Pressure sensing device and method of manufacturing the same, electronic device

Abstract

The application discloses a pressure sensing detection device, a manufacturing method and an electronic device. The manufacturing method of the pressure sensing detection device comprises the following steps: providing two circuit boards, wherein at least one of the circuit boards is provided with a protrusion; and oppositely arranging the two circuit boards, and supporting and fixing the protrusion on the other circuit board, so that a gap is formed between the two circuit boards and the electrical connection of the two circuit boards is realized. The manufacturing method of the pressure sensing detection device can reduce the cost. Moreover, the pressure sensing detection device can improve the spacing accuracy between the two circuit boards.

Description

Technical Field

[0001] This application relates to the field of capacitance technology, specifically to a pressure-sensitive detection device and its manufacturing method, and electronic equipment. Background Technology

[0002] The principle of capacitive pressure sensing technology is to apply pressure to the panel, causing a micron-level change in the gap between the flexible circuit board and the rigid circuit board, which in turn changes the capacitance between the two. The signal is transmitted to the chip, processed, and then used to make a judgment and operation, so as to realize the pressure-sensing press interaction.

[0003] To achieve this design requirement, a common industry solution is to solder the first circuit board onto the second circuit board. In one prior art, a circuit board is placed on a carrier, a spacer is placed on the circuit board, and solder paste is applied. Another circuit board is then attached to the spacer, during which the solder paste is squeezed until it adheres to the spacer. A reflow oven process is then performed to fix the shape of the solder paste, and finally the spacer is removed.

[0004] In existing technologies, spacers are needed to help ensure the gap height between two circuit boards. The spacers are then removed after the reflow oven. This involves many steps and requires high precision in placing and removing the spacers, resulting in higher costs.

[0005] Therefore, there is a need for a method to manufacture a pressure-sensitive detection device that can eliminate the need for shims, thereby reducing the assembly cost of the circuit board, while ensuring the accuracy of the spacing between the two circuit boards. Summary of the Invention

[0006] In view of this, this application provides a pressure-sensitive detection device and its manufacturing method, as well as an electronic device, to solve the problem of high assembly costs in existing systems.

[0007] This application provides a method for manufacturing a pressure-sensitive detection device, comprising: providing two circuit boards, wherein at least one of the circuit boards has a protrusion; arranging the two circuit boards opposite to each other, and supporting and fixing the protrusion to the other circuit board, such that there is a gap between the two circuit boards and an electrical connection between the two circuit boards is achieved.

[0008] Optionally, the method of supporting and fixing the protrusion to another circuit board includes: providing a slot at a position on the other circuit board corresponding to the protrusion, and fixing the protrusion in the slot; or, fixing the surface of the protrusion to the surface of the other circuit board; or fixing the protrusion to a protrusion located on the other circuit board.

[0009] Optionally, a first chamfer is formed at the edge of the card slot, and / or a second chamfer is formed at the edge of the protrusion; during the process of supporting and fixing the protrusion to another circuit board, the positions of the two circuit boards are corrected by the bevels of the first chamfer and / or the second chamfer.

[0010] Optionally, the method for forming the protrusion includes: during the process of forming the circuit board, using the same material as the substrate of the circuit board to form multiple layers of the protrusion on the circuit board, so that the protrusion and the circuit board on which the protrusion is located are an integral structure.

[0011] Optionally, the circuit board includes an electrode layer; when the two circuit boards are arranged opposite each other, the electrode layers of the two circuit boards face each other to form a capacitor structure, and the protrusion is located on the outside of the capacitor structure.

[0012] Optionally, at least one pair of block-shaped protrusions are symmetrically arranged on the outside of the capacitor structure; and / or, at least one pair of strip-shaped protrusions are arranged on the outside of the capacitor structure; and / or, annular protrusions are arranged around the capacitor structure.

[0013] Optionally, the protrusion is provided with a conductive part, which is electrically connected to the circuit in the circuit board where the protrusion is located; the step of supporting and fixing the protrusion to another circuit board further includes: electrically connecting the conductive part to the circuit in the other circuit board; or, electrically connecting the two circuit boards through leads.

[0014] Optionally, the method of fixing the protruding support to the surface of another circuit board further includes: providing a connector to fix the protruding support to the opposite circuit board.

[0015] Optionally, the connector may include solder or adhesive.

[0016] Optionally, the method of fixing the protrusion support to the surface of another circuit board further includes: forming a connecting groove on the top of the protrusion, and placing the connector in the connecting groove.

[0017] The manufacturing method of the pressure-sensitive detection device described in this application uses protrusions on the circuit board to support two circuit boards relative to each other, forming a gap with a preset size. This reduces the assembly process difficulty and assembly cost by omitting steps such as placing and removing shims. Furthermore, since the height of the protrusions can be controlled more precisely, the accuracy of the spacing between the two circuit boards can be effectively improved.

[0018] A pressure-sensitive detection device includes: two opposing circuit boards, wherein at least one of the circuit boards has a protrusion; the protrusion is supported and fixed to the other circuit board, such that there is a gap between the two circuit boards and an electrical connection is achieved between the two circuit boards.

