Display device and method of manufacturing the same

Abstract

The present application provides a display device and a manufacturing method thereof, the display device comprising: a display component; and a touch component arranged on the display component, the touch component comprising: a first touch insulating layer located on the display component; a first touch conductive layer arranged on the first touch insulating layer and comprising a second touch bridge electrode; a second touch insulating layer arranged on the first touch conductive layer and containing an organic substance, and comprising a first contact hole penetrating the second touch insulating layer in a thickness direction; a second touch conductive layer arranged on the second touch insulating layer and comprising a first lower sensing line overlapping the second touch bridge electrode; and a third touch conductive layer arranged on the second touch conductive layer and comprising a first upper sensing line overlapping the first lower sensing line, a width of the first upper sensing line being greater than a width of the first lower sensing line.

Description

Technical Field

[0001] This invention relates to a display device and a method for manufacturing the same. Background Technology

[0002] Electronic devices that provide images to users, such as smartphones, tablet PCs, digital cameras, laptops, navigation devices, and smart TVs, include display devices for displaying images. These display devices include display components that generate and display images, as well as various input devices.

[0003] The display device includes a touch component disposed on a display component, the touch component may include a plurality of touch conductive layers and a touch insulating layer that insulates the plurality of touch conductive layers.

[0004] On the other hand, the touch conductive layer may form a parasitic capacitance with the display conductive layer of the display component, which may reduce the touch sensitivity of the touch component. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide a display device that improves the touch characteristics of the touch component of the display device and improves the defects of the second touch insulating layer of the touch component.

[0006] Another problem to be solved by the present invention is to provide a method for manufacturing a display device that improves the touch characteristics of the touch component of the display device and improves the defects of the second touch insulating layer of the touch component.

[0007] The subject matter of this invention is not limited to the subject matter mentioned above, and those skilled in the art will clearly understand from the following description other technical subject matter not mentioned.

[0008] A display device according to one embodiment for solving the aforementioned problem includes: a display component; and a touch component disposed on the display component, the touch component including: a first touch insulating layer located on the display component; a first touch conductive layer disposed on the first touch insulating layer and including a second touch bridge electrode; a second touch insulating layer disposed on the first touch conductive layer and comprising an organic material, and including a first contact hole penetrating the second touch insulating layer in the thickness direction; a second touch conductive layer disposed on the second touch insulating layer and including a first lower sensing line overlapping the second touch bridge electrode; and a third touch conductive layer disposed on the second touch conductive layer and including a first upper sensing line overlapping the first lower sensing line, the width of the first upper sensing line being greater than the width of the first lower sensing line.

[0009] A method for manufacturing a display device according to an embodiment for solving the aforementioned other problem includes: a display component forming step, wherein a first insulating film, a first conductive layer, a second insulating film on the first conductive layer, and a second conductive layer are formed on a substrate portion including an effective region and a pad region located around the effective region; the first conductive layer is disposed on the first insulating film and includes a gate electrode in the effective region and a first pad electrode in the pad region; the second conductive layer is disposed on the second insulating film and includes a drain electrode and a source electrode in the effective region and a second pad electrode in the pad region; a first touch insulating layer forming step, wherein a first touch insulating layer is formed on the second conductive layer in the effective region and the pad region; and a first touch conductive layer forming step, wherein a first touch conductive layer including a second touch bridge electrode is formed on the first touch insulating layer in the effective region. The process includes: a second touch insulating layer forming step, forming a second touch insulating layer of organic material on the first touch conductive layer in the effective region and the pad region; a contact hole forming step, forming a first contact hole exposing the upper surface of the second touch bridge electrode and a second contact hole exposing the upper surface of the second pad electrode; a second touch conductive layer forming step, forming a second touch conductive layer on the second touch insulating layer; a third touch conductive layer forming step, forming a third touch conductive layer on the second touch conductive layer; a photoresist forming step, forming photoresist on the third touch conductive layer; an upper sensing line forming step, forming a first upper sensing line and a second upper sensing line of the third touch conductive layer spaced apart by the photoresist in the effective region, and forming a fourth pad electrode of the third touch conductive layer in the pad region; and an etching step, removing the photoresist using an etching solution.

[0010] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0011] (Invention Effects)

[0012] According to one embodiment of the display device and its manufacturing method, the touch characteristics of the touch component of the display device can be improved, and the defects of the second touch insulating layer of the touch component can be improved.

[0013] The effects of the embodiments are not limited to those illustrated above, and more effects are included in this specification. Attached Figure Description

[0014] Figure 1 This is a plan view of a display device according to one embodiment.

[0015] Figure 2 This is a schematic cross-sectional view of a curved display device according to one embodiment.

[0016] Figure 3 This is a schematic cross-sectional view of a display device according to one embodiment.

[0017] Figure 4 This is a cross-sectional view of the main area and the pad area of ​​a display device according to an embodiment.

[0018] Figure 5 This is a plan view of the display component and touch component of a display device according to one embodiment.

[0019] Figure 6 It is magnification Figure 5 Plan view of the FF1 area.

[0020] Figure 7 It is along Figure 6 The I-I' line and Figure 5 The enlarged view is a cross-sectional view taken from line II-II'.

[0021] Figure 8 This is a flowchart of a method for manufacturing a display device according to an embodiment.

[0022] Figures 9 to 16 This is a cross-sectional view of each process step in a method for manufacturing a display device according to an embodiment.

[0023] Figure 17 This is a cross-sectional view of a display device according to another embodiment.

[0024] Figure 18 as well as Figure 19 It is based on Figure 17 Cross-sectional views of each process step in the manufacturing method of the display device.

[0025] Figure 20 This is a cross-sectional view of a display device according to yet another embodiment.

[0026] (Explanation of reference numerals in the attached diagram)

[0027] 1: Display device

[0028] 10: Display panel

[0029] 20: Display component

[0030] 30: Touch component Detailed Implementation

[0031] With the attached Figure 1The advantages and features of the invention, as well as the methods of implementing them, will become clear from the detailed embodiments described below. However, the invention is not limited to the embodiments disclosed below and can be implemented in various ways, different from each other. These embodiments are provided merely to make the disclosure of the invention complete and to fully convey the scope of the invention to those skilled in the art to which it pertains, and the invention is defined only by the scope of the claims.

