Electronic device and method of manufacturing the same

Abstract

A method for manufacturing an electronic device is provided. The method includes the following steps. A first substrate is provided. The first substrate has a top surface and a side surface. A first conductive line is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate, such that the auxiliary bonding pad contacts the first conductive line. A second conductive line is formed on the side surface of the first substrate, such that the second conductive line contacts the auxiliary bonding pad. The second conductive line and the auxiliary bonding pad comprise at least one same material. The method for manufacturing the electronic device can reduce the contact resistance, thereby ensuring the effect of electrical transmission between surfaces of various dimensions in the electronic device.

Description

Technical Field

[0001] This disclosure relates to an electronic device and a method for manufacturing the same, and more particularly to an electronic device and a method for manufacturing the same that can reduce contact resistance. Background Technology

[0002] Electronic products have become an indispensable part of modern society. With the rapid development of electronic products, certain technologies used in them (such as connectivity technologies) are also constantly improving. Improving the efficiency of electronic devices has become a continuous improvement project. Summary of the Invention

[0003] This disclosure provides an electronic device and a method for manufacturing the same, which has the effect of ensuring electrical transmission between surfaces of various dimensions in the electronic device.

[0004] According to an embodiment of this disclosure, a method for manufacturing an electronic device includes the following steps: A first substrate is provided. The first substrate has a top surface and a side surface. A first conductive line is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate such that the auxiliary bonding pad contacts the first conductive line. A second conductive line is formed on the side surface of the first substrate such that the second conductive line contacts the auxiliary bonding pad. The second conductive line and the auxiliary bonding pad comprise at least one of the same material.

[0005] According to embodiments disclosed herein, an electronic device includes a first substrate, a first conductive line, an auxiliary bonding pad, and a second conductive line. The first substrate has a top surface and a side surface. The first conductive line is disposed on the top surface of the first substrate. The auxiliary bonding pad is disposed on the top surface of the first substrate and contacts the first conductive line. The second conductive line is disposed on the side surface of the first substrate and contacts the auxiliary bonding pad. The second conductive line and the auxiliary bonding pad comprise at least one of the same material. Attached Figure Description

[0006] The accompanying drawings are included to further illustrate the present disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0007] Figure 1 This is a top view schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0008] Figures 2A to 2C for Figure 1 A cross-sectional schematic diagram of the manufacturing method of an electronic device;

[0009] Figure 2D This is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure;

[0010] Figure 3A for Figure 1A side view of the electronic device along section line B-B';

[0011] Figure 3B for Figure 1 A top view of the edge area of ​​an electronic device;

[0012] Figure 4 This is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure;

[0013] Figure 5 This is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure;

[0014] Figure 6 This is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure;

[0015] Figure 7A This is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure;

[0016] Figure 7B This is a perspective view of an electronic device according to another embodiment of the present disclosure;

[0017] Figure 8A This is a perspective view of an electronic device according to another embodiment of the present disclosure;

[0018] Figure 8B for Figure 8A A cross-sectional schematic diagram of the electronic device along section line C-C';

[0019] Figure 9 This is a top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0020] Figure 10 This is a top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0021] Figure 11 This is a top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0022] Figure 12 This is a top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Detailed Implementation

[0023] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0024] Throughout this specification and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that function identically but have different names.

[0025] In the following description and claims, the words “comprising” and “including” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0026] It should be understood that when a component or membrane is referred to as being "on" or "attached" to another component or membrane, it can be directly on or directly attached to that other component or membrane, or there may be an interposed component or membrane between them (indirect cases). Conversely, when a component is referred to as being "directly" on or "attached" to another component or membrane, there may be no interposed component or membrane between them.

[0027] While the terms "first," "second," "third," etc., can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order in which the components are declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.

[0028] In this text, the terms "about," "approximately," "substantially," and "roughly" typically indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantity is an approximate quantity; that is, even without specific mention of "about," "approximately," "substantially," or "roughly," the meaning of these terms is implied. Furthermore, the phrases "range from the first value to the second value" or "range between the first value and the second value" indicate that the range includes the first value, the second value, and other values ​​in between.

[0029] In some embodiments disclosed herein, length and width can be measured using an optical microscope, and thickness can be measured from a cross-sectional image obtained using an electron microscope, but these methods are not limited thereto. Furthermore, any two values ​​or directions used for comparison may contain a certain degree of error.

[0030] In some embodiments disclosed herein, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, wherein another structure is disposed between the two structures. Furthermore, these terms regarding engagement and connection may also include situations where both structures are movable or both structures are fixed. In addition, the term "coupled" includes any direct and indirect electrical connection means.

[0031] The electronic devices disclosed herein may include, but are not limited to, display devices, backlight devices, antenna devices, sensing devices, or splicing devices. The electronic devices may be bendable or flexible. Display devices may be non-emissive or emissive. Antenna devices may be liquid crystal type or non-liquid crystal type antenna devices. Sensing devices may be sensing devices that sense capacitance, light, heat, or ultrasound, but are not limited to these. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited to these. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited to these. It should be noted that the electronic devices may be any combination of the foregoing, but are not limited to these. The following description will use display devices as electronic devices or splicing devices to illustrate the contents of this disclosure, but this disclosure is not limited thereto.

[0032] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0033] Reference will now be made in detail to the exemplary embodiments disclosed herein, examples of which are illustrated in the accompanying drawings. Wherever possible, the same component reference numerals are used in the drawings and description to denote the same or similar parts.

[0034] Figure 1 This is a top view schematic diagram of an electronic device according to an embodiment of the present disclosure. Figures 2A to 2C for Figure 1 A cross-sectional schematic diagram of the manufacturing method of an electronic device. Figure 2C for Figure 1 A cross-sectional schematic diagram of the electronic device along section line A-A'. Figure 2DThis is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure. Figure 3A for Figure 1 A side view of the electronic device along section line B-B'. Figure 3B for Figure 1 A top view of the edge region of an electronic device. For clarity and ease of explanation, the accompanying diagram is shown below. Figure 1 Several components are omitted.

