Light panel, preparation method thereof and backlight module

Abstract

The application provides a lamp panel and a preparation method thereof and a backlight module. The lamp panel has a light-emitting side and a backlight side. The lamp panel comprises a light-emitting device, the light-emitting device has a positive electrode connecting part and a negative electrode connecting part; a reflector, one side of the reflector on the light-emitting side is provided with a plurality of groups of electric connecting parts, each group of electric connecting parts comprises a positive electrode pad and a negative electrode pad, the positive electrode connecting part is electrically connected with the positive electrode pad, and the negative electrode connecting part is electrically connected with the negative electrode pad; wherein the reflector is provided with a through hole penetrating through two sides thereof, one side of the reflector on the backlight side is provided with a connecting circuit, and the positive electrode pad and the negative electrode pad are electrically connected with the connecting circuit through the through hole. In the application, the silver glue is not covered by the reflecting sheet or the ink when the light-emitting device is fixed, and the phenomenon that the reflecting sheet or the ink is broken due to the solidification of the silver glue can be avoided.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a lamp panel and its preparation method, and a backlight module. Background Technology

[0002] Currently, with the development of the display industry, direct-lit miniLED backlight modules have advantages such as good display effect and zone control, and are gradually occupying a large market share in the high-end market. Among them, the core part of the backlight module is the lamp board. The main structure of the lamp board includes a carrier substrate, conductive traces, white ink, and LEDs. In the process of manufacturing the lamp board, silver paste printing, pre-baking, ink printing / reflective bonding, die bonding, and final baking are required. However, because a reflective sheet or ink is covered on top during the final baking and curing of the silver paste, the curing solvent of the silver paste does not evaporate easily, which causes the reflective sheet or ink to crack. Summary of the Invention

[0003] This application provides a lamp panel and its preparation method, as well as a backlight module, aiming to solve the technical problem that the curing of silver paste on the lamp panel causes the reflector or ink to crack.

[0004] In a first aspect, this application provides a lamp panel having a light-emitting side and a backlight side, the lamp panel comprising:

[0005] A light-emitting device, which has a positive electrode connection part and a negative electrode connection part;

[0006] The reflector has multiple sets of electrical connection parts on the light-emitting side. Each set of electrical connection parts includes a positive electrode pad and a negative electrode pad. The positive electrode pad is electrically connected to the positive electrode connection part, and the negative electrode pad is electrically connected to the negative electrode connection part.

[0007] The reflector has through holes on both sides, and a connection circuit is provided on the side of the reflector located on the backlight side. The positive electrode pad and the negative electrode pad are electrically connected to the connection circuit through the through holes.

[0008] In some embodiments, the reflector includes a reflective sheet;

[0009] The electrical connection part is located on the side of the reflector that is on the light-emitting side, and the connection circuit is located on the side of the reflector that is on the backlight side.

[0010] In some embodiments, the reflector includes a flexible substrate and a reflective sheet bonded together.

[0011] The electrical connection part is located on the side of the reflector away from the flexible substrate, the connection circuit is located on the side of the flexible substrate away from the reflector, and the via penetrates the flexible substrate and the reflector.

[0012] In some embodiments, the connection circuit includes multiple circuit traces;

[0013] One end of the circuit trace is electrically connected to the positive pad of a set of electrical connection parts, and the other end is electrically connected to the negative pad of another set of electrical connection parts.

[0014] In some embodiments, a via includes a first via and a second via;

[0015] The positive electrode pad covers the first via located at one end of the light-emitting side, and the negative electrode pad covers the second via located at one end of the light-emitting side. The positive electrode pad is electrically connected to the circuit trace through the first via, and the negative electrode pad is electrically connected to the circuit trace through the second via.

[0016] In some embodiments, one end of the circuit trace covers the end of the first via located on the backlight side, and the other end covers the end of the second via located on the backlight side.

[0017] The first via contains a first conductor that connects the circuit trace and the positive pad, and the second via contains a second conductor that connects the circuit trace and the negative pad.

[0018] In some embodiments, the orthographic projection of the light-emitting device onto the reflector does not overlap with the via.

[0019] In some embodiments, the cross-sectional area of ​​the via gradually increases from the backlight side to the light-emitting side; or

[0020] From the backlight side to the light-emitting side, the cross-sectional area of ​​the via gradually decreases.