[0019] Optionally, the protrusion being fixed to the surface of another circuit board includes: a slot being provided at a corresponding position on the other circuit board, and the protrusion being fixedly engaged in the slot; or, the surface of the protrusion being fixedly connected to the surface of the other circuit board; or the protrusion being fixedly connected to a protrusion on the other circuit board.

[0020] Optionally, the edge of the slot has a first chamfer, and / or the edge of the protrusion has a second chamfer.

[0021] Optionally, the protrusion and the circuit board on which the protrusion is located are an integral structure.

[0022] Optionally, the circuit board includes an electrode layer, and the electrode layers of two circuit boards are arranged opposite to each other to form a capacitor structure; the protrusion is located on the outside of the capacitor structure.

[0023] Optionally, the protrusions include at least a pair of block-shaped protrusions symmetrically disposed on the outside of the capacitor structure; and / or, the protrusions include at least a pair of strip-shaped protrusions distributed on the outside of the capacitor structure; and / or, the protrusions include annular protrusions disposed around the capacitor structure.

[0024] Optionally, the protrusion includes a conductive portion electrically connected to circuitry within a circuit board and electrically connected to circuitry within another circuit board; or, the two circuit boards are electrically connected via leads.

[0025] Optionally, the protrusion is also supported and fixed to the opposite circuit board surface by a connector.

[0026] Optionally, the connector may include solder or adhesive.

[0027] Optionally, the top of the protrusion has a connecting groove, and the connector is disposed within the connecting groove.

[0028] In the pressure-sensitive detection device described in this application, the protrusions support the two circuit boards relative to each other, forming a gap with a preset size. Since the height of the protrusions can be controlled more precisely, when the height of the protrusions is equal, the accuracy of the spacing between the two circuit boards can be effectively improved.

[0029] An electronic device includes: a housing; and a pressure-sensitive detection device as described in any one of the preceding claims, the pressure-sensitive detection device being located within the housing.

[0030] Optionally, the housing has a pressure-controlled area, and one of the circuit boards in the pressure-sensitive detection device is a flexible circuit board, with the outer surface of the flexible circuit board and the inner surface of the pressure-controlled area of ​​the housing being bonded together. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the first embodiment of this application; Figure 2 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the second embodiment of this application; Figure 3 This is a schematic flowchart of the manufacturing method of the pressure sensing device according to the third embodiment of this application; Figure 4 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the fourth embodiment of this application; Figure 5 This is a schematic flowchart of the manufacturing method of the pressure sensing device according to the fifth embodiment of this application; Figure 6 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the sixth embodiment of this application; Figure 7 This is a schematic diagram of the pressure sensing device according to the first embodiment of this application; Figure 8 This is a schematic diagram of the pressure sensing device according to the second embodiment of this application; Figure 9 This is a schematic diagram of the pressure sensing device according to the third embodiment of this application; Figure 10 This is a schematic diagram of the pressure sensing device according to the fourth embodiment of this application; Figure 11 This is a schematic diagram of the pressure sensing device according to the fifth embodiment of this application; Figure 12 This is a schematic diagram of the pressure sensing device according to the sixth embodiment of this application; Figure 13 This is a schematic diagram of the pressure sensing device according to the seventh embodiment of this application; Figure 14 This is a schematic diagram of the pressure sensing device according to the eighth embodiment of this application; Figure 15This is a schematic diagram of the pressure sensing device according to the ninth embodiment of this application; Figure 16 This is a schematic diagram of the pressure sensing device according to the tenth embodiment of this application; Figure 17 This is a schematic diagram of the pressure sensing device according to the eleventh embodiment of this application; Figure 18 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0033] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0034] Please see Figure 1 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the first embodiment of this application.

[0035] The method for manufacturing the pressure-sensitive detection device of this application includes: Step S11. Provide two circuit boards, wherein at least one of the circuit boards has a protrusion.

[0036] Step S12. The two circuit boards are arranged opposite each other, and the protrusion support is fixed to the other circuit board, so that there is a gap between the two circuit boards and the two circuit boards are electrically connected.

[0037] The electrical connection between the two circuit boards can be achieved by protrusions or by providing leads on the two circuit board components.

[0038] In one embodiment, only one of the circuit boards has a protrusion on its surface, and the protrusion is fixedly connected to another circuit board, such that there is a gap between the two circuit boards and an electrical connection between the two circuit boards is achieved, thereby enabling the assembly of the two circuit boards.

[0039] In one embodiment, both circuit boards have protrusions on their surfaces, and the protrusions on the two circuit boards are staggered. Each protrusion is fixedly connected to the flat surface of the other circuit board, so that there is a gap between the two circuit boards and the two circuit boards are electrically connected, thereby realizing the assembly of the two circuit boards.

[0040] In one embodiment, both circuit boards have protrusions on their surfaces, and the protrusions on the two circuit boards are positioned correspondingly. The protrusions on one circuit board and the protrusions on the other circuit board are fixedly connected, so that there is a gap between the two circuit boards and the two circuit boards are electrically connected, thereby realizing the assembly of the two circuit boards.

[0041] In existing technologies, the relative positions of two circuit boards are determined by placing a shim between them. After the two circuit boards are fixedly connected and removed, the shim is then removed from between them. This process requires high precision and is costly. Without the shim, it is difficult to meet the requirement of accurate relative positioning of the two circuit boards. However, in the embodiments of this application, a protrusion is used to create a predetermined gap between the two circuit boards, thereby ensuring the spacing between the two circuit boards without omitting the steps of placing and removing the shim, thus reducing the assembly difficulty and cost.