[0035] Please refer to the following simultaneously: Figure 1 and Figure 2C The electronic device 100 of this embodiment includes a first substrate 110, a circuit layer 120, a first conductive line 130, an auxiliary bonding pad 140, a second conductive line 150, and a second substrate 160. The first substrate 110 has a top surface 111, a bottom surface 112, and a side surface 113 extending in a dimension different from that of the top surface 111 and / or the bottom surface 112. The top surface 111 and the bottom surface 112 are opposite to each other, and the side surface 113 connects the top surface 111 and the bottom surface 112. Please refer to... Figure 3B Multiple first conductive lines 130 are disposed on the top surface 111 of the first substrate 110. For simplicity, the following description will focus on a single first conductive line 130. Please also refer to... Figure 2C The second substrate 160 has a top surface 161, a bottom surface 162, and a side surface 163 extending in a dimension different from the top surface 161 and / or the bottom surface 162. The top surface 161 and the bottom surface 162 are opposite to each other, and the side surface 163 connects the top surface 161 and the bottom surface 162. Figure 2C As shown, the top surface 111 of the first substrate 110 faces the top surface 161 of the second substrate 160.

[0036] In this embodiment, the electronic device 100 is, for example, a borderless or narrow-bezel display device, but is not limited thereto. The electronic device 100 includes a first side 101, a second side 102, a third side 103, and a fourth side 104. The first side 101 and the third side 103 are opposite to each other, and the second side 102 and the fourth side 104 are opposite to each other. The second side 102 connects the first side 101 and the third side 103. The electronic device 100 includes a panel area 114. The panel area 114 has a first area 1141 and a second area 1142. The first area 1141 may be a display area. The second area 1142 may be disposed adjacent to the first area 1141. In some embodiments, the second area 1142 may be disposed around the first area 1141, such as... Figure 1 As shown, but not limited to, panel area 114 may include side area 114S. Side area 114S may overlap at least one side of electronic device 100. For example, as Figure 1As shown, side region 114 overlaps with first side 101. In some embodiments, the wires in side region 114S can be specially designed, which will be further described below.

[0037] Figure 2C for Figure 1 A cross-sectional view of the side region 114S of the electronic device 100 along section line A-A'. Please refer to... Figure 1 and Figure 2C The design includes conductors in the side area 114S, which may include a first conductor 130, an auxiliary bonding pad 140, and a second conductor 150. The conductors in the side area 114S are electrically connected to the circuit layer 120 disposed in the first area 1141. Specifically, the circuit layer 120 disposed in the first area 1141 (display area) may be a display pixel circuit, a display driving circuit, a power unit, a common circuit, a touch sensing circuit, a bypass wiring, an electrostatic discharge protection system, or a combination thereof, but is not limited thereto. The first conductor 130 may be a pad electrically connected to the circuit layer 120, and at least a portion of the first conductor 130 is disposed between the circuit layer 120 and one side of the electronic device. For example, please refer to... Figure 2C At least a portion of the first conductor 130 is disposed between the line layer 120 and the second conductor 150.

[0038] For ease of explanation, Figure 1 Only a single side region 114S is shown, and the conductors in the side region 114S include the first conductor 130, the auxiliary bonding pad 140, and the second conductor 150 as described above. In some embodiments, the electronic device 100 may include more than one side region 114S. For example, although Figure 1 Not shown, but the electronic device 100 may include another side area located on the second side 102, another side area located on the third side 103, and / or another side area located on the fourth side 104. The other side area may adopt a similar or the same design as described above, that is, the other side area may also include a first wire 130, an auxiliary bonding pad 140, and a second wire 150, and the relevant description will not be repeated.

[0039] Please refer to Figure 2CA wiring layer 120, a first conductive line 130, and an auxiliary bonding pad 140 are disposed on the top surface 111 of the first substrate 110. The wiring layer 120 is electrically connected to the first conductive line 130. The auxiliary bonding pad 140 is connected to and contacts the first conductive line 130. A second conductive line 150 is disposed on the side surface 113 of the first substrate 110 and may be referred to as side wiring. Furthermore, the second conductive line 150 is connected to and contacts the auxiliary bonding pad 140, and the second conductive line 150 can be electrically connected to the first conductive line 130 through the auxiliary bonding pad 140. In this embodiment, the second conductive line 150 and the auxiliary bonding pad 140 contain at least one of the same material. The same material includes, for example, silver, silver alloy, gold, gold alloy, copper, copper alloy, graphene, carbon nanotubes, or combinations thereof. In this embodiment, since the second conductive line 150 and the auxiliary bonding pad 140 contain at least one of the same material, the contact resistance between the second conductive line 150 and the auxiliary bonding pad 140 can be reduced.

[0040] In some embodiments, such as Figure 2C As shown, the auxiliary bonding pad 140 can be disposed on the first wire 130. Alternatively, in some embodiments, such as Figure 2D As shown, the first wire 130 can be disposed on the auxiliary bonding pad 140.

[0041] In some embodiments, the first region 1141 may be a display area. Furthermore, the image may still be displayed in the second region 1142. That is, in some embodiments, the second region 1142 may also include a display area. The electronic device 100 may include a display component (not shown) in the display area. The display component may be a liquid crystal, microLED, mini LED, or organic light-emitting diode, or a combination thereof, but is not limited thereto.

[0042] In this embodiment, please also refer to Figure 1 and Figure 2C Directions X, Y, and Z are different directions. Directions X and Y can define a plane parallel to the top surface 111 of the first substrate 110. For example, direction X is approximately the extension direction of section line B-B', direction Y is approximately the extension direction of section line A-A', and direction Z is approximately the normal direction of the substrate 110. Directions Y and Z can be perpendicular to direction X, and direction Y can be perpendicular to direction Z, but are not limited thereto.

[0043] Next, please refer to Figure 1 as well as Figures 2A to 2C The following will describe the manufacturing method of the second region 1142 of the electronic device 100 in this embodiment.

[0044] Please refer to the following at the same time Figure 1 and Figure 2A A first substrate 110 is provided, and a circuit layer 120 and a first conductor 130 are formed on the top surface 111 of the first substrate 110 in a second region 1142. Specifically, the circuit layer 120 is first formed on the top surface 111 of the first substrate 110 so that the circuit layer 120 can be electrically connected to a circuit (not shown) in the first region 1141.

