Transfer device

Abstract

This disclosure provides a transfer device, comprising: a support assembly having a support end face for supporting a target workpiece, the support assembly being movably positioned to transfer the target workpiece into a processing chamber; and an adsorption assembly being movably positioned relative to the support assembly, the adsorption assembly having an adsorption body, wherein when the adsorption body is within the processing chamber, gas within the processing chamber adheres to the adsorption body. This disclosure solves the problem of low yield of wafers in high-temperature processes in the prior art.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and more specifically, to a transfer device. Background Technology

[0002] During wafer manufacturing, there are high-temperature processes. At this time, due to the different coatings on the wafer surface, gas release will occur, that is, the substances inside the wafer decompose and are released into the reaction chamber under the action of high temperature.

[0003] During the production process, the rapid thermal annealing process has a short reaction time. After the previous wafer reacts, the released gas in the reaction chamber cannot be removed in time. When the next room temperature wafer enters the reaction chamber, due to the thermophoresis effect (which refers to the effect of temperature gradient on particles, causing particles to move from a high temperature zone to a low temperature zone), these released gases will be adsorbed, which will lead to a decrease in wafer quality. As wafers are placed in the reaction chamber for processing one after another, more released gas will accumulate on the subsequent wafers, increasing product defects and affecting the wafer yield. Summary of the Invention

[0004] The main objective of this disclosure is to provide a transfer device to solve the problem of low yield of wafers in high-temperature processes in the prior art.

[0005] To achieve the above objectives, this disclosure provides a transfer device, comprising: a support assembly having a support end face for supporting a target workpiece, the support assembly being movably positioned to transfer the target workpiece into a processing chamber; and an adsorption assembly being movably positioned relative to the support assembly, the adsorption assembly having an adsorption body, wherein when the adsorption body is within the processing chamber, gas within the processing chamber adheres to the adsorption body.

[0006] Furthermore, the temperature of the adsorbent body is lower than the temperature inside the processing chamber.

[0007] Furthermore, when the adsorption body is inside the processing chamber, the adsorption body is positioned above the target workpiece.

[0008] Furthermore, the projected area of ​​the adsorption body on the horizontal plane is greater than or equal to the projected area of ​​the target workpiece on the horizontal plane.

[0009] Furthermore, the adsorption assembly also includes: a cooling channel disposed within the adsorption body, the cooling channel being used for the flow of a cooling medium; a medium inlet disposed on the adsorption body and connected to a first port of the cooling channel; and a medium outlet disposed on the adsorption body and connected to a second port of the cooling channel.

[0010] Furthermore, the cooling channel includes: a first channel segment extending along the circumferential direction of the adsorption body, with a first end connected to the medium outlet; a second channel segment located on one side of the first channel segment near the middle of the adsorption body, extending along the circumferential direction of the adsorption body, with a first end connected to the medium inlet; and a connecting channel segment, with both ends connected to the second ends of the first channel segment and the second end of the second channel segment, respectively.

[0011] Furthermore, the cooling channels extend along the circumferential direction of the adsorption body; there are multiple cooling channels, which are arranged alternately on the adsorption body.

[0012] Furthermore, the cooling channels are arranged in a spiral shape.

[0013] Furthermore, the adsorption assembly also includes: a first rotating arm, on which the adsorption body is disposed, the first rotating arm being rotatably disposed around a predetermined axis, and the adsorption body being rotated by the first rotating arm; the first rotating arm has a first flow path and a second flow path, the first flow path being connected to the medium inlet and the second flow path being connected to the medium outlet.

[0014] Furthermore, the support assembly also includes: a tray, with a support end face disposed on the tray; and a second rotating arm, with the tray disposed on the second rotating arm, the second rotating arm being rotatably disposed around a predetermined axis, thereby driving the tray to rotate.

