Feedthrough assembly and device comprising the same

Abstract

Various embodiments of a feedthrough joint assembly and a device including the same are disclosed. The assembly includes a joint having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed proximate the inner surface of the joint, a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via extending through the dielectric substrate and the joint. The feedthrough pin extends beyond the outer surface of the joint.

Description

Technical Field

[0001] This disclosure generally relates to a feedthrough connector assembly, and more particularly to an implantable medical device including said feedthrough connector assembly. Background Technology

[0002] Implantable medical devices, such as implantable pacemakers, can deliver pacing pulses to a patient's heart and monitor the patient's cardiac condition. In some instances, an implantable pacemaker includes a pulse generator and one or more electrical leads. For example, the pulse generator can be implanted in a small pouch in the patient's chest. The electrical leads can be coupled to the pulse generator, which may include circuitry for generating pacing pulses and / or sensing cardiac electrical activity. The electrical leads can extend from the pulse generator to a target site (e.g., the atrium and / or ventricle), such that electrodes at the distal ends of the leads are positioned at the target site. The pulse generator can then provide electrical stimulation to the target site and / or monitor cardiac electrical activity at the target site via the electrodes.

[0003] Other implantable pacemakers are configured to be implanted entirely within the heart chambers. Such pacemakers may be referred to as intracardiac pacing devices or leadless pacing devices, and may include one or more electrodes on their outer casing to deliver therapeutic electrical signals and / or sense intrinsic depolarization of the heart. These pacemakers may be positioned inside or outside the heart, and in some instances, may be anchored to the heart wall via a fixation mechanism. Summary of the Invention

[0004] This disclosure generally relates to a feedthrough connector assembly and an implantable medical device including said assembly. The assembly may include a connector and a dielectric substrate including a patterned conductive layer, wherein the dielectric substrate insulates the patterned conductive layer from the connector. The assembly may also include a feedthrough pin electrically connected to a conductive portion of the patterned conductive layer. The feedthrough pin extends through the dielectric substrate and the connector and beyond the outer surface of the connector while maintaining isolation from the connector. The feedthrough connector assembly may form part of an electronic module. This electronic module may be electrically connected to a power source to provide the implantable medical device.

[0005] In one example, aspects of this disclosure relate to a feedthrough connector assembly, comprising: a connector having an inner surface and an outer surface; and a dielectric substrate having a first main surface and a second main surface. The second main surface of the dielectric substrate is configured adjacent to the inner surface of the connector. The assembly further includes a patterned conductive layer disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via extending through the dielectric substrate and the connector. The feedthrough pin extends beyond the outer surface of the connector.

[0006] In another example, aspects of this disclosure relate to an electronic module comprising: an electronic layer having a substrate and electronic components disposed on the substrate; and a feedthrough connector assembly electrically connected to the electronic layer. The feedthrough connector assembly includes: a connector having an inner surface and an outer surface; and a dielectric substrate having a first main surface and a second main surface. The second main surface of the dielectric substrate is configured adjacent to the inner surface of the connector. The assembly further includes a patterned conductive layer disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion. The assembly also includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a through-hole extending through the dielectric substrate and the connector. The feedthrough pin extends beyond the outer surface of the connector.

[0007] In another example, aspects of this disclosure relate to an implantable medical device comprising: a power source; and an electronic module electrically connected to the power source, the electronic module including an electronic layer and a feedthrough connector assembly electrically connected to the electronic layer. The electronic layer includes a substrate and electronic components disposed on the substrate. The feedthrough connector assembly includes: a connector having an inner surface and an outer surface; and a dielectric substrate having a first main surface and a second main surface. The second main surface of the dielectric substrate is configured adjacent to the inner surface of the connector. The feedthrough connector assembly further includes a patterned conductive layer disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion. The feedthrough connector assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via extending through the dielectric substrate and the connector. The feedthrough pin extends beyond the outer surface of the connector.

[0008] In another example, an aspect of this disclosure relates to a method comprising forming a patterned conductive layer on a first main surface of a dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion. The method further comprises: electrically connecting a feedthrough pin to a second conductive portion of the patterned conductive layer; and setting the second main surface of the dielectric substrate as an inner surface adjacent to a connector, such that the feedthrough pin is disposed within a via and extends through the dielectric substrate, the connector, and beyond the outer surface of the connector.

[0009] Details of one or more aspects of this disclosure are set forth in the accompanying drawings and the following description. Other features, objects, and advantages of the technology described in this disclosure will become apparent from the detailed description, the accompanying drawings, and the claims. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of one implementation of an implantable medical device placed inside a patient's body.

[0011] Figure 2yes Figure 1 A schematic perspective view of an implantable medical device.

[0012] Figure 3 yes Figure 1 A schematic block diagram of an implantable medical device.

[0013] Figure 4 yes Figure 1 A schematic perspective view of an implantable medical device.

[0014] Figure 5 yes Figure 1 A schematic partially exploded diagram of an implantable medical device.

[0015] Figure 6 yes Figure 1 A schematic partially exploded view of the electronic module of an implantable medical device.

[0016] Figure 7 yes Figure 6 A schematic side view of the electronic module.

[0017] Figure 8 yes Figure 6 A schematic cross-sectional view of the feedthrough connector assembly of the electronic module.

[0018] Figure 9 yes Figure 8 A schematic plan view of the dielectric substrate and patterned conductive layer of the feedthrough connector assembly.

[0019] Figure 10 yes Figure 8 A schematic perspective view of the feedthrough connector assembly.

[0020] Figure 11 This is a schematic perspective view of another implementation of an implantable medical device.

[0021] Figure 12 yes Figure 11 A schematic cross-sectional view of an implantable medical device.

[0022] Figure 13 It is formed Figure 1 A flowchart of an implementation scheme for a method of implantable medical device.

[0023] Figure 14 This is an exploded view of another embodiment of the feedthrough connector assembly.

[0024] Figure 15 yes Figure 14 A perspective view of the feedthrough connector assembly;

[0025] Figure 16 This is a schematic exploded view of another embodiment of the feedthrough connector assembly.

[0026] Figure 17 This is a schematic perspective view of another embodiment of the feedthrough connector assembly.