[0021] In some embodiments, the reflector has a first groove on the light-emitting side, and the electrical connection portion is disposed within the first groove; and / or

[0022] A second groove is provided on the side of the reflector located on the backlight side, and the connecting circuit is disposed in the second groove.

[0023] In some embodiments, the light-emitting device and the electrical connection portion correspond one-to-one, and the positive electrode connection portion and the negative electrode connection portion of the same light-emitting device are electrically connected to the same electrical connection portion.

[0024] In some embodiments, the materials of the positive and negative electrode pads include conductive silver paste or copper foil; and / or

[0025] The materials used to connect the circuits include conductive silver paste or copper foil.

[0026] In some embodiments, a protective layer is also included, which covers the side of the reflector located on the backlight side.

[0027] Secondly, this application provides a method for preparing a lamp panel, comprising:

[0028] Provide a reflector;

[0029] A via is made in the reflector, and the via penetrates both sides of the reflector;

[0030] A connection circuit is formed on one side of the reflector, and multiple sets of electrical connection parts are formed on the other side. The electrical connection parts include positive electrode pads and negative electrode pads. The connection circuit is electrically connected to the positive electrode pads and negative electrode pads through vias.

[0031] The light-emitting device is installed on the side of the reflector that has an electrical connection part. The positive electrode connection part of the light-emitting device is connected to the positive electrode pad, and the negative electrode connection part is connected to the negative electrode pad.

[0032] In some embodiments, the method further includes:

[0033] A protective layer is placed over the side of the reflector that is facing away from the light.

[0034] Thirdly, this application provides a backlight module, including the lamp panel as described in the first aspect.

[0035] This application provides electrical connection parts and connection circuits on both sides of the reflector, and connects the electrical connection parts and connection circuits through vias. The light-emitting device can be directly mounted on the positive and negative electrode pads. Since the positive and negative electrode pads are located on the surface of the reflector, the silver paste is not covered by the reflective sheet or ink during the die bonding of the light-emitting device, thus avoiding the phenomenon of the reflective sheet or ink cracking due to the curing of the silver paste. At the same time, since the connection circuit is set on the back side of the reflector, only the positive and negative electrode pads for die bonding are exposed on the light-emitting side of the reflector, which avoids the influence of the connection circuit on the reflector's reflectivity. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a lamp panel provided in an embodiment of this application;

[0038] Figure 2 This is a schematic diagram of another structure of the lamp panel provided in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram of another structure of the lamp panel provided in the embodiments of this application;

[0040] Figure 4 This is a schematic diagram of a structure of the light-emitting side of the reflector provided in the embodiments of this application;

[0041] Figure 5This is a schematic diagram of a structure of the backlight side of the reflector provided in the embodiments of this application;

[0042] Figure 6 This is a schematic diagram of another structure of the lamp panel provided in the embodiments of this application;

[0043] Figure 7 This is a schematic diagram of another structure of the lamp panel provided in the embodiments of this application;

[0044] Figure 8 This is a schematic diagram of another structure of the lamp panel provided in the embodiments of this application;

[0045] Figure 9 This is a schematic flowchart of a lamp board preparation method provided in the embodiments of this application.

[0046] Among them, 100 is the lamp board, 10 is the reflector, 110 is the electrical connection part, 111 is the positive electrode pad, 112 is the negative electrode pad, 120 is the connection circuit, 121 is the circuit trace, 130 is the conductor, 131 is the first conductor, 132 is the second conductor, 11 is the via, 101 is the first via, 102 is the second via, 12 is the reflector sheet, 13 is the flexible substrate, 14 is the first groove, 15 is the second groove, 20 is the light-emitting device, 21 is the positive electrode connection part, 22 is the negative electrode connection part, and 30 is the protective layer. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0050] This application provides a lamp board and its preparation method, as well as a backlight module, which will be described in detail below.

[0051] First, refer to Figure 1 , Figure 1 This paper shows a schematic diagram of a structure of a lamp board 100 in an embodiment of this application, wherein the lamp board 100 includes:

[0052] The light-emitting device 20 has a positive electrode connection portion 21 and a negative electrode connection portion 22;

[0053] The reflector 10 has multiple sets of electrical connection portions 110 on one side of the reflector 10 located on the light-emitting side. Each set of electrical connection portions 110 includes a positive electrode pad 111 and a negative electrode pad 112. The positive electrode pad 111 is electrically connected to the positive electrode connection portion 21, and the negative electrode pad 112 is electrically connected to the negative electrode connection portion 22.

