Method of controlling a semiconductor process apparatus and semiconductor process apparatus

Abstract

The application discloses a control method of a semiconductor process equipment and the semiconductor process equipment, and belongs to the technical field of semiconductor equipment. The control method comprises the following steps: S1, recording process history information of each wafer; S2, when the processing process of the wafer is interrupted, judging whether the wafer needs to be cooled according to the process history information; and S3, in response to a one-key return instruction, transmitting the wafer needing to be cooled to a cooling chamber to perform a cooling process, and transmitting the wafer after being cooled to a wafer storage device. The control method can solve the problem that the efficiency and accuracy of checking whether each wafer needs to be cooled after the wafer processing process is abnormally stopped are low.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, specifically relating to a control method for semiconductor process equipment and semiconductor process equipment. Background Technology

[0002] In semiconductor manufacturing processes, high-temperature chambers are typically used to process wafers. The temperature within these chambers can reach approximately 400°C. After a certain period of time in the high-temperature chamber, the wafer's own temperature can also reach between 300 and 400°C due to thermal radiation and other factors. If the wafer is directly transferred back to the wafer storage device without cooling, its high temperature can easily cause it to attract impurities and become unusable. Furthermore, it can damage the wafer storage device and other wafers, rendering them unusable as well. Therefore, wafers that have passed through the high-temperature chamber must undergo a cooling process before being transferred back to the wafer storage device.

[0003] However, in actual manufacturing processes, when a process is halted due to an anomaly and a large number of wafers need to be transferred back to the wafer storage device, the one-click transfer function cannot be used because a cooling process is required. Furthermore, it is necessary to trace the process path already performed on each wafer to determine if cooling is needed, transfer the wafers requiring cooling to the cooling chamber, and then transfer them back to the wafer storage device. This process requires manual inspection of each wafer individually, which is inefficient and time-consuming. At the same time, manual inspection is prone to errors and cannot ensure the comprehensiveness and accuracy of the inspection. Summary of the Invention

[0004] The purpose of this application is to provide a control method and semiconductor process equipment that can solve the problem of low efficiency and accuracy in checking whether each wafer needs cooling after the wafer processing process has stopped due to an abnormality.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a method for controlling semiconductor process equipment, including:

[0007] Step S1: Record the process history information for each wafer;

[0008] Step S2: When the wafer processing is interrupted, determine whether each wafer needs cooling based on the process history information;

[0009] Step S3: In response to the one-click return command, the wafer that needs to be cooled is transferred to the cooling chamber for cooling, and the cooled wafer is transferred to the wafer storage device.

[0010] Secondly, embodiments of this application also provide a semiconductor process apparatus. Applying the above-described control method, the semiconductor process apparatus includes a high-temperature chamber, a cooling chamber, a transfer device, and a wafer storage device. The transfer device is used to move each wafer between the cooling chamber, the high-temperature chamber, and the wafer storage device. The semiconductor process apparatus further includes:

[0011] A recording module is used to record the process history information of each wafer.

[0012] The judgment module is used to determine whether each wafer needs cooling based on the process history information when the wafer processing is interrupted.

[0013] The control module is used to respond to a one-key return command, control the transmission device to transfer the wafer that needs to be cooled to the cooling chamber for cooling, and control the transmission device to transfer the cooled wafer to the wafer storage device.

[0014] In this embodiment, the process history information of each wafer can be recorded during the manufacturing process. When the semiconductor process equipment is interrupted, the process history information of each wafer recorded before the interruption is used to determine whether each wafer needs cooling. Then, in response to a one-click data transfer command, the wafers requiring cooling are transferred to the cooling chamber for cooling, and the cooled wafers are transferred to the wafer storage device. This process eliminates the need for manual inspection and identification of each wafer, thereby improving inspection efficiency and saving labor costs. In addition, by tracking and recording the process history information throughout the entire process for inspection and identification, the comprehensiveness and accuracy of the inspection are improved. Therefore, this embodiment can solve the problem of low efficiency and accuracy in checking whether each wafer needs cooling after the wafer processing process is abnormally stopped. Attached Figure Description

[0015] Figure 1 This is a schematic flowchart of the control method for semiconductor process equipment disclosed in the embodiments of this application;

