Haptic feedback system

Abstract

A haptic feedback system includes a stationary portion, a movable portion, and a drive assembly. The stationary portion is fixed to an electronic device, the movable portion is movable relative to the stationary portion, and the drive assembly is configured to move the movable portion relative to the stationary portion and generate a feedback force to a user.

Description

Technical Field

[0001] This invention relates to a haptic feedback system. More specifically, this invention relates to a haptic feedback system having a sensing module. Background Technology

[0002] Electronic devices such as mobile phones or tablets typically have vibrators inside to provide users with appropriate tactile feedback.

[0003] However, with the rapid development of sensor technology, providing users with richer and more accurate tactile feedback has become an important challenge for researchers in this field. Summary of the Invention

[0004] In view of the aforementioned known problems, one embodiment of the present invention provides a haptic feedback system disposed on an electronic device. The haptic feedback system includes a fixed part, a movable part, and a driving component. The fixed part is fixed to the electronic device, the movable part is movable relative to the fixed part, and the driving component is used to drive the movable part to move relative to the fixed part and generate a feedback force.

[0005] In one embodiment, the aforementioned electronic device further includes a central processing unit (CPU) and a sensing module, wherein the aforementioned sensing module is disposed outside the aforementioned haptic feedback system and is used to output a first sensing signal to the aforementioned central processing unit.

[0006] The aforementioned haptic feedback system further includes a control unit for outputting a control signal to the aforementioned drive assembly, thereby driving the aforementioned movable part to move relative to the aforementioned fixed part via the drive assembly. The aforementioned central processing unit outputs a command signal to the aforementioned control unit to adjust the aforementioned control unit to a specific control mode; the aforementioned sensing module further outputs a second sensing signal to the aforementioned control unit, and the aforementioned second sensing signal does not pass through the aforementioned central processing unit.

[0007] In one embodiment, the aforementioned fixing part includes an outer frame and a base connected to the aforementioned outer frame, the aforementioned driving component and the aforementioned movable part are disposed inside the aforementioned outer frame, the aforementioned sensing module and the aforementioned control unit are disposed outside the aforementioned outer frame, and the aforementioned sensing module is fixedly connected to the aforementioned fixing part.

[0008] In one embodiment, the aforementioned sensing module is disposed on a plate-shaped member of the aforementioned electronic device, and the aforementioned fixing part is fixedly connected to the aforementioned plate-shaped member, wherein the aforementioned tactile feedback system is electrically connected to the aforementioned sensing module via a circuit component, and the aforementioned circuit component is disposed on the aforementioned plate-shaped member.

[0009] In one embodiment, an external measuring device generates a first relationship curve of motion information of the aforementioned active part relative to the aforementioned second sensing signal by measuring the motion of the aforementioned active part and the aforementioned second sensing signal.

[0010] In one embodiment, the aforementioned external measuring device adjusts a characteristic parameter of the aforementioned control unit according to the aforementioned first relationship curve.

[0011] In one embodiment, the aforementioned haptic feedback system further includes a sensing element disposed within or on the aforementioned fixed portion, for sensing the movement of the aforementioned movable portion and outputting a third sensing signal to the aforementioned control unit, wherein the aforementioned control unit outputs the aforementioned control signal based on the aforementioned second and third sensing signals, and the aforementioned sensing element is disposed within the aforementioned fixed portion.

[0012] In one embodiment, an external measuring device generates a first relationship curve of motion information of the aforementioned active part relative to the aforementioned second sensing signal by measuring the motion of the aforementioned active part and the aforementioned second sensing signal, and the aforementioned external measuring device further generates a second relationship curve of motion information of the aforementioned active part relative to the aforementioned third sensing signal by measuring the motion of the aforementioned active part and the aforementioned third sensing signal.

[0013] In one embodiment, the aforementioned external measuring device adjusts a characteristic parameter of the aforementioned control unit according to the aforementioned first and second relationship curves.

[0014] In one embodiment, the aforementioned sensing element includes a Hall effect sensor.

[0015] In one embodiment, the aforementioned central processing unit outputs the aforementioned instruction signal to the aforementioned control unit based on the aforementioned first sensing signal, and the aforementioned control unit outputs the aforementioned drive signal to the aforementioned drive component based on the aforementioned instruction signal.

[0016] In one embodiment, the aforementioned control unit outputs the aforementioned drive signal to the aforementioned drive component based on the aforementioned command signal and the aforementioned second sensing signal.

[0017] In one embodiment, the aforementioned haptic feedback system performs closed-loop control of the movement of the aforementioned active part based on the aforementioned second sensing signal.

[0018] In one embodiment, when the aforementioned second sensing signal meets a first preset condition, the aforementioned control unit drives the aforementioned active part to move in a first mode through the aforementioned driving component, and when the aforementioned second sensing signal meets a second preset condition, the aforementioned control unit drives the aforementioned active part to move in a second mode through the aforementioned driving component.

[0019] In one embodiment, the aforementioned driving component includes a coil disposed on the aforementioned fixed portion and a magnet disposed on the aforementioned movable portion.

[0020] In one embodiment, the aforementioned sensing module includes an optical finger navigation sensor, a gyroscope, an accelerometer, a touch switch, a fingerprint sensor, a pressure sensor, a sound wave sensor, a gas sensor, a temperature sensor, or a specific gas concentration sensor.

[0021] In one embodiment, the aforementioned sensing module constitutes at least a portion of a user interface of the aforementioned electronic device.

[0022] In one embodiment, the aforementioned second sensing signal is different from the aforementioned first sensing signal.

[0023] In one embodiment, the aforementioned second sensing signal is the same as the aforementioned first sensing signal.

[0024] In one embodiment, the aforementioned fixed portion, the aforementioned movable portion, and the aforementioned driving component constitute at least a portion of a linear resonant actuator inside the aforementioned electronic device. Attached Figure Description

[0025] This disclosure will become clear from the following detailed description and accompanying illustrations. It should be emphasized that, in accordance with industry standard practice, the features are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the features may be arbitrarily enlarged or reduced for clarity.

[0026] Figure 1 A schematic diagram illustrating an embodiment of the electronic device of the present invention.

[0027] Figure 2 Indicates that it is set in Figure 1 A schematic diagram of the haptic feedback system and sensing module inside the electronic device.

[0028] Figure 3 A Function Block Diagram (FBD) representing the haptic feedback system, sensing module, and central processing unit (CPU) within an electronic device.

[0029] Figure 4 This is a schematic diagram showing that the motion information of the oscillator measured by an external measuring device is different from the first target curve relative to the second sensing signal.

[0030] Figure 5 This is a schematic diagram illustrating a tactile feedback system and a sensing module inside an electronic device according to another embodiment of the present invention.

[0031] Figure 6 This is a functional block diagram illustrating the haptic feedback system, sensing module, and central processing unit (CPU) within an electronic device according to another embodiment of the present invention.

[0032] Figure 7 This is a schematic diagram showing that the second relationship curve, which represents the motion information of the oscillator measured by an external measuring device, is different from the second target curve relative to the third sensing signal.

[0033] Figure 8 An exploded view of an optical element drive mechanism according to certain features of this disclosure is shown.

[0034] Figure 9A This is a perspective view of an optical element drive mechanism according to certain features of the present disclosure.

[0035] Figure 9B This is a bottom view of an optical element drive mechanism according to certain features of this disclosure.

[0036] Figure 10A This is a bottom view of a base according to certain features of this disclosure.

[0037] Figure 10B This is a bottom view of the first carrier according to certain features of this disclosure.

[0038] Figure 11A This is a cross-sectional view of an optical element drive mechanism according to certain features of this disclosure.

[0039] Figure 11B This is a cross-sectional view of a framework based on certain features of this disclosure.

[0040] Figure 11C A perspective view of a framework based on certain features of this disclosure.

[0041] Figure 12 This is a perspective view of a frame, a first magnetic element, a second magnetic element, a third magnetic element, a second circuit assembly, and a second sensing element, according to certain features of this disclosure.

[0042] Figure 13 A perspective view of the second circuit assembly, the second sensing element, and the reinforcement assembly, shown separately according to certain features of this disclosure.

[0043] Figure 14 A schematic diagram showing the first shock-absorbing element, the second shock-absorbing element, the third shock-absorbing element, and the fourth shock-absorbing element in accordance with certain features of this disclosure.

[0044] Figure 15A perspective view of the first coil and the third coil embedded in the third circuit assembly is shown in dashed lines to illustrate certain features of this disclosure.

[0045] Figure 16A A perspective view of the second carrier, the second coil, and the second sensing assembly, shown in accordance with certain features of this disclosure.

[0046] Figure 16B A top view showing the second carrier, the second coil, and the second sensing assembly according to certain features of this disclosure.

[0047] Figure 17A A perspective view of the first drive assembly, the second drive assembly, and the third drive assembly, shown separately according to certain features of this disclosure.

[0048] Figure 17B This is a top view of the first drive assembly, the second drive assembly, and the third drive assembly, shown separately according to certain features of this disclosure.

[0049] Figure 18A This is a cross-sectional view of a first carrier, a first optical element, a first circuit assembly, a third circuit assembly, a fourth circuit assembly, a base, a connecting portion, and a magnetically conductive element, according to certain features of this disclosure.

[0050] Figure 18B In accordance with certain features of this disclosure, along Figure 18A The cross-sectional view extracted from the dashed lines 2-A to 2-A' in the figure.

[0051] Figure 18C A top view showing the first drive assembly, the second drive assembly, and the third drive assembly separately according to certain features of this disclosure.

[0052] Figure 19 This is an exploded view of an optical element driving mechanism according to another embodiment of the present disclosure.

[0053] Figure 20A For the purpose of displaying certain features of this disclosure Figure 19 A perspective view of the optical element drive mechanism, but the outer frame is not shown for illustrative purposes.

[0054] Figure 20B For the purpose of displaying certain features of this disclosure Figure 19 A perspective view of the optical element drive mechanism, but the outer frame is not shown for illustrative purposes.

[0055] Figure 21A A schematic diagram of an optical module according to some embodiments of the present disclosure is shown.

[0056] Figure 21B yes Figure 21A A schematic diagram of some of the components.

[0057] Figure 21C This is a schematic diagram of an optical module according to some embodiments of this disclosure.

[0058] Figure 21D yes Figure 21C A schematic diagram of some of the components.

[0059] Figure 22A This is a schematic diagram of the light intensity adjustment mechanism.

[0060] Figure 22B This is an exploded view of the light intensity adjustment mechanism.

[0061] Figure 23A This is a schematic diagram of some components of the light intensity adjustment mechanism.

[0062] Figure 23B This is a top view of some components of the light intensity adjustment mechanism.

[0063] Figure 23C This is a top view of some components of the light intensity adjustment mechanism.

[0064] Figure 23D This is a top view of some components of the light intensity adjustment mechanism.

[0065] Figures 24A to 24C This is a schematic diagram showing the positional relationships of some components in the light intensity adjustment mechanism.

[0066] Figures 25A to 25C This is a schematic diagram showing the positional relationships of some components in the light intensity adjustment mechanism.

[0067] Figure 26 This is a schematic diagram of a light intensity adjustment mechanism according to some embodiments of the present disclosure.

[0068] Figure 27 An exploded view of an optical element drive mechanism is shown according to some embodiments.

[0069] Figure 28 A perspective view of an optical element driving mechanism is shown according to some embodiments.

[0070] Figure 29 A top view of an optical element drive mechanism according to some embodiments is shown, wherein the outer frame and the first moving part are omitted.

[0071] Figure 30 The diagram shows a front view of an optical element drive mechanism according to some embodiments, with the outer frame and the first moving part omitted.

[0072] Figure 31 A top view of an optical element driving mechanism is shown according to some embodiments, with the outline omitted.

[0073] Figure 32 The image shows a left view of an optical element drive mechanism according to some embodiments.

[0074] Figure 33 A perspective view of a haptic feedback system according to some embodiments of the present disclosure is shown.

[0075] Figure 34 An exploded view of a haptic feedback system according to some embodiments of the present disclosure is shown.

[0076] Figure 35 A perspective view showing the internal structure of a haptic feedback system according to some embodiments of the present disclosure.

[0077] Figure 36 A top view showing the internal structure of a haptic feedback system according to some embodiments of the present disclosure.

[0078] Figure 37 A bottom view of the frame of a modal adjustment component according to some embodiments of the present disclosure is shown.

[0079] Figure 38 A haptic feedback system according to some embodiments of the present disclosure is shown along... Figure 33 The sectional view shown is along line 5-A-5-A.

[0080] Figure 39 A perspective view of an adjustment element according to some embodiments of the present disclosure is shown.

[0081] Figure 40 The adjustment element according to some embodiments of the present disclosure is shown along Figure 35 The sectional view shown is along line 5-B-5-B.

[0082] Figure 41 This is a perspective view of a haptic feedback system according to an embodiment of the present disclosure.

[0083] Figure 42 An exploded view of a haptic feedback system according to an embodiment of the present disclosure.

[0084] Figure 43 For along Figure 41 A cross-sectional view of the haptic feedback system cut along line segment 6-A-6-A.

[0085] Figure 44 This is a schematic diagram of some components of a haptic feedback system according to an embodiment of the present disclosure.

[0086] Figure 45 This is a schematic diagram of some components of a haptic feedback system according to an embodiment of the present disclosure.

[0087] The attached figures are labeled as follows:

