Storage container and processing system

Abstract

The present application provides a storage container and a processing system capable of positioning and storing a consumed member. A storage container of one embodiment of the present application is a container that stores a ring-shaped member having a notch in at least one of an outer periphery and an inner periphery, wherein the storage container has a bottom plate that places the ring-shaped member, and a plurality of guide pins that protrude from the bottom plate, position the ring-shaped member, the plurality of guide pins including a pin that engages with the notch.

Description

Technical Field

[0001] This disclosure relates to storage containers and processing systems. Background Technology

[0002] A technique is known to use lifting pins of a system to lift and lower an edge ring and a cover ring respectively, and to transport a component one by one, wherein the edge ring and the cover ring are arranged around the wafer on an electrostatic chuck located in a processing container for plasma processing (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-113603 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a technique for locating and storing consumable components.

[0008] Solution for solving the problem

[0009] One aspect of this disclosure is a storage container for storing an annular member having a notch on at least one of its outer and inner circumferences, wherein the storage container has: a base plate on which the annular member is placed; and a plurality of guide pins protruding from the base plate for positioning the annular member, the plurality of guide pins including pins that engage with the notch.

[0010] The effects of the invention

[0011] According to this disclosure, consumable components can be located and stored. Attached Figure Description

[0012] Figure 1 This is a diagram illustrating an example of a processing system for an implementation method.

[0013] Figure 2 This is a schematic cross-sectional view representing an example of a processing module.

[0014] Figure 3 This is a front sectional view showing an example of a storage module.

[0015] Figure 4 This is a side sectional view showing an example of a storage module.

[0016] Figure 5 This is a rough top view showing the forklift not holding the transported object.

[0017] Figure 6This is a schematic top view showing the upper fork of the first assembly.

[0018] Figure 7 This is a schematic top view showing the upper fork of the second assembly.

[0019] Figure 8 This is a rough top view showing only the upper fork of the transport fixture.

[0020] Figure 9 This is a schematic perspective view showing an example of a box within a storage module.

[0021] Figure 10 This is a diagram illustrating an example of a positioning mechanism for an edge ring.

[0022] Figure 11 This is a diagram illustrating an example of a positioning mechanism for a cover ring.

[0023] Figure 12 This is a diagram illustrating an example of a positioning mechanism for the edge ring and the cover ring.

[0024] Figure 13 This is another example of a positioning mechanism for the edge ring and the cover ring.

[0025] Figure 14 This is a schematic top view showing an example of the second assembly housed in the box.

[0026] Figure 15 This is a schematic top view showing an example of a handling fixture stored in a box.

[0027] Figure 16 This is a schematic perspective view showing another example of a box within a storage module.

[0028] Figure 17 This is a schematic diagram of an electrostatic chuck with an edge ring and a cover ring.

[0029] Figure 18 This is a diagram illustrating an example of a simultaneous transport mode.

[0030] Figure 19 This is a schematic diagram of an electrostatic chuck with an edge ring and a cover ring.

[0031] Figure 20 Figure (1) is an example of a single-transportation mode.

[0032] Figure 21 Figure (2) shows an example of a single-transportation mode.

[0033] Figure 22 This is a flowchart illustrating an example of a method for replacing consumable components in an implementation.

[0034] Figure 23 This is a schematic cross-sectional view representing another example of a processing module.

[0035] Figure 24 This is a diagram showing the state of the lifting mechanism in the simultaneous transport mode.

[0036] Figure 25 This is a diagram showing the state of the lifting mechanism in the stand-alone handling mode. Detailed Implementation

[0037] Hereinafter, with reference to the accompanying drawings, non-limiting exemplary embodiments of this disclosure will be described. In all the drawings, the same or corresponding components or parts are labeled with the same or corresponding reference numerals, and repeated descriptions are omitted.

[0038] [Processing System]

[0039] Reference Figure 1 An example of a processing system for an implementation method will be described. For example... Figure 1 As shown, the processing system PS is a system capable of performing various processes on a substrate, such as plasma processing. The substrate can be, for example, a semiconductor wafer.

[0040] The processing system PS includes vacuum transport modules TM1 and TM2, processing modules PM1 to PM12, loading interlock modules LL1 and LL2, atmospheric transport module LM, and storage module SM.

[0041] Vacuum transport modules TM1 and TM2 are roughly quadrilateral in shape when viewed from above. Processing modules PM1 to PM6 are connected to two opposite sides of vacuum transport module TM1. Loading interlocking modules LL1 and LL2 are connected to one of the other two opposite sides of vacuum transport module TM1, and a passageway (not shown) for connection to vacuum transport module TM2 is connected to the other side. The side of vacuum transport module TM1 connected to loading interlocking modules LL1 and LL2 is angled accordingly. Processing modules PM7 to PM12 are connected to two opposite sides of vacuum transport module TM2. A passageway (not shown) for connection to vacuum transport module TM1 is connected to one of the other two opposite sides of vacuum transport module TM2, and a storage module SM is connected to the other side. Vacuum transport modules TM1 and TM2 have vacuum chambers, inside which transport robots TR1 and TR2 are respectively configured.

[0042] The handling robots TR1 and TR2 are configured to rotate, extend, and lift freely. The handling robot TR1 uses its upper fork FK11 and lower fork FK12, both located at the top, to hold and transport the base plate and consumable components. Figure 1In the example, the handling robot TR1 uses the upper fork FK11 and the lower fork FK12 to hold the substrate and consumable components, transporting them between the loading interlock modules LL1 and LL2, the processing modules PM1 to PM6, and the passageway (not shown). The handling robot TR2 uses the upper fork FK21 and the lower fork FK22 located at the top to hold and transport the substrate and consumable components. Figure 1 In the example, the transport robot TR2 uses the upper fork FK21 and the lower fork FK22 to hold the substrate and consumable components, transporting the substrate and consumable components between the processing modules PM7-PM12, the storage module SM, and the passageway (not shown). Consumable components are components that are replaceably installed within the processing modules PM1-PM12 and are consumed due to various processes such as plasma processing performed within the processing modules PM1-PM12. Examples of consumable components include, for example, the edge ring FR, the cover ring CR, and the top plate 121 of the upper electrode 12, described later.

[0043] Processing modules PM1 to PM12 each have a processing chamber and a stage (placement stage) disposed within it. After placing the substrate onto the stage, processing modules PM1 to PM12 depressurize the interior and introduce processing gas, apply RF power to generate plasma, and perform plasma processing on the substrate using the plasma. Vacuum transport modules TM1 and TM2 and processing modules PM1 to PM12 are separated by a freely opening and closing gate valve G1. Edge rings FR and cover rings CR are disposed on the stage. An upper electrode 12 for applying RF power is disposed on the upper part opposite to the stage.

[0044] Loading interlock modules LL1 and LL2 are configured between vacuum transport module TM1 and atmospheric transport module LM. Loading interlock modules LL1 and LL2 have variable internal pressure chambers capable of switching between vacuum and atmospheric pressure. Loading interlock modules LL1 and LL2 also have internal stages. When a substrate is moved from atmospheric transport module LM to vacuum transport module TM1, loading interlock modules LL1 and LL2 maintain atmospheric pressure internally, receive the substrate from atmospheric transport module LM, depressurize the internal pressure, and move the substrate into vacuum transport module TM1. When a substrate is moved from vacuum transport module TM1 to atmospheric transport module LM, loading interlock modules LL1 and LL2 maintain vacuum internally, receive the substrate from vacuum transport module TM1, pressurize the internal pressure to atmospheric pressure, and move the substrate into atmospheric transport module LM. Loading interlock modules LL1 and LL2 and vacuum transport module TM1 are separated by a freely opening and closing gate valve G2. Loading interlock modules LL1 and LL2 and atmospheric transport module LM are separated by a freely opening and closing gate valve G3.

[0045] The atmospheric transport module LM is configured opposite to the vacuum transport module TM1. The atmospheric transport module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM is cuboid in shape and includes an FFU (Fan Filter Unit), which is an atmospheric transport chamber maintained at atmospheric pressure. Two loading interlock modules LL1 and LL2 are connected to one side of the atmospheric transport module LM along its length. Loading ports LP1 to LP5 are connected to the other side of the atmospheric transport module LM along its length. Containers (not shown) for holding multiple (e.g., 25) substrates are placed in loading ports LP1 to LP5. These containers can be, for example, FOUP (Front-Opening UnifiedPod). A transport robot (not shown) is configured within the atmospheric transport module LM to transport substrates. The transport robot transports substrates between the FOUP and the variable-pressure chambers of the loading interlock modules LL1 and LL2.

