Display panel and manufacturing method thereof

Abstract

The embodiment of the present invention discloses a display panel and a manufacturing method thereof, wherein the display panel has a display area and includes: a substrate; a light-emitting device layer located on the substrate and including a plurality of light-emitting devices, wherein the light-emitting devices are located in the display area; an encapsulation layer located on the light-emitting device layer, wherein the encapsulation layer covers the light-emitting devices in the top-view direction of the display panel; wherein the encapsulation layer includes a first inorganic encapsulation layer, wherein the first inorganic encapsulation layer includes a first sublayer and a second sublayer located on the first sublayer, wherein the orthographic projection of the second sublayer on the substrate is located within the orthographic projection of the first sublayer on the substrate. The present invention avoids the formation of the second sublayer in the first inorganic encapsulation layer on the substrate from being in an unintended encapsulation film-forming area, thereby improving the product quality of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] At present, the inorganic thin film used by the display panel to block water / oxygen intrusion is usually prepared by plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD). Due to the limitation of the film forming method, the PECVD method has poor coverage of the step structure in the display panel. Therefore, the atomic layer deposition method is combined with the PECVD method and other deposition methods to improve the water / oxygen blocking ability of the inorganic thin film. However, since the atomic layer deposition method and other methods do not have regional selectivity during film formation, the inorganic encapsulation film layer will also be formed in the area where the encapsulation film is not expected, affecting the product quality.

[0003] Therefore, a display panel and a manufacturing method thereof are urgently needed to solve the above technical problems. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, which can alleviate the current technical problem that a film layer in an inorganic film used for blocking water / oxygen intrusion in a display panel is formed in an unintended packaging film-forming area.

[0005] The present invention provides a display panel, including a display area, wherein the display panel includes:

[0006] substrate;

[0007] a light emitting device layer, located on the substrate and comprising a plurality of light emitting devices, wherein the light emitting devices are located in the display area;

[0008] an encapsulation layer, located on the light-emitting device layer, wherein the encapsulation layer covers the light-emitting devices in a top-view direction of the display panel;

[0009] The encapsulation layer includes a first inorganic encapsulation layer, the first inorganic encapsulation layer includes a first sublayer and a second sublayer located on the first sublayer, and the orthographic projection of the second sublayer on the substrate is located within the orthographic projection of the first sublayer on the substrate.

[0010] Preferably, the display panel further comprises an organic barrier layer located on the substrate, and the organic barrier layer comprises an organic barrier portion arranged around the display area;

[0011] Wherein, in a top-view direction of the display panel, a boundary of the first inorganic encapsulation layer is located outside the display area and on a side of the organic barrier portion close to the display area.

[0012] Preferably, the organic barrier comprises a first side away from the display area and a second side close to the display area;

[0013] Wherein, in a top-view direction of the display panel, the first inorganic encapsulation layer is located on a side of the second side close to the display area.

[0014] Preferably, the side of the organic barrier away from the substrate has a halogen-containing group.

[0015] Preferably, the display panel further comprises a pixel definition layer located between the substrate and the light-emitting device layer, and the organic barrier layer is disposed on the same layer as the pixel definition layer; or,

[0016] The display panel further includes a planarization layer located between the substrate and the light-emitting device layer, and the organic barrier layer is disposed on the same layer as the planarization layer.

[0017] Preferably, the encapsulation layer further comprises an organic encapsulation layer located on the first inorganic encapsulation layer and a second inorganic encapsulation layer located on the organic encapsulation layer;

[0018] The second inorganic encapsulation layer includes a third sublayer located on the organic encapsulation layer and a fourth sublayer located on the third sublayer, and the orthographic projection of the fourth sublayer on the substrate is located within the orthographic projection of the third sublayer on the substrate.

[0019] Preferably, the distance from the side of the organic barrier portion away from the substrate to the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer away from the substrate to the substrate, and the distance from the side of the organic barrier portion away from the substrate to the substrate is greater than or equal to the distance from the side of the first sublayer away from the substrate to the substrate.

[0020] Preferably, the material of the first sublayer includes at least one of silicon oxide, silicon oxynitride or silicon nitride, and the material of the second sublayer includes titanium dioxide.