[0032] The term "elements" or "layers" "on" another element or layer includes all cases where an element is directly on top of another element or in between, separated by other layers or other elements. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0033] Although terms such as "first," "second," etc., are used to describe various constituent elements, it is clear that these constituent elements are not limited to these terms. These terms are used merely to distinguish one constituent element from others. Therefore, it is obvious that the first constituent element mentioned below can also be a second constituent element within the technical concept of this invention.

[0034] The following describes specific embodiments with reference to the accompanying drawings.

[0035] Figure 1 This is a plan view of a display device according to one embodiment. Figure 2 This is a schematic partial cross-sectional view of a display device according to an embodiment. Figure 3 This is a schematic cross-sectional view of a display device according to one embodiment.

[0036] In this embodiment, the first direction DR1 and the second direction DR2 intersect each other in directions that are different from each other. Figure 1 In the plan view, for ease of explanation, a first direction DR1 is defined as the vertical direction and a second direction DR2 is defined as the horizontal direction. In the following embodiments, one side of the first direction DR1 refers to the upper direction on the plan view, and the other side of the first direction DR1 refers to the lower direction on the plan view; one side of the second direction DR2 refers to the right direction on the plan view, and the other side of the second direction DR2 refers to the left direction on the plan view. However, it should be understood that the directions mentioned in the embodiments refer to relative directions, and the embodiments are not limited to the mentioned directions.

[0037] Reference Figures 1 to 3Display device 1 can refer to all electronic devices that provide a display screen. For example, it can include not only portable electronic devices that provide a display screen, such as mobile phones, smartphones, tablet PCs (personal computers), electronic watches, smartwatches, watch phones, mobile communication terminals, electronic manuals, e-books, PMPs (portable multimedia players), navigators, game consoles, digital cameras, etc., but also televisions, laptops, monitors, billboards, Internet of Things devices, etc., are included in display device 1.

[0038] Display device 1 includes an active area AAR (or active region) and an inactive area NAR (or passive region). In display device 1, if the portion displaying the image is defined as the display area, the portion not displaying the image is defined as the non-display area, and the area for sensing touch input is defined as the touch area, then the display area and the touch area can be included in the active area AAR. The display area and the touch area can overlap. That is, the active area AAR can be an area that both displays and senses touch input. The shape of the active area AAR can be a rectangle or a rectangle with rounded corners. An example active area AAR is a rectangle with rounded corners and a first direction DR1 longer than a second direction DR2. However, it is not limited to this; the active area AAR can have a rectangular shape, a square or other polygonal shape, or various shapes such as a circle or an ellipse, where the second direction DR2 is longer than the first direction DR1.

[0039] The invalid region NAR is configured around the valid region AAR. The invalid region NAR can be a border area. The invalid region NAR can surround all edges of the valid region AAR (the four edges in the figure). However, it is not limited to this; for example, an invalid region NAR may not be configured near the top edge or the left or right edge of the valid region AAR.

[0040] The invalid area NAR can be configured with signal wiring or driving circuitry for applying signals to the valid area AAR (display area or touch area). The invalid area NAR may not include the display area. Furthermore, the invalid area NAR may not include the touch area. In another embodiment, the invalid area NAR may also include a portion of the touch area, and sensor components such as pressure sensors may be configured in this area. In some embodiments, the valid area AAR may be an area completely identical to the display area of ​​the displayed image, and the invalid area NAR may be an area completely identical to the non-display area where no image is displayed.

[0041] Display device 1 includes a display panel 10 that provides a displayed image. Examples of display panels 10 include organic light-emitting display panels, micro LED display panels, nano LED display panels, quantum dot light-emitting display panels, liquid crystal display panels, plasma display panels, field emission display panels, electrophoretic display panels, and electrowetting display panels. In the following description, an organic light-emitting display panel is illustrated as an example of display panel 10, but it is not limited to this. Other display panels can be applied as long as the same technical concept can be used.

[0042] The display device 1 may also include a touch component 30 for sensing touch input. While the touch component 30 may be provided as a panel or film different from the display panel 10 and attached to the display panel 10, it may also be provided as a touch layer inside the display panel 10. Although the following embodiments illustrate a case where the touch component 30 is disposed inside the display panel 10 and included within the display panel 10, the present invention is not limited thereto.

[0043] The display panel 10 may include a flexible substrate containing a flexible polymer material such as polyimide. Therefore, the display panel 10 can be bent, folded, rolled, or bent.

[0044] The display panel 10 may include a curved area, namely the curved area BR, of the panel. Centered on the curved area BR, the display panel 10 may be divided into a main area MR located on one side of the curved area BR and a sub-area SR located on the other side of the curved area BR. The invalid area NAR of the display device 1 may include the curved area BR. Based on the curved area BR, the invalid area NAR may be divided into an upper area of ​​the curved area BR (where MR is the area above the curved area BR). Figure 1 (based on the first direction DR1) and the lower region of the bending region BR (with Figure 1 (Based on the first direction DR1). The upper region of the curved region BR can be located in the main region MR, which will be described later, and the lower region of the curved region BR can be located in the sub-region SR, which will be described later.

[0045] The display area of ​​the display panel 10 is configured in the main region MR. The display area includes multiple pixels. In one embodiment, the peripheral edge portion of the display area in the main region MR, the entire curved region BR, and the entire sub-region SR may be non-display areas. However, it is not limited to this; the curved region BR and / or the sub-region SR may also include display areas.

[0046] The main region MR may have a shape that is substantially similar to the planar shape of the display device 1. The main region MR may be a flat area located on a plane. However, it is not limited to this, and at least one of the remaining edges of the main region MR, except for the edge (edge) connected to the curved region BR, may be bent to form a curved surface or bent in a vertical direction.

