A package structure for a power management chip and a working method thereof

Abstract

The application relates to the technical field of chip packaging, in particular to a packaging structure for a power management chip, which comprises a circuit board, a chip packaging body is installed on the circuit board, a protection assembly for protecting the chip packaging body is installed on the circuit board, a dust removal assembly for cleaning dust on the chip packaging body is arranged on the protection assembly, and a heat dissipation assembly for dissipating heat of the chip packaging body is arranged on the protection assembly. The packaging structure for the power management chip can protect the chip packaging body, avoid collision and extrusion with other devices, prevent the chip packaging body from being damaged, clean the chip packaging body, prevent dust from affecting the chip packaging body, dissipate heat of the chip packaging body, and prevent high temperature from affecting the chip packaging body.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically a packaging structure for power management chips. Background Technology

[0002] With the advancement of technology, smart electronic products have gradually entered people's lives, especially in power management, which can improve people's comfort. The chip used in power management is the decisive factor in performance. After the chip is manufactured, it needs to be packaged and installed on the circuit board. Currently, the chip is packaged in plastic, which is easy to collide with other components during use, causing damage to the package. In addition, when the packaged chip is installed on the circuit board, dust often accumulates at the connection between the chip and the circuit board. If it is not cleaned in time, the dust will cause poor contact between the chip and the circuit board, and also make maintenance and disassembly difficult. The current chip packaging has extremely poor heat dissipation during use. Although some circuit boards are equipped with cooling fans, the cooling fans occupy a large area on the circuit board. Summary of the Invention

[0003] The purpose of this invention is to provide a packaging structure for power management chips to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a packaging structure for a power management chip, comprising a circuit board, a chip packaging body mounted on the circuit board, a protective component for protecting the chip packaging body mounted on the circuit board, a dust removal component for cleaning dust at the connection between the chip packaging body and the circuit board, and a heat dissipation component for dissipating heat from the chip packaging body.

[0005] The selected protective component includes a protective shell, one end of which is a through groove, and a first threaded rod is installed at the bottom of one end of the protective shell. The first threaded rod is connected through the circuit board, and a heat dissipation groove is formed on the surface of the protective shell.

[0006] Selected: A second threaded rod is threaded through the protective shell, and a stabilizing block is fixedly installed at one end of the second threaded rod. A support rib is installed on the chip packaging body, and the stabilizing block is movably pressed and connected to the chip packaging body. Selected: The dust removal assembly includes a third threaded rod, and a turntable is rotatably installed at the bottom of the third threaded rod. The turntable is fixedly assembled on the chip packaging body. A protective ring is fixedly installed on the protective shell. The protective ring is annular, and a threaded ring is fixedly installed inside the protective ring. The threaded ring is rotatably threaded together with the third threaded rod. Selected: A shaped gear is fixedly installed on the third threaded rod. A fixing seat is fixedly installed on the chip packaging body, and a connecting rod is rotatably installed on the fixing seat. A torsion spring is fixedly installed inside the fixing seat, and the connecting rod is fixedly connected to the torsion spring. One end of the connecting rod is movably pressed and connected to the shaped gear, and the end where the connecting rod and the shaped gear press against each other has an arc-shaped design.

[0007] The selected end of the connecting rod away from the irregular gear is fixedly equipped with a cleaning plate, and a cleaning block is fixedly equipped at the bottom of the cleaning plate. The cleaning block is made of fluffy material and rotates at the connection between the chip package body and the circuit board.

[0008] The selected heat dissipation component includes a sealing cylinder, at least two of which are fixedly mounted on the chip package body. A sealing rod is fixedly installed at the bottom of the protective shell. A second sealing groove is opened inside the sealing cylinder, and the sealing rod slides in a sealing manner inside the second sealing groove.

[0009] The selected sealing cylinder has a first sealing groove inside, a hydraulic rod is fixedly installed at the bottom of the protective shell, the output end of the hydraulic rod is a sliding rod, a piston block is fixedly installed at the end of the sliding rod away from the hydraulic rod, the piston block slides and seals inside the first sealing groove, and a connecting groove is opened on the second sealing groove, the first sealing groove is connected to the second sealing groove through the connecting groove.

