A display panel, its manufacturing method, and a display device.

Abstract

This application discloses a display panel, its manufacturing method, and a display device. The display panel includes a substrate with heat-conducting particles distributed inside; a driving circuit layer disposed on one side of the substrate; and a light-emitting unit disposed on the side of the driving circuit layer away from the substrate. The beneficial effect of this application is that the display panel, its manufacturing method, and the display device inject heat-conducting particles inside the substrate. Without needing to add an additional heat-conducting layer, the heat generated by the light-emitting unit is quickly transferred to the outside of the substrate through the heat-conducting particles, thereby avoiding the aging and failure of the driving circuit layer caused by heat accumulation on it. The density of heat-conducting particles in the region corresponding to the light-emitting unit within the substrate is the highest, thus maximizing the thermal conductivity of the substrate.

Description

Technical Field

[0001] This application relates to the field of printing, specifically to a display panel and its preparation method, and a display device. Background Technology

[0002] Light-emitting diodes (LEDs) are semiconductor electronic components that convert electrical energy into light energy. Due to their small size, long lifespan, rich and varied colors, and low energy consumption, they are widely used in lighting, displays, signal lights, backlights, toys, and other fields. Mini LEDs, also known as sub-millimeter LEDs, typically have a size of 80 to 200 micrometers. They represent a new generation of LED technology, inheriting the high efficiency, high reliability, high brightness, and fast response time of small-pitch LEDs, while consuming less power and costing less than small-pitch LEDs.

[0003] The development of Mini-LED has become one of the hot topics in future display technologies. Compared with current LCD and OLED display devices, it has advantages such as fast response, high color gamut, and low energy consumption; however, it has many technical difficulties and is technically complex.

[0004] LED chips emit light and heat for extended periods, which can cause heat to accumulate inside the substrate, especially flexible substrates, and prevent it from dissipating. This results in the lower TFT driver layer operating at high temperatures for extended periods, affecting the lifespan of the TFT driver and the stability of the supplied current. Summary of the Invention

[0005] This application provides a display panel and its manufacturing method, as well as a display device, which can solve the technical problem of poor heat dissipation capacity of light-emitting unit display panels in the prior art.

[0006] This application provides a display panel including a substrate with heat-conducting particles distributed inside it; a driving circuit layer disposed on one side of the substrate; and a light-emitting unit disposed on the side of the driving circuit layer away from the substrate.

[0007] Optionally, in some embodiments of this application, the thermally conductive particles are metal particles, carbon particles, or graphene particles.

[0008] Optionally, in some embodiments of this application, the material of the thermally conductive particles includes at least one of titanium, aluminum, and copper.

[0009] Optionally, in some embodiments of this application, the distance between any two adjacent heat-conducting particles is less than 10 times the size of the heat-conducting particles.

[0010] Optionally, in some embodiments of this application, the region of the substrate corresponding to the light-emitting unit is defined as region A, and the rest as region B, wherein the density of thermally conductive particles in region B is less than the density of thermally conductive particles in region A.

[0011] Optionally, in some embodiments of this application, the display panel further includes an encapsulation layer disposed on the side of the driving circuit layer away from the substrate and covering the light-emitting unit.

[0012] Accordingly, this application also provides a method for manufacturing a display panel, including the following manufacturing steps:

[0013] Provide a substrate;

[0014] A driving circuit layer and a light-emitting unit are sequentially fabricated on the substrate;

[0015] The substrate is flipped over, and thermally conductive particles are injected into the side of the substrate away from the driving circuit layer.

[0016] Optionally, in some embodiments of this application, the thermally conductive particles are implanted using ion implantation doping.

[0017] Optionally, in some embodiments of this application, the number of thermally conductive particles injected into the substrate corresponding to the light-emitting unit region is greater than the number of thermally conductive particles injected into other regions of the substrate.

[0018] Accordingly, this application also provides a display device including the aforementioned display panel.