[0027] Figure 18 This is a schematic perspective view of another implementation scheme of the electronic module. Detailed Implementation

[0028] This disclosure generally relates to a feedthrough connector assembly and an implantable medical device including said assembly. The assembly may include a connector and a dielectric substrate including a patterned conductive layer, wherein the dielectric substrate insulates the patterned conductive layer from the connector. The assembly may also include a feedthrough pin electrically connected to a conductive portion of the patterned conductive layer. The feedthrough pin extends through the dielectric substrate and the connector and beyond the outer surface of the connector while maintaining isolation from the connector. The feedthrough connector assembly may form part of an electronic module. This electronic module may be electrically connected to a power source to provide the implantable medical device.

[0029] A typical connector assembly for an implantable medical device may include a feedthrough pin that is electrically connected to an electronic module housed within the device housing. The feedthrough pin may extend from inside the housing and beyond the connector connected to the housing. Because one or both of the housing or the connector may be electrically active, the feedthrough pin is typically insulated from both the connector and the housing. Openings in the connector and the housing through which the feedthrough pin extends must be sealed to prevent bodily fluids and contaminants from flowing into the interior of the housing, which could damage the electronic components therein.

[0030] One or more embodiments of this disclosure may provide a feedthrough connector assembly including feedthrough pins that can be connected to an electronic module disposed within a device housing, wherein the feedthrough pins are reliably electrically connected to the module while making efficient use of space within the housing. The feedthrough connector assembly may be compatible with various standard surface mount processes and reliably and dimensionally efficient in connecting to solderable components or subassemblies of integrated circuits or die stacks.

[0031] Figure 1 This is a schematic diagram of one embodiment of an implantable medical device 12 (IMD) disposed within the body of patient 2. IMD 12 may include any suitable medical device, such as a pacemaker, pressure sensor, cardiac monitor, other physiological sensors, etc. IMD 12 may include the arrangement of electronic modules and feedthrough connector assemblies, as further described herein. IMD 12 may be, for example, an implantable leadless pacemaker configured to be fully implanted in a chamber of heart 4 and to deliver electrical signals to the heart below sternum 3 via electrodes carried on the pacemaker's housing.

[0032] The IMD 12 is typically described as an intracardiac pacing device attached to a chamber of the heart 4. In one or more embodiments, the IMD 12 may be attached to the outer surface of the heart 4, such that the device is located outside the heart but can pace in the desired chamber. In one or more embodiments, the IMD 12 is attached to the outer surface of the heart 4, and one or more components of the device may contact the epicardium of the heart. Figure 1 The diagram schematically illustrates an IMD 12, which is attached to the ventricular wall of the heart 4 via one or more fixation elements (e.g., serrations, spirals, etc.) that penetrate the tissue. These fixation elements secure the IMD 12 to the cardiac tissue and maintain contact between the electrodes (e.g., cathodes or anodes) and the cardiac tissue. The IMD 12 can be implanted at or near the apex of the heart. In one or more embodiments, the pacing device can be implanted at other ventricular locations, such as on the free wall or septum, at the atrium, or anywhere on or within the heart 4.

[0033] Figure 2 yes Figure 1 A schematic side view of the IMD 12. In one or more embodiments, the IMD 12 is adapted to be implanted within the cardiac chamber of the heart 4 of a patient 2, for example, to monitor the electrical activity of the heart and / or to deliver electrical therapy to the heart. Figure 2 In the example shown, IMD 12 includes a housing 14, fixed teeth 16, and electrodes 18 and 20.

[0034] The housing 14 of the IMD 12 may include any suitable size and take any suitable one or more shapes. The housing 14 extends along the longitudinal axis 10 between a first end 6 and a second end 8. In one or more embodiments, the housing 14 may have a cylindrical (e.g., pill-shaped) shape factor. In one or more embodiments, the housing 14 comprises an elongated tubular housing. Furthermore, the housing 14 may include any suitable one or more materials as further described herein.

[0035] The IMD 12 may include a fixation mechanism suitable for securing the pacemaker 12 to tissue within the patient 2. For example, in Figure 2In the embodiment illustrated in the figure, the IMD 12 includes retaining teeth 16 extending from the housing 14, the retaining teeth 16 being adapted to engage with tissue to substantially secure the housing in position within the patient 2. In one or more embodiments, the retaining teeth 16 are adapted to anchor the housing 14 to cardiac tissue such that the pacemaker 12 moves with the cardiac tissue during cardiac contraction. The retaining teeth 16 may comprise any suitable material, such as shape memory materials (e.g., nitinol). Although the IMD 12 includes multiple retaining teeth 16 adapted to anchor the device to tissue, in one or more embodiments, other types of fixation mechanisms (e.g., but not limited to barbs), coils, etc., may be used to secure the device to tissue.

[0036] The housing 14, also referred to as an elongated housing, houses the electronic components of the IMD 12, such as sensing circuitry for sensing electrical activity via electrodes 18 and 20 and treatment generation circuitry for delivering electrical stimulation therapy via the electrodes. The electronic components may include any discrete and / or integrated electronic circuitry implementing analog and / or digital circuitry capable of producing the functionality attributed to the IMD 12 described herein. In one or more embodiments, the housing 14 may also house components for sensing other physiological parameters, such as acceleration, pressure, sound, and / or impedance. Although shown with two electrodes 18 and 20, the device 12 may include any suitable number of electrodes disposed in any suitable portion or section of the housing.

[0037] Additionally, housing 14 may also house a memory containing instructions that, when executed by processing circuitry housed within the housing, cause IMD 12 to perform various functions belonging to the present invention. In one or more embodiments, housing 14 may house communication circuitry enabling IMD 12 to communicate with other electronic devices, such as a medical device programmer. In one or more embodiments, housing 14 may house an antenna for wireless communication. Housing 14 may also house a power source, such as a battery. Housing 14 may be hermetically sealed or nearly hermetically sealed using any suitable technology to help prevent fluid ingress into the housing. For example, in one or more embodiments, one or more portions of housing 14 may be hermetically sealed together using one or more laser diffusion bonding techniques described in jointly owned U.S. Patent No. 10,124,559B2 entitled KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS.

[0038] The IMD 12 includes electrodes 18, 20 that can be connected to the housing using any suitable one or more technologies. In one or more embodiments, at least one of the electrodes 18, 20 may be mechanically connected to the housing 14. In one or more embodiments, at least one of the electrodes 18, 20 may be defined by a conductive exterior of the housing 14. For example, electrode 20 may be defined by a conductive portion of the housing 14 that exposes tissue.