[0021] The present invention also provides a method for manufacturing a display panel, comprising:

[0022] forming an organic barrier layer on a substrate, wherein the organic barrier layer comprises an organic barrier portion disposed around a display area;

[0023] forming a light-emitting device layer on the substrate, wherein the light-emitting device layer includes a plurality of light-emitting devices located in the display area;

[0024] forming a first sub-layer on the light-emitting device layer through a first predetermined process;

[0025] forming a second sub-layer on the first sub-layer through a second predetermined process;

[0026] The first predetermined process is different from the second predetermined process, in that, in the top-view direction of the light-emitting device layer, the first sublayer and the second sublayer cover the light-emitting device, the first sublayer is located in the second sublayer, and the boundary of the first sublayer is located outside the display area and on the side of the organic barrier portion close to the display area.

[0027] Preferably, after the step of forming the second sub-layer on the first sub-layer by a second predetermined process, the method further comprises:

[0028] The organic barrier is removed.

[0029] The present invention prevents the second sublayer from being formed in an unexpected encapsulation film-forming area by making the orthographic projection of the second sublayer in the first inorganic encapsulation layer on the substrate within the orthographic projection of the first sublayer on the substrate, thereby improving the product quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 is a schematic diagram of a first structure of a display panel provided by an embodiment of the present invention;

[0032] Figure 2 is a schematic diagram of a second structure of a display panel provided by an embodiment of the present invention;

[0033] Figure 3 is a flowchart of the steps of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0034] Figure 4a to Figure 4d It is a schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0036] At present, when the inorganic thin film used to block water / oxygen intrusion in the display panel is formed by a combination of atomic layer deposition and plasma vapor deposition, there is a problem that the inorganic packaging film layer is formed in the unintended packaging film-forming area, affecting the product quality.

[0037] See also Figure 1-2 The embodiment of the present invention provides a display panel 100, including a display area DA, and the display panel 100 includes:

[0038] Substrate 101;

[0039] A light emitting device layer 102, located on the substrate 101 and comprising a plurality of light emitting devices 103, wherein the light emitting devices 103 are located in the display area DA;

[0040] The encapsulation layer 104 is located on the light emitting device layer 102 . In the top view direction of the display panel 100 , the encapsulation layer 104 covers the light emitting device 103 .

[0041] The encapsulation layer 104 includes a first inorganic encapsulation layer 105 , which includes a first sublayer 106 and a second sublayer 107 located on the first sublayer 106 , and the orthographic projection of the second sublayer 107 on the substrate 101 is located within the orthographic projection of the first sublayer 106 on the substrate 101 .

[0042] The present invention prevents the second sublayer from being formed in an unexpected encapsulation film-forming area by making the orthographic projection of the second sublayer in the first inorganic encapsulation layer on the substrate within the orthographic projection of the first sublayer on the substrate, thereby improving the product quality of the display panel.

[0043] The technical solution of the present invention is now described in conjunction with specific embodiments.

[0044] See also Figure 1 as well as Figure 2In this embodiment, when the orthographic projection of the second sub-layer 107 on the substrate 101 is located within the orthographic projection of the first sub-layer 106 on the substrate 101, the area of ​​the orthographic projection of the second sub-layer 107 on the substrate 101 is less than or equal to the area of ​​the orthographic projection of the first sub-layer 106 on the substrate 101; that is, in the top view direction of the display panel 100, the boundary of the second sub-layer 107 does not exceed the boundary of the first sub-layer 106.

[0045] The water and oxygen barrier capability of the second sublayer 107 is stronger than that of the first sublayer 106 . By disposing the second sublayer 107 with stronger water and oxygen barrier capability on the first sublayer 106 , it is beneficial to improve the encapsulation performance of the first inorganic encapsulation layer 105 .

[0046] The formation speed of the first sub-layer 106 is faster than the formation speed of the second sub-layer 107. The ratio of the thickness of the first sub-layer 106 to the thickness of the second sub-layer 107 can be 80:1 to 10:1, which ensures that the second sub-layer 107 is sufficient to enhance the ability of the first inorganic encapsulation layer 105 to block water and oxygen while avoiding the process time of the second sub-layer 107 being too long, thereby causing excessively high process costs.

