[0070] The collar 22 of assembly 10 may further include a groove 78 disposed in the body 26 of the collar. In one or more embodiments, the groove 78 may extend along the edge 58 and overhang 114 of the body 26 of the collar. The groove 78 may take any suitable shape or have any suitable size. When assembly 10 and housing 102 are joined together, the groove 78 may be adapted to form a vent 80 with the edge 106 of housing. In one or more embodiments, the groove 78 may be adapted to form a vent 80 together with the edge 106 and sidewall 104 of housing 102. The vent 80 may allow backfill gas exchange of the package 100 before assembly 10 is sealed to housing 102. Once gas exchange is complete, the vent 80 may be sealed with weld seam 108.

[0071] For example, Figure 15 This is a schematic plan view of the external portion of the package 100. (See attached image.) Figure 15 As shown, a large portion of the edge 58 of the body 26 of the ferrule 22 is connected to the edge 106 of the housing 102 via a weld seam 108. However, a portion of the edges 58 and 106 remains unwelded, exposing the vent 80. Gas exchange of the package 100 can be performed through the vent 80. After gas exchange is completed, the remaining portions of the edges 58 and 106 and the vent 80 can be welded with a weld seam 122 to seal the ferrule 22 to the housing 102.

[0072] In one or more embodiments, the encapsulation 100 may include an optional second housing 118 connected to a second edge 120 of the body 26 of the collar 22. All design considerations and possibilities regarding the housing 102 also apply to the second housing 118. The second housing 118 may be any suitable structure or component to which the assembly 10 is attached. In one or more embodiments, the second housing 118 may include the head of an implantable medical device (e.g., Figures 5 to 8 (Head 330). The second housing 118 may include the same material as the housing 102 or a different material.

[0073] The second housing 118 can be attached to the second edge 120 of the collar 22 using any suitable technique or one or more, such as the same technique described herein for the attachment of housing 102 to the collar. In one or more embodiments, the second housing 118 can be attached to the collar 22 via a weld 122 arranged to pass through the second housing and into the collar. Furthermore, the second edge 120 of the collar 22 may include a second overhang 124 disposed adjacent to the edge 126 of the second housing 118.

[0074] The second housing 118 can be electrically connected to the collar 22 using any suitable technology or one or more techniques. In one or more embodiments, the second housing 118 can be electrically connected to the sealing assembly 10 via an electrical connection from the collar 22 to the patterned conductive layer 20. Furthermore, the second housing 118 can be electrically connected to the housing 102 via the collar 22.

[0075] Package 100 can be manufactured using any suitable technology or one or more techniques. For example, Figure 4 This is a flowchart of one embodiment of a method 200 for forming a hermetically sealed package 100. Although package 100 has been described, method 200 can be used to form any suitable hermetically sealed package.

[0076] Method 200 includes placing a power source 110 within a recess 112 of the housing 102 at 202. In one or more embodiments, the power source 110 may be a hermetically sealed battery formed within the housing 102 using any suitable one or more techniques. A patterned conductive layer 20 may be laser-bonded to a first main surface 14 of the dielectric substrate 12 at 204. Furthermore, at 206, an electronic device 54 may be placed on a second main surface 16 of the dielectric substrate 12. At 208, a flange 26 of a collar 22 may be welded to a weld portion 28 of the patterned conductive layer 20 such that the weld portion is between the flange and the first main surface 14 of the dielectric substrate 12, and the collar is hermetically sealed to the dielectric substrate. Furthermore, at 210, an edge 58 of the body 26 of the collar 22 may be attached to an edge 106 of the housing 102 (or hermetically sealed battery) using any suitable one or more techniques, such that the electronic device 54 is placed within a cavity 116. In one or more embodiments, any suitable one or more techniques may be used to form a weld seam 108 between the collar 22 and the housing 102. In one or more embodiments, the weld seam 108 hermetically seals the assembly 10 to the housing 102.

