Method for manufacturing electronic component, and method for manufacturing display device

Abstract

The present invention aims to provide a method for manufacturing an electronic component, which is a method for transferring a chip component from a transfer laminate on a transfer substrate having a transfer layer having a chip component disposed thereon to a driving circuit substrate. This manufacturing method can reduce adhesive layer residue and transfer the chip component with a good yield. Furthermore, the present invention aims to provide a method for manufacturing a display device, which includes the method for manufacturing this electronic component. The present invention relates to a method for manufacturing an electronic component, comprising: a step (1) of bringing a transfer laminate having a chip component disposed on a transfer substrate having a transfer layer containing a gas-generating agent close to a driving circuit substrate and aligning the chip component with the driving circuit substrate; and a step (2) of applying stimulation to the adhesive layer containing the gas-generating agent to transfer the chip component from the transfer laminate to the driving circuit substrate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an electronic component, which involves transferring a chip component from a transfer laminate on a transfer substrate having an adhesive layer to a driving circuit substrate. This method reduces adhesive layer residue and enables the transfer of chip components with a good yield. Additionally, this invention relates to a method for manufacturing a display device, which includes the method for manufacturing this electronic component. Background Technology

[0002] A micro LED display is a display device in which each pixel is a tiny light-emitting diode (LED) chip that emits light to display an image. Micro LED displays are attracting attention as a next-generation display device because of their high contrast, fast response time, and the fact that they do not require color filters used in LCDs and OLEDs, allowing for thinner designs.

[0003] In a micro LED display, multiple micro LED chips are planarly and densely arranged. The manufacturing process of such a micro LED display involves transferring the micro LED chips from a transfer laminate on a transfer substrate having an adhesive layer to a driver circuit substrate, and then electrically connecting them.

[0004] In the transfer process of micro LED chips, the micro LED chips are peeled off from the transfer laminate and transferred with the LED chip-arranged surface of the transfer laminate facing the electrode-formed surface of the driving circuit substrate.

[0005] As a method for peeling micro-LED chips from a transfer laminate, one known method is to peel the micro-LED chips by focusing a laser beam onto an adhesive layer from the back side of the substrate of the transfer laminate (e.g., Patent Document 1). Another known method involves thermally pressing a transfer laminate to a drive circuit substrate using an adhesive layer containing thermally expandable particles or microcapsules, causing the thermally expandable particles or microcapsules to expand thermally, thereby deforming the adhesive layer, reducing the bonding area, and peeling off the micro-LED chips (e.g., Patent Documents 2 and 3).

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2019-138949

[0009] Patent Document 2: Japanese Patent Application Publication No. 2019-15899

[0010] Patent Document 3: Japanese Patent Application Publication No. 2003-7986 Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] However, in methods such as laser irradiation as described in Patent Documents 1-3, or methods using thermally expandable particles or microcapsules, there is a problem that adhesive layer residue adheres to the micro-LED chip. Furthermore, in methods using thermally expandable particles or microcapsules, since the micro-LED chip is peeled off by deformation of the adhesive layer, it is difficult to transfer the micro-LED chip onto the driver circuit board with a good yield.

[0013] The object of the present invention is to provide a method for manufacturing an electronic component, which is a method for transferring a chip component from a transfer laminate on a transfer substrate having an adhesive layer to a driving circuit substrate. This manufacturing method reduces adhesive layer residue and enables the transfer of chip components with a good yield. Furthermore, the object of the present invention is to provide a method for manufacturing a display device, which includes the method for manufacturing this electronic component.

[0014] means for solving problems

[0015] The present invention relates to a method for manufacturing an electronic component, the method comprising: a step (1) of placing a transfer laminate on a transfer substrate having a chip component disposed on a transfer substrate having a gas-generating adhesive layer, bringing the chip component close to a drive circuit substrate and aligning the chip component with the drive circuit substrate; and a step (2) of applying stimulation to the adhesive layer having a gas-generating adhesive layer to transfer the chip component from the transfer laminate to the drive circuit substrate.

[0016] The present invention will now be described in detail.

[0017] The inventors investigated the following: In a method for manufacturing electronic components that transfers chip components onto a driving circuit board by disposing of a transfer laminate containing a chip component on a transfer substrate having an adhesive layer, a gas-generating agent-containing adhesive layer is used. Stimulation is applied to the adhesive layer containing the gas-generating agent, thereby peeling the chip component from the transfer laminate and transferring it. The inventors discovered that this method reduces adhesive layer residue and enables the transfer of chip components with a good yield, thus completing the present invention.

[0018] exist Figure 1 ,6 Figure 7 shows an example of a process in the manufacturing method of the electronic component of the present invention. Hereinafter, reference will be made to... Figure 1 , 6 Section 7 describes the manufacturing method of the electronic component of the present invention.

[0019] In the manufacturing method of the electronic component of the present invention, the first step (1) is performed: a transfer laminate on which a chip component is disposed on a transfer substrate having an adhesive layer containing a gas generating agent is brought close to a drive circuit substrate, and the positions of the chip component and the drive circuit substrate are aligned.

[0020] exist Figure 1 A diagram is shown illustrating an example of step (1) in a method for manufacturing an electronic component according to the present invention. In step (1) described above, as... Figure 1 As shown, the transfer laminate 6, on which the chip component 1 is disposed, is brought close to the drive circuit substrate 7, so that the positions of the chip component 1 and the drive circuit substrate 7 are aligned. Figure 1 In the chip component 1 and the driving circuit substrate 7, there are electrodes 1a and 7a, respectively.

[0021] It should be noted that, in Figure 1 In the present invention, the transfer substrate 9 is a laminate consisting of a support 5 and a double-sided adhesive tape 4 having at least an adhesive layer containing a gas-generating agent. However, in the manufacturing method of the electronic component of the present invention, the transfer substrate is not limited to such a configuration.

[0022] The aforementioned transfer laminate has a chip component disposed on a transfer substrate having an adhesive layer containing a gas generating agent.

[0023] The aforementioned chip components are not particularly limited; examples include micro LED chips and optical chips for image sensors. It should be noted that the aforementioned chip components are micro LED chips. Furthermore, the manufacturing method of a display device that includes the manufacturing method of the electronic components of this invention is also part of this invention.

[0024] In the above-mentioned transfer laminate, the chip component is disposed on the adhesive layer containing the gas generating agent of the above-mentioned transfer substrate.

[0025] In the manufacturing method of the electronic component of the present invention, by using the adhesive layer containing the gas generating agent and by applying stimulation to the adhesive layer containing the gas generating agent in the following step (2), the chip component is peeled off from the transfer substrate, thereby reducing the residue of the adhesive layer containing the gas generating agent and transferring the chip component with a good yield.