[0016] Figure 2 and Figure 3 These are partial flowcharts illustrating the control methods for semiconductor process equipment disclosed in different embodiments of this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] The control method and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0020] This application discloses a semiconductor process apparatus, which includes a high-temperature chamber, a cooling chamber, a transfer device, and a wafer storage device. The transfer device is connected to the high-temperature chamber, the cooling chamber, and the wafer storage device, respectively, and is used to move each wafer between the cooling chamber, the high-temperature chamber, and the wafer storage device. The high-temperature chamber can specifically be a preheating chamber, a process chamber, etc., to perform preheating, thin film deposition, and other processes on each wafer. During these processes, the temperature inside the high-temperature chamber is relatively high, resulting in a relatively high temperature for the wafer. The cooling chamber can reduce the temperature of each wafer, thereby facilitating wafer transfer and storage. Optionally, the transfer device can be a structure capable of moving wafers, such as a robotic arm. Optionally, this semiconductor process apparatus can be a PVD (Physical Vapor Deposition) apparatus; no specific limitation is made here.

[0021] like Figure 1 As shown in the embodiments of this application, a control method for semiconductor process equipment is disclosed. This control method can be applied to batch wafer fabrication processes, and includes:

[0022] S100 records the process history information for each wafer.

[0023] The process history information here refers to the chambers and process flows that each wafer experiences. Specifically, it includes information such as whether each wafer enters a high-temperature chamber, whether the process is completed within that chamber, whether it enters a cooling chamber, and whether cooling is completed there. In other words, when the chambers and process flows that each wafer experiences change, the process history information can be updated. It's important to note that each wafer entering the semiconductor processing equipment carries a unique ID (Identity Document). The semiconductor processing equipment uses these IDs to record the process history information of each wafer, thereby achieving the purpose of full-process tracking and monitoring.

[0024] S200. When the wafer processing is interrupted, determine whether each wafer needs cooling based on the process history information.

[0025] When a semiconductor process is interrupted due to a malfunction or other abnormal situation, the process history information of each wafer recorded before the interruption can be used to determine whether each wafer needs cooling. This eliminates the need for manual inspection and identification of each wafer individually, thereby improving the efficiency and accuracy of the inspection.

[0026] Optionally, the semiconductor process equipment also includes an alarm device. When a malfunction in the semiconductor process equipment causes an interruption in the wafer processing, the alarm device issues an alarm message, thereby reminding the user to initiate an operation to check whether each wafer needs cooling. This allows the user to promptly detect the malfunction and initiate the inspection operation as soon as possible. While manual observation is also possible, this method is less labor-intensive than using an alarm device. The user can trigger the step of checking whether each wafer needs cooling by operating buttons or other means.

[0027] S300, in response to a one-key return command, transfers the wafer that needs to be cooled to the cooling chamber for cooling, and then transfers the cooled wafer to the wafer storage device.

[0028] The one-click data transfer command here can be issued by the user. With a single operation, the user can trigger operations such as inspection, transfer, and cooling for each wafer in a batch. For wafers that have undergone high-temperature processing in the high-temperature chamber but have not been cooled, the transfer device can transport these wafers to the cooling chamber for cooling. Optionally, the wafers in this step specifically include wafers that have not passed through the high-temperature chamber and wafers that have passed through the high-temperature chamber but have not been cooled; no specific limitation is made here.

[0029] Wafers processed in a high-temperature chamber and cooled in a cooling chamber not only ensure their own safety, but also prevent them from affecting the wafer storage device and other wafers stored in the device after being transferred to the wafer storage device.

[0030] This application records the process history information of each wafer during the manufacturing process. When the semiconductor process equipment is interrupted, it determines whether each wafer needs cooling based on the recorded process history information before the interruption. Then, in response to a one-click data transfer command, the wafers requiring cooling are transferred to the cooling chamber for cooling, and the cooled wafers are transferred to the wafer storage device. This process eliminates the need for manual inspection of each wafer, thereby improving inspection efficiency and saving labor costs. Furthermore, by tracking and recording the process history information throughout the entire process, the comprehensiveness and accuracy of the inspection are improved. Therefore, the embodiments of this application can solve the problem of low efficiency and accuracy in checking whether each wafer needs cooling after the wafer processing process is abnormally stopped.

