Circuit structure and electronic device comprising the same

Abstract

A circuit structure and an electronic device including the same are disclosed. The circuit structure includes a plurality of lines, and each of the plurality of lines has a first portion and a second portion, the first portion and the second portion having a first width W1 and a second width W2, respectively, the second width W2 being different from the first width W1. Furthermore, at least one of the plurality of lines satisfies the following equation: AR1 / AR2=1 / W1 / W2, where AR1 and AR2 are the aperture ratios of the first portion and the second portion, respectively.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to a circuit structure of an electronic device. Background Technology

[0002] Electronic products such as displays, antennas, and optical sensors have become indispensable necessities in modern society. With the rapid development of these electronic products, consumers have high expectations for their quality, functionality, and price.

[0003] Adhesive materials are commonly used to connect substrates in electronic devices. These materials can overlap with components within the device, such as circuitry on the substrate. In some cases, the circuitry needs to be patterned to create openings that allow light to penetrate the adhesive material for curing. However, these openings increase the resistance of the circuitry and negatively impact its performance.

[0004] As mentioned above, the existing structure of electronic devices is not satisfactory in all aspects, and there is still a need to develop structural designs that can improve the performance of electronic devices. Summary of the Invention

[0005] According to some embodiments of the present invention, a circuit structure is provided, the circuit structure comprising a plurality of circuits, each of the plurality of circuits having a first portion and a second portion, the first portion and the second portion having a first width W1 and a second width W2 respectively, the second width W2 being different from the first width W1. Furthermore, at least one of the plurality of circuits satisfies the following formula: AR1 and AR2 are the opening ratios of the first and second parts, respectively.

[0006] According to some embodiments of the present invention, an electronic device is provided, comprising a first substrate, a second substrate, a circuit structure as described above, and an adhesive material. The circuit structure is disposed on at least one of the first substrate and the second substrate, and the adhesive material bonds the first substrate and the second substrate together. Furthermore, at least a portion of the circuit structure overlaps with the adhesive material.

[0007] To make the features or advantages of the present invention more apparent and understandable, some embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0008] The invention can be more fully understood by reading the following detailed description and embodiments, and by referring to the accompanying drawings, wherein:

[0009] Figure 1A This is a top view schematic diagram of the electronic device in some embodiments of the present invention;

[0010] Figure 1B In some embodiments of the present invention, along Figure 1A A schematic diagram of the cross-sectional structure of the electronic device with section I-I' in the figure;

[0011] Figure 2 In some embodiments of the present invention, Figure 1A A top view schematic diagram of the electronic device in one area;

[0012] Figure 3 In some embodiments of the present invention, Figure 2 An enlarged schematic diagram of electronic devices in a portion of the area;

[0013] Figure 4A In some embodiments of the present invention, Figure 3 An enlarged schematic diagram of an electronic device in one area;

[0014] Figure 4B In some embodiments of the present invention, Figure 3 An enlarged schematic diagram of an electronic device in one area;

[0015] Figure 5 This is a top view structural diagram of a region of an electronic device in some embodiments of the present invention;

[0016] Figure 6A In some embodiments of the present invention, Figure 5 An enlarged schematic diagram of an electronic device in one area;

[0017] Figure 6B In some embodiments of the present invention, Figure 5 An enlarged schematic diagram of an electronic device in one area;

[0018] Figure 7 This is a top view structural diagram of a region of an electronic device in some embodiments of the present invention;

[0019] Figure 8A In some embodiments of the present invention, Figure 7 An enlarged schematic diagram of an electronic device in one area;

[0020] Figure 8B In some embodiments of the present invention, Figure 7 An enlarged schematic diagram of an electronic device in one area;

[0021] Figure 9 This is a top view structural diagram of a region of an electronic device in some embodiments of the present invention;

[0022] Figure 10A In some embodiments of the present invention, Figure 9 An enlarged schematic diagram of an electronic device in one area;

[0023] Figure 10B In some embodiments of the present invention, Figure 9 An enlarged schematic diagram of an electronic device in one area.

[0024] Symbol Explanation

[0025] 10: Electronic devices

[0026] 12: Panel

[0027] 14: Flexible Circuit Board

[0028] 16: Printed Circuit Board

[0029] 102a:Substrate

[0030] 102b:Substrate

[0031] 104: Line Structure

[0032] 104e: Edge

[0033] 104f: Edge

[0034] 104i: Internal branch section

[0035] 104i-1: Internal branch section

[0036] 104i-2: Internal branch section

[0037] 104i-3: Internal branch section

[0038] 104i-4: Internal branch section

[0039] 104i-5: Internal branch section

[0040] 104o: Outer branch

[0041] 104o-1: Outer branch portion

[0042] 104o-2: Outer branch portion

[0043] 104R: Branch Section

[0044] 104w: Line

[0045] 106: Adhesive Material

[0046] 108a: Protective layer

[0047] 108b: Protective layer

[0048] 110: Shielding layer

[0049] AA: Active (Active) Region

[0050] AK: Alignment element

[0051] BA: Surrounding Area

[0052] C1: Centerline

[0053] C2: Rightmost edge

[0054] C3: Leftmost edge

[0055] CL: Connection part

[0056] D1: Distance

[0057] E104: Extension direction

[0058] G1: First gap width

[0059] G2: Second gap width

[0060] G2-1: Second gap width

[0061] G2-2: Second gap width

[0062] G2-3: Second gap width

[0063] G2-4: Second gap width

[0064] L: Light source

[0065] L1: First Length

[0066] L1-1: Length

[0067] L1-2: Length

[0068] L2: Second Length

[0069] L2-1: Length

[0070] L2-2: Length

[0071] OP: Open

[0072] OP-1: Opening

[0073] OP-2: Opening

[0074] P0: Bending section

[0075] P1: Part 1

[0076] P2: Part Two

[0077] R0: Region

[0078] R1: Region

[0079] R2: Region

[0080] R3: Region

[0081] R4: Region

[0082] R5: Region

[0083] R6: Region

[0084] R7: Region

[0085] R8: Region

[0086] R9: Region

[0087] R10: Region

[0088] R11: Region

[0089] R12: Region

[0090] SW: Switch structure

[0091] TK: Test Component

[0092] I-I': Cutoff line

[0093] W1: First width

[0094] W1-1: Width

[0095] W1-2: Width

[0096] W2: Second width

[0097] W2-1: Width

[0098] W2-2: Width

[0099] W3: Third width

[0100] W4: Fourth Width

[0101] W5: Fifth Width Detailed Implementation

[0102] The circuit structure and electronic device of the present invention will be described in detail below according to embodiments of the present invention. In the following detailed description, for illustrative purposes, numerous specific details and embodiments are set forth to provide a thorough understanding of the present invention. The specific elements and arrangements described in the following detailed description are merely for clearly describing some embodiments of the present invention. It is obvious that these exemplary embodiments are merely illustrative and not intended to limit the present invention. Furthermore, similar and / or corresponding reference numerals may be used in different embodiments to identify similar and / or corresponding elements to clearly describe the present invention. However, the use of these similar and / or corresponding reference numerals is merely for the simple and clear description of some embodiments of the present invention and does not imply any correlation between the different embodiments and / or structures discussed.

