Polishing apparatus for semiconductor wafers

Abstract

The present invention relates to a polishing device for a semiconductor wafer, which can maintain the polishing processing accuracy of the outer peripheral portion of the semiconductor wafer for a long period with high accuracy. The polishing device (10) has a column (17) provided with a chuck (21) holding a semiconductor wafer (W), a reciprocating table (14) installed on a base member (13) so as to be able to reciprocate, a polishing head (55) rotatably supporting a polishing pad (56), and a support table (48) supporting a sliding plate (54) on which the polishing head (55) is installed, a pressing cylinder (41) of a pressing force applying member applying a pressing force of a pressing force toward the polishing head (55) to the semiconductor wafer via the reciprocating table (14) is installed on the base member (13), and a load cell (76) of an actual load measuring device measuring the actual load applied to the semiconductor wafer by the pressing force applying member is installed between the support table and the sliding plate.

Description

Technical Field

[0001] This invention relates to a wafer grinding apparatus for grinding the outer periphery of a semiconductor wafer. Background Technology

[0002] Semiconductor wafers, used as materials in semiconductor integrated circuits, are generally made of single-crystal silicon, and are called silicon wafers. Silicon wafers are manufactured by slicing raw materials into cylindrical ingots into thin sheets, forming multiple circuit patterns such as wiring and components for semiconductor integrated circuits on their surface. The silicon wafers with these circuit patterns are then cut into individual semiconductor chips through a dicing process.

[0003] On the outer periphery of a semiconductor wafer, in order to indicate crystal orientation, V-shaped notches (called orientation notches) or straight sections (called orientation planes) are ground. During the process of forming circuit patterns on the semiconductor wafer, these notches or planes align the wafer's orientation.

[0004] Orientation notches and flat surfaces processed on the outer periphery of a semiconductor wafer are ground using a grinding apparatus. During grinding, the semiconductor wafer is held by a chuck, as described in Patent Document 1. The chuck is mounted on a reciprocating stage, which is movably mounted on a base component. A circular grinding pad, used for grinding the outer periphery of the semiconductor wafer, is rotatably mounted on a support stage. The semiconductor wafer, held in the chuck, is pressed towards the grinding pad by the reciprocating stage.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2006-114643 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] To apply the necessary load for polishing from the polishing pad to the outer periphery of the semiconductor wafer, a pressing cylinder consisting of a pneumatic cylinder is mounted on the reciprocating stage. To measure the pressing force applied from the polishing pad to the semiconductor wafer during polishing, a force sensor was installed between the rod of the pressing cylinder and the reciprocating stage.

[0010] A reciprocating stage equipped with a chuck is mounted freely on a base component, and sliding resistance is applied to the reciprocating stage relative to the base component. Furthermore, multiple wires and conduits are connected to the chuck, and the resistance of these wires and conduits is applied to the sliding stage. If these resistances change over time or years, the actual polishing load applied to the semiconductor wafer from the polishing pad becomes unstable.

[0011] As described above, if a force sensor is installed in the pressing cylinder to detect the pressing force applied from the polishing pad to the semiconductor wafer, the force sensor monitors whether the pressing load of the pressing cylinder on the reciprocating stage is output according to the commanded value. Therefore, if the sliding resistance applied to the reciprocating stage changes over time or years, the actual load applied from the polishing pad to the semiconductor wafer cannot be monitored more accurately by the force sensor. If an error occurs between the actual load and the set value of the pressing force, the polishing accuracy of the notches and orientation planes on the outer periphery of the semiconductor wafer will be reduced.

[0012] The purpose of this invention is to maintain the grinding precision of the outer periphery of a semiconductor wafer for a long period of time with high accuracy.

[0013] Technical solutions to solve technical problems

[0014] A semiconductor wafer polishing apparatus includes: a column with a chuck for holding the semiconductor wafer; a reciprocating stage mounted reciprocally on a base member and having the column mounted thereon; a polishing head that rotatably supports a polishing pad having a rotation center axis perpendicular to the reciprocating direction of the reciprocating stage, for polishing the outer periphery of the semiconductor wafer; a support stage that supports a sliding plate on which the polishing head is mounted, allowing it to move freely in the same direction as the reciprocating stage; a pressure applying member mounted on the base member that applies pressure toward the polishing head to the semiconductor wafer via the reciprocating stage; and an actual load measuring device mounted between the support stage and the sliding plate that measures the actual load applied to the polishing pad and the semiconductor wafer by the pressure applying member.