[0031] In one optional embodiment, the process history information includes cooling instruction information for determining whether the wafer needs cooling. This cooling instruction information can correspond to different values, allowing the value to be updated at any time during the process to represent the changes in the process flow experienced by each wafer. In other words, the cooling instruction information directly characterizes whether each wafer needs cooling; by calling this cooling instruction information, it can be quickly determined whether each wafer needs cooling. At this time, such as Figure 2 As shown, step S100 specifically includes:

[0032] S110, Obtain the type of the chamber where the wafer is currently located.

[0033] The type of chamber in which the wafer is currently located can specifically include a high-temperature chamber and a cooling chamber.

[0034] S120. When the current chamber of the wafer is a high-temperature chamber, generate the first cooling command information that needs to be cooled.

[0035] Because the temperature inside the high-temperature chamber is high, when the wafer is inside the high-temperature chamber, the temperature of the wafer itself is high due to thermal radiation and other reasons. Therefore, as soon as the wafer enters the high-temperature chamber, it means that the wafer needs to be cooled down after it is output from the high-temperature chamber. At this time, the cooling command information can be updated to the first cooling command information.

[0036] Step S200, which determines whether each wafer needs cooling based on process history information, specifically includes:

[0037] S210. When the cooling command information is the first cooling command information, the wafer needs to be cooled.

[0038] As mentioned earlier, once the wafer is located in a high-temperature chamber, a first cooling command message can be generated. This first cooling command message can specifically correspond to the case where the wafer has already completed the processing in the high-temperature chamber, or it can correspond to the case where the wafer has not completed the processing in the high-temperature chamber. There is no specific limitation here. As long as the wafer has passed through the high-temperature chamber, it needs to be cooled down before it can be transferred to the wafer storage device, thereby ensuring the safety of the wafer and the wafer storage device and other wafers in the wafer storage device.

[0039] In a further optional embodiment, step S100 further includes:

[0040] S130. When the current chamber of the wafer is a cooling chamber, determine whether the cooling process has been completed.

[0041] If the wafer is inside a cooling chamber, the cooling process may not have started yet, or only partially started, or the cooling process may have been completed but the wafer has not been moved out of the cooling chamber. In the cases where the cooling process has not started yet or only partially started, the wafer needs to be cooled if the wafer processing is interrupted. However, in the cases where the cooling process has been completed but the wafer has not been moved out of the cooling chamber, the wafer does not need to be cooled if the wafer processing is interrupted.

[0042] S140. When the cooling process is completed, a second cooling instruction message is generated that does not require cooling.

[0043] As mentioned above, when a wafer is in the cooling chamber, the cooling process may have been completed but the wafer has not been transferred out of the cooling chamber. In this case, the wafer does not need to undergo the cooling process again, so it can be directly transferred to the wafer storage device to avoid repeated cooling and waste of resources.

[0044] Step S200, which involves determining whether each wafer requires cooling based on process history information, also includes:

[0045] S220. When the cooling command information is the second cooling command information, the wafer does not need to be cooled.

[0046] When the cooling instruction information is the second cooling instruction information, the wafer does not need to be cooled, thus avoiding resource waste. This embodiment updates the cooling instruction information to the second instruction information, allowing for a faster determination of whether each wafer needs cooling, thereby improving the efficiency of the determination.

[0047] In a further optional embodiment, step S100 further includes:

[0048] S150. When the cooling process has not been completed, generate the first cooling instruction information pointing to the area that needs to be cooled.

[0049] As described above, when a wafer is in a cooling chamber, the cooling process may only be partially completed. If the processing is interrupted, the unfinished cooling process needs to be continued to cool the wafer further and meet storage requirements. This embodiment updates the cooling instruction information to the first instruction information, allowing for a faster determination of whether each wafer needs cooling, thus improving efficiency.

[0050] In one alternative embodiment, such as Figure 2 As shown, step S100 may specifically include:

[0051] S101. Obtain the type of the chamber where the wafer is currently located.

[0052] S102. Determine whether the current chamber of the wafer is a high-temperature chamber. If it is, proceed to step S105; otherwise, proceed to step S103.

[0053] S103. Determine whether the current chamber of the wafer is a cooling chamber. If it is, proceed to step S104; otherwise, end.