[0042] The protrusion can be fixed to the opposing circuit board via a mechanical connection. In one embodiment, step S12, the method of supporting and fixing the protrusion to the other circuit board, includes: providing a slot at a position on the other circuit board corresponding to the protrusion, and fixing the protrusion into the slot. In other embodiments, the surface of the protrusion can be directly fixed to the surface of the other circuit board by applying external force through pressing, bonding, or other means. In still other embodiments, the protrusion can also be directly fixed to the surface of a protrusion on the other circuit board through mechanical means such as pressing or bonding.

[0043] Please see Figure 2 This is a flowchart illustrating the manufacturing method of the pressure-sensitive detection device according to the second embodiment of this application.

[0044] In this embodiment, the method of fixing the protrusion support to another circuit board includes: S121. A slot is provided at a position on another circuit board corresponding to the protrusion.

[0045] S122. The protrusion is fixedly engaged in the slot.

[0046] When two circuit boards are fixedly connected using a slot and a protrusion, simply align the slot and the protrusion, then snap the protrusion into the slot to complete the assembly. This simple and easy-to-operate assembly process reduces assembly costs. Furthermore, the gap between the two circuit boards can be controlled by adjusting the height of the protrusion and the depth of the slot. For example, subtracting the depth of the slot from the height of the protrusion gives the gap between the two circuit boards, allowing for precise control of the gap and thus improving the yield rate.

[0047] To ensure that the protrusion can be reliably engaged in the slot, the size of the protrusion and the size of the slot are interference-fitted, or the edge of the protrusion is provided with a flange, and the slot is provided with a groove corresponding to the flange, so that when the protrusion is engaged in the slot, the flange is engaged in the groove, which can effectively prevent the protrusion from coming out of the slot.

[0048] In one embodiment, the method of fixing the protrusion to another circuit board includes: directly connecting the surface of the protrusion to the surface of the other circuit board or a protrusion on the surface of another circuit board by applying external force through pressing, bonding, or other methods. For example, pressing allows the material at the interface between the protrusion and the circuit board or another protrusion to be tightly bonded, forming a vacuum bonding state. This tight bonding is achieved under atmospheric pressure, which requires a high degree of smoothness of the bonding surface. In other embodiments, a suitable high-temperature environment can be provided during the pressing process, causing the material at the bonding interface to diffuse or slightly melt, and a stable connection can be formed between the materials on both sides of the interface through intermolecular forces or material fusion. In still other embodiments, if both the surface of the protrusion and the opposite surface of the circuit board are metal, a stable connection can be achieved through metal bonding. All of the above methods do not require slots, saving steps and thus reducing the assembly cost of the two circuit boards.

[0049] In one embodiment, the method of supporting and fixing the protrusion to another circuit board includes: fixing the protrusion to a protrusion located on the other circuit board. This embodiment is only applicable to the case where both circuit boards have protrusions that correspond to each other. Here, the protrusions correspond, and the orthographic projections of the protrusions on the two circuit boards at least partially overlap.

[0050] against Figure 2 In the illustrated embodiment, a first chamfer can be formed at the edge of the slot, and / or a second chamfer can be formed at the edge of the protrusion. During the process of supporting and fixing the protrusion to the other circuit board, the position of the two circuit boards is corrected by the bevels of the first and / or second chamfers. Even if there is a misalignment between the two circuit boards, the protrusion can be guided by the bevels of the chamfers to be engaged in the slot.

[0051] In one embodiment, a first chamfer is formed at the edge of the slot. In this embodiment, when the two circuit boards are brought close together and their positions are slightly misaligned, the protrusion first contacts the first chamfer and then slides into the slot along the slope of the first chamfer. During this process, the positional deviation of the two circuit boards can be corrected, thereby improving the assembly accuracy of the two circuit boards.

[0052] In another embodiment, a second chamfer is formed at the edge of the protrusion. In this embodiment, when the two circuit boards are brought close together and their positions are slightly misaligned, the beveled surface of the second chamfer contacts the edge of the slot. Through the beveled surface of the second chamfer, the protrusion is slid into the slot. In this process, the positional deviation of the two circuit boards can be corrected, thereby improving the assembly accuracy of the two circuit boards.

[0053] In another embodiment, a first chamfer can be formed at the edge of the slot, and a second chamfer can be formed at the edge of the protrusion. In this embodiment, when the two circuit boards are brought closer together and their positions are slightly misaligned, the beveled surfaces of the two chamfers slide together, causing the protrusion to slide into the slot. During this process, the positional deviation of the two circuit boards can be corrected, thereby improving the assembly accuracy of the two circuit boards.

[0054] In other embodiments, the protrusion support can also be fixed to the circuit board by a connector.

[0055] Please see Figure 3 This is a schematic flowchart of the manufacturing method of the pressure sensing device according to the third embodiment of this application.

[0056] In step S12, the method of fixing the protruding support to the other circuit board further includes: Step S123. Set the connector.

[0057] Step S124. Fix the protruding support to the opposite circuit board using the connector. For example, the connector can be a screw, bolt, clamp, or other similar component.