[0010] Selected, a first air guide pipe is installed on one side of the sealing cylinder, one end of the first air guide pipe penetrates the inner wall of the sealing cylinder, and one end of the first air guide pipe is connected to the second sealing groove. The first air guide pipe is L-shaped. A second air guide pipe is installed on one side of the sealing cylinder, one end of the second air guide pipe penetrates the inner wall of the sealing cylinder, and one end of the second air guide pipe is connected to the second sealing groove. The two sealing cylinders are connected together through the second air guide pipe. Exhaust ports are installed on the first air guide pipe and the second air guide pipe. The exhaust port on the first air guide pipe is located on the surface of the chip packaging body.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The protective shell is assembled onto the circuit board by the first threaded rod. At the same time, the third threaded rod is inserted into the inside of the threaded ring. Then, the second threaded rod is rotated and screwed onto the protective shell. The second threaded rod drives the stabilizing block at one end to move. The stabilizing block is pressed and connected to the chip package body to maintain the stability of the chip package body. The protective shell protects the chip package body and avoids collisions and compression with other devices during the use of the chip package body, which could lead to damage to the chip package body.

[0012] 2. When the protective shell and the chip package body are installed close together, the third threaded rod rotates through the threaded ring. The threaded ring rotates on the chip package body through the turntable. When the threaded ring rotates, it drives the special gear to rotate. The special gear rotates and squeezes the connecting rod. The connecting rod rotates on the fixed seat. The connecting rod drives the cleaning plate to rotate. The cleaning plate drives the cleaning block to move. The cleaning block can clean the dust at the connection between the chip package body and the circuit board. In addition, when the sealing rod is inserted into the second sealing groove inside the sealing cylinder, it not only plays a positioning role when the protective shell is installed, but also when the sealing rod is inserted into the second sealing groove, it will squeeze the air inside the second sealing groove. The air inside the second sealing groove will rush to the second air guide tube and the first air guide tube. The air inside the second air guide tube and the first air guide tube will be ejected through the exhaust port. The air ejected from the exhaust port on the first air guide tube can blow away the dust at the connection between the chip package body and the circuit board. It can blow away the dust at the connection between the chip package body and the circuit board, and prevent the dust from adhering too firmly, so that the cleaning block can clean it cleanly. This can prevent dust from causing poor contact between the chip and the circuit board, and avoid causing trouble for maintenance and disassembly.

[0013] 3. When heat dissipation is required during the use of the chip package body, the hydraulic rod is activated. The output end of the hydraulic rod drives the sliding rod to move, which in turn moves the piston block inside the first sealing groove. The piston block compresses the air inside the first sealing groove, and the air inside the first sealing groove flows through the connecting groove to the first and second air guide pipes. The first and second air guide pipes then expel the air through the exhaust port, thus dissipating heat from the chip package body. The heat dissipation component not only occupies a small area on the circuit board but also effectively dissipates heat from the circuit board, preventing excessive temperature from affecting the chip package body. (See attached diagram for details.) Figure 1 This is a schematic diagram of the overall structure of a packaging structure for a power management chip according to the present invention. Figure 2 This is a partial structural diagram of a packaging structure for a power management chip according to the present invention; Figure 3 This is a partial cross-sectional view of a packaging structure for a power management chip according to the present invention. Figure 4 This is a second partial cross-sectional view of a packaging structure for a power management chip according to the present invention. Figure 5 This is a partial structural diagram of a dust removal component based on a packaging structure for power management chips according to the present invention. Figure 6 This is a third partial cross-sectional view of a packaging structure for a power management chip according to the present invention; Figure 7 This is a partial cross-sectional view of a heat dissipation component of a packaging structure for a power management chip according to the present invention. Figure 8 This is a second partial cross-sectional view of a heat dissipation component of a packaging structure for a power management chip according to the present invention. Figure 9 This invention provides a packaging structure for power management chips. Figure 8 Enlarged view of section A in the middle.