[0054] S104. Determine whether the cooling process has been completed. If yes, proceed to step S106; otherwise, proceed to step S105.

[0055] S105. Generate the first cooling command information that needs to be cooled.

[0056] S106. Generate a second cooling instruction message that does not require cooling.

[0057] The above steps can record the process history information of each wafer more comprehensively. When the chamber where each wafer is located and the process it undergoes changes, the cooling command information can be updated in a timely manner, so that when the processing is interrupted, the cooling command information can be used to accurately and quickly determine whether each wafer needs cooling.

[0058] The number of cooling chambers can be one. In another optional embodiment, the number of cooling chambers is at least two, including a first cooling chamber and a second cooling chamber. Optionally, the structures of the first cooling chamber and the second cooling chamber can be the same or different; no specific limitation is made here. The above control method also includes:

[0059] S400, display chamber configuration interface.

[0060] Optionally, the semiconductor process equipment has a display panel on which a chamber configuration interface is displayed for user operation. The chamber configuration interface may include options for a first cooling chamber and options for a second cooling chamber. Furthermore, after step S200 is completed, all wafers requiring cooling can be automatically identified, and the chamber configuration interface can also display the ID name of each wafer requiring cooling for user selection.

[0061] S500: Determine whether the user has entered chamber configuration information on the chamber configuration interface.

[0062] After a user selects the ID of a wafer, they can choose a corresponding cooling chamber. This cooling chamber can be the first cooling chamber, the second cooling chamber, or other cooling chambers, depending on the user's needs. There are no specific restrictions here. Alternatively, a user can select a cooling chamber and then choose the corresponding wafer.

[0063] Step S300, which involves transferring the wafer requiring cooling to the cooling chamber for cooling, specifically includes:

[0064] S310. When chamber configuration information exists, the wafer that needs to be cooled is transferred to the cooling chamber corresponding to the chamber configuration information.

[0065] When a user selects a cooling chamber for a wafer or a wafer for a cooling chamber on the chamber configuration interface, it means that the user has completed the chamber configuration operation. At this time, the control module of the semiconductor process equipment transmits the wafer to the cooling chamber corresponding to the chamber configuration information according to the chamber configuration information, thereby executing the cooling process.

[0066] Since each cooling chamber can only cool one wafer at a time, when there are many wafers, there may be a large number of wafers waiting to be cooled. Therefore, this embodiment sets up at least two cooling chambers to cool at the same time, thereby speeding up the cooling efficiency and avoiding the accumulation of wafers waiting to be cooled.

[0067] In a further optional embodiment, the above control method further includes:

[0068] S600: When the user does not enter chamber configuration information on the chamber configuration interface, the first prompt message is output.

[0069] Optionally, if no user input of chamber configuration information is detected after the chamber configuration interface has displayed the first preset time, it means that the chamber configuration operation is not complete, and subsequent cooling operations cannot be performed. The first preset time can be flexibly selected, and this embodiment does not limit it. The first prompt information can be an audible and visual alarm or a display reminder; there are no specific limitations on this.

[0070] If the user does not enter the chamber configuration information on the chamber configuration interface, the semiconductor process equipment will output the first prompt message to remind the user to enter the specific chamber configuration information, so as to configure the specific cooling process conditions for the wafer, so that the cooled wafer can better meet the requirements of the wafer storage device.

[0071] In another optional embodiment, the control method further includes:

[0072] S700, Display cooling process configuration interface.

[0073] Optionally, the semiconductor process equipment includes a display panel on which a cooling process configuration interface is displayed for user operation. When a user selects a cooling chamber, that chamber contains corresponding specific cooling process parameters, which are displayed on the cooling process configuration interface for user selection based on actual needs. Furthermore, after step S200 is completed, all wafers requiring cooling can be automatically identified, and the cooling process configuration interface can also display the ID name of each wafer requiring cooling, allowing the user to select the corresponding process configuration information for each wafer.

[0074] S800: Determine whether the user has entered process configuration information in the cooling process configuration interface.

[0075] Users can select the corresponding process configuration information based on the process history information of a certain wafer. The specific process configuration information can include cooling power, cooling time, etc., without specific restrictions.

[0076] Step S300, which involves transferring the wafer requiring cooling to the cooling chamber for cooling, further includes:

[0077] S320. When process configuration information exists, the wafer that needs to be cooled is transferred to the cooling chamber, and the cooling process corresponding to the process configuration information is executed.