[0019] The beneficial effect of the embodiments of this application is that the display panel and its preparation method and display device in the embodiments of this application inject heat-conducting particles inside the substrate. Without the need to add an additional heat-conducting layer, the heat generated by the light-emitting unit is quickly transferred to the outside of the substrate through the heat-conducting particles, thereby avoiding the aging and failure of the driving circuit layer caused by the accumulation of heat on the driving circuit layer. The density of heat-conducting particles in the region corresponding to the light-emitting unit inside the substrate is the largest, thereby maximizing the heat conduction efficiency of the substrate. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure after the encapsulation layer provided in the embodiments of this application has been fabricated;

[0023] Figure 3 This is a schematic diagram of the structure when injecting thermally conductive particles according to an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] Substrate 100; Driving circuit layer 200;

[0026] Light-emitting unit 300; Encapsulation layer 400;

[0027] 500 thermally conductive particles; 310 pixel units. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0029] This application provides a display panel, a method for manufacturing the same, and a display device. The following provides a detailed description.

[0030] Example

[0031] This embodiment provides a display panel and a display device of the present invention. The main technical features and all technical effects of the display device are concentrated on the display panel. Other components of the display device will not be described in detail in this embodiment.

[0032] Specifically, such as Figure 1 As shown, the display panel includes a substrate 100, a driving circuit layer 200, a light-emitting unit 300, an encapsulation layer 400, and thermally conductive particles 500.

[0033] The substrate 100 is a flexible substrate made of polyimide material, which is used to support the film layer to be prepared later, and at the same time can prevent the intrusion of external moisture.

[0034] A driving circuit layer 200 is disposed on one side surface of the substrate 100. Specifically, the driving circuit layer 200 includes several driving circuit structures and several pads, wherein the pads are exposed on the side surface of the driving circuit layer 200 away from the substrate 100 for connection with the light-emitting unit 300, and the driving circuit structures are used to transmit electrical signals to the pads. In another preferred embodiment of the present invention, the driving circuit structure is a thin-film transistor unit, which can actively and separately drive each light-emitting unit 300 to increase the brightness contrast of the display panel.

[0035] The light-emitting unit 300 is disposed on the surface of the driving circuit layer 200 away from the substrate 100. In this embodiment, the light-emitting unit 300 is a sub-millimeter light-emitting diode (Mini-LED), and its array is distributed on the driving circuit layer 200. Each light-emitting unit 300 is correspondingly soldered to a pad. In this embodiment, a group of light-emitting units 300 is correspondingly soldered on each pad. Each group of light-emitting units 300 includes a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit. Each group of light-emitting units 300 is a pixel unit 310. There is a gap between two adjacent pixel units 310.

[0036] The encapsulation layer 400 is located on the side of the driving circuit layer 200 away from the substrate 100. The encapsulation layer 400 is a transparent encapsulation material used to encapsulate the light-emitting unit 300 and prevent external moisture from entering the interior of the light-emitting unit 300, thereby causing the light-emitting unit 300 to fail.

[0037] When the light-emitting unit 300 emits light, it releases a large amount of heat when converting electrical energy into light energy. This heat needs to be dissipated as quickly as possible to prevent heat accumulation that could cause the driving circuit layer 200 below the light-emitting unit 300 to age and fail rapidly under high-temperature conditions. In this embodiment, several thermally conductive particles 500 are doped inside the substrate 100. The thermally conductive particles 500 are carbon particles, graphene particles, or metal particles. The metal particles include at least one of titanium, copper, and aluminum, which helps to further improve the thermal conductivity of the substrate 100 and enhance the heat transfer efficiency.

[0038] In this embodiment, the heat-conducting particles 500 are dispersed inside the substrate 100. Each heat-conducting particle 500 forms a heat-conducting path with its adjacent heat-conducting particles 500. The heat generated by the light-emitting unit 300 is quickly transferred to the outside of the substrate 100 through the heat-conducting path, thereby effectively reducing the time when heat accumulates in the driving circuit layer 200 and avoiding the failure of the driving circuit layer 200 due to excessive temperature.

[0039] Since the heat of the light-emitting unit 300 is mainly concentrated at the bottom of the light-emitting unit 300 and transferred towards the substrate 100, in this embodiment, the density of heat-conducting particles 500 in the area of ​​the substrate 100 corresponding to the light-emitting unit 300 is greater than the density of heat-conducting particles 500 in the other areas of the substrate 100. This results in the most heat conduction paths directly below the light-emitting unit 300, maximizing the heat conduction efficiency of the heat-conducting particles 500 and improving the heat conduction capability of the substrate 100.