[0054] The reflector 10 is provided with a through hole 11 that runs through both sides of it. The side of the reflector 10 located on the backlight side is provided with a connection circuit 120. The positive electrode pad 111 and the negative electrode pad 112 are electrically connected to the connection circuit 120 through the through hole 11.

[0055] Specifically, the light-emitting side typically refers to the side of the lamp panel 100 that emits and propagates light, while the backlight side refers to the side of the lamp panel 100 opposite to the light-emitting side. In some embodiments of this application, the side of the reflector 10 where the light-emitting device 20 is mounted is the light-emitting side of the lamp panel 100, and the side of the reflector 10 opposite to the light-emitting device 20 is the backlight side of the lamp panel 100. Figure 1 For example, the light-emitting side refers to the top of the reflector 10, and the backlight side refers to the bottom of the reflector 10.

[0056] When the positive electrode connection 21 and the negative electrode connection 22 of the light-emitting device 20 are connected to a power source, the light-emitting device 20 can emit white light or colored light (e.g., red light, green light, or blue light) from the light-emitting side. For example, the light-emitting device 20 can be an inorganic light-emitting diode, such as a Mini LED or a Micro LED, or the light-emitting device 20 can also be an inorganic light-emitting diode, a quantum dot light-emitting device, etc.

[0057] The reflector 10 can reflect the light emitted by the light-emitting device 20 toward the backlight side, thereby improving the light utilization rate of the light-emitting device 20. Among them, the side of the reflector 10 located on the light-emitting side is provided with multiple sets of electrical connection portions 110. Each set of electrical connection portions 110 includes a positive electrode pad 111 and a negative electrode pad 112. The positive electrode pad 111 is electrically connected to the positive electrode connection portion 21, and the negative electrode pad 112 is electrically connected to the negative electrode connection portion 22.

[0058] In some embodiments of this application, the positive electrode pads 111 and negative electrode pads 112 that are close to each other are the same set of electrical connection portions 110. The light-emitting device 20 corresponds one-to-one with the electrical connection portion 110. The positive electrode connection portion 21 and the negative electrode connection portion 22 of the same light-emitting device 20 are electrically connected to the same electrical connection portion 110. That is to say, in the same set of electrical connection portions 110, the positive electrode pads 111 and the negative electrode pads 112 are electrically connected to the positive electrode connection portion 21 and the negative electrode connection portion 22 of the same light-emitting device 20, so that the light-emitting device 20 is connected to the corresponding electrical connection portion 110.

[0059] It is understandable that the positive electrode pads 111 and negative electrode pads 112, which are a certain distance apart (e.g., 10cm), can be used as the same set of electrical connection parts 110, and the light-emitting device 20 can be connected to them through electrical connection lines; or the positive electrode connection part 21 of the light-emitting device 20 can be electrically connected to the positive electrode pads 111 of the set of electrical connection parts 110, while its negative electrode connection part 22 can be electrically connected to the negative electrode pads 112 of another set of electrical connection parts 110.

[0060] In some embodiments of this application, see Figure 1 The reflector 10 can be a reflective sheet. Since the reflective sheet has the characteristics of light reflection and flexibility, while reflecting the light emitted by the light-emitting device 20 towards the backlight side, the lamp board 100 with the reflective sheet 12 as the main body also has flexibility. Therefore, the lamp board 100 can also be combined with a flexible screen to realize a curved TV.

[0061] In other embodiments of this application, see [reference]. Figure 2 , Figure 2This illustration shows another structural diagram of the lamp panel 100 in an embodiment of this application, wherein the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded together. For example, the flexible substrate 13 can be PET or PI. Since both the reflective sheet 12 and the flexible substrate 13 are flexible, the lamp panel 100, which is mainly composed of the reflective sheet 12 and the flexible substrate 13, is also flexible, and therefore can be used with a flexible screen to realize a curved television. Simultaneously, because the reflective sheet 12 is bonded to the flexible substrate 13, the strength of the lamp panel 100, which is mainly composed of the reflective sheet 12 and the flexible substrate 13, is improved, enhancing the overall toughness and reliability of the lamp panel 100.

[0062] It is understandable that reflector 10 can also refer to other substrates with reflective functions, such as coating the surface of flexible substrate 13 with white ink to form a reflective layer, thereby preparing reflector 10 with reflective function and flexible characteristics.