[0014] In the figure: 1. Circuit board; 2. Chip package body; 3. Protective component; 31. Protective shell; 32. First threaded rod; 33. Heat dissipation groove; 34. Second threaded rod; 35. Support rib; 36. Stabilizing block; 4. Dust removal component; 41. Third threaded rod; 42. Protective ring; 43. Connecting rod; 44. Threaded ring; 45. Fixing base; 46. Cleaning plate; 47. Irregular gear; 48. Cleaning block; 5. Heat dissipation component; 51. Sealing cylinder; 52. First air guide pipe; 53. Second air guide pipe; 54. Sealing rod; 55. Hydraulic rod; 56. Sliding rod; 57. Exhaust port; 58. First sealing groove; 59. Second sealing groove; 510. Connecting groove. Detailed implementation method. To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0015] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0016] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0017] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Please refer to... Figures 1 to 9 This invention provides a packaging structure for a power management chip, including a circuit board 1, a chip package body 2 mounted on the circuit board 1, and a protective component 3 mounted on the circuit board 1 to protect the chip package body 2. The protective component 3 protects the chip package body 2 from collisions and compression with other devices during use, preventing damage to the chip package body 2. The protective component 3 is equipped with a dust removal component 4 for cleaning dust at the connection between the chip package body 2 and the circuit board 1, preventing dust from affecting the chip package body 2. The protective component 3 is also equipped with a heat dissipation component 5 for cooling the chip package body 2, preventing overheating from affecting the chip package body 2.

[0018] like Figure 2 , Figure 3 As shown, the protective component 3 includes a protective shell 31. One end of the protective shell 31 is a through groove, and a first threaded rod 32 is installed at the bottom of one end of the protective shell 31. The first threaded rod 32 is connected through the circuit board 1. A heat dissipation groove 33 is formed on the surface of the protective shell 31. The heat dissipation groove 33 can increase the contact area between the chip package body 2 and the outside world, avoiding the protective shell 31 from wrapping the chip package body 2 too tightly, which would cause the chip package body 2 to generate a lot of heat during use. Figure 2 , Figure 3 As shown, a second threaded rod 34 is threaded through the protective shell 31, and a stabilizing block 36 is fixedly installed at one end of the second threaded rod 34. A support rib 35 is installed on the chip packaging body 2. The stabilizing block 36 is movably pressed and connected to the chip packaging body 2. By pressing and connecting the stabilizing block 36 to the support rib 35 on the chip packaging body 2, the support rib 35 can play a supporting role, and at the same time, the stabilizing block 36 can improve the stability of the chip packaging body 2.

[0019] like Figure 3 , Figure 4 , Figure 5 As shown, the dust removal assembly 4 includes a third threaded rod 41, a turntable is rotatably mounted on the bottom of the third threaded rod 41, the turntable is fixedly mounted on the chip packaging body 2, and a protective ring 42 is fixedly mounted on the protective shell 31. The protective ring 42 is annular, and a threaded ring 44 is fixedly mounted inside the protective ring 42. The threaded ring 44 is rotatably screwed together with the third threaded rod 41. The protective ring 42 can play a stabilizing role when the third threaded rod 41 and the threaded ring 44 are screwed and pressed together. The third threaded rod 41 can rotate on the chip packaging body 2 through the turntable.

[0020] like Figure 3 , Figure 4 , Figure 5 As shown, a shaped gear 47 is fixedly installed on the third threaded rod 41, and a fixed base 45 is fixedly installed on the chip package body 2. A connecting rod 43 is rotatably installed on the fixed base 45. A torsion spring is fixedly installed inside the fixed base 45. The connecting rod 43 is fixedly connected to the torsion spring. One end of the connecting rod 43 is movably pressed and connected to the shaped gear 47. The end of the connecting rod 43 that is pressed against the shaped gear 47 is designed with an arc shape. The connecting rod 43 rotates on the fixed base 45. At the same time, a torsion spring is installed inside the fixed base 45. The torsion spring and the connecting rod 43 are connected together. When the pressing between the connecting rod 43 and the shaped gear 47 is released, the torsion spring can make the connecting rod 43 return to the starting position.

[0021] like Figure 3 , Figure 4 , Figure 5 As shown, a cleaning plate 46 is fixedly installed at the end of the connecting rod 43 away from the irregular gear 47. A cleaning block 48 is fixedly installed at the bottom of the cleaning plate 46. The cleaning block 48 is made of velvet material. The cleaning block 48 rotates at the connection between the chip package body 2 and the circuit board 1. The connection between the chip package body 2 and the circuit board 1 can be cleaned by the cleaning block 48.