[0015] Furthermore, the transfer device also includes a drive shaft assembly, wherein the first rotating arm and the second rotating arm are both connected to the drive shaft assembly, and the drive shaft assembly drives the first rotating arm or the second rotating arm to rotate.

[0016] Furthermore, the adsorption body is disc-shaped; and / or, the adsorption body is made of metal, ceramic, or quartz.

[0017] Furthermore, the temperature of the adsorbent body is 17°C to 20°C; and / or the thickness of the adsorbent body is 1.5 mm to 2.5 mm.

[0018] Furthermore, the adsorption body has an adsorption end face; the minimum distance between the adsorption end face and the supporting end face is 3mm to 5mm.

[0019] Furthermore, an exhaust channel is provided on the inner wall of the processing chamber so that some of the gas inside the processing chamber can be discharged through the exhaust channel.

[0020] Applying the technical solution of this disclosure, the transfer device includes a support assembly with a support end face for supporting the target workpiece. The support assembly is movably positioned to transfer the target workpiece into the processing chamber. After the target workpiece is transferred into the processing chamber, an adsorption assembly is movably positioned relative to the support assembly. The adsorption body of the adsorption assembly has the function of adsorbing gas, so that when the adsorption body is in the processing chamber, the gas in the processing chamber adheres to the adsorption body. By movably positioning the adsorption assembly relative to the support assembly, after the support assembly transfers the target workpiece into the processing chamber, the adsorption body is moved into the processing chamber. During the processing of the target workpiece, the adsorption body adsorbs the gas generated during the processing of the target workpiece, thus avoiding the problem of excessive gas remaining in the processing chamber and affecting the quality of the next target workpiece, thereby improving the yield of the target workpiece. Attached Figure Description

[0021] The accompanying drawings, which form part of this application, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure. In the drawings:

[0022] Figure 1 A schematic diagram of the working state of an embodiment of the transfer device according to the present disclosure is shown;

[0023] Figure 2 A schematic diagram of the structure of an embodiment of the transfer device according to the present disclosure is shown;

[0024] Figure 3 A schematic diagram of the adsorption assembly of the transfer device according to the present disclosure is shown;

[0025] Figure 4 A schematic diagram showing the cooperation of the support assembly and the adsorption assembly of the transfer device according to the present disclosure is shown;

[0026] Figure 5 A schematic diagram of the structure of a second embodiment of the cooling channel of the transfer device according to the present disclosure is shown;

[0027] Figure 6 A schematic diagram of the cooling channel of the transfer device according to the present disclosure is shown;

[0028] Figure 7 A schematic diagram of the structure of a fourth embodiment of the cooling channel of the transfer device according to the present disclosure is shown;

[0029] Figure 8 A side view of a fourth embodiment of the cooling channel of the transfer device according to the present disclosure is shown.

[0030] The above figures include the following reference numerals:

[0031] 100. Target workpiece; 101. Exhaust channel; 200. Processing chamber; 1. Support assembly; 10. Support end face; 2. Adsorption assembly; 20. Adsorption body; 201. Adsorption end face; 21. Cooling channel; 22. Medium inlet; 23. Medium outlet; 210. First channel section; 211. Second channel section; 212. Connecting channel section; 24. First rotating arm; 221. First flow path; 222. Second flow path; 11. Tray; 12. Second rotating arm; 3. Drive shaft assembly. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0033] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0034] Please refer to Figures 1 to 8 The present invention provides a transfer device, comprising: a support assembly 1 having a support end face 10 for supporting a target workpiece 100, the support assembly 1 being movably positioned to transfer the target workpiece 100 into a processing chamber 200; and an adsorption assembly 2 being movably positioned relative to the support assembly 1, the adsorption assembly 2 having an adsorption body 20, wherein when the adsorption body 20 is within the processing chamber 200, gas within the processing chamber 200 adheres to the adsorption body 20.