[0040] To better explain the present invention, this embodiment also provides a method for preparing the above-mentioned display panel, the specific steps of which are as follows:

[0041] S1) as Figure 2 As shown, a substrate 100 is provided. The substrate 100 is a flexible substrate. A driving circuit layer 200, a light-emitting unit 300, and an encapsulation layer 400 are sequentially fabricated on the substrate 100.

[0042] S2) as Figure 3 As shown, the substrate 100 is flipped so that the side of the substrate 100 away from the encapsulation layer 400 faces upward. Thermally conductive particles 500 are implanted inside the substrate 100. In this embodiment, the thermally conductive particles 500 are implanted by ion implantation doping. The thermally conductive particles 500 are carbon particles, graphene particles, or metal particles. The number of thermally conductive particles 500 implanted in the region of the substrate 100 corresponding to the light-emitting unit 300 is greater than the number of thermally conductive particles 500 implanted in other regions of the substrate 100.

[0043] The beneficial effect of this embodiment is that the display panel and its preparation method and display device in this embodiment inject heat-conducting particles inside the substrate. Without the need to add an additional heat-conducting layer, the heat generated by the light-emitting unit is quickly transferred to the outside of the substrate through the heat-conducting particles, thereby avoiding the aging and failure of the driving circuit layer caused by the accumulation of heat on the driving circuit layer. The density of heat-conducting particles in the area corresponding to the light-emitting unit inside the substrate is the largest, thereby maximizing the heat conduction efficiency of the substrate.

[0044] The above provides a detailed description of a display panel, its preparation method, and the display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, include A substrate having thermally conductive particles distributed inside it is a flexible substrate made of polyimide. The thermally conductive particles are at least one of metal particles, carbon particles, and graphene particles, and the thermally conductive particles are implanted into the substrate by ion implantation doping. A driving circuit layer is disposed on one side of the substrate and in direct contact with the substrate. The driving circuit layer includes several driving circuit structures and several pads. The pads are exposed on the surface of the driving circuit layer away from the substrate. The driving circuit structure is a thin film transistor unit used to transmit electrical signals to the pads. A light-emitting unit is disposed on the side of the driving circuit layer away from the substrate, and the light-emitting unit is connected to the pad; The region of the substrate corresponding to the light-emitting unit is defined as region A, and the rest is defined as region B. The density of the heat-conducting particles in region B is less than the density of the heat-conducting particles in region A. Each heat-conducting particle forms a heat-conducting path with its adjacent heat-conducting particles. The number of heat-conducting paths in region A is greater than the number of heat-conducting paths in region B. The heat generated by the light-emitting unit is transferred to the outside of the substrate through the heat-conducting paths. The distance between any two adjacent heat-conducting particles is less than 10 times the size of the heat-conducting particles.

2. The display panel according to claim 1, characterized in that, The material of the heat-conducting particles includes at least one of titanium, aluminum, and copper.

3. The display panel according to claim 1, characterized in that, Also includes An encapsulation layer is disposed on the side of the driving circuit layer away from the substrate and covers the light-emitting unit.

4. A method for manufacturing a display panel, characterized in that, The preparation steps include the following: A substrate is provided, the substrate being a flexible substrate, and the substrate being made of polyimide; A driving circuit layer and a light-emitting unit are sequentially fabricated on the substrate. The driving circuit layer includes several driving circuit structures and several pads. The pads are exposed on the side of the driving circuit layer away from the substrate and are used to connect with the light-emitting unit. The driving circuit structure is a thin-film transistor unit used to transmit electrical signals to the pads. The substrate is flipped over, and thermally conductive particles are implanted into the side of the substrate away from the driving circuit layer by ion implantation doping. The number of thermally conductive particles implanted in the substrate corresponding to the light-emitting unit region is greater than the number of thermally conductive particles implanted in other regions of the substrate. Each thermally conductive particle forms a thermally conductive path with its adjacent thermally conductive particles. The number of thermally conductive paths in the substrate corresponding to the light-emitting unit region is greater than the number of thermally conductive paths in other regions of the substrate. The heat generated by the light-emitting unit is transferred to the outside of the substrate through the thermally conductive path. The thermally conductive particles are at least one of metal particles, carbon particles, and graphene particles. The distance between any two adjacent thermally conductive particles is less than 10 times the size of the thermally conductive particles.

5. A display device, characterized in that, The display panel includes any one of claims 1 to 3.

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