[0047] When at least one of the remaining edges in the main region MR, excluding the edge (edge) connected to the curved region BR, forms a curved surface or bend, a display area may be configured at that edge. However, it is not limited to this; the curved or bend edge may also be a non-display area where no image is displayed, or a display area and a non-display area may be jointly provided at that location.

[0048] The curved region BR is connected to the main region MR on one side of the first direction DR1. For example, the curved region BR can be connected via the lower short side of the main region MR. The width of the curved region BR can be smaller than the width of the main region MR (the width of the short side). The connection between the main region MR and the curved region BR can have an L-shaped cut.

[0049] Within the curved region BR, the display panel 10 can be bent with a certain curvature in the thickness direction downwards, i.e., in the opposite direction to the display surface. The curved region BR can have a certain radius of curvature, but is not limited to this, and can also have different radii of curvature in different sections. As the display panel 10 bends at the curved region BR, the surface of the display panel 10 can be flipped. That is, the side of the display panel 10 facing upwards can be changed through the curved region BR to first face outwards and then downwards again.

[0050] The sub-region SR extends from the curved region BR. The sub-region SR can extend in a direction parallel to the main region MR after the curvature is completed. The sub-region SR can overlap with the main region MR in the thickness direction of the display panel 10. The width of the sub-region SR (the width of the second direction DR2) can be the same as, but is not limited to, the width of the curved region BR.

[0051] like Figure 1 As shown, the sub-region SR may include a pad region PA. A driver chip 70 may be configured in the pad region PA of the sub-region SR. The driver chip 70 may include an integrated circuit for driving the display panel 10. The integrated circuit may include an integrated circuit for the display and / or an integrated circuit for the touch unit. The integrated circuit for the display and the integrated circuit for the touch unit may be provided as separate chips or integrated into a single chip.

[0052] Although not illustrated, the sub-region SR of the display panel 10 may also include a second pad region located between the pad region PA and the other end of the first direction DR1 of the display panel 10, wherein a driving substrate made of a flexible printed circuit board or film may be connected in the second pad region.

[0053] Reference Figure 3 The display panel 10 may include a display component 20, a touch component 30, a polarizing component 40, and a bending protective film 50 (BPL). The display component 20 may be configured across the main region MR, the bending region BR, and the sub-region SR. Figure 3 As shown in the enlarged view, the display component 20 includes a substrate portion (see reference). Figure 4 '101'), and the circuit layer disposed on the substrate (refer to '101'), Figure 4 'TR'), and the light-emitting layer disposed on the circuit layer (refer to 'TR'). Figure 4 (122) and the encapsulation layer disposed on the light-emitting layer (refer to '122' ... Figure 4 (refer to '116'). The display panel 10 may also include a first electrode disposed below the light-emitting layer (see '116'). Figure 4 (121) and the second electrode disposed above the light-emitting layer (refer to) Figure 4 (123). The first electrode, the light-emitting layer, and the second electrode can constitute a light-emitting element. The light-emitting element can be disposed in each pixel.

[0054] The planar shape of the display component 20 can be substantially the same as the planar shape of the display panel 10 described above. That is, the display component 20 can have a planar shape that is substantially the same as the planar shape of the main region MR, the curved region BR, and the sub-region SR.

[0055] Touch component 30 can be disposed on display component 20. Touch component 30 can be disposed across main region MR, curved region BR, and sub-region SR. Touch component 30 can be formed directly on display component 20. As described later, touch component 30 may include a first touch insulating layer, a first touch conductive layer disposed on the first touch insulating layer, a second touch insulating layer disposed on the first touch conductive layer, a second touch conductive layer disposed on the second touch insulating layer, a third touch conductive layer disposed on the second touch conductive layer, and a third touch insulating layer disposed on the third touch conductive layer.

[0056] The planar shape of the touch component 30 can be substantially the same as the planar shape of the display component 20. That is, the touch component 30 can have a planar shape that is substantially the same as the planar shape of the main region MR, the curved region BR, and the sub-region SR.

[0057] like Figure 3As shown, the polarizing component 40 can be configured to substantially overlap with the main region MR in the thickness direction, but is not configured within the curved region BR. The curved protective film 50 can be configured to completely overlap with the curved region BR, and can also extend to a portion of the adjacent main region MR and sub-region SR. The opposing sides of the polarizing component 40 and the curved protective film 50 can be in contact with each other. That is, no space may be provided between the sides of the polarizing component 40 and the curved protective film 50. The boundary between one side of the curved protective film 50 and one side of the polarizing component 40 can be located within the main region MR.

[0058] Refer again Figure 1 The planar shape of the polarizing component 40 may be substantially the same as the planar shape corresponding to the main region MR of the touch component 30 described above. In some embodiments, the plane dimension of the polarizing component 40 may be smaller than that of the touch component 30, thereby exposing a portion of the border of the touch component 30 corresponding to the main region MR.

[0059] The planar shape of the curved protective film 50 can be substantially the same as the planar shape corresponding to the curved area BR of the touch component 30 described above. The planar shape of the curved protective film 50 can be substantially rectangular. In some embodiments, the planar dimension of the curved protective film 50 can be smaller than that of the touch component 30. That is, the width of the curved protective film 50 in the second direction DR2 can also be smaller than the width of the touch component 30 in the second direction DR2.

[0060] Figure 4 This is a cross-sectional view of the main area and the pad area of ​​a display device according to an embodiment. Figure 5 This is a plan view of the display component and touch component of a display device according to one embodiment. Figure 6 It is magnification Figure 5 Plan view of the FF1 area. Figure 7 It is along Figure 6 The I-I' line and Figure 5 The enlarged view is a cross-sectional view taken from line II-II'.

[0061] Reference Figures 4 to 7The substrate portion 101 may include a first support substrate 102, a second support substrate 103 disposed on the first support substrate 102, and a barrier layer 104 disposed between the first support substrate 102 and the second support substrate 103. The first support substrate 102 and the second support substrate 103 may be flexible substrates as described above. For example, the first support substrate 102 and the second support substrate 103 may be one of a film substrate containing a polymeric organic material and a plastic substrate, respectively. For example, the first support substrate 102 and the second support substrate 103 may comprise one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetate cellulose, and cellulose acetate propionate. Additionally, the substrate portion 101 may also comprise fiber glass reinforced plastic (FRP).