[0035] The transfer device provided by the present invention includes a support assembly 1, which has a support end face 10 for supporting a target workpiece 100. The support assembly 1 is movably disposed to transfer the target workpiece 100 into a processing chamber 200. After the target workpiece 100 is transferred into the processing chamber 200, an adsorption assembly 2 is movably disposed relative to the support assembly 1. The adsorption body 20 of the adsorption assembly 2 has the function of adsorbing gas, so that when the adsorption body 20 is in the processing chamber 200, the gas in the processing chamber 200 adheres to the adsorption body 20. The adsorption component 2 is movably arranged relative to the support component 1. After the support component 1 transfers the target workpiece 100 into the processing chamber 200, the adsorption body 20 is moved into the processing chamber 200. During the processing of the target workpiece 100, the adsorption body 20 adsorbs the gas generated by the target workpiece 100 during the processing, so that the gas is adsorbed onto the adsorption body 20. This avoids the problem of too much gas remaining in the processing chamber 200, which would affect the quality of the next target workpiece 100, and improves the yield of the target workpiece 100.

[0036] This disclosure uses wafer processing as an example. Multiple wafers are stored in a storage station. A support component 1 is used to transfer one wafer from the storage station to a processing chamber 200 for heating. During heating, the wafer surface coating releases gas, meaning the material inside the wafer decomposes and releases into the processing chamber 200 due to the high temperature. The gas remaining in the processing chamber 200 gradually accumulates as wafers are heated one after another. As wafer processing continues, this accumulated gas adheres to the wafer, causing defects. Therefore, an adsorption component 2 is provided, which is movable relative to the support component 1. The adsorption component 2 and the support component 1 are controlled independently to avoid interference between the support component 1 and the adsorption component 2 during the wafer handling process. Furthermore, after the support component 1 places the wafer into the processing chamber 200, the adsorption body 20 is moved into the processing chamber 200. Since the adsorption body 20 has the function of adsorbing gas, the gas released during the wafer heating process can adhere to the adsorption body 20 to avoid gas residue in the processing chamber 200. After the wafer processing is completed, the adsorption body 20 and the support component 1 are moved out of the processing chamber 200 in sequence to facilitate the treatment of the gas adsorbed on the adsorption body 20.

[0037] In the specific implementation process, the temperature of the adsorption body 20 is lower than the temperature inside the processing chamber 200. Based on the thermophoresis phenomenon (which refers to the phenomenon that in a gas with a temperature gradient, the gas molecules in the higher temperature part collide with the particles with higher kinetic energy than the gas molecules in the lower temperature part, causing the particles to move from the high temperature part to the low temperature part), the temperature difference between the adsorption body 20 and the processing chamber 200 can be used to make the higher temperature gas adsorbed on the lower temperature adsorption body 20.

[0038] like Figure 2 As shown, when the adsorption body 20 is inside the processing chamber 200, the adsorption body 20 is positioned above the target workpiece 100. This arrangement allows the higher-temperature gas to escape upwards, while the temperature of the adsorption body 20 is lower than the temperature inside the processing chamber 200. Consequently, as much of the higher-temperature gas as possible can be adsorbed onto the adsorption body 20, thereby minimizing the amount of gas residue inside the processing chamber 200.

[0039] In practice, the projected area of ​​the adsorption body 20 on the horizontal plane is greater than or equal to the projected area of ​​the target workpiece 100 on the horizontal plane. This arrangement allows the adsorption body 20 to completely cover the target workpiece 100, ensuring that the adsorption body 20 fully receives the gas generated by the target workpiece 100 during gas generation.

[0040] In the embodiments provided in this disclosure, to ensure that the adsorption component 2 is kept at a low temperature, the adsorption component 2 further includes: a cooling channel 21 disposed within the adsorption body 20, the cooling channel 21 being used for the flow of a cooling medium; a medium inlet 22 disposed on the adsorption body 20 and connected to a first port of the cooling channel 21; and a medium outlet 23 disposed on the adsorption body 20 and connected to a second port of the cooling channel 21. By providing the medium inlet 22, the medium outlet 23, and the cooling channel 21, the cooling medium circulates within the cooling channel 21, thereby ensuring the temperature stability of the adsorption body 20. Preferably, the cooling medium is liquid or gaseous, such as water or liquid nitrogen. The cooling medium can be treated industrial wastewater, thus enabling the secondary utilization of water resources and avoiding resource waste.