[0039] Electrodes 18 and 20 are insulated from each other. Electrode 18 may be referred to as a tip electrode, and retaining teeth 16 may be adapted to anchor IMD 12 to tissue such that electrode 18 remains in contact with the tissue. In one or more embodiments, retaining teeth 16 may also be electrically connected to one or more electronic components such that the teeth are adapted to direct electrical signals to the patient's tissue and / or receive electrical signals from the tissue. In one or more embodiments, a portion of housing 14 may be covered with or formed of insulating material to isolate electrodes 18 and 20 from each other and / or to provide the desired size and shape for one or both electrodes.

[0040] Electrode 20 may be part of housing 14, such as second portion 24, which does not include this insulating material. Electrode 20 may be most or all of housing 14, but most of housing (except for electrode 20) may be covered with an insulating coating. In one or more embodiments, electrode 20 may be coated with a material to facilitate conduction. In one or more embodiments, electrode 20 may be part of a separate ring portion of housing 14, which is conductive. Electrodes 18, 20 that may include conductive portions of the first portion 22 of housing 14 may be electrically connected to at least some electronics of pacemaker 12 (e.g., sensing circuitry, electrical stimulation circuitry, or both). In one or more embodiments, housing 14 may include end cap 26 that may accommodate or surround a feedthrough connector assembly (e.g., Figure 3 The feedthrough connector assembly 42) is used to electrically connect the electrode 18 to electronic devices within the housing 14, while insulating the electrode (e.g., including electrode 20 or other conductive portions of the housing) from the housing 14.

[0041] In such Figure 2In the embodiment illustrated in the figure, housing 14 includes a first portion 22 and a second portion 24. The first portion 22 may be disposed adjacent to a first end 6 of housing 14, while the second portion 24 may be disposed adjacent to a second end 8 of housing 14. As used herein, the term "adjacent to the first end" means that an element or component is disposed closer to the first end 6 of housing 14 than to the second end 8 of housing 14. Similarly, the term "adjacent to the second end" means that an element or component is disposed closer to the second end 8 of housing 14 than to the first end 6 of housing 14. In one or more embodiments, the second portion 24 may define at least a portion of a power supply compartment (e.g., a battery) housing the power source of IMD 12. In one or more embodiments, the second portion 24 may include conductive portions of housing 14 forming electrodes 20.

[0042] The second portion 24 of the housing may include a vent 35 disposed in any suitable location. The vent 35 may allow backfill gas exchange of the encapsulation device 12 prior to the first portion 22 being connected to the second portion. Once gas exchange is complete, the vent 35 may be sealed by welding, as further described in U.S. Patent Application No. 17 / 118,283, entitled HERMETIC ASSEMBLY AND DEVICEINCLUDING SAME, by Ruben et al.

[0043] The first portion 22 of housing 14 can be attached to the second portion 24 of housing using any suitable technology or one or more. In one or more embodiments, the first portion 22 of housing 14 can be attached to the second portion 24 of housing using laser bonding. For example, electromagnetic radiation (e.g., light) can be directed through the outer surface of the first portion 22 and focused at the interface between the first and second portions 24 to form a laser bond.

[0044] A bond can be formed between the first portion 22 and the second portion 24 of the housing 14 using any suitable electromagnetic radiation. In one or more embodiments, the electromagnetic radiation may include a laser, which may include any suitable wavelength or wavelength range. In one or more embodiments, the laser may include light having a wavelength of at least 200 nm. In one or more embodiments, the laser may include a wavelength not greater than 10,000 nm. For example, the laser may include UV light, visible light, IR light, and combinations thereof. In one or more embodiments, a UV laser may be used to provide light having a wavelength of about 350 nm and a pulse width of 30 ns. In one or more embodiments, the materials of the first portion 22 and the second portion 24 of the housing 14, as well as the power level and wavelength of the light used, may be selected such that the light does not directly damage, ablate, distort, or cut the housing, and that the first and second portions of the housing maintain their integral properties.

[0045] Generally, light can be provided by any suitable laser or laser system. For example, a laser can generate light with a relatively narrow set of wavelengths (e.g., a single wavelength). The light emitted by the laser can form a collimated beam, which may not be focused at a specific point. The light emitted by the laser can be focused at the interface between the first portion 22 and the second portion 22 of the housing 14 to generate laser bonding.

[0046] Although lasers can provide light with a narrow wavelength range, in one or more embodiments, a laser can represent one or more devices that emit light with a wider wavelength range than a single typical laser. A wide variety of devices can be used to emit light with narrow or wide wavelength ranges. In one or more embodiments, the laser can include one or more laser devices, including diode and fiber lasers. Laser sources can also include, for example, TI sapphire, argon ion, Nd:YAG, XeF, HeNe, dye, GaAs / AlGaAs, CO2, alexandrite, InGaAs, InGaAsP, Nd:glass, Yb:YAG, or Yb fiber lasers. Laser devices can also include one of continuous wave, modulated, or pulsed modes. Therefore, a wide variety of laser devices can be used in the bonding process. In one or more embodiments, the laser power level can be set to approximately 1W, distributed over a focused beam diameter of approximately 10 μm with a high-top-cap or Gaussian spatial energy profile.

[0047] exist Figure 2 In one embodiment, the IMD 12 may further include a flange 28 connected at the second end 8 of the housing defining an opening to the second portion 24 of the housing 14. The flange 28 allows a medical device to be attached to the IMD 12, for example, for delivery and / or removal of a device. For example, extending through the insertion into the heart 4 ( Figure 1 The tether of the catheter can be attached to the flange 28 and / or through the opening to insert or remove the IMD 12.

[0048] Figure 3 This is a schematic block diagram of one embodiment of IMD 12, including a power source 30 (e.g., a battery), an electronic module 32, and an electrical contact assembly 34. Although... Figure 3 The IMD is described as IMD 12, but Figure 3 The structure shown can also be used for other implantable or external medical devices, such as cardioverter defibrillators, physiological monitors or neurostimulators, or any other electronic devices.

[0049] The housing 14 includes a first portion 22, a second portion 24, and a sidewall 36 disposed within the housing between the battery 30 and the electrical contact assembly 34. The sidewall 36 may be disposed within the first portion 22 and the second housing portion 24 or at the boundary between the first housing portion and the second housing portion. In one or more embodiments, the first housing portion 22 and the second housing portion 24 are shared with a ground terminal of the battery 30. In one or more embodiments, one or both of the first housing portion 22 and the second housing portion 24 are non-conductive. For example, the first housing portion 22 may be formed of a non-conductive material such as sapphire, which can more easily transmit electromagnetic signals into and out of the housing 14 compared to metals or other conductive materials.