[0046] The storage module SM is detachably connected to the vacuum transport module TM2. The storage module SM has a storage chamber for storing consumable components. For example, the storage module SM is connected to the vacuum transport module TM2 when replacing consumable components in processing modules PM1-PM12, and is detached from the vacuum transport module TM2 after the replacement is complete. This allows for efficient utilization of the area surrounding the processing system PS. However, the storage module SM can also remain connected to the vacuum transport module TM2 at all times. The storage module SM has a position detection sensor that detects the position of the consumable components stored in the storage chamber. The consumable components are transported between processing modules PM1-PM12 and the storage module SM by transport robots TR1 and TR2. The vacuum transport module TM2 and the storage module SM are separated by a freely opening and closing gate valve G4.

[0047] The processing system PS includes a control unit CU. The control unit CU controls various parts of the processing system, such as the transport robots TR1 and TR2 located in the vacuum transport modules TM1 and TM2, the transport robot located in the atmospheric transport module LM, and gate valves G1 to G4. For example, the control unit CU is configured to select a simultaneous transport mode in which transport robots TR1 and TR2 simultaneously transport the edge ring FR and the cover ring CR, and a separate transport mode in which transport robots TR1 and TR2 transport only the edge ring FR. The simultaneous transport mode and the separate transport mode will be described later.

[0048] The control unit (CU) can be, for example, a computer. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and auxiliary storage devices. The CPU operates based on programs stored in the ROM or auxiliary storage devices, controlling various parts of the processing system (PS).

[0049] [Plasma Processing Device]

[0050] Reference Figure 2 For being used as Figure 1 An example of a plasma processing device consisting of processing modules PM1 to PM12 in the PS processing system will be described.

[0051] The plasma processing device 1 includes a plasma processing chamber 10, a gas supply unit 20, an RF power supply unit 30, an exhaust system 40, a lifting mechanism 50, and a control unit 90.

[0052] The plasma processing chamber 10 includes a substrate support 11 and an upper electrode 12. The substrate support 11 is disposed in the lower region of the plasma processing space 10s within the plasma processing chamber 10. The upper electrode 12 is disposed above the substrate support 11 and can function as a partial top plate of the plasma processing chamber 10.

[0053] The substrate support 11 supports the substrate W in the plasma processing space 10s. The substrate support 11 includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W at its upper surface. The ring assembly 113 includes an edge ring FR and a cover ring CR. The edge ring FR has a ring shape and is disposed around the substrate W at the periphery of the upper surface of the lower electrode 111. The edge ring FR, for example, improves the uniformity of the plasma processing. The cover ring CR has a ring shape and is disposed at the outer periphery of the edge ring FR. The cover ring CR, for example, protects the upper surface of the insulator 115 from the effects of the plasma. Figure 2 In this example, the outer periphery of the edge ring FR is mounted on the inner periphery of the covering ring CR. Thus, when the plurality of support pins 521 described later rise and fall, the covering ring CR and the edge ring FR rise and fall as a single unit. The insulator 115 is disposed on the base 116 in a manner that surrounds the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10 and supports the lower electrode 111 and the insulator 115. An example of the ring shape includes a circular ring shape.

[0054] The upper electrode 12, together with the insulating member 13, constitutes the plasma processing chamber 10. The upper electrode 12 supplies one or more processing gases from the gas supply unit 20 into the plasma processing space 10s. The upper electrode 12 includes a top plate 121 and a support body 122. The lower surface of the top plate 121 defines the plasma processing space 10s. A plurality of gas inlets 121a are formed in the top plate 121. The plurality of gas inlets 121a extend along the thickness direction (vertical direction) of the top plate 121. The support body 122 supports the top plate 121 so that it can be easily installed and removed. A gas diffusion chamber 122a is provided inside the support body 122. A plurality of gas inlets 122b extend downward from the gas diffusion chamber 122a. The plurality of gas inlets 122b communicate with the plurality of gas inlets 121a. A gas supply port 122c is formed in the support body 122. The upper electrode 12 supplies one or more processing gases from the gas supply port 122c through the gas diffusion chamber 122a, multiple gas inlets 122b and multiple gas inlets 121a to the plasma processing space 10s.

[0055] An inlet / outlet 10p is formed on the side wall of the plasma processing chamber 10. The substrate W is transported between the plasma processing space 10s and the outside of the plasma processing chamber 10 via the inlet / outlet 10p. The inlet / outlet 10p is opened and closed by a gate valve G1.

[0056] The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 supplies one or more types of process gases from each gas source 21 to the gas supply port 122c via each flow controller 22. The flow controller 22 may also include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may also include one or more flow modulation devices for modulating or pulsedizing the flow rate of one or more process gases.

[0057] The RF power supply unit 30 includes two RF power supplies (first RF power supply 31a and second RF power supply 31b) and two matching devices (first matching device 32a and second matching device 32b). The first RF power supply 31a supplies first RF power to the lower electrode 111 via the first matching device 32a. The frequency of the first RF power can be, for example, 13MHz to 150MHz. The second RF power supply 31b supplies second RF power to the lower electrode 111 via the second matching device 32b. The frequency of the second RF power can be, for example, 400kHz to 13.56MHz. Alternatively, a DC power supply can be used instead of the second RF power supply 31b.

[0058] The exhaust system 40 can be connected, for example, to a gas exhaust port 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may also include a pressure regulating valve and a vacuum pump. The pressure within the plasma processing space 10s is adjusted using the pressure regulating valve. The vacuum pump may also include a turbomolecular pump, a dry pump, or a combination thereof.

[0059] The lifting mechanism 50 raises and lowers the substrate W, the edge ring FR, and the cover ring CR. The lifting mechanism 50 includes a first lifting mechanism 51 and a second lifting mechanism 52.

[0060] The first lifting mechanism 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 pass through through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112, and can protrude into the upper surface of the electrostatic chuck 112. The plurality of support pins 511 protrude relative to the upper surface of the electrostatic chuck 112, thereby abutting the upper end against the lower surface of the substrate W to support the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. The actuator 512 can be, for example, a DC motor, a stepper motor, a linear motor, an air-driven mechanism such as a cylinder, or a piezoelectric actuator. This first lifting mechanism 51 raises and lowers the plurality of support pins 511, for example, when the substrate W is transferred between the handling robots TR1 and TR2 and the substrate support 11.

[0061] The second lifting mechanism 52 includes a plurality of support pins 521 and an actuator 522. The plurality of support pins 521 pass through a through hole H2 formed in the insulator 115 and are able to protrude into the upper surface of the insulator 115. The plurality of support pins 521 protrude relative to the upper surface of the insulator 115, thereby abutting against the lower surface of the cover ring CR to support the cover ring CR. The actuator 522 raises and lowers the plurality of support pins 521. For example, the same actuator as actuator 512 can be used as the actuator 522. This second lifting mechanism 52 raises and lowers the plurality of support pins 521 when, for example, the edge ring FR and the cover ring CR are exchanged between the handling robots TR1 and TR2 and the substrate support 11. Figure 2 In this example, the outer periphery of the edge ring FR is mounted on the inner periphery of the cover ring CR. Thus, when the actuator 522 raises and lowers the plurality of support pins 521, the cover ring CR and the edge ring FR are raised and lowered as a single unit.

[0062] The control unit 90 controls various parts of the plasma processing apparatus 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a storage unit 912, and a communication interface 913. The CPU 911 can be configured to perform various control actions based on a program stored in the storage unit 912. The storage unit 912 includes at least one memory type selected from the group consisting of auxiliary storage devices such as RAM, ROM, HDD (Hard Disk Drive), and SSD (Solid State Drive). The communication interface 913 can also communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network). The control unit 90 can be set up independently of the control unit CU or included in the control unit CU.

[0063] [Storage Module]

[0064] Reference Figure 3 and Figure 4 right Figure 1 The following is an example of the storage module SM in the processing system PS.

[0065] The storage module SM has a chamber 70 on the frame 60, and a mechanical chamber 81 on the upper part of the chamber 70. The chamber 70 can be depressurized internally using an exhaust section 72 connected to an exhaust port 71 located at the bottom. Additionally, N2 gas is supplied to the chamber 70 as a purge gas. This allows for pressure regulation within the chamber 70. The mechanical chamber 81 is, for example, at atmospheric pressure.