[0063] In this embodiment, an electrical connection portion 110 and a connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection portion 110 and the connection circuit 120 are electrically connected through a via 11. The light-emitting device 20 can be directly mounted on the positive electrode pad 111 and the negative electrode pad 112. Since the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver paste is not covered by the reflective sheet 12 or ink when the light-emitting device 20 is die-bonded, thus avoiding the phenomenon of the reflective sheet 12 or ink cracking due to the curing of the silver paste. At the same time, since the connection circuit 120 is set on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for die bonding are exposed on the light-emitting side of the reflector 10, which can also avoid the phenomenon of the connection circuit 120 blocking the surface of the reflector 10 and causing its reflectivity to decrease.

[0064] In some embodiments of this application, such as an embodiment where the reflector 10 is a reflective sheet 12, see [reference]. Figure 1 The electrical connection portion 110 is disposed on the light-emitting side of the reflector 12, and the connection circuit 120 is disposed on the backlight side of the reflector 12. That is, the positive electrode pad 111, the negative electrode pad 112, and the corresponding connection circuit 120 are directly fabricated on both sides of the reflector 12. When the light-emitting device 20 emits light, the light directed towards the backlight side is reflected back to the light-emitting side by the reflector 12, thereby improving the light utilization rate of the light-emitting device 20. At the same time, since the electrical connection portion 110 and the connection circuit 120 are respectively on both sides of the reflector 12, the connection circuit 120 will not block the surface of the light-emitting side of the reflector 12, thereby avoiding the influence on the light reflectivity of the reflector 12.

[0065] In other embodiments of this application, such as embodiments where the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded together, see [reference needed]. Figure 2An electrical connection portion 110 is disposed on the side of the reflector 12 facing away from the flexible substrate 13, and a connection circuit 120 is disposed on the side of the flexible substrate 13 facing away from the reflector 12. A via 11 penetrates the flexible substrate 13 and the reflector 12. The electrical connection portion 110 is connected to the connection circuit 120 through the via 11 penetrating the flexible substrate 13 and the reflector 12. The reflector 12 is located on the light-emitting side and can reflect light rays directed toward the backlight side. Since the electrical connection portion 110 and the connection circuit 120 are respectively disposed on the opposite sides of the reflector 12 and the flexible substrate 13, the connection circuit 120 will not affect the reflectivity of the reflector 12.

[0066] Understandably, the connection circuit 120 and the electrical connection part 110 can also have other configurations, for example, see [reference needed]. Figure 3 , Figure 3 This paper shows another structural schematic diagram of the lamp board 100 in an embodiment of this application. The connection circuit 120 is located between the flexible substrate 13 and the reflector 12. The flexible substrate 13 and the reflector 12 jointly protect the connection circuit 120 and avoid the risk of the connection circuit 120 being exposed.

[0067] As an exemplary embodiment, see [reference] Figure 4 as well as Figure 5 , Figure 4 This paper shows a schematic diagram of the structure of the light-emitting side of the reflector 10 in an embodiment of this application. Figure 5 The diagram shows a schematic of the backlight side of the reflector 10 in an embodiment of this application. The connection circuit 120 includes multiple circuit traces 121. One end of the circuit trace 121 is electrically connected to the positive pad 111 of a set of electrical connection parts 110, and the other end is electrically connected to the negative pad 112 of another set of electrical connection parts 110. In other words, the connection circuit 120 connects the two sets of electrical connection parts 110 in series through the circuit traces 121, thereby forming a series circuit structure.

[0068] In some embodiments of this application, the connection circuit 120 can connect all electrical connection portions 110 in series through multiple circuit traces 121. It is understood that the connection circuit 120 can also connect multiple sets of electrical connection portions 110 in parallel or a combination of series and parallel connections through multiple circuit traces 121.

[0069] In some embodiments of this application, see further reference. Figure 1 , Figure 4 as well as Figure 5The via 11 includes a first via 101 and a second via 102. The positive pad 111 covers the end of the first via 101 located on the light-emitting side, and the negative pad 112 covers the end of the second via 102 located on the light-emitting side. The positive pad 111 is electrically connected to the circuit trace 121 through the first via 101, and the negative pad 112 is electrically connected to the circuit trace 121 through the second via 102. Since the positive pad 111 covers the first via 101 and the negative pad 112 covers the second via 102, the first via 101 and the second via 102 can be avoided from being exposed on the surface of the reflector 10 on the light-emitting side, thus preventing the light from the light-emitting device 20 from entering the first via 101 and the second via 102, thereby improving the light reflectivity of the reflector 10.