[0015] Invention Effects

[0016] Because the pressing pressure applied from the polishing pad to the outer periphery of the semiconductor wafer can be set with high precision, i.e., the actual load, the polishing accuracy of the outer periphery of the semiconductor wafer can be maintained for a long time. Attached Figure Description

[0017] Figure 1 This is a three-dimensional diagram showing a grinding apparatus for semiconductor wafers.

[0018] Figure 2 yes Figure 1 The main view.

[0019] Figure 3 yes Figure 2 The right-side view.

[0020] Figure 4a It is a top view showing a semiconductor wafer with directional notches.

[0021] Figure 4b It is a top view showing a semiconductor wafer with a directional plane.

[0022] Figure 5 yes Figure 1 An enlarged 3D view of the chuck drive unit shown.

[0023] Figure 6 yes Figure 5 The main view.

[0024] Figure 7 It means Figure 1 A magnified front view of the pad drive unit in the image.

[0025] Figure 8 It means Figure 7 A three-dimensional view of the back side.

[0026] Figure 9 It means Figure 7 A three-dimensional view of the upper part.

[0027] Figure 10 It is a pneumatic circuit used to supply compressed air to the pressing cylinder.

[0028] Figure 11 This is a block diagram representing the control circuit of the grinding device.

[0029] Figure 12a This is a schematic diagram illustrating the principle of measuring the pressing pressure of the abrasive pad of the present invention.

[0030] Figure 12b This is a schematic diagram illustrating the principle of pressure measurement for an abrasive pad used as a comparative example.

[0031] Explanation of reference numerals in the attached figures

[0032] 10: Grinding device; 11: Chuck drive unit; 12: Pad drive unit; 13: Base component; 14: Reciprocating moving table; 17: Column; 19: Swing arm; 21: Chuck; 26: Space; 31: Drive box; 41: Pressing cylinder (pressure imparting component); 45: Support table; 48: Support worktable; 54: Sliding plate; 55: Grinding head; 66: Grinding pad; 68: Pressing amount measuring device; 76: Force sensor (actual load measuring device). Detailed Implementation

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figures 1 to 3 The semiconductor wafer polishing apparatus 10 shown is illustrated in the state of polishing a pre-processed orientation notch on the outer periphery of the semiconductor wafer W. This polishing apparatus 10 can polish not only the notch but also the orientation plane. Figure 4a This refers to a semiconductor wafer W, which has a notch V for orientation machined on its outer periphery. Figure 4b This indicates a semiconductor wafer W with a plane F being processed.

[0034] like Figures 1 to 3 As shown, the grinding apparatus 10 includes a chuck driving unit 11 that drives a chuck holding a semiconductor wafer W as a workpiece, and a pad driving unit 12 that drives a grinding pad that performs grinding processing on a notch V or a plane F pre-processed on the outer periphery of the workpiece W.

[0035] (Chuck drive unit)

[0036] like Figure 5 and Figure 6 As shown, on a base component 13 arranged in a horizontal direction, a chuck drive unit 11 includes a reciprocating stage 14 that is freely mounted for reciprocating movement in a linear direction. A guide block 15 is mounted on the reciprocating stage 14, and the guide block 15 is freely mounted along a guide rail 16 fixed to the base component 13. The reciprocating stage 14 is guided and moved by the guide rail 16. The direction of movement of the reciprocating stage 14 is... Figure 1 and Figure 6 In the X-axis direction shown, if the chuck drive unit 11 is... Figure 6 If the shown face is designated as the front, then the movement direction of the reciprocating moving stage 14 becomes the left-right direction. It should be noted that... Figure 1 and Figure 5 The illustration of the base component 13 is omitted in the text.

[0037] A column 17 is mounted on a reciprocating stage 14, and a swing shaft 18 is rotatably mounted on the column 17, with its front end protruding from the front of the column 17. The swing shaft 18 has a swing center axis O extending in the Y-axis direction, which is perpendicular to the X-axis direction, and a swing arm 19 is provided on the swing shaft 18. A chuck 21 for holding a semiconductor wafer W is provided on the swing arm 19. The chuck 21 is centered on the swing shaft 18, as shown in the image. Figure 5 and Figure 6 As shown, it swings freely within an angle θ in the vertical direction. In the case shown, it swings within a range of 70° vertically relative to the horizontal position.