[0066] A storage section 75 is provided within the chamber 70. This storage section 75 includes a stage 73 and a basket 74 located below the stage 73. The storage section 75 can be raised and lowered using a ball screw 76. A line sensor 82 for detecting the position, orientation, etc., of consumable components and a motor 77 for driving the ball screw 76 are provided within the machine room 81. A window 84 made of quartz or the like is provided between the chamber 70 and the machine room 81 to allow the line sensor 82 to receive light from the light-emitting unit 83, which will be described later.

[0067] The stage 73 holds a consumable component. The stage 73 has a light-emitting portion 83 opposite to the line sensor 82. The stage 73 is rotatable in the θ direction, causing the held consumable component, such as an edge ring FR, to rotate in a predetermined orientation. That is, the stage 73 aligns (positions) the edge ring FR. During alignment, the orientation plane (OF) of the edge ring FR is aligned with the predetermined orientation. Alternatively, the alignment can be configured to align the center position of the edge ring FR.

[0068] The line sensor 82 detects the amount of light irradiated by the self-emitting unit 83 and outputs the detected amount of light to the control unit CU. In the control unit CU, the orientation plane of the edge ring FR is detected based on the variation of the detected amount of light according to the presence or absence of the orientation plane. The control unit CU then detects the orientation of the edge ring FR based on the detected orientation plane. The line sensor 82 is, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) line sensor.

[0069] A basket 74 is located at the lower part of the platform 73. A box 78 is placed inside the basket 74. The box 78 is a storage container that can be removed from the basket 74. The box 78 stores multiple consumable components at intervals in the vertical direction. Figure 3 In the example, box 78 has multiple edge rings FR. One side of the front of the storage module SM of box 78 is open. Further details about box 78 will be described later.

[0070] In addition to the platform 73 and the basket 74, the storage section 75 also has a guide 79 supported on its side by a ball screw 76. The ball screw 76 connects the upper and lower surfaces of the chamber 70, and passes through the upper surface of the chamber 70 to connect with the motor 77 in the machine room 81. The passage through the upper surface of the chamber 70 is sealed in a way that allows the ball screw 76 to rotate. The ball screw 76 rotates by the motor 77, thereby enabling the storage section 75 to move in the vertical direction (Z-axis direction).

[0071] The storage module SM is connected to the vacuum transport module TM2 via a gate valve G4 in a detachable manner. The upper fork FK21 and lower fork FK22 of the transport robot TR2 of the vacuum transport module TM2 can be inserted into the chamber 70 via the gate valve G4. The upper fork FK21 and lower fork FK22, for example, perform actions such as moving the edge ring FR into the box 78, moving the edge ring FR placed in the box 78 out, placing the edge ring FR onto the stage 73, and acquiring the edge ring FR placed on the stage 73. The door 80 opens and closes, for example, when removing the box 78 from the chamber 70 or when placing the box 78 into the chamber 70.

[0072] When the storage unit 75 moves from the bottom surface of the chamber 70 to an upper position such that the housing 78 is opposite the gate valve G4, the light-emitting unit 85 and the chip count detection sensor 86 detect the number of chips on the edge ring FR placed on the housing 78. The light-emitting unit 85 is, for example, an LED (Light Emitting Diode), a semiconductor laser, etc. The chip count detection sensor 86 detects the amount of light irradiated by the self-emitting unit 85 and outputs the detected amount of light to the control unit CU. The control unit CU measures the number of times the light irradiated by the self-emitting unit 85 is blocked by the edge ring FR based on the detected amount of light, thereby detecting the number of chips on the edge ring FR. The chip count detection sensor 86 is, for example, a photodiode, a phototransistor, etc. Alternatively, the chip count detection sensor 86 can also be, for example, a CCD, CMOS, or other linear sensor.

[0073] Furthermore, the above example illustrates a case where the control unit CU calculates the position information of the edge ring FR based on the amount of light detected by the line sensor 82 within the storage module SM, but this disclosure is not limited to this. For example, a position detection sensor comprising an inner circumference sensor that detects the position of the inner circumference of the edge ring FR and an outer circumference sensor that detects the position of the outer circumference of the edge ring FR can also be used. In this case, the control unit CU calculates the position information of the edge ring FR based on the inner circumference position detected by the inner circumference sensor and the outer circumference position detected by the outer circumference sensor. Alternatively, for example, other optical sensors or cameras can be used instead of the line sensor 82. In this case, the control unit CU calculates the position information of the edge ring FR based on images captured by the camera, for example, using image processing techniques.

[0074] [Transportation Robot]

[0075] Reference Figures 5-8 The upper fork FK21 of the handling robot TR2 will be described. Furthermore, the lower fork FK22 of the handling robot TR2 can also have the same structure as the upper fork FK21. Additionally, the upper fork FK11 and lower fork FK12 of the handling robot TR1 can also have the same structure as the upper fork FK21 of the handling robot TR2.

[0076] Figure 5 This is a schematic top view of the upper forklift FK21 that is not holding the transported object. (Example) Figure 5 As shown, the upper fork FK21 has a roughly U-shaped form when viewed from above. The upper fork FK21 is configured to hold, for example, a substrate W, a transport fixture CJ, an edge ring FR, a cover ring CR, a first assembly A1, and a second assembly A2.

[0077] The transport fixture CJ is a fixture that supports the edge ring FR from below, and can be used when only the edge ring FR needs to be replaced.

[0078] The first assembly A1 is an assembly in which the edge ring FR and the cover ring CR are integrated by placing the edge ring FR on the cover ring CR.

[0079] The second assembly A2 is an assembly in which the transport fixture CJ and the edge ring FR are integrated by placing the edge ring FR on the transport fixture CJ.

[0080] Figure 6 This is a schematic top view of the upper fork FK21, showing the state with the first assembly A1 (edge ​​ring FR and cover ring CR) intact. (See attached image.) Figure 6 As shown, the upper fork FK21 is configured to hold the first assembly A1. Thus, the handling robot TR2 can simultaneously handle the edge ring FR and the cover ring CR.

[0081] Figure 7 This is a schematic top view of the upper fork FK21, showing the state with the second assembly A2 (transfer fixture CJ and edge ring FR) in place. Figure 7 As shown, the upper fork FK21 is configured to hold the second assembly A2. Thus, the handling robot TR2 can simultaneously handle the edge ring FR and the handling fixture CJ.

[0082] Figure 8 This is a schematic top view showing the upper fork FK21 in a state where only the transport jig CJ is present. (See attached image.) Figure 8 As shown, the upper fork FK21 is configured as a transport fixture CJ capable of holding the unsupported edge ring FR. Thus, the transport robot TR2 can independently transport the transport fixture CJ.

[0083] 〔box〕

[0084] Further reference Figure 9 As an example of the box 78 in the storage module SM, the box 78 for the storage edge ring FR will be described. Figure 9 This is a schematic perspective view showing an example of box 78 within the storage module SM. Furthermore, in Figure 9 Box 78 represents the state where the edge ring FR is not contained.

[0085] Box 78 stores the edge ring FR. Box 78 has multiple base plates 781 and multiple guide pins 782.

[0086] Multiple base plates 781 are arranged in multiple layers along the vertical direction. Edge rings FR are mounted on the multiple base plates 781. Each base plate 781 has a generally rectangular plate shape. Each base plate 781 is formed, for example, of resin or metal. Each base plate 781 includes a mounting surface 781a, an outer frame portion 781b, and a fork insertion groove 781c.

[0087] The edge ring FR is placed on the mounting surface 781a.

[0088] The outer frame portion 781b protrudes upward from the mounting surface 781a on the outer periphery of three of the four sides, excluding the side on the front side where the upper fork FK21 and lower fork FK22 are inserted. Another base plate 781 is mounted on this outer frame portion 781b.

[0089] A fork insertion groove (recess) 781c is formed on the mounting surface 781a. The fork insertion groove 781c is recessed relative to the mounting surface 781a. When the handling robot TR2 places the edge ring FR on the mounting surface 781a, the fork insertion groove 781c is inserted by the upper fork FK21 and the lower fork FK22.

[0090] Multiple guide pins 782 are disposed on the mounting surface 781a. Each guide pin 782 may have a pointed conical shape. When the handling robot TR2 places the edge ring FR on the mounting surface 781a, the multiple guide pins 782 contact the outer periphery of the edge ring FR to guide it, so that the edge ring FR is placed at a predetermined position on the mounting surface 781a. Each guide pin 782 may be formed of resin or metal. If it is made of resin, the generation of particles caused by friction when in contact with the outer periphery of the edge ring FR can be suppressed.