[0058] In one embodiment, the connector includes solder or adhesive. In this embodiment, if the protrusion has a conductive portion, both the solder and adhesive materials are conductive, thereby achieving an electrical connection between the two circuit boards.

[0059] In this embodiment, please refer to Figure 4 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the fourth embodiment of this application.

[0060] Step S12 includes the following steps: Step S125. Apply solder paste to the top of the protrusion and / or at a corresponding location on another circuit board opposite the protrusion.

[0061] Step S126. Position the two circuit boards opposite each other and adjust the distance between them so that the solder paste between them is compressed and deformed until the gap between the two circuit boards reaches a preset height. Positioning them opposite each other means that the orthographic projections of the two circuit boards at least partially overlap.

[0062] Step S127. The solder paste is cured to form solder balls, thereby fixing the relative positions of the two circuit boards.

[0063] In existing technologies, a spacer is placed between two circuit boards, and the thickness of the spacer determines the gap between the two circuit boards. Solder is then used to fix the two circuit boards together. The precise placement and removal of the spacer requires high precision, resulting in high production costs for the pressure-sensitive detection device. Without the spacer, the gap between the two circuit boards is entirely determined by the solder balls, making it difficult to guarantee dimensional accuracy and height consistency. Therefore, in this embodiment, a protrusion is added to the circuit boards. Due to the protrusion, the gap between the two circuit boards is determined by both the height of the protrusion and the height of the solder balls. Since the height of the protrusion is controllable, the gap error between the two circuit boards originates entirely from the solder balls. With the gap between the first and second circuit boards remaining constant, the height of the solder balls in this embodiment is smaller than that in existing technologies, thus reducing the range of height error between different solder balls and ensuring uniformity in the gap between the two circuit boards.

[0064] Furthermore, compared with existing technologies, this solution ensures the spacing between the two circuit boards and reduces assembly costs by omitting the steps of placing and removing the shims.

[0065] For further details, please refer to Figure 5 This is a schematic flowchart of the manufacturing method of the pressure sensing device according to the fifth embodiment of this application.

[0066] In step S126, the method of arranging the two circuit boards opposite each other and adjusting the spacing between the two circuit boards includes: Step S1261. Place the first circuit board on the carrier.

[0067] Step S1262. Use a suction cup to pick up the center position of the back of the second circuit board and move the second circuit board to be parallel to the surface of the first circuit board, so that the second circuit board is close to the first circuit board, in order to adjust the distance between the first circuit board and the second circuit board.

[0068] In this embodiment, the first circuit board is placed and fixed on the carrier, thereby defining the position of the first circuit board. The back surface of the second circuit board is the surface of the second circuit board away from the first circuit board. For example, when the first circuit board is below and the second circuit board is above the first circuit board, the upper surface of the second circuit board is the back surface of the second circuit board. The suction cup picks up the center position of the back surface of the second circuit board, which allows for more stable placement and removal of the second circuit board. Furthermore, when adjusting the distance between the first and second circuit boards, the second circuit board will press the solder paste downwards. The suction cup applies pressure at the center of the second circuit board, which makes the force applied to each solder paste more even, thus reducing the height error between each solder paste. In this embodiment, it is more preferable to make the position of the solder paste centrally symmetrical with respect to the second circuit board, in which case the force on each solder paste is more even and the height error between each solder paste is smaller.

[0069] In other alternative embodiments, multiple suction cups are provided, and the working surfaces of the multiple suction cups are on the same horizontal plane. When picking up the second circuit board, multiple suction cups simultaneously pick up the same second circuit board, which allows for smoother picking and placing of the second circuit board. Furthermore, the pressure applied to the second circuit board by multiple suction cups makes the force applied to each solder paste more even, thereby reducing the height error between each solder paste. Preferably, the positions of each suction cup and each solder paste correspond, which can further make the pressure on each solder paste more even, thus further reducing the height error between each solder paste.

[0070] In this embodiment, the first circuit board is a flexible circuit board, and the second circuit board is a rigid circuit board. The rigid circuit board deforms less when subjected to pressure from the suction cup, thus applying a more even force to each solder paste, further reducing height errors between individual solder pastes.

[0071] Please see Figure 6 This is a schematic flowchart of the manufacturing method of the pressure-sensitive detection device according to the sixth embodiment of this application.

[0072] In step S12, the method of fixing the protruding support to the other circuit board further includes: Step S128. A connecting groove is formed on the top of the protrusion.

[0073] Step S129. Place the connector in the connecting groove.

[0074] In this embodiment, solder paste is placed in the connecting groove, making its position on each protrusion more consistent and improving the assembly accuracy of the two circuit boards. Therefore, it is understood that the depth of the connecting groove should be less than the height of the connector. The distance between the two circuit boards is still determined by the height of the protrusion and the connector. In this embodiment, the bottom of the connecting groove is flat, and the distance from the bottom of the connecting groove to the circuit board containing the protrusion is defined as the groove bottom height. This ensures that the bottom height of each connecting groove is equal, thereby reducing assembly errors between the two circuit boards.

[0075] In step S11, the method for forming the protrusion includes: during the process of forming the circuit board, the same material as the substrate of the circuit board is used to stack multiple layers on the circuit board to form the protrusion, so that the protrusion and the circuit board on which the protrusion is located are an integral structure.

