Organic equipment and methods for manufacturing organic equipment

Abstract

One aspect of the organic device of this application comprises: at least one electrode; an insulating layer disposed adjacent to the at least one electrode in a top view; and an organic layer continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer, and comprising a polymer of organic material. The organic material comprises a basic molecular backbone and polymerizable functional groups. In the polymer, the organic material is polymerized through the polymerizable functional groups.

Description

Technical Field

[0001] This application relates to organic devices, etc., in which organic thin films are a component. Background Technology

[0002] Organic devices are devices that use organic materials as their constituent elements, such as organic EL (electroluminescence), organic solar cells, or organic camera elements.

[0003] For these organic devices, there are devices that laminate organic thin films between a substrate, an insulating layer, and electrodes. In such organic devices, because electrical connections and circuits need to be formed, the surfaces of the substrate, insulating layer, and electrodes of the organic thin film are not uniform.

[0004] When using printing or coating methods to form films of organic materials, a thin film is formed by coating an ink containing organic material dissolved in a solvent onto a substrate and allowing the solvent to evaporate. In cases where the area and spacing of pixel electrodes are relatively large, such as in organic EL displays used in televisions, it is possible to coat each pixel with an organic thin film separately. However, in organic devices with high-density micropixels, such as organic imaging elements, it is necessary to form the organic thin film by simultaneously covering the micropixel electrodes and the insulating layer separating them.

[0005] As dissolved organic materials, materials in various forms, such as low-molecular-weight materials or high-molecular-weight materials, have been developed. For example, in Patent Document 1 and Non-Patent Document 1, materials used in the blocking layer or photoelectric conversion layer of solar cells are disclosed as polymeric organic materials used in organic devices. Furthermore, for example, in Non-Patent Document 2, materials used in the blocking layer of LEDs (Light Emitting Diodes) are disclosed as polymeric organic materials used in organic devices.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2014-034618

[0009] Non-patent literature

[0010] Non-patent literature 1: Jixian Xu et al., “Crosslinked Remote-Doped Hole-Extracting Contacts Enhance Stability under Accelerated Lifetime Testing in Perovskite Solar Cells”, Advanced Materials, 2016, No. 28, pp. 2807-2815

[0011] Non-patent document 2: Chi-Yen Lin et al., "A thermally cured 9,9-diarylfluorene-based triaryldiamine polymer displaying high hole mobility and remarkable ambient stability" Journal of Material Chemistry, 2009, No. 19, p. 3618-3623 Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] Organic devices incorporating organic thin films require uniformity of device characteristics related to the function of the organic device. Therefore, the objective of this application is to provide organic devices, etc., that can improve the uniformity of device characteristics.

[0014] Methods for solving problems

[0015] One aspect of the organic device of this application comprises: at least one electrode; an insulating layer disposed adjacent to the at least one electrode in a top view; and an organic layer continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer, and comprising a polymer of organic material. The organic material comprises a basic molecular backbone and polymerizable functional groups, wherein the organic material is polymerized through the polymerizable functional groups.

[0016] One aspect of this application discloses a method for manufacturing an organic device comprising: forming a structure having at least one electrode and an insulating layer disposed adjacent to the at least one electrode in a top view, wherein the upper surface of the at least one electrode and the upper surface of the insulating layer are exposed; coating the upper surface of the at least one electrode and the upper surface of the insulating layer with a solution containing an organic material comprising polymeric functional groups; and polymerizing the organic material to continuously deposit an organic layer comprising a polymer of the organic material in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer.

[0017] Invention Effects

[0018] According to this application, the uniformity of equipment characteristics can be improved. Attached Figure Description

[0019] Figure 1 This is a schematic cross-sectional view showing the structure of the organic device in Embodiment 1.

[0020] Figure 2 This is a flowchart illustrating the manufacturing method of the organic device in Embodiment 1.

[0021] Figure 3 This is a schematic cross-sectional view showing the structure of the organic device in Embodiment 2.

[0022] Figure 4 This is a top view showing an example of a planar layout of multiple electrodes according to Embodiment 2.

[0023] Figure 5 This is a schematic cross-sectional view showing the structure of the organic device in Embodiment 3. Detailed Implementation

[0024] (Insights into one of the solutions presented in this application)

[0025] The inventors have discovered that in organic devices, particularly organic devices in which organic films are formed on uneven surfaces where two or more components are exposed, the following problems arise when trying to improve the uniformity of device characteristics.

[0026] In the above-described examples, an organic film is formed on a uniform surface of a single component, and an organic film is not formed to cover an uneven surface that spans two or more components. Furthermore, in the above-described examples, the effect of the organic film formed on the uneven surfaces exposed by two or more components on the organic device is not understood.

[0027] During coating or printing, as the solution obtained from the dissolution of organic materials wets and spreads on the coated surface, or as the volume of the solution obtained from the dissolution of organic materials gradually decreases during drying, the shape and internal structure gradually change in the direction of the decrease in the sum of the solution's internal energy, the external force applied by the process, and the energy of the solid-solution interface. In the case of shapes with a large surface area to volume ratio, such as thin films, the influence of interfacial energy becomes greater.

[0028] When two or more components are exposed on such an uneven surface, the organic film formed thereon is affected by the uneven interfacial energy. In particular, for polymeric materials such as organic materials, the interactions between polymer chains are greater than those of low-molecular-weight organic materials. As a result of the increased viscosity of the solution obtained by dissolving the polymer, the fine structure such as the molecular chain arrangement becomes more susceptible to the influence of the solution flow process.

[0029] On the other hand, in organic imaging devices, which are one type of organic device, the organic thin film formed as part of the pixels is required to have uniform characteristics within the pixel electrode arrangement in order to improve the uniformity of device characteristics. The non-uniform interfacial energy caused by the non-uniform surface formed by the pixel electrodes and the insulating layer separating them, through the flow process of the solution obtained by dissolving the polymer material, causes deviations in the thickness and orientation of the organic thin film. That is, the flow process of the polymer material solution may cause non-uniformity in the orientation and thickness of the polymer material in the organic thin film. Due to these deviations, noise relative to the displayed and captured images becomes more likely to occur in certain areas, reducing the uniformity of device characteristics on the surface where the organic thin film is formed. Furthermore, in the case of low-molecular-weight organic materials, since there are no interactions generated by molecular chains like in polymer materials, the intermolecular interactions of organic materials are small, and the influence of dissimilar material boundaries during the coating process is less. However, after film formation, cracking caused by dissimilar material boundaries may occur in the organic thin film. As a result, non-uniformity of device characteristics may occur.

[0030] This application provides an organic device for forming organic thin films on the exposed surfaces of two or more components, which is an organic device capable of improving the uniformity of device characteristics on the surface where the organic thin film is formed.

[0031] The summary of one aspect of this application is as follows.

