Package structure and method of forming the same

Abstract

Disclosed are a packaging structure and a forming method thereof. The method comprises: performing void detection on a first package to determine that there is no void in the first package; performing void detection on a second package to determine that there is no void in the second package; after the first package and the second package pass the void detection respectively, stacking the second package above the first package and bonding the second package with the first package, wherein a second package body of the second package faces a first package body of the first package. The above technical solution of the present application can detect the void generated in the molding process of the packaging structure, and improve the reliability and yield of the product.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a packaging structure and a method for forming the same. Background Technology

[0002] like Figure 1 As shown, the current 3D stacked structure 10 supports the upper substrate 16 and the lower substrate 18 through the interposer 12 and the interposer 14 therein. At the same time, the interposer 14 also has the function of conducting the circuits of the upper substrate 16 and the lower substrate 18.

[0003] During the molding process, if a mold void 20 is generated between the interposer 12 and the substrate (e.g., the lower substrate 18) or between the die 15 and the substrate (e.g., the lower substrate 18), for example, due to limitations imposed by the mainboard circuitry on the upper substrate 16 and the lower substrate 18, it may be impossible to detect the mold void 20 using Scan Acoustic Tomography (SAT) technology after the molding process. This mold void problem will severely impact product reliability. Summary of the Invention

[0004] To address the problem that molding voids generated during the molding process of stacked packaging structures cannot be detected in related technologies, this invention proposes a method for forming a packaging structure and a packaging structure that solves the above problem by detecting molding voids before stacking the packaging components.

[0005] The technical solution of this invention is implemented as follows:

[0006] According to one aspect of the present invention, a method for forming an encapsulation structure is provided. The method includes: performing void detection on a first encapsulation to determine that no voids exist in the first encapsulation; performing void detection on a second encapsulation to determine that no voids exist in the second encapsulation; and, after the first and second encapsulations have respectively passed void detection, stacking the second encapsulation on top of the first encapsulation and engaging the second encapsulation with the first encapsulation, wherein the second encapsulant of the second encapsulation faces the first encapsulant of the first encapsulation.

[0007] According to an embodiment of the present invention, before performing void detection on the first package, the method further includes: selectively molding the first package body to form the first package body, the first package body having a first device and a first electronic component taller than the first device. Wherein, the first package body in the region corresponding to the first electronic component is taller than the first package body in the region corresponding to the first device.

[0008] According to an embodiment of the present invention, before performing void detection on the second package, the method further includes: selectively molding a second package body to form a second package body, the second package body having a second device and a second electronic component that is taller than the second device. Specifically, the second package body in the region corresponding to the second electronic component is taller than the second package body in the region corresponding to the second device.

[0009] According to an embodiment of the present invention, joining the second package to the first package includes joining the second package to the first package by means of an adhesive layer.

[0010] According to an embodiment of the present invention, the first package has a first adapter, and the second package has a second adapter. Furthermore, engaging the second package with the first package includes: aligning the first adapter with the second adapter, and engaging the second adapter to the first adapter.

[0011] According to an embodiment of the present invention, joining the second package to the first package includes joining the second package to the first package by solder.

[0012] According to an embodiment of the present invention, joining the second package to the first package includes: connecting the first substrate of the first package to the second substrate of the second package using a flexible circuit board.

[0013] According to an embodiment of the present invention, at the interface where the first package and the second package are joined together, the shapes of the first package and the second package are complementary.

[0014] According to another aspect of the present invention, a packaging structure is provided. The packaging structure includes a first packaging member, the first packaging member including a first packaging body having a first portion and a second portion adjacent to each other, the first portion protruding relative to the second portion. The packaging structure also includes a second packaging member stacked on top of the first packaging member, the second packaging member including a second packaging body, the second packaging body having a first portion and a second portion adjacent to each other, the first portion of the second packaging body protruding relative to the second portion of the second packaging body. The first portion of the first packaging body is opposite to and engages with the second portion of the second packaging body, and the second portion of the first packaging body is opposite to and engages with the first portion of the second packaging body.

