Display back panel and manufacturing method thereof, and display terminal

Abstract

The present application proposes a display backplane and a manufacturing method thereof, and a display terminal; the display backplane includes a thin film transistor area and a binding area located on at least one side of the thin film transistor area, a substrate is arranged in the thin film transistor area and the binding area, at least one thin film transistor and a planarization layer covering the thin film transistor are arranged on the substrate of the thin film transistor area, a binding terminal is arranged on the substrate of the binding area, and the distance from the surface of the binding terminal away from the substrate to the substrate is greater than or equal to the distance from the surface of the planarization layer away from the substrate to the substrate; through the above arrangement, the present application allows the anisotropic conductive adhesive on the binding terminal to be more fully squeezed during the chip transfer process, thereby better releasing the conductive metal particles therein, which is beneficial to improving the conductive performance stability of the anisotropic conductive adhesive film.

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