[0032] One aspect of the organic device of this application comprises: at least one electrode; an insulating layer disposed adjacent to the at least one electrode in a top view; and an organic layer continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer, and comprising a polymer of organic material. The organic material comprises a basic molecular backbone and polymerizable functional groups. In the polymer, the organic material is polymerized through the polymerizable functional groups.

[0033] Thus, an organic layer containing an organic material, which is a polymer, is formed across the upper surface of a structure where dissimilar materials are adjacent, such as an insulating layer and an electrode. Because the polymer chains of the organic material interact strongly with each other, compared to low-molecular-weight materials, the organic layer is less prone to cracking or other defects caused by the boundaries between dissimilar materials. Therefore, in the organic device of this design, the uniformity of device characteristics is improved on the surface where the organic layer is formed.

[0034] Furthermore, since organic materials contain a basic molecular framework and polymerizable functional groups, it is possible to easily impart functionality to organic layers without combining them with other materials when they contain a functional basic molecular framework.

[0035] Furthermore, for example, the polymer of the aforementioned organic material may also be insoluble relative to the solvent.

[0036] Polymers of organic materials that are insoluble in solvents cannot be dissolved in solvents for coating. Therefore, they are formed by polymerization on the upper surfaces of the insulating layer and the electrodes, or by laminating pre-thinned polymers of organic materials. Since the process of coating with a solution of the organic polymer is not applicable, the properties of the organic polymer are less likely to deviate due to flow effects at the boundaries of dissimilar materials. That is, the uniformity of the organic layer is increased. Consequently, the uniformity of device characteristics is improved. Furthermore, when the organic polymer is insoluble in solvents, and another layer is formed on the organic layer by coating with a solvent, the solvent used in the formation of the other layer has less impact on device characteristics, and the degradation of device characteristics can be suppressed.

[0037] In addition, for example, the organic layer may also contain the organic material comprising the unpolymerized polymeric functional groups described above.

[0038] Therefore, when the microstructure of the organic layer changes due to subsequent heat treatment or stress, the stability of the film's microstructure is increased by polymerizing the unpolymerized polymerizable functional groups that have moved to a position where they can react again, thus maintaining the uniformity of the organic layer.

[0039] In addition, for example, the organic layer may also be a polymer of the organic material polymerized after being coated on the upper surface of the at least one electrode and the upper surface of the insulating layer.

[0040] Therefore, since the organic material before polymerization is coated onto the upper surface of structures with dissimilar materials such as insulating layers and electrodes, there is no interaction between polymer chains compared to coating with organic materials in a polymeric state. Consequently, for polymers of organic materials polymerized after coating, it is less likely to produce deviations in thickness and orientation characteristics at the boundaries of dissimilar materials due to flow effects. Therefore, it is possible to suppress the inhomogeneity of equipment characteristics caused by these deviations, thus improving the uniformity of equipment characteristics.

[0041] In addition, for example, the at least one electrode may also include multiple electrodes, and the insulating layer is disposed between the multiple electrodes in a top view, and the organic layer is continuously disposed in contact with the upper surfaces of the multiple electrodes and the upper surface of the insulating layer.

[0042] Thus, when the insulating layer is located between multiple electrodes, the organic layer is also formed across multiple electrodes and the insulating layer. Therefore, the uniformity at the boundary between the electrode and the insulating layer in the organic layer, as well as the uniformity between the boundary between a certain electrode and the insulating layer and the boundary between other electrodes and the insulating layer, is improved.

[0043] Furthermore, for example, the width of the insulating layer between two adjacent electrodes in the plurality of electrodes viewed from above can also be greater than the thickness of the organic layer.

[0044] Therefore, since the thickness of the organic layer is thinner than that of the insulating layer between two adjacent electrodes, the influence of the boundary between dissimilar materials when coating with a solvent containing polymer materials becomes easier to extend along the thickness direction of the organic layer, resulting in a significant improvement in the uniformity of device characteristics.

[0045] Furthermore, for example, the aforementioned organic device may further include a photoelectric conversion layer stacked on the aforementioned organic layer, and the aforementioned plurality of electrodes are plurality of pixel electrodes.

[0046] Therefore, by capturing the charge generated in the photoelectric conversion layer by irradiation light using pixel electrodes, image capture becomes possible. Consequently, by using the organic device of this solution, an organic imaging device with improved uniformity of device characteristics can be achieved.

[0047] In addition, for example, the organic layer described above can also be a charge blocking layer.

[0048] Therefore, by functioning as a charge blocking layer, the organic layer can suppress unwanted charge injection from the pixel electrode to the photoelectric conversion layer. As a result, noise in organic imaging devices using this solution can be reduced.

[0049] Furthermore, for example, the aforementioned basic molecular framework can also be a π-conjugated molecular framework.

[0050] Thus, in the organic layer, charge is transported through the overlap between the π orbitals of the basic molecular skeleton, enabling the organic layer to be endowed with charge transport function.

[0051] In addition, for example, the π-conjugated molecular skeleton mentioned above can also be a triphenylamine skeleton, a fluorene skeleton, a benzo[a]phenanthrene skeleton, or a carbazole skeleton.

[0052] Therefore, since organic materials contain a basic molecular framework with a large number of π electrons, it becomes easy to tune the energy levels of the molecular orbitals of the polymer of organic materials to energy levels suitable for selective charge transport in electrons and holes.

[0053] In addition, for example, the aforementioned polymerizable functional groups may also be functional groups having a styrene backbone, a silane backbone, an oxetane backbone, an acrylate backbone, or a trifluorovinyl ether backbone.

[0054] Such polymerizable functional groups are easy to bond with the basic molecular backbone and can be polymerized under relatively mild conditions, thus they can easily form polymers of organic materials.

[0055] In addition, for example, the aforementioned organic materials can also be photopolymers or thermal polymers.

[0056] Therefore, organic materials can easily form polymers by polymerizing through light irradiation or heating.

[0057] In addition, for example, the aforementioned organic materials can also be thermally polymerized materials.

[0058] Because polymerization can be achieved through heating alone without the use of thermally polymerizable materials, catalysts, or polymerization initiators, it is easy to form polymers of organic materials with few impurities.

[0059] In addition, for example, the aforementioned polymerizable functional group can also be a functional group with a styrene backbone.

[0060] The polymerizable functional groups of such a styrene skeleton are easily incorporated into organic materials. Furthermore, due to their good polymerizability, they are more likely to form polymers of organic materials.

[0061] In addition, for example, the organic material described above may also be a compound represented by the following structural formula (1), the following structural formula (2) or the following structural formula (3).

[0062] [Chemical Formula 1]

[0063]

[0064] [Chemical Formula 2]

[0065]

[0066] [Chemical Formula 3]

[0067]

[0068] Such organic materials are readily available and exhibit good polymerizability, thus facilitating the formation of organic polymers. Furthermore, these organic materials contain a π-conjugated molecular backbone. Therefore, the organic layers of polymers containing organic materials can be endowed with charge-transporting capabilities through the overlap of π orbitals within the formed layer's π-conjugated molecular backbone.