[0076] In this embodiment, the protrusion and the circuit board are integrated, forming part of the circuit board. Specifically, the protrusion is formed by stacking materials on the circuit board according to the multi-layer stacking process of the circuit board. Compared with forming protrusions on the circuit board through other methods (such as soldering, bonding, etc.), the height of the protrusion in this embodiment is more precisely controllable, increasing the accuracy of the pressure sensing device formed by this method. Furthermore, since the protrusion and the circuit board are manufactured as a single unit, no additional steps are required, reducing costs. The connection between the protrusion and the main body of the circuit board is also stronger, improving the safety and service life of the pressure sensing device formed by this method.

[0077] Furthermore, the circuit board includes an electrode layer; when the two circuit boards are arranged opposite each other, the electrode layers of the two circuit boards face each other, forming a capacitor structure, with the protrusion located on the outside of the capacitor structure. The capacitor structure is a pressure-sensitive capacitor structure. Pressing causes deformation of the circuit board, resulting in a micrometer-level change in the distance between the two electrode layers, thereby changing the capacitance between the two electrode layers. The changed signal is transmitted to the chip, processed, and then used for subsequent operations to achieve pressure-sensitive press interaction. The protrusion, located on the outside of the capacitor structure, can support and fix the position of the electrode layers while not hindering the deformation of the circuit board and electrode layers.

[0078] The type of bump includes one or more of the following combinations: First, at least one pair of block-shaped protrusions are symmetrically arranged on the outside of the capacitor structure; second, at least one pair of strip-shaped protrusions are arranged on the outside of the capacitor structure; third, annular protrusions are arranged around the capacitor structure.

[0079] In this embodiment, the protrusions function as follows: First, the protrusions support a predetermined gap between the two circuit boards, thereby ensuring the accuracy of the capacitor structure and reducing the height error of the gap between the two circuit boards to a predetermined level. This reduces the cost of assembling the two circuit boards into a capacitor structure without the use of spacers, while still maintaining the accuracy of the capacitor structure. Second, the protrusions connect and fix the two circuit boards together. Third, different types of protrusions can stably support the two circuit boards, allowing them to withstand more pressure without damage and improving the lifespan of the capacitor structure.

[0080] Furthermore, the protrusion is provided with a conductive part, which is electrically connected to the circuit in the circuit board where the protrusion is located; the step of supporting and fixing the protrusion to another circuit board also includes: making the conductive part electrically connected to the circuit in the other circuit board.

[0081] In this embodiment, in addition to the three functions mentioned above, the protrusion can also electrically connect the two circuit boards through a conductive part, thereby enabling signal exchange between the two circuit boards. It is understood that the conductive part can be a lead wire, electrically connecting the two circuit boards, or connected through other conductors.

[0082] An embodiment of the present invention also provides a pressure-sensitive detection device, the pressure-sensitive detection device comprising: two opposing circuit boards, wherein at least one of the circuit boards has a protrusion; the protrusion is supported and fixed to the other circuit board, such that there is a gap between the two circuit boards and an electrical connection is achieved between the two circuit boards.

[0083] In this embodiment, the electrical connection between the two circuit boards can be achieved through protrusions or by providing leads on the two circuit board components. In this embodiment, the protrusions support the two circuit boards relative to each other, forming a gap with a preset size. Since the height of the protrusions can be controlled relatively precisely, when the heights of the protrusions are all equal, the accuracy of the spacing between the two circuit boards can be effectively improved.

[0084] Please see Figure 7 This is a schematic diagram of the pressure sensing device according to the first embodiment of this application.

[0085] The pressure-sensitive detection device of this application in this embodiment includes two circuit boards 11 and 12 arranged opposite to each other, wherein the surface of one of the circuit boards 11 has a protrusion 13; the protrusion 13 is supported and fixed to the other circuit board 12, such that there is a gap between the two circuit boards 11 and 12. Furthermore, the electrical connection between the two circuit boards 11 and 12 can be achieved through the protrusion 13 or by providing a lead wire between the two circuit boards 11 and 12.

[0086] Please see Figure 8This is a schematic diagram of the pressure sensing device according to the first embodiment of this application.

[0087] The pressure-sensitive detection device of this embodiment includes two opposing circuit boards 21 and 22, wherein the surfaces of the two circuit boards 21 and 22 have protrusions 23; the protrusions 23 are supported and fixed to the other circuit board 22 and 21, such that there is a gap between the two circuit boards 21 and 22. Furthermore, the electrical connection between the two circuit boards 21 and 22 can be achieved through the protrusions 23 or by providing leads between the two circuit boards 21 and 22.

[0088] Please see Figure 9 This is a schematic diagram of the pressure sensing device according to the first embodiment of this application.

[0089] The pressure-sensitive detection device of this embodiment includes two opposing circuit boards 31 and 32, wherein the surfaces of the two circuit boards 31 and 32 have corresponding protrusions 33 and 34; the protrusion 33 on one circuit board 31 is supported and fixed to the protrusion 34 on the other circuit board 32, such that there is a gap between the two circuit boards 31 and 32. Furthermore, the electrical connection between the two circuit boards 31 and 32 can be achieved through the protrusion 33 or by providing a lead wire between the two circuit boards 31 and 32.