[0088] 1-1: Haptic Feedback System

[0089] 1-11: Fixing part

[0090] 1-111: Outer Frame

[0091] 1-112: Base

[0092] 1-12: Shock

[0093] 1-13: Control Unit

[0094] 1-14: Circuit Components

[0095] 1-15: Sensing Element

[0096] 1-2: Sensing Module

[0097] 1-C: Central Processing Unit

[0098] 1-C1: Command signal

[0099] 1-E: Electronic devices

[0100] 1-E0: Housing

[0101] 1-E1: Screen

[0102] 1-R1: First Relationship Curve

[0103] 1-R1': First target curve

[0104] 1-R2: Second Relationship Curve

[0105] 1-R2': Second target curve

[0106] 1-S1: First sensing signal

[0107] 1-S2: Second sensing signal

[0108] 1-S3: Third sensing signal

[0109] 2-1: First optical element

[0110] 2-10, 2-10': Optical element drive mechanism

[0111] 2-100: Fixing part

[0112] 2-110, 2-110': Outer frame

[0113] 2-120, 2-120': Frame

[0114] 2-121: First side

[0115] 2-122: Second side

[0116] 2-123: Corner

[0117] 2-124: First Accommodation Space

[0118] 2-125: Second Accommodation Space

[0119] 2-126: Third Accommodation Space

[0120] 2-127: Frame protrusion

[0121] 2-1271: First frame surface

[0122] 2-1272: Second frame surface

[0123] 2-128: Inner wall

[0124] 2-1280: Inner surface

[0125] 2-130: Base

[0126] 2-131: Third opening

[0127] 2-132: Stop section

[0128] 2-140: Second circuit component

[0129] 2-141: Part One

[0130] 2-142: Part Two

[0131] 2-200: First Activities Department

[0132] 2-210: First load-bearing component

[0133] 2-211: First opening

[0134] 2-212: Avoidance Department

[0135] 2-213: concave part

[0136] 2-220: First circuit component

[0137] 2-230: Third Circuit Component

[0138] 2-240: Fourth Circuit Component

[0139] 2-300: Second Activities Department

[0140] 2-310: Second load-bearing component

[0141] 2-400: Connecting part

[0142] 2-500: First drive component

[0143] 2-501: First magnetic element

[0144] 2-502: First coil

[0145] 2-5022: First Section

[0146] 2-510: Second drive component

[0147] 2-511: Second magnetic element

[0148] 2-512: Second coil

[0149] 2-5122: Second section

[0150] 2-520: Third drive component

[0151] 2-521: Third magnetic element

[0152] 2-522: Third coil

[0153] 2-5222: Third section

[0154] 2-600, 2-600': First support component

[0155] 2-601, 2-601': Support element

[0156] 2-650: Second support component

[0157] 2-651: First elastic element

[0158] 2-652: Second elastic element

[0159] 2-700: Sensing Components

[0160] 2-710: First sensing element

[0161] 2-720: Second sensing element

[0162] 2-730: Sensing Magnet

[0163] 2-D1: Spindle

[0164] 2-D2: Second Axis

[0165] 2-D3: Third Axis

[0166] 2-S1: First Axis

[0167] 2-S2: Shaft

[0168] 2-O1: First optical axis

[0169] 2-O2: Second optical axis

[0170] 3-1001, 3-1002: Optical modules

[0171] 3-1100, 3-2100: Light intensity adjustment mechanism

[0172] 3-1110: Fixing part

[0173] 3-1111: Outer frame

[0174] 3-1112, 3-2112: Base

[0175] 3-1113, 3-2113: Top plate

[0176] 3-1114: First stop section

[0177] 3-1115: Second stop section

[0178] 3-1116: First Surface

[0179] 3-1117: Second Surface

[0180] 3-1120, 3-2120: Activities Department

[0181] 3-1121: First Guiding Section

[0182] 3-1122: Second Guiding Section

[0183] 3-1123: Third Guiding Section

[0184] 3-1124: Fourth Guiding Section

[0185] 3-1130, 3-2300: Accommodation space

[0186] 3-1140, 3-2140: Light intensity control element

[0187] 3-1141: First light quantity control unit

[0188] 3-1142: Second light quantity control unit

[0189] 3-1143: Third Light Quantity Control Unit

[0190] 3-1144: Fourth Light Quantity Control Unit

[0191] 3-1150: First drive component

[0192] 3-1151, 3-2151: First driving element

[0193] 3-1152, 3-2152: Second driving element

[0194] 3-1160: Third elastic element

[0195] 3-1162, 3-2162: Connecting elements

[0196] 3-1164, 3-2164: Magnetic elements

[0197] 3-1166: Position sensing element

[0198] 3-1171: First Positioning Unit

[0199] 3-1172: Second Positioning Unit

[0200] 3-1173: Third Positioning Unit

[0201] 3-1174: Fourth Positioning Unit

[0202] 3-1175: Fifth Positioning Department

[0203] 3-1176: Sixth Positioning Department

[0204] 3-1177: Seventh Positioning Department

[0205] 3-1178: Eighth Positioning Department

[0206] 3-1181: First guide groove

[0207] 3-1182: Second guide groove

[0208] 3-1183: Third guide groove

[0209] 3-1184: Fourth guide groove

[0210] 3-1191: First positioning slot

[0211] 3-1192: Second positioning slot

[0212] 3-1193: Third positioning slot

[0213] 3-1194: Fourth positioning slot

[0214] 3-1195: Fifth positioning slot

[0215] 3-1196: Sixth positioning slot

[0216] 3-1200: Optical Component Drive Mechanism

[0217] 3-1211: Outer shell

[0218] 3-1212: Base

[0219] 3-1220: Bearing seat

[0220] 3-1230: Optical Components

[0221] 3-1231: Lens tube

[0222] 3-1232: Lens

[0223] 3-1240: Second drive component

[0224] 3-1241: Third driving element

[0225] 3-1242: Fourth driving element

[0226] 3-1300: Thermal control components

[0227] 3-1311, 3-1312: First thermal energy control element

[0228] 3-1313: Third connecting element

[0229] 3-1320: Second thermal control element

[0230] 3-1400: First connecting element

[0231] 3-1500, 3-2500: Spindle

[0232] 4-10: Optical Component Drive Mechanism

[0233] 4-100: First Activities Department

[0234] 4-150: Framework

[0235] 4-200: Second Activities Department

[0236] 4-210: First bearing seat

[0237] 4-300: Third Activities Department

[0238] 4-310: Second bearing seat

[0239] 4-330: Circuit Components

[0240] 4-350: Base Plate

[0241] 4-400: First drive component

[0242] 4-410: Driving element

[0243] 4-420: Conductive element

[0244] 4-430: Conductive elements

[0245] 4-500: Second drive component

[0246] 4-510: First coil

[0247] 4-520: First magnetic element

[0248] 4-550: First sensing component

[0249] 4-600: Third drive component

[0250] 4-610: Second coil

[0251] 4-620: Second magnetic element

[0252] 4-630: Second sensing component

[0253] 4-660: Third coil

[0254] 4-670: Third magnetic element

[0255] 4-680: Third sensing component

[0256] 4-710: First support component

[0257] 4-720: Second support component

[0258] 4-730: Third Support Component

[0259] 4-810: First stop assembly

[0260] 4-820: Second stop assembly

[0261] 4-830: Third stop assembly

[0262] 4-900: Fixing part

[0263] 4-901: First side

[0264] 4-902: Second side

[0265] 4-910: Outer frame

[0266] 4-920: Base

[0267] 4-925: Accommodation space

[0268] 4-950: Third optical element

[0269] 4-A1: First Axis

[0270] 4-A2: Second Axis

[0271] 4-A3: Third Axis

[0272] 4-A4: Fourth Axis

[0273] 4-M: Spindle

[0274] 4-O1: First optical axis

[0275] 4-O2: Second optical axis

[0276] 5-10: Haptic Feedback System

[0277] 5-110: Outer shell

[0278] 5-120: Base

[0279] 5-130: Outer frame

[0280] 5-131: First sidewall

[0281] 5-132: Second sidewall

[0282] 5-140: Modal adjustment component

[0283] 5-141: Framework

[0284] 5-141A:Body

[0285] 5-141B: Metal parts

[0286] 5-142: First side view

[0287] 5-143: Second side view

[0288] 5-144: Protrusion

[0289] 5-145: Stop section

[0290] 5-146, 5-147, 5-148: Groove

[0291] 5-149: Counterweight

[0292] 5-150: Adjustment element

[0293] 5-151: Bearing seat

[0294] 5-151A:Body

[0295] 5-151B: Metal parts

[0296] 5-152: Depression

[0297] 5-153: Angled Structure

[0298] 5-155: Counterweight

[0299] 5-160: First connecting component

[0300] 5-161: First paragraph

[0301] 5-162: Second section

[0302] 5-163: Connecting part

[0303] 5-170: Second connecting component

[0304] 5-171: First section

[0305] 5-172: Second section

[0306] 5-173: Connecting part

[0307] 5-174: Extension

[0308] 5-180: Circuit Board

[0309] 5-181: Part One

[0310] 5-182: Part Two

[0311] 5-183: Metal sheet

[0312] 5-185: Position Sensor

[0313] 5-190: Driver Components

[0314] 5-191: Coil

[0315] 5-192: First Magnetic Element

[0316] 5-193: Second magnetic element

[0317] 5-200: Buffer

[0318] 5-A-5-A,5-B-5-B: line

[0319] 5-F: Fixing part

[0320] 5-M: Activities Department

[0321] 6-1: Haptic Feedback System

[0322] 6-100: Fixing part

[0323] 6-110: Top Cover

[0324] 6-111: First page

[0325] 6-112: Second page

[0326] 6-113: Third page

[0327] 6-114: Page 4

[0328] 6-115: Top surface

[0329] 6-120: Base

[0330] 6-200: Activities Department

[0331] 6-210: Main Body

[0332] 6-211: First side

[0333] 6-212: Second side

[0334] 6-213: Third side

[0335] 6-214: Fourth side

[0336] 6-215: First recessed portion

[0337] 6-216: Second recess

[0338] 6-217: First Reception Section

[0339] 6-218: Second Reception Section

[0340] 6-220: Counterweight Components

[0341] 6-300: Connecting components

[0342] 6-310: First elastic element

[0343] 6-311, 6-321: First section

[0344] 6-312, 6-322: Second section

[0345] 6-313, 6-323: Third section

[0346] 6-314, 6-324: First bend

[0347] 6-315, 6-325: Second bend

[0348] 6-316, 6-326: First connecting section

[0349] 6-317, 6-327: Second connecting section

[0350] 6-320: Second elastic element

[0351] 6-400: Driver Components

[0352] 6-410: Drive magnet assembly

[0353] 6-411: Magnetic Components

[0354] 6-411A: Magnetic Unit

[0355] 6-420: Drive coil assembly

[0356] 6-421: First coil

[0357] 6-422: Second coil

[0358] 6-423: Magnetic Components

[0359] 6-423A: Shaft

[0360] 6-423B: Separator

[0361] 6-430: Magnetic plate

[0362] 6-500: Circuit Components

[0363] 6-510: Circuit Board

[0364] 6-520: IC Components

[0365] 6-600: Sensing Components

[0366] 6-610: Reference element

[0367] 6-620: Position sensing element

[0368] 6-700: Buffer element

[0369] 6-800: Damping element

[0370] 6-D1: First Direction

[0371] 6-D2: Second Direction

[0372] 6-D3: Third direction

[0373] 6-Df: Drive direction

[0374] 6-Dr1: First mode direction

[0375] 6-Dr2: Second mode direction

[0376] 6-Dw1: First winding direction

[0377] 6-Dw2: Second winding direction

[0378] 6-H: Height

[0379] 6-L: Length

[0380] 6-P: Hollow-out pattern

[0381] 6-W: Width

[0382] 6-θ1: First bending angle

[0383] 6-θ2: Second bending angle Detailed Implementation

[0384] First Embodiment

[0385] The following describes a haptic feedback system according to embodiments of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in particular ways and are not intended to limit the scope of the invention.

[0386] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0387] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0388] Please refer to the following first: Figure 1 , Figure 2 , Figure 3 ,in Figure 1 A schematic diagram illustrating an embodiment of the electronic device 1-E of the present invention. Figure 2 Indicates that it is set in Figure 1 A schematic diagram of the haptic feedback system 1-1 and the sensing module 1-2 inside the electronic device 1-E.

[0389] like Figure 1 , Figure 2 As shown, an electronic device 1-E according to an embodiment of the present invention may be a mobile phone, a tablet computer or other electronic device, and it has a housing 1-E0 and a screen 1-E1 disposed in the center of the housing.

[0390] Specifically, a sensing module 1-2 is provided on the bottom side of the housing 1-E0 of the electronic device 1-E, wherein the aforementioned sensing module 1-2 can constitute at least a part of a user interface such as a touch pad or button. In one embodiment, the aforementioned sensing module 1-2 may include an optical finger navigation (OFN) sensor, a gyroscope, an accelerometer, a tactile switch, a fingerprint sensor, a pressure sensor, a sound wave sensor, a gas sensor, a temperature sensor, or a specific gas concentration sensor, etc., and is not limited to those disclosed in this embodiment.

[0391] from Figure 2 As can be seen, a tactile feedback system 1-1 connected to the sensing module 1-2 is provided inside the housing 1-E0 of the aforementioned electronic device 1-E. The aforementioned tactile feedback system 1-1 mainly includes a fixing part 1-11 (including an outer frame 1-111 and a flat base 1-112), a vibrator 1-12 (moving part), a control unit 1-13, and a circuit assembly 1-14. The aforementioned outer frame 1-111 is fixed inside the housing 1-E0 of the electronic device 1-E, and the base 1-112 is fixed to the bottom side of the outer frame 1-111. The aforementioned vibrator 1-12 is disposed in the outer frame 1-111 and can move inside the outer frame 1-111, thereby generating a vibration signal (feedback force).

[0392] It should be understood that the aforementioned sensing module 1-2, circuit assembly 1-14, and control unit 1-13 disposed on circuit assembly 1-14 are all fixed on base 1-112 and are also located outside of outer frame 1-111. The sensing module 1-2 and control unit 1-13 can be electrically connected to a central processing unit inside electronic device 1-E through circuit assembly 1-14.

[0393] In one embodiment, the aforementioned sensing module 1-2 may also be disposed in other locations inside the electronic device 1-E, for example, it may be disposed on the housing 1-E0 of the electronic device 1-E, or on a circuit board (not shown) or other plate-like components inside the housing 1-E0; on the other hand, the aforementioned outer frame 1-111 and circuit assembly 1-14 may also be fixed on the aforementioned housing 1-E0 or the circuit board or other plate-like components inside the housing 1-E0, and are not limited to those disclosed in this embodiment.

[0394] Specifically, the aforementioned control unit 1-13 may include a controller IC, and it may output a control signal to a drive component (not shown) inside the outer frame 1-111 via the circuit component 1-14, thereby driving the vibrator 1-12 (moving part) to vibrate relative to the outer frame 1-111 (fixed part) through the aforementioned drive component.

[0395] In this embodiment, the aforementioned driving assembly may include a coil disposed on the outer frame 1-111 and a magnet disposed on the vibrator 1-12, and when a current (control signal) is applied to the coil, the vibrator 1-12 can be driven to move relative to the outer frame 1-111. For example, the aforementioned fixed part 1-11, vibrator 1-12 (moving part) and driving assembly may constitute at least a part of a vibrator or linear resonant actuator (LRA) inside the electronic device 1-E.

[0396] Please refer to the following: Figure 3 ,in Figure 3 The functional block diagram (FBD) shows the relationship between the haptic feedback system 1-1, the sensing module 1-2, and the central processing unit 1-C (CPU) inside the electronic device 1-E.

[0397] like Figure 3 As shown, the aforementioned sensing module 1-2 can, for example, sense the posture, movement speed, acceleration, or user touch / press of the electronic device 1-E, and simultaneously output a first sensing signal 1-S1 to a central processing unit 1-C inside the electronic device 1-E. Then, the central processing unit 1-C can output a command signal 1-C1 to the control unit 1-13 based on the first sensing signal 1-S1, to adjust or change the control unit 1-13 to a specific control mode (for example, when the sensing module 1-2 senses that the electronic device 1-E is in different postures, it causes the vibrator 1-12 to vibrate with different amplitudes). In this way, the control unit 1-13 can output control signals of different modes to the aforementioned driving components based on the command signal 1-C1, to provide the user with different types of tactile feedback.

[0398] Furthermore, the sensing module 1-2 can output a second sensing signal 1-S2 to the control unit 1-13 based on the attitude, movement speed, or acceleration of the electronic device 1-E it senses, and this second sensing signal 1-S2 does not pass through the central processing unit 1-C. In this embodiment, the aforementioned second sensing signal 1-S2 may be the same as or different from the first sensing signal 1-S1.

[0399] It should be noted that the aforementioned control unit 1-13 can output control signals to the drive components (such as coils disposed on the outer frame 1-111) inside the outer frame 1-111 according to the aforementioned command signal 1-C1 and the second sensing signal 1-S2, thereby driving the vibrator 1-12 to vibrate relative to the outer frame 1-111, thereby providing the user with appropriate tactile feedback.

[0400] Figure 4 This is a schematic diagram showing that the motion information of the vibrator 1-12 measured by an external measuring device is different from the first target curve 1-R1' of the second sensing signal 1-S2.

[0401] In this embodiment, the motion (e.g., displacement, velocity, or acceleration) of the vibrator 1-12 relative to the outer frame 1-111 can be measured by an external measuring device (not shown), and a first relationship curve 1-R1 of the motion information of the vibrator 1-12 relative to the aforementioned second sensing signal 1-S2 can be obtained based on the motion and the second sensing signal 1-S2 generated by the sensing module 1-2. Figure 4 ).

[0402] It should be understood that since the sensing module 1-2 has not undergone proper calibration after assembly, the aforementioned first relationship curve 1-R1 may have an error with a first target curve 1-R1'. In this case, the external measuring device can adjust the characteristic parameters of the control unit 1-13 according to the first relationship curve 1-R1 to improve the motion control accuracy of the vibrator 1-12 relative to the outer frame 1-111, and the aforementioned calibration does not need to go through the central processing unit 1-C.

[0403] It should be noted that after the aforementioned calibration procedure is completed, the haptic feedback system 1-1 can perform precise closed-loop control of the movement or amplitude of the vibrator 1-12 based on the aforementioned second sensing signal 1-S2, so as to provide the user with appropriate and accurate haptic feedback.

[0404] Please refer to the following as well. Figure 5 , Figure 6 , Figure 7 ,in Figure 5 This is a schematic diagram showing the tactile feedback system 1-1 and sensing module 1-2 inside the electronic device 1-E according to another embodiment of the present invention. Figure 6 This is a functional block diagram illustrating the tactile feedback system 1-1, the sensing module 1-2, and the central processing unit 1-C (CPU) within the electronic device 1-E according to another embodiment of the present invention. Figure 7This is a schematic diagram showing that the motion information of the vibrator 1-12 measured by an external measuring device is different from the second target curve 1-R2 relative to the third sensing signal 1-S3.

[0405] Figures 5-7 Implementation examples and Figures 2-4 The main difference is that: in this embodiment, a sensing element 1-15 is further provided inside the outer frame 1-111. Figure 5 This is used to sense the movement of the vibrator 1-12 relative to the outer frame 1-111, and can output a third sensing signal 1-S3 to the control unit 1-13 accordingly. Figure 6 ).

[0406] However, the aforementioned sensing element 1-15 can also be directly disposed on the outer frame 1-111 or the base 1-112, and is not limited to those disclosed in this embodiment. For example, the aforementioned sensing element 1-15 can be a Hall effect sensor.

[0407] like Figure 6 As shown, the aforementioned control unit 1-13 can output a control signal to the drive component inside the outer frame 1-111 according to the command signal 1-C1, the second sensing signal 1-S2 and the third sensing signal 1-S3, thereby driving the vibrator 1-12 to vibrate relative to the outer frame 1-111 through the aforementioned drive component, so as to provide the user with appropriate tactile feedback.

[0408] In this embodiment, the motion (e.g., displacement or acceleration value) of the vibrator 1-12 relative to the outer frame 1-111 can be measured by an external measuring device (not shown), and a second relationship curve 1-R2 (i.e., motion information of the vibrator 1-12 relative to the aforementioned third sensing signal 1-S3) can be obtained based on the motion and the third sensing signal 1-S3 generated by the aforementioned sensing element 1-15. Figure 7 ).

[0409] Since the haptic feedback system 1-1 has not undergone proper calibration after assembly, the aforementioned second relationship curve 1-R2 may have an error with a second target curve 1-R2'. In this case, the external measuring device can adjust the characteristic parameters of the control unit 1-13 according to the aforementioned first relationship curve 1-R1 and the second relationship curve 1-R2 to further enhance the motion control accuracy of the vibrator 1-12 relative to the outer frame 1-111, and the aforementioned calibration does not need to go through the central processing unit 1-C.

[0410] It should be noted that after the aforementioned calibration procedure is completed, the haptic feedback system 1-1 can perform precise closed-loop control of the movement or amplitude of the vibrator 1-12 based on the aforementioned second sensing signal 1-S2 and third sensing signal 1-S3, so as to provide the user with appropriate and accurate haptic feedback.

[0411] For example, when the sensing module 1-2 includes a gyroscope and / or accelerometer, it can be used to sense the attitude of the electronic device 1-E. When the second sensing signal 1-S2 generated by the sensing module 1-2 meets a first preset condition (for example, the sensing module 1-2 detects that the electronic device 1-E is facing upwards), the control unit 1-13 can drive the vibrator 1-12 to move in a first mode (for example, continuous vibration) through the driving component. Similarly, when the second sensing signal 1-S2 generated by the sensing module 1-2 meets a second preset condition (for example, the sensing module 1-2 detects that the electronic device 1-E is facing downwards), the control unit 1-13 can drive the vibrator 1-12 to move in a second mode (for example, intermittent vibration) through the driving component to provide the user with different tactile feedback.

[0412] Second Embodiment

[0413] The following describes the optical element driving mechanism of an embodiment of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in a particular manner and are not intended to limit the scope of the invention. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0414] Figure 8 An exploded view of an optical element driving mechanism 2-10 according to certain features of this disclosure is shown. The aforementioned optical element driving mechanism 2-10 can be disposed inside an electronic device such as a camera, tablet computer, or mobile phone to acquire images. The aforementioned optical element driving mechanism 2-10 allows relative movement between a first optical element 2-1 and a second optical element (not shown) disposed therein, to achieve auto-focusing (AF) and optical image stabilization (OIS). The detailed structure of the optical element driving mechanism 2-10 will be described below.