[0103] The description of the embodiments of the present invention can be understood in conjunction with the accompanying drawings, which are also considered part of the disclosure. It should be understood that the drawings of the present invention are not drawn to scale; in fact, the dimensions of the elements may be arbitrarily enlarged or reduced to clearly illustrate the features of the embodiments of the present invention.

[0104] It should be understood that relative terms, such as "lower," "bottom," "higher," or "top," may be used in the embodiments to describe the relative relationship of one element to another in the figures. It is understood that if the apparatus in the figures is flipped upside down, an element described as being on the "lower" side will become an element on the "higher" side. Furthermore, when referring to a first element or layer being disposed on a second element or layer, it may include the first element or layer being directly disposed on the second element or layer, or the existence of an intermediate element or layer between the first element or layer and the second element or layer. Conversely, when referring to a first element or layer being directly disposed on a second element or layer, there is no intermediate element or layer between the first element or layer and the second element or layer.

[0105] According to some embodiments of the present invention, unless otherwise specifically defined, terms relating to connection, coupling, etc., such as "connection" and "interconnection," may represent two structures in direct contact, or may represent two structures not in direct contact and with other structures between them. Furthermore, the term "electrically connected to" may mean "directly electrically connected to" or "indirectly electrically connected to".

[0106] Furthermore, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, components, or parts, these elements, components, or parts should not be limited by these terms. These terms are only used to distinguish different elements, components, or parts. Therefore, the first element, component, or part discussed below may be referred to as the second element, component, or part without departing from the teachings of the present invention.

[0107] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number for that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, "first element" in the specification may be "second element" in the claims.

[0108] In this text, the terms "about," "approximately," and "substantially" generally indicate that a given value or range is within ±10%, ±5%, ±3%, ±2%, ±1%, or ±0.5%. The given quantity is an approximate quantity; that is, even without specific mention of "about," "approximately," or "substantially," their meaning is implied. Furthermore, the phrases "range from the first value to the second value" or "range between the first value and the second value" indicate that the range includes the first value, the second value, and other values ​​in between.

[0109] In this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This invention is not intended to distinguish between components that have the same function but different names. In the following description and claims, the terms "comprising" and "including" are open-ended terms and should therefore be interpreted as meaning "including but not limited to...".

[0110] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0111] Furthermore, it should be understood that features from several different embodiments can be combined, modified, substituted, or recombined to complete other embodiments without departing from the spirit of the invention. Features from each embodiment can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with it.

[0112] According to some embodiments of the present invention, an electronic device including a circuit structure is provided, wherein the width and aperture ratio of the circuit structure are designed to satisfy a specific formula, thereby ensuring that the curing of the adhesive material in different areas of the electronic device is consistent, and furthermore, the resistance of the circuit structure can be maintained.

[0113] Please refer to Figure 1A , Figure 1A The diagram shown is a top view of the electronic device 10 according to some embodiments of the present invention. It should be understood that, for clarity, Figure 1AOnly some components of the electronic device 10 are shown below. According to some embodiments, additional features or components may be selectively added to the electronic device 10. According to some embodiments, some features of the electronic device 10 described below may be selectively replaced or omitted.

[0114] According to some embodiments, the electronic device 10 may include a display device, an antenna device, a sensing device, a splicing device, other suitable devices, or combinations thereof, but is not limited thereto. The display device may include a touch display device, a curved display device, or an irregularly shaped display device. The electronic device 10 may be a bendable or flexible electronic device. Furthermore, the electronic device 10 may include light-emitting diodes (LEDs), fluorescent materials, phosphorescent materials, quantum dots (QDs), other suitable materials, or combinations thereof, but is not limited thereto. Light-emitting diodes may include, for example, inorganic light-emitting diodes (OLEDs), organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, quantum dot (QD) light-emitting diodes (QLEDs or QDLEDs), or combinations thereof, but are not limited thereto. Antenna devices may be, for example, liquid crystal antenna devices, but are not limited thereto. Splicing devices may be, for example, spliced ​​display devices or spliced ​​liquid crystal devices, but are not limited thereto. It should be understood that the electronic device 10 of the embodiments of the present invention can be any combination of the foregoing, but is not limited thereto. Furthermore, the shape of the electronic device 10 can be rectangular, circular, polygonal, irregular, with curved edges, or other suitable shapes. Moreover, according to some embodiments, the electronic device 10 may have peripheral systems such as a drive system, a control system, a light source system, or a shelving system to support the display device or antenna device.

[0115] Please refer to Figure 1A as well as Figure 1B , Figure 1B According to some embodiments of the present invention, along Figure 1AThe diagram shows a cross-sectional view of the electronic device 10 along line I-I'. According to some embodiments, the electronic device 10 may include a panel 12, a flexible circuit board (FCB) 14, an adhesive material 106, and a printed circuit board (PCB) 16. According to some embodiments, the panel 12 can be electrically connected to the PCB 16 via the flexible circuit board 14. Specifically, according to some embodiments, the electronic device 10 may be an organic light-emitting diode display device, a liquid crystal display device, or a liquid crystal antenna device. The panel 12 may include an active area AA, a peripheral area BA, a substrate 102a, a substrate 102b, and a circuit structure 104. The peripheral area BA of the panel 12 may be adjacent to or surround the active area AA of the panel 12. According to some embodiments, the active area AA of the panel 12 may include a driving element, a display element, a working element, a modulation element, or a combination thereof, but is not limited thereto. According to some embodiments, the active area AA of the panel 12 may correspond to the working area of ​​the electronic device 10, while the peripheral area BA of the panel 12 may correspond to the non-working area of ​​the electronic device 10. In embodiments where the electronic device 10 is a light-emitting diode display device or a liquid crystal display device, the active area AA of the panel 12 may be the display area, and the peripheral area BA of the panel 12 may include the area of ​​peripheral circuitry or adhesive material 106. In embodiments where the electronic device 10 is a liquid crystal antenna device, the peripheral area BA of the panel 12 may include the area of ​​peripheral circuitry or adhesive material 106, and the area other than those described above may be the active area AA of the panel 12. According to some embodiments, the circuit structure 104 (e.g., Figure 1B (As shown) can be located in the peripheral area BA. According to some embodiments, the line structure 104 can extend from the active area AA to the peripheral area BA. According to other embodiments, the line structure 104 can be electrically connected to a driving element, display element, operating element, or modulation element in the active area AA. It should be noted that, although in Figure 1B The circuit structure 104 is directly disposed on the substrate 102a (e.g., the circuit structure 104 may serve as a first additional metal layer). However, according to some embodiments, the circuit structure 104 may not be directly disposed on the substrate 102a, and an intermediate layer may exist between the circuit structure 104 and the substrate 102a (e.g., the circuit structure 104 may serve as a second additional metal layer). According to some embodiments, the circuit structure 104 may simultaneously serve as both a first additional metal layer and a second additional metal layer.