[0050] like Figure 3 As illustrated in the embodiment shown in the figure, a sidewall 36 extends across the housing 14 between the battery 30 on one side and the electrical contact assembly 34 on the other side. The sidewall 36 may include at least one feedthrough (not shown) to allow electrical connection between the battery 30 and the electronic module 32. As discussed herein, the feedthrough assembly 42 may also include at least one feedthrough to allow electrical connection between the electrode 18 and the electronic layer 40. The electronic module 32 is disposed between the electrode 18 and the electrical contact assembly 34. In one or more embodiments, the electrical contact assembly 34 may be secured to the sidewall 36 to provide mechanical support for the electronic module 32. The electrical contact assembly 34 provides electrical connection between the battery 30 and the electronic module 32. For example, the electronic module 32 may include one or more electrical contacts adapted to electrically connect the module to the electrical contact assembly 34.

[0051] IMD 12 may also include a battery connector 38 disposed between the battery 30 and the electrical contact assembly 34. A sidewall 36 may form part or all of the battery connector 38. The battery connector 38, sidewall 36, and electrical contact assembly 34 may be electrically connected to the electronic module 32 using any suitable technology or one or more of these methods. In one or more embodiments, the battery connector 38, sidewall 36, and / or electrical contact assembly 34 may include feedthroughs and / or openings for establishing an electrical connection between the battery 30 and the electronic module 32.

[0052] Electrical contact assembly 34 may include any suitable component for electrically connecting electronic module 32 and battery 30, such as one or more embodiments of the electrical contact assembly described in co-owned U.S. Patent Application Serial No. 17 / 071,463 entitled ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE. In one or more embodiments, electrical contact assembly 34 may include spring contacts for holding electronic module 32 in place and for providing an electrical connection between electronic module and battery 30.

[0053] The IMD 12 can be manufactured using a single tube for the first housing portion 22 or as two tube portions for such a housing portion. Using a single tube for the housing portion 22 reduces the cost and complexity of the pacemaker 12's housing compared to two portions (e.g., two half-tubes). The single tube opens up new housing options and can be manufactured from alternative materials. For example, a single sapphire tube for the first housing portion 22 could allow for wireless charging of the battery 30, even when the IMD 12 is implanted in a patient.

[0054] In one or more embodiments, at least one of the first portion 22 and the second portion 24 of the housing 14 may comprise a substantially transparent material. As used herein, the phrase “substantially transparent” means that, assuming no reflected light at the air-substrate boundary, the substrate transmits more than 50% of the electromagnetic radiation incident on the substrate for a selected wavelength or wavelength range. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation with a wavelength of at least 200 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation with a wavelength greater than 10,000 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit electromagnetic radiation in the wavelength range of 200 nm to 10,000 nm. In one or more embodiments, at least one of the first portion 22 and the second portion 24 may substantially transmit at least one of UV light, visible light, or IR light. The substantially transparent material may comprise at least one of glass, quartz, silicon dioxide, sapphire, silicon carbide, diamond, or gallium nitride.

[0055] In one or more embodiments, the first housing portion 22 may include a substantially transparent material, allowing one or more sensors, transmitters, or detectors to be disposed within and emitting or receiving electromagnetic radiation through this portion. For example, Figure 4 yes Figures 1 to 3 The perspective view of IMD 12, with the first transparent portion 22 partially removed for clarity. (See image.) Figure 4 As shown, electronic module 32 is disposed within the first part 22.

[0056] Electronic module 32 may include any suitable element or component. For example, such as Figure 3 As shown, the electronic module 32 includes one or more layers of electronic layers 40 and feedthrough connector assemblies 42 electrically connected to one or more layers of electronic layers 40. The electronic module 32 may also include one or more coils 44 electrically connected to the electronic layers 40.

[0057] Figures 5 to 7 yes Figures 1 to 4 An exploded view of the electronic module 32 of the pacemaker 12. Module 32 includes an electronic layer 40 and a feedthrough connector assembly 42 electrically connected to the electronic layer.

[0058] Electronic layer 40 includes a first electronic layer 48, a second electronic layer 50, and a third electronic layer 52. Although illustrated as including three electronic layers, electronic layer 40 may include any suitable number of layers, such as one, two, three, four, five, or more layers. Each layer in electronic layer 40 may include a substrate. For example, the first electronic layer 48 includes a substrate 54 having a first main surface 56 and a second main surface 58.

[0059] The electronic layer 40 can be positioned relative to the feedthrough connector assembly 42 and the battery 30 in any suitable relationship. In one or more embodiments, the electronic layers 40 can be positioned such that they are substantially orthogonal to the longitudinal axis 10 of the IMD 12. Figure 5 The housing 14 of the device extends along a longitudinal axis. For example, the first main surface 56 of the substrate 54 of the first electronic layer 48 is substantially orthogonal to the longitudinal axis 10 of the housing 14. As used herein, the term “substantially orthogonal” means that the longitudinal axis 10 forms an angle of no more than 10 degrees with one or more substrates in the electronic layers 40.

[0060] The electronic layers 40 can be electrically connected together using any suitable one or more techniques. In one or more embodiments, one or more layers of the electronic layers 40 may include one or more conductive vias configured to pass through the respective substrates of one or more layers of the electronic layers. Furthermore, one or more conductive pads 60 may be disposed on one or more layers of the conductive layers 40 to provide electrical connections between the feedthrough assembly 42 and the conductive layers, between layers of the conductive layers, and between the conductive layers and the electrical contact assembly 34. For example, the conductive pads 62 may be disposed between the feedthrough assembly 42 and the first electronic layer 48 (e.g., between their conductive surfaces) to provide an electrical connection between the feedthrough assembly and the first electronic layer. In one or more embodiments, this connection may be between the housing 14 and the first electronic layer 48, or between one or more of the pins 84 of the assembly and the first electronic layer. The conductive pads 60 may include any suitable conductive contacts, such as solder bumps, solder balls, conductive epoxy, brazing alloys, etc.

[0061] One or more layers of electronic layers 40 may include electronic components disposed on their respective substrates. For example, the first electronic layer 48 includes electronic components 64 disposed on a first main surface 56 of substrate 54. Electronic components 64 may be disposed on at least one of the first main surface 56 or the second main surface 58 of substrate 54. Any suitable number of electronic components may be disposed on one or both main surfaces 56, 58 of substrate 54. Furthermore, electronic components 64 may be electrically connected to one or more additional electronic components disposed on substrate 54 or on the second electronic layer 50 or the third electronic layer 52 using any suitable one or more techniques. In one or more embodiments, electronic components 64 may be disposed on a patterned conductive layer (not shown) disposed on substrate 54 using any suitable one or more techniques. One or more conductive vias may be disposed between the first main surface 56 and the second main surface 58 of substrate 54 to provide one or more conductive paths between the patterned conductive layer and other elements or components disposed on the side of substrate 54 opposite to the electronic components. Furthermore, one or more conductive pads 60 may be directly connected to electronic components 64 to electrically connect the components to one or more additional components or devices.