[0090] Furthermore, the protrusion being fixed to the surface of another circuit board includes: a slot being provided at a corresponding position on the other circuit board, and the protrusion being fixedly engaged in the slot; or, the surface of the protrusion being fixedly connected to the surface of the other circuit board; or the protrusion being fixedly connected to a protrusion on the other circuit board.

[0091] Please see Figure 10 This is a schematic diagram of the pressure sensing device according to the fourth embodiment of this application.

[0092] In this embodiment, a slot 421 is provided at a corresponding position on another circuit board 42, and the protrusion 43 is fixedly engaged in the slot 421.

[0093] When two circuit boards 41 and 42 are fixedly connected by the snap-fit ​​of the slot 421 and the protrusion 43, it is only necessary to align the slot 421 and the protrusion 43, and then snap the protrusion 43 into the slot 421 to complete the assembly of the two circuit boards 41 and 42. The assembly process is simple and easy to operate, reducing the assembly cost. Furthermore, the gap between the two circuit boards 41 and 42 can be controlled by adjusting the height of the protrusion 43 and the depth of the slot 421. For example, in this embodiment, the gap between the two circuit boards 41 and 42 can be obtained by subtracting the depth of the slot 421 from the height of the protrusion 43. Therefore, the accuracy of the gap between the two circuit boards 42 and 42 can be controlled, thereby improving the yield rate.

[0094] In one embodiment, the raised surface is fixedly connected to the surface of another circuit board. This embodiment eliminates the need for a slot and saves assembly steps, thus reducing the assembly cost of the two circuit boards.

[0095] In one embodiment, the protrusion is fixedly connected to a protrusion on another circuit board. This embodiment is only applicable to the case where both circuit boards have protrusions that correspond to each other. Here, the protrusions correspond, and the orthographic projections of the protrusions on the two circuit boards at least partially overlap.

[0096] Furthermore, the edge of the slot has a first chamfer, and / or the edge of the protrusion has a second chamfer.

[0097] In one embodiment, please refer to Figure 11 This is a schematic diagram of the pressure sensing device according to the fifth embodiment of this application.

[0098] In this embodiment, the edge of the slot 521 has a first chamfer 5211. In this embodiment, when the positions of the two circuit boards 51 and 52 are slightly misaligned during the process of approaching each other, the protrusion 53 first contacts the first chamfer 5211, and then slides into the slot 521 along the inclined surface of the first chamfer 5211. During this process, the positional deviation of the two circuit boards 51 and 52 can be corrected.

[0099] In another embodiment, the edge of the protrusion is provided with a second chamfer. In this embodiment, when the two circuit boards are brought close together and their positions are slightly misaligned, the beveled surface of the second chamfer contacts the edge of the slot. Through the beveled surface of the second chamfer, the protrusion is slid into the slot. In this process, the positional deviation of the two circuit boards can be corrected, thereby improving the assembly accuracy of the two circuit boards.

[0100] In another embodiment, the edge of the slot has a first chamfer, and the edge of the protrusion has a second chamfer. In this embodiment, when the two circuit boards are brought close together and their positions are slightly misaligned, the beveled surfaces of the two chamfers slide together, causing the protrusion to slide into the slot. During this process, the positional deviation of the two circuit boards can be corrected, thereby improving the assembly accuracy of the two circuit boards.

[0101] Furthermore, in one embodiment, the protrusion and the circuit board on which the protrusion is located are an integral structure.

[0102] In this embodiment, the protrusion and the circuit board are integrated, forming part of the circuit board. Specifically, the protrusion can be formed by stacking materials on the circuit board according to the multi-layer stacking process of the circuit board. Compared with connecting the protruding circuit board through other methods (such as soldering or bonding), the height of the protrusion in this embodiment is more precise and controllable, increasing the accuracy of the pressure sensing device formed by this method. Furthermore, the connection between the protrusion and the circuit board is more robust, improving the safety and service life of the pressure sensing device formed by this method.

[0103] Please see Figure 12 This is a schematic diagram of the pressure sensing device according to the sixth embodiment of this application.

[0104] In this embodiment, the circuit boards 61 and 62 include electrode layers 611 and 621, and the electrode layers 611 and 621 of the two circuit boards 61 and 62 are arranged opposite to each other to form a capacitor structure 64; the protrusion 63 is located on the outside of the capacitor structure 64.

[0105] The purpose of this pressure-sensitive detection device manufacturing method is to assemble two circuit boards 61 and 62, so that the electrode layers 611 and 621 of the two circuit boards 61 and 62 face each other, forming a capacitor structure 64. The capacitor structure 64 is a pressure-sensitive capacitor structure. Pressing causes deformation of the circuit board 61 or 62, resulting in a micrometer-level change in the gap between the two electrode layers 611 and 621, thus changing the capacitance between the two electrode layers 611 and 621. The changed signal is transmitted to the chip, processed, and then used for subsequent operations to achieve pressure-sensitive press interaction. The protrusion 63 is located on the outside of the capacitor structure 64, which on the one hand supports and fixes the relative position of the electrode layers 611 and 621, and on the other hand does not hinder the deformation of the electrode layers 611 and 621.

[0106] Furthermore, the protrusions include at least a pair of block-shaped protrusions symmetrically arranged on the outside of the capacitor structure; and / or, the protrusions include at least a pair of strip-shaped protrusions distributed on the outside of the capacitor structure; and / or, the protrusions include annular protrusions arranged around the capacitor structure.