[0077] When the collar 22 includes the groove 78, a portion of the edges 58, 106 may remain disconnected, exposing the vent 80. In such an embodiment, method 200 includes gas exchange between the package 100 and the external environment of the package. Any suitable gas exchange technique or one or more can be used. In one or more embodiments, a vacuum may be applied to the package 100 to remove any internal gases or ambient air from the package. Optionally, the package 100 may be heated under vacuum to remove any moisture from the package. In one or more embodiments, the package 100 may be backfilled by exposing the package to an inert or low-reactivity gas such as argon, nitrogen, helium, or a combination thereof, allowing the gas to enter the package through the vent 80. While still in an inert gas environment, a weld 108 may be positioned over the vent 80 and between the remaining edge 58 of the body 26 of the collar 22 and the edge 106 of the housing 102, such that the assembly 10 is hermetically sealed to the housing.

[0078] In embodiments where the hermetic seal 100 includes a second housing 118, the edge 126 of this housing may be connected at 212 to the second edge 120 of the body 26 of the ferrule 22 using any suitable technique or one or more. In one or more embodiments, a weld 122 may be formed through the edge 126 of the second housing 118 and into the second edge 120 of the body 26 of the ferrule 22. The second housing 118 is the head (e.g., Figures 5 to 8 In one or more embodiments of the head 308, the head may be connected to the second edge 120 of the body 26 of the collar 22, such that the head is electrically connected to the feed passage 20 of the sealing assembly 10 using any suitable one or more technologies. In one or more embodiments, gas exchange through the vent 80 may occur before or after the second housing 118 is connected to the second edge 120 of the body 26 of the collar 22.

[0079] The various embodiments of the feedthrough assemblies described herein can be used with any device or system requiring a hermetically sealed conductive path. For example, one or more embodiments of the feedthrough assemblies described herein can be used with implantable medical devices or systems. In one or more embodiments, the implantable medical device or system may employ one or more leads that can be used with the various embodiments of the feedthrough assemblies described herein. Representative examples of such implantable medical devices include hearing implants, such as cochlear implants; sensing or monitoring devices; signal generators such as pacemakers or defibrillators; neurostimulators (such as spinal cord stimulators, brain or deep brain stimulators, peripheral nerve stimulators, vagus nerve stimulators, occipital nerve stimulators, subcutaneous stimulators, etc.); gastric stimulators; and so on. Furthermore, in one or more embodiments, the implantable medical device may include one or more external contacts of the hermetically sealed assembly, which can be used to directly deliver energy to the patient's tissues.

[0080] For example, Figures 5 to 8 These are various schematic diagrams of one embodiment of an implantable medical device system 300. The system 300 includes an implantable medical device (IMD) 302, a lead 304, and a lead extension 306.

[0081] IMD 302 includes a hermetically sealed package 303, which includes a housing 310, a sealing (e.g., feedthrough) assembly 312 forming part of the housing, and a head 308 adapted to receive a proximal portion 314 of a lead extension 306. Regarding Figure 3 All design considerations and possibilities of the hermetic seal package 100 also apply to the hermetic seal package 303 of the IMD 302. Although described as including a single sealing assembly 312, the IMD 302 may include any suitable number of sealing assemblies.

[0082] The proximal portion 314 of the lead extension 306 includes one or more electrical contacts 316 that are electrically connected to internal contacts (not shown) at the distal connector 318 of the lead extension. The head 308 of the IMD 302 includes internal contacts 320. Figures 6 to 7 It is adapted to receive the proximal portion 314 of the lead extension 306 so that when the lead extension is inserted into the head, the internal contacts of the head can be electrically connected to the contacts 316 of the lead extension.

[0083] Figures 5 to 8 The illustrated system 300 also includes a lead 304. The lead 304 has a proximal portion 322 including contacts 324 and a distal portion 326 including electrodes 328. Each electrode 328 can be electrically connected to the discrete contacts 324. A distal connector 318 of the lead extension 306 is adapted to receive the proximal portion 322 of the lead 304 such that the contacts 324 of the lead can be electrically connected to internal contacts of the connector of the extension. Therefore, when the lead is connected to the extension 306 and the extension is connected to the IMD, signals generated by the IMD 302 can be transmitted to the patient's tissue via the electrodes 328 of the lead 304. In one or more embodiments, when the lead is connected to the extension 306 and the extension is connected to the IMD, signals received from the patient by the electrodes 328 of the lead 304 can be transmitted to the contacts 320 of the IMD 302.

