A piezoelectric ceramic sheet sticking tool and process applied to a tuning fork liquid level switch

Abstract

This invention discloses a piezoelectric ceramic sheet bonding fixture and process for use in tuning fork level switches, belonging to the technical field of tuning fork level switches. It includes a main fixing base plate, an insulating sheet fixing base plate, a piezoelectric ceramic sheet positioning plate, a pressure post positioning plate, a pressure post fixing plate, and a pressure post top plate. The insulating sheet fixing base plate is disposed on the main fixing base plate and has several insulating sheet fixing holes. The piezoelectric ceramic sheet positioning plate has several piezoelectric ceramic sheet positioning holes. The pressure post positioning plate is disposed on the main fixing base plate and has several pressure post positioning holes for the pressure post to pass through. The pressure post fixing plate is disposed above the pressure post positioning plate and has several pressure post through holes. The pressure post top plate is disposed above the pressure post fixing plate and has pressure post through holes for the pressure rod to pass through. This invention standardizes the thickness of the adhesive, the curing pressure, and the position of the piezoelectric ceramic sheet during the production process, saving significant production time and reducing the scrap rate.

Description

Technical Field

[0001] This invention belongs to the field of tuning fork level switch technology, specifically relating to a piezoelectric ceramic sheet bonding fixture and process for use in tuning fork level switches. Background Technology

[0002] Tuning fork level switches are a type of vibration level switch. Based on the vibration principle of a cantilever beam, they use two symmetrical forks as sensor components. Piezoelectric ceramics drive the forks to vibrate, enabling the detection of material height inside an invisible container. When the forks come into contact with the liquid being measured, the vibration frequency and amplitude of the sensor components decrease significantly. This change in the sensor components is directly reflected in the output signal of the piezoelectric ceramics. The detection circuit uses this change in output signal to determine the level and output a switching signal.

[0003] Tuning fork level switches are specifically designed for measuring and detecting liquid levels in containers, storage tanks, vessel tanks, and various pipelines. They are widely used in industries such as petrochemicals, water conservancy, chemicals, environmental protection, food, and pharmaceuticals. Tuning fork level switches serve as high / low fault safety limit switches in daily production processes, providing overflow or dry-run protection. They control the pump or system status based on the actual liquid level, therefore, high quality is required in the application environment.

[0004] Currently, the existing methods for fixing piezoelectric ceramics in tuning fork level switches can be roughly divided into two types: adhesive bonding and stacking. (1) Stacking generally involves adding an electrode plate in the middle of multiple piezoelectric ceramic plates and then welding the wire to the electrode plate to achieve the conduction of the piezoelectric ceramic plate; (2) Adhesive bonding is mostly achieved by directly welding the wire to the electrode of the piezoelectric ceramic plate to achieve the conduction of the piezoelectric ceramic plate.

[0005] In the production of tuning fork level switches, we currently use adhesive-bonded piezoelectric ceramic sheets. The manufacturing process has strict requirements on the thickness of the epoxy resin adhesive, the position of the piezoelectric ceramic sheet, and the temperature and pressure during curing. If production is done manually based on experience, human error is inevitable at each step, leading to waste of raw materials. Furthermore, if an error in a single step goes undetected, it can cause unpredictable malfunctions in the finished product. Therefore, this invention uses a standardized production process and tooling, regulating the thickness of the adhesive, the curing pressure, and the position of the ceramic sheet. This saves significant production time and reduces the scrap rate.

[0006] In the previous production process of bonding piezoelectric ceramic sheets, due to the lack of standardized production procedures and tooling, only single-sheet production was possible. Clamps were used to fix the ceramic sheet and alumina insulating sheet, which frequently resulted in misalignment. The center of the piezoelectric ceramic sheet could not be guaranteed to coincide with the center of the alumina insulating sheet, leading to substandard product performance. Furthermore, during high-temperature curing, epoxy resin would flow onto the clamps, rendering the entire set of raw materials unusable. The lack of tooling also resulted in inconsistent epoxy resin thickness, leading to poor consistency and unstable performance in the produced tuning fork sensor components. Summary of the Invention

[0007] To address the aforementioned technical problems in the existing technology, this invention proposes a piezoelectric ceramic sheet bonding fixture and process for use in tuning fork level switches. The design is reasonable, solves the shortcomings of the existing technology, and has good results.