[0026] The transfer substrate described above is not particularly limited as long as it has an adhesive layer containing a gas-generating agent. For example, it can be a single-sided adhesive tape with an adhesive layer containing a gas-generating agent laminated on one side of a substrate. That is, without a support or the like, such a single-sided adhesive tape itself is the transfer substrate described above.

[0027] In addition, the aforementioned transfer substrate, such as Figure 1 As shown, the substrate can be a laminate consisting of a support and a double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent. From a manufacturing processability perspective, the transfer substrate described above is preferably a laminate consisting of a support and a double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent. The support is not particularly limited, and examples include glass substrates, metal substrates, and organic substrates.

[0028] The aforementioned double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent is not particularly limited, but preferably, in addition to the adhesive layer containing a gas-generating agent (chip component side adhesive layer), it further has a support side adhesive layer. That is, the aforementioned double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent is preferably a double-sided adhesive tape having both an adhesive layer containing a gas-generating agent and a support side adhesive layer.

[0029] exist Figure 2 The diagram shows a cross-sectional view schematically illustrating an example of a double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent, used in a method for manufacturing an electronic component according to the present invention.

[0030] Figure 2 The double-sided adhesive tape 4 shown is a double-sided adhesive tape that has a layer of adhesive containing a gas generating agent (chip component side adhesive layer) 4b and a support side adhesive layer 4a stacked on it, and does not have a substrate. Although not shown, it is used to place a chip component on the adhesive layer containing the gas generating agent (chip component side adhesive layer) 4b and to attach the support side adhesive layer 4a to a support.

[0031] When the transfer substrate described above includes the aforementioned support and a double-sided adhesive tape having the aforementioned adhesive layer containing a gas-generating agent and an adhesive layer on the support side, the double-sided adhesive tape having the aforementioned adhesive layer containing a gas-generating agent and an adhesive layer on the support side preferably satisfies the following points: that is, when the peel force of the adhesive layer containing the gas-generating agent in the 180° direction relative to the SUS board is set to Fb and the peel force of the adhesive layer on the support side in the 180° direction relative to the SUS board is set to Fa, it is preferable that Fa > Fb and Fa is 1 N / inch or more.

[0032] By ensuring that Fa > Fb and Fa is 1 N / inch or more, peeling between the support and the double-sided adhesive tape can be suppressed, and the chip component can be easily peeled off. This allows for the transfer of the chip component with a higher yield.

[0033] The preferred lower limit for Fa is 2 N / inch, and the even more preferred lower limit is 5 N / inch. The upper limit for Fa is not specifically limited, but is practically around 50 N / inch.

[0034] The aforementioned Fb is not particularly limited, but a preferred upper limit is 0.3 N / inch. If the aforementioned Fb is 0.3 N / inch or less, the aforementioned chip component can be easily peeled off, and the aforementioned chip component can be transferred with a higher yield. A more preferred upper limit for the aforementioned Fb is 0.2 N / inch, and a further preferred upper limit is 0.1 N / inch. The aforementioned lower limit for Fb is not particularly limited, but from the viewpoints of suppressing unintentional detachment, peeling off the aforementioned chip component by gas generation without residue, and reducing the peeling stress applied to the aforementioned chip component, a preferred lower limit is 0.02 N / inch.

[0035] It should be noted that when the adhesive layer containing the gas-generating agent and the adhesive layer on the support side are curable adhesive layers, Fb and Fa refer to the peel force after curing by light irradiation or the like. As a method for curing the adhesive layer containing the gas-generating agent and the adhesive layer on the support side by light irradiation, for example, one could use an ultra-high pressure mercury ultraviolet irradiator to achieve a cumulative irradiation dose of 2000 mJ / cm². 2 This method involves irradiating the adhesive layer with 365nm ultraviolet light. The irradiation intensity is not particularly limited, but is preferably 50–500 mW / cm². 2 .

[0036] For example, a method for measuring Fb and Fa can be described as follows: using an Autograph (manufactured by Shimadzu Corporation), in an environment with a temperature of 23°C and a relative humidity of 50%, double-sided adhesive tape is peeled off along a 180° direction at a tensile speed of 300 mm / min, and the peel force is measured.

[0037] By incorporating the gas-generating agent into the adhesive layer and stimulating it to generate gas, a gas-based gap is created between the adhesive layer and the chip component, allowing for easy peeling of the chip component. As a result, residue in the adhesive layer is reduced, and the chip component is transferred with a good yield. Furthermore, in a more preferred embodiment, by stimulating the adhesive layer to generate gas, the chip component peels off from the adhesive layer, allowing for transfer under conditions where peel stress is not easily applied to the chip component or by natural drop.

[0038] The gas generating agent described above is not particularly limited, but is preferably a gas generating agent that generates gas through stimulation by light, heat, electromagnetic waves, or electron beams. Examples of light include ultraviolet light and lasers. Among these, a gas generating agent that generates gas through light is preferred.

[0039] There are no particular limitations on the gas-generating agents that produce gas through the above-mentioned stimulation; azo compounds, azido compounds, carboxylic acid compounds, or tetrazolium compounds may be used appropriately.

[0040] Examples of the aforementioned azo compounds include: 2,2'-azobis-(N-butyl-2-methylpropionamide), 2,2'-azobis{2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide}, 2,2'-azobis{2-methyl-N-[2-(1-hydroxybutyl)]propionamide}, 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propionamide], 2-azobis[N-(2-propenyl)-2-methylpropionamide], 2,2 2,2'-Azobis(N-butyl-2-methylpropamide), 2,2'-Azobis(N-cyclohexyl-2-methylpropamide), 2,2'-Azobis[2-(5-methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'-Azobis[2-(2-imidazolin-2-yl)propane] dihydrochloride, 2,2'-Azobis[2-(2-imidazolin-2-yl)propane] disulfide dihydrate (Japanese: ジサルフエイトジハイドロレート), 2,2'-Azobis[2-(2-imidazolin-2-yl)propane] disulfide dihydrate (Japanese: ジサルフエイトジハイドロレート), 2,2'-Azobis[2-(5-methyl- ...butyl-2-methylpropamide] dihydrate, 2,2'-Azobis[2-butyl-2-methylpropane] dihydrate, 2,2'-Azobis[2-butyl-2-methylpropane] dihydrate, 2,2'-Azobis[2-butyl-2-methylpropane] dihydrate, 2,2'-Azobis[2-butyl-2-methylpropane] dihydrate, 2,2' Nizobis[2-(3,4,5,6-tetrahydropyrimidin-2-yl)propane] dihydrochloride, 2,2'-azobis{2-[1-(2-hydroxyethyl)-2-imidazolin-2-yl]propane} dihydrochloride, 2,2'-azobis[2-(2-imidazolin-2-yl)propane], 2,2'-azobis(2-methylpropane) hydrochloride, 2,2'-azobis(2-aminopropane) dihydrochloride, 2,2'-azobis[N-(2-carboxylacyl)-2-methylpropane] 2,2'-Azobis{2-[N-(2-carboxyethyl)amidine]propane}, 2,2'-Azobis(2-methylpropamidooxime), 2,2'-Azobis(2-methylpropionic acid) dimethyl ester, 2,2'-Azobisisobutyrate dimethyl ester, 4,4'-Azobis(4-cyanocarbonate) (Japanese: 4,4'-Azobis(4-Shiancarolbonitsukuashitsudo)), 4,4'-Azobis(4-cyanopentanoic acid), 2,2'-Azobis(2,4,4-trimethylpentane), etc.