[0084] It should be understood that lead 304 can be connected to IMD 302 without using extension 306. Any number of leads 304 or extensions 306 can be connected to device 302. Although lead 304 is described as having four electrodes 328, it should be understood that the lead can include any number of electrodes, such as 1, 2, 3, 4, 5, 6, 7, 8, 16, 32, or 64 electrodes. A corresponding change in the number of contacts 324 in lead 304, contacts 316 and internal contacts in connector 318 of lead extension 306, or internal contacts 320 in head 308 of device 302 may be required or expected. As used below, “lead” will refer to both “multiple leads” and “multiple lead extensions” unless the content and context clearly indicate otherwise.

[0085] IMD 302 also includes a hermetically sealed package 303 in which electronic device 334 is housed. The housing 310 of the hermetically sealed package 303 may comprise any suitable material or combination of materials, such as titanium, glass, sapphire, etc. In one or more embodiments, the housing 310 may be conductive to provide a ground electrode for IMD 302, as known in the art.

[0086] Lead receptacles 330 and 332 may be formed in the housing 336 of the head 308. The receptacles 330 and 332 may take any suitable shape or have any suitable size. Although described as including two receptacles 330 and 332, the head 308 may include any suitable number of receptacles, such as 1, 2, 3, 4, or more. Furthermore, the receptacles 330 and 332 may be adapted to receive the contacts 316 of the lead extension 306 (or the contacts 324 of the lead 304) and electrically connect them to the contacts 320 of the head 308. Any suitable number of leads 304 and lead extensions 306 may be electrically connected to the head 308 via the receptacles 330 and 332.

[0087] Sockets 330 and 332 have internal contacts 320 that are positioned to align with and electrically connect to contacts 316 of lead extension 306 and / or contacts 324 of lead 304 when lead extension or lead is properly inserted into one or both sockets. Figure 6 The spacing of the internal contacts 320 is adapted to allow electrical connection with the contacts 316 of the lead extension 306 or the contacts 324 of the lead 304.

[0088] Electronic device 334, disposed within package 303, is adapted to transmit or receive electrical signals to or from patient tissue via leads operatively coupled to the electronics of IMD 302. As used herein, the term “transmitted electrical signal” refers to a signal transmitted by electronics 334 to or received by electronics from patient tissue. In one or more embodiments, conductors of IMD 302 may be electrically connected via conductors 338 of hermetically sealed assembly 312 to internal contacts 320 of lead sockets 330, 332, which are electrically connected to a patterned conductive layer 340 of the assembly. For example, in one or more embodiments, conductors 338 may be electrically connected to electronics 334 via a feedthrough disposed in dielectric substrate 342 of hermetically sealed assembly 312. In one or more embodiments, any suitable one or more techniques may be used to electrically connect one or more conductors to a patterned conductive layer disposed on a second main surface of dielectric substrate 342. Feedthroughs may include any suitable feedthroughs described herein, such as… Figure 1 The feedthrough 18 of assembly 10. Therefore, a conductive path is formed between the internal contacts 320 of lead sockets 330, 332 and the electronic device 334. Sealing assembly 312 may include any sealing assembly described herein, such as... Figures 1 to 3 Sealing assembly 10.

[0089] In one or more embodiments, each conductor 338 can electrically connect the internal contacts 320 of the lead sockets 330, 332 to a discrete channel of the electronic device 334. As used herein, a “channel” of the electronic device is a discrete electronic path through which a signal can be transmitted independently of another channel. Each channel of the electronic device 334 can be independently connected to the discrete internal contacts 320 of the sockets 330, 332, which can be connected to the discrete contacts 316 of the lead extension 306 or the contacts 324 of the lead 304, which in turn can be connected to the discrete electrodes 328 of the lead. Thus, each channel of the electronic device 334 can be operatively connected to a given electrode 328 of the lead 304.

[0090] like Figure 8As shown, one or more test points 362 may be disposed on surface 335 of electronic device 334 (i.e., electronic device package or assembly). Such test points 362 can be used to test electronic device 334. Test points 362 may be incorporated into electronic device 334 as part of a three-dimensional die stack of the electronic package. Although not shown, vertical interconnects such as vias may be disposed through one or more electronic devices 334 and electrically connected to test points 362. Surface 335 may be a non-functional surface, such as glass, on which test points 362 are disposed, and one or more vias are disposed through the surface and into the electronic device layer. In one or more embodiments, surface 335 of electronic device 334 may be an active surface, on which test points 362 are disposed directly or on a redistribution layer disposed on the active surface. Test points 362 can be used to access schematic nodes disposed in the top or intermediate layers of the electronic device 334 package, or to access schematic nodes disposed on substrate 342 that are not disposed within the package.