[0045] Next, a first conductive line 130 is formed on the top surface 111 of the first substrate 110 to electrically connect the first conductive line 130 to the circuit layer 120. In some embodiments, the first conductive line 130 includes an upper surface 131 and a side surface 132. The upper surface 131 is the surface of the first conductive line 130 away from the first substrate 110, and the side surface 132 is the side surface of the first conductive line 130 away from the first region 1141. The side surface 132 of the first conductive line 130 may be flush with the side surface 113 of the first substrate 110. In this embodiment, the step of forming the circuit layer 120 (or the first conductive line 130) involves, for example, first forming a metal material layer (not shown) on the top surface 111 of the substrate 110 by sputtering, evaporation, chemical deposition, or physical deposition. Then, the metal material layer is patterned using photolithography so that the patterned metal material layer can form the circuit layer 120 (or the first conductive line 130), but this is not a limitation. The circuit layer 120 and the first conductive line 130 can be formed from different conductive layers (e.g., metal material layers), but this disclosure is not limited thereto. In some embodiments, the circuit layer and the first conductive line can be formed from the same metal material layer, and they can be integrally formed together.

[0046] In this embodiment, the thickness T1 of the first conductive line 130 can be in the range of 0.01 micrometers (μm) to 100 micrometers, or in the range of 1 micrometer to 50 micrometers, for example, about 10 micrometers, but is not limited thereto. The thickness T1 is, for example, the maximum thickness of the first conductive line 130 measured along the normal direction (i.e., direction Z) of the substrate 110. In this embodiment, the materials of the circuit layer 120 and the first conductive line 130 may include copper, copper alloys, aluminum, aluminum alloys, molybdenum, molybdenum alloys, titanium, titanium alloys, indium tin oxide (ITO), or combinations thereof, but are not limited thereto. In this embodiment, the first substrate 110 may include a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the first substrate 110 may include glass, quartz, sapphire, ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or combinations thereof, but is not limited thereto.

[0047] Then, please refer to Figure 2B An auxiliary bonding pad 140 is formed on the top surface 111 of the first substrate 110 so that the auxiliary bonding pad 140 can contact the first conductor 130. Specifically, the auxiliary bonding pad 140 is formed on the upper surface 131 of the first conductor 130 so that the auxiliary bonding pad 140 can contact and connect to the first conductor 130, and can be electrically connected to the circuit layer 120 through the first conductor 130. In this embodiment, the auxiliary bonding pad 140 and the first substrate 110 may be located on opposite sides of the first conductor 130. The auxiliary bonding pad 140 may cover a portion of the upper surface 131 of the first conductor 130, but is not limited thereto. In some embodiments, the auxiliary bonding pad may cover the entire upper surface (not shown) of the first conductor.

[0048] In this embodiment, the auxiliary bonding pad 140 includes an upper surface 141 and a side surface 142. The upper surface 141 is the surface of the auxiliary bonding pad 140 away from the first substrate 110. The side surface 142 is the side surface of the auxiliary bonding pad 140 away from the first region 1141, and the side surface 142 can be flush with the side surface 113 of the first substrate 110. In this embodiment, the step of forming the auxiliary bonding pad 140 is, for example, to first form a conductive layer (not shown) on the surface of the first conductor 130 away from the first substrate 110 by sputtering, vapor deposition, chemical deposition, or physical deposition, and then to pattern the conductive layer into the auxiliary bonding pad 140 by photolithography, but is not limited thereto.

[0049] In this embodiment, the thickness T2 of the auxiliary bonding pad 140 can be in the range of 0.01 micrometers to 100 micrometers, or in the range of 1 micrometer to 50 micrometers, for example, less than or equal to 10 micrometers, but not limited thereto. The thickness T2 is, for example, the maximum thickness of the auxiliary bonding pad 140 measured along the normal direction (i.e., direction Z) of the first substrate 110. In this embodiment, the auxiliary bonding pad 140 and the first conductive wire 130 are formed of different materials. The material of the auxiliary bonding pad 140 may include silver, silver alloy, gold, gold alloy, copper, copper alloy, graphene, carbon nanotubes, or combinations thereof. The material of the auxiliary bonding pad 140 may also include other suitable conductive materials, but is not limited thereto.

[0050] Then, please refer to Figure 2C The first substrate 110 and the second substrate 160 are assembled together using a sealant (not shown), and a second conductive line 150 is formed on the side surface 113 of the first substrate 110 so that the second conductive line 150 can contact the auxiliary bonding pad 140. Specifically, unlike... Figure 2C Cross-sectional view, Figure 3B The top view shows multiple wiring layers 120, multiple first conductors 130, and multiple auxiliary bonding pads 140. Please refer to... Figure 3A and Figure 3BFirst, a frame adhesive is formed on the first substrate 110 so that the second substrate 160 can be disposed on the first substrate 110 through the frame adhesive, and the circuit layer 120, the first conductor 130, the auxiliary bonding pad 140, and the frame adhesive can be located between the second substrate 160 and the first substrate 110. Next, a second conductor 150 is formed on the side surface 113 of the first substrate 110 and the side surface 163 of the second substrate 160, so that the second conductor 150 can extend from the side surface 113 of the first substrate 110 to the side surface 163 of the second substrate 160, and the second conductor 150 can contact the auxiliary bonding pad 140 and the first conductor 130. Next, the second conductor 150 is subjected to a point annealing process using a heater (e.g., far-infrared ray, air blower, electric heating rod, but not limited to this), so that the second conductor 150 can contact the auxiliary bonding pad 140 and change the metallic bond between the second conductor 150 and the auxiliary bonding pad 140. This increases the robustness, malleability, and ductility between the second conductor 150 and the auxiliary bonding pad 140, and reduces the contact resistance between them. Thus, the electronic device 100 of this embodiment is complete. For ease of explanation, a single first conductor 130, a single second conductor 150, and a single auxiliary bonding pad 140 have been described. However, multiple first conductors 130, multiple second conductors 150, and multiple auxiliary bonding pads 140 can also be applied, and therefore will not be described further here.