[0015] According to an embodiment of the present invention, the first package includes a first substrate and a first electronic component and a first device disposed on the first substrate. The first electronic component is higher than the first device, and a first portion of the first package covers the first electronic component, and a second portion of the first package covers the first device.

[0016] According to an embodiment of the present invention, the second package includes a second substrate and a second electronic component and a second device disposed on the second substrate. The second electronic component is higher than the second device, and a first portion of the second package covers the second electronic component, and a second portion of the second package covers the second device.

[0017] According to embodiments of the present invention, the packaging structure further includes an adhesive layer connecting the first package and the second package. In some embodiments, the adhesive layer comprises a conductive material. In some embodiments, the adhesive layer is a shielding layer. In some embodiments, the adhesive layer is a conductive adhesive layer or an EMI film.

[0018] According to an embodiment of the present invention, a first package includes a first adapter, the first package body exposing the first adapter. A second package includes a second adapter, the second package body exposing the second adapter, the first adapter and the second adapter being aligned with and engaged with each other.

[0019] According to an embodiment of the present invention, the first adapter and the second adapter are joined together by solder.

[0020] According to an embodiment of the present invention, the packaging structure further includes a flexible circuit board, which connects to the first substrate of the first package and the second substrate of the second package from the outside of the first package and the second package.

[0021] According to an embodiment of the present invention, the sidewall of the first portion of the first package adjacent to the second portion of the first package is a vertical sidewall, and the sidewall of the first portion of the second package adjacent to the second portion of the second package is a vertical sidewall.

[0022] According to an embodiment of the present invention, the sidewall of the first portion of the first package adjacent to the second portion of the first package is an inclined sidewall, and the sidewall of the first portion of the second package adjacent to the second portion of the second package is an inclined sidewall. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional schematic diagram of the current 3D stacked packaging structure.

[0025] Figure 2 This is a flowchart of a method for forming an encapsulation structure according to an embodiment of the present invention.

[0026] Figures 3A to 3EThis is a schematic diagram of the various intermediate stages of forming the packaging structure according to an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram of a packaging structure according to another embodiment of the present invention.

[0028] Figures 5A to 5D This is a schematic diagram of the various intermediate stages of forming a packaging structure according to another embodiment of the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0030] This invention provides a method for forming a package structure by stacking known good packages (KGPs) whose molding voids have been tested.

[0031] Figure 2 This is a flowchart of a method for forming a package structure according to an embodiment of the present invention. The method begins at step S202, where a void detection is performed on a first package to determine that there are no voids in the first package.

[0032] Then, in step S204, a void detection is performed on the second package to determine that there are no voids in the second package. The void detection performed on either the first or second package can detect molding voids formed at any location during the molding of the first package. Furthermore, the first or second package determined to be free of voids is considered a KGP.

[0033] In step S206, after the first and second packages have passed the gap detection, the second package is stacked on top of the first package. Then, the second package is joined to the first package with the first package's first encapsulant facing the second package's second encapsulant. The first and second packages that have passed the gap detection can be joined in any suitable manner, and the present invention is not limited thereto.

[0034] The method of the present invention first performs gap detection on the first and second packages to be joined, respectively, to detect the presence of gaps in the first and second packages. Then, the first and second packages are joined after the gap detection is passed. Therefore, it effectively detects gaps generated in the packaging structure during the molding process. This, in turn, improves product reliability and yield.

[0035] Figures 3A to 3E This is a schematic diagram of the various intermediate stages in forming the packaging structure 300 according to an embodiment of the present invention. The following references... Figures 3A to 3E The method for forming the encapsulation structure 300 according to the present invention is illustrated in the figure.