[0415] like Figure 8As shown, the optical element driving mechanism 2-10 includes a fixing part 2-100, a first movable part 2-200, a second movable part 2-300, a connecting part 2-400, a first driving assembly 2-500, a second driving assembly 2-510, a third driving assembly 2-520, a first support assembly 2-600, a second support assembly 2-650, a sensing assembly 2-700, and a reinforcing assembly 2-800 (displayed on...). Figure 13 Three magnetically conductive elements 2-900 (displayed in the display) Figures 18A to 18C ), and a first shock-absorbing element 2-1000 (displayed in the display) Figure 14 ), and a second shock-absorbing element 2-1010 (displayed in Figure 14 ), and a third shock-absorbing element 2-1020 (displayed in Figure 14 ) and a fourth shock-absorbing element 2-1030 (displayed in Figure 14 ).

[0416] The fixing part 2-100 includes an outer frame 2-110, a frame 2-120, and a base 2-130. The outer frame 2-110 has a plate-like structure and is fixedly connected to the frame 2-120. The base 2-130 is fixedly connected to the frame 2-120. Details regarding the frame 2-120 will be provided later. Figures 11A to 11C Detailed description. Furthermore, the first movable part 2-200 includes a first circuit assembly 2-220. The fixed part 2-100 also includes a second circuit assembly 2-140.

[0417] The first circuit assembly 2-220 has a plate-like structure. The second circuit assembly 2-140 is disposed on the frame 2-120. The second circuit assembly 2-140 includes a first part 2-141 and a second part 2-142. Both the first part 2-141 and the second part 2-142 have plate-like structures, and the first part 2-141 and the second part 2-142 are not parallel to each other.

[0418] The first movable part 2-200 also includes a first carrier 2-210, a third circuit assembly 2-230, and a fourth circuit assembly 2-240. The first carrier 2-210 is fixedly connected to the first circuit assembly 2-220. The second movable part 2-300 includes a second carrier 2-310.

[0419] The first carrier 2-210 is used to connect a first optical element 2-1, and the second carrier 2-310 is used to connect a second optical element (not shown). In this embodiment, the first optical element 2-1 is used to receive electromagnetic waves and output signals. The first optical element 2-1 and the second optical element can be optical elements such as photosensitive elements, lenses, and mirrors.

[0420] The first optical element 2-1 has a first optical axis 2-O1, and the second optical element has a second optical axis 2-O2. In this embodiment, the first optical axis 2-O1, the second optical axis 2-O2, and a principal axis 2-D1 are substantially parallel. When viewed along the first optical axis 2-O1, the first optical element 2-1 at least partially overlaps with the first circuit assembly 2-220. The first optical element 2-1 is electrically connected to the first circuit assembly 2-220.

[0421] Both the third circuit assembly 2-230 and the fourth circuit assembly 2-240 have a plate-like structure. The third circuit assembly 2-230 is disposed on the fourth circuit assembly 2-240. The third circuit assembly 2-230 is electrically connected to the first circuit assembly 2-220 via the fourth circuit assembly 2-240.

[0422] The optical element drive mechanism 2-10 can achieve the effect of anti-shake by moving the first movable part 2-200 relative to the fixed part 2-100. The optical element drive mechanism 2-10 can achieve the effect of autofocus by moving the second movable part 2-300 relative to the fixed part 2-100.

[0423] When light from the outside enters the optical element driving mechanism 2-10, which carries the first optical element 2-1 and the second optical element (not shown), the incident light travels from the light incident end (near the outer frame) along the second optical axis of the second optical element, passes through the second optical element disposed in the optical element driving mechanism 2-10, to the light emitting end, and then to the first optical element 2-1 to acquire an image. The connecting part 2-400 is used to connect the first circuit assembly 2-220 to an external circuit (not shown), wherein the first circuit assembly 2-220 or the connecting part 2-400 can be connected to the external circuit via a flexible printed circuit board or TSA+ technology.

[0424] The first drive assembly 2-500 includes four first magnetic elements 2-501 and four first coils 2-502. The second drive assembly 2-510 includes four second magnetic elements 2-511 and four second coils 2-512. The third drive assembly 2-520 includes two third magnetic elements 2-521 and two third coils 2-522.

[0425] The first magnetic element 2-501 and the second magnetic element 2-511 have an integrated structure, meaning that the first magnetic element 2-501 and the second magnetic element 2-511 are not two separate elements; the first magnetic element 2-501 is also the second magnetic element 2-511. In this way, the size of the optical element driving mechanism 2-10 can be reduced, thereby achieving miniaturization.

[0426] The first magnetic element 2-501, the second magnetic element 2-511, and the third magnetic element 2-521 are disposed in the frame 2-120. The first coil 2-502 and the third coil 2-522 are embedded in the third circuit assembly 2-230. The second coil 2-512 is disposed in the second support 2-310.

[0427] The first drive assembly 2-500 is electrically connected to the first circuit assembly 2-220. The second drive assembly 2-510 is electrically connected to the second circuit assembly 2-140. The first drive assembly 2-500 is used to drive the first carrier 2-210 to move relative to the frame 2-120 in a first dimension. The first dimension is the movement along the plane formed by a second axis 2-D2 and a third axis 2-D3. The second drive assembly 2-510 is used to drive the second carrier 2-310 to move relative to the frame 2-120 in a second dimension. The second dimension is the movement along the second optical axis 2-O2.

[0428] One feature of this disclosure is that the optical element driving mechanism 2-10 includes a third driving assembly 2-520. The third driving assembly 2-520 is used to drive the first carrier 2-210 to move relative to the frame 2-120 in a third dimension. The third dimension is rotation about a pivot axis, and this pivot axis is parallel to the first optical axis 2-O1.

[0429] The first support assembly 2-600 can support the movement of the first bearing member 2-210 relative to the frame 2-120. The first support assembly 2-600 includes four support elements 2-601. In this embodiment, all four support elements 2-601 are ball bearings.

[0430] The second support assembly 2-650 supports the movement of the second carrier 2-310 relative to the frame 2-120. The second support assembly 2-650 includes a first elastic element 2-651 and a second elastic element 2-652. When viewed along the first optical axis 2-O1, the first support assembly 2-600 and the second support assembly 2-650 partially overlap. The second carrier 2-310 is movably connected to the frame 2-120 via the first elastic element 2-651 and the second elastic element 2-652.

[0431] The sensing assembly 2-700 includes three first sensing elements 2-710, one second sensing element 2-720, and two sensing magnets 2-730. The second sensing element 2-720... Figure 8 Not visible from the viewpoint, the configuration of the second sensing element 2-720 on the second circuit assembly 2-140 will be related to Figures 12 to 13 To depict.

[0432] The aforementioned first sensing element 2-710 and second sensing element 2-720 can be Hall effect detectors, while the sensing magnet 2-730 can be a permanent magnet. The Hall effect detector can determine the position of the permanent magnet by detecting changes in its magnetic field, thereby increasing the accuracy of compensation or focusing.

[0433] In another embodiment, other types of alignment elements / components, such as magnetoresistive sensors (MRS) or optical sensors, may also be used to detect the relative positions of the first movable part 2-200 and the second movable part 2-300.

[0434] The first sensing element 2-710 is used to sense the movement of the first carrier 2-210. The first sensing element 2-710 is disposed on and electrically connected to the fourth circuit assembly 2-240. The second sensing element 2-720 is used to sense the movement of the second carrier 2-310. The second sensing element 2-720 is electrically connected to the second circuit assembly 2-140, and the second sensing element 2-720 is disposed on the first portion 2-141 of the second circuit assembly 2-140.

[0435] When viewed from any direction perpendicular to the main axis 2-D1, the first sensing element 2-710 and the second sensing element 2-720 do not overlap. The sensing magnet 2-730 is positioned on the opposite side of the second support member 2-310; its details will be shown in... Figures 16A to 16B .

[0436] Figure 9A This is a perspective view of an optical element driving mechanism 2-10 according to certain features of this disclosure. Figure 9A The outer frame 2-110, the frame 2-120, the second part 2-142 of the second circuit assembly 2-140, the connecting part 2-400, and part of the base 2-130 can be seen. The base 2-130 is fixedly connected to the frame 2-120.

[0437] Figure 9B This is a bottom view of the optical element driving mechanism 2-10 according to certain features of this disclosure. The first circuit assembly 2-220 is electrically connected to the connecting part 2-400. The first circuit assembly 2-220 is fixedly connected to the first carrier 2-210.

[0438] Figure 10A A bottom view of base 2-130 according to certain features of this disclosure. Figure 10BThis is a bottom view of the first support member 2-210 according to certain features of this disclosure. The base 2-130 includes a second opening 2-131 and four stops 2-132. The base 2-130 is made of a metallic material. The first support member 2-210 includes a first opening 2-211, four avoidance portions 2-212, and four recesses 2-213. The first support member 2-210 is made of a non-metallic material, such as plastic, fiberglass, or rubber, etc. Because in Figure 10B Concave 2-213 is not visible from the viewpoint, therefore concave 2-213 will be related to Figures 11A to 11B Detailed explanation.

[0439] The first opening 2-211 and the second opening 2-131 correspond to the first optical axis 2-O1 of the first optical element 2-1. The avoidance part 2-212 is a recessed structure used to correspond to the stop part 2-132. The stop part 2-132 is used to limit the range of motion of the first support member 2-210.

[0440] In detail, the stop portion 2-132 is provided within the recessed avoidance portion 2-212, so when the first bearing member 2-210 is subjected to the first drive assembly 2-500 or the third drive assembly 2-520 ( Figure 8 When the first carrier 2-210 moves under the drive of the stop part 2-132, the movement of the first carrier 2-210 will be restricted by the stop part 2-132.

[0441] Figure 11A This is a cross-sectional view of an optical element drive mechanism 2-10 according to certain features of this disclosure. Figure 11B A cross-sectional view of frame 2-120 according to certain features of this disclosure. Figure 11C This is a perspective view of frame 2-120 according to certain features of this disclosure. Figure 11A as well as Figure 11B This is a cross-sectional view taken along a first axis 2-S1. The first axis 2-S1 lies in the plane formed by the second axis 2-D2 and the third axis 2-D3, and the angles between the first axis 2-S1 and the second axis 2-D2, as well as between the first axis 2-S1 and the third axis 2-D3, are all 45 degrees. The relationship between the first axis 2-S1 and the second and third axes 2-D3 will be discussed later. Figure 17B It displays more clearly.

[0442] Please refer to this as well. Figures 11A to 11C The frame 2-120 includes two first sides 2-121, two second sides 2-122, four corners 2-123, a first receiving space 2-124, a second receiving space 2-125, a third receiving space 2-126, four frame protrusions 2-127, and four inner walls 2-128.

[0443] The first side 2-121 consists of two opposite sides of frame 2-120, and the second side 2-122 consists of two other opposite sides of frame 2-120. The first side 2-121 extends along the second axis 2-D2. The first side 2-121 and the second side 2-122 are adjacent and perpendicular to each other. The four corners 2-123 are located at the intersections of the first side 2-121 and the second side 2-122, respectively. When viewed along the main axis 2-D1, the support elements 2-601 of the first support assembly 2-600 are located at the four corners 2-123 of frame 2-120, respectively.

[0444] The first receiving space 2-124 is used to receive the first carrier 2-210. The first receiving space 2-124 is adjacent to the base 2-130. The second receiving space 2-125 is used to receive the second carrier 2-310 and the second optical element (not shown). The third receiving space 2-126 is adjacent to the outer frame 2-110. The first elastic element 2-651 is located in the third receiving space 2-126.

[0445] The main shaft 2-D1 passes through a first receiving space 2-124, a second receiving space 2-125, and a third receiving space 2-126. The second receiving space 2-125 is connected to both the first receiving space 2-124 and the third receiving space 2-126. When viewed along the first optical axis 2-O1, the stop 2-132, the first support member 2-210, and the first circuit assembly 2-220 at least partially overlap.

[0446] The frame protrusion 2-127 has a first frame surface 2-1271 and a second frame surface 2-1272. The first frame surface 2-1271 and the second frame surface 2-1272 face opposite directions. The first frame surface 2-1271 faces the first receiving space 2-124. The second frame surface 2-1272 faces the third receiving space 2-126.

[0447] When viewed along the main axis 2-D1, the first frame surface 2-1271 and the second frame surface 2-1272 partially overlap. The frame protrusion 2-127 is adjacent to the second receiving space 2-125. The inner wall 2-128 has an inner surface 2-1280, and the frame protrusion 2-127 protrudes from the inner wall 2-128. When viewed along the first axis 2-S1, the frame protrusion 2-127 overlaps with the second receiving space 2-124.

[0448] Support element 2-601 is located at corner 2-123 of frame 2-120. When viewed along main axis 2-D1, first magnetic element 2-501 is located at corner 2-123. When viewed along main axis 2-D1, corner 2-123 is adjacent to first side 2-121.

[0449] In this embodiment, the support element 2-601 is positioned in the recess 2-213. The support element 2-601 contacts the frame 2-120 and the first carrier 2-210 respectively, so as to be in the first drive assembly 2-500 ( Figure 8 ) or third drive component 2-520 ( Figure 8 When driving the first support member 2-210, it assists the first support member 2-210 to move relative to the frame 2-120.

[0450] like Figure 11A As shown, the stop 2-132 is positioned within the recessed structure of the avoidance part 2-212. When the first movable part 2-200 is subjected to the first drive assembly 2-500 ( Figure 8 ) or the third drive component 2-520 ( Figure 8 When the first moving part 2-200 is driven, and the displacement reaches a limit position, the avoidance part 2-212 will contact the stop part 2-132, thus restricting the first moving part 2-200 within a certain range of motion.

[0451] Figure 12 A perspective view of a frame 2-120, a first magnetic element 2-501, a second magnetic element 2-511, a third magnetic element 2-521, a second circuit assembly 2-140, and a second sensing element 2-720, according to certain features of this disclosure. Figure 13 A perspective view of the second circuit assembly 2-140, the second sensing element 2-720, and the reinforcement assembly 2-800, shown separately according to certain features of this disclosure.

[0452] like Figure 12 As shown, the frame protrusion 2-127 positions the first magnetic element 2-501 and the second magnetic element 2-511, which have an integrated structure. The first magnetic element 2-501 and the second magnetic element 2-511, which have an integrated structure, are located at corners 2-123 of the frame 2-120, respectively.

[0453] The two third magnetic elements 2-521 are located on the two first sides 2-121 respectively, although in Figure 12 From the perspective of [the viewpoint], only one third magnetic element 2-521 can be seen. In this embodiment, the third magnetic element 2-521 is disposed on the frame 2-120, but in different embodiments, the third magnetic element 2-521 may be disposed on the second support member 2-310 or on the frame 2-120.

[0454] The second sensing element 2-720 is disposed on the first part 2-141. The second circuit assembly 2-140 is electrically connected to the second drive assembly 2-510. Figure 8) and the second sensing element 2-720. The second driving assembly 2-510 is connected via the first elastic element 2-651 ( Figure 8 Electrically connect the second circuit assembly 2-140.

[0455] Refer to together Figures 12 to 13 The reinforcing component 2-800 is made of metal. The reinforcing component 2-800 is fixedly connected to the frame 2-120. The second drive component 2-510 is electrically connected to the second circuit component 2-140 via the reinforcing component 2-800. In this embodiment, the reinforcing component 2-800 is embedded within the frame 2-120, a configuration that achieves miniaturization.

[0456] For illustrative purposes, Figure 14 This diagram illustrates the first shock-absorbing element 2-1000, the second shock-absorbing element 2-1010, the third shock-absorbing element 2-1020, and the fourth shock-absorbing element 2-1030. The first shock-absorbing element 2-1000, the second shock-absorbing element 2-1010, and the third shock-absorbing element 2-1020 are used to suppress abnormal movement of the first movable part 2-200. The fourth shock-absorbing element 2-1030 is used to suppress abnormal movement of both the first movable part 2-200 and the second movable part 2-300.

[0457] The first shock-absorbing element 2-1000, the second shock-absorbing element 2-1010, the third shock-absorbing element 2-1020, and the fourth shock-absorbing element 2-1030 are flexible and are all made of non-metallic materials. In this embodiment, the first shock-absorbing element 2-1000, the second shock-absorbing element 2-1010, the third shock-absorbing element 2-1020, and the fourth shock-absorbing element 2-1030 may be gels.

[0458] like Figure 14 As shown, the first shock-absorbing element 2-1000 is located in the first receiving space 2-124. The first shock-absorbing element 2-1000 directly contacts the third circuit assembly 2-230 of the first movable part 2-200 and the frame 2-120 of the fixed part 100. The second shock-absorbing element 2-1010 directly contacts the first support member 2-210 of the first movable part 2-200 and the frame 2-120 and base 2-130 of the fixed part 100.

[0459] like Figure 14 As shown, the third shock-absorbing element 2-1020 is located in the recessed structure of the avoidance portion 2-212 and directly contacts the first support member 2-210 and the first circuit assembly 2-140 of the first movable portion 2-200, as well as the base 2-130. The fourth shock-absorbing element 2-1030 directly contacts the third circuit assembly 2-230 of the first movable portion 2-200 and the second support member 2-310 of the second movable portion 2-300.

[0460] Figure 15 The first coil 2-502 and the third coil 2-522, embedded in the third circuit assembly 2-230, are shown in dashed lines. The support element 2-601 is disposed in the recess 2-213 on the first carrier 2-210. The first sensing assembly 2-710 is disposed on the fourth circuit assembly 2-240.

[0461] The first magnetic element 2-501 is set on frame 2-120. Figure 8 This corresponds to the first coil 2-502 disposed on the third circuit assembly 2-230, to drive the first carrier 2-210 ( Figure 8 ) moves in the first dimension. The third magnetic element 2-521 is set on frame 2-120. Figure 8 This corresponds to the third coil 2-522 disposed on the third circuit assembly 2-230, to drive the first carrier 2-210 ( Figure 8 It moves in the third dimension.

[0462] Figure 16A A perspective view of the second carrier 2-310, the second coil 2-512, and the sensing magnet 2-730 according to certain features of this disclosure. Figure 16B A top view of the second carrier 2-310, the second coil 2-512, and the second sensing component 2-730 according to certain features of this disclosure.

[0463] The second coil 2-512 corresponds to the second magnetic element 2-511 set in the frame 2-120. Figure 12 This drives the second support member 2-310 to move in the second dimension. For example... Figures 16A to 16B As shown, four second coils 2-512 are sleeved on the second carrier 2-310, and two sensing magnets 2-730 are disposed on two surfaces of the second carrier 2-310 facing opposite directions.