[0116] According to some embodiments, substrate 102a may be opposite to substrate 102b, and circuit structure 104 may be disposed on substrate 102a. According to some embodiments, multiple driving elements may be disposed on substrate 102a, and the multiple driving elements may form an active matrix driving circuit or a passive matrix driving circuit. According to some embodiments, chip-on-film (COF) or chip-on-glass (COG) packaging methods may be used to dispose of the driving elements on substrate 102a, but are not limited thereto.

[0117] According to some embodiments, substrates 102a and 102b may be flexible substrates, rigid substrates, or combinations thereof. According to some embodiments, the materials of substrates 102a and 102b may include glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or combinations thereof, but are not limited thereto. According to some embodiments, the material of substrate 102a may be the same as or different from the material of substrate 102b. Furthermore, the light transmittance of substrates 102a and 102b is not limited; that is, substrates 102a and 102b may be transparent substrates, semi-transparent substrates, or opaque substrates.

[0118] As described above, the circuit structure 104 can be electrically connected to components located in the active region AA. Furthermore, the circuit structure 104 can transmit signals from the active region AA to the peripheral region BA. For example, the signals may include, but are not limited to, Vcom signals, VGH signals, VGL signals, clock signals, STV signals, or data signals. According to some embodiments, the material of the circuit structure 104 may include a conductive material. According to some embodiments, the conductive material may include metallic conductive materials, transparent conductive materials, or combinations thereof, but is not limited to. For example, metallic conductive materials may include copper (Cu), aluminum (Al), tungsten (W), titanium (Ti), gold (Au), platinum (Pt), nickel (Ni), copper alloys, aluminum alloys, tungsten alloys, titanium alloys, gold alloys, platinum alloys, nickel alloys, other suitable materials, or combinations thereof, but are not limited to. Transparent conductive materials may include transparent conductive oxides (TCOs), such as indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or combinations thereof, but are not limited thereto.

[0119] like Figure 1B As shown, the circuit structure 104 may have multiple open-ended (OP) apertures. According to some embodiments, the OP apertures can be formed through a patterning process, which may include photolithography and / or etching processes. The photolithography process may include, but is not limited to, photoresist coating (e.g., spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning, and drying. The etching process may include dry etching or wet etching, but is not limited to these.

[0120] Please refer to Figure 1BAccording to some embodiments, an adhesive material 106 may be disposed between substrate 102a and substrate 102b, and the adhesive material 106 may bond substrate 102a and substrate 102b together. According to some embodiments, at least a portion of the circuit structure 104 may overlap with the adhesive material 106. According to some embodiments, the adhesive material 106 may comprise a photocurable adhesive, a photothermal curable adhesive, other suitable materials, or combinations thereof, but is not limited thereto. According to some embodiments, the adhesive material 106 may comprise epoxy resin, acrylic resin, filler, photoinitiator, coupling agent, or combinations thereof, but is not limited thereto. According to some embodiments, the adhesive material 106 may comprise optically clear adhesive (OCA), optically clear resin (OCR), glass frit, or combinations thereof. According to some embodiments, the circuit structure 104 may be disposed between the adhesive material 106 and substrate 102a.

[0121] In addition, according to some embodiments, panel 12 may further include a protective layer 108a, a protective layer 108b, and a shielding layer 110. The protective layer 108a may be disposed between the substrate 102a and the adhesive material 106, the protective layer 108b may be disposed between the substrate 102b and the adhesive material 106, and the shielding layer 110 may be disposed on the substrate 102b and between the substrate 102b and the protective layer 108b.

[0122] According to some embodiments, protective layers 108a and 108b may comprise inorganic materials, organic materials, or combinations thereof. According to some embodiments, the inorganic material may comprise silicon nitride, silicon oxide, silicon oxynitride, other suitable materials, or combinations thereof, but is not limited thereto. According to some embodiments, the organic material may comprise polyethylene terephthalate (PET), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), polyurethane (PU), silicone, polytetrafluoroethylene (PTFE), other suitable materials, or combinations thereof, but is not limited thereto.

[0123] According to some embodiments, the shielding layer 110 may at least partially overlap with the circuit structure 104 in the normal direction of the substrate 102a (e.g., the Z direction in the figures). The shielding layer 110 may shield the circuit structure 104 so that the circuit structure 104 is not visible from the front of the electronic device 10 (e.g., the side near the substrate 102b). According to some embodiments, the shielding layer 110 may, for example, comprise an opaque material such as a black matrix material, but is not limited thereto. For example, the black matrix material may comprise organic resins, glass pastes, and resins or pastes comprising black pigments, metal particles (e.g., nickel, aluminum, molybdenum, and alloys thereof), metal oxide particles (e.g., chromium oxide), or metal nitride particles (e.g., chromium nitride), or any other suitable material, but is not limited thereto.

[0124] It should be noted that, according to some embodiments, the light source L may be disposed near the substrate 102a on which the circuit structure 104 is disposed (e.g., the back side of the electronic device 10). Light emitted from the light source L can pass through the opening OP of the circuit structure 104 and cure the adhesive material 106.

[0125] Please refer to Figure 2 , Figure 2 This is shown in some embodiments of the present invention, in Figure 1A The diagram shows the top view of the electronic device 10 in region R0. Furthermore, components or elements that are the same or similar to those described above will be indicated by the same or similar designations in the following text. Their materials, manufacturing methods, and functions are the same or similar to those described above, therefore this part will not be repeated in the following text.