[0041] Examples of the aforementioned azide compounds include, for example, 3-azidomethyl-3-methyloxetane, terephthalic acid dimethyl azide, tert-butylbenzoyl azide, and polymers containing an azide group, such as glycidyl azide polymers obtained by ring-opening polymerization of 3-azidomethyl-3-methyloxetane.

[0042] Examples of the aforementioned carboxylic acid compounds include phenylacetic acid, biphenylacetic acid, triphenylacetic acid, or their salts.

[0043] Examples of the aforementioned tetrazolium compounds include, for example, 1H-tetrazole, 5-phenyl-1H-tetrazole, 5,5-azobis-1H-tetrazole or their salts.

[0044] The content of the gas-generating agent is not particularly limited, but the preferred lower limit is 1 part by weight relative to 100 parts by weight of the adhesive constituting the adhesive layer containing the gas-generating agent, and the preferred upper limit is 100 parts by weight. If the content of the gas-generating agent is 1 part by weight or more, the adhesive layer containing the gas-generating agent has sufficient gas-generating properties, which can further reduce adhesive layer residue and transfer the chip component with a good yield. If the content of the gas-generating agent is 100 parts by weight or less, the adhesive layer containing the gas-generating agent has sufficient adhesiveness and can suppress unintentional detachment of the chip component. The more preferred lower limit of the content of the gas-generating agent is 3 parts by weight, and the more preferred upper limit is 50 parts by weight.

[0045] The adhesive constituting the adhesive layer containing the gas generator is not particularly limited and can be any non-curing or curing adhesive. Specifically, examples include: rubber-based adhesives, acrylic adhesives, vinyl alkyl ether-based adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, and styrene-diene block copolymer adhesives. Among these, acrylic adhesives are preferred for ease of adjusting adhesion, and acrylic curing adhesives are more preferred.

[0046] Examples of curable adhesives include photocurable adhesives that are crosslinked and cured by light irradiation, and thermocurable adhesives that are crosslinked and cured by heating. From the perspective of curing by light irradiation before or after step (b) described later, thereby increasing the storage modulus and further reducing residue in the adhesive layer containing the gas-generating agent, resulting in a good yield for transferring the chip components, photocurable adhesives are preferred, and ultraviolet-curable adhesives are more preferred. That is, the adhesive layer containing the gas-generating agent is preferably a photocurable adhesive layer, and more preferably an ultraviolet-curable adhesive layer.

[0047] Examples of photocurable adhesives include, for example, adhesives that use a polymer as the main component and contain a photopolymerization initiator. Examples of thermocurable adhesives include, for example, adhesives that use a polymer as the main component and contain a thermopolymerization initiator.

[0048] The aforementioned polymeric polymer can be obtained, for example, by pre-synthesizing a (meth)acrylic polymer having functional groups within the molecule (hereinafter referred to as a functionalized (meth)acrylic polymer), and then reacting a compound having functional groups that react with the aforementioned functional groups within the molecule and unsaturated bonds with free radical polymerizability (hereinafter referred to as a functionalized unsaturated compound).

[0049] The aforementioned functionalized (meth)acrylic polymers can be obtained, for example, by copolymerizing alkyl acrylates and / or alkyl methacrylates with the alkyl group typically having a carbon number in the range of 2 to 18, functionalized monomers, and other modifying monomers that can copolymerize with them as needed.

[0050] The weight-average molecular weight of the above-mentioned functional group (meth)acrylic polymers is not particularly limited, but is usually around 200,000 to 2,000,000.

[0051] It should be noted that the weight-average molecular weight can be determined using gel permeation chromatography. For example, an HSP gel HRMB-M 6.0×150mm column can be used as the chromatographic column, THF can be used as the eluent, the determination can be performed at 40°C, and the weight-average molecular weight can be determined by polystyrene standards.

[0052] Examples of the aforementioned functionalized monomers include: carboxyl-containing monomers such as acrylic acid and methacrylic acid; hydroxyl-containing monomers such as hydroxyl ethyl acrylate and hydroxyl ethyl methacrylate; and epoxy-containing monomers such as glycidyl acrylate and glycidyl methacrylate. Additionally, examples of the aforementioned functionalized monomers include isocyanate-containing monomers such as ethyl isocyanate and ethyl methacrylate; and amino-containing monomers such as amino ethyl acrylate and amino ethyl methacrylate.

[0053] Other monomers that can be copolymerized include, for example, vinyl acetate, acrylonitrile, styrene, and other monomers commonly used in (meth)acrylic polymers.

[0054] To obtain the aforementioned functionalized (meth)acrylic acid polymer, the starting monomers are subjected to a free radical reaction in the presence of a polymerization initiator. As a method for subjecting the starting monomers to a free radical reaction, i.e., as a polymerization method, existing known methods can be used, such as solution polymerization (boiling point polymerization or isothermal polymerization), emulsion polymerization, suspension polymerization, bulk polymerization, etc.

[0055] The polymerization initiator used in the free radical reaction to obtain the above-mentioned functionalized (meth)acrylic acid polymer is not particularly limited, and examples include: organic peroxides, azo compounds, etc. Examples of organic peroxides include: 1,1-bis(tert-hexylperoxide)-3,3,5-trimethylcyclohexane, tert-hexyl peroxypentanoate, tert-butyl peroxypentanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxide)hexane, tert-hexyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxyisobutyrate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxylaurate, etc. Examples of azo compounds include: azobisisobutyronitrile, azobiscyclohexanenitrile, etc. These polymerization initiators can be used alone or in combination of two or more.