[0091] This placement of test point 362 reduces or eliminates the need for mixed test points. Furthermore, because test point 362 is on or within the electronics stack, interconnects for such test points do not significantly increase stacking complexity. Additionally, this positioning of test point 362 reduces wiring length to off-board test points, reduces EMI issues, and simplifies manufacturing. Moreover, test point 362 simplifies burn-in when test panels / chips are being tested and downstream devices are being segmented. And, because test point 362 remains formed on electronics 334, it simplifies the process of completing troubleshooting.

[0092] like Figure 8 As shown, the collar 344 of the sealing assembly 312 may include an optional groove 378. The groove 378 may take any suitable shape or have any suitable size. The groove 378 may be used together with the housing 336 to form a vent to allow gas exchange between the package 303 and the environment surrounding the package, as described herein. Figure 3 The groove 78 and the vent 80 are described.

[0093] A sealing assembly 312 may be disposed within a head 308 such that a housing 336 surrounds the assembly, and the assembly may be connected between the head and the housing to a sidewall of the housing 310 of the IMD 302. In one or more embodiments, the sealing assembly 312 may be disposed on any sidewall of the housing 310 such that the system does not include a head. In one or more embodiments, the sealing assembly 312 may be connected to the housing via a collar 344 connected to a weld portion 346 of a patterned conductive layer 340, the weld portion 346 being disposed between a flange 354 of the collar and a first main surface 348 of a dielectric substrate 342, such that the collar is hermetically sealed to the dielectric substrate. Any suitable one or more techniques may be used, for example, those described herein. Figure 3 The same technique described for the hermetically sealed package 100 is used to hermetically seal the ferrule 344 to the dielectric substrate 342. For example, the patterned conductive layer 340 can be laser-bonded 356 to the first main surface 348 of the dielectric substrate 342. Furthermore, the flange 354 of the ferrule 344 can be welded 358 to the weld portion 346 of the patterned conductive layer 340, thereby hermetically sealing the ferrule to the dielectric substrate. Additionally, the sealing assembly 312 can use any suitable one or more techniques, for example, those described herein. Figure 3 The same technology described in the hermetically sealed package 100 is disposed on the side wall of the housing 310.

[0094] Head 308 can use any suitable one or more techniques, for example, as described here. Figure 3 The same technology described for the hermetic sealed package 100 is used to connect at least one of the sealing assembly 312 and the housing 310. In one or more embodiments, the sealing assembly 312 may include a tab 350 ( Figure 8 The tab can receive one or more fasteners that extend through the opening in the head 308 and the opening 352 in the tab and connect the head to the sealing assembly. The head 308 can be connected to the sealing assembly 312 using any suitable fasteners.

[0095] As described herein, the various embodiments of the feedthrough assembly described herein can be used in any suitable device. For example, Figures 9 to 10 Various views are shown for another embodiment of the implantable medical device 400. Regarding... Figures 5 to 8 All design considerations and possibilities of the implantable medical device 300 also apply to Figures 9 to 10 An implantable medical device 400. Device 400 includes a hermetically sealed package 402 having a housing 404 and a sealing (e.g., feedthrough) assembly 406 forming part of the housing.

[0096] The sealing assembly 406 includes a dielectric substrate 410 and a collar 412. The collar 412 includes a body 414 and a flange 416 extending from the body. The collar 412 is connected to a solder portion 418 of a patterned conductive layer 420, the solder portion 418 being disposed between the flange 416 and a first main surface 422 of the dielectric substrate 410, such that the collar is hermetically sealed to the dielectric substrate. An edge 424 of the body 414 of the collar 412 is connected to an edge 426 of the housing 404.