[0062] The barrier layer 104 can be disposed between the first support substrate 102 and the second support substrate 103 to bond the first support substrate 102 and the second support substrate 103 while planarizing the first and second support substrates 102 and 103 containing organic materials. The barrier layer 104 can be composed of inorganic materials.

[0063] A buffer layer 111 is disposed on the substrate portion 101. The buffer layer 111 may be disposed on the second support substrate 103. The buffer layer 111 functions to smooth the surface of the substrate portion 101 and prevent the penetration of moisture or external air. The buffer layer 111 may be an inorganic film. The buffer layer 111 may be a single-layer film or a multi-layer film.

[0064] Multiple thin-film transistors (TRs) are configured on the buffer layer 111. Here, the multiple thin-film transistors (TRs) can be driving thin-film transistors. More than one thin-film transistor (TR) can be configured in each pixel. The thin-film transistor (TR) can include a semiconductor layer CH, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0065] More specifically, a semiconductor layer CH is disposed on the buffer layer 111. The semiconductor layer CH may include amorphous silicon, polysilicon, or organic semiconductors. In another embodiment, the semiconductor layer CH may be an oxide semiconductor. Although not illustrated, the semiconductor layer CH may include a channel region and source and drain regions disposed on both sides of the channel region and doped with impurities.

[0066] A gate insulating film 112 is disposed on the semiconductor layer CH. The gate insulating film 112 can be an inorganic film. The gate insulating film 112 can be a single-layer film or a multilayer film.

[0067] A first conductive layer DCL1 may be disposed on the gate insulating film 112. The first conductive layer DCL1 may include a gate electrode GE and a first pad electrode PE1. The first conductive layer DCL1 may also include a plurality of scan lines. The gate electrode GE may be connected to one of the plurality of scan lines.

[0068] The first conductive layer DCL1 can be formed of a conductive metallic material. For example, the first conductive layer DCL1 can contain molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti). The first conductive layer DCL1 can be a single-layer film or a multilayer film.

[0069] An interlayer insulating film 113 is disposed on the first conductive layer DCL. The interlayer insulating film 113 can be an inorganic film. The interlayer insulating film 113 can be a single-layer film or a multi-layer film. The interlayer insulating film 113 can also be disposed in the pad region PA. In the pad region PA, the interlayer insulating film 113 can partially expose the upper surface of the first pad electrode PE1.

[0070] A second conductive layer DCL2 may be disposed on the interlayer insulating film 113. The second conductive layer DCL2 may include a source electrode SE, a drain electrode DE, and a second pad electrode PE2 disposed on the pad region PA. In addition, the second conductive layer DCL2 may include high-potential voltage wiring, low-potential voltage wiring, and multiple data lines, but is not limited thereto.

[0071] The source electrode SE and drain electrode DE can be electrically connected to the source and drain regions of the semiconductor layer CH, respectively, through contact holes that penetrate the interlayer insulating film 113 and the gate insulating film 112. The second pad electrode PE2 can be connected to the first pad electrode PE1. The second pad electrode PE2 can directly contact the top of the first pad electrode PE1.

[0072] The second conductive layer DCL2 is formed of a conductive metallic material. For example, the second conductive layer DCL2 may contain aluminum (Al), copper (Cu), titanium (Ti), or molybdenum (Mo).

[0073] Although not shown, the display device 1 may also include a storage capacitor and a switching thin-film transistor on the substrate 101.

[0074] A protective layer 114 is disposed on the second conductive layer DCL2 and the interlayer insulating film 113. Here, the protective layer 114 is configured to cover the pixel circuit portion including the thin-film transistor TR. The protective layer 114 may be a planarization film. The planarization film may include materials such as acrylic and polyimide.

[0075] A plurality of first electrodes 121 are disposed on the protective layer 114. The first electrodes 121 may be pixel electrodes disposed in each pixel. Alternatively, the first electrodes 121 may be the anode electrode of an organic light-emitting diode.

[0076] The first electrode 121 can be electrically connected to the drain electrode DE (or source electrode SE) disposed on the first substrate portion 101 through a via through the protective layer 114.

[0077] The first electrode 121 can be formed by comprising a material with a high work function. The first electrode 121 can comprise indium-tin-oxide (ITO), indium-zinc-oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), etc. The illustrated conductive materials have relatively high work functions and are transparent. When the organic light-emitting display device is front-emitting, in addition to the illustrated conductive materials, it may also contain reflective materials, such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or mixtures thereof. Therefore, the first electrode 121 can have a single-layer structure composed of the illustrated conductive and reflective materials, or a multilayer structure with layers of them stacked.

[0078] A pixel defining film 115 is disposed on the first electrode 121. The pixel defining film 115 includes an opening that exposes at least a portion of the first electrode 121. The pixel defining film 115 may contain organic or inorganic materials. As one embodiment, the pixel defining film 115 may contain materials such as photoresist, polyimide resin, acrylic resin, silicon compound, and polyacrylic resin.

[0079] An organic light-emitting layer 122 is disposed on the first electrode 121 exposed by the pixel defining film 115. The organic light-emitting layer 122 may be a colored light-emitting layer that emits light of a specific color. For example, the organic light-emitting layer 122 may include a red light-emitting layer 122_1 that emits red light, a green light-emitting layer 122_2 that emits green light, and a blue light-emitting layer 122_3 that emits blue light. Each colored light-emitting layer may be disposed in each pixel.

[0080] In some embodiments, with Figure 4 Unlike the example shown, the organic light-emitting layer 122 can be formed as a single unit. That is, the organic light-emitting layer 122 can be formed as a single unit without being separated from the pixel. The organic light-emitting layer 122 can be composed of a colored light-emitting layer that emits light of one color. For example, the organic light-emitting layer 122 can be a blue light-emitting layer that emits blue light. In this case, in order to convert the color of the light emitted from the organic light-emitting layer 122, a wavelength conversion pattern can also be disposed above the organic light-emitting layer 122.