[0062] Coil 44 is electrically connected to one or more layers of electronic layer 40. This coil 44 may include any suitable number of coils disposed on or within housing 46, and one or more electronic components also disposed within housing 46. Coil 44 can be used to inductively couple device 12 to an external inductive charging system for charging the device when implanted in patient 4, or for telemetry or other types of communication with a transceiver outside the patient. Coil 44 can be electrically connected to electronic layer 40 using any suitable one or more technologies. Furthermore, coil 44 can be electrically connected to, for example, electronic layer 52 using any suitable one or more technologies. Housing 46 of coil 44 can provide one or more electrical pathways between battery 30 and electronic layer 40 using any suitable one or more technologies. In one or more embodiments, one or more conductors 47 ( Figure 4 It can be disposed on or within housing 46 to provide one or more of these electrical pathways.

[0063] The feedthrough connector assembly 42 is also electrically connected to one or more layers of the electronic layer 40. For example... Figure 6 As shown, component 42 includes a connector 66 having an inner surface 68 and an outer surface 70. Component 42 also includes a dielectric substrate 72 having a first main surface 74 and a second main surface 76. Figure 9 The second primary surface 76 of the dielectric substrate 72 is configured to be adjacent to the inner surface 68 of the connector 66. As used herein, the term "adjacent to inner surface" means that an element or component is configured to be closer to the inner surface 68 of the connector than to the outer surface 70 of the connector.

[0064] Component 42 may take any suitable shape or have any suitable size. In one or more embodiments, component 42 may include an elliptical cross-section in a plane substantially parallel to the first main surface 74 of the dielectric substrate 72.

[0065] Component 42 further includes one or more patterned conductive layers 78 disposed on a first main surface 74 of the dielectric substrate 72. The patterned conductive layer 78 includes a first conductive portion 80 and a second conductive portion 82 insulated from the first conductive portion. Component 10 also includes the second conductive portion 82 electrically connected to the patterned conductive layer 78 and disposed in a through-hole 86 extending through the dielectric substrate 72 and the connector 66. Figure 8 Feedthrough pin 84 is located within the connector 66. Feedthrough pin 84 extends beyond the outer surface 70 of the connector 66.

[0066] The connector 66 can have any suitable size and take any suitable one or more shapes. Furthermore, the connector 66 can comprise any suitable one or more materials, such as at least one of titanium, copper, niobium, tantalum, or alloys thereof. In one or more embodiments, the connector 66 is conductive.

[0067] The connector 66 may include a flange 88 that at least partially forms the outer surface 70 of the connector. The flange 88 may be adapted to connect the connector 66 to the end cap 26. Figure 2 In addition, connector 66 may include one or more conductive protrusions 90. Figure 10 Each conductive protrusion 90 extends from the inner surface 68. The conductive protrusions 90 can take any suitable shape or have any suitable size. Furthermore, the connector 66 can include any suitable number of conductive protrusions 90, for example, one, two, three, four, five, or more conductive protrusions. The conductive protrusions 90 can be integrally formed with the connector 66. In one or more embodiments, the conductive protrusions 90 can be deposited onto or attached to the inner surface 68 of the connector 66 using any suitable one or more techniques.

[0068] Conductive protrusions 90 are electrically connected to connector 66. In one or more embodiments, one or more conductive protrusions 90 are adapted to electrically connect connector 66 to a first conductive portion 80 of patterned conductive layer 78. In one or more embodiments, one or more conductive protrusions 90 extend from the inner surface 68 of connector 66 through dielectric substrate 72 to the first conductive portion 80 of patterned conductive layer 78. The conductive protrusions 90 can be electrically connected to the first conductive portion 80 using any suitable one or more techniques, such as brazing, soldering, conductive epoxy, etc.

[0069] The dielectric substrate 72 is positioned adjacent to the inner surface 68 of the connector 66. The dielectric substrate 72 can take any suitable shape or one or more. In one or more embodiments, any suitable technique can be used to attach the connector 66 to the dielectric substrate 72, such as adhesive (e.g., using pressure-sensitive adhesive), mechanical fastening, bonding, etc. In one or more embodiments, the dielectric substrate 72 can take a substantially rectangular shape, which can extend beyond the outer periphery of the connector 66, such as... Figure 9 As shown, one or more portions of the dielectric substrate can be removed during the manufacturing process, such that the dielectric substrate takes the form of... Figure 6 The elliptical shape shown is consistent with the shape of connector 66. Furthermore, dielectric substrate 72 may include any suitable one or more dielectric materials, such as at least one of polyimide, polyester, or polyester film. Additionally, dielectric substrate 72 may include one or more layers of material, which are connected together using any suitable one or more techniques.

[0070] A patterned conductive layer 78 is disposed on a first main surface 74 of the dielectric substrate 72. The patterned conductive layer 78 can take any suitable shape or have any suitable size. Furthermore, the patterned conductive layer 78 may comprise any suitable conductive material or material, such as at least one of titanium, copper, niobium, or platinum. The patterned conductive layer 78 can be disposed on the first main surface 74 of the dielectric substrate 72 using any suitable technique or method, such as chemical vapor deposition, plasma deposition, or photolithography with adhesive bonding. Additionally, the patterned conductive layer 78 can be patterned using any suitable technique or method, such as photolithography.

[0071] The feedthrough connector assembly 42 may further include one or more conductive pads 62 disposed on the patterned conductive layer 78 such that the patterned conductive layer is located between the conductive pads and the dielectric substrate 72. Any suitable number of conductive pads 62 may be disposed on the patterned conductive layer 78. The conductive pads 62 may include any suitable conductive structure, such as solder bumps, solder paste, conductive epoxy, or at least one of conductive contacts. Furthermore, the conductive pads 62 may be adapted to electrically connect the patterned conductive layer 78 to one or more layers of the electronic layers 40 of the electronic module 32. In one or more embodiments, the conductive pads 62 may electrically connect at least one of a first conductive portion 80 or a second conductive portion 82 (or any suitable number of additional conductive portions) of the patterned conductive layer 78 to the first electronic layer 48 in the electronic layer 40. In one or more embodiments, the conductive pads 62 may provide redundant connections between the patterned conductive layer 78 and other components of the IMD 12 (e.g., one or more layers of the electronic layers 40).