[0008] To achieve the above objective 1, the present invention adopts the following technical solution:

[0009] A piezoelectric ceramic sheet bonding fixture for use in tuning fork level switches includes a main fixing base plate, an insulating sheet fixing base plate, a piezoelectric ceramic sheet position plate, a pressure column position plate, a pressure column fixing plate, and a pressure column top plate.

[0010] An insulating sheet fixing base plate is set on the main fixing base plate and has several insulating sheet fixing holes for fixing the position of the insulating sheet; a piezoelectric ceramic sheet positioning plate has several piezoelectric ceramic sheet positioning holes for fixing the position of the piezoelectric ceramic sheet so that the piezoelectric ceramic sheet is placed exactly on the insulating sheet; a pressure column positioning plate is set on the main fixing base plate and has several pressure column positioning holes for the pressure column to pass through so that the pressure column is placed on the insulating sheet; a pressure column fixing plate is set above the pressure column positioning plate and has several pressure column through holes with a diameter smaller than the pressure column for applying pressure to the pressure column; a pressure column top plate is set above the pressure column fixing plate and has pressure rod through holes for the pressure rod to pass through, the pressure rod is inserted into the pressure rod through holes, and a spring is sleeved at the lower end.

[0011] Furthermore, a fixing post is provided at each of the four corners of the top surface of the main fixing base plate, and two first fixing protrusions are provided on the transverse center line of the main fixing base plate.

[0012] Furthermore, the insulating sheet fixing base plate has two second fixing protrusions and two fixing holes corresponding to the first fixing protrusions on the transverse center line, and a rectangular groove is provided on the top surface.

[0013] Furthermore, a fixing hole corresponding to the second fixing protrusion is provided on the transverse center line of the piezoelectric ceramic sheet positioning plate. The piezoelectric ceramic sheet positioning hole is set in correspondence with the insulating sheet fixing hole, and four positioning protrusions are evenly provided on its inner wall along the circumferential direction. When the piezoelectric ceramic sheet positioning plate is set on the insulating sheet fixing base plate, the center of the piezoelectric ceramic sheet positioning hole coincides with the center of the insulating sheet fixing hole.

[0014] Furthermore, the pressure column position plate has a fixing hole on the transverse center line that corresponds to the second fixing protrusion, and the pressure column position hole is set in correspondence with the insulating sheet fixing hole.

[0015] Furthermore, the four corners of the pressure post fixing plate are respectively provided with fixing holes corresponding to the four fixing posts, and the pressure post through holes are set in accordance with the fixing holes of the insulating sheet.

[0016] Furthermore, the pressure plate has fixing holes at its four corners corresponding to the four fixing posts, and the pressure rod through holes are set to correspond to the fixing holes of the insulating sheet. The bottom end of the pressure rod has a pressing part of the same size as the piezoelectric ceramic sheet. The pressing part passes through the pressure post through hole and the pressure post position hole and is placed on the piezoelectric ceramic sheet.

[0017] Furthermore, the pressure column is used to fix the FPC flexible plate and the piezoelectric ceramic sheet. It has a cylindrical structure with openings at both the top and bottom. Its inner wall is provided with protrusions that engage with the piezoelectric ceramic sheet to fix the orientation of the piezoelectric ceramic sheet.

[0018] The FPC flexible board has lines running through both ends, with one end welded to the electrode of the piezoelectric ceramic sheet and the other end welded to the drive circuit.

[0019] Furthermore, the centers of the insulating sheet fixing hole, the pressure post position hole, the pressure post through hole, and the pressure rod through hole coincide.

[0020] To achieve the above objective 2, the present invention adopts the following technical solution:

[0021] A piezoelectric ceramic sheet bonding process for use in tuning fork level switches, employing a piezoelectric ceramic bonding fixture as described above, includes the following steps:

[0022] S1. Clean the surface of the insulating sheet and piezoelectric ceramic sheet with alcohol, and apply a thin layer of epoxy resin adhesive to the bottom of the piezoelectric ceramic sheet.

[0023] S2. Fix the insulating sheet fixing base plate onto the main fixing base plate, and then place the insulating sheet into the insulating sheet fixing hole;

[0024] S3. Place the piezoelectric ceramic positioning plate in the rectangular groove of the insulating sheet fixing base plate, place the piezoelectric ceramic sheet coated with epoxy resin into the piezoelectric ceramic sheet positioning hole, so that the center of the piezoelectric ceramic sheet coincides with the center of the insulating sheet, and remove the piezoelectric ceramic sheet positioning plate.

