Display backplane and display device

Abstract

The present application provides a display backplane and a display device; the display backplane sets redundant pixels in pixel light-emitting units, and when there is a failed micro-LED in the pixel light-emitting unit, sets an organic light-emitting diode device or a quantum dot light-emitting diode device in the redundant pixel, so that the pixel light-emitting unit can be repaired by the organic light-emitting diode device or the quantum dot light-emitting diode device, and the organic light-emitting diode device or the quantum dot light-emitting diode device can be directly obtained by printing, without the need for transfer and with high precision, thereby improving the repair efficiency and repair accuracy of the display backplane.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display backplane and a display device. Background Art

[0002] Micro LED (micro light emitting diode) display devices are widely used due to their small size, low power consumption, high brightness, high color saturation, fast response and long life. In order to improve the yield of Micro LED display devices, in the preparation process of existing Micro LED display devices, after the LED chip is transferred, the LEDD chip will be accurately addressed, detected and repaired to eliminate the light-emitting chip that cannot be displayed and improve the yield of the display device. The repair process of existing Micro LED display devices includes laser repair / chip replacement and transfer of redundant chips. The laser repair / chip replacement technology is to transfer new LED chips after removing the bad points by laser. Transferring redundant chips means setting redundant space next to each chip, and transferring redundant chips next to the failed chip after the laser disconnects the failed chip. Both processes require the chip to be transferred after the bad points are removed by laser, resulting in low efficiency. As the size of the LED chip decreases, the repair accuracy requirements are higher, which makes the repair more difficult.

[0003] Therefore, the existing Micro LED repair process has technical problems such as low efficiency and high difficulty in high-precision repair. Summary of the invention

[0004] The embodiments of the present application provide a display backplane and a display device to alleviate the technical problems of low efficiency and high difficulty in high-precision repair in the existing Micro LED repair process.

[0005] An embodiment of the present application provides a display backplane, which includes a plurality of pixel light-emitting units arranged in an array, and the pixel light-emitting units include:

[0006] Micro light emitting diodes, the micro light emitting diodes at least comprising a red micro light emitting diode, a green micro light emitting diode and a blue micro light emitting diode;

[0007] A redundant pixel is arranged on one side of the micro light emitting diode;

[0008] Among them, the pixel light-emitting unit includes at least one failed micro-light-emitting diode, and the redundant pixel in the same pixel light-emitting unit as the failed micro-light-emitting diode includes one of an organic light-emitting diode device or a quantum dot light-emitting diode device, and the light-emitting color of the redundant pixel is the same as the failed color of the failed micro-light-emitting diode.

[0009] In some embodiments, the display backplane further includes an anode layer, the anode layer includes a first anode of the micro-LED and a second anode of the redundant pixel, and the organic light emitting diode device or the quantum dot light emitting diode device is disposed on the second anode.

[0010] In some embodiments, the display backplane further includes a cathode layer, wherein the cathode layer is disposed on the micro light emitting diode, and the cathode layer is disposed on the organic light emitting diode device or the quantum dot light emitting diode device.

[0011] In some embodiments, the display backplane further includes a planar layer, and in the redundant pixel, the planar layer is disposed between the anode layer and the cathode layer, and the planar layer is in contact with the anode layer and the cathode layer.

[0012] In some embodiments, the red micro LED, the green micro LED and the blue micro LED in the same micro LED are arranged horizontally, and the redundant pixel is arranged between two adjacent rows of micro LEDs.

[0013] In some embodiments, the width of the redundant pixel along the horizontal direction is equal to the width of the failed green micro LED along the vertical direction, and the width of the redundant pixel along the vertical direction is equal to the width of the failed green micro LED along the horizontal direction.

[0014] In some embodiments, the redundant pixel includes a first redundant pixel and a second redundant pixel located in the same pixel light emitting unit, and the first redundant pixel and the second redundant pixel have different light emitting colors.

[0015] In some embodiments, the red micro LEDs and the blue micro LEDs in the pixel light-emitting units in the same column are arranged alternately, the green micro LEDs and the red micro LEDs are located in adjacent columns, and the redundant pixels and the green micro LEDs are arranged in the same column.

[0016] In some embodiments, the spacing between the redundant pixel and the next column of pixel light emitting units is equal to the spacing between the blue micro LED and the next column of pixel light emitting units.