[0069] Furthermore, a method for manufacturing an organic device according to one aspect of this application includes: forming a structure having at least one electrode and an insulating layer disposed adjacent to the at least one electrode in a top view, wherein the upper surface of the at least one electrode and the upper surface of the insulating layer are exposed; coating the upper surface of the at least one electrode and the upper surface of the insulating layer with a solution containing an organic material comprising polymeric functional groups; and polymerizing the organic material to continuously deposit an organic layer comprising the organic material in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer.

[0070] Therefore, since the organic material before polymerization is coated onto the upper surface of a structure where dissimilar materials such as insulating layers and electrodes are adjacent, there is no interaction between polymer chains compared to coating the organic material in a polymeric state. Consequently, in the polymer of the organic material polymerized after coating, it is less likely to produce deviations in thickness and orientation characteristics at the boundaries of dissimilar materials due to flow effects. Therefore, by using the manufacturing method of this scheme, the inhomogeneity of device characteristics caused by these deviations can be suppressed, and the uniformity of device characteristics in the surface of the organic device with the organic layer is improved.

[0071] Furthermore, for example, the above manufacturing method may further include removing the solvent from the above solution between the time of coating and the time of application of the organic layer.

[0072] Therefore, the increased concentration of organic materials accelerates the reaction rate in the polymerization process. As a result, the heating or light irradiation required for polymerization can be reduced, and the degradation of the formed organic layer can be suppressed. Consequently, the characteristics of the resulting equipment can be improved.

[0073] Furthermore, for example, the at least one electrode may also include multiple electrodes, and the insulating layer is disposed between the multiple electrodes. As for the organic layer, the organic layer is continuously disposed in contact with the upper surfaces of the multiple electrodes and the upper surface of the insulating layer. The width of the insulating layer between the multiple electrodes in a top view is between the thickness of the coated solution and the thickness of the organic layer.

[0074] Therefore, the thickness of the coated solution increases compared to the distance between the boundary positions of the dissimilar materials, i.e., the width of the insulating layer between adjacent electrodes. The influence of the dissimilar material boundary becomes less pronounced the further away from the boundary, thus allowing the organic material to polymerize from the solution coated in a more uniform state. Consequently, the uniformity of the organic layer is further improved.

[0075] Furthermore, one embodiment of the organic device of this application comprises: at least one electrode; an insulating layer disposed adjacent to the at least one electrode in a top view; and an organic layer continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer, and comprising a polymer of organic material, wherein the polymer is insoluble in a solvent.

[0076] The following embodiments of this application will be described with reference to the accompanying drawings.

[0077] It should be noted that elements essential for the operation of the organic device but not relevant to the description of this application have been omitted in this specification. For example, detailed descriptions of well-known matters and repetitive descriptions of substantially the same configuration are sometimes omitted. This is to avoid unnecessarily lengthy descriptions and to facilitate understanding by those skilled in the art. It should also be noted that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the description of this application and are not intended to limit the subject matter of the claims.

[0078] Furthermore, the accompanying drawings are for conceptual purposes and are drawn without any regard for details of shapes, scales, etc., which are not useful for the description of this application.

[0079] Furthermore, in the accompanying drawings, elements representing substantially the same structure, action, and effect are labeled with the same symbol. Also, all numerical values ​​described below are illustrative for the purpose of specifically illustrating this application, and this application is not limited to the illustrative values. Furthermore, the connection relationships between constituent elements are illustrative for the purpose of specifically illustrating this application, and the connection relationships for realizing the function of this application are not limited thereto.

[0080] Furthermore, the embodiments described below are all general or specific examples. The values, shapes, materials, constituent elements, the arrangement and connection of constituent elements, processes, and the order of processes shown in the following embodiments are examples and are not intended to limit the scope of this application.

[0081] In addition, sometimes more detailed explanations than necessary are omitted.

[0082] Furthermore, in this specification, terms indicating the relationship between elements such as parallel or orthogonal, terms indicating the shape of elements, terms such as identical and uniform, and expressions indicating numerical ranges are not merely expressions of a strict meaning, but also expressions that include substantially equivalent ranges, such as expressions indicating differences of a few percent.

[0083] Furthermore, in this specification, the terms "above" and "below" do not refer to the absolute spatial direction of upward (vertical above) and downward (vertical below), but are used as terms defined by relative positional relationships based on the stacking order in a layered structure. Moreover, the terms "above" and "below" apply not only to situations where two constituent elements are arranged with space between them and other constituent elements exist between them, but also to situations where two constituent elements are arranged closely together and in contact. Furthermore, the term "top-down view" refers to the observation of the organic device along the vertical direction of the main surface of the organic layer.

[0084] (Implementation Method 1)

[0085] The organic device of Embodiment 1 will be described below.

[0086] [Overall Composition of Organic Equipment]

[0087] First, the overall structure of the organic device in this embodiment will be explained. Figure 1 This is a schematic cross-sectional view showing the structure of the organic device 10 in this embodiment.

[0088] The organic device 10 in this embodiment is an organic device that includes an organic layer. The organic device 10 is used, for example, in organic imaging devices, organic EL (electro-optical arrays), or organic solar cells. Figure 1As shown, the organic device 10 includes electrodes 110 and 111, an insulating layer 100 disposed adjacent to electrodes 110 and 111 in a top view, and an organic layer 120 continuously disposed in contact with the upper surfaces of electrodes 110, 111, and the insulating layer 100. Electrodes 110 and 111 are embedded in the insulating layer 100. The upper surfaces of electrodes 110, 111, and the insulating layer 100 form a flat plane. That is, the upper surfaces of electrodes 110 and 111 are flat with no step difference, forming a so-called coplanar plane. It should be noted that the organic device 10 may also not include either electrode 110 or electrode 111, i.e., it may have only electrode 110 or electrode 111.

[0089] Although not shown, electrodes 110 and 111 are further connected to the in-plane or lower electrode layer via in-plane wiring or via wiring to form a circuit.

[0090] Electrodes 110 and 111 are made of conductive materials. For example, materials used for electrodes 110 and 111 may be (i) low-resistivity metals such as Cu, aluminum (Al), copper silicide (CuSi), aluminum silicide (AlSi), or their alloys; (ii) noble metals such as gold (Au), silver (Ag), or platinum (Pt); or (iii) titanium nitride (TiN). x ), tantalum nitride (TaN) x ), tungsten nitride (WN) x ), tantalum silicide nitride (TaSiN) x ), tantalum aluminum nitride (TaAlN) x ), titanium oxynitride (TiN) x O y ) or titanium silicide oxynitride (TiSi) x N y O z Conductive materials such as metal nitrides and metal oxynitrides.

[0091] The insulating layer 100 is made of an insulating material. For example, silicon oxide (SiO2) is used as the material for the insulating layer 100. x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), aluminum oxide (AlO) x ), aluminum nitride (AlN) x ) or aluminum oxynitride (AlO x N y Insulating inorganic materials such as poly(p-xylene) or insulating organic materials such as polyimide.