[0078] Optionally, this embodiment can further select specific cooling conditions for the cooling chamber selected in step S310, thereby precisely cooling the wafer. This allows users to independently select the cooling conditions for each wafer according to actual needs, thus improving cooling accuracy and avoiding resource waste. It should be noted that the cooling conditions here are formed by the process configuration information entered by the user in the process configuration interface.

[0079] In a further optional embodiment, the above control method further includes:

[0080] S900: When the user does not enter process configuration information in the cooling process configuration interface, a second reminder message will be output.

[0081] Optionally, if no user input of cooling process configuration information is detected after the chamber configuration interface displays the second preset time, it means that the cooling process configuration operation is not completed, and subsequent cooling operations cannot be performed. The second preset time can be flexibly selected, and this embodiment does not limit it. The second prompt information can be an audible and visual alarm or a display reminder; there are no specific limitations on this.

[0082] If the user does not enter process configuration information on the cooling process configuration interface, the semiconductor process equipment will output a second prompt message to remind the user to enter the process configuration information. This will allow the cooling process conditions of the cooling chamber to be configured so that the cooled wafer can better meet the requirements of the wafer storage device.

[0083] As mentioned above, step S200 determines whether each wafer needs cooling. For wafers that do not require cooling, no further cooling process is needed. Therefore, step S300 also includes:

[0084] S330: Transfer wafers that do not require cooling directly to the wafer storage device.

[0085] This embodiment directly transfers wafers that do not require cooling to the wafer storage device, thereby accelerating the wafer processing technology and improving the working efficiency of semiconductor process equipment.

[0086] Optionally, the chamber configuration interface and the cooling process configuration interface can be different interfaces. In this case, after the user enters the chamber configuration information on the chamber configuration interface, they need to switch to the next interface, namely the cooling process configuration interface, to enter the cooling process configuration information, which is a rather cumbersome process. Therefore, in an optional embodiment, the chamber configuration interface and the cooling process configuration interface are the same interface. In this case, the user can directly enter the cooling process configuration information after entering the chamber configuration information on the chamber configuration interface, which is more convenient for the user.

[0087] In one alternative embodiment, such as Figure 3 As shown, step S300 specifically includes:

[0088] S301. Determine whether the cooling instruction information of the wafer is the first cooling instruction information. If it is, proceed to step S302; otherwise, proceed to step S309.

[0089] S302, Display chamber configuration interface and cooling process configuration interface.

[0090] S303. Determine whether the user has entered chamber configuration information on the chamber configuration interface. If yes, proceed to step S305; otherwise, proceed to step S304.

[0091] S304, Output the first prompt message.

[0092] S305. Determine whether the user has entered process configuration information in the cooling process configuration interface. If yes, proceed to step S307; otherwise, proceed to step S306.

[0093] S306, Output the second reminder message.

[0094] S307. Transfer the wafer that needs to be cooled to the cooling chamber corresponding to the chamber configuration information.

[0095] S308, The cooling process corresponding to the process configuration information.

[0096] S309. Transfer the wafer to the wafer storage device.

[0097] The above embodiments can execute different operations according to the specific information of the cooling command. They can also display a chamber configuration interface and a cooling process configuration interface. The cooling process is only executed after the user inputs chamber configuration information and process configuration information. If the user does not input chamber configuration information, a first prompt message is output; if the user does not input process configuration information, a second prompt message is output. For wafers that do not require cooling, the data is directly transferred to the wafer storage device. Therefore, this embodiment can execute the wafer cooling process more accurately and comprehensively based on the process history information of each wafer and the user's response to the chamber configuration interface and cooling process configuration interface.

[0098] It should be noted that the execution entity of the control method provided in the embodiments of this application can be a control device, or a control module in the control device for executing the control method. This application embodiment uses the execution of the control method by a control device as an example to illustrate the control device for semiconductor process equipment provided in the embodiments of this application.

[0099] The control device for semiconductor process equipment disclosed in this application includes a recording module, a judgment module, and a control module. The recording module is used to record the process history information of each wafer; the judgment module is used to determine whether each wafer needs cooling based on the process history information when the wafer processing is interrupted; the control module is used to control the transmission device to transfer the wafers that need cooling to the cooling chamber for cooling in response to a one-key feedback command, and to control the transmission device to transfer the cooled wafers to the wafer storage device.