[0025] S4. Place the pressure column position plate in the rectangular groove of the insulating sheet fixing base plate, place the pressure column into the pressure column position hole, and adjust the direction so that the protrusion on the inner wall of the pressure column engages with the piezoelectric ceramic sheet.

[0026] S5. The pressure column fixing plate is placed on several pressure columns by fixing columns at the four corners of the main fixing base plate. The pressure column fixing plate applies a pressure of 0.2 to 5 N to each pressure column.

[0027] S6. Place the pressure column top plate above the pressure column fixing plate by fixing the columns at the four corners of the main fixing base plate. By placing a weight on the pressure column top plate, the pressing part of the pressure rod applies a pressure of 0.5 to 10 N to each piezoelectric ceramic sheet.

[0028] S7. After assembly, place the entire device in an oven and cure it at 100-250℃ for 0.5-3 hours. Allow it to cool naturally.

[0029] The beneficial technical effects brought about by this invention are as follows:

[0030] This invention uses a standardized production process and tooling, which standardizes the thickness of the adhesive, the pressure during curing, and the position of the piezoelectric ceramic sheet during production, thereby saving a significant amount of production time and reducing the scrap rate during production. Attached Figure Description

[0031] The present invention will be further described below with reference to the accompanying drawings:

[0032] Figure 1 This is a schematic diagram of the structure of a piezoelectric ceramic sheet bonding fixture according to the present invention;

[0033] Figure 2 This is a schematic diagram of the main fixed base plate in this invention;

[0034] Figure 3 This is a schematic diagram of the insulating sheet fixing plate in this invention;

[0035] Figure 4 This is a schematic diagram of the structure in this invention where the insulating sheet fixing plate is mounted on the main fixing base plate;

[0036] Figure 5 This is a schematic diagram of the piezoelectric ceramic sheet positioning plate in this invention;

[0037] Figure 6 This is a schematic diagram of the structure in which the piezoelectric ceramic sheet positioning plate is mounted on the main fixing base plate in this invention;

[0038] Figure 7 This is a schematic diagram of the structure of the pressure column position plate in this invention;

[0039] Figure 8 This is a schematic diagram of the structure in which the pressure column position plate is installed on the main fixed base plate in this invention;

[0040] Figure 9 This is a schematic diagram of the structure of the pressure column fixing plate in this invention;

[0041] Figure 10 This is a schematic diagram of the structure of the pressure column fixing plate installed on the main fixing base plate in this invention;

[0042] Figure 11 This is a schematic diagram of the structure of the pressure column, piezoelectric ceramic sheet, and insulating sheet in this invention;

[0043] Figure 12 This is a schematic diagram of the structure of the pressure column top plate in this invention;

[0044] Figure 13 This is a flowchart of the piezoelectric ceramic sheet bonding process in this invention;

[0045] Wherein, 1-Main fixing base plate; 2-Insulating sheet fixing base plate; 3-Piezoelectric ceramic sheet position plate; 4-Pressure column position plate; 5-Pressure column fixing plate; 6-Pressure column top plate; 7-Fixing column; 8-First fixing protrusion; 9-Insulating sheet; 10-Rectangular groove; 11-Insulating sheet fixing hole; 12-Second fixing protrusion; 13-Fixing hole; 14-Piezoelectric ceramic sheet; 15-Piezoelectric ceramic sheet position hole; 16-Positioning protrusion; 17-Pressure column; 18-Pressure column position hole; 19-Pressure column through hole; 20-Pressure rod; 21-Pressure rod through hole; 22-Pressing part; 23-Spring; Detailed Implementation

[0046] This invention proposes a piezoelectric ceramic sheet bonding fixture and process for use in tuning fork level switches. To make the advantages and technical solutions of this invention clearer and more explicit, the invention will be described in detail below with reference to specific embodiments.