[0081] A second electrode 123 is disposed on the organic light-emitting layer 122. The second electrode 123 may be a common electrode disposed across the entire structure without being distinguishable from the pixel. Alternatively, the second electrode 123 may be the cathode electrode of an organic light-emitting diode.

[0082] The second electrode 123 may be formed comprising a material with a low work function. The second electrode 123 may comprise Li, Ca, LiF, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, or compounds or mixtures thereof (e.g., mixtures of Ag and Mg), or a material having a multilayer structure such as LiF / Ca or LiF / Al. The second electrode 123 may also include an auxiliary electrode. The auxiliary electrode may comprise a film formed by deposition of the material and a transparent metal oxide on the film, such as indium-tin-oxide (ITO), indium-zinc-oxide (IZO), zinc oxide (ZnO), indium-tin-zinc-oxide (IZO), etc.

[0083] When the display device 1 is a front-emitting type, the second electrode 123 can form a conductive layer with a small work function into a thin film, and then stack a transparent conductive film on top of it, such as an indium-tin-oxide (ITO) layer, an indium-zinc-oxide (IZO) layer, a zinc oxide (ZnO) layer, or an indium oxide (In2O3) layer.

[0084] As described above, the first electrode 121, the organic light-emitting layer 122, and the second electrode 123 can constitute a light-emitting element.

[0085] Although not illustrated, it may be that a hole injection layer and / or a hole transport layer are disposed between the first electrode 121 and the organic light-emitting layer 122, and an electron transport layer and / or an electron injection layer are disposed between the organic light-emitting layer 122 and the second electrode 123.

[0086] An encapsulation layer 116 is disposed on the second electrode 123. The encapsulation layer 116 includes at least one inorganic layer and at least one organic layer. The at least one inorganic layer and the at least one organic layer may be stacked on top of each other. For example, as Figure 6 As shown, the encapsulation layer 116 can be composed of a multilayer film comprising a first encapsulation inorganic layer 116a, an encapsulation organic layer 116b, and a second encapsulation inorganic layer 116c stacked sequentially. Here, the first encapsulation inorganic layer 116a and the second encapsulation inorganic layer 116c can contain silicon oxide (SiO2) as a component. x ), silicon nitride (SiN) x ), silicon oxynitride (SiON) x The encapsulating organic layer 116b may contain any one or more of the group consisting of epoxy resin, acrylate or polyurethane acrylate.

[0087] A touch component 30 is disposed on the encapsulation layer 116. The touch component 30 can directly contact the top of the second encapsulation inorganic layer 116c of the encapsulation layer 116.

[0088] Alternatively, a sensing electrode and a bridging electrode connected to the sensing electrode may be configured in the effective area AAR of the touch component 30, and multiple signal lines connected to the sensing electrode may be configured in the ineffective area NAR of the touch component 30.

[0089] The touch component 30 may include a first touch insulating layer 310, a first touch conductive layer YMTL1 disposed on the first touch insulating layer 310, a second touch insulating layer 330 disposed on the first touch conductive layer YMTL1, a second touch conductive layer YMTL2 disposed on the second touch insulating layer 330, a third touch conductive layer YMTL3 disposed on the second touch conductive layer YMTL2, and a third touch insulating layer 350 disposed on the third touch conductive layer YMTL3.

[0090] The first touch insulating layer 310 can be disposed on the second package inorganic layer 116c. The first touch insulating layer 310 can also be directly formed on the second package inorganic layer 116c. The first touch insulating layer 310 serves to insulate the first touch conductive layer YMTL1 and the multiple conductive layers of the display component 20 from each other. The first touch insulating layer 310 can also be disposed on the pad area PA.

[0091] As one embodiment, the first touch insulating layer 310 may comprise an inorganic insulating material. Here, the inorganic material may comprise silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiON) x The first touch insulating layer 310 may also contain an organic material. Here, the organic material may contain at least one of acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, polyurethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and dinaphthalene-based resins.

[0092] The first touch conductive layer YMTL1 can be disposed on the first touch insulating layer 310. The first touch conductive layer YMTL1 may include second touch bridge electrodes CP2 that electrically connect adjacent second sensing electrodes IE2_1 to IE2_4. The second touch bridge electrodes CP2 can be spaced apart from each other. The spaced-apart second touch bridge electrodes CP2 can partially expose the upper surface of the first touch insulating layer 310. The touch bridge electrodes of the first touch conductive layer YMTL1 can overlap with the black matrix and the pixel delimiting film 115. Therefore, it can be prevented from being observed by the user.

[0093] The touch component 30 may include a plurality of first sensing electrodes IE1-1 to IE1-8, a plurality of second sensing electrodes IE2-1 to IE2-4, a first touch bridge electrode CP1 that electrically connects adjacent first sensing electrodes IE1-1 to IE1-8, the aforementioned second touch bridge electrode CP2, and a pad PAD disposed in the pad area PA.

[0094] Multiple first sensing electrodes IE1-1 to IE1-8 may extend along the second direction DR2 and be arranged along the first direction DR1. Multiple second sensing electrodes IE2-1 to IE2-4 may extend along the first direction DR1 and be arranged along the second direction DR2.

[0095] The plurality of first sensing electrodes IE1-1 to IE1-8 may include a plurality of first sensing lines SPL1 configured to each have a mesh shape. The region divided by the plurality of first sensing lines SPL1 may overlap with the organic light-emitting layer 122 disposed in each pixel.

[0096] The plurality of second sensing electrodes IE2-1 to IE2-4 may include a plurality of second sensing lines SPL2 configured to each have a mesh shape. The regions defined by the plurality of second sensing lines SPL2 may also overlap with the organic light-emitting layer 122. As one embodiment, the regions defined by the plurality of first sensing lines SPL1 and the regions defined by the plurality of second sensing lines SPL2 may have a rhomboid shape. Here, considering the manufacturing process and the configuration of the sensing lines, the rhomboid shape includes not only a substantially rhomboid shape but also a shape approximating a rhomboid shape.