[0092] The organic layer 120 is continuously disposed in contact with the upper surfaces of the electrodes 110, 111, and 100, respectively. That is, the organic layer 120 spans the upper surfaces of the electrodes 110, 111, and 100, covering them. The organic layer 120 comprises a polymer of organic material. In other words, the organic layer 120 comprises polymerized organic material. In the organic layer 120, for example, the orientation of the polymer of organic material is uniform. The organic layer 120, for example, has a uniform thickness. Thus, by achieving uniform thickness and orientation in the organic layer 120, the uniformity of the organic device 10 is improved.

[0093] Organic materials, for example, have a basic molecular backbone for transporting charge and polymerizable functional groups for crosslinking the basic molecular backbone to polymerize the organic material. The polymer of the organic material is formed by polymerizing the organic material through the polymerizable functional groups. The polymer of the organic material has a structure in which polymerizable functional groups are polymerized between the basic molecular backbones. The polymerizable functional groups are, for example, bonded to the basic molecular backbone through covalent bonds. In this way, since the organic material contains a basic molecular backbone and polymerizable functional groups, when it contains a basic molecular backbone with functions such as charge transport, the organic layer 120 can be easily functionalized without being combined with other materials.

[0094] As basic molecular skeletons, examples of π-conjugated molecular skeletons include those shown in the following structural formulas, such as the triphenylamine skeleton, the fluorene skeleton, the triphenylene skeleton, the carbazole skeleton, and the molecular skeletons of their derivatives.

[0095] [Chemical Formula 4]

[0096]

[0097] Organic materials can have one basic molecular backbone in a single molecule, or they can have multiple basic molecular backbones. Furthermore, in the case of organic materials having multiple basic molecular backbones, they can have one type of basic molecular backbone or multiple types of basic molecular backbones. The basic molecular backbone is not limited to the molecular backbones exemplified above. The basic molecular backbone can also be a molecular backbone having a π-conjugated system other than the exemplified molecular backbones, or a molecular backbone that forms a π-conjugated system after polymerization.

[0098] In the organic layer 120 of a polymer containing an organic material with a π-conjugated molecular backbone as its basic molecular backbone, charge is transported via the overlap between the π orbitals of the basic molecular backbone within the formed layer. Simultaneously, by selecting the energies of the HOMO (Highest Occupied Molecular Orbital) and LUMO (Lowest Unoccupied Molecular Orbital) energy levels corresponding to the desired purpose, the polymer of the organic material can selectively transport one type of charge, either electrons or holes. For example, by using a π-conjugated molecular backbone as shown in the above structural formula as the basic molecular backbone, it becomes easy to adjust the HOMO and LUMO energy levels of the polymer of the organic material to energy levels suitable for the selective transport of one type of charge, either electrons or holes.

[0099] As polymerizable functional groups, examples include functional groups with molecular skeletons such as styene, silane, oxetane, acrylate, trifluorovinyl ether, and derivatives of these molecular skeletons. Functional groups with molecular skeletons as shown in the following structural formulas readily bond to the basic molecular skeleton, allowing for polymerization under relatively mild conditions, and thus readily forming polymers of organic materials.

[0100] [Chemical Formula 5]

[0101]

[0102] Furthermore, organic materials can have one or more polymerizable functional groups within a molecule. From the viewpoint of improving the polymerizability of organic materials, organic materials can also have multiple polymerizable functional groups within a molecule. Polymerizable functional groups are not limited to the functional groups exemplified above. Polymerizable functional groups can also be functional groups other than those exemplified, which can polymerize through heat, light, or catalysts and can covalently bond with the basic molecular skeleton. For example, a polymerizable functional group may also have substituents in a portion of the functional groups exemplified above. Furthermore, a portion of the polymerizable functional group may also be contained within the basic molecular skeleton.

[0103] From the perspective of easy polymerization, organic materials are, for example, photopolymerizable or thermally polymerizable materials. Photopolymerizable materials are, for example, compounds containing functional groups with oxobutane or acrylate backbones as polymerizable functional groups, which polymerize via photoacid generators or photoradical generators. Thermally polymerizable materials are, for example, compounds containing functional groups with styrene or trifluorovinyl ether backbones, which polymerize thermally. While functional groups with silane backbones generate byproducts, requiring heat treatment to remove these byproducts, they have the advantage of spontaneously polymerizing at room temperature in the presence of trace amounts of water or hydroxyl groups.

[0104] From the viewpoint that polymerization can occur even without catalysts or polymerization initiators such as photoacid generators or photoradix generators, organic materials can also be thermally polymerizable. When an organic material is thermally polymerizable, from the viewpoint of easy incorporation into organic materials and good polymerizability, the thermally polymerizable material can also possess the polymerizable functional groups of the styrene skeleton described above. Furthermore, when an organic material is thermally polymerizable, it can also possess a basic molecular skeleton with multiple aromatic rings, such as the π-conjugated molecular skeleton described above. Therefore, due to the increased molecular weight, the organic material is less volatile and its thermal stability is easily improved. Thus, it is easy to obtain polymers of organic materials with fewer defects, which can improve the device characteristics of the organic device 10.

[0105] As specific examples of organic materials, the following compounds with structural formulas (1) to (7) can be listed.

[0106] [Chemical Formula 6]

[0107]

[0108] [Chemical Formula 7]

[0109]

[0110] [Chemical Formula 8]

[0111]

[0112] [Chemical Formula 9]

[0113]

[0114] [Chemical Formula 10]

[0115]

[0116] [Chemical Formula 11]

[0117]

[0118] [Chemical Formula 12]

[0119]

[0120] Organic materials can also be VB-FNPD (9,9-bis[4-[(4-vinylphenyl)methoxy]phenyl]-N2,N7-bis-1-naphthalenyl-N2,N7-diphenyl-9H-fluorene-2,7-diamine) as shown in structural formula (1) and VNPB (N4,N4'-bis(naphthalen-1-yl)-N4,N4'-bis(4-vinylphenyl)biphenyl-4,4'-diamine) as shown in structural formula (2). These organic materials are readily available and exhibit good polymerizability. Furthermore, these organic materials contain a π-conjugated molecular backbone. Therefore, for the organic layer of a polymer containing these organic materials, charge transport functionality can be imparted through the overlap of π orbitals within the formed layer's π-conjugated molecular backbone.

[0121] The polymer of the organic material can also be insoluble with respect to the solvent. Since the polymer of the organic material is insoluble with respect to the solvent cannot be dissolved in the solvent for coating, it can be formed by polymerization on the upper surfaces of the electrodes 110, 111, and insulating layer 100, or by laminating pre-thinned polymers of the organic material. Therefore, since the process of coating a solution of the organic material polymer is not applicable, it is less likely to cause deviations in the properties of the organic material polymer due to flow effects at the boundary of dissimilar materials. That is, the uniformity of the organic layer 120 is increased. Furthermore, when the polymer of the organic material is insoluble with respect to the solvent, and another layer is formed on the organic layer 120 by coating with a solvent, the solvent used in the formation of the other layer is less likely to affect the device characteristics, and the reduction in the device characteristics of the organic device 10 can be suppressed.