[0464] Figure 17A A perspective view of the first drive assembly 2-500, the second drive assembly 2-510, and the third drive assembly 2-520, shown separately according to certain features of this disclosure. Figure 17B Top view of the first drive assembly 2-500, the second drive assembly 2-510, and the third drive assembly 2-520, shown separately according to certain features of this disclosure.

[0465] like Figure 17AAs shown in the figure, for illustrative purposes, the magnetic pole orientation of the first magnetic element 2-501 and the second magnetic element 2-511 is indicated in one of the first magnetic elements 2-501, and the magnetic pole orientation of the third magnetic element 2-521 is indicated in one of the third magnetic elements 2-521.

[0466] The first coil 2-502 has a first segment 2-5022 perpendicular to the magnetic pole arrangement direction of the first magnetic element 2-501. The second coil 2-512 has a second segment 2-5122 perpendicular to the magnetic pole arrangement direction of the second magnetic element 2-511. The third coil 2-522 has a third segment 2-5222 perpendicular to the magnetic pole arrangement direction of the third magnetic element 2-521.

[0467] like Figure 17A As shown, the extension direction of the first segment 2-5022 is parallel to the extension direction of the second segment 2-5122. The extension direction of the third segment 2-5222 is not parallel to the extension direction of the first segment 2-5022. The extension direction of the third segment 2-5222 is not perpendicular to the extension direction of the first segment 2-5022.

[0468] When viewed along the main axis 2-D1, the extension direction of the third segment 2-5222 is not parallel to the second axis 2-D2. When viewed along the main axis 2-D1, the extension direction of the third segment 2-5222 is perpendicular to the second axis 2-D2. When viewed along the main axis 2-D1, the magnetic pole arrangement direction of the third magnetic element 2-521 is parallel to the second axis 2-D2.

[0469] The first segment 2-5022 and the first magnetic element 2-501 are used to generate a first driving force. The second segment 2-5122 and the second magnetic element 2-511 are used to generate a second driving force. The third segment 2-5222 and the third magnetic element 2-521 are used to generate a third driving force.

[0470] The first driving force can drive the first load-bearing component 2-210 ( Figure 8 Relative frame 2-120 ( Figure 8 ) moves in the first dimension. The second driving force can drive the second bearing member 2-310 ( Figure 8 Relative frame 2-120 ( Figure 8 ) moves in the second dimension. The third driving force can drive the first bearing component 2-210 ( Figure 8 Relative frame 2-120 ( Figure 8 It moves in the third dimension.

[0471] To elaborate, such as Figure 17BAs shown, the first axis 2-S1 lies in the plane formed by the second axis 2-D2 and the third axis 2-D3. The angles between the first axis 2-S1 and the second axis 2-D2, and between the first axis 2-S1 and the third axis 2-D3, are both 45 degrees. The first axis 2-S2 lies in the plane formed by the second axis 2-D2 and the third axis 2-D3, and is perpendicular to the first axis 2-S1.

[0472] The first dimension is the movement along the plane formed by the first axis 2-S1 and the second axis 2-D2 (which is also the plane between the second axis 2-D2 and the third axis 2-D3), and more specifically, the first dimension is the movement with the first axis 2-S1 or the second axis 2-S2 as the direction of movement. The second dimension is the movement along the second optical axis 2-O2 ( Figure 8 The movement of ) in the third dimension is rotation about a pivot axis, and the pivot axis is perpendicular to the first optical axis 2-O1 ( Figure 8 Parallel.

[0473] Figure 18A This is a cross-sectional view of the first optical element 2-1, the base 2-130, the first carrier 2-210, the first circuit assembly 2-220, the third circuit assembly 2-230, the fourth circuit assembly 2-240, the connecting part 2-400, and the magnetically conductive element 2-900. Figure 18A The cross-section of the magnetically conductive element 2-900 embedded in the first bearing member 2-210 can be seen.

[0474] Figure 18B In accordance with certain features of this disclosure, along Figure 18A The cross-sectional view extracted from the dashed lines 2-A to 2-A' in the diagram. From Figure 18B The three magnetically conductive elements 2-900 can be seen embedded in the first support member 2-210 and not exposed in the first support member 2-210. Figure 18C A top view showing the first drive assembly 2-500, the second drive assembly 2-510, the third drive assembly 2-520, and the magnetic conductive element 2-900.

[0475] Please refer to this as well. Figures 18A to 18C The magnetic element 2-900 is made of metallic material. Magnetic element 2-900 corresponds to the first magnetic element 2-501. When viewed along the main axis 2-D1, two magnetic elements 2-900 are located near the first side 2-121 of the frame 2-120. Figure 11C Another magnetically conductive element 2-900 is located on the second side 2-142 near the frame 2-120.

[0476] When viewed along the main axis 2-D1, the magnetic element 2-900 at least partially overlaps with the first drive assembly 2-500. When viewed along the main axis 2-D1, the magnetic element 900 at least partially overlaps with the second drive assembly 2-510. When viewed along the main axis 2-D1, the magnetic element 2-900 at least partially overlaps with the third drive assembly 2-520.

[0477] Figure 19 This is an exploded view of the optical element driving mechanism 2-10' shown according to another embodiment of the present disclosure. Figure 19 The optical element drive mechanism 2-10' shown is... Figure 8 The difference in the optical element drive mechanism 2-10 shown is its outer frame 2-110', frame 2-120', base, and first support assembly 2-600'.

[0478] exist Figure 19 In the illustrated embodiment, the outer frame 2-110' and the frame 2-120' of the optical element driving mechanism 2-10' have different appearances from the outer frame 2-110 and the frame 2-120 of the optical element driving mechanism 2-10, but the outer frame 2-110' and the frame 2-120' have a similar arrangement relationship with the outer frame 2-110 and the frame 2-120. Furthermore, the optical element driving mechanism 2-10' does not have a base.

[0479] In addition, Figure 8 In the illustrated embodiment, the support element 2-601 is a ball bearing. Figure 19 In the illustrated embodiment, the support element 2-601' is a suspension line. The first carrier 2-210 is movable relative to the frame 2-120' via the support element 2-601'.

[0480] Figure 20A show Figure 19 A perspective view of the optical element drive mechanism 2-10', but the outer frame 2-110' is not shown for illustrative purposes. Figure 20B show Figure 19 A perspective view of the optical element drive mechanism 2-10', but the outer frame 2-110' is not shown for illustrative purposes.

[0481] like Figures 20A to 20B As shown, the two ends of the support element 2-601' are connected to the first elastic element 2-651 and the first bearing member 2-210, respectively. The support element 2-601' can support the movement of the first bearing member 2-210 relative to the frame 2-120'.

[0482] In summary, this invention provides an optical element driving mechanism for driving a first optical element and a second optical element, thereby achieving functions such as optical focusing or optical motion compensation. Specifically, the combination of three driving mechanisms—a first driving component driving the first optical element to move in a plane perpendicular to the first optical axis, a second driving component driving the second optical element to move along the second optical axis, and a third driving component driving the first optical element to rotate around the first optical axis—gives the optical element driving mechanism superior optical focusing and optical compensation capabilities, significantly improving the performance of electronic devices.

[0483] Third Embodiment

[0484] First, please refer to Figure 21A The diagram illustrates an optical module 3-1001 according to some embodiments of the present disclosure. The optical module 3-1001 may mainly include a light intensity adjustment mechanism 3-1100 and an optical element driving mechanism 3-1200. An optical element 3-1230 may be disposed in the optical element driving mechanism 3-1200, and the optical element 3-1230 may be driven by the optical element driving mechanism 3-1200 to achieve optical image stabilization (OIS) or autofocus (AF) functions. The light intensity adjustment mechanism 3-1100 may be disposed on the optical element driving mechanism 3-1200 to control the total amount or characteristics of light incident on the optical element 3-1230. For example, the light intensity adjustment mechanism 3-1100 may serve as an aperture to control the depth of field, image quality, and light intake of the optical element 3-1230.

[0485] In some embodiments, optical element 3-1230 may include, for example, a lens, mirror, prism, beam splitter, aperture, liquid lens, image sensor, camera module, ranging module, etc. It should be noted that the definition of optical element here is not limited to elements related to visible light; elements related to invisible light (e.g., infrared light, ultraviolet light) may also be included in this invention. For example, when optical element 3-1230 is a lens, it may include a lens barrel 3-1231 and at least one lens element 3-1232. In some embodiments, the material of lens barrel 3-1231 may include a non-metallic material, and the thermal conductivity of lens barrel 3-1231 may differ from that of the support 3-1220; for example, the thermal conductivity of lens barrel 3-1231 may be higher than that of support 3-1220.

[0486] Figure 22A This is a schematic diagram of the light intensity adjustment mechanism 3-1100. Figure 22B This is an exploded view of the light intensity adjustment mechanism 3-1100. (See diagram below.) Figure 21A , Figure 22A as well as Figure 22B As shown, the light intensity adjustment mechanism 3-1100 mainly includes an outer frame 3-1111, a base 3-1112, a top plate 3-1113, a movable part 3-1120, a light intensity control element 3-1140, a first drive assembly 3-1150, a third elastic element 3-1160, a connecting element 3-1162, a magnetically conductive element 3-1164, and a position sensing element 3-1166, all arranged on the main shaft 3-1150. The outer frame 3-1111, base 3-1112, and top plate 3-1113 can be collectively referred to as the fixing part 3-1110. The light intensity control element 3-1140 may include a first light intensity control unit 3-1141, a second light intensity control unit 3-1142, a third light intensity control unit 3-1143, and a fourth light intensity control unit 3-1144, or may include light intensity control elements such as blades, polarizers, and filters. The outer frame 3-1111 and the base 3-1112 form a first receiving space 3-1130 to accommodate components such as the movable part 3-1120, the third elastic element 3-1160, the connecting element 3-1162, the magnetically conductive element 3-1164, and the position sensing element 3-1166. In some embodiments, the base 3-1112 is closer to the optical element 3-1230 than the outer frame 3-1111. The light intensity control element 3-1140 may be located outside the first receiving space 3-1130.

[0487] The movable part 3-1120 can be connected to the light intensity control element 3-1140 and can move relative to the fixed part 3-1110, for example, it can be movably connected to the base 3-1112 via the connecting element 3-1162. The first drive assembly 3-1150 can be used to drive the movable part 3-1120 to move relative to the fixed part 3-1110. For example, the first drive assembly 3-1150 may include a first drive element 3-1151 and a second drive element 3-1152, respectively disposed on the movable part 3-1120 and the fixed part 3-1110 (e.g., the base 3-1112). The first drive element 3-1151 and the second drive element 3-1152 may be, for example, a combination of a magnet and a coil, to generate a driving force to drive the movable part 3-1120 to move relative to the fixed part 3-1110. In some embodiments, the first drive assembly 3-1150 may also include a piezoelectric element, a shape memory alloy, or other drive element. The magnetically conductive element 3-1164 can be used to guide the direction of the magnetic field of the first driving element 3-1151. In some embodiments, such as Figure 21A , Figure 22BAs shown, the first driving element 3-1151 and the second driving element 3-1152 can be arranged along the direction of the main shaft 3-1500, and the magnetic conductive element 3-1164 and the first driving element 3-1151 can also be arranged along the direction of the main shaft 3-1500.

[0488] The position sensing element 3-1166 can be used to sense changes in the magnetic field when the first driving element 3-1151 moves, so as to obtain the position of the moving part 3-1120 relative to the fixed part 3-1110. For example, the aforementioned position sensing element 3-1166 may include a Hall effect sensor, a magnetoresistive effect sensor (MR sensor), a giant magnetoresistive effect sensor (GMRS sensor), a tunneling magnetoresistive effect sensor (TMRS sensor), or a fluxgate sensor.

[0489] In some embodiments, the optical element driving mechanism 3-1200 may mainly include a housing 3-1211, a base 3-1212, a support 3-1220, and a second driving assembly 3-1240. The housing 3-1211 and the base 3-1212 may be fixed to each other to form the housing of the optical element driving mechanism 3-1200 to accommodate other components. The support 3-1220 may move relative to the housing 3-1211 and the base 3-1212 and may be used to connect the optical element 3-1230.

[0490] The second drive assembly 3-1240 may include a third drive element 3-1241 and a fourth drive element 3-1242, respectively disposed on the support 3-1220 and the housing 3-1211. The third drive element 3-1241 and the fourth drive element 3-1242 may be, for example, a combination of a magnet and a coil, used to generate a driving force to drive the support 3-1220 to move relative to the housing 3-1211. In some embodiments, the second drive assembly 3-1240 may also include a piezoelectric element, a shape memory alloy, or other drive element.

[0491] In some embodiments, the support 3-1220 can be suspended in the second receiving space 3-1260 formed by the outer shell 3-1211 and the base 3-1212 via the first elastic element 3-1251 and the second elastic element 3-1252. Thus, the support 3-1220 can be movably connected to the outer shell 3-1211 via the first elastic element 3-1251 and the second elastic element 3-1252.

[0492] In some embodiments, heat is generated when the first driving assembly 3-1150 drives the movable part 3-1120 to move relative to the fixed part 3-1110. However, excess heat may affect the image quality of the optical element 3-1230. Therefore, a thermal control assembly 3-1300 can be provided in the optical module 3-1001 to adjust the temperature of the optical element 3-1230, thereby improving the image quality. In some embodiments, the thermal control assembly 3-1300 may correspond to the optical element 3-1230 or the carrier 3-1220, and may include a first thermal control element 3-1311 and a second thermal control element 3-1320.

[0493] Figure 21B yes Figure 21A A schematic diagram of some components is shown. For example, the first thermal control element 3-1311 can have a heat insulation effect and can be disposed between the light intensity adjustment mechanism 3-1100 and the optical element driving mechanism 3-1200. For example, it can be disposed between the optical element 3-1230 and the light intensity adjustment mechanism 3-1100 to isolate the heat generated by the first driving component 3-1150 (heat source) from being conducted to the optical element 3-1230.

[0494] The second thermal control element 3-1320 may have a heat conduction or heat dissipation effect to conduct the heat generated by the first drive assembly 3-1150 (heat source) away from the optical element 3-1230. In some embodiments, the material of the second thermal control element 3-1320 may include metal, while the material of the base 3-1112 does not include metal, and may include non-metallic materials (plastic, rubber, etc.). For example, the second thermal control element 3-1320 may be fixedly disposed in the fixing part 3-1110, for example, it may be embedded in the base 3-1112 and exposed on the first surface 3-1116 of the base 3-1112 facing away from the optical element 3-1230, and not exposed on the second surface 3-1117 of the base 3-1112 facing the optical element 3-1230. In some embodiments, the second thermal control element 3-1320 may be connected to the outer frame 3-1111, and the material of the outer frame 3-1111 may include metal, thereby transferring the heat generated by the first drive assembly 3-1150 to the outer frame 3-1111 via the second thermal control element 3-1320 for heat dissipation through the outer frame 3-1111, which is made of metal. Furthermore, in some embodiments, by exposing the second thermal control element 3-1320 to the base 3-1112, heat can be further dissipated from the portion of the second thermal control element 3-1320 exposed to the base 3-1112, thereby preventing the heat generated by the first drive assembly 3-1150 from affecting the operation of the first optical element 3-1230.

[0495] In some embodiments, the thermal conductivity of the first thermal control element 3-1311 is lower than that of the second thermal control element 3-1320, the thermal conductivity of the base 3-1112 is lower than that of the outer frame 3-1111, and the thermal conductivity of the second thermal control element 3-1320 is higher than that of the outer frame 3-1111. In some embodiments, the first thermal control element 3-1311 is closer to the optical element 3-1230 than the second thermal control element 3-1320, and the first thermal control element 3-1311 is located between the optical element 3-1230 and the second thermal control element 3-1320.

[0496] In some embodiments, the carrier 3-1220 and the optical element 3-1230 can be connected via the first connecting element 3-1400. For example, such as Figure 21A , Figure 21BAs shown, the first bonding element 3-1400 can directly contact the carrier 3-1220 and the optical element 3-1230, and the first bonding element 3-1400 may include a non-metallic material (e.g., plastic, rubber, etc.). In some embodiments, the first thermal control element 3-1311 may also be referred to as the second bonding element, and the second thermal control element 3-1320 is (indirectly) connected to the optical element 3-1230 via the first thermal control element 3-1311. In some embodiments, the materials of the first thermal control element 3-1311 and the first bonding element 3-1400 may be different; for example, the thermal conductivity of the first thermal control element 3-1311 may be lower than that of the first bonding element 3-1400.

[0497] Figure 21C This is a schematic diagram of the optical module 3-1002 according to some embodiments of this disclosure, and Figure 21D yes Figure 21C A schematic diagram of some components is shown. In some embodiments, the various components of optical module 3-1002 are generally similar to those of optical module 3-1001, with the main difference being that the first thermal control element 3-1312 of optical module 3-1002 can be a gap located between base 3-1112 and optical element 3-1230 to avoid heat conduction. In this embodiment, base 3-1112 and carrier 3-1220 can be connected by a third bonding element 3-1313, which can be, for example, glue or welding material, and the thermal conductivity of the third bonding element 3-1313 can be different from that of the first bonding element 3-1400. This method also avoids heat generated by the first drive assembly 3-1150 (heat source) from being conducted to optical element 3-1230.

[0498] Figure 23A This is a schematic diagram of some components of the light intensity adjustment mechanism 3-1100. Figure 23B This is a top view of some components of the light intensity adjustment mechanism 3-1100, with the top plate 3-1113 mainly omitted. Figure 23C This is a top view of some components of the light intensity adjustment mechanism 3-1100, where other components on the outer frame 3-1111 are mainly omitted. Figure 23D This is a top view of some components of the light intensity adjustment mechanism 3-1100, mainly omitting the outer frame 3-1111 and other components on the outer frame 3-1111.

[0499] like Figures 23A to 23DAs shown, an opening can be formed among the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 of the light quantity control element 3-1140, with a maximum size of D1, to allow light to pass through. Furthermore, the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 can be movably connected to the movable part 3-1120.