[0070] In some embodiments of this application, such as embodiments where via 11 includes a first via 101 and a second via 102, see [reference needed]. Figure 2 One end of the circuit trace 121 covers the backlight side of the first via 101, and the other end covers the backlight side of the second via 102. The first via 101 contains a first conductor 131 that connects the circuit trace 120 and the positive pad 111, and the second via 102 contains a second conductor 132 that connects the circuit trace 120 and the negative pad 112. In other words, the two ends of the first via 101 are covered by the positive pad 111 and the circuit trace 121, respectively, and the two ends of the second via 102 are covered by the negative pad 112 and the circuit trace 121, respectively. This makes the first via 101 and the second via 102 sealed, preventing impurities from entering the first via 101 and the second via 102 and affecting the conductivity of the first conductor 131 and the second conductor 132.

[0071] In some embodiments of this application, the positive electrode pad 111, the negative electrode pad 112, the first conductor 131, the second conductor 132, and the circuit trace 121 are all made of conductive silver paste. While the conductive silver paste is used to prepare the electrical connection portion 110 and the circuit trace 121 on both sides of the reflector 10, the conductive silver paste will fill the via 11 to form the first conductor 131 and the second conductor 132. This helps to reduce the difficulty of preparing the electrical connection portion 110, the circuit trace 121, the first conductor 131, and the second conductor 132 on the reflector 10. At the same time, the positive electrode pad 111 and the negative electrode pad 112 formed by the conductive silver paste have certain light reflection properties, which can further improve the light utilization rate of the light-emitting device 20.

[0072] It is understandable that the positive electrode pad 111, negative electrode pad 112, first conductor 131, second conductor 132 and circuit trace 121 can also be formed of other conductive materials, such as copper foil, silver foil, etc.

[0073] In some embodiments of this application, see Figure 1 The orthographic projection of the light-emitting device 20 onto the reflector 10 does not overlap with the via 11. When the light-emitting device 20 is fixed, the positive electrode connection portion 21 and the negative electrode connection portion 22 of the light-emitting device 20 can avoid being connected around the via 11, thereby ensuring the reliability of the light-emitting device 20 being fixed on the reflector 10. Furthermore, in some embodiments of this application, such as embodiments where the positive electrode pad 111 and the negative electrode pad 112 are cured conductive silver paste, the portion of the conductive silver paste exposed outside the light-emitting device 20 and overlapping with the via 11 also has light reflectivity. Therefore, the portions of the positive electrode pad 111 and the negative electrode pad 112 outside the light-emitting device 20 will not affect the light reflectivity of the reflector 10.

[0074] In some embodiments of this application, see Figure 1 In this process, the cross-sectional area of ​​the via 11 gradually increases from the backlight side to the light-emitting side. When fabricating the electrical connection portion 110 and the connection circuit 120 on the reflector 10, the connection circuit 120 can be fabricated first on the side of the reflector 10 located on the backlight side. Since the cross-sectional area of ​​the via 11 gradually increases along the direction from the backlight side to the light-emitting side, the conductive silver paste can more easily enter the via 11 to form the conductor 130 when fabricating the connection circuit 120, thereby reducing the difficulty of fabricating the conductor 130 in the via 11.

[0075] In other embodiments of this application, see further reference. Figure 6 , Figure 6 This illustration shows another structural schematic of the lamp board 100 in an embodiment of this application, wherein the cross-sectional area of ​​the via 11 gradually decreases from the backlight side to the light-emitting side. When fabricating the electrical connection portion 110 and the connecting circuit 120 on the reflector 10, the electrical connection portion 110 can be fabricated first on the side of the reflector 10 located on the light-emitting side. Similarly, since the cross-sectional area of ​​the via 11 gradually decreases along the direction from the backlight side to the light-emitting side, the conductive silver paste is more likely to enter the via 11 to form the conductor 130 when fabricating the electrical connection portion 110, thereby reducing the difficulty of fabricating the conductor 130 in the via 11.