[0091] In addition, Figure 9 The example shown is a box 78 for storing the edge ring FR, but the same structure can also be used for a box 78 for storing, for example, the transport fixture CJ, the cover ring CR, the first assembly A1, and the second assembly A2, except for the multiple guide pins 782.

[0092] For example, in the box 78 that houses the cover ring CR, a plurality of guide pins 782 are provided at positions that contact the inner periphery of the cover ring CR, which is placed on the mounting surface 781a by the handling robot TR2. As a result, the cover ring CR is guided and placed at a predetermined position on the mounting surface 781a.

[0093] Additionally, for example, in the box 78 that houses the edge ring FR and the cover ring CR, multiple guide pins 782 are provided at positions that contact the outer periphery of the edge ring FR and the inner periphery of the cover ring CR, which are placed on the mounting surface 781a by the handling robot TR2. Thus, the edge ring FR and the cover ring CR are guided and placed at predetermined positions on the mounting surface 781a.

[0094] Reference Figure 10 This describes an example of a positioning mechanism that transports the material from the upper fork FK21 to the edge ring FR within the storage module SM, which is then placed on the base plate 781 of the box 78. Figure 10 This is a diagram illustrating an example of the positioning mechanism for the edge ring FR. Figure 10 (a) is a top view of the upper fork FK21 with the edge ring FR in place above the base plate 781. Figure 10(b) indicates along Figure 10 The cross section obtained by cutting along the single-dotted dashed line B1-B1 of (a). Figure 10 (c) is a cross-sectional view of the edge ring FR being placed on the base plate 781 using the upper fork FK21.

[0095] First, such as Figure 10 (a) and Figure 10 As shown in (b), the edge ring FR has a notch FRa on its outer periphery. The upper fork FK21, which holds the edge ring FR, is inserted above the base plate 781. The notch FRa has a letter V shape, for example, when viewed from above. The opening angle of the letter V shape can be appropriately set, for example, it can be 90°. Alternatively, the notch FRa can also have a curved shape, such as a letter U shape, when viewed from above.

[0096] Next, as Figure 10 As shown in (c), the upper fork FK21 is lowered. The edge ring FR, held by the upper fork FK21, is then placed on the mounting surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch FRa of the edge ring FR, and the remaining two guide pins 782 contact the outer periphery of the edge ring FR, thereby positioning the edge ring FR. As a result, the edge ring FR can be positioned relative to the base plate 781 in both the horizontal and rotational directions.

[0097] In this way, by using the upper fork FK21 to place the edge ring FR on the base plate 781, the edge ring FR can be positioned. Therefore, the edge ring FR can be transported to the processing modules PM1 to PM12 in its positioned state without the need for a separate alignment mechanism for positioning the edge ring FR. As a result, downtime caused by transporting the edge ring FR to the alignment mechanism can be reduced. In addition, the cost of device implementation can be reduced. Furthermore, space efficiency is improved. However, it is also possible to provide a separate alignment mechanism to precisely align and transport the edge ring FR.

[0098] In addition, Figure 10 The example shows the edge ring FR having one notch FRa on its outer periphery, but the number of notches FRa is not limited to this. For example, the edge ring FR may also have multiple notches FRa that are separated from each other in the circumferential direction on its outer periphery. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches FRa. This reduces angular errors.

[0099] In addition, Figure 10 The example shows the use of the upper fork FK21, but the lower fork FK22 can also be used.

[0100] Reference Figure 11An example of a positioning mechanism is described for a case where the cover ring CR, which is moved from the upper fork FK21 into the storage module SM, is placed on the base plate 781 of the box 78. Figure 11 This is a diagram illustrating an example of the positioning mechanism of the covering ring CR. Figure 11 (a) is a top view of the upper fork FK21 with the cover ring CR in place above the base plate 781. Figure 11 (b) indicates along Figure 11 The cross section obtained by cutting along the single-dotted dashed line B2-B2 in (a). Figure 11 (c) is a cross-sectional view of the cover ring CR being placed on the base plate 781 using the upper fork FK21.

[0101] First, such as Figure 11 (a) and Figure 11 As shown in (b), the cover ring CR has a notch CRa on its inner circumference. The upper fork FK21 holding the cover ring CR is inserted above the base plate 781. The notch CRa has a letter V shape, for example, when viewed from above. The opening angle of the letter V shape can be appropriately set, for example, it can be 90°. Alternatively, the notch CRa can also have a curved shape, such as a letter U shape, when viewed from above.

[0102] Next, as Figure 11 As shown in (c), the upper fork FK21 is lowered. The cover ring CR, held by the upper fork FK21, is then placed on the mounting surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch CRa of the cover ring CR, and the remaining two guide pins 782 contact the inner circumference of the cover ring CR, thereby positioning the cover ring CR. As a result, the cover ring CR can be positioned relative to the base plate 781 in both the horizontal and rotational directions.

[0103] In this way, by using the upper fork FK21 to place the cover ring CR onto the base plate 781, the cover ring CR can be positioned. Therefore, the cover ring CR can be transported to the processing modules PM1 to PM12 in its positioned state without the need for a separate alignment mechanism for positioning the cover ring CR. As a result, downtime caused by transporting the cover ring CR to the alignment mechanism can be reduced. In addition, the cost of device implementation can be reduced. Furthermore, space efficiency is improved. However, it is also possible to provide a separate alignment mechanism to precisely align and transport the cover ring CR.

[0104] In addition, Figure 11The example shows a case where the cover ring CR has one notch CRa on its inner circumference, but the number of notches CRa is not limited to this. For example, the cover ring CR may also have multiple notches CRa that are separated from each other in the circumferential direction on its inner circumference. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches CRa. This reduces angular errors.

[0105] In addition, Figure 11 The example shows the use of the upper fork FK21, but the lower fork FK22 can also be used.

[0106] Reference Figure 12 The positioning mechanism for the edge ring FR and cover ring CR, which are transported by the upper fork FK21 to the storage module SM, is described. Figure 12 This is a diagram illustrating an example of the positioning mechanism for the edge ring FR and the cover ring CR. Figure 12 (a) is a top view of the upper fork FK21, which holds the edge ring FR and the cover ring CR, entering above the base plate 781. Figure 12 (b) indicates along Figure 12 The cross section obtained by cutting along the single-dotted dashed line B3-B3 in (a). Figure 12 (c) is a cross-sectional view of the edge ring FR and cover ring CR being mounted on the base plate 781 using the upper fork FK21.

[0107] First, such as Figure 12 (a) and Figure 12 As shown in (b), the upper fork FK21, which holds the edge ring FR and the cover ring CR, is positioned above the base plate 781. The outer periphery of the edge ring FR and the inner periphery of the cover ring CR do not overlap when viewed from above. That is, the outer diameter of the edge ring FR is the same as or smaller than the inner diameter of the cover ring CR. The edge ring FR has a notch FRa on its outer periphery. The cover ring CR has a notch CRa on its inner periphery. The notches FRa and CRa, for example, have a letter V shape when viewed from above. The opening angle of the letter V shape can be appropriately set, for example, it can be 90°. Alternatively, the notches FRa and CRa can also have a curved shape, such as a letter U shape, when viewed from above.

[0108] Next, as Figure 12As shown in (c), the upper fork FK21 is lowered. The edge ring FR and cover ring CR, held by the upper fork FK21, are then placed on the mounting surface 781a of the base plate 781. At this time, one of the three guide pins 782 engages with the notch FRa of the edge ring FR and the notch CRa of the cover ring CR, while the remaining two guide pins 782 contact the outer periphery of the cover ring CR, thereby positioning the edge ring FR and the cover ring CR. As a result, the edge ring FR and the cover ring CR can be positioned relative to the base plate 781 in both the horizontal and rotational directions.

[0109] In this way, by using the upper fork FK21 to mount the edge ring FR and the cover ring CR on the base plate 781, the edge ring FR and the cover ring CR can be positioned. Therefore, the edge ring FR and the cover ring CR can be transported to the processing modules PM1 to PM12 in their positioned state without the need for a separate alignment mechanism for positioning the edge ring FR and the cover ring CR. As a result, downtime caused by transporting the edge ring FR and the cover ring CR to the alignment mechanism can be reduced. In addition, the cost of device implementation can be reduced. Furthermore, space efficiency is improved. However, it is also possible to provide a separate alignment mechanism to precisely align and transport the edge ring FR and the cover ring CR.