[0047] Specifically, the thickness of the first sub-layer 106 can be 500 nanometers to 800 nanometers, which is conducive to achieving the expected water and oxygen blocking effect of the first sub-layer 106 within a suitable thickness range, while ensuring that the water and oxygen blocking ability of the first sub-layer 106 meets the expectations while reducing the process cost; the thickness of the second sub-layer 107 can be 10 nanometers to 50 nanometers, which is conducive to improving the overall water and oxygen blocking ability of the first inorganic encapsulation layer 105 while not affecting the production efficiency of the display panel 100 due to the long process time of the second sub-layer 107.

[0048] The material of the first sub-layer 106 may include at least one of silicon oxide, silicon oxynitride or silicon nitride, and the material of the second sub-layer 107 may include titanium dioxide.

[0049] See also Figure 1 as well as Figure 2 In some embodiments, the display panel 100 further includes an organic barrier layer 108 located on the substrate 101 , and the organic barrier layer 108 includes an organic barrier portion 109 disposed around the display area DA.

[0050] In the top view of the display panel 100 , the boundary of the first inorganic encapsulation layer 105 is located outside the display area DA and on a side of the organic barrier 109 close to the display area DA.

[0051] The organic barrier portion 109 includes a first side 112 away from the display area DA and a second side 113 close to the display area DA. The distance between the first side 112 and the second side 113 is preferably 200 microns to 2000 microns. The width of the organic barrier portion 109 will not be too wide to affect the overall design of the display panel, nor will the organic barrier portion 109 be too narrow to cause the first inorganic encapsulation layer 105 to cross the organic barrier portion 109 during the manufacturing process and be formed in an unintended encapsulation film-forming area, thereby affecting the product quality of the display panel 100.

[0052] In some embodiments, in a top-view direction of the display panel 100 , a distance between a boundary of the first inorganic encapsulation layer 105 and the first side 112 is greater than 0.

[0053] The first inorganic encapsulation layer 105 is located on the second side 113 close to the display area DA. Alternatively, the boundary of the first inorganic encapsulation layer 105 is located between the first side 112 and the second side 113, and the distance between the boundary of the first inorganic encapsulation layer 105 and the first side 112 is greater than 0.

[0054] When the first inorganic encapsulation layer 105 is located on the side of the second side 113 close to the display area DA, in the top view direction of the display panel 100, the boundary of the first sub-layer 106 is located outside the display area DA and the boundary of the first sub-layer 106 does not cross the second side 113; similarly, in the top view direction of the display panel 100, the boundary of the second sub-layer 107 is located outside the display area DA and the boundary of the second sub-layer 107 does not cross the second side 113. At this time, the first sub-layer 106 may be in contact with the second side 113 of the organic barrier 109, and the second sub-layer 107 may be in contact with the second side 113; or, the first sub-layer 106 and the second side 113 have a first spacing, and the second sub-layer 107 and the second side 113 have a second spacing; or, the first sub-layer 106 and the second side 113 are in contact, and the second sub-layer 107 and the second side 113 have the second spacing.

[0055] When the boundary of the first inorganic encapsulation layer 105 is located between the first side 112 and the second side 113, and the distance between the boundary of the first inorganic encapsulation layer 105 and the first side 112 is greater than 0, in the top-view direction of the display panel 100, the boundary of the first sublayer 106 may be located between the first side 112 and the second side 113 and the distance between the boundary of the first sublayer 106 and the first side 112 is greater than 0, and the boundary of the second sublayer 107 may be located between the first side 112 and the second side 113 and the distance between the boundary of the second sublayer 107 and the first side 112 is greater than 0; or, the boundary of the first sublayer 106 may be located between the first side 112 and the second side 113 and the distance between the boundary of the first sublayer 106 and the first side 112 is greater than 0, and the boundary of the second sublayer 107 is located on the side of the second side 113 close to the display area DA. At this time, the organic barrier 109 further includes a third side connecting the first side 112 and the second side 113 , the third side is located on a side of the organic barrier 109 away from the substrate 101 , and the first sublayer 106 is in contact with the second side 113 and the third side.