[0076] In some embodiments of this application, see Figure 7 , Figure 7The diagram shows another structural schematic of the lamp board 100 in an embodiment of this application. In this embodiment, the reflector 10 has a first groove 14 on the light-emitting side, and the electrical connection part 110 is disposed in the first groove 14. The surface of the electrical connection part 110 is basically flush with the surface of the reflector 10. For some embodiments of this application, such as embodiments where the positive electrode pad 111 and the negative electrode pad 112 are solidified conductive silver paste, this makes the surface of the reflector 10 on the light-emitting side flat. The electrical connection part 110 in the first groove 14 can also reflect light, thereby avoiding the phenomenon of irregular light reflection caused by the uneven surface of the reflector 10, which is beneficial to improving the uniformity of light emission from the lamp board 100.

[0077] In some embodiments of this application, see further reference. Figure 8 , Figure 8 The diagram shows another structural schematic of the lamp board 100 in an embodiment of this application. In this embodiment, the reflector 10 has a second groove 15 on the side facing the backlight. The connecting circuit 120 is disposed in the second groove 15. In some embodiments of this application, such as the embodiment where the connecting circuit 120 is a cured conductive silver paste, when preparing the connecting circuit 120, the liquid conductive silver paste is directly filled into the second groove 15 and cured by baking to form the connecting circuit 120. Since the conductive silver paste is restricted by the second groove 15, it can avoid the liquid conductive silver paste before curing from flowing randomly due to factors such as machine vibration, which would eventually lead to short circuits or open circuits in the circuit structure after curing.

[0078] In some embodiments of this application, see further reference. Figure 1 The light panel 100 also includes a protective layer 30, which covers the side of the reflector 10 located on the backlight side. The connecting circuit 120 is located between the protective layer 30 and the reflector 10. The protective layer 30 has insulating properties, thereby preventing the risk of exposed circuitry. For example, the protective layer 30 can be made of flexible and insulating materials such as glass fiber, basalt fiber, polyvinyl alcohol, or polyethylene naphthalate.

[0079] It is worth noting that the above description of the lamp board 100 is intended to clearly illustrate the implementation process of this application. Based on this application, those skilled in the art can also make equivalent modifications and designs, such as the positive electrode pad 111 and the negative electrode pad 112 being formed of copper foil, and the connection circuit 120 being formed by baking and curing conductive silver paste.

[0080] Furthermore, to better implement the lamp board 100 of this application, based on the lamp board 100, this application also provides a method for preparing the lamp board 100, see reference. Figure 9 , Figure 9This paper illustrates a flowchart of a method for preparing a lamp panel 100 according to an embodiment of this application. The method for preparing the lamp panel 100 includes:

[0081] Step S901, provide a reflector 10;

[0082] Specifically, the reflector 10 can reflect light emitted by the light-emitting device 20 towards the backlight side, thereby improving the light utilization rate of the light-emitting device 20. In some embodiments of this application, the reflector 10 can be a reflective sheet 12. In other embodiments of this application, the reflector 10 includes a flexible substrate 13 and a reflective sheet 12 bonded together. It is understood that the reflector 10 can also refer to other substrates with reflective functions, such as coating the surface of the flexible substrate 13 with white ink to form a reflective layer, thereby preparing a reflector 10 with reflective function and flexibility.

[0083] Step S902: A through hole 11 is made on the reflector 10, and the through hole 11 penetrates both sides of the reflector 10.

[0084] In some embodiments of this application, the cross-sectional area of ​​the via 11 gradually increases from the backlight side to the light-emitting side. In other embodiments of this application, the cross-sectional area of ​​the via 11 gradually decreases from the backlight side to the light-emitting side. In some embodiments, the via 11 can be a circular hole, a tapered hole, or a square hole, etc.

[0085] Specifically, the via 11 can be formed by physical or chemical means. For example, the via 11 can be formed on the reflector 10 by mechanical drilling equipment; or by laser drilling; or by using chemical agents to etch the reflector 10 to form the via 11.

[0086] In step S903, a connection circuit 120 is formed on one side of the reflector 10, and multiple sets of electrical connection portions 110 are formed on the other side. The electrical connection portion 110 includes a positive electrode pad 111 and a negative electrode pad 112. The connection circuit 120 is electrically connected to the positive electrode pad 111 and the negative electrode pad 112 through a via 11.