[0036] Firstly, as Figure 3A As shown, the first package 120 is selectively molded to form the first package 100. Figure 3A In the illustrated embodiment, the first package 100 may include a first substrate 102 and a first electronic component 112 and a first device 114 disposed on the first substrate 102. The first device 114 may include any type of die. The first electronic component 112 may include electronic components such as resistors, capacitors, and inductors. The height of the first electronic component 112, measured from the upper surface of the first substrate 102, is greater than the height of the first device 114. The first package 120 covers the first electronic component 112 and the first device 114. Specifically, a first portion 121 of the first package 120 covers the first electronic component 112, and a second portion 122 of the first package 120 covers the first device 114. In some embodiments, since the first electronic component 112 is higher than the first device 114, the surface 125 of the first package 120 may be non-flat. The first package 120 in the region corresponding to the first electronic component 112 is higher than the first package 114 in the region corresponding to the first device 114. Furthermore, in this embodiment, the sidewall 129 of the first portion 121 of the first package 120 adjacent to the second portion 122 of the first package 120 is a vertical sidewall. In some embodiments, such as Figure 3A As shown, the region 140 corresponding to the first device 114 (e.g.) Figure 3A The first package 120 (shown by dashed lines) includes a first portion 121 and a second portion 122.

[0037] During the molding process of forming the first package 120, gaps may form between the first package 120 and the first substrate 102, or between the first device 114 and the first substrate 102. Gap detection can be performed on the first package 100 to determine whether such gaps exist. Gap detection can be performed using any applicable detection technology, such as SAT technology.

[0038] like Figure 3B As shown, a second package 200 is formed by selective molding using a second package 220. In some embodiments, the second package 200 may include a second substrate 202 and a second electronic component 212 and a second device 214 disposed on the second substrate 202. The second device 214 may include any type of die. The second electronic component 212 may include electronic components such as resistors, capacitors, and inductors. The height of the second electronic component 212 is greater than the height of the second device 214. The second package 220 covers the second electronic component 212 and the second device 214. Specifically, a second portion 222 of the second package 220 covers the second electronic component 212, and a second portion 222 of the second package 220 covers the second device 214. Since the second electronic component 212 is higher than the second device 214, the surface 225 of the second package 220 may be non-planar. The second package 220 in the region corresponding to the second electronic component 212 is higher than the second package 220 in the region corresponding to the second device 214. Furthermore, the sidewall 229 of the first portion 221 of the second package 220 adjacent to the second portion 222 of the second package 220 is a vertical sidewall.

[0039] After the first package 100 and the second package 200 pass the void detection, as Figures 3C to 3D As shown, the first package 100 and the second package 200 are joined together. It should be understood that the following references... Figures 3C to 3D As shown, the first package 100 and the second package 200 are joined by an adhesive layer 150. However, joining can also be achieved by any other suitable means, and the present invention is not limited to this.

[0040] like Figure 3C As shown, an adhesive layer 150 is formed over the second package 200. In some embodiments, the adhesive layer 150 may include a conductive material for electrical connection. In some embodiments, the adhesive layer 150 may be a shielding layer to prevent signal interference between the first package 100 and the second package 200.

[0041] In one embodiment, the adhesive layer 150 may be a conductive adhesive layer. In such an embodiment, a conductive adhesive layer conformally to the surface of the first package 100 may be formed by coating on the surface of the first package 100. In another embodiment, the adhesive layer 150 may be an EMI (electromagnetic interference) film. In such an embodiment, the EMI film may be pressed onto the surface of the first package 100 by lamination (e.g., vacuum lamination) so that the formed EMI film conforms to the surface of the first package 100.

[0042] like Figure 3DAs shown, the first package 100 is flipped so that the second package body 220 of the second package 200 is opposite to the first package body 120 of the first package 100. The second package body 220 is then bonded to the first package 100 via an adhesive layer 150, thereby forming a package structure 300. Specifically, the second portion 122 of the first package body 120 is opposite to and bonded to the first portion 221 of the second package body 220, and the first portion 121 of the first package body 120 is opposite to and bonded to the second portion 222 of the second package body 220. At the interface where the first package 100 and the second package 200 are bonded, the shapes of the first package 100 and the second package 200 can be complementary.

[0043] The formed package structure 300 undergoes void detection between the joined first package body 120 and second package body 220. Therefore, the package structure 300 will not contain voids generated during the molding process. This improves product reliability and yield.