[0056] As the unsaturated compound containing a functional group that reacts with the aforementioned functionalized (meth)acrylic polymer, a compound identical to the aforementioned functionalized monomer can be used, depending on the functional group of the aforementioned functionalized (meth)acrylic polymer. For example, if the functional group of the aforementioned functionalized (meth)acrylic polymer is a carboxyl group, an epoxy-containing monomer or an isocyanate-containing monomer can be used. If the functional group of the aforementioned functionalized (meth)acrylic polymer is a hydroxyl group, an isocyanate-containing monomer can be used. If the functional group of the aforementioned functionalized (meth)acrylic polymer is an epoxy group, a carboxyl-containing monomer or an amide-containing monomer such as acrylamide can be used. If the functional group of the aforementioned functionalized (meth)acrylic polymer is an amino group, an epoxy-containing monomer can be used.

[0057] Examples of photopolymerization initiators contained in the aforementioned photocurable adhesives include substances activated by irradiation with light of wavelengths from 250 to 800 nm. Examples of such photopolymerization initiators include: acetophenone derivatives such as methoxyacetophenone, acetophenone propyl ether, acetophenone isobutyl ether, benzyl dimethyl ketal, acetophenone diethyl ketal, and phosphine oxide derivatives. Other examples include: bis(n-5-cyclopentadienyl)dicenoctane derivatives, benzophenone, miconazole, chlorothioxanone, dodecylthioxanone, dimethylthioxanone, diethylthioxanone, α-hydroxycyclohexylphenyl ketone, and 2-hydroxymethylphenylpropane. These photopolymerization initiators can be used alone or in combination of two or more.

[0058] Examples of thermal polymerization initiators contained in the aforementioned thermosetting adhesives include substances that decompose upon heating to generate active free radicals that initiate polymerization and curing. Specifically, examples include: dicumyl peroxide, di-tert-butyl peroxide, tert-butyl peroxide, tert-butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, p-monane hydroperoxide, and di-tert-butyl peroxide.

[0059] There are no particular limitations on the commercially available thermal polymerization initiators mentioned above. Examples include Perbutyl D, Perbutyl H, Perbutyl P, and Perpenta H (all manufactured by Nippon Yusen Co., Ltd.). These thermal polymerization initiators can be used alone or in combination of two or more.

[0060] The aforementioned adhesive layer containing a gas-generating agent may further contain a multifunctional oligomer or monomer with free radical polymerizability. By containing a multifunctional oligomer or monomer with free radical polymerizability, the photocurability and thermocurability of the aforementioned adhesive layer containing a gas-generating agent are improved.

[0061] The aforementioned multifunctional oligomers or monomers are not particularly limited, but a weight-average molecular weight of 10,000 or less is preferred. From the perspective of more efficient three-dimensional networking of the aforementioned adhesive layer containing a gas-generating agent based on light irradiation or heating, it is preferable that the aforementioned multifunctional oligomers or monomers have a weight-average molecular weight of 5,000 or less and have 2 to 20 unsaturated bonds with free radical polymerization within the molecule.

[0062] Examples of the aforementioned multifunctional oligomers or monomers include: trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, and their methacrylates. Other examples of the aforementioned multifunctional oligomers or monomers include: 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylates, and their methacrylates. These multifunctional oligomers or monomers can be used alone or in combination of two or more.

[0063] The aforementioned adhesive layer containing a gas-generating agent may further contain inorganic fillers such as fumed silica. By including inorganic fillers, the cohesiveness of the aforementioned adhesive layer containing a gas-generating agent is improved, enabling it to adhere to the substrate with sufficient adhesive force and to fully fix the substrate.

[0064] The adhesive layer containing the gas-generating agent preferably contains a crosslinking agent. By containing a crosslinking agent, the cohesiveness of the adhesive layer containing the gas-generating agent is improved, enabling it to adhere to the substrate with sufficient adhesive force and to fully fix the substrate.

[0065] The crosslinking agent mentioned above is not particularly limited, and examples include: isocyanate-based crosslinking agents, epoxy-based crosslinking agents, aziridine-based crosslinking agents, and metal chelate-based crosslinking agents. Among these, isocyanate-based crosslinking agents are preferred from the perspective of further improving adhesion.

[0066] Relative to 100 parts by weight of the adhesive constituting the adhesive layer containing the gas generating agent, the content of the crosslinking agent is preferably 0.01 parts by weight or more and 20 parts by weight or less. By keeping the content of the crosslinking agent within the above range, the adhesive can be moderately crosslinked, thereby improving the adhesive strength. From the viewpoint of further improving the adhesive strength, the more preferred lower limit of the content of the crosslinking agent is 0.05 parts by weight, the more preferred upper limit is 15 parts by weight, the more preferred lower limit is 0.1 parts by weight, and the more preferred upper limit is 10 parts by weight.

[0067] The aforementioned adhesive layer containing a gas-generating agent may contain known additives such as plasticizers, resins, surfactants, waxes, and particulate fillers. These additives may be used alone or in combination of two or more.

[0068] The gel fraction of the adhesive layer containing the gas-generating agent is preferably 20% by weight or more and less than 95% by weight. By keeping the gel fraction within the above range, it is possible to adhere to the substrate with sufficient adhesive force and to fully fix the substrate. From the viewpoint of achieving good adhesion, the gel fraction of the adhesive layer is more preferably 30% by weight or more, and more preferably 90% by weight or less.

[0069] It should be noted that when the adhesive layer containing the gas generating agent is a curing adhesive layer, the gel fraction mentioned above refers to the gel fraction before curing by light irradiation or the like.

[0070] The storage modulus of the adhesive layer containing the gas-generating agent before the application of stimulation is 1.0 × 10⁻⁶. 4 Pa or higher. If the storage modulus before applying the above stimulus is 1.0 × 10⁻⁶ Pa. 4 A pressure of Pa or higher can adequately preserve the chip components and further reduce residue in the adhesive layer containing the gas-generating agent, resulting in a better yield for transferring the chip components. A more preferred lower limit for the storage modulus before applying the above-mentioned stimulus is 5.0 × 10⁻⁶. 4Pa. From the viewpoint of fully preserving the aforementioned chip components and ensuring good separation, the preferred upper limit for the storage modulus before applying the aforementioned stimulus is 5.0 × 10⁻⁶. 7 Pa, more preferably an upper limit of 5.0 × 10 Pa. 6 Pa, with a further preferred upper limit of 1.0 × 10⁻⁶. 6 Pa.

[0071] It should be noted that when the adhesive layer containing the gas generating agent is a curing adhesive layer, the storage modulus before the above-mentioned stimulation is the storage modulus before it is cured by light irradiation or the like and before the stimulation is applied.

[0072] The storage modulus of the adhesive layer containing the gas generating agent before the application of the above-mentioned stimulation can be measured, for example, as follows.