[0038] The chuck 21 has a drive housing 22 mounted on the swing arm 19. A retaining member 23 is provided on one side of the drive housing 22, and a movable retaining member 24 is provided on the other side. The retaining member 23 has two retaining bars 25 extending in the X-axis direction, and each retaining bar 25 has two claw portions 25a at its front end that contact the outer peripheral surface of the workpiece W. Figure 5As shown, a space 26 for grinding is formed between the two claw portions 25a. On the other hand, the retaining member 24 extends perpendicularly to the retaining rod 25, and has two claw portions 24a at both ends that contact the outer peripheral surface of the workpiece W. The two claw portions 24a are spaced apart by a gap wider than the space 26. Each claw portion 25a, 24a is formed of a material with suitable elasticity and chemical resistance, such as fluororubber.

[0039] Inside the drive box 22, a cylinder (not shown) is assembled, and a retaining component 24 is mounted on the cylinder rod 27. The jaws 24a of the retaining component 24 can reciprocate freely in both directions of approach and distance from the jaws 25a of the retaining component 23 via the cylinder. The jaws 25a and 24a contact the outer periphery of the workpiece W, which is supported by the chuck 21. The four jaws 25a and 24a form a support surface for the workpiece W, which swings within an angle θ around the swing center axis O. The swing center of the support surface, which is also the swing center of the workpiece W, is the position of the swing center axis O in the space 26 between the two jaws 25a.

[0040] like Figure 3 As shown, a conduit 28, consisting of hoses for supplying / discharging compressed air to / from the internal cylinders, is installed on the drive box 22. A wiring 29, consisting of signal cables for transmitting control signals to control the cylinders, is also installed on the drive box 22. The conduit 28 and wiring 29 connect to external control equipment. Wiring and conduit (not shown) are provided between the control equipment and the column 17.

[0041] A drive housing 31 is fixed to the lower surface of the column 17, and the drive housing 31 protrudes downward from the through hole 32 formed in the base component 13. An electric motor 33 for workpiece oscillation is mounted on the front of the drive housing 31. A pulley 34 of the main shaft of the electric motor 33 is disposed inside the drive housing 31, and a pulley 35 of the oscillation shaft 18 is disposed inside the column 17. A belt 36 is strung between the two pulleys 34 and 35. The rotation of the main shaft of the electric motor 33 is transmitted to the chuck 21 via the belt 36, and the workpiece W is driven by the electric motor 33 with the oscillation center as the center.

[0042] (Pillar drive)

[0043] like Figure 6 As shown, a guide rail 37 is mounted on the lower surface of the base component 13 extending along the X-axis direction, and a positioning electric motor 38 is mounted on the guide rail 37. A slider 39 mounted on the guide rail 37 is threadedly engaged with a ball screw driven by the rotation of the main shaft of the electric motor 38, and the slider 39 reciprocates in the X-axis direction by the electric motor 38.

[0044] A pneumatic cylinder 41 is mounted on the slider 39 via a bracket 42. The piston rod 43 of the cylinder 41 is fixed to the mounting platform 67 of the drive housing 31 and presses against the connecting block 44. Therefore, if the piston rod 43 of the cylinder 41 is driven in a protruding direction, the column 17... Figure 2 The piston rod 43 is driven to the left. A contacting member 43a, consisting of a nut or similar component that contacts the inner surface of the mounting platform 67, is provided on the piston rod 43. When the piston rod 43 moves backward, the contacting member 43a contacts the mounting platform 67, and the column 17... Figure 2 The chuck 21 is driven to the right. Thus, the chuck 21 is moved by the electric motor 38. Figure 2 and Figure 6 The processing position shown and the position closer to this position Figure 6 The workpiece moves back and forth between the mounting positions in the middle-right direction.

[0045] (Pad Drive Unit)

[0046] like Figure 7 As shown, the pad drive unit 12 includes a support platform 45. (As indicated...) Figures 7 to 9 As shown, two guide rails 46 are mounted on the support platform 45 extending along the Y-axis direction, and a support worktable 48 is mounted on the sliders 47 mounted on each guide rail 46. A frame 49 is mounted on the support platform 45, and an oscillating electric motor 51 is mounted on the frame 49. The feed screw 52 mounted on the spindle of the electric motor 51 is threadedly engaged with the nut of the nut assembly 53 fixed to the support worktable 48. Therefore, the support worktable 48 moves along the Y-axis direction via the electric motor 51. Furthermore, in Figure 1 , Figure 8 as well as Figure 9 The diagram of support platform 45 is omitted in the text.