[0041] In a first embodiment of the cooling channel 21 of this disclosure, as Figure 3As shown, the cooling channel 21 includes: a first channel section 210, which extends along the circumferential direction of the adsorption body 20, and its first end is connected to the medium outlet 23; a second channel section 211, which is disposed on one side of the first channel section 210 near the middle of the adsorption body 20, and extends along the circumferential direction of the adsorption body 20, and its first end is connected to the medium inlet 22; and a connecting channel section 212, whose two ends are connected to the second ends of the first channel section 210 and the second ends of the second channel section 211, respectively. The first channel segment 210 extends in a circumferential direction, the second channel segment 211 extends in a circumferential direction, and the diameter of the circumference of the second channel segment 211 is smaller than the diameter of the circumference of the first channel segment 210. The connecting channel segment 212 extends in a circumferential direction. In this way, the cooling medium flowing in the first channel segment 210, the connecting channel segment 212 and the second channel segment 211 can keep the temperature on the adsorption body 20 uniform, so that the gas is uniformly attached to the surface of the adsorption body 20.

[0042] The first channel segment 210 has an opening to form a first clearance channel between the medium inlet end and the medium outlet end of the first channel segment 210. At least a portion of the flow path 221 is disposed on the adsorption body 20, and the first flow path 221 is cleared by the first clearance channel. Furthermore, a notch is provided on the connecting channel segment 212 to form a second clearance channel communicating with the first clearance channel between the two ports of the connecting channel segment 212. In this way, a portion of the flow path 221 is disposed in the first clearance channel and the second clearance channel, so that the cooling medium can flow smoothly into the second channel segment 211, while ensuring the structural strength of the adsorption body 20.

[0043] In a second embodiment of the cooling channel 21 disclosed herein, as Figure 6 As shown, cooling channels 21 extend along the circumferential direction of the adsorption body 20; there are multiple cooling channels 21, which are arranged alternately on the adsorption body 20. By setting multiple cooling channels 21 alternately on the adsorption body 20, the surface temperature of the adsorption body 20 is ensured to be uniform. Specifically, the multiple cooling channels 21 are evenly spaced, and cooling medium flows through each of the multiple cooling channels 21. In actual use, because the flow path of the cooling medium in each cooling channel 21 is relatively short, the temperature at any position on the surface of the adsorption body 20 can be kept consistent, thus improving the adsorption effect of the adsorption body 20. The cooling channels 21 can also extend along the radial direction of the adsorption body 20 or along a curved trajectory to ensure the cooling effect of the adsorption body 20.

[0044] In a third embodiment of the cooling channel 21 disclosed herein, as Figure 7 and Figure 8 As shown, the cooling channel 21 is arranged in a spiral shape. By making the cooling channel 21 spiral, the surface temperature of the adsorption body 20 can be kept uniform during the flow of the cooling medium. Simultaneously, to enable the cooling medium to circulate, such as... Figure 8 As shown, the cooling channel 21 is spirally shaped along the thickness direction of the adsorption body 20, which ensures that the overall temperature of the adsorption body 20 remains at a low level. During processing, the adsorption body 20 is configured as a first body and a second body. A flow groove is formed on the surface of the second body. Then, spiral-shaped flow channels are gradually formed on the second body along the spiral direction and connect with the flow groove. The first body is then fastened onto the second body to form a complete cooling channel 21. To ensure a stable connection between the first and second bodies, after fastening the first body onto the second body, sealant is used to seal the gap between the first and second bodies, thus preventing the risk of cooling medium leakage.