[0047] A piezoelectric ceramic sheet bonding fixture for use in tuning fork level switches, such as Figure 1 As shown, it includes a main fixing base plate 1, an insulating sheet fixing base plate 2, a piezoelectric ceramic sheet position plate 3, a pressure column position plate 4, a pressure column fixing plate 5, and a pressure column top plate 6;

[0048] Specifically, such as Figure 2 As shown, a fixing post 7 is provided at each of the four corners of the top surface of the main fixing base plate 1, and two first fixing protrusions 8 are provided on its horizontal center line;

[0049] Specifically, such as Figure 3 As shown, the insulating sheet fixing plate 2 is used to fix the position of the insulating sheet 9. Its top surface has a rectangular groove 10, and the rectangular groove 10 has two rows of insulating sheet fixing holes 11, with five holes in each row. The insulating sheet 9 can fit perfectly into the insulating sheet fixing holes 11. Two second fixing protrusions 12 and two fixing holes 13 corresponding to the first fixing protrusions 8 are provided on the transverse center line of the rectangular groove 10. Figure 4 As shown, the insulating sheet fixing plate 2 is fixed to the main fixing base plate 1 by the first fixing protrusion 8 and the fixing hole 13.

[0050] Specifically, such as Figure 5 As shown, the piezoelectric ceramic sheet positioning plate 3 is used to fix the position of the piezoelectric ceramic sheet 14. It has a piezoelectric ceramic sheet positioning hole 15 corresponding to the insulating sheet fixing hole 11. The piezoelectric ceramic sheet 14 can be placed into the piezoelectric ceramic sheet positioning hole 15. The inner wall of the piezoelectric ceramic sheet positioning hole 15 is evenly provided with four positioning protrusions 16 along the circumferential direction. The positioning protrusions 16 contact the piezoelectric ceramic sheet 14, reducing the contact area with the piezoelectric ceramic sheet 14 and effectively preventing it from sticking to the piezoelectric ceramic sheet positioning plate 3 during production. The piezoelectric ceramic sheet positioning plate 3 has a fixing hole 13 corresponding to the second fixing protrusion 12 on the transverse center line. The piezoelectric ceramic sheet positioning plate 3 can be placed in the rectangular groove 10 of the insulating sheet fixing plate 2 and can be fixed in the rectangular groove 10 by the second fixing protrusion 12 and the fixing hole 13. At this time, the center of the piezoelectric ceramic sheet positioning hole 15 coincides with the center of the insulating sheet fixing hole 11. Figure 6 As shown.

[0051] Specifically, such as Figure 7 As shown, the pressure post positioning plate 4 has a pressure post positioning hole 18 corresponding to the insulating sheet fixing hole 11, through which the pressure post 17 passes. The pressure post positioning plate 4 has a fixing hole 13 corresponding to the second fixing protrusion 12 on its transverse center line. The pressure post positioning plate 4 can be placed in the rectangular groove of the insulating sheet fixing plate 11 and fixed in the rectangular groove 10 by the second fixing protrusion 12 and the fixing hole 13. The centers of the insulating sheet fixing hole 11 and the pressure post positioning hole 18 coincide. Figure 8 As shown;

[0052] Among them, the tuning fork level switch with adhesive is used. If the electrode surface of the piezoelectric ceramic sheet 14 does not have enough area, the solder joint will be weak and it will be easy to fall off when directly soldered with wires. Therefore, a flexible board made of FPC material is used to replace the function of wires. The pressure column 17 is used to fix the FPC flexible board and the piezoelectric ceramic sheet 14.

[0053] The pressure column 17 is a cylindrical structure with openings at both the top and bottom. Its inner wall has protrusions and the piezoelectric ceramic sheet has grooves. The protrusions and grooves are engaged to fix the orientation of the piezoelectric ceramic sheet 14.

[0054] The FPC flexible board has a line running through both the left and right ends. One end is welded to the electrode of the piezoelectric ceramic sheet 14, and the other end extends out of the pressure post 17 and is welded to the drive circuit.

[0055] Specifically, such as Figure 9As shown, the pressure post fixing plate 5 has pressure post through holes 19 corresponding to the insulating sheet fixing holes 11. The diameter of the pressure post through holes 19 is smaller than the diameter of the pressure post position holes 18. The four corners of the pressure post fixing plate 5 have fixing holes 13 corresponding to the four fixing posts 7. The plate is fixed above the pressure post position plate 4 by the fixing posts 7 and fixing holes 13. The center of the pressure post through holes 19 coincides with the center of the insulating sheet fixing holes 11. Figure 10 As shown; this plate is used to apply pressure to the pressure column 17, enabling the pressure column 17, the insulating sheet 9, and the piezoelectric ceramic sheet 14 to be cured together with epoxy resin, as shown. Figure 11 As shown.