[0051] In this embodiment, the contact area between the auxiliary bonding pad 140 and the first wire 130 has a first contact area A1, the contact area between the second wire 150 and the auxiliary bonding pad 140 has a second contact area A2, and the contact area between the second wire 150 and the first wire 130 has a third contact area A3. The first contact area A1 between the auxiliary bonding pad 140 and the first wire 130 may be larger than the second contact area A2 between the second wire 150 and the auxiliary bonding pad 140, but is not limited thereto. The first contact area A1 may be larger than the third contact area A3 between the second wire 150 and the first wire 130, but is not limited thereto. In some embodiments, the second contact area A2 may be larger than the third contact area A3. In this embodiment, since the first contact area A1 can be larger than the third contact area A3, compared with electronic devices without auxiliary bonding pads (which have the problem of high contact resistance due to the small contact area between the second wire and the first wire), the electronic device 100 in this embodiment can increase the contact area (i.e. the first contact area A1) by setting the auxiliary bonding pad 140, thereby reducing the contact resistance.

[0052] In some embodiments, the auxiliary bonding pad 140 and the second conductive line 150 can be formed using different processes. In this embodiment, the second conductive line 150 is formed, for example, by a printing process, inkjet printing, or dispensing, but is not limited thereto. The width W1 of the second conductive line 150 can be, for example, 30 micrometers to 50 micrometers, but is not limited thereto. The width W2 of the first conductive line 130 can be, for example, equal to the width W3 of the auxiliary bonding pad 140, but is not limited thereto. The width W2 of the first conductive line 130 can be, for example, greater than the width W1 of the second conductive line 150, but is not limited thereto. The width W3 of the auxiliary bonding pad 140 can be, for example, greater than the width W1 of the second conductive line 150, but is not limited thereto. When the spacing between the first substrate 110 and the second substrate 160 is 10 micrometers to 20 micrometers, the height H1 of the second conductive line 150 can be, for example, 0.1 millimeters (mm) to 2.0 millimeters, but is not limited thereto. In some embodiments, the height H1 of the second conductive line 150 can be greater than 2.0 millimeters. The spacing P1 between two adjacent second conductors 150 can be, for example, 50 micrometers to 100 micrometers, but is not limited thereto. Width W1 is, for example, the maximum width of the second conductor 150 measured along direction X; width W2 is, for example, the maximum width of the first conductor 130 measured along direction X; width W3 is, for example, the maximum width of the auxiliary bonding pad 140 measured along direction X; height H1 is, for example, the maximum height of the second conductor 150 measured along the normal direction (i.e., direction Z) of the first substrate 110; and spacing P1 is, for example, the maximum distance between two adjacent second conductors 150 measured along direction X. In this embodiment, the material of the auxiliary bonding pad 140 may also include silver, silver alloy, gold, gold alloy, copper, copper alloy, graphene, carbon nanotubes, or combinations thereof, but is not limited thereto. In some embodiments, the material of the second conductor 150 is different from the material of the first conductor 130.

[0053] In this embodiment, since the second lead 150 and the auxiliary bonding pad 140 are formed by different processes, although the second lead 150 and the auxiliary bonding pad 140 contain at least one of the same material, they are not integrally formed, and an interface SM exists between them. Structurally, in this embodiment, the second lead 150 and the auxiliary bonding pad 140 can be distinguished, for example, using an optical microscope (OM), a scanning electron microscope (SEM), or a focused ion beam (FIB). In this embodiment, the material of the second lead 150 and the material of the auxiliary bonding pad 140 can be distinguished, for example, using a focused ion beam, an electron probe microanalyzer (EPMA), or an energy dispersive X-ray spectroscopy (EDX).

[0054] In this embodiment, since the second conductive wire 150 is disposed on the side surface 113 of the first substrate 110 and the side surface 163 of the second substrate 160, a circuit board (not shown) or other electronic device to be subsequently bonded to the electronic device 100 can be bonded to the second conductive wire 150 located on the side surface 113 of the first substrate 110 to achieve the effect of side bonding. Therefore, it is not necessary to additionally provide a bonding area in the second region 1142 of the first substrate 110, thereby reducing the width of the frame of the electronic device 100 or achieving a frameless effect.

[0055] In short, compared to the high contact resistance between the second conductor 150 and the first conductor 130, in some embodiments, the contact resistance between the second conductor 150 and the auxiliary bonding pad 140 can be reduced by forming an auxiliary bonding pad 140 that contacts the first conductor 130 and making the second conductor 150 (side line) and the auxiliary bonding pad 140 contain at least one of the same materials. This improves the contact between the side line and the first conductor. In some embodiments, since the first contact area A1 between the auxiliary bonding pad 140 and the first conductor 130 is larger than the third contact area A3 between the second conductor 150 and the first conductor 130, the electronic device 100 of this embodiment can increase the contact area and thus reduce the contact resistance by providing the auxiliary bonding pad 140, compared to an electronic device without an auxiliary bonding pad. Therefore, electrical transmission between the first conductor 130 and the second conductor 150 (side line) can be ensured. Furthermore, by changing the metal bonding between the second conductor 150 and the auxiliary bonding pad 140, the contact resistance between the second conductor 150 and the auxiliary bonding pad 140 can be reduced.

[0056] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0057] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 2C and Figure 4 The electronic device 100a in this embodiment is generally similar to Figure 2CThe electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100a in this embodiment and the electronic device 100 in the present embodiment is that, in the electronic device 100a in this embodiment, the second wire 150a can also extend and be disposed on the bottom surface 112 of the first substrate 110. Thereby, the electronic component 200 can be disposed on the bottom surface 112 of the substrate 110 through the second wire 150a, and electrically connected to the auxiliary bonding pad 140, the first wire 130, the circuit layer 120 and the circuit in the first region 1141 through the second wire 150a. The electronic component 200 may include an IC chip, a flexible printed circuit board (FPC) or a printed circuit board assembly (PCBA), but is not limited thereto. In this embodiment, since the second wire 150a can extend to the bottom surface 112 of the substrate 110, the circuit board to be bonded can be disposed on the bottom surface 112 of the substrate 110 through the second wire 150a, and does not need to be disposed on the top surface 161 of the second substrate 160. This can reduce the width of the frame of the electronic device 100a or achieve a frameless effect.