[0500] Specifically, in some embodiments, when viewed along the main axis 3-1500, the first light intensity control unit 3-1141 includes a first guide groove 3-1181 extending along a first direction (Y direction), the second light intensity control unit 3-1142 includes a second guide groove 3-1182 extending along the first direction, the third light intensity control unit 3-1143 includes a third guide groove 3-1183 extending along a second direction (X direction), and the fourth light intensity control unit 3-1144 includes a fourth guide groove 3-1184 extending along the second direction.

[0501] In addition, the movable part 3-1120 may include a first guide part 3-1121, a second guide part 3-1122, a third guide part 3-1123, and a fourth guide part 3-1124, extending along the main shaft 3-1500. The first guide part 3-1121 is disposed in the first guide groove 3-1181, the second guide part 3-1122 is disposed in the second guide groove 3-1182, the third guide part 3-1123 is disposed in the third guide groove 3-1183, and the fourth guide part 3-1124 is disposed in the fourth guide groove 3-1184.

[0502] In some embodiments, when the movable part 3-1120 rotates, the first guide part 3-1121, the second guide part 3-1122, the third guide part 3-1123, and the fourth guide part 3-1124 can slide in the first guide groove 3-1181, the second guide groove 3-1182, the third guide groove 3-1183, and the fourth guide groove 3-1184, respectively, to drive the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 to move in a specific direction. This allows control over the size of the opening, thereby adjusting the aperture size.

[0503] In some embodiments, the first light quantity control unit 3-1141 further includes a first positioning groove 3-1191 and a second positioning groove 3-1192 extending along a second direction (X direction), the second light quantity control unit 3-1142 further includes a third positioning groove 3-1193 and a fourth positioning groove 3-1194 extending along the second direction, the third light quantity control unit 3-1143 further includes a fifth positioning groove 3-1195 extending along a first direction (Y direction), and the fourth light quantity control unit 3-1144 further includes a sixth positioning groove 3-1196 extending along the first direction.

[0504] In some embodiments, the outer frame 3-1111 may include a first positioning part 3-1171, a second positioning part 3-1172, a third positioning part 3-1173, a fourth positioning part 3-1174, a fifth positioning part 3-1175, a sixth positioning part 3-1176, a seventh positioning part 3-1177, and an eighth positioning part 3-1178, extending along the main axis 3-1500. A first positioning part 3-1171 is disposed in a first positioning groove 3-1191, a second positioning part 3-1172 is disposed in a second positioning groove 3-1192, a third positioning part 3-1172 is disposed in a third positioning groove 3-1193, a fourth positioning part 3-1174 is disposed in a fourth positioning groove 3-1194, a fifth positioning part 3-1175 and a sixth positioning part 3-1176 are disposed in a fifth positioning groove 3-1195, and a seventh positioning part 3-1177 and an eighth positioning part 3-1178 are disposed in a sixth positioning groove 3-1196. The first positioning part 3-1171 and the second positioning part 3-1172 are arranged in a second direction, the third positioning part 3-1173 and the fourth positioning part 3-1174 are arranged in a second direction, the fifth positioning part 3-1175 and the sixth positioning part 3-1176 are arranged in the first direction, and the seventh positioning part 3-1177 and the eighth positioning part 3-1178 are arranged in the first direction.

[0505] Therefore, the direction of movement of the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 can be limited by positioning parts arranged in a specific direction. For example, since the first positioning part 3-1171 and the second positioning part 3-1172 are arranged in the second direction, the direction of movement of the first light quantity control unit 3-1141 will be limited in the second direction. In addition, the movable range of the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1173, the fourth positioning part 3-1174, the fifth positioning part 3-1175, the sixth positioning part 3-1176, the seventh positioning part 3-1177, and the eighth positioning part 3-1178 can be defined.

[0506] like Figure 23D As shown, the third elastic element 3-1160 can be disposed on the base 3-1112, and the movable part 3-1120 can include a groove 3-1125, and the third elastic element 3-1160 can be disposed in the groove 3-1125, and the size of the groove 3-1125 can be larger than the size of the third elastic element 3-1160. Therefore, when the movable part 3-1120 rotates clockwise or counterclockwise relative to the fixed part 3-1110, the movable range of the movable part 3-1120 can be defined by the third elastic element 3-1160.

[0507] Figures 24A to 24C These are schematic diagrams showing the positional relationship of some components of the light intensity adjustment mechanism 3-1100 when the movable part 3-1120 rotates clockwise (first dimension), illustrating the relationship with... Figure 23A to Figure 23C Similar components. For example... Figures 24A to 24C As shown, when the movable part 3-1120 rotates clockwise until the first guide part 3-1121 contacts the first stop part 3-1114 of the outer frame 3-1111, the openings in the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 can have a size 3-D2, and the size 3-D2 is larger than the aforementioned size 3-D1, so as to achieve the purpose of adjusting the size of the opening.

[0508] Figures 25A to 25C These are schematic diagrams showing the positional relationship of some components of the light intensity adjustment mechanism 3-1100 when the movable part 3-1120 rotates counterclockwise (in the second dimension), illustrating the relationship with... Figure 23A to Figure 23CSimilar components. For example... Figures 25A to 25C As shown, when the movable part 3-1120 rotates counterclockwise until the first guide part 3-1121 contacts the second stop part 3-1115 of the outer frame 3-1111, the openings in the first light quantity control unit 3-1141, the second light quantity control unit 3-1142, the third light quantity control unit 3-1143, and the fourth light quantity control unit 3-1144 can have a size 3-D3, and the size 3-D3 is smaller than the aforementioned sizes 3-D1 and 3-D2, so as to achieve the purpose of adjusting the size of the opening.

[0509] Figure 26 This is a schematic diagram of a light intensity adjustment mechanism 3-2100 according to some embodiments of the present disclosure. In some embodiments, the light intensity adjustment mechanism 3-2100 mainly includes a frame 3-2111, a base 3-2112, a top plate 3-2113, a movable part 3-2120, a light intensity control element 3-2140, a first driving element 3-2151, a second driving element 3-2152, a connecting element 3-2162, and a magnetically conductive element 3-2164 arranged on a main shaft 3-2500. The light intensity adjustment mechanism 3-2100 can be used to replace the aforementioned light intensity adjustment mechanism 3-1100 and is disposed in an optical module 3-1001 or an optical module 3-1002 to control the total amount or characteristics of light incident on the optical element 3-1230. The frame 3-2111, the base 3-2112, and the top plate 3-2113 can form a receiving space 2300 to accommodate other components. The functions of the frame 3-2111, base 3-2112, top plate 3-2113, movable part 3-2120, light quantity control element 3-2140, first drive element 3-2151, second drive element 3-2152, connecting element 3-2162, and magnetic conductive element 3-2164 are the same as or similar to the functions of the aforementioned outer frame 3-1111, base 3-1112, top plate 3-1113, movable part 3-1120, light quantity control element 3-1140, first drive element 3-1151, second drive element 3-1152, connecting element 3-1162, and magnetic conductive element 3-1164, and will not be described in detail here.

[0510] like Figure 26As shown, in some embodiments, the first driving element 3-2151 and the second driving element 3-2152 may be arranged along the direction perpendicular to the main axis 3-2500, and the magnetic element 3-2164 and the first driving element 3-2151 are also arranged along the direction perpendicular to the main axis 3-2500, with the second driving element 3-2152 positioned between the magnetic element 3-2164 and the first driving element 3-2151. Thus, the movable part 3-2120 can also be driven to move relative to the frame 3-2111 or the base 3-2112 to drive the light quantity control element 3-2140 and control the total amount or characteristics of light incident on the optical element 3-1230.

[0511] This disclosure provides an optical module including a carrier and a thermal control component. The carrier is used to connect an optical element. The thermal control component is used to adjust the temperature of the optical element. The thermal control component corresponds to either the optical element or the carrier. This prevents heat from other external components from affecting the optical element and also achieves miniaturization.

[0512] The specific relative positions and size relationships of the components disclosed in this disclosure not only enable the drive mechanism to achieve thinning in a specific direction and overall miniaturization, but also further improve the optical quality of the system (such as shooting quality or depth sensing accuracy) by matching different optical modules, and further utilize each optical module to achieve a multi-stage anti-shake system to greatly improve the anti-shake effect.

[0513] Fourth embodiment

[0514] This disclosure provides an optical element driving mechanism, including multiple optical elements (e.g., lenses, photosensitive elements, etc.). To achieve the desired optical effect, these optical elements need to move relative to each other. Therefore, the optical element driving mechanism of this disclosure also includes multiple driving components, each for moving one or more optical elements. In this disclosure, these driving components allow the optical elements to move in different directions (e.g., translational movement in the X, Y, and Z axes and / or rotational movement about the Z-axis) to achieve excellent optical effects.

[0515] First, please refer to Figure 27 . Figure 27 An exploded view of the optical element drive mechanism 4-10 according to some embodiments is shown. Figure 27As shown, the optical element driving mechanism 4-10 mainly includes: a first movable part 4-100, a second movable part 4-200, a third movable part 4-300, a first driving assembly 4-400, a second driving assembly 4-500, a third driving assembly 4-600, and a fixed part 4-900. In some embodiments, the first movable part 4-100 may be connected to a first optical element (e.g., a lens including one or more lenses, not shown), and the second movable part 4-200 may also be connected to the first optical element. The third movable part 4-300 may be connected to a second optical element (e.g., a photosensitive element, not shown). The components of the optical element driving mechanism 4-10 are arranged along a main axis 4-M, and the first optical element has a first optical axis 4-O1, and the second optical element has a second optical axis 4-O2. Figure 30 In some embodiments, the main shaft 4-M, the first optical axis 4-O1, and the second optical axis 4-O2 are all parallel to each other. According to some embodiments of this disclosure, a first drive assembly 4-400 drives a first movable part 4-100 to move relative to a fixed part 4-900 in a first dimension, a second drive assembly 4-500 drives a second movable part 4-200 to move relative to the fixed part 4-900 in a second dimension, and a third drive assembly 4-600 drives a third movable part 4-300 to move relative to the fixed part 4-900 in a third dimension. More specifically, the second movable part 4-200 can move relative to the first movable part 4-100, and the third movable part 4-300 can move relative to both the first movable part 4-100 and the second movable part 4-200. In some embodiments, the third dimension is different from both the first and second dimensions. For example, in some embodiments, the movement in the first dimension may be a movement along the main axis 4-M, the movement in the second dimension may be a movement along the first optical axis 4-O1, and the movement in the third dimension may be a movement in a direction perpendicular to the second optical axis 4-O2 or a rotation about a first axis of rotation, wherein the first axis of rotation is parallel to the second optical axis 4-O2.

[0516] Please refer to the following: Figure 27 and Figure 28 . Figure 28The diagram shows a perspective view of an optical element driving mechanism 4-10 according to some embodiments. The optical element driving mechanism 4-10 of this disclosure further includes a first support assembly 4-710, a second support assembly 4-720, and a third support assembly 4-730. The first support assembly 4-710 is disposed between a first movable portion 4-100 and a fixed portion 4-900, and the first movable portion 4-100 moves relative to the fixed portion 4-900 via the first support assembly 4-710. The second support assembly 4-720 is disposed between the first movable portion 4-100 and a second movable portion 4-200, and the second movable portion 4-200 moves relative to the fixed portion 4-900 via the second support assembly 4-720. The third support assembly 4-730 is disposed between the first movable portion 4-100 and a third movable portion 4-300, and the third movable portion 4-300 moves relative to the fixed portion 4-900 via the third support assembly 4-730.

[0517] In detail, the first support assembly 4-710 includes a first support element with an elongated structure, fixedly disposed at the fixing part 4-900, extending along the main shaft 4-M direction, such as... Figure 28 As shown. The first movable part 4-100 has a hole corresponding to the first support element, allowing the first support element to pass through the hole, so that the first movable part 4-100 can move relative to the first support element. The second support assembly 4-720 includes one or more second support elements having flexibility and a plate-like structure, perpendicular to the first optical axis 4-O1. Figure 28 In the illustrated embodiment, the second support assembly 4-720 includes two second support elements, respectively disposed on the upper and lower sides of the second movable portion 4-200. In some embodiments, the second support elements may be springs or other suitable elastic materials, and may have any suitable shape. The second movable portion 4-200 is movably connected to the first movable portion 4-100 via the second support elements. The third support assembly 4-730 includes one or more third support elements having flexibility and an elongated structure. Figure 28In the illustrated embodiment, the third support assembly 4-730 includes four third support elements, respectively disposed at the four corners of the first movable portion 4-100, extending along the direction of the second optical axis 4-O2. In some embodiments, the third support elements may be suspension wires. The third movable portion 4-300 is movably connected to the first movable portion 4-100 via the third support elements. In some other embodiments, the third support elements may have a spherical structure, by disposing ball bearings between the first movable portion 4-100 and the third movable portion 4-300, allowing the third movable portion 4-300 to move relative to the first movable portion 4-100. It should be noted that neither the second support assembly 4-720 nor the third support assembly 4-730 contacts the fixed portion 4-900. Furthermore, the side of the fixed portion 4-900 where the first support assembly 4-710 is not disposed is referred to as the first side 4-901. Figure 31 ), and the side where the first support component 4-710 is located is referred to as the second side 4-902 (Figure 31), by Figure 28 It can be seen that the distance between the second support component 4-720 and the first side 4-901 of the fixing part 4-900 is less than the distance between the second support component 4-720 and the second side 4-902 of the fixing part 4-900.

[0518] like Figure 28 As shown, a first drive assembly 4-400 is provided on the side opposite to the first support assembly 4-710. The first drive assembly 4-400 includes a drive element 4-410, a conductive element 4-420, and a conductive element 4-430. The drive element 4-410 is fixed to the fixing part 4-900, has a piezoelectric material, and generates a first driving force 4-F1. Figure 30The direction of the first driving force 4-F1 is parallel to the main shaft 4-M. The transmission element 4-420 has an elongated structure and extends along the main shaft 4-M. One end of the transmission element 4-420 is connected to the drive element 4-410, transmitting the first driving force 4-F1 to the first movable part 4-100. The transmission element 4-420 can move relative to the fixed part 4-900 and the first movable part 4-100 to achieve optical zoom or optical focus. Specifically, the first movable part 4-100 has a hole corresponding to the transmission element 4-420, allowing the transmission element 4-420 to pass through the hole, so that the first movable part 4-100 can move relative to the transmission element 4-420. When the conductive element 4-420 moves along the main shaft 4-M direction under the first driving force 4-F1 generated by the driving element 4-410, if the frictional force between the conductive element 4-420 and the first movable part 4-100 is less than the maximum static frictional force, the conductive element 4-420 can drive the first movable part 4-100 to move together in the main shaft 4-M direction, achieving the effect of driving the first movable part 4-100 to move relative to the fixed part 4-900. It should be noted that in some embodiments, when the first driving assembly 4-400 drives the first movable part 4-100 to move, it simultaneously drives the second movable part 4-200 to move relative to the fixed part 4-900. In some embodiments, when the first driving assembly 4-400 drives the first movable part 4-100 to move, it can also simultaneously drive the third movable part 4-300 to move relative to the fixed part 4-900. The conductive element 4-430 is electrically connected to the driving element 4-410 and the external power supply to provide a driving signal to the first driving assembly 4-400.

[0519] Please refer to the following: Figure 29 and Figure 30 . Figure 29 and Figure 30The diagram shows a top view and a front view of an optical element driving mechanism 4-10 according to some embodiments, wherein the outer frame 4-910 and the first movable part 4-100 are omitted. In some embodiments, the second movable part 4-200 includes a first support 4-210, which can be connected to a first optical element (not shown), for example, the first optical element can be disposed inside the first support 4-210. The third movable part 4-300 includes a second support 4-310, a circuit assembly 4-330, and a base plate 4-350. The second support 4-310 can be connected to a second optical element (not shown), for example, the second optical element can be disposed inside the second support 4-310. The circuit assembly 4-330 is electrically connected to the third driving assembly 4-600, providing driving force to the third movable part 4-300. The base plate 4-350 is fixedly connected to the second bearing seat 4-310 and has holes for the first drive assembly 4-400 and the first support assembly 4-710 to pass through.

[0520] like Figure 29 As shown, the second drive assembly 4-500 includes a first coil 4-510 and at least one first magnetic element 4-520. Figure 29 In one embodiment, the first coil 4-510 has a ring structure and is arranged to surround the second movable part 4-200, which helps to simplify the circuit. In other embodiments, the first coil 4-510 may also be divided into several coils arranged on each side of the second movable part 4-200. Figure 29 In one embodiment, the second driving assembly 4-500 includes four first magnetic elements 4-520, respectively disposed on the four sides of the second movable part 4-200. The first magnetic elements 4-520 correspond to the first coil 4-510 and generate a second driving force 4-F2. Figure 30 The direction of the second driving force 4-F2 is parallel to the first optical axis 4-O1. The second driving force 4-F2 drives the second movable part 4-200 to move relative to the fixed part 4-900 along the direction of the first optical axis 4-O1.

[0521] like Figure 29 and Figure 30 As shown, the third driving assembly 4-600 includes three second coils 4-610 and three second magnetic elements 4-620. Each second magnetic element 4-620 corresponds to one second coil 4-610 and generates a third driving force 4-F3. Due to the relative positions of the second coils 4-610 and the second magnetic elements 4-620, a third driving force 4-F3 can be generated in both the X and Y directions. Figure 29This allows the third drive assembly 4-600 to drive the third movable part 4-300 to move in the X and Y directions, that is, in a direction perpendicular to the second optical axis 4-O2. Viewed along the second optical axis 4-O2, the direction of any third driving force 4-F3 extends through the center of the second optical element, such as... Figure 29 As shown. Furthermore, since both the second coil 4-610 and the second magnetic element 4-620 are positioned above the second optical element (in the positive Z direction), when viewed along the direction perpendicular to the second optical axis 4-O2 (as shown). Figure 30 (From the perspective of the third driving force 4-F3), the direction of the third driving force 4-F3 extends but does not pass through the center of the second optical element. The third driving assembly 4-600 also includes a third coil 4-660 and a third magnetic element 4-670. The third magnetic element 4-670 corresponds to the third coil 4-660 and generates a fourth driving force 4-F4. Figure 29 As shown, the direction of the fourth driving force 4-F4 is perpendicular to the second optical axis 4-O2, and it is a driving force for rotation around the second optical axis 4-O2. Therefore, the third driving assembly 4-600 can also drive the third movable part 4-300 to rotate around the second optical axis 4-O2.