[0072] The conductive pad 62 can be disposed on the patterned conductive layer 78 using any suitable one or more techniques, such as sputtering, electroplating, etc. In one or more embodiments, the conductive pad 62 can be integral with the patterned conductive layer 78, that is, the conductive pad and the patterned conductive layer are formed as a single entity.

[0073] Feedthrough pin 84 is electrically connected to a second conductive portion 82 of the patterned conductive layer 78. The feedthrough pin 84 can be electrically connected to the second conductive portion 82 using any suitable technique or one or more, such as soldering, brazing, copper soldering, adhesion using conductive adhesives, etc. In one or more embodiments, the feedthrough pin 84 is electrically connected to the second conductive portion 82 of the patterned conductive layer 78 via a solder contact. Furthermore, in one or more embodiments, the feedthrough pin 84 may extend through the second conductive portion 82 of the patterned conductive layer 78, such as... Figure 8 As shown.

[0074] As mentioned herein, a feedthrough pin 84 is disposed within a via 86, which extends through the dielectric substrate 72 and the connector 66. Figure 8 As shown, an insulating material 94 may be disposed between the feedthrough pin 84 and at least a portion 96 of the through-hole 86 configured to pass through the connector 66, thereby insulating the feedthrough pin from the connector. Any suitable insulating material 94 may be used to isolate the feedthrough pin 84 within the through-hole 86, such as glass, sapphire, epoxy resin, or other non-conductive materials that provide a seal.

[0075] The feedthrough connector assembly 42 may also include one or more electronic components. For example, such as... Figure 9 As shown, component 42 includes one or more filters 92 disposed at any suitable location on the patterned conductive layer 78. In one or more embodiments, the filter 92 may be electrically connected to at least one of a first conductive portion 80 or a second conductive portion 82 of the patterned conductive layer 78. Furthermore, the filter 92 may utilize any suitable one or more techniques to be electrically connected to at least one of the first conductive portion 80 or the second conductive portion 82. The filter 92 may include any suitable filter or other electronic component.

[0076] Although described as including one feedthrough pin 84, the feedthrough connector assembly 42 may include any suitable number of feedthrough pins, such as two, three, four, five, or more. For example, Figures 11 to 12 Various views of another embodiment of the pacemaker 200. Figures 1 to 10 All design considerations and possibilities of the pacing device 12 also apply to Figure 11 The pacing device 100.

[0077] One difference between pacemaker 200 and pacemaker 12 is that pacemaker 100 includes four feedthrough pins 202 extending from the end cap 204 of the device. Each of the feedthrough pins 202 can be electrically connected to a conductive portion of a patterned conductive layer (e.g., Figure 6 The second conductive portion 82 of the patterned conductive layer 78. Furthermore, each of the feedthrough pins 202 may be disposed within a via 206 extending through the dielectric substrate 208 and the connector 210. In one or more embodiments, two or more of the feedthrough pins may be disposed in the same via and insulated using an insulating material. In one or more embodiments, each feedthrough pin 202 may be disposed in its respective via. Furthermore, each of the feedthrough pins 202 may extend beyond the outer surface of the connector, such as... Figure 8 The feedthrough pin 84 and connector 66 are shown.

[0078] The dielectric substrate (e.g.,) can be fabricated using any suitable technique or one or more. Figures 1 to 10 The dielectric substrate 72) is connected to a connector (e.g., connector 66) such that the dielectric substrate remains positioned and oriented as desired. For example, Figures 14 to 15 This is a schematic exploded and perspective view of another embodiment of the feedthrough connector assembly 400. This article is about... Figures 1 to 10 All design considerations and possibilities described in feedthrough connector assembly 42 also apply to the feedthrough connector assembly 42. Figures 14 to 15 A feedthrough connector assembly 400. Assembly 400 includes a connector 466 having an inner surface 468, a dielectric substrate 472 including a first main surface 474 and a second main surface (not shown), and a patterned conductive layer 478 disposed on the first main surface of the dielectric substrate. The second main surface of the dielectric substrate 472 is configured adjacent to the inner surface 468 of the connector 466. Although not shown, assembly 400 may also include feedthrough pins electrically connected to the patterned conductive layer 478 (e.g., ...). Figure 8 The feedthrough pin 84 is disposed within a via 486 extending through the dielectric substrate 472 and the connector 468 as further described herein.

[0079] Figures 14 to 15 Component 400 and Figures 1 to 10One difference between components 42 is that the connector 468 of component 400 includes one or more tabs 467 disposed on an inner surface 468, the tabs 467 being adapted to engage one or more edges 473 of dielectric substrate 472. Therefore, dielectric substrate 472 can take any suitable shape or one or more forms in a plane parallel to a first main surface 474, which is adapted to fit within the tabs 467 on the inner surface 468 of connector 466, such that the dielectric substrate is aligned with the connector in a desired position and orientation. Furthermore, the tabs 467 of connector 466 can be adapted to retain dielectric substrate 472 on the inner surface 468, such that the dielectric substrate is secured in place. Connector 466 can include any suitable number of tabs 467. Furthermore, tabs 467 can take any suitable shape or one or more forms and have any suitable dimensions. Tabs 467 can be integral with the inner surface 468 of connector 466. In one or more embodiments, tabs 467 are manufactured separately from connector 466 and disposed on the inner surface 468 using any suitable one or more techniques. In one or more embodiments, the tabs 467 of the connector 466 may be positioned relative to one or more edges 473 of the conductive layer 478 to facilitate engagement of the connector and the conductive layer 478 and electrical connection of the tabs and the conductive layer.

[0080] Figures 16 to 17 This is a schematic exploded and perspective view of another embodiment of the feedthrough connector assembly 500. This article is about... Figures 1 to 10 Feedthrough connector assembly 42 and Figures 14 to 15 All design considerations and possibilities described in the feedthrough connector assembly 400 also apply to Figures 16 to 17 500 feedthrough connector assembly.