[0058] Figure 5 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 2C and Figure 5 The electronic device 100b in this embodiment is generally similar to Figure 2C The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100b in this embodiment and the electronic device 100b is that, in the electronic device 100b in this embodiment, the auxiliary bonding pad 140b is disposed between the first wire 130b and the first substrate 110.

[0059] Specifically, please refer to Figure 5 In the electronic device 100b of this embodiment, an auxiliary bonding pad 140b and a circuit layer 120 are first formed on the top surface 111 of the first substrate 110, so that a gap G1 exists between the auxiliary bonding pad 140b and the circuit layer 120. Next, a first conductive line 130b is formed on the auxiliary bonding pad 140b and the circuit layer 120, and the first conductive line 130b is filled into the gap G1 between the auxiliary bonding pad 140b and the circuit layer 120, so that the auxiliary bonding pad 140b can be electrically connected to the circuit layer 120 through the first conductive line 130b. That is, the first conductive line 130b can be disposed on the upper surface 141b and the side surface 143b of the auxiliary bonding pad 140b. The side surface 143b is the side surface of the auxiliary bonding pad 140b away from the second conductive line 150.

[0060] In this embodiment, the first conductor 130b may cover a portion of the upper surface 141b of the auxiliary bonding pad 140b, but is not limited thereto. In some embodiments, the first conductor may cover the entire upper surface of the auxiliary bonding pad (not shown).

[0061] Figure 6 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 2C and Figure 6 The electronic device 100c in this embodiment is generally similar to Figure 2C The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100c in this embodiment and the electronic device 100 is that, in the electronic device 100c in this embodiment, the circuit layer 120c, the first conductor 130c and the auxiliary bonding pad 140c are disposed on the second substrate 160, and the side surface 132c of the first conductor 130c is not cut flush with the side surface 163 of the second substrate 160.

[0062] Specifically, please refer to Figure 6 In the electronic device 100c of this embodiment, a gap G2 is provided between the side surface 132c of the first conductor 130c and the second conductor 150. An auxiliary bonding pad 140c is disposed on the upper surface 131c of the first conductor 130c (i.e., the surface of the first conductor 130c away from the second substrate 160) and in the gap G2 between the first conductor 130c and the second conductor 150. In other words, the auxiliary bonding pad 140c is disposed on the upper surface 131c and the side surface 132c of the first conductor 130c (i.e., the side surface of the first conductor 130c adjacent to the side surface of the second conductor 150). Therefore, the second conductor 150 can be electrically connected to the first conductor 130c and the circuit layer 120c via the auxiliary bonding pad 140c. In this embodiment, the circuit layer 120c can be electrically connected to a circuit (not shown) within the first region 1141, such as a touch sensing circuit, but is not limited thereto.

[0063] Figure 7A This is a cross-sectional schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 3A and Figure 7A The electronic device 100d in this embodiment is generally similar to Figure 3A The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100d in this embodiment and the electronic device 100d is that the electronic device 100d in this embodiment also includes a first wire 130d (i.e., another first wire), an auxiliary bonding pad 140d (i.e., another auxiliary bonding pad) and a second wire 150d (i.e., another second wire).

[0064] Specifically, please refer to Figure 7A In the manufacturing method of the electronic device 100d in this embodiment, the following steps are also included: providing a second substrate 160 such that the second substrate 160 is disposed opposite to the first substrate 110; forming a first conductive line 130d on the top surface 161 of the second substrate 160 adjacent to the first substrate 110; forming an auxiliary bonding pad 140d on the top surface 161 of the second substrate 160 such that the auxiliary bonding pad 140d contacts the first conductive line 130d; and forming a second conductive line 150d on the side surface 163 of the second substrate 160 such that the second conductive line 150d contacts the auxiliary bonding pad 140d. In this embodiment, the electronic device 100d includes: a second substrate 160 disposed opposite to a first substrate 110; another first conductive line 130d disposed on the top surface 161 of the second substrate 160, wherein the top surface 111 of the first substrate 110 faces the top surface 161 of the second substrate 160; another auxiliary bonding pad 140d disposed on the top surface 161 of the second substrate 160, wherein the other auxiliary bonding pad 140d contacts the other first conductive line 130d; and another second conductive line 150d disposed on the side surface 63 of the second substrate 160, wherein the other second conductive line 150d contacts the other auxiliary bonding pad 140d.

[0065] Please refer to Figure 7A Multiple first conductive lines 130d are disposed on the top surface 161 of the second substrate 160. For simplicity, a single first conductive line 130d will be used for explanation below. In some embodiments, a second conductive line 150 may extend from the side surface 113 of the first substrate 110 to the side surface 163 of the second substrate 160, and a second conductive line 150d may extend from the side surface 163 of the second substrate 160 to the side surface 113 of the first substrate 110. The second conductive lines 150 and 150d are arranged, for example, in an alternating manner. In this embodiment, although the second conductive lines 150 and 150d may be arranged in an alternating manner, this disclosure does not limit the arrangement of the second conductive lines 150 and 150d, as long as the second conductive lines 150 and 150d can respectively contact the auxiliary bonding pad 140 and the auxiliary bonding pad 140d.

[0066] In this embodiment, the second wire 150 can contact and be electrically connected to the auxiliary bonding pad 140 and the first wire 130, but the second wire 150 does not contact the auxiliary bonding pad 140d and the first wire 130d. The second wire 150d can contact and be electrically connected to the auxiliary bonding pad 140d and the first wire 130d, but the second wire 150d does not contact the auxiliary bonding pad 140 and the first wire 130.

[0067] Please refer to Figure 7AIn this embodiment, since the side surface 113 of the first substrate 110 and the side surface 163 of the second substrate 160 are both located on the same side of the electronic device 100d, the second wire 150 and the second wire 150d will also be located on the same side of the electronic device 100d. For example, the second wire 150 and the second wire 150d are both located on the first side 101 of the electronic device 100d, wherein the first side 101 extends on the plane formed by the X and Z directions. However, this disclosure does not limit the second wire 150 and the second wire 150d to be located on the same side of the electronic device 100d. That is, in other embodiments, the second wire 150 and the second wire 150d' can also be located on different sides of the electronic device 100d', such as... Figure 7B As shown.