[0047] A sliding plate 54 is movably mounted on a support table 48 in the same direction as the reciprocating stage 14, i.e., the X-axis direction. A grinding head 55 is mounted on the lower surface of the sliding plate 54 in the vertical direction, i.e., the Z-axis direction. The grinding head 55 is formed of a hollow, cylindrical housing component, passing through a through hole 56 formed in the support table 48 and a through hole 57 formed in the support table 45, and protruding downwards towards the support table 45. A drive-side pulley 61 is rotatably mounted on the front side of a support plate 58, which is fixed perpendicularly to the upper surface of the sliding plate 54. A grinding shaft 62 is rotatably mounted on the lower end of the grinding head 55. A driven-side pulley 63 mounted on the grinding shaft 62 is disposed within the grinding head 55 and protrudes towards the back side of the grinding head 55. A belt 64 is strung between the two pulleys 61 and 63. Figure 8 and Figure 9As shown, a grinding motor 65 is mounted on the back side of the support plate 58, and a pulley 61 on the drive side is mounted on the main shaft of the motor 65. A power supply line that supplies power to the motor 65 is connected to an externally fixed control device.

[0048] (Abrasive pad)

[0049] Two circular grinding pads 66 are mounted on the grinding shaft 62 and are driven to rotate by an electric motor 65 via a belt 64. The rotation center axis P of the grinding pads 66 is in the Y-axis direction, which is perpendicular to the reciprocating direction of the reciprocating table 14, i.e., the X-axis direction, and is parallel to the support table 48. The grinding surface of the outer periphery of the grinding pads 66, which rotates around the rotation center axis P, rotates and moves in a direction traversing the outer periphery of the workpiece W, thus grinding the outer periphery of the workpiece W. Since multiple grinding pads 66 are provided on the grinding head 55, the grinding of the notch V can be performed using any of the grinding pads 66. After one grinding pad 66 wears out, another grinding pad 66 can be used to process the notch V of a new workpiece W. This extends the time until the grinding pad 66 is replaced with a new one.

[0050] (Applying pressure to the abrasive pad)

[0051] When grinding the outer periphery of the semiconductor wafer W using the grinding pad 66, a pressing force is applied to the workpiece W towards the grinding pad 66 via the pressing cylinder 41, connecting block 44, drive box 31, column 17, and chuck 21. When a pressing force is applied from the semiconductor wafer W to the grinding pad 66, a pressing force is applied from the grinding pad 66 to the outer periphery of the semiconductor wafer W as a reaction force. Thus, the pressing cylinder 41 constitutes a pressing force applying force to the semiconductor wafer W towards the grinding pad 66. The pressing force applying component is not limited to the pressing cylinder 41; the pressing force can also be applied via the connecting block 44 using an electric motor that drives the feed screw, a compression coil spring, or the like.

[0052] like Figure 6 As shown, a pressing amount measuring device 68 for detecting the pressing stroke of the pressing cylinder 41 is provided on the mounting platform 67 fixed to the drive box 31. When the slider 39 is driven by the electric motor 38... Figure 2 When driven to the left, as described above, the drive box 31 is driven to the left via the mounting platform 67 by pressing the cylinder 41.

[0053] Figure 10This is a pneumatic circuit for supplying compressed air to the pressing cylinder 41. A pressure regulating valve 73 is provided on the pipe 72 connecting the pneumatic supply source 71 (composed of a compressor, etc.) and the pressing cylinder 41 to adjust the pressure of the compressed air discharged from the pneumatic supply source 71, and an on / off valve 74 is provided to switch between supplying compressed air to the pressing cylinder 41 and cutting off the supply. Thus, the pressing force applied to the outer peripheral surface of the semiconductor wafer W is set by the pressure regulating valve 73 and by the pressure of the compressed air supplied to the pressurization chamber of the pressing cylinder 41.