[0017] At the same time, an embodiment of the present application provides a display device, which includes the display backplane and the driving chip described in any of the above embodiments.

[0018] Beneficial effects: The present application provides a display backplane and a display device; the display backplane includes a plurality of pixel light-emitting units arranged in an array, the pixel light-emitting units include micro light-emitting diodes and redundant pixels, the micro light-emitting diodes include at least red micro light-emitting diodes, green micro light-emitting diodes and blue micro light-emitting diodes, and the redundant pixels are arranged on one side of the micro light-emitting diodes, wherein the pixel light-emitting unit includes at least one failed micro light-emitting diode, and the redundant pixels in the same pixel light-emitting unit as the failed micro light-emitting diode include one of an organic light-emitting diode device or a quantum dot light-emitting diode device, and the luminous color of the redundant pixels is the same as the failed color of the failed micro light-emitting diode. The present application arranges redundant pixels in the pixel light-emitting unit, and when there is a failed micro light-emitting diode in the pixel light-emitting unit, arranges an organic light-emitting diode device or a quantum dot light-emitting diode device in the redundant pixel, so that the pixel light-emitting unit can be repaired by the organic light-emitting diode device or the quantum dot light-emitting diode device, and the organic light-emitting diode device or the quantum dot light-emitting diode device can be directly obtained by printing, without the need for transfer and with high precision, thereby improving the repair efficiency and repair precision of the display backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0020] Figure 1 A first schematic diagram of a display backplane provided in an embodiment of the present application.

[0021] Figure 2 A second schematic diagram of a display backplane provided in an embodiment of the present application.

[0022] Figure 3 A third schematic diagram of the display backplane provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0027] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0028] In view of the technical problems that the existing Micro LED repair process has low efficiency and is difficult to repair with high precision, the embodiments of the present application provide a display backplane and a display device to alleviate the above technical problems.

[0029] like Figure 1 , Figure 2 As shown, an embodiment of the present application provides a display backplane, the display backplane 1 includes a plurality of pixel light emitting units 11 arranged in an array, and the pixel light emitting units 11 include:

[0030] Micro light emitting diodes 111, wherein the micro light emitting diodes 111 at least include a red micro light emitting diode 111a, a green micro light emitting diode 111b and a blue micro light emitting diode 111c;

[0031] A redundant pixel 112 is disposed on one side of the micro light emitting diode 111;

[0032] The pixel light emitting unit 11 includes at least one failed micro light emitting diode 111, and the redundant pixel 112 in the same pixel light emitting unit 11 as the failed micro light emitting diode 111 includes one of an organic light emitting diode device or a quantum dot light emitting diode device ( Figure 2 An organic light emitting diode device is shown in FIG. 1 ), and the light emission color of the redundant pixel 112 is the same as the failed color of the failed micro light emitting diode 111.

[0033] An embodiment of the present application provides a display backplane, which arranges redundant pixels in pixel light-emitting units, and when a failed micro-LED exists in the pixel light-emitting unit, arranges an organic light-emitting diode device or a quantum dot light-emitting diode device in the redundant pixel, so that the pixel light-emitting unit can be repaired by the organic light-emitting diode device or the quantum dot light-emitting diode device, and the organic light-emitting diode device or the quantum dot light-emitting diode device can be directly obtained by printing, without the need for transfer and with high precision, thereby improving the repair efficiency and repair accuracy of the display backplane.

[0034] It should be noted that the failed color in the failed micro LED refers to the color that the failed micro LED cannot emit. For example, if a red micro LED in the micro LED fails and cannot emit red, the failed color is red.

[0035] It should be noted that since redundant pixels are provided in the pixel light-emitting unit and repair is performed through an organic light-emitting diode device or a quantum dot light-emitting diode device, and since the organic light-emitting diode device or the quantum dot light-emitting diode device can be inkjet printed, there is no need to transfer the chip, and the efficiency is high. The accuracy of inkjet printing is higher than the accuracy of transfer, and the accuracy of chip repair can be improved. Compared with the technology of transferring redundant chips for repair, since the embodiment of the present application only needs to set a redundant pixel for each pixel light-emitting unit to repair a failed micro-light-emitting diode, compared with the transfer redundant chip repair technology, a redundant chip needs to be set for each micro-light-emitting diode, which reduces the space occupied by a single pixel light-emitting unit and improves the resolution of the display backplane.