[0045] In a fourth embodiment of the cooling channel 21 disclosed herein, such as Figure 5 As shown, the cooling channel 21 is spirally arranged along the thickness direction of the adsorption body 20. The difference between this embodiment and the third embodiment described above is that in this embodiment, the circumference of the channel segments of the cooling channel 21 located in the same plane is the same, ensuring that the cooling channel 21 is evenly distributed inside the adsorption body 20. This arrangement ensures that the overall temperature of the adsorption body 20 remains low during the flow of the cooling medium within the cooling channel 21, thereby improving the adsorption effect of the adsorption body 20 on the gas. In specific implementation, the adsorption body 20 is configured as a first body and a second body, with spiral flow channels respectively formed on the first and second bodies. After the first and second bodies are interlocked, the cooling channel 21 is formed, which facilitates the processing of the shape and structure of the cooling channel 21.

[0046] In this disclosure, such as Figures 2 to 4As shown, the adsorption assembly 2 further includes: a first rotating arm 24, on which the adsorption body 20 is disposed. The first rotating arm 24 is rotatably disposed around a predetermined axis, and the adsorption body 20 is rotated by the first rotating arm 24. The first rotating arm 24 has a first flow path 221 and a second flow path 222. The first flow path 221 is connected to the medium inlet 22, and the second flow path 222 is connected to the medium outlet 23. By disposing of the adsorption body 20 on the first rotating arm 24, the adsorption body 20 is rotated by the first rotating arm 24 to avoid or rotate above the target workpiece 100. By providing the first flow path 221 and the second flow path 222 on the first rotating arm 24, it is convenient to introduce the cooling medium into the cooling channel 21 to achieve the circulation of the cooling medium.

[0047] The first rotating arm 24 includes a first side and a second side arranged opposite to each other. The first side is provided with a first interface, and a first flow path 221 is connected to the first interface. The first interface is used to connect with a pump source for providing cooling medium. The second side is provided with a second interface, and a second flow path 222 is connected to the second interface. The second interface is used to connect with a cooling medium recovery tank. In this way, when the first rotating arm 24 rotates, the pipes on the first interface and the pipes on the second interface are prevented from getting tangled. A heat exchange component is provided in the recovery tank. The outlet end of the recovery tank is connected to the pump source. In this way, after the high-temperature cooling medium is recovered into the recovery tank, it exchanges heat with the heat exchange component to obtain a lower-temperature cooling medium. Then, the pump source is used to pass the heat-exchanged cooling medium into the cooling channel 21 to realize the recycling of the cooling medium, so as to save resources and avoid resource waste.

[0048] In the specific implementation process, such as Figure 2 As shown, the supporting assembly 1 further includes: a tray 11, with a supporting end face 10 disposed on the tray 11; and a second rotating arm 12, with the tray 11 disposed on the second rotating arm 12. The second rotating arm 12 is rotatably disposed around a predetermined axis, and drives the tray 11 to rotate. By disposing the tray 11 on the second rotating arm 12, the second rotating arm 12 drives the tray 11 to rotate, facilitating the transfer of the target workpiece 100 from the storage station to the processing chamber 200. The second rotating arm 12 is rotatably disposed relative to the first rotating arm 24, ensuring that the first rotating arm 24 and the second rotating arm 12 do not interfere with each other, thus guaranteeing the normal movement of the first rotating arm 24 and the second rotating arm 12.

[0049] Among them, such as Figure 4As shown, the transfer device also includes a drive shaft assembly 3. The first rotating arm 24 and the second rotating arm 12 are both connected to the drive shaft assembly 3, and the drive shaft assembly 3 drives the first rotating arm 24 or the second rotating arm 12 to rotate. By coaxially arranging the first rotating arm 24 and the second rotating arm 12, the overall structure is more compact, reducing the installation space occupied by the entire device.