[0056] In some embodiments, the display panel 100 further includes a pixel definition layer located between the substrate 101 and the light-emitting device layer 102 , and the organic barrier layer 108 is disposed on the same layer as the pixel definition layer.

[0057] Alternatively, the display panel 100 further includes a planarization layer located between the substrate 101 and the light-emitting device layer 102 , the organic barrier layer 108 is disposed on the same layer as the planarization layer, and the planarization layer is located between the pixel definition layer and the substrate 101 .

[0058] Alternatively, the organic barrier layer 108 may be independently formed on the substrate 101 , for example, the organic barrier layer 108 may be formed on the planarization layer, or the organic barrier layer 108 may be formed on the pixel definition layer.

[0059] The materials of the pixel definition layer, the planarization layer and the organic barrier layer 108 are all organic materials. By arranging the organic barrier layer 108 and the pixel definition layer in the same layer, it is beneficial for the organic barrier layer 108 and the pixel definition layer to be formed in the same process using the same material, thereby saving process costs. Similarly, arranging the organic barrier layer 108 and the planarization layer in the same layer is beneficial for the organic barrier layer 108 and the planarization layer to be formed in the same process using the same material, thereby saving process costs.

[0060] The organic blocking portion 109 may include a first sub-blocking portion and a second sub-blocking portion located on the first sub-blocking portion. The first sub-blocking portion may be disposed on the same layer as the planarization layer, and the second sub-blocking portion may be disposed on the same layer as the pixel definition layer. This is beneficial for the first sub-blocking portion and the second sub-blocking portion to be formed in the same process flow and using the same material as the pixel definition layer and the planarization layer, respectively, thereby saving process costs.

[0061] In some embodiments, the display area DA may be the area where the display panel 100 emits light when the display panel 100 is displayed, and the distance between the second side 113 and the display area DA may be 1 mm to 4 mm, which can ensure the encapsulation effect of the encapsulation layer 104 on the display area DA, while also preventing the organic barrier part 109 from being too far away from the display area DA to affect the arrangement of other structures of the display panel 100.

[0062] See also Figure 2 In some embodiments, the encapsulation layer 104 further includes an organic encapsulation layer 110 located on the first inorganic encapsulation layer 105 and a second inorganic encapsulation layer 111 located on the organic encapsulation layer 110. The arrangement of the first inorganic encapsulation layer-the organic encapsulation layer-the second inorganic encapsulation layer is conducive to further improving the encapsulation capability of the encapsulation layer 104 for the light-emitting device 103 in the display area DA, thereby improving the product quality of the display panel 100.

[0063] The second inorganic encapsulation layer 111 includes a third sublayer located on the organic encapsulation layer 110 and a fourth sublayer located on the third sublayer. The orthographic projection of the fourth sublayer on the substrate 101 is located within the orthographic projection of the third sublayer on the substrate 101 .

[0064] Similar to the first sublayer 106 and the second sublayer 107, when the orthographic projection of the fourth sublayer on the substrate 101 is within the orthographic projection of the third sublayer on the substrate 101, the area of ​​the orthographic projection of the fourth sublayer on the substrate 101 is less than or equal to the area of ​​the orthographic projection of the third sublayer on the substrate 101; that is, in the top view direction of the display panel 100, the boundary of the fourth sublayer does not exceed the boundary of the third sublayer. The water and oxygen blocking capability of the fourth sublayer is stronger than that of the third sublayer, and by disposing the fourth sublayer with stronger water and oxygen blocking capability on the third sublayer, it is beneficial to improve the encapsulation performance of the second inorganic encapsulation layer 111.

[0065] The thickness of the organic encapsulation layer 110 can be 4 microns to 12 microns, and the thickness of the second inorganic encapsulation layer 111 can be 0.5 microns to 1.5 microns, which is conducive to achieving the expected water and oxygen blocking effect of the organic encapsulation layer 110 and the second inorganic encapsulation layer 111 within a suitable thickness range, while ensuring that the water and oxygen blocking capabilities of the organic encapsulation layer 110 and the second inorganic encapsulation layer 111 meet the expectations while reducing the process cost.