[0022] like Figure 6 , Figure 7 , Figure 8 As shown, the heat dissipation assembly 5 includes a sealing cylinder 51. At least two sealing cylinders 51 are fixedly mounted on the chip package body 2. A sealing rod 54 is fixedly installed on the bottom of the protective shell 31. A second sealing groove 59 is opened inside the sealing cylinder 51. The sealing rod 54 slides in a sealing manner inside the second sealing groove 59.

[0023] like Figure 7 , Figure 8 , Figure 9As shown, a first sealing groove 58 is provided inside the sealing cylinder 51. A hydraulic rod 55 is fixedly installed at the bottom of the protective shell 31. The output end of the hydraulic rod 55 is a sliding rod 56. A piston block is fixedly installed at the end of the sliding rod 56 away from the hydraulic rod 55. The piston block slides and seals inside the first sealing groove 58. A connecting groove 510 is provided on the second sealing groove 59. The first sealing groove 58 is connected to the second sealing groove 59 through the connecting groove 510. The first sealing groove 58 and the second sealing groove 59 can be connected through the connecting groove 510.

[0024] like Figure 6 , Figure 7 As shown, a first air guide pipe 52 is installed on one side of the sealing cylinder 51. One end of the first air guide pipe 52 penetrates the inner wall of the sealing cylinder 51, and the other end of the first air guide pipe 52 is connected to the second sealing groove 59. The first air guide pipe 52 is L-shaped.

[0025] like Figure 6 , Figure 7 As shown, a second air guide pipe 53 is installed on one side of the sealing cylinder 51. One end of the second air guide pipe 53 penetrates the inner wall of the sealing cylinder 51, and the other end of the second air guide pipe 53 is connected to the second sealing groove 59. The two sealing cylinders 51 are connected together through the second air guide pipe 53. An exhaust port 57 is installed on the first air guide pipe 52 and the second air guide pipe 53. The exhaust port 57 on the first air guide pipe 52 is located on the surface of the chip package body 2. The second air guide pipe 53 can make the air inside the first sealing groove 58 and the second sealing groove 59 spray out over a wider range, which can improve the heat dissipation effect of the chip package body 2.

[0026] Working principle: After chip packaging is completed, the chip package body 2 is assembled onto the circuit board 1, and the protective shell 31 is assembled onto the circuit board 1 via the first threaded rod 32. Simultaneously, the third threaded rod 41 is inserted into the threaded ring 44. This not only positions the protective shell 31 during installation, but also, when the protective shell 31 is close to the chip package body 2, the third threaded rod 41 rotates via the threaded ring 44. The third threaded rod 41 rotates on the chip package body 2 via a turntable. The rotation of the third threaded rod 41 drives the shaped gear 47 to rotate, which in turn presses against the connecting rod 43. The connecting rod 43 rotates on the fixed base 45, driving the cleaning plate 46 to rotate. The cleaning plate 46 causes the cleaning block 48 to shift, and the cleaning block 48 can clean the dust at the connection between the chip package body 2 and the circuit board 1. When the shaped gear 47 and the connecting rod 43 are no longer pressed together, the torsion spring inside the fixed base 45 will drive the connecting rod 43 back to its initial position. In addition, when the sealing rod 54 is inserted into the second sealing groove 59 inside the sealing cylinder 51, it not only plays a positioning role when the protective shell 31 is installed, but also when the sealing rod 54 is inserted into the second sealing groove 59, the sealing rod 54 will squeeze... The air inside the second sealing groove 59 is compressed, and the air inside the second sealing groove 59 rushes towards the second air guide tube 53 and the first air guide tube 52. The air inside the second air guide tube 53 and the first air guide tube 52 will be ejected through the exhaust port 57. The air ejected from the exhaust port 57 on the first air guide tube 52 can blow away the dust at the connection between the chip package body 2 and the circuit board 1, and at the same time dissipate heat from the chip package body 2. Then, the second threaded rod 34 is rotated. The second threaded rod 34 is screwed and rotated on the protective shell 31. The second threaded rod 34 drives the stabilizing block 36 at one end to move. The stabilizing block 36 will move against the chip. The chip package body 2 is squeezed and connected to maintain its stability. When the chip package body 2 needs heat dissipation during use, the hydraulic rod 55 is activated. The output end of the hydraulic rod 55 drives the sliding rod 56 to move. The sliding rod 56 drives the piston block to move inside the first sealing groove 58. The piston block will squeeze the air inside the first sealing groove 58 to move. The air inside the first sealing groove 58 will flow through the connecting groove 510 to the first air guide tube 52 and the second air guide tube 53. The first air guide tube 52 and the second air guide tube 53 will spray the air out through the exhaust port 57, which can dissipate heat from the chip package body 2.