[0036] In one embodiment, if Figure 2 As shown, the display backplane further includes an anode layer 23, the anode layer includes a first anode 231 of a micro-LED and a second anode 232 of a redundant pixel, and the organic light emitting diode device or the quantum dot light emitting diode device is disposed on the second anode 232. By providing the first anode and the second anode, the second anode is provided for the redundant pixel, so that when the pixel light emitting unit needs to be repaired, the organic light emitting diode device or the quantum dot light emitting diode device can be directly formed on the second anode without re-setting the anode layer, thereby reducing the process flow of the display backplane and improving the repair efficiency of the display backplane.

[0037] In one embodiment, if Figure 2 As shown, the display backplane also includes a cathode layer 26, and the cathode layer 26 is arranged on the micro-LED, and the cathode layer 26 is arranged on the organic light-emitting diode device or the quantum dot light-emitting diode device. By setting the cathode layer on the entire surface, it is not necessary to increase the process flow during the preparation of the display backplane, thereby improving the repair efficiency of the display backplane, and when repairing the display backplane, it is only necessary to form an organic light-emitting diode device or a quantum dot light-emitting diode device, and the display can be realized through the anode, cathode and the organic light-emitting diode device or the quantum dot light-emitting diode device, and the pixel light-emitting unit can be repaired. This process does not require the process of transfer and chip connection, thereby improving the repair efficiency of the pixel light-emitting unit.

[0038] It should be noted that the organic light-emitting diode device includes a hole layer, an electron layer and an organic light-emitting layer located between the anode and the cathode. Specifically, the hole layer includes a hole injection layer and a hole transport layer, and the electron layer includes an electron injection layer and an electron transport layer. The quantum dot light-emitting diode device includes a hole layer, an electron layer and a quantum dot light-emitting layer located between the anode and the cathode. Specifically, the hole layer includes a hole injection layer and a hole transport layer, and the electron layer includes an electron injection layer and an electron transport layer.

[0039] When the micro-LED displays normally, there is no need to set an organic light-emitting diode device or a quantum dot light-emitting diode device at the redundant pixel, resulting in the problem of holes at the redundant pixel. In one embodiment, the display backplane also includes a flat layer, and in the redundant pixel, the flat layer is arranged between the anode layer and the cathode layer, and the flat layer is in contact with the anode layer and the cathode layer. For the pixel light-emitting unit that does not need to be repaired, a flat layer is set in the area of ​​the retained redundant pixel to keep the redundant pixel and the micro-LED flat, which is convenient for the preparation of subsequent film layers. In the redundant pixel, no organic light-emitting diode device or quantum dot light-emitting diode device is set between the anode layer and the cathode layer, and the redundant pixel will not emit light, thereby avoiding the redundant pixel affecting the normal display of the pixel light-emitting unit.

[0040] In one embodiment, if Figure 1 As shown, the red micro-LED 111a, the green micro-LED 111b and the blue micro-LED 111c in the same micro-LED 111 are arranged horizontally, and the redundant pixel 112 is arranged between two adjacent rows of micro-LEDs 111. By arranging the redundant pixel between two adjacent rows of micro-LEDs, when the micro-LED in the pixel light-emitting unit fails, the redundant pixel can replace the failed micro-LED, so that the pixel light-emitting unit can display normally.

[0041] The problem that the different light-emitting areas of the micro-LED and the redundant pixel may lead to different light-emitting effects of the pixel light-emitting unit. Figure 1As shown, the width L1 of the redundant pixel 112 along the horizontal direction is equal to the width L3 of the failed green micro-LED 111b along the vertical direction, and the width L2 of the redundant pixel 112 along the vertical direction is equal to the width L4 of the failed green micro-LED 111b along the horizontal direction. In the present application, by making the horizontal width of the redundant pixel equal to the vertical width of the green micro-LED, the vertical width of the redundant pixel equal to the horizontal width of the green micro-LED, the luminous area of ​​the redundant pixel is close to or even the same as the luminous area of ​​the failed micro-LED. When the micro-LED of the pixel light-emitting unit fails, the redundant pixel can replace the failed micro-LED to repair the pixel light-emitting unit, and the luminous effect of the redundant pixel can be the same as the luminous effect of the failed micro-LED, so that the pixel light-emitting unit can display normally. In addition, the vertical width of the redundant pixel is smaller than the horizontal width, which reduces the area occupied by the redundant pixel and improves the resolution of the display backplane.