[0126] like Figure 2 As shown, the circuit structure 104 may contain multiple circuits 104w, which may be arranged adjacent to each other and spaced apart by a distance. The circuits 104w may be patterned to have openings OP (see reference). Figures 1A-1B According to some embodiments, line 104w may be electrically connected to flexible circuit board 14. According to some embodiments, panel 12 may further include a switch structure SW disposed on substrate 102a, and at least one of line 104w may be electrically connected to switch structure SW. Switch structure SW may include at least one switching transistor, but is not limited thereto. According to some embodiments, switch structure SW may include a gate driving circuit disposed on panel (GOP circuit). According to some embodiments, panel 12 may further include a driving transistor, reset transistor, or other suitable thin-film transistor, but is not limited thereto.

[0127] Furthermore, according to some embodiments, panel 12 may further include a test key and an alignment key AK, which may be disposed on substrate 102a and in peripheral area BA, respectively. Circuit structure 104 may be disposed adjacent to test key TK and alignment key AK. According to some embodiments, circuit structure 104 is closer to active area AA than test key TK and alignment key AK. According to some embodiments, a portion of circuit 104w may be electrically connected to test key TK, but is not limited thereto.

[0128] like Figure 2 As shown, adhesive material 106 may be disposed in the peripheral area BA. Furthermore, at least a portion of the circuit structure 104 may overlap with adhesive material 106 in the normal direction of the substrate 102a (e.g., the Z direction in the figures). According to some embodiments, the lines 104w of the circuit structure 104 may include some bent portions or bends; for example, the bent portion P0 may be a bent portion of the lines 104w of the circuit structure 104.

[0129] Please refer to Figure 3 , Figure 3 This is shown in some embodiments of the present invention, in Figure 2 Enlarged schematic diagrams of electronic devices 10 in regions R1, R2, R3, and R4. Figure 3 As shown, line 104w can extend in various different directions. According to some embodiments, the configuration of the openings OP in regions R1, R2, R3, and R4 can be different. Specifically, the size, number, or shape of the openings OP in each line 104w can vary depending on their location.

[0130] Please refer to Figure 4A as well as Figure 4B , Figure 4A as well as Figure 4B According to some embodiments of the present invention, in Figure 3 Enlarged schematic diagram of electronic device 10 in regions R5 and R6. (See diagram below.) Figure 4A as well as Figure 4B The configurations of line 104w in regions R5 and R6 differ. According to some embodiments, line 104w may include multiple branch portions 104R. According to some embodiments, a branch portion 104R may have an inner branch portion 104i and an outer branch portion 104o, the outer branch portion 104o being adjacent to one of the inner branch portions 104i, the inner branch portion 104i being located between openings OP. For example, as... Figure 4AAs shown, the inner branch portion 104i-1 is located between openings OP-1 and OP-2, and the outer branch portion 104o is located between opening OP and the edge 104e of line 104w. Furthermore, line 104w may include multiple connecting portions CL, and the connecting portions CL may connect adjacent inner branch portions 104i and adjacent outer branch portions 104o. For example, one of the multiple connecting portions CL may be connected to two adjacent inner branch portions 104i and two adjacent outer branch portions 104o, such as... Figure 4A As shown, the two adjacent inner branch portions 104i can be the two inner branch portions 104i of the leftmost edge C3 and the rightmost edge C2 of the adjacent connecting portion CL. The two adjacent outer branch portions 104o can be the outer branch portions 104o of the leftmost edge C3 and the rightmost edge C2 of the adjacent connecting portion CL. Furthermore, the extension direction of the connecting portion CL can be perpendicular to the extension direction E104 of the line 104w.

[0131] According to embodiments of the present invention, the term "direction of extension" refers to a direction along or substantially parallel to the long axis of an object. Furthermore, according to some embodiments, the direction of extension E104 of line 104w refers to the direction of extension of the outer branch portion 104o of line 104w furthest from the active region AA. For example, see... Figure 4A The extension direction E104 of line 104w refers to the extension direction of the edge 104f of line 104w.

[0132] like Figure 4A as well as Figure 4B As shown, each line 104w may have a first portion P1 and a second portion P2, and the first portion P1 and the second portion P2 respectively have a first width W1 and a second width W2, wherein the second width W2 may be different from the first width W1. Furthermore, at least one of the multiple lines 104w satisfies the following formula:

[0133]

[0134] Where AR1 and AR2 are the aperture ratios of the first part P1 and the second part P2, respectively. According to some embodiments, all lines 104w satisfy the above formula.

[0135] Specifically, according to some embodiments of the present invention, the first portion P1 and the second portion P2 may be two portions randomly selected from the same line 104w. According to some embodiments, the extension direction of the first portion P1 may differ from the extension direction of the second portion P2. Furthermore, each portion may be defined as the area of ​​line 104w between the center lines C1 of two adjacent connecting portions CL. Alternatively, each portion may be defined as the area of ​​line 104w between the rightmost edges C2 of two adjacent connecting portions CL, or the area of ​​line 104w between the leftmost edges C3 of two adjacent connecting portions CL.

[0136] It should be noted that, for clarity, Figure 4A as well as Figure 4B The regions depicted as first portion P1 and second portion P2 include a small portion between two adjacent lines 104w; however, first portion P1 and second portion P2 do not actually include these portions. Instead, first portion P1 and second portion P2 refer to the region between the edges of line 104w (e.g., edges 104e and 104f).

[0137] In addition, such as Figure 4A As shown, the first width W1 of the first portion P1 refers to the average width of the two edges of the first portion P1 (i.e., the edges of the connecting portion CL). According to some embodiments, the two edges of the first portion P1 are substantially perpendicular to the extension direction E104 of the line 104w. More specifically, if the leftmost edge C3 is one of the two edges of the first portion P1, and one of the leftmost edges C3 has a width W1-1 and the other has a width W1-2, then the first width W1 of the first portion P1 refers to the average of widths W1-1 and W1-2. Figure 4B As shown, the second width W2 of the second portion P2 refers to the average width of the two edges of the second portion P2 (i.e., the edges of the connecting portion CL). According to some embodiments, the two edges of the second portion P2 are substantially perpendicular to the extension direction E104 of the line 104w. More specifically, if the leftmost edge C3 is one of the two edges of the second portion P2, and one of the leftmost edges C3 has a width W2-1 and the other has a width W2-2, then the second width W2 of the second portion P2 refers to the average of width W2-1 and width W2-2.