[0073] A test sample containing only the aforementioned adhesive layer of the gas-generating agent was prepared with a thickness of 400 μm. The sample was then measured using a viscoelastic spectrometer (DVA-200, manufactured by IT Measurement & Control Co., Ltd., or equivalent) under shear mode, a heating rate of 10 °C / min, and a frequency of 10 Hz. The storage modulus at 23 °C was taken as the storage modulus before the application of stimulation.

[0074] The thickness of the adhesive layer containing the gas-generating agent is not particularly limited, but is preferably 200 μm or less. If the thickness is 200 μm or less, residue from the adhesive layer containing the gas-generating agent can be further reduced, and the chip component can be transferred. A more preferred upper limit for the thickness is 50 μm, and a more preferably upper limit is 20 μm. The lower limit for the thickness is not particularly limited, but from the viewpoint of maintaining the chip component and ensuring good peeling, a preferred lower limit is 2 μm, and a more preferred lower limit is 5 μm.

[0075] The adhesive constituting the aforementioned support-side adhesive layer is not particularly limited, and the same adhesive as the adhesive constituting the aforementioned adhesive layer containing the gas generator can be used. Among these, an acrylic adhesive is preferred from the perspective of excellent heat resistance and ease of adjusting adhesion.

[0076] As an example of the aforementioned acrylic adhesive, an adhesive with a (meth)acrylic polymer as the main component can be cited. The aforementioned (meth)acrylic polymer can be obtained in the same manner as the aforementioned functionalized (meth)acrylic polymer, for example, by copolymerizing alkyl acrylates and / or alkyl methacrylates with the alkyl group typically having a carbon number in the range of 2 to 18, and further, as needed, other modifying monomers that can copolymerize with them.

[0077] The aforementioned double-sided adhesive tape having at least one adhesive layer containing a gas-generating agent can be a supported type with a substrate or an unsupported type without a substrate.

[0078] Specifically, for example, in the case of a support type with a substrate, it can be a double-sided adhesive tape having the aforementioned adhesive layer containing a gas-generating agent (chip component side adhesive layer) on one side of the substrate and the aforementioned support side adhesive layer on the other side of the substrate. In the case of a supportless type without a substrate, it can be a double-sided adhesive tape formed by laminating the aforementioned adhesive layer containing a gas-generating agent (chip component side adhesive layer) and the aforementioned support side adhesive layer.

[0079] There are no particular limitations on the material of the aforementioned substrate, but heat-resistant materials are preferred. Examples of materials that can be used as the aforementioned substrate include: polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, polybutylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polystyrene, polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, fluoropolymers, liquid crystal polymers, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred from the perspective of excellent heat resistance.

[0080] The thickness of the aforementioned substrate is not particularly limited, but a preferred lower limit is 5 μm, and a preferred upper limit is 188 μm. By keeping the thickness of the substrate within the aforementioned range, a double-sided adhesive tape with moderate stiffness and excellent processability can be produced. A more preferred lower limit for the thickness of the aforementioned substrate is 12 μm, and a more preferred upper limit is 125 μm.

[0081] The method for placing the chip components onto the transfer substrate is not particularly limited. Examples include: directly placing the chip components on the adhesive layer containing the gas-generating agent of the transfer substrate; and transferring the chip components from a temporary laminate in which the chip components are arranged onto the transfer substrate. From a productivity point of view, the method of transferring the chip components from a temporary laminate in which the chip components are arranged onto the transfer substrate is preferred.

[0082] The method for transferring the chip components from a temporary stack to a transfer substrate is not particularly limited, but may include, for example, a method including the following steps (a), (b) and (c).

[0083] That is, firstly, a step (a) is performed to prepare a temporary laminate in which the aforementioned chip components are arranged. Next, a step (b) is performed to attach the surface of the temporary laminate in which the aforementioned chip components are arranged to the adhesive layer containing the gas generating agent on the transfer substrate. Further, a step (c) is performed to peel the temporary substrate constituting the temporary laminate from the aforementioned chip components to obtain a transfer laminate in which the aforementioned chip components are disposed on the transfer substrate.

[0084] In the above process (a), a temporary stack in which the above chip components are arranged is prepared.

[0085] exist Figure 3 The diagram shows a cross-sectional view schematically illustrating an example of a temporary laminate used in a method for manufacturing an electronic component according to the present invention. Figure 3 In the temporary laminate 3 shown, a plurality of chip components 1 with electrodes 1a on their surfaces are arranged on the temporary substrate 2 in such a way that the side with electrodes 1a is in contact with each other.

[0086] The aforementioned chip components are typically manufactured through the following chip component manufacturing process, which includes forming electrodes on the surface while the components are temporarily fixed to a support such as a glass substrate by a temporary fixing adhesive layer. Then, multiple of the manufactured chip components are bonded to a temporary substrate and peeled off from the temporary fixing adhesive layer and the support, thereby arranging them on the temporary substrate.

[0087] The temporary substrate is not particularly limited, and examples include glass substrates, metal substrates, and organic substrates. Preferably, the temporary substrate has an adhesive layer for depositing the chip components onto it. Preferably, the peel force between the adhesive layer for depositing the chip components and the chip components is relatively small.

[0088] Next, in the above-mentioned step (b), the surface of the temporary laminate on which the chip components are arranged is attached to the adhesive layer containing the gas generating agent of the transfer substrate.

[0089] exist Figure 4 The diagram illustrates an example of step (b) in a method for manufacturing an electronic component according to the present invention. In step (b) described above, as... Figure 4 As shown, the side of a temporary laminate on which chip components 1 are arranged on a temporary substrate 2 is bonded to an adhesive layer containing a gas-generating agent on a transfer substrate 9. That is, the back side of the chip components 1 is bonded to the adhesive layer containing a gas-generating agent on the transfer substrate 9.

[0090] It should be noted that, in Figure 4In the present invention, the transfer substrate 9 is a laminate consisting of a support 5 and a double-sided adhesive tape 4 having at least an adhesive layer containing a gas-generating agent. However, in the manufacturing method of the electronic component of the present invention, the transfer substrate is not limited to such a configuration.

[0091] The method of attaching the surface of the temporary laminate on which the chip components are arranged to the adhesive layer containing the gas generating agent of the transfer substrate is not particularly limited, and for example, a flip chip bonding machine (e.g., FC-3000, manufactured by Toray Engineering Co., Ltd., or equivalent) can be used.

[0092] Next, in the above-mentioned step (c), the temporary substrate is peeled off from the chip component to obtain a transfer laminate on which the chip component is disposed on the transfer substrate.