[0044] like Figure 3E As shown, the packaging structure 300 can also utilize a flexible printed circuit (FPC) 302 to connect the first substrate 102 of the first package 100 and the second substrate 202 of the second package 200. The FPC 302 connects to the first substrate 102 of the first package 100 and the second substrate 202 of the second package 200 from the outside of the first package 100 and the second package 200. The FPC 302 can also connect to the adhesive layer 150.

[0045] Figure 4 This is a schematic diagram of a packaging structure 400 according to another embodiment of the present invention. Reference numerals are used to mark the same information. Figures 3A to 3E Components similar to those described. For example... Figure 4 In the illustrated embodiment, the first package 100 may include a first interposer 306, the upper portion of which is connected to the first substrate 102. The second package 200 includes a second interposer 308, the lower portion of which is connected to the second substrate 202. See also... Figures 3A to 3EThe described process forms the package structure 400. Before bonding the first package 100 and the second package 200, the first package 120 may expose the lower portion of the first adapter 306, and the second package 220 or adhesive layer 150 may expose the upper portion of the second adapter 308. Then, during bonding, the first adapter 306 and the second adapter 308 are aligned with each other, and the exposed lower portion of the first adapter 306 is bonded to the exposed upper portion of the second adapter 308. More specifically, in some embodiments, the first adapter 306 and the second adapter 308 may be bonded by solder 309. In some embodiments, adhesive layer 150 may be electrically connected to the first adapter 306 or the second adapter 308. It should be understood that, in addition to the adapters described above, other suitable connectors may be used to connect the first substrate 102 and the second substrate 202, such as conductive pillars.

[0046] Figures 5A to 5D This is a schematic diagram of the various intermediate stages of forming the packaging structure 500 according to another embodiment of the present invention. Figure 5A As shown, the first package 120 is selectively molded to form the first package 100. (And...) Figure 3A The difference in the illustrated embodiment is that the sidewall of the first portion 121 of the first package 120 adjacent to the second portion 122 of the first package 120 is an inclined sidewall 129. This creates an obtuse angle greater than 90 degrees on the non-flat surface 125 of the first package 120, instead of a right angle.

[0047] like Figure 5B As shown, the second package 220 is selectively molded to form the second package 200. (The last sentence appears to be incomplete and possibly refers to a different process.) Figure 3B The difference in the illustrated embodiment is that the sidewall 229 of the first portion 221 of the second package 220 adjacent to the second portion 222 of the second package 220 is an inclined sidewall. This creates an obtuse angle greater than 90 degrees on the non-flat surface 225 of the second package 220, instead of a right angle (e.g., ...). Figures 3A to 3E ).

[0048] like Figure 5C As shown, an adhesive layer 150 is formed over the second package 200. In some embodiments, the adhesive layer 150 may include a conductive material for electrical connection. In some embodiments, the adhesive layer 150 may be a shielding layer. In one embodiment, the adhesive layer 150 may be a conductive adhesive layer.

[0049] In another embodiment, the adhesive layer 150 may be an EMI film. In such an embodiment, the EMI film may be pressed onto the surface of the second package 200 by means of lamination (e.g., vacuum lamination) so that the formed EMI film conforms to the surface of the second package 200. The first portion 121 of the first package 120 has a sidewall 229 adjacent to the second portion 122 of the first package 120, and the first portion 221 of the second package 220 has a sidewall 229 adjacent to the second portion 222 of the second package 220. In this embodiment, since obtuse angles greater than 90 degrees are formed on the non-flat surface 125 of the first package 120 and the non-flat surface 225 of the second package 220, instead of right angles (e.g., ...), the EMI film may be formed on the non-flat surface 125 of the first package 120 and the non-flat surface 225 of the second package 220. Figures 3A to 3E It is easy to understand that pressing the adhesive layer 150 at a right angle may result in poor bonding at the right angle. By not forming right angles on the non-flat surface 125 of the first package 120 and the non-flat surface 225 of the second package 220, it is beneficial to press the adhesive layer 150.