[0056] Specifically, such as Figure 12 As shown, the pressure column top plate 6 is provided with a pressure rod through hole 21 corresponding to the insulating sheet fixing hole 11, through which the pressure rod 20 passes. The pressure rod 20 passes through the pressure rod through hole 21, and the bottom end of the pressure rod 20 is provided with a pressing part 22. A spring 23 is provided on the pressure rod 20 between the pressing part 22 and the pressure column top plate 6. The size of the pressing part 22 is the same as the size of the piezoelectric ceramic sheet 14. The pressing part 22 passes through the pressure column through hole 19 and the pressure column position hole 18 and then abuts against the piezoelectric ceramic sheet 14. The four corners of the pressure column top plate 6 are respectively provided with fixing holes 13 corresponding to the four fixing columns 7. The fixing is fixed above the pressure column position plate 4 through the fixing columns 7 and the fixing holes 13. This plate is used to apply pressure to the piezoelectric ceramic sheet 14 when it is cured, so that the piezoelectric ceramic sheet 14 and the insulating sheet 9 can be better bonded together. The design of the spring 23 on the pressure rod 20 makes the force on each piezoelectric ceramic sheet 14 more uniform.

[0057] In addition, some components of this device have strict requirements for the coefficient of thermal expansion, so some boards are made of fiberglass, while other parts are made of metal with better thermal conductivity.

[0058] A piezoelectric ceramic sheet bonding process for use in tuning fork level switches, employing the aforementioned piezoelectric ceramic bonding fixture for tuning fork level switches, such as... Figure 13 As shown, it includes the following steps:

[0059] S1. Clean the surfaces of the insulating sheet 9 and the piezoelectric ceramic sheet 14 with alcohol, and apply a thin layer of epoxy resin adhesive to the bottom of the piezoelectric ceramic sheet 14.

[0060] S2. Fix the insulating sheet fixing base plate 2 on the main fixing base plate 1, and then place the insulating sheet 9 in the insulating sheet fixing hole 11;

[0061] S3. Place the piezoelectric ceramic positioning plate 3 in the rectangular groove 10 of the insulating sheet fixing base plate 2, place the piezoelectric ceramic sheet 14 coated with epoxy resin into the piezoelectric ceramic sheet positioning hole 15, so that the center of the piezoelectric ceramic sheet 14 coincides with the center of the insulating sheet 9, and remove the piezoelectric ceramic sheet positioning plate 3.

[0062] S4. Place the pressure column position plate 4 in the rectangular groove 10 of the insulating sheet fixing base plate 2, place the pressure column 17 into the pressure column position hole 18, and adjust the direction so that the protrusion on the inner wall of the pressure column 17 engages with the piezoelectric ceramic sheet 14.

[0063] S5. The pressure column fixing plate 5 is placed on several pressure columns 17 by the fixing columns 7 at the four corners of the main fixing base plate 1. The pressure column fixing plate 5 applies a pressure of 0.2 to 5 N to each pressure column 17.

[0064] S6. The pressure column top plate 6 is placed above the pressure column fixing plate 5 by fixing columns 7 at the four corners of the main fixing base plate 1. By placing weights on the pressure column top plate 6, the pressing part 33 of the pressure rod 17 applies a pressure of 0.5 to 10 N to each piezoelectric ceramic sheet 14.

[0065] S7. After assembly, place the entire device in an oven and cure it at 100-250℃ for 0.5-3 hours. Allow it to cool naturally.

[0066] Of course, the above description is not intended to limit the present invention, and the present invention is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present invention should also fall within the protection scope of the present invention.