[0122] Solvents, for example, are solvents capable of dissolving the aforementioned organic materials. Specifically, solvents include organic solvents such as toluene, xylene, chlorobenzene, dichlorobenzene, dichloroethane, chloroform, tetrahydrofuran (THF), and dimethylformamide. Furthermore, "insoluble relative to the solvent" means that the polymer of the organic material is substantially insoluble; for example, it means that even when the polymer of the organic material is immersed in a solvent, it will not dissolve at all.

[0123] The organic layer 120 may also comprise a polymer of organic material obtained by polymerizing organic material after it has been coated onto the upper surfaces of the electrodes 110, 111, and the insulating layer 100. Specifically, the organic layer 120 is formed by coating a solution containing an organic material composed of molecules having a basic molecular framework and polymerizable functional groups using a solution method followed by polymerization.

[0124] Furthermore, the organic layer 120 may also contain an organic material with unpolymerized polymeric functional groups. Thus, if the microstructure of the organic layer 120 changes due to heat treatment or stress after its formation, the stability of the microstructure is increased by polymerizing the unpolymerized polymeric functional groups that have moved to a position where they can react again, thereby maintaining the uniformity of the organic layer 120.

[0125] [Manufacturing methods for organic devices]

[0126] Next, the manufacturing method of the organic device 10 of this embodiment will be described.

[0127] Figure 2 This is a flowchart illustrating the manufacturing method of the organic device 10 in this embodiment.

[0128] The manufacturing method of the organic device 10 in this embodiment includes a forming process, a coating process, a removal process, and a polymerization process.

[0129] like Figure 2 As shown, firstly, in the manufacturing method of the organic device 10, as a forming step, a structure is formed having electrodes 110, electrodes 111, and an insulating layer 100 disposed adjacent to the electrodes 110 and electrodes 111 in a top view, wherein the upper surfaces of the electrodes 110, electrodes 111, and insulating layer 100 of the structure are exposed (step S11). Such a structure is formed, for example, by using general methods of semiconductor processes such as CMP (Chemical Mechanical Polishing), the formation of a planarization layer, and etch-back.

[0130] Next, in the manufacturing method of the organic device 10, as a coating step, a solution containing an organic material having polymerizable functional groups is coated on the upper surfaces of the electrodes 110, 111, and the insulating layer 100 (step S12). For example, the solution is continuously coated across the upper surfaces of the electrodes 110, 111, and the insulating layer 100. Examples of methods for coating the solution containing the organic material include spin coating, dip coating, or spray coating of a solution obtained by dissolving the organic material in a solvent (hereinafter sometimes referred to as ink), or printing methods using liquid inks such as offset printing, gravure printing, or inkjet printing. The solvents described above can be used as solvents.

[0131] Next, in the manufacturing method of the organic device 10, as a removal step, the solvent in the solution containing the organic material is removed (step S13). Methods for removing the solvent include, for example, heating the structure coated with the solution, reducing pressure, or heating under reduced pressure. This increases the concentration of the organic material, thereby accelerating the reaction rate in the polymerization step described later. When heating the structure coated with the solution, the heating temperature is, for example, a temperature above the boiling point of the solvent.

[0132] It should be noted that in the manufacturing method of organic device 10, the removal process can also be omitted.

[0133] Next, in the manufacturing method of the organic device 10, as a polymerization step, an organic layer 120 containing the polymer of the organic material is continuously formed in contact with the upper surfaces of the electrodes 110, 111, and the insulating layer 100 by polymerizing the organic material (step S14). That is, the organic layer 120 is formed across the upper surfaces of the electrodes 110, 111, and the insulating layer 100. Thus, the organic device 10 is obtained. As a method for polymerizing the organic material, for example, a method of applying external stimulation such as heat or light to the organic material can be used. In addition, when applying external stimulation, a catalyst such as an acid generator, a free radical generator, or an organometallic catalyst can also be used on the organic material. The catalyst can also be mixed into the solution in a necessary amount, or it can be diffused and permeated after the solution is coated.

[0134] Even when the basic molecular framework or polymerizable functional groups of organic materials deteriorate due to electron exchange with oxygen or moisture, organic materials can still be polymerized in a dry or deoxygenated atmosphere. If residual solvent remains after the polymerization process, it can be removed by heating or similar methods.

[0135] It should be noted that, during the polymerization process, the organic layer 120 containing organic materials with unpolymerized polymerizable functional groups can also be formed by adjusting the polymerization conditions or polymerization time.

[0136] Specifically, the organic layer 120 is formed, for example, by spin-coating an o-xylene solution of VB-FNPD (as shown in structural formula (1)) as the organic material onto the respective upper surfaces of the electrodes 110, 111, and the insulating layer 100 in a dry and deoxygenated atmosphere, followed by polymerization treatment at 200°C for 30 minutes. At this time, for example, SiO₂ is used as the material for the insulating layer 100. x Cu is used as the material for electrodes 110 and 111. The effects of forming the organic layer 120 in this manner will be explained below.

[0137] Just from SiO x The surface energy composition of the insulating layer 100 differs from that of the Cu-based electrodes 110 and 111. Regarding SiO... x On the surface, highly polar structures like Si-O-Si and highly polar structures like Si-OH with strong hydrogen bonding are exposed, forming an overall polar surface. Therefore, regarding SiO... xOn the surface, the interaction with the low-polarity solvent, o-xylene, is weak, but due to the high uniformity of polarity, the interfacial fluidity with o-xylene is good. On the other hand, the surfaces of electrodes 110 and 111, respectively formed of Cu, are partially oxidized Cu structures. In a dry and deoxidized atmosphere, the influence of the unoxidized Cu structure is evident, resulting in a large local dispersion of surface polarity. Therefore, regarding the Cu surface, the wettability with o-xylene is good, but the interfacial fluidity with o-xylene is reduced due to the non-uniformity of polarity caused by partial oxidation. Thus, regarding SiO... x The interfacial fluidity of the surface is different from that of o-xylene compared to that of Cu.

[0138] In the coating and polymerization processes, the processes of spreading the solution onto the upper surfaces of electrodes 110, 111, and the insulating layer 100, and the process of volume shrinkage of the solution due to solvent evaporation, are carried out sequentially or partially simultaneously. During each process, the solution flows on the upper surfaces of the insulating layer 100, electrodes 110, and 111. However, the different interactions between the solvent and the insulating layer 100 and between the solvent and the electrodes 110 and 111 affect the flow of the solution. Particularly at the boundaries between the insulating layer 100 and the electrode 110, and between the insulating layer 100 and the electrode 111, where the magnitude of the interaction changes, the change in the magnitude of the interaction, parallel to the upper surfaces of the electrodes 110, 111, and the insulating layer 100, provides a new driving force for the flow of the solution. That is, the flow of the solution on the upper surfaces of the insulating layer 100, electrodes 110, and 111 becomes non-uniform.