[0068] Figure 7B This is a perspective view of an electronic device according to another embodiment of the present disclosure. Please also refer to... Figure 7A and Figure 7B The electronic device 100d' in this embodiment is generally similar to Figure 7A The electronic device 100d is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100d' and the electronic device 100d' in this embodiment is that, in the electronic device 100d' of this embodiment, the second wire 150 and the second wire 150d' can be located on different sides of the electronic device 100d'.

[0069] Specifically, please refer to Figure 7B In the electronic device 100d' of this embodiment, the second wire 150 is located on the first side 101 of the electronic device 100d', while the second wire 150d' is located on the second side 102 of the electronic device 100d'. The first side 101 and the second side 102 are different sides of the electronic device 100d'. For example, the first side 101 of the electronic device 100d' extends in the plane formed by the X and Z directions, while the second side 102 of the electronic device 100d' extends in the plane formed by the Y and Z directions. In this embodiment, the second wire 150 contacts the auxiliary bonding pad 140 and the first wire 130, but does not contact the auxiliary bonding pad 140d'. The second wire 150d' contacts the auxiliary bonding pad 140d' and the first wire 130d', but does not contact the auxiliary bonding pad 140.

[0070] Figure 8A This is a perspective view of an electronic device according to another embodiment of the present disclosure. Figure 8B for Figure 8A A cross-sectional view of the electronic device along section line C-C'. For clarity and ease of explanation, the accompanying drawings are shown. Figure 8A Several components are omitted from the diagram. Please refer to [the documentation] as well. Figure 2C and Figures 8A to 8B The electronic device 100e in this embodiment is generally similar to Figure 2C The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100e in this embodiment and the electronic device 100e in this embodiment is that the electronic device 100e in this embodiment is a dual-side display device.

[0071] Please refer to Figure 8A and Figure 8B The wiring in the side area 114S is specially designed, and the wiring includes a first conductor 130e1, an auxiliary bonding pad 140e1, another first conductor 130e2, another auxiliary bonding pad 140e2, and a second conductor 150e electrically connecting the auxiliary bonding pad 140e1 and the other auxiliary bonding pad 140e2. Specifically, the electronic device 100e of this embodiment includes a display panel 100e1, a display panel 100e2, connecting lines 190, and an adhesive layer 191. The display panel 100e1 includes a substrate 110e1, a wiring layer 120e1, a first conductor 130e1, an auxiliary bonding pad 140e1, and a lens 180e1. The display panel 100e2 includes a substrate 110e2, a wiring layer 120e2, a first conductor 130e2, an auxiliary bonding pad 140e2, and a lens 180e2. In this configuration, the substrate 110e1 of display panel 100e1 and the substrate 110e2 of display panel 100e2 are connected and fixed together by an adhesive layer 191. The bottom surface 112e1 of substrate 110e1 is adjacent to the second surface 112e2 of substrate 110e2 and away from the first surface 111e2 of substrate 110e2. A connection line 190 connects display panel 100e1 and display panel 100e2, and the connection line 190 can be used to transmit signals between display panel 100e1 and display panel 100e2. In some embodiments, the connection line 190 may be, for example, a flexible circuit board or a printed circuit board assembly. In some embodiments, the connection line 190 may include a second conductor 150e (side conductor), but is not limited thereto.

[0072] More specifically, the panel area 114e1 of the display panel 100e1 has a first area 1141e and a second area 1142e. The second area 1142e is disposed adjacent to the first area 1141e. In some embodiments, the second area 1142e may be disposed around the first area 1141e, such as... Figure 8A As shown, but not limited to. In this embodiment, Figure 8B for Figure 8A A cross-sectional view of the second region 1142e of the panel area 114e1 of the display panel 100e1 along section line C-C'. Please refer to... Figure 8BA circuit layer 120e1, a first conductor 130e1, and an auxiliary bonding pad 140e1 are disposed on the top surface 111e1 of the substrate 110e1 (i.e., the surface of the substrate 110e1 away from the substrate 110e2). The circuit layer 120e1 is electrically connected to the first conductor 130e1. The auxiliary bonding pad 140e1 is disposed on the upper surface 131e1 of the first conductor 130e1 (i.e., the surface of the first conductor 130e1 away from the substrate 110e1) and in the gap G3 between the first conductor 130e1 and the second conductor 150e. That is, the auxiliary bonding pad 140e1 can be disposed on the upper surface 131e1 and the side surface 132e1 of the first conductor 130e1 (i.e., the side surface of the first conductor 130e1 adjacent to the second conductor 150e).

[0073] In this embodiment, a circuit layer 120e2, a first conductive line 130e2, and an auxiliary bonding pad 140e2 are disposed on a first surface 111e2 of a substrate 110e2 (i.e., the surface of the substrate 110e2 away from the adhesive layer 191). The circuit layer 120e2 is electrically connected to the first conductive line 130e2. The auxiliary bonding pad 140e2 is disposed on the upper surface 131e2 of the first conductive line 130e2 (i.e., the surface of the first conductive line 130e2 away from the substrate 110e2) and in the gap G4 between the first conductive line 130e2 and the second conductive line 150e. That is, the auxiliary bonding pad 140e2 can be disposed on the upper surface 131e2 and the side surface 132e2 of the first conductive line 130e2 (i.e., the side surface of the first conductive line 130e2 adjacent to the second conductive line 150e).

[0074] In this embodiment, the second conductive line 150e is disposed on the side surface 113e1 of the substrate 110e1 and extends along the side surface 142e1 of the auxiliary bonding pad 140e1 to the upper surface 141e1 of the auxiliary bonding pad 140e1 away from the substrate 110e1. Furthermore, the second conductive line 150e is also disposed on the side surface 113e2 of the substrate 110e2 and extends along the side surface 142e2 of the auxiliary bonding pad 140e2 to the upper surface 141e2 of the auxiliary bonding pad 140e2 away from the substrate 110e2. The second conductive line 150e can connect to and contact the auxiliary bonding pads 140e1 and 140e2. The second conductive line 150e can be electrically connected to the first conductive line 130e1 and the circuit layer 120e1 via the auxiliary bonding pad 140e1, and the second conductive line 150e can also be electrically connected to the first conductive line 130e2 and the circuit layer 120e2 via the auxiliary bonding pad 140e2. In other words, since the second conductor 150e can electrically connect the first conductor 130e1 and the first conductor 130e2 (or the line layer 120e1 and the line layer 120e2), the second conductor 150e can be regarded as a connection line to transmit signals between the display panel 100e1 and the display panel 100e2.