[0522] It should be noted that, for the purpose of miniaturization, in some embodiments, the second magnetic element 4-620 may be integrally formed with the first magnetic element 4-520, and the third magnetic element 4-670 may also be integrally formed with one of the first magnetic elements 4-520. In other words, the second drive assembly 4-500 and the third drive assembly 4-600 may share magnetic elements. Furthermore, viewed along the second optical axis 4-O2, the second magnetic element 4-620 may have an elongated structure, for example, a rectangular structure. Figure 29 In this configuration, two second magnetic elements 4-620 arranged in the Y direction extend along a first axis 4-A1, and a second magnetic element 4-620 and a third magnetic element 4-670 arranged in the X direction extend along a second axis 4-A2. The first axis 4-A1 and the second axis 4-A2 are not parallel. In some embodiments, the first axis 4-A1 and the second axis 4-A2 are perpendicular to each other. Figure 29 In the illustrated embodiment, viewed along the second optical axis 4-O2, the third magnetic element 4-670 has an arc-shaped structure. The arc-shaped structure of the third magnetic element 4-670 facilitates the maintenance of stability by providing a fourth driving force 4-F4 for rotational motion. Figure 29As shown, when viewed along the second optical axis 4-O2, the maximum size of the second magnetic element 4-620 on the first axis 4-A1 is different from the maximum size of the third magnetic element 4-670 on the second axis 4-A2. More specifically, the maximum size of the second magnetic element 4-620 on the first axis 4-A1 is greater than the maximum size of the third magnetic element 4-670 on the second axis 4-A2. Correspondingly, the maximum size of the second coil 4-610 on the first axis 4-A1 is different from the maximum size of the third coil 4-660 on the second axis 4-A2. More specifically, the maximum size of the second coil 4-610 on the first axis 4-A1 is greater than the maximum size of the third coil 4-660 on the second axis 4-A2. Furthermore, in some embodiments, the second coil 4-610 and the third coil 4-660 may be at least partially embedded in the circuit assembly 4-330.

[0523] Next, please refer to Figure 31 . Figure 31 A top view of an optical element driving mechanism 4-10 according to some embodiments is shown, wherein the outer frame 4-910 is omitted. Viewed along the main axis 4-M, the fixing portion 4-900 has a polygonal structure, such as a rectangular structure. As described above, the fixing portion 4-900 includes a first side 4-901 and a second side 4-902. The first side 4-901 extends along a third axis 4-A3, and the second side 4-902 extends along a fourth axis 4-A4. The maximum dimension of the first side 4-901 on the third axis 4-A3 is different from the maximum dimension of the second side 4-902 on the fourth axis 4-A4. More specifically, the maximum dimension of the first side 4-901 on the third axis 4-A3 is greater than the maximum dimension of the second side 4-902 on the fourth axis 4-A4. It should be noted that in embodiments of this disclosure, the first axis 4-A1 is parallel to the third axis 4-A3, and the second axis 4-A2 is parallel to the fourth axis 4-A4.

[0524] Viewed along the main axis 4-M, the first drive assembly 4-400 is located on the second side 4-902 of the fixed part 4-900. This reduces the overall size of the mechanism in a specific direction (e.g., the Y direction). Viewed along the third axis 4-A3, the first drive assembly 4-400 partially overlaps with the second drive assembly 4-500. Viewed along the fourth axis 4-A4, the first drive assembly 4-400 does not overlap with the second drive assembly 4-500, nor does it overlap with the third drive assembly 4-600. Viewed along the third axis 4-A3, the first drive assembly 4-400 partially overlaps with the third drive assembly 4-600. More specifically, viewed along the third axis 4-A3, the first drive assembly 4-400 partially overlaps with the second magnetic element 4-620, and also partially overlaps with the third magnetic element 4-670. Furthermore, as... Figure 31 As shown, when viewed along the main axis 4-M, the line formed between the first support assembly 4-710 and the first drive assembly 4-400 passes through the first optical element located in the center.

[0525] Next, please refer to Figure 32 . Figure 32 The diagram shows a left view of the optical element driving mechanism 4-10 according to some embodiments. Viewed along the third axis 4-A3, the first support assembly 4-710 at least partially overlaps with the first drive assembly 4-400; the first support assembly 4-710 partially overlaps with the second drive assembly 4-500; the first support assembly 4-710 partially overlaps with the third drive assembly 4-600; the first support assembly 4-710 partially overlaps with the first optical element; and the first support assembly 4-710 partially overlaps with the second optical element. Furthermore, viewed along the fourth axis 4-A4, the first support assembly 4-710 does not overlap with the first drive assembly 4-400; the first support assembly 4-710 does not overlap with the second drive assembly 4-500; the first support assembly 4-710 does not overlap with the third drive assembly 4-600; the first support assembly 4-710 does not overlap with the first optical element; and the first support assembly 4-710 does not overlap with the second optical element.

[0526] In some embodiments, the fixing part 4-900 may include an outer frame 4-910, a base 4-920, and a third optical element 4-950. The outer frame 4-910 includes a plate-shaped top wall perpendicular to the main shaft 4-M. The base 4-920 is fixedly connected to the outer frame 4-910, and a receiving space 4-925 is formed between the outer frame 4-910 and the base 4-920 to receive the first movable part 4-100 and other components. The third optical element 4-950 is fixedly disposed on the outer frame 4-910. In some embodiments, since the third optical element 4-950 is closer to the light source than the first optical element, light passes through the third optical element 4-950 and then enters the first optical element. In some embodiments, the third optical element 4-950 can be used for optical zoom. In some embodiments, the first driving assembly 4-400 can drive the first optical element to move relative to the third optical element 4-950. Furthermore, in some embodiments, since the first optical element is closer to the light source than the second optical element, light passes through the first optical element before incident on the second optical element. In other words, before reaching the second optical element (e.g., a photosensitive element), the light passes through the first and third optical elements 4-950 for preliminary optical zoom and / or optical focusing before incidenting on the second optical element. However, it should be noted that in embodiments according to this disclosure, the second optical element can move relative to the first and third optical elements 4-950, thus further achieving the effects of optical zoom and / or optical focusing through this relative movement.

[0527] In some embodiments, the optical element driving mechanism 4-10 further includes a first stop assembly 4-810, a second stop assembly 4-820, and a third stop assembly 4-830. The first stop assembly 4-810 is located between the first movable portion 4-100 and the fixed portion 4-900. For example, the first stop assembly 4-810 may include a plurality of protrusions located on the top surface of the first movable portion 4-100. During movement of the first movable portion 4-100, when these protrusions contact the fixed portion 4-900, the movement of the first movable portion 4-100 relative to the fixed portion 4-900 can be limited within a first range of motion. The second stop assembly 4-820 is located between the first movable portion 4-100 and the third movable portion 4-300. For example, the first movable part 4-100 may include a frame 4-150 surrounding its periphery, and a second stop assembly 4-820 may be located on the surface of the frame 4-150 facing the second movable part 4-200, and the circuit assembly 4-330 of the third movable part 4-300 may face the surface of the second movable part 4-200. During movement of the second movable part 4-200, when the second movable part 4-200 contacts the frame 4-150 or the circuit assembly 4-330, the movement of the second movable part 4-200 relative to the first movable part 4-100 may be limited to a second range of motion. The third stop assembly 4-830 is located at both the first movable part 4-100 and the third movable part 4-300. For example, the third stop assembly 4-830 may be located on the surface of the first movable part 4-100 facing the third movable part 4-300, and the circuit assembly 4-330 of the third movable part 4-300 may face the surface of the first movable part 4-100. During the movement of the third movable part 4-300, when the circuit assembly 4-330 contacts the first movable part 4-100, the third movable part 4-300 can be limited to move within a third movement range relative to the first movable part 4-100 and / or the second movable part 4-200.

[0528] In some embodiments, the size of the first range of motion in the main axis 4-M direction differs from the size of the second range of motion in the main axis 4-M direction. More specifically, the size of the first range of motion in the main axis 4-M direction is greater than the size of the second range of motion in the main axis 4-M direction. In these embodiments, the travel distance for optical zoom is typically greater than the travel distance for optical focus. In other embodiments, the sizes of the first and second ranges of motion can be determined as needed.

[0529] Furthermore, in some embodiments, the optical element driving mechanism 4-10 may further include a first sensing component 4-550, a second sensing component 4-630, and a third sensing component 4-680. The first sensing component 4-550 is connected to the second driving component 4-500 and is used to sense the position of the second movable part 4-200 relative to the fixed part 4-900. The second sensing component 4-630 is connected to the third driving component 4-600 and is used to sense the position of the third movable part 4-300 relative to the fixed part 4-900 through translational movement. The third sensing component 4-680 is connected to the third driving component 4-600 and is used to sense the position of the third movable part 4-300 relative to the fixed part 4-900 through rotational movement. In some embodiments, the second sensing component 4-630 and the third sensing component 4-680 may be embedded in the second support 4-310 and electrically connected to the circuit component 4-330, such as... Figure 30 As shown.

[0530] In summary, the optical element driving mechanism 4-10 disclosed herein includes multiple optical elements: a first optical element (e.g., a lens), a second optical element (e.g., a photosensitive element), and a third optical element (e.g., a lens). The first and second optical elements are moved respectively by multiple driving components (e.g., the first driving component 4-400, the second driving component 4-500, and the third driving component 4-600) via piezoelectric and electromagnetic driving methods. Besides the lens itself being able to move relative to the fixed part 4-900, the photosensitive element can also move and rotate in the direction perpendicular to the optical axis, which helps to achieve more precise zoom and / or focus, resulting in excellent optical effects.

[0531] Fifth embodiment

[0532] Figure 33 A perspective view of a haptic feedback system 5-10 according to some embodiments of the present disclosure is shown. It should be noted that in this embodiment, the haptic feedback system 5-10 may, for example, be disposed in an electronic device (not shown) and generate feedback (e.g., haptic feedback) according to different functions. The present disclosure provides a haptic feedback system 5-10 capable of providing different vibration modes and achieving miniaturization. Figure 33 As shown, the haptic feedback system 5-10 includes a housing 5-110, a base 5-120, and an outer frame 5-130. In some embodiments, the outer frame 5-130 is disposed between the housing 5-110 and the base 5-120, such that the housing 5-110, the base 5-120, and the outer frame 5-130 can form a generally rectangular housing.

[0533] In some embodiments, the thickness of the outer frame 5-130 in the vertical direction (e.g., the Z-axis) is less than the dimensions of the housing 5-110 and the base 5-120 in the horizontal direction (e.g., a direction parallel to the XY plane). This allows for a significantly smaller size of the haptic feedback system 5-10 in at least one direction, thereby achieving miniaturization of the haptic feedback system 5-10 and its associated electronic devices. In some embodiments, the housing 5-110, base 5-120, and outer frame 5-130 can be separate components (e.g., the housing 5-110, base 5-120, and outer frame 5-130 can be separable from each other), thereby reducing the difficulty of assembling the internal components of the haptic feedback system 5-10. In other embodiments, the outer frame 5-130 can be integrated with the housing 5-110 and base 5-120 (e.g., the outer frame 5-130 can be integrally formed with the housing 5-110 or base 5-120), thereby reducing the assembly steps of the haptic feedback system 5-10.

[0534] Figure 34 An exploded view of a haptic feedback system 5-10 according to some embodiments of the present disclosure is shown. As shown in FIG. 34, the haptic feedback system 5-10 includes a fixed portion 5-F, a movable portion 5-M, a drive assembly 5-190, and a first connecting assembly 5-160. In some embodiments, the fixed portion 5-F may include a housing 5-110, a base 5-120, and an outer frame 5-130, and is fixedly connected to the disposed electronic device. The movable portion 5-M is movable relative to the fixed portion 5-F. In some embodiments, the movable portion 5-M may include a modal adjustment assembly 5-140 and can be driven by the drive assembly 5-190 to move relative to the fixed portion to generate feedback (e.g., haptic feedback) to the electronic device. The movable portion 5-M is movably connected to the fixed portion 5-F via the first connecting assembly 5-160.

[0535] In some embodiments, the outer frame 5-130 may have a first sidewall 5-131 and a second sidewall 5-132 connected to each other. The first sidewall 5-131 and the second sidewall 5-132 may be substantially perpendicular to each other. In some embodiments, a rounded corner may be formed between the first sidewall 5-131 and the second sidewall 5-132, thereby reducing the probability of damage to the outer frame 5-130 from collision with other components in the electronic device. In some embodiments, the modal adjustment assembly 5-140 includes a frame 5-141, an adjustment element 5-150, and a second connecting assembly 5-170. The frame 5-141 is connected to the first connecting assembly 5-160. The adjustment element 5-150 may be movably connected to the frame 5-141 via the second connecting assembly 5-170, such that the adjustment element 5-150 is movable relative to the frame 5-141 and the fixing portion 5-F. In some embodiments, the mass of the adjustment element 5-150 is different from the mass of the frame 5-141. The following will be used in conjunction with... Figure 35 Further explanation of the detailed structure of framework 5-141 and the operation of modal adjustment component 5-140.

[0536] In some embodiments, a circuit board 5-180 is disposed on a base 5-120. The circuit board 5-180 may include a first portion 5-181 and a second portion 5-182 spaced apart from each other. In other words, the first portion 5-181 and the second portion 5-182 are not in direct contact and a gap is formed between them. In some embodiments, the first portion 5-181 and the second portion 5-182 have different shapes on the base 5-120, but this disclosure is not limited thereto. The first portion 5-181 and the second portion 5-182 of the circuit board 5-180 may be physically and electrically connected by a drive assembly 5-190 (e.g., coil 5-191). In this way, signals can be transmitted between the first portion 5-181 and the second portion 5-182, thereby reducing the manufacturing cost of the circuit board 5-180. The circuit board 5-180 can be used to receive or transmit signals between the drive assembly 5-190 (e.g., coil 5-191) and external components to cause the modal adjustment assembly 5-140 to generate haptic feedback.

[0537] In some embodiments, a metal sheet 5-183 may be provided between the first portion 5-181 and the second portion 5-182 to support a drive assembly 5-190 (e.g., coil 5-191) connecting the first portion 5-181 and the second portion 5-182. The metal sheet 5-183 may be positioned to correspond to the gap between the first portion 5-181 and the second portion 5-182. For example, the metal sheet 5-183 may be positioned along the contours of the first portion 5-181 and the second portion 5-182, and the spacing between the metal sheet 5-183 and the first portion 5-181 (and / or the second portion 5-182) may remain constant, but this disclosure is not limited thereto. The metal sheet 5-183 may not contact the first portion 5-181 and the second portion 5-182 and may be electrically insulated from the first portion 5-181 and the second portion 5-182. In some embodiments, the metal sheet 5-183 may not be electrically connected to any conductive element and may not be used to transmit any signals. This reduces the probability of short circuits forming between the metal sheet 5-183 and other conductive components. In some embodiments, the metal sheet 5-183 may be omitted, or it may be replaced by other insulating materials, all of which are covered within the scope of this disclosure.

[0538] A position sensor 5-185 may be disposed on a circuit board 5-180. In some embodiments, the position sensor 5-185 may be disposed on a second portion 5-182 and located inside (e.g., surrounded by) a coil 5-191. For example, the position sensor 5-185 may be a Hall effect sensor and may be located at a position on the second portion 5-182 protruding toward the first portion 5-181. The position sensor 5-185 may sense the position of the modal adjustment component 5-140, thereby determining whether the transmitted signal and vibration-related parameters need to be adjusted. However, it should be understood that the above configuration is merely an example of this disclosure, and those skilled in the art to which this disclosure pertains will be able to derive other similar configurations based on the content of this disclosure (e.g., disposing of the position sensor 5-185 on the first portion 5-181 or changing the shape or position of the first portion 5-181 and the second portion 5-182), and these configurations are all covered within the scope of this disclosure.

[0539] Figure 35 A perspective view of the internal structure of a haptic feedback system 5-10 according to some embodiments of the present disclosure is shown. It should be noted that, for clarity of the internal structure of the haptic feedback system 5-10, the housing 5-110 and the outer frame 5-130 are not shown in this embodiment. Figure 35 As shown, the frame 5-141 of the modal adjustment assembly 5-140 has a first side 5-142 and a second side 5-143 different from the first side 5-142. In some embodiments, both the first side 5-142 and the second side 5-143 are substantially perpendicular to the top surface of the frame 5-141. The second connecting assembly 5-170 can connect to the outer frame 5-130 (see... Figure 34 The second side 5-143 of the frame 5-141, whereby the frame 5-141 can move relative to the fixed part 5-F (e.g., the outer frame 5-130).

[0540] The first side surface 5-142 may face the adjusting element 5-150. The frame 5-141 also has a plurality of protrusions 5-144 protruding from the first side surface 5-142. The protrusions 5-144 may extend to the opposite side of the adjusting element 5-150. Thus, the second connecting assembly 5-170 may connect the protrusions 5-144 and the adjusting element 5-150, thereby allowing the adjusting element 5-150 to move relative to the frame 5-141. Furthermore, the frame 5-141 also has a plurality of stops 5-145 formed on the first side surface 5-142, for example extending from the first side surface 5-142 toward the second connecting assembly 5-170. The stops 5-145 may limit the range of motion of the adjusting element 5-150. In other words, the adjusting element 5-150 may only move within the range between the opposing stops 5-145. Buffers 5-200 may be provided on the first side surface 5-142 and the stops 5-145. In this way, the adjusting element 5-150 will contact the buffer 5-200 without directly impacting the frame 5-141 (e.g., the first side 5-142 and the stop 5-145). For example, the buffer 5-200 may be made of a material with a lower hardness than the frame 5-141 (e.g., rubber or colloid), and when the adjusting element 5-150 contacts the buffer 5-200, it can absorb the impact force of the adjusting element 5-150, reducing the probability of damage to the overall modal adjustment assembly 5-140, or reducing the noise generated by the operation of the adjusting element 5-150.