[0139] In solutions of polymers with strong intermolecular interactions, even at low concentrations, the increased viscosity of the solution leads to flow. This non-uniform flow affects the molecular orientation of the polymer. For example, the polymer is subjected to macroscopic and microscopic forces that influence orientation in the direction of wetting expansion or volume contraction, as well as forces that disrupt orientation due to turbulence. Therefore, compared to solutions flowing on a uniform material surface, the uniformity of the polymer's orientation is reduced in the solution and in the organic layer of the subsequently formed film. Furthermore, the non-uniform orientation also results in non-uniform film thickness.

[0140] On the other hand, for low-molecular-weight materials, due to the weak interactions between molecules, the viscosity of the solution does not easily increase when compared to the same concentration as high-molecular-weight materials, and the influence of random molecular motion caused by heat is greater. As a result, the flow of the solution does not easily affect the molecular orientation of low-molecular-weight materials. Therefore, the orientation state of low-molecular-weight materials in solution is well-uniform. That is, the basic molecular framework of organic materials tends to be oriented in a random direction.

[0141] Therefore, the organic layer 120, which contains a polymer (in other words, a high-molecular-weight material) formed by polymerizing the organic material (VB-FNPD, which is a low-molecular-weight organic material according to structural formula (1)) through solution coating and heating, is in a state where the basic molecular backbone is cross-linked and polymerized in a random direction, regardless of the positions of the insulating layer 100, electrode 110, and electrode 111 on their respective upper surfaces. Consequently, the uniformity of the local structure, such as the orientation state of the organic material polymer in the organic layer 120, becomes good. Furthermore, the uniformity of the thickness of the organic layer 120 also becomes good. As a result, the uniformity of the device characteristics of the organic device 10 in the surface where the organic layer 120 is formed is improved.

[0142] (Implementation Method 2)

[0143] Next, the organic device of Embodiment 2 will be described. It should be noted that in the following description of Embodiment 2, the focus is on the differences from Embodiment 1, and the description of the commonalities is omitted or simplified.

[0144] Figure 3 This is a schematic cross-sectional view showing the structure of the organic device 20 in this embodiment. Figure 4 This is a top view showing an example of the planar layout of the plurality of electrodes 210 in this embodiment. Figure 4 In order to illustrate the planar arrangement of the multiple electrodes 210, a state in which the organic layer 220 is not formed is shown. Organic device 20 differs from organic device 10 in that it has multiple electrodes 210 arranged in rows and columns instead of electrodes 110 and 111.

[0145] like Figure 3 As shown, the organic device 20 includes a plurality of electrodes 210, an insulating layer 200 disposed between the plurality of electrodes 210 in a top view, and an organic layer 220. The plurality of electrodes 210 are embedded in the insulating layer 200. A flat plane is formed by the upper surfaces of the plurality of electrodes 210 and the insulating layer 200, respectively. That is, the upper surface of each of the plurality of electrodes 210 and the upper surface of the insulating layer 200 are on the same plane. Although not shown, the plurality of electrodes 210 are further connected to an in-plane or lower electrode layer via in-plane wiring or through-hole wiring to form a circuit.

[0146] The same material used in insulating layer 200 as that used in insulating layer 100 can be used.

[0147] Multiple electrodes 210 such Figure 4 As shown, the electrodes are arranged in a 4x6 row pattern with equal intervals in a top-view configuration. Each of the multiple electrodes 210 has a square shape in its top-view appearance. It should be noted that the top-view shape, number, and arrangement of the multiple electrodes 210 are not limited to... Figure 4 The example shown. The top-view shape of the multiple electrodes 210 can also be circular, or a regular polygon such as a regular hexagon or a regular octagon. In addition, the multiple electrodes 210 can be arranged with the same number of rows and columns, or arranged in a single column.

[0148] The same material used in the multiple electrodes 210 as that used in electrodes 110 and 111 can be used.

[0149] Refer again Figure 3 The organic layer 220 is continuously disposed in contact with the upper surfaces of the plurality of electrodes 210 and the insulating layer 200. That is, the organic layer 220 covers the plurality of electrodes 210 and the insulating layer 200 across the upper surfaces of the plurality of electrodes 210 and the insulating layer 200. The same material as that used in the organic layer 120 can be used for the organic layer 220.

[0150] Organic device 20 can be manufactured using the same method as the organic device 10 of embodiment 1.

[0151] Specifically, the organic device 20 is formed, for example, by the following method. First, a 0.5% by weight THF solution of a mixture of QUPD (as shown in structural formula (3) as the organic material) and 1% by weight of 4-octyloxydiphenyliodonium hexafluoroantimonate (as the polymerization initiator) of QUPD is spin-coated onto the upper surfaces of the plurality of electrodes 210 and the insulating layer 200 respectively. Then, ultraviolet light (UVA) is irradiated by an ultraviolet lamp, and polymerization is further performed by heating at 120°C. Thus, an organic layer 220 with a thickness of 40 nm is formed. At this time, for example, SiO2 is used as the material for the insulating layer 200. x For the material of multiple electrodes 210, TaN is used. x .

[0152] As with the organic layer 220 manufactured in this way, since it is less affected by the boundary of the surface of the dissimilar material, the uniformity at the boundary between the local electrode 210 and the insulating layer 200 is improved. In addition, the uniformity between the boundary between the insulating layer 200 and the electrode 210 on the outer side of the arrangement of the plurality of electrodes 210 and the boundary between the insulating layer 200 and the electrode 210 on the inner side of the arrangement of the plurality of electrodes 210 is also improved.

[0153] Furthermore, in the manufacturing method of the organic device 20, during the polymerization step, an organic layer 220 is continuously disposed in contact with the upper surfaces of the plurality of electrodes 210 and the insulating layer 200, respectively. That is, the organic layer 220 is formed across the upper surfaces of the plurality of electrodes 210 and the insulating layer 200. In the polymerization step, from the viewpoint of improving the uniformity of the organic layer 220, the smaller of the width of the electrode 210 in top view and the width of the insulating layer between adjacent electrodes 210 can be a value between the initial thickness of the solution coated in the coating step and the thickness of the organic layer 220 formed in the polymerization step. In other words, the width of the insulating layer between adjacent electrodes 210 is the width of the insulating layer 200 located in the gap between adjacent electrodes 210 along the arrangement direction in top view. Furthermore, when the top view shape of the electrode 210 is not square, the width of the electrode 210 is the width at the position where the distance between opposite sides of the electrode 210 is shortest in top view.