[0054] (Based on the determination of the actual load of the pressure)

[0055] like Figures 7 to 9 As shown, bracket 75 is fixed to support table 48, and force sensor 76 is mounted on bracket 75 as an actual load measuring device. On the other hand, a pressure rod 78 is mounted on bracket 77 mounted on sliding plate 54. When pressing force is applied to grinding pad 66, the pressing force is transmitted to force sensor 76 via pressure rod 78, and the pressing force is detected by force sensor 76. As described above, although force sensor 76 is mounted on support table 48 via bracket 75 and pressure rod 78 is mounted on sliding plate 54 via bracket 77, if force sensor 76 is arranged between support table 48 and sliding plate 54, it is also possible to mount force sensor 76 on sliding plate 54 and pressure rod 78 on support table 48.

[0056] Supply pipes 79a and 79b are mounted on the side of column 17 for applying a slurry-like polishing slurry to the workpiece and polishing pad 66. Supply pipe 79a applies the polishing slurry from the upper side of the semiconductor wafer W, and supply pipe 79b applies the polishing slurry from the lower side. The nozzles of the two supply pipes 79a and 79b face the space 26 and are opposite to each other. Each supply pipe 79a and 79b is connected to an external polishing slurry supply unit via piping (not shown).

[0057] Figure 11 This is a block diagram showing the control circuit of the grinding apparatus 10. The control unit 81 has a memory for storing control programs, calculation formulas, mapping data, and temporary data, as well as a microprocessor for processing control signals, and sends control signals to the aforementioned electric motors 33, 38, 51, and 65. The operation panel 82 is connected to the control unit 81, and operation switches such as those for issuing commands to start the grinding operation of the grinding apparatus 10 are provided on the operation panel 82. The control unit 81 sends a control signal to the on / off valve 74. If the on / off valve 74 is opened, compressed air is supplied to the pressing cylinder 41. The pressing force applied to the grinding pad 66 by the pressing cylinder 41 is measured by the force sensor 76, and the measured signal is sent to the control unit 81.

[0058] (Grinding sequence of the notch)

[0059] A semiconductor wafer W, with a notch V pre-machined on its outer periphery, is mounted and held in chuck 21. The workpiece mounting position at this time is... Figure 2 The semiconductor wafer W is positioned and mounted on the chuck 21 with the notch V centered in the space 26 between the two retaining rods 25, positioned slightly to the right. Meanwhile, the support stage 48 is driven by the electric motor 51 to position one of the two polishing pads 66 in the space 26. In this state, the electric motor 38 is driven, and the column 17 is conveyed to… Figure 2 and Figure 6 The grinding position shown is such that the notch V is positioned at the position of the swing center axis O and at the position of space 26.

[0060] When the electric motor 38 is driven, the column 17 is driven toward the grinding head 55. If the column 17 is driven until the grinding pad 66 enters the notch V, the electric motor 38 stops. Then, the on / off valve 74 is opened, and pressing force is applied to the grinding pad 66 via the pressing cylinder 41 through the column 17 and the chuck 21. The duration for which the on / off valve 74 remains open is set by a timer installed in the control unit 81. The pressing force is detected by the force sensor 76, which confirms whether a predetermined pressing force has been applied.

[0061] In this state, the drive motor 65 rotates the polishing pad 66 to polish the notch V. During this polishing process, the drive motor 33 is driven, and the semiconductor wafer W is moved by the rocker arm 19 around the notch V. Figure 6 The horizontal position shown by the arrow oscillates within an angle θ in the vertical direction. Furthermore, the electric motor 51 is driven, causing the grinding pad 66 to oscillate and reciprocate slightly along the Y-axis.

[0062] (Comparison based on the principles of pressure measurement)

[0063] Figure 12a This is a schematic diagram illustrating the principle of measuring the pressing pressure of the abrasive pad of the present invention. Figure 12b This is a schematic diagram illustrating the principle of pressure measurement for an abrasive pad used as a comparative example.

[0064] like Figure 12a and Figure 12b As shown, the reciprocating stage 14, which is freely mounted on the base component 13, experiences sliding resistance R1 from the base component 13, and the column 17 experiences wiring / piping resistance R2 from the wiring / piping installed between the column 17 and the external fixed part, and the piping connected to the supply pipes 79a, 79b, etc. A pressing force is applied from the pressing cylinder 41 to the reciprocating stage 14 to slide the reciprocating stage 14, including the column 17, chuck 21, etc. The sliding resistance R1 and the wiring / piping resistance R2 cannot be avoided changing over time / years.