Claims

1. A piezoelectric ceramic sheet sticking tool applied to a tuning fork liquid level switch, characterized by, This includes a main fixing base plate, an insulating sheet fixing base plate, a piezoelectric ceramic sheet position plate, a pressure column position plate, a pressure column fixing plate, and a pressure column top plate; The insulating sheet fixing base plate is disposed on the main fixing base plate and has several insulating sheet fixing holes for fixing the position of the insulating sheet; the piezoelectric ceramic sheet positioning plate has several piezoelectric ceramic sheet positioning holes for fixing the position of the piezoelectric ceramic sheet so that the piezoelectric ceramic sheet is placed precisely on the insulating sheet; the pressure column positioning plate is disposed on the main fixing base plate and has several pressure column positioning holes for the pressure column to pass through so that the pressure column is placed on the insulating sheet; the pressure column fixing plate is disposed above the pressure column positioning plate and has several pressure column through holes with a diameter smaller than the pressure column for applying pressure to the pressure column; the pressure column top plate is disposed above the pressure column fixing plate and has a pressure rod through hole for the pressure rod to pass through, the pressure rod is inserted in the pressure rod through hole, and a spring is sleeved at the lower end; The main fixed base plate has a fixed post at each of the four corners of its top surface, and two first fixed protrusions on its horizontal center line. The insulating sheet fixing base plate has two second fixing protrusions and two fixing holes corresponding to the first fixing protrusions on the transverse center line, and a rectangular groove is provided on the top surface. The piezoelectric ceramic sheet positioning plate has a fixing hole corresponding to the second fixing protrusion on its transverse center line. The piezoelectric ceramic sheet positioning hole is set in correspondence with the insulating sheet fixing hole. Four positioning protrusions are evenly provided on its inner wall along the circumferential direction. When the piezoelectric ceramic sheet positioning plate is set on the insulating sheet fixing base plate, the center of the piezoelectric ceramic sheet positioning hole coincides with the center of the insulating sheet fixing hole. The pressure column position plate has a fixing hole on its transverse center line that corresponds to the second fixing protrusion, and the pressure column position hole is set in correspondence with the insulating sheet fixing hole. The four corners of the pressure column fixing plate are respectively provided with fixing holes corresponding to the four fixing columns, and the pressure column through holes are set to correspond to the fixing holes of the insulating sheet.

2. The piezoelectric ceramic sheet sticking tooling applied to the tuning fork liquid level switch according to claim 1, characterized in that, The top plate of the pressure column is provided with fixing holes at the four corners corresponding to the four fixing columns. The through holes of the pressure rod are provided with corresponding fixing holes of the insulating sheet. The bottom end of the pressure rod is provided with a pressing part of the same size as the piezoelectric ceramic sheet. The pressing part passes through the through holes of the pressure column and the position holes of the pressure column and is placed on the piezoelectric ceramic sheet.

3. The piezoelectric ceramic sheet sticking tooling for tuning fork liquid level switch according to claim 1, characterized in that, The pressure column is used to fix the FPC flexible plate and the piezoelectric ceramic sheet. It has a cylindrical structure with openings at both the top and bottom. Its inner wall is provided with protrusions that engage with the piezoelectric ceramic sheet to fix the orientation of the piezoelectric ceramic sheet. The FPC flexible board has lines running through both ends, one end of which is welded to the electrode of the piezoelectric ceramic sheet, and the other end is welded to the drive circuit.

4. The piezoelectric ceramic sheet sticking tooling for tuning fork liquid level switch according to claim 1, characterized in that, The centers of the insulating sheet fixing hole, the pressure post position hole, the pressure post through hole, and the pressure rod through hole coincide.

5. A piezoelectric ceramic sheet bonding process applied to a tuning fork liquid level switch, characterized by, The piezoelectric ceramic bonding fixture for a tuning fork level switch, as described in any one of claims 1-4, comprises the following steps: S1. Clean the surface of the insulating sheet and piezoelectric ceramic sheet with alcohol, and apply a thin layer of epoxy resin adhesive to the bottom of the piezoelectric ceramic sheet. S2. Fix the insulating sheet fixing base plate onto the main fixing base plate, and then place the insulating sheet into the insulating sheet fixing hole; S3. Place the piezoelectric ceramic positioning plate in the rectangular groove of the insulating sheet fixing base plate, place the piezoelectric ceramic sheet coated with epoxy resin into the piezoelectric ceramic sheet positioning hole, so that the center of the piezoelectric ceramic sheet coincides with the center of the insulating sheet, and remove the piezoelectric ceramic sheet positioning plate. S4. Place the pressure column position plate in the rectangular groove of the insulating sheet fixing base plate, place the pressure column into the pressure column position hole, and adjust the direction so that the protrusion on the inner wall of the pressure column engages with the piezoelectric ceramic sheet. S5. Place the pressure column fixing plate on several pressure columns through the fixing columns at the four corners of the main fixing base plate. The pressure column fixing plate applies a pressure of 0.2~5N to each pressure column. S6. Place the pressure column top plate above the pressure column fixing plate by fixing the columns at the four corners of the main fixing base plate. By placing a weight on the pressure column top plate, the pressing part of the pressure rod applies a pressure of 0.5~10N to each piezoelectric ceramic sheet. S7. After assembly, place the entire device in an oven and cure it at 100~250℃ for 0.5~3 hours. Allow it to cool naturally.

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