[0110] In addition, Figure 12 The example illustrates the following situation: the edge ring FR has one notch FRa on its outer periphery, and the covering ring CR has one notch CRa on its inner periphery, but the number of notches FRa and CRa is not limited to this. For example, the edge ring FR may have multiple notches FRa that are circumferentially separated on its outer periphery, and the covering ring CR may have multiple notches CRa that are circumferentially separated on its inner periphery. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches FRa and CRa. This reduces angular errors.

[0111] In addition, Figure 12 The example shows the use of the upper fork FK21, but the lower fork FK22 can also be used.

[0112] In addition, Figure 12 The example illustrates the case where the edge ring FR and the cover ring CR are positioned on the outer or inner periphery, but it is not limited to this. For example, the edge ring FR and the cover ring CR can also be positioned by providing a recess (or a protrusion) for positioning on the back side of the edge ring FR and the cover ring CR (the side on which they are placed on the mounting surface 781a).

[0113] In addition, Figure 12The example illustrates a structure where the outer periphery of the edge ring FR and the inner periphery of the covering ring CR do not overlap, but it is not limited to this; a structure where the outer periphery of the edge ring FR and the inner periphery of the covering ring CR overlap is also possible. In this case, the edge ring FR may be held in a position where it is positioned relative to the covering ring CR. In one example, the covering ring CR is positioned by providing a positioning part on its outer periphery, thereby positioning the edge ring FR. Alternatively, in another example, the outer periphery of the edge ring FR and the inner periphery of the covering ring CR may overlap, such as... Figure 13 As shown, recesses FRb and CRb (or protrusions) for positioning are provided in the non-overlapping areas of the edge ring FR and the cover ring CR. In this case, the guide pin 782 can be positioned to engage with the recesses FRb and CRb. Thus, the positioning of the edge ring FR and the cover ring CR can be performed respectively.

[0114] Above, refer to Figures 10-13 The example illustrates the use of the upper fork FK21 to mount the edge ring FR and / or cover ring CR onto the base plate 781 of the box 78, but is not limited to this. For example, the operator may manually mount the edge ring FR and / or cover ring CR onto the base plate 781 of the box 78 when the storage module SM is not in operation.

[0115] Reference Figure 14 This describes the situation where the second assembly A2 (transfer fixture CJ and edge ring FR) is transported from the upper fork FK21 to the storage module SM and placed on the base plate 781 of the box 78. Figure 14 The operation shown is performed, for example, when the outer periphery of the edge ring FR and the inner periphery of the cover ring CR overlap when the device is placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the individual handling mode described later. Figure 14 This is a schematic top view showing an example of the second assembly A2 housed in box 78.

[0116] First, such as Figure 14 As shown, the upper fork FK21, which holds the second assembly A2, is brought above the base plate 781. Next, the upper fork FK21 is lowered. As a result, the second assembly A2 held by the upper fork FK21 is placed on the mounting surface 781a of the base plate 781.

[0117] In this way, the transport robot TR2 can use the upper fork FK21 to hold the second assembly A2 (transport fixture CJ and edge ring FR), thereby transporting the edge ring FR and the transport fixture CJ simultaneously.

[0118] In addition, Figure 14 The example shows the use of the upper fork FK21, but the lower fork FK22 can also be used.

[0119] Reference Figure 15 This describes the situation where the transport fixture CJ, which is moved from the upper fork FK21 to the storage module SM, is placed on the base plate 781 of the box 78. Figure 15 The operation shown is performed, for example, when the outer periphery of the edge ring FR and the inner periphery of the cover ring CR overlap when the device is placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the individual handling mode described later. Figure 15 This is a schematic top view showing an example of a transport fixture CJ housed in box 78.

[0120] First, such as Figure 15 As shown, the upper fork FK21 holding the transport fixture CJ is brought above the base plate 781. Next, the upper fork FK21 is lowered. As a result, the transport fixture CJ held by the upper fork FK21 is placed on the mounting surface 781a of the base plate 781.

[0121] In this way, the transport robot TR2 can use the upper fork FK21 to hold the transport fixture CJ and transport the transport fixture CJ independently.

[0122] In addition, Figure 15 The example shows the use of the upper fork FK21, but the lower fork FK22 can also be used.

[0123] Reference Figure 16 ,right Figure 3 and Figure 4 Another example of the storage module SM with box 78 will be described. Figure 16 This is a schematic perspective view of another example of box 78 within the storage module SM, showing box 78X for storing the edge ring FR, which is an example of a consumable component.

[0124] Figure 16 Box 78X shown Figure 9 The difference in the shown box 78 is that box 78X has an inclined block 782b instead of multiple guide pins 782, the inclined block 782b having an inclined surface that abuts against the outer periphery of the edge ring FR to hold the edge ring FR in a predetermined position. Furthermore, regarding other structures, it could be with... Figure 9 The structure is the same as that of box 78 shown.

[0125] Alternatively, as another example, the box 78 may have a tilting block (not shown) with an inclined surface that abuts against the inner periphery of the cover ring CR to hold the cover ring CR in a predetermined position. Alternatively, the box 78 may have a tilting block (not shown) with an inclined surface that abuts against the outer periphery of the edge ring FR and the inner periphery of the cover ring CR to hold the edge ring FR and the cover ring CR in predetermined positions. Alternatively, the tilting block may be configured to abut against the inner periphery of the edge ring FR to hold the edge ring FR in a predetermined position. Alternatively, the tilting block may be configured to abut against the outer periphery of the cover ring CR to hold the cover ring CR.

[0126] [Methods for transporting consumable components]

[0127] Reference Figure 17 and Figure 18 As an example of a method for transporting consumable components in the processing system PS of an embodiment, the case where the control unit CU selects and executes a simultaneous transport mode in which the transport robot TR2 simultaneously transports the edge ring FR and the cover ring CR will be described. Hereinafter, the case where the control unit 90 is included in the control unit CU, and the control unit CU controls the transport robot TR2 and the lifting mechanism 50 will be described. However, it is also possible to configure the control unit 90 independently of the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifting mechanism 50. Furthermore, a structure is provided where the outer periphery of the edge ring FR and the inner periphery of the cover ring CR overlap when viewed from above.

[0128] like Figure 18 As shown in (a), the control unit CU moves the upper fork FK21, which holds the unused edge ring FR and cover ring CR, above the electrostatic chuck 112.

[0129] Next, as Figure 18 As shown in (b), the control unit CU raises the plurality of support pins 521 from the standby position to the support position. Consequently, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR held by the upper fork FK21, and the cover ring CR is lifted by the plurality of support pins 521, thus moving the cover ring CR away from the upper fork FK21. At this time, the outer periphery of the edge ring FR is mounted on the inner periphery of the cover ring CR. Therefore, when the cover ring CR is lifted by the plurality of support pins 521, the edge ring FR is also lifted together with the cover ring CR. That is, the edge ring FR and the cover ring CR become one unit and move away from the upper fork FK21.

[0130] Next, as Figure 18 As shown in (c), the control unit CU causes the upper fork FK21, which is not holding the transported object, to retract.

[0131] Next, as Figure 18As shown in (d), the control unit CU lowers the multiple support pins 521 from the supported position to the standby position. Consequently, the edge ring FR and the cover ring CR, supported by the multiple support pins 521, are placed on the electrostatic chuck 112. According to the above, as... Figure 17 As shown, the edge ring FR and the cover ring CR are simultaneously moved into the plasma processing chamber 10 and placed on the electrostatic chuck 112.

[0132] Furthermore, when the edge ring FR and the cover ring CR, which are placed on the electrostatic chuck 112, are removed from the plasma processing chamber 10, the control unit CU performs the opposite operation to the aforementioned removal of the edge ring FR and the cover ring CR.

[0133] As explained above, the processing system PS according to the embodiment is capable of simultaneously transporting the edge ring FR and the cover ring CR.