[0065] like Figure 12b As shown in the comparative example, when a force sensor 76 is installed between the pressing cylinder 41 and the reciprocating stage 14, and the pressing force applied to the semiconductor wafer W is measured by the pressing load applied by the pressing cylinder 41 to the reciprocating stage 14, the measured value includes the sliding resistance R1 and the wiring and piping resistance R2. Therefore, the force sensor 76 can only monitor whether the pressing load of the pressing cylinder 41 is output as instructed. Since the measured value of the force sensor 76 is affected by changes over time / years, it is not the actual pressing load applied to the semiconductor wafer W.

[0066] In contrast, such as Figure 12a As shown in the present invention, when a force sensor 76 is arranged between the polishing head 55 and the support table 48, the force sensor 76 can detect the actual load applied from the polishing pad 66 to the semiconductor wafer W even if the sliding resistance R1 and the wiring and piping resistance R2 change. This improves the accuracy of the pressing load detection and enhances the polishing quality of the outer peripheral surface of the semiconductor wafer W over a long period. When the sliding table 54 moves a long distance on the support table 48, the sliding table 54 is subject to sliding resistance relative to the support table 48 and piping resistance of the power supply cable connected to the electric motor 65. However, when the force sensor 76 detects the load, the sliding table 54 only moves a distance that transmits the pressing load to the force sensor 76, i.e., only a distance of less than 1 mm (micrometer unit). The load measurement value of the force sensor 76 is not affected by the sliding resistance of the sliding table 54 or the piping resistance of the power supply cable.

[0067] Furthermore, the pressure of the compressed air supplied to the pressing cylinder 41 can be controlled by feedback based on the pressing load detected by the force sensor 76, so as to change the pressing load of the pressing cylinder 41 on the semiconductor wafer W. This is achieved through control. Figure 10 The pressure regulating valve 73 shown can freely control the pressure, so by controlling the pressure of the compressed air supplied to the pressing cylinder 41 to detect the pressing force set by the force sensor 76, the pressing force of the grinding pad 66 can always be maintained at the set value.

[0068] (Grinding of oriented planes)

[0069] like Figure 4b As shown, the polishing apparatus 10 can also perform polishing processing on the plane F of the semiconductor wafer W. In this case, instead of the polishing pad 66 on the disk, a cylindrical polishing pad is mounted on the polishing head 55. Furthermore, Figure 5 The retaining rod 25 shown has been replaced with one for surface grinding. The dimensions of the space 26 in the retaining rod 25 for surface grinding are different from those for recess grinding.

[0070] This invention is not limited to the above-described embodiments, and various modifications can be made without departing from its spirit.

Claims

1. A grinding apparatus for semiconductor wafers, comprising: A post, which holds the semiconductor wafer chuck in place; A reciprocating moving stage is mounted on a base component and has the aforementioned column installed on it; A grinding head rotatably supports a grinding pad, the grinding pad having a rotational central axis perpendicular to the reciprocating direction of the reciprocating stage, for grinding the outer periphery of the semiconductor wafer; The support table supports the sliding plate on which the grinding head is mounted, allowing it to move freely in the same direction as the reciprocating moving table. A pressure-applying component, mounted on the base component, applies pressure towards the grinding head to the semiconductor wafer via the reciprocating stage; and An actual load measuring device is installed between the support worktable and the sliding plate to measure the actual load applied to the polishing pad and the semiconductor wafer by the pressure-applying component.

2. The semiconductor wafer polishing apparatus according to claim 1, wherein, The column has a swing arm with the outer periphery of the semiconductor wafer as its swing center, and the chuck is disposed on the swing arm. The semiconductor wafer is oscillated around the outer periphery where it is to be ground by means of a swing arm.

3. The semiconductor wafer polishing apparatus according to claim 1, wherein, The semiconductor wafer polishing apparatus has: A support platform supports the support worktable so that it can move freely in a direction parallel to the rotation center axis; as well as A feed motor, mounted on the support platform, drives a feed screw threaded into the support platform. The grinding head has multiple grinding pads with the same central axis of rotation. The feed motor positions any one of the multiple polishing pads at the polishing location of the semiconductor wafer.

4. The semiconductor wafer polishing apparatus according to claim 1, wherein, The pressure-applying component is mounted on a bracket driven by a positioning electric motor, which causes the chuck to reciprocate between the processing position and the workpiece mounting position via the pressure-applying component.

Images