[0081] One difference between component 500 and components 42 and 400 is that component 500 includes one or more posts 567 disposed on the inner surface 568 of connector 566. Posts 567 are adapted to be inserted through openings 504 in insulating layer 502 and openings 573 in dielectric substrate 572 and patterned conductive layer 578 to hold the dielectric substrate in a desired position and orientation relative to the connector. In one or more embodiments, posts 567 may be connected to at least one of insulating layer 502, dielectric substrate 572, or patterned conductive layer 578 using any suitable one or more techniques. For example, posts 567 may be soldered to patterned conductive layer 578 such that dielectric substrate 572 and insulating layer 502 are held on connector 566 and patterned conductive layer is electrically connected to connector 566. In one or more embodiments, one or more posts 567 may include a base 569 having a cross-sectional area larger than that of the post. Such a base 569 may be adapted to position insulating layer 502 on connector 566 by inserting the base into opening 504 in insulating layer 502.

[0082] The connector 566 may include any suitable number of posts 567. Furthermore, the posts 567 may take any suitable one or more shapes and have any suitable dimensions. In one or more embodiments, the dimensions of the posts 567 and openings 573 in the dielectric substrate 572 and the patterned conductive layer 578 may be selected such that the openings frictionally engage with the posts. Additionally, the posts 567 may be disposed on the inner surface 568 of the connector 566 using any suitable one or more techniques. The posts 567 may be integral with the inner surface 568 of the connector 566. In one or more embodiments, the posts 567 are manufactured separately and attached to the inner surface 568 using any suitable one or more techniques.

[0083] Another difference between component 500 and components 42 and 400 is that component 500 includes an insulating layer 502 disposed between the inner surface 568 of connector 566 and dielectric substrate 572. Insulating layer 502 may comprise any suitable one or more non-conductive materials, such as polyimide, polyester, polyester film, or similar insulating materials. Furthermore, insulating layer 502 may take any suitable one or more shapes and have any suitable dimensions. In one or more embodiments, at least one of the shapes or dimensions of insulating layer 502 may be selected to provide a barrier against molding, potting, or underfill materials that may be disposed above dielectric substrate 572 and patterned conductive layer 578, preventing the potting material from contacting connector 566.

[0084] As mentioned herein, insulating layer 502 can serve as a barrier to prevent potting material from contacting joint 566. For example, Figure 18 This is a schematic perspective view of another embodiment of electronic module 600. This article is about... Figures 1 to 10 All the design considerations and possibilities described in electronic module 32 also apply to... Figure 18 An electronic module 600. The electronic module 600 includes a potting material 602 disposed on at least a portion of the module 600. The potting material 602 can be used to encapsulate a dielectric substrate (e.g., Figure 8 The dielectric substrate 72) and the patterned conductive layer (e.g.,) disposed on the dielectric substrate. Figure 9 The patterned conductive layer 78). The potting material 602 can be disposed on at least a portion of the module 600 using any suitable one or more techniques. In one or more embodiments, the potting material 602 can be disposed on one or more electronic layers (e.g., Figure 7 The electronic layer 40) is used to encapsulate this layer. Although not shown, the module 600 may also include an insulating layer (e.g., Figures 16 to 17 The insulating layer 502 prevents the potting material 602 from contacting the module connector 666.

[0085] The potting material 602 may comprise any suitable one or more non-conductive materials, such as epoxy resin, adhesive, or suitable thermoplastic material. Furthermore, the potting material 602 may be formed into any suitable one or more shapes using any suitable one or more techniques. Figure 18 As shown, supports 604 are formed in the potting material 602. These supports 604 prevent one or more conductive portions of the electronic module 600 from contacting the housing surrounding the module and potentially forming one or more electrical fault paths. Any suitable number of supports 604 can be formed in the potting material 602. The supports 604 can take any suitable shape or have any suitable dimensions. Furthermore, the supports 604 can be formed in the potting material 602 using any suitable one or more techniques, such as dimensional molding, laser cutting, machining, waterjet cutting, etc. One or more valleys 606 can be formed between the supports 604. Electrical traces 608 disposed in the valleys of the electronic layer within the potting material 602 can be used as test traces for testing the electronic layer.

[0086] The various embodiments of the pacemaker, electronic module, and feedthrough connector assembly described herein can be manufactured using any suitable one or more technologies. For example, Figure 13 This is a flowchart of one embodiment of the method 300 for forming a pacemaker 12. Although regarding... Figures 1 to 10 The pacing device 12 is described, and the method described therein can be used to form any suitable implantable medical device.

[0087] At 302, a patterned conductive layer 78 can be disposed on a first main surface 74 of the dielectric substrate 72 using any suitable technique or one or more, such as deposition followed by etching. At 304, a feedthrough pin 84 can be connected to a connector 66, and the feedthrough pin 84 can be electrically connected to a second conductive portion 82 of the patterned conductive layer 78 using any suitable technique or one or more, for example, a solder joint can be formed between the feedthrough pin and the second conductive portion. At 306, the second main surface 76 of the dielectric substrate 72 can be configured as an inner surface 68 adjacent to the connector 66, such that the feedthrough pin 84 is disposed within a via 86, such that the feedthrough pin extends through the dielectric substrate, the connector 66, and beyond the outer surface 70 of the connector using any suitable technique or one or more.

[0088] In one or more embodiments, at 308, the connector 66 can be electrically connected to the first conductive portion 80 of the patterned conductive layer 78 using any suitable one or more techniques. In one or more embodiments, a conductive protrusion 90 can be disposed on the inner surface 68 of the connector 66 such that the conductive protrusion extends from the inner surface of the connector through the dielectric substrate 72 to the first conductive portion 80 of the patterned conductive layer 78. At 310, a second conductive portion 82 of the patterned conductive layer 78 can be electrically connected to an electronic component 64 of an electronic layer 48 disposed adjacent to the first main surface 74 of the dielectric substrate 72 using any suitable one or more techniques. In one or more embodiments, the conductive pad 62 can be electrically connected to the electronic component 64 via conductive vias disposed in the substrate 54 of the electronic layer 48.

[0089] At 312, connector 66 can be connected to the first end 6 of the elongated tubular housing 14, such that electronic module 32 (e.g., one or more layers of electronic layers 40) is disposed within the housing. Connector 66 to the first end 6 of housing 14 can be achieved using any suitable technique or one or more. In one or more embodiments, end cap 26 is connected to connector 66, wherein the end cap defines the first end 6 of housing 14.

[0090] At 314, a power source (e.g., battery 30) can be electrically connected to one or more layers of the electronic layers 40, for example, by pressing a first side of the electronic module 32 against the electrical contact assembly 34. A first portion 22 of the housing 14 can be disposed above the electronic module 32 and connected to a second portion 24 of the housing 14 using any suitable technique or method (e.g., laser bonding). Furthermore, an end cap 26 can be connected to a connector 66 of the feedthrough assembly 42 of the electronic module 32 using any suitable technique or method (e.g., welding).