[0097] The hermetic-sealed package 406 also includes a second housing 408 connected to a second edge 428 of the body 414 of the collar 412. Any suitable one or more techniques can be used, for example, those described herein regarding... Figure 3 The same technique used to connect the outer shell 102 of the hermetically sealed package 100 and the second outer shell 118 is used to connect the second outer shell 408 to the collar 412. In one or more embodiments, the second outer shell 408 includes external contacts 430 adapted to provide electrical signals to the patient's tissue using any suitable one or more techniques. In one or more embodiments, the external contacts 430 can be electrically connected to the patterned conductive layer 420 of the sealing assembly 406 using any suitable one or more techniques.

[0098] The IMD 400 may take any suitable shape or one shape. In one or more embodiments, at least one of the housing 404, the second housing 408, or the dielectric substrate 410 may have an elliptical cross-section in a plane substantially parallel to the first main surface 422 of the dielectric substrate 410. Furthermore, the IMD 400 may have any suitable dimensions.

[0099] The IMD 400 may also include one or more forks 432 connected to the second housing 408 using any suitable technology or one or more of the same. In one or more embodiments, the one or more forks 432 may be electrically connected to the sealing assembly 406 using any suitable technology or one or more of the same.

[0100] Figures 11 to 12 Various views of another embodiment of the implantable medical device (IMD) 500. About Figures 5 to 8 Implantable medical devices 300 and Figures 9 to 10 All design considerations of the implantable medical device 400 also apply to Figures 11 to 12 An implantable medical device 500. Device 500 includes a hermetically sealed package 502 having a housing 504 and a sealing assembly 506 forming part of the housing. Although described as including a single sealing assembly 506, the implantable medical device 500 may include any suitable number of sealing assemblies.

[0101] The sealing assembly 506 includes a dielectric substrate 508 and a collar 510. The collar 510 includes a body 512 and a flange 514 extending from the body. Figure 12 As shown, flange 516 extends from the upper portion 516 of body 512. A collar 510 is connected to a solder portion 518 of patterned conductive layer 520, which is disposed between flange 514 and a first main surface 522 of dielectric substrate 508, such that the collar is hermetically sealed to the dielectric substrate. Edge 524 of body 512 of collar 510 is connected to edge 526 of housing 504 using any suitable technique or one or more (e.g., soldering).

[0102] Figures 11 to 12 The IMD 500 and Figures 9 to 10 One difference between the IMD 400 and the IMD 500 is that the IMD 500 does not include a second housing. Instead, the hermetically sealed assembly 506 forms the upper portion of the hermetically sealed package 502 of the IMD 500. Furthermore, the housing 504 connected to the collar 510 can be a sealed battery electrically connected to the hermetically sealed assembly 506 using any suitable technology or one of the following.

[0103] In one or more embodiments, the patterned conductive layer 520 may include external electrodes 528 disposed on a first main surface 522 of the dielectric substrate 508, such as Figure 11 As shown. External electrode 528 can be electrically connected to electronic component 530 using any suitable technology or one or more of these methods. Electronic component 530 is connected to a second main surface 532 of dielectric substrate 508. In one or more embodiments, external electrode 528 can be adapted to direct energy (e.g., signals) to the patient's tissue. In one or more embodiments, external electrode 528 can be adapted to receive energy from the patient's tissue, thereby functioning as a sensor. In one or more embodiments, external electrode 528 can be adapted to direct energy to and receive energy from the patient's tissue.

[0104] The IMD 500 may take any suitable shape or one or more shapes. In one or more embodiments, at least one of the housing 504 or the dielectric substrate 508 may take a rectangular shape in a plane substantially parallel to the first main surface 522 of the dielectric substrate 508. Furthermore, the IMD 500 may have any suitable size.

[0105] As described herein, various embodiments of the hermetically sealed assembly can be used in any suitable application. For example, one or more embodiments of the hermetically sealed assembly can serve as an optical window or port that provides a hermetically sealed window for observing one or more components disposed within a housing connected to the assembly, or for emitting and detecting electromagnetic radiation guided through the dielectric substrate of the assembly. For example, a transmitter suitable for emitting electromagnetic radiation can be disposed within a housing partially formed by the hermetically sealed assembly. Such electromagnetic radiation can be guided from within the housing and through the dielectric substrate hermetically sealed to the hermetically sealed assembly. Therefore, such a dielectric substrate is suitable for providing an optical window for the transmitter.