[0138] According to some embodiments, the first width W1 may range from 20 micrometers (μm) to 250 micrometers (20μm ≤ first width W1 ≤ 250μm). According to some embodiments, the second width W2 may range from 20μm to 250μm (20μm ≤ second width W2 ≤ 250μm), but is not limited thereto.

[0139] According to embodiments of the present invention, the width and length of an assembly can be measured from an image obtained from an optical microscopy (OM) microscope, and the thickness of an assembly can be measured from a cross-sectional image obtained from an electron microscope, but is not limited thereto. According to some embodiments, the width, length, or thickness of each element, or the distance between elements, can be measured using an optical microscopy (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. More specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional structural image containing the element to be measured, and the width, length, or thickness of each element, or the distance between elements, can be measured.

[0140] Furthermore, the aperture ratio AR1 of the first part P1 refers to the ratio of the transmittance area (i.e., the area of ​​the opening OP in the first part P1) to the area of ​​the first part P1, and the aperture ratio AR2 of the second part P2 refers to the ratio of the transmittance area (i.e., the area of ​​the opening OP in the second part P2) to the area of ​​the second part P2. According to some embodiments, the aperture ratio AR1 may differ from the aperture ratio AR2. According to some embodiments, the aperture ratio AR1 may range from 10% to 70% (10% ≤ aperture ratio AR1 ≤ 70%). According to some embodiments, the aperture ratio AR2 may range from 10% to 70% (10% ≤ aperture ratio AR2 ≤ 70%). Moreover, the opening OP, the first part P1, and the second part P2 are calculated using the same units.

[0141] Specifically, according to some embodiments, an image of an optical microscope containing a first portion P1 or a second portion P2 can be converted into a black and white image using image processing software (e.g., the color of the image can be removed, and the contrast or gamma correction can be adjusted). The white area in the processed image represents the light-transmitting area, and the white area plus the black area represents the area of ​​the first portion P1 or the second portion P2. The aperture ratio can be obtained by dividing the area of ​​the white area by the area of ​​the white area plus the area of ​​the black area, but the present invention is not limited thereto.

[0142] It should be noted that, according to some embodiments, the width and aperture ratio of the line 104w in the control line structure 104 are such that they satisfy the following formula: Therefore, the curing performance of the adhesive material 106 in different areas of the electronic device 10 can be more consistent, or the resistance of the circuit structure 104 can be reduced.

[0143] According to some embodiments, the difference between the aperture ratio AR1 and the aperture ratio AR2 can be achieved by the difference in the number of apertures OP in the first portion P1 and the second portion P2. According to some embodiments, the difference between the aperture ratios AR1 and AR2 is less than 10%. For example, the difference between the aperture ratios AR1 and AR2 can be between 0% and 10% (0% ≤ the difference between the aperture ratios AR1 and AR2 ≤ 10%), or between 2% and 6%, or between 3% and 5%. Therefore, the curing performance of the adhesive material 106 can be more consistent.

[0144] In addition, such as Figure 4A as well as Figure 4B As shown, the first portion P1 and the second portion P2 have a first length L1 and a second length L2, respectively. The first length L1 of the first portion P1 refers to the average length of the two edges of the first portion P1 (i.e., the outer edges of the outer branch portion 104o). In some embodiments, the two edges of the first portion P1 are substantially parallel to the extension direction E104 of the line 104w. More specifically, if the outer edges of the outer branch portion 104o are the two edges of the first portion P1, and one of the outer edges of the outer branch portion 104o has a length L1-1 and the other has a length L1-2, then the first length L1 of the first portion P1 refers to the average of length L1-1 and length L1-2. Figure 4B As shown, the second length L2 of the second portion P2 refers to the average length of the two edges of the second portion P2 (i.e., the outer edges of the outer branch portion 104o), and these edges of the second portion P2 are substantially parallel to the extension direction E104 of the line 104w. More specifically, if the outer edges of the outer branch portion 104o are the two edges of the second portion P2, and one of the outer edges of the outer branch portion 104o has a length L2-1 and the other has a length L2-2, then the second length L2 of the second portion P2 refers to the average of lengths L2-1 and L2-2. According to some embodiments, the area of ​​the first portion P1 can also be obtained by multiplying the first width W1 by the first length L1, and the area of ​​the second portion P2 can also be obtained by multiplying the second width W2 by the second length L2.

[0145] According to some embodiments, the first length L1 may be between 50 μm and 500 μm (50 μm ≤ first length L1 ≤ 500 μm). According to some embodiments, the second length L2 may be between 50 μm and 500 μm (50 μm ≤ second length L2 ≤ 500 μm).

[0146] According to some embodiments, the outer branch portion 104o may have a third width W3, and the range of the third width W3 may be between 5 μm and 40 μm (5 μm ≤ third width W3 ≤ 40 μm). According to some embodiments, the inner branch portion 104i may have a fourth width W4, and the range of the fourth width W4 may be between 5 μm and 30 μm (5 μm ≤ fourth width W4 ≤ 30 μm). According to some embodiments, the third width W3 may be greater than or equal to the fourth width W4. According to some embodiments, the total width of the branch portion 104R may range between 10 μm and 150 μm (10 μm ≤ total width of branch portion 104R ≤ 150 μm). More specifically, as... Figure 4B As shown, the total width of the branch portion 104R can be the total width of the outer branch portion 104o-1, the outer branch portion 104o-2, and the inner branch portions 104i-1 to 104i-5.

[0147] Furthermore, the third width W3 refers to the maximum width of the outer branch 104o along the direction perpendicular to the extension direction E104 of the line 104w, and the fourth width W4 refers to the maximum width of the inner branch 104i along the direction perpendicular to the extension direction E104 of the line 104w.

[0148] Furthermore, it should be noted that the number of branch portions 104R in each section (the total number of outer branch portions 104o and inner branch portions 104i) is not limited to the number shown in the figure. According to some embodiments, the number of branch portions 104R in each section may be between 1 and 20 (1 ≤ number of branch portions 104R ≤ 20).