[0091] The following terms include examples of the techniques disclosed herein.

[0092] Clause 1: An electronic module comprising: an electronic layer including a substrate and electronic components disposed on the substrate; and a feedthrough connector assembly electrically connected to the electronic layer, wherein the feedthrough connector assembly includes: a connector including an inner surface and an outer surface; a dielectric substrate including a first main surface and a second main surface, wherein the second main surface of the dielectric substrate is configured adjacent to the inner surface of the connector; a patterned conductive layer disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion; and a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a through-hole extending through the dielectric substrate and the connector, wherein the feedthrough pin extends beyond the outer surface of the connector.

[0093] Clause 2: The module according to Clause 1, wherein the first conductive portion is electrically connected to the connector via a conductive post extending from the inner surface of the connector through the dielectric substrate to the first conductive portion.

[0094] Clause 3: The module according to Clause 1 or 2, wherein the feedthrough connector assembly further includes a conductive pad disposed on the patterned conductive layer such that the patterned conductive layer is located between the conductive pad and the dielectric substrate, wherein the electronic components are electrically connected to the conductive pad of the feedthrough connector assembly through conductive vias disposed on the substrate through the electronic layer.

[0095] Clause 4: The module according to any one of Clauses 1 to 3 further includes a filter disposed on the patterned conductive layer and electrically connected to at least one of the first conductive portion or the second conductive portion of the patterned conductive layer.

[0096] Clause 5: A module according to any one of Clauses 1 to 4, wherein the feedthrough pin extends through the second conductive portion of the patterned conductive layer.

[0097] Clause 6: An implantable medical device comprising: a power source; and an electronic module electrically connected to the power source, and including an electronic layer and a feedthrough connector assembly electrically connected to the electronic layer, wherein the electronic layer includes a substrate and electronic components disposed on the substrate, and further wherein the feedthrough connector assembly includes: a connector including an inner surface and an outer surface; a dielectric substrate including a first main surface and a second main surface, wherein the second main surface of the dielectric substrate is configured adjacent to the inner surface of the connector; a patterned conductive layer disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion insulated from the first conductive portion; and a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via extending through the dielectric substrate and the connector, wherein the feedthrough pin extends beyond the outer surface of the connector.

[0098] Clause 7: The apparatus according to Clause 6, wherein the first conductive portion is electrically connected to the connector via a conductive post extending from the inner surface of the connector through the dielectric substrate to the first conductive portion.

[0099] Clause 8: The device according to Clause 6 or 7 further includes: an elongated tubular housing extending along a longitudinal axis between a first end and a second end, and further wherein a first portion of the housing adjacent to the first end surrounds the electronic module, and a second portion of the housing adjacent to the second end surrounds the power supply.

[0100] Clause 9: The device according to Clause 8, wherein the first portion of the elongated tubular housing comprises a substantially transparent material.

[0101] Clause 10: The apparatus according to Clause 8 or 9, wherein the longitudinal axis is substantially orthogonal to the dielectric substrate of the feedthrough connector assembly.

[0102] Clause 11: The apparatus according to any one of Clauses 8 to 10, wherein the longitudinal axis is substantially orthogonal to the substrate of the electronic layer of the electronic module.

[0103] Clause 12: The apparatus according to Clause 6, wherein the feedthrough connector assembly further includes a conductive pad disposed on the patterned conductive layer such that the patterned conductive layer is located between the conductive pad and the dielectric substrate, wherein the conductive pad electrically connects the feedthrough connector assembly to the electronic layer.

[0104] It should be understood that the various aspects disclosed herein can be combined with combinations different from those specifically presented in the specification and drawings. It should also be understood that, depending on the example, the actions or events of any process or method described herein can be performed in a different order, and can be added, combined, or excluded entirely (e.g., all described actions and events may not be necessary for performing the technique). Furthermore, although certain aspects of this disclosure are described for clarity as being performed by a single module or unit, it should be understood that the techniques of this disclosure can be performed by combinations of units or modules associated with, for example, a medical device.

[0105] In one or more instances, the technology may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. The computer-readable medium may include a computer-readable storage medium, as opposed to a tangible medium, such as a data storage medium (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and is accessible by a computer).

[0106] The instructions can be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable arrays (FPGAs), or other equivalent integrated or discrete logic circuit systems. Therefore, the term "processor" as used herein can refer to any of the foregoing structures or any other physical structure suitable for implementing the technology. Furthermore, the technology can be fully implemented in one or more circuit or logic elements.

Claims

1. A feedthrough connector assembly, comprising: The connector includes an inner surface and an outer surface; A dielectric substrate includes a first main surface and a second main surface, wherein the second main surface of the dielectric substrate is configured as the inner surface adjacent to the connector; A patterned conductive layer is disposed on the first main surface of the dielectric substrate, wherein the patterned conductive layer includes a first conductive portion and a second conductive portion that is insulated from the first conductive portion. as well as A feedthrough pin, electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via extending through the dielectric substrate and the connector, wherein the feedthrough pin extends beyond the outer surface of the connector.

2. The component of claim 1, wherein the first conductive portion is electrically connected to the connector via a conductive post extending from the inner surface of the connector through the dielectric substrate to the first conductive portion.

3. The component of claim 1, wherein the feedthrough pin is electrically connected to the second conductive portion of the patterned conductive layer via a solder contact.

4. The component of claim 1, wherein the feedthrough pin extends through the second conductive portion of the patterned conductive layer.

5. The component according to any one of claims 1 to 4, further comprising a filter disposed on the patterned conductive layer and electrically connected to at least one of the first conductive portion or the second conductive portion of the patterned conductive layer.

6. The component according to any one of claims 1 to 4 further comprises an insulating material disposed between the feedthrough pin and at least a portion of the through-hole configured to pass through the connector, such that the feedthrough pin is insulated from the connector.

7. The component according to any one of claims 1 to 4, wherein the component further comprises an elliptical cross-section in a plane substantially parallel to the first main surface of the dielectric substrate.

8. The component according to any one of claims 1 to 4, further comprising a conductive pad disposed on the patterned conductive layer such that the patterned conductive layer is located between the conductive pad and the dielectric substrate, wherein the conductive pad comprises at least one of solder bumps, solder paste, conductive epoxy resin, or conductive contacts.

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