[0066] When the second inorganic encapsulation layer 111 includes the third sublayer and the fourth sublayer, the formation speed of the third sublayer is faster than that of the fourth sublayer, and the ratio of the thickness of the third sublayer to the thickness of the fourth sublayer can be 80:1 to 10:1, while ensuring that the fourth sublayer is sufficient to enhance the ability of the second inorganic encapsulation layer 111 to block water and oxygen, while avoiding the process time of the fourth sublayer being too long, which results in excessively high process costs.

[0067] In some embodiments, the distance between the side of the organic barrier 109 away from the substrate 101 and the substrate 101 is not greater than the distance between the side of the encapsulation layer 104 away from the substrate 101 and the substrate 101 .

[0068] Specifically, the distance from the side of the organic barrier 109 away from the substrate 101 to the substrate 101 is greater than or equal to the distance from the side of the first sub-layer 106 away from the substrate 101 to the substrate 101. When the encapsulation layer 104 includes the first inorganic encapsulation layer 105, the distance from the side of the organic barrier 109 away from the substrate 101 to the substrate 101 may be less than or equal to the distance from the side of the second sub-layer 107 away from the substrate 101 to the substrate 101. When the encapsulation layer 104 further includes the organic encapsulation layer 110 and the second inorganic encapsulation layer 111, the distance from the side of the organic barrier 109 away from the substrate 101 to the substrate 101 is less than or equal to the distance from the side of the second inorganic encapsulation layer 111 away from the substrate 101 to the substrate 101. By ensuring that the distance from the side of the organic barrier 109 away from the substrate 101 to the substrate 101 does not exceed the distance from the side of the encapsulation layer 104 away from the substrate 101 to the substrate 101, it is helpful to avoid the presence of the organic barrier 109 affecting the arrangement of other structures on the display panel 100 and affecting the flatness of the display panel 100.

[0069] The distance between the side of the organic barrier 109 away from the substrate 101 and the substrate 101 is preferably 0.5 microns to 5 microns, which can not only realize the blocking effect of the organic barrier 109 on the second sub-layer 107 or the fourth sub-layer in the process of the first inorganic encapsulation layer 105 or the process of the second inorganic encapsulation layer 111, but also avoid the organic barrier 109 being too thick to affect the arrangement of other structures on the display panel 100 and the flatness of the display panel 100.

[0070] The orthographic projection of the organic barrier 109 on a first plane perpendicular to the substrate 101 may be a square or a rectangle, and the first side 112 and the second side 113 are perpendicular to the first plane.

[0071] In some embodiments, the side of the organic barrier 109 away from the substrate 101 has a halogen-containing group. The halogen-containing group includes one or more of -Cl, -F, -CF3, etc. The side of the organic barrier 109 away from the substrate 101 has a halogen-containing group, which is beneficial to avoid the organic barrier 109 from adsorbing the precursor material for forming the second sub-layer 107 during the process of forming the second sub-layer 107, and prevent the second sub-layer 107 from being formed in an unintended encapsulation thin film forming area.

[0072] The display panel 100 also includes an organic film layer located on the substrate 101, and in the top view direction of the display panel 100, the organic film layer covers the display panel 100. The organic film layer may include the pixel definition layer, the planarization layer, etc. In the top view direction of the display panel 100, the organic film layer includes a first portion covered by the first sublayer 106 and a second portion not covered by the first inorganic encapsulation layer 105. The side of the second portion away from the substrate 101 also has a halogen-containing group. The type of the halogen-containing group on the side of the second portion away from the substrate 101 may be consistent with the type of the halogen-containing group on the side of the organic barrier 109 away from the substrate 101. For example, when the halogen-containing group on the side of the organic barrier 109 away from the substrate 101 is -Cl, the halogen-containing group on the side of the second portion away from the substrate 101 is also -Cl. The second portion having a halogen-containing group on the side away from the substrate 101 can help avoid the second portion from adsorbing the precursor material for forming the second sublayer 107 during the manufacturing process of the second sublayer 107, thereby preventing the second sublayer 107 from being formed in an unintended packaging thin film forming area.