[0134] Reference Figures 19-21 As another example of the method for handling consumable components in the processing system PS of the embodiment, the case where the control unit CU selects and executes a separate handling mode in which the handling robot TR2 handles only the edge ring FR will be described. Hereinafter, the case where the control unit 90 is included in the control unit CU, and the control unit CU controls the handling robot TR2 and the lifting mechanism 50 will be described. However, it is also possible to configure the control unit 90 independently of the control unit CU, with the control unit CU controlling the handling robot TR2 and the control unit 90 controlling the lifting mechanism 50. Furthermore, a structure is provided where the outer periphery of the edge ring FR and the inner periphery of the covering ring CR overlap when viewed from above.

[0135] like Figure 20 As shown in (a), the control unit CU moves the upper fork FK21, which holds the transport fixture CJ holding the unused edge ring FR, above the electrostatic chuck 112.

[0136] Next, as Figure 20 As shown in (b), the control unit CU raises the multiple support pins 511 from the standby position to the support position. Consequently, the upper ends of the multiple support pins 511 abut against the lower surface of the transport fixture CJ held by the upper fork FK21, lifting the transport fixture CJ away from the upper fork FK21. At this time, the inner circumference of the edge ring FR is mounted on the transport fixture CJ. Therefore, when the transport fixture CJ is lifted using the multiple support pins 511, the edge ring FR is also lifted along with the transport fixture CJ. That is, the transport fixture CJ and the edge ring FR become one unit and move away from the upper fork FK21.

[0137] Next, as Figure 20 As shown in (c), the control unit CU causes the upper fork FK21, which is not holding the transported object, to retract.

[0138] Next, as Figure 20 As shown in (d), the control unit CU raises the plurality of support pins 521 from the standby position to the support position. Consequently, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR mounted on the electrostatic chuck 112, which is then lifted by the plurality of support pins 521, thus moving the cover ring CR away from the electrostatic chuck 112. Furthermore, the outer periphery of the edge ring FR mounted on the transport fixture CJ is mounted on the inner periphery of the cover ring CR.

[0139] Next, as Figure 21 As shown in (a), the control unit CU causes the upper fork FK21, which is not holding the transported object, to enter between the transport fixture CJ, the edge ring FR, the cover ring CR, and the electrostatic chuck 112.

[0140] Next, as Figure 21 As shown in (b), the control unit CU lowers the multiple support pins 511 from the support position to the standby position. At this time, the outer periphery of the edge ring FR is placed on the inner periphery of the cover ring CR, so the transport fixture CJ, supported only by the multiple support pins 511, is placed on the upper fork FK21.

[0141] Next, as Figure 21 As shown in (c), the control unit CU causes the upper fork FK21, which holds the transport fixture CJ, to retract.

[0142] Next, as Figure 21 As shown in (d), the control unit CU lowers the multiple support pins 521 from the supported position to the standby position. Consequently, the edge ring FR and the cover ring CR, supported by the multiple support pins 521, are placed on the electrostatic chuck 112. According to the above, as... Figure 19 As shown, only the edge ring FR is moved into the plasma processing chamber 10 and placed on the electrostatic chuck 112, which already has the cover ring CR.

[0143] Furthermore, when only the edge ring FR placed on the electrostatic chuck 112 and the edge ring FR in the cover ring CR are removed from the plasma processing chamber 10, the control unit CU performs the opposite operation to the aforementioned removal of the edge ring FR.

[0144] As explained above, the processing system PS according to the embodiment is able to move only the edge ring FR without replacing the cover ring CR.

[0145] [Methods for replacing consumable components]

[0146] Reference Figure 22 An example of a method for replacing consumable components in an embodiment will be described. Figure 22 This is a flowchart illustrating an example of a method for replacing consumable components in an implementation.

[0147] The following explanation uses the case where only the edge ring FR of the stage (electrostatic chuck 112) placed in the aforementioned processing module PM12 is replaced as an example. Specifically, the following case is explained: the edge ring FR already used in processing module PM12 is stored in the storage module SM and replaced with an unused edge ring FR pre-stored in the storage module SM. Furthermore, the edge ring FR of the stages placed in processing modules PM1 to PM11 other than processing module PM12 can also be replaced using the same method. Additionally, Figure 22 The method for replacing consumable components in the illustrated embodiment is performed by controlling each part of the processing system PS by the control unit CU.

[0148] like Figure 22 As shown, the method for replacing consumable components in this embodiment includes a wear level determination step S10, a replaceability determination step S20, a first cleaning step S30, a removal step S40, a second cleaning step S50, a removal step S60, and an aging step S70. Each step will be explained below.

[0149] The consumption level determination step S10 is a step that determines whether the edge ring FR of the stage placed in the processing module PM12 needs to be replaced. In the consumption level determination step S10, the control unit CU determines whether the edge ring FR of the stage placed in the processing module PM12 needs to be replaced. Specifically, the control unit CU determines whether the edge ring FR needs to be replaced based on, for example, the cumulative RF time, the cumulative RF power, and the cumulative value of a specific step in the process. The cumulative RF time refers to the cumulative value of the time during which high-frequency power is supplied in the processing module PM12 during the predetermined plasma processing. The cumulative RF power refers to the cumulative value of the high-frequency power supplied in the processing module PM12 during the predetermined plasma processing. The cumulative value of a specific step in the process refers to the cumulative value of the time during which high-frequency power is supplied in the step of cutting the edge ring FR in the processing steps performed in the processing module PM12, and the cumulative value of the high-frequency power. Furthermore, the cumulative RF time, the cumulative RF power, and the cumulative value of the specific step in the process are calculated starting from the time when the edge ring FR is replaced, such as the time of device introduction or the time of maintenance.

[0150] When determining whether the edge ring FR needs to be replaced based on the accumulated RF time, the control unit CU determines that the edge ring FR needs to be replaced if the accumulated RF time has reached a threshold. Conversely, the control unit CU determines that the edge ring FR does not need to be replaced if the accumulated RF time has not reached the threshold. Furthermore, the threshold is a value determined through preliminary experiments based on the type of material, etc., of the edge ring FR.

[0151] When determining whether the edge ring FR needs replacement based on the accumulated RF power, the control unit CU determines that the edge ring FR needs replacement if the accumulated RF power has reached a threshold. Conversely, the control unit CU determines that the edge ring FR does not need replacement if the accumulated RF power has not reached the threshold. Furthermore, the threshold value is determined based on the type of material, etc., of the edge ring FR through preliminary experiments.

[0152] When determining whether the edge ring FR needs replacement based on the cumulative value of a specific step in the process, the control unit CU determines that the edge ring FR needs replacement if the cumulative RF time or cumulative RF power in that specific step has reached a threshold. Conversely, the control unit CU determines that the edge ring FR does not need replacement if the cumulative RF time or cumulative RF power in that specific step has not reached the threshold. When determining whether the edge ring FR needs replacement based on the cumulative value of a specific step in the process, the replacement time for the edge ring FR can be calculated based on the step where high-frequency power is applied to cut the edge ring FR. Therefore, the replacement time for the edge ring FR can be calculated with particularly high accuracy. Furthermore, the threshold value is determined through preliminary experiments or the like based on the type of material, etc., of the edge ring FR.

[0153] In the consumption level determination step S10, if it is determined that the edge ring FR of the stage placed on the processing module PM12 needs to be replaced, the control unit CU performs the replacement determination step S20. In the consumption level determination step S10, if it is determined that the edge ring FR of the stage placed on the processing module PM12 does not need to be replaced, the control unit CU repeats the consumption level determination step S10.

[0154] The replaceability determination step S20 is a step to determine whether the state of the processing system PS is such that the edge ring FR can be replaced. In the replaceability determination step S20, the control unit CU determines whether the state of the processing system PS is such that the edge ring FR can be replaced. Specifically, the control unit CU determines that the edge ring FR can be replaced if, for example, the substrate W has not been processed in the processing module PM12 where the edge ring FR is to be replaced. Conversely, the control unit CU determines that the edge ring FR cannot be replaced if the substrate W is processed in the processing module PM12. Alternatively, the control unit CU may determine that the edge ring FR can be replaced if, for example, the processing of substrate W in the same batch as the substrate W processed in the processing module PM12 where the edge ring FR is to be replaced has ended. In this case, the control unit CU determines that the edge ring FR cannot be replaced until the processing of substrate W in the same batch as the substrate W processed in the processing module PM12 has ended.

[0155] If, in the replaceability determination step S20, it is determined that the processing system PS is in a state where the edge ring FR can be replaced, the control unit CU performs the first cleaning step S30. If, in the replaceability determination step S20, it is determined that the processing system PS is in a state where the edge ring FR cannot be replaced, the control unit CU repeats the replaceability determination step S20.