[0027] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for a power management chip, comprising a circuit board (1), characterized in that, A chip package body (2) is mounted on the circuit board (1). A protective component (3) for protecting the chip package body (2) is mounted on the circuit board (1). A dust removal component (4) for cleaning dust at the connection between the chip package body (2) and the circuit board (1) is provided on the protective component (3). A heat dissipation component (5) for dissipating heat from the chip package body (2) is provided on the protective component (3). The protective component (3) includes a protective shell (31). The dust removal component (4) includes a transmission component, a rotation component, and a cleaning component. The transmission component is located on the protective shell (31). The rotation component is located on the chip package body (2). When the protective shell (31) and the chip package body (2) are installed and disassembled, the transmission component drives the rotation component to work. The rotation component drives the cleaning component to clean the dust. The heat dissipation component (5) includes a driving component and an exhaust component. The driving component performs air extraction and exhaust through the exhaust component. The exhaust component draws in and exhausts the gas generated by the driving component to dissipate heat from the chip package body (2). The exhaust component and the cleaning component cooperate to clean the dust on the chip package body (2). One end of the protective shell (31) is a through groove, and the bottom of the other end of the protective shell (31) is equipped with a first threaded rod (32). The first threaded rod (32) is connected through the circuit board (1), and the surface of the protective shell (31) is provided with heat dissipation grooves (33). A second threaded rod (34) is threaded through the protective shell (31), and a stabilizing block (36) is fixedly installed at one end of the second threaded rod (34). A support rib (35) is installed on the chip packaging body (2), and the stabilizing block (36) is movably pressed and connected to the chip packaging body (2). The rotating assembly includes a third threaded rod (41), a turntable is rotatably mounted on the bottom of the third threaded rod (41), the turntable is fixedly mounted on the chip packaging body (2), the transmission assembly includes a protective ring (42), the protective ring (42) is fixedly mounted on the protective shell (31), the protective ring (42) is movably connected to the third threaded rod (41), a special gear (47) is fixedly mounted on the third threaded rod (41), the cleaning assembly includes a fixed seat (45), the fixed seat (45) is fixedly mounted on the chip packaging body (2), a connecting rod (43) is rotatably mounted on the fixed seat (45), one end of the connecting rod (43) is movably pressed and connected to the special gear (47), a cleaning plate (46) is fixedly mounted on the end of the connecting rod (43) away from the special gear (47), a cleaning block (48) is fixedly mounted on the bottom of the cleaning plate (46), and the cleaning block (48) rotates at the connection between the chip packaging body (2) and the circuit board (1).

2. The packaging structure for a power management chip according to claim 1, characterized in that, The drive assembly includes a sealing cylinder (51) and a sealing rod (54). The sealing rod (54) is fixedly installed at the bottom of the protective shell (31). A second sealing groove (59) is provided inside the sealing cylinder (51). The sealing rod (54) slides and seals inside the second sealing groove (59). A first sealing groove (58) is provided inside the sealing cylinder (51). The second sealing groove (59) is connected to the first sealing groove (58). A hydraulic rod (55) is fixedly installed at the bottom of the protective shell (31). A sliding rod (56) is provided at the output end of the hydraulic rod (55). One end of the exhaust assembly moves inside the first sealing groove (58). The exhaust assembly includes a first air guide pipe (52), which is connected to the sealing cylinder (51). One end of the first air guide pipe (52) is connected to the second sealing groove (59). A second air guide pipe (53) is installed on one side of the sealing cylinder (51). One end of the second air guide pipe (53) is connected to the second sealing groove (59). An exhaust port (57) is connected to the first air guide pipe (52) and the second air guide pipe (53). The exhaust port (57) on the first air guide pipe (52) is located on the surface of the chip packaging body (2).