[0087] In some embodiments of this application, the connection circuit 120 and the electrical connection portion 110 can be formed by baking conductive silver paste to solidify it. For example, conductive silver paste is first applied to the side of the reflector 10 located on the backlight side and the conductive silver paste fills the via 11. After baking, the connection circuit 120 is formed on the side of the reflector 10 located on the backlight side. Then, conductive silver paste is applied to the side of the reflector 10 located on the light-emitting side and the conductive silver paste is solidified around the via 11, so that the connection circuit 120 is connected to the electrical connection portion 110 through the via 11.

[0088] Understandably, the connecting circuit 120 and the electrical connection part 110 can also be formed by bonding metal foils (such as copper foil, silver foil, etc.) to both sides of the reflector 10.

[0089] In step S904, the light-emitting device 20 is installed on the side of the reflector 10 where the electrical connection part 110 is provided. The positive electrode connection part 21 of the light-emitting device 20 is connected to the positive electrode pad 111, and the negative electrode connection part 22 is connected to the negative electrode pad 112.

[0090] In some embodiments of this application, the light-emitting device 20 is soldered to the light-emitting side of the reflector 10, such that the positive electrode connection 21 of the light-emitting device 20 is connected to the positive electrode pad 111, and the negative electrode connection 22 is connected to the negative electrode pad 112. In other embodiments of this application, the light-emitting device 20 is bonded to the light-emitting side of the reflector 10 using a conductive adhesive (e.g., silver paste). Those skilled in the art will understand that other soldering or adhesive bonding methods can also be used to mount the light-emitting device 20 to the reflector 10, which will not be elaborated upon here.

[0091] In this embodiment, an electrical connection portion 110 and a connection circuit 120 are respectively provided on both sides of the reflector 10, and the electrical connection portion 110 and the connection circuit 120 are electrically connected through a via 11. The light-emitting device 20 can be directly mounted on the positive electrode pad 111 and the negative electrode pad 112. Since the positive electrode pad 111 and the negative electrode pad 112 are located on the surface of the reflector 10, the silver paste is not covered by the reflective sheet 12 or ink when the light-emitting device 20 is die-bonded, thus avoiding the phenomenon of the reflective sheet 12 or ink cracking due to the curing of the silver paste. At the same time, since the connection circuit 120 is set on the backlight side of the reflector 10, only the positive electrode pad 111 and the negative electrode pad 112 for die bonding are exposed on the light-emitting side of the reflector 10, which can also avoid the phenomenon of the connection circuit 120 blocking the surface of the reflector 10 and causing its reflectivity to decrease.

[0092] In some embodiments of this application, to better protect the protective layer 30 located on the backlight side of the reflector 10, the lamp board 100 manufacturing method further includes covering the protective layer 30 on the backlight side of the reflector 10. For example, adhesive can be applied to the side of the protective layer 30 facing the reflector 10, and then the protective layer 30 is bonded to the reflector 10 and baked, thus fixing the protective layer 30 to the backlight side of the reflector 10. In some embodiments of this application, the protective layer 30 can be made of flexible and insulating materials such as glass fiber, basalt fiber, polyvinyl alcohol, or polyethylene naphthalate. After covering with the protective layer 30, the connection circuit 120 is located between the protective layer 30 and the reflector 10. Because the protective layer 30 has insulating properties, the risk of exposed and leaking current in the connection circuit 120 can be avoided.

[0093] Understandably, the order of the above steps can be adjusted according to actual needs. For example, after forming the connection circuit 120 on the backlight side of the reflector 10, a protective layer 30 is then covered on the backlight side of the reflector 10 to protect the connection circuit 120 in a timely manner.

[0094] Furthermore, to better implement the lamp board 100 of this application, based on the lamp board 100, this application also provides a backlight module, which includes the lamp board 100 of any of the above embodiments. Since the backlight module in the embodiments of this application includes the lamp board 100 of the above embodiments, it has all the beneficial effects of the lamp board 100 of the above embodiments, and will not be repeated here.

[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed descriptions of other embodiments above, which will not be repeated here.

[0096] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely an example and does not constitute a limitation of this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. It should also be noted that the application scenarios of the lamp board in the embodiments of this application include, but are not limited to, backlight modules for liquid crystal display devices, Mini LED direct-view displays, Micro LED direct-view displays, and other fields.