[0107] In this embodiment, the protrusions function as follows: First, the protrusions support a predetermined gap between the two circuit boards, thereby ensuring the accuracy of the capacitor structure and reducing the height error of the gap between the two circuit boards to a predetermined level. This reduces the cost of assembling the two circuit boards into a capacitor structure without the use of spacers, while still maintaining the accuracy of the capacitor structure. Second, the protrusions connect and fix the two circuit boards together. Third, different types of protrusions can stably support the two circuit boards, allowing them to withstand more pressure without damage and improving the lifespan of the capacitor structure.

[0108] Please see Figure 13 This is a schematic diagram of the pressure sensing device according to the seventh embodiment of this application.

[0109] In this embodiment, the protrusions include three pairs of block-shaped protrusions 731 symmetrically arranged on the outside of the capacitor structure 741.

[0110] Please see Figure 14 This is a schematic diagram of the pressure sensing device according to the eighth embodiment of this application.

[0111] In this embodiment, the protrusions include a pair of strip-shaped protrusions 732 distributed on the outside of the capacitor structure 742.

[0112] Please see Figure 15 This is a schematic diagram of the pressure sensing device according to the ninth embodiment of this application.

[0113] In this embodiment, the protrusion includes an annular protrusion 733 disposed around the capacitor structure 743.

[0114] Furthermore, the protrusion includes a conductive portion that is electrically connected to circuitry within a circuit board and to circuitry within another circuit board.

[0115] In this embodiment, in addition to the three functions mentioned above, the protrusion can also electrically connect the two circuit boards through a conductive part, thereby enabling signal exchange between the two circuit boards. It is understood that the two circuit boards can also be electrically connected via leads or other conductors.

[0116] Please see Figure 16 This is a schematic diagram of the pressure sensing device according to the tenth embodiment of this application.

[0117] In this embodiment, the protrusion 83 is also supported and fixed to the surfaces of the opposing circuit boards 81 and 82 by a connector 85. For example, the connector 85 can be a screw, bolt, clamp, or other component. In one embodiment, the connector includes solder or adhesive.

[0118] Please see Figure 17 This is a schematic diagram of the pressure sensing device according to the eleventh embodiment of this application.

[0119] In one embodiment, the top of the protrusion 93 has a connecting groove 931, and the connector 95 is disposed in the connecting groove 931.

[0120] In this embodiment, the connector 95 is disposed within the connecting groove 931, making the positions of the connector 95 on each protrusion 93 more consistent and improving the assembly accuracy of the two circuit boards 91 and 92. Therefore, it can be understood that the depth of the connecting groove 931 should be less than the height of the connector 95, so that the protrusion 93 does not directly contact the circuit board 92. In this case, the distance between the two circuit boards 91 and 92 is still determined by the heights of the protrusion 93 and the connector 95. In this embodiment, the bottom of the connecting groove 931 is flat. The distance from the bottom of the connecting groove 931 to the circuit board 91 where the protrusion 93 is located is defined as the groove bottom height H. Therefore, the groove bottom height H of each connecting groove 931 is equal, thereby reducing the assembly error between the two circuit boards 91 and 92.

[0121] Please see Figure 18 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0122] The electronic device of this embodiment includes: a housing 01; and a pressure-sensitive detection device as described in any of the above-mentioned embodiments, wherein the pressure-sensitive detection device is located inside the housing 01.

[0123] In this embodiment, the housing deforms when pressed, causing the circuit board to deform as well. It is understood that the housing and the circuit board can be fitted together, allowing the housing to directly deform the circuit board. Alternatively, a force transmission element can connect the housing and the circuit board; the deformation of the housing causes displacement of the force transmission element, thereby applying pressure to the circuit board.

[0124] The housing 01 has a pressure control area 011, and one of the circuit boards 101 in the pressure sensing device is a flexible circuit board, with the outer surface of the flexible circuit board and the inner surface of the pressure control area 011 of the housing 01 being attached.

[0125] In this embodiment, the pressure-controlled area 011 can deform when pressed, thereby causing the flexible circuit board to deform.

[0126] Although this application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and the accompanying drawings. This application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the aforementioned components, the terminology used to describe such components is intended to correspond to any component (unless otherwise indicated) that performs the specified function of said component (e.g., is functionally equivalent to it), even if structurally not equivalent to the disclosed structure performing the functions in the exemplary implementations of this specification shown herein.

[0127] That is, the above description is only an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, such as the combination of technical features between embodiments, or direct or indirect application in other related technical fields, are similarly included within the patent protection scope of this application.

[0128] Furthermore, it should be understood that in the description of this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In addition, for structural elements with the same or similar characteristics, this application may use the same or different reference numerals for identification.

[0129] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as more preferred or advantageous than other embodiments. This application has been provided above to enable any person skilled in the art to implement and use it. Various details have been set forth in the above description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be implemented without using these specific details. In other embodiments, well-known structures and processes will not be described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed herein.