[0042] Specifically, the light-emitting area of ​​the redundant pixel is equal to the light-emitting area of ​​the failed green micro-LED. Then, the light-emitting effect of the redundant pixel can be the same as the light-emitting effect of the failed micro-LED, so that the pixel light-emitting unit can display normally.

[0043] It should be noted that Figure 1 The detailed explanation is given in the example that the lengths and widths of the red micro-LEDs, green micro-LEDs and blue micro-LEDs are equal, but in actual design, since the luminous efficiencies of the red micro-LEDs, green micro-LEDs and blue micro-LEDs may be different, resulting in different luminous areas of the red micro-LEDs, green micro-LEDs and blue micro-LEDs, when setting redundant pixels, the luminous area of ​​the redundant pixels can be made the same as that of the corresponding failed micro-LEDs.

[0044] Specifically, when setting redundant pixels, the area of ​​the redundant pixels is equal to the one with the largest light-emitting area among the red micro-LED, green micro-LED and blue micro-LED. After the failed micro-LED is determined, an organic light-emitting diode device or a quantum dot light-emitting diode device can be printed according to the determined light-emitting area of ​​the micro-LED, so that the light-emitting area of ​​the redundant pixels is equal to the light-emitting area of ​​the failed micro-LED.

[0045] Specifically, the above-mentioned embodiment is described by taking the failure of a green micro-LED as an example, but the embodiments of the present application are not limited to this. For example, when a red micro-LED or a blue micro-LED fails, the light-emitting area of ​​the redundant pixel can also be made the same as the light-emitting area of ​​the red micro-LED or the blue micro-LED, so that the pixel light-emitting unit can emit light normally, and the redundant pixels are arranged vertically, thereby reducing the space occupied by the redundant pixels and improving the resolution of the display backplane.

[0046] In order to solve the problem that multiple micro-LEDs may fail in a single pixel light-emitting unit, in one embodiment, the redundant pixel border is located at the first redundant pixel and the second redundant pixel of the same pixel light-emitting unit, and the first redundant pixel and the second redundant pixel have different luminous colors. By setting the first redundant pixel and the second redundant pixel in the same pixel light-emitting unit, when two micro-LEDs fail in the pixel light-emitting unit, the first redundant pixel and the second redundant pixel can be used to replace the two micro-LEDs respectively, so that the pixel light-emitting unit can display normally.

[0047] Specifically, for example, if the red micro LED and the green micro LED in the same pixel light-emitting unit fail, the red micro LED and the green micro LED can be replaced by the first redundant pixel and the second redundant pixel respectively, so that the pixel light-emitting unit can display normally.

[0048] Specifically, setting two redundant pixels in the same pixel light-emitting unit may increase the width of the pixel light-emitting unit, resulting in a problem of reduced resolution of the display backplane. When setting two redundant pixels, the present application can set the redundant pixels according to the lateral width and longitudinal width of the micro-LED in the same pixel light-emitting unit. For example, when the lateral width of the micro-LED in the same pixel light-emitting unit is greater than or equal to twice the longitudinal width, setting two redundant pixels will not increase the width of the same pixel light-emitting unit. When the lateral width of the micro-LED is less than twice the longitudinal width, the lateral width of the redundant pixel can be reduced. By increasing the thickness of the light-emitting material, the light-emitting efficiency of the light-emitting material is improved. When the normal display of the pixel light-emitting unit is achieved, the lateral width of the pixel light-emitting unit is not increased.

[0049] Specifically, setting two redundant pixels in the same pixel light-emitting unit may increase the width of the pixel light-emitting unit, resulting in a problem of reduced resolution of the display backplane. In one embodiment, two adjacent pixel light-emitting units are provided with three redundant pixels, the three redundant pixels are arranged in sequence, and the redundant pixel located in the middle position spans across two pixel light-emitting units. By making the redundant pixel located in the middle position span across two pixel light-emitting units, it is not necessary to increase the lateral width of the pixel light-emitting unit, and when two micro-light-emitting diodes fail in the pixel light-emitting unit, the redundant pixel in the middle position can replace one of the micro-light-emitting diodes, so that the pixel light-emitting unit can display normally.