[0541] The adjusting element 5-150 may include a support 5-151 and a counterweight 5-155 disposed within the support 5-151. In some embodiments, the support 5-151 and the counterweight 5-155 may be made of different materials. For example, the counterweight 5-155 may be made of a high-density alloy, such as a tungsten (W)-containing alloy or any other suitable material, while the support 5-151 may be made of, for example, plastic or any other suitable material. The arrangement of the counterweight 5-155 allows for the configuration of a sufficiently large adjusting element 5-150 within a limited space, enabling the modal adjustment assembly 5-140 to operate in the desired vibration mode. The support 5-151 is selected from an easily machinable material, thereby allowing it to be manufactured in conjunction with the counterweight 5-155 to achieve the desired shape of the adjusting element 5-150.

[0542] For example, the first connecting component 5-160 may be a spring or other elastic element. In this embodiment, the first connecting component 5-160 includes a first segment 5-161, a second segment 5-162, and a connecting portion 5-163. For example, the first segment 5-161 and the second segment 5-162 may be defined as portions extending generally in a straight line, and the connecting portion 5-163 may be defined as the portion connecting the first segment 5-161 and the second segment 5-162. In some embodiments, the first segment 5-161 may be connected to the outer frame 5-130, and the second segment 5-162 may be connected to the frame 5-141 (e.g., connected to the second side 5-143), and the first segment 5-161 and the second segment 5-162 are connected by the connecting portion 5-163. In some embodiments, the extending directions of the first segment 5-161 and the second segment 5-162 are not parallel. By providing first connecting components 5-160 on opposite sides of the frame 5-141, the frame 5-141 can move along an axial direction (e.g., in a direction generally parallel to the X-axis). In some embodiments, the connecting portions 5-163 of the first connecting components 5-160 on opposite sides of the frame 5-141 have different orientations. More specifically, the connecting portion 5-163 of one first connecting component 5-160 is positioned toward the protrusion 5-144 of the frame 5-141, while the connecting portion 5-163 of the other first connecting component 5-160 is positioned away from the protrusion 5-144 of the frame 5-141. However, the above configuration is merely exemplary and is not intended to limit the scope of this disclosure.

[0543] For example, the second connecting assembly 5-170 may be a spring or other resilient element. In this embodiment, the second connecting assembly 5-170 includes a plurality of first segments 5-171, a plurality of second segments 5-172, and a plurality of connecting portions 5-173. For example, the first segments 5-171 and second segments 5-172 may be defined as portions extending generally in a straight line, while the connecting portions 5-173 may be defined as portions connecting the first segments 5-171 and second segments 5-172. In some embodiments, the first segments 5-171 and second segments 5-172 are alternately arranged, and each first segment 5-171 and second segment 5-172 is connected by a corresponding connecting portion 5-173. In some embodiments, the connecting portions 5-163 and 5-173 have different orientations. More specifically, the connecting portion 5-173 may face the housing 5-110 or the base 5-120 (see...). Figure 34In some embodiments, the orientations of the connecting portions 5-163 and 5-173 may be substantially perpendicular, but this disclosure is not limited thereto. By providing second connecting components 5-170 on opposite sides of the adjusting element 5-150, the adjusting element 5-150 can move along an axial direction (e.g., along a direction substantially parallel to the X-axis). It should be understood that the above configuration is merely exemplary and is not intended to limit the scope of this disclosure.

[0544] Figure 36 A top view showing the internal structure of a haptic feedback system 5-10 according to some embodiments of the present disclosure. Figure 36 As shown, the frame 5-141 may include a body 5-141A and a metal part 5-141B. In some embodiments, the metal part 5-141B may be formed in the body 5-141A by in-mold molding. In some embodiments, the hardness of the metal part 5-141B may be greater than the hardness of the body 5-141A, thereby improving the overall structural strength of the frame 5-141. In this embodiment, the metal part 5-141B may be exposed in the protrusion 5-144 of the frame 5-141, and the exposed portion of the metal part 5-141B may be connected to the second connecting assembly 5-170 in any suitable manner (e.g., welding).

[0545] In addition, such as Figure 36 As shown, the buffer 5-200 can be disposed between the first segment 5-161 and the second segment 5-162 of the first connecting assembly 5-160 to provide cushioning between the first segment 5-161 and the second segment 5-162, reducing the probability of damage to the first connecting assembly 5-160. In this embodiment, the buffer 5-200 can be disposed on the first segment 5-161, but this disclosure is not limited thereto. In other embodiments, the buffer 5-200 can also be disposed on the second segment 5-162 (located between the first segment 5-161 and the second segment 5-162), or disposed on the connecting portion 5-163 (located between the connecting portion 5-163 and the frame 5-141). These embodiments are all covered within the scope of this disclosure. By configuring the buffer 5-200, the service life of the first connecting assembly 5-160 and / or the modal adjustment assembly 5-140 can be extended, or the noise generated during the operation of the modal adjustment assembly 5-140 can be reduced.

[0546] The circuit board 5-180 can generate or receive signals from the outside and transmit the signals to the drive assembly 5-190 (coil 5-191). The coil 5-191 and the magnetic element of the drive assembly 5-190 then form a driving force, driving the movable part 5-M to move relative to the fixed part 5-F. Since this driving force has a specific frequency, it induces resonance in the modal adjustment assembly 5-140 of the movable part 5-M, causing the modal adjustment assembly 5-140 to vibrate, thereby forming a vibration mode. In this way, the haptic feedback system 5-10 can achieve the function of generating haptic feedback. In some embodiments, the circuit board 5-180 can extend beyond the projection range of the frame 5-141 on the XY plane. For example, the circuit board 5-180 can be closer to the outer frame 5-130 (see figure) than the frame 5-141. Figure 34 However, this disclosure is not limited thereto.

[0547] For example, coil 5-191 can receive a first signal having a first frequency, and cause movable part 5-M to have a first vibration mode relative to fixed part 5-F. In this embodiment, the first frequency is the same as the frequency of the first vibration mode. More specifically, when movable part 5-M moves in the manner described in the first vibration mode, movable part 5-M (e.g., frame 5-141) can move relative to fixed part 5-F in a first dimension (e.g., along a direction generally parallel to the X-axis) (e.g., linear motion). Simultaneously, adjusting element 5-150 can move relative to frame 5-141 in a first motion mode, and the frequency of this first motion mode is approximately the same as the frequency of the first vibration mode. When adjusting element 5-150 moves relative to frame 5-141 in the manner described in the first motion mode, adjusting element 5-150 can move in a second dimension (e.g., along a direction generally parallel to the X-axis) (e.g., linear motion). When the movable part 5-M moves in the first vibration mode, there is a first phase difference between the movement of the frame 5-141 relative to the fixed part 5-F and the movement of the adjusting element 5-150 relative to the frame 5-141. For example, the frame 5-141 and the adjusting element 5-150 can simultaneously reach the extreme position in the positive X-axis direction (i.e., the farthest position they can reach in this direction relative to the center of the haptic feedback system 5-10), at which time the phase difference between the movement of the frame 5-141 and the movement of the adjusting element 5-150 can be approximately 0 degrees.

[0548] By configuring the modal adjustment component, the movable part 5-M can have a second vibration mode relative to the fixed part 5-F, wherein the frequency of the first vibration mode is different from the frequency of the second vibration mode. For example, the coil 5-191 can receive a second signal, wherein the second signal has a second frequency, and cause the movable part 5-M to have a second vibration mode relative to the fixed part 5-F. In this embodiment, the second frequency is the same as the frequency of the second vibration mode. When the movable part 5-M moves in the second vibration mode, the movable part 5-M moves relative to the fixed part 5-F in the aforementioned first dimension (e.g., along a direction approximately parallel to the X-axis). At this time, the adjustment element 5-150 moves relative to the frame 5-141 in a second motion mode, and the frequency of the second motion mode is the same as the frequency of the second vibration mode. When the adjustment element 5-150 moves relative to the frame 5-141 in the second motion mode, the adjustment element 5-150 moves in the second dimension (e.g., along a direction approximately parallel to the X-axis). When the movable part 5-M moves in the second vibration mode, there is a second phase difference between the movement of the frame 5-141 relative to the fixed part 5-F and the movement of the adjusting element 5-150 relative to the frame 5-141, and the first phase difference is different from the second phase difference. For example, when the frame 5-141 reaches the extreme position in the positive X-axis direction, the adjusting element 5-150 can reach the extreme position in the negative X-axis direction, at which time the phase difference between the movement of the frame 5-141 and the movement of the adjusting element 5-150 can be approximately 90 degrees. In some embodiments, the first phase difference and the second phase difference differ by more than 45 degrees, but this disclosure is not limited thereto.

[0549] In summary, because the movements of the frame 5-141 and the adjusting element 5-150 can have different phase differences, the moving part 5-M of the haptic feedback system 5-10 can generate different vibration modes, thereby achieving different types of haptic feedback effects. It should be understood that although the above embodiments illustrate two vibration modes, those skilled in the art to which this disclosure pertains should be able to derive other or more vibration modes based on the content of this disclosure, and any vibration mode achievable by the structure of this disclosure is covered within the scope of this disclosure.

[0550] Figure 37 A bottom view of the frame 5-141 of the modal adjustment assembly 5-140 according to some embodiments of the present disclosure is shown. Figure 37As shown, the frame 5-141 has grooves 5-146, 5-147, and 5-148, each for accommodating different components. In some embodiments, the drive assembly 5-190 may include a first magnetic element 5-192 and a pair of second magnetic elements 5-193, which can generate a driving force with the coil 5-191 to drive the mode adjustment assembly 5-140. In some embodiments, the magnetic pole directions of the first magnetic element 5-192 and the second magnetic element 5-193 may be different. For example, the magnetic pole direction of the first magnetic element 5-192 may be towards the negative Y-axis direction, while the magnetic pole direction of the second magnetic element 5-193 may be towards the positive Y-axis direction, but this disclosure is not limited thereto. For the sake of brevity, other magnetic pole configurations of the first magnetic element 5-192 and the second magnetic element 5-193 will not be listed separately, but all possible magnetic pole configurations are covered within the scope of this disclosure.

[0551] In this embodiment, the first magnetic element 5-192 is accommodated in the groove 5-146, while the second magnetic element 5-193 is accommodated in the groove 5-147. It should be noted that in some embodiments, the first magnetic element 5-192, the second magnetic element 5-193, and their corresponding grooves 5-146 and 5-147 are not completely sealed; that is, there may be a gap between the first magnetic element 5-192 and the groove 5-146 (e.g., at the corner of the groove 5-146), and a gap may be present between the second magnetic element 5-193 and the groove 5-147 (e.g., at the corner of the groove 5-147). This reduces the assembly difficulty of the first magnetic element 5-192 and the second magnetic element 5-193.

[0552] The modal adjustment assembly 5-140 also includes a counterweight 5-149. In some embodiments, the frame 5-141 (e.g., body 5-141A) and the counterweight 5-149 may be made of different materials. For example, the counterweight 5-149 may be made of a high-density alloy, such as a tungsten (W)-containing alloy or any other suitable material, while the body 5-141A of the frame 5-141 may be made of, for example, plastic or any other suitable material. The counterweight 5-149 allows for the configuration of a sufficiently large modal adjustment assembly 5-140 within a limited space, enabling the modal adjustment assembly 5-140 to operate in the desired vibration mode. The body 5-141A is selected from an easily machinable material, thereby allowing it to be fitted with the counterweight 5-149 to achieve the desired shape of the modal adjustment assembly 5-140. In this embodiment, the counterweight 5-149 is received in a recess 5-148. Similarly, the counterweight 5-149 and its corresponding groove 5-148 are not completely sealed; that is, there may be a gap between the counterweight 5-149 and the groove 5-148 (for example, at the corner of the groove 5-148). This reduces the difficulty of assembling the counterweight 5-149.

[0553] Figure 38 The haptic feedback system 5-10 according to some embodiments of the present disclosure is shown along... Figure 33 The sectional view shown is along line 5-A-5-A. (See figure.) Figure 38 As shown, a buffer 5-200 is provided around the adjusting element 5-150. For example, the buffer 5-200 may be provided on the surfaces of the outer frame 5-130, the base 5-120, and the frame 5-141 facing the adjusting element 5-150. In some embodiments, the buffer 5-200 may also be provided on the surface of the housing 5-110 facing the adjusting element 5-150, further reducing the probability of the adjusting element 5-150 colliding with surrounding components. In some embodiments, the thickness of the buffer 5-200 provided on the base 5-120 is greater than the thickness of the circuit board 5-180, and the thicknesses of the buffer 5-200 and the circuit board 5-180 may be measured, for example, in a direction generally parallel to the Z-axis. In this way, the probability of the circuit board 5-180 being impacted by the adjusting element 5-150 can be reduced.

[0554] In some embodiments, the metal part 5-141B of the frame 5-141 may partially overlap with the first magnetic element 5-192 in a direction generally parallel to the Z-axis. For example, the shortest distance between the metal part 5-141B and the first side surface 5-142 may be less than the shortest distance between the first magnetic element 5-192 and the first side surface 5-142, which may be measured in a direction, for example, parallel to the Y-axis, but this disclosure is not limited thereto. In some embodiments, the metal part 5-141B may completely overlap with the first magnetic element 5-192 in a direction generally parallel to the Z-axis. Furthermore, as Figure 38 As shown, the counterweight 5-149 can be set lower than the first magnetic element 5-192, and the counterweight 5-149 can be closer to the coil 5-191 than the first magnetic element 5-192.

[0555] Figure 39 A perspective view of adjusting elements 5-150 according to some embodiments of the present disclosure is shown. Figure 39 As shown, the support 5-151 of the adjusting element 5-150 includes a body 5-151A and a metal part 5-151B embedded in the body 5-151A. The metal part 5-151B can be formed in the body 5-151A by in-mold molding. In some embodiments, the hardness of the metal part 5-151B can be greater than the hardness of the body 5-151A, thereby improving the overall structural strength of the support 5-151. The support 5-151 has a recess 5-152, which is provided to accommodate a counterweight 5-155. Similarly, the counterweight 5-155 and the corresponding recess 5-152 are not completely sealed, that is, there may be a gap between the counterweight 5-155 and the recess 5-152 (e.g., at the corner of the recess 5-152). In some embodiments, the recess 5-152 may be configured to face the outer frame 5-130, that is, when viewed from the first surface 5-142 of the frame 5-141 toward the adjusting element 5-150, the recess 5-152 will not be visible. In some embodiments, an angled structure 5-153 may be provided on the outer edge of the recess 5-152. With the above configuration, the difficulty of setting the counterweight 5-155 can be reduced, but this disclosure is not limited thereto. In other embodiments, the angled structure 5-153 may be omitted, thereby reducing the difficulty of manufacturing the support 5-151.

[0556] Figure 40 The adjustment element 5-150 according to some embodiments of the present disclosure is shown along... Figure 35 The sectional view shown is along line 5-B-5-B. (See figure.) Figure 40As shown, the second connecting assembly 5-170 further includes an extension 5-174 connected to the second segment 5-172. In this embodiment, the metal part 5-151B may be partially exposed within the body 5-151A, and the exposed portion of the metal part 5-151B may be connected to the extension 5-174 of the second connecting assembly 5-170 in any suitable manner (e.g., welding). Furthermore, in this cross-sectional view, the metal part 5-151B may have a non-linear profile within the support 5-151. More specifically, the metal part 5-151B may be located at a higher position (compared to the exposed portion of the metal part 5-151B) corresponding to the counterweight 5-155 and may be covered by the body 5-151A. In some embodiments, a portion of the metal part 5-151B corresponding to the counterweight 5-155 and another portion of the metal part 5-151B not corresponding to the counterweight 5-155 are located on different planes. In this way, the structural strength of the bearing seat 5-151 can be increased to support the weight of the counterweight 5-155.

[0557] In summary, this disclosure provides a haptic feedback system with different vibration modes. By configuring the modal adjustment component, the moving part can have vibration modes with different frequencies relative to the fixed part. Because the drive component receives signals of different frequencies, the movement of the frame and adjustment element of the modal adjustment component has different phase differences, thereby achieving different vibration modes. Furthermore, by providing multiple buffers around the range of motion of the moving part, the service life of the haptic feedback system can be extended, or the noise generated during the operation of the haptic feedback system can be reduced.

[0558] Sixth Embodiment

[0559] First, please refer to Figures 41 to 43 . Figure 41 This is a perspective view of a haptic feedback system 6-1 according to an embodiment of the present disclosure. Figure 42 An exploded view of a haptic feedback system 6-1 according to an embodiment of the present disclosure. Figure 43 For along Figure 41 A cross-sectional view of the haptic feedback system cut along line segment 6-A-6-A. The haptic feedback system 6-1 can be widely installed in various devices, such as smartphones, wearable devices, game controllers, game consoles, tablets, etc., allowing the device to use the vibration of the haptic feedback system 6-1 as information feedback. The haptic feedback system 6-1 includes a fixed part 6-100, a movable part 6-200, a connecting component 6-300, a driving component 6-400, a circuit component 6-500, a sensing component 6-600, multiple buffer elements 6-700, and multiple damping elements 6-800.

[0560] The fixing part 6-100 is fixedly connected to any of the above-described devices, including a top cover 6-110 and a base 6-120. The top cover 6-110 has a first surface 6-111, a second surface 6-112, a third surface 6-113, a fourth surface 6-114, and a top surface 6-115. The first surface 6-111 and the third surface 6-113 are opposite each other, and the second surface 6-112 and the fourth surface 6-114 are opposite each other. The top surface 6-115 is rectangular, with a length 6-L and a width 6-W. The first surface 6-111, the second surface 6-112, the third surface 6-113, and the fourth surface 6-114 have a height 6-H, extending from the top surface 6-115 along a first direction 6-D1 towards the base 6-120. The height 6-H is less than the length 6-L and the width 6-W, forming a flat structure to facilitate the miniaturization of the device.

[0561] The movable part 6-200 is movable relative to the fixed part 6-100 along a first modal direction 6-Dr1 and a second modal direction 6-Dr2, and is movably connected to the fixed part 6-100 via a connecting assembly 6-300. The movable part 6-200 includes a main body 6-210 and a plurality of counterweight elements 6-220. The main body 6-210 is disposed inside the upper cover 6-110 and has a first side 6-211, a second side 6-212, a third side 6-213, a fourth side 6-214, a first recess 6-215, a second recess 6-216, a first receiving part 6-217, and a plurality of second receiving parts 6-218. The first side 6-211, the second side 6-212, the third side 6-213, and the fourth side 6-214 are respectively opposite to the first surface 6-111, the second surface 6-112, the third surface 6-113, and the fourth surface 6-114.