[0073] In some embodiments, the light-emitting device 103 may include an OLED (Organic Light-Emitting Diode) material, or may include a Micro LED or a Mini LED, which is not specifically limited herein. When the light-emitting device 103 includes an OLED material, the light-emitting device layer 102 may include an anode layer located on the planarization layer, a light-emitting material layer located on the anode layer, and a cathode layer located on the light-emitting material layer. The pixel definition layer includes a pixel opening and a pixel definition portion surrounding the pixel opening, and the anode layer is correspondingly arranged in the pixel opening. The display panel 100 also includes a polarizing layer located on the encapsulation layer 104, a flexible cover plate located on the polarizing layer, and the display panel 100 also includes a corresponding bonding layer located between the polarizing layer and the flexible cover plate.

[0074] In the embodiment of the present invention, the orthographic projection of the second sub-layer 107 in the first inorganic encapsulation layer 105 on the substrate 101 is located within the orthographic projection of the first sub-layer 106 on the substrate 101, thereby avoiding the second sub-layer 107 from being formed in an unintended encapsulation film-forming area, thereby improving the product quality of the display panel 100.

[0075] See also Figure 1 to Figure 3 as well as Figure 4a to Figure 4d The embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0076] S100 , forming an organic barrier layer 108 on the substrate 101 , wherein the organic barrier layer 108 includes an organic barrier portion 109 disposed around the display area DA.

[0077] In some embodiments, step S100 includes:

[0078] S110 , forming an organic layer on the substrate 101 .

[0079] S120 , the organic layer is subjected to a first patterning process to form the organic barrier layer 108 .

[0080] S200 , forming a light emitting device layer 102 on the substrate 101 , wherein the light emitting device layer 102 includes a plurality of light emitting devices 103 located in the display area DA.

[0081] S300 , forming a first sub-layer 106 on the light-emitting device layer 102 through a first predetermined process.

[0082] The first predetermined process may include plasma enhanced chemical vapor deposition, the material of the first sub-layer 106 may include at least one of silicon oxide, silicon oxynitride or silicon nitride, and the thickness of the first sub-layer 106 may be 500 nanometers to 800 nanometers.

[0083] S400 , forming a second sub-layer 107 on the first sub-layer 106 through a second predetermined process.

[0084] The second predetermined process is different from the first predetermined process, and the second predetermined process may include atomic layer deposition. In the top view of the light-emitting device layer 102, the first sublayer 106 and the second sublayer 107 cover the light-emitting device 103, the first sublayer 106 is located in the second sublayer 107, and the boundary of the first sublayer 106 is located outside the display area DA and on the side of the organic barrier 109 close to the display area DA.

[0085] In some embodiments, step S400 includes:

[0086] S410, performing halogen treatment on the surface of the display panel to be processed.

[0087] In some embodiments, the surface of the display panel to be processed is subjected to a first plasma treatment, so that the organic film layer of the display panel to be processed and the portion of the organic barrier 109 not covered by the first sub-layer 106 are halogenated on the side away from the substrate 101. That is, the surface of the organic film layer covering the substrate 101 and the organic barrier 109 exposed to the first sub-layer 106 are halogenated. The first plasma includes a plasma of Cl2 and / or CF4. At this time, since the organic matter has hydroxyl groups, it provides sites for halogenation and has high reaction activity, and the exposed surface of the organic film layer and the organic barrier 109 is halogenated; and since the first sub-layer 106 is an inorganic material, it cannot provide enough sites for halogenation and has low reaction activity, so the surface of the display panel to be processed undergoes regional selective halogenation.

[0088] During the halogenation treatment, the halogenation temperature can be between 80 degrees Celsius and 120 degrees Celsius, preferably 100 degrees Celsius; the pressure required for the halogenation treatment can be between 1.0 Torr and 2.0 Torr; in the first plasma, the plasma concentration of Cl2 and / or CF4 is greater than or equal to 99%, which is beneficial to improving the halogenation efficiency.

[0089] S420 , forming a first precursor layer on the first sub-layer 106 .