Claims

1. A method for manufacturing a pressure-sensitive detection device, characterized in that, include: Two circuit boards are provided, wherein at least one of the circuit boards has a protrusion; The two circuit boards are arranged opposite each other, and the protrusion is fixed to the other circuit board, so that there is a gap between the two circuit boards and the two circuit boards are electrically connected. The method for forming the protrusion includes: during the process of forming the circuit board, using the same material as the substrate of the circuit board to form multiple layers of the protrusion on the circuit board, so that the protrusion and the circuit board on which the protrusion is located are an integral structure.

2. The method for manufacturing the pressure-sensitive detection device according to claim 1, characterized in that, The method of supporting and fixing the protrusion to another circuit board includes: providing a slot at a position on the other circuit board corresponding to the protrusion, and fixing the protrusion in the slot; or, fixing the surface of the protrusion to the surface of the other circuit board; or fixing the protrusion to a protrusion located on the other circuit board.

3. The method for manufacturing the pressure-sensitive detection device according to claim 2, characterized in that, A first chamfer is formed at the edge of the slot, and / or a second chamfer is formed at the edge of the protrusion; During the process of fixing the protruding support to another circuit board, the positions of the two circuit boards are corrected by the bevels of the first chamfer and / or the second chamfer.

4. The method for manufacturing the pressure-sensitive detection device according to claim 1, characterized in that, The circuit board includes an electrode layer; when the two circuit boards are arranged opposite each other, the electrode layers of the two circuit boards are opposite each other to form a capacitor structure, and the protrusion is located on the outside of the capacitor structure.

5. The method for manufacturing the pressure-sensitive detection device according to claim 4, characterized in that, At least one pair of block-shaped protrusions are symmetrically arranged on the outside of the capacitor structure; and / or, at least one pair of strip-shaped protrusions are arranged on the outside of the capacitor structure; and / or, annular protrusions are arranged around the capacitor structure.

6. The method for manufacturing the pressure-sensitive detection device according to claim 4, characterized in that, The protrusion is provided with a conductive part, which is electrically connected to the circuit in the circuit board where the protrusion is located. The method of fixing the protrusion support to another circuit board further includes: electrically connecting the conductive part to a circuit in the other circuit board; Alternatively, the two circuit boards can be electrically connected via leads.

7. The method for manufacturing the pressure-sensitive detection device according to claim 1, characterized in that, The method of fixing the protruding support to the surface of another circuit board further includes: providing a connector to fix the protruding support to the opposite circuit board.

8. The method for manufacturing the pressure-sensitive detection device according to claim 7, characterized in that, The connector includes solder or adhesive.

9. The method for manufacturing the pressure-sensitive detection device according to claim 7, characterized in that, The method of fixing the protrusion to the surface of another circuit board further includes: forming a connecting groove on the top of the protrusion, and placing the connector in the connecting groove.

10. A pressure-sensitive detection device, characterized in that, include: Two opposing circuit boards, wherein at least one of the circuit boards has a protrusion; The protrusion is fixed to another circuit board, so that there is a gap between the two circuit boards and the two circuit boards are electrically connected. The method for forming the protrusion includes: during the process of forming the circuit board, using the same material as the substrate of the circuit board to form multiple layers of the protrusion on the circuit board, so that the protrusion and the circuit board on which the protrusion is located are an integral structure.

11. The pressure-sensitive detection device according to claim 10, characterized in that, The protrusion being fixed to another circuit board includes: a slot being provided at a corresponding position on the other circuit board, and the protrusion being fixedly engaged in the slot; or, the surface of the protrusion being fixedly connected to the surface of the other circuit board; or the protrusion being fixedly connected to a protrusion on the other circuit board.

12. The pressure-sensitive detection device according to claim 11, characterized in that, The edge of the slot has a first chamfer, and / or the edge of the protrusion has a second chamfer.

13. The pressure-sensitive detection device according to claim 10, characterized in that, The circuit board includes an electrode layer, and the electrode layers of two circuit boards are arranged opposite each other to form a capacitor structure; the protrusion is located on the outside of the capacitor structure.

14. The pressure-sensitive detection device according to claim 13, characterized in that, The protrusions include at least a pair of block-shaped protrusions symmetrically arranged on the outside of the capacitor structure; and / or, the protrusions include at least a pair of strip-shaped protrusions distributed on the outside of the capacitor structure; and / or, the protrusions include annular protrusions arranged around the capacitor structure.

15. The pressure-sensitive detection device according to claim 14, characterized in that, The protrusion includes a conductive portion that is electrically connected to a circuit within a circuit board and to a circuit within another circuit board; or, the two circuit boards are electrically connected via leads.

16. The pressure-sensitive detection device according to claim 10, characterized in that, The protrusion is also supported and fixed to the opposite circuit board surface by a connector.

17. The pressure-sensitive detection device according to claim 16, characterized in that, The connector includes solder or adhesive.

18. The pressure-sensitive detection device according to claim 16, characterized in that, The top of the protrusion has a connecting groove, and the connector is disposed in the connecting groove.

19. An electronic device, characterized in that, include: Housing; the pressure-sensitive detection device as described in any one of claims 10-18, wherein the pressure-sensitive detection device is located within the housing.

20. The electronic device according to claim 19, characterized in that, The housing has a pressure-controlled area, and one of the circuit boards in the pressure-sensitive detection device is a flexible circuit board, with the outer surface of the flexible circuit board and the inner surface of the pressure-controlled area of ​​the housing being attached.

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