[0050] In a preferred embodiment of this disclosure, the adsorption body 20 is disc-shaped; and / or, the adsorption body 20 is made of metal, ceramic, or quartz. By setting the adsorption body 20 to a disc shape, sharp edges are avoided, thus preventing liquid from dripping onto the target workpiece 100 along the sharp edges when high-temperature gas adheres to and liquefies on the adsorption body 20. Simultaneously, making the adsorption body 20 of metal, ceramic, or quartz improves its thermal conductivity, allowing the temperature of the cooling medium to be rapidly transferred to the adsorption body 20.

[0051] In another embodiment of the adsorption body 20 provided in this disclosure, the adsorption body 20 is a prism, a frustum, or an elliptical disk. Here, only the outline shape of the adsorption body 20 is given as an example. Any shape of the adsorption body 20 that can adsorb gas is within the protection scope of this disclosure.

[0052] Specifically, in the first embodiment of the adsorption body 20 disclosed herein, the adsorption body 20 includes a first body and a second body that are interlocked with each other. The first body is provided with a first groove, and the second body is provided with a second groove. The first groove and the second groove are opposite to each other. When the first body and the second body are interlocked with each other, a cooling channel 21 is formed between the first groove and the second groove. This facilitates the processing of the cooling channel 21 of the adsorption body 20, and allows the cooling channel 21 to be processed into any shape according to actual needs. The first body has a first step structure extending along its circumference, and the second body has a second step structure extending along its circumference. The first and second step structures are interlocked to fasten the first and second bodies together. To ensure a tight connection between the first and second bodies and prevent them from detaching, a sealing strip is installed on the first step end face of the first body during installation. The sealing strip is positioned along the circumference of the first body, and the second step end face of the second body is fitted against the sealing strip. This achieves an interference fit between the second and second step end faces, preventing cooling medium leakage and ensuring the connection stability between the first and second bodies. Furthermore, the interlocking design of the adsorption body 20 facilitates maintenance. When the cooling channel 21 is damaged or blocked, the cooling channel 21 can be repaired simply by removing the first body from the second body.

[0053] In a second embodiment of the adsorption body 20 disclosed herein, the adsorption body 20 includes a first body and a second body that are interlocked. The first body is provided with a flow groove. After the flow groove is processed on the first body, the second body is interlocked with the first body to form a cooling channel 21 between the flow groove and the second body. The first body is provided with a first step structure that extends along the circumferential direction of the first body, and the second body is provided with a second step structure that extends along the circumferential direction of the second body. The first step structure and the second step structure are interlocked to interlock the first body and the second body together. In order to ensure a tight connection between the first body and the second body and avoid the risk of the first body and the second body separating from each other, a sealing strip is provided on the first step end face of the first body during installation. The sealing strip is arranged along the circumferential direction of the first body, and the second step end face of the second body is fitted with the sealing strip. This achieves that the second step end face is fitted on the first step end face, and the first step end face and the second step end face achieve an interference fit, which avoids the leakage of the cooling medium and ensures the connection stability between the first body and the second body.

[0054] Preferably, the temperature of the adsorption body 20 is 17°C to 20°C; and / or the thickness of the adsorption body 20 is 1.5mm to 2.5mm. By maintaining the temperature of the adsorption body 20 at 17°C to 20°C and setting the thickness of the adsorption body 20 to 1.5mm to 2.5mm, the adsorption body 20 can adsorb as much high-temperature gas as possible. Preferably, the thickness of the adsorption body 20 is 2mm. If the thickness of the adsorption body 20 is too large, there is a risk that the adsorption body 20 will scrape against the inner surface of the processing chamber 200 during the process of the adsorption body 200 entering the processing chamber 200. If the thickness of the adsorption body 20 is set too small, the strength of the adsorption body 20 cannot be guaranteed when a cooling channel 21 is set inside the adsorption body 20.