[0093] exist Figure 5 The diagram illustrates an example of process (c) in the manufacturing method of the electronic component of the present invention. In process (c), by peeling the temporary substrate from the chip component, a chip is obtained as described above. Figure 5 The transfer laminate 6 shown has a chip component 1 disposed on a transfer substrate 9.

[0094] There is no particular limitation on the method for separating the temporary substrate from the chip component. For example, the temporary substrate can be peeled off to separate it from the chip component.

[0095] In the above process (1), the transfer laminate thus obtained is brought close to the drive circuit substrate, so that the chip component and the drive circuit substrate are aligned.

[0096] There is no particular limitation on the method for aligning the chip components with the drive circuit board. For example, a flip chip bonding machine (e.g., FC-3000, manufactured by Toray Engineering Co., Ltd., or an equivalent) can be used.

[0097] In the above process (1), the chip component and the driving circuit substrate can be as follows: Figure 1 They can be separated as shown, or they can be connected. From the viewpoint of suppressing damage caused by contact between the chip components and the drive circuit substrate, it is preferable that the chip components be separated from the drive circuit substrate.

[0098] In the manufacturing method of the electronic component of the present invention, after the above-described step (1), a step (2) is performed to stimulate the adhesive layer containing the gas generating agent and transfer the chip component from the transfer laminate to the driving circuit substrate.

[0099] Therefore, the chip component is connected to the driving circuit board.

[0100] The aforementioned driving circuit substrate is not particularly limited. Typically, an adhesive layer is formed on the surface of the driving circuit substrate to achieve connection and conduction with the aforementioned chip component. Preferably, the driving circuit substrate has an anisotropic conductive film and anisotropic conductive adhesive on its surface. In the aforementioned process (2), it is preferable to electrically connect the electrodes on the aforementioned chip component to the electrodes on the aforementioned driving circuit substrate.

[0101] In the above-described step (2), stimulation can be applied to the entire adhesive layer containing the gas-generating agent, or stimulation can be applied to each chip component area of ​​the adhesive layer containing the gas-generating agent to be peeled off. When stimulation is applied to the entire adhesive layer containing the gas-generating agent, it is preferable from the perspective of being able to transfer multiple chip components together. When stimulation is applied to each chip component area of ​​the adhesive layer containing the gas-generating agent to be peeled off, it is preferable from the perspective of selectively transferring only the target chip component.

[0102] It should be noted that when the adhesive layer containing the gas generating agent is a curing adhesive layer, for example, the adhesive layer containing the gas generating agent can be cured by light irradiation or the like, and the adhesive layer containing the gas generating agent can be stimulated at the same time.

[0103] exist Figure 6 The diagram shows an example of step (2) in a method for manufacturing an electronic component according to the present invention. In step (2) described above, for example, as... Figure 6 As shown, by applying stimulation, for example, ultraviolet light to the entire adhesive layer containing a gas-generating agent of the double-sided adhesive tape 4, the chip component 1 is peeled off from the transfer substrate 9 and transferred to the drive circuit substrate 7.

[0104] exist Figure 7 The diagram shows another example of step (2) in the method of manufacturing the electronic component of the present invention. In step (2) described above, for example, as Figure 7 As shown, by applying light 8a, for example, irradiated by light irradiation device 8, to each chip component area to be peeled off of the adhesive layer containing a gas-generating agent of double-sided adhesive tape 4, the chip component 1 is peeled off from the transfer substrate 9 and transferred to the drive circuit substrate 7.

[0105] In the manufacturing method of the electronic component of the present invention, by stimulating the adhesive layer containing the gas generating agent, the chip component is peeled off from the transfer substrate, thereby reducing the residue of the adhesive layer containing the gas generating agent and transferring the chip component with a good yield.

[0106] The stimulation applied to the adhesive layer containing the gas-generating agent is not particularly limited, but is preferably light, heat, electromagnetic waves, or an electron beam. The light is not particularly limited, but is preferably ultraviolet light or a laser. Especially when stimulating the entire adhesive layer containing the gas-generating agent, ultraviolet light is preferred. When stimulating each chip component area of ​​the adhesive layer containing the gas-generating agent to be peeled off, it is preferable to focus and irradiate with a laser or ultraviolet light.

[0107] Invention Effects

[0108] According to the present invention, a method for manufacturing an electronic component can be provided, which involves transferring a chip component from a transfer laminate on a transfer substrate having an adhesive layer to a driving circuit substrate. This method reduces adhesive layer residue and enables the transfer of chip components with a good yield. Furthermore, according to the present invention, a method for manufacturing a display device incorporating this method for manufacturing the electronic component can be provided. Attached Figure Description

[0109] Figure 1 This is a diagram schematically illustrating an example of step (1) in the manufacturing method of the electronic component of the present invention.

[0110] Figure 2 This is a cross-sectional view schematically illustrating an example of a double-sided adhesive tape having at least an adhesive layer containing a gas-generating agent, used in the manufacturing method of the electronic component of the present invention.

[0111] Figure 3 This is a cross-sectional view schematically illustrating an example of a temporary laminate used in the manufacturing method of the electronic component of the present invention.

[0112] Figure 4 This is a diagram schematically illustrating an example of step (b) in the manufacturing method of the electronic component of the present invention.

[0113] Figure 5 This is a schematic diagram illustrating an example of step (c) in the manufacturing method of the electronic component of the present invention.

[0114] Figure 6 This is a diagram schematically illustrating another example of step (2) in the manufacturing method of the electronic component of the present invention.

[0115] Figure 7 This is a diagram schematically illustrating another example of step (2) in the manufacturing method of the electronic component of the present invention. Detailed Implementation

[0116] The present invention will be described in more detail below with reference to specific embodiments, but the present invention is not limited to these embodiments.

[0117] (Synthesis of (meth)acrylic polymer A)

[0118] A reactor equipped with a thermometer, stirrer, and condenser was prepared. 51 parts by weight of 2-ethylhexyl acrylate (an alkyl methacrylate), 37 parts by weight of isobornyl acrylate, 1 part by weight of acrylic acid (a functionalized monomer), 19 parts by weight of hydroxyethyl methacrylate, 0.01 parts by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate were added to the reactor, and the reactor was heated to initiate reflux. Next, 0.01 parts by weight of 1,1-bis(tert-hexylperoxide)-3,3,5-trimethylcyclohexane was added as a polymerization initiator, and polymerization was initiated under reflux. Subsequently, 0.01 parts by weight of 1,1-bis(tert-hexylperoxide)-3,3,5-trimethylcyclohexane were added one hour and two hours after the start of polymerization, respectively. Finally, 0.05 parts by weight of tert-butyl peroxypentanoate was added four hours after the start of polymerization to continue the polymerization reaction. Then, 8 hours after the polymerization started, an ethyl acetate solution of a functional group (meth)acrylic acid polymer with a solid content of 55% by weight and a weight average molecular weight of 600,000 was obtained.