[0097] The plurality of first sensing lines SPL1 are electrically insulated from the plurality of second sensing lines SPL2. As one embodiment, the plurality of first sensing lines SPL1 may be disposed on the same layer as the plurality of second sensing lines SPL2. In this case, the plurality of first touch bridge electrodes CP1 and the plurality of second touch bridge electrodes CP2 are disposed on different layers, thereby being electrically insulated from each other.

[0098] The aforementioned touch bridge electrode and sensing electrode can overlap with the black matrix and pixel defining film 115. This prevents them from being observed by the user.

[0099] The touch component 30 may further include a second signal line SL2 and a third signal line SL3 connected to a plurality of first sensing electrodes IE1-1 to IE1-8 and a plurality of second sensing electrodes IE2-1 to IE2-4 and passing through the pad area PA. The display component 20 may include a first signal line SL1 connected to a transistor TR in the active area AAR and passing through the pad area PA. The transistor TR can be connected to the pad PAD through the first signal line SL1.

[0100] like Figure 5As shown, the touch component 30 according to this embodiment may be: the first sensing electrodes IE1_1 to IE1_4 are connected to the pad PAD via the right side and the third signal line SL3; the first sensing electrodes IE1_5 to IE1_8 are connected to the pad PAD via the left side and the third signal line SL3; and the second sensing electrodes IE2_1 to IE2_4 are connected to the pad PAD via the lower side and the second signal line SL2.

[0101] The second touch insulating layer 330 can be disposed on the first touch conductive layer YMTL1. The second touch insulating layer 330 can be in direct contact with the exposed first touch insulating layer 310. The second touch insulating layer 330 can serve to insulate the first touch conductive layer YMTL1 and the second touch conductive layer YMTL2. The second touch insulating layer 330 can be formed by containing an organic insulating material. Examples of such organic insulating materials include polyacrylate resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene ether resins, polyphenylene sulfide resins, or benzocyclobutene (BCB), etc.

[0102] The second touch insulating layer 330 contains an organic insulating material, thereby significantly reducing the number of sensing lines SPL1a, SPL2a and display components in the second touch conductive layer YMTL2 (described later). Figure 4 Parasitic capacitance is generated between the conductive layers DCL1 and DCL2 of (20).

[0103] In the pad region PA, a second touch insulating layer 330 may be disposed on the second pad electrode PE2. The second touch insulating layer 330 may partially expose the upper surface of the second pad electrode PE2. Specifically, in the effective region AAR, the second touch insulating layer 330 exposes the upper surface of the second touch bridge electrode CP2 and includes a first contact hole CNT' extending through the second touch insulating layer 330 in the thickness direction. In the pad region PA, the first and second touch insulating layers 310 and 330 include a second contact hole CNT' extending through the thickness direction.

[0104] The second touch conductive layer YMTL2 can be disposed on the second touch insulating layer 330. The second touch conductive layer YMTL2 may include a first lower sensing line SPL1a overlapping the first sensing line SPL1 that is superimposed on the second touch bridge electrode CP2, a second lower sensing line SPL2a separated from the first lower sensing line SPL1a and connected to the second touch bridge electrode CP2 through the first contact hole CNT, and a third pad electrode PE3 connected to the second pad electrode PE2 through the second contact hole CNT′. The lower part SPL1a_S2 of the first lower sensing line SPL1a can be in direct contact with the second touch insulating layer 330.

[0105] The first touch conductive layer YMTL1 may contain a conductive material. Here, the conductive material may contain, for example, low-resistance metals such as silver (Ag), aluminum (Al), chromium (Cr), and nickel (Ni), or conductive nanomaterials such as silver nanowires and carbon nanotubes.

[0106] A third touch conductive layer YMTL3 can be configured on the second touch conductive layer YMTL2. The third touch conductive layer YMTL3 may include a first upper sensing line SPL1b overlapping the first lower sensing line SPL1a, a second upper sensing line SPL2b overlapping the second lower sensing line SPL2a, and a fourth pad electrode PE4 overlapping the third pad electrode PE3 on the pad region PA. Specifically, the first upper sensing line SPL1b may be in direct contact with the first lower sensing line SPL1a, the second upper sensing line SPL2b may be in direct contact with the second lower sensing line SPL2a, and the fourth pad electrode PE4 may be in direct contact with the third pad electrode PE3. That is, the lower part SPL1b_S2 of the first upper sensing line SPL1b may be in direct contact with the upper part SPL1a_S1 of the first lower sensing line SPL1a.

[0107] The material of the third conductive touch layer YMTL3 can differ from that of the second conductive touch layer YMTL2. For example, the second conductive touch layer YMTL2 can contain an opaque metal, while the third conductive touch layer YMTL3 can contain a transparent conductive material. For instance, the second conductive touch layer YMTL2 can contain low-resistance metals such as silver (Ag), aluminum (Al), chromium (Cr), or nickel (Ni), or conductive nanomaterials such as silver nanowires or carbon nanotubes. The third conductive touch layer YMTL3 can contain a transparent conductive oxide (TCO). Examples of such transparent conductive oxides include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0108] On the other hand, when the sensing lines SPL1 and SPL2 are formed solely by the second touch conductive layer, photoresist is disposed in the remaining area directly above the second touch conductive layer, excluding the pattern corresponding to the desired sensing lines SPL1 and SPL2. The desired sensing lines SPL1 and SPL2 patterns are formed through exposure and development. After forming the sensing lines SPL1 and SPL2 patterns, the photoresist formed directly above the second touch conductive layer is removed using an etchant containing an amine component. During this etching process, the etchant may penetrate into the second touch insulating layer 330 located directly below the second touch conductive layer. Since the second touch insulating layer 330 contains organic matter, this penetrating etchant may cause internal cracks in the second touch insulating layer 330. More specifically, because the etching solution causes internal cracking of the second touch insulating layer 330, a large number of voids are generated in the internal crack space. Due to the voids, the second touch insulating layer 330 expands upward. If the expansion is severe, the second touch insulating layer 330 may peel off from the first touch insulating layer 310 and the first touch conductive layer YMTL1 directly below.