[0562] The first recess 6-215 is recessed from the first side 6-211 along a second direction 6-D2 away from the first surface 6-111. The second recess 6-216 is recessed from the third side 6-213 along the second direction 6-D2 away from the third surface 6-113. The first receiving portion 6-217 and a plurality of second receiving portions 6-218 penetrate the movable portion 6-200 along the first direction 6-D1. When viewed along a third direction 6-D3, the first receiving portion 6-217 and the plurality of second receiving portions 6-218 at least partially overlap. The second direction 6-D2 is perpendicular to the first direction 6-D1, and the third direction 6-D3 is perpendicular to both the first direction 6-D1 and the second direction 6-D2.

[0563] Multiple counterweight elements 6-220 are respectively disposed in multiple second receiving portions 6-218. The multiple counterweight elements 6-220 and the main body 6-210 are made of different materials. For example, the counterweight elements 6-220 may be made of high-density metal, such as a tungsten (W) alloy or any other suitable material, while the main body 6-210 may be made of, for example, plastic or any other suitable material. By arranging the counterweight elements 6-220, sufficient mass can be configured within a limited space, enabling the moving part 6-200 to operate in the desired vibration mode, thereby enhancing the vibration feedback felt by the user.

[0564] The connecting assembly 6-300 includes a first elastic element 6-310 and a second elastic element 6-320. The first elastic element 6-310 has a first segment 6-311, a second segment 6-312, a third segment 6-313, a first bending portion 6-314, a second bending portion 6-315, a first connecting portion 6-316, and a second connecting portion 6-317. The first segment 6-311 is connected to the second segment 6-312 via the first bending portion 6-314, and the second segment 6-312 is connected to the third segment 6-313 via the second bending portion 6-315. The first connecting portion 6-316 connects the first segment 6-311 to the fixed portion 6-100, and the second connecting portion 6-317 connects the third segment 6-313 to the movable portion 6-200.

[0565] The first segment 6-311, the second segment 6-312, and the third segment 6-313 are not parallel to each other. The first bent segment 6-314 has a first bending angle 6-θ1, and the second bent segment 6-315 has a second bending angle 6-θ2. The first segment 6-311 has a first length, the second segment 6-312 has a second length, and the third segment 6-313 has a third length. In some embodiments, the first bending angle 6-θ1 is smaller than the second bending angle 6-θ2, the first length is greater than the second length, and the third length is greater than the second length, but this is not limited to these and can be changed as needed.

[0566] The second elastic element 6-320 has the same structure as the first elastic element 6-310, including a first segment 6-321, a second segment 6-322, a third segment 6-323, a first bending portion 6-324, a second bending portion 6-325, a first connecting portion 6-326, and a second connecting portion 6-327. When viewed along the first direction 6-D1, the first elastic element 6-310 and the second elastic element 6-320 are symmetrically arranged.

[0567] More specifically, the first connecting portion 6-316 of the first elastic element 6-310 is connected to the fourth surface 6-114 of the upper cover 6-110, the second connecting portion 6-317 of the first elastic element 6-310 is connected to the third surface 6-113 of the upper cover 6-110, and the first connecting portion 6-326 of the second elastic element 6-320 is connected to the second surface 6-112 of the upper cover 6-110, and the second connecting portion 6-327 of the second elastic element 6-320 is connected to the first surface 6-111 of the upper cover 6-110. The first segment 6-311 and the second segment 6-312 of the first elastic element 6-310 are disposed between the fourth surface 6-114 of the upper cover 6-110 and the fourth side 6-214 of the movable part 6-200. The third segment 6-313 of the first elastic element 6-310 is disposed between the third surface 6-113 of the upper cover 6-110 and the second recess 6-216 of the movable part 6-200. The first segment 6-321 and the second segment 6-322 of the second elastic element 6-320 are disposed between the second surface 6-112 of the upper cover 6-110 and the second side 6-212 of the movable part 6-200. The third segment 6-323 of the second elastic element 6-320 is disposed between the first surface 6-111 of the upper cover 6-110 and the first recess 6-215 of the movable part 6-200.

[0568] In some embodiments, at least one of the first segments 6-311, 6-321 and the second segments 6-312, 6-322 of the first elastic element 6-310 and the second elastic element 6-320 is provided with a hollow pattern 6-P. For example, in this embodiment, the first segments 6-311, 6-321 and the second segments 6-312, 6-322 are all provided with the hollow pattern 6-P, thereby adjusting the resonant frequency and vibration response of the first elastic element 6-310 and the second elastic element 6-320.

[0569] Next, please refer to Figures 41 to 44 . Figure 44This is a schematic diagram of some components of a haptic feedback system 6-1 according to an embodiment of the present disclosure. A driving assembly 6-400 drives a movable part 6-200 to move relative to a fixed part 6-100 by a driving force, wherein a driving direction 6-Df of the driving force differs from both a first modal direction 6-Dr1 and a second modal direction 6-Dr2, as will be described in detail later. The driving assembly 6-400 includes a driving magnet assembly 6-410, a driving coil assembly 6-420, and a magnetic guide plate 6-430. The driving magnet assembly 6-410 is disposed in a first receiving portion 6-217 of the movable part 6-200, and the driving coil assembly 6-420 is disposed in a base 6-120 of the fixed part 6-100 and is partially received in the first receiving portion 6-217. When viewed along the first direction 6-D1, the driving magnet assembly 6-410 and the driving coil assembly 6-420 do not overlap.

[0570] The driving magnet assembly 6-410 includes at least two magnetic elements 6-411, symmetrically arranged on the two inner walls of the first receiving portion 6-217. Each of the two magnetic elements 6-411 includes at least three magnetic units 6-411A, such as... Figure 44 As shown, Figure 44 This is a schematic diagram showing the configuration of multiple magnetic units 6-411A and drive coil group 6-420 disposed within magnetic element 6-411. The multiple magnetic units 6-411A are arranged along a third direction 6-D3. The magnetic pole directions of any two adjacent magnetic units 6-411A are different.

[0571] The drive coil assembly 6-420 includes a first coil 6-421, a second coil 6-422, and a magnetic element 6-423. The first coil 6-421 and the second coil 6-422 are wound around the magnetic element 6-423. The magnetic element 6-423 has a shaft portion 6-423A and a separator portion 6-423B. The shaft portion 6-423A extends along a third direction 6-D3, and the separator portion 6-423B separates the first coil 6-421 from the second coil 6-422. A first winding direction 6-Dw1 of the first coil 6-421 and a second winding direction 6-Dw2 of the second coil 6-422 are different. For example, in some embodiments, one of the first coil 6-421 and the second coil 6-422 is wound clockwise around the shaft portion 6-423A, while the other is wound counterclockwise around the shaft portion 6-423A. By configuring the magnetic unit 6-411A with the first coil 6-421 and the second coil 6-422, the magnetic field along the third direction 6-D3 can be made stronger, thereby increasing the driving force along the third direction 6-D3 and enhancing the vibration amplitude.

[0572] The magnetic guide plate 6-430 has a rectangular shape and is disposed between the movable part 6-200 and the top surface 6-115 of the upper cover 6-110. It is used for magnetic conduction and can also serve as a support surface for the movable part 6-200 relative to the upper cover 6-110. By providing the magnetic guide plate 6-430, the magnetic field can be increased, thereby increasing the driving force and thus improving the vibration amplitude. Furthermore, it makes the assembly of the drive magnet assembly 6-410 and the counterweight element 6-220 easier. When viewed along the first direction 6-D1, the magnetic guide plate 6-430 overlaps with the drive magnet assembly 6-410.

[0573] Circuit assembly 6-500 and position sensing assembly 6-600 are used to perform closed-loop control of moving part 6-200. Circuit assembly 6-500 includes a circuit board 6-510 and multiple IC components 6-520 disposed on the circuit board 6-510 (for simplicity, ...). Figure 42 Only one IC component 6-520 is shown. A circuit board 6-510 is disposed on the base 6-120 of the fixed portion 6-100. A sensing component 6-600 is connected to the circuit board 6-510 and senses the movement of the movable portion 6-200 relative to the fixed portion 6-100. This component includes a reference element 6-610 and a position sensing element 6-620. In this embodiment, the reference element 6-610 is a magnetic element disposed on the movable portion 6-200. The position sensing element 6-620, for example, can be a Hall effect sensor, a magnetoresistive sensor, or a fluxgate sensor, disposed on the circuit board 6-510 to sense the magnetic field of the reference element 6-610 disposed on the movable portion 6-200, thereby obtaining the position of the movable portion 6-200 relative to the fixed portion 6-100. When viewed along the first direction 6-D1, the reference element 6-610 and the position sensing element 6-620 at least partially overlap.

[0574] Please refer to the following: Figure 42 , Figure 43 as well as Figure 45 . Figure 45 This is a schematic diagram of some components of a haptic feedback system 6-1 according to an embodiment of the present disclosure. Multiple buffer elements 6-700, including gel or damping oil, are disposed between the fixed portion 6-100 and the movable portion 6-200 to reduce impact damage or noise generated when the haptic feedback system 6-1 operates. For example, when viewed along a first direction 6-D1, the first receiving portion 6-217 of the movable portion 6-200 is rectangular, and four of the multiple buffer elements 6-700 can be disposed at the four corners of the first receiving portion 6-217 to prevent the movable portion 6-200 from directly impacting the drive coil assembly 6-420 disposed on the fixed portion 6-100.

[0575] Furthermore, by providing a first recess 6-215 and a second recess 6-216, a buffer distance is provided between the connecting assembly 6-300 and the movable part 6-200. The two corners of the movable part 6-200 near the connecting assembly 6-300 are designed as non-right angles, so that one of the multiple buffer elements 6-700 is located between the first recess 6-215 and / or the second recess 6-216 of the movable part 6-200 and the connecting assembly 6-300 (the two corners mentioned above). This can prevent the movable part 6-200 from impacting the connecting assembly 6-300 and causing the connecting assembly 6-300 to break.

[0576] Multiple damping elements 6-800 may include gel or damping oil, etc., to accelerate the response speed of the haptic feedback system 6-1, enabling the haptic feedback system 6-1 to achieve rapid start-up and rapid stop. The multiple damping elements 6-800 are disposed between the fixed part 6-100 and the movable part 6-200. For example, at least one of the multiple damping elements 6-800 may be disposed between the movable part 6-200 and the base plate. Furthermore, at least one of the multiple damping elements 6-800 may be disposed between the movable part 6-200 and the first coil 6-421 (and / or the second coil 6-422) of the drive assembly 6-400.

[0577] Next, refer to Figure 43 The operation of the haptic feedback system 6-1 is explained. The movable part 6-200 has a first natural frequency (more specifically, the combination of the movable part 6-200 and the connecting component 6-300 has a first natural frequency). When the driving component 6-400 drives the movable part 6-200 at a first excitation frequency, and the first excitation frequency is equal to the first natural frequency, the movable part 6-200 has a first vibration mode relative to the fixed part 6-100, and moves along the first mode direction 6-Dr1.

[0578] Furthermore, the movable part 6-200 has a second natural frequency (more specifically, the combination of the movable part 6-200 and the connecting component 6-300 has a second natural frequency). When the driving component 6-400 drives the movable part 6-200 at a second excitation frequency, and the second excitation frequency is equal to the second natural frequency, the movable part 6-200 has a second vibration mode relative to the fixed part 6-100, and moves along the second mode direction 6-Dr2.

[0579] As mentioned earlier, the mass of the movable part 6-200 can be changed by altering the counterweight element 6-220, or by changing the hollow pattern 6-P or its thickness in the connecting component 6-300, thereby changing the natural frequency of the combination of the movable part 6-200 and the connecting component 6-300. In this embodiment, the aforementioned variables are controlled so that the first modal direction 6-Dr1 and the second modal direction 6-Dr2 are different and not parallel. More specifically, the first modal direction 6-Dr1 and the second modal direction 6-Dr2 are perpendicular to the first direction 6-D1. Furthermore, in this embodiment, the driving direction Df is perpendicular to the first direction 6-D1, and the driving direction 6-Df is neither parallel nor perpendicular to the first modal direction 6-Dr1 and the second modal direction 6-Dr2.

[0580] During movement, the movable part 6-200 is subjected to two forces: a driving force, generated by the interaction of the magnetic fields between the driving magnet assembly 6-410 in the movable part 6-200 and the driving coil assembly 6-420 in the fixed part 6-100; and a restoring force from the first elastic element 6-310 and the second elastic element 6-320, which is the restoring force generated by the bending deformation of the first elastic element 6-310 and the second elastic element 6-320 under the traction of the movable part 6-200.

[0581] In this embodiment, through the structural design of the first elastic element 6-310 and the second elastic element 6-320, namely, the first elastic element 6-310 and the second elastic element 6-320 have first segments 6-311, 6-321, second segments 6-312, 6-322 and third segments 6-313, 6-323 extending in different directions, the bending deformation of the first elastic element 6-310 and the second elastic element 6-320 caused by the traction of the movable part 6-200 has a deformation component not only in the direction parallel to the driving force but also in the direction perpendicular to the driving force. Therefore, when the driving component 6-400 applies a driving force to the movable part 6-200, even though the driving direction 6-Df of the driving force is not along the first modal direction 6-Dr1 or the second modal direction 6-Dr2, the movable part 6-200 can still move along the first modal direction 6-Dr1 at the first excitation frequency and along the second modal direction 6-Dr2 at the second excitation frequency through the structure of the connecting component 6-300. This achieves the effect of generating vibrations in multiple directions with only one haptic feedback system 6-1, thereby enhancing the functionality of the device, reducing its weight, and lowering its cost.

[0582] Furthermore, the extension lengths of the first segments 6-311, 6-321, the second segments 6-312, 6-322, and the third segments 6-313, 6-323, as well as the first bending angle 6-θ1 and the second bending angle 6-θ2, can also affect the vibration amplitude components of the movable part 6-200 in the second direction 6-D2 and the third direction 6-D3. By changing the lengths and angles between the segments, the haptic feedback system 6-1 can meet the vibration amplitude components in different directions required by the device, thereby achieving the effect of product customization.

[0583] In summary, this disclosure provides a haptic feedback system disposed in a device, including a fixed part, a movable part, a connecting component, and a driving component. The fixed part is fixedly connected to the device. The movable part is movable relative to the fixed part along a first modal direction and a second modal direction. The movable part is movably connected to the fixed part via the connecting component. The driving component drives the movable part to move relative to the fixed part by a driving force. The haptic feedback system of this disclosure can realize that the movable part can move along the first modal direction or the second modal direction by a driving force along the same driving direction.

[0584] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently in development or to be developed in the future can be understood from the disclosure of this invention, and can be used according to the present invention as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0585] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A haptic feedback system, installed in an electronic device, the haptic feedback system comprising: A fixing part is fixed to the electronic device; A movable part that can move relative to the fixed part; A drive assembly is used to drive the moving part relative to the fixed part to move and generate a feedback force; as well as A control unit is used to output a control signal to the drive assembly, thereby driving the movable part to move relative to the fixed part through the drive assembly; The electronic device includes a central processing unit and a sensing module, wherein the sensing module is located outside the haptic feedback system and is used to output a first sensing signal to the central processing unit. The central processing unit outputs a command signal to the control unit to adjust the control unit to a specific control mode. The sensing module also outputs a second sensing signal to the control unit, and the second sensing signal does not pass through the central processing unit; An external measuring device generates a first relationship curve of motion information of the movable part relative to the second sensing signal by measuring the motion of the movable part and the second sensing signal, wherein the second sensing signal is generated by the sensing module in response to the motion of the movable part; The external measuring device adjusts a characteristic parameter of the control unit according to the first relationship curve.

2. The haptic feedback system as claimed in claim 1, wherein the sensing module is disposed on a plate-shaped member of the electronic device, and the fixing part is fixedly connected to the plate-shaped member, wherein the haptic feedback system is electrically connected to the sensing module via a circuit component, and the circuit component is disposed on the plate-shaped member.

3. The haptic feedback system as claimed in claim 1, further comprising a sensing element disposed within or on the fixed portion, for sensing the movement of the movable portion and outputting a third sensing signal to the control unit, wherein the control unit outputs the control signal based on the second and third sensing signals, and the sensing element is disposed within the fixed portion.

4. The haptic feedback system of claim 3, wherein the external measuring device further generates a second relationship curve of motion information of the movable part relative to the third sensing signal by measuring the motion of the movable part and the third sensing signal, wherein the third sensing signal is generated by the sensing element in response to the motion of the movable part.

5. The haptic feedback system of claim 3, wherein the sensing element comprises a Hall effect sensor.

6. The haptic feedback system as claimed in claim 1, wherein the central processing unit outputs the instruction signal to the control unit according to the first sensing signal, and the control unit outputs the drive signal to the drive component according to the instruction signal.

7. The haptic feedback system of claim 6, wherein the control unit outputs the control signal to the drive component according to the instruction signal and the second sensing signal.

8. The haptic feedback system as claimed in claim 1, wherein the haptic feedback system performs closed-loop control of the movement of the movable part based on the second sensing signal.

9. The haptic feedback system as claimed in claim 1, wherein when the second sensing signal meets a first preset condition, the control unit drives the movable part to move in a first mode via the driving component, and when the second sensing signal meets a second preset condition, the control unit drives the movable part to move in a second mode via the driving component.

10. The haptic feedback system of claim 1, wherein the driving component includes a coil disposed on the fixed portion and a magnet disposed on the movable portion.

11. The haptic feedback system of claim 1, wherein the sensing module constitutes at least a portion of a user interface of the electronic device.

12. The haptic feedback system of claim 1, wherein the second sensing signal is different from the first sensing signal.

13. The haptic feedback system of claim 1, wherein the second sensing signal is the same as the first sensing signal.

14. The haptic feedback system of claim 1, wherein the fixed part, the movable part, and the driving component constitute at least a portion of a linear resonant actuator within the electronic device.

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