[0156] The first cleaning step S30 is a step of cleaning the processing module PM12. In the first cleaning step S30, the control unit CU controls the gas introduction system, exhaust system, power introduction system, etc., thereby performing the cleaning process on the processing module PM12. The cleaning process refers to the process of removing deposits generated in the processing module PM12 by using plasma or the like of a processing gas, thereby stabilizing the processing module PM12 in a clean state. By performing the first cleaning step S30, when the self-supporting stage removes the edge ring FR in the removal step S40, the stirring of deposits in the processing module PM12 can be suppressed. As the processing gas, for example, oxygen (O2), fluorocarbon (CF) based gas, nitrogen (N2), argon (Ar), helium (He), or a mixture of two or more of the above gases can be used. Furthermore, during the cleaning process of the processing module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process can be performed with the substrate W, such as the simulation wafer, placed on the upper surface of the electrostatic chuck 112. Additionally, if there are no deposits inside the processing module PM12 and the deposits will not be stirred up, the first cleaning step S30 can be omitted. Furthermore, when the edge ring FR is adsorbed onto the stage using the electrostatic chuck 112, a destatic treatment is performed before the subsequent unloading step S40.

[0157] Step S40 involves removing the edge ring FR from the processing module PM12 without opening it to the atmosphere. In step S40, the control unit CU controls various parts of the processing system PS to remove the edge ring FR from the processing module PM12 without opening it to the atmosphere. Specifically, gate valve G1 is opened, and the transport robot TR2 removes the edge ring FR from the platform inside the processing module PM12. Next, gate valve G4 is opened, and the transport robot TR2 stores the edge ring FR removed from the processing module PM12 in the storage module SM.

[0158] The second cleaning step S50 is a step of cleaning the surface of the mounting edge ring FR of the stage of the processing module PM12. In the second cleaning step S50, the control unit CU controls the gas introduction system, exhaust system, power introduction system, etc., thereby performing the cleaning process on the surface of the mounting edge ring FR of the stage of the processing module PM12. The cleaning process in the second cleaning step S50 can be performed in the same way as the first cleaning step S30. That is, as the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of the above gases can be used. In addition, when cleaning the processing module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process can also be performed with the substrate W, such as the simulation wafer, placed on the upper surface of the electrostatic chuck 112. Alternatively, the second cleaning step S50 can be omitted.

[0159] Step S60 involves moving the edge ring FR into the processing module PM12 without opening it to the atmosphere, and then placing it on the loading stage. In step S60, the control unit CU controls each part of the processing system PS to move the edge ring FR into the processing module PM12 without opening it to the atmosphere. Specifically, gate valve G4 is opened, and the transport robot TR2 removes the unused edge ring FR stored in the storage module SM. Next, gate valve G1 is opened, and the transport robot TR2 moves the unused edge ring FR into the processing module PM12 and places it on the loading stage. For example, the control unit CU controls each part of the processing system PS, through... Figure 20 (a)~ Figure 20 (d) and Figure 21 (a)~ Figure 21 The handling method shown in (d) involves placing the edge ring FR housed in the storage module SM onto the stage within the processing module PM12.

[0160] The aging step S70 is a step in aging the processing module PM12. In aging step S70, the control unit CU controls the gas introduction system, exhaust system, and power introduction system, thereby performing the aging process on the processing module PM12. The aging process refers to a process used to stabilize the temperature and the state of the deposits within the processing module PM12 through a predetermined plasma treatment. Alternatively, in aging step S70, after the aging process of the processing module PM12, a quality control wafer can be placed into the processing module PM12 and subjected to a predetermined treatment. This allows verification of whether the processing module PM12 is in a normal state. Furthermore, aging step S70 can be omitted.

[0161] As explained above, in the processing system PS according to the embodiment, the edge ring FR is removed from the processing module PM12 using a transport robot TR2 without opening the processing module PM12 to the atmosphere. Then, the processing module PM12 is cleaned, and the edge ring FR is then moved back into the processing module PM12 using the transport robot TR2. This allows for the replacement of the edge ring FR individually without manual replacement by an operator. Therefore, the time required for edge ring FR replacement is reduced, thereby increasing productivity. Furthermore, by cleaning the surface on which the edge ring FR is placed before moving it in, deposits between the edge ring FR and the surface on which it is placed can be suppressed. As a result, good contact between the two is achieved, thereby maintaining good temperature control of the edge ring FR.

[0162] Furthermore, when replacing both the edge ring FR and the cover ring CR of the stage (electrostatic chuck 112) placed in the aforementioned processing module PM12, the same method as when only the edge ring FR is replaced can be applied. In this case, in the consumption level determination step S10, the control unit CU determines whether it is necessary to replace the edge ring FR and the cover ring CR of the stage placed in the processing module PM12. In the removal step S40, the control unit CU controls each part of the processing system PS to remove the edge ring FR and the cover ring CR of the stage placed inside the processing module PM12. In the loading step S60, the control unit CU controls each part of the processing system PS and, through... Figure 18 (a)~ Figure 18 The handling method shown in (d) involves placing the edge ring FR and cover ring CR, which are housed in the storage module SM, onto the stage within the processing module PM12.

[0163] Reference Figures 23-25 For being used as Figure 1 Another example of a plasma processing device consisting of processing modules PM1 to PM12 in the PS processing system will be described.

[0164] The plasma processing apparatus 1X includes a plasma processing chamber 10X and a lifting mechanism 50X, replacing the plasma processing chamber 10 and lifting mechanism 50 in the plasma processing apparatus 1. Furthermore, other structures may be identical to those in the plasma processing apparatus 1.

[0165] The plasma processing chamber 10X includes a substrate support portion 11X and an upper electrode 12. The substrate support portion 11X is disposed in the lower region of the plasma processing space 10s within the plasma processing chamber 10X. The upper electrode 12 is disposed above the substrate support portion 11X and can function as a partial top plate of the plasma processing chamber 10X.

[0166] A substrate support 11X supports a substrate W in a plasma processing space 10s. The substrate support 11X includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113X, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W at its upper surface. The ring assembly 113X includes an edge ring FRX and a cover ring CRX. The edge ring FRX has a ring shape and is disposed around the substrate W at the periphery of the upper surface of the lower electrode 111. The edge ring FRX, for example, improves the uniformity of the plasma processing. The cover ring CRX has a ring shape and is disposed at the outer periphery of the edge ring FRX. The cover ring CRX, for example, protects the upper surface of the insulator 115 from the effects of the plasma. Figure 23 In this example, the outer diameter of the edge ring FRX is the same as or smaller than the inner diameter of the cover ring CRX. That is, when viewed from above, the edge ring FRX and the cover ring CRX do not overlap. Therefore, the edge ring FRX and the cover ring CRX can be raised and lowered independently. The insulator 115 is disposed on the base 116 in a manner that surrounds the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10X and supports the lower electrode 111 and the insulator 115.

[0167] The lifting mechanism 50X raises and lowers the substrate W, the edge ring FRX, and the cover ring CRX. The lifting mechanism 50X includes a first lifting mechanism 51, a third lifting mechanism 53, and a fourth lifting mechanism 54.

[0168] The first lifting mechanism 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 pass through through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112, and can protrude into the upper surface of the electrostatic chuck 112. The plurality of support pins 511 protrude relative to the upper surface of the electrostatic chuck 112, thereby abutting the lower surface of the substrate W to support the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. The actuator 512 can be a DC motor, a stepper motor, a linear motor, an air drive mechanism such as a cylinder, a piezoelectric actuator, etc. This first lifting mechanism 51 raises and lowers the plurality of support pins 511, for example, when the substrate W is transferred between the handling robots TR1 and TR2 and the substrate support 11.

[0169] The third lifting mechanism 53 includes a plurality of support pins 531 and an actuator 532. The plurality of support pins 531 protrude into the upper surface of the insulator 115 through a through hole H3 formed in the insulator 115. The protrusion of the plurality of support pins 531 relative to the upper surface of the insulator 115 allows their upper ends to abut against the lower surface of the edge ring FRX, thereby supporting the edge ring FRX. The actuator 532 raises and lowers the plurality of support pins 531. For example, the same actuator as actuator 512 can be used as actuator 532.