3. The packaging structure for a power management chip according to claim 2, characterized in that, The protective ring (42) is annular, and a threaded ring (44) is fixedly installed inside the protective ring (42). The threaded ring (44) is rotatably screwed together with the third threaded rod (41). A torsion spring is fixedly installed inside the fixed seat (45). The connecting rod (43) is fixedly connected to the torsion spring. The end of the connecting rod (43) that is pressed against the shaped gear (47) is arc-shaped. The cleaning block (48) is made of fluffy material. There are at least two sealing cylinders (51), which are fixedly assembled on the chip packaging body (2). A piston block is fixedly installed at one end of the sliding rod (56). The piston block is in the first... The sealing groove (58) has an internal sealing sliding, and the second sealing groove (59) has a connecting groove (510). The first sealing groove (58) is connected to the second sealing groove (59) through the connecting groove (510). One end of the first air guide pipe (52) penetrates the inner wall of the sealing cylinder (51) and is connected to the second sealing groove (59). The first air guide pipe (52) is L-shaped. One end of the second air guide pipe (53) penetrates the inner wall of the sealing cylinder (51) and is connected to the second sealing groove (59). The two sealing cylinders (51) are connected together through the second air guide pipe (53).

4. A method for operating a packaging structure for a power management chip as described in any one of claims 1-3, characterized in that, The process includes the following steps: When the chip packaging is completed, the chip package body (2) is assembled onto the circuit board (1), and the protective shell (31) is assembled onto the circuit board (1) through the first threaded rod (32). At the same time, the third threaded rod (41) is inserted into the inside of the threaded ring (44), which not only plays a positioning role when the protective shell (31) is installed, but also, when the protective shell (31) is close to the chip package body (2), the third threaded rod (41) rotates through the threaded ring (44), and the third threaded rod (41) rotates on the chip package body (2) through the turntable. When the third threaded rod (41) rotates, it drives the shaped gear (47) to rotate. The shaped gear (47) rotates and presses the connecting rod (43). 43) Rotating on the fixed seat (45), the connecting rod (43) drives the cleaning plate (46) to rotate, and the cleaning plate (46) drives the cleaning block (48) to move. The cleaning block (48) can clean the dust at the connection between the chip package body (2) and the circuit board (1). When the shaped gear (47) and the connecting rod (43) are released from compression, the torsion spring inside the fixed seat (45) will drive the connecting rod (43) to return to the starting position. In addition, when the sealing rod (54) is inserted into the second sealing groove (59) inside the sealing cylinder (51), it not only plays a positioning role when the protective shell (31) is installed, but also when the sealing rod (54) is inserted into the second sealing groove (59), the sealing rod (54) will The air inside the second sealing groove (59) is squeezed, and the air inside the second sealing groove (59) rushes to the second air guide tube (53) and the first air guide tube (52). The air inside the second air guide tube (53) and the first air guide tube (52) will be ejected through the exhaust port (57). The air ejected from the exhaust port (57) on the first air guide tube (52) can blow away the dust at the connection between the chip package body (2) and the circuit board (1), and at the same time dissipate heat from the chip package body (2). Then, the second threaded rod (34) is rotated. The second threaded rod (34) is screwed and rotated on the protective shell (31). The second threaded rod (34) drives the stabilizing block (36) at one end to move. The stabilizing block (36) will move with the chip. The chip package body (2) is squeezed together to maintain the stability of the chip package body (2). When the chip package body (2) needs to dissipate heat during use, the hydraulic rod (55) is activated. The output end of the hydraulic rod (55) drives the sliding rod (56) to move. The sliding rod (56) drives the piston block to move inside the first sealing groove (58). The piston block will squeeze the air inside the first sealing groove (58) to move. The air inside the first sealing groove (58) will flow to the first air guide pipe (52) and the second air guide pipe (53) through the connecting groove (510). The first air guide pipe (52) and the second air guide pipe (53) will spray air out through the exhaust port (57) to dissipate heat from the chip package body (2).

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