[0154] In the above-described example of forming the organic layer 220, since the organic layer 220 with a thickness of 40 nm is formed using a 0.5% solution, the initial solution thickness in the coating process is approximately 40 nm ÷ 0.005 = 8000 nm. Therefore, when the smaller of the width of the electrode 210 in a top-view view and the width of the insulating layer 200 between adjacent electrodes 210 is the initial solution thickness in the coating process, i.e., between approximately 8000 nm and the thickness of the organic layer 220 of 40 nm, the effect of improving the uniformity of the organic layer 220 becomes greater.

[0155] When increasing the density of multiple electrodes 210 in a top-down view, the width of the insulating layer 200 between adjacent electrodes 210 is smaller than the width of the electrode 210 itself. In this case, the width of the insulating layer 200 between adjacent electrodes 210 can also be between the thickness of the solution coated in the coating process and the thickness of the organic layer 220 formed in the polymerization process. Therefore, in the organic device 20, the width of the insulating layer 200 between adjacent electrodes 210 can also be greater than the thickness of the organic layer 220.

[0156] (Implementation Method 3)

[0157] Next, the organic device of Embodiment 3 will be described. It should be noted that in the following description of Embodiment 3, the focus is on the differences from Embodiments 1 and 2, and the description of the commonalities is omitted or simplified.

[0158] Figure 5 This is a schematic cross-sectional view showing the structure of the organic device 30 according to this embodiment. The organic device 30 differs from the organic devices 10 and 20 in that it further includes a photoelectric conversion layer 321, a buffer layer 322, and a counter electrode 323. The organic device 30 is, for example, an organic imaging device.

[0159] like Figure 5 As shown, the organic device 30 includes a plurality of electrodes 310, an insulating layer 300 disposed between the plurality of electrodes 310 in a top view, and an organic layer 320. The organic device 30 further includes a photoelectric conversion layer 321 stacked on the organic layer 320, and a counter electrode 323 stacked on the photoelectric conversion layer 321. The organic device 30 may also, as needed, include a buffer layer 322 located between the photoelectric conversion layer 321 and the counter electrode 323.

[0160] The same material as insulating layer 100 can be used for insulating layer 300.

[0161] Multiple electrodes 310 are pixel electrodes used to read out the charge generated in the photoelectric conversion layer 321. Like the multiple electrodes 210, the multiple electrodes 310 are arranged in rows and columns in a top-view configuration. Furthermore, although not shown, each of the multiple electrodes 310 is connected to a lower-layer readout circuit, for example, via via wiring, to capture the charge generated in the photoelectric conversion layer 321 and transfer it to the readout circuit. Additionally, for example, the multiple electrodes 310 are connected to a charge storage section via via wiring, accumulating the charge generated in the photoelectric conversion layer 321 in the charge storage section, and the signal corresponding to the accumulated charge is read out by the readout circuit. The same material used for the multiple electrodes 310 can be used as for electrodes 110 and 111.

[0162] The same material used in organic layer 320 as in organic layer 120 can be used. With the basic molecular framework described above, organic layer 320 functions as a charge blocking layer because it can selectively transport one type of charge—electrons or holes—by adjusting the HOMO and LUMO energy levels of the polymer of the organic material. The charge blocking layer suppresses unwanted charges from being injected into the photoelectric conversion layer 321 from the multiple electrodes 310. This reduces noise in the organic device 30.

[0163] Multiple electrodes 310, insulating layer 300 and organic layer 320 can be manufactured by the same method as the manufacturing method of organic device 10 in Embodiment 1.

[0164] The photoelectric conversion layer 321 receives incident light and generates electron-hole pairs. The photoelectric conversion layer 321 is composed, for example, of donor and acceptor molecules. As a donor molecule, an organic semiconductor polymer such as P3HT (poly(3-hexylthiophene)) can be used. In addition to organic semiconductor polymers, low-molecular-weight organic semiconductors such as phthalocyanines or naphthalenephthalocyanines, semiconductor carbon nanotubes, or quantum dots formed from semiconductor materials such as lead sulfide (PbS), lead selenide (PbSe), cadmium selenide (CdSe), or cadmium telluride (CdTe) can also be used as donor molecules.

[0165] As acceptor molecules, such as fullerenes like PCBM ([6,6]-Phenyl-C61-Butyric Acid Methyl Ester), C60, or SIMEF (silyl methyl fullerene), are molecules that can strip charges from donor molecules.

[0166] The photoelectric conversion layer 321 is formed, for example, by coating a solution of a mixture of donor and acceptor molecules onto the organic layer 320 and then drying it. The coating method can be the same as the method used for coating the aforementioned organic material solution. The photoelectric conversion layer 321 can also be formed by vapor deposition.

[0167] The counter electrode 323 is, for example, a transparent electrode formed of a transparent conductive material. The counter electrode 323 is disposed on the side where light is incident within the photoelectric conversion layer 321. Therefore, light passing through the counter electrode 323 is incident into the photoelectric conversion layer 321. It should be noted that "transparent" in this specification means that at least a portion of the wavelength range to be detected is transparent, not that the entire visible light wavelength range must be transparent.

[0168] Although not illustrated, the counter electrode 323 is connected to a voltage supply circuit, from which a voltage is applied. By controlling the potential of the counter electrode 323 relative to the potential of the electrode 310 through the voltage supply circuit, either holes or electrons from the hole-electron pairs generated in the photoelectric conversion layer 321 through photoelectric conversion can be captured as charges through the electrode 310. For example, when holes are used as charges, by increasing the potential of the counter electrode 323 compared to the electrode 310, holes can be selectively captured through the electrode 310. It should be noted that electrons can also be used as charges; in this case, simply decreasing the potential of the counter electrode 323 compared to the electrode 310 is sufficient.

[0169] As the material for the counter electrode 323, for example, indium oxide (InO) such as ITO (Indium Tin Oxide) can be used. x Compounds doped with tin (Sn), silicon (Si), or tungsten (W), and tin oxide (SnO) x Compounds doped with antimony (Sb) or fluorine (F), or compounds doped with Al or gallium (Ga) in zinc oxide (ZnO), possess both the properties of light transmittance and conductivity to be received by the photoelectric conversion layer 321. The counter electrode 323 is formed, for example, by electron beam deposition, sputtering, resistance heating deposition, or solution coating.

[0170] The buffer layer 322 is provided, for example, to suppress the impact of sputtering process damage during the formation of the counter electrode 323 on the photoelectric conversion layer 321, or to suppress the injection of unwanted charge from the counter electrode 323 into the photoelectric conversion layer 321. The material of the buffer layer 322 may be, for example, a p-type semiconductor or an n-type semiconductor. For example, by selecting the energies of the HOMO and LUMO energy levels of the material of the buffer layer 322, the buffer layer 322 can selectively transport one type of charge, either electrons or holes, and suppress the injection of unwanted charge from the counter electrode 323 into the photoelectric conversion layer 321. The buffer layer 322 is formed, for example, by solution coating or vapor deposition.