[0100] With the aforementioned control device, when the semiconductor process equipment is interrupted, the system determines whether each wafer needs cooling based on the process history information recorded before the interruption. Then, in response to a one-key feedback command, the wafers requiring cooling are transferred to the cooling chamber for cooling, and the cooled wafers are transferred to the wafer storage device. This process eliminates the need for manual inspection of each wafer, thus improving inspection efficiency and saving labor costs. Furthermore, by tracking and recording the entire process history for inspection, the comprehensiveness and accuracy of the inspection are improved. Therefore, the embodiments of this application can solve the problem of low efficiency and accuracy in checking whether each wafer needs cooling after a wafer processing process is abnormally stopped.

[0101] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A control method for semiconductor process equipment, characterized in that, include: Step S1: Record the process history information of each wafer. The process history information includes cooling instruction information for determining whether the wafer needs to be cooled. The cooling instruction information is obtained based on the type of the chamber in which the wafer is currently located. Obtain the type of the chamber in which the wafer is currently located. When the chamber in which the wafer is currently located is a high-temperature chamber, generate first cooling instruction information indicating that cooling is required. When the chamber in which the wafer is currently located is a cooling chamber, determine whether the cooling process has been completed. When the cooling process has not been completed, generate the first cooling instruction information indicating that cooling is required. Step S2: When the wafer processing is interrupted, determine whether each wafer passed through the high-temperature chamber before the interruption based on the process history information recorded before the interruption, so as to determine whether each wafer needs to be cooled. When the cooling instruction information is the first cooling instruction information that requires cooling, the wafer needs to be cooled. Step S3: In response to the one-click return command, the wafer that needs to be cooled is transferred to the cooling chamber for cooling, and the cooled wafer is transferred to the wafer storage device.

2. The control method according to claim 1, characterized in that, Step S1 further includes: When the cooling process is completed, a second cooling instruction message is generated pointing to a location where cooling is not required. In step S2, determining whether each wafer needs cooling based on the process history information recorded before the interruption, to determine whether each wafer needs cooling, further includes: When the cooling instruction information is the second cooling instruction information, the wafer does not need to be cooled.

3. The control method according to claim 1, characterized in that, The number of cooling chambers is at least two, and the control method further includes: Display chamber configuration interface; Determine whether the user has entered chamber configuration information on the chamber configuration interface; The process of transferring the wafer requiring cooling to the cooling chamber for cooling specifically includes: When the chamber configuration information exists, the wafer that needs to undergo a cooling process is transferred to the cooling chamber corresponding to the chamber configuration information.

4. The control method according to claim 3, characterized in that, The control method further includes: If the user does not enter chamber configuration information on the chamber configuration interface, the first prompt message will be output.

5. The control method according to claim 3, characterized in that, The control method further includes: Displays the cooling process configuration interface; Determine whether the user has entered process configuration information on the cooling process configuration interface; The step of transferring the wafer requiring cooling to the cooling chamber for cooling further includes: When the process configuration information exists, the wafer that needs to be cooled is transferred to the cooling chamber, and the cooling process corresponding to the process configuration information is executed.

6. The control method according to claim 5, characterized in that, The control method further includes: If the user does not enter process configuration information in the cooling process configuration interface, a second reminder message will be output.

7. The control method according to claim 1, characterized in that, Step S3 further includes: The wafer, which does not require cooling, is directly transferred to the wafer storage device.

8. A semiconductor process apparatus, employing the control method according to any one of claims 1-7, characterized in that, The semiconductor process equipment includes a high-temperature chamber, a cooling chamber, a transfer device, and a wafer storage device. The transfer device is used to move each wafer between the cooling chamber, the high-temperature chamber, and the wafer storage device. The semiconductor process equipment also includes: A recording module is used to record the process history information of each wafer. The judgment module is used to determine whether each wafer needs cooling based on the process history information when the wafer processing is interrupted. The control module is used to respond to a one-key return command, control the transmission device to transfer the wafer that needs to be cooled to the cooling chamber for cooling, and control the transmission device to transfer the cooled wafer to the wafer storage device.

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