[0050] Specifically, the above embodiment is described in detail using the example of a rectangular micro-LED and an elliptical redundant pixel, but the embodiments of the present application are not limited to this. The shapes of the micro-LED and the redundant pixel are set according to the requirements for resolution and the requirements for the preparation process.

[0051] The problem that the redundant pixel is set between two rows of pixel light-emitting units will lead to a reduction in the resolution of the display backplane. In one embodiment, Figure 3 As shown, the red micro-LEDs 111a and the blue micro-LEDs 111c in the pixel light-emitting units 11 in the same column are arranged alternately, the green micro-LEDs 111b and the red micro-LEDs 111a are located in adjacent columns, and the redundant pixels 112 and the green micro-LEDs 111b are arranged in the same column. By arranging the micro-LEDs of three colors and the redundant pixels in the pixel light-emitting units in a rectangular manner, the redundant pixels utilize the gaps of the micro-LEDs in the pixel light-emitting units, and there is no need to add a new redundant pixel setting position, thereby avoiding increasing the space occupied by a single pixel light-emitting unit and improving the resolution of the display backplane.

[0052] In one embodiment, the spacing between the redundant pixel and the next column of pixel light emitting units is equal to the spacing between the blue micro-LED and the next column of pixel light emitting units. By making the spacing between the redundant pixel and the blue micro-LED and the next column of pixel light emitting units equal, there is no need to increase the spacing between adjacent pixel light emitting units, reducing the occupied area of ​​the pixel light emitting units and improving the resolution of the display backplane.

[0053] In one embodiment, if Figure 2 As shown, the display backplane is a display panel, and the display panel further includes a substrate 21, a driving circuit layer 22, and an insulating layer 24. For the micro-LEDs directly disposed on the driving backplane, after the micro-LEDs are formed on the anode, the failed micro-LEDs can be detected, and after the failed micro-LEDs are detected, an organic light-emitting diode device or a quantum dot light-emitting diode device can be formed on the anode, thereby repairing the display panel.

[0054] In one embodiment, the display backplane is a backlight module. When the micro-LED in the pixel light-emitting unit fails during the formation of the backplane module, an organic light-emitting diode device or a quantum dot light-emitting diode device is formed on the anode to repair the display panel.

[0055] In one embodiment, if Figure 2 As shown, the micro LED includes a red light emitting chip 251. Figure 2 It is a cross-sectional schematic diagram, and thus only the red micro-LED and redundant pixels are shown, while the green micro-LED and the blue micro-LED are not shown. However, in fact, the pixel light-emitting unit includes a green micro-LED and a blue micro-LED.

[0056] At the same time, an embodiment of the present application provides a method for preparing a display backplane, which is used to prepare the display backplane described in any of the above embodiments. The method for preparing the display backplane includes:

[0057] providing a substrate;

[0058] forming a driving circuit layer and an anode layer on the substrate in sequence;

[0059] Forming micro light emitting diodes on the anode layer; the micro light emitting diodes at least include a red micro light emitting diode, a green micro light emitting diode and a blue micro light emitting diode;

[0060] detecting the micro light emitting diodes, and determining position information of the failed micro light emitting diodes when a failed micro light emitting diode is detected;

[0061] Printing an organic light emitting diode device or a quantum dot light emitting diode device on the anode layer according to the position information of the failed micro light emitting diode; the color of the organic light emitting diode device or the quantum dot light emitting diode device is the same as the color of the failed micro light emitting diode;

[0062] A cathode is formed on the micro light emitting diode, and the cathode is arranged on an organic light emitting diode device or a quantum dot light emitting diode device to obtain a display backplane.

[0063] An embodiment of the present application provides a method for preparing a display backplane. After forming micro-LEDs, the micro-LEDs are detected to determine failed micro-LEDs, and organic light-emitting diode devices or quantum dot light-emitting diode devices are printed at corresponding positions of the failed micro-LEDs, so that the pixel light-emitting units can be repaired by the organic light-emitting diode devices or quantum dot light-emitting diode devices. The organic light-emitting diode devices or quantum dot light-emitting diode devices can be directly obtained by printing without the need for transfer and with high precision, thereby improving the repair efficiency and repair precision of the display backplane.

[0064] Specifically, the position of the failed micro-LED can be detected by AOI (Automated Optical Inspection) and recorded, so as to print an organic light-emitting diode device or a quantum dot light-emitting diode device at the corresponding position to repair the pixel light-emitting unit.