[0050] like Figure 5D As shown, the first package 100 is flipped over, and the second package 200 is bonded to the first package 100 through the adhesive layer 150, thereby forming a package structure 500. Other aspects of the package structure 500 are similar to the package structures 300 and 400 described above, and will not be repeated here.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for forming an encapsulation structure, characterized in that, include: A first package is selectively molded using a first package body to form a first package, the first package having a first device and a first electronic component taller than the first device, wherein the first package body in the region corresponding to the first electronic component is taller than the first package body in the region corresponding to the first device; a second package is selectively molded using a second package body to form a second package, the second package having a second device and a second electronic component taller than the second device, wherein the second package body in the region corresponding to the second electronic component is taller than the second package body in the region corresponding to the second device; A void detection is performed on the first package to determine that there are no voids in the first package; The second package is subjected to void detection to determine that there are no voids in the second package; After the first package and the second package pass the gap detection, the second package is stacked on top of the first package and the second package is joined to the first package by an adhesive layer, wherein the second package body of the second package faces the first package body of the first package. Wherein, in the height direction in which the first package and the second package are joined together, the first electronic component overlaps with the second device, the second electronic component overlaps with the first device, and the interface where the first package and the second package are joined together includes an inclined joint surface.

2. The method for forming an encapsulation structure according to claim 1, characterized in that, The first package has a first adapter, the second package has a second adapter, and engaging the second package with the first package includes: Align the first adapter with the second adapter, and engage the second adapter with the first adapter.

3. The method for forming an encapsulation structure according to claim 1, characterized in that, Joining the second package to the first package includes: The second package is bonded to the first package using solder.

4. The method for forming an encapsulation structure according to claim 1, characterized in that, Joining the second package to the first package includes: A flexible circuit board is used to connect the first substrate of the first package to the second substrate of the second package.

5. The method for forming an encapsulation structure according to claim 1, characterized in that, At the interface where the first package and the second package engage, the shapes of the first package and the second package are complementary.

6. A packaging structure, characterized in that, include: A first package includes a first package body having a first portion and a second portion adjacent to each other. The first portion of the first package body protrudes beyond the second portion of the first package body. The first package includes a first substrate and a first electronic component and a first device disposed on the first substrate. The first electronic component is higher than the first device, and the first portion of the first package body covers the first electronic component, and the second portion of the first package body covers the first device. The second package, stacked on top of the first package, includes a second package body having a first portion and a second portion adjacent to each other. The first portion of the second package body protrudes beyond the second portion of the second package body. The second package includes a second substrate and a second electronic component and a second device disposed on the second substrate. The second electronic component is higher than the second device, and the first portion of the second package body covers the second electronic component, and the second portion of the second package body covers the second device. Wherein, the first portion of the first package is opposite to the second portion of the second package and is joined by an adhesive layer, and the second portion of the first package is opposite to the first portion of the second package and is joined by the adhesive layer; Wherein, in the height direction where the first package and the second package are joined together, the first electronic component overlaps with the second device, the second electronic component overlaps with the first device, and the sidewall of the first portion of the first package adjacent to the second portion of the first package is an inclined sidewall, and the sidewall of the first portion of the second package adjacent to the second portion of the second package is an inclined sidewall.

7. The packaging structure according to claim 6, characterized in that, The adhesive layer includes a conductive material.

8. The packaging structure according to claim 6, characterized in that, The adhesive layer is a shielding layer.

9. The packaging structure according to claim 6, characterized in that, The adhesive layer is a conductive adhesive layer or an EMI film.

10. The packaging structure according to claim 6, characterized in that, The first package includes a first adapter, and the first package body exposes the first adapter. The second package includes a second adapter, the second package body exposes the second adapter, and the first adapter and the second adapter are aligned with and engaged with each other.

11. The packaging structure according to claim 10, characterized in that, The first adapter and the second adapter are joined together by solder.

12. The packaging structure according to claim 6, characterized in that, Also includes: A flexible circuit board connects the first substrate of the first package and the second substrate of the second package from the outside of the first package and the second package.

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