[0170] The fourth lifting mechanism 54 includes a plurality of support pins 541 and an actuator 542. The plurality of support pins 541 pass through a through hole H4 formed in the insulator 115 and are able to protrude into the upper surface of the insulator 115. The plurality of support pins 541 protrude relative to the upper surface of the insulator 115, thereby abutting their upper ends against the lower surface of the cover ring CRX to support the cover ring CRX. The actuator 542 raises and lowers the plurality of support pins 541. For example, the same actuator as actuator 512 can be used as actuator 542.

[0171] In this lifting mechanism 50X, multiple support pins 531 and 541 are raised and lowered when the edge ring FRX and cover ring CRX are exchanged between the handling robots TR1 and TR2 and the substrate support 11. For example, when the edge ring FRX and cover ring CRX placed on the electrostatic chuck 112 are moved out using the handling robots TR1 and TR2, as... Figure 24 As shown, multiple support pins 531 and 541 are raised. This allows the edge ring FRX to be lifted using the multiple support pins 531, and the cover ring CRX to be lifted using the multiple support pins 541, enabling the handling robots TR1 and TR2 to simultaneously move the edge ring FRX and cover ring CRX out.

[0172] Furthermore, in this lifting mechanism 50X, when only the edge ring FRX is transferred between the handling robots TR1 and TR2 and the substrate support 11, multiple support pins 531 are raised and lowered. For example, when the handling robots TR1 and TR2 only remove the edge ring FRX placed on the electrostatic chuck 112, such as... Figure 25 As shown, multiple support pins 531 are raised. Thus, by using multiple support pins 531, only the edge ring FRX is lifted, thereby enabling the handling robots TR1 and TR2 to individually remove the edge ring FRX.

[0173] Furthermore, in the above embodiments, edge rings FR and FRX and cover rings CR and CRX are examples of annular members; edge rings FR and FRX are examples of inner rings; and cover rings CR and CRX are examples of outer rings. Additionally, handling robots TR1 and TR2 are examples of handling devices. Furthermore, support pin 521 is an example of a first support pin, support pin 511 is an example of a second support pin, support pin 531 is an example of a third support pin, and support pin 541 is an example of a fourth support pin.

[0174] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0175] In the above embodiments, lifting mechanisms 50 and 50X have been described as mechanisms for raising and lowering the edge ring FR and / or the cover ring CR, but are not limited thereto. For example, when the outer periphery of the edge ring FR and the inner periphery of the cover ring CR overlap, by forming a through hole in the cover ring CR and using a support pin having a first retaining portion and a second retaining portion, the edge ring FR and the cover ring CR can be raised and lowered independently. The first retaining portion is fitted into the through hole, and the second retaining portion is connected to the axial direction of the first retaining portion and has a protrusion protruding from the outer periphery of the first retaining portion. For example, by having the first retaining portion pass through the through hole of the cover ring CR and abutting the top end of the first retaining portion against the back surface of the edge ring FR, the edge ring FR can be raised independently. Alternatively, for example, by having the first retaining portion pass through the through hole of the cover ring CR and abutting the protrusion of the second retaining portion against the lower surface of the cover ring CR, the cover ring CR can be raised independently. Furthermore, details of this structure are described in U.S. Patent Application Publication No. 2020 / 0219753.

[0176] In the above embodiments, the case of transporting the edge ring between the storage module and the processing module has been described, but this disclosure is not limited thereto. For example, it can also be applied to the case of transporting other consumable components installed in the processing module, such as a cover ring or a top plate of the upper electrode, in place of the edge ring.

Claims

1. A storage container, which houses a ring-shaped member with a notch on its outer periphery, wherein, The annular component is an annular component disposed within the processing container for plasma treatment. The storage container has a base plate for holding the annular component. The base plate has multiple guide pins that protrude from the base plate and position the annular member. The plurality of guide pins includes pins that engage with the notch. The base plate includes a mounting surface on which the annular member is mounted. The annular member has one notch on its outer periphery. When the annular member is placed on the mounting surface, the pin of the plurality of guide pins engages with the notch, and the remaining guide pins of the plurality of guide pins contact the outer periphery of the annular member.

2. The storage container according to claim 1, wherein, The base plate is designed to be multi-layered.

3. The storage container according to claim 1 or 2, wherein, The base plate includes: A fork insertion slot, which is recessed relative to the mounting surface, is provided for the fork of a handling robot that handles the annular component to insert.

4. The storage container according to claim 1 or 2, wherein, The plurality of guide pins have a tapered shape at the tip.

5. The storage container according to claim 1 or 2, wherein, The annular member is a component disposed around the substrate during plasma processing.

6. The storage container according to claim 1 or 2, wherein, The notch has a V-shape when viewed from above.

7. A storage container, which houses a ring-shaped member with a notch on its inner circumference, wherein, The annular component is an annular component disposed within the processing container for plasma treatment. The storage container has a base plate for holding the annular component. The base plate has multiple guide pins that protrude from the base plate and position the annular member. The plurality of guide pins includes pins that engage with the notch. The base plate includes a mounting surface on which the annular member is mounted. The annular member has one notch on its inner circumference. When the annular member is placed on the mounting surface, the pin of the plurality of guide pins engages with the notch, and the remaining guide pins of the plurality of guide pins contact the inner circumference of the annular member.

8. A storage container for storing a first annular member having a first notch on its outer periphery and a second annular member having a second notch on its inner periphery, wherein, The outer diameter of the first annular member and the inner diameter of the second annular member are the same. The first annular member and the second annular member are annular members disposed within a processing container for plasma processing. The storage container has a base plate for holding the first annular member and the second annular member. The base plate has multiple guide pins that protrude from the base plate and position the first annular member and the second annular member. The plurality of guide pins includes pins that engage simultaneously with the first notch and the second notch. The base plate includes a mounting surface on which the first annular member and the second annular member are mounted. The first annular member has a first notch on its outer periphery, and the second annular member has a second notch on its inner periphery. When the first annular member and the second annular member are placed on the mounting surface, the pins of the plurality of guide pins engage with the first notch and the second notch simultaneously, and the remaining guide pins of the plurality of guide pins contact the outer periphery of the second annular member.

9. A processing system, wherein, The processing system includes: A storage module includes a storage container that houses an annular member with a notch on its outer periphery, the annular member being disposed within a processing container for plasma treatment; and A vacuum transport module, connected to the storage module, includes a transport robot for transporting the annular component into the storage container. The storage container has: A base plate on which the annular member is mounted; as well as Multiple guide pins, protruding from the base plate, position the annular component. The plurality of guide pins includes pins that engage with the notch. The base plate includes a mounting surface on which the annular member is mounted. The annular member has one notch on its outer periphery. When the annular member is placed on the mounting surface, the pin of the plurality of guide pins engages with the notch, and the remaining guide pins of the plurality of guide pins contact the outer periphery of the annular member.

10. A processing system, wherein, The processing system includes: A storage module includes a storage container that houses an annular member with a notch on its inner circumference, the annular member being disposed within a processing container for plasma treatment; and A vacuum transport module, connected to the storage module, includes a transport robot for transporting the annular component into the storage container. The storage container has: A base plate on which the annular member is mounted; as well as Multiple guide pins, protruding from the base plate, position the annular component. The plurality of guide pins includes pins that engage with the notch. The base plate includes a mounting surface on which the annular member is mounted. The annular member has one notch on its inner circumference. When the annular member is placed on the mounting surface, the pin of the plurality of guide pins engages with the notch, and the remaining guide pins of the plurality of guide pins contact the inner circumference of the annular member.

11. A processing system, wherein, The processing system includes: A storage module includes a storage container that houses a first annular member having a first notch on its outer periphery and a second annular member having a second notch on its inner periphery, wherein the outer diameter of the first annular member and the inner diameter of the second annular member are the same, and the first and second annular members are annular members disposed within a processing container for plasma processing; and A vacuum transport module, connected to the storage module, includes a transport robot for transporting the first annular component and the second annular component into the storage container. The storage container has: A base plate, on which the first annular member and the second annular member are mounted; and Multiple guide pins, protruding from the base plate, position the first annular member and the second annular member. The plurality of guide pins includes pins that engage simultaneously with the first notch and the second notch. The base plate includes a mounting surface on which the first annular member and the second annular member are mounted. The first annular member has a first notch on its outer periphery, and the second annular member has a second notch on its inner periphery. When the first annular member and the second annular member are placed on the mounting surface, the pins of the plurality of guide pins engage with the first notch and the second notch simultaneously, and the remaining guide pins of the plurality of guide pins contact the outer periphery of the second annular member.

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