[0075] For example, a lens 180e1 disposed in panel area 114e1 of display panel 100e1 can transmit the captured image to display panel 100e2 via a second wire 150e, and the image captured by lens 180e1 is displayed on display panel 100e2. Similarly, a lens 180e2 disposed in panel area 114e2 of display panel 100e2 can transmit the captured image to display panel 100e1 via a second wire 150e, and the image captured by lens 180e2 is displayed on display panel 100e1. In some embodiments, electronic device 100e may not include lenses 180e1 and 180e2.

[0076] Furthermore, the method for manufacturing the electronic device 100e in this embodiment may include the following steps: providing a substrate 110e1; forming a first conductive line 130e1 on the top surface 111e1 of the substrate 110e1; forming an auxiliary bonding pad 140e1 on the top surface 111e1 of the substrate 110e1, such that the auxiliary bonding pad 140e1 contacts the first conductive line 130e1; providing a substrate 110e2, such that the substrate 110e2 can be disposed on the bottom surface 112e1 of the substrate 110e1; forming the first conductive line 130e2 on a first surface 111e2 of the substrate 110e2 away from the substrate 110e1; forming an auxiliary bonding pad. A pad 140e2 is formed on a first surface 111e2 of substrate 110e2 away from substrate 110e1, so that the auxiliary bonding pad 140e2 contacts the first wire 130e2; a second wire 150e is formed on the side surface 113e1 of substrate 110e1 and the side surface 113e2 of substrate 110e2, so that the second wire 150e contacts the auxiliary bonding pad 140e1 and the auxiliary bonding pad 140e2; a second wire 150e is formed on the upper surface 141e1 of auxiliary bonding pad 140e1 away from substrate 110e1 and the upper surface 141e2 of auxiliary bonding pad 140e2 away from substrate 110e2.

[0077] Figure 9 This is a top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1 , Figure 2C as well as Figure 9 The electronic device 100f in this embodiment is generally similar to Figure 1 and Figure 2C The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100f in this embodiment and the electronic device 100f is that, in the electronic device 100f in this embodiment, the second wire 150f is disposed on one of the side surfaces of the second substrate 160f.

[0078] Specifically, in this embodiment, the electronic device 100f includes a first substrate 110f, a second substrate 160f, a chip 210, and a flexible circuit board 220. The second substrate 160f is assembled with the first substrate 110f. The chip 210 and the flexible circuit board 220 are disposed on the first substrate 110f.

[0079] In this embodiment, the second substrate 160f includes a first side 163a, a second side 163b, a third side 163c, a fourth side 163d, and a plurality of side regions 114S. The first side 163a and the third side 163c are opposite to each other, and the second side 163b and the fourth side 163d are opposite to each other. The second substrate 160f includes a display area 114a and a non-display area 114b. The non-display area 114b is located around the display area 114a. The non-display area 114b is distributed along the first side 163a, the second side 163b, the third side 163c, and the fourth side 163d of the second substrate 160f. The chip 210 and the flexible circuit board 220 are adjacent to the third side 163c. The side regions 114S may overlap with the first side 163a, the third side 163c, and the fourth side 163d of the second substrate 160f, but do not overlap with the second side 163b. The second conductive wire 150f is disposed on the third side surface 163c of the second substrate 160f and the corresponding side surface (not shown) of the first substrate 110f, so that components on the second substrate 160f can be electrically connected to components on the first substrate 110f through the second conductive wire 150f. In some embodiments, the second conductive wire 150f may also be disposed on the first side surface 163a and the fourth side surface 163d, but not on the second side surface 163b, because the corresponding side surface of the first substrate 110f will not be flush with the second side surface 163b.

[0080] Figure 10 This is a top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1 and Figure 10 The electronic device 300 in this embodiment is generally similar to Figure 1 The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 300 and the electronic device 100 in this embodiment is that the electronic device 300 in this embodiment is a splicing display device, and the electronic device 300 includes a first panel 310 and a second panel 320.

[0081] Specifically, the first panel 310 and the second panel 320 can be one of the aforementioned electronic devices. In this embodiment, the third side 310c of the first panel 310 can be joined to the first side 320a of the second panel 320. The third side 310c of the first panel 310 is the side of the first panel 310 adjacent to the second panel 320. The first side 230a of the second panel 320 is the side of the second panel 320 adjacent to the first panel 310. An auxiliary bonding pad (not shown) and a second wire (not shown) are disposed adjacent to the third side 310c of the first panel 310 and the first side 230a of the second panel 320.

[0082] Figure 11 This is a top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 9 and Figure 10 The electronic device in this embodiment weighs approximately 100g. Figure 9 The electronic device 100f is the same as that in the two embodiments, so the same and similar components will not be repeated here. The main difference between the electronic device 100g and the electronic device 100f is that the second substrate 160g of the electronic device 100g in this embodiment includes a display area AA and a plurality of side areas 114S. Specifically, the side areas 114 can overlap with the first side 163a, the third side 163c and the fourth side 163d of the second substrate 160g, but do not overlap with the second side 163b. In some embodiments, the second substrate of the electronic device may also include a side area that overlaps with the first side, the third side or the fourth side.

[0083] In some embodiments, such as Figure 12 As shown, electronic device 100h may also not include, for example, Figure 11 The chip 210 and flexible circuit board 220 are shown. Therefore, the multiple side regions 114S of the electronic device 100h can overlap with the first side 163a, the second side 163b, the third side 163c and the fourth side 163d of the second substrate 160h, respectively.

[0084] In summary, in some embodiments, by forming an auxiliary bonding pad that contacts the first conductor, and the second conductor (side line) and the auxiliary bonding pad comprising at least one of the same material, the contact resistance between the second conductor and the auxiliary bonding pad can be reduced. Therefore, the contact between the side line and the first conductor can be improved. In some embodiments, since the first contact area between the auxiliary bonding pad and the first conductor is designed to be larger than the third contact area between the second conductor and the first conductor, the contact area can be increased. Therefore, electrical transmission between the first conductor and the second conductor (side line) can be ensured.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions disclosed herein, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments disclosed herein.