[0109] However, according to the present invention, the display device 1 forms sensing lines SPL1 and SPL2 not only through the second touch conductive layer YMTL2 but also through the third touch conductive layer YMTL3. In the etching process of the photoresist used when forming the pattern of the third touch conductive layer YMTL3, since the second touch conductive layer YMTL2 does not penetrate into the second touch insulating layer 330, the upper sensing lines SPL1b and SPL2b formed from the third touch conductive layer YMTL3 are used as masks to form the pattern of the second touch conductive layer YMTL2 (or the lower sensing lines SPL1a and SPL2a).

[0110] The method for forming the third pad electrode PE3 and the fourth pad electrode PE4 is the same as the method for forming the sensing lines SPL1 and SPL2 through the second and third touch conductive layers YMTL2 and YMTL3 described above, so detailed descriptions will be omitted.

[0111] Due to the manufacturing process of the aforementioned sensing lines SPL1 and SPL2, the width of the first upper sensing line SPL1b may be greater than the width of the first lower sensing line SPL1a, the width of the second upper sensing line SPL2b may be greater than the width of the second lower sensing line SPL2a, and the width of the fourth pad electrode PE4 may be greater than the width of the third pad electrode PE3.

[0112] Alternatively, on the plane, the first lower sensing line SPL1a may be located within the first upper sensing line SPL1b; the second lower sensing line SPL2a may be located within the second upper sensing line SPL2b; and the third pad electrode PE3 may be located within the fourth pad electrode PE4.

[0113] This can be achieved by the following configuration: On a plane, one side of the first upper sensing line SPL1b is closer to the adjacent second upper sensing line SPL2b than one side of the first lower sensing line SPL1a; on a plane, the other side of the first upper sensing line SPL1b, SPL1b_S3, is closer to the adjacent second upper sensing line SPL2b than the other side of the first lower sensing line SPL1a, SPL1a_S3. Conversely, on a plane, one side of the second upper sensing line SPL2b is closer to the adjacent first upper sensing line SPL1b than one side of the second lower sensing line SPL2a.

[0114] The third touch insulating layer 350 may be disposed on the third touch conductive layer YMTL3. The third touch insulating layer 350 may contain at least one of the materials of the second touch insulating layer 330 described above. For example... Figure 7 As shown, the third touch insulating layer 350 can directly contact the top SPL1b_S1 and side SPL1b_S3 of the first upper sensing line SPL1b, the top and side of the second upper sensing line SPL2b, the side SPL1a_S3 of the first lower sensing line SPL1a, the side of the second lower sensing line SPL2a, and the exposed top surface of the second touch insulating layer 330. On the pad region PA, the third touch insulating layer 350 can partially expose the top surface of the fourth pad electrode PE4.

[0115] Hereinafter, a method for manufacturing a display device according to one embodiment will be described. The same reference numerals are used for structures identical to those described in the following embodiments, and their descriptions will be omitted or simplified.

[0116] Figure 8 This is a flowchart of a method for manufacturing a display device according to an embodiment. Figures 9 to 16 This is a cross-sectional view of each process step in a method for manufacturing a display device according to an embodiment. In the following, when referring to... Figures 8 to 16 When describing a method for manufacturing a display device according to one embodiment, reference is made to the above description. Figures 1 to 7 .

[0117] Reference Figure 4 , Figure 8 as well as Figure 9The display component forming step (S10) is performed, in which a gate insulating film 112, a first conductive layer DCL1, an interlayer insulating film 113 on the first conductive layer DCL1 and a pad area PA located around the effective region AAR are formed on a substrate portion 101 including an effective region AAR and a pad area PA located around the effective region AAR. The first conductive layer DCL1 is disposed on the gate insulating film 112 and includes the gate electrode GE in the effective region AAR and the first pad electrode PE1 in the pad area PA. The second conductive layer DCL2 is disposed on the interlayer insulating film 113 and includes the drain electrode DE and the source electrode SE in the effective region AAR and the second pad electrode PE2 in the pad area PA.

[0118] Next, refer to Figure 4 , Figure 8 as well as Figure 9 The first touch insulating layer forming step (S20) is performed, in which the first touch insulating layer 310 is formed on the second conductive layer DCL2 in the effective area AAR and the pad area PA.

[0119] Next, the first touch conductive layer formation step (S30) is performed, in which a first touch conductive layer including the second touch bridge electrode CP2 is formed on the first touch insulating layer 310 in the effective area AAR.

[0120] Next, refer to Figure 4 , Figure 8 as well as Figure 10 The second touch insulating layer forming step (S40) is performed, in which a second touch insulating layer 330 formed of organic material is formed on the first touch conductive layer in the effective area AAR and the pad area PA.

[0121] Examples of such organic insulating materials include polyacrylate resins, epoxy resins, phenolic resins, polyamide resins, polyimide resins, unsaturated polyester resins, polyphenylene ether resins, polyphenylene sulfide resins, or benzocyclobutene (BCB).

[0122] Next, the contact hole forming step (S50) is performed to form a first contact hole CNT on the upper surface of the second touch bridge electrode CP2 and a second contact hole CNT' on the upper surface of the second pad electrode PE2.

[0123] Next, refer to Figure 4 , Figure 8 as well as Figure 11 Then, the second touch conductive layer forming step (S60) is performed to form a second touch conductive layer YMTL2' on the second touch insulating layer 330. The second touch conductive layer YMTL2' can fill the contact holes CNT, CNT'.

[0124] Next, refer to Figure 4 , Figure 8 as well as Figure 12 Then, the third touch conductive layer forming step (S70) is performed to form the third touch conductive layer YMTL3' on the second touch conductive layer YMTL2'.

[0125] Next, refer to Figure 4 , Figure 8 as well as Figure 13 Perform the photoresist formation step (S80) to form photoresist PR on the third touch conductive layer YMTL3'.