[0171] Specifically, the organic device 30 is formed, for example, by the following method. First, a 10 mg / mL dichloroethane solution of VNPB, represented by structural formula (2) as the organic material, is spin-coated onto the upper surfaces of the plurality of electrodes 310 and the insulating layer 300. Then, a polymerization process is performed by heating at 110°C for 10 minutes, followed by heating at 230°C for 90 minutes. This forms an organic layer 320 with a thickness of 30 nm. For example, the material for the insulating layer 300 is SiO2 formed by decomposing tetraethoxysilane (TEOS) via plasma CVD (chemical vapor deposition). x For the material of multiple electrodes 310, TiN is used. x Furthermore, for example, the width of electrode 310 is 2.8 μm, and the width of insulating layer 300 between adjacent electrodes 310 is 0.2 μm.

[0172] Next, a chloroform solution of the material obtained by mixing the donor molecule P3HT and the acceptor molecule PCBM in a 1:1 ratio is spin-coated onto the organic layer 320 to form a photoelectric conversion layer 321. Then, a counter electrode 323 made of ITO is formed on the photoelectric conversion layer 321 by sputtering to obtain the organic device 30.

[0173] The following describes the results of measuring the characteristics of the organic device 30 obtained by operating in this manner. Specifically, a voltage of +4V was applied to the counter electrode 323 relative to the electrode 310, and readout signals were obtained in the dark (i.e., when no light is illuminating the organic device 30) and under uniform visible light illumination. For each readout signal, the uniformity of the arrangement of the electrodes 310 was evaluated, and good results were obtained in both cases.

[0174] On the other hand, instead of VNPB, an organic device 30 was evaluated by coating an organic layer 320 formed by coating a solution of a composite material (PEDOT:PSS) consisting of poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid as polymeric materials. As a result, the uniformity of the readout signal was reduced compared to the organic device 30 with an organic layer 320 formed using VNPB. In particular, the uniformity in the dark was reduced in the organic device 30 with PEDOT:PSS compared to the organic device 30 with an organic layer 320 formed using VNPB; this reduction was not only limited to the uniformity of a few electrodes 310, but also to the overall uniformity of the arrangement of the multiple electrodes 310.

[0175] (Other implementation methods)

[0176] The above describes one or more organic devices based on various embodiments, but this application is not limited to these embodiments.

[0177] For example, in the above embodiments, the organic material has a basic molecular framework for transporting charge, and the polymer of the organic material can selectively transport one type of charge, either electrons or holes, but is not limited thereto. The polymer of the organic material can also be a photoelectric conversion material that excites electrons such as π electrons by irradiation with light. Furthermore, the polymer of the organic material can also be an insulating material that has a molecular framework that is not π-conjugated and does not transport charge.

[0178] Furthermore, for example, in the above embodiment, a polymerization step is performed after the solvent removal step, but it is not limited to this. The solvent removal step and the polymerization step can also be performed simultaneously. That is, the polymerization process can be performed while the solvent is being removed.

[0179] Furthermore, any modifications to this embodiment that can be conceived by those skilled in the art, and any combination of constituent elements from different embodiments, are also included within the scope of this application, as long as they do not depart from the spirit of this application.

[0180] Industrial availability

[0181] The organic devices described in this application are beneficial for applications requiring uniform device characteristics, such as organic camera elements and organic EL displays.

[0182] Explanation of symbols

[0183] 10, 20, 30 Organic equipment

[0184] 100, 200, 300 insulation layers

[0185] 110, 111, 210, 310 electrodes

[0186] 120, 220, 320 Organic layers

[0187] 321 Photoelectric conversion layer

[0188] 322 Buffer Layer

[0189] 323 Opposite electrode

Claims

1. An organic device comprising: At least one electrode; An insulating layer disposed adjacent to the at least one electrode in a top-view view; and An organic layer, which is continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer, and comprises a polymer of organic material. The organic material comprises a basic molecular framework and polymerizable functional groups. In the polymer, the organic material is polymerized via the polymerizable functional groups. The basic molecular skeleton is a triphenylamine skeleton, a fluorene skeleton, a benzo[a]phenanthrene skeleton, or a carbazole skeleton. The at least one electrode comprises a plurality of electrodes. The insulating layer is positioned between the plurality of electrodes when viewed from above. The organic layer is continuously disposed in contact with the upper surfaces of the plurality of electrodes and the upper surface of the insulating layer.

2. The organic device according to claim 1, wherein, The polymer is insoluble in relation to the solvent.

3. The organic device according to claim 1, wherein, The organic layer comprises the organic material containing the unpolymerized polymeric functional groups.

4. The organic device according to any one of claims 1 to 3, wherein, The organic layer comprises the polymer of the organic material polymerized after being coated on the upper surface of the at least one electrode and the upper surface of the insulating layer.

5. The organic device according to claim 1, wherein, In a top-down view, the width of the insulating layer between two adjacent electrodes of the plurality of electrodes is greater than the thickness of the organic layer.

6. The organic device according to claim 1 or 5, further comprising a photoelectric conversion layer stacked on the organic layer, The plurality of electrodes are plurality of pixel electrodes.

7. The organic device according to claim 6, wherein, The organic layer is a charge blocking layer.

8. The organic device according to any one of claims 1 to 3, wherein, The polymerizable functional group is a functional group having a styrene backbone, a silane backbone, an oxetane backbone, an acrylate backbone, or a trifluorovinyl ether backbone.

9. The organic device according to any one of claims 1 to 3, wherein, The organic material is a photopolymer or a thermal polymer.

10. The organic device according to any one of claims 1 to 3, wherein, The organic material is a thermally polymerized material.

11. The organic device according to claim 10, wherein, The polymerizable functional group is a functional group with a styrene framework.

12. The organic device according to any one of claims 1 to 3, wherein, The organic material is a compound represented by the following structural formula (1), the following structural formula (2), or the following structural formula (3). 。 13. A method for manufacturing the organic device according to any one of claims 1 to 12, comprising: A structure is formed having at least one electrode and an insulating layer disposed adjacent to the at least one electrode in a top view, wherein the upper surface of the at least one electrode and the upper surface of the insulating layer are exposed. A solution containing an organic material comprising polymeric functional groups is coated onto the upper surface of the at least one electrode and the upper surface of the insulating layer; and By polymerizing the organic material, an organic layer containing the polymer of the organic material is continuously disposed in contact with the upper surface of the at least one electrode and the upper surface of the insulating layer.

14. The method for manufacturing the organic device according to claim 13, wherein, The process further includes removing the solvent from the solution between the application and the end of the application of the organic layer.

15. The method for manufacturing the organic device according to claim 13 or 14, wherein, The at least one electrode comprises a plurality of electrodes. The insulating layer is disposed between the plurality of electrodes. For the organic layer to be disposed, the organic layer is disposed continuously in contact with the upper surfaces of the plurality of electrodes and the upper surface of the insulating layer; The width of the insulating layer between the plurality of electrodes in a top-down view is between the thickness of the coated solution and the thickness of the organic layer.

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