[0055] In the specific implementation process, the adsorption body 20 has an adsorption end face 201; the minimum distance between the adsorption end face 201 and the supporting end face 10 is 3mm to 5mm. By limiting the minimum distance between the adsorption end face 201 and the supporting end face 10 to 3mm to 5mm, it is ensured that neither the tray 11 nor the adsorption body 20 will rub against the inside of the processing chamber 200, and it also avoids the adsorption body 20 from coming into contact with the target workpiece 100 on the tray 11, so as not to affect the quality of the target workpiece 100.

[0056] To ensure that all gas in the processing chamber 200 is discharged as much as possible, an exhaust channel 101 is provided on the inner wall of the processing chamber 200 so that some of the gas in the processing chamber 200 can be discharged through the exhaust channel 101. Specifically, the exhaust channel 101 is connected to a pump body, and the pump body is used to extract the gas in the exhaust channel 101.

[0057] In practical applications, the drive shaft assembly 3 first drives the first rotating arm 24 to rotate to a position where it forms a certain angle with the second rotating arm 12, wherein the angle is greater than or equal to 90°. Then, the second rotating arm 12 moves the tray 11 to the storage station to retrieve the wafer to be processed. Afterwards, the second rotating arm 12 rotates, moving the wafer into the processing chamber 200. Then, the first rotating arm 24 moves the adsorption body 20 into the processing chamber 200, moving the adsorption body 20 above the wafer. Simultaneously, the cooling channel... The cooling medium inside 21 is constantly circulating to transfer the cooling energy to the surface of the adsorption body 20. Utilizing the temperature difference between the adsorption body 20 and the gas released from the wafer, the gas is adsorbed onto the adsorption body 20. At the same time, the pump connected to the exhaust channel 101 is opened. Under the combined action of the exhaust channel 101 and the adsorption body 20, the gas in the processing chamber 200 is completely discharged. After a wafer is processed, the tray 11 and the adsorption body 20 are removed. The operator can wipe the adsorption body 20 to ensure that the surface of the adsorption body 20 is clean.

[0058] In this disclosure, an adsorption component 2 is added to the drive shaft assembly 3 based on the original support component 1, so that the rotation axis of the support component 1 and the rotation axis of the adsorption component 2 are on the same axis. The adsorption component 2 and the support component 1 are controlled independently, which makes it convenient for operators to clean the adsorption body 20 of the adsorption component 2 regularly, reduces the installation space occupied by the adsorption component 2, and makes the overall structure of the transfer device more compact, while improving the quality of the wafer and the yield.

[0059] As can be seen from the above description, the embodiments of this disclosure achieve the following technical effects:

[0060] The transfer device provided by the present invention includes a support assembly 1, which has a support end face 10 for supporting a target workpiece 100. The support assembly 1 is movably disposed to transfer the target workpiece 100 into a processing chamber 200. After the target workpiece 100 is transferred into the processing chamber 200, an adsorption assembly 2 is movably disposed relative to the support assembly 1. The adsorption body 20 of the adsorption assembly 2 has the function of adsorbing gas, so that when the adsorption body 20 is in the processing chamber 200, the gas in the processing chamber 200 adheres to the adsorption body 20. The adsorption component 2 is movably arranged relative to the support component 1. After the support component 1 transfers the target workpiece 100 into the processing chamber 200, the adsorption body 20 is moved into the processing chamber 200. During the processing of the target workpiece 100, the adsorption body 20 adsorbs the gas generated by the target workpiece 100 during the processing, so that the gas is adsorbed onto the adsorption body 20. This avoids the problem of too much gas remaining in the processing chamber 200, which would affect the quality of the next target workpiece 100, and improves the yield of the target workpiece 100.