[0065] At the same time, an embodiment of the present application provides a display device, which includes the display backplane and the driving chip described in any of the above embodiments.

[0066] According to the above embodiments, it can be seen that:

[0067] The embodiment of the present application provides a display backplane and a display device, the display backplane includes a plurality of pixel light-emitting units arranged in an array, the pixel light-emitting units include micro light-emitting diodes and redundant pixels, the micro light-emitting diodes include at least red micro light-emitting diodes, green micro light-emitting diodes and blue micro light-emitting diodes, and the redundant pixels are arranged on one side of the micro light-emitting diodes, wherein the pixel light-emitting unit includes at least one failed micro light-emitting diode, and the redundant pixels in the same pixel light-emitting unit as the failed micro light-emitting diode include one of an organic light-emitting diode device or a quantum dot light-emitting diode device, and the luminous color of the redundant pixels is the same as the failed color of the failed micro light-emitting diode. The present application arranges redundant pixels in the pixel light-emitting unit, and when there is a failed micro light-emitting diode in the pixel light-emitting unit, arranges an organic light-emitting diode device or a quantum dot light-emitting diode device in the redundant pixel, so that the pixel light-emitting unit can be repaired by the organic light-emitting diode device or the quantum dot light-emitting diode device, and the organic light-emitting diode device or the quantum dot light-emitting diode device can be directly obtained by printing, without the need for transfer and with high precision, thereby improving the repair efficiency and repair precision of the display backplane.

[0068] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0069] The above is a detailed introduction to a display backplane and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display backplane, characterized in that: A plurality of pixel light emitting units are arranged in an array, wherein the pixel light emitting units include: Micro light emitting diodes, the micro light emitting diodes at least comprising a red micro light emitting diode, a green micro light emitting diode and a blue micro light emitting diode; A redundant pixel is arranged on one side of the micro light emitting diode; Wherein, the pixel light-emitting unit includes at least one failed micro-LED, and the redundant pixel in the same pixel light-emitting unit as the failed micro-LED includes one of an organic light-emitting diode device or a quantum dot light-emitting diode device, and the light-emitting color of the redundant pixel is the same as the failed color of the failed micro-LED; the display backplane also includes an anode layer, the anode layer includes a first anode of the micro-LED and a second anode of the redundant pixel, and the organic light-emitting diode device or the quantum dot light-emitting diode device is arranged on the second anode.

2. The display backplane according to claim 1, characterized in that: The display backplane further includes a cathode layer, wherein the cathode layer is disposed on the micro light emitting diode, and the cathode layer is disposed on the organic light emitting diode device or the quantum dot light emitting diode device.

3. The display backplane according to claim 2, characterized in that: The display backplane further includes a planar layer. In the redundant pixel, the planar layer is disposed between the anode layer and the cathode layer, and the planar layer is in contact with the anode layer and the cathode layer.

4. The display backplane according to claim 1, wherein: The red micro light emitting diode, the green micro light emitting diode and the blue micro light emitting diode in the same micro light emitting diode are arranged horizontally, and the redundant pixel is arranged between two adjacent rows of micro light emitting diodes.

5. The display backplane according to claim 4, characterized in that: The width of the redundant pixel along the horizontal direction is equal to the width of the failed green micro light emitting diode along the vertical direction, and the width of the redundant pixel along the vertical direction is equal to the width of the failed green micro light emitting diode along the horizontal direction.

6. The display back panel according to claim 4, characterized in that: The redundant pixels include a first redundant pixel and a second redundant pixel located in the same pixel light emitting unit, and the first redundant pixel and the second redundant pixel have different light emitting colors.

7. The display backplane according to claim 1, characterized in that: The red micro LEDs and the blue micro LEDs in the pixel light emitting units in the same column are arranged alternately, the green micro LEDs and the red micro LEDs are located in adjacent columns, and the redundant pixels and the green micro LEDs are arranged in the same column.

8. The display back panel according to claim 7, characterized in that: The spacing between the redundant pixel and the next column of pixel light emitting units is equal to the spacing between the blue micro light emitting diode and the next column of pixel light emitting units.

9. A display device, characterized in that: It comprises a display back panel and a driving chip as described in any one of claims 1 to 8.

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