[0119] Relative to 100 parts by weight of the resin solid component containing an ethyl acetate solution of a (meth)acrylic polymer, 12 parts by weight of ethyl 2-isocyanate methacrylate were added to react and a (meth)acrylic polymer A was obtained.

[0120] (Preparation of adhesive solution A, which constitutes the adhesive layer on the chip component side)

[0121] To a resin solids content of 100 parts by weight of the ethyl acetate solution of the obtained (meth)acrylic polymer A, 1.25 parts by weight of crosslinking agent (S-Dine curing agent UA, manufactured by Sekisui Fuller), 1 part by weight of photoinitiator (Omnirad 651, manufactured by Toyota Chemiplas), and 20 parts by weight of gas generator (Vam-110, manufactured by Fujifilm and Koden Pharmaceutical Co., Ltd.) were mixed. Thus, an ethyl acetate solution constituting the adhesive layer on the chip component side was obtained.

[0122] (Preparation of adhesive solution B constituting the adhesive layer on the chip component side)

[0123] An ethyl acetate solution of adhesive constituting the adhesive layer on the chip component side was obtained by mixing 100 parts by weight of resin solids component of an ethyl acetate solution of an acrylic polymer (SK DYNE 1495C, manufactured by Soken Chemical Co., Ltd.) with 2 parts by weight of crosslinking agent (S-Dine curing agent UA, manufactured by Sekisui Fuller Co., Ltd.).

[0124] (Preparation of adhesive solution C constituting the adhesive layer on the support side)

[0125] An ethyl acetate solution constituting the adhesive layer of the support body was obtained by mixing 100 parts by weight of resin solids component of an ethyl acetate solution of an acrylic polymer (SK DYNE 1604N, manufactured by Zongyan Chemical Co., Ltd.) with 1 part by weight of a crosslinking agent (S-Dine curing agent UA, manufactured by Sekisui Fuller Co., Ltd.).

[0126] (Preparation of adhesive solution D constituting the adhesive layer on the support body side)

[0127] An ethyl acetate solution constituting the adhesive layer of the support body is obtained by mixing 100 parts by weight of the resin solids component of an ethyl acetate solution of an acrylic polymer (SK DYNE 1495C, manufactured by Zongyan Chemical Co., Ltd.) with 0.5 parts by weight of a crosslinking agent (S-Dine curing agent UA, manufactured by Sekisui Fuller Co., Ltd.).

[0128] (Example 1)

[0129] (1) Manufacturing of double-sided adhesive tape

[0130] The adhesive solution A, which constitutes the chip component side adhesive layer, was applied to a PET film (NS-50-C, manufactured by Nakamoto Packs) after demolding treatment using a doctor blade, so that the thickness of the dried film was 10 μm, and left to stand at room temperature for 10 minutes. Then, the coating solution was dried by heating at 110°C for 5 minutes in an oven preheated to 110°C, thus obtaining the chip component side adhesive layer.

[0131] Similarly, the adhesive solution C constituting the support-side adhesive layer was applied to a PET film (NS-50-MA, manufactured by Nakamoto Packs) after demolding treatment using a scraper, resulting in a dried film thickness of 10 μm. The film was then allowed to stand at room temperature for 10 minutes. Next, the solution was dried in an oven preheated to 110°C for 5 minutes to obtain the support-side adhesive layer. By bonding the chip component-side adhesive layer to the support-side adhesive layer, a double-sided adhesive tape was obtained.

[0132] (2) Determination of Fa

[0133] The surface of a 1 mm thick SUS board was cleaned with ethanol and thoroughly dried. A pre-cut 25 mm wide and 10 cm long double-sided adhesive strip was peeled from the adhesive layer side of the support, and then rolled back and forth once with a 2 kg roller to attach it to the SUS board, resulting in a laminate. Next, the adhesive layer side of the chip component was peeled off, and a 50 μm thick PET film (Lumirror S10, manufactured by Toray Industries, Inc.) was rolled back and forth once with a 2 kg roller to adhere it to the laminate, obtaining the sample for testing.

[0134] Then, an ultra-high pressure mercury ultraviolet irradiator was used to accumulate an irradiation dose of 2000 mJ / cm². 2 The sample was irradiated with 365 nm ultraviolet light at an intensity of 100 mW / cm². 2 The illuminance was adjusted using an Autograph (manufactured by Shimadzu Corporation). The double-sided adhesive tape was peeled off along a 180° direction at a stretching speed of 300 mm / min in an environment of 23°C and 50% relative humidity, and the peel force Fa was measured. It should be noted that the peel force of the sample before irradiation with ultraviolet light was also measured in the same manner.

[0135] (3) Determination of Fb

[0136] After peeling off the spacer on the adhesive layer side of the double-sided adhesive tape and attaching a 50μm thick PET film (Lumirror S10, manufactured by Toray Industries, Inc.), peel off the spacer on the adhesive layer side of the chip component and attach it to the SUS plate to prepare the sample for measurement. Otherwise, the measurement is performed in the same manner as the Fa measurement described above.

[0137] (4) Determination of storage modulus before ultraviolet irradiation

[0138] A test sample was prepared with an adhesive layer only on the chip component side, with a thickness of 400 μm. For this test sample, measurements were performed using a viscoelastic spectrometer (DVA-200, manufactured by IT Measurement & Control Co., Ltd.) under shear mode, a heating rate of 10 °C / min, and a frequency of 10 Hz. The storage modulus at 23 °C at this point was taken as the storage modulus before the application of stimulation (before curing by UV irradiation and before the application of stimulation).

[0139] (5) Attaching chip components to the support (fabrication of transfer laminates)

[0140] Using a lamination apparatus (ATM-812, manufactured by Takatori), the separator on the adhesive layer side of the support of the double-sided adhesive tape is peeled off, and the double-sided adhesive tape is bonded to the support (quartz glass) to obtain a transfer substrate.

[0141] Then, the separator on the chip component side of the adhesive layer of the double-sided adhesive tape in the transfer substrate is peeled off, and the Si chip (1 cm square, 700 μm thick) is placed on the chip component side adhesive layer using a flip chip bonding machine (FC-3000, manufactured by Toray Engineering Co., Ltd.) to obtain a transfer laminate.