[0061] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0062] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0063] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A transfer device, characterized in that, include: Support assembly (1) having a support end face (10) for supporting a target workpiece (100) and the support assembly (1) being movably positioned to transfer the target workpiece (100) into the processing chamber (200); An adsorption component (2) is movably disposed relative to the support component (1). The adsorption component (2) has an adsorption body (20). When the adsorption body (20) is inside the processing chamber (200), the gas inside the processing chamber (200) adheres to the adsorption body (20). The temperature of the adsorption body (20) is lower than the temperature inside the processing chamber (200); The adsorption component (2) further includes: A cooling channel (21) is provided inside the adsorption body (20), and the cooling channel (21) is used for the flow of cooling medium; A medium inlet (22) is provided on the adsorption body (20) and communicates with the first port of the cooling channel (21); The medium outlet (23) is located on the adsorption body (20) and is connected to the second port of the cooling channel (21).

2. The transfer device according to claim 1, characterized in that, When the adsorption body (20) is inside the processing chamber (200), the adsorption body (20) is located above the target workpiece (100).

3. The transfer device according to claim 1, characterized in that, The projected area of ​​the adsorption body (20) on the horizontal plane is greater than or equal to the projected area of ​​the target workpiece (100) on the horizontal plane.

4. The transfer device according to claim 1, characterized in that, The cooling channel (21) includes: The first channel segment (210) extends along the circumferential direction of the adsorption body (20), and the first end of the first channel segment (210) is connected to the medium outlet (23). The second channel segment (211) is disposed on the side of the first channel segment (210) near the middle of the adsorption body (20). The second channel segment (211) extends along the circumferential direction of the adsorption body (20). The first end of the second channel segment (211) is connected to the medium inlet (22). A connecting channel segment (212) is provided, the two ends of which are respectively connected to the second end of the first channel segment (210) and the second end of the second channel segment (211).

5. The transfer device according to claim 1, characterized in that, The cooling channel (21) extends along the circumferential direction of the adsorption body (20); There are multiple cooling channels (21), and the multiple cooling channels (21) are arranged alternately on the adsorption body (20).

6. The transfer device according to claim 1, characterized in that, The cooling channel (21) is arranged in a spiral shape.

7. The transfer device according to claim 1, characterized in that, The adsorption component (2) further includes: The first rotating arm (24) is provided on the adsorption body (20). The first rotating arm (24) is rotatably provided around a predetermined axis, and the adsorption body (20) is driven to rotate by the first rotating arm (24). The first rotating arm (24) has a first flow path (221) and a second flow path (222), the first flow path (221) being connected to the medium inlet (22) and the second flow path (222) being connected to the medium outlet (23).

8. The transfer device according to claim 7, characterized in that, The support component (1) also includes: The pallet (11) has the supporting end face (10) disposed on the pallet (11); The second rotating arm (12) is mounted on the tray (11). The second rotating arm (12) is rotatably mounted around the predetermined axis, and the tray (11) is rotated by the second rotating arm (12).

9. The transfer device according to claim 8, characterized in that, The transfer device further includes: The drive shaft assembly (3) is connected to both the first rotating arm (24) and the second rotating arm (12), and the drive shaft assembly (3) drives the first rotating arm (24) or the second rotating arm (12) to rotate.

10. The transfer device according to any one of claims 1 to 9, characterized in that, The adsorption body (20) is disc-shaped; and / or, The adsorption body (20) is made of metal, ceramic or quartz.

11. The transfer device according to any one of claims 1 to 9, characterized in that, The temperature of the adsorbent body (20) is 17°C to 20°C; and / or The thickness of the adsorption body (20) is 1.5 mm to 2.5 mm.

12. The transfer device according to any one of claims 1 to 9, characterized in that, The adsorption body (20) has an adsorption end face (201); The minimum distance between the adsorption end face (201) and the support end face (10) is 3 mm to 5 mm.

13. The transfer device according to any one of claims 1 to 9, characterized in that, An exhaust channel (101) is provided on the inner wall of the processing chamber (200) so that some of the gas in the processing chamber (200) can be discharged through the exhaust channel (101).

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