[0106] Figures 13 to 14 These are various views of one embodiment of the sealing assembly 600. Regarding... Figures 1 to 2 Sealing assembly 10 and Figure 3 All design considerations and possibilities of the hermetically sealed enclosure 100 also apply to Figures 13 to 14 The sealing assembly 600.

[0107] The sealing assembly 600 includes a dielectric substrate 602 having a first main surface 604 and a second main surface 606. The assembly 600 also includes a patterned layer 608 connected to the first main surface 604 of the dielectric substrate 602 by laser bonding 610, and a collar 612 having a body 614 and a flange 616 extending from the body. The flange 616 is welded to a weld portion 618 of the patterned layer 608, the weld portion 618 being disposed between the flange and the first main surface 604 of the dielectric substrate 602, such that the collar 612 is hermetically sealed to the dielectric substrate.

[0108] The sealing assembly 600 can be attached to any suitable housing using any suitable technology or one or more of them (e.g., Figure 3 The housing 102 of the package 100. Furthermore, the sealing assembly 600 can be used with any suitable system or package, such as... Figures 11 to 12 500 implantable medical devices.

[0109] The various embodiments of the hermetic sealing package described herein may include any suitable number of sealing assemblies. For example, Figure 15 This is a schematic cross-sectional view of another embodiment of the hermetically sealed package 700. The description herein relates to... Figure 3 All design considerations and possibilities of the hermetic seal 100 also apply to Figure 15 The hermetically sealed package 700 includes a first sealing assembly 710 and a second sealing assembly 770. Each of the first and second sealing assemblies 710 and 770 may include any suitable sealing assembly, such as... Figures 1 to 2The sealing assembly 10. The package 700 may include the same assemblies 710, 770. In one or more embodiments, the first assembly 710 is different from the second assembly 770. Although described as including two sealing assemblies 710, 770, the package 700 may include any suitable number of assemblies.

[0110] Assemblies 710 and 770 can be connected together using any suitable technology or one or more techniques. In one or more embodiments, the collar 722 of the first assembly 710 is connected to the collar 772 of the second assembly 770. Figure 15 In the illustrated embodiment, the edge 758 of the body 726 of the ferrule 722 is connected to the edge 766 of the body 768 of the ferrule 772 via a joint or weld seam 764. Any suitable one or more techniques may be used, for example, those described herein regarding... Figures 1 to 2 The same technique is used to form the weld seam 764 between the flange 26 of the patterned conductive layer 20 of the assembly 10 and the weld seam 28.

[0111] Sealing assemblies 710, 770 may form part of the housing 702 of the package 700. In such embodiments, additional portions of the housing 702 may be attached to one or both of the assemblies 710, 770 to form a hermetically sealed housing 712. In one or more embodiments, the assemblies 710, 770 form integrally with the housing 702 and provide a hermetically sealed housing 712.

[0112] The package 700 can be used in any suitable device or system, such as an implantable medical device. The package 700 can provide sensing of electrical signals within the patient's body in two different directions. Furthermore, this device can utilize an external transceiver to provide more reliable telemetry because signals can be transmitted through one or both of the assemblies 710 and 770, which can be oriented in different directions. Additionally, the package 700 can be used with an implantable power delivery system adapted to receive electromagnetic energy passing through two or more sides of the housing 702 via the assemblies 710 and 770.

[0113] The exemplary aspects of this disclosure are set forth in the following provisions.

[0114] Clause 1: A hermetically sealed package comprising a housing and a sealing assembly forming part of the housing, wherein the sealing assembly comprises: a dielectric substrate having a first main surface and a second main surface; a patterned layer connected to the first main surface of the dielectric substrate by laser bonding; and a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welded portion of the patterned layer, the welded portion being disposed between the flange and the first main surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate; wherein an edge of the body of the ferrule is connected to an edge of the housing.

[0115] Clause 2: The encapsulation body according to Clause 1 further includes a second edge of the body connected to the ferrule and electrically connected to the head of the sealing assembly.

[0116] Clause 3: The encapsulation body according to Clause 1 or 2 further includes a second housing connected to a second edge of the body of the ferrule, wherein the second housing includes external contacts adapted to provide electrical signals to the patient's tissue.

[0117] Clause 4: The package according to any one of Clauses 1 to 3, wherein the ferrule further comprises a groove disposed in the body of the ferrule, wherein the groove is adapted to form a vent with the edge of the housing and the sidewall of the housing.