[0090] In some embodiments, the material of the first precursor layer may be TiCl 4 , and the first precursor layer is formed by performing a first gas treatment on the surface of the display panel to be processed.

[0091] When forming the first precursor layer on the first sublayer 106, the temperature required for the reaction can be between 80 degrees Celsius and 120 degrees Celsius, preferably 100 degrees Celsius; the pressure required for the reaction can be between 1.0 Torr and 2.0 Torr; the first gas includes TiCl4, and the concentration of TiCl4 is greater than or equal to 99%, and the other gases in the first gas except TiCl4 are inert gases, such as nitrogen, which is beneficial to improving the formation efficiency of the first precursor layer.

[0092] Since the surface of the organic film layer covering the substrate 101 and the organic barrier 109 exposed on the first sub-layer 106 is halogenated and cannot absorb the material of the first precursor layer, the first precursor layer is selectively formed on the first sub-layer 106 .

[0093] S430: The first precursor layer forms a first atomic layer.

[0094] In some embodiments, the first precursor layer is treated with a second gas to form a first atomic layer, and the first atomic layer is an atomic layer of titanium oxide; the second gas may include water vapor and an inert gas, such as nitrogen, etc. The temperature of the reaction in step S430 may be 80 degrees Celsius to 120 degrees Celsius, preferably 100 degrees Celsius; the pressure required for the reaction may be 1.0 Torr to 2.0 Torr, which is conducive to improving the formation efficiency of the first atomic layer.

[0095] S440 , repeating step S410 to step S430 until the thickness of the first atomic layer accumulates to a first target thickness to form the second sub-layer 107 .

[0096] In some embodiments, the first target thickness is the thickness of the second sub-layer 107, which may be 10 nanometers to 50 nanometers. At this time, the number of cycles from step S410 to step S430 is preferably 100 to 500 cycles.

[0097] In some embodiments, after step S400, the following steps are further included:

[0098] S500 , forming an organic encapsulation layer 110 on the second sub-layer 107 .

[0099] S600 , forming a second inorganic encapsulation layer 111 on the organic encapsulation layer 110 .

[0100] In some embodiments, step S600 further includes:

[0101] S610 , forming a third sub-layer on the organic encapsulation layer 110 .

[0102] S620 , forming a fourth sub-layer on the third sub-layer.

[0103] The formation step of the third sub-layer may be similar to the formation step of the first sub-layer 106 , and the formation step of the fourth sub-layer may be similar to the formation step of the second sub-layer 107 .

[0104] In some embodiments, after step S400, the method further includes:

[0105] S700 , removing the organic barrier 109 .

[0106] In some embodiments, since the presence of the organic barrier portion 109 will affect other structures of the display panel, such as causing a significant impact on the design of the packaging frame, the organic barrier portion 109 will be removed after the second sub-layer 107 or the fourth sub-layer is formed to avoid the organic barrier portion 109 affecting the product quality of the display panel.

[0107] The method for manufacturing a display panel provided in an embodiment of the present invention can be used to manufacture the display panel as described above. The organic barrier layer 108, the light-emitting device layer 102, the first sublayer 106, the second sublayer 107, the organic encapsulation layer 110 and the second inorganic encapsulation layer 111 involved in the method for manufacturing the display panel have been described in detail in the previous text and will not be repeated here.

[0108] The method for manufacturing a display panel provided in an embodiment of the present invention avoids the formation of the second sublayer 107 in an unintended packaging film-forming area by making the orthographic projection of the second sublayer 107 in the first inorganic packaging layer 105 on the substrate 101 be located within the orthographic projection of the first sublayer 106 on the substrate 101, thereby improving the product quality of the display panel.

[0109] The embodiment of the present invention discloses a display panel and a manufacturing method thereof, wherein the display panel has a display area and includes: a substrate; a light-emitting device layer located on the substrate and including a plurality of light-emitting devices, wherein the light-emitting devices are located in the display area; an encapsulation layer located on the light-emitting device layer, wherein the encapsulation layer covers the light-emitting devices in the top-view direction of the display panel; wherein the encapsulation layer includes a first inorganic encapsulation layer, wherein the first inorganic encapsulation layer includes a first sublayer and a second sublayer located on the first sublayer, wherein the orthographic projection of the second sublayer on the substrate is located within the orthographic projection of the first sublayer on the substrate. The present invention avoids the formation of the second sublayer in the first inorganic encapsulation layer on the substrate from being in an unintended encapsulation film-forming area, thereby improving the product quality of the display panel.