[0149] According to some embodiments, the second width W2 of the second portion P2 can be greater than the first width W1 of the first portion P1, and the total width of the branch portions 104R (outer branch portion 104o and inner branch portion 104i) in the second portion P2 can be greater than or equal to the total width of the branch portions 104R in the first portion P1. According to some embodiments, the width of the branch portions 104R (outer branch portion 104o or inner branch portion 104i) in the first portion P1 can be different from the width of the branch portions 104R (outer branch portion 104o or inner branch portion 104i) in the second portion P2. For example, the width of one of the outer branch portions 104o in the first portion P1 can be different from the width of one of the outer branch portions 104o in the second portion P2. According to some embodiments, the width of the branch portion 104R (outer branch portion 104o or inner branch portion 104i) in the first portion P1 can be the same as the width of the branch portion 104R (outer branch portion 104o or inner branch portion 104i) in the second portion P2. In other words, as the width of the line 104w increases, the total width of the branch portions 104R or the width of each branch portion 104R can be adjusted (e.g., increased) to maintain the difference between the aperture ratio AR1 and the aperture ratio AR2 within a specific range, such as less than 10%. Therefore, the curing performance of the adhesive material 106 in different areas of the electronic device can be more consistent, or the resistance of the line structure 104 can be reduced.

[0150] According to some embodiments, the difference between the aperture ratio AR1 and the aperture ratio AR2 can be achieved through the size difference of the openings OP in the first portion P1 and the second portion P2. It should be noted that the size of the opening OP refers to the gap width of one of the openings OP or the total gap width of the openings OP. More specifically, in one portion, such as the first portion P1, the opening OP closest to the outer branch portion 104o may have a first gap width G1, and the openings disposed between the inner branch portions 104i may have a second gap width G2. According to some embodiments, the first gap width G1 may range from 1 μm to 50 μm (1 μm ≤ first gap width G1 ≤ 50 μm). According to some embodiments, the second gap width G2 may range from 1 μm to 50 μm (1 μm ≤ second gap width G2 ≤ ​​50 μm). According to some embodiments, the first gap width G1 may be the same as or different from the second gap width G2. According to some embodiments, the total gap width (i.e., the sum of the first gap width G1 and the second gap width G2) in a portion (e.g., the first portion P1 and / or the second portion P2) can be between 1 μm and 180 μm (1 μm ≤ total gap width ≤ 180 μm). For example, as Figure 4AAs shown, the total gap width in the first part P1 is the sum of the first gap width G1, the second gap width G2-1, the second gap width G2-2, the second gap width G2-3, and the second gap width G2-4. According to some embodiments, the second gap widths G2-1, G2-2, G2-3, and G2-4 may be the same or different, but are not limited thereto. It should be noted that the second gap widths G2-1, G2-2, G2-3, and G2-4 have the same unit, for example, micrometers or nanometers.

[0151] The first gap width G1 refers to the maximum width of the opening OP closest to the outer branch portion 104o in a direction perpendicular to the extension direction E104 of the line 104w. The second gap width G2 refers to the maximum width of the opening OP provided between the inner branches 104i in a direction perpendicular to the extension direction E104 of the line 104w.

[0152] Furthermore, it should be noted that the number of openings OP in each section is not limited to those shown in the figures. According to some embodiments, the number of openings OP in each section can be between 1 and 20 (1 ≤ number of openings OP ≤ 20). Moreover, according to some embodiments, the openings OP may have rounded corners or curved edges.

[0153] According to some embodiments, the second width W2 of the second portion P2 can be greater than the first width W1 of the first portion P1, and the number of openings OP in the second portion P2 can be greater than or equal to the number of openings OP in the first portion P1. In other words, as the width of line 104w increases, the number of openings OP can be adjusted (e.g., increased) to maintain the difference between the opening ratio AR1 and the opening ratio AR2 within a specific range, for example, less than 10%.

[0154] Furthermore, according to some embodiments, the total gap width of the opening OP in the second part P2 (the sum of the first gap width G1 and the second gap width G2) can be greater than or equal to the total gap width of the opening OP in the first part P1. According to some embodiments, if the size of the opening is the gap width of one opening, the second width can be greater than the first width, and the gap width of the opening OP in the second part P2 (either the first gap width G1 or the second gap width G2) can be different from the gap width of the opening OP in the first part P1 (either the first gap width G1 or the second gap width G2). According to some embodiments, the gap width of the opening OP in the second part P2 (either the first gap width G1 or the second gap width G2) can be the same as the gap width of the opening OP in the first part P1 (either the first gap width G1 or the second gap width G2). In other words, as the width of line 104w increases, the total gap width of the opening OP or the gap width of each opening OP can be adjusted to maintain the difference between the opening ratio AR1 and the opening ratio AR2 within a specific range, for example, less than 10%.

[0155] According to some embodiments, the connecting portion CL may have a fifth width W5, and the fifth width W5 may range from 2μm to 40μm (2μm≤fifth width W5≤40μm). The fifth width W5 refers to the maximum width of the connecting portion CL along a direction parallel to the extension direction E104 of the line 104w.

[0156] According to some embodiments, two adjacent lines 104w can be separated from each other by a distance D1, and the distance D1 can be between 1 μm and 50 μm (1 μm ≤ distance D1 ≤ 50 μm). Distance D1 refers to the maximum distance between two adjacent lines 104w in a direction perpendicular to the extension direction E104 of the line 104w.

[0157] Specifically, in Figure 4A as well as Figure 4BIn the illustrated embodiment, the first width W1 can range from 125 μm to 160 μm (125 μm ≤ first width W1 ≤ 160 μm), for example, 135 μm. The second width W2 can range from 125 μm to 160 μm (125 μm ≤ second width W2 ≤ 160 μm), for example, 157 μm. The aperture ratio AR1 can range from 35% to 55% (35% ≤ aperture ratio AR1 ≤ 50%), for example, 43%. The aperture ratio AR2 can range from 35% to 55% (35% ≤ aperture ratio AR2 ≤ 55%), for example, 46%. The difference between aperture ratio AR1 and aperture ratio AR2 can be less than or equal to 3%. The total width of the branch portion 104R in the first portion P1 can range from 75 μm to 110 μm (75 μm ≤ total width of branch portion 104R ≤ 110 μm), for example, 85 μm. The total width of the branch portion 104R in the second part P2 can range from 75 μm to 110 μm (75 μm ≤ total width of branch portion 104R ≤ 110 μm), for example, 97 μm. The sum of the first gap width G1 and the second gap width G2 in the first part P1 can range from 45 μm to 80 μm (45 μm ≤ sum of first gap width G1 and second gap width G2 ≤ ​​80 μm), for example, 55 μm. The sum of the first gap width G1 and the second gap width G2 in the second part P2 can range from 45 μm to 80 μm (45 μm ≤ sum of first gap width G1 and second gap width G2 ≤ ​​80 μm), for example, 66 μm. Furthermore, the number of openings OP in the first part P1 or the second part P2 can range from 1 to 10 (1 ≤ number of openings OP ≤ 10). Specifically, the number of openings OP in the first part P1 can be 5, and the number of openings OP in the second part P2 can be 6.