[0118] Clause 5: The package according to any one of Clauses 1 to 4, wherein the sealing assembly further comprises a feedthrough disposed in the dielectric substrate.

[0119] Clause 6: A method comprising: laser bonding a patterned layer to a first main surface of a dielectric substrate; and welding a flange of a ferrule to a welding portion of the patterned layer such that the welding portion is between the flange and the first main surface of the dielectric substrate, and the ferrule is hermetically sealed to the dielectric substrate, wherein the flange extends from a body of the ferrule.

[0120] Clause 7: The method according to Clause 6 further includes placing the power source in the recess of the housing before welding the flange of the ferrule to the welding portion of the patterned layer.

[0121] Clause 8: The method described in Clause 6 or 7 further comprises attaching the edge of the body of the ferrule to the edge of the housing.

[0122] Clause 9: The method described in Clause 8 further comprises attaching a second edge of the body of the ferrule to an edge of the second housing.

[0123] Clause 10: The method according to Clause 9, wherein the second housing includes a head electrically connected to a feedthrough disposed in the dielectric substrate.

[0124] Clause 11: The method according to any one of Clauses 6 to 10 further comprises forming a feedthrough in the dielectric substrate prior to laser bonding the patterned layer to the first main surface of the dielectric substrate, wherein forming the feedthrough comprises: forming a via between the first main surface and the second main surface of the dielectric substrate; disposing a conductive material within the via; and forming an external contact above the via such that the external contact is electrically connected to the conductive material disposed within the via, wherein the external contact is part of the patterned layer.

[0125] Clause 12: According to the method of Clause 11, the external contact of the feeder is formed through the welded portion of the patterned layer, such that the feeder is electrically connected to the flange of the ferrule.

[0126] It should be understood that the various aspects disclosed herein can be combined in combinations different from those specifically presented in the specification and drawings. It should also be understood that, depending on the instance, certain actions or events of any process or method described herein may be performed in a different order, and may be added, combined, or omitted entirely (e.g., all described actions or events may not be necessary for performing the technique). Furthermore, although some aspects of this disclosure are described for clarity as being performed by a single module or unit, it should be understood that the techniques of this disclosure can be performed by combinations of units or modules associated with, for example, a medical device.

[0127] In one or more instances, the technology may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. The computer-readable medium may include a computer-readable storage medium, which corresponds to a tangible medium such as a data storage medium (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer).

[0128] The instructions can be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Therefore, the term "processor" as used herein can refer to any of the foregoing structures or any other physical structure suitable for implementing the technology. Furthermore, the technology can be implemented entirely with one or more circuit or logic elements.

Claims

1. A sealing assembly comprising: A dielectric substrate comprising a first main surface and a second main surface; A patterned layer, which is laser-bonded to the first main surface of the dielectric substrate; and A collar comprising a body and a flange extending from the body, wherein the flange is welded to a weld portion of the patterned layer, the weld portion being disposed between the flange and a first main surface of the dielectric substrate, such that the collar is hermetically sealed to the dielectric substrate.

2. The assembly according to claim 1, further comprising a feedthrough disposed in the dielectric substrate.

3. The assembly of claim 2, wherein the feeder comprises: A through-hole is disposed between the first main surface and the second main surface of the dielectric substrate; A conductive material, wherein the conductive material is disposed in the through hole; as well as An external contact is disposed above the via, adjacent to the first main surface of the dielectric substrate, wherein the external contact is electrically connected to the conductive material disposed in the via.

4. The assembly of claim 3, wherein the external contact of the feedthrough is hermetically sealed to the first main surface of the dielectric substrate by laser bonding around the through-hole.

5. The assembly according to any one of claims 1 to 4, wherein the flange further comprises a main surface that contacts the weld portion of the patterned layer.

6. The assembly of claim 5, wherein the main surface of the flange is substantially parallel to the first main surface of the dielectric substrate.

7. The assembly according to any one of claims 1 to 4, further comprising an electronic component disposed adjacent to at least one of the first main surface or the second main surface of the dielectric substrate, wherein one or more test points are disposed on the surface of the electronic component.

8. The assembly according to any one of claims 1 to 4, wherein the ferrule further comprises a tab extending from the body and adapted to connect the ferrule to the head.

Images