[0110] The above is a detailed introduction to a display panel and a manufacturing method thereof provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A display panel, characterized in that: Comprising a display area, the display panel comprises: substrate; a light emitting device layer, located on the substrate and comprising a plurality of light emitting devices, wherein the light emitting devices are located in the display area; an encapsulation layer, located on the light-emitting device layer, wherein the encapsulation layer covers the light-emitting devices in a top-view direction of the display panel; Among them, the encapsulation layer includes a first inorganic encapsulation layer, the first inorganic encapsulation layer includes a first sublayer and a second sublayer located on the first sublayer, and the orthographic projection of the second sublayer on the substrate is located within the orthographic projection of the first sublayer on the substrate; the display panel also includes an organic barrier layer located on the substrate, the organic barrier layer includes an organic barrier part arranged around the display area, and the side of the organic barrier part away from the substrate has a halogen-containing group.

2. The display panel according to claim 1, characterized in that: In a top-view direction of the display panel, a boundary of the first inorganic encapsulation layer is located outside the display area and on a side of the organic barrier portion close to the display area.

3. The display panel according to claim 2, characterized in that: The organic barrier comprises a first side away from the display area and a second side close to the display area; Wherein, in a top-view direction of the display panel, the first inorganic encapsulation layer is located on a side of the second side close to the display area.

4. The display panel according to claim 2, characterized in that: The display panel further comprises a pixel definition layer located between the substrate and the light emitting device layer, and the organic barrier layer is disposed on the same layer as the pixel definition layer; or The display panel further includes a planarization layer located between the substrate and the light-emitting device layer, and the organic barrier layer is disposed on the same layer as the planarization layer.

5. The display panel according to claim 1, characterized in that: The encapsulation layer further comprises an organic encapsulation layer located on the first inorganic encapsulation layer and a second inorganic encapsulation layer located on the organic encapsulation layer; The second inorganic encapsulation layer includes a third sublayer located on the organic encapsulation layer and a fourth sublayer located on the third sublayer, and the orthographic projection of the fourth sublayer on the substrate is located within the orthographic projection of the third sublayer on the substrate.

6. The display panel according to claim 5, characterized in that: The distance from the side of the organic barrier away from the substrate to the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer away from the substrate to the substrate, and the distance from the side of the organic barrier away from the substrate to the substrate is greater than or equal to the distance from the side of the first sublayer away from the substrate to the substrate.

7. The display panel according to claim 1, characterized in that: The material of the first sub-layer includes at least one of silicon oxide, silicon oxynitride or silicon nitride, and the material of the second sub-layer includes titanium dioxide.

8. A method for manufacturing a display panel, characterized in that: include: forming an organic barrier layer on a substrate, wherein the organic barrier layer comprises an organic barrier portion disposed around a display area; forming a light-emitting device layer on the substrate, wherein the light-emitting device layer includes a plurality of light-emitting devices located in the display area; forming a first sub-layer on the light-emitting device layer through a first predetermined process; forming a second sub-layer on the first sub-layer through a second predetermined process; The first predetermined process is different from the second predetermined process, in the top view direction of the light-emitting device layer, the first sublayer and the second sublayer cover the light-emitting device, the first sublayer is located in the second sublayer, and the boundary of the first sublayer is located outside the display area and on a side of the organic barrier portion close to the display area; The forming of the second sub-layer on the first sub-layer by a second predetermined process comprises the following steps: S410, performing halogen treatment on the surface of the display panel to be processed; S420, forming a first precursor layer on the first sub-layer; S430, the first precursor layer forms a first atomic layer; repeating steps S410 to S430 until the thickness of the first atomic layer accumulates to a first target thickness to form the second sub-layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that: After the step of forming the second sub-layer on the first sub-layer by a second predetermined process, the method further includes: The organic barrier is removed.

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