[0158] Please refer to Figure 5 , Figure 6A as well as Figure 6B , Figure 5 This diagram shows a top view of a region of an electronic device according to some embodiments of the present disclosure. Figure 6A as well as Figure 6B According to some embodiments of the present invention, in Figure 5 Enlarged schematic diagrams of the electronic devices in regions R7 and R8. It should be understood that the same or similar component designations in the following paragraphs have the same definitions as above, and therefore will not be repeated below.

[0159] like Figure 6A as well as Figure 6BAs shown, the configurations of line 104w in region R7 and region R8 are different, and the extension direction E104 of conductor 104 can be changed more than once in region R7 and region R8. Furthermore, the number of openings OP in region R7 can be different from the number of openings in region R8. According to... Figure 6A as well as Figure 6B In the embodiment shown, line 104w has a first portion P1 and a second portion P2, and the first portion P1 and the second portion P2 respectively have a first width W1 and a second width W2, the second width W2 being different from the first width W1. Furthermore, line 104w also satisfies the following formula:

[0160] Specifically, in Figure 6A as well as Figure 6B In the illustrated embodiment, the first width W1 can range from 130 μm to 190 μm (130 μm ≤ first width W1 ≤ 190 μm), for example, 148 μm. The second width W2 can range from 130 μm to 190 μm (130 μm ≤ second width W2 ≤ 190 μm), for example, 178 μm. The aperture ratio AR1 of the first portion P1 can range from 25% to 60% (25% ≤ aperture ratio AR1 ≤ 60%), for example, 38%. The aperture ratio AR2 can range from 25% to 60% (25% ≤ aperture ratio AR2 ≤ 60%), for example, 41%. The difference between aperture ratio AR1 and aperture ratio AR2 can be less than or equal to 3%. The total width of the branch portion 104R in the first portion P1 can range from 65 μm to 110 μm (65 μm ≤ total width of branch portion 104R ≤ 110 μm), for example, 82 μm. The total width of the branch portion 104R in the second part P2 can range from 65 μm to 110 μm (65 μm ≤ total width of branch portion 104R ≤ 110 μm), for example, 90 μm. The sum of the first gap G1 and the second gap G2 in the first part P1 can range from 50 μm to 100 μm (50 μm ≤ sum of first gap G1 and second gap G2 ≤ ​​100 μm), for example, 66 μm. The sum of the first gap G1 and the second gap G2 in the second part P2 can range from 50 μm to 100 μm (50 μm ≤ sum of first gap G1 and second gap G2 ≤ ​​100 μm), for example, 88 μm. Furthermore, the number of openings OP in the first part P1 or the second part P2 can range from 1 to 8 (1 ≤ number of openings OP ≤ 8). Specifically, the number of openings OP in the first part P1 can be 3, and the number of openings OP in the second part P2 can be 4.

[0161] Please refer to Figure 7 , Figure 8A as well as Figure 8B , Figure 7 This diagram shows a top view of a region of an electronic device according to some embodiments of the present invention. Figure 8A as well as Figure 8B According to some embodiments of the present invention, in Figure 7 Enlarged schematic diagram of the electronic devices in regions R9 and R10.

[0162] like Figure 8A as well as Figure 8B As shown, the configuration of line 104w in region R9 and region R10 can be different. The extension direction E104 of conductor 104 in region R9 can be different from the extension direction E104 in region R10. Furthermore, the number of openings OP in region R9 can be different from the number of openings OP in region R10. According to... Figure 8A as well as Figure 8B In the embodiment shown, line 104w may also have a first portion P1 and a second portion P2, and the first portion P1 and the second portion P2 may each have a first width W1 and a second width W2, respectively, where the second width W2 is different from the first width W1. Furthermore, line 104w also satisfies the following formula:

[0163] Specifically, in Figure 8A as well as Figure 8BIn the illustrated embodiment, the first width W1 can range from 25 μm to 120 μm (25 μm ≤ first width W1 ≤ 120 μm), for example, 41 μm. The second width W2 can range from 25 μm to 120 μm (25 μm ≤ second width W2 ≤ 120 μm), for example, 91 μm. The aperture ratio AR1 of the first portion P1 can range from 15% to 35% (15% ≤ aperture ratio AR1 ≤ 35%), for example, 27.5%. The aperture ratio AR2 of the second portion P2 can range from 15% to 35% (15% ≤ aperture ratio AR2 ≤ 35%), for example, 29.5%. The difference between aperture ratio AR1 and aperture ratio AR2 can be less than or equal to 2%. The total width of the branch portion 104R in the first portion P1 can range from 15 μm to 100 μm (15 μm ≤ total width of branch portion 104R ≤ 100 μm), for example, 30 μm. The total width of the branch portion 104R in the second part P2 can range from 15 μm to 100 μm (15 μm ≤ total width of branch portion 104R ≤ 100 μm), for example, 75 μm. The first part P1 may have only one opening OP, and the first gap G1 of the opening OP can range from 5 μm to 40 μm (5 μm ≤ first gap G1 ≤ 40 μm), for example, 11 μm. The sum of the first gap G1 and the second gap G2 in the second part P2 can range from 5 μm to 40 μm (5 μm ≤ sum of first gap G1 and second gap G2 ≤ ​​40 μm), for example, 20 μm. Furthermore, the number of openings OP in the first part P1 or the second part P2 can range from 1 to 10 (1 ≤ number of openings OP ≤ 10). Specifically, the number of openings OP in the first part P1 can be 1, and the number of openings OP in the second part P2 can be 4.

[0164] Please refer to Figure 9 , Figure 10A as well as Figure 10B , Figure 9 This diagram shows a top view of a region of an electronic device according to some embodiments of the present invention. Figure 10A as well as Figure 10B According to some embodiments of the present invention, in Figure 9 Enlarged schematic diagram of the electronic devices in regions R11 and R12.

