印刷电路板
By setting multi-layered connectors and pads within the vias of the printed circuit board, and by adjusting the plating method, the problem of plating limitations for large-diameter vias was solved, achieving uniformity and reliability of the conductive parts, and improving the shielding and heat dissipation performance of the circuit.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LG INNOTEK CO LTD
- Filing Date
- 2020-11-26
- Publication Date
- 2026-07-17
AI Technical Summary
Existing printed circuit boards have limitations in the plating process of large-diameter vias, which leads to the formation of recessed areas, affecting the uniformity and reliability of the conductive parts, and making them difficult to process, especially during further stacking.
The conductive part adopts a novel structure. By setting a multi-layer structure of connecting parts and pads in the conductive hole, the upper surface of the connecting part is concave downward and the lower surface is concave upward. Combined with the use of seed crystal layer, the plating method is adjusted to achieve stable plating of large-diameter conductive holes.
Uniform plating of large-diameter vias was achieved, improving the reliability of the conductive parts and the quality reliability after stacking, and enhancing the shielding and heat dissipation performance of the circuit.
Smart Images
Figure CN114902816B_ABST