[0126] Next, the upper sensing line formation step (S90) is performed, in which the first upper sensing line SPL1b and the second upper sensing line SPL2b of the third touch conductive layer YMTL3 are formed in the effective area AAR by photoresist PR, and the fourth pad electrode PE4 of the third touch conductive layer YMTL3 is formed in the pad area PA.

[0127] Next, an etching step (S100) is performed, using an etching solution to remove the photoresist PR. Figure 14 The cross-sectional shape of the photoresist PR after removal is shown. In the etching step (S100), the etching solution can not penetrate into the second touch insulating layer 330 due to the second touch conductive layer YMTL2'.

[0128] Next, refer to Figure 4 , Figure 8 as well as Figure 15 The lower sensing line formation step (S110) is performed, in which the first lower sensing line SPL1a and the second lower sensing line SPL2a of the second touch conductive layer YMTL2 are formed in the effective area AAR through the first upper sensing line SPL1b, the second upper sensing line SPL2b and the fourth pad electrode PE4, and the third pad electrode PE3 of the second touch conductive layer YMTL2 is formed in the pad area PA.

[0129] Next, refer to Figure 4 , Figure 8 as well as Figure 16The third touch insulating layer formation step (S120) is performed to form a third touch insulating layer 350 on the first upper sensing line SPL1b, the second upper sensing line SPL2b, and the fourth pad electrode PE4. On the pad area PA, the third touch insulating layer 350 can partially expose the upper surface of the fourth pad electrode PE4.

[0130] Figure 17 This is a cross-sectional view of a display device according to another embodiment. Figure 18 as well as Figure 19 It is based on Figure 17 Cross-sectional views of each process step in the manufacturing method of the display device.

[0131] Reference Figures 17 to 19 The display device according to this embodiment, in that it does not include the third touch conductive layer YMTL3, is similar to that according to... Figure 7 The display devices are different.

[0132] According to Figure 17 The manufacturing method of the display device will be described. Figure 17 The manufacturing method of the display device and according to Figure 7 The manufacturing method of the display device and Figures 9 to 15 Same, and Figure 16 different.

[0133] Reference Figure 4 , Figure 8 , Figure 18 as well as Figure 19 According to Figure 15 The cross-sectional shape of the display device may include an upper sensing line etching step of etching the first upper sensing line SPL1b, the second upper sensing line SPL2b and the fourth pad electrode PE4, and a third touch insulating layer forming step of forming a third touch insulating layer 350 on the first lower sensing line SPL1a, the second lower sensing line SPL2a and the third pad electrode PE3.

[0134] Figure 20 This is a cross-sectional view of a display device according to yet another embodiment.

[0135] Reference Figure 20 According to this embodiment, the material of the second touch conductive layer YMTL2_1 of the display device is... Figure 7 The material of the third touch conductive layer YMTL3 described above is the same as that of the third touch conductive layer YMTL3_1. Figure 7 The difference lies in the fact that the material of the second touch conductive layer YMTL2 described in the text is the same.

[0136] Other explanations have been provided. Figure 7 The description is as follows, therefore detailed explanations will be omitted.

[0137] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the invention can be implemented in other specific ways without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as exemplary in all respects and not limiting.

Claims

1. A method for manufacturing a display device, wherein, The method for manufacturing the display device includes: In the display component forming step, a first insulating film, a first conductive layer, a second insulating film on the first conductive layer, and a second conductive layer are formed on a substrate portion including an effective region and a pad region located around the effective region. The first conductive layer is disposed on the first insulating film and includes a gate electrode in the effective region and a first pad electrode in the pad region. The second conductive layer is disposed on the second insulating film and includes a drain electrode and a source electrode in the effective region and a second pad electrode in the pad region. The first touch insulating layer forming step involves forming a first touch insulating layer on the second conductive layer in the effective area and the pad area; In the first touch conductive layer forming step, a first touch conductive layer including a second touch bridge electrode is formed on the first touch insulating layer in the effective area; The second touch insulating layer forming step involves forming a second touch insulating layer made of organic material on the first touch conductive layer in the effective area and the pad area. The contact hole forming step involves forming a first contact hole that exposes the upper surface of the second touch bridge electrode and a second contact hole that exposes the upper surface of the second pad electrode; The second touch conductive layer forming step involves forming a second touch conductive layer on the second touch insulating layer; The third touch conductive layer forming step involves forming a third touch conductive layer on the second touch conductive layer; The photoresist formation step involves forming photoresist on the third touch conductive layer; In the upper sensing line formation step, a first upper sensing line and a second upper sensing line spaced apart from each other are formed in the effective area using the photoresist, and a fourth pad electrode of the third touch conductive layer is formed in the pad area; and The step of removing photoresist using a photoresist remover while the second touch insulating layer is covered by the second touch conductive layer.

2. The method for manufacturing a display device according to claim 1, wherein, During the photoresist removal step, the photoresist removal solution does not penetrate into the second touch insulating layer due to the second touch conductive layer.

3. The method for manufacturing a display device according to claim 1, wherein, The method for manufacturing the display device further includes: In the lower sensing line formation step, a first lower sensing line and a second lower sensing line of the second touch conductive layer are formed in the effective area through the first upper sensing line, the second upper sensing line and the fourth pad electrode, and a third pad electrode of the second touch conductive layer is formed in the pad area.

4. The method for manufacturing a display device according to claim 3, wherein, The width of the first upper sensing line is greater than the width of the first lower sensing line.

5. The method for manufacturing a display device according to claim 3, wherein, The method for manufacturing the display device further includes: The third touch insulating layer formation step involves forming a third touch insulating layer on the first upper sensing line, the second upper sensing line, and the fourth pad electrode. The third touch insulating layer partially exposes the top of the fourth pad electrode in the pad area.

6. The method for manufacturing a display device according to claim 3, wherein, The method for manufacturing the display device further includes: The upper sensing line etching step etches the first upper sensing line, the second upper sensing line, and the fourth pad electrode; and The third touch insulating layer formation step involves forming a third touch insulating layer on the first lower sensing line, the second lower sensing line, and the third pad electrode. The third touch insulating layer partially exposes the top of the third pad electrode in the pad area.

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