[0165] like Figure 10A as well as Figure 10B As shown, the configurations of line 104w in regions R11 and R12 are different. The extension direction E104 of line 104w in region R11 can be different from the extension direction E104 in region R12. Furthermore, the number of openings OP in region R11 can be the same as the number of openings in region R12. Figure 10A as well as Figure 10B In the embodiment shown, line 104w also has a first portion P1 and a second portion P2, and the first portion P1 and the second portion P2 each have a second width W2, which is different from the first width W1. Furthermore, line 104w also satisfies the following formula:

[0166] Specifically, in Figure 10A as well as Figure 10B In the illustrated embodiment, the first width W1 can range from 120 μm to 210 μm (120 μm ≤ first width W1 ≤ 210 μm), for example, 140 μm. The second width W2 can range from 120 μm to 210 μm (120 μm ≤ second width W2 ≤ 210 μm), for example, 195 μm. The aperture ratio AR1 of the first portion P1 can range from 30% to 60% (30% ≤ aperture ratio AR1 ≤ 60%), for example, 41%. The aperture ratio AR2 can range from 30% to 60% (30% ≤ aperture ratio AR2 ≤ 60%), for example, 46%. The difference between aperture ratio AR1 and aperture ratio AR2 can be less than or equal to 5%. The total width of the branch portion 104R in the first portion P1 can range from 70 μm to 130 μm (70 μm ≤ total width of branch portion 104R ≤ 130 μm), for example, 90 μm. The total width of the branch portion 104R in the second part P2 can range from 70 μm to 130 μm (70 μm ≤ total width of branch portion 104R ≤ 130 μm), for example, 109 μm. The sum of the first gap G1 and the second gap G2 in the first part P1 can range from 40 μm to 150 μm (40 μm ≤ sum of first gap G1 and second gap G2 ≤ ​​150 μm), for example, 64 μm. The sum of the first gap G1 and the second gap G2 in the second part P2 can range from 10 μm to 150 μm (40 μm ≤ sum of first gap G1 and second gap G2 ≤ ​​150 μm), for example, 95 μm. Furthermore, the number of openings OP in the first part P1 or the second part P2 can range from 1 to 10 (1 ≤ number of openings OP ≤ 10). Specifically, the number of openings OP in the first part P1 can be 4, and the number of openings OP in the second part P2 can be 5.

[0167] In summary, according to some embodiments of the present invention, the width and aperture ratio of the circuit structure in the electronic device are designed to satisfy specific relationships. Therefore, the curing performance of the adhesive material in different areas of the electronic device can be more consistent, or the resistance of the circuit structure can be maintained. The width and aperture ratio of the circuit structure in the electronic device are designed to satisfy specific formulas, thereby ensuring consistent curing of the adhesive material in different areas of the electronic device, or maintaining the resistance of the circuit structure.

[0168] While the present invention has been disclosed in the above embodiments, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Features between embodiments of the present invention can be freely combined and used as long as they do not violate the spirit of the invention or conflict with it. Furthermore, the scope of protection of the present invention is not limited to the manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the disclosure of the present invention the current or future manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein, and can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-described manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. The scope of protection of the present invention should be determined by the scope of the appended claims. No embodiment or claim of the present invention needs to achieve all the objectives, advantages, and features disclosed in the present invention.

Claims

1. A circuit structure, characterized in that, include: Multiple lines, each of the multiple lines having a first part and a second part, the first part and the second part having a first width W1 and a second width W2 respectively, the second width W2 being different from the first width W1; At least one of the plurality of lines satisfies the following formula: 0 < |AR2 - AR1| < (|W2 - W1|) / W1, AR1 and AR2 are the aperture ratios of the first part and the second part, respectively. The first width W1 ranges from 20 μm to 250 μm, the second width W2 ranges from 20 μm to 250 μm, AR1 ranges from 10% to 70%, and AR2 ranges from 10% to 70%. AR1 is different from AR2, and the difference between AR1 and AR2 is less than 10%.

2. The circuit structure as described in claim 1, characterized in that, All of the aforementioned multiple lines satisfy the formula.

3. The circuit structure as described in claim 1, characterized in that, The difference between AR1 and AR2 is achieved by the difference in the number of openings in the first part and the second part.

4. The circuit structure as described in claim 3, characterized in that, The second width is greater than the first width, and the number of openings in the second part is greater than or equal to the number of openings in the first part.

5. The circuit structure as described in claim 1, characterized in that, The difference between AR1 and AR2 is achieved through the size difference of the openings in the first part and the second part.

6. The circuit structure as described in claim 5, characterized in that, The size of the opening is the total gap width of the opening, the second width is greater than the first width, and the total gap width of the opening in the second part is greater than or equal to the total gap width of the opening in the first part.

7. The circuit structure as described in claim 5, characterized in that, The size of the opening is the gap width of one of the openings, the second width is greater than the first width, and the gap width of one of the openings in the first part is different from the gap width of one of the openings in the second part.

8. The circuit structure as described in claim 1, characterized in that, The second width is greater than the first width, and each of the multiple lines includes multiple branch sections, wherein the total width of the multiple branch sections in the second part is greater than or equal to the total width of the multiple branch sections in the first part.

9. The circuit structure as described in claim 8, characterized in that, The width of one of the plurality of branches in the first part is different from the width of one of the plurality of branches in the second part.

10. The circuit structure as described in claim 9, characterized in that, Each of the plurality of branch portions has a plurality of inner branch portions and a plurality of outer branch portions adjacent to one of the inner branch portions.

11. The circuit structure as described in claim 10, characterized in that, Each of the plurality of lines includes a plurality of connecting portions, and one of the plurality of connecting portions is connected to two adjacent inner branch portions and two adjacent outer branch portions.

12. The circuit structure as described in claim 1, characterized in that, The direction of extension of the first part is different from the direction of extension of the second part.

13. An electronic device, characterized in that, include: First substrate; Second substrate; The circuit structure as described in claim 1 is disposed on at least one of the first substrate and the second substrate; as well as An adhesive material is used to bond the first substrate and the second substrate together; At least a portion of the circuit structure overlaps with the adhesive material.

14. The electronic device as claimed in claim 13, characterized in that, The electronic device is an organic light-emitting diode (OLED) display device.

15. The electronic device as claimed in claim 13, characterized in that, The electronic device is a liquid crystal display device.

16. The electronic device as claimed in claim 13, characterized in that, The electronic device is a liquid crystal antenna device.

17. The electronic device as claimed in claim 13, characterized in that, It also includes a switching structure, wherein at least one of the plurality of lines is electrically connected to the switching structure.

18. The electronic device as claimed in claim 13, characterized in that, The circuit structure is disposed between the adhesive material and at least one of the first substrate and the second substrate.

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