Claims

1. A method for manufacturing an electronic device, characterized in that, include: A first substrate is provided, wherein the first substrate has a top surface, a bottom surface and a side surface, and the side surface connects the top surface and the bottom surface; A first conductive line is formed on the top surface of the first substrate; An auxiliary bonding pad is formed on the top surface of the first substrate so that the auxiliary bonding pad contacts the first wire; A second conductive line is formed on the side surface and the bottom surface of the first substrate, so that the second conductive line contacts the auxiliary bonding pad and is electrically connected to the first conductive line through the auxiliary bonding pad; An electronic component is disposed on the bottom surface of the first substrate so that the electronic component is electrically connected to the second wire; as well as A second substrate is provided and disposed opposite to the top surface of the first substrate, wherein the second substrate has a top surface, a bottom surface, and a side surface, and the side surface connects the top surface and the bottom surface. The second conductor and the auxiliary bonding pad contain at least one of the same material. The second conductive wire is also disposed on the side surface of the second substrate. The second conductive wire extends from the bottom surface of the first substrate to the side surface of the first substrate, and also extends to the side surface of the second substrate. In the top view, the width of the first conductor is greater than the width of the second conductor, and the width of the auxiliary bonding pad is greater than the width of the second conductor.

2. The method for manufacturing an electronic device according to claim 1, characterized in that, The auxiliary bonding pad and the second wire are formed by different processes.

3. The method for manufacturing an electronic device according to claim 1, characterized in that, The auxiliary bonding pad is formed by photolithography, and the second conductor is formed by printing.

4. The method for manufacturing an electronic device according to claim 1, characterized in that, The at least one identical material includes silver, silver alloys, gold, gold alloys, copper, copper alloys, graphene, carbon nanotubes, or combinations thereof.

5. The method for manufacturing an electronic device according to claim 1, characterized in that, The auxiliary bonding pad and the first wire are formed of different materials.

6. The method for manufacturing an electronic device according to claim 1, characterized in that, The material of the first conductor includes copper, copper alloy, aluminum, aluminum alloy, molybdenum, molybdenum alloy, titanium, titanium alloy, indium tin oxide, or a combination thereof.

7. The method for manufacturing an electronic device according to claim 1, characterized in that, The second wire contacts the first wire.

8. The method for manufacturing an electronic device according to claim 1, characterized in that, The first contact area between the auxiliary bonding pad and the first wire is greater than the second contact area between the second wire and the auxiliary bonding pad, and the first contact area is greater than the third contact area between the second wire and the first wire.

9. The method for manufacturing an electronic device according to claim 1, characterized in that, Also includes: The second conductor is subjected to a spot annealing process to bring it into contact with the auxiliary bonding pad.

10. The method for manufacturing an electronic device according to claim 1, characterized in that, The top surface and the bottom surface are opposite to each other.

11. The method for manufacturing an electronic device according to claim 8, characterized in that, The second contact area between the second conductor and the auxiliary bonding pad is greater than the third contact area between the second conductor and the first conductor.

12. The method for manufacturing an electronic device according to claim 11, characterized in that, The first wire is disposed on the upper surface of the auxiliary bonding pad.

13. The method for manufacturing an electronic device according to claim 11, characterized in that, The auxiliary bonding pad is disposed on the upper surface of the first conductor.

14. An electronic device, characterized in that, include: A first substrate has a top surface, a bottom surface, and a side surface, wherein the side surface connects the top surface and the bottom surface; A first conductive line is disposed on the top surface of the first substrate; An auxiliary bonding pad is disposed on the top surface of the first substrate and contacts the first wire; A second conductive line is disposed on the side surface and the bottom surface of the first substrate, wherein the second conductive line contacts the auxiliary bonding pad, and the second conductive line is electrically connected to the first conductive line through the auxiliary bonding pad; An electronic component is disposed on the bottom surface of the first substrate and electrically connected to the second wire; as well as A second substrate is disposed opposite to the top surface of the first substrate, wherein the second substrate has a top surface, a bottom surface, and a side surface, and the side surface connects the top surface and the bottom surface. The second conductor and the auxiliary bonding pad contain at least one of the same material. The second conductive wire is also disposed on the side surface of the second substrate. The second conductive wire extends from the bottom surface of the first substrate to the side surface of the first substrate, and also extends to the side surface of the second substrate. In the top view, the width of the first conductor is greater than the width of the second conductor, and the width of the auxiliary bonding pad is greater than the width of the second conductor.

15. The electronic device according to claim 14, characterized in that, The at least one identical material includes silver, silver alloys, gold, gold alloys, copper, copper alloys, graphene, carbon nanotubes, or combinations thereof.

16. The electronic device according to claim 14, characterized in that, The first contact area between the auxiliary bonding pad and the first wire is greater than the second contact area between the second wire and the auxiliary bonding pad.

17. The electronic device according to claim 16, characterized in that, The first contact area is greater than the third contact area between the second conductor and the first conductor, and the second contact area is greater than the third contact area.

18. The electronic device according to claim 14, characterized in that, The electronic device includes a first panel and a second panel, which are joined together in a first direction. The first panel includes a first substrate, a first conductive line, an auxiliary bonding pad, a second conductive line, the electronic component, and the second substrate. In the top view, in the first direction, the width of the first conductor is greater than the width of the second conductor, and the width of the auxiliary bonding pad is greater than the width of the second conductor.

19. The electronic device according to claim 14, characterized in that, Also includes: Another first conductive wire is disposed on the top surface of the second substrate, wherein the top surface of the first substrate faces the top surface of the second substrate; Another auxiliary bonding pad is disposed on the top surface of the second substrate, wherein the other auxiliary bonding pad contacts the other first wire; as well as Another second conductor is disposed on the side of the second substrate, wherein the other second conductor contacts the other auxiliary bonding pad.

20. The electronic device according to claim 19, characterized in that, The other second conductor extends from the side surface of the second substrate to the side surface of the first substrate, and the second conductor and the other second conductor are arranged alternately.

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