[0097] The above provides a detailed description of a lamp board and its preparation method, as well as a backlight module, provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A light panel, characterized in that, The lamp panel has a light-emitting side and a backlight side, and the lamp panel includes: A light-emitting device, the light-emitting device having a positive electrode connection portion and a negative electrode connection portion; A reflector, wherein the reflector has multiple sets of electrical connection portions on the light-emitting side, each set of electrical connection portions including a positive electrode pad and a negative electrode pad, the positive electrode pad being electrically connected to the positive electrode connection portion, and the negative electrode pad being electrically connected to the negative electrode connection portion; The reflector is provided with a through hole penetrating both sides of it, and a connection circuit is provided on the side of the reflector located on the backlight side. The positive electrode pad and the negative electrode pad are electrically connected to the connection circuit through the through hole. The cross-sectional area of ​​the via gradually increases from the backlight side to the light-emitting side; or, the cross-sectional area of ​​the via gradually decreases from the backlight side to the light-emitting side. The reflector has a first groove on the light-emitting side, and the electrical connection part is disposed in the first groove; and / or, the reflector has a second groove on the backlight side, and the connection circuit is disposed in the second groove.

2. The lamp panel as described in claim 1, characterized in that, The reflector includes a reflective sheet; The electrical connection portion is disposed on the side of the reflector located on the light-emitting side, and the connection circuit is disposed on the side of the reflector located on the backlight side.

3. The lamp panel as described in claim 1, characterized in that, The reflector includes a flexible substrate and a reflective sheet bonded together. The electrical connection portion is disposed on the side of the reflective sheet opposite to the flexible substrate, the connection circuit is disposed on the side of the flexible substrate opposite to the reflective sheet, and the via penetrates the flexible substrate and the reflective sheet.

4. The lamp panel as described in claim 1, characterized in that, The connection circuit includes multiple circuit traces; One end of the circuit trace is electrically connected to the positive pad of a set of electrical connection parts, and the other end is electrically connected to the negative pad of another set of electrical connection parts.

5. The lamp panel as described in claim 4, characterized in that, The via includes a first via and a second via; The positive electrode pad covers one end of the first via on the light-emitting side, and the negative electrode pad covers one end of the second via on the light-emitting side. The positive electrode pad is electrically connected to the circuit trace through the first via, and the negative electrode pad is electrically connected to the circuit trace through the second via.

6. The lamp panel as described in claim 5, characterized in that, One end of the circuit trace covers the end of the first via located on the backlight side, and the other end covers the end of the second via located on the backlight side. The first via is provided with a first conductor connecting the circuit trace and the positive electrode pad, and the second via is provided with a second conductor connecting the circuit trace and the negative electrode pad.

7. The lamp panel as described in claim 1, characterized in that, The orthographic projection of the light-emitting device onto the reflector does not overlap with the via.

8. The lamp panel as described in claim 1, characterized in that, The materials of the positive electrode pad and the negative electrode pad include conductive silver paste or copper foil; and / or The materials used in the connecting circuit include conductive silver paste or copper foil.

9. The lamp panel as described in claim 1, characterized in that, The light-emitting device corresponds one-to-one with the electrical connection portion, and the positive electrode connection portion and the negative electrode connection portion of the same light-emitting device are electrically connected to the same electrical connection portion.

10. The lamp panel according to any one of claims 1 to 9, characterized in that, It also includes a protective layer that covers the side of the reflector located on the backlight side.

11. A method for preparing a lamp panel, characterized in that, include; Provide a reflector; A through hole is made in the reflector, and the through hole penetrates both sides of the reflector; A connection circuit is formed on one side of the reflector, and multiple sets of electrical connection portions are formed on the other side. The electrical connection portions include positive electrode pads and negative electrode pads. The connection circuit is electrically connected to the positive electrode pads and negative electrode pads through the vias. The light-emitting device is installed on the side of the reflector that has an electrical connection portion. The positive electrode connection portion of the light-emitting device is connected to the positive electrode pad, and the negative electrode connection portion is connected to the negative electrode pad. Specifically, the cross-sectional area of ​​the via gradually increases from the backlight side to the light-emitting side; or, the cross-sectional area of ​​the via gradually decreases from the backlight side to the light-emitting side. The reflector has a first groove on the light-emitting side, and the electrical connection part is disposed in the first groove; and / or, the reflector has a second groove on the backlight side, and the connection circuit is disposed in the second groove.

12. The lamp panel preparation method according to claim 11, characterized in that, The method further includes: A protective layer is applied to the side of the reflector that is located on the backlight side.

13. A backlight module, characterized in that, Includes the lamp panel as described in any one of claims 1 to 10.

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