[0142] (6) Transfer of chip components

[0143] As the driving circuit substrate, a substrate with an adhesive layer on its surface (with a peel force of 0.2 N / inch in the 180° direction relative to the SUS board) is used. The chip surface of the transfer laminate is brought into contact with the driving circuit substrate, and otherwise... Figure 1 The same procedure was performed to align the chip components with the driver circuit board. Then, a high-pressure mercury ultraviolet irradiation device (GWSM-300R, manufactured by Takatori) was used to achieve a cumulative irradiation dose of 2000 mJ / cm². 2 The adhesive layer on the chip component side is irradiated with 365nm ultraviolet light from the support side, stimulating the entire adhesive layer to generate gas and simultaneously curing it (full-surface irradiation). The irradiation intensity is 100mW / cm². 2 The illumination was adjusted in a specific manner. After irradiation, the transfer substrate was lifted, and the chip components were transferred.

[0144] (Example 2)

[0145] The thicknesses of the adhesive layer on the chip component side and the adhesive layer on the support side were changed to 25 μm, and the chip component transfer was performed in the same manner as in Example 1.

[0146] (Example 3)

[0147] Using adhesive solution B that forms the adhesive layer on the chip component side, the chip component transfer is performed in the same manner as in Example 1.

[0148] (Example 4)

[0149] The double-sided adhesive tape was manufactured in the same manner as in Example 1. A spot UV irradiation device (LS5, manufactured by Hamamatsu Photonics) was used to concentrate ultraviolet light into a 1cm square instead of irradiating the entire adhesive layer on the chip component side (full-sided irradiation), with an irradiation intensity of 500mW / cm². 2Each chip component area to be peeled off is irradiated for 10 seconds in the manner described in Example 1. Otherwise, the chip component transfer is performed in the same manner as in Example 1.

[0150] (Example 5)

[0151] The chip components were transferred using adhesive solution D, which forms the adhesive layer on the support side, in the same manner as in Example 1.

[0152] <Evaluation>

[0153] For the embodiments, the following methods were used for evaluation. The results are shown in Table 1.

[0154] (1) Evaluation of the yield rate of the transfer printing

[0155] Perform the chip component transfer as described in (6) five times, and mark the case where all five transfers are successful as ○ and the case where even one transfer fails as ×.

[0156] (2) Evaluation of residue

[0157] The transferred chip components of the above (6) were observed using an optical microscope (VHX-500F, manufactured by Keyence) to evaluate the adhesion of residue. For each chip component, ◎ was marked as 1 or less of residual adhesive areas larger than 0.1 mm, ○ was marked as 2 or more but less than 5, and × was marked as 5 or more or as cases where the adhesive was not properly removed and could not be observed.

[0158] (3) Evaluation of the peeling of chip components from double-sided adhesive tape (determination of the number of natural falls).

[0159] The chip surface of the transfer laminate is separated from the driving circuit board by 1 cm. The chip component and the driving circuit board are aligned. Otherwise, the chip component is transferred in the same way as in the example (the chip component transfer in (6) above). Five evaluations were performed to determine the number of times the chip component naturally peeled off (fell) from the adhesive layer on the chip component side after ultraviolet irradiation and was transferred to the driving circuit board (number of drops).

[0160] [Table 1]

[0161]

[0162] Industrial availability

[0163] According to the present invention, a method for manufacturing an electronic component can be provided, which involves transferring a chip component from a transfer laminate on a transfer substrate having an adhesive layer to a driving circuit substrate. This manufacturing method reduces adhesive layer residue and achieves a good yield for transferring the chip component. Furthermore, according to the present invention, a method for manufacturing a display device can be provided, which includes the method for manufacturing this electronic component.

[0164] Explanation of reference numerals in the attached figures

[0165] 1. Chip Components

[0166] 1a electrode

[0167] 2 Temporary substrate

[0168] 3 Temporary laminates

[0169] 4. Double-sided adhesive tape having at least one adhesive layer containing a gas-generating agent.

[0170] 4a Support side adhesive layer

[0171] 4b Adhesive layer containing gas-generating agent (die component side adhesive layer)

[0172] 5. Support structure

[0173] 6. Transfer layer

[0174] 7. Drive circuit board

[0175] 7a electrode

[0176] 8. Light irradiation device

[0177] 8a light

[0178] 9. Transfer substrate

Claims

1. A method for manufacturing an electronic component, the method comprising: The process (1) involves bringing a transfer laminate on a transfer substrate having a gas-generating adhesive layer, on which chip components are disposed, close to a drive circuit substrate, and aligning the positions of the chip components with those of the drive circuit substrate; and The process (2) involves applying stimulation to the adhesive layer containing the gas generating agent to transfer the chip components from the transfer laminate to the driving circuit substrate. The transfer substrate has a support and a double-sided adhesive tape. The double-sided adhesive tape has an adhesive layer containing a gas-generating agent and an adhesive layer on the support side. When the peel force of the adhesive layer containing the gas-generating agent relative to the SUS board in the 180° direction is set as Fb, and the peel force of the adhesive layer on the support side relative to the SUS board in the 180° direction is set as Fa, Fa > Fb. The adhesive layer containing a gas generating agent contains a gas generating agent that generates gas by light and an adhesive, and the adhesive layer containing a gas generating agent has a storage modulus of 1.0 x 104Pa or more before application of the stimulus. 4 Pa or more.

2. The method for manufacturing an electronic component according to claim 1, wherein, In the process (2), the adhesive layer containing the gas generating agent is stimulated as a whole.

3. The method for manufacturing an electronic component according to claim 1, wherein, In the process (2), a stimulus is applied to each chip component area to be peeled off from the adhesive layer containing the gas generating agent.

4. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, In the process (2), the stimulus applied to the adhesive layer containing the gas generating agent is light, heat, electromagnetic waves or electron beam.

5. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, Fa is above 1 N / inch.

6. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The adhesive layer containing the gas generating agent is an ultraviolet-cured adhesive layer.

7. The method for manufacturing an electronic component according to claim 5, wherein, The Fb is below 0.3 N / inch.

8. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The thickness of the adhesive layer containing the gas generating agent is less than 200 μm.

9. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The content of the gas generating agent is more than 1 part by weight and less than 100 parts by weight relative to 100 parts by weight of the adhesive constituting the adhesive layer containing the gas generating agent.

10. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The adhesive constituting the adhesive layer containing the gas generating agent is an acrylic adhesive.

11. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The adhesive layer containing the gas-generating agent contains a crosslinking agent.

12. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The adhesive layer containing the gas generating agent has a gel fraction of 20% by weight or more and less than 95% by weight.

13. The method for manufacturing an electronic component according to claim 1, 2, or 3, wherein, The adhesive that forms the adhesive layer on the side of the support is an acrylic adhesive.

14. A method for manufacturing a display device, comprising the method for manufacturing the electronic component as described in claